Cutting device

Abstract

To prevent contamination of the upper surface of a wafer while restricting water consumption.SOLUTION: Used cutting water is discharged in a -X direction from a machining point K1 and then collides with a third side surface 73 of a first-direction changer 70 to change its course to a direction oblique to the -X direction, along a direction in which the third side surface 73 extends. As a result, the used cutting water collides with a side wall 64 in an oblique direction and falls along the side wall 64 while flowing in a +Y direction. Therefore, it is possible to prevent the used cutting water having collided with the side wall 64 from splashing toward a cutting blade 51. This makes it possible to prevent the used cutting water from contaminating a cut surface of a wafer 100. In addition, it is not necessary to form a water layer on the upper surface of a wafer 100 in order to prevent contamination of the upper surface of the wafer 100. Therefore, an increase in the amount of water consumption can be prevented.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a cutting device. [Background technology]

[0002] As disclosed in Patent Documents 1 and 2, a cutting device that cuts a wafer by rotating a cutting blade while supplying cutting water is equipped with a mist suppression unit to prevent the cutting water from atomizing in the processing chamber due to the centrifugal force of the cutting blade. However, the configurations described in these documents require the provision of a mist suppression unit with a complex structure to prevent the cutting water from atomizing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2021-178394 [Patent Document 2] Japanese Patent Application Publication No. 2016-082083 [Patent Document 3] Japanese Patent Application Laid-Open No. 2017-094455 [Patent Document 4] Japanese Patent Publication No. 2022-064024 Summary of the Invention [Problem to be solved by the invention]

[0004] The cutting water contains cutting debris, which may bounce off the sidewall of the processing chamber, adhere to the blade cover, etc., and then drip down, contaminating the upper surface of the wafer.

[0005] For this reason, in the techniques disclosed in Patent Documents 3 and 4, a water layer is formed on the upper surface of the wafer during cutting. However, this technique consumes a large amount of water.

[0006] Therefore, an object of the present invention is to suppress contamination of the upper surface of the wafer while suppressing water consumption. [Means for solving the problem]

[0007] The cutting device of the present invention (the present cutting device) is a cutting device comprising: a chuck table that holds a wafer with a holding surface; a cutting unit that cuts the wafer with a cutting blade that rotates while supplying cutting water; a cutting feed mechanism that moves the chuck table and the cutting blade relatively in the cutting feed direction of the cutting blade that is parallel to the holding surface; and a processing chamber that accommodates at least the chuck table and the cutting blade, and the cutting unit is provided with a direction change section that changes the direction of the cutting water that is discharged parallel to the cutting feed direction from the processing point that is the contact point between the wafer and the cutting blade, to a direction oblique to the cutting feed direction.

[0008] In the cutting device, the direction changer may be configured to branch the direction of the cutting water into at least two directions.

[0009] The cutting device may further include a movement mechanism that moves the direction changer in the direction of the rotation axis of the cutting blade. [Effects of the Invention]

[0010] In this cutting machine, the cutting water used in cutting (used cutting water) is subjected to the centrifugal force of the rotating cutting blade and is discharged from the processing point parallel to the cutting feed direction. After being discharged from the processing point, the direction changer changes the course of the used cutting water to a diagonal direction relative to the cutting feed direction.

[0011] As a result, the used cutting water discharged from the processing point hits the side wall of the processing chamber at an angle and runs down the side wall. Therefore, the used cutting water that hits the side wall can be prevented from bouncing back toward the cutting blade. This makes it possible to prevent the used cutting water from contaminating the top surface of the wafer (the surface to be cut).

[0012] Furthermore, in this cutting device, there is no need to form a water layer on the upper surface of the wafer in order to suppress contamination of the upper surface of the wafer. Therefore, this cutting device can suppress contamination of the wafer while preventing an increase in water consumption. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 2 is a perspective view showing the configuration of a cutting device. [Figure 2] FIG. 2 is a side view showing the configuration of a processing chamber. [Figure 3] FIG. 3(a) is a top view showing the cutting unit during cutting in the case of down cutting, and FIG. 3(b) is a side view of the same. [Figure 4] FIG. 4(a) is a top view showing the cutting unit during cutting in the case of an upper cut, and FIG. 4(b) is a side view of the same. [Figure 5] FIG. 5(a) is a top view showing a cutting unit having a direction changer of another shape during cutting, and FIG. 5(b) is a side view of the same. [Figure 6] FIG. 6(a) is a top view showing a cutting unit equipped with a moving mechanism during cutting, and FIG. 6(b) is a side view of the same. [Figure 7] FIG. 10 is a top view showing the cutting unit equipped with the moving mechanism during cutting processing. DETAILED DESCRIPTION OF THE INVENTION

[0014] 1 is an example of a workpiece and has a roughly circular shape. A grid of dividing lines 102 is formed on the surface of the wafer 100. Various devices (not shown) are formed in each of the areas defined by the dividing lines 102.

[0015] A dicing tape 103 is attached to the back surface of the wafer 100. A ring frame 105 is attached to the outer periphery of the dicing tape 103. In this manner, the wafer 100 is processed in the cutting device 1 in the state of a work set 107 supported by the ring frame 105 via the dicing tape 103.

[0016] 1 is an example of a processing device, and performs cutting processing on a wafer 100. The cutting device 1 includes a base 10, a gate-type column 14 erected on the base 10, and a control unit 7 that controls each member of the cutting device 1.

[0017] An X-axis direction moving mechanism 30 is disposed on the base 10. The X-axis direction moving mechanism 30 is an example of a cutting feed mechanism that moves the chuck table 20 and the cutting blade 51 of the cutting unit 50 relatively in a cutting feed direction (X-axis direction) of the cutting blade 51 that is parallel to the holding surface 22 (see FIG. 2 ) of the chuck table 20. In this embodiment, the X-axis direction moving mechanism 30 moves the chuck table 20 along the X-axis direction relative to the cutting blade 51.

[0018] The X-axis direction movement mechanism 30 includes a pair of guide rails 31 extending in the X-axis direction, an X-axis table 33 placed on the guide rails 31, a ball screw 32 extending parallel to the guide rails 31, and a motor 34 that rotates the ball screw 32.

[0019] A pair of guide rails 31 are arranged on the upper surface of the base 10 parallel to the X-axis direction. The X-axis table 33 is installed on the pair of guide rails 31 so as to be slidable along these guide rails 31. The θ table 25 and the chuck table 20 are arranged on the X-axis table 33.

[0020] The ball screw 32 is threadedly engaged with a nut portion (not shown) provided on the X-axis table 33. The motor 34 is connected to one end of the ball screw 32 and rotates the ball screw 32. When the ball screw 32 is rotated, the X-axis table 33, the θ table 25, and the chuck table 20 move in the X-axis direction along the guide rails 31.

[0021] The chuck table 20 holds the wafer 100, which is the workpiece, on a holding surface 22 (see FIG. 2). In this embodiment, the wafer 100 is held by the chuck table 20 in the state of the work set 107 described above.

[0022] 2, the chuck table 20 has a holding surface 22 made of a porous material. The holding surface 22 can be connected to a suction source (not shown). The chuck table 20 uses the holding surface 22 to suction-hold the wafer 100 on the work set 107 via the dicing tape 103.

[0023] Four clamps 28 are provided around the periphery of the chuck table 20. The clamps 28 clamp and fix a ring frame 105 around the periphery of the wafer 100 held on the chuck table 20.

[0024] The chuck table 20 is supported by a θ table 25 disposed on the bottom side of the chuck table 20. As shown in FIG. 1, the θ table 25 is provided on the upper surface of the X-axis table 33 so as to be rotatable within the XY plane. The θ table 25 further includes a table motor 251 for rotating the θ table 25 and the table portion 21. Therefore, the θ table 25 not only supports the chuck table 20, but also can rotate the chuck table 20 within the XY plane.

[0025] 2, the cutting device 1 is also provided with a cover plate 24 that surrounds the periphery of the θ table 25, and a bellows cover 26 that is attached to the cover plate 24 and expands and contracts in the X-axis direction. The cover plate 24 and the bellows cover 26 are omitted from FIG.

[0026] As shown in FIG. 1, a gate-type column 14 is erected on the rear side (−X direction side) of the base 10 so as to straddle the X-axis direction movement mechanism 30.

[0027] A cutting unit moving mechanism 13 that moves the cutting unit 50 is provided on the front surface (the surface on the +X direction side) of the gate-type column 14. The cutting unit moving mechanism 13 indexes the cutting unit 50 in the Y-axis direction and cuts the cutting unit 50 in the Z-axis direction.

[0028] The cutting unit moving mechanism 13 includes a Z-axis direction moving mechanism 16 that moves the cutting unit 50 in the Z-axis direction, and a Y-axis direction moving mechanism 17 that moves the cutting unit 50 in the Y-axis direction.

[0029] The Y-axis direction moving mechanism 17 moves the cutting blade 51 of the cutting unit 50, which is a processing unit, toward and away from the chuck table 20 along the Y-axis direction. In this embodiment, the Y-axis direction moving mechanism 17 is configured to move the cutting blade 51 of the cutting unit 50 back and forth along the Y-axis direction relative to the chuck table 20.

[0030] In this embodiment, the Y-axis direction moving mechanism 17 is disposed in front of the gate-type column 14. The Y-axis direction moving mechanism 17 moves the Z-axis direction moving mechanism 16, which supports the cutting unit 50, back and forth along the Y-axis direction.

[0031] The Y-axis direction movement mechanism 17 includes a pair of guide rails 171 extending in the Y-axis direction, a Y-axis table 173 attached to the guide rails 171, a ball screw 170 extending parallel to the guide rails 171, and a motor 172 that rotates the ball screw 170.

[0032] A pair of guide rails 171 are arranged parallel to the Y-axis direction in front of the gate-type column 14. A Y-axis table 173 is installed on the pair of guide rails 171 so as to be slidable along these guide rails 171. A Z-axis direction moving mechanism 16 and a cutting unit 50 are attached to the Y-axis table 173.

[0033] The ball screw 170 is threadedly engaged with a nut portion (not shown) provided on the Y-axis table 173. The motor 172 is connected to one end of the ball screw 170 and rotates the ball screw 170. When the ball screw 170 is rotated, the Y-axis table 173, the Z-axis direction moving mechanism 16, and the cutting unit 50 move in the Y-axis direction along the guide rail 171.

[0034] The Z-axis direction movement mechanism 16 moves the cutting blade 51 of the cutting unit 50, which is a processing unit, toward and away from the chuck table 20 along the Z-axis direction. In this embodiment, the Z-axis direction movement mechanism 16 is configured to move the cutting unit 50 back and forth relative to the chuck table 20 along the Z-axis direction.

[0035] The Z-axis movement mechanism 16 includes a pair of guide rails 161 extending in the Z-axis direction, a support member 163 arranged on the guide rails 161, a ball screw 160 extending parallel to the guide rails 161, and a motor 162 that rotates the ball screw 160.

[0036] The pair of guide rails 161 are arranged parallel to the Z-axis direction on the Y-axis table 173. The support member 163 is installed on the pair of guide rails 161 so as to be slidable along these guide rails 161. The cutting unit 50 and the camera 182 are attached to the lower end of the support member 163.

[0037] The ball screw 160 is threadedly engaged with a nut portion (not shown) provided on the support member 163. The motor 162 is connected to one end of the ball screw 160 and rotates the ball screw 160. When the ball screw 160 is rotated, the support member 163 and the cutting unit 50 move in the Z-axis direction along the guide rail 161.

[0038] The camera 182 captures an image of the wafer 100 held on the holding surface 22 of the chuck table 20 and detects the cut portion of the wafer 100 .

[0039] The cutting unit 50 is an example of a processing unit, and cuts the wafer 100 held on the chuck table 20. The cutting unit 50 rotatably supports a cutting blade 51 that cuts the wafer 100. That is, the cutting unit 50 cuts the wafer 100 with the rotating cutting blade 51 while supplying cutting water.

[0040] Here, the cutting unit 50 and its surrounding structure will be described in detail.

[0041] As shown in FIG. 2, the cutting device 1 has a processing chamber 60 (not shown in FIG. 1) that covers the chuck table 20 and the cutting unit 50.

[0042] The processing chamber 60 accommodates at least the chuck table 20 and the cutting blade 51 of the cutting unit 50. The processing chamber 60 has a loading / unloading area 201 for loading and unloading the work set 107 onto and from the chuck table 20, and a processing area 202 for cutting the wafer 100 with the cutting unit 50. The loading / unloading area 201 and the processing area 202 are adjacent to each other in the X-axis direction.

[0043] 2, the processing chamber 60 includes an upper wall 61, side walls 62, 63 and 64, a protective member 65, and a partition plate 67. The lower portion of the processing chamber 60 is closed by a cover plate 24 and a bellows cover 26.

[0044] The upper wall 61 is formed across the loading / unloading area 201 and the processing area 202 along the XY plane, and covers the area above the chuck table 20 and the cutting unit 50. A through hole 611 is formed in the upper wall 61 in an area where the support member 163 of the Z-axis movement mechanism 16, which moves in the Y-axis and Z-axis directions, passes through. A protective member 65 is provided above the cutting unit 50, and is capable of closing the through hole 611.

[0045] A pair of side walls 62 are formed along the XZ plane across the loading / unloading area 201 and the machining area 202, and cover both sides of the chuck table 20 and the cutting unit 50 in the Y-axis direction. One of the side walls 62 is provided with an opening (not shown) for loading / unloading the work set 107 into / out of the loading / unloading area 201. The side wall 63 is formed along the YZ plane and covers the +X direction side of the loading / unloading area 201. The side wall 64 is formed along the YZ plane and covers the -X direction side of the machining area 202.

[0046] The partition plate 67 is formed in the processing chamber 60 along the YZ plane, similar to the side walls 63 and 64, and separates the loading / unloading area 201 from the processing area 202.

[0047] An opening 68 through which the chuck table 20 passes is formed below the partition plate 67. That is, the chuck table 20 can move back and forth between the loading / unloading area 201 and the processing area 202 by being moved along the X-axis direction via the opening 68 of the partition plate 67 by the X-axis direction moving mechanism 30.

[0048] The cutting unit 50 is disposed within the processing area 202. The cutting unit 50 processes the wafer 100 held on the chuck table 20 positioned in the processing area 202 along the planned dividing line 102 using a cutting blade 51 that rotates at high speed.

[0049] In addition to the cutting blade 51, the cutting unit 50 includes a spindle 52 that rotates with the cutting blade 51 attached, a housing 53 that rotatably supports the spindle (see FIG. 3(a)), and a motor (not shown) that rotates the spindle. That is, the cutting blade 51 is fixed to the tip of the spindle 52 that can be rotated by the motor.

[0050] Furthermore, as shown in FIG. 2, the cutting unit 50 includes a first blade cover 551 that covers the -X direction side and upper side of the cutting blade 51, a second blade cover 552 that covers the +X direction side and upper side of the cutting blade 51, and a blade cooling nozzle 56 and a cutting water nozzle 57 for supplying cutting water.

[0051] The blade cooling nozzle 56 and the cutting water nozzle 57 are examples of cutting water supply nozzles that supply cutting water to a machining chamber 60, which is a machining space.

[0052] A pair of blade cooling nozzles 56 are provided facing each other on both sides of the cutting blade 51. The pair of blade cooling nozzles 56 are attached to the -X direction side of the first blade cover 551 via a first support block 561. Cutting water is supplied to the blade cooling nozzles 56 from a cutting water supply source (not shown) via the supply member 54 and a cutting water passage 541 in the first support block 561. The blade cooling nozzles 56 spray the supplied cutting water laterally toward the cutting blade 51.

[0053] The cutting water nozzle 57 is attached to the +X direction side of the second blade cover 552 via a second support block 571. The cutting water nozzle 57 supplies cutting water supplied from a cutting water supply source from the +X direction side of the cutting blade 51 to a processing point, for example, a contact point between the cutting blade 51 and the wafer 100.

[0054] The cutting unit 50 also includes a first direction changer (drainage fender) 70. As shown in FIG. 3(a), the first direction changer 70 has a generally triangular prism shape with a triangular base parallel to the XY plane. The first direction changer 70 has a first side surface 71 extending along the X-axis direction, a second side surface 72 extending along the Y-axis direction perpendicular to the first side surface 71, and a third side surface 73 facing the cutting blade 51 and tilting with respect to the X-axis and Y-axis directions. In this embodiment, the third side surface 73 extends so as to tilt toward the +Y direction as it advances in the -X direction.

[0055] The first direction change section 70 having such a shape changes the direction of the cutting water (used cutting water) used in the cutting process, which is discharged parallel to the cutting feed direction (X-axis direction) from the processing point K1, which is the cutting position of the cutting blade 51 on the wafer 100, to an oblique direction toward the Y-axis direction relative to the cutting feed direction (X-axis direction) by the third side surface 73.

[0056] For this reason, the first direction change section 70 is positioned on the side in which used cutting water is drained from the processing point K1, i.e., rearward of the processing point K1 in the direction of rotation of the cutting blade 51 (on the side in the direction of movement of the lower end of the cutting blade 51 at the processing point K1).

[0057] 3(a) and 3(b), during cutting, the chuck table 20 holding the wafer 100 moves in the direction of arrow 301 (-X direction), and the cutting blade 51 rotates in the direction indicated by arrow 302 (down cut). Therefore, the first direction changer 70 is disposed on the movement direction side of the lower end of the cutting blade 51 at the processing point K1, i.e., on the -X direction side of the cutting blade 51. Specifically, the first direction changer 70 is attached to the lower surface of the first support block 561 so as to be disposed between the pair of blade cooling nozzles 56.

[0058] 1 includes a CPU that performs arithmetic processing according to a control program, a storage medium such as a memory, etc. The control unit 7 executes various processes and controls each component of the cutting device 1.

[0059] The wafer processing method controlled by the control unit 7 will be described below.

[0060] [Holding process] In this step, the control unit 7 controls a transfer device (not shown) to place the wafer 100 of the work set 107 on the holding surface 22 of the chuck table 20 located in the loading / unloading area 201 in the processing chamber 60 shown in FIG. 2, and the wafer 100 is suction-held by the holding surface 22. Furthermore, the control unit 7 clamps and fixes the ring frame 105 of the work set 107 with the clamp 28. As a result, the work set 107 is held by the chuck table 20.

[0061] [Processing process] After the holding step, the processing step is carried out. In the processing step, the wafer 100 is cut by the rotating cutting blade 51 while cutting water is supplied by the blade cooling nozzle 56 and the cutting water nozzle 57. In this step, the wafer 100 is cut along the plurality of planned dividing lines 102 shown in FIG. 1.

[0062] Specifically, the control unit 7 first controls the X-axis direction moving mechanism 30 to place the chuck table 20 holding the wafer 100 in the processing area 202 in the processing chamber 60 as shown in Fig. 2. Then, the control unit 7 controls the θ table 25, the X-axis direction moving mechanism 30, and the Y-axis direction moving mechanism 17 shown in Fig. 1 to make one planned dividing line 102 on the wafer 100 held on the chuck table 20 parallel to the X-axis and to place it in a position where it can be cut by the cutting blade 51.

[0063] 3(b), the control unit 7 controls the Z-axis direction moving mechanism 16 to adjust the height of the cutting blade 51 and rotates the cutting blade 51 at high speed as indicated by arrow 302. Furthermore, the control unit 7 controls the X-axis direction moving mechanism 30 to move the chuck table 20 holding the wafer 100 in the -X direction as indicated by arrow 301. As a result, the rotating cutting blade 51 cuts the wafer 100 along one of the planned dividing lines 102.

[0064] Then, the control unit 7 cuts the wafer 100 along all of the planned dividing lines 102 on the wafer 100. Thereafter, the control unit 7 removes the work set 107 including the wafer 100 from the chuck table 20 in the processing chamber 60, and controls a transfer device (not shown) to carry the work set 107 out of the processing chamber 60.

[0065] During the machining process, the control unit 7 connects a cutting water supply source (not shown) to the blade cooling nozzle 56 and the cutting water nozzle 57, thereby supplying cutting water to the cutting blade 51 from the blade cooling nozzle 56 and the cutting water nozzle 57.

[0066] At this time, the cutting water (used cutting water) used in the cutting process, containing cutting chips, is subjected to the centrifugal force of the rotating cutting blade 51 and is discharged from the outer edge of the cutting blade 51 at the processing point K1 in the -X direction.

[0067] In this embodiment, the used cutting water is discharged from the machining point K1 in the -X direction, and then collides with the third side surface 73 of the first direction changer 70, as shown by arrow 303 in Fig. 3(a), and changes course in a direction diagonal to the -X direction (toward the +Y direction) along the direction in which the third side surface 73 extends. That is, the direction of the used cutting water discharged from the machining point K1 in parallel to the cutting feed direction (-X direction) is changed by the first direction changer 70 to a direction diagonal to the +Y direction side with respect to the -X direction.

[0068] As a result, the used cutting water discharged from the processing point K1 collides with the sidewall 64 of the processing chamber 60 in a direction oblique to the -X direction, which is a direction perpendicular to the sidewall 64, and flows along the +Y direction while running down the sidewall 64. Therefore, in this embodiment, the used cutting water that collides with the sidewall 64 can be prevented from bouncing back toward the cutting blade 51. This makes it possible to prevent the used cutting water from adhering to the first blade cover 551 of the cutting unit 50, etc., and then dripping down and contaminating the upper surface (cutting surface) of the wafer 100. In this way, in this embodiment, the contamination of the upper surface of the wafer 100 can be prevented using the first direction changer 70 with a simple structure.

[0069] Furthermore, in this embodiment, it is not necessary to form a water layer on the upper surface of the wafer 100 in order to suppress contamination of the upper surface of the wafer 100. Therefore, in this embodiment, it is possible to suppress contamination of the wafer 100 while preventing an increase in water consumption.

[0070] As shown in Figures 4(a) and 4(b), during cutting, the chuck table 20 holding the wafer 100 may move in the direction of arrow 301 (-X direction), and the cutting blade 51 may rotate in the direction shown by arrow 304 (upper cut).

[0071] In this case, the cutting unit 50 has a second direction changer 80 instead of the first direction changer 70. This second direction changer 80 also changes the direction of the used cutting water used in the cutting process, which is discharged parallel to the cutting feed direction (X-axis direction) from the processing point K1, which is the cutting position of the cutting blade 51 in the wafer 100, to an oblique direction toward the Y-axis direction with respect to the cutting feed direction (X-axis direction).

[0072] The second direction changer 80 is disposed on the movement direction side of the lower end of the cutting blade 51 at the processing point K1, i.e., on the +X direction side of the cutting blade 51. Specifically, the first direction changer 70 is attached to the lower surface of the second blade cover 552. In this configuration, the cutting unit 50 does not have the cutting water nozzle 57 and the second support block 571.

[0073] Similar to the first direction changer 70, the second direction changer 80 has a roughly triangular prism shape with a triangular base parallel to the XY plane. As shown in Fig. 4(a), the second direction changer 80 has a first side surface 81 extending along the X-axis direction, a second side surface 82 extending along the Y-axis direction perpendicular to the first side surface 81, and a third side surface 83 facing the cutting blade 51 while being inclined with respect to the X-axis direction and the Y-axis direction. The third side surface 83 extends so as to be inclined toward the +Y direction as it advances in the +X direction.

[0074] In this configuration, in the machining process, the control unit 7 connects a cutting water supply source (not shown) to the blade cooling nozzle 56, thereby supplying cutting water to the cutting blade 51 from the blade cooling nozzle 56.

[0075] At this time, the used cutting water containing machining chips is subjected to the centrifugal force of the rotating cutting blade 51 and is discharged from the outer periphery of the cutting blade 51 at the machining point K1 in the +X direction.

[0076] Then, after being discharged from the machining point K1 in the +X direction, the used cutting water collides with the third side surface 83 of the second direction change unit 80, as shown by arrow 305 in Fig. 4(a), and changes course in a direction diagonal to the +X direction (+Y direction side) along the direction in which the third side surface 83 extends. In other words, the direction of the used cutting water discharged from the machining point K1 in a direction parallel to the cutting feed direction (+X direction) is changed by the second direction change unit 80 to a direction diagonal to the +X direction (+Y direction side).

[0077] As a result, the used cutting water discharged from the processing point K1 collides with the side wall 63 of the processing chamber 60 in a direction oblique to the +X direction, which is a direction perpendicular to the side wall 63, and flows along the +Y direction while running down the side wall 63. Therefore, it is possible to prevent the used cutting water that collides with the side wall 63 from bouncing back toward the cutting blade 51. As in the above-described embodiment, it is possible to prevent the used cutting water from adhering to the second blade cover 552 of the cutting unit 50, etc., and then dripping down to contaminate the top surface of the wafer 100. 3(a) and 3(b), in an upper cut, the first direction change unit 70 may be used by rotating the cutting blade 51 in the direction indicated by the arrow 302 and moving the chuck table 20 in the direction opposite to the direction indicated by the arrow 301 (-X direction) (+X direction). The direction of used cutting water discharged from the machining point K1 in parallel to the -X direction is changed by the first direction change unit 70 to an oblique direction toward the +Y direction with respect to the -X direction.

[0078] The direction changer provided in the cutting unit 50 may be configured to branch the direction of the used cutting water into at least two directions. 5(a) and 5(b), the cutting unit 50 has a third direction changer 90 instead of the first direction changer 70 and the second direction changer 80. This third direction changer 90 also changes the direction of used cutting water used in cutting, which is discharged parallel to the cutting feed direction (X-axis direction) from the processing point K1, which is the cutting position of the cutting blade 51 in the wafer 100, to an oblique direction toward the Y-axis direction with respect to the cutting feed direction (X-axis direction).

[0079] 5(a) and 5(b), during cutting, the chuck table 20 holding the wafer 100 moves in the direction of arrow 301 (-X direction), and the cutting blade 51 rotates in the direction shown by arrow 302 (down cut). Therefore, used cutting water is discharged from the processing point K1 in the -X direction.

[0080] As shown in Figure 5(b), the third direction changer 90 is attached to the underside of the first support block 561 in the cutting unit 50 so as to be positioned between a pair of blade cooling nozzles 56, similar to the first direction changer 70 shown in Figure 3(b).

[0081] 5(a), the third direction changer 90 has a roughly triangular prism shape with a triangular (approximately isosceles) base parallel to the XY plane. The third direction changer 90 has a first side surface 91 extending along the Y-axis direction, and a second side surface 92 and a third side surface 93 facing the cutting blade 51 while being inclined with respect to the X-axis direction and the Y-axis direction. The second side surface 92 extends so as to be inclined toward the +Y direction as it advances in the -X direction. The third side surface 93 extends so as to be inclined toward the -Y direction as it advances in the -X direction.

[0082] In this configuration, during the machining process, the control unit 7 connects a cutting water supply source (not shown) to the blade cooling nozzle 56 and the cutting water nozzle 57, thereby supplying cutting water to the cutting blade 51 from the blade cooling nozzle 56 and the cutting water nozzle 57.

[0083] At this time, the used cutting water containing machining chips is subjected to the centrifugal force of the rotating cutting blade 51 and is discharged from the outer periphery of the cutting blade 51 at the machining point K1 in the -X direction.

[0084] Then, after being discharged from the machining point K1 in the -X direction, the used cutting water collides with the vicinity of the contact point (corner) between the second side surface 92 and the third side surface 93 of the third direction changer 90, as shown in Fig. 5(a). Then, as shown by arrow 306, a part of the used cutting water changes its course in a direction diagonal to the -X direction (toward the +Y direction) along the direction in which the second side surface 92 extends. Furthermore, as shown by arrow 307, another part of the used cutting water changes its course in a direction diagonal to the -X direction (toward the -Y direction) along the direction in which the third side surface 93 extends. In other words, the direction of the used cutting water discharged from the machining point K1 in a direction parallel to the cutting feed direction (-X direction) is changed by the third direction changer 90 to a direction diagonal to the -X direction.

[0085] As a result, the used cutting water discharged from the processing point K1 collides with the side wall 64 of the processing chamber 60 in a direction oblique to the -X direction, which is a direction perpendicular to the side wall 64, and flows along the +Y direction or the -Y direction while running down the side wall 64. Therefore, the used cutting water that collides with the side wall 64 can be prevented from bouncing back toward the cutting blade 51. As in the above-described embodiment, it is possible to prevent the used cutting water from adhering to the first blade cover 551 of the cutting unit 50, dripping down, and contaminating the top surface of the wafer 100. The third direction changer 90 may be configured to branch the direction of the used cutting water into three or more directions.

[0086] The cutting device 1 (cutting unit 50) may also be provided with a movement mechanism that moves the first direction changer 70, the second direction changer 80, or the third direction changer 90 in the direction of the rotation axis of the cutting blade 51 (Y-axis direction).

[0087] 6(a) and 6(b), the cutting unit 50 has a movement mechanism 95 for moving the third direction changer 90 shown in FIGS. 5(a) and 5(b). The movement mechanism 95 is disposed in the first support block 561, and is configured to move the third direction changer 90 along the Y-axis direction.

[0088] In this configuration, in the machining process, the control unit 7 connects a cutting water supply source (not shown) with the blade cooling nozzle 56 and the cutting water nozzle 57, thereby supplying cutting water from the blade cooling nozzle 56 and the cutting water nozzle 57 to the cutting blade 51. In addition, the control unit 7 controls, for example, the movement mechanism 95 to move the third direction change unit 90 in the +Y direction as indicated by arrow 310.

[0089] At this time, the used cutting water containing machining chips is subjected to the centrifugal force of the rotating cutting blade 51 and is discharged from the outer periphery of the cutting blade 51 at the machining point K1 in the -X direction.

[0090] Then, the used cutting water is discharged from the machining point K1 in the -X direction, and then collides with the third side surface 93 of the third direction changer 90, which has been moved in the +Y direction, as shown in Fig. 6(a). Then, the used cutting water changes course in a direction diagonal to the -X direction (towards the -Y direction) along the direction in which the third side surface 93 extends, as shown by arrow 307. That is, the direction of the used cutting water discharged from the machining point K1 in a direction parallel to the cutting feed direction (-X direction) is changed by the third direction changer 90 to a direction diagonal to the -X direction.

[0091] As a result, the used cutting water discharged from the processing point K1 collides with the side wall 64 of the processing chamber 60 in a direction oblique to the -X direction, which is a direction perpendicular to the side wall 64, and flows along the -Y direction while running down the side wall 64. Therefore, the used cutting water that collides with the side wall 64 can be prevented from bouncing back toward the cutting blade 51. As in the above-described embodiment, it is possible to prevent the used cutting water from adhering to the first blade cover 551 of the cutting unit 50, dripping down, and contaminating the top surface of the wafer 100.

[0092] In this configuration, the control unit 7 may also control the moving mechanism 95 to move the third direction changer 90 in the -Y direction, as shown in FIG. 7 , as indicated by arrow 311. In this case, the used cutting water is discharged from the machining point K1 in the -X direction and then collides with the second side surface 92 of the third direction changer 90 moved in the -Y direction. Then, as indicated by arrow 306, the used cutting water changes course in a direction oblique to the -X direction (toward the +Y direction) along the direction of extension of the second side surface 92. As a result, the used cutting water collides with the side wall 64 of the machining chamber 60 in a direction oblique to the -X direction and flows down the side wall 64 while flowing in the +Y direction. This prevents the used cutting water that collides with the side wall 64 from bouncing back toward the cutting blade 51.

[0093] In this way, in a configuration having the movement mechanism 95, the control unit 7 can adjust the flow direction (+Y direction or -Y direction) of the used cutting water. Therefore, the operator can better prevent the used cutting water from contaminating the equipment or the workpiece. [Explanation of symbols]

[0094] 1: cutting device, 7: control unit, 10: base, 13: cutting unit moving mechanism, 14: Gate column, 16: Z-axis direction movement mechanism, 17: Y-axis direction movement mechanism, 20: chuck table, 21: table portion, 22: holding surface, 24: cover plate, 25: θ table, 26: bellows cover, 28: clamp, 30: X-axis direction movement mechanism, 31: guide rail, 32: ball screw, 33: X-axis table, 34: motor, 50: cutting unit, 51: cutting blade, 52: spindle, 53: housing, 54: supply member, 56: blade cooling nozzle, 57: cutting water nozzle, 60: machining chamber, 61: upper wall, 62: side wall, 63: side wall, 64: Side wall, 65: Protective member, 67: Partition plate, 68: Opening, 70: First direction change portion, 71: First side surface, 72: Second side surface, 73: Third side surface, 80: second direction change portion, 81: first side surface, 82: second side surface, 83: third side surface, 90: third direction change portion, 91: first side surface, 92: second side surface, 93: third side surface, 95: Movement mechanism, 100: wafer, 102: planned dividing line, 103: dicing tape, 105: Ring frame, 107: Work set, 160: ball screw, 161: guide rail, 162: motor, 163: support member, 170: Ball screw, 171: Guide rail, 172: Motor, 173: Y-axis table, 182: camera, 201: loading / unloading area, 202: processing area, 251: table motor, 541: cutting channel, 551: first blade cover, 552: second blade cover, 561: first support block, 571: second support block, 611: Through hole, K1: Machining point,

Claims

1. A cutting device comprising: a chuck table that holds a wafer by a holding surface; a cutting unit that cuts the wafer by a cutting blade that rotates while cutting water is supplied; a cutting feed mechanism that moves the chuck table and the cutting blade relatively in a cutting feed direction of the cutting blade that is parallel to the holding surface; and a processing chamber that houses at least the chuck table and the cutting blade, The cutting unit includes a direction changer that changes the direction of the cutting water discharged parallel to the cutting feed direction from a processing point, which is a contact point between the wafer and the cutting blade, to a direction oblique to the cutting feed direction. cutting equipment.

2. The direction change unit branches the direction of the cutting water into at least two directions. The cutting device according to claim 1.

3. Further provided is a movement mechanism that moves the direction changer in the direction of the rotation axis of the cutting blade.

3. The cutting device according to claim 1 or 2.

Images