Substrate processor and method for processing substrate

Abstract

To provide a substrate processor which can suppress breakage or missing of pieces of a laminate substrate in which a plurality of substrates are joined to each other and can improve the productivity of a processing process.SOLUTION: A substrate processor 1 includes: a substrate holding device 2 for holding a laminate substrate Ws in which a first substrate W1 and a second substrate W2 are joined to each other and rotating the laminate substrate; an ejection nozzle 3 for accelerating filler particles Fp forming a filling layer L and blowing the filler particles Fp to a gap G between an edge part E1 of the first substrate W1 and an edge part E2 of the second substrate W2; and a filler particle supply line 12 connected to the ejection nozzle 3, the line being for supplying the filler particles Fp to the ejection nozzle 3.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for forming a filling layer on a laminated substrate in which a plurality of substrates are bonded together. [Background technology]

[0002] In recent years, in order to achieve even higher density and higher performance in semiconductor devices, development of three-dimensional packaging technology, which stacks multiple substrates to integrate them three-dimensionally, has progressed. In three-dimensional packaging technology, for example, the device surface of a first substrate on which integrated circuits and electrical wiring are formed is bonded to the device surface of a second substrate on which integrated circuits and electrical wiring are formed. Furthermore, after bonding the first substrate to the second substrate, the second substrate is thinned using a polishing or grinding device. In this way, integrated circuits can be stacked in a direction perpendicular to the device surfaces of the first and second substrates.

[0003] In 3D packaging technology, three or more substrates may be bonded together. For example, after a second substrate is bonded to a first substrate and then bonded to the second substrate, a third substrate may be bonded to the second substrate and then bonded to the third substrate. In this specification, the form of multiple substrates bonded together may be referred to as a "laminated substrate."

[0004] Typically, the edges of a substrate are pre-polished to a rounded or chamfered shape to prevent cracks and chipping. When a second substrate having such a shape is ground, a sharp edge is formed on the second substrate. This sharp edge (hereinafter referred to as a knife edge) is formed by the back surface of the ground second substrate and the outer peripheral surface of the second substrate. Such a knife edge is easily chipped by physical contact, which can damage the laminated substrate itself during transportation. Furthermore, if the bonding between the first and second substrates is insufficient, the second substrate may crack during grinding.

[0005] Therefore, to prevent cracking or chipping of the knife edge, a filler is applied to the laminated substrate before grinding the second substrate. The filler is applied to the gap between the edge of the first substrate and the edge of the second substrate. The filler supports the knife edge formed after grinding the second substrate, preventing cracking or chipping of the knife edge. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 2022-38834 Summary of the Invention [Problem to be solved by the invention]

[0007] Conventionally, fillers used to fill the gap between the edge of a first substrate and the edge of a second substrate contain a heat-curing material and a solvent. In the process of applying such fillers to laminated substrates, after the filler is applied to the gap between the edge of the first substrate and the edge of the second substrate, a curing process is performed in which the filler is cured by heat and the solvent contained in the filler is volatilized. This curing process takes a relatively long time, which can reduce the productivity of the entire process.

[0008] Furthermore, if the solvent in the filler is not completely removed during the curing process, the remaining solvent components may contaminate the substrate in subsequent processes and adversely affect the device. Therefore, a process of removing the filler from the laminated substrate may be required after thinning the second substrate.

[0009] Therefore, the present invention provides a substrate processing apparatus and a substrate processing method that can prevent cracking and chipping of a laminated substrate formed by bonding a plurality of substrates and improve the productivity of the processing process. [Means for solving the problem]

[0010] In one aspect, a substrate processing apparatus is provided that forms a filling layer on a laminated substrate formed by bonding a first substrate and a second substrate, the substrate processing apparatus comprising: a substrate holding device that holds and rotates the laminated substrate; a spray nozzle that accelerates filler particles that constitute the filling layer and sprays the filler particles into the gap between the edge portion of the first substrate and the edge portion of the second substrate; and a filler particle supply line connected to the spray nozzle for supplying the filler particles to the spray nozzle. In one embodiment, the spray nozzle is a plasma spray nozzle that accelerates the filler particles with heat from the plasma and melts the filler particles with the heat from the plasma. In one embodiment, the injection nozzle is a flame spray nozzle that accelerates the filler particles with heat from a combustion flame and melts the filler particles with heat from the combustion flame. In one embodiment, the injection nozzle is a Laval nozzle that accelerates the filler particles to a speed greater than the speed of sound.

[0011] In one aspect, the substrate processing apparatus further includes a heated gas supply line connected to the Laval nozzle for supplying heated gas to the Laval nozzle, and the Laval nozzle is configured to heat the filler particles with the heated gas. In one aspect, the substrate processing apparatus further includes a vaporization chamber connected to the filler particle supply line for vaporizing the filler material from which the filler particles are made, and the Laval nozzle is configured to accelerate the filler particles formed from the vaporized filler material and spray the filler particles into the gap. In one aspect, the substrate processing apparatus further includes a suspension generating device connected to the filler particle supply line that disperses the filler particles in a liquid to generate a suspension containing the filler particles, and the spray nozzle is configured to accelerate the suspension and spray the suspension into the gap. In one aspect, the substrate processing apparatus further includes an aerosol chamber connected to the filler particle supply line for aerosolizing the filler particles, and the spray nozzle is configured to accelerate the aerosolized filler particles and spray the aerosolized filler particles into the gap.

[0012] In one aspect, the substrate processing apparatus further includes a swinging mechanism that swings the laminated substrate or the injection nozzle about a predetermined swing center. In one aspect, the substrate processing apparatus further includes a movement mechanism that moves the laminated substrate or the injection nozzle in a thickness direction of the laminated substrate. In one aspect, the substrate processing apparatus further includes an edge shape detector that detects the shape of the edge portion of the laminated substrate, and an operation control unit that controls the operation of the oscillating mechanism, and the operation control unit is configured to cause the oscillating mechanism to oscillate the laminated substrate or the injection nozzle around the oscillating center based on the detected shape of the edge portion. In one aspect, the substrate processing apparatus further includes an edge shape detector that detects the shape of the edge portion of the laminated substrate, and an operation control unit that controls the operation of the moving mechanism, and the operation control unit is configured to cause the moving mechanism to move the laminated substrate or the injection nozzle in the thickness direction of the laminated substrate based on the detected shape of the edge portion. In one embodiment, the filler particles are made of the same material or compound as the material that makes up the laminate substrate. In one embodiment, the filler particles are comprised of a ceramic.

[0013] In one aspect, a substrate processing method is provided for forming a filling layer on a laminated substrate formed by bonding a first substrate and a second substrate, the method comprising: supplying filler particles that constitute the filling layer to an injection nozzle; accelerating the filler particles with the injection nozzle while rotating the laminated substrate; and spraying the filler particles into the gap between the edge portion of the first substrate and the edge portion of the second substrate. In one aspect, accelerating the filler particles with the injection nozzle and spraying the filler particles into the gap involves accelerating the filler particles with plasma heat using a plasma spray nozzle, melting the filler particles with the plasma heat, and spraying the molten filler particles into the gap. In one aspect, accelerating the filler particles with the injection nozzle and spraying the filler particles into the gap involves accelerating the filler particles with the heat of a combustion flame using a flame spray nozzle, melting the filler particles with the heat of the combustion flame, and spraying the molten filler particles into the gap. In one embodiment, accelerating the filler particles by the injection nozzle is accelerating the filler particles to a speed equal to or greater than the speed of sound by a Laval nozzle.

[0014] In one aspect, the substrate processing method further includes supplying heated gas to the Laval nozzle, and accelerating the filler particles with the injection nozzle and spraying the filler particles into the gap means accelerating the filler particles with the Laval nozzle to a speed greater than or equal to the speed of sound, heating the filler particles with the heated gas, and spraying the heated filler particles into the gap. In one aspect, supplying the filler particles to the injection nozzle means vaporizing a filler material that is the material of the filler particles and supplying filler particles formed from the vaporized filler material to the injection nozzle, and accelerating the filler particles with the injection nozzle and spraying the filler particles into the gap means accelerating the filler particles to a speed greater than the speed of sound with the Laval nozzle and spraying the filler particles into the gap. In one aspect, supplying the filler particles to the spray nozzle means dispersing the filler particles in a liquid to generate a suspension containing the filler particles and supplying the suspension to the spray nozzle, and accelerating the filler particles with the spray nozzle and spraying the filler particles into the gap means accelerating the suspension with the spray nozzle and spraying the suspension into the gap. In one aspect, supplying the filler particles to the spray nozzle means aerosolizing the filler particles and supplying the aerosolized filler particles to the spray nozzle, and accelerating the filler particles with the spray nozzle and spraying the filler particles into the gap means accelerating the aerosolized filler particles with the spray nozzle and spraying the aerosolized filler particles into the gap.

[0015] In one aspect, the substrate processing method further includes swinging the laminated substrate or the injection nozzle about a predetermined swing center. In one aspect, the substrate processing method further includes moving the laminated substrate or the injection nozzle in a thickness direction of the laminated substrate. In one aspect, the substrate processing method further includes detecting the shape of an edge portion of the laminated substrate, and oscillating the laminated substrate or the injection nozzle around the oscillation center based on the detected shape of the edge portion. In one aspect, the substrate processing method further includes detecting the shape of an edge portion of the laminated substrate, and moving the laminated substrate or the injection nozzle in the thickness direction of the laminated substrate based on the detected shape of the edge portion. In one embodiment, the filler particles are made of the same material or compound as the material that makes up the laminate substrate. In one embodiment, the filler particles are comprised of a ceramic. [Effects of the Invention]

[0016] According to the present invention, by forming a filler layer in the gap between the edge portion of the first substrate and the edge portion of the second substrate, the knife edge formed on the edge portion of the second substrate is protected. As a result, cracking and chipping of the laminated substrate can be suppressed. Furthermore, the filler layer is formed by accelerating filler particles and spraying them into the gap between the edge portion of the first substrate and the edge portion of the second substrate, and since a subsequent curing step is not required, the productivity of the treatment process can be improved. [Brief explanation of the drawings]

[0017] [Figure 1] Figure 1(a) is a cross-sectional view showing an example of an edge portion of a laminated substrate to be processed, Figure 1(b) is a cross-sectional view showing an example of an edge portion of a laminated substrate on which a filling layer has been formed, and Figure 1(c) is a cross-sectional view showing an example of an edge portion of a laminated substrate that has been thinned after a filling layer has been formed. [Figure 2] 1 is a front view showing an embodiment of a substrate processing apparatus. [Figure 3] FIG. 3 is a side view of the substrate processing apparatus shown in FIG. [Figure 4] FIG. 2 is a schematic diagram illustrating an embodiment of an injection nozzle. [Figure 5] FIG. 10 is a schematic diagram showing another embodiment of the injection nozzle. [Figure 6] FIG. 10 is a schematic diagram showing yet another embodiment of the injection nozzle. [Figure 7] FIG. 10 is a side view showing another embodiment of the substrate processing apparatus. [Figure 8] FIG. 10 is a side view showing still another embodiment of the substrate processing apparatus. [Figure 9] FIG. 10 is a side view showing still another embodiment of the substrate processing apparatus. [Figure 10] FIG. 10 is a side view showing still another embodiment of the substrate processing apparatus. [Figure 11] 10 is a schematic diagram showing how filler particles are deposited in gaps between laminated substrates by a spray nozzle. FIG. [Figure 12] 10A and 10B are schematic diagrams illustrating an embodiment of a method for forming a filling layer in gaps in a laminated substrate by rocking the laminated substrate using a substrate rocking mechanism. [Figure 13] FIG. 10 is a side view showing another embodiment of the swing mechanism. [Figure 14] FIG. 10 is a side view showing still another embodiment of the substrate processing apparatus. [Figure 15] 10A and 10B are schematic diagrams illustrating an embodiment of a method for forming a filling layer in a gap in a laminated substrate by moving the laminated substrate in its thickness direction using a substrate moving mechanism. [Figure 16]FIG. 10 is a side view showing another embodiment of the moving mechanism. [Figure 17] FIG. 10 is a front view showing still another embodiment of the substrate processing apparatus. [Figure 18] 10A and 10B are diagrams illustrating an example of an image of an edge portion of a laminated substrate generated by an edge shape detector. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1(a) is a cross-sectional view showing an example of an edge portion of a laminated substrate Ws to be processed. As shown in Fig. 1(a), the laminated substrate Ws has a structure in which a first substrate W1 and a second substrate W2 are joined together. The first substrate W1 and the second substrate W2 used in this embodiment are circular.

[0019] The edge portion E1 of the first substrate W1 is the outermost side surface inclined with respect to the bonding surface (e.g., device surface) S1 of the first substrate W1. More specifically, the edge portion E1 of the first substrate W1 has a rounded or chamfered shape. The edge portion E2 of the second substrate W2 is also the outermost side surface inclined with respect to the bonding surface (e.g., device surface) S2 of the second substrate W2. More specifically, the edge portion E2 of the second substrate W2 has a rounded or chamfered shape. The edge portions E1 and E2 are sometimes called bevel portions. A gap G is formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. The edge portions of the laminated substrate Ws include the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.

[0020] 1(b) is a cross-sectional view showing an example of an edge portion of a laminated substrate Ws on which a filling layer L is formed. The filling layer L is formed in the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. This gap G is formed around the entire periphery of the laminated substrate Ws and has a substantially triangular cross section. The filling layer L is formed to fill this gap G.

[0021] 1(c) is a cross-sectional view showing an example of an edge portion of the laminated substrate Ws that has been thinned after the formation of the filling layer L. As a result of this thinning process, a knife edge portion Ek is formed at the edge portion E2 of the second substrate W2. Because the knife edge portion Ek is held (supported) by the filling layer L, the knife edge portion Ek is prevented from cracking or chipping.

[0022] Fig. 2 is a front view showing one embodiment of the substrate processing apparatus 1, and Fig. 3 is a side view of the substrate processing apparatus 1 shown in Fig. 2. The substrate processing apparatus 1 is an apparatus for forming a filling layer L on a laminated substrate Ws in which a first substrate W1 and a second substrate W2 are bonded together. The substrate processing apparatus 1 includes a substrate holding device 2 that holds the laminated substrate Ws in a vertical position and rotates the held laminated substrate Ws, and an injection nozzle 3 that forms a filling layer L on the laminated substrate Ws.

[0023] The substrate holding device 2 includes a holding stage 5 that holds the back surface of the multilayer substrate Ws, a rotation shaft 6 connected to the center of the holding stage 5, and a rotation mechanism 8 that rotates the holding stage 5 and the rotation shaft 6. The holding stage 5 is configured to hold the back surface of the multilayer substrate Ws by vacuum suction. As shown in FIG. 3, the holding stage 5 has a holding surface 5a that is perpendicular to the horizontal plane. The multilayer substrate Ws is held by the holding stage 5 so that the flat portion of the multilayer substrate Ws is perpendicular to the horizontal plane. Therefore, the multilayer substrate Ws is held in a vertical position by the substrate holding device 2.

[0024] The rotation mechanism 8 includes a motor (not shown) and is configured to rotate the holding stage 5 and the laminated substrate Ws held by the holding stage 5 together in the direction indicated by the arrow in FIG. 2 around the rotation axis R of the substrate holding device 2.

[0025] In one embodiment, the substrate holding device 2 may be provided with, instead of the holding stage 5, a plurality of (e.g., four) rollers (not shown) that can contact the peripheral portion of the laminated substrate Ws, and the laminated substrate Ws may be held by these rollers so that the flat portion of the laminated substrate Ws is perpendicular to the horizontal plane. In this case, instead of the rotation shaft 6 and the rotation mechanism 8, the substrate holding device 2 is provided with a roller rotation mechanism (not shown) that rotates each roller around its axis at the same speed in the same direction. By rotating the plurality of rollers using the roller rotation mechanism, the laminated substrate Ws is rotated around the rotation center of the substrate holding device 2.

[0026] In another embodiment, the holding stage 5 of the substrate holding device 2 may have a holding surface parallel to the horizontal plane, and the multilayer substrate Ws may be held by the holding stage 5 so that the flat portion of the multilayer substrate Ws is parallel to the horizontal plane. In other words, the multilayer substrate Ws may be held in a horizontal position by the substrate holding device 2.

[0027] The substrate processing apparatus 1 is equipped with a filler particle supply line 12 for supplying filler particles Fp constituting the filling layer L to the injection nozzle 3. The filler particle supply line 12 is connected to the injection nozzle 3. The injection nozzle 3 is connected to a filler particle supply source 13 via the filler particle supply line 12. The filler particles Fp are powder that does not contain volatile components such as solvents. In one embodiment, the particle size (diameter) of the filler particles Fp is in the range of 1 μm to 100 μm, and more preferably, the particle size (diameter) of the filler particles Fp is in the range of 1 μm to 10 μm. An example of the filler particle supply source 13 is a disk-type powder feeder.

[0028] The filler particles Fp are composed of the same material (e.g., silicon, etc.) as the material constituting the laminated substrate Ws, or a compound thereof (e.g., silicon oxide, silicon nitride, silicon carbide, etc.). In one embodiment, the filler particles Fp may be a material (e.g., a ceramic such as alumina, zirconia, silicon oxide, silicon nitride, or silicon carbide) having mechanical properties (e.g., tensile strength, etc.) or thermal properties (e.g., heat resistance, linear expansion coefficient, etc.) similar to those of the laminated substrate Ws, or another material used in semiconductor manufacturing processes (e.g., a metal such as tungsten, carbon, etc.). The filler layer L formed in the laminated substrate Ws using filler particles Fp composed of such a material does not contaminate the laminated substrate Ws in subsequent processes. Therefore, there is no need to remove the filler layer L from the laminated substrate Ws after thinning the second substrate W2, thereby improving productivity of the entire process.

[0029] The filler particle supply source 13 is connected to a carrier gas supply source 16 via a carrier gas supply line 15. When a carrier gas is supplied from the carrier gas supply source 16 through the carrier gas supply line 15 to the filler particle supply source 13, the filler particles Fp in the filler particle supply source 13 flow into the filler particle supply line 12 together with the carrier gas. The filler particles Fp are supplied to the injection nozzle 3 through the filler particle supply line 12 together with the carrier gas. Examples of the carrier gas include gases such as nitrogen, air, helium, and argon, or mixtures of these.

[0030] A flow rate adjustment valve 17 and a flow meter 18 are attached to the carrier gas supply line 15. The flow rate adjustment valve 17 is configured to adjust the flow rate of the carrier gas flowing through the carrier gas supply line 15. The carrier gas supply line 15 is connected to the filler particle supply line 12 via the filler particle supply source 13. Therefore, the flow rates of the carrier gas and filler particles Fp flowing through the filler particle supply line 12 can be adjusted by the flow rate adjustment valve 17. The flow meter 18 is configured to measure the flow rate of the carrier gas flowing through the carrier gas supply line 15. In one embodiment, the flow rate adjustment valve 17 and the flow meter 18 may be attached to the filler particle supply line 12.

[0031] The injection nozzle 3 is located radially outward of the laminated substrate Ws held by the substrate holding device 2, and is disposed above the laminated substrate Ws facing the gap G between the laminated substrates Ws. The injection nozzle 3 is configured to accelerate the filler particles Fp and spray the filler particles Fp into the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 of the laminated substrate Ws. The injection nozzle 3 is configured to collide the accelerated filler particles Fp with the laminated substrate Ws, thereby forming a filling layer L in the gap G between the laminated substrates Ws.

[0032] In one embodiment, the velocity of the filler particles Fp injected from the injection nozzle 3 is 150 m / sec or more. As will be described later, the injection nozzle 3 is configured to accelerate the filler particles Fp supplied through the filler particle supply line 12. In one embodiment, if the velocity of the filler particles Fp supplied to the injection nozzle 3 together with the carrier gas through the filler particle supply line 12 is sufficiently high, the injection nozzle 3 does not need to have a mechanism for accelerating the filler particles Fp. In other words, the injection nozzle 3 may be configured to spray the filler particles Fp into the gaps G of the laminated substrate Ws at the same velocity at which they are supplied to the injection nozzle 3 through the filler particle supply line 12.

[0033] The formation of the filling layer L on the laminated substrate Ws by the injection nozzle 3 is performed while the laminated substrate Ws is rotated by the substrate holding device 2. This allows the filling layer L to be formed in the gap G formed around the entire periphery of the laminated substrate Ws.

[0034] The substrate processing apparatus 1 further includes an operation control unit 10 electrically connected to the substrate holding device 2, the spray nozzle 3, the flow rate adjustment valve 17, and the flow meter 18. The operations of the substrate holding device 2, the spray nozzle 3, and the flow rate adjustment valve 17 are controlled by the operation control unit 10. The flow rate of the carrier gas flowing through the carrier gas supply line 15 measured by the flow meter 18 is sent to the operation control unit 10.

[0035] The operation control unit 10 is composed of at least one computer. The operation control unit 10 includes a storage device 10a storing a program, and an arithmetic unit 10b that executes calculations according to instructions included in the program. The storage device 10a includes a main storage device such as a random access memory (RAM), and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the arithmetic unit 10b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 10 is not limited to these examples.

[0036] FIG. 4 is a schematic diagram showing one embodiment of the spray nozzle 3. The spray nozzle 3 of this embodiment is a plasma spray nozzle. The plasma spray nozzle is configured to generate plasma, accelerate the filler particles Fp with the heat of the plasma, and melt the filler particles Fp. The plasma spray nozzle is connected to a plasma gas supply line 20 for supplying a plasma gas for generating plasma to the plasma spray nozzle. The plasma gas supply line 20 is connected to a plasma gas supply source (not shown). The plasma gas is supplied from the plasma gas supply source through the plasma gas supply line 20 to the plasma spray nozzle. Examples of the plasma gas include argon and nitrogen.

[0037] The plasma spray nozzle includes a nozzle body 22 having a substantially cylindrical shape, a cathode 23 and an anode 24 housed within the nozzle body 22, and a plasma gas flow path 25 communicating with a plasma gas supply line 20. The nozzle body 22 has an ejection port 22a at its tip for ejecting filler particles Fp. The plasma gas flow path 25 is formed by the inner surface of the nozzle body 22, the outer surface of the cathode 23, and the outer surface of the anode 24, and extends to the ejection port 22a. The plasma gas supplied to the plasma spray nozzle through the plasma gas supply line 20 flows through the plasma gas flow path 25 toward the ejection port 22a. A voltage is applied to the cathode 23 and the anode 24 from a power source (not shown). When plasma gas is supplied between the cathode 23 and the anode 24 to which the voltage is applied, plasma (arc plasma) P is generated.

[0038] The plasma spray nozzle further includes a filler particle introduction line 27 connected to the filler particle supply line 12. In this embodiment, the filler particle introduction line 27 penetrates the nozzle body 22 at a lower portion thereof and extends perpendicular to the longitudinal direction of the nozzle body 22. The filler particle introduction line 27 communicates with the plasma gas flow path 25, and the outlet end of the filler particle introduction line 27 is adjacent to the injection port 22a.

[0039] The carrier gas and filler particles Fp are supplied to the plasma P generated between the cathode 23 and the anode 24 in the plasma gas flow path 25 through the filler particle supply line 12 and the filler particle introduction line 27. The configuration of the filler particle introduction line 27 is not limited to that of this embodiment, as long as it can supply the filler particles Fp to the plasma P generated between the cathode 23 and the anode 24. For example, the plasma spray nozzle may be provided with multiple filler particle introduction lines 27. In another example, the filler particle introduction line 27 may extend obliquely with respect to the longitudinal direction of the nozzle body 22, or the filler particle introduction line 27 may pass through the cathode 23 and extend in the longitudinal direction of the nozzle body 22.

[0040] The carrier gas supplied to the plasma P in the plasma gas flow passage 25 through the filler particle introduction line 27 rapidly expands due to the heat of the plasma P, generating a jet that is sprayed out through the injection port 22a. The filler particles Fp are accelerated by this jet and are injected from the plasma spray nozzle through the injection port 22a. The filler particles Fp are also melted by the heat of the plasma P, and the molten filler particles Fp are injected from the plasma spray nozzle.

[0041] The specific configuration of the plasma spray nozzle is not limited to the present embodiment, as long as it can generate plasma, accelerate the filler particles Fp with the heat of the plasma, and melt the filler particles Fp. In one embodiment, the plasma spray nozzle may be configured to generate plasma using microwaves.

[0042] The plasma spray nozzle is disposed so that its ejection port 22a faces the gap G between the laminated substrates Ws. In one embodiment, the distance K from the ejection port 22a of the plasma spray nozzle to the outermost end of the edge portion of the laminated substrate Ws is within a range of 1 mm to 100 mm. The filler particles Fp, accelerated by the plasma P and melted, are ejected from the ejection port 22a toward the gap G between the laminated substrates Ws and collide with the laminated substrate Ws (more specifically, the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2, which form the gap G). The filler particles Fp are deformed upon impact with the laminated substrate Ws and cooled on the surface of the laminated substrate Ws, forming a coating on the laminated substrate Ws. The plasma spray nozzle sprays the filler particles Fp into the gap G between the laminated substrates Ws and deposits a coating of the filler particles Fp, thereby forming a filling layer L that fills the gap G.

[0043] According to this embodiment, the filler particles Fp are accelerated and sprayed into the gaps G of the laminated substrate Ws, thereby forming a filler layer L in the gaps G, eliminating the need for a subsequent curing step. This improves the productivity of the entire process. Furthermore, since no equipment is required for the curing step, installation and maintenance costs can be reduced.

[0044] 5 is a schematic diagram showing another embodiment of the injection nozzle 3. The injection nozzle 3 of this embodiment is a flame spray nozzle. The flame spray nozzle is configured to accelerate the filler particles Fp by the heat of a combustion flame and melt the filler particles Fp. The flame spray nozzle is connected to a fuel supply line 30 for supplying fuel to the flame spray nozzle for generating a combustion flame, and a combustion supporting gas supply line 31 for supplying a combustion supporting gas to the flame spray nozzle.

[0045] The fuel supply line 30 is connected to a fuel supply source (not shown). Fuel (fuel gas) is supplied from the fuel supply source through the fuel supply line 30 to the flame spray nozzle. An example of the fuel is acetylene. The combustion-sustaining gas supply line 31 is connected to a combustion-sustaining gas supply source (not shown). The combustion-sustaining gas is supplied from the combustion-sustaining gas supply source through the combustion-sustaining gas supply line 31 to the flame spray nozzle. An example of the combustion-sustaining gas is oxygen.

[0046] The flame spray nozzle includes a nozzle body 33 having a substantially cylindrical shape, a fuel flow path 34 communicating with a fuel supply line 30, a combustion supporting gas flow path 35 communicating with a combustion supporting gas supply line 31, and a combustion chamber 36 communicating with the fuel flow path 34 and the combustion supporting gas flow path 35. The nozzle body 33 has an injection port 33a at its tip for ejecting filler particles Fp. The fuel flow path 34, the combustion supporting gas flow path 35, and the combustion chamber 36 are formed by the inner surface of the nozzle body 33. The combustion chamber 36 extends to the injection port 33a.

[0047] Fuel supplied to the flame spray nozzle through fuel supply line 30 flows through fuel flow path 34 and is supplied to combustion chamber 36. Combustion supporting gas supplied to the flame spray nozzle through combustion supporting gas supply line 31 flows through combustion supporting gas flow path 35 and is supplied to combustion chamber 36. The fuel and combustion supporting gas are mixed in combustion chamber 36, and a combustion flame Q is generated by burning this mixed gas.

[0048] The flame spray nozzle further includes a filler particle introduction line 38 connected to the filler particle supply line 12. In this embodiment, the filler particle introduction line 38 penetrates the nozzle body 33 at a lower portion thereof and extends perpendicular to the longitudinal direction of the nozzle body 33. The filler particle introduction line 38 communicates with the combustion chamber 36, and the outlet end of the filler particle introduction line 38 is adjacent to the injection port 33a.

[0049] The carrier gas and filler particles Fp are supplied to the combustion flame Q in the combustion chamber 36 through the filler particle supply line 12 and the filler particle introduction line 38. The configuration of the filler particle introduction line 38 is not limited to that of this embodiment, as long as it is possible to supply the filler particles Fp to the combustion flame Q in the combustion chamber 36. For example, the flame spray nozzle may be provided with multiple filler particle introduction lines 38. In another example, the filler particle introduction line 38 may extend obliquely with respect to the longitudinal direction of the nozzle body 33, or the filler particle introduction line 38 may extend in the longitudinal direction of the nozzle body 33.

[0050] The carrier gas supplied to the combustion flame Q through the filler particle introduction line 38 rapidly expands due to the heat of the combustion flame Q, generating a jet that is sprayed out through the injection port 33a. The filler particles Fp are accelerated by this jet and are injected from the flame spray nozzle through the injection port 33a. The filler particles Fp are also melted by the heat of the combustion flame Q, and the molten filler particles Fp are injected from the flame spray nozzle.

[0051] The specific configuration of the flame spray nozzle is not limited to this embodiment, as long as it can generate a combustion flame, accelerate the filler particles Fp with the heat of the combustion flame, and melt the filler particles Fp.

[0052] The flame spray nozzle is disposed so that its injection port 33a faces the gap G between the laminated substrates Ws. In one embodiment, the distance K from the injection port 33a of the flame spray nozzle to the outermost end of the edge portion of the laminated substrate Ws is within a range of 1 mm to 100 mm. The molten filler particles Fp are accelerated by the combustion flame Q and injected from the injection port 33a toward the gap G between the laminated substrates Ws, colliding with the laminated substrate Ws (more specifically, the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2, which form the gap G). The filler particles Fp are deformed by colliding with the laminated substrate Ws and are cooled on the surface of the laminated substrate Ws, forming a coating on the laminated substrate Ws. The flame spray nozzle sprays the filler particles Fp into the gap G between the laminated substrates Ws and deposits a coating of the filler particles Fp, thereby forming a filling layer L that fills the gap G.

[0053] FIG. 6 is a schematic diagram showing yet another embodiment of the injection nozzle 3. The injection nozzle 3 of this embodiment is a Laval nozzle. The Laval nozzle is configured to accelerate filler particles Fp to the speed of sound or faster. The Laval nozzle includes a nozzle body 40 having a diameter-reduced portion 40a where the diameter is locally reduced, and a flow path 41 formed by the inner surface of the nozzle body 40. The flow path 41 communicates with the filler particle supply line 12. The flow path 41 is formed by the diameter-reduced portion 40a and has a throat portion 41a where the horizontal cross-sectional area of the nozzle body 40 is the smallest. The nozzle body 40 has an injection port 40b at its tip for ejecting the filler particles Fp.

[0054] The carrier gas and filler particles Fp supplied to the Laval nozzle through the filler particle supply line 12 flow through the flow path 41. The carrier gas is compressed in the throat 41a of the flow path 41. In the flow direction of the carrier gas and filler particles Fp, the carrier gas expands downstream of the throat 41a, causing the flow velocity of the carrier gas and filler particles Fp to reach or exceed the speed of sound (sonic or supersonic). The filler particles Fp accelerated to or exceed the speed of sound are ejected from the Laval nozzle through the ejection port 40b.

[0055] The Laval nozzle of this embodiment is connected to a heated gas supply line 45 for supplying heated gas to the Laval nozzle. The heated gas supply line 45 is connected to a heater 46. The heater 46 is configured to heat the carrier gas supplied from the carrier gas supply source 16 through a carrier gas supply line 47. In one embodiment, the temperature of the carrier gas heated by the heater 46 (i.e., the heated gas) is within a range of 100°C to 2000°C.

[0056] A flow rate adjustment valve 48 and a flow meter 49 are attached to the carrier gas supply line 47. The flow rate adjustment valve 48 is configured to adjust the flow rate of the carrier gas flowing through the carrier gas supply line 47. The carrier gas supply line 47 is in communication with the heating gas supply line 45 via a heater 46. Therefore, the flow rates of the carrier gas and filler particles Fp flowing through the heating gas supply line 45 can be adjusted by the flow rate adjustment valve 48. The flow meter 49 is configured to measure the flow rate of the carrier gas flowing through the carrier gas supply line 47. In one embodiment, the flow rate adjustment valve 48 and the flow meter 49 may be attached to the heating gas supply line 45.

[0057] The flow rate control valve 48 and the flow meter 49 are electrically connected to the operation control unit 10. The operation of the flow rate control valve 48 is controlled by the operation control unit 10. The flow rate of the carrier gas flowing through the carrier gas supply line 47 measured by the flow meter 49 is sent to the operation control unit 10.

[0058] The carrier gas (hereinafter referred to as heated gas) heated by the heater 46 is supplied to the Laval nozzle through a heated gas supply line 45. The Laval nozzle further includes a heated gas introduction line 43 connected to the heated gas supply line 45. In this embodiment, the heated gas introduction line 43 is connected to the nozzle body 40 upstream of the diameter contraction section 40a in the flow direction of the carrier gas and filler particles Fp, and is connected to a flow path 41. The heated gas supplied to the flow path 41 heats the filler particles Fp flowing through the flow path 41 by its heat. The heated filler particles Fp are accelerated in the flow path 41 to a speed greater than the speed of sound and are ejected from the Laval nozzle through the ejection port 40b.

[0059] The Laval nozzle is disposed so that its ejection port 40b faces the gap G between the laminated substrates Ws. In one embodiment, the distance K from the ejection port 40b of the Laval nozzle to the outermost end of the edge portion of the laminated substrate Ws is within a range of 1 mm to 100 mm. The filler particles Fp accelerated and heated by the Laval nozzle are ejected from the ejection port 40b toward the gap G between the laminated substrates Ws and collide with the laminated substrate Ws (more specifically, the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 that form the gap G). The filler particles Fp are deformed upon impact with the laminated substrate Ws and cooled on the surface of the laminated substrate Ws, forming a coating on the laminated substrate Ws. The Laval nozzle sprays the filler particles Fp into the gap G between the laminated substrates Ws and deposits a coating of the filler particles Fp, thereby forming a filling layer L that fills the gap G.

[0060] The filler particles Fp that have been heated and softened by the heated gas are easily deformed when they collide with the laminated substrate Ws, allowing a coating of the filler particles Fp to be effectively deposited on the laminated substrate Ws. The filler particles Fp that have been heated by the heated gas may be in a molten state or a semi-molten state.

[0061] In one embodiment, when the speed of the filler particles Fp sprayed from the Laval nozzle is sufficiently high (for example, when the speed of the filler particles Fp is 500 m / sec or higher), the Laval nozzle does not need to be provided with the heated gas introduction line 43, and heated gas does not need to be supplied into the Laval nozzle. This is because, when the speed of the filler particles Fp sprayed from the Laval nozzle is sufficiently high, the filler particles Fp are heated and deformed upon impact with the laminated substrate Ws, even if they are not softened, and a coating can be formed on the laminated substrate Ws.

[0062] FIG. 7 is a side view showing another embodiment of the substrate processing apparatus 1. The configuration and operation of this embodiment, unless otherwise specified, are the same as those described with reference to FIGS. 2 and 3 , and therefore will not be described again. The injection nozzle 3 of this embodiment is a Laval nozzle described with reference to FIG. 6. In this embodiment, the filler particle supply line 12 is connected to a vaporization chamber 51 that vaporizes the filler material Fm, which is the material for the filler particles Fp, instead of the filler particle supply source 13. The vaporization chamber 51 is connected to a carrier gas supply source 16 via a carrier gas supply line 15. When the carrier gas is supplied from the carrier gas supply source 16 to the vaporization chamber 51 through the carrier gas supply line 15, the interior of the vaporization chamber 51 is filled with the carrier gas at a predetermined pressure. Examples of the carrier gas include nitrogen, air, helium, argon, and other gases, or mixtures thereof.

[0063] The vaporization chamber 51 of this embodiment is provided therein with a heater 53 as a heat source. A filler material Fm, which is the material for filler particles Fp, is placed on the heater 53. The vaporization chamber 51 is configured to vaporize the filler material Fm by the heat of the heater 53 in a carrier gas atmosphere. The vaporized filler material Fm forms filler particles Fp having diameters on the order of nanometers before reaching the laminated substrate Ws.

[0064] The specific configuration of the vaporization chamber 51 is not limited to this embodiment as long as it can vaporize the filler material Fm. In one embodiment, the vaporization chamber 51 may be configured to vaporize the filler material Fm by laser ablation.

[0065] In this embodiment, the substrate holding device 2 that holds the laminated substrate Ws and the injection nozzle 3 are housed in a vacuum chamber 55. The vacuum chamber 55 is connected to a vacuum pump 58 via a vacuum line 56. The vacuum pump 58 is configured to evacuate the vacuum chamber 55 through the vacuum line 56 to create a vacuum state within the vacuum chamber 55. The vacuum pump 58 is electrically connected to the operation control unit 10, and the operation of the vacuum pump 58 is controlled by the operation control unit 10.

[0066] Due to the pressure difference between the vaporization chamber 51 and the vacuum chamber 55, the vaporized filler material Fm or filler particles Fp formed from the vaporized filler material Fm flows together with the carrier gas from the vacuum chamber 55 into the filler particle supply line 12. The vaporized filler material Fm or filler particles Fp formed from the vaporized filler material Fm is supplied together with the carrier gas from the filler particle supply line 12 to the injection nozzle 3 (a Laval nozzle in this embodiment). The injection nozzle 3 (a Laval nozzle in this embodiment) accelerates the vaporized filler material Fm or filler particles Fp formed from the vaporized filler material Fm to the speed of sound or faster.

[0067] Filler particles Fp accelerated by the spray nozzle 3 (a Laval nozzle in this embodiment) are sprayed from the Laval nozzle toward the gaps G in the laminated substrate Ws and collide with the laminated substrate Ws (more specifically, the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 that form the gaps G). The filler particles Fp, which have diameters on the order of nanometers, collide with the laminated substrate Ws and can form a dense coating on the laminated substrate Ws. The Laval nozzle sprays the filler particles Fp into the gaps G in the laminated substrate Ws and deposits a coating of the filler particles Fp, thereby forming a filling layer L that fills the gaps G.

[0068] In this embodiment, the formation of the filler layer L in the gaps G of the laminated substrate Ws by the spray nozzle 3 is performed in a vacuum chamber 55 in which a vacuum state is created. This makes it possible to reduce the generation of bubbles when forming the filler layer L. In one embodiment, the formation of the filler layer L in the gaps G of the laminated substrate Ws using the plasma spray nozzle described with reference to FIGS. 2 to 4 may be performed in a vacuum chamber 55.

[0069] FIG. 8 is a side view showing yet another embodiment of the substrate processing apparatus 1. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the substrate processing apparatus 1 described with reference to FIGS. 2 and 3, and therefore, redundant description will be omitted. The injection nozzle 3 of this embodiment is the plasma spray nozzle described with reference to FIG. 4. In this embodiment, the filler particle supply line 12 is connected to a suspension generator 60, instead of the filler particle supply source 13, which generates a suspension Fs containing filler particles Fp. The suspension generator 60 is configured to disperse the filler particles Fp in a liquid (e.g., water, ethanol, etc.) to generate a suspension (slurry) Fs containing the filler particles Fp.

[0070] A suspension pump 61 is attached to the filler particle supply line 12. The suspension pump 61 is configured to pump the suspension Fs containing filler particles Fp from the suspension generator 60 to the injection nozzle 3 (in this embodiment, a plasma spray nozzle) through the filler particle supply line 12. The suspension pump 61 is electrically connected to the operation control unit 10, and the operation of the suspension pump 61 is controlled by the operation control unit 10.

[0071] The injection nozzle 3 (in this embodiment, a plasma spray nozzle) accelerates the suspension fluid Fs containing filler particles Fp using the heat of the plasma. The suspension fluid Fs containing filler particles Fp, accelerated by the injection nozzle 3, is injected from the injection nozzle 3 toward the gaps G between the laminated substrates Ws. The injection nozzle 3 sprays the suspension fluid Fs containing filler particles Fp onto the gaps G between the laminated substrates Ws (more specifically, onto the edge portions E1 of the first substrate W1 and the edge portions E2 of the second substrate W2 that form the gaps G). Before or immediately after the collision with the laminated substrate Ws, the liquid components of the suspension fluid Fs containing filler particles Fp volatilize, forming a coating of filler particles Fp. The injection nozzle 3 sprays the suspension fluid Fs containing filler particles Fp into the gaps G between the laminated substrates Ws and deposits a coating of filler particles Fp, thereby forming a filling layer L that fills the gaps G.

[0072] 9 is a side view showing yet another embodiment of the substrate processing apparatus 1. The configuration and operation of this embodiment, which are not particularly described, are the same as those of the embodiment described with reference to FIG. 7, and therefore, redundant description will be omitted. In this embodiment, the filler particle supply line 12 is connected to an aerosol chamber 65 that aerosolizes the filler particles Fp, instead of the vaporization chamber 51. The aerosol chamber 65 is connected to a carrier gas supply source 16 via a carrier gas supply line 15. The aerosol chamber 65 is configured to mix the filler particles Fp with a carrier gas supplied from the carrier gas supply source 16 through the carrier gas supply line 15 into the aerosol chamber 65, thereby generating aerosolized filler particles Fp.

[0073] In this embodiment, the substrate holding device 2 that holds the laminated substrate Ws and the injection nozzle 3 are housed in a vacuum chamber 55, and the inside of the vacuum chamber 55 is maintained in a vacuum state. Due to the pressure difference between the aerosol chamber 65 and the vacuum chamber 55, the aerosolized filler particles Fp flow together with the carrier gas from the aerosol chamber 65 into the filler particle supply line 12. The aerosolized filler particles Fp are supplied together with the carrier gas through the filler particle supply line 12 to the injection nozzle 3 (a Laval nozzle in this embodiment). The injection nozzle 3 (a Laval nozzle in this embodiment) accelerates the aerosolized filler particles Fp to the speed of sound or faster.

[0074] The aerosolized filler particles Fp are accelerated by the spray nozzle 3 (a Laval nozzle in this embodiment) and sprayed from the spray nozzle 3 toward the gaps G in the laminated substrate Ws, colliding with the laminated substrate Ws (more specifically, the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2 that form the gaps G). The aerosolized filler particles Fp collide with the laminated substrate Ws, forming a dense coating on the laminated substrate Ws. The spray nozzle 3 sprays the filler particles Fp into the gaps G in the laminated substrate Ws and deposits a coating of the filler particles Fp, thereby forming a filling layer L that fills the gaps G.

[0075] In any of the embodiments described above with reference to FIGS. 5 to 9, the filler particles Fp are accelerated and sprayed into the gaps G in the laminated substrate Ws, thereby forming a filler layer L in the gaps G, eliminating the need for a subsequent curing step. This improves the productivity of the entire process. Furthermore, since no equipment for the curing step is required, installation and maintenance costs can be reduced.

[0076] FIG. 10 is a side view showing yet another embodiment of the substrate processing apparatus 1. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to FIGS. 2 to 4, and therefore, redundant description will be omitted. The substrate processing apparatus 1 shown in FIG. 10 further includes a swinging mechanism (substrate swinging mechanism) 70 that swings the laminated substrate Ws around a predetermined swing center. The injection nozzle 3 of this embodiment is the plasma spray nozzle described with reference to FIG. 4, but in one embodiment, it may be the flame spray nozzle described with reference to FIG. 5 or the Laval nozzle described with reference to FIG. 6. The substrate swinging mechanism 70 of this embodiment can be applied to any of the substrate processing apparatuses 1 described with reference to FIGS. 7 to 9.

[0077] The substrate rocking mechanism 70 includes a rocking arm 72 connected to the substrate holding device 2, a rocking shaft 73 connected to the rocking arm 72, and a motor 74 connected to the rocking shaft 73. The motor 74 is configured to rotate the rocking shaft 73 about its axis. The motor 74 is configured to rotate the rocking shaft 73 to rock the entire substrate holding device 2 via the rocking arm 72, and to rock the laminated substrate Ws held by the substrate holding device 2 about the rocking center O (i.e., the axis of the rocking shaft 73).

[0078] The substrate rocking mechanism 70 rocks the laminated substrate Ws around the rocking center O, tilting the laminated substrate Ws at a predetermined angle with respect to the spray direction J of the filler particles Fp from the injection nozzle 3. In other words, the substrate rocking mechanism 70 is configured to change the relative angle between the spray direction J of the filler particles Fp from the injection nozzle 3 and the radial direction of the laminated substrate Ws. The substrate rocking mechanism 70 is configured to maintain the tilt angle of the laminated substrate Ws. The substrate rocking mechanism 70 (more specifically, the motor 74) is electrically connected to the operation control unit 10, and the operation of the substrate rocking mechanism 70 (more specifically, the motor 74) is controlled by the operation control unit 10.

[0079] FIG. 11 is a schematic diagram showing how filler particles Fp are deposited in gaps G in a laminated substrate Ws by the injection nozzle 3. As described above, the injection nozzle 3 sprays the filler particles Fp into the gaps G in the laminated substrate Ws, depositing a film of the filler particles Fp in the gaps G in the laminated substrate Ws, thereby forming a filling layer L in the gaps G. The filler particles Fp that collide with the laminated substrate Ws settle at the location of impact, and as shown in FIG. 11, the filler particles Fp may be unevenly deposited in a portion of the gaps G in the laminated substrate Ws, preventing the formation of a filling layer L throughout the entire gap G. Therefore, in this embodiment, the substrate oscillation mechanism 70 oscillates the laminated substrate Ws, changing the position on the laminated substrate Ws where the filler particles Fp sprayed from the injection nozzle 3 collide, thereby forming a filling layer L in the gaps G in the laminated substrate Ws.

[0080] In this embodiment, the position of the oscillation center O coincides with the deepest part of the gap G in the laminated substrate Ws. The position of the oscillation center O and the tilt angle of the laminated substrate Ws are determined in advance based on experimental results, etc., so that the filling layer L is appropriately formed in the gap G in the laminated substrate Ws.

[0081] FIG. 12 is a schematic diagram showing one embodiment of a method for forming a filler layer L in the gaps G of the laminated substrate Ws by rocking the laminated substrate Ws using a substrate rocking mechanism 70. For ease of explanation, the substrate rocking mechanism 70 is not shown in FIG. 12. As shown in step 1-1 of FIG. 12, the filler particles Fp are sprayed from the spray nozzle 3 in a state where the spray direction J of the filler particles Fp from the spray nozzle 3 is aligned with the radial direction of the laminated substrate Ws, i.e., with the laminated substrate Ws not tilted. For example, while the substrate holding device 2 rotates the laminated substrate Ws once, the filler particles Fp are sprayed from the spray nozzle 3 without tilting the laminated substrate Ws.

[0082] Next, in step 1-2, the substrate rocking mechanism 70 rocks the laminated substrate Ws in a first direction D1 around the rocking center O, and the injection nozzle 3 sprays the filler particles Fp onto the laminated substrate Ws while tilting the laminated substrate Ws at a first angle with respect to the injection direction J of the filler particles Fp from the injection nozzle 3. For example, while the substrate holding device 2 rotates the laminated substrate Ws once, the injection nozzle 3 sprays the filler particles Fp onto the laminated substrate Ws while tilting the laminated substrate Ws at the first angle.

[0083] In step 1-3, the substrate rocking mechanism 70 rocks the laminated substrate Ws around the rocking center O in a second direction D2 opposite to the first direction D1, and the injection nozzle 3 sprays the filler particles Fp onto the laminated substrate Ws in a state where the laminated substrate Ws is tilted at a second angle with respect to the injection direction J of the filler particles Fp from the injection nozzle 3. For example, while the substrate holding device 2 rotates the laminated substrate Ws once, the injection nozzle 3 sprays the filler particles Fp onto the laminated substrate Ws in a state where the laminated substrate Ws is tilted at the second angle.

[0084] In step 1-4, the substrate rocking mechanism 70 rocks the laminated substrate Ws in the first direction D1 around the rocking center O, and similarly to step 1-1, the injection nozzle 3 sprays the filler particles Fp in a state where the injection direction J of the filler particles Fp from the injection nozzle 3 coincides with the radial direction of the laminated substrate Ws, i.e., the laminated substrate Ws is not tilted. For example, while the substrate holding device 2 rotates the laminated substrate Ws once, the injection nozzle 3 sprays the filler particles Fp without tilting the laminated substrate Ws. Steps 1-1 to 1-4 may be repeated until a filling layer L is formed so as to fill the gaps G in the laminated substrate Ws.

[0085] In one embodiment, in each of steps 1-1 to 1-4, the injection nozzle 3 may spray the filler particles Fp while the substrate holding device 2 rotates the laminated substrate Ws multiple times. In another embodiment, after steps 1-1 to 1-4, when steps 1-1 to 1-4 are repeated again, filler particles made of a different material from the filler particles used in the initial steps 1-1 to 1-4 may be used. This allows multiple filler layers made of different materials to be stacked in the gaps G of the laminated substrate Ws.

[0086] In still another embodiment, the injection nozzle 3 may spray the filler particles Fp onto the laminated substrate Ws while the substrate swinging mechanism 70 swings the laminated substrate Ws around the swing center O.

[0087] According to this embodiment, by rocking the laminated substrate Ws using the substrate rocking mechanism 70 and depositing filler particles Fp in the gaps G of the laminated substrate Ws, a filling layer L can be formed throughout the entire gap G without the filler particles Fp being unevenly deposited in only one part of the gap G.

[0088] 13 , the substrate processing apparatus 1 may include, instead of the substrate swinging mechanism 70, a swinging mechanism (nozzle swinging mechanism) 75 that swings the jet nozzle 3 around a predetermined swing center. The nozzle swinging mechanism 75 includes a nozzle holder 77 that holds the jet nozzle 3, a swing shaft 78 connected to the nozzle holder 77, and a motor 79 connected to the swing shaft 78. The motor 79 is configured to rotate the swing shaft 78 around its axis. The motor 79 is configured to rotate the swing shaft 78 to swing the jet nozzle 3 held by the nozzle holder 77 around the swing center O (i.e., the axis of the swing shaft 78).

[0089] The nozzle swinging mechanism 75 swings the injection nozzle 3 held by the nozzle holder 77 around the swing center O, tilting the injection nozzle 3 at a predetermined angle with respect to the radial direction of the laminated substrate Ws. In other words, the nozzle swinging mechanism 75 is configured to change the relative angle between the injection direction J of the filler particles Fp by the injection nozzle 3 and the radial direction of the laminated substrate Ws. The nozzle swinging mechanism 75 is configured to maintain the tilt angle of the injection nozzle 3. The nozzle swinging mechanism 75 (more specifically, the motor 79) is electrically connected to the operation control unit 10, and the operation of the nozzle swinging mechanism 75 (more specifically, the motor 79) is controlled by the operation control unit 10.

[0090] The position of the oscillation center O and the tilt angle of the jet nozzle 3 are determined in advance based on experimental results or the like so that the filling layer L is appropriately formed in the gap G of the laminated substrate Ws.

[0091] In this embodiment, too, the nozzle swinging mechanism 75 swings the injection nozzle 3 around the swing center O, and the injection nozzle 3 deposits filler particles Fp into the gap G of the laminated substrate Ws, thereby depositing the filler particles Fp so as to fill the gap G.

[0092] FIG. 14 is a side view showing yet another embodiment of the substrate processing apparatus 1. The configuration and operation of this embodiment, which are not particularly described, are the same as those of the embodiment described with reference to FIG. 10, and therefore, redundant description will be omitted. The substrate processing apparatus 1 of this embodiment further includes a movement mechanism (substrate movement mechanism) 80 that moves the laminated substrate Ws in its thickness direction. The injection nozzle 3 of this embodiment is the plasma spray nozzle described with reference to FIG. 4, but in one embodiment, it may be the flame spray nozzle described with reference to FIG. 5 or the Laval nozzle described with reference to FIG. 6. The substrate movement mechanism 80 of this embodiment can be applied to any of the substrate processing apparatuses 1 described with reference to FIGS. 7 to 9.

[0093] The substrate moving mechanism 80 of the present embodiment includes a connecting member 81 connected to the substrate holding device 2, a linear guide 82 that guides the movement direction of the connecting member 81 in the thickness direction of the laminated substrate Ws, a linear motion mechanism 83 connected to the connecting member 81, and a motor 84 connected to the linear motion mechanism 83. Examples of the linear motion mechanism 83 include a ball screw mechanism and a cylinder mechanism. The motor 84 is configured to move the entire substrate holding device 2 in the thickness direction of the laminated substrate Ws via the linear motion mechanism 83, the linear guide 82, and the connecting member 81, thereby moving the laminated substrate Ws held by the substrate holding device 2 in its thickness direction. In one embodiment, the substrate moving mechanism 80 may include a linear motion electric actuator (such as a linear motor) instead of the linear guide 82, the linear motion mechanism 83, and the motor 84.

[0094] The substrate moving mechanism 80 moves the laminated substrate Ws in its thickness direction, thereby shifting the position of the center C of the gap G in the thickness direction of the laminated substrate Ws by a predetermined distance from the position of the ejection port 22a of the jet nozzle 3 in the thickness direction of the laminated substrate Ws. In other words, the substrate moving mechanism 80 is configured to change the relative position of the center C of the gap G in the thickness direction of the laminated substrate Ws and the ejection port 22a of the jet nozzle 3. The substrate moving mechanism 80 (more specifically, the motor 84) is electrically connected to the operation control unit 10, and the operation of the substrate moving mechanism 80 (more specifically, the motor 84) is controlled by the operation control unit 10.

[0095] The movement distance in the thickness direction of the laminated substrate Ws is determined in advance based on experimental results or the like so that the filling layer L is appropriately formed in the gap G of the laminated substrate Ws.

[0096] FIG. 15 is a schematic diagram showing one embodiment of a method for forming a filling layer L in a gap G of a laminated substrate Ws by moving the laminated substrate Ws in its thickness direction using a substrate moving mechanism 80. For ease of explanation, the substrate moving mechanism 80 is not shown in FIG. 15. As shown in step 2-1 of FIG. 15, filler particles Fp are sprayed from the spray nozzle 3 with the center C of the gap G in the thickness direction of the laminated substrate Ws positioned directly below the spray port 22a of the spray nozzle 3. For example, while the substrate holding device 2 rotates the laminated substrate Ws once, the filler particles Fp are sprayed from the spray nozzle 3 with the center C of the gap G in the thickness direction of the laminated substrate Ws positioned directly below the spray port 22a of the spray nozzle 3.

[0097] Next, in step 2-2, the substrate moving mechanism 80 moves the laminated substrate Ws in the third direction D3, and in a state where the position of the center C of the gap G in the thickness direction of the laminated substrate Ws is shifted in the third direction D3 from the position of the injection port 22a of the injection nozzle 3 in the thickness direction of the laminated substrate Ws, filler particles Fp are sprayed from the injection nozzle 3. For example, while the substrate holding device 2 rotates the laminated substrate Ws once, the position of the center C of the gap G in the thickness direction of the laminated substrate Ws is shifted in the third direction D3 from the position of the injection port 22a of the injection nozzle 3 in the thickness direction of the laminated substrate Ws, and filler particles Fp are sprayed from the injection nozzle 3.

[0098] In step 2-3, the substrate moving mechanism 80 moves the laminated substrate Ws in a fourth direction D4 opposite to the third direction D3, and in a state in which the position of the gap G in the thickness direction of the laminated substrate Ws is shifted in the fourth direction D4 from the position of the injection port 22a of the injection nozzle 3 in the thickness direction of the laminated substrate Ws, filler particles Fp are sprayed from the injection nozzle 3. For example, while the substrate holding device 2 rotates the laminated substrate Ws once, the position of the gap G in the thickness direction of the laminated substrate Ws is shifted in the fourth direction D4 from the position of the injection port 22a of the injection nozzle 3 in the thickness direction of the laminated substrate Ws, and filler particles Fp are sprayed from the injection nozzle 3.

[0099] In step 2-4, the substrate moving mechanism 80 moves the laminated substrate Ws in the third direction D3, and similarly to step 2-1, the injection nozzle 3 sprays the filler particles Fp while the center C of the gap G in the thickness direction of the laminated substrate Ws is positioned directly below the injection port 22a of the injection nozzle 3. For example, while the substrate holding device 2 rotates the laminated substrate Ws once, the injection nozzle 3 sprays the filler particles Fp while the center C of the gap G in the thickness direction of the laminated substrate Ws is positioned directly below the injection port 22a of the injection nozzle 3. Steps 2-1 to 2-4 may be repeated until a filling layer L is formed to fill the gap G in the laminated substrate Ws.

[0100] In one embodiment, in each of steps 2-1 to 2-4, the injection nozzle 3 may spray the filler particles Fp while the substrate holding device 2 rotates the laminated substrate Ws multiple times. In another embodiment, after steps 2-1 to 2-4, when steps 2-1 to 2-4 are repeated again, filler particles made of a different material from the filler particles used in the initial steps 2-1 to 2-4 may be used. This allows multiple filler layers made of different materials to be stacked in the gaps G of the laminated substrate Ws.

[0101] In still another embodiment, the injection nozzle 3 may spray the filler particles Fp onto the laminated substrate Ws while the substrate moving mechanism 80 moves the laminated substrate Ws in its thickness direction.

[0102] According to this embodiment, the substrate moving mechanism 80 moves the laminated substrate Ws in its thickness direction, and filler particles Fp are deposited in the gaps G of the laminated substrate Ws, thereby forming a filling layer L over the entire gap G without the filler particles Fp being unevenly deposited in only one part of the gap G.

[0103] 16 , the substrate processing apparatus 1 may include, instead of the substrate moving mechanism 80, a moving mechanism (nozzle moving mechanism) 85 that moves the injection nozzle 3 in the thickness direction of the laminated substrate Ws. The nozzle moving mechanism 85 of this embodiment includes a nozzle holder 86 that holds the injection nozzle 3, a linear guide 87 that guides the movement direction of the nozzle holder 86 in the thickness direction of the laminated substrate Ws, a linear motion mechanism 88 connected to the nozzle holder 86, and a motor 89 connected to the linear motion mechanism 88. Examples of the linear motion mechanism 88 include a ball screw mechanism and a cylinder mechanism.

[0104] The motor 89 is configured to move the injection nozzle 3 in the thickness direction of the laminated substrate Ws via the linear motion mechanism 88, the linear guide 87, and the nozzle holder 86. In one embodiment, the nozzle movement mechanism 85 may include a linear motion electric actuator (such as a linear motor) instead of the linear guide 87, the linear motion mechanism 88, and the motor 89.

[0105] The nozzle movement mechanism 85 moves the jet nozzle 3 in the thickness direction of the laminated substrate Ws, shifting the position of the jet port 22a of the jet nozzle 3 in the thickness direction of the laminated substrate Ws by a predetermined distance from the position of the center C of the gap G in the thickness direction of the laminated substrate Ws. In other words, the nozzle movement mechanism 85 is configured to change the relative position of the center C of the gap G in the thickness direction of the laminated substrate Ws and the jet port 22a of the jet nozzle 3. The nozzle movement mechanism 85 (more specifically, the motor 89) is electrically connected to the operation control unit 10, and the operation of the nozzle movement mechanism 85 (more specifically, the motor 89) is controlled by the operation control unit 10.

[0106] The movement distance of the injection nozzle 3 in the thickness direction of the laminated substrate Ws is determined in advance based on experimental results or the like so that the filling layer L is appropriately formed in the gap G of the laminated substrate Ws.

[0107] In this embodiment, too, the nozzle moving mechanism 85 moves the injection nozzle 3 in the thickness direction of the laminated substrate Ws, and the injection nozzle 3 deposits filler particles Fp into the gaps G of the laminated substrate Ws, thereby depositing the filler particles Fp so as to fill the gaps G.

[0108] FIG. 17 is a front view showing yet another embodiment of the substrate processing apparatus 1. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the embodiment described with reference to FIG. 10, and therefore, redundant description will be omitted. The substrate processing apparatus 1 of this embodiment further includes an edge shape detector 90 that detects the shape of the edge portion of the laminated substrate Ws. The injection nozzle 3 of this embodiment is the plasma spray nozzle described with reference to FIG. 4, but in one embodiment, it may be the flame spray nozzle described with reference to FIG. 5 or the Laval nozzle described with reference to FIG. 6. The edge shape detector 90 of this embodiment can be applied to any of the substrate processing apparatuses 1 described with reference to FIGS. 7 to 9.

[0109] The edge shape detector 90 of this embodiment is configured to generate an image of the edge portion of the laminated substrate Ws and detect the shape of the edge portion of the laminated substrate Ws. As shown in FIG. 2, the edge shape detector 90 is located radially outward of the laminated substrate Ws held by the substrate holding device 2 and is disposed facing the edge portion of the laminated substrate Ws, including the gap G between the laminated substrates Ws. The edge shape detector 90 is disposed upstream of the injection nozzle 3 in the rotation direction of the laminated substrate Ws and is disposed to the side of the laminated substrate Ws. The edge shape detector 90 includes an image sensor (e.g., a CMOS sensor or a CCD sensor) (not shown). In one embodiment, the edge shape detector 90 may be a two-dimensional profile measuring device (line sensor) that is a non-contact laser displacement sensor.

[0110] FIG. 18 is a diagram showing an example of an image of the edge portion of the laminated substrate Ws generated by the edge shape detector 90. The edge shape detector 90 is configured to detect the shape of the edge portion of the laminated substrate Ws based on the image of the edge portion of the laminated substrate Ws. The detected shape of the edge portion of the laminated substrate Ws includes the shape of a valley indicating the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. As shown in FIG. 17, the edge shape detector 90 is electrically connected to the operation control unit 10. The shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90 is sent to the operation control unit 10.

[0111] The operation control unit 10 is configured to control the operation of the substrate rocking mechanism 70 based on the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90. More specifically, the operation control unit 10 determines the tilt angle of the laminated substrate Ws when forming a filling layer L in the gap G of the laminated substrate Ws based on the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90. For example, the operation control unit 10 determines a first angle with respect to the spray direction J of the filler particles Fp by the jet nozzle 3 in step 1-2 of FIG. 12 and a second angle with respect to the spray direction J of the filler particles Fp by the jet nozzle 3 in step 1-3. The operation control unit 10 issues a command to the substrate rocking mechanism 70 to rock the laminated substrate Ws to the determined tilt angle, causing the jet nozzle 3 to form a filling layer L in the gap G of the laminated substrate Ws.

[0112] According to this embodiment, the tilt angle of the laminated substrate Ws is determined based on the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90. As a result, the filling layer L can be appropriately formed to fill the gap G of the laminated substrate Ws.

[0113] The edge shape detector 90 described with reference to FIGS. 17 and 18 can also be applied to the substrate processing apparatus 1 equipped with the nozzle swing mechanism 75 described with reference to FIG. 13. In this case, the operation control unit 10 is configured to control the operation of the nozzle swing mechanism 75 based on the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90. More specifically, the operation control unit 10 determines the tilt angle of the injection nozzle 3 when forming a filling layer L in the gap G of the laminated substrate Ws based on the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90. The operation control unit 10 issues a command to the nozzle swing mechanism 75 to swing the injection nozzle 3 to the determined tilt angle, causing the injection nozzle 3 to form a filling layer L in the gap G of the laminated substrate Ws.

[0114] The edge shape detector 90 described with reference to FIGS. 17 and 18 can also be applied to the substrate processing apparatus 1 including the substrate moving mechanism 80 described with reference to FIG. 14. In this case, the operation control unit 10 is configured to control the operation of the substrate moving mechanism 80 based on the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90. More specifically, the operation control unit 10 determines the movement distance in the thickness direction of the laminated substrate Ws when forming a filling layer L in the gap G of the laminated substrate Ws, based on the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90. The operation control unit 10 issues a command to the substrate moving mechanism 80 to move the laminated substrate Ws in its thickness direction by the determined movement distance, and to form a filling layer L in the gap G of the laminated substrate Ws with the injection nozzle 3.

[0115] The edge shape detector 90 described with reference to FIGS. 17 and 18 can also be applied to the substrate processing apparatus 1 equipped with the nozzle movement mechanism 85 described with reference to FIG. 16. In this case, the operation control unit 10 is configured to control the operation of the nozzle movement mechanism 85 based on the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90. More specifically, the operation control unit 10 determines the movement distance of the jet nozzle 3 in the thickness direction of the laminated substrate Ws when forming a filling layer L in the gap G of the laminated substrate Ws, based on the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90. The operation control unit 10 issues a command to the nozzle movement mechanism 85 to move the jet nozzle 3 in the thickness direction of the laminated substrate Ws by the determined movement distance, causing the jet nozzle 3 to form a filling layer L in the gap G of the laminated substrate Ws.

[0116] In one embodiment, the edge shape detector 90 may be provided in a device separate from the substrate processing apparatus 1. In this case, the edge shape detector 90 detects in advance the shape of the edge portion of the laminated substrate Ws before it is transferred to the substrate processing apparatus 1, and the shape of the edge portion of the laminated substrate Ws detected by the edge shape detector 90 is sent to the operation control unit 10. The operation control unit 10 controls the operation of the substrate rocking mechanism 70, the nozzle rocking mechanism 75, the substrate moving mechanism 80, or the nozzle moving mechanism 85 based on the shape of the edge portion of the laminated substrate Ws, and causes the injection nozzle 3 to form a filling layer L in the gap G of the laminated substrate Ws.

[0117] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims. [Explanation of symbols]

[0118] 1. Substrate processing equipment 2 Substrate holding device 3 spray nozzle 5 Holding stage 5a Holding surface 6 Rotation Axis 8 Rotation mechanism 10 Operation control section 10a storage device 10b Arithmetic unit 12 Filler particle supply line 13 Filler particle source 15 Carrier gas supply line 16 Carrier gas supply source 17 Flow control valve 18 Flow meter 20 Plasma gas supply line 22 Nozzle body 22a injection port 23 Cathode 24 Anode 25 Plasma gas flow path 27 Filler particle introduction line 30 Fuel supply line 31 Combustion-supporting gas supply line 33 Nozzle body 33a injection port 34 Fuel flow path 35 Combustion-supporting gas flow path 36 Combustion chamber 38 Filler particle introduction line 40 Nozzle body 40a Reducing diameter 40b injection port 41 Flow path 43 Heated gas introduction line 45 Heated gas supply line 46 Heater 47 Carrier gas supply line 48 Flow Control Valve 49 Flow meter 51 Vaporization Chamber 53 Heater 55 Vacuum Chamber 56 Vacuum Line 58 Vacuum Pump 60 Suspension generator 61 Suspension pump 65 Aerosol Chamber 70 Swing mechanism (substrate swing mechanism) 72 Swing arm 73 Swing axis 74 Motor 75 Swing mechanism (nozzle swing mechanism) 77 Nozzle holder 78 Swing shaft 79 Motor 80 Substrate moving mechanism 81 Connecting member 82 Linear guide 83 Linear motion mechanism 84 Motor 85 Nozzle movement mechanism 86 Nozzle holder 87 Linear Guide 88 Linear motion mechanism 89 Motor 90 Edge Shape Detector G Gap Fp filler particles Fm filling material Fs suspension L packed bed W1 First board W2 Second board Ws laminated substrate

Claims

1. 1. A substrate processing apparatus for forming a filling layer on a laminated substrate in which a first substrate and a second substrate are bonded, a substrate holding device that holds and rotates the laminated substrate; an injection nozzle that accelerates filler particles that constitute the filling layer and sprays the filler particles into the gap between the edge portion of the first substrate and the edge portion of the second substrate; The substrate processing apparatus further comprises a filler particle supply line connected to the injection nozzle for supplying the filler particles to the injection nozzle.

2. 2. The substrate processing apparatus according to claim 1, wherein the spray nozzle is a plasma spray nozzle that accelerates the filler particles with heat from plasma and melts the filler particles with the heat from plasma.

3. 2. The substrate processing apparatus according to claim 1, wherein the spray nozzle is a flame spray nozzle that accelerates the filler particles with heat from a combustion flame and melts the filler particles with the heat from the combustion flame.

4. The substrate processing apparatus according to claim 1 , wherein the injection nozzle is a Laval nozzle that accelerates the filler particles to a speed equal to or greater than the speed of sound.

5. a heated gas supply line connected to the Laval nozzle for supplying heated gas to the Laval nozzle; The substrate processing apparatus according to claim 4 , wherein the rubber nozzle is configured to heat the filler particles with the heated gas.

6. a vaporization chamber connected to the filler particle supply line for vaporizing a filler material that is a material for the filler particles; The substrate processing apparatus according to claim 4 , wherein the Laval nozzle is configured to accelerate the filler particles formed from the vaporized filler material and spray the filler particles into the gap.

7. a suspension generator connected to the filler particle supply line for dispersing the filler particles in a liquid to generate a suspension containing the filler particles; The substrate processing apparatus according to claim 1 , wherein the injection nozzle is configured to accelerate the suspension and spray the suspension into the gap.

8. an aerosol chamber connected to the filler particle supply line for aerosolizing the filler particles; The substrate processing apparatus of claim 1 , wherein the spray nozzle is configured to accelerate the aerosolized filler particles and spray the aerosolized filler particles into the gap.

9. The substrate processing apparatus according to claim 1 , further comprising a swing mechanism for swinging the laminated substrate or the injection nozzle about a predetermined swing center.

10. The substrate processing apparatus according to claim 1 , further comprising a movement mechanism that moves the laminated substrate or the injection nozzle in a thickness direction of the laminated substrate.

11. an edge shape detector for detecting the shape of an edge portion of the laminated substrate; Further, an operation control unit is provided to control the operation of the swing mechanism.

10. The substrate processing apparatus according to claim 9, wherein the operation control unit is configured to cause the swing mechanism to swing the laminated substrate or the injection nozzle about the swing center based on the detected shape of the edge portion.

12. an edge shape detector for detecting the shape of an edge portion of the laminated substrate; further comprising an operation control unit for controlling the operation of the movement mechanism; The substrate processing apparatus according to claim 10 , wherein the operation control unit is configured to cause the movement mechanism to move the laminated substrate or the injection nozzle in the thickness direction of the laminated substrate based on the detected shape of the edge portion.

13. The substrate processing apparatus according to claim 1 , wherein the filler particles are made of the same material as that constituting the laminated substrate, or a compound thereof.

14. The substrate processing apparatus of claim 1 , wherein the filler particles are made of ceramic.

15. 1. A substrate processing method for forming a filling layer on a laminated substrate in which a first substrate and a second substrate are bonded, comprising: Supplying filler particles constituting the packed layer to an injection nozzle; A substrate processing method comprising: rotating the laminated substrate while accelerating the filler particles with the injection nozzle, and spraying the filler particles into the gap between the edge portion of the first substrate and the edge portion of the second substrate.

16. 16. The substrate processing method of claim 15, wherein accelerating the filler particles with the injection nozzle and spraying the filler particles into the gap comprises accelerating the filler particles with plasma heat using a plasma spray nozzle, melting the filler particles with the plasma heat, and spraying the molten filler particles into the gap.

17. 16. The substrate processing method of claim 15, wherein accelerating the filler particles with the injection nozzle and spraying the filler particles into the gap comprises accelerating the filler particles with heat from a combustion flame using a flame spray nozzle, melting the filler particles with the heat from the combustion flame, and spraying the molten filler particles into the gap.

18. 16. The substrate processing method according to claim 15, wherein accelerating the filler particles by the injection nozzle comprises accelerating the filler particles by a Laval nozzle at a speed equal to or faster than the speed of sound.

19. further comprising supplying heated gas to the Laval nozzle; 19. The substrate processing method of claim 18, wherein accelerating the filler particles with the injection nozzle and spraying the filler particles into the gap comprises accelerating the filler particles with the rubber nozzle at a speed greater than the speed of sound, heating the filler particles with the heated gas, and spraying the heated filler particles into the gap.

20. supplying the filler particles to the injection nozzle includes vaporizing a filler material that is a material for the filler particles, and supplying filler particles formed from the vaporized filler material to the injection nozzle; 19. The substrate processing method of claim 18, wherein accelerating the filler particles with the injection nozzle and spraying the filler particles into the gap comprises accelerating the filler particles with the Laval nozzle at or above the speed of sound and spraying the filler particles into the gap.

21. supplying the filler particles to the injection nozzle includes dispersing the filler particles in a liquid to generate a suspension containing the filler particles, and supplying the suspension to the injection nozzle; The substrate processing method of claim 15, wherein accelerating the filler particles with the spray nozzle and spraying the filler particles into the gap comprises accelerating the suspension with the spray nozzle and spraying the suspension into the gap.

22. supplying the filler particles to the spray nozzle includes aerosolizing the filler particles and supplying the aerosolized filler particles to the spray nozzle; 16. The substrate processing method of claim 15, wherein accelerating the filler particles with the spray nozzle and spraying the filler particles into the gap comprises accelerating the aerosolized filler particles with the spray nozzle and spraying the aerosolized filler particles into the gap.

23. The substrate processing method according to claim 15, further comprising swinging the laminated substrate or the injection nozzle about a predetermined swing center.

24. The substrate processing method of claim 15 , further comprising moving the laminated substrate or the injection nozzle in a thickness direction of the laminated substrate.

25. further comprising detecting a shape of an edge portion of the laminated substrate; 24. The substrate processing method according to claim 23, wherein the laminated substrate or the injection nozzle is swung about the swing center based on the detected shape of the edge portion.

26. further comprising detecting a shape of an edge portion of the laminated substrate; 25. The substrate processing method according to claim 24, further comprising moving the laminated substrate or the injection nozzle in the thickness direction of the laminated substrate based on the detected shape of the edge portion.

27. 16. The substrate processing method according to claim 15, wherein the filler particles are made of the same material or a compound thereof as the material constituting the laminated substrate.

28. The method of claim 15 , wherein the filler particles are composed of ceramic.

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