Method for pre-profiling grinding tool

Abstract

To provide a device for hard fine machining of workpieces and for profiling grinding tools.SOLUTION: A device, in particular a gear grinding machine (1), includes: a workpiece spindle (2) for rotating a workpiece; a grinding spindle (3), which is feedable at least along an X-grinding-spindle-infeed-axis, for rotating a grinding tool, in particular a grinding worm (4) or a grinding wheel; and a profiling device (5) with a fixed first profiling plate (6). A grinding tool blank, in particular a grinding worm blank, is provided on the grinding spindle (3) of the device. The device is brought into a profiling configuration. The grinding spindle (3) is fed until the grinding tool blank is operatively connected to the first profiling plate (6). Finally, the grinding tool blank is pre-profiled.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present invention relates to a method for pre-profiling a grinding tool and to a device for hard precision machining of a workpiece and profiling of a grinding tool. [Background technology]

[0002] In the case of hard precision machining of workpieces, such as gear blanks, these are machined using grinding tools such as grinding wheels or grinding worms. A preferred method is generating grinding using a gear grinding machine. It is important that the grinding tool used has a profile that precisely matches the desired profile shape of the workpiece. This is achieved, among other things, by corresponding profiling of the tool blank. Profiling involves pre-profiling to obtain the required rough profile and dressing for the precise profiling. Pre-profiling of the grinding tool blank is usually performed once on a profiling machine designated for this purpose, such as a circular grinding machine, while dressing is performed on the gear grinding machine, such as a generating grinding machine, and is periodically repeated after a certain period of use. In the case of pre-profiling, line dressing is performed, for example, using a radial profile roller, which offers relatively high flexibility but is time-consuming. Rotary dressing tools, in particular, have the disadvantage that damage to the grinding tool blank can easily occur, for example, if used improperly.

[0003] Therefore, pre-profiling is usually not performed by the grinding machine user, especially the user of generating grinding machines, but by the supplier of the corresponding machine. The user acquires the grinding tools that are already pre-profiled and stores them for future use. This limits the flexibility of the customer and also represents a financial burden, as the customer must estimate in advance the need for profiled grinding tools.

[0004] It is known from the prior art to use so-called dressing masters for pre-profiling. These are, in particular, diamond tools whose shape corresponds to the desired profile shape of the workpiece to be machined. Such dressing masters can then also be clamped in a grinding machine, for example, in particular the workpiece, and operatively connected to a grinding tool blank. As a result, a profile is introduced into the grinding tool blank, whose profile corresponds to the negative of the profile of the dressing master.

[0005] However, this type of method has the disadvantage of being relatively inflexible: a corresponding dressing master is required for each workpiece shape. In addition, there are problems with producing profiles for relatively small workpieces, for example, workpieces with modules of less than 1 mm. Summary of the Invention

[0006] The object of the present invention is to provide a method that belongs to the technical field mentioned at the beginning and allows flexible and demand-based pre-profiling of grinding tools using a device that is also suitable for hard precision machining of workpieces.

[0007] The solution to this object is defined by the features of claim 1. According to the invention, a method for pre-profiling a grinding tool comprises: a) providing a device for hard precision machining of workpieces and pre-profiling of grinding tools, in particular a gear grinding machine, which device comprises: a. a workpiece spindle for rotating the workpiece; b. a grinding spindle for rotating a grinding tool, in particular a grinding worm or a grinding wheel, which is infeedable at least along the X-grinding spindle infeed axis; c. a profile processing device having a fixed first profile processing plate; b) providing a grinding tool blank, in particular a grinding worm blank, on a grinding spindle of said device; c) placing the device in a profiled configuration; d) feeding the grinding spindle until the grinding tool blank is operatively connected to the first profile machining plate; e) pre-profiling the grinding tool blank.

[0008] A further aspect of the invention is a device for hard precision machining of workpieces and profiling of grinding tools, in particular using the method according to the invention, in particular a gear grinding machine, which device comprises: a) a workpiece spindle for rotating the workpiece; b) a grinding spindle for rotating a grinding tool, in particular a grinding worm or a grinding wheel, which is feedable along at least an X-grinding spindle feed axis, said device having a workpiece machining configuration that allows the grinding spindle to be fed into the workpiece spindle along the X-grinding spindle feed axis until the grinding tool located on the grinding spindle is operatively connected to a workpiece located on the workpiece spindle; c) a profile machining device having a fixed first profile machining plate, the profile machining device having a first profile machining configuration that allows the grinding spindle to be fed into the profile machining device until a grinding tool located on the grinding spindle is operably connected to the first profile machining plate.

[0009] Here, workpiece means in particular a gear blank, which has to be further processed by hard precision machining, such as generating grinding, in order to be usable as a gear in, for example, a gear mechanism. Generally, such workpieces consist of metal, for example hardened steel.

[0010] In the context of the present invention, a grinding tool, in particular a grinding worm or grinding wheel, is a tool suitable for hard precision machining of workpieces. In particular, such a grinding tool consists of a molding and bonding medium and particles that are bonded in the medium and are usually harder than the material of the workpiece to be machined. The medium can be ceramic, while the particles consist of, for example, fused or sintered corundum.

[0011] For suitable hard precision machining of a workpiece, the grinding tool has a profile that corresponds to the negative of the desired profile shape of the workpiece. In the case of a grinding worm, this profile spirals around the outside of the grinding worm so that the grinding worm has multiple teeth that resemble a gear in cross section. In the case of a grinding wheel, on the other hand, the profile simply corresponds to the shape of the pitch profile of the finished gear, i.e., the left tooth flank, root region, and right tooth flank, or the negative thereof.

[0012] A grinding tool blank is a blank for a grinding tool, which becomes a suitable tool simply by introducing a profile. By providing a corresponding device, in particular a gear grinding machine, preferably a generating grinding machine, this device becomes available for use in the remaining part of the method, which, according to the invention, is a device having the above-mentioned characteristics.

[0013] The workpiece spindle serves to rotate the workpiece during hard precision machining. During generating grinding, this occurs continuously, while the workpiece is operatively connected to a grinding worm, similar to a worm gear mechanism. When a grinding wheel is used, for example during pitch profile grinding, the workpiece will only rotate further unless the grinding wheel and workpiece are engaged.

[0014] The grinding spindle holds and rotates the grinding tool, the axis of which is usually inclined, particularly at an angle of 90°, to the axis of workpiece rotation of the workpiece spindle, but can be tilted in the present process, and rotates the grinding tool at a rotational speed adjusted to the respective grinding or profiling operation.

[0015] In this process, the grinding spindle is infeedable at least along the X-grinding spindle infeed axis. In other words, the grinding spindle is movable to the workpiece located on the workpiece spindle in order to operatively connect the grinding tool with the workpiece. For this purpose, the grinding spindle is arranged, in particular, on a movably mounted grinding slide.

[0016] The X-grinding spindle infeed axis is in particular a movement axis which extends perpendicular to the rotation axis of the grinding spindle and also perpendicular to the rotation axis of the workpiece spindle. The X-grinding spindle infeed axis preferably extends horizontally.

[0017] The profile machining device according to the present invention is suitable for pre-profiling grinding tool blanks. For this purpose, the profile machining device must include at least one fixed first profile machining plate. The fixed first profile machining plate means that it is fixed in such a way that it does not rotate during the profile machining operation and cannot rotate around a rotation axis, particularly around a rotation axis extending parallel and / or perpendicular to the grinding spindle rotation axis. In this case, the first profile machining plate has a plate shape. In the direction extending parallel to the grinding spindle rotation axis, the first profile machining plate has a width, in the engagement region, that is narrower than the tooth thickness of the gear for which the grinding tool blank is to be provided. In particular, the profile machining plate has a maximum length that is smaller than, for example, the minimum diameter of the workpiece spindle.

[0018] The first profile machining plate, in contrast to, for example, a grinding wheel, is also not rotationally symmetrical, particularly during rotation around an axis perpendicular to one of its main surfaces and passing through the first profile machining plate. In particular, the first profile machining plate, in its distal region facing the grinding spindle during pre-profiling (see below), is arrow-shaped or triangular with its tip pointing towards the grinding spindle. At least in the profile machining configuration of the profile machining device, the first profile machining plate is preferably oriented so that its main surfaces are horizontal.

[0019] The first profiling plate in particular consists of or comprises a material harder than hardened steel, for example diamond (see below). When providing the grinding tool blank on the grinding spindle, the grinding tool blank is placed on the grinding spindle so that the grinding spindle can rotate the grinding tool blank, and is therefore mounted in particular in the same way as an already finished profiled grinding tool is mounted on a device for machining a workpiece.

[0020] Placing the device in the profile processing configuration includes all steps of placing the device in a configuration (first profile processing configuration) in which the grinding spindle can be fed into the profile processing device until the grinding tool blank is operably connected to the first profile processing plate. This particularly means aligning the first profile processing plate with respect to the grinding spindle. Alternatively or additionally, depending on the specific device, it can also mean moving the grinding spindle, for example, along the Z-grinding spindle axis, to a suitable vertical height, particularly the vertical height of the profile processing device. It can also include removing protection from the profile processing device, for example, opening a protective hood, or unfolding the profile processing device. Similarly, assuming the profile processing configuration means fixing the first profile processing plate in a way that it is not freely movable and / or rotatable (if not previously). In particular, for example, in devices in which the workpiece spindle is arranged on a movable base, especially adjacent to a carrier tower, placing the device in the profile processing configuration also includes suitable rotation or alignment of this base (see below).

[0021] In this process, the feed can be performed along the X-grinding spindle feed axis. It is also possible for the feed axis to the profile machining device to be offset from the X-grinding spindle feed axis, for example, perpendicular to the X-grinding spindle feed axis, for example, vertically upward. In particular, the feed can be performed along a Y-grinding spindle axis parallel to the grinding spindle axis. In this case, the grinding tool blank is first positioned relative to the first profile machining plate, for example, by moving it along the X-grinding spindle feed axis, so that there is a straight line parallel to the grinding spindle axis that extends through both the tip of the first profile machining plate and the outer region of the grinding tool blank.

[0022] Pre-profiling the grinding tool blank includes feeding the grinding spindle with the grinding tool blank into the profiling device until the grinding tool blank is operably connected to the first profiling plate. Additionally, pre-profiling the grinding tool blank includes rotating the grinding spindle. During rotation of the grinding tool blank, material removal occurs as a result of interaction with the first profiling plate. This results in profiling, particularly pre-profiling, of the grinding tool blank. Preferably, pre-profiling includes further movement of the grinding spindle, for example, along a Y-grinding spindle axis parallel to the grinding spindle rotation axis. In the case of a grinding worm blank, for example, the grinding spindle is also moved along the profiling device to accommodate the rotation speed, particularly along the Y-grinding spindle axis, so that the removal material spirals around the grinding tool blank in the desired manner. Further details of this variant are described further below.

[0023] On the other hand, with a grinding wheel blank, the grinding spindle is moved, if at all, only so that the desired profile shape is created by removal. An advantage of the method according to the invention and the device according to the invention is that grinding tool blanks can be pre-profiled using the same device, which can then also be used to carry out hard precision machining of the workpiece. Thus, the user of the device can, for example, prepare grinding tool blanks and pre-profile them as needed in order to use them as grinding tools in the subsequent hard precision machining. Furthermore, no dedicated dressing master is required for each gear shape. This allows for particularly flexible, on-demand pre-profiling.

[0024] In addition, the use of a first profiling plate results in a high level of wear, so profiling can be carried out more quickly. Profiling can also be carried out dry, i.e., without the addition of cooling oil, which makes the method particularly simple.

[0025] A further advantage is that the method and / or device can be used to produce profiles that allow relatively precise tooth grinding. Grinding tools that are particularly suitable for grinding gears with a module of less than 1, in particular up to 0.5, can therefore be pre-profiled in a simple, flexible and customizable manner. This results in a particularly flexible and versatile method and, likewise, a particularly flexible and versatile device.

[0026] Bringing the device into the profile machining configuration preferably involves moving the first profile machining plate, in particular pivoting the first profile machining plate along a circular path to the machining position of the grinding tool. The machining position of the grinding tool in this case is the position that the first profile machining plate has in the profile machining configuration, in particular the position that it maintains during the entire profile machining operation. In this case, the movement can be performed linearly, for example, horizontally, or linearly, for example, vertically. The movement is preferably performed horizontally along a circular path. In this case, the first profile machining plate can be pivoted, for example, along a vertical pivot axis located outside the first profile machining plate, particularly preferably outside the profile machining device. However, the profile machining plate can also be pivoted along a horizontally extending pivot axis to the machining position of the grinding tool. By moving the first profile machining plate into the machining position of the grinding tool, the device can be easily and very quickly brought into the profile machining configuration. The profile processing device and the first profile processing plate can be of a relatively compact design relative to the other components of the device, so that movement of the first profile processing plate can be easily performed and can be done particularly quickly.

[0027] Alternatively, placing the device in the profile machining configuration may be performed without moving the first profile machining plate, for example by moving the grinding spindle, or for example by feeding the profile machining device on an infeed axis other than the X-grinding spindle infeed axis.

[0028] In a preferred version of the above-mentioned variants of the invention, placing the device in the profile machining configuration includes moving the grinding spindle along a Z-grinding spindle axis extending parallel to the workpiece rotation axis to the grinding spindle profile machining height. This means that the grinding spindle is moved before feeding into the profile machining device. This provides a method that can be used, for example, with a profile machining device arranged on the device at a different height than the workpiece located on the workpiece spindle. In particular, devices can be used in which the profile machining device is located above or below the clamping area of the workpiece spindle.

[0029] Such a method also allows for a profile machining device that is arranged fixedly, i.e. immovably, spaced apart from the workpiece spindle only in vertical height, which makes the method particularly flexible.

[0030] Alternatively, the method may be performed without movement along the Z-grinding spindle axis, for example, if the profile machining device in the profile machining configuration is at the same height as the workpiece located on the workpiece spindle, or if the feed axis to the profile machining device is an axis different from the X-grinding spindle feed axis.

[0031] In a preferred embodiment of all the above-mentioned variants of the present invention, the first profile machining plate is moved to a waiting position after completion of the pre-profile machining, in which the first profile machining plate is located outside the feed area between the grinding spindle and the workpiece spindle.

[0032] The waiting position is, in particular, a position where the first profile machining plate does not interfere with the feed of the grinding spindle into the workpiece spindle and can remain in that position even during the grinding operation. The feed area, for example, has a particularly small spatial area, which includes all positions of the grinding tool during the feed of the workpiece spindle and, in particular, all positions of the grinding tool during the grinding operation of the workpiece. By moving the profile machining plate to the waiting position, the device for completing the method according to the invention can be made particularly quickly available for hard precision machining of the workpiece. This makes it particularly easy to incorporate the method into a sequence that provides both pre-profiling of the grinding tool and hard precision machining of the workpiece.

[0033] Alternatively, the first profiling plate may remain stationary after pre-profiling is complete, which can be used, for example, in methods where the height of the profiling device and the height of the workpiece located on the workpiece spindle are different along the Z-grinding spindle axis.

[0034] In a preferred embodiment of the present invention, during pre-profile machining, the grinding spindle is moved along a Y-grinding spindle axis extending parallel to the grinding spindle rotation axis of the grinding spindle in a Y-operationally connected movement region in which the grinding tool blank located on the grinding spindle remains operatively connected to the first profile machining plate.

[0035] In other words, the Y-operationally connected travel area refers to a travel area in which the grinding spindle can move along the Y-grinding spindle axis to the profile machining device after infeed without the grinding tool and the first profile machining plate becoming disengaged. This Y-operationally connected travel area can be a region along the Y-grinding spindle axis that is wider than the width of the desired profile or a region whose width corresponds to the width of the desired profile. Thus, by moving the grinding spindle together with the grinding tool blank, a helical profile can be produced, particularly on a grinding worm blank. This movement is also called a shift. In particular, in this case, the width of the desired profile is passed completely from one side to the other, and then the grinding spindle is moved back to the starting position along the Y-grinding spindle axis, and in particular also along the X-grinding spindle axis. This can be repeated several times. In particular, after the return, a position offset from the starting position can be assumed, for example, to profile the second flank of the profile facing the first flank in a new pass. The speed of movement along the Y-grinding spindle axis is in this case coordinated in particular with the rotational speed of the grinding spindle in order to obtain the desired profile.

[0036] This allows flexible pre-profiling, especially of the grinding worm, making use of the customary movement possibilities of gear grinding machines, especially generating grinding machines, and of typical grinding and shifting carriages. Even in the case of pre-profiling of the grinding wheel, a movement can be made along the Y-grinding spindle axis to obtain the desired profile.

[0037] This makes the method particularly simple and universally usable, and also particularly flexible and demand-oriented. Alternatively, the grinding spindle may remain stationary and, for example, the profile machining device or the first profile machining plate may be moved, for example, parallel to the grinding spindle rotation axis, which is a variant especially for gear grinding machines that do not allow any movement of the grinding spindle along the Y-grinding spindle axis.

[0038] In a preferred embodiment of the invention, during pre-profile machining, the clamping legs of the profile machining plate holder contact and support one side of the first profile machining plate, which side has a surface normal substantially oriented in the same direction as the rotation direction of the grinding tool blank in the local operational connection area between the grinding tool blank and the profile machining plate.

[0039] The clamping legs of the profile machining plate holder serve as supports for the profile machining plate and prevent it from being damaged by forces, particularly during profiling (see below). The local operative connection area is, in particular, the area of the grinding tool blank that is operatively connected to the first profile machining plate. The corresponding rotation direction is therefore, in particular, the direction of the force that the grinding tool blank exerts on the profile machining plate. In particular, the supported side surface is the main surface of the first profile machining plate. The support of the side surface whose surface normal faces in the same direction therefore counteracts the effect of this force and, in particular, prevents bending or damage to the first profile machining plate during the profiling operation.

[0040] This makes the method particularly reliable and sustainable. Alternatively, the method can be carried out without clamping legs or the clamping legs can be oriented differently, in which case it is necessary to use a first profile machining plate that has the necessary stability even without supports.

[0041] In a preferred embodiment of the present invention, before the device is placed in the profile machining configuration, a measurement of the first profile machining plate is performed, for which the first profile machining plate is brought into contact with the probe, in particular at at least two contact points of the profile machining plate, consecutively. An essential factor affecting the quality of the results and thus the quality of the method is accurate knowledge of the geometry of the profile machining plate. This knowledge is particularly necessary to be able to accurately plan advances and related movements, such as shifts. However, the geometry of the profile machining plate changes from its initial geometry during each profile machining operation as a result of wear.

[0042] Measurement here refers to a method of gathering knowledge about the geometry of the first profile machining plate, particularly about the geometry of the portion of the profile machining plate that will be operatively connected to the grinding tool blank. A probe, particularly a measuring cube, having a known geometry and location within the device is brought into contact with the first profile machining plate, for example, by a movement that is also recorded. For example, by knowing the exact position of the probe during contact, the geometry of the first profile machining plate can then be scanned. In particular, in this case, the probe is moved while the first profile machining plate remains stationary. The probe may include, for example, a contact sensor, such as a capacitance sensor, or a laser measurement system in which contact is registered. Contact can also be established by observation by an operator, for example, using a camera. The probe is preferably brought into continuous contact with the first profile machining plate at multiple positions. In particular, the probe is brought into contact with the outermost tip of the first profile machining plate, particularly facing the grinding spindle in the profile machining configuration, and also, for example, with two opposing points on the side of the first profile machining plate. Naturally, to improve resolution, the probe can be brought into contact with more locations on the first profiled plate, but tests have shown that a particularly efficient yet accurate method is achieved using three contact points, in this case preferably on the outermost tip of the first profiled plate and in each case on the opposing flank of the first profiled plate.

[0043] The geometry of the first profile machining plate can then be reconstructed from the various contact locations or positions of the probe. The results of the measurements are preferably used as input in the pre-profile machining planning, in particular for planning the movement of the grinding spindle, for example by the grinding slide and / or the shift slide. The results can also be used to determine whether the first profile machining plate needs to be replaced.

[0044] This additional step provides an efficient yet particularly reliable and high quality method. In a particularly preferred variant of the above-described method, before the measurement of the first profile machining plate, the probe is fed into the profile machining device until the probe and the first profile machining plate come into contact with each other, in particular in this case the probe is fed along the X-grinding spindle feed axis.

[0045] This has the advantage that existing moving components present in the gear grinding machine, such as the grinding slide, are also used to move the probe. In particular, for this purpose, the probe is brought into a measurement configuration before feed-in, in which it is, for example, in front of the grinding spindle and the grinding tool blank. The probe can then be fed in in the same way as the grinding spindle in the profile machining configuration.

[0046] Thus, a particularly simple and efficient method is provided. Alternatively, the probe can be brought into contact with the first profiling plate in a different way, for example by moving the profiling device or by pivoting the probe on the profiling device.

[0047] Alternatively, the measurement may be omitted. Possible alternatives are described further below in the text. If sufficient wear has been experienced, it is also possible, for example, to replace the first profiling plate after a certain number of profiling operations and then start with a new, known geometry.

[0048] In a preferred embodiment of the present invention, before the device is configured for profiling or before pre-profiling, a digital twin of the first profiling plate is called up for the purpose of planning the pre-profiling, this digital twin representing the previous wear state of the first profiling plate, and during or after pre-profiling, the digital twin is updated, particularly by simulation, to represent the updated wear state of the first profiling plate. In particular, the digital twin can serve as a substitute for measurements using a probe, but can also serve, for example, as a supplement. Thus, planning the pre-profiling includes, in particular, determining the necessary movements to be performed before and during profiling, in particular the infeed distance but also, for example, the shift distance.

[0049] The digital twin is a digital representation of the first profile machining plate, which is stored, for example, on the hard disk of a PC or a control unit. In particular, the digital twin represents the geometry of the profile machining plate and / or its wear state. However, the digital twin can also represent additional elements, such as the age and composition of the profile machining plate, for example, the material from which the first profile machining plate, and in particular the cutting elements of the first profile machining plate, are made. By calling up the digital twin, it is possible to retrieve a geometry that corresponds in particular to the geometry of the first profile machining plate. This can be used to plan the pre-profile machining.

[0050] In this case, updating the digital twin includes, in particular, a simulation, for example a simulation using the finite element method (FEM). In this case, for example, pre-profiling movement data from the plan or recorded values are used as input for the simulation. The updated digital twin thus represents the changed geometry of the first profiling plate after the profiling operation and is available for further profiling operations.

[0051] This provides a particularly efficient and accurate method that also takes into account the wear of the profile machining plate, independent of the measurement value. Alternatively, for example in the case of the measurements mentioned above, the digital twin can be omitted.

[0052] In a variant of the device according to the invention, the grinding spindle in the first profile machining configuration can be fed into the profile machining device along the X-grinding spindle feed axis, which simplifies the construction of the device, since the same feed axis serves both for feeding the finished profiled grinding tool into the workpiece and for feeding the grinding tool blank into the profile machining device.

[0053] Alternatively, if, for example, the profile machining device is arranged above the grinding spindle, the infeed can also take place, for example, along the vertical Z-grinding spindle axis.

[0054] In particular, when pre-profiling a grinding worm, the grinding spindle in the grinding worm profiling configuration can be fed into the profiling device along the Y-grinding spindle feed axis. For this purpose, the grinding tool blank can be positioned relative to the first profiling plate, for example by moving it along the X-grinding spindle feed axis, so that there is a straight line parallel to the grinding spindle axis that runs through both the tip of the first profiling plate and the outer region of the grinding tool blank.

[0055] In a preferred variant of the device, the first profile machining plate is movable, in particular pivotable, to a waiting position, in which it is located outside the infeed area along the X-grinding spindle infeed axis between the grinding spindle and the workpiece spindle. The waiting position can be located, for example, in a spatial area located on the opposite side of the grinding spindle from the workpiece spindle. If the device comprises a carrier tower (see below), the waiting position can in particular be located on the opposite side of the carrier tower from the workpiece spindle.

[0056] By moving into a standby position, the device for completing the method according to the invention can be made particularly quickly available for hard precision machining of a workpiece, so that the device is particularly flexible and allows a simple, reliable and fast transition from a first profile machining configuration to a workpiece machining configuration.

[0057] Alternatively, the first profile machining plate can also be fixed, for example immobile, which can be used in particular in solutions where the height of the profile machining device on the one hand and the height of the workpiece located on the workpiece spindle on the other hand differ along the Z-grinding spindle axis.

[0058] In a preferred embodiment of the device according to the invention, the profile machining device comprises a pivotally mounted pivot arm, the first profile machining plate being arranged at the distal end of the pivot arm.

[0059] In this case, the pivot arm is pivotable, in particular about an axis extending parallel to the rotation axis of the workpiece spindle, in particular about an axis extending vertically. In particular, the pivot arm is substantially rectangular and has a vertical height corresponding to more than 50% of its horizontal length and a width corresponding to more than 40% of said length. This ensures sufficient stability of the pivot arm even during force-intensive profiling operations. The length of the pivot arm, measured, for example, from its free end to its pivotable mounting, is in particular less than 20 times the maximum length of the first profiling plate.

[0060] For mounting the pivot arm, the profiling device may in particular also comprise a pivot arm base, on which the pivot arm is pivotably mounted. The profile machining device with a pivoting arm has the advantage that the first profile machining plate can be positioned on the device so that it can be easily unfolded and folded, thereby allowing the profile machining device to be located in a less exposed position within the device. This prevents the first profile machining plate from being damaged, for example, during secondary machining or pivoting of the entire profile machining device. This allows the entire device to be constructed more compactly. In addition, by pivoting the pivoting arm, the first profile machining plate can be flexibly aligned or adjusted relative to the grinding worm, so that different profile flank geometries can be produced in a simple manner.

[0061] Alternatively, the profile processing device can also be designed without a pivoting arm, for example if sufficient space is available. In a preferred embodiment of the device according to the present invention, the grinding spindle is movable along a Y-grinding spindle axis, which extends parallel to the grinding spindle rotation axis of the grinding spindle, particularly perpendicular to the X-grinding spindle feed axis. In this case, in the first profile machining configuration, a Y-operationally connected movement area is present, within which the grinding tool located on the grinding spindle is operatively connected to the first profile machining plate. In particular, the Y-grinding spindle axis extends horizontally. The grinding spindle can preferably be mounted on a shift slide, which is movably mounted along the Y-grinding spindle axis. The advantages of the Y-operationally connected movement area have already been described further in the text with reference to the corresponding method. In this way, a particularly simple device is provided that is simultaneously suitable for hard precision machining of the workpiece and pre-profiling of the ground worm blank. Alternatively, the profile machining device may be designed to be shiftable, i.e., movable parallel to the grinding spindle rotation axis.

[0062] The grinding spindle is preferably movable along a Z-grinding spindle axis, which extends parallel to the workpiece rotation axis of the workpiece spindle, in particular perpendicular to the X-grinding spindle feed axis, and the grinding spindle assumes a grinding spindle profile machining height along the Z-grinding spindle axis in the workpiece machining configuration.

[0063] In particular, for this purpose, a shift slide, on which the grinding spindle is arranged, is mounted so as to be movable along a Z-grinding spindle axis, which in this case extends in particular vertically.

[0064] The mobility along the Z-grinding spindle axis allows the profile machining device to be mounted at a height offset from the height of the workpiece located on the workpiece spindle, allowing for a compact and flexible construction of the device.

[0065] In a preferred variant of the invention, the device comprises in particular a rotatably mounted carrier tower, which carrier tower in particular has a workpiece carrier for transporting the workpiece to the workpiece spindle.

[0066] Carrier towers for gear grinding machines are known per se. The carrier tower is, in particular, a substantially cylindrical component that carries various functional elements of the gear grinding machine. In this case, the carrier tower is, in particular, located opposite or in front of the grinding spindle. In particular, a rotatable carrier tower allows various functional elements, such as, for example, a dressing device, to be selectively placed in a position for interaction with the grinding spindle. The carrier tower is, in particular, equipped with a workpiece carrier, which can fix a workpiece so that the workpiece can be transported. The workpiece carrier can also be designed, for example, to transport a grinding tool blank to the grinding spindle.

[0067] The presence of the carrier tower makes the device particularly versatile and, in this case, compact. Alternatively, the device can be designed without a carrier tower.

[0068] In a preferred alternative of the above variant of the invention, the carrier tower is rotatable or pivotable to the carrier tower profile processing position. The advantage of a rotatable or pivotable carrier tower is that the functional components can be arranged in a fixed manner on the carrier tower. Since most functional components, such as dressing devices or profiling devices, are usually smaller than the carrier tower, a very stable yet flexible device can be realized. Alternatively, the carrier tower can also be arranged in a rotationally fixed manner. In this case, the functional components can be arranged rotatably on the carrier tower, for example, or in some cases, a grinding spindle can be rotatably mounted around the carrier tower.

[0069] The profile processing device is preferably arranged on the carrier tower, for this purpose the profile processing device can in particular be arranged on one of the side walls of the carrier tower.

[0070] This allows for a particularly robust and simple positioning of the first profile machining plate in the device, in particular on the side of the carrier tower facing away from the workpiece spindle or, for example, even at a different height than the workpiece arranged on the workpiece spindle.

[0071] In a preferred variant of the above embodiment, the carrier tower and the workpiece spindle are arranged on a rotatable base, and the profile machining device is arranged in an angular range outside the workpiece spindle angular range on the carrier tower relative to the base rotation axis.

[0072] Rotatable bases are known per se. In this case, such bases have, in particular, a rounded shape relative to a horizontal plane. The base rotation axis, for example, runs vertically through the center of the base. The workpiece spindle angular field is, in particular, the angular field that the workpiece spindle takes up relative to the base rotation axis. In other words, it is a field in which a straight line can be constructed, starting from the base rotation axis and perpendicular to the base rotation axis, to a tip on the workpiece spindle, and in particular to a tip on a workpiece attached to the workpiece spindle. Outside means, in particular, that no point of the profile machining device is located within the angular field of the workpiece spindle.

[0073] This configuration has the advantage that the device can be set into the profile machining configuration very efficiently and quickly. For this purpose, it is necessary to rotate only the base so that the profile machining device faces the grinding spindle. In this case, the workpiece spindle and, for example, the workpiece located on the workpiece spindle are simultaneously rotated away from the grinding spindle. Similarly, the profile machining device automatically moves to a standby position as soon as the workpiece spindle faces the grinding spindle.

[0074] Alternatively, the profile machining device may also be arranged above or below the workpiece spindle, for example in the same angular region. The device can also be designed without a rotatable base.

[0075] In a preferred alternative of the above embodiment, the device comprises a dressing device arranged on a carrier tower, the profile processing device being arranged on the dressing device.

[0076] The device according to the invention therefore allows for additional dressing of the grinding tool, in particular after pre-profiling. In particular, in this variant, the profiling configuration is identical or nearly identical to the dressing configuration of the device, so that pre-profiling with subsequent dressing can be carried out particularly quickly and efficiently. Alternatively, the profiling device can be arranged separately from the dressing device or can be designed without a dressing device.

[0077] In a further alternative embodiment of the invention, the device comprises a workpiece tailstock arranged on a carrier tower having a tailstock base, the profile machining device being arranged on the tailstock base. It is known to arrange the tailstock by means of a tailstock base for holding the workpiece on the carrier tower. In this case, the tailstock can be mounted so as to be vertically movable, in particular along the carrier tower. At least in the workpiece machining configuration of the device, the tailstock is located above the workpiece spindle and has the same axis of rotation.

[0078] In this case, by arranging the profile processing device on the tailstock base, it is possible to change to the profile processing configuration, for example by moving the grinding spindle along the Z-grinding spindle axis, even when the carrier tower does not rotate or only rotates slightly. This makes the device particularly efficient and simple to construct. In addition, this arrangement does not take up unused space on the carrier tower, so that, for example, a particularly large number of additional functional components can be arranged on the carrier tower.

[0079] In a preferred embodiment of the present invention, the first profile machining plate is provided with cutting elements having polycrystalline diamond (PCD). In particular, the first profile machining plate is made of polycrystalline diamond (PCD), i.e., diamond particles surrounded by a metal matrix. Alternatively, the cutting elements can be sintered onto a body, for example, a cemented carbide body.

[0080] Tests have shown that a first profiling plate having cutting elements made of polycrystalline diamond is particularly well suited for pre-profiling grinding tools. Alternatively, the first profiling plate can include cutting elements made of another hard cutting material.

[0081] In particularly preferred embodiments of all the above variants of the device, the first profiled plate has a first distal profiled plate tip angle of 1° to 50°, in particular 5° to 45°, particularly preferably 10° to 30°.

[0082] The profile cutting plate tip angle particularly refers to the internal angle of the outermost tip of the profile cutting plate, where the narrow angle also ensures that the first profile cutting plate is particularly well suited for producing narrow profiles on the grinding tool blank.

[0083] In a preferred variant of the invention, the profile processing device has a first profile processing plate holder for holding a first profile processing plate, the first profile processing plate holder having: a) a first clamp leg having a first receiving surface, the first receiving surface contacting the first profile machining plate; b) a first clamping element for pressing the first profile machining plate against the first receiving surface.

[0084] The first profile processing plate holder is in particular a connecting element, by means of which the first profile processing plate is connected to the rest of the device, for example to the carrier tower wall, and the first clamp leg is in particular a support for the first profile processing plate, which receives the first profile processing plate and supports it against displacement and breakage.

[0085] The first clamping element is located on the first clamping leg, and is preferably smaller than the first clamping leg and presses the first profiled plate only against the receiving surface. The clamping element can be fastened to the first clamping leg, preferably by means of screws or bolts. In particular, both the clamping leg and the clamping element are made of steel or aluminum.

[0086] The first clamping element is particularly rotatably mounted so that it can be rotated away from the receiving surface, for example horizontally. Alternatively, the first clamping element can be completely or partially detached from the first clamp leg, for example by loosening a screw connection. This allows for easy removal and replacement of the first profiling plate if it becomes unusable, for example as a result of wear.

[0087] In a preferred embodiment of the present invention, the first receiving surface dimension of the first receiving surface is 50% to 95%, particularly 80% or more, of the first profiling plate main surface dimension of the first profiling plate.

[0088] The receiving surface dimension in this case is the surface of the receiving surface of the first clamp leg, which is, for example, 200 mm 2 On the other hand, the dimension of the main surface of the profiling plate is the surface of the main surface of the first profiling plate, in particular the surface of the profiling plate that is in contact with the receiving surface. It can be, for example, 250 mm 2 It could be.

[0089] The first profiling plate is subjected to relatively strong forces during the profiling operation. Therefore, there is a risk that the first profiling plate may break during the profiling operation, for example. The corresponding risk can be reduced by a support with a large surface. Furthermore, the contact with a large surface also allows for improved heat transfer from the first profiling plate, which is likewise advantageous, since the first profiling plate may heat up strongly during friction.

[0090] However, a further requirement for the profile machining device is that only the first profile machining plate, in particular, be in contact with and operatively connected to the grinding tool blank. Therefore, it is advantageous to support the profile machining plate, especially in the distal region of the profile machining device, on clamp legs whose receiving area is smaller than that of the first profile machining plate. Tests have shown that particularly good support of the first profile machining plate is achieved without the first clamp leg affecting the profiling operation if the receiving surface dimensions of the first receiving surface are 50% to 95% of the main surface dimensions of the first profile machining plate. In particular, the receiving surface is narrower than the first profile machining plate in the distal region of the first clamp leg. In this case, the receiving surface is particularly arrow-shaped. In particular, the first clamp leg is not wider than the receiving surface when measured parallel to the receiving surface behind or below the receiving surface. In other words, when the first clamp leg is projected onto a plane extending parallel to the receiving surface, a profile corresponding to the receiving surface is created in the distal region.

[0091] Alternatively, the first clamp leg may, for example, have a smaller bearing surface. In a preferred embodiment of the invention, the first clamping leg has a thickness perpendicular to the first receiving surface, which thickness corresponds to at least 70%, in particular at least 100%, of the maximum length of the receiving surface.

[0092] Sufficient volume of the first clamp leg is required to support the first profiled plate. Alternatively, the clamp legs can be made thinner, however this requires a particularly careful selection of materials.

[0093] In this case, the thickness is in particular the average thickness of the first clamping leg at all locations on the first receiving surface. In a preferred embodiment of the invention, the clamp leg has at least one first stabilizing surface adjacent to the first receiving surface, particularly perpendicular to the first receiving surface, which supports the first profile processing plate against slipping in the first profile processing plate holder, particularly in at least one direction parallel to the stabilizing surface. The stabilizing surface in this case has a shape that corresponds to the shape of the side of the first profile processing plate that is in contact with the stabilizing surface. The stabilizing surface can be oriented, for example, perpendicular to the receiving surface. In particular, the stabilizing surface can also be oriented at an angle to the receiving surface, with the internal angle being less than 90°. In particular, the first profile processing plate is designed with an inclined side, which is also supported by the stabilizing surface against movement away from the receiving surface.

[0094] The stabilizing surface provides in a simple manner a very stable attachment of the first profiled plate, which makes the device particularly reliable and robust. Preferably, a cylindrical stabilizing pin is located on the receiving surface, which engages in a recess in the first profile machining plate and supports the correct positioning of the first profile machining plate on the receiving surface, and also absorbs forces acting on the first profile machining plate parallel to the receiving surface.

[0095] In a variant of the invention, the first clamp leg in the first profile machining configuration of the device is positioned above the first clamp element. This has the advantage that the grinding tool blank can be rotated so that the force of the grinding tool blank acting on the first profile machining plate is directed upward during the profile machining operation. This results in the resulting chips being able to fall freely downward and not accumulate on the first profile machining plate.

[0096] Alternatively, the clamp legs can easily be positioned below the first profiled plate. In a preferred variant of all the above-mentioned embodiments of the invention, the profile machining device comprises a second profile machining plate, and in particular also a third profile machining plate, and preferably also a fourth profile machining plate.

[0097] In particular, the device has corresponding further profiling arrangements in which the grinding spindles can be fed into the respective profiling plates.

[0098] Thus, for example, various profile machining plate shapes can be used in the same device, thereby further increasing the device's flexibility. Therefore, additionally or alternatively, ready-to-use provisions may also be present. In particular, for example, if the first profile machining plate is damaged, a change in the profile machining configuration, and therefore the profile machining plate, can allow the profile machining operation to continue or further profile machining operations to be performed. In addition, various profile machining plates, for example, the first profile machining plate and the second profile machining plate, can be designed as rough machining plates or finish machining plates. Thus, rough machining and finish machining can be performed using different designated profile machining plates. Thus, for example, a profile machining plate, in particular the third profile machining plate, can be designed as a contour plate provided for a contour portion.

[0099] This makes the device particularly reliable and flexible.Alternatively, the device can also comprise only one, namely the first, profiled plate. The profile cutting plates of the profile cutting device preferably have a first profile cutting plate tip angle of the first profile cutting plate and a second profile cutting plate tip angle of the second profile cutting plate, and in particular also a third profile cutting plate tip angle of the third profile cutting plate, and particularly preferably also a fourth profile cutting plate tip angle of the fourth profile cutting plate, in each case the profile cutting plate tip angles differ from each other by at least 2°, in particular at least 3°.

[0100] The offset of the profile cutting plate tip angles of the profile cutting plates ensures that the profile cutting plate that matches the angle can be selected depending on the desired profile, making the device particularly flexible and universally usable. Alternatively, the profile cutting plate tip angles can be entirely or partially identical, in which case the profile cutting plates can function as substitutes for one another.

[0101] The first distal profiling plate tip of the first profiling plate and the second distal profiling plate tip of the second profiling plate, and in particular also the third distal profiling plate tip of the third profiling plate and preferably also the fourth distal profiling plate tip of the fourth profiling plate, are preferably arranged circumferentially with respect to the arrangement plane, wherein the profiling device is pivotably or rotatably mounted about a displacement axis passing through the center of the circumference perpendicular to the arrangement plane so that each profiling plate tip can be aligned with the grinding spindle, and the arrangement plane extends parallel to the main surface of the first profiling plate, in particular in a round table arrangement, or at an angle, in particular in a revolver arrangement.

[0102] In this case, the arrangement relative to the arrangement plane is understood to mean in particular that the position of the tip of the profiling plate is projected onto the arrangement plane in such a way that it is perpendicular to the arrangement plane. Therefore, in the case of a placement plane that runs parallel to the first receiving surface, a difference in the vertical height of the profile cutting plate relative to the placement plane can still be implied. A round table placement means that the profile cutting plate tips are evenly distributed around the circumference.

[0103] A revolver arrangement means that the arrangement plane extends so that the translation axis projected onto the horizontal plane is perpendicular to the grinding spindle rotation axis, so that the profile machining plate is changed by translation or rotation like a revolver.

[0104] These arrangements have the advantage that the profile processing device can be of a particularly compact design having two or more profile processing plates and that the device can be changed particularly quickly and efficiently to different profile processing configurations.

[0105] In an alternative to the above embodiment of the present invention, the profile processing device is a stack profile processing device, wherein the first distal profile processing plate tip of the first profile processing plate and the second distal profile processing plate tip of the second profile processing plate, and in particular also the third distal profile processing plate tip of the third profile processing plate, and preferably also the fourth distal profile processing plate tip of the fourth profile processing plate, are spaced apart from each other along a stacking axis extending perpendicular to the main surface of the first profile processing plate and are identically aligned with respect to a plane extending parallel to the main surface of the first profile processing plate.

[0106] This has the advantage that the profile processing device can be designed without moving parts, making the profile processing device particularly robust. The stack profile processing device can also be movably mounted around the stacking axis so that the tip of each profile processing plate can be brought to the grinding tool machining height. This allows for the creation of a profile processing device that occupies a particularly small angular area, for example on the carrier tower, while at the same time managing the grinding spindle without moving it, especially along the Z-grinding spindle axis.

[0107] The device preferably comprises a probe and has a first profile machining plate measurement configuration that allows the device to feed the probe into the profile machining device until the probe contacts the first profile machining plate.

[0108] A description of the probe and its function is given further in the text. The probe can have, for example, a square or cubic measuring head. The latter itself can be particularly easily detected in its geometric shape and can also be easily measured in imaging methods.

[0109] In particular, the device comprises a grinding slide for feeding the grinding spindle. In this case, the device may also comprise a shift slide arranged on the grinding slide and movably mounted along the Y-grinding spindle axis. In this variant, the probe is preferably arranged on the shift slide, for example, next to the grinding spindle. In particular, the probe can be designed to be foldable in front of the grinding spindle, for example, around a vertical or horizontal axis, in particular parallel to the grinding spindle rotation axis. For this purpose, the probe can be provided with a pivoting arm.

[0110] Preferably, the device comprises a control unit designed to cause the device to carry out the method according to the invention. The control unit may be a PC or a PLC, in whose memory unit the commands for carrying out the method are stored and can be called up. The control unit may in particular be located in the device itself and may be operable, for example, by means of a touchscreen. However, the control unit may also simply be connected to the rest of the device by a data transmission connection. In this variant, the device comprises in particular a command unit, which is suitable for receiving the commands of the control unit and converting them into actual operations.

[0111] Further advantageous embodiments and feature combinations of the invention emerge from the following detailed description and the claims as a whole. The drawings used to explain the exemplary embodiments are listed below. [Brief explanation of the drawings]

[0112] [Figure 1A] 1 shows an embodiment of a generating grinding machine according to the present invention. [Figure 1B] 1 shows an embodiment of a generating grinding machine according to the present invention. [Figure 1C] 1 shows an embodiment of a generating grinding machine according to the present invention. [Figure 2] 1 shows a flow diagram of one embodiment of a method according to the present invention; [Figure 3A] 1 shows a further embodiment of a generating grinding machine according to the invention; [Figure 3B] 1 shows a further embodiment of a generating grinding machine according to the invention; [Figure 3C] 1 shows a further embodiment of a generating grinding machine according to the invention; [Figure 4] 3 shows a flow diagram of a further embodiment of the method according to the invention; [Figure 5A] 1 shows a further embodiment of a generating grinding machine according to the invention; [Figure 5B] 1 shows a further embodiment of a generating grinding machine according to the invention; [Figure 6] 1 shows the profile processing devices in a stacked arrangement. [Figure 7] 1 shows a further profile processing device as a revolver arrangement. [Figure 8] 1 shows a further profile processing device as a round table arrangement. DETAILED DESCRIPTION OF THE INVENTION

[0113] As a rule, identical parts are provided with the same reference numbers in the drawings. 1A and 1B show a first inventive generating grinding machine 1. In this case, FIG. 1A shows the generating grinding machine 1 in a side view, and FIG. 1B shows a portion of the generating grinding machine 1 in horizontal section. The generating grinding machine 1 comprises a machine bed 11, on the upper side of which a schematically illustrated grinding slide 10 and a vertically oriented carrier tower 7 (vertically in the image plane of FIG. 1A and perpendicular to the image plane of FIG. 1B) are arranged adjacent to each other. The grinding slide 10, which is movably mounted relative to the machine bed 11, comprises a shift slide 13 facing the carrier tower 7, which has a grinding spindle 3 that rotates a grinding worm 4 around a rotation axis that extends substantially horizontally (perpendicular to the image plane of FIG. 1A and vertically in the image plane of FIG. 1B). In the illustrated position of the shift slide 13, the grinding spindle 3 is located at approximately one-third of the maximum height of the carrier tower 7. The grinding slide 10 can be fed into the carrier tower 7 along a horizontal axis X. In addition, the shift slide 13 can move relative to the grinding slide 10 in a vertical axis Z parallel to the rotation axis of the workpiece spindle 2 and along an axis Y (see FIG. 1B) parallel to the rotation axis of the grinding spindle 3. In addition, the rotation axis of the grinding spindle 3 can be tilted in both directions by the shift slide 13 by an angle of about 40° relative to the horizontal plane (so that the axis Y is also tilted). A cooling oil nozzle 9, which can supply cooling oil to the area of action around the grinding worm 4, is likewise arranged on the shift slide 13 and above the grinding spindle 3.

[0114] In this case, the carrier tower 7 and the workpiece spindle 2, which is located adjacent to the carrier tower and rotates a workpiece (not shown) located thereon about a vertically extending rotation axis, are arranged on a base 12 rotatably mounted with respect to the machine bed 11. In this case, the base 12 is rotatably mounted about a base rotation axis that extends vertically through the center of the base 12. Thus, rotation of the base 12 can align the workpiece spindle 2 with the grinding slide 10. In addition, a vertically movable tailstock 8 having a tailstock base is located on the carrier tower above the workpiece spindle 2, and this tailstock 8 can clamp the workpiece located on the workpiece spindle 2 from above.

[0115] In addition, generating grinding machine 1 has a gripper 14, which is arranged on carrier tower 7 and can grip and transport a workpiece. Gripper 14 is located on a pivot arm by means of which gripper 14 can be pivoted outward about a vertical pivot axis extending laterally on carrier tower 7. When gripper 14 grips a workpiece and pivots inward, the workpiece is positioned so that its workpiece axis coincides with the rotation axis of workpiece spindle 2. The workpiece can then be fixed on workpiece spindle 2 by moving tailstock 8. Gripper 14 can then be released and moved away from the workpiece.

[0116] In the workpiece machining configuration, the base 2 is rotated so that the workpiece spindle 2 faces the grinding spindle 3 and thus faces the grinding worm 4 (not shown). The shift slide 13 is moved along axis Z to a height at which the grinding worm 4 has substantially the same height as the workpiece on the grinding spindle 2. The grinding spindle 2 can thus be fed into the workpiece spindle by the grinding slide 10 along axis X until the grinding worm 4 and the workpiece located on the workpiece spindle 2 are operatively connected.

[0117] Furthermore, a profile machining device 5 with a profile machining plate 6 is arranged on the side of the carrier tower 7 facing away from the workpiece spindle, and thus in an angular region that is outside the angular region of the workpiece spindle 2 relative to the base rotation axis. Further details of the profile machining device 5 will be explained further below with reference to FIG. 1C . In this case, the profile machining device 5 is fixed on the carrier tower 7 at a vertical height that is approximately midway between the tailstock 8 and the workpiece spindle 2, and outside the base rotation axis. By rotating the base 12, the profile machining plate 6 can be pivoted to a grinding tool machining position. The generating grinding machine 1 can be brought into a profile machining configuration by additional corresponding positioning of the grinding spindle 4, in which the rotation axis of the grinding spindle 4 is located approximately at the height of the profile machining plate 6. In the profile machining configuration, the grinding spindle 3 can be fed along the axis X up to the profile machining device 5 until the grinding worm 4 is operatively connected to the profile machining plate 6. In this way, the grinding worm 4 can be pre-profiled or completely profiled by the profiling plate 6 .

[0118] FIG. 1C shows the profile machining device 5 in a perspective top view with the profile machining plate 6. The profile machining plate 6 is made of polycrystalline diamond. At its distal end, the profile machining plate 6 tapers to a tip and has an inner profile machining plate tip angle of 15°. The profile machining plate tip angle can also have a staggered value, for example, an angle between 10° and 30°. The outer profile of the main surface of the profile machining plate 6 consists of two parts: a long distal part is triangular or arrow-shaped (having the above-mentioned profile machining plate tip angle), and a short proximal part is rectangular, the longest edge of which represents the proximal end of the profile machining plate 6. Here, the outer edge of the proximal part extends at an angle to the axis of symmetry of the triangle, having an angle of approximately 40°. In the proximal region, the profile machining plate 6 is circularly perforated.

[0119] The profile cutting plate 6 is located in a profile cutting plate holder 50. The profile cutting plate holder 50 here essentially consists of two parts: a clamping leg 51 and a clamping element 52. The clamping leg 51 serves as a support and supports the profile cutting plate 6, while the clamping element 52 presses the profile cutting plate 6 against the clamping leg 51, thus fixing the profile cutting plate 6. The clamping leg 51 has a horizontal receiving surface 55 for receiving the profile cutting plate 6, the shape of which is similar to that of the profile cutting plate 6. The distal region of the receiving surface, which is in contact with the distal part of the profile cutting plate 6, also tapers towards the tip of the arrow shape. However, in this case, the distal tip of the profile cutting plate 6 is outside the distal tip of the receiving surface 55. In the distal region, the profile cutting plate 6 therefore projects beyond the clamping legs 51 on all sides, with the result that during the profiling operation the grinding worm 4 is operatively connected only to the profile cutting plate 6 and not directly to the clamping legs 51. In the proximal region, the outer edges of the receiving surface 55 and of the profile cutting plate 6 terminate flush with one another. Overall, the receiving surface 55 therefore has a surface dimension that is approximately 90% of the surface dimension of the main surface of the profile cutting plate 6 that is in contact with the receiving surface 55.

[0120] A cylindrical fixing pin 54 is also located on the receiving surface 55, which passes through an opening in the profile processing plate 6 and terminates flush with the surface of the profile processing plate 6. The profile processing plate 6 is fixed in its position by the fixing pin 54 and protected from displacement. A vertical stabilizing surface 56 is located proximally adjacent to the receiving surface 55 of the clamp leg 51, the rectangular shape of which corresponds to the proximal side of the profile processing plate 6 and which is also in contact with the profile processing plate 6. In particular, rotation of the profile processing plate 6 is prevented by the stabilizing surface 56.

[0121] The clamp legs 55 are wedge-shaped below the receiving surface 55, with the distal wedge edges extending at an included angle of approximately 20° relative to the vertical, so that the clamp legs are recessed below the receiving surface.

[0122] Therefore, if the profile machining plate 6 is sufficiently supported, it is ensured that no contact of the clamping legs with the grinding worm 4 occurs. The thickness of the clamping legs 51 below the receiving surface, i.e. the vertical extent between the receiving surface 55 and the underside, corresponds approximately to the maximum horizontal extent of the receiving surface. Outside the receiving surface 55, the clamping legs have a thickness that essentially corresponds to the thickness below the receiving surface 55 plus the additional height of the stabilizing surface 56. Behind the stabilizing surface 56, the upper side of the clamping legs therefore remains essentially flush with the upper side of the profile machining plate 6.

[0123] At its end facing away from the profile processing plate 6, the clamping leg 51 has a connection area 57 that has the shape of a T in the horizontal plane, with the receiving area of the profile processing plate 6 extending in the center away from the connection area 57. On both sides of the connection area 57 there are fastening bolts with external threads that are introduced into horizontal through-holes. By means of the fastening bolts, the clamping leg 51 is firmly screwed to the carrier tower 7 so that the profile processing plate 6 is placed horizontally and protrudes from the carrier tower 7. An additional stabilizing pin that engages in a recess in the carrier tower 7 is located on the clamping leg 51 between the fastening bolts.

[0124] The clamping element 52 is fastened to the upper side of the clamping leg 51 behind the receiving surface 55 and the stabilizing surface 56 by a fastening bolt, the external thread of which engages in an internally threaded bore. The clamping element 52, which is generally C-shaped in a vertical plane, in this case has a front part facing the profile machining plate 6, tapering from the fastening bolt in the direction of the profile machining plate 6 and terminating in a pressing area facing downwards towards the profile machining plate 6. The pressing area is the part of the clamping element 52 that contacts the upper side of the profile machining plate 6 and clamps the profile machining plate 6 coming from above onto the receiving surface 55. The rear part of the clamping element 52, facing away from the profile machining plate 6, has a stabilizing area that also faces downwards and engages in a recess 53 on the upper side of the clamping leg 51. The clamping element 52 is protected from rotation around the fastening bolt by the interaction of the stabilizing area with the clamping leg 51. The profile cutting plate 6 is supported in the profile cutting plate holder 50 in a sufficiently strong manner so that it does not shift or break during the profiling operation, and at the same time the profile cutting plate 6 can be easily replaced by simply loosening the clamping element 52.

[0125] 2 shows a flow diagram of a method 70 according to the invention. In a first step a, the generating grinding machine 1 of Figures 1A-1C is provided with a workpiece spindle 2, a grinding spindle 3 that is infeedable along an axis X for rotating a grinding tool (e.g., a grinding worm 4), and a profile machining device 5 with a profile machining plate 6. In a next step b, a grinding worm blank (e.g., a grinding worm 4 that does not yet have a grinding profile) is provided on the grinding spindle 3 and mounted on the grinding spindle 3.

[0126] Then, in step c), the control unit pre-calculates the profile machining and predetermines all inputs required for the complete pre-profile machining, such as the movement profiles of the grinding slide 10 and the shift slide 13, as well as the rotational speed of the grinding spindle 3. For this purpose, the exact geometry of the profile machining plate 6 must now be known. A digital twin of the profile machining plate 6 is called up, which represents the wear state of the profile machining plate 6 by simulating all profile machining operations performed on the profile machining plate 6. The profile machining is pre-calculated using information from this digital twin. The pre-calculation can be performed even before the grinding worm blank is installed.

[0127] The generating grinding machine 1 is then placed in the profile machining configuration in step d. For this purpose, the base 12 is rotated so that the profile machining device 5 with the profile machining plate 6 is positioned closest to the grinding spindle 3, and the radial connection line from the center of the carrier tower 7 through the profile machining plate 6 is perpendicular to the rotation axis of the grinding spindle 3 and thus perpendicular to the axis Y (see FIG. 1B). This is the grinding tool machining position of the profile machining plate 6. In addition, the shift slide 13 is moved along the axis Z so that the rotation axis of the grinding spindle 3 is positioned at the same height (along the axis Z) as the profile machining plate 6. The shift slide 13 is further moved along the axis Y so that the first outer region of the planned profile faces the profile machining plate.

[0128] In a next step e, the grinding spindle 3 is fed through the axis X into the profile machining device 5 until the grinding worm blank and the profile machining plate 6 are operatively connected.

[0129] Then, in step f, the grinding worm blank is pre-profiled as follows: The grinding spindle 3 rotates the grinding worm blank clockwise from the perspective of FIG. 1A, so that in each case the side of the grinding worm blank facing the profile machining plate 6 moves from top to bottom. At the same time, the shift slide 13 is moved along the axis Y at the speed precalculated in step c by the length of the planned profile on the grinding worm from the first outer region of the planned profile to the second outer region of the planned profile. As a result, the grinding worm profile is introduced into the grinding worm blank by the profile machining plate 6.

[0130] After the profile machining plate has completely passed the planned grinding worm profile once as a result of its movement along the axis Y, the grinding slide 10 moves back along the axis X, so that the profile machining plate 6 and the grinding worm blank no longer come into contact with each other. The shift slide 13 is then moved back again to the starting position of the profile machining arrangement, i.e. is repositioned accordingly along the axis Y.

[0131] In a further pass, the grinding spindle 3 is again fed into the profile machining plate 6 by means of the grinding slide 10, and the rotation of the grinding spindle 3 and the movement of the shift slide 13 along the axis Y take place again.

[0132] This process can be repeated many more times according to the pre-calculation in step c. After the pre-profile machining is finished, the grinding slide 10 is returned to the end. In step g, the digital twin is now updated by a simulation of the performed grinding operation, taking into account the movement data collected in step f (pre-profiling), so that the digital twin represents the new wear state of the profiling plate 6 and can serve for the pre-calculation of further pre-profiling.

[0133] Figures 3A to 3C show a further generating grinding machine 101 according to the invention or part thereof, where Figure 3A shows the generating grinding machine 101 in direct side view, while Figure 3B shows the generating grinding machine 101 in horizontal section at the level of the profile machining plate 106. The machine bed 111, grinding slide 110 and shift slide 113, grinding spindle 103 and rotatable base 112 of the generating grinding machine 101 substantially correspond to those of the generating grinding machine 1 of Figures 1A and 1B.

[0134] A carrier tower 107 is arranged on the base 112. The generating grinding machine 101 is designed as a multi-spindle module with a first workpiece spindle 102.1 and a second workpiece spindle 102.2 arranged on two opposite sides of the carrier tower 107. A first tailstock 108.1 or a second tailstock 108.2 is located on the carrier tower 107 above the workpiece spindles 102.1, 102.2 in each case.

[0135] The generating grinding machine 101 therefore has two workpiece machining configurations in which the base 112 is rotated in each case so that one of the two workpiece spindles 102.1, 102.2 faces the grinding spindle 103.

[0136] Furthermore, a profile processing device 105 with a profile processing plate 106 is arranged on one side of the carrier tower 107, the profile processing device 105 in each case facing away from the two workpiece spindles 102.1, 102.2 at an angle of 90° in the radial direction, as will be explained in more detail below with reference to Figure 3C.

[0137] The generating grinding machine 101 further comprises a cube-shaped probe 120, which is arranged on the shift slide 113 via a pivot arm. In the profile machining plate measurement configuration of the generating grinding machine 101, the pivot arm of the probe 120, which is otherwise oriented vertically upward, is aligned horizontally. The probe 120 is thus located in front of the grinding spindle 103 and the grinding worm 104. The shift slide 113 is further movable along the axis Y so that the probe 120 is centrally located in front of the carrier tower 107. The probe 120 comprises a contact sensor. The generating grinding machine 101 further comprises a control unit designed to correlate the movements of the grinding slide 110, the shift slide 113, and the signal of the contact sensor of the probe 120. Thus, the wear of the profile machining plate 106 can be measured by the probe 120 (the details of this method will be further explained below with reference to FIG. 4).

[0138] FIG. 3C shows a top view of the profile processing device 105 of the generating grinding machine 101 (FIGS. 3A and 3B). The profile processing plate 106 and the profile processing plate holder 150 correspond to the profile processing plate 6 and the profile processing plate holder 50 of the first embodiment (FIG. 2C). Additionally, the profile processing device 105 includes a round pivot base 160, on which a pivot arm 162 is disposed via a holder 161. In this case, the pivot arm 162 has a substantially rectangular parallelepiped shape, and its horizontal width is approximately 40% of its horizontal length. The vertical thickness of the pivot arm 162 (see FIG. 2A) is approximately equal to its horizontal length. In this case, the profile processing plate holder 150 is attached to the distal end of the pivot arm 162 (see FIG. 3A) so that the lower surface of the profile processing plate holder 150 and the lower surface of the pivot arm 162 are approximately at the same height. The arrow-shaped tip of the profiled plate 106 has an included angle of approximately 40° relative to the longitudinal edge of the pivot arm 162 .

[0139] In the profile machining configuration of the generating grinding machine 101, the pivot arm 162 of the profile machining device 105 is pivoted away from the carrier tower 107 so that the profile machining plate 106 faces radially away from the carrier tower (see FIG. 3B).

[0140] 4 shows diagrammatically a further method 170 according to the invention. In step a2, a generating grinding machine 101 is provided. Then, in step b2, a grinding worm blank the size of the grinding worm 104 is provided.

[0141] In contrast to method 70 of FIG. 2 , in method 170 of FIG. 4 , the profile machining plate is first measured in step c2. To this end, the generating grinding machine 101 is placed in the profile machining plate measurement configuration. This involves rotating the base of the carrier tower 107 so that the side of the carrier tower 107 on which the profile machining device 105 is located faces directly toward the grinding spindle 103. In addition, the pivot arm 162 of the profile machining device is pivoted so that the profile machining plate 106 faces directly toward the grinding spindle 103. In addition, the pivot arm of the probe 120 is pivoted to horizontal alignment, and the shift slide 113 is moved along axis Y so that the probe 120 is centered in front of the carrier tower 107.

[0142] The grinding slide 110 then advances the probe 120 along the X axis into the profile machining plate 106 until the probe 120 registers a contact. The probe 120 is then returned and moved along the Y axis by the shift slide 113 by an amount corresponding to approximately half the maximum width of the profile machining plate 106. The probe 120 is then again advanced into the profile machining plate 106 until the probe 120 registers a further contact. This procedure is repeated in the other direction along the Y axis. The geometry of the profile machining plate 106, in particular its wear as a result of the previous profile machining operation, is then determined with reference to the registered contact and the positions corresponding to the contacts along the X and Y axes (as well as the known geometry of the probe 120). Furthermore, a pre-calculation of the pre-profile machining is subsequently performed based on the geometry of the profile machining plate 106 determined by measurements by the control unit of the generating grinding machine 101.

[0143] In the next step d2, the generating grinding machine 101 is placed in the profile machining configuration. The carrier tower 107 and profile machining device 105 are held in the same position as in the profile machining plate measurement configuration, but the probe 120 is pivoted to be vertically aligned. As a result, the ground worm blank can be fed into the profile machining device 105 in step e2 until the ground worm blank and the profile machining plate 106 are operatively connected.

[0144] The pre-profiling in step f2 substantially corresponds to step f of the method 70 of FIG. 2, but the measurements in step c2 serve as the basis for the movement of the grinding slide 110 and the movement of the shift slide 113.

[0145] In contrast to method 70 of FIG. 2, method 170 does not require simulation of the profile machining operation in subsequent steps. 5A and 5B show a further generating grinding machine 1001 according to the invention, with FIG. 5A showing the generating grinding machine 1001 in direct side view and FIG. 5B showing the generating grinding machine 1001 in horizontal section at the height of the profile machining plate 1006.

[0146] The machine bed 1011, grinding slide 1010, shift slide 1013, grinding spindle 1003, and grinding worm 1004 are of the same type as in the generating grinding machine 1 and the generating grinding machine 101. The rotatable base 1012 also substantially corresponds to the base 112 of FIG. 3A. The workpiece spindle 1002 is arranged adjacent to the carrier tower 1007. A tailstock 1008 above the workpiece spindle 1002 is located on the carrier tower 1007. At the vertical height between the workpiece spindle 1002 and the tailstock 1008, the carrier tower 1007 comprises a triple gripper 1014. The triple gripper 1014 comprises independently movable gripper elements rotatably mounted around a gripper rotation axis that extends parallel to, but does not coincide with, the base rotation axis. The triple gripper 1014 serves to flexibly transport the workpiece to and from the workpiece spindle 1002. In addition, the workpiece can thus remain held in a secondary machining position outside of the generating grinding machine 1001.

[0147] The profiling device 1005 with the profiling plate 1006 substantially corresponds to the profiling device 5 with the profiling plate 6 of Fig. 1C, but has a modified proximal fastening. The profiling device 1005 is arranged laterally on the tailstock base of the tailstock 1008.

[0148] In the profile machining configuration of the generating grinding machine 1001, the base 1012 is rotated so that the profile machining plate 1006 faces directly towards the grinding spindle 1003 (see FIG. 5B). The generating grinding machine 1001 can be used, for example, in a method substantially corresponding to method 70 of FIG.

[0149] Figure 6 shows a side plan view of a further profile processing device 205. The profile processing device 205 comprises three profile processing plates 206.1, 206.2, 206.3 held in profile processing plate holders 250.1, 250.2, 250.3, respectively, which substantially correspond to the profile processing plate holder 50 of Figure 1C.

[0150] Profiled plate 206.1 has substantially the same shape as profiled plate 6 of FIG. 1C. Profiled plate 206.2 has a profiled plate tip angle that is 2° greater than the profiled plate tip angle of profiled plate 206.1. The same applies to profiled plate 206.3 in relation to profiled plate 206.2. Meanwhile, the proximal regions of all profiled plates 206.1, 206.2, 206.3 correspond to profiled plate 6 of FIG. 1C.

[0151] The profile processing plates 206.1, 206.2, 206.3 and the profile processing plate holders 250.1, 250.2, 250.3 are spaced apart from one another along a vertical axis, while their horizontal arrangement and position are identical, e.g., the vertical spacing between the profile processing plates 206.1 and 206.2 in this case corresponds to approximately twice the vertical thickness of the clamping legs of the profile processing plate holder 250.1.

[0152] The profile machining device 205 can be, for example, part of a generating grinding machine that substantially corresponds to the generating grinding machine 1. For each profile machining configuration, the grinding spindle has a different height along the axis Z (FIG. 1A) and can thus be selectively fed into one of the profile machining plates 206.1, 206.2, 206.3.

[0153] In this case, the offset profile machining plate tip angles allow for profiling of different sized grinding worms or grinding profiles of different sizes and shapes.

[0154] FIG. 7 shows a profile processing device 305 designed as a turret profile processing device. The profile processing device 305 comprises three profile processing plates 306.1, 306.2, and 306.3, which at their distal tips substantially correspond to the profile processing plates 206.1, 206.2, and 206.3 of FIG. 6. Unlike the profile processing plate 6 of FIG. 1C, the profile processing plates 306.1, 306.2, and 306.3 are arranged symmetrically around an axis of symmetry extending through their respective tips. The proximal regions of the profile processing plates 306.1, 306.2, and 306.3 have a square shape, one edge of which is on the axis of symmetry (see FIG. 8, which shows profile processing plates 406.1, 406.2, 406.3, and 406.4 with the same shape). On the side opposite this edge, the arrow-shaped distal region rises together with the tip of the profile processing plate. The proximal end of the profiled plates 306.1, 306.2, 306.3, 306.4 is therefore made up of two sides, which are at an angle of 90° to each other.

[0155] The profile processing plates 306.1, 306.2, 306.3, 306.4 are held by profile processing plate holders 350.1, 350.2, 350.3. In their distal regions, the profile processing plate holders 350.1, 350.2, 350.3 correspond in principle to the profile processing plate holder 50 of Fig. 1C and each consist of a clamping leg and a clamping element. However, unlike the profile processing plate holder 50 of Fig. 1C, they have two stabilizing surfaces on the clamping legs that match the shape of the profile processing plates 306.1, 306.2, 306.3.

[0156] The fastening area of each of the profiled plate holders 350.1, 350.2, 350.3 has a substantially rectangular parallelepiped shape, and the area with the respective profiled plate 306.1, 306.2, 306.3 is formed in the center of the distal edge of this rectangular parallelepiped shape. In thickness, the profiled plate holders 350.1, 350.2, 350.3 correspond to the vertical thickness of the profiled plate holder 50 of FIG. 1C.

[0157] The profile processing plate holders 350.1, 350.2, 350.3 are arranged so that the tips of the profile processing plates 306.1, 306.2, 306.3 lie on a circumference that here lies on an arrangement plane that forms an included angle of approximately 70° with the upper main surface of the profile processing plate 306.1, the arrangement plane being perpendicular to the tip direction of the tips of the profile processing plates 306.1. The profile processing plate holders 350.1, 350.2, 350.3 are further arranged so that the main side of each profile processing plate 306.1, 306.2, 306.3 facing away from the clamping legs faces a rotation axis D, which runs through the center of the circumference and perpendicular to the arrangement plane.

[0158] The profile machining device 305 is mounted rotatably about the axis of rotation D so that each profile machining plate 306.1, 306.2, 306.3 can be put into a horizontal position. The profile machining device 305 can be mounted, for example, on a generating grinding machine corresponding to the generating grinding machine 1 of Figures 1A and 1B. The profile machining device 305 thus provides three different profile machining configurations, in each case the desired profile machining plate 306.1, 306.2, 306.3 is put into a horizontal position by rotation of the profile machining device 305 about the axis of rotation D.

[0159] 8 shows a profile processing device 405, designed as a rotary table profile processing device, in a top view. The profile processing device 405 comprises four profile processing plates 406.1, 406.2, 406.3, 406.4, corresponding to the profile processing plates 306.1, 306.2, 306.3, 306.4 of FIG. 7. The profile processing plate holders 450.1, 450.2, 450.3, 450.4 substantially correspond to the profile processing plate holders 350.1, 350.2, 350.3, but are arranged differently. In addition, in this embodiment, the areas carrying the respective profile processing plates 406.1, 406.2, 406.3, 406.4 are located laterally in each case at the distal edge of the profile processing plate holders 450.1, 450.2, 450.3, 450.4.

[0160] In the profile processing device 405, the profile processing plate holders 450.1, 450.2, 450.3, 450.4 are arranged so that the tips of the profile processing plates 406.1, 406.2, 406.3, 406.4 are circumferentially aligned with a horizontal plane and point radially away from the circumference. However, in this case, the profile processing plate holders 450.1, 450.2, 450.3, 450.4 are fastened together so that the profile processing plates 406.1, 406.2, 406.3, 406.4 are vertically spaced apart from one another. The profile processing plate holder 450.1 is located at the bottom, and the profile processing plate holder 450.2 is located above it and is rotated 90° counterclockwise horizontally. Above the profile processing plate holder 450.2, again rotated 90° clockwise, is the profile processing plate holder 450.3, and again above that, again rotated 90°, is the profile processing plate holder 450.4, in this case the profile processing device 405 is mounted rotatably about an axis that passes through the center of the circle and emerges perpendicular to the image plane.

[0161] The profile machining device 405 can be used in a generating grinding machine, such as the generating grinding machine 1 of Figures 1A and 1B. To employ various profile machining configurations, the rotary table profile machining device 405 is rotated about its axis of rotation so that the desired profile machining device faces the grinding spindle of the generating grinding machine.

[0162] The present invention is not limited to the illustrated exemplary embodiments. The illustrated generating grinding machines may be configured differently. For example, they may have multiple carrier towers or none at all. The carrier towers may also be arranged stationary, i.e., non-rotating, on the machine bed. The grinding tools may also have larger or smaller diameters. The number of workpiece spindles is variable. Thus, for example, three workpiece spindles may be present in a generating grinding machine. The movement of the grinding spindles, in particular the closing and resetting, may be realized differently, for example, using similarly feedable shift slides. The profile processing plates may have shapes other than those shown, in particular, for example, a simple triangular shape, a star shape, or a shape with a rounded tip. The illustrated profile processing plate holder may have other shapes. For example, the profile processing plate holder may hold multiple profile processing plates. The profile processing plates may also be clamped in a sandwich arrangement, for example, by two clamp legs. The rotary table profile processing device may also be realized so that all profile processing plates lie in a common plane. The turret profiling device may also be realized such that the rotation axis extends parallel to the main surfaces of the profiling plates, with all profiling plates facing in the same direction.

[0163] The method may deviate from the illustrated example. Therefore, the measurement of the profile machining plate may be performed before providing the grinding tool blank. In either case, only one measurement may be performed after each pre-profile machining operation or after a certain number of pre-profile machining operations. Similarly, the digital twin may be started at another time, for example, only after the profile machining configuration has been taken. The simulation of the profile machining operation may also be performed already before the pre-profile machining, for example, based on pre-calculated input values rather than on actual recorded movement data. The grinding tool may move and pass the profile machining plate along the axis Y more or less frequently. It is also possible that after a pass, the grinding device is rotated about a horizontal axis perpendicular to the grinding spindle rotation axis and then moves and passes the profile machining plate along the axis Y in the opposite direction.

[0164] In summary, it should be noted that a method and device are provided that allows for both hard precision machining of the workpiece and pre-profiling of the grinding tool.

Claims

1. 1. A method for pre-profiling a grinding tool, comprising: a) providing a device for hard precision machining of workpieces and pre-profiling of grinding tools, in particular a gear grinding machine, said device comprising: a. a workpiece spindle for rotating the workpiece; b) a grinding spindle for rotating a grinding tool, in particular a grinding worm or a grinding wheel, which is feedable at least along the X-grinding spindle feed axis; c. a profile processing device having a fixed first profile processing plate; b) providing a grinding tool blank, in particular a grinding worm blank, on the grinding spindle of the device; c) placing said device in a profiled configuration; d) feeding the grinding spindle until the grinding tool blank is operatively connected to the first profile machining plate; e) pre-profiling said grinding tool blank.

2. 2. The method according to claim 1, wherein placing the device in the profile machining configuration comprises moving the first profile machining plate, in particular pivoting the first profile machining plate along a circular path to a machining position of a grinding tool.

3. 3. The method of claim 1 or 2, wherein placing the device in the profile machining configuration comprises moving the grinding spindle to a grinding spindle profile machining height along a Z-grinding spindle axis extending parallel to a workpiece rotation axis.

4. 4. The method according to claim 1, wherein the first profile machining plate is moved to a standby position after the completion of the pre-profile machining, and in the standby position, the first profile machining plate is located outside the feed area between the grinding spindle and the workpiece spindle.

5. 5. The method according to claim 1, wherein during the pre-profile machining, the grinding spindle is moved along a Y-grinding spindle axis extending parallel to a grinding spindle rotation axis of the grinding spindle in a Y-operatively connected movement region in which the grinding tool blank located on the grinding spindle remains operatively connected to the first profile machining plate.

6. 6. The method according to claim 1, wherein during the pre-profile machining, the clamping legs of the profile machining plate holder contact and support one side of the first profile machining plate, the side having a surface normal substantially oriented in the same direction as the rotation direction of the grinding tool blank in the local operational connection area between the grinding tool blank and the profile machining plate.

7. 7. A method according to claim 1, wherein before placing the device in a profile processing configuration, a measurement of the first profile processing plate is carried out, and for said measurement, the first profile processing plate is brought into contact with a probe, in particular successively at at least two contact points of the profile processing plate.

8. The method of claim 7 , wherein prior to the measurement of the first profile machining plate, the probe is fed into the profile machining device until the probe and the first profile machining plate contact each other.

9. A device for hard precision machining of workpieces and profiling of grinding tools, in particular a gear grinding machine, using in particular a method according to any one of claims 1 to 8, said device comprising: a) a workpiece spindle for rotating a workpiece; b) a grinding spindle for rotating a grinding tool, in particular a grinding worm or a grinding wheel, which is feedable along at least an X-grinding spindle feed axis, said device having a workpiece machining configuration that allows said grinding spindle to be fed into said workpiece spindle along said X-grinding spindle feed axis until a grinding tool located on said grinding spindle is operatively connected to a workpiece located on said workpiece spindle; c) a profile machining device comprising a fixed first profile machining plate, the profile machining device having a first profile machining configuration that allows the grinding spindle to be fed into the profile machining device until the grinding tool located on the grinding spindle is operably connected to the first profile machining plate.

10. 10. The device according to claim 9, wherein the first profile machining plate is movable, in particular pivotable, to a standby position, in which the first profile machining plate is located outside an infeed area along the X-grinding spindle infeed axis between the grinding spindle and the workpiece spindle.

11. 11. The device according to claim 9 or 10, wherein the profile machining device comprises a pivotally mounted pivot arm, the first profile machining plate being located at a distal end of the pivot arm.

12. the grinding spindle is movable along a Y-grinding spindle axis, which extends parallel to the grinding spindle rotation axis of the grinding spindle and in particular perpendicular to the X-grinding spindle feed axis, 12. The device according to claim 9, wherein in the first profile machining configuration there is a Y-operationally connected movement area in which a grinding tool located on the grinding spindle is operatively connected to the first profile machining plate.

13. 13. The device according to any one of claims 9 to 12, wherein the grinding spindle is movable along a Z-grinding spindle axis, which extends parallel to a workpiece rotation axis of the workpiece spindle, in particular perpendicular to the X-grinding spindle infeed axis, and wherein the grinding spindle assumes a grinding spindle profile machining height along the Z-grinding spindle axis in the workpiece machining configuration.

14. 14. The device according to any one of claims 9 to 13, wherein the device comprises, in particular, a rotatably mounted carrier tower, the carrier tower having, in particular, a workpiece carrier for transporting workpieces to the workpiece spindle.

15. The device of claim 14 , wherein the profile processing device is disposed on the carrier tower.

16. 16. The device of claim 15, wherein the carrier tower and the workpiece spindle are arranged on a rotatable base, and the profile machining device is arranged in an angular range on the carrier tower outside a workpiece spindle angular range relative to a base rotation axis.

17. The device of claim 14 , further comprising a dressing device disposed on the carrier tower, the profile processing device being disposed on the dressing device.

18. 16. The device of claim 15, further comprising a workpiece tailstock disposed on said carrier tower having a tailstock base, said profile machining device being disposed on said tailstock base.

19. 19. A device according to any one of claims 9 to 18, wherein the first profile machining plate comprises cutting elements made of polycrystalline diamond.

20. 20. The device according to any one of claims 9 to 19, wherein the first profiled plate has a first distal profiled plate tip angle of 1° to 50°, in particular 5° to 45°, particularly preferably 10° to 30°.

21. The profile processing device has a first profile processing plate holder that holds the first profile processing plate, and the first profile processing plate holder a) a first clamp leg having a first receiving surface, the first receiving surface contacting the first profiled plate; 21. The device according to any one of claims 9 to 20, comprising: b) a first clamping element for pressing the first profiled plate against the first receiving surface.

22. 22. The device of claim 21, wherein a first receiving surface dimension of the first receiving surface is 50% to 95% of a first profiled plate major surface dimension of the first profiled plate.

23. 23. The device according to claim 21 or 22, wherein the first clamping leg has a thickness perpendicular to the first receiving surface, said thickness corresponding to at least 70%, in particular at least 100%, of a maximum length of the receiving surface.

24. 24. The device according to any one of claims 21 to 23, wherein the first clamp leg has at least one first stabilizing surface adjacent to the first receiving surface, in particular perpendicular to the first receiving surface, which first stabilizing surface supports the first profile processing plate against slipping in the first profile processing plate holder.

25. 25. The device according to any one of claims 9 to 24, wherein the profile machining device comprises a second profile machining plate, also in particular a third profile machining plate, and preferably also a fourth profile machining plate.

26. 26. The device according to claim 25, wherein the profile cutting plates of the profile cutting device preferably have a first profile cutting plate tip angle of the first profile cutting plate and a second profile cutting plate tip angle of the second profile cutting plate, and in particular also a third profile cutting plate tip angle of the third profile cutting plate, and particularly preferably also a fourth profile cutting plate tip angle of the fourth profile cutting plate, in each case the profile cutting plate tip angles differing from each other by at least 2°, in particular at least 3°.

27. a first distal profile processing plate tip of the first profile processing plate and a second distal profile processing plate tip of the second profile processing plate, and in particular also a third distal profile processing plate tip of the third profile processing plate and preferably also a fourth distal profile processing plate tip of the fourth profile processing plate, are arranged circumferentially with respect to an arrangement plane, 27. A device according to claim 25 or 26, wherein the profile machining device is mounted so as to be pivotable or rotatable about a displacement axis passing through the centre of the circumference perpendicular to the arrangement plane, so that each profile machining plate tip can be aligned with the grinding spindle, the arrangement plane extending parallel to a main surface of the first profile machining plate, in particular in a round table arrangement, or at an angle, in particular in a revolver arrangement.

28. 27. The device of claim 25 or 26, wherein the profile processing device is a stack profile processing device, and the first distal profile processing plate tip of the first profile processing plate and the second distal profile processing plate tip of the second profile processing plate, and in particular also the third distal profile processing plate tip of the third profile processing plate, and preferably also the fourth distal profile processing plate tip of the fourth profile processing plate, are spaced apart from each other along a stacking axis extending perpendicular to a main surface of the first profile processing plate and are identically aligned with respect to a plane extending parallel to the main surface of the first profile processing plate.

29. 29. A device according to any one of claims 9 to 28, comprising a probe, the device having a first profile machining plate measurement configuration capable of feeding the probe into the profile machining device until the probe contacts the first profile machining plate.

Images