Fixing structure of electronic component

Abstract

To provide an electronic component fixing structure capable of reliably fixing an electronic component to a base without accurately controlling an application amount of an adhesive.SOLUTION: There is provided an electronic component fixing structure in which an electronic component 80 is fixed to a base 11 by pressing an adhesive 88 disposed on a bonding surface 11a of the base 11 or a bonding surface 80a of the electronic component 80 with the electronic component 80. The electronic component fixing structure has a non-restricting part in which a restricting member 82 capable of restricting a range of wetting and spreading of the adhesive 88 on the bonding surface 11a is disposed on an outer edge 80b of the bonding surface 80a of the electronic component 80 facing the bonding surface 11a of the base 11, and in which the restricting member 82 is not disposed on the outer edge 80b and a part of the bonding surface 11a is provided.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a fixing structure for an electronic component. [Background technology]

[0002] In recent years, automobiles equipped with motors as a driving source (such as hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs)) have become widespread. These automobiles use vehicle drive systems that incorporate a driving motor, a power module, an inverter, and the like. In vehicle drive systems, some electronic components may be fixed to a base by being adhered with an adhesive.

[0003] Patent Document 1 discloses an electrophoretic display device including an element substrate, a transparent substrate arranged opposite the element substrate, an electrophoretic layer arranged between the element substrate and the transparent substrate, and a surface protection substrate fixed to the transparent substrate via a frame-shaped porous material provided on the surface of the transparent substrate opposite the electrophoretic layer and an optical adhesive arranged within the frame of the porous material.

[0004] In the electrophoretic display device disclosed in Patent Document 1, the optical adhesive spreads on the transparent substrate by pressing the surface protection substrate against the transparent substrate, and the surface protection substrate is fixed to the transparent substrate. When the optical adhesive spreads on the transparent substrate, the optical adhesive is surrounded by a frame-shaped porous material, and therefore, air flows out of the porous material through the pores in the porous material, but the optical adhesive does not penetrate into the porous material and is blocked by the porous material. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-028113 Summary of the Invention [Problem to be solved by the invention]

[0006] In the electrophoretic display device disclosed in Patent Document 1, a frame-shaped porous material is arranged, and therefore, in order to spread the adhesive throughout the entire space inside the porous material without any gaps, it is necessary to accurately control the amount of adhesive applied, and there is room for improvement.

[0007] Therefore, there is a demand for a fixing structure for an electronic component that can reliably fix an electronic component to a base without having to precisely control the amount of adhesive applied. [Means for solving the problem]

[0008] One embodiment of the fixing structure for an electronic component according to the present disclosure is a fixing structure for an electronic component that fixes the electronic component to the base by pressing an adhesive placed on the adhesive surface of the base or the adhesive surface of the electronic component with the electronic component, in which a limiting member that can limit the range of wetting and spreading of the adhesive on the adhesive surface is placed on the outer edge of the adhesive surface of the electronic component that faces the adhesive surface of the base, and the outer edge and part of the adhesive surface have non-restricting portions where the limiting member is not placed.

[0009] According to this embodiment, a non-restricting portion where no limiting member is disposed is formed on a portion of the outer edge of the electronic component. Therefore, if the adhesive is applied in an amount slightly larger than the volume of the space filled with the adhesive when the limiting member is at a predetermined height, the adhesive will wet and spread throughout the entire space, and any excess adhesive will then flow into the non-restricting portion. Meanwhile, because the limiting member prevents the adhesive from leaking, it is possible to place components outside the limiting member whose performance would be degraded by the adhesive. Therefore, even if the amount of adhesive applied is not precisely controlled, the adhesive can be wetted and spread over the entire bonding surface of the base, ensuring reliable fixation of the electronic component to the base. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a circuit diagram of a cooling circuit including a vehicle drive system. [Figure 2] FIG. 2 is an exploded perspective view of the vehicle drive device and the housing. [Figure 3] FIG. 1 is a perspective view of a power circuit assembly with a smoothing capacitor separated and turned upside down. [Figure 4] FIG. 2 is a circuit diagram of a power circuit assembly. [Figure 5] FIG. 10 is a bottom view showing the smoothing capacitor to which the porous material is attached. [Figure 6] 6 is a cross-sectional view taken along line VI-VI of FIG. 5, illustrating a step of fixing the smoothing capacitor to the cooling plate. [Figure 7] 10A to 10C are cross-sectional views illustrating a process of fixing the smoothing capacitor to the cooling plate. [Figure 8] 10A to 10C are cross-sectional views illustrating a process of fixing the smoothing capacitor to the cooling plate. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the electronic component fixing structure according to the present disclosure will be described in detail with reference to the drawings. Note that the embodiments described below are merely examples for explaining the electronic component fixing structure, and the electronic component fixing structure is not limited to these embodiments. Therefore, the electronic component fixing structure can be embodied in various forms without departing from the spirit of the present disclosure.

[0012] [Cooling circuit] As shown in FIG. 1, the vehicle drive device A is mounted on a cooling circuit consisting of a coolant flow path L1 for circulating a coolant as a cooling fluid, a refrigerant flow path L2 for circulating a refrigerant, and a lubricant flow path L3 for circulating a lubricant.

[0013] The coolant flow path L1 is driven by a coolant pump 33 to circulate the coolant through the radiator 34, the cooling plate 11 (an example of a base) of the power circuit assembly PE, the oil cooler 32, and the water-cooled condenser 31 in that order. The coolant is cooling water such as long-life coolant (LLC), or insulating oil such as paraffin-based oil.

[0014] The refrigerant flow path L2 is configured to supply an externally cooled refrigerant to the water-cooled condenser 31. In this refrigerant flow path L2, a hydrofluorocarbon (HFC), a hydrofluoroolefin (HFO), or the like is used as the refrigerant.

[0015] The lubricating oil passage L3 supplies low-temperature lubricating oil to the inside of the traveling motor M and the gear mechanism Ge when the hydraulic pump 35 is driven.

[0016] In this cooling circuit, the coolant cooled by the radiator 34 flows through a flow path R (see FIG. 6) formed inside the cooling plate 11 of the power circuit assembly PE. As a result, the coolant absorbs heat generated in the power circuit assembly PE and cools the power circuit assembly PE. As a result, the temperature of the coolant rises.

[0017] The oil cooler 32 is disposed downstream of the power circuit assembly PE in the coolant flow path L1, and exchanges heat between the coolant circulating through the coolant flow path L1 and the lubricant circulating through the lubricant flow path L3. This further increases the temperature of the coolant and decreases the temperature of the lubricant. The cooled lubricant flows through the lubricant flow path L3 and is supplied to the drive motor M and the gear mechanism Ge. This prevents the drive motor M and the gear mechanism Ge from increasing in temperature and lubricates the drive motor M and the gear mechanism Ge. The coolant, whose temperature has increased in the oil cooler 32, removes heat from the refrigerant in the water-cooled condenser 31, then dissipates heat in the radiator 34, where it is cooled and supplied to the power module B again.

[0018] [Configuration of vehicle drive device] 2 shows a vehicle drive device A that transmits the driving force of a traction motor M to wheels (not shown). This vehicle drive device A accommodates the traction motor M, a drive shaft DS connected to transmit the driving force of the traction motor M to the wheels, a gear mechanism Ge that reduces the driving force of the traction motor M and transmits it to the drive wheels, and a power circuit assembly PE including a power module B and an inverter C, all housed in a housing AH. Hereinafter, a vehicle equipped with a traction motor M as a driving source will also be referred to as an electric vehicle. Examples of electric vehicles include hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs).

[0019] The housing AH includes a first housing chamber E1 that houses the travel motor M, and a second housing chamber E2 that houses a power supply module B and an inverter C that control the power supplied to the travel motor M. The direction perpendicular to the vertical direction Z and along the rotation axis A1 of the rotor (not shown) of the travel motor M is defined as the axial direction L, the direction orthogonal to the vertical direction Z and the axial direction L is defined as the axial-orthogonal direction Y, and one side of the axial-orthogonal direction Y is defined as the axial-orthogonal first side Y1.

[0020] The housing AH has a first cover 101 that closes the outside of the drive motor M in the first accommodation chamber E1, and a second cover 102 that closes the outside of the gear mechanism Ge in the first accommodation chamber E1. In addition, an opening at the top of the housing AH is closed by an upper cover 103. This gives the housing AH a sealed structure.

[0021] The gear mechanism Ge includes a differential gear mechanism 110 arranged on the same axis as the rotation axis A1 of the drive shaft DS of the driving motor M, and a counter gear mechanism 111 arranged on an offset axis B1 offset from the rotation axis A1.

[0022] When mounted on an electric vehicle, the second storage chamber E2 has an upper region E3 which is above the driving motor M in the vertical direction Z and overlaps with the driving motor M when viewed in the vertical direction, and a lateral region E4 which is adjacent to the upper region E3 and is on the first side Y1 in the direction perpendicular to the axis of the driving motor M and does not overlap with the driving motor M when viewed in the vertical direction.

[0023] In the vehicle drive device A of this embodiment, at least a portion of the inverter C is disposed in the upper area E3, and the power supply module B is disposed in an area extending below the inverter C in the side area E4.

[0024] That is, in this embodiment, when viewed in the direction along the axial direction L (side view), with the inverter C in a horizontal position, the power supply module B extends in the vertical direction Z, thereby forming an L-shape with the inverter C and the power supply module B. That is, in the upper region E3 of the second housing chamber E2, in a region extending in the axially orthogonal direction Y, the inverter C is arranged in a horizontal position above the traction motor M, and the power supply module B is arranged in a vertical position in a side region E4 adjacent to the upper region E3 and extending in the vertical direction. Note that instead of the arrangement of this embodiment, the power supply module B may be arranged in the upper region E3 and the inverter C in the side region E4.

[0025] In this embodiment, the side opposite to the axially orthogonal direction first side Y1 in the direction along the axially orthogonal direction Y is referred to as the axially orthogonal direction second side Y2, and either the axially orthogonal direction first side Y1 or the axially orthogonal direction second side Y2 may be the front side of the body of the electric vehicle.

[0026] [Configuration of power circuit assembly] 4 shows a circuit diagram of the power circuit assembly PE. The power circuit assembly PE includes a filter unit 40 and an OBC unit 50 that constitute a power module B, an auxiliary inverter unit 60 and a main inverter unit 65 that constitute an inverter C, and a control unit D.

[0027] [Filter unit] The filter unit 40 includes an input connector 40a, an output connector 40b, an AC filter 22, a relay module 42, a coil module 21, a current detection module 44, and an input / output control unit 45. The input / output control unit 45 outputs a control signal to the relay module 42 and acquires a detection signal from the current detection module 44.

[0028] [OBC Unit] The OBC unit 50 includes a transformer T, a low-voltage connector 50a, a conversion circuit 51, a primary coil control circuit 52, a bulk capacitor 16, a secondary coil control circuit 54, a tertiary coil control circuit 55, a conversion circuit control unit 56, a transformer control unit 57, and a low-voltage control unit 58. The primary coil control circuit 52 controls the primary coil T1 of the transformer T. The bulk capacitor 16 is disposed in a power system that transmits power from the conversion circuit 51 to the primary coil control circuit 52. The secondary coil control circuit 54 controls the secondary coil T2 of the transformer T. The tertiary coil control circuit 55 obtains power from the tertiary coil T3 of the transformer T. The low-voltage connector 50a supplies power from the tertiary coil control circuit 55 to a low-voltage system battery BAT2.

[0029] The conversion circuit control unit 56 controls the multiple switching elements of the conversion circuit 51. Furthermore, the transformer control unit 57 controls the multiple switching elements of the primary coil control circuit 52 and the multiple switching elements of the secondary coil control circuit 54. The low voltage control unit 58 controls the multiple switching elements of the tertiary coil control circuit 55.

[0030] [Auxiliary inverter unit] The auxiliary inverter unit 60 of the inverter C functions as a DC-DC converter, and includes a first high-voltage connector 60 a, an auxiliary drive circuit 61 , a DC filter 62 , and an auxiliary control unit 63 .

[0031] The auxiliary drive circuit 61 includes a plurality of switching elements. The auxiliary control unit 63 controls the auxiliary drive circuit 61 to supply high-voltage power to auxiliary equipment such as the air conditioner 5 via the first high-voltage connector 60a. That is, the auxiliary inverter unit 60 includes a plurality of switching elements.

[0032] As shown in FIGS. 2 and 3, the auxiliary inverter unit 60 of the inverter C is disposed above the cooling plate 11 in the vertical direction Z.

[0033] [Main inverter unit] 4, the main inverter unit 65 of the inverter C has a second high-voltage connector 65a, a motor drive circuit 66, and a smoothing capacitor 80 (an example of an electronic component). The motor drive circuit 66 has a plurality of switching elements and supplies power to the traction motor M.

[0034] When high-voltage power flowing between the OBC unit 50 and the auxiliary inverter unit 60 is supplied to the main inverter unit 65, the main inverter unit 65 functions to supply this high-voltage power from the second high-voltage connector 65a to the main battery BAT1 to charge it. Therefore, in a broad sense, the OBC unit 50 and the main inverter unit 65 can be collectively referred to as an on-board charger.

[0035] In addition, the main inverter unit 65 converts the power from the main battery BAT1 into three-phase AC power using the motor drive circuit 66, controls the frequency, and supplies it to the traction motor M, thereby obtaining driving force from the traction motor M that enables the electric vehicle to run.

[0036] 2 and 3, the main inverter unit 65 including the motor drive circuit 66 and the smoothing capacitor 80 is disposed in contact with the upper surface 11a (an example of an adhesive surface) of the cooling plate 11. In this way, the main inverter unit 65 is cooled by the cooling plate 11. The motor drive circuit 66 is disposed adjacent to the smoothing capacitor 80.

[0037] [Control unit] The control unit D outputs control signals to the input / output control unit 45, the conversion circuit control unit 56, the transformer control unit 57, the low voltage control unit 58, and the auxiliary control unit 63. As shown in FIGS. 2 and 3, the control unit D is disposed above the cooling plate 11 and adjacent to the smoothing capacitor 80. As a result, the control unit D is cooled by the cooling plate 11.

[0038] Current Flow in Power Circuit Assembly As shown in FIG. 4, the power circuit assembly PE, under the control of the relay module 42, converts AC power from an AC power source (basically a commercial power source) supplied from outside the electric vehicle to an input connector 40a into DC power using a conversion circuit 51, and supplies AC of a set frequency generated by a primary coil control circuit 52 to the primary coil T1 side of the transformer T.

[0039] Furthermore, the high voltage power output to the secondary coil T2 side of the transformer T is extracted as high voltage DC power by the secondary coil control circuit 54 and is charged into the main battery BAT1 from the second high voltage connector 65a.

[0040] The high-voltage DC power charged in the main battery BAT1 is converted to three-phase AC power by the motor drive circuit 66, and the frequency is controlled before being supplied to the traction motor M. This allows the traction motor M to operate at a target rotation speed, enabling the electric vehicle to travel. In addition, the high-voltage DC power from the main battery BAT1 is DC-DC converted by the accessory drive circuit 61 and supplied to the air conditioner 5 and the like from the first high-voltage connector 60a.

[0041] In response to this, the low-voltage power output to the tertiary coil T3 side of the transformer T is converted into DC power by the tertiary coil control circuit 55 and charged into the system battery BAT2 from the low-voltage connector 50a. The power charged into the system battery BAT2 in this manner is supplied to the control device of the vehicle body and control devices of the electric vehicle.

[0042] Furthermore, the power circuit assembly PE, under the control of the relay module 42, sequentially supplies power from the main battery BAT1 to the secondary coil control circuit 54, the transformer T, the primary coil control circuit 52, etc., thereby creating AC power similar to commercial power and outputting it from the output connector 40b.

[0043] [Smoothing capacitor fixing structure] In this embodiment, the "smoothing capacitor fixing structure" is a structure for fixing the smoothing capacitor 80 to the upper surface 11a of the cooling plate 11 (hereinafter, also simply referred to as the "fixing structure"). As described above, the smoothing capacitor 80 is disposed in contact with the upper surface 11a of the cooling plate 11, as shown in FIG. 2. Specifically, the smoothing capacitor 80 is fixed to the upper surface 11a of the cooling plate 11 by an adhesive 88 (see FIG. 8). It is desirable that the adhesive 88 have high thermal conductivity.

[0044] As shown in FIGS. 3 and 5 , a porous material 82 (an example of a limiting member) is disposed on an outer edge 80b of a lower surface 80a (an example of an adhesive surface) of the smoothing capacitor 80 facing the cooling plate 11, and an adhesive 88 is disposed inside the porous material 82. In the fixing structure according to this embodiment, the porous material 82 is not disposed over the entire outer edge 80b of the smoothing capacitor 80, but is disposed only on a portion of the outer edge 80b. Hereinafter, a portion (space) of the outer edge 80b where the porous material 82 is not disposed is referred to as a communicating portion 83 (an example of a non-restricting portion). When the smoothing capacitor 80 is fixed to the upper surface 11a of the cooling plate 11, the area where the adhesive 88 is disposed, i.e., a space 89 partitioned by the lower surface 80a of the smoothing capacitor 80, the upper surface 11a of the cooling plate 11, and the porous material 82, communicates with the space outside the smoothing capacitor 80 via the communicating portion 83. The adhesive 88 disposed in the space 89 can flow out of the smoothing capacitor 80 through the communicating portion 83.

[0045] In this embodiment, the porous material 82 has a large number of interconnected microscopic pores 82a (see FIGS. 6 to 8) and is made of an elastically deformable material. Examples of materials for the porous material 82 include foamed resins such as sponges. The porous material 82 is configured to allow only air to pass through, but not the adhesive 88.

[0046] A method for fixing the smoothing capacitor 80 to the cooling plate 11 in this embodiment will be described with reference to FIGS. 5 to 8. First, as shown in FIG. 5, a porous material 82 is placed on a portion of the outer edge 80b of the lower surface 80a of the smoothing capacitor 80 and fixed by adhesive or other methods. Next, an adhesive 88 is applied to the lower surface 80a on the inside of the porous material 82 (see FIG. 3). Then, as shown in FIG. 6, the lower surface 80a of the smoothing capacitor 80 on which the adhesive 88 has been applied is placed opposite the upper surface 11a of the cooling plate 11, and the porous material 82 and adhesive 88 are brought into contact with the upper surface 11a. This forms a space 89. Next, the smoothing capacitor 80 is pressed toward the cooling plate 11 to wet and spread the adhesive 88 throughout the space 89. As a result, the porous material 82 is compressed and its height is reduced, and the adhesive 88 is wet and spread throughout the space 89. Specifically, when the adhesive 88 is wetted and spread and approaches the porous material 82, the air in the space 89 that is between the adhesive 88 and the porous material 82 flows out of the porous material 82 through the holes 82a of the porous material 82 (see FIG. 7). This allows the adhesive 88 to wet and spread until it comes into contact with the porous material 82. On the other hand, the adhesive 88 that has come into contact with the porous material 82 cannot pass through the holes 82a of the porous material 82 and is blocked by the porous material 82. In this way, the adhesive 88 can be wetted and spread throughout the entire space 89 (see FIG. 8).

[0047] In this embodiment, part of the outer edge 80b of the smoothing capacitor 80 forms the communication portion 83, so that even after the adhesive 88 has spread throughout the entire space 89, any excess adhesive 88 flows into the communication portion 83. In this case, some of the adhesive 88 may flow out of the smoothing capacitor 80 from the communication portion 83. The adhesive 88 is cured when the compressed porous material 82 reaches a predetermined height.

[0048] In this embodiment, a communication portion 83 where no porous material 82 is disposed is formed in a portion of the outer edge 80b of the smoothing capacitor 80. Therefore, if the adhesive 88 is applied in an amount slightly larger than the volume of the space 89 when the porous material 82 reaches a predetermined height, the adhesive 88 will wet and spread throughout the entire space 89, and the excess adhesive 88 will then flow into the communication portion 83. Therefore, even if the amount of adhesive 88 applied is not accurately controlled, the adhesive 88 can be made to wet and spread throughout the entire space 89, and the smoothing capacitor 80 can be reliably fixed to the cooling plate 11.

[0049] With the smoothing capacitor 80 fixed to the cooling plate 11, heat generated in the smoothing capacitor 80 is transferred to the cooling plate 11 via the adhesive 88 and is cooled by the coolant flowing through the flow path R (see FIG. 6) formed inside the cooling plate 11. This makes it possible to suppress a rise in temperature of the smoothing capacitor 80.

[0050] 3 and 5, the smoothing capacitor 80 has a substantially rectangular shape in plan view. In this state, the communicating portions 83 are provided on two opposing sides of the outer edge 80b. As a result, when the smoothing capacitor 80 is pressed against the cooling plate 11, the excess adhesive 88 spreads and flows into the communicating portions 83 on one side in one direction and the communicating portions 83 on the other side. This makes it easier to achieve left-right balance when pressing the smoothing capacitor 80, and makes it easier to press the smoothing capacitor 80 while maintaining the lower surface 80a of the smoothing capacitor 80 parallel to the upper surface 11a of the cooling plate 11.

[0051] Furthermore, in this embodiment, the communicating portions 83 are formed so that the total length (a1 in FIG. 5) of the communicating portions 83 on one side in one direction along the outer edge 80b of the smoothing capacitor 80 in a plan view is the same as the total length (a2+a3) of the communicating portions 83 on the other side in one direction along the outer edge 80b of the smoothing capacitor 80 (a1=a2+a3). As a result, when the smoothing capacitor 80 is pressed against the cooling plate 11, the pressure acting on the adhesive 88 that spreads and flows into the communicating portions 83 is the same on both sides. This makes it easy to achieve a balance between the left and right when pressing the smoothing capacitor 80, making it easy to press the smoothing capacitor 80 while maintaining the lower surface 80a of the smoothing capacitor 80 parallel to the upper surface 11a of the cooling plate 11.

[0052] In this embodiment, the porous material 82 is disposed in a location where it is necessary to restrict the adhesive 88 from spreading outside the smoothing capacitor 80. Specifically, as shown in Fig. 6, the porous material 82 is disposed, for example, in front of an electrode 11b (an example of a portion where a terminal is connected) to which a terminal 80d of the smoothing capacitor 80 is electrically connected, or in front of a positioning hole 11c (an example of a positioning portion) that positions the smoothing capacitor 80 on the cooling plate 11.

[0053] The electrode 11b to which the terminal 80d of the smoothing capacitor 80 is electrically connected is adjacent to the motor drive circuit 66 (see FIG. 3), and is therefore disposed so as to face one entire side of the rectangular smoothing capacitor 80. Therefore, the porous material 82 is also disposed over the entire side (outer edge 80b) on which the terminal 80d is provided. The porous material 82 is also disposed over the entire side of the rectangular smoothing capacitor 80 that faces the side on which the terminal 80d is provided.

[0054] An example of the positioning holes 11c is a bolt hole into which a bolt 80g is fastened, which is inserted into a through-hole 80e formed in a case 80f of the smoothing capacitor 80. Furthermore, in the case 80f of this embodiment, a pair of through-holes 80e1 are formed on one side adjacent to the side on which the terminal 80d is provided, as holes for connecting input terminals, and a pair of through-holes 80e2 are formed on the other side adjacent to the terminal 80d, as holes for connecting output terminals. The terminal 80d is electrically connected to the motor drive circuit 66 via the electrode 11b. The input terminal connected to the through-hole 80e1 is electrically connected to the main battery BAT1. The output terminal connected to the through-hole 80e2 is electrically connected to the accessory drive circuit 61 (see also FIG. 4). Because the adhesive 88 does not leak out of the smoothing capacitor 80 from the location where the porous material 82 is disposed, the vehicle drive device A can be manufactured even after the smoothing capacitor 80 is fixed to the cooling plate 11, and the operation of the vehicle drive device A is not affected by the fixation of the smoothing capacitor 80. The positioning holes 11c are not limited to bolt holes, and any method can be used as long as they are capable of positioning, such as knock pins.

[0055] In this embodiment, the smoothing capacitor 80 is configured by incorporating multiple capacitor elements 80c inside a case 80f (see FIGS. 5 and 6). When the vehicle drive device A is operated, the multiple capacitor elements 80c generate heat. In this embodiment, the porous material 82 is arranged in a location inside the case 80f that does not overlap the multiple capacitor elements 80c in a plan view (see FIG. 5). In other words, the multiple capacitor elements 80c overlap the adhesive 88 in a plan view. The porous material 82 has many fine pores 82a formed therein, and air is present in the pores 82a. Air has high thermal insulation properties and a lower thermal conductivity than the adhesive 88. Therefore, by arranging the multiple capacitor elements 80c so that they overlap the adhesive 88 in a plan view, the heat generated by the multiple capacitor elements 80c is conducted through the adhesive 88, which has high thermal conductivity, rather than through the porous material 82, which has low thermal conductivity. As a result, heat generated in the plurality of capacitor elements 80c is transferred from adhesive 88 to cooling plate 11, and is efficiently cooled by the coolant flowing through flow paths R formed inside cooling plate 11.

[0056] [Another embodiment] The present invention may be configured as follows in addition to the above-described embodiment (common numbers and symbols as in the embodiment are used to designate components having the same functions as in the embodiment).

[0057] (1) In the above embodiment, the porous material 82 is disposed on the lower surface 80a of the smoothing capacitor 80, but this is not limiting. The porous material 82 may be disposed on the upper surface 11a of the cooling plate 11. Furthermore, in the above embodiment, the adhesive 88 is also applied to the lower surface 80a, but it may also be applied to the upper surface 11a. It is desirable that the location where the porous material 82 is disposed and the location where the adhesive 88 is applied are the same surface. If they are the same surface, the adhesive 88 can be reliably applied to the inside of the porous material 82.

[0058] (2) In the above embodiment, the smoothing capacitor 80 is fixed to the cooling plate 11, but it may be fixed to something other than the cooling plate 11 (for example, a wiring board).

[0059] (3) In the above embodiment, the smoothing capacitor 80 is fixed to the cooling plate 11, but a similar fixing structure can be adopted for electronic components other than the smoothing capacitor 80.

[0060] (4) In the above embodiment, the communication portions 83 are provided on two opposing sides of the outer edge 80b of the rectangular smoothing capacitor 80. However, the communication portions 83 may be provided on two adjacent sides. Furthermore, the communication portions 83 may be provided on one side or on three or more sides.

[0061] (5) In the above embodiment, the total length of the communicating portion 83 along the outer edge 80b on one side in one direction when viewed in a plane is set to be the same as the total length along the outer edge 80b on the other side in one direction, but the total lengths may be different.

[0062] (6) In the above embodiment, the adhesive 88 is applied to the lower surface 80a of the smoothing capacitor 80, but the adhesive 88 may also be applied to the upper surface 11a of the cooling plate 11. Alternatively, the adhesive 88 may be applied to both the lower surface 80a of the smoothing capacitor 80 and the upper surface 11a of the cooling plate 11.

[0063] In the above-described embodiment, the following configurations are envisioned.

[0064] <1> The fixing structure for an electronic component, which fixes an electronic component (80) to a base (11) by pressing an adhesive (88) arranged on an adhesive surface (11a) of the base (11) or an adhesive surface (80a) of the electronic component (80) with the electronic component (80), has a limiting member (82) that can limit the range of wetting and spreading of the adhesive (88) on the adhesive surface (11a) and is arranged on an outer edge (80b) of the adhesive surface (80a) of the electronic component (80) that faces the adhesive surface (11a) of the base (11), and has a non-limiting portion (83) where the limiting member (82) is not arranged on a part of the outer edge (80b) and the adhesive surface (11a).

[0065] According to this configuration, a non-restricting portion 83 where the restricting member 82 is not disposed is formed on a portion of the outer edge 80b of the bonding surface 80a of the electronic component 80. Therefore, if the adhesive 88 is applied in an amount slightly larger than the volume of the space 89 to be filled with the adhesive 88 when the restricting member 82 is at a predetermined height, the adhesive 88 will spread throughout the entire space 89, and the excess adhesive 88 will then flow into the non-restricting portion 83. Meanwhile, the restricting member 82 prevents the adhesive 88 from flowing out, allowing components whose performance would be degraded by the adhesive 88 to be placed outside the restricting member 82. Therefore, even if the amount of adhesive 88 applied is not precisely controlled, the adhesive 88 can be spread over the entire bonding surface 11a of the base 11 and the bonding surface 80a of the electronic component 80, thereby reliably securing the electronic component 80 to the base 11.

[0066] <2> <1> In the fixing structure for an electronic component, it is preferable that the non-restrictive portion (83) is arranged at one outer edge (80b) and the other outer edge (80b) in one direction of the electronic component (80) parallel to the adhesive surface (11a).

[0067] According to this configuration, when the electronic component (80) is pressed against the base (11), the excess adhesive (88) spreads and flows into the non-restrictive portion (83) on one side in one direction and the non-restrictive portion (83) on the other side in one direction. This makes it easy to achieve a balance between the left and right sides when pressing the electronic component (80), and makes it easy to press the electronic component (80) while maintaining the electronic component (80) and the base (11) in a parallel state.

[0068] <3> <2> In the electronic component fixing structure, it is preferable that the total length along the outer edge (80b) on one side of the non-restricting portion (83) is the same as the total length along the outer edge (80b) on the other side in a plan view.

[0069] According to this configuration, when the electronic component (80) is pressed against the base (11), the pressure of the adhesive (88) that spreads and flows into the non-restrictive portion (83) on one side in one direction can be made equal to the pressure of the adhesive (88) that flows into the non-restrictive portion (83) on the other side. This makes it easy to achieve a balance between the left and right sides when pressing the electronic component (80), making it easy to press the electronic component (80) while maintaining the electronic component (80) and the base (11) in a parallel state.

[0070] <4> the above <1> from <3> In the fixing structure for an electronic component described in any one of the above, the base (11) has at least one of a portion (11b) to which a terminal (80d) of the electronic component (80) is connected and a positioning portion (11c) of the electronic component (80) outside the electronic component (80), and the restricting member (82) is preferably arranged at a location where it can restrict the spreading of the liquid onto at least one of the terminal (80d) and the positioning portion (11c).

[0071] According to this configuration, the adhesive (88) does not flow out of the electronic component (80) from the location where the restricting member (82) is arranged, and therefore the adhesive (88) does not flow into the portion (11b) of the base (11) to which the terminal (80d) of the electronic component (80) is connected or the positioning portion (11c) of the electronic component (80). [Industrial Applicability]

[0072] The present invention can be used in a fixing structure for electronic components. [Explanation of symbols]

[0073] 11: cooling plate (base), 11a: upper surface (adhesive surface), 11b: electrode (portion to which terminal is connected), 11c: positioning hole (positioning portion), 80: smoothing capacitor (electronic component), 80a: lower surface (adhesive surface), 80b: outer edge, 80d: terminal, 82: porous material (restriction member), 83: communication portion (non-restriction portion), 88: adhesive

Claims

1. An electronic component fixing structure in which an adhesive disposed on an adhesive surface of a base or an adhesive surface of an electronic component is pressed by the electronic component to fix the electronic component to the base, a limiting member capable of limiting a range of wetting and spreading of the adhesive on the adhesive surface is disposed on an outer edge of the adhesive surface of the electronic component facing the adhesive surface of the base, A fixing structure for an electronic component, the fixing structure having a non-restricting portion where the restricting member is not disposed on the outer edge and part of the adhesive surface.

2. The fixing structure for an electronic component according to claim 1 , wherein the non-restricting portions are arranged on the outer edge on one side and the outer edge on the other side in one direction of the electronic component parallel to the adhesive surface.

3. The electronic component fixing structure according to claim 2 , wherein, in a plan view, the total length of the non-restricting portion along the outer edge on the one side is the same as the total length of the non-restricting portion along the outer edge on the other side.

4. the base has at least one of a portion to which a terminal of the electronic component is connected and a positioning portion for the electronic component, the portion being located outside the electronic component; The electronic component fixing structure according to claim 1 , wherein the restricting member is disposed at a position capable of restricting the spreading of the liquid onto at least one of the terminal and the positioning portion.

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