Electronic component and structural element for electronic component

Abstract

The embodiment of the invention relates to an electronic component and a structural element for the electronic component. The invention relates to an electrical component provided for making electrical contact with a carrier plate, comprising a damping element which is arranged on a first side of the electrical component, the damping element being cylindrical and protruding beyond the first side of the electrical component, and wherein a contact device is arranged on the free end of the damping element, which contact device is provided for establishing a support on the support member.

Description

Technical Field

[0001] This invention relates to an electronic component and an electrical or electronic structural element (hereinafter referred to as the electrical structural element) for the electronic component, the electrical structural element having a mechanical damping function to improve mechanical shock resistance and vibration resistance. Furthermore, this invention also relates to a method for manufacturing the electronic component. Background Technology

[0002] Electronic components with a support plate, such as a circuit board or the like, are known in the prior art in various configurations, for example, as power modules in electric vehicle converters. Such electronic components typically have heavy electrical structural elements, such as transformers or electrolytic capacitors, arranged on the support plate. Due to the significant weight of these electrical structural elements, they may vibrate along with the support plate to which they are attached, for example, during vibrations or sudden accelerations. This can lead to problems with the electrical contacts and / or other electrical structural elements within the electronic component. Summary of the Invention

[0003] In contrast, the electrical structural element according to the invention has the advantages that structural elements with greater weight can be securely fixed to a support plate and can be damped in the event of vibration, impact, or shock without causing further damage to other electrical structural elements, the support plate, or similar components. The support plate is preferably a printed circuit board, substrate, or similar structure. The electrical structural element includes an electrical contact on a first side. The electrical contact of the electrical structural element is configured to make electrical contact with the support plate. The electrical structural element also includes a damping element disposed on the first side of the electrical structural element. Therefore, the damping element faces the support plate. The damping element is constructed in a columnar shape and protrudes beyond the electrical contact of the electrical structural element on the first side. A contact device is arranged at the free end of the damping element, which is configured to provide a detachable support or actual fixed connection between the damping element and a support member, such as a housing. Thus, the damping element is supported on the support member at its free end, while the other end of the damping element is connected to the electrical structural element, thereby providing a damping function to the electrical structural element. The electrical structural components are connected to the load-bearing plate on one hand, and directly to the supporting members on the other hand through damping elements. This prevents the electrical structural components from vibrating and being damaged independently, especially the load-bearing plate and other electrical connections.

[0004] The preferred embodiments illustrate preferred extensions of the invention.

[0005] Preferably, the electrical structural element has an encapsulation at least partially surrounded by a casting block, and the damping element is also made from the casting block of the electrical structural element. Therefore, the damping element and the encapsulation of the electrical structural element are integrally constructed and can be manufactured particularly simply and at low cost.

[0006] Therefore, the contact between the damping element and the support member is created during the bonding process used to manufacture the electronic component. The encapsulated casting block is preferably made of plastic material. That is, the damping element is preferably made of plastic material.

[0007] Furthermore, preferably, the contact device of the damping element is configured to provide a material-locking connection at the free end of the damping element. Additionally or alternatively, the contact device is configured to provide a force-locking connection at the free end of the damping element. More preferably or alternatively, the contact device is configured to provide a form-locking connection at the free end. In other words, a material-locking connection and / or a force-locking connection and / or a form-locking connection, or any combination thereof, can be provided between the damping element and the support member.

[0008] In particular, the contact device has a hot region at the free end of the damping element, which can be melted by thermal energy. This makes it possible, for example, to provide a material-locking connection through a change in the mass at the free end of the damping element. If there are also cutouts on the support member, such as dovetail cutouts or similar cutouts, a form-locking connection can also be provided between the damping element and the support member through the closure of the material at the free end.

[0009] Alternatively, the contact device includes an expansion element at the free end of the damping element. The expansion element is configured to perform an expansion process when mechanical contact occurs between the free end and the support member. This expansion allows for a larger contact area between the free end of the damping element and the support member. In particular, a force-locking connection can be provided here.

[0010] Furthermore, preferably, the contact device also comprises a two-component material. The two-component material includes a first component and a second component. The first component is disposed at the free end of the damping element, and the second component is disposed on the support member. During assembly, a chemical reaction occurs when the first component comes into contact with the second component, thereby establishing a material-locked connection between the damping element and the support member.

[0011] The present invention also relates to an electronic component comprising an electrical structural element, a carrier plate, and a support member as described above, particularly a housing or cooler. The carrier plate has a through-hole configured to receive a damping element of the electrical structural element. The damping element passes through this through-hole. The support member has a support region, particularly the inner surface of the support member, which contacts the free end of the damping element and provides support between the free end and the support region, and preferably also provides a fixed connection. The connection is preferably mechanical and can be force-locked, for example by an expansion element or frictional force; it can be material-locked, for example by a chemical reaction, melting process, or adhesive process, particularly by means of a two-component material; or it can be a shape-locked connection. A shape-locked connection can be, for example, a side-cut connection, or a button-type connection, such as a button, which may consist of a receiving portion and a button portion that can be fixed in the receiving portion.

[0012] The present invention also relates to an electronic component comprising a carrier plate having a through-hole, a support member, particularly a housing, and an electrical structural element, particularly a transformer or capacitor of significant weight. The electrical structural element includes an electrical contact on a first side, configured to provide electrical contact with the carrier plate. The electrical structural element also includes a damping element disposed between the electrical structural element and the support member. The damping element passes through the through-hole in the support plate. The damping element is disposed on the support member and has a free end with a contact device configured to establish a supportive and / or fixed connection with the electrical structural element.

[0013] The damping element is preferably constructed integrally with the support element. As mentioned above, the contact device can be a material-locking connection and / or a force-locking connection and / or a form-locking connection between the free end of the damping element and the support member.

[0014] Alternatively, in the electronic assembly, the damping element is not fixedly connected to the electrical structural element, but rather fixedly connected to a support. The aforementioned support and / or fixed connection between the free end of the damping element and the electrical structural element is then achieved.

[0015] Alternatively, the damping element can be a single, columnar component. Thus, the damping element has two free ends, each with the contact device described above. During assembly, the individual damping element can be held, for example, by means of an auxiliary device, and this auxiliary device can be removed after the assembly process. Thus, the damping element has contact devices at both free ends. Preferably, the contact devices are implemented identically at both free ends of the damping element.

[0016] Therefore, it is evident that, according to the present invention, the damping element can be arranged either on an electrical structural component, such as a transformer, or on a supporting member, particularly a housing or individual component. The corresponding free end of the damping element is in contact with and / or connected to another corresponding component for support. Thus, excellent damping functionality can be provided for electrical structural components with relatively large weights.

[0017] The electrical structural components are preferably the structural components with the highest weight located in the electronic components.

[0018] It should be noted that multiple electrical structural components can certainly be supported in the same manner as described above. For this, it is only necessary to provide multiple additional through holes in the support plate below the electrical structural component to be supported.

[0019] Furthermore, the present invention relates to a method for manufacturing the electronic component of the present invention. The electronic component includes an electrical structural element, a carrier plate, a support member, and a damping element. During the joining step for connecting the carrier plate, particularly a circuit board or substrate, to the support member, particularly a housing, support for the electrical structural element is simultaneously established on the support member. The support of the electrical structural element on the support member can be a detachable contact or a direct connection of the two members. The damping element is preferably fixedly arranged on the electrical structural element and the support occurs at the free end of the damping element, or the damping element is arranged on the support member and the support occurs at the free end of the electrical structural element. Alternatively, the damping element can be arranged on a separate structure, such as an assembly aid, which is removed after the joining process. Particularly preferred is that the damping element is integrally constructed with the electrical structural element or integrally constructed with the support member. Attached Figure Description

[0020] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The drawings show:

[0021] Figure 1 A schematic diagram of an electronic component according to a first embodiment of the present invention is shown, wherein the method of the present invention is illustrated.

[0022] Figure 2 Show Figure 1 A schematic cross-sectional view of the electronic components shown.

[0023] Figure 3 A schematic cross-sectional view of an electronic component according to a second embodiment of the present invention is shown.

[0024] Figure 4 A schematic cross-sectional view of an electronic component according to a third embodiment of the present invention is shown.

[0025] Figure 5A schematic diagram of an electronic component according to a fourth embodiment of the present invention is shown, wherein the method of the invention is illustrated.

[0026] Figure 6 A schematic cross-sectional view of an electronic component according to a fourth embodiment of the present invention is shown. Detailed Implementation

[0027] Preferably, the same components, elements and / or units in all the figures are given the same reference numerals.

[0028] The following will be referenced Figure 1 and Figure 2 The present invention describes in detail an electronic component 1 together with electrical structural elements 2, and a method for manufacturing the electronic component according to the present invention.

[0029] Figure 2 The assembly state of electronic component 1 is shown. Electronic component 1 includes an electrical structural element 2, which has a relatively large weight. The electrical structural element 2 is, for example, a transformer or a capacitor. The electrical structural element 2 is fixed to a support plate 3. Here, the electrical structural element 2 is electrically connected to and fixed to the support plate 3 via an electrical connection 6.

[0030] The carrier plate 3 is, for example, a circuit board. The carrier plate 3 has through holes 30.

[0031] The support plate 3 is connected to 7 ( Figure 2 The diagram only schematically shows the connection between the connector and the support member 4, especially the shell.

[0032] Electronic component 1 also includes a damping element 5, which in Figure 1 and Figure 2 The damping element 5 is schematically shown in the diagram. It is made of plastic and is fixed to the electrical structural element 2.

[0033] The damping element 5 is preferably constructed integrally with the electrical structural element 2, particularly with the casting block, which provides at least partial encapsulation of the electrical structural element 2. Thus, the encapsulation of the electrical structural element 2 and the damping element 5 can be manufactured in one step during the casting of the electrical structural element.

[0034] like Figure 1 As shown, the damping element 5 has a free end 51. The damping element 5 is arranged on the first side 20 of the electrical structural element 2. An electrical contact area 21 on the first side 20 for electrical connection with the support plate 3 is schematically shown.

[0035] The damping element 5 has a columnar shape, particularly a columnar or square shape. The through-hole 30 in the support plate 3 is configured to be slightly larger than the cross-section of the damping element 5. For example... Figure 1As indicated by arrow A, during the process of joining electrical structural component 2 to support plate 3, damping element 5 passes through through hole 30 in support plate 3. Damping element 5 here has a longitudinally extending dimension, such that... Figure 2 As shown, in the engagement state of the electrical structural element 2 on the support plate 3, the free end 51 is in contact with the support member 4.

[0036] A contact device 8 is arranged at the free end 51 of the damping element 5 to support the electrical structural element 2. The contact device 8 includes a plurality of expansion elements 80. During engagement, the free end 51 contacts the support member 4, causing the contact device 8 to expand the expansion elements 80. Figure 2 This status is displayed.

[0037] During this process, a force-locked connection is established between the contact device 8 on the free end 51 and the support member 4. In this embodiment, the contact device 8 has a plurality of expansion elements 80 arranged around the periphery of the damping element 5.

[0038] Here, a force-locking connection is established between the contact device 8 at the free end 51 and the support member 4. In this embodiment, the contact device 8 has a plurality of expansion elements 80 arranged circumferentially along the damping element 5.

[0039] Therefore, the heavy electrical structural component 2 can be damped immediately upon the occurrence of vibration. In particular, the damping element 5 prevents the electrical structural component 2 from vibrating and potentially damaging the electrical connection 6 or other electrical connections on the support plate 3, and in extreme cases, causing an interruption of electrical contact.

[0040] According to the invention, the damping element 5 can be engaged simultaneously when the support plate 3 is assembled onto the support member 4. Alternatively, it is also possible to first assemble only the support plate 3 onto the support member 4, and then fix the electrical structural element 2 together with the damping element 5 onto the support plate 3, wherein the damping element 5 passes through the through hole 30 and contacts the support member 4.

[0041] Figure 3 The electronic component 1 according to a second embodiment of the present invention is shown. Components that are identical or functionally identical to those described in the first embodiment have the same reference numerals. Unlike the first embodiment, in the second embodiment, a contact device 8 is provided on the free end 51 as a heat-deformation element 81. Heat deformation is schematically indicated by arrow B. Heat deformation can be achieved in various ways. For example, the support member 4 can be preheated so that the heat-deformation element 81 begins to melt when the free end 51 of the damping element 5 contacts the support member 4. Thus, a form-locking connection and a material-locking connection can also be achieved between the damping element 5 and the support member 4 (see [reference]). Figure 3 ).

[0042] Figure 4 An electronic component 1 according to a third embodiment of the present invention is shown. Here, the contact device 8 is designed as a chemically deformable element 82. A cutout 40 is provided on the support member 4, wherein the damping element 5 is chemically changeable, particularly upon contact, allowing material of the damping element 5 to flow into the cutout 40 in the support member 4. The contact area between the damping element 5 and the support member 4 is also increased by the chemically deformable element 82. The chemically deformable element 82 can be, for example, a two-component material having a first component on the damping element 5 and a second component on the support member 4. Once the first component comes into contact with the second component during the bonding process, a chemical reaction begins, which can change the polymerization state of the damping element 5, particularly from a solid polymerization state to a liquid or viscous polymerization state, making manufacturing easier. Figure 4 The connection shown is constructed in a shape-locking and material-locking manner.

[0043] Figure 5 and Figure 6 An electronic component 1 and method according to a fourth embodiment of the present invention are shown. Unlike the first embodiment, in the fourth embodiment, the damping element 5 is not arranged on the electronic structural element 2, but rather on the support member 4. The damping element 5 is preferably integrally manufactured with the support member 4. For engagement, in a first step, the electrical structural element 2 is electrically contacted and fixed to the electrical connector 6 on the carrier plate 3. Then, as... Figure 5 As indicated by arrow A, the joining step connects the bearing plate 3 to the support member 4. Figure 5 As shown, the electrical structural element 2 is positioned above the through hole 30, such that during engagement, the damping element 5 passes through the through hole 30 and contacts the first side 20 of the electrical structural element 2 pointing towards the support plate 3. Preferably, a notch 20a is provided on the first side 20, allowing the contact device 8, which in the fourth embodiment is a thermally deformable element 81, to widen within the notch between the electrical structural element 2 and the support plate 3. This allows for a form-locking connection between the damping element 5 and the electrical structural element 2, and if necessary, also between the damping element and the support plate 3. This form-locking connection can also be material-locking.

[0044] The common feature of all the embodiments described is that the damping element 5 can safely support heavy electrical structural components 2, such as transformers or electrolytic capacitors, on the support member 4. The damping element 5 prevents the heavy electrical structural components 2 from vibrating and immediately dampens vibrations that may occur during operation, especially in vehicles or similar equipment. This avoids damage, particularly to the electrical connections 6 and other components and connections on the support plate 3. The invention is highlighted here for its simple and low-cost solution. In particular, when the damping element 5 is integrally constructed with the electrical structural component 2, for example in the form of a cast block, or integrally constructed with the support member 4, for example in the form of an injection-molded housing, a very low-cost damping solution can be provided for heavy electrical structural components 2.

Claims

1. An electrical structural element configured for electrical contact with a support plate (3), comprising: - Damping element (5), said damping element is arranged on the first side (20) of the electrical structural element, - wherein the damping element (5) is configured as a column and protrudes beyond the first side (20) of the electrical structural element, and -A contact device (8) is provided on the free end (51) of the damping element (5), the contact device being configured to establish support on the support member (4).

2. The electrical structural element according to claim 1, wherein the electrical structural element has at least partially an encapsulation made of a casting block, and the damping element (5) is integrally manufactured with the encapsulation made of the casting block.

3. The electrical structural element according to claim 2, wherein the casting block is made of plastic material.

4. An electrical structural element according to any one of the preceding claims, wherein the contact device (8) provides a detachable support, particularly a force-locking connection, between the damping element (5) and the support member (4), and / or wherein the contact device (8) provides a material-locking connection between the damping element (5) and the support member (4), and / or wherein the contact device (8) provides a form-locking connection between the damping element (5) and the support member (4).

5. The electrical structural element according to claim 4, wherein the contact device (8) includes a heat-deformable element (81) at the free end (51), the heat-deformable element being meltable by heat.

6. The electrical structural element according to claim 4 or 5, wherein the contact device (8) includes an expansion element (80) at the free end (51) of the damping element (5), the expansion element being configured to perform an expansion process when the free end (51) is in mechanical contact with the support member (4).

7. The electrical structural element according to any one of claims 4 to 6, wherein the contact device (8) comprises a two-component material having a first component and a second component, wherein the first component is disposed on the free end (51) of the damping element (5) and the second component is disposed on the support member (4), and provides a material-locking connection between the damping element (5) and the support member (4) when the two components are in contact.

8. An electronic component, comprising: - Electrical structural element (2) according to any one of the preceding claims, - Support plate (3), and - Supporting components (4), - wherein the support plate (3) has a through hole (30) configured to receive and pass through the damping element (5), and -The support member (4) has a support area that contacts the free end (51) of the damping element (5) and provides support for the electrical structural element (2) on the support member (4) through the damping element (5).

9. An electronic component, comprising: - A support plate (3) with through holes (30), - Supporting components (4), - Electrical structural components (2), and - A damping element (5), said damping element being arranged between the electrical structural element (2) and the support member (4), - wherein the electrical structural element (2) is fixed to the support plate (3) and the damping element (5) passes through the through hole (30) in the support plate. -The damping element (5) is configured as a columnar shape. -The damping element (5) is arranged on the support member (4) and has a free end (51) including a contact device (8) configured to establish contact with the electrical structural element (2), or -The damping element (5) is a separate component and has contact devices (8) at both free ends of the damping element for contact with the support member (4) and with the electrical structural element (2).

10. A method for manufacturing an electronic component (1) having an electrical structural element (2), a carrier plate (3), a support member (4), and a damping element (5), wherein in a joining step for connecting the carrier plate (3) to the support member (4), the damping element (5) simultaneously establishes support for the electrical structural element (2) on the support member (4).

11. The method according to claim 10, wherein the support between the damping element (5) and the support member (4) is a force-locked connection and / or a material-locked connection and / or a shape-locked connection.

12. The method according to claim 10 or 11, wherein the damping element (5) is arranged on the electrical structural element (2) or on the support member (4) before the engagement step, or is a separate component that is positioned in the electronic assembly by means of an auxiliary device and is removed after the engagement step.

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