Electronic control device

Abstract

To obtain an electronic control device with which, while suppressing noise propagation to the outside, the device size and cost are reduced.SOLUTION: The electronic control device comprises: a printed circuit board having an intra-device element and a connector; a cover having a body part and a wall part extending from the body part in a direction between the intra-device element and the connector of the printed circuit board; and a base covering the other side of the printed circuit board. The printed circuit board includes a single or a plurality of exposed GND sections exposed to one side of the printed circuit board facing the wall part, and a plurality of solder buildups connected to the exposed GND sections, with the cover and the base being composed of a conductive material and the plurality of solder buildups being arranged along the wall part at intervals. The interval is less than λ / 2 in length, when the lowest frequency wavelength of noise generated by operation of the intra-device element is defined as λ. A plurality of elastic bodies are provided between a section of the printed circuit board facing an edge of the wall part and the base, with the elastic bodies pressing the printed circuit board and the plurality of solder buildups against the wall part.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to an electronic control device. [Background technology]

[0002] An electronic control device is provided with a printed circuit board having internal elements that form circuits. The printed circuit board has connectors connected to the internal elements, and the connectors are connected to external devices. Some internal elements generate noise. A configuration has been disclosed in which the internal elements are covered with a shielding member to suppress the propagation of noise to the outside (see, for example, Patent Document 1).

[0003] In the device configuration disclosed in Patent Document 1, multiple connectors are arranged outside a ground pattern that surrounds a shielded area including a communication control circuit, and a shielding material covers the shielded area. The shielding material is fixed to the printed circuit board so that the portion of the shielding material facing the ground pattern is electrically connected to the ground pattern. The ground pattern, which is arranged in a continuous ring shape on the surface of the printed circuit board, is connected to the pedestal of the cover and base of the shielding material by multiple screws at the protrusions of the ground pattern. Shielding the area where the communication control circuit is implemented in this way can suppress noise from inside the device from propagating to the outside. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2021-150517 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above-mentioned Patent Document 1, the pedestals on the cover and base, which are shielding members, are electrically connected to the protrusions on the ground pattern provided on the printed circuit board by screws. This allows for shielding of the area where the communication control circuit is mounted. However, this configuration requires the provision of pedestals for screw fastening at the locations of the cover and base that are fixed using screws. Since components cannot be mounted or pattern wiring cannot be provided on the portion of the printed circuit board where the pedestals contact, there are issues of increased size of the printed circuit board and increased cost of the printed circuit board. Increasing the size of the printed circuit board leads to an increase in the size of the electronic control device, which in turn increases the cost of the electronic control device.

[0006] Furthermore, in the disclosed configuration, only two or less protrusions made of solder or the like can be arranged between the screws, which necessitates a large number of screws, increasing the cost of the screws and resulting in an increase in the cost of the electronic control device.

[0007] Therefore, an object of the present disclosure is to provide an electronic control device that is miniaturized and inexpensive while suppressing the propagation of noise to the outside. [Means for solving the problem]

[0008] The electronic control device of the present disclosure includes a printed circuit board having an in-device element provided on at least one surface thereof and forming a circuit, and a connector connected to the in-device element and arranged at a distance from the in-device element, a main body portion covering one surface of the printed circuit board, a cover extending from the main body portion in a direction between the in-device element and the connector of the printed circuit board and having a wall portion separating the in-device element and the connector, and a base having a portion facing the other surface of the printed circuit board at a distance and covering the other surface of the printed circuit board, and the printed circuit board has a portion facing the end of the wall portion. The board has one or more exposed GND portions exposed on one side thereof and multiple solder deposits connected to the exposed GND portions, the cover and base are made of a conductive material, the multiple solder deposits are arranged at intervals along the wall portion, the intervals being less than λ / 2, where λ is the wavelength of the lowest frequency of noise generated by the operation of elements within the device, and multiple elastic bodies are provided between the part of the printed circuit board facing the end of the wall portion and the base, and the elastic bodies press the printed circuit board and multiple solder deposits against the wall portion and the base. [Effects of the Invention]

[0009] According to the electronic control device of the present disclosure, the printed circuit board has one or more exposed GND portions exposed on one side of the printed circuit board facing the end of the wall portion, and multiple solder deposits connected to the exposed GND portions, the cover and the base are made of a conductive material, the multiple solder deposits are arranged at intervals along the wall portion, and the intervals are less than λ / 2, where λ is the wavelength of the lowest frequency of noise generated by the operation of the elements within the device, and multiple elastic bodies are provided between the part of the printed circuit board facing the end of the wall portion and the base, and the elastic bodies press the printed circuit board and the multiple solder deposits against the base, so that the intervals are less than λ / 2 and the printed circuit board and cover are connected via the multiple solder deposits, and the gap between the printed circuit board and the cover is sealed, thereby suppressing the propagation of noise caused by the elements within the device to the outside. Furthermore, because the printed circuit board and the multiple solder deposits are pressed against the wall by the elastic body, there is no need to provide screw pedestals on the cover and base, and components can be mounted and pattern wiring can be performed in the areas where screw pedestals were provided, which allows for a smaller and less expensive printed circuit board.Since the printed circuit board is smaller and less expensive, the electronic control device can also be smaller and less expensive.Furthermore, because screws are not required, the cost of screws is reduced, which allows for a lower cost electronic control device. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a side view showing an outline of an electronic control device according to a first embodiment. [Figure 2] 2 is a perspective view showing an outline of a printed circuit board of the electronic control device according to the first embodiment. FIG. [Figure 3] 2 is a perspective view showing an outline of a cover of the electronic control device according to the first embodiment. FIG. [Figure 4] 4 is another perspective view showing the outline of the printed circuit board of the electronic control device according to the first embodiment. FIG. [Figure 5] 1 is a perspective view showing an outline of a base of an electronic control device according to a first embodiment. [Figure 6]1 is a cross-sectional view showing an outline of an electronic control device according to a first embodiment. [Figure 7] 1 is a cross-sectional view showing an outline of a main part of an electronic control device according to a first embodiment. [Figure 8] FIG. 2 is a cross-sectional view showing an outline of an electronic control device of a comparative example. [Figure 9] 2 is a cross-sectional view showing a portion where a printed circuit board of the electronic control device according to the first embodiment is fixed. FIG. [Figure 10] 4 is a perspective view showing an outline of another base of the electronic control device according to the first embodiment. FIG. [Figure 11] 2 is a cross-sectional view showing a portion where a printed circuit board of the electronic control device according to the first embodiment is fixed. FIG. [Figure 12] FIG. 10 is a cross-sectional view showing an outline of a main part of an electronic control device according to a second embodiment. [Figure 13] FIG. 11 is a perspective view showing an outline of a printed circuit board of an electronic control device according to a third embodiment. [Figure 14] FIG. 11 is a perspective view showing an outline of another printed circuit board of the electronic control device according to the third embodiment. [Figure 15] FIG. 10 is a plan view showing an outline of a printed circuit board of an electronic control device according to a fourth embodiment. [Figure 16] FIG. 10 is a plan view showing an outline of a printed circuit board of an electronic control device according to a fifth embodiment. [Figure 17] FIG. 13 is a plan view showing an outline of a printed circuit board of an electronic control device according to a sixth embodiment. [Figure 18] FIG. 13 is a plan view showing an outline of a printed circuit board of an electronic control device according to a seventh embodiment. [Figure 19] FIG. 13 is a plan view showing an outline of a printed circuit board of an electronic control device according to an eighth embodiment. [Figure 20] FIG. 13 is a cross-sectional view showing an outline of an electronic control device according to an eighth embodiment. [Figure 21] FIG. 13 is a plan view showing an outline of a printed circuit board of an electronic control device according to a ninth embodiment. [Figure 22] FIG. 23 is a perspective view showing an outline of a printed circuit board of an electronic control device according to a tenth embodiment. [Figure 23] FIG. 23 is a cross-sectional view showing an outline of a printed circuit board of an electronic control device according to a tenth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, an electronic control device according to an embodiment of the present disclosure will be described with reference to the drawings. Note that the same or equivalent members and parts in each drawing will be denoted by the same reference numerals.

[0012] Embodiment 1 FIG. 1 is a side view showing an outline of an electronic control device 100 according to a first embodiment, showing the side opposite to the side where the connector 4 is provided. FIG. 2 is a perspective view showing an outline of the printed circuit board 1 of the electronic control device 100, as seen from one side 1a. FIG. 3 is a perspective view showing an outline of the cover 5 of the electronic control device 100, as seen from the inside where the printed circuit board 1 is provided. FIG. 4 is another perspective view showing an outline of the printed circuit board 1 of the electronic control device 100, as seen from the other side 1b. FIG. 5 is a perspective view showing an outline of the base 9 of the electronic control device 100, as seen from one side 9a. FIG. 6 is a cross-sectional view showing an outline of the electronic control device 100, in which the portion where the wall portion 6 is provided is cut perpendicular to the board surface of the printed circuit board 1. FIG. 7 is a cross-sectional view showing an outline of a main part of the electronic control device 100, showing an enlarged view of the same cross section as in FIG. 6. The electronic control device 100 is, for example, a control device incorporating a high-speed communication circuit.

[0013] <Electronic control device 100> As shown in FIG. 1, the electronic control device 100 includes a printed circuit board 1, a cover 5, and a base 9. The cover 5 and the base 9 form a housing 40 that houses the printed circuit board 1. As shown in FIG. 2, the printed circuit board 1 has an internal element 4a on at least one surface 1a, which includes a circuit 30, and a connector 4 connected to the internal element 4a and spaced apart from the internal element 4a. While FIG. 2 shows four internal elements 4a and three connectors 4, the number of internal elements 4a and connectors 4 is not limited to these and may be greater or less. The printed circuit board 1 is, for example, a multilayer board. While FIG. 2 shows the internal elements 4a and connectors 4 in a planar manner for simplicity, the internal elements 4a and connectors 4 are actually components with thickness. As shown in FIG. 4, an elastic body 8 is provided on the other surface 1b of the printed circuit board 1. The elastic body 8 is, for example, adhered to the other surface 1b. The elastic body 8 may be provided on one surface 9a of the base 9 instead of the other surface 1b of the printed circuit board 1.

[0014] The circuit 30 is provided, for example, in the portion of one surface 1a surrounded by a dashed line. The circuit 30 may also be provided on the other surface 1b. The circuit 30 is formed by connecting the in-device elements 4a with pattern wiring (not shown in FIG. 2) provided on the printed circuit board 1. The location where the pattern wiring is formed is not limited to one surface 1a of the printed circuit board 1, but may be formed on one or both of the inner layer of the printed circuit board 1 and the other surface 1b of the printed circuit board 1. The pattern wiring provided on one surface 1a and the pattern wiring provided on the inner layer and the other surface 1b are connected by vias provided in the printed circuit board 1. Some of the pattern wiring and vias are GND. Note that GND may be further provided in areas on the printed circuit board 1 where there is no pattern wiring, thereby expanding the GND portion.

[0015] As shown in FIG. 3 , the cover 5 includes a main body 5a covering one surface 1a of the printed circuit board 1, and a wall 6 extending from the main body 5a toward the connector 4 and the internal device 4a of the printed circuit board 1, separating the connector 4 from the internal device 4a. Because the connectors 4 in this embodiment have the same shape, the wall 6 is formed as a single flat plate. The shape of the wall 6 is not limited to a single flat plate. If multiple connectors 4 have different shapes, the wall 6 may have a curved shape to accommodate the shape of the connectors 4. As shown in FIG. 1 , the base 9 has a portion facing the other surface 1b of the printed circuit board 1 with a gap therebetween and covers the other surface 1b of the printed circuit board 1. In this embodiment, the base 9 is formed in a plate shape as shown in FIG. 5 . The portion of the base 9 facing the other surface 1b with a gap therebetween is one surface 9a of the base 9. The electronic control device 100 is attached to, for example, another device via the other surface 9b of the base 9. The base 9 is fixed to the cover 5 by, for example, screws. The shape of the base 9 is not limited to a plate shape, and may be, for example, a cylindrical shape with a bottom. When the base 9 is formed into a cylindrical shape with a bottom, the cylindrical portion of the base 9 and the side wall portion of the cover 5 are connected.

[0016] The cover 5 and the base 9 are made of a conductive material. The conductive properties of the cover 5 and the base 9 shield the inside of the cover 5 and the base 9. The cover 5 and the base 9 are made of a conductive metal such as aluminum. The material of the cover 5 and the base 9 is not limited to metal, and may be a conductive resin. Furthermore, the cover 5 and the base 9 may be made of resin coated with a conductive paint.

[0017] <Comparative Example> Prior to describing the main parts of the present disclosure, a comparative example will be described. FIG. 8 is a cross-sectional view showing an outline of an electronic control device 200 of the comparative example, taken perpendicularly to the surface of the printed circuit board 201, illustrating the portion where the cover 202, the printed circuit board 201, and the base 203 are connected. The cover 202, the printed circuit board 201, and the base 203 are connected and in contact with each other by screws 13a that penetrate through them. To connect them with the screws 13a, a cover screw seat 11 is provided on the cover 202, and a base screw seat 12 is provided on the base 203. Because components cannot be mounted on the portion of the printed circuit board 201 where these screw seats are in contact, and no pattern wiring is provided, the size of the printed circuit board 201 increases. Furthermore, the increase in size of the printed circuit board 201 increases the cost of the printed circuit board 201. The increase in size and cost of the printed circuit board 201 increases the size of the electronic control device 200, which in turn increases the cost of the electronic control device 200.

[0018] <Shield structure> The shielding structure of the contact area between the printed circuit board 1 and the cover 5, which is a key part of the present disclosure, will be described. The internal elements 4a of the circuit 30 of the electronic control device 100 include elements that generate noise. In order to prevent noise generated inside the electronic control device 100 from propagating to the outside, the electronic control device 100 has a structure that shields the inside of the contact area between the printed circuit board 1 and the cover 5.

[0019] The printed circuit board 1 has one or more exposed GND portions 2 exposed on one surface 1a of the printed circuit board 1 facing the end of the wall portion 6, and multiple solder bumps 3 connected to the exposed GND portions 2. In this embodiment, as shown in FIG. 2, the printed circuit board 1 has a single exposed GND portion 2. An example in which the printed circuit board 1 has multiple exposed GND portions 2 will be described later. The multiple solder bumps 3 are arranged along the wall portion 6 at intervals 3a, and the intervals 3a are less than λ / 2, where λ is the wavelength of the lowest frequency of noise generated by the operation of the internal device 4a. The lowest frequency of the noise is, for example, the lowest frequency of the frequency band or multiple frequencies of noise generated by the operation of the internal device 4a. For example, the noise frequency corresponds to the operating frequency of the internal device 4a. The noise is noise radiated from the internal device 4a. As shown in FIG. 6, multiple elastic bodies 8 are provided between the portion of the printed circuit board 1 facing the end of the wall portion 6 and the base 9. Elastic body 8 presses printed circuit board 1 and the plurality of solder deposits 3 against wall portion 6 with respect to base 9. In this embodiment, since wall portion 6 is a single flat plate, the plurality of solder deposits 3 are arranged in a line along wall portion 6.

[0020] The height of the solder deposits 3 is, for example, approximately 150 μm to 200 μm. In this embodiment, as shown in FIG. 7 , the printed circuit board 1 is a multilayer board, and one of the inner layers has an inner-layer GND 14. The exposed portion 2 of the GND and the inner-layer GND 14 are connected by a via 16. The configuration of the printed circuit board 1 is not limited to this, and it may be a single-layer printed circuit board without an inner layer. In this embodiment, the exposed portion 2 of the GND excluding the portion where the solder deposits 3 are provided is covered with a board resist 15. In addition, the portion of the pattern wiring 31 provided on the other surface 1 b of the printed circuit board 1 is covered with the board resist 15. Although the configuration is not limited to the one provided with the board resist 15, providing the board resist 15 can protect the exposed portion 2 of the GND and the pattern wiring 31.

[0021] The frequency f of noise that can pass between the end of the wall 6 and the printed circuit board 1 is expressed as f = c / 2L, where L is the length of the gap 3a between the solder deposits 3 and c is the electromagnetic wave speed. L has the relationship L = λ / 2, where λ is the wavelength of frequency f. Setting L to a predetermined value makes it possible to suppress the external propagation of noise with frequencies higher than a given frequency component. As described above, connecting the printed circuit board 1 and the cover 5 with the gap 3a less than λ / 2 and sealing the gap between the printed circuit board 1 and the cover 5 with multiple solder deposits 3 can suppress the external propagation of noise generated by the operation of the internal device 4a. For example, if the minimum noise frequency f is 10 GHz, L = c / 2f, so the gap 3a is 15 mm. The minimum noise frequency f is not limited to 10 GHz.

[0022] 2, in this embodiment, a single GND exposed portion 2 is provided continuously on a portion of one surface 1a of the printed circuit board 1 facing the end of the wall portion 6, and multiple solder deposits 3 are connected to it. The solder deposits 3 are provided on the GND exposed portion 2 after the GND exposed portion 2 is formed on the printed circuit board 1. By providing a single GND exposed portion 2 continuously on a portion of one surface 1a of the printed circuit board 1 facing the end of the wall portion 6, the spacing 3a between the solder deposits 3 can be set arbitrarily depending on the in-device elements 4a to be used. Because the spacing 3a between the solder deposits 3 can be set arbitrarily, the degree of freedom in designing the electronic control device 100 can be improved.

[0023] In this embodiment, multiple elastic bodies 8 press the printed circuit board 1 and the multiple solder deposits 3 against the base 9 toward the wall 6 (the direction of the arrow in FIG. 6 ). The elastic bodies 8 are made of, for example, rubber. In this embodiment, five elastic bodies 8 are provided, but the number of elastic bodies 8 is not limited to this. During the design stage of the electronic control device 100, the clearance 10 between the printed circuit board 1 and the base 9 is set to be less than the height of the elastic bodies 8. Therefore, after manufacturing, the printed circuit board 1 and the multiple solder deposits 3 are pressed against the wall 6 by the elastic bodies 8, ensuring that the solder deposits 3 are in reliable contact with the wall 6. This configuration eliminates the need for screw pedestals on the cover 5 and base 9, allowing for component mounting and pattern wiring in the areas where screw pedestals would have been provided, thereby enabling the printed circuit board 1 to be made smaller and less expensive. The reduced size and cost of the printed circuit board 1 also contributes to the reduced size and cost of the electronic control device 100. Furthermore, since screws are not required, the cost of the screws is reduced, thereby enabling the cost of the electronic control device 100 to be reduced. Furthermore, since the step of fastening screws is not required, the electronic control device 100 can be manufactured inexpensively and the productivity of the electronic control device 100 can be improved.

[0024] <Fixing printed circuit board 1> The fixation of the printed circuit board 1 in the electronic control device 100 will be described. As shown in FIG. 3, the cover 5 has a board-holding pedestal 7 that protrudes toward the printed circuit board 1 at a portion facing the printed circuit board 1. The printed circuit board 1 is fixed to the board-holding pedestal 7. In this embodiment, the board-holding pedestal 7 is provided along the outer periphery of the printed circuit board 1 and at the center of the printed circuit board 1. The locations where the board-holding pedestal 7 is provided are not limited to these, and more or fewer board-holding pedestals may be provided. In this embodiment, the shape of the board-holding pedestal 7 is formed as a rectangular parallelepiped or a cylindrical shape, but this is not limited thereto, and the shape of the board-holding pedestal 7 may be other shapes, such as a cube. As shown in FIG. 9, the printed circuit board 1 is fixed to the board-holding pedestal 7 by, for example, a screw 13, which is a fastening component, using a through-hole 1c provided in the printed circuit board 1. FIG. 9 is a cross-sectional view showing a portion of the electronic control device 100 where the printed circuit board 1 is fixed to the board-holding pedestal 7.

[0025] With this configuration, the printed circuit board 1 can be fixed to the cover 5 without providing a new member for fixing the printed circuit board 1, thereby making it possible to manufacture the electronic control device 100 at low cost. Furthermore, since the printed circuit board 1 can be easily fixed to the cover 5, the productivity of the electronic control device 100 can be improved.

[0026] The fixing of the printed circuit board 1 is not limited to the above-described configuration. Another configuration for fixing the printed circuit board 1 will be described. The cover 5 has the above-described board holding pedestal 7, and the base 9 has a board holding base pedestal 9c that protrudes toward the printed circuit board 1 at a portion facing the printed circuit board 1, as shown in FIG. 10. FIG. 10 is a perspective view showing an outline of another base 9 of the electronic control device 100, as seen from one surface 9a. As shown in FIG. 11, the printed circuit board 1 is fixed by being sandwiched between the board holding pedestal 7 and the board holding base pedestal 9c. FIG. 11 is a cross-sectional view showing a portion where the printed circuit board 1 of the electronic control device 100 is fixed to the cover 5 and the base 9.

[0027] With this configuration, the printed circuit board 1 can be fixed to the electronic control device 100 without providing any additional members or screws for fixing the printed circuit board 1, thereby enabling the electronic control device 100 to be manufactured at low cost. Furthermore, since the printed circuit board 1 can be easily fixed to the electronic control device 100, the productivity of the electronic control device 100 can be improved.

[0028] In this embodiment, as shown in FIG. 3 , the heights of the wall 6 and the board-holding base 7 in a direction perpendicular to one surface 1 a of the printed circuit board 1 are the same. The direction perpendicular to one surface 1 a of the printed circuit board 1 is the direction of the arrow shown in FIG. 3 . Being equal means that the design lengths are the same, and the difference in length is within the tolerance range, within the range of manufacturing error. By setting the height of the wall 6 to be equal to that of the board-holding base 7 in this manner, when the printed circuit board 1 is fixed to the board-holding base 7 or when the printed circuit board 1 is sandwiched and fixed between the board-holding base 7 and the board-holding base 9 c, the solder deposit 3 absorbs the gap between the wall 6 and the printed circuit board 1 due to tolerance variations, thereby ensuring reliable contact between the wall 6 and the printed circuit board 1.

[0029] As described above, in the electronic control device 100 according to the first embodiment, the printed circuit board 1 has one or more exposed GND portions 2 exposed on one surface 1 a of the printed circuit board 1 facing the end of the wall portion 6, and a plurality of solder deposits 3 connected to the exposed GND portions 2; the cover 5 and the base 9 are made of a conductive material; the plurality of solder deposits 3 are arranged along the wall portion 6 at intervals 3 a, where λ is the wavelength of the lowest frequency of noise generated by the operation of the in-device elements 4 a; and a plurality of elastic bodies 8 are provided between the portion of the printed circuit board 1 facing the end of the wall portion 6 and the base 9; the elastic bodies 8 press the printed circuit board 1 and the plurality of solder deposits 3 against the wall portion 6 against the base 9. Therefore, the intervals 3 a are set to a length of less than λ / 2, and the printed circuit board 1 and the cover 5 are connected via the plurality of solder deposits 3, and the gap between the printed circuit board 1 and the cover 5 is blocked, thereby suppressing the propagation of noise caused by the in-device elements 4 a to the outside.

[0030] Furthermore, because the printed circuit board 1 and the plurality of solder deposits 3 are pressed against the wall portion 6 by the elastic body 8, there is no need to provide screw pedestals on the cover 5 and base 9, and components can be mounted and pattern wiring can be performed in the areas where screw pedestals were provided, thereby enabling the miniaturization and cost reduction of the printed circuit board 1. Because the printed circuit board 1 is miniaturized and cost-effective, the electronic control device 100 can also be miniaturized and cost-effective. Furthermore, because screws are not required, the cost of the screws is reduced, allowing the cost of the electronic control device 100 to be reduced.

[0031] When a single GND exposed portion 2 is provided continuously on one surface 1a of the printed circuit board 1 facing the end of the wall portion 6 and multiple solder deposits 3 are connected, the spacing 3a between the solder deposits 3 can be set arbitrarily depending on the in-device elements 4a being used. Because the spacing 3a between the solder deposits 3 can be set arbitrarily, the degree of freedom in designing the electronic control device 100 can be improved.

[0032] When the cover 5 has a board holding seat 7 that protrudes in the direction of the printed circuit board 1 at a portion facing the printed circuit board 1, and the printed circuit board 1 is fixed to the board holding seat 7, the printed circuit board 1 can be fixed to the cover 5 without providing a new member for fixing the printed circuit board 1, and therefore the electronic control device 100 can be manufactured at low cost. Furthermore, because the printed circuit board 1 can be easily fixed to the cover 5, the productivity of the electronic control device 100 can be improved.

[0033] When the cover 5 has a board-holding pedestal 7 that protrudes toward the printed circuit board 1 at a portion facing the printed circuit board 1, the base 9 has a board-holding base pedestal 9c that protrudes toward the printed circuit board 1 at a portion facing the printed circuit board 1, and the printed circuit board 1 is sandwiched and fixed between the board-holding pedestal 7 and the board-holding base pedestal 9c, the printed circuit board 1 can be fixed to the electronic control device 100 without providing new members or screws for fixing the printed circuit board 1, and the electronic control device 100 can be manufactured inexpensively. Furthermore, because the printed circuit board 1 can be easily fixed to the electronic control device 100, the productivity of the electronic control device 100 can be improved.

[0034] If the heights of the wall portion 6 and the board holding base 7 in the direction perpendicular to one surface 1a of the printed circuit board 1 are the same, when the printed circuit board 1 is fixed to the board holding base 7, or when the printed circuit board 1 is sandwiched and fixed between the board holding base 7 and the board holding base base 9c, the solder deposit 3 absorbs the gap between the wall portion 6 and the printed circuit board 1 caused by tolerance variations, thereby ensuring reliable contact between the wall portion 6 and the printed circuit board 1.

[0035] Embodiment 2 An electronic control device 100 according to embodiment 2 will be described. Fig. 12 is a cross-sectional view showing an outline of the main parts of the electronic control device 100, in which the part where the wall part 6 is provided is cut perpendicular to the board surface of the printed circuit board 1 and shown enlarged. The electronic control device 100 according to embodiment 2 is configured such that the printed circuit board 1 has a plurality of exposed GND parts 2.

[0036] In this embodiment, the GND has a portion on an inner layer of the printed circuit board 1. The inner layer portion is the inner layer GND 14. The inner layer GND 14 is provided, for example, on the entire surface of one inner layer. The location where the inner layer GND 14 is provided is not limited to the entire surface of one inner layer, and it may be on only a part of one inner layer.

[0037] Each of the multiple GND exposed portions 2 is provided at intervals on one surface 1a of the printed circuit board 1 facing the end of the wall portion 6, corresponding to the arrangement of the multiple solder bumps 3, and each of the multiple GND exposed portions 2 is connected to an inner layer GND 14, which is an inner layer portion, through a via 16 provided in the printed circuit board 1.

[0038] With this configuration, pattern wiring 31 can be provided between the solder deposits 3 and adjacent solder deposits 3. Furthermore, components (not shown) can be mounted between the solder deposits 3 and adjacent solder deposits 3. This increases the layout area of the printed circuit board 1, allowing for a reduction in size and cost of the printed circuit board 1. The reduction in size and cost of the printed circuit board 1 allows for a reduction in size and cost of the electronic control device 100.

[0039] For example, in high-speed signal wiring, it is sometimes required to wire from a communication device in a circuit to a connector on the same layer of a printed circuit board. By using the configuration shown in this embodiment, pattern wiring 31 can be provided between solder deposits 3 and adjacent solder deposits 3, so this required configuration can be realized.

[0040] Embodiment 3 An electronic control device 100 according to a third embodiment will now be described. Figures 13 and 14 are perspective views showing an outline of the printed circuit board 1 of the electronic control device 100 according to the third embodiment, and are views of the printed circuit board 1 as viewed from the other surface 1b side. The connector 4 is omitted in Figures 13 and 14. The electronic control device 100 according to the third embodiment has one or more exposed portions 17 of the other side GND on the other surface 1b of the printed circuit board 1.

[0041] In this embodiment, the elastic body 8 is made of a conductive material. For example, the elastic body 8 is made of conductive rubber to which a conductive substance has been added. The elastic body 8 is not limited to conductive rubber, and may be made of a metal material having elasticity and spring properties.

[0042] The other surface 1b of the printed circuit board 1 has one or more exposed portions 17 of the other-side GND in a portion of the printed circuit board 1 facing the end of the wall portion 6. A plurality of elastic bodies 8 are arranged at intervals along the portion of the printed circuit board 1 facing the end of the wall portion 6, and the intervals between the plurality of elastic bodies 8 are less than λ / 2, where λ is the wavelength of the lowest frequency of noise generated by the operation of the in-device element 4a, and the elastic bodies 8 abut against the exposed portion 17 of the other-side GND. In the configuration shown in FIG. 13 , the other surface 1b of the printed circuit board 1 has a single exposed portion 17 of the other-side GND.

[0043] The internal device elements 4a, which are noise sources within the electronic control device 100, are not only mounted on one surface 1a of the printed circuit board 1 on which the connector 4 is mounted, but may also be mounted on the other surface 1b. By arranging a plurality of conductive elastic bodies 8 in this manner, it is possible to improve noise shielding not only on the one surface 1a side of the printed circuit board 1 but also on the other surface 1b side.

[0044] In this embodiment, the single exposed portion 17 of the other-side GND is provided continuously on the other surface 1b of the portion of the printed circuit board 1 facing the end of the wall 6, and is connected to a plurality of elastic bodies 8. The elastic bodies 8 are provided on the exposed portion 17 of the other-side GND after the exposed portion 17 of the other-side GND is formed on the printed circuit board 1. By providing the single exposed portion 17 of the other-side GND continuously on the other surface 1b of the portion of the printed circuit board 1 facing the end of the wall 6, the spacing between the elastic bodies 8 can be set arbitrarily depending on the in-device elements 4a to be used. Because the spacing between the elastic bodies 8 can be set arbitrarily, the degree of freedom in designing the electronic control device 100 can be improved.

[0045] 14, the other surface 1b of the printed circuit board 1 may have a configuration having a plurality of exposed portions 17 of the other side GND. The GND has an inner layer GND 14 (not shown in FIG. 14) which is an inner layer portion of the printed circuit board 1. Each of the exposed portions 17 of the other side GND is provided at intervals corresponding to the arrangement of the plurality of elastic bodies 8 on the other surface 1b of the portion of the printed circuit board 1 facing the end of the wall portion 6, and each of the exposed portions 17 of the other side GND is connected to the inner layer GND 14 which is an inner layer portion through a via 16 (not shown in FIG. 14) provided in the printed circuit board 1.

[0046] By configuring in this manner, it is possible to provide pattern wiring between the elastic body 8 and the adjacent elastic body 8. Also, it is possible to mount components between the elastic body 8 and the adjacent elastic body 8. This increases the layout area of the printed circuit board 1, allowing the printed circuit board 1 to be made smaller and less expensive. Since the printed circuit board 1 is made smaller and less expensive, it is possible to make the electronic control device 100 smaller and less expensive.

[0047] Embodiment 4 An electronic control device 100 according to embodiment 4 will be described. Fig. 15 is a plan view showing an outline of the printed circuit board 1 of the electronic control device 100 according to embodiment 4, and is a view showing a portion of the printed circuit board 1 as viewed from the other surface 1b side. The electronic control device 100 according to embodiment 4 has a configuration in which, in addition to the configuration shown in Fig. 13 of embodiment 3, an additional exposed portion 19 of the other side GND and an impedance element 18 are provided on the other surface 1b of the printed circuit board 1.

[0048] In this embodiment, the other surface 1b of the printed circuit board 1 is connected to the circuit 30 (not shown in FIG. 15 ) and has an additional exposed portion 19 of the other-side GND spaced apart from the exposed portion 17 of the other-side GND. The exposed portion 17 of the other-side GND and the exposed portion 19 of the additional exposed portion 19 of the other-side GND are connected by one or more impedance elements 18. While the printed circuit board 1 of the electronic control device 100 shown in FIG. 15 has two impedance elements 18, the number of impedance elements 18 is not limited to this. The number of impedance elements 18 may be one or more. The impedance element 18 may be, for example, a resistor or an inductor. In the configuration shown in FIG. 15 , the exposed portion 19 of the additional exposed portion 19 of the other-side GND is arranged to surround the exposed portion 17 of the other-side GND, but the arrangement of the exposed portion 19 of the additional exposed portion 19 of the other-side GND is not limited to this. The exposed portion 19 of the additional exposed portion 19 of the other-side GND may be arranged only on the side where the impedance element 18 is provided.

[0049] If the GND of the printed circuit board 1 is directly connected to the housing 40 via the conductive elastic body 8, when the potential of the housing 40 fluctuates, the GND of the printed circuit board 1 also fluctuates. If the GND potential fluctuates significantly in the negative direction, the terminal voltage of the in-device element 4a may exceed the maximum rating, which may destroy the in-device element 4a, or the input voltage value to the in-device element 4a may fluctuate, which may cause the electronic control device 100 to malfunction. Furthermore, when a large current flows through the housing 40, the current may also flow to the GND, which may destroy the in-device element 4a.

[0050] By separating exposed portion 17 of the other-side GND connected to conductive elastic body 8 from exposed portion 19 of the additional other-side GND and connecting them with impedance element 18, it is possible to suppress fluctuations in the potential of GND and current flow to GND. Since fluctuations in the potential of GND and current flow to GND are suppressed, it is possible to suppress damage to in-device element 4a and malfunction of electronic control device 100. Note that exposed portion 19 of the additional other-side GND is not limited to a configuration in which the entire portion is exposed from printed circuit board 1, and the portion other than the portion connected to impedance element 18 may be covered with substrate resist 15.

[0051] Embodiment 5. An electronic control device 100 according to embodiment 5 will be described. Fig. 16 is a plan view showing an outline of the printed circuit board 1 of the electronic control device 100 according to embodiment 5, and is a view showing a portion of the printed circuit board 1 as viewed from the other surface 1b side. In addition to the configuration shown in embodiment 3, the electronic control device 100 according to embodiment 5 is configured such that an additional exposed portion 19 of the other side GND and an AC coupling element 20 are provided on the other surface 1b of the printed circuit board 1.

[0052] In this embodiment, the other surface 1b of the printed circuit board 1 is connected to a circuit 30 (not shown in FIG. 16 ) and has an additional exposed portion 19 of the other-side GND spaced apart from the exposed portion 17 of the other-side GND. The exposed portion 17 of the other-side GND and the exposed portion 19 of the additional other-side GND are connected by one or more AC coupling elements 20. While the printed circuit board 1 of the electronic control device 100 shown in FIG. 16 is provided with two AC coupling elements 20, the number of AC coupling elements 20 is not limited to this. The number of AC coupling elements 20 may be one or more. The AC coupling element 20 is, for example, a capacitor. In the configuration shown in FIG. 16 , the exposed portion 19 of the additional other-side GND is disposed surrounding the exposed portion 17 of the other-side GND, but the arrangement of the exposed portion 19 of the additional other-side GND is not limited to this. The exposed portion 19 of the additional other-side GND may be disposed only on the side where the AC coupling element 20 is provided.

[0053] When the GND of the printed circuit board 1 is directly connected to the housing 40 via the conductive elastic body 8 and the housing 40 is connected to the vehicle body, the current that should flow in the order of battery, harness, electronic control device 100, harness, and battery may flow in the order of battery, harness, electronic control device 100, vehicle body, and battery. When the current flows through the vehicle body, the current loop becomes larger, which causes the radiation noise to worsen.

[0054] By separating the exposed portion 17 of the other-side GND connected to the conductive elastic body 8 from the exposed portion 19 of the additional other-side GND connected to the circuit 30 and connecting them with the AC coupling element 20, it is possible to provide DC insulation between the electronic control device 100 and the vehicle body. Because the electronic control device 100 and the vehicle body are DC insulated, the return current from the electronic control device 100 to the battery can be passed through the harness instead of the vehicle body, thereby improving EMI performance. Note that the exposed portion 19 of the additional other-side GND does not have to be entirely exposed from the printed circuit board 1; the exposed portion 19 may be covered with a substrate resist 15 except for the portion connected to the AC coupling element 20.

[0055] Embodiment 6 An electronic control device 100 according to a sixth embodiment will be described. Fig. 17 is a plan view showing an outline of the printed circuit board 1 of the electronic control device 100 according to the sixth embodiment, and is a view showing a portion of the printed circuit board 1 as viewed from one surface 1a. The electronic control device 100 according to the sixth embodiment has a configuration in which, in addition to the configuration shown in Fig. 2 of the first embodiment, an additional exposed portion 19a of one side GND and an impedance element 18 are provided on one surface 1a of the printed circuit board 1.

[0056] In this embodiment, one side 1a of printed circuit board 1 has one-side GND exposed portion 2a, which is an exposed portion of the GND. One side 1a of printed circuit board 1 is connected to circuit 30 and has an additional one-side GND exposed portion 19a spaced apart from the one-side GND exposed portion 2a. The one-side GND exposed portion 2a and the additional one-side GND exposed portion 19a are connected by one or more impedance elements 18. While two impedance elements 18 are provided on printed circuit board 1 of electronic control device 100 shown in FIG. 17 , the number of impedance elements 18 is not limited thereto. The number of impedance elements 18 may be one or more. Impedance element 18 may be, for example, a resistor or an inductor. In the configuration shown in FIG. 17 , the additional one-side GND exposed portion 19a is arranged to surround the one-side GND exposed portion 2a, but the arrangement of the additional one-side GND exposed portion 19a is not limited thereto. The additional exposed portion 19a of the one-side GND may be disposed only on the side where the impedance element 18 is provided.

[0057] If the GND of the printed circuit board 1 is directly connected to the housing 40 via the solder deposit 3, when the potential of the housing 40 fluctuates, the GND of the printed circuit board 1 also fluctuates. If the GND potential fluctuates significantly in the negative direction, the terminal voltage of the in-device element 4a may exceed the maximum rating, which may destroy the in-device element 4a, or the input voltage value to the in-device element 4a may fluctuate, which may cause the electronic control device 100 to malfunction. Furthermore, when a large current flows through the housing 40, the current may also flow to the GND, which may destroy the in-device element 4a.

[0058] By separating exposed portion 2a of one side GND connected to solder deposit 3 from exposed portion 19a of additional one side GND and connecting them by impedance element 18, it is possible to suppress fluctuations in the GND potential and current flow to GND. Since fluctuations in the GND potential and current flow to GND are suppressed, it is possible to suppress damage to in-device element 4a and malfunction of electronic control device 100. Note that exposed portion 19a of additional one side GND is not limited to a configuration in which the entire portion is exposed from printed circuit board 1, and the portion other than the portion connected to impedance element 18 may be covered with substrate resist 15.

[0059] Embodiment 7 An electronic control device 100 according to a seventh embodiment will be described. Fig. 18 is a plan view showing an outline of the printed circuit board 1 of the electronic control device 100 according to the seventh embodiment, and is a view showing a portion of the printed circuit board 1 as viewed from one surface 1a. The electronic control device 100 according to the seventh embodiment has a configuration in which, in addition to the configuration shown in Fig. 2 of the first embodiment, an additional exposed portion 19a of one side GND and an AC coupling element 20 are provided on one surface 1a of the printed circuit board 1.

[0060] In this embodiment, one side 1a of the printed circuit board 1 has an exposed portion of the one-side GND 2a, which is an exposed portion of the GND. The one side 1a of the printed circuit board 1 is connected to the circuit 30 and has an additional exposed portion of the one-side GND 19a spaced apart from the exposed portion of the one-side GND 2a. The exposed portion of the one-side GND 2a and the exposed portion of the additional one-side GND 19a are connected by one or more AC coupling elements 20. While the printed circuit board 1 of the electronic control device 100 shown in FIG. 18 has two AC coupling elements 20, the number of AC coupling elements 20 is not limited thereto. The number of AC coupling elements 20 may be one or more. The AC coupling element 20 is, for example, a capacitor. In the configuration shown in FIG. 18, the exposed portion of the additional one-side GND 19a is arranged to surround the exposed portion of the one-side GND 2a, but the arrangement of the exposed portion of the additional one-side GND 19a is not limited thereto. The additional exposed portion 19a of the one-side GND may be disposed only on the side where the AC coupling element 20 is provided.

[0061] When the GND of the printed circuit board 1 is directly connected to the housing 40 via the solder deposits 3 and the housing 40 is connected to the body of a vehicle, the current that should flow in the order of battery, harness, electronic control device 100, harness, and battery may flow in the order of battery, harness, electronic control device 100, body, and battery. If the current flows through the body, the current loop becomes larger, which causes the radiation noise to worsen.

[0062] By separating the exposed portion 2a of the one-side GND connected to the solder deposit 3 from the exposed portion 19a of the additional one-side GND connected to the circuit 30 and connecting them with the AC coupling element 20, it is possible to provide DC insulation between the electronic control device 100 and the vehicle body. Because the electronic control device 100 and the vehicle body are DC-insulated, the return current from the electronic control device 100 to the battery can be passed through the harness instead of the vehicle body, thereby improving EMI performance. Note that the exposed portion 19a of the additional one-side GND is not limited to being entirely exposed from the printed circuit board 1; the exposed portion 19a may be covered with a substrate resist 15 except for the portion connected to the AC coupling element 20.

[0063] Embodiment 8 An electronic control device 100 according to embodiment 8 will be described. Fig. 19 is a plan view showing an outline of the printed circuit board 1 of the electronic control device 100 according to embodiment 8, showing a portion of the printed circuit board 1 as viewed from one surface 1a, and Fig. 20 is a cross-sectional view showing an outline of the electronic control device 100, cut perpendicular to the board surface of the printed circuit board 1. The electronic control device 100 according to embodiment 8 has a configuration in which the location where the AC coupling element 20 is arranged is specified in the configuration shown in embodiment 7.

[0064] In this embodiment, as shown in Fig. 20, the AC coupling element 20 is provided between the wall 6 and the connector 4. As shown in Fig. 19, the AC coupling element 20 is connected to an exposed portion 2a of one side GND and an exposed portion 19a of the additional one side GND. Although four AC coupling elements 20 are provided on the printed circuit board 1 of the electronic control device 100 shown in Fig. 19, the number of AC coupling elements 20 is not limited to this. The number of AC coupling elements 20 may be one or more, but all of the AC coupling elements 20 are provided between the wall 6 and the connector 4. The AC coupling element 20 is, for example, a capacitor.

[0065] If there is no contact between the printed circuit board 1 and the housing 40, and electrostatic noise is applied to the housing 40, dielectric breakdown may occur at an unintended location between the housing 40 and the in-device element 4a of the printed circuit board 1. If dielectric breakdown occurs, there is a risk that the in-device element 4a may be destroyed.

[0066] By providing the AC coupling element 20 between the wall 6 and the connector 4, electrostatic noise applied to the housing 40 passes through the wall 6 of the cover 5, enters the exposed portion 2a of the one-side GND on which the solder deposit 3 is provided, reaches the connector 4 via the AC coupling element 20 and the additional exposed portion 19a of the one-side GND, and then propagates from the connector 4 to the outside. In this way, it is possible to prevent the electrostatic noise applied to the housing 40 from entering the inside of the electronic control device 100, thereby further improving the effect of preventing damage to the in-device elements 4a and malfunction of the electronic control device 100.

[0067] Embodiment 9 An electronic control device 100 according to embodiment 9 will be described. Fig. 21 is a plan view showing an outline of the printed circuit board 1 of the electronic control device 100 according to embodiment 9, and is a view showing a portion of the printed circuit board 1 as viewed from one surface 1a. The electronic control device 100 according to embodiment 9 has a configuration in which a resistor 21 is provided on one surface 1a of the printed circuit board 1 in addition to the configuration shown in embodiment 7.

[0068] In this embodiment, one surface 1a of the printed circuit board 1 has one or more resistors 21 connected to the exposed portion 2a of the one-side GND and the exposed portion 19a of the additional one-side GND. The resistor 21 is provided in parallel with the AC coupling element 20. Although the printed circuit board 1 of the electronic control device 100 shown in FIG. 21 is provided with two AC coupling elements 20 and one resistor 21, the number of AC coupling elements 20 and resistors 21 is not limited to this. The number of each of the AC coupling elements 20 and resistors 21 may be one or more.

[0069] The AC coupling element 20 connecting the exposed portion 2a of the one-side GND and the exposed portion 19a of the additional one-side GND does not have the effect of attenuating electrostatic noise. By providing a resistor 21 in parallel with the AC coupling element 20 in addition to the AC coupling element 20, the resistor 21 can consume electrostatic noise, thereby attenuating the electrostatic noise. Because the resistor 21 attenuates electrostatic noise, the energy of the electrostatic noise propagating to the circuit 30 of the electronic control device 100 is reduced, thereby further improving the effect of preventing damage to the internal element 4a and malfunction of the electronic control device 100.

[0070] Embodiment 10 An electronic control device 100 according to a tenth embodiment will be described. Fig. 22 is a perspective view showing an outline of the printed circuit board 1 of the electronic control device 100 according to the tenth embodiment, showing the first layer 51 having one surface 1a and one inner layer 52 when the printed circuit board 1, which is a multilayer board, is viewed from the side of one surface 1a, and Fig. 23 is a cross-sectional view showing an outline of the printed circuit board 1 of the electronic control device 100, showing the first layer 51 and the inner layer 52 cut at the AA cross section position in Fig. 22. The electronic control device 100 according to the tenth embodiment is configured so that the printed circuit board 1 has a capacitance inside.

[0071] 22, one surface 1a of printed circuit board 1 has one-side GND exposed portion 2a, which is an exposed portion of the GND, and the single one-side GND exposed portion 2a is provided continuously on a portion of one surface 1a of printed circuit board 1 facing the end of wall portion 6, and is connected to a plurality of solder bumps 3. When viewed perpendicularly to one surface 1a of printed circuit board 1, the GND has a GND overlap region 22 that overlaps with one-side GND exposed portion 2a and is an inner layer portion of printed circuit board 1 connected to circuit 30. As shown in FIG. 23, there is a capacitance 53 between one-side GND exposed portion 2a and GND overlap region 22.

[0072] 22, a portion of the inner layer GND 14 is the GND overlap region 22, but this is not limited thereto, and the region of the inner layer GND 14 and the GND overlap region 22 may coincide. Because the exposed portion 2a of the one-side GND and the GND overlap region 22 are close to each other and capacitively coupled, in the configuration shown in this embodiment, an additional exposed portion 19a of the one-side GND may be provided on one surface 1a of the printed circuit board 1, but this is not essential. Furthermore, when viewed perpendicularly to one surface 1a of the printed circuit board 1, the GND overlap region 22 and the exposed portion 2a of the one-side GND are not limited to a complete overlap, and a partial overlap may also be acceptable.

[0073] Because exposed portion 2a of one-side GND and GND overlap region 22 overlap and capacitance 53 is formed between exposed portion 2a of one-side GND and GND overlap region 22, capacitance 53 plays the role of AC coupling element 20 shown in Fig. 18, and therefore a configuration equivalent to the configuration shown in Fig. 18 can be obtained without providing AC coupling element 20. Because AC coupling element 20 is not required, AC coupling element 20 can be eliminated, and an electronic control device 100 with improved EMI performance can be obtained at low cost.

[0074] Although the present disclosure describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments are not limited to application to a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless variations not exemplified are conceivable within the scope of the technology disclosed in this specification, including, for example, cases where at least one component is modified, added, or omitted, and cases where at least one component is extracted and combined with components of another embodiment. [Explanation of symbols]

[0075] 1 printed circuit board, 1a one side, 1b other side, 1c through hole, 2 exposed portion of GND, 2a exposed portion of one side GND, 3 solder buildup, 3a spacing, 4 connector, 4a internal device element, 5 cover, 5a main body, 6 wall, 7 board holding base, 8 elastic body, 9 base, 9a one side, 9b other side, 9c board holding base base, 10 clearance, 11 cover screw base, 12 base screw base, 13, 13a screw, 14 inner layer GND, 15 board resist, 16 via, 17 exposed portion of other side GND, 18 impedance element, 19 additional exposed portion of other side GND, 19a additional exposed portion of one side GND, 20 AC coupling element, 21 resistor, 22 GND overlap area, 30 circuit, 31 pattern wiring, 40 housing, 51 First layer, 52 inner layer, 53 capacitance, 100 electronic control device, 200 electronic control device, 201 printed circuit board, 202 cover, 203 base

Claims

1. a printed circuit board provided on at least one surface thereof, the printed circuit board having an in-device element on which a circuit is formed, and a connector connected to the in-device element and disposed at a distance from the in-device element; a cover having a main body covering one surface of the printed circuit board, and a wall extending from the main body in a direction between the internal device of the printed circuit board and the connector, and separating the internal device from the connector; a base having a portion facing the other surface of the printed circuit board with a gap therebetween and covering the other surface of the printed circuit board; the printed circuit board has one or more exposed GND portions exposed on one surface of the printed circuit board facing the end of the wall portion, and a plurality of solder pads connected to the exposed GND portions, the cover and the base are made of a conductive material; the plurality of solder deposits are arranged at intervals along the wall portion, and the intervals are less than λ / 2, where λ is the wavelength of the lowest frequency of noise generated by the operation of the in-device element; a plurality of elastic bodies are provided between the base and a portion of the printed circuit board facing the end of the wall portion; The elastic body presses the printed circuit board and the plurality of solder deposits against the wall portion of the base.

2. 2. The electronic control device according to claim 1, wherein the single exposed portion of the GND is provided continuously on a portion of one surface of the printed circuit board facing the end of the wall portion, and connects the plurality of solder pads.

3. GND has a portion of an inner layer of the printed circuit board, the plurality of exposed portions of the GND are provided at intervals on a portion of one surface of the printed circuit board facing the end portion of the wall portion in accordance with the arrangement of the plurality of solder deposits; 3. The electronic control device according to claim 1, wherein each of the exposed portions of the GND is connected to the inner layer portion through a via provided in the printed circuit board.

4. the elastic body is made of a conductive material, the other surface of the printed circuit board has one or more exposed portions of the other-side GND in a portion of the printed circuit board facing the end of the wall portion; the plurality of elastic bodies are arranged at intervals along a portion of the printed circuit board facing an end of the wall portion, and the intervals between the plurality of elastic bodies are less than λ / 2, where λ is the wavelength of the lowest frequency of noise generated by operation of the in-device element; 2. The electronic control device according to claim 1, wherein the elastic body abuts against an exposed portion of the other-side GND.

5. 5. The electronic control device according to claim 4, wherein the single exposed portion of the other side GND is provided continuously on the other surface of the portion of the printed circuit board facing the end of the wall portion, and connects the plurality of elastic bodies.

6. GND has a portion of an inner layer of the printed circuit board, the exposed portions of the other side GND are provided at intervals on the other surface of the printed circuit board facing the end of the wall portion in accordance with the arrangement of the elastic bodies, 6. The electronic control device according to claim 4, wherein each of the exposed portions of the other side GND is connected to the inner layer portion through a via provided in the printed circuit board.

7. the other surface of the printed circuit board is connected to the circuit and has an additional exposed portion of the other side GND provided at a distance from the exposed portion of the other side GND; 6. The electronic control device according to claim 5, wherein the exposed portion of the other-side GND and the exposed portion of the additional other-side GND are connected by one or more impedance elements.

8. the other surface of the printed circuit board is connected to the circuit and has an additional exposed portion of the other side GND provided at a distance from the exposed portion of the other side GND; 6. The electronic control device according to claim 5, wherein the exposed portion of the other-side GND and the exposed portion of the additional other-side GND are connected by one or more AC coupling elements.

9. One surface of the printed circuit board has an exposed portion of one side GND, which is an exposed portion of the GND, one surface of the printed circuit board is connected to the circuit and has an additional exposed portion of one side GND provided at a distance from the exposed portion of the one side GND; 3. The electronic control device according to claim 2, wherein the exposed portion of the one-side GND and the exposed portion of the additional one-side GND are connected by one or more impedance elements.

10. One surface of the printed circuit board has an exposed portion of one side GND, which is an exposed portion of the GND, one surface of the printed circuit board is connected to the circuit and has an additional exposed portion of one side GND provided at a distance from the exposed portion of the one side GND; 3. The electronic control device according to claim 2, wherein the exposed portion of the one-side GND and the exposed portion of the additional one-side GND are connected by one or more AC coupling elements.

11. 11. The electronic control device according to claim 10, wherein the AC coupling element is provided between the wall portion and the connector, and is connected to the exposed portion of the one-side GND and the exposed portion of the additional one-side GND.

12. 11. The electronic control device according to claim 10, wherein one surface of the printed circuit board has one or more resistors connected to the exposed portion of the one-side GND and the exposed portion of the additional one-side GND.

13. One surface of the printed circuit board has an exposed portion of one side GND, which is an exposed portion of the GND, the single exposed portion of the one-side GND is provided continuously on a portion of one surface of the printed circuit board facing the end portion of the wall portion, and connects the plurality of solder deposits; the GND has a portion of an inner layer of the printed circuit board that overlaps the exposed portion of the one-side GND when viewed perpendicularly to the one surface of the printed circuit board and is connected to the circuit; 2. The electronic control device according to claim 1, wherein there is a capacitance between the exposed portion of the one-side GND and the portion of the inner layer.

14. the cover has a board-holding base that protrudes toward the printed circuit board at a portion facing the printed circuit board, 2. The electronic control device according to claim 1, wherein the printed circuit board is fixed to the board holding base.

15. the cover has a board-holding base that protrudes toward the printed circuit board at a portion facing the printed circuit board, the base has a board-holding base seat that protrudes toward the printed circuit board at a portion facing the printed circuit board, 2. The electronic control device according to claim 1, wherein the printed circuit board is fixed by being sandwiched between the board-holding pedestal and the board-holding base pedestal.

16. 16. The electronic control device according to claim 14, wherein the wall and the board-holding base have the same height in a direction perpendicular to one surface of the printed circuit board.

Images