Circuit board assembly and electronic equipment

Abstract

The embodiment of the utility model provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a circuit board and a through-flow assembly; the circuit board comprises a plurality of bonding pads; the through-flow assembly is arranged on one side, provided with the bonding pad, of the circuit board; comprising at least two conductive parts, and the at least two conductive parts are stacked in the thickness direction of the circuit board; the conductive parts are insulated from each other; and the at least two conductive parts are connected with different bonding pads. According to the circuit board assembly provided by the embodiment of the invention, the space in the thickness direction of the circuit board can be fully utilized, so that the space occupied by the through-flow assembly in the first direction and the second direction is saved; the conductive parts are insulated from each other, and the at least two conductive parts are connected with different bonding pads, so that the at least two conductive parts can be respectively connected into different circuits, the through-flow of different circuits is realized, and the effect of reducing the DC impedance of multiple paths of power supplies in a limited space is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] With the rapid development of electronic technology, the number of components within electronic devices is increasing. These devices include circuit board assemblies (PCBs), which contain chip sets such as system-on-chips (SOCs), power management units (PMUs), wireless fidelity (Wi-Fi), and radio frequency integrated circuits (RFICs). RF main chip modules (such as Wi-Fi and RFICs) typically share a PMU with the SoC, which typically has stringent DC (direct current) impedance requirements.

[0003] In related technologies, due to the constraints of the overall device architecture, the RF main chip module is located far from the SOC. With limited circuit board wiring resources, its DC impedance requirements are difficult to meet. This results in a significant power supply voltage drop under heavy loads, which in turn fails to meet the minimum voltage requirement for normal chip operation. Therefore, how to reduce the DC impedance of multiple power supplies within a limited space is an urgent problem facing those skilled in the art. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a circuit board assembly and electronic device to reduce the DC impedance of multiple power supplies within a limited space. The specific technical solution is as follows:

[0005] An embodiment of the first aspect of the present application proposes a circuit board assembly, which includes a circuit board and a flow-through assembly; the circuit board includes multiple solder pads; the flow-through assembly is arranged on a side of the circuit board where the solder pads are provided; it includes at least two conductive parts, and the at least two conductive parts are stacked in the thickness direction of the circuit board; the conductive parts are insulated from each other; and the at least two conductive parts are connected to different solder pads.

[0006] As can be seen from the above, the circuit board assembly of the embodiment of the present application includes a circuit board and a current-passing assembly, and the current-passing assembly is arranged on the side of the circuit board where the pad is provided; the current-passing assembly includes at least two conductive parts, and the at least two conductive parts are stacked in the thickness direction of the circuit board, which can make full use of the space in the thickness direction of the circuit board, thereby saving the space occupied by the current-passing assembly in the first direction and the second direction; the conductive parts are insulated from each other, and at least two conductive parts are connected to different pads. With such an arrangement, the at least two conductive parts can be respectively connected to different circuits, thereby realizing current flow to different circuits, thereby achieving the effect of reducing the DC impedance of multiple power supplies in a limited space.

[0007] In some embodiments of the present application, the first flow-through structure includes at least one conductive portion;

[0008] The second flow-through structure is insulated from the first flow-through structure and is arranged on a side of the first flow-through structure away from the circuit board; and includes at least one conductive portion.

[0009] As can be seen from the above, with such a configuration, the first flow-through structure can be connected to at least one circuit, and the second flow-through structure can be connected to at least one circuit, thereby reducing the DC impedance of at least two power supplies; the second flow-through structure is arranged on the side of the first flow-through structure away from the circuit board, utilizing the space in the thickness direction of the circuit board, thereby saving the space occupied by the flow-through component in the horizontal direction (first direction and second direction).

[0010] In some embodiments of the present application, the first flow-through structure and the second flow-through structure are spaced apart from each other.

[0011] As can be seen from the above, the insulation between the first flow-through structure and the second flow-through structure is achieved by setting them at intervals, thereby achieving insulation between different conductive parts, which is simple and reliable.

[0012] In some embodiments of the present application, the plurality of pads include: a first pad and a second pad spaced apart;

[0013] The first flow-through structure includes: a first conductive strip extending along a first direction; the first conductive strip is connected to the first pad;

[0014] The second current-passing structure includes: a second conductive strip extending along the first direction; the second conductive strip is located on a side of the first conductive strip away from the circuit board; and the second conductive strip is connected to the second pad;

[0015] The first direction and the thickness direction of the circuit board are perpendicular to each other.

[0016] As can be seen from the above, the first conductive strip and the second conductive strip are conductive parts, the processing method of the conductive strip is simple, and it can be directly welded and fixed to the pad, which is conducive to improving production efficiency; the first conductive strip is connected to the first pad, and the first pad can be connected to a circuit; the second conductive strip is connected to the second pad, and the second pad can be connected to another pad, thereby reducing the DC impedance of different power supplies.

[0017] In some embodiments of the present application, one side of the first conductive strip in the second direction is bent toward the second conductive strip to form a first flange structure;

[0018] One side of the second conductive strip in the second direction is bent toward the first conductive strip to form a second flange structure;

[0019] The first flanging structure and the second flanging structure are staggered in the second direction;

[0020] The second direction is perpendicular to the first direction and the thickness direction of the circuit board.

[0021] As can be seen above, the arrangement of an upper flange on one side of the first conductive strip and a lower flange on one side of the second conductive strip enhances the rigidity of the first and second conductive strips, reduces the likelihood of deformation, and thus reduces the possibility of overlap between the two due to deformation, thereby improving insulation between the two. The staggered arrangement of the first and second flange structures in the second direction prevents interference between them, saves space occupied by the first and second flange structures in the thickness direction of the circuit board, and facilitates the miniaturization of the circuit board assembly.

[0022] In some embodiments of the present application, the dimension of the first flange structure in the thickness direction of the circuit board is twice the thickness of the first conductive strip;

[0023] The dimension of the second flange structure in the thickness direction of the circuit board is twice the thickness of the second conductive strip.

[0024] As can be seen from the above, such an arrangement can achieve a good effect of enhancing rigidity without taking up extra space, which is beneficial to the miniaturization design of the circuit board assembly.

[0025] In some embodiments of the present application, the first flow-through structure further includes: a first insulating layer, the first insulating layer being disposed on a surface of the first conductive strip close to the second conductive strip;

[0026] The second current-passing structure further includes a second insulating layer, which is arranged on a surface of the second conductive strip close to the first conductive strip and on a surface of the second conductive strip away from the first conductive strip.

[0027] As can be seen above, providing the first insulating layer and the second insulating layer can improve the insulation between the first conductive strip and the second conductive strip, preventing the occurrence of short circuits. Providing a spacing between the two can further improve the insulation. Furthermore, the surface of the first conductive strip not connected to the first pad can be covered with the first insulating layer, and the surface of the second conductive strip not connected to the second pad can be covered with the second insulating layer to achieve a better insulation effect.

[0028] In some embodiments of the present application, the plurality of pads include: a first pad and a second pad spaced apart;

[0029] The first flow-through structure includes: a first conductive strip extending along a first direction; the first conductive strip is connected to the first pad;

[0030] The second flow-through structure is a first flexible circuit board, and the first flexible circuit board extends along the first direction; the first flexible circuit board is connected to the second pad;

[0031] The first direction and the thickness direction of the circuit board are perpendicular to each other.

[0032] As can be seen above, the first conductive strip and the conductive layer in the first flexible circuit board are the conductive components. The first conductive strip is simple to manufacture and can be directly soldered to the first pad, improving production efficiency. The first conductive strip is connected to the first pad, which can be connected to one circuit. The first flexible circuit board is connected to the second pad, which can be connected to another circuit, thereby reducing the DC impedance of different power sources. Furthermore, the first flexible circuit board inherently has a conductive layer and an insulating layer, eliminating the need for an additional insulating layer, improving production efficiency.

[0033] In some embodiments of the present application, the first flow-through structure further includes: a first insulating layer, which is disposed on a surface of the first conductive strip close to the first flexible circuit board.

[0034] As can be seen from the above, by providing the first insulating layer, the insulation between the first conductive strip and the first flexible circuit board can be improved to prevent the occurrence of a short circuit. The spacing between the two can further improve the insulation.

[0035] In some embodiments of the present application, the number of the second pads is at least two, and the at least two second pads are respectively arranged on both sides of the first pad in the first direction;

[0036] A length of the second flow-through structure in the first direction is greater than a length of the first conductive strip in the first direction.

[0037] As can be seen above, by designing the shape of the second conductive strip, the first and second conductive strips can be arranged vertically in the thickness direction of the circuit board, thereby reducing the space occupied by the current-passing component in the first and second directions. As shown in the figure, both ends of the second conductive strip extend toward the circuit board and connect to the second pad. The second conductive strip can include multiple interconnected straight sections, with adjacent straight sections perpendicular to each other.

[0038] In some embodiments of the present application, the orthographic projection of the second flow-through structure on the circuit board covers the orthographic projection of the first conductive strip on the circuit board.

[0039] As can be seen from the above, the space occupied by the through-flow component in the first direction and the second direction can be determined by the structure of the second through-flow structure. Optionally, in the second direction, the widths of the first conductive strip and the second conductive strip can be consistent to minimize DC impedance.

[0040] In some embodiments of the present application, the flow-through component is a second flexible circuit board; the second flexible circuit board includes at least two conductive layers stacked in sequence in a direction away from the circuit board;

[0041] The number of the pads is at least four; every two pads form a group and are connected to at least one conductive layer to form a conductive portion; the conductive portions are insulated from each other.

[0042] As can be seen above, the conductive layer of the second flexible circuit board is the conductive portion. By using the different conductive layers of a single second flexible circuit board to connect to different circuits, the board occupies less space in the thickness direction, facilitating the miniaturization of the circuit board assembly. Furthermore, the second flexible circuit board has its own insulating layer, eliminating the need for additional insulation, simplifying the processing and improving production efficiency.

[0043] In some embodiments of the present application, the at least two conductive layers include: a first conductive layer, a second conductive layer, and a third conductive layer stacked in sequence in a direction away from the circuit board;

[0044] The at least four pads include: two third pads and two fourth pads;

[0045] The two third pads are respectively connected to the first conductive layer and the second conductive layer to form a first conductive portion;

[0046] The two fourth pads are respectively connected to the third conductive layer to form a second conductive portion, and the second conductive portion is insulated from the first conductive portion.

[0047] As can be seen from the above, the first conductive part can be connected to one circuit, and the second conductive part can be connected to another circuit, thereby reducing the impedance of different power sources.

[0048] In some embodiments of the present application, the second flexible circuit board is a double-layer FPC or a multi-layer FPC.

[0049] As can be seen from the above, a double-layer FPC has two conductive layers, and a multi-layer FPC has at least three conductive layers, which can directly realize connection with different circuits, and the structural design is simpler.

[0050] In some embodiments of the present application, the circuit board assembly further includes: a shielding cover;

[0051] The shielding cover is arranged on the circuit board and forms a receiving space together with the circuit board;

[0052] The through-flow component is arranged in the accommodating space.

[0053] As can be seen from the above, the shielding cover is arranged outside the flow-through component, which can prevent the flow-through component from being deformed due to external collisions, and has a protective effect on the flow-through component, thereby reducing the occurrence of short circuits.

[0054] In some embodiments of the present application, a third insulating layer is provided on the inner surface of the shielding cover.

[0055] As can be seen from the above, the short circuit between the shielding cover and the second flow-through structure can be prevented, thereby improving the working stability of the circuit board assembly.

[0056] In some embodiments of the present application, the shielding cover is an integral structure;

[0057] Alternatively, the shielding cover includes a shielding frame and a shielding cover; the shielding frame is fixedly connected to the circuit board and is arranged around the flow-through component; the shielding cover is arranged on a side of the shielding frame away from the circuit board.

[0058] As can be seen from the above, the integrated structure is easy to install and helps improve installation efficiency; the separate setting allows the shielding frame and shielding cover to be installed in different process steps, making the installation method more flexible.

[0059] In some embodiments of the present application, both the first conductive strip and the second conductive strip are copper strips;

[0060] The thickness of the first conductive strip is 0.1 mm;

[0061] The thickness of the second conductive strip is 0.12 mm;

[0062] The gap between the first conductive strip and the second conductive strip in the thickness direction of the circuit board is 0.15 mm;

[0063] The first insulating layer and the second insulating layer are made of insulating varnish, insulating Mylar or Parylene.

[0064] As can be seen from the above, such a setting can save space in the thickness direction of the circuit board while reducing DC impedance; the insulation layer material is diverse, and the design is more flexible.

[0065] An embodiment of the second aspect of the present application provides an electronic device, comprising a circuit board assembly according to any embodiment of the first aspect.

[0066] As can be seen from the above, the electronic device of the embodiment of the present application, including the circuit board assembly of any of the above embodiments, fully utilizes the space in the thickness direction of the circuit board, saves the space occupied by the current-passing assembly in the first direction and the second direction, realizes the current passing to different circuits, and achieves the effect of reducing the DC impedance of multiple power supplies in a limited space, thereby improving the performance of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other embodiments can be obtained based on these drawings without paying any creative work.

[0068] Figure 1 A schematic structural diagram of an electronic device according to an embodiment of the present application;

[0069] Figure 2 A schematic diagram of the exploded structure of an electronic device according to an embodiment of the present application;

[0070] Figure 3 This is a schematic structural diagram of the circuit board assembly in an embodiment of the present application (without the flow-through assembly);

[0071] Figure 4 This is a schematic structural diagram of a circuit board assembly in an embodiment of the present application (with a flow-through assembly);

[0072] Figure 5 This is a schematic structural diagram of a circuit board assembly according to the first embodiment of the present application;

[0073] Figure 6 This is a pad layout diagram of a circuit board assembly according to the first embodiment of the present application;

[0074] Figure 7 A diagram showing the positional relationship between the first conductive strip and the second conductive strip in the first embodiment of the present application;

[0075] Figure 8 for Figure 7 Side view of

[0076] Figure 9 for Figure 7 A top view of

[0077] Figure 10 for Figure 9 AA cross-sectional view;

[0078] Figure 11 A diagram showing the positional relationship between the first conductive strip and the second conductive strip in the second embodiment of the present application;

[0079] Figure 12 for Figure 11 Dorsal view of;

[0080] Figure 13 for Figure 11 sectional view of ;

[0081] Figure 14 A diagram showing the positional relationship between the first conductive strip and the second conductive strip in the third embodiment of the present application;

[0082] Figure 15 for Figure 14 The main view;

[0083] Figure 16 A top view of a circuit board assembly according to a fourth embodiment of the present application;

[0084] Figure 17 for Figure 16 BB cross-section diagram;

[0085] Figure 18 This is a pad layout diagram of a circuit board assembly according to a fourth embodiment of the present application;

[0086] Figure 19 A top view of a circuit board assembly according to a fifth embodiment of the present application;

[0087] Figure 20 for Figure 19 CC cross-section diagram;

[0088] Figure 21 This is a pad layout diagram of a circuit board assembly according to a fifth embodiment of the present application;

[0089] Figure 22 A top view of a circuit board assembly according to a sixth embodiment of the present application;

[0090] Figure 23 for Figure 22 DD cross-section diagram;

[0091] Figure 24This is a pad layout diagram of a circuit board assembly according to a sixth embodiment of the present application;

[0092] Figure 25 This is a cross-sectional view of a first location of the second flexible circuit board in the sixth embodiment of the present application;

[0093] Figure 26 This is a cross-sectional view of the second flexible circuit board at the second location in the sixth embodiment of the present application.

[0094] Description of reference numerals:

[0095] Circuit board assembly 10; first circuit board assembly 11; second circuit board assembly 12; middle frame 20; USB device 30; battery 40; display screen 50; back cover 60; circuit board 100; camera module hollow area 101; flow assembly application position 102; solder pad 110; first solder pad 111; second solder pad 112; third solder pad 113; fourth solder pad 114; fifth solder pad 115; tin-through hole 1101; flow assembly 200; conductive portion 201; first flow structure 210; first conductive strip 211; first flange structure 2111; first insulating layer 212; second flow structure 220; second conductive strip 221; second flange structure 2211; Second insulating layer 222; first flexible circuit board 223; second flexible circuit board 230; conductive layer 231; first conductive layer 2311; second conductive layer 2312; third conductive layer 2313; first connecting pad 232; second connecting pad 233; first base material layer 2341; first adhesive layer 2351; second base material layer 2342; second adhesive layer 2352; third base material layer 2343; third adhesive layer 2353; fourth base material layer 2344; shielding cover 300; shielding frame 310; shielding lid 320; third insulating layer 400; solder 500; RFIC chip 610; PMU chip 620; SOC chip 630; WIFI chip 640. DETAILED DESCRIPTION

[0096] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0097] To facilitate a clear description of the technical solutions of the embodiments of the present application, the terms "first" and "second" are used in the embodiments of the present application to distinguish between identical or similar items with substantially the same functions and effects. For example, the terms "first" and "second" are intended to distinguish between different swing arms and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the number or position, and that the terms "first" and "second" do not necessarily define differences.

[0098] It should be noted that, in this application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described in this application as "exemplary" or "for example" should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplarily" or "for example" is intended to present the relevant concepts in a concrete manner.

[0099] With the rapid development of electronic technology, the number of components within electronic devices is increasing. These devices include circuit board assemblies (PCBs), which contain chip sets such as SOCs (system on chip), PMUs (power management units), Wi-Fi (Wireless Fidelity), and RFICs (radio frequency integrated circuits). RF main chip modules (such as Wi-Fi and RFICs) typically share a PMU with the SoC, which typically has stringent DC (direct current) impedance requirements.

[0100] In related technologies, due to the influence of the overall device architecture, the layout location of the RF main chip module is far from the SOC. When circuit board wiring resources are limited, its DC impedance requirements are difficult to meet. This will cause the power supply voltage to drop significantly under heavy load, and thus fail to meet the minimum voltage requirement for normal operation of the chip. Therefore, how to reduce the DC impedance of multiple power supplies within a limited space is an urgent problem that technicians in this field need to solve. To solve the above technical problems, the embodiments of the present application provide a circuit board assembly and electronic equipment.

[0101] The electronic device provided in the embodiments of the present application may be a mobile phone, a tablet computer, a wearable device, an in-vehicle device, an augmented reality (AR) / virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), or other terminal products. The embodiments of the present application do not limit the specific type of the electronic device.

[0102] For the convenience of description, the following embodiments take a mobile phone as an example to illustrate the structure of the electronic device.

[0103] like Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present application. Figure 2This is a schematic diagram of the exploded structure of an electronic device according to an embodiment of the present application. The electronic device may include a display screen 50, a middle frame 20, a back cover 60, a circuit board assembly 10, and a battery 40. The display screen 50, the middle frame 20, and the back cover 60 define a storage space, and the circuit board assembly 10 and the battery 40 are both disposed within the storage space.

[0104] The materials of the middle frame 20 and the back cover 60 include, but are not limited to, metal, ceramic, plastic, and glass. The materials of the middle frame 20 and the back cover 60 can be the same or different. This embodiment of the application does not limit this.

[0105] The display screen 50 may be a flexible display screen or a rigid display screen. For example, the display screen 50 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD) display screen.

[0106] The circuit board assembly 10 may include a first circuit board assembly 11 and a second circuit board assembly 12 distributed along the length of the electronic device. The first circuit board assembly 11 and the second circuit board assembly 12 may be fixed to the middle frame 20 by means of threaded connection, gluing, clamping, or welding. The first circuit board assembly 11 and the second circuit board assembly 12 may be rigid circuit boards, flexible circuit boards, or rigid-soft structure circuit boards. The first circuit board assembly 11 and the second circuit board assembly 12 may be connected via a flexible printed circuit (FPC). The first circuit board assembly 11 and the second circuit board assembly 12 may be made of the same material or different materials, which is not limited in this application.

[0107] In addition, the second circuit board assembly 12 may be integrated with a universal serial bus (USB) device 30. The USB device 30 may be a USB type-C interface device, a USB type-A interface device, a USB type Micro-B interface device, or a USB type-B interface device. Furthermore, a socket is provided on the middle frame 20 at a location corresponding to the USB device 30. Accessories such as chargers, headphones, and data cables can be electrically connected to the USB device 30 via this socket to achieve power, signal, and data transmission.

[0108] In the length direction of the electronic device, the battery 40 is located between the first circuit board assembly 11 and the second circuit board assembly 12. The battery 40 is used to provide power to the first circuit board assembly 11 and the second circuit board assembly 12, as well as other electronic components. The battery 40 may include, but is not limited to, a nickel-cadmium battery, a nickel-metal hydride battery, a lithium battery, or other types of batteries containing bare cells. Moreover, in the electronic device provided in the embodiment of the present application, the number of batteries 40 may be one or more. The specific number and arrangement of the batteries 40 can be set according to actual needs, and the embodiment of the present application does not limit this.

[0109] like Figure 3 and Figure 4 As shown, Figure 3 Schematic diagram of the structure of the circuit board assembly 10 in the embodiment of the present application (without the flow assembly 200). Figure 4 The schematic diagram of the structure of the circuit board assembly 10 in the embodiment of the present application (with the flow assembly 200) is shown. The circuit board 100 is provided with a camera module hollow area 101 for setting the camera module (not shown in the figure); the PMU chip 620 arranged on the circuit board 100 will be close to the SOC chip 630 layout, which can give priority to the PDN (packet datanetwork, information interaction establishes a packet data network) indicator requirements; the RF main chip module (such as the WIFI chip 640 and the RFIC chip 610) generally shares the PMU chip 620 with the SOC chip 630, and the DC impedance requirements of the RF main chip module are generally strict. Due to the influence of the overall machine architecture, the layout position of the RF main chip module (WIFI chip 640 and RFIC chip 610) is far away from the SOC chip 630, and the wiring resources are limited, and its DC impedance requirements are difficult to meet; if the power supply voltage is raised, the chip power consumption will increase, affecting the service life of the entire machine; the circuit board assembly 10 of the embodiment of the present application is provided with a flow component 200 at the flow component application position 102 to reduce the DC impedance of multiple power supplies. For example, the DC impedance of the RFIC chip 610 and the WIFI chip 640 can be reduced by a flow component 200.

[0110] The structure of the circuit board assembly 10 according to the embodiment of the present application is described in detail below.

[0111] like Figure 5 and Figure 6 As shown, Figure 5 This is a schematic structural diagram of a circuit board assembly 10 according to the first embodiment of the present application. Figure 6 This is a layout diagram of the pads 110 of the circuit board assembly 10 of the first embodiment of the present application. For the convenience of description, we define the first direction, the second direction, and the thickness direction of the circuit board 100 as being perpendicular to each other. The embodiment of the present application proposes a circuit board assembly 10, which includes a circuit board 100 and a flow assembly 200. Specifically, the circuit board 100 includes a plurality of pads 110; the flow assembly 200 is arranged on a side of the circuit board 100 where the pads 110 are provided; it includes at least two conductive parts 201, and the at least two conductive parts 201 are stacked in the thickness direction of the circuit board 100; the conductive parts 201 are insulated from each other; and at least two conductive parts 201 are connected to different pads 110.

[0112] The circuit board assembly 10 of the embodiment of the present application includes a circuit board 100 and a current-passing assembly 200. The current-passing assembly 200 is arranged on a side of the circuit board 100 where a pad 110 is provided. The current-passing assembly 200 includes at least two conductive parts 201. The at least two conductive parts 201 are stacked in the thickness direction of the circuit board 100, which can fully utilize the space in the thickness direction of the circuit board 100, thereby saving the space occupied by the current-passing assembly 200 in the first direction and the second direction. The conductive parts 201 are insulated from each other, and at least two conductive parts 201 are connected to different pads 110. With this arrangement, the at least two conductive parts 201 can be respectively connected to different circuits, thereby realizing current flow to different circuits, thereby achieving the effect of reducing the DC impedance of multiple power supplies in a limited space.

[0113] It can be understood that by controlling the cross-sectional area of ​​the conductive part 201 in the thickness direction of the circuit board 100, different effects of reducing DC impedance can be achieved; for example, the thickness of the conductive part 201 in the thickness direction of the circuit board 100 can be increased, thereby increasing its cross-sectional area in the thickness direction of the circuit board 100 and increasing its current carrying capacity, thereby achieving a better effect of reducing DC impedance.

[0114] In the first embodiment of the present application, Figure 5As shown, the flow assembly 200 includes a first flow structure 210 and a second flow structure 220. The first flow structure 210 includes at least one conductive portion 201. The second flow structure 220 is insulated from the first flow structure 210 and is disposed on a side of the first flow structure 210 away from the circuit board 100. The second flow structure 220 includes at least one conductive portion 201. With this arrangement, the first flow structure 210 and the second flow structure 220 can be connected to at least one circuit, thereby reducing the DC impedance of at least two power sources. The second flow structure 220 is disposed on a side of the first flow structure 210 away from the circuit board 100, utilizing space in the thickness direction of the circuit board 100, thereby saving space occupied by the flow assembly 200 in the lateral directions (first and second directions).

[0115] In the first embodiment of the present application, Figure 5 As shown, the first flow-through structure 210 and the second flow-through structure 220 are spaced apart. By spacing apart, the first flow-through structure 210 and the second flow-through structure 220 are insulated, thereby achieving insulation between different conductive parts 201, which is simple and reliable.

[0116] In the first embodiment of the present application, Figure 5 As shown, the first current-passing structure 210 includes a first conductive strip 211 extending in a first direction; the second current-passing structure 220 includes a second conductive strip 221 extending in the first direction; the second conductive strip 221 is located on a side of the first conductive strip 211 away from the circuit board 100; the plurality of pads 110 include a first pad 111 and a second pad 112 spaced apart; the first conductive strip 211 is connected to the first pad 111; and the second conductive strip 221 is connected to the second pad 112. That is, the first conductive strip 211 and the second conductive strip 221 constitute the conductive portion 201. The conductive strips are simple to process and can be directly welded to the pads 110, improving production efficiency. The first conductive strip 211 is connected to the first pad 111, which can be connected to one circuit; the second conductive strip 221 is connected to the second pad 112, which can be connected to another pad 110, thereby reducing the DC impedance of different power sources.

[0117] Optionally, the first conductive strip 211 and the second conductive strip 221 may be copper strips, forming a three-dimensional copper strip structure. The copper strips may be made of a material with high conductivity, high tensile strength, and high hardness, such as C1100 1 / 2H. The circuit board 100 may be a PCB (Printed Circuit Board).

[0118] In the first embodiment of the present application, Figure 5As shown, the first flow-through structure 210 further includes a first insulating layer 212, which is disposed on the surface of the first conductive strip 211 near the second conductive strip 221. The second flow-through structure 220 further includes a second insulating layer 222, which is disposed on the surface of the second conductive strip 221 near the first conductive strip 211 and on the surface of the second conductive strip 221 away from the first conductive strip 211. The provision of the first insulating layer 212 and the second insulating layer 222 can improve the insulation between the first conductive strip 211 and the second conductive strip 221, preventing the occurrence of short circuits. The spacing between the first and second insulating layers can further improve the insulation. Furthermore, the surface of the first conductive strip 211 not connected to the first pad 111 can be covered with the first insulating layer 212, and the surface of the second conductive strip 221 not connected to the second pad 112 can be covered with the second insulating layer 222, to achieve a better insulation effect.

[0119] Optionally, the first insulating layer 212 and the second insulating layer 222 may be made of insulating varnish, insulating Mylar or parylene, wherein the insulating layer made of parylene may be processed by nano-coating.

[0120] In the first embodiment of the present application, Figure 5 and Figure 6 As shown, there are at least two second pads 112, and at least two second pads 112 are respectively arranged on both sides of the first pad 111 in the first direction; the length of the second flow structure 220 in the first direction is greater than the length of the first conductive strip 211 in the first direction, that is, the length of the second conductive strip 221 in the first direction is greater than the length of the first conductive strip 211 in the first direction. In this way, by designing the shape of the second conductive strip 221, the effect of arranging the first conductive strip 211 and the second conductive strip 221 in the thickness direction of the circuit board 100 can be achieved, thereby saving the space occupied by the flow assembly 200 in the first and second directions. Figure 5 As shown, both ends of the second conductive strip 221 extend toward the circuit board 100 and are connected to the second pad 112 ; the second conductive strip 221 may include a plurality of straight strip portions connected to each other, with adjacent straight strip portions being perpendicular to each other.

[0121] Alternatively, as Figure 6 As shown, the number of the first solder pads 111 can be one; with such a configuration, the area of ​​the first solder pad 111 is larger, which can improve the connection reliability between it and the first conductive strip 211; at this time, by connecting any two points of the first solder pad 111 to the circuit, the circuit can be turned on. In order to achieve better results, the connection points can be located at both ends of the first solder pad 111 in the first direction; in some other embodiments of the present application, the number of the first solder pads 111 can also be two, and the present application does not limit this.

[0122] Specifically, the first conductive strip 211 and the second conductive strip 221 can be connected to the pad 110 on the circuit board 100 through solder 500. That is, during the production process, tin can be pre-formed on the pad 110, and then the first conductive strip 211 and the second conductive strip 221 are aligned and then fixed by soldering.

[0123] In the first embodiment of the present application, Figures 7 to 10 As shown, Figure 7 This is a positional relationship diagram of the first conductive strip 211 and the second conductive strip 221 in the first embodiment of the present application. Figure 8 for Figure 7 Side view of Figure 9 for Figure 7 A top view of Figure 10 for Figure 9 The AA cross-sectional view shows the structure and positional relationship of the first conductive strip 211 and the second conductive strip 221 from different angles. The orthographic projection of the second flow-through structure 220 on the circuit board 100 can overlap the orthographic projection of the first conductive strip 211 on the circuit board 100. In this way, the structure of the second flow-through structure 220 can determine the space occupied by the flow-through assembly 200 in the first and second directions. Optionally, in the second direction, the widths of the first and second conductive strips 211, 221 can be the same to minimize DC impedance.

[0124] The difference between the circuit board assembly 10 of the second embodiment of the present application and the circuit board assembly 10 of the first embodiment of the present application lies in whether a flange structure is provided.

[0125] In the second embodiment of the present application, Figures 11 to 13 As shown, Figure 11 This is a positional relationship diagram of the first conductive strip 211 and the second conductive strip 221 in the second embodiment of the present application. Figure 12 for Figure 11 Back view of Figure 13 for Figure 11In the cross-sectional view, the first conductive strip 211 is bent in the second direction toward the second conductive strip 221 on one side, forming a first flange structure 2111; the second conductive strip 221 is bent in the second direction toward the first conductive strip 211 on one side, forming a second flange structure 2211. The first flange structure 2111 and the second flange structure 2211 are staggered in the second direction. That is, one side of the first conductive strip 211 is formed as an upper flange, and one side of the second conductive strip 221 is formed as a lower flange. This arrangement can enhance the rigidity of the first conductive strip 211 and the second conductive strip 221, reduce the possibility of deformation between the two, and thus reduce the occurrence of overlap between the two due to deformation, which is conducive to improving the insulation between the two. The first flange structure 2111 and the second flange structure 2211 are staggered in the second direction, so that there is no interference between them, saving the space occupied by them in the thickness direction of the circuit board 100, and facilitating the miniaturization design of the circuit board assembly 10.

[0126] In the second embodiment of the present application, Figure 13 As shown, the dimension d1 of the first flange structure 2111 in the thickness direction of the circuit board 100 is twice the thickness of the first conductive strip 211; the dimension d2 of the second flange structure 2211 in the thickness direction of the circuit board 100 is twice the thickness of the second conductive strip 221. This arrangement can achieve a good rigidity enhancement effect without occupying additional space, facilitating the miniaturization of the circuit board assembly 10.

[0127] The circuit board assembly 10 of the third embodiment of the present application differs from the circuit board assembly 10 of the first embodiment of the present application in that the structure of the first conductive strip 211 is different.

[0128] In the third embodiment of the present application, Figure 14 and Figure 15 As shown, Figure 14 This is a positional relationship diagram of the first conductive strip 211 and the second conductive strip 221 in the third embodiment of the present application. Figure 15 for Figure 14 As shown in the front view, both ends of the second conductive strip 221 may have inclined portions to form inclined surfaces, so that the connection is smoother and has fewer sharp corners, thereby reducing the probability of scratching other components.

[0129] The difference between the circuit board assembly 10 of the fourth embodiment of the present application and the circuit board assembly 10 of the first embodiment of the present application lies in whether a shielding cover 300 is provided.

[0130] In the fourth embodiment of the present application, Figure 16 and Figure 17 As shown, Figure 16 This is a top view of a circuit board assembly 10 according to a fourth embodiment of the present application. Figure 17 for Figure 16 In the BB cross-sectional view, the circuit board assembly 10 further includes a shielding cover 300. The shielding cover 300 is positioned over the circuit board 100 and, together with the circuit board 100, forms a housing space within which the flow assembly 200 is disposed. Specifically, the shielding cover 300 covers the exterior of the flow assembly 200, preventing deformation of the flow assembly 200 caused by external collisions. This protects the flow assembly 200 and reduces the likelihood of short circuits.

[0131] Optionally, the shielding cover 300 may be an integrated structure, which is convenient for installation and helps to improve installation efficiency.

[0132] During the production of the circuit board assembly 10 of the fourth embodiment of the present application, after the circuit board 100 is screen-printed with tin, the first conductive strip 211 (first layer of copper strip) is first pasted, then the second conductive strip 221 (second layer of copper strip) is pasted, and finally the shielding cover 300 is pasted. After the AOI (Automated Optical Inspection) step detects that there are no problems with the patch, reflow soldering is performed.

[0133] In the fourth embodiment of the present application, Figure 17 As shown, the inner surface of the shielding cover 300 is provided with a third insulating layer 400 , which can prevent the shielding cover 300 and the second flow-through structure 220 from short-circuiting, thereby improving the working stability of the circuit board assembly 10 .

[0134] Optionally, the third insulating layer 400 may be made of insulating varnish, insulating Mylar or parylene, wherein the insulating layer made of parylene may be processed by nano-coating.

[0135] In the fourth embodiment of the present application, Figure 18 As shown, Figure 18 This is a layout diagram of the solder pads 110 of the circuit board assembly 10 according to the fourth embodiment of the present application. A fifth solder pad 115 may be provided on the circuit board 100 . A plurality of fifth solder pads 115 are arranged at intervals for connection with the shielding cover 300 .

[0136] The design of the circuit board assembly 10 of the fourth embodiment of the present application is described in detail below. It is understood that the circuit board assemblies 10 of the first to third embodiments of the present application can also be designed with reference to the following numerical ranges.

[0137] like Figure 17 and Figure 18As shown, in the first and second directions, the lateral gaps of the circuit board assembly 10 are designed as follows: the gap between the first pad 111 and the second pad 112 is 0.25 mm; the gap between the second pad 112 and the fifth pad 115 is 0.25 mm; on the PCBA (Printed Circuit Board Assembly), the distance between the first pad 111 and the second pad 112 and the device body can be 0.2 mm. The width of the first pad 111 in the second direction can be 0.7 mm, and the length in the first direction can be the same as the length of the first conductive strip 211, which can be 10 mm. The size of the second pad 112 in the second direction can be 0.7 mm, and the size in the first direction can be 0.5 mm. The size of the second pad 112 can be 0.7 mm × 0.5 mm.

[0138] like Figure 17 As shown, in the thickness direction of the circuit board 100, the thickness gap of the circuit board assembly 10 is designed as follows, see Table 1, which is a thickness decomposition table of the two-layer three-dimensional copper bar structure, that is, the first conductive strip 211 and the second conductive strip 221 are both copper strips; taking the inner height of the shielding cover 300 (the total thickness available in the thickness direction of the circuit board 100) as an example, the height of the solder 500 is 0.03mm, the thickness of the first conductive strip 211 (copper strip) is 0.1mm, and the thickness of the second conductive strip 221 (copper strip) is 0.12mm; the gap between the first conductive strip 211 and the second conductive strip 221 is 0.15mm, and the gap between the second conductive strip 221 and the shielding cover 300 is 0.1mm.

[0139] Insulation measures are added to the outer surface (including the side surfaces) of the first conductive strip 211, the inner and outer surfaces (including the side surfaces) of the second conductive strip 221, and the inner surface (including the side surfaces) of the shielding cover 300, that is, a first insulating layer 212, a second insulating layer 222, and a third insulating layer 400 are provided correspondingly; if an insulating paint solution is adopted, 0.02 mm of insulating paint needs to be plated on the above-mentioned positions; if an insulating Mylar solution is adopted, 0.025 mm of insulating Mylar needs to be affixed to the above-mentioned positions; if a nano-coating solution is adopted, 0.01 mm of nano-coating needs to be plated on the above-mentioned positions.

[0140] Table 1

[0141]

[0142] In some other embodiments of the present application, the flow-through component 200 may also be designed as a multi-layer three-dimensional copper bar design, and the inner height of the shielding cover 300 needs to be higher.

[0143] As shown in Tables 2 and 3, Table 2 is a thickness breakdown table for a three-layer three-dimensional copper bar structure, and Table 3 is a thickness breakdown table for a four-layer three-dimensional copper bar structure. When the first insulating layer 212 and the second insulating layer 222 are insulating varnish, the shielding cover 300 with an inner height of 0.87 mm can be designed as a three-layer copper bar stack, and the shielding cover 300 with an inner height of 1.18 mm can be designed as a four-layer copper bar stack; when the first insulating layer 212 and the second insulating layer 222 are insulating Mylar, the shielding cover 300 with an inner height of 0.895 mm can be designed as a three-layer copper bar stack, and the shielding cover 300 with an inner height of 1.215 mm can be designed as a four-layer copper bar stack; when the first insulating layer 212 and the second insulating layer 222 are parylene prepared by nano-coating, the shielding cover 300 with an inner height of 0.82 mm can be designed as a three-layer copper bar stack; and the shielding cover 300 with an inner height of 1.11 mm can be designed as a four-layer copper bar stack.

[0144] Table 2

[0145]

[0146] Table 3

[0147]

[0148] The circuit board assembly 10 of the fourth embodiment of the present application can meet the DC impedance reduction requirements of multiple power supplies when the resources of the circuit board 100 are limited. Taking the first conductive strip 211 and the second conductive strip 221 as copper strips as an example, the DC impedance of the copper strip with a width of 0.7mm, a thickness of 0.1mm, and a length of 10mm is about 2.2mOhm; to achieve a DC impedance of 2.2mOhm, taking a copper thickness of 15μm as an example, the PCB trace needs to be about 4.7mm wide, which is a huge waste of PCB wiring resources and occupies the lateral space of the circuit board 100. When there is available space in the thickness direction of the circuit board 100, a three-dimensional copper strip structure with current flow can be used to greatly save PCB wiring resources. If the DC impedance needs to be made smaller, the thickness or width of the copper strip can be appropriately increased or a material with higher conductivity can be replaced.

[0149] The circuit board assembly 10 of the fourth embodiment of the present application uses insulating varnish, insulating Mylar or nano-coating, and reserves gaps in the thickness direction of the circuit board 100 to ensure insulation between the first conductive strip 211 and the second conductive strip 221, and between the second conductive strip 221 and the shielding cover 300. At the same time, insulating varnish, insulating Mylar or nano-coating is used in the horizontal direction to ensure insulation between the first conductive strip 211 and the second conductive strip 221 and other conductive devices.

[0150] The circuit board assembly 10 of the fifth embodiment of the present application differs from the circuit board assembly 10 of the fourth embodiment of the present application in that the structures of the second flow-through structure 220 and the shielding cover 300 are different.

[0151] In the fifth embodiment of the present application, Figures 19 to 21 As shown, Figure 19 This is a top view of a circuit board assembly 10 according to a fifth embodiment of the present application. Figure 20 for Figure 19 CC cross-section diagram, Figure 21 This is a layout diagram of the pads 110 of the circuit board assembly 10 according to the fifth embodiment of the present application. The first flow-through structure 210 includes a first conductive strip 211 extending along a first direction; the second flow-through structure 220 is a first flexible circuit board 223 extending along the first direction; the plurality of pads 110 include first and second pads 111 and 112 spaced apart; the first conductive strip 211 is connected to the first pad 111; and the first flexible circuit board 223 is connected to the second pad 112. Specifically, the conductive layer in the first conductive strip 211 and the first flexible circuit board 223 constitutes the conductive portion 201. The first conductive strip 211 is simple to process and can be directly soldered to the first pad 111, improving production efficiency. The first conductive strip 211 is connected to the first pad 111, which can be connected to one circuit; the first flexible circuit board 223 is connected to the second pad 112, which can be connected to another circuit, thereby reducing the DC impedance of different power sources. In addition, the first flexible circuit board 223 itself has a conductive layer and an insulating layer, and there is no need to provide an additional insulating layer, which is conducive to improving production efficiency.

[0152] Optionally, the first conductive strips 211 may be copper strips made of a material with high conductivity, high tensile strength, and high hardness, such as C1100 1 / 2H. The first flexible printed circuit board 223 may be made of PI (Polyimide), MPI (Modified Polyimide), or LCP (Liquid Crystal Polymer) sheet material. To reduce DC impedance for more power sources, the first flexible printed circuit board 223 may be a double-layer or multi-layer FPC.

[0153] In the fifth embodiment of the present application, Figure 20As shown, the first flow-through structure 210 further includes a first insulating layer 212, which is disposed on the surface of the first conductive strip 211 adjacent to the first flexible printed circuit board 223. The provision of the first insulating layer 212 improves the insulation between the first conductive strip 211 and the first flexible printed circuit board 223, preventing short circuits. Spacing the two further improves insulation. To further enhance insulation, the surface of the first conductive strip 211 not connected to the first pad 111 can be covered with the first insulating layer 212 to achieve even better insulation.

[0154] In the fifth embodiment of the present application, Figure 20 As shown, the shielding cover 300 includes a shielding frame 310 and a shielding cover 320. The shielding frame 310 is fixedly connected to the circuit board 100 and is arranged around the flow assembly 200. The shielding cover 320 is located on the side of the shielding frame 310 away from the circuit board 100. The separate arrangement allows the shielding frame 310 and shielding cover 320 to be installed in different process steps, providing more flexible installation methods.

[0155] like Figure 20 As shown, along the thickness direction of circuit board 100, the thickness gap design of circuit board assembly 10 can be as follows: solder 500 height is 0.03mm, first conductive strip 211 (first copper strip) thickness is 0.1mm, first flexible circuit board 223 is a 0.2035mm thick three-layer flexible printed circuit (FPC), the gap between the first copper strip and the three-layer FPC is 0.1mm, and the gap between the three-layer FPC and shielding cover 320 is 0.1mm. Insulation measures are added to the outer surface (including the sides) of the first copper strip, namely, a first insulating layer 212 is provided. If an insulating varnish solution is used, a 0.02mm thick insulating varnish is applied to the above-mentioned location; if an insulating Mylar solution is used, a 0.025mm thick insulating Mylar is applied to the above-mentioned location; if a nano-coating solution is used for insulation, a 0.01mm thick nano-coating is applied to the above-mentioned location. If the inner height of shielding cover 300 can be increased, a structure with multiple layers of copper strips and multiple layers of FPC can be stacked.

[0156] like Figure 20 and Figure 21As shown, in the first and second directions, the lateral clearances of the circuit board assembly 10 are designed as follows: the clearance between the fifth pad 115 and the third-layer FPC is 0.2mm, and the clearance between the third-layer FPC and the first pad 111 is 0.2mm. The second pad 112 can be a FOB (FPC on Board, a technology combining flexible and rigid boards for soldering) pad. The size of the second pad 112 can be 0.24mm×0.35mm. The diameter of the tin-through hole 1101 on the FOB pad is 0.075mm×0.15mm, and the pitch (center distance between adjacent solder joints) is 0.5mm. The width of the first pad 111 in the second direction is 0.7mm, and its length in the first direction is the length of the first layer copper strip, which is 10mm.

[0157] During the production process of the circuit board assembly 10 of the fifth embodiment of the present application, after the circuit board 100 completes double-sided welding (including the first layer of copper bars and the shielding frame 310), the first flexible circuit board 223 is welded to the circuit board 100 through the FOB laser welding process, and then the shielding cover 320 is buckled.

[0158] The circuit board assembly 10 of the fifth embodiment of the present application can be a three-dimensional flow-through structure composed of multiple layers of copper bars and multiple layers of FPCs. This structure can meet the DC impedance reduction requirements of multiple power supplies when circuit board 100 resources are limited. The FPC surface layer is insulating, and only assembly clearances are required between FPCs and between FPCs and shielding cover 320. Insulation between copper bars can be achieved using insulating varnish, insulating Mylar, or nano-coating, combined with reserved clearances in the thickness direction of circuit board 100. Meanwhile, insulation between copper bars and other conductive components is ensured laterally by using insulating varnish, insulating Mylar, or nano-coating, combined with reserved clearances.

[0159] The circuit board assembly 10 of the sixth embodiment of the present application differs from the circuit board assembly 10 of the fifth embodiment of the present application in that the structure of the throughflow assembly 200 is different.

[0160] In the sixth embodiment of the present application, Figures 22 to 26 As shown, Figure 22 This is a top view of a circuit board assembly 10 according to a sixth embodiment of the present application. Figure 23 for Figure 22 DD cross-section diagram, Figure 24 This is a layout diagram of the solder pads 110 of the circuit board assembly 10 according to the sixth embodiment of the present application. Figure 25 This is a cross-sectional view of the first portion of the second flexible circuit board 230 in the sixth embodiment of the present application. Figure 26This is a cross-sectional view of the second portion of the second flexible circuit board 230 in the sixth embodiment of the present application. The flow assembly 200 is the second flexible circuit board 230. The second flexible circuit board 230 includes at least two conductive layers 231 stacked sequentially in a direction away from the circuit board 100. There are at least four solder pads 110. Each pair of solder pads 110 forms a group, connected to at least one conductive layer 231 to form a conductive portion. The conductive portions are insulated from each other. That is, the conductive layer 231 of the second flexible circuit board 230 is the conductive portion 201. Connections to different circuits are achieved through different conductive layers 231 of the second flexible circuit board 230, which occupies less space in the thickness direction of the circuit board 100 and facilitates the miniaturization of the circuit board assembly 10. Furthermore, the second flexible circuit board 230 has its own insulating layer, eliminating the need for additional insulation, simplifying the processing process and improving production efficiency.

[0161] Optionally, the second flexible circuit board 230 may be made of PI (Polyimide), MPI (Modified Polyimide) or LCP (Liquid Crystal Polymer) board.

[0162] In the sixth embodiment of the present application, the second flexible circuit board 230 can be a double-layer FPC or a multi-layer FPC. The double-layer FPC has two conductive layers 231, and the multi-layer FPC has at least three conductive layers 231, which can directly connect to different circuits and simplify the structural design.

[0163] In the sixth embodiment of the present application, Figures 24 to 26 As shown, at least two conductive layers 231 include a first conductive layer 2311, a second conductive layer 2312, and a third conductive layer 2313, stacked in sequence in a direction away from the circuit board 100. At least four solder pads 110 include two third solder pads 113 and two fourth solder pads 114. The two third solder pads 113 are respectively connected to the first conductive layer 2311 and the second conductive layer 2312 to form a first conductive portion. The two third solder pads 113 are respectively connected to the third conductive layer 2313 to form a second conductive portion, which is insulated from the first conductive portion. The first conductive portion can be connected to one circuit, and the second conductive portion can be connected to another circuit, thereby reducing the impedance of different power sources.

[0164] Alternatively, as Figures 24 to 26As shown, a plurality of connecting pads can be provided on the second flexible circuit board 230, the first conductive layer 2311 and the second conductive layer 2312 can both be connected to the first connecting pad 232, the third conductive layer 2313 is connected to the second connecting pad 233, the first connecting pad 232 can be connected to the third pad 113 on the circuit board 100, and the second connecting pad 233 can be connected to the fourth pad 114, and the connection method is simple.

[0165] In some other embodiments of the present application, the first conductive layer 2311 may be connected to the first connecting pad 232, and the second conductive layer 2312 and the third conductive layer 2313 may be connected to the second connecting pad 233. As long as the requirement of reducing DC impedance can be met, the present application does not impose any limitation on this.

[0166] In the sixth embodiment of the present application, a 0.2035 mm thick three-layer FPC is used as an example. The three-layer FPC includes a first base layer 2341, a first adhesive layer 2351, a first conductive layer 2311, a second base layer 2342, a second conductive layer 2312, a second adhesive layer 2352, a third base layer 2343, a third conductive layer 2313, a third adhesive layer 2353, and a fourth base layer 2344, which are stacked in sequence. In the thickness direction of the circuit board 100, the height of the solder 500 is 0.03 mm, and the gap between the three-layer FPC and the shielding cover 320 is 0.1 mm. For data on the three-layer FPC, see Table 4, which shows the stacking structure data of the three-layer FPC.

[0167] Table 4

[0168]

[0169] like Figure 23 and Figure 24 As shown, in the first direction and the second direction, the lateral gap of the circuit board assembly 10 is designed as follows: the gap between the fifth pad 115 and the second flexible circuit board 230 is 0.2 mm, the third pad 113 and the fourth pad 114 can be FOB pads, the FOB pad size is 0.24 mm × 0.35 mm, the aperture of the tin-through hole 1101 is 0.075 mm × 0.15 mm; the pitch spacing of the solder joints is 0.5 mm; the inner height of the shielding cover 300 is increased, and an FPC with thicker copper thickness and more layers can be used, or a multi-layer FPC structure can be stacked to achieve a better effect of reducing DC impedance.

[0170] During the production of the circuit board assembly 10 of the sixth embodiment of the present application, after the double-sided welding of the circuit board 100 is completed, the second flexible circuit board 230 can be welded to the circuit board 100 through the FOB laser welding process, and then the shielding cover 320 can be fastened.

[0171] The circuit board assembly 10 of the sixth embodiment of the present application can meet the DC impedance reduction requirements of multiple power supplies even when circuit board resources are limited. The second flexible circuit board 230 has an insulating surface, and only assembly clearance is required between the second flexible circuit board 230 and between the second flexible circuit board 230 and the shielding cover 320. This three-dimensional, flow-through FPC structure allows for easy assembly within the shielding cover 300, eliminating the need to disassemble the shielding cover 300 into a separate structure consisting of a shielding frame 310 and a shielding cover 320.

[0172] In addition to the above scenarios, the circuit board assembly 10 of the embodiment of the present application is also applicable to other scenarios where the DC impedance needs to be reduced. For example, the DC impedance requirements of the charge and discharge link are also relatively strict. 2 R shows that the greater the link impedance, the more serious the heat consumption of the PCB link, especially for high-current fast charging scenarios and high-current discharge scenarios, the heat consumption is more obvious, which in turn affects the charging time of the mobile phone and the battery discharge time. Especially for foldable products, in order to make full use of the space of the whole machine and increase battery life, there are generally two or more batteries, and the length of the charging link and the discharge link will be longer than that of straight-plate products. Targeting the location of PCB wiring resource bottlenecks (such as narrow strip scenarios, SOC fanout (fan-out) peripheral wiring areas). It is understandable that the above embodiments of the present application can be combined to match more usage scenarios.

[0173] The electronic device of the embodiment of the present application includes the circuit board assembly 10 of any of the above embodiments, which fully utilizes the space in the thickness direction of the circuit board 100 and saves the space occupied by the current-passing assembly 200 in the first direction and the second direction; realizes the current passing to different circuits, achieves the effect of reducing the DC impedance of multiple power supplies in a limited space, and thereby improves the performance of the electronic device.

[0174] It should be noted that in the examples and description of this patent, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "including a" does not exclude the presence of other identical elements in the process, method, article or device that includes the element.

[0175] Although the present application has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the application.

Claims

1. A circuit board assembly, characterized in that: include: a circuit board including a plurality of solder pads; A flow-through component is provided on a side of the circuit board where the pad is provided; It comprises at least two conductive parts, which are stacked in the thickness direction of the circuit board; the conductive parts are insulated from each other; and the at least two conductive parts are connected to different pads.

2. The circuit board assembly according to claim 1, wherein: The flow-through assembly comprises: a first flow-through structure comprising at least one conductive portion; The second flow-through structure is insulated from the first flow-through structure and is arranged on a side of the first flow-through structure away from the circuit board; and includes at least one conductive portion.

3. The circuit board assembly according to claim 2, wherein: The first flow-through structure and the second flow-through structure are spaced apart from each other.

4. The circuit board assembly according to claim 2, wherein: The plurality of pads include: a first pad and a second pad that are spaced apart; The first flow-through structure includes: a first conductive strip extending along a first direction; the first conductive strip is connected to the first pad; The second current-passing structure includes: a second conductive strip extending along the first direction; the second conductive strip is located on a side of the first conductive strip away from the circuit board; and the second conductive strip is connected to the second pad; The first direction and the thickness direction of the circuit board are perpendicular to each other.

5. The circuit board assembly according to claim 4, wherein: One side of the first conductive strip in the second direction is bent toward the second conductive strip to form a first flange structure; One side of the second conductive strip in the second direction is bent toward the first conductive strip to form a second flange structure; The first flanging structure and the second flanging structure are staggered in the second direction; The second direction is perpendicular to the first direction and the thickness direction of the circuit board.

6. The circuit board assembly according to claim 5, wherein: The dimension of the first flange structure in the thickness direction of the circuit board is twice the thickness of the first conductive strip; The dimension of the second flange structure in the thickness direction of the circuit board is twice the thickness of the second conductive strip.

7. The circuit board assembly according to claim 4, wherein: The first current-passing structure further includes: a first insulating layer, the first insulating layer being arranged on a surface of the first conductive strip close to the second conductive strip; The second current-passing structure further includes a second insulating layer, which is arranged on a surface of the second conductive strip close to the first conductive strip and on a surface of the second conductive strip away from the first conductive strip.

8. The circuit board assembly according to claim 2, wherein: The plurality of pads include: a first pad and a second pad that are spaced apart; The first flow-through structure includes: a first conductive strip extending along a first direction; the first conductive strip is connected to the first pad; The second flow-through structure is a first flexible circuit board, and the first flexible circuit board extends along the first direction; the first flexible circuit board is connected to the second pad; The first direction and the thickness direction of the circuit board are perpendicular to each other.

9. The circuit board assembly according to claim 8, wherein: The first current-passing structure further includes a first insulating layer, which is arranged on a surface of the first conductive strip close to the first flexible circuit board.

10. The circuit board assembly according to any one of claims 4 to 9, characterized in that: The number of the second pads is at least two, and the at least two second pads are respectively arranged on both sides of the first pad in the first direction; A length of the second flow-through structure in the first direction is greater than a length of the first conductive strip in the first direction.

11. The circuit board assembly according to any one of claims 4 to 9, characterized in that: The orthographic projection of the second flow-through structure on the circuit board covers the orthographic projection of the first conductive strip on the circuit board.

12. The circuit board assembly according to claim 1, wherein: The flow-through component is a second flexible circuit board; the second flexible circuit board includes at least two conductive layers stacked in sequence in a direction away from the circuit board; The number of the pads is at least four; every two pads form a group and are connected to at least one conductive layer to form a conductive portion; the conductive portions are insulated from each other.

13. The circuit board assembly according to claim 12, wherein: The at least two conductive layers include: a first conductive layer, a second conductive layer, and a third conductive layer stacked in sequence in a direction away from the circuit board; The at least four pads include: two third pads and two fourth pads; The two third pads are respectively connected to the first conductive layer and the second conductive layer to form a first conductive portion; The two fourth pads are respectively connected to the third conductive layer to form a second conductive portion, and the second conductive portion is insulated from the first conductive portion.

14. The circuit board assembly according to claim 12, wherein: The second flexible circuit board is a double-layer FPC or a multi-layer FPC.

15. The circuit board assembly according to claim 1, wherein: The circuit board assembly further includes: a shielding cover; The shielding cover is arranged on the circuit board and forms a receiving space together with the circuit board; The through-flow component is arranged in the accommodating space.

16. The circuit board assembly according to claim 15, wherein: The inner surface of the shielding cover is provided with a third insulating layer.

17. The circuit board assembly according to claim 15, wherein: The shielding cover is an integrated structure; Alternatively, the shielding cover includes a shielding frame and a shielding cover; the shielding frame is fixedly connected to the circuit board and is arranged around the flow-through component; the shielding cover is arranged on a side of the shielding frame away from the circuit board.

18. The circuit board assembly according to claim 7, wherein: The first conductive strip and the second conductive strip are both copper strips; The thickness of the first conductive strip is 0.1 mm; The thickness of the second conductive strip is 0.12 mm; The gap between the first conductive strip and the second conductive strip in the thickness direction of the circuit board is 0.15 mm; The first insulating layer and the second insulating layer are made of insulating varnish, insulating Mylar or Parylene.

19. An electronic device, characterized in that: A circuit board assembly comprising any one of claims 1 to 18.

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