Transfer system, transfer method, method for manufacturing article, control program, and storage medium

Abstract

To inhibit, in an apparatus comprising a gas curtain in a passage connecting a transfer room and a treatment room, mixture of atmosphere in moving a treatment object between the transfer room and the treatment room.SOLUTION: A transfer system comprises: a transfer room; a treatment device for performing treatment on a transfer object; a passage connecting the transfer room and a treatment device; a gas curtain mechanism that forms a gas curtain in the passage; a transfer mechanism for moving the transfer object through the passage from the transfer room toward the treatment device; and a control unit. In the passage, ejection means for ejecting gas into a region in which the gas curtain is formed and absorption means for absorbing gas at a position closer to the treatment device than the region in which the gas curtain is formed are arranged. The absorption means is driven when a tip of the transfer object is at a position closer to the treatment device than the region in which the gas curtain is formed, and the ejection means is driven when a rear end of the transfer object is in the region in which the gas curtain is formed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a transfer system that moves an object to be transferred, such as a substrate, between a transfer chamber and a processing device. [Background technology]

[0002] The manufacture of electronic devices such as semiconductors, flat panel displays, and solar cells uses processing equipment that performs a variety of processes, including etching, film formation, drying, cleaning, baking, ashing, and surface treatment. In the processing chambers of these processing equipment, it is necessary to maintain a specified gas atmosphere at an extremely high purity in order to process workpieces such as substrates.

[0003] If external gases are mixed into the gas atmosphere inside the processing chamber when a workpiece such as a substrate is loaded into or unloaded from the processing chamber, the purity of the atmospheric gas inside the processing chamber will decrease, causing problems in processing. Therefore, a load-lock chamber is provided on the transfer path for loading or unloading the workpiece into or from the processing apparatus, and the atmosphere in the load-lock chamber is replaced to match the atmosphere of the destination during loading or unloading.

[0004] However, a transfer system equipped with a load lock chamber has a problem in that the device configuration is large and expensive, and it takes a long time to replace the atmosphere, which reduces the manufacturing speed of electronic devices.

[0005] Patent Document 1 describes a method of preventing outside air from mixing into the atmosphere in a processing chamber by arranging a gas curtain mechanism and an exhaust processing mechanism in a transport path of an object to be processed. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-262781 Summary of the Invention [Problem to be solved by the invention]

[0007] In the method described in Patent Document 1, when the object is transferred from the transfer chamber to the processing chamber via the transfer path, a relatively large amount of the atmosphere in the transfer path may be mixed into the processing chamber, which may reduce the purity of the atmosphere in the processing chamber, making it impossible to properly perform the intended processing in the processing chamber.

[0008] Furthermore, when the processed object is transferred from the processing chamber to the transfer chamber via the transfer path, a relatively large amount of the process gas from the processing chamber may be mixed into the atmosphere of the transfer path.If the process gas from the processing chamber is mixed into the atmosphere of the gas curtain on the transfer path, the process gas may be further mixed from the atmosphere of the gas curtain into the atmosphere of the transfer chamber.

[0009] Generally, the atmosphere in the transfer chamber is adjusted to prevent deterioration of the workpieces, such as substrates, but if process gas from the processing chamber gets mixed in, there is a possibility that the workpieces may be deteriorated while they are in the transfer chamber, which is inconvenient. Also, although the gas used as the gas curtain is generally circulated, if a relatively large amount of process gas gets mixed in, it takes time to restore the purity, which can slow down the manufacturing speed of electronic devices.

[0010] Therefore, in an apparatus equipped with a gas curtain in the passage connecting the transfer chamber and the processing chamber, a technology was desired that could prevent the atmosphere of either the transfer chamber or the processing chamber from mixing with the atmosphere of the other when moving the workpiece (object to be transferred) between the transfer chamber and the processing chamber. [Means for solving the problem]

[0011] A first aspect of the present invention provides a method for manufacturing a processing apparatus, the method comprising: a transfer chamber in which a first atmosphere is circulated; a processing device for processing a transfer object in a second atmosphere having a composition different from that of the first atmosphere; a passage connecting the transfer chamber and the processing device; a gas curtain mechanism for forming a gas curtain in the passage to prevent the first atmosphere in the transfer chamber from mixing with the second atmosphere in the processing device; a transfer mechanism for moving the transfer object via the passage along a first direction from the transfer chamber toward the processing device or along a second direction from the processing device toward the transfer chamber; and a control unit. The passage includes a gas curtain mechanism for sucking gas within a region where the gas curtain is formed. This conveying system is characterized in that it comprises a first suction means, a first ejection means that ejects gas into an area where the gas curtain is formed, a second suction means that sucks in gas at a position closer to the processing device than the area where the gas curtain is formed, and a second ejection means that ejects gas at a position closer to the processing device than the area where the gas curtain is formed, and when the transported object passes through the passage, the control unit drives at least one of the first suction means, the first ejection means, the second suction means, and the second ejection means depending on the direction in which the transport mechanism moves the transported object and the position of the transported object.

[0012] A second aspect of the present invention provides a system including a transfer chamber in which a first atmosphere is circulated, a processing device for processing a transfer object in a second atmosphere having a composition different from that of the first atmosphere, a passage connecting the transfer chamber and the processing device, a gas curtain mechanism for forming a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing, a transfer mechanism for moving the transfer object via the passage along a first direction from the transfer chamber toward the processing device or along a second direction from the processing device toward the transfer chamber, and a control unit, wherein the passage is provided with a first suction means for suctioning gas within an area where the gas curtain is formed. a first ejection means for ejecting gas into an area where the gas curtain is formed; a second suction means for sucking gas at a position closer to the processing device than the area where the gas curtain is formed; and a second ejection means for ejecting gas at a position closer to the processing device than the area where the gas curtain is formed, wherein the control unit drives at least one of the first suction means, the first ejection means, the second suction means, and the second ejection means depending on the direction in which the transport mechanism moves the transported object and the position of the transported object when the transported object passes through the passage.

[0013] In addition, a third aspect of the present invention is a transfer system comprising: a transfer chamber in which a first atmosphere circulates; a processing device that processes a transfer object in a second atmosphere having a composition different from that of the first atmosphere; a passage connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transfer mechanism that moves the transfer object from the transfer chamber toward the processing device via the passage; and a control unit, wherein the passage is provided with a jetting means that jets gas into an area where the gas curtain is formed, and a suction means that sucks gas at a position closer to the processing device than the area where the gas curtain is formed, and the control unit drives the suction means when the leading end of the transfer object is closer to the processing device than the area where the gas curtain is formed, and drives the jetting means when the trailing end of the transfer object is within the area where the gas curtain is formed.

[0014] In addition, a fourth aspect of the present invention is a transfer system comprising: a transfer chamber in which a first atmosphere circulates; a processing device that processes a transfer object in a second atmosphere having a composition different from that of the first atmosphere; a passage connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transfer mechanism that moves the transfer object from the processing device toward the transfer chamber via the passage; and a control unit, wherein the passage is provided with a suction means that sucks gas within an area where the gas curtain is formed, and a jetting means that jets gas at a position closer to the processing device than the area where the gas curtain is formed, and the control unit drives the suction means when the leading end of the transfer object is within the area where the gas curtain is formed, and drives the jetting means when the trailing end of the transfer object is closer to the processing device than the area where the gas curtain is formed. [Effects of the Invention]

[0015] According to the present invention, in an apparatus equipped with a gas curtain in a passage connecting a transfer chamber and a processing chamber, when an object to be processed (object to be transferred) is moved between the transfer chamber and the processing chamber, it is possible to prevent the atmosphere of either the transfer chamber or the processing chamber from mixing with the atmosphere of the other. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 3 is a schematic cross-sectional view illustrating a passage provided in the transport device according to the first embodiment. [Figure 2] 1 is a schematic plan view showing the configuration of an electronic device manufacturing apparatus according to a first embodiment. [Figure 3] 1 is a schematic diagram for explaining an ambient gas that moves with a substrate near the leading or trailing end of the substrate as the substrate is moved; [Figure 4] 10 is a flowchart showing the procedure of a transfer process for transferring a substrate from a transfer chamber to a processing section via a passage in the first embodiment. [Figure 5] Schematic diagram showing the positional relationship of each part at the time when the sensor detects the leading edge of the substrate moving in direction A. [Figure 6] Schematic diagram showing the positional relationship of each part at the time when the sensor detects the rear end of the substrate moving in direction A. [Figure 7] 10 is a flowchart showing the procedure of a transfer process for transferring a substrate from a processing section to a transfer chamber via a passage in the first embodiment. [Figure 8] Schematic diagram showing the positional relationship of each part at the time when the sensor detects the leading edge of the substrate moving in the A' direction. [Figure 9] Schematic diagram showing the positional relationship of each part at the timing when the sensor detects the rear end of the substrate moving in the A' direction. [Figure 10] 10 is a flowchart showing the procedure of a transfer process for transferring a substrate from a transfer chamber to a processing section via a passage in the second embodiment. [Figure 11] 10 is a schematic diagram showing the positional relationship of each part at the time when the leading edge of the substrate moving in direction A reaches the suction start position. [Figure 12]Schematic diagram showing the positional relationship of each part at the timing when the rear end of the substrate moving in direction A reaches the ejection start position. [Figure 13] 10 is a flowchart showing the procedure of a transfer process for transferring a substrate from a processing section to a transfer chamber via a passage in the second embodiment. [Figure 14] 10 is a schematic diagram showing the positional relationship of each part at the time when the leading edge of the substrate moving in the A' direction reaches the suction start position. [Figure 15] Schematic diagram showing the positional relationship of each part at the timing when the rear end of the substrate moving in the A' direction reaches the ejection start position. DETAILED DESCRIPTION OF THE INVENTION

[0017] A conveying device and the like according to an embodiment of the present invention will be described with reference to the drawings. Note that the embodiment shown below is an example, and for example, those skilled in the art can appropriately modify the detailed configuration without departing from the spirit of the present invention. Note that in the drawings referred to in the following description of the embodiment, elements denoted by the same reference numerals have the same functions unless otherwise noted. When multiple identical elements are arranged in a drawing, the reference numerals and their descriptions may be omitted.

[0018] Furthermore, the drawings may be represented schematically for the convenience of illustration and explanation, and the shape, size, arrangement, etc. of the elements depicted in the drawings may not necessarily be strictly identical to the actual objects.

[0019] In the following description, for example, when "X-plus direction" is written, it refers to the same direction as the X-axis arrow in the coordinate system shown, and when "X-minus direction" is written, it refers to the direction 180 degrees opposite to the direction of the X-axis arrow in the coordinate system shown. Also, when simply written as "X direction," it refers to a direction parallel to the X-axis, regardless of whether it is different from the direction of the X-axis arrow in the drawings. The same applies to directions other than the X-axis.

[0020] [Embodiment 1] 2 is a schematic plan view showing the configuration of an electronic device manufacturing apparatus 100 equipped with a conveying apparatus according to embodiment 1. In the following description, to clarify the positional relationships, mutually orthogonal X-axis, Y-axis, and Z-axis directions are defined, and the Z-positive direction is defined as the vertically upward direction. The manufacturing apparatus 100 is an apparatus for manufacturing substrates used in, for example, display devices.

[0021] The manufacturing apparatus 100 is configured to include, for example, a film forming apparatus that forms an organic film on a substrate 11. The organic film can be, for example, any of a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer of an organic light-emitting device (OLED). A process for manufacturing an organic EL device can include a step of applying a solution containing a functional material to form an organic film such as a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, or an electron injection layer on a substrate.

[0022] The process of forming an organic film on the substrate 11 may include a cleaning step of cleaning the substrate 11, a coating step of coating a film-forming solution onto the substrate 11 by, for example, an inkjet method, a drying step of drying the coated film-forming solution to form a dried film, and a baking step of baking the dried film. The film-forming solution may be a solution containing a solute and a solvent for forming an organic film.

[0023] Manufacturing apparatus 100 includes processing sections 62 to 67, each of which performs one of the above-described steps, and processing section 3. Manufacturing apparatus 100 may also include a gate 61 for loading and unloading a substrate from outside the apparatus, and a load lock chamber 60 for isolating the atmosphere inside and outside the apparatus during loading and unloading.

[0024] Gate 61, processing sections 62 to 67, and processing section 3 are arranged to surround transfer chamber 1. Manufacturing apparatus 100 includes a transfer mechanism 10 for transferring substrate 11 from transfer chamber 1 to gate 61 or any processing section, or for transferring substrate 11 from gate 61 or any processing section to transfer chamber 1. As transfer mechanism 10, for example, a transfer robot having an articulated robot hand and a mechanism for rotating the robot hand toward gate 61 or any processing section may be used. To prevent deterioration of substrate 11 within transfer chamber 1, an inert gas (e.g., N2) is used as the main component of the atmosphere within transfer chamber 1, and preferably a high-purity inert gas atmosphere containing 90% or more inert gas by volume is used.

[0025] Each of processing sections 62 to 67 and processing section 3 is a processing device for performing processing on a substrate (transported object). Each of processing sections 62 to 67 and processing section 3 may be a cleaning device for cleaning substrate 11, a coating device for coating substrate 11 with a film-forming solution that is a raw material for an organic film, a drying device for drying the coated film-forming solution, or a baking device for baking the dried film-forming solution. These processing sections (processing devices) may include a processing chamber for maintaining an atmosphere suitable for the processing performed by each section. In other words, manufacturing apparatus 100 may be a multi-chamber type substrate manufacturing apparatus.

[0026] For example, clean dry air (hereinafter referred to as CDA, CDA atmosphere, etc.), which can be supplied at a relatively low cost, is preferably used as the atmosphere in the processing chamber of a cleaning apparatus, a coating apparatus, or a baking apparatus. CDA is particularly suitable for processes that require an appropriate amount of oxygen, such as baking. The atmosphere used in these processing apparatuses has a higher oxygen content than the atmosphere in the transfer chamber 1. Furthermore, for example, in a drying apparatus, an atmosphere containing an appropriate amount of solvent vapor is preferably used to adjust the drying speed of the applied film-forming solution. As will be described later, in this embodiment, a gas curtain is installed in at least the passage 4 connecting the processing section 3 and the transfer chamber 1 among the passages connecting each processing section and the transfer chamber 1, to prevent the atmospheres in the processing section 3 and the transfer chamber 1 from mixing with each other.

[0027] The manufacturing apparatus 100 may further include a control unit 20. The control unit 20 may be configured with hardware such as a field programmable gate array (FPGA). It may also be configured with a programmable logic device (PLD) or an application specific integrated circuit (ASIC). Alternatively, the control unit 20 may be configured with a general-purpose or dedicated computer with a program (software) installed, or may be configured with a combination of all or part of the above.

[0028] The control unit 20 may include a CPU, an I / O port, and a computer-readable recording medium. The computer-readable recording medium may be a non-transitory recording medium that stores processing programs executed by the CPU, parameters required for executing the processing, and the like. Examples of non-transitory recording media that may be used include flexible disks, optical disks, magneto-optical disks, magnetic tapes, USB memories, and SSDs. The information processing device may also include a rewritable storage medium (such as RAM) that provides a storage area required for processing, such as calculations.

[0029] The control unit 20 controls the operation of each part of the manufacturing apparatus 100, including the transport mechanism 10, processing units 62 to 67, processing unit 3, and elements (described in detail later) provided in a passage 4 connecting the transport chamber 1 and processing unit 3. A computer-readable non-transitory recording medium provided in the control unit 20 stores a control program for the transport operation according to this embodiment and for the manufacturing apparatus 100 to manufacture a substrate for an organic EL display device.

[0030] (The passage connecting the transport chamber and the processing section) Fig. 1 is a schematic cross-sectional view illustrating a passage 4 provided in a transfer device according to embodiment 1. Fig. 1 is a partial cross-sectional view of a manufacturing apparatus 100 taken along line DD, which is indicated by a dashed line in Fig. 2. Here, the processing unit 3 is exemplified as a baking apparatus that heats substrates in a CDA atmosphere containing oxygen, but the processing unit 3 may also be a cleaning apparatus, a coating apparatus, or other apparatus.

[0031] The atmosphere in the transfer chamber 1 has a composition containing 90% or more inert gas by volume, and the atmosphere in the processing section 3 (processing device) has a composition containing more oxygen by volume than the atmosphere in the transfer chamber 1. In other words, the composition of the atmosphere in the transfer chamber 1 and the composition of the atmosphere in the processing section 3 are different from each other.

[0032] The transfer chamber 1 and the processing section 3 are connected by a passage 4 defined by an airtight enclosure. The internal space of the passage 4 surrounded by the enclosure is large enough to allow the substrate 11 held by the transfer mechanism 10 to pass through.

[0033] 1 shows a state in which the transfer mechanism 10 is about to move the substrate 11 in the A direction (positive X direction) to carry the substrate 11 from the transfer chamber 1 into the processing section 3. As will be described later, when moving the substrate 11 from the processing section 3 to the transfer chamber 1, the transfer mechanism 10 can move the substrate 11 in the A' direction (negative X direction).

[0034] The transfer chamber 1 is equipped with a gas supply mechanism (not shown) that supplies and circulates a high-concentration inert gas (e.g., N2), and the composition of the atmosphere inside the transfer chamber 1 is adjusted to contain a high-purity inert gas. The processing section 3 is equipped with a CDA supply mechanism (not shown) that supplies CDA, and the atmosphere inside the chamber of the processing section 3 is adjusted to be filled with CDA.

[0035] The passage 4 connecting the transfer chamber 1 and the processing section 3 is provided with a gas curtain outlet (not shown) and a gas curtain suction port (not shown) for forming a gas curtain 2 through which a high concentration of inert gas (e.g., N2) flows. The gas curtain 2 is always formed, regardless of whether a substrate 11 is present in the passage 4, so as to prevent the atmosphere in the transfer chamber 1 and the atmosphere in the processing section 3 from mixing. The gas forming the gas curtain 2 is preferably a gas containing 90% or more inert gas by volume, and is circulated. Similar to the gas in the transfer chamber 1, the gas curtain 2 circulates a gas containing 90% or more inert gas. However, the inert gas in the transfer chamber 1 must be maintained at a higher purity and more stably than that in the gas curtain 2. For this reason, it is preferable to configure separate gas circulation systems for the atmospheres in the transfer chamber 1 and the gas curtain 2.

[0036] In this embodiment, in the passage 4, a sensor 41, gas inlets 31a and 31b, gas inlets 21a and 21b, and a sensor 42 are provided in this order from the transfer chamber 1 side to the processing section 3 side.

[0037] Sensors 41 and 42 are disposed at predetermined positions in passage 4 to detect the position of substrate 11, which is the object to be transferred. In this embodiment, sensor 41 is disposed closer to transfer chamber 1 than gas inlet / outlet 31a, gas inlet / outlet 31b, gas inlet / outlet 21a, and gas inlet / outlet 21b. Sensor 41 is configured to detect whether the leading or trailing end of substrate 11 reaches a predetermined position inside gas curtain 2 when substrate 11 is moved in direction A from transfer chamber 1 to processing unit 3. Sensor 42 is disposed closer to processing unit 3 than gas inlet / outlet 31a, gas inlet / outlet 31b, gas inlet / outlet 21a, and gas inlet / outlet 21b. Sensor 42 is configured to detect whether the leading or trailing end of substrate 11 reaches a predetermined position outside gas curtain 2 when substrate 11 is moved in direction A' from processing unit 3 to transfer chamber 1. Sensors 41 and 42 may be, for example, optical sensors or ultrasonic sensors. However, the detection mechanism is not limited to the exemplified sensor, and may be, for example, a video camera capable of taking moving images, as long as it is capable of detecting the position of the substrate 11 that is the object to be transported. Also, the sensor does not necessarily have to be provided in the passage 4.

[0038] The detection signals from sensors 41 and 42 are transmitted to the control unit 20, and as will be described later, the control unit 20 controls the flow of gas in and out at gas inlets / outlets 31a, 31b, 21a, and 21b based on the notified detection results.

[0039] Each gas inlet / outlet is configured to be able to select whether to inject a high concentration inert gas (e.g., N2) to a predetermined position in passage 4, to suck the atmosphere at a predetermined position in passage 4, or to close without injecting or sucking, based on a command from control unit 20. Of these, gas inlet / outlet 31a and gas inlet / outlet 31b as first gas inlets and outlets are arranged in positions close to processing unit 3 within the region where gas curtain 2 steadily flows, specifically near the end of gas curtain 2 on the processing unit 3 side. Gas inlet / outlet 21a and gas inlet / outlet 21b as second gas inlets and outlets are arranged closer to processing unit 3 than the region where gas curtain 2 steadily flows.

[0040] Each gas inlet / outlet is connected to an inert gas supply mechanism and a suction mechanism such as a vacuum pump via an electromagnetic valve that can switch paths and open / close. The control unit 20 can close each gas inlet / outlet, spray inert gas from the gas inlet / outlet into the passage 4, or suck and exhaust the atmosphere in the passage 4 through the gas inlet / outlet, for example, by controlling the operation of the electromagnetic valve.

[0041] 3 is a schematic diagram illustrating that the ambient gas is carried along with the substrate 11 near the leading or trailing end of the substrate when the substrate 11, which is the object to be transferred, moves through the passage 4. For example, when the substrate 11 is moved in direction A (positive X direction) to move the substrate 11 from the transfer chamber 1 to the processing unit 3, a region 51 exists near the leading end of the substrate 11 in the direction of movement, from which a mass of gas is pushed out by the substrate 11. Furthermore, a region 52 exists near the trailing end of the substrate 11 in the direction of movement, from which a mass of gas is carried along (pulled in) by the substrate 11 due to a pressure drop that occurs.

[0042] Furthermore, for example, when substrate 11 is moved in the A' direction (negative X direction) to move substrate 11 from processing unit 3 to transfer chamber 1, there is a region 52 near the front end of substrate 11 in the direction of movement where a gas mass is pushed out by substrate 11. There is also a region 51 near the rear end of substrate 11 in the direction of movement where a gas mass is drawn in by substrate 11 due to a resulting pressure drop. In this embodiment, control unit 20 appropriately controls the flow of gas within passage 4 using gas inlets 31a to 21b to prevent the gas mass in region 51 or region 52, which is moving with substrate 11, from being brought into and mixed with the atmosphere of the chamber to which substrate 11 is transferred. When substrate 11 is transferred from transfer chamber 1 to processing unit 3, or when substrate 11 is transferred from processing unit 3 to transfer chamber 1, a high-concentration inert gas (e.g., N2) can be stably circulated, particularly in transfer chamber 1.

[0043] (Control of substrate transfer from the transfer chamber to the processing section) 4 is a flowchart showing the procedure of the transfer process for transferring the substrate 11 from the transfer chamber 1 to the processing section 3 via the passage 4. Each step of the process is executed by the control section 20 controlling each section of the manufacturing apparatus 100.

[0044] When the transfer process starts, in step S201, the control unit 20 controls the transfer mechanism 10 to start moving the substrate 11 from the transfer chamber 1 toward the processing unit 3. The sensors 41 and 42 start detecting whether or not the substrate 11 is present at their respective detection points, and thereafter transmit the detection results to the control unit. Under the control of the control unit 20, the gas curtain 2 is constantly formed even before the transfer process starts, but all four gas inlets 31a to 21b are closed.

[0045] In step S202, when sensor 41 detects that the leading edge of substrate 11 has reached the vicinity of the end of gas curtain 2, it transmits a notification to control unit 20. FIG. 5 is a schematic diagram showing the positional relationship of each part at the time when sensor 41 detects the leading edge of substrate 11 moving in direction A at speed V1. When viewed in direction A, which is the direction of travel, a region 51 that pushes out a mass of gas exists at the leading edge of substrate 11 over a length L2. That is, substrate 11 moves toward processing unit 3 with region 51 of gas curtain 2 that pushes out inert gas on its leading edge.

[0046] In step S203, the control unit 20 uses, for example, a software timer to determine whether a first predetermined time (suction start set time T1) has elapsed since the leading edge of the substrate 11 was detected by the sensor 41. The suction start set time T1 can be set, for example, to satisfy the following formulas 1 and 2, where T1≧0.

number

number

[0047] If the control unit 20 determines that the suction start set time T1 has not elapsed (step S203: NO), it waits while repeatedly executing step S203 in a loop.

[0048] If the control unit 20 determines that the suction start set time T1 has elapsed (step S203: YES), the process proceeds to step S204, where the control unit 20 starts suction of gas from the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0049] In the next step S205, the control unit 20 determines whether a second predetermined time (suction end set time T2) has elapsed, for example, using a software timer. The suction end set time T2 can be set to satisfy, for example, the following formula 3, where T2≧0.

number

[0050] If the control unit 20 determines that the suction end set time T2 has not elapsed (step S205: NO), it repeatedly executes step S205 in a loop.

[0051] If the control unit 20 determines that the suction end set time T2 has elapsed (step S205: YES), the control unit 20 proceeds to step S206 and stops the suction of gas from the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0052] In this embodiment, when substrate 11 moves to processing unit 3 through gas curtain 2 of inert gas, the gas mass (inert gas) in region 51 that moves along with the leading edge of substrate 11 is sucked and discharged from gas inlet / outlet 21a and gas inlet / outlet 21b by the above suction operation. This prevents the inert gas from being brought into processing unit 3 and being mixed into the atmosphere (e.g., CDA) of processing unit 3.

[0053] In the following step S207, when sensor 41 detects that the rear end of substrate 11 has passed, it transmits a notification to control unit 20. FIG. 6 is a schematic diagram showing the positional relationship of each unit at the time when sensor 41 detects the passage of the rear end of substrate 11, which is moving in direction A at speed V1. As viewed in direction A, which is the traveling direction, there is a region 52 at the rear end of substrate 11 that carries a gas mass over a length L5 due to a pressure drop that occurs during movement. That is, substrate 11 is moving toward processing unit 3 with region 52, which carries the inert gas of gas curtain 2, on its rear end side.

[0054] In step S208, the control unit 20 uses, for example, a software timer to determine whether a third predetermined time (jetting start set time T3) has elapsed since the passage of the rear end of the substrate 11 was detected by the sensor 41. The jetting start set time T3 can be set, for example, to satisfy the following formulas 4 and 5, where T3≧0.

number

number

[0055] If the control unit 20 determines that the jetting start set time T3 has not elapsed (step S208: NO), it waits while repeatedly executing step S208 in a loop.

[0056] If the control unit 20 determines that the ejection start set time T3 has elapsed (step S208: YES), the process proceeds to step S209, where it starts ejecting gas (for example, the same type of gas as the gas curtain 2) from the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0057] In the next step S210, the control unit 20 determines whether a fourth predetermined time (a jetting end set time T4) has elapsed, for example, using a software timer. The jetting end set time T4 can be set to satisfy, for example, the following mathematical formula 6, where T4≧0.

number

[0058] If the control unit 20 determines that the jetting end set time T4 has not elapsed (step S210: NO), it repeatedly executes step S210 in a loop.

[0059] If the control unit 20 determines that the set ejection end time T4 has elapsed (step S210: YES), the control unit 20 proceeds to step S211 and stops the ejection of gas from the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0060] In this embodiment, when substrate 11 moves to processing section 3 through gas curtain 2 of inert gas, inert gas is ejected from gas inlet / outlet 31a and gas inlet / outlet 31b by the above-described ejection operation, thereby mitigating the pressure drop that occurs on the rear end side of substrate 11. This mitigates the accompanying movement (drawing) of the gas mass (inert gas) in region 52, and prevents the inert gas from being brought into processing section 3 and being mixed into the atmosphere (e.g., CDA) of processing section 3. When the substrate 11 is thus carried into the processing section 3, the control section 20 completes the transport processing of the substrate 11 in step S212.

[0061] (Control of substrate transfer from processing section to transfer chamber) 7 is a flowchart showing the procedure of the transfer process for transferring the substrate 11 from the processing unit 3 to the transfer chamber 1 via the passage 4. Each step of the process is executed by the control unit 20 controlling each part of the manufacturing apparatus 100.

[0062] When the transfer process starts, in step S301, the control unit 20 controls the transfer mechanism 10 to start moving the substrate 11 from the processing unit 3 toward the transfer chamber 1. The sensors 41 and 42 start detecting whether or not the substrate 11 is present at their respective detection points, and thereafter transmit the detection results to the control unit. Under the control of the control unit 20, the gas curtain 2 is constantly formed before the transfer process starts, but all four gas inlets 31a to 21b are closed.

[0063] In step S302, when sensor 42 detects that the leading edge of substrate 11 has arrived, it transmits a notification to control unit 20. FIG. 8 is a schematic diagram showing the positional relationship of each part at the time when sensor 42 detects the leading edge of substrate 11 moving in direction A' at speed V2. When viewed in direction A', which is the direction of travel, a region 51 that pushes out a gas mass exists at the leading edge of substrate 11 over a length L12. That is, substrate 11 moves toward transfer chamber 1 with region 51 that pushes out atmospheric gas (e.g., CDA) from processing unit 3 on its leading edge side.

[0064] In step S303, the control unit 20 determines, for example, using a software timer, whether a fifth predetermined time (suction start set time T11) has elapsed since the leading edge of the substrate 11 was detected by the sensor 42. The suction start set time T11 can be set, for example, to satisfy the following formulas 7 and 8, where T11≧0.

number

number

[0065] If the control unit 20 determines that the suction start set time T11 has not elapsed (step S303: NO), it waits while repeatedly executing step S303 in a loop.

[0066] If the control unit 20 determines that the suction start set time T11 has elapsed (step S303: YES), the process proceeds to step S304, where the control unit 20 starts suction of gas from the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0067] In the next step S305, the control unit 20 determines whether a sixth predetermined time (suction end set time T12) has elapsed, for example, using a software timer. The suction end set time T12 can be set to satisfy, for example, the following formula 9, where T12≧0.

number

[0068] If the control unit 20 determines that the suction end set time T12 has not elapsed (step S305: NO), it repeatedly executes step S305 in a loop.

[0069] If the control unit 20 determines that the suction end set time T12 has elapsed (step S305: YES), the control unit 20 proceeds to step S306 and stops the suction of gas from the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0070] In this embodiment, by the above suction operation, when the substrate 11 moves through the gas curtain 2 of inert gas, the gas mass (ambient gas of the processing section 3) in the region 51 that moves along with the leading edge of the substrate 11 is sucked and discharged from the gas inlet / outlet 31a and the gas inlet / outlet 31b. This prevents the ambient gas of the processing section 3 from being brought into the transfer chamber 1 and being mixed into the atmosphere (e.g., N2) of the transfer chamber 1.

[0071] In the following step S307, when sensor 42 detects that the rear end of substrate 11 has passed, it transmits a notification to control unit 20. FIG. 9 is a schematic diagram showing the positional relationship of each part at the timing when sensor 42 detects that the rear end of substrate 11, moving in the A' direction at speed V2, has passed. As viewed in the A' direction, which is the traveling direction, at the rear end of substrate 11, there is a region 52 over a length L15 that draws in (pulls in) a mass of gas due to a pressure drop that occurs during movement. That is, substrate 11 moves toward transfer chamber 1 while carrying region 52 that draws in the ambient gas of processing unit 3 on its rear end side.

[0072] In step S308, the control unit 20 determines, for example, using a software timer, whether a seventh predetermined time (jetting start set time T13) has elapsed since the passage of the rear end of the substrate 11 was detected by the sensor 42. The jetting start set time T13 can be set, for example, to satisfy the following formulas 10 and 11, where T13≧0.

number

number

[0073] If the control unit 20 determines that the jetting start set time T13 has not elapsed (step S308: NO), it waits while repeatedly executing step S308 in a loop.

[0074] If the control unit 20 determines that the ejection start set time T13 has elapsed (step S308: YES), the process proceeds to step S309, where it starts ejecting gas (for example, the same type of gas as the gas curtain 2) from the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0075] In the next step S310, the control unit 20 determines whether an eighth predetermined time (a jetting end set time T14) has elapsed, for example, using a software timer. The jetting end set time T14 can be set to satisfy, for example, the following mathematical expression 12, where T14≧0.

number

[0076] If the control unit 20 determines that the jetting end set time T14 has not elapsed (step S310: NO), it repeatedly executes step S310 in a loop.

[0077] If the control unit 20 determines that the set ejection end time T14 has elapsed (step S310: YES), the process proceeds to step S311, where the control unit 20 stops the ejection of gas from the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0078] In this embodiment, when substrate 11 moves to processing section 3 through the gas curtain of inert gas, inert gas is ejected from gas inlet / outlet 21a and gas inlet / outlet 21b by the above-described ejection operation, thereby mitigating the pressure drop that occurs on the rear end side of substrate 11. This mitigates the accompanying movement of the gas mass in region 52, and prevents the ambient gas of processing section 3 from being brought into transfer chamber 1 and being mixed into the atmosphere (e.g., N2) of transfer chamber 1. When the substrate 11 is thus carried into the transfer chamber 1, the control unit 20 completes the transfer process of the substrate 11 in step S312.

[0079] [Embodiment 2] An explanation will be given of an electronic device manufacturing apparatus equipped with a conveying apparatus according to embodiment 2. Explanations of matters common to embodiment 1 will be simplified or omitted.

[0080] In the first embodiment, sensors 41 and 42 for detecting the position of the substrate are provided in the passage 4, and the control unit 20 controls the intake and exhaust of gas at the four gas inlets and outlets based on the detection results notified by the sensors. In the present embodiment, instead of the sensors 41 and 42, a position sensor of the robot hand provided in the transport mechanism 10 is used to detect the position of the leading or trailing end of the substrate 11, which is the object to be transported, and the detection result is sent to the control unit 20.

[0081] (Control of substrate transfer from the transfer chamber to the processing section) 10 is a flowchart showing the procedure of the transfer process for transferring the substrate 11 from the transfer chamber 1 to the processing section 3 via the passage 4. Each step of the process is executed by the control section 20 controlling each section of the manufacturing apparatus 100.

[0082] When the transfer process starts, in step S401, the control unit 20 controls the transfer mechanism 10 to start moving the substrate 11 from the transfer chamber 1 toward the processing unit 3. A position sensor provided in the transfer mechanism 10 starts measuring the position of the robot hand holding the substrate 11, and thereafter transmits the detection results to the control unit. Under the control of the control unit 20, the gas curtain 2 is constantly formed even before the transfer process starts, but all four gas inlets 31a to 21b are closed.

[0083] In step S402, the control unit 20 determines whether the leading edge of the substrate 11 has reached the suction start position R1 based on the detection result of the position sensor provided in the transport mechanism 10. FIG. 11 is a schematic diagram showing the positional relationship of each part at the time when the leading edge of the substrate 11, moving in the A direction at a speed V1, reaches the suction start position R1. When viewed in the A direction, which is the traveling direction, a region 51 for pushing out a gas mass exists at the leading edge of the substrate 11 over a length L2. That is, the substrate 11 is moving toward the processing unit 3 with the region 51 for pushing out the inert gas of the gas curtain 2 on its leading edge.

[0084] The suction start position R1 is a position that is G1 away from the position where the tip of the substrate 11 overlaps with the gas inlet / outlet 21a and the gas inlet / outlet 21b toward the transfer chamber 1. G1 can be set as shown in the following formula 13, where G1≧0.

number

[0085] If the control unit 20 determines that the leading edge of the substrate 11 has not reached the suction start position R1 (step S402: NO), it waits while repeatedly executing step S402 in a loop.

[0086] When the control unit 20 determines that the tip of the substrate 11 has reached the suction start position R1 (step S402: YES), the process proceeds to step S403, where the control unit 20 starts suction of gas from the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0087] Next, in step S404, the control unit 20 determines whether the leading edge of the substrate 11 has reached the suction end position R2 based on the detection result of the position sensor provided in the transfer mechanism 10. The suction end position R2 corresponds to the position where the leading edge of the substrate 11 overlaps with the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0088] If the control unit 20 determines that the leading edge of the substrate 11 has not reached the suction end position R2 (step S404: NO), it waits while repeatedly executing step S404 in a loop.

[0089] When the control unit 20 determines that the tip of the substrate 11 has reached the suction end position R2 (step S404: YES), the process proceeds to step S405, where the control unit 20 ends the suction of gas from the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0090] In this embodiment, when substrate 11 moves to processing unit 3 through gas curtain 2 of inert gas, the gas mass (inert gas) in region 51 that moves along with the leading edge of substrate 11 is sucked and discharged from gas inlet / outlet 21a and gas inlet / outlet 21b by the above suction operation. This prevents the inert gas from being brought into processing unit 3 and being mixed into the atmosphere (e.g., CDA) of processing unit 3.

[0091] In the next step S406, the control unit 20 determines whether the rear end of the substrate 11 has reached the ejection start position R3 based on the detection result of the position sensor provided in the transport mechanism 10. FIG. 12 is a schematic diagram showing the positional relationship of each part at the time when the rear end of the substrate 11, moving in the A direction at a speed V1, reaches the ejection start position R3. As viewed in the A direction, which is the traveling direction, a region 52 that entrains (draws in) a gas mass exists at the rear end of the substrate 11 over a length L5. That is, the substrate 11 is moving toward the processing unit 3 with the region 52 that entrains the inert gas of the gas curtain 2 on its rear end side.

[0092] The ejection start position R3 is a position G2 away from the position where the rear end of the substrate 11 overlaps with the gas inlet / outlet 31a and the gas inlet / outlet 31b toward the transfer chamber 1. G2 can be set as shown in the following formula 14, where G2≧0.

number

[0093] If the control unit 20 determines that the rear end of the substrate 11 has not reached the ejection start position R3 (step S406: NO), it waits while repeatedly executing step S406 in a loop.

[0094] When the control unit 20 determines that the rear end of the substrate 11 has reached the ejection start position R3 (step S406: YES), it proceeds to step S407 and starts ejecting gas (e.g., the same type of gas as the gas curtain 2) from the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0095] In the following step S408, the control unit 20 determines whether the rear end of the substrate 11 has reached the ejection end position R4 based on the detection result of the position sensor provided in the transport mechanism 10. The ejection end position R4 is a position that is closer to the processing unit 3 by L5 (the width of the region 52) than the position where the rear end of the substrate 11 overlaps with the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0096] If the control unit 20 determines that the rear end of the substrate 11 has not reached the ejection end position R4 (step S408: NO), it waits while repeatedly executing step S408 in a loop.

[0097] When the control unit 20 determines that the rear end of the substrate 11 has reached the ejection end position R4 (step S408: YES), it proceeds to step S409 and ends the ejection of gas (e.g., the same type of gas as the gas curtain 2) from the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0098] In this embodiment, when substrate 11 moves to processing section 3 through gas curtain 2 of inert gas, inert gas is ejected from gas inlet / outlet 31a and gas inlet / outlet 31b by the above-described ejection operation, thereby mitigating the pressure drop that occurs on the rear end side of substrate 11. This mitigates the accompanying movement of the gas mass (inert gas) in region 52, and prevents the inert gas from being brought into processing section 3 and being mixed into the atmosphere (e.g., CDA) of processing section 3. When the substrate 11 is thus carried into the processing section 3, the control section 20 completes the transport processing of the substrate 11 in step S410.

[0099] (Control of substrate transfer from processing section to transfer chamber) 13 is a flowchart showing the procedure of the transfer process for transferring the substrate 11 from the processing unit 3 to the transfer chamber 1 via the passage 4. Each step of the process is executed by the control unit 20 controlling each part of the manufacturing apparatus 100.

[0100] When the transfer process starts, in step S501, the control unit 20 controls the transfer mechanism 10 to start moving the substrate 11 from the processing unit 3 toward the transfer chamber 1. A position sensor provided in the transfer mechanism 10 starts measuring the position of the robot hand holding the substrate 11, and thereafter transmits the detection results to the control unit. Under the control of the control unit 20, the gas curtain 2 is constantly formed even before the transfer process starts, but all four gas inlets 31a to 21b are closed.

[0101] In step S502, the control unit 20 determines whether the leading edge of the substrate 11 has reached the suction start position R11 based on the detection result of the position sensor provided in the transfer mechanism 10. FIG. 14 is a schematic diagram showing the positional relationship of each part at the time when the leading edge of the substrate 11, moving in the A' direction at a speed V2, reaches the suction start position R11. When viewed in the A' direction, which is the traveling direction, a region 51 for pushing out a gas mass exists at the leading edge of the substrate 11 over a length L12. That is, the substrate 11 is moving toward the transfer chamber 1 with the region 51 for pushing out the atmospheric gas of the processing unit 3 on its leading edge side.

[0102] The suction start position R11 is a position that is closer to the processing unit 3 by G11 than the position where the tip of the substrate 11 overlaps with the gas inlet / outlet 31a and the gas inlet / outlet 31b. G11 can be set as shown in the following formula 15, where G11≧0.

number

[0103] If the control unit 20 determines that the leading edge of the substrate 11 has not reached the suction start position R11 (step S502: NO), it waits while repeatedly executing step S502 in a loop.

[0104] When the control unit 20 determines that the tip of the substrate 11 has reached the suction start position R11 (step S502: YES), the process proceeds to step S503, where the control unit 20 starts suction of gas from the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0105] Next, in step S504, the control unit 20 determines whether the leading edge of the substrate 11 has reached the suction end position R12 based on the detection result of the position sensor provided in the transfer mechanism 10. The suction end position R12 corresponds to the position where the leading edge of the substrate 11 overlaps with the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0106] If the control unit 20 determines that the leading edge of the substrate 11 has not reached the suction end position R12 (step S504: NO), it waits while repeatedly executing step S504 in a loop.

[0107] When the control unit 20 determines that the tip of the substrate 11 has reached the suction end position R12 (step S504: YES), the process proceeds to step S505, where the control unit 20 ends the suction of gas from the gas inlet / outlet 31a and the gas inlet / outlet 31b.

[0108] In this embodiment, when the substrate 11 is moved to the transfer chamber 1 through the inert gas curtain 2, the gas mass (the atmosphere of the processing section 3) in the region 51 that moves with the leading edge of the substrate 11 is sucked and discharged from the gas inlet / outlet 31a and the gas inlet / outlet 31b by the above suction operation. This prevents the atmosphere of the processing section 3 (e.g., CDA) from being brought into the transfer chamber 1 and being mixed with the atmosphere of the transfer chamber 1 (e.g., N2).

[0109] In the next step S506, the control unit 20 determines whether the rear end of the substrate 11 has reached the ejection start position R13 based on the detection result of the position sensor provided in the transfer mechanism 10. FIG. 15 is a schematic diagram showing the positional relationship of each part at the time when the rear end of the substrate 11, moving in the A' direction at a speed V2, reaches the ejection start position R13. As viewed in the A' direction, which is the traveling direction, a region 52 carrying a gas mass exists at the rear end of the substrate 11 over a length L15. That is, the substrate 11 is moving toward the transfer chamber 1 with the region 52 carrying the atmospheric gas of the processing unit 3 on its rear end side.

[0110] The ejection start position R13 is a position G12 away from the position where the rear end of the substrate 11 overlaps with the gas inlet / outlet 21a and the gas inlet / outlet 21b toward the processing section 3. G12 can be set as shown in the following formula 16, where G12≧0.

number

[0111] If the control unit 20 determines that the rear end of the substrate 11 has not reached the ejection start position R13 (step S506: NO), it waits while repeatedly executing step S506 in a loop.

[0112] When the control unit 20 determines that the rear end of the substrate 11 has reached the ejection start position R13 (step S506: YES), it proceeds to step S507 and starts ejecting gas (for example, the same type of gas as the gas curtain 2) from the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0113] In the following step S508, the control unit 20 determines whether the rear end of the substrate 11 has reached the ejection end position R14 based on the detection result of the position sensor provided in the transfer mechanism 10. The ejection end position R14 is a position that is closer to the transfer chamber 1 by L15 (the width of the region 52) than the position where the rear end of the substrate 11 overlaps with the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0114] If the control unit 20 determines that the rear end of the substrate 11 has not reached the ejection end position R14 (step S508: NO), it waits while repeatedly executing step S508 in a loop.

[0115] When the control unit 20 determines that the rear end of the substrate 11 has reached the ejection end position R14 (step S508: YES), it proceeds to step S509 and terminates the ejection of gas (for example, the same type of gas as the gas curtain 2) from the gas inlet / outlet 21a and the gas inlet / outlet 21b.

[0116] In this embodiment, when the substrate 11 moves to the transfer chamber 1 through the gas curtain 2 of inert gas, the inert gas is ejected from the gas inlet / outlet 21a and the gas inlet / outlet 21b by the above-described ejection operation, thereby mitigating the pressure drop that occurs on the rear end side of the substrate 11. This mitigates the accompanying movement of the gas mass in the region 52 (the atmospheric gas of the processing section 3), and prevents the atmospheric gas of the processing section 3 from being brought into the transfer chamber 1 and being mixed into the atmosphere (e.g., N2) of the transfer chamber 1.

[0117] When the substrate 11 is thus carried into the processing section 3, the control section 20 completes the transport processing of the substrate 11 in step S510.

[0118] [Other embodiments] The present invention is not limited to the above-described embodiments, and many modifications are possible within the technical spirit of the present invention. For example, the above-described different embodiments may be combined in whole or in part.

[0119] For example, while Figure 2 shows a so-called cluster-type manufacturing system in which multiple processing devices are arranged radially around a transfer chamber, the application of the transfer system according to the present invention is not limited to cluster-type manufacturing systems. There is no problem with applying the system to a so-called in-line-type manufacturing system in which a transfer chamber and processing chambers are arranged linearly.

[0120] In the above-described embodiment, a configuration has been exemplified in which the substrate 11, which is the object to be transferred, can move within the passage 4 in either direction A (from the transfer chamber to the processing device) or direction A' (from the processing device to the transfer chamber). However, for example, in an inline manufacturing system, the system may be configured by connecting devices in series, such as first transfer chamber - first passage - processing device - second passage - second transfer chamber. In this case, in the first passage, the substrate moves only in the direction from the first transfer chamber to the processing device, and in the second passage, the substrate moves only in the direction from the first transfer chamber to the processing device. The present invention can also be implemented in such a system. That is, for the first passage, the same device configuration and control method as those used in the above-described embodiment for moving the substrate in direction A can be implemented, and for the second passage, the same device configuration and control method as those used in the above-described embodiment for moving the substrate in direction A' can be implemented.

[0121] Specifically, the system includes a first transfer chamber in which a first atmosphere circulates, a processing device that processes the transferred object in a second atmosphere different from the first atmosphere, and a first passage connecting the first transfer chamber and the processing device. Furthermore, the system includes a gas curtain mechanism that forms a gas curtain in the first passage to prevent the first atmosphere in the first transfer chamber and the second atmosphere in the processing device from mixing, a transfer mechanism that moves the transferred object from the first transfer chamber toward the processing device through the first passage, and a control unit.

[0122] The first passage is provided with an ejection means for ejecting gas into the region where the gas curtain is formed, and a suction means for sucking the gas at a position closer to the processing device than the region where the gas curtain is formed.

[0123] The control unit does not drive either the suction means or the ejection means when the transported object is not present in the first passage. The control unit drives the suction means when the leading end of the transported object is located in a position within the first passage closer to the processing device than the area where the gas curtain is formed, and drives the ejection means when the trailing end of the transported object is within the area where the gas curtain is formed.

[0124] Also provided are a processing device that processes the transferred object in the second atmosphere, a second transfer chamber in which a third atmosphere different from the second atmosphere circulates, and a second passage connecting the processing device and the second transfer chamber.Further provided are a gas curtain mechanism that forms a gas curtain in the second passage to prevent the third atmosphere in the second transfer chamber from mixing with the second atmosphere in the processing device, a transfer mechanism that moves the transferred object from the processing chamber toward the second transfer chamber through the second passage, and a control unit.

[0125] The second passage is provided with a suction means for sucking gas within the region where the gas curtain is formed, and a jetting means for jetting gas at a position closer to the processing device than the region where the gas curtain is formed.

[0126] The control unit does not drive either the suction means or the ejection means when the transported object is not present in the second passage. The control unit drives the suction means when the leading end of the transported object is within the area where the gas curtain is formed in the second passage, and drives the ejection means when the trailing end of the transported object is in a position closer to the processing device than the area where the gas curtain is formed.

[0127] Furthermore, in the first embodiment, the position of the substrate, which is the transported object, is detected using a sensor installed in the aisle, and in the second embodiment, the position of the substrate, which is the transported object, is detected based on operational information of the transport mechanism. For example, the position of the leading edge of the substrate may be detected using a sensor installed in the aisle, and the position of the trailing edge of the substrate may be detected based on operational information of the transport mechanism. Conversely, the position of the trailing edge of the substrate may be detected using a sensor installed in the aisle, and the position of the leading edge of the substrate may be detected based on operational information of the transport mechanism. Alternatively, the control unit may detect the positions of the leading and trailing edges of the substrate based on both the detection results of the sensor installed in the aisle and the operational information of the transport mechanism.

[0128] In addition, in the example shown, four gas inlets 31a to 21b are arranged in the passage 4, two on each of the front and back sides of the substrate 11, but the arrangement of the gas inlets is not limited to this example. For example, a number of gas inlets other than four may be provided. Furthermore, instead of gas inlets that can eject and suck gas, a separate gas ejection port that can eject gas and a separate suction port that can suck gas may be provided.

[0129] Furthermore, in the above example, gas is ejected into a low-pressure region generated at the rear end of the substrate, which is the transported object, to suppress a drop in pressure and prevent the gas from moving along with the substrate. However, embodiments of the present invention are not limited to this. For example, instead of or in addition to the gas ejection operation described above, a process may be performed in which a suction device sucks in the gas that is moving along with the rear end of the substrate at a position further along the substrate's traveling direction. The suction device that sucks the rear end of the substrate may also be used as a suction device that performs a suction operation on the front end of the substrate. In this way, it is possible to prevent the intrusion of atmosphere using only one suction device.

[0130] An embodiment of the present invention also includes a method for manufacturing an article, in which a substrate, which is a transport object, is moved to a processing chamber using a transport system according to any of the above-described embodiments, and the substrate is processed to manufacture the article.

[0131] The present invention can also be realized by supplying a program that realizes one or more functions of the embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program.The present invention can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0132] This specification discloses at least the following: [Item 1] a transfer chamber in which a first atmosphere is circulated; a processing device that processes the object in a second atmosphere having a composition different from that of the first atmosphere; a passageway connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transport mechanism that moves the object via the passage along a first direction from the transport chamber toward the processing device or along a second direction from the processing device toward the transport chamber; a control unit, The passageway includes: a first suction means for suctioning gas within the region where the gas curtain is formed; a first ejection means for ejecting gas into an area where the gas curtain is formed; a second suction means for suctioning gas at a position closer to the processing device than the area where the gas curtain is formed; a second ejection means for ejecting gas at a position closer to the processing device than the region where the gas curtain is formed, The control unit When the object passes through the passage, at least one of the first suction means, the first ejection means, the second suction means, and the second ejection means is driven depending on the direction in which the transport mechanism moves the object and the position of the object. A transport system characterized by: [Matter 2] When the transport mechanism moves the object in the first direction, The control unit driving the second suction means when the leading end of the transported object is located closer to the processing device than the area where the gas curtain is formed; driving the first ejection means when the rear end of the transported object is within the region where the gas curtain is formed; Item 1. A transport system according to item 1. [Matter 3] When the transport mechanism moves the transported object in the second direction, The control unit driving the first suction means when the tip of the object is within the region where the gas curtain is formed; driving the second ejection means when the rear end of the transported object is located closer to the processing device than the area where the gas curtain is formed; 3. The transport system according to item 1 or 2. [Matter 4] A sensor is disposed in the passage to detect the position of the transported object and notify the control unit. 4. The transport system according to any one of items 1 to 3. [Matter 5] The transport mechanism notifies the control unit of the position of the transported object in the passage. 5. A transport system according to any one of items 1 to 4. [Matter 6] The first atmosphere contains an inert gas in an amount of 90% or more by volume, The second atmosphere contains more oxygen by volume than the first atmosphere. 6. A transport system according to any one of items 1 to 5. [Matter 7] The gas curtain is formed by circulating a gas containing 90% or more of an inert gas by volume. 7. A transport system according to any one of items 1 to 6. [Matter 8] The first suction means and the first ejection means are connected to the passage via a common gas inlet / outlet. 8. A transport system according to any one of items 1 to 7. [Matter 9] The second suction means and the second ejection means are connected to the passage via a common gas inlet / outlet. 9. A transport system according to any one of items 1 to 8. [Matter 10] Using the conveying system according to any one of items 1 to 9, the conveyed object is moved to the processing device, and the conveyed object is processed. A method for manufacturing an article. [Matter 11] a transfer chamber in which a first atmosphere is circulated; a processing device that processes the object in a second atmosphere having a composition different from that of the first atmosphere; a passageway connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transport mechanism that moves the object via the passage along a first direction from the transport chamber toward the processing device or along a second direction from the processing device toward the transport chamber; a control unit, The passageway includes: a first suction means for suctioning gas within the region where the gas curtain is formed; a first ejection means for ejecting gas into an area where the gas curtain is formed; a second suction means for suctioning gas at a position closer to the processing device than the area where the gas curtain is formed; a second ejection means for ejecting gas at a position closer to the processing device than the region where the gas curtain is formed, The control unit When the object passes through the passage, at least one of the first suction means, the first ejection means, the second suction means, and the second ejection means is driven depending on the direction in which the transport mechanism moves the object and the position of the object. A transport method characterized by: [Matter 12] When the transport mechanism moves the object in the first direction, The control unit driving the second suction means when the leading end of the transported object is located closer to the processing device than the area where the gas curtain is formed; driving the first ejection means when the rear end of the transported object is within the region where the gas curtain is formed; 12. The method of claim 11. [Matter 13] When the transport mechanism moves the transported object in the second direction, The control unit driving the first suction means when the tip of the object is within the region where the gas curtain is formed; driving the second ejection means when the rear end of the transported object is located closer to the processing device than the area where the gas curtain is formed; 13. The method of claim 11 or 12. [Matter 14] a sensor disposed in the passage detects the position of the transported object and notifies the control unit; 14. The method of transport according to any one of items 11 to 13. [Matter 15] the conveying mechanism notifies the control unit of the position of the conveyed object in the passage; 15. The transport method according to any one of items 11 to 14. [Matter 16] The first atmosphere contains an inert gas in an amount of 90% or more by volume, The second atmosphere contains more oxygen by volume than the first atmosphere. 16. The method of transport according to any one of items 11 to 15. [Matter 17] The gas curtain is formed by circulating a gas containing 90% or more of an inert gas by volume. 17. The method of claim 11, wherein the first and second electrodes are connected to each other. [Matter 18] The first suction means and the first ejection means are connected to the passage via a common gas inlet / outlet. 18. The method of transport according to any one of items 11 to 17. [Matter 19] The second suction means and the second ejection means are connected to the passage via a common gas inlet / outlet. 19. The method of transport according to any one of items 11 to 18. [Matter 20] 20. A control program for causing the control unit to execute each process of the conveying method described in any one of items 11 to 19. [Matter 21] 21. A computer-readable recording medium having the control program according to item 20 recorded thereon. [Matter 22] a transfer chamber in which a first atmosphere is circulated; a processing device that processes the object in a second atmosphere having a composition different from that of the first atmosphere; a passageway connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transport mechanism that moves the object from the transport chamber toward the processing device via the passage; a control unit, the passage is provided with a jetting means for jetting gas into an area where the gas curtain is formed, and a suction means for suctioning the gas at a position closer to the processing device than the area where the gas curtain is formed; The control unit driving the suction means when the leading end of the transported object is located closer to the processing device than the area where the gas curtain is formed; the ejection means is driven when the rear end of the transported object is within the region where the gas curtain is formed. A transport system characterized by: [Matter 23] a transfer chamber in which a first atmosphere is circulated; a processing device that processes the object in a second atmosphere having a composition different from that of the first atmosphere; a passageway connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transport mechanism that moves the object from the processing device toward the transport chamber via the passage; a control unit, a suction means for suctioning gas within a region where the gas curtain is formed, and a jetting means for jetting gas at a position closer to the processing device than the region where the gas curtain is formed are disposed in the passage; The control unit driving the suction means when the tip of the object is within the region where the gas curtain is formed; the ejection means is driven when the rear end of the transported object is located closer to the processing device than the area where the gas curtain is formed. A transport system characterized by: [Explanation of symbols]

[0133] 1 Transfer chamber / 2 Gas curtain / 3 Processing section / 4 Passageway / 10 Transfer mechanism / 11 Substrate / 20 Control section / 21a, 21b Gas inlet / outlet / 31a, 31b Gas inlet / outlet / 41 Sensor / 42 Sensor / 51, 52 Area / 60 Load lock chamber / 61 Gate / 62-67 Processing section

Claims

1. a transfer chamber in which a first atmosphere is circulated; a processing device that processes the object in a second atmosphere having a composition different from that of the first atmosphere; a passageway connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transport mechanism that moves the object via the passage along a first direction from the transport chamber toward the processing device or along a second direction from the processing device toward the transport chamber; a control unit, The passageway includes: a first suction means for suctioning gas within the region where the gas curtain is formed; a first ejection means for ejecting gas into an area where the gas curtain is formed; a second suction means for suctioning gas at a position closer to the processing device than the area where the gas curtain is formed; a second ejection means for ejecting gas at a position closer to the processing device than the region where the gas curtain is formed, The control unit When the object passes through the passage, at least one of the first suction means, the first ejection means, the second suction means, and the second ejection means is driven depending on the direction in which the transport mechanism moves the object and the position of the object. A transport system characterized by:

2. When the transport mechanism moves the transported object in the first direction, The control unit driving the second suction means when the leading end of the transported object is located closer to the processing device than the area where the gas curtain is formed; driving the first ejection means when the rear end of the transported object is within the region where the gas curtain is formed; 2. The transport system according to claim 1.

3. When the transport mechanism moves the transported object in the second direction, The control unit driving the first suction means when the tip of the object is within the region where the gas curtain is formed; driving the second ejection means when the rear end of the transported object is located closer to the processing device than the area where the gas curtain is formed; 2. The transport system according to claim 1.

4. A sensor is disposed in the passage to detect the position of the transported object and notify the control unit.

2. The transport system according to claim 1.

5. The transport mechanism notifies the control unit of the position of the transported object in the passage.

2. The transport system according to claim 1.

6. The first atmosphere contains an inert gas in a volume ratio of 90% or more, The second atmosphere contains more oxygen by volume than the first atmosphere.

6. The transport system according to claim 1, wherein the transport system is a transport system for transporting a plurality of objects.

7. The gas curtain is formed by circulating a gas containing an inert gas in a volume ratio of 90% or more.

6. The transport system according to claim 1, wherein the transport system is a transport system for transporting a plurality of objects.

8. the first suction means and the first ejection means are connected to the passage via a common gas inlet / outlet.

6. The transport system according to claim 1, wherein the transport system is a transport system for transporting a plurality of objects.

9. the second suction means and the second ejection means are connected to the passage via a common gas inlet / outlet.

6. The transport system according to claim 1, wherein the transport system is a transport system for transporting a plurality of objects.

10. The transport system according to any one of claims 1 to 5 is used to move the transported object to the processing device, and the transported object is processed. A method for manufacturing an article.

11. a transfer chamber in which a first atmosphere is circulated; a processing device that processes the object in a second atmosphere having a composition different from that of the first atmosphere; a passageway connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transport mechanism that moves the object via the passage along a first direction from the transport chamber toward the processing device or along a second direction from the processing device toward the transport chamber; a control unit, The passageway includes: a first suction means for suctioning gas within the region where the gas curtain is formed; a first ejection means for ejecting gas into an area where the gas curtain is formed; a second suction means for suctioning gas at a position closer to the processing device than the area where the gas curtain is formed; a second ejection means for ejecting gas at a position closer to the processing device than a region where the gas curtain is formed, The control unit When the object passes through the passage, at least one of the first suction means, the first ejection means, the second suction means, and the second ejection means is driven depending on the direction in which the transport mechanism moves the object and the position of the object. A transport method characterized by:

12. When the transport mechanism moves the transported object in the first direction, The control unit driving the second suction means when the leading end of the transported object is located closer to the processing device than the area where the gas curtain is formed; driving the first ejection means when the rear end of the transported object is within the region where the gas curtain is formed; 12. The method of claim 11.

13. When the transport mechanism moves the transported object in the second direction, The control unit driving the first suction means when the tip of the object is within the region where the gas curtain is formed; driving the second ejection means when the rear end of the transported object is located closer to the processing device than the area where the gas curtain is formed; 12. The method of claim 11.

14. a sensor disposed in the passage detects the position of the transported object and notifies the control unit; 12. The method of claim 11.

15. the conveying mechanism notifies the control unit of the position of the conveyed object in the passage; 12. The method of claim 11.

16. The first atmosphere contains an inert gas in a volume ratio of 90% or more, The second atmosphere contains more oxygen by volume than the first atmosphere.

16. The method of claim 11, wherein the first and second electrodes are connected to each other.

17. The gas curtain is formed by circulating a gas containing an inert gas in a volume ratio of 90% or more.

16. The method of claim 11, wherein the first and second electrodes are connected to each other.

18. the first suction means and the first ejection means are connected to the passage via a common gas inlet / outlet.

16. The method of claim 11, wherein the first and second electrodes are connected to each other.

19. the second suction means and the second ejection means are connected to the passage via a common gas inlet / outlet.

16. The method of claim 11, wherein the first and second electrodes are connected to each other.

20. A control program for causing the control unit to execute each process of the conveying method according to any one of claims 11 to 15.

21. A computer-readable recording medium on which the control program according to claim 20 is recorded.

22. a transfer chamber in which a first atmosphere is circulated; a processing device that processes the object in a second atmosphere having a composition different from that of the first atmosphere; a passageway connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transport mechanism that moves the object from the transport chamber toward the processing device via the passage; a control unit, the passage is provided with a jetting means for jetting gas into an area where the gas curtain is formed, and a suction means for suctioning the gas at a position closer to the processing device than the area where the gas curtain is formed; The control unit driving the suction means when the leading end of the transported object is located closer to the processing device than the area where the gas curtain is formed; the ejection means is driven when the rear end of the transported object is within the region where the gas curtain is formed. A transport system characterized by:

23. a transfer chamber in which a first atmosphere is circulated; a processing device that processes the object in a second atmosphere having a composition different from that of the first atmosphere; a passageway connecting the transfer chamber and the processing device; a gas curtain mechanism that forms a gas curtain in the passage to prevent the first atmosphere in the transfer chamber and the second atmosphere in the processing device from mixing; a transport mechanism that moves the object from the processing device toward the transport chamber via the passage; a control unit, a suction means for suctioning gas within a region where the gas curtain is formed, and a jetting means for jetting gas at a position closer to the processing device than the region where the gas curtain is formed are disposed in the passage; The control unit driving the suction means when the tip of the object is within the region where the gas curtain is formed; the ejection means is driven when the rear end of the transported object is located closer to the processing device than the area where the gas curtain is formed. A transport system characterized by:

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