Machining apparatus

Abstract

To prevent fluid containing machining chips and mist-like machining water from moving from a first machining chamber being a space where machining chips larger in size than machining chips generated in a second machining chamber may be generated, to the second machining chamber.SOLUTION: A machining apparatus for machining a workpiece comprises: a first machining unit; a second machining unit; a first machining chamber cover including a first machining chamber; a second machining chamber cover including a second machining chamber spatially connected to the first machining chamber; a first suction pipe portion connected to the first machining chamber cover; and a second suction pipe portion connected to the second machining chamber cover. The first machining chamber is a space where machining chips larger in size than the second machining chamber may be generated . During operation of the first machining unit and the second machining unit, the gauge pressures of the first machining chamber and the second machining chamber are negative, and the pressure of the second machining chamber is adjusted to be higher than the pressure of the first machining chamber, thereby generating an airflow heading from the second machining chamber toward the first machining chamber.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus for processing a workpiece by grinding, polishing, or the like. [Background technology]

[0002] In the manufacturing process of semiconductor devices, for example, after forming multiple devices such as ICs (Integrated Circuits) on the front surface of a wafer, the back surface of the wafer is ground using a grinding device to thin it, and then this thinned wafer is divided into device units using a cutting device.

[0003] In processing equipment such as grinding equipment and cutting equipment, a wafer held by suction on a chuck table is placed in a processing chamber partitioned by a processing chamber cover, and processing such as grinding and cutting is performed on the wafer while processing water such as pure water is supplied to the contact area between the processing tool and the wafer.

[0004] During machining, cutting chips, grinding chips, and other machining chips are generated. Some of these machining chips mix with mist-like machining water (see, for example, Patent Document 1) and fill the machining chamber. If the scattered machining chips adhere to the inner wall of the machining chamber cover, the inside of the machining chamber will be contaminated.

[0005] Furthermore, if machining debris or mist-like machining water adheres to the inner surface of the transparent plate installed in the window of the machining chamber cover, it becomes difficult to see inside the machining chamber cover from the outside. In this way, if machining debris, machining water, etc. adhere to the inside of the machining chamber cover, it will have a negative effect on the machining equipment.

[0006] Furthermore, if processing debris is scattered outside the processing chamber cover and into the space inside the processing device, which is partitioned by an exterior panel or the like, problems such as (i) contamination of the inside of the processing device, (ii) contamination of wafers transported by a transport device inside the processing device before and after processing, and (iii) cracking of wafers that are sucked, held, gripped, etc. by the transport device may occur.

[0007] To avoid such problems, an exhaust port is provided in the processing chamber cover, and processing debris and mist-like processing water are discharged from inside the processing chamber cover to the outside of the processing device through an exhaust duct connected to the exhaust port.

[0008] Incidentally, when multiple processing units, each having a spindle and a processing tool (grinding wheel, polishing wheel, etc.) attached to the lower end of the spindle, are provided in one processing device, multiple chuck tables are arranged on a disc-shaped turntable.

[0009] A number of linear partition plates are radially arranged on the top surface of the turntable, and one chuck table is provided in each fan-shaped area separated by the partition plates. As the turntable rotates, each chuck table can be moved to a different processing chamber (rough grinding chamber, finish grinding chamber, etc.) covered by a separate cover member.

[0010] A rough grinding wheel fixed to the lower end of the first spindle is placed in the rough grinding chamber where rough grinding of the wafer is performed, and a finish grinding wheel fixed to the lower end of the second spindle is placed in the finish grinding chamber where finish grinding of the wafer is performed. The rough processing chamber and the finish processing chamber are each exhausted through individual exhaust ducts.

[0011] However, the first side plate of the first processing chamber cover, which separates the rough grinding chamber, and the second side plate of the second processing chamber cover, which separates the finish grinding chamber, are in contact with each other, and when the turntable is stationary, a small slit-like gap is formed between the first and second side plates and the partition plate located directly below the first and second side plates to enable rotational movement of the turntable.

[0012] These minute gaps can cause processing debris and mist-like processing water to move between adjacent processing chambers. In particular, if processing debris generated in the rough processing chamber enters the finish processing chamber, it can cause defects such as scratches and cracks on the wafers when they are processed with the finish grinding wheel. [Prior art documents] [Patent documents]

[0013] [Patent Document 1] Japanese Patent Application Publication No. 11-188568 Summary of the Invention [Problem to be solved by the invention]

[0014] The present invention has been made in consideration of the above problems, and aims to prevent a fluid containing machining debris and mist-like machining water from moving from the first machining chamber, which is a space where machining debris larger than that generated in the second machining chamber may be generated, to the second machining chamber. [Means for solving the problem]

[0015] According to one aspect of the present invention, there is provided a processing device for processing a workpiece, comprising: a first processing unit having a first spindle and a first processing tool attached to a lower end of the first spindle; a second processing unit having a second spindle and a second processing tool attached to a lower end of the second spindle; a first processing chamber cover having a first side plate and a first top plate and capable of accommodating the first processing tool in a first processing chamber defined by at least the first side plate and the first top plate; and a second side plate and a second top plate and capable of accommodating the second processing tool in a second processing chamber defined by at least the second side plate and the second top plate, the first side plate and the second side plate being the boundary between the first side plate and the second side plate. A processing device is provided, which comprises a second processing chamber cover spatially connecting a first processing chamber and a second processing chamber, a first suction pipe section connected to the first processing chamber cover, and a second suction pipe section connected to the second processing chamber cover, wherein the first processing chamber is a space where processing chips larger in size than the second processing chamber may be generated due to differences between the first processing tool and the second processing tool, and while the first processing unit and the second processing unit are operating, the gauge pressures of the first processing chamber and the second processing chamber are negative, and the pressure of the second processing chamber is adjusted to be higher than the pressure of the first processing chamber, so that an airflow is generated from the second processing chamber toward the first processing chamber.

[0016] Preferably, the processing device further comprises: a third processing unit having a third spindle, with a polishing tool attached to the lower end of the third spindle; a third side plate and a third top plate, with the polishing tool being able to be accommodated in a third processing chamber partitioned by at least the third side plate and the third top plate, a third processing chamber cover spatially connecting the second processing chamber and the third processing chamber with the third side plate and a fourth side plate constituting the second processing chamber cover as the boundary; and a third suction pipe section connected to the third processing chamber cover, wherein the second processing chamber is a space in which processing chips larger in size than the third processing chamber may be generated due to differences between the second processing tool and the polishing tool, and during operation of the second processing unit and the third processing chamber, the gauge pressures of the second processing chamber and the third processing chamber are negative, and the pressure in the third processing chamber is adjusted to be higher than the pressure in the second processing chamber, so that an airflow is generated from the third processing chamber to the second processing chamber.

[0017] Also, preferably, the first suction pipe section and the second suction pipe section are connected to a first vacuum generating device that generates negative pressure, the third suction pipe section is connected to a second vacuum generating device different from the first vacuum generating device, the pressure difference between the first processing chamber and the second processing chamber is adjusted by a vacuum regulator or a leak valve provided in the second suction pipe section, and the pressure difference between the second processing chamber and the third processing chamber reflects the difference between the negative pressure generated by the first vacuum generating device and adjusted by the vacuum regulator or the leak valve, and the negative pressure generated by the second vacuum generating device.

[0018] Preferably, the first suction pipe section, the second suction pipe section, and the third suction pipe section are connected to a first vacuum generating device that generates negative pressure, and the pressure difference between the first processing chamber and the second processing chamber is adjusted by a vacuum regulator or a leak valve provided in the second suction pipe section, and the pressure difference between the second processing chamber and the third processing chamber is adjusted by a vacuum regulator or a leak valve provided in the third suction pipe section. [Effects of the Invention]

[0019] In a processing device according to one aspect of the present invention, while the first processing unit and the second processing unit are operating, the gauge pressures of the first processing chamber and the second processing chamber are negative, and the pressure of the second processing chamber is higher than the pressure of the first processing chamber, thereby generating an airflow from the second processing chamber toward the first processing chamber.

[0020] Therefore, when a workpiece is machined with a first machining tool and also with a second machining tool, machining chips can be prevented from entering the second machining chamber from the first machining chamber, which is a space where machining chips larger than those generated in the second machining chamber may be generated. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. [Figure 2] FIG. [Figure 3] 3 is a cross-sectional view of FIG. 2 taken along line B-B. [Figure 4] 3 is a cross-sectional view taken along CC in FIG. 2. [Figure 5] FIG. 2 is a block diagram showing the connection relationship between a plurality of processing chambers and a plurality of vacuum generating devices. [Figure 6] FIG. 10 is a block diagram showing the connection relationship between a plurality of processing chambers and one vacuum generating device in the second embodiment. [Figure 7] FIG. 10 is a block diagram showing a modified example of the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0022] (First embodiment) An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view of a grinding / polishing apparatus (processing apparatus) 2, and Fig. 2 is a plan view of the grinding / polishing apparatus 2. In Fig. 1, some of the components are shown in functional blocks. In Figs. 1 and 2, the X-axis direction (left-right direction), Y-axis direction (front-back direction), and Z-axis direction (up-down direction) are perpendicular to each other.

[0023] The grinding / polishing device 2 has a rectangular parallelepiped base 4 that supports the components. A recess 4a is formed in the front of the base 4 (on one side along the Y-axis direction), and a transfer robot 6 that transfers the workpiece 11 is provided in this recess 4a.

[0024] The transport robot 6 has a multi-joint link structure. A fork-shaped hand unit called an end effector is provided at the tip of the topmost stage of the multi-joint link. Each hand unit is provided with a plurality of disk-shaped suction pads (not shown), and the hand unit can suck and hold the workpiece 11 without contact.

[0025] Two mounting tables 8a and 8b are provided on the front side of the recess 4a so as to protrude forward from the front end of the base 4. A cassette 10a containing one or more workpieces 11 is placed on the mounting table 8a, and a cassette 10b containing one or more workpieces 11 is also placed on the mounting table 8b.

[0026] Each workpiece 11 is disk-shaped and has a single crystal substrate made of a semiconductor material such as silicon, silicon carbide, gallium nitride, etc. For example, a plurality of planned division lines are set in a lattice pattern on the surface of the workpiece 11, and a device such as an IC (Integrated Circuit) is formed in each of the rectangular regions defined by the plurality of planned division lines.

[0027] No such devices are formed on the back surface of the workpiece 11, and the single crystal substrate is exposed. The grinding and polishing device 2 processes the workpiece 11 by grinding, polishing, etc. the back surface of the workpiece 11.

[0028] A positioning table 12 is provided in the area behind the recess 4a (the other side along the Y-axis direction) and adjacent to the recess 4a in the X-axis direction, for determining the position of the workpiece 11 transported by the transport robot 6 at a predetermined position within the XY plane.

[0029] The positioning table 12 has a disk-shaped table 12a with a diameter smaller than that of the workpiece 11, and a plurality of positioning pins 12b arranged at approximately equal intervals along the circumferential direction of the table 12a on the radial outside of the table 12a.

[0030] Each positioning pin 12b moves an equal distance radially of the table 12a and comes into contact with the outer edge of the workpiece 11 placed on the table 12a, thereby adjusting the position of the workpiece 11 to a predetermined position within the XY plane relative to the base 4.

[0031] A disk-shaped turntable 16 is provided near the positioning table 12, and is provided with a plurality of (four in this embodiment) chuck tables 14. A rotation shaft (not shown) having a longitudinal portion disposed along the Z-axis direction is fixed to the underside of the turntable 16.

[0032] By rotating this rotation shaft with a rotation drive source (not shown) such as a motor, the turntable 16 can rotate either clockwise or counterclockwise in a plan view. A plurality of linear partition plates 16a are radially arranged on the top surface 16b of the turntable 16.

[0033] The upper surface 16b of the turntable 16 is divided into four sector-shaped areas by multiple partition plates 16a. The central angle of each sector is approximately 90 degrees. The sector-shaped area closest to the positioning table 12 is a loading / unloading area A1 where the workpiece 11 is loaded onto the turntable 16 or unloaded from the turntable 16 (see FIG. 2).

[0034] The fan-shaped area approximately 90 degrees clockwise from the loading / unloading area A1 in a planar view is the rough grinding area A2 for performing rough grinding on the workpiece 11, and the fan-shaped area approximately 180 degrees clockwise from the loading / unloading area A1 in a planar view is the finish grinding area A3 for performing finish grinding on the workpiece 11 (see Figure 2).

[0035] Furthermore, a fan-shaped area approximately 90 degrees counterclockwise from the loading / unloading area A1 in a plan view is a polishing area A4 where the workpiece 11 is polished (see FIG. 2). One chuck table 14 is provided in each of the loading / unloading area A1, the rough grinding area A2, the finish grinding area A3, and the polishing area A4.

[0036] Each chuck table 14 is selectively positioned in one of the carry-in / carry-out area A1, rough grinding area A2, finish grinding area A3, and polishing area A4 by rotation of the turntable 16. The chuck table 14 has a disk-shaped frame made of non-porous ceramics.

[0037] A disk-shaped recess is formed on the top surface of the frame, and a disk-shaped porous plate made of porous ceramics is fixed in this recess. A suction source (not shown), such as a vacuum pump, is connected to the frame, and negative pressure generated by the suction source is transmitted to the top surface of the porous plate via the frame. This suction source is housed in the base 4.

[0038] The upper surfaces of the frame and the porous plate are flush with each other and function as a holding surface 14a that suction-holds the workpiece 11. The holding surface 14a has a conical shape with the center protruding slightly (for example, by a predetermined value of 10 μm to 30 μm) compared to the outer periphery. A rotation shaft (not shown) is fixed to the underside of each chuck table 14, with its longitudinal direction aligned approximately parallel to the Z-axis direction.

[0039] The rotation axis of each chuck table 14 is tilted at a slight angle with respect to the Z-axis direction so that part of the cone shape is approximately parallel to the XY plane. When the rotation axis is rotated by a rotation drive source (not shown) such as a servo motor, the chuck table 14 rotates about the rotation axis.

[0040] A square pillar-shaped first support structure (not shown) is provided behind the rough grinding area A2 so as to protrude from the upper surface 4b of the base 4. A first grinding feed unit (not shown) is provided in front of the first support structure.

[0041] The first grinding feed unit includes a pair of Z-axis guide rails that are approximately parallel to the Z-axis direction, a Z-axis moving plate attached to the pair of Z-axis guide rails, a nut portion fixed to the back surface of the Z-axis moving plate, a screw shaft that is rotatably connected to the nut portion via multiple balls, and a drive source such as a motor connected to the upper end of the screw shaft.

[0042] A rough grinding unit (first processing unit) 20 is provided on the front surface of the Z-axis moving plate located in front of the first support structure. The rough grinding unit 20 has a holding member 22 fixed to the Z-axis moving plate and having a cylindrical cavity.

[0043] A cylindrical spindle housing 24 is disposed in the hollow portion of the holding member 22, and the spindle housing 24 is fixed to the holding member 22. As shown in FIG. 3, a portion of a cylindrical spindle (first spindle) 26 is rotatably accommodated within the spindle housing 24.

[0044] Figure 3 is a cross-sectional view taken along the line BB in Figure 2. The spindle 26 is disposed substantially parallel to the Z-axis direction. A rotational drive source 28 such as a motor is provided in the longitudinal center of the spindle 26. The upper surface of a disk-shaped wheel mount 30 is fixed to the lower end of the spindle 26.

[0045] An annular rough grinding wheel (first processing tool) 32 is attached to the lower surface of the wheel mount 30. In this manner, the rough grinding wheel 32 is attached to the lower end of the spindle 26 via the wheel mount 30.

[0046] The rough grinding wheel 32 has an annular wheel base 32a made of a metal material such as an aluminum alloy. A plurality of block-shaped rough grinding stones 32b are fixed to the underside of the wheel base 32a. The plurality of rough grinding stones 32b are arranged in an annular shape at approximately equal intervals along the circumferential direction of the wheel base 32a.

[0047] The circular grinding surface defined by the locus of the lower surface of the rough grinding wheel 32b is approximately parallel to the XY plane. The rough grinding wheel 32b has abrasive grains such as diamond or cBN (cubic boron nitride) and a binder such as ceramic or resin for fixing the abrasive grains.

[0048] A first grinding water supply nozzle (not shown) that supplies grinding water such as pure water to the contact area (ground area) between the workpiece 11 and the rough grinding stone 32b is provided directly below the rough grinding wheel 32. During rough grinding, grinding water is supplied to the ground area from the first grinding water supply nozzle.

[0049] When rough grinding the workpiece 11, the wheel mount 30 and the rough grinding wheel 32 are placed inside a first processing chamber cover 36 that defines a rough grinding chamber (first processing chamber) 34. In other words, when rough grinding, the rough grinding wheel 32 is housed in the rough grinding chamber 34.

[0050] The first machining chamber cover 36 has a substantially rectangular first top plate 36a. In this embodiment, the first top plate 36a is rectangular, but the first top plate 36a may be a square, pentagon, hexagon, or other shape. A through opening 36a1 having substantially the same diameter as the wheel mount 30 and the rough grinding wheel 32 is provided in the first top plate 36a.

[0051] The wheel mount 30 and the rough grinding wheel 32 can pass through the through opening 36a1 and enter and exit the rough grinding chamber 34. A front side plate 36b1, a rear side plate 36b2, a central side plate (first side plate) 36b3, and an outer side plate 36b4 are provided on each end of the first top plate 36a, each of which hangs down along the Z-axis direction (see FIG. 2).

[0052] As shown in FIG. 3, at least the central side plate 36b3 and the first top plate 36a define a rough grinding chamber 34 in the grinding / polishing apparatus 2.

[0053] More specifically, the rough grinding chamber 34, which is an approximately closed space, is defined by the first top plate 36a, front side plate 36b1, rear side plate 36b2, central side plate 36b3 and outer side plate 36b4, which each constitute the first processing chamber cover 36, two partition plates 16a located directly below the first processing chamber cover 36, the upper surface 16b of the turntable 16, the upper surface 4b of the base 4, etc.

[0054] When the turntable 16 is stationary, the front side plate 36b1 and the partition plate 16a on the turntable 16 located directly below the front side plate 36b1 are slightly spaced apart in the Z-axis direction, and a slit-shaped gap (not shown) is formed along the X-axis direction between the lower end of the front side plate 36b1 and the upper end of the partition plate 16a.

[0055] Similarly, when the turntable 16 is stationary, the central side plate 36b3 and the partition plate 16a on the turntable 16 located directly below the central side plate 36b3 are slightly separated in the Z-axis direction, and a slit-shaped gap 38 is formed along the Y-axis direction between the lower end of the central side plate 36b3 and the upper end of the partition plate 16a.

[0056] The top surface of each partition plate 16a in the Z-axis direction is located higher than the uppermost surface of the workpiece 11 held by suction on the holding surface 14a. The rough grinding chamber 34 is not completely closed due to gaps between the front side plate 36b1 and the partition plate 16a and gaps 38 between the center side plate 36b3 and the partition plate 16a. These gaps allow the turntable 16 to rotate without the partition plate 16a interfering with the first machining chamber cover 36.

[0057] A through opening 40 is formed in the rear side plate 36b2, and one end of a first suction pipe section 42 is connected to the through opening 40 of the rear side plate 36b2. The other end of the first suction pipe section 42 is connected to a first vacuum generator 44 that generates negative pressure.

[0058] The first vacuum generating device 44 includes, for example, a vacuum pump, but may also include an ejector, a vacuum blower, etc. The first vacuum generating device 44 is different from a suction source that supplies negative pressure to the chuck table 14, etc., and is not a component of the grinding / polishing apparatus 2.

[0059] The first vacuum generating device 44 is installed in a building (not shown) equipped with a clean room or the like, and is capable of supplying negative pressure to devices other than the grinding / polishing device 2. The first vacuum generating device 44 of this embodiment supplies negative pressure to the rough grinding chamber 34 and a finish grinding chamber 64, which will be described later.

[0060] 1, a square pillar-shaped second support structure (not shown) is provided behind the finish grinding area A3 so as to protrude from the upper surface 4b of the base 4. A second grinding feed unit (not shown) is provided in front of the second support structure.

[0061] Like the first grinding feed unit, the second grinding feed unit also includes a pair of Z-axis guide rails, a Z-axis moving plate, a nut portion, a screw shaft, a drive source, and the like.

[0062] A finish grinding unit (second processing unit) 50 is provided on the front surface of the Z-axis moving plate located in front of the second support structure. The finish grinding unit 50 has a holding member 52 fixed to the Z-axis moving plate and having a cylindrical cavity.

[0063] A cylindrical spindle housing 54 is disposed in the hollow portion of the holding member 52, and the spindle housing 54 is fixed to the holding member 52. As shown in FIG. 3, a portion of a cylindrical spindle (second spindle) 56 is rotatably accommodated within the spindle housing 54.

[0064] The spindle 56 is also disposed substantially parallel to the Z-axis direction. A rotation drive source 58 such as a motor is provided at the longitudinal center of the spindle 56. The upper surface of a disk-shaped wheel mount 60 is fixed to the lower end of the spindle 56.

[0065] An annular finish grinding wheel (second processing tool) 62 is attached to the lower surface of the wheel mount 60. In this manner, the finish grinding wheel 62 is attached to the lower end of the spindle 56 via the wheel mount 60.

[0066] The finish grinding wheel 62 has an annular wheel base 62a made of a metal material. A plurality of block-shaped finish grinding stones 62b are fixed to the underside of the wheel base 62a. The plurality of finish grinding stones 62b are arranged in an annular shape at approximately equal intervals along the circumferential direction of the wheel base 62a.

[0067] The annular grinding surface defined by the locus of the lower surface of the finish grinding wheel 62b is approximately parallel to the XY plane. Like the rough grinding wheel 32b, the finish grinding wheel 62b also contains abrasive grains and a binder. However, the average grain size of the abrasive grains of the finish grinding wheel 62b is smaller than that of the rough grinding wheel 32b.

[0068] Therefore, when the workpiece 11 is ground with the finish grinding wheel 62, chips of smaller size (for example, smaller average particle size) are generated compared to when the workpiece 11 is ground with the rough grinding wheel 32.

[0069] In other words, due to the difference between the rough grinding wheel 32 and the finish grinding wheel 62, the finish grinding chamber 64 is a space where smaller chips may be generated than in the rough grinding chamber 34; in other words, the rough grinding chamber 34 is a space where larger chips may be generated than in the finish grinding chamber 64.

[0070] A second grinding water supply nozzle (not shown) that supplies grinding water such as pure water to the contact area (ground area) between the workpiece 11 and the finish grinding stone 62b is provided directly below the finish grinding wheel 62. During finish grinding, grinding water is supplied to the ground area from the second grinding water supply nozzle.

[0071] During finish grinding of the workpiece 11, the wheel mount 60 and the finish grinding wheel 62 are placed inside a second processing chamber cover 66 that defines a finish grinding chamber (second processing chamber) 64. In other words, during finish grinding, the finish grinding wheel 62 is housed in the finish grinding chamber 64.

[0072] The second machining chamber cover 66 has a substantially rectangular second top plate 66a. In this embodiment, the second top plate 66a is rectangular, but the second top plate 66a may be a square, pentagon, hexagon, or other shape. A through opening 66a1 having substantially the same diameter as the wheel mount 60 and the finish grinding wheel 62 is provided in the second top plate 66a.

[0073] The wheel mount 60 and the finish grinding wheel 62 can pass through the through opening 66a1 and enter and exit the finish grinding chamber 64. A front side plate (fourth side plate) 66b1, a rear side plate 66b2, a center side plate (second side plate) 66b3, and an outer side plate 66b4 are provided on each end side of the second top plate 66a, each of which hangs down along the Z-axis direction (see FIG. 2).

[0074] In this embodiment, the central side plate 66b3 of the second processing chamber cover 66 and the central side plate 36b3 of the first processing chamber cover 36 correspond to the left and right halves of one and the same plate member. However, the central side plate 66b3 and the central side plate 36b3 may each be an independent, separate plate member.

[0075] As shown in FIG. 3, at least the central side plate 66b3 and the second top plate 66a define a finish grinding chamber 64 in the grinding / polishing apparatus 2.

[0076] More specifically, the finish grinding chamber 64, which is an approximately closed space, is defined by the second top plate 66a, front side plate 66b1, rear side plate 66b2, central side plate 66b3 and outer side plate 66b4, which each constitute the second machining chamber cover 66, two partition plates 16a located directly below the second machining chamber cover 66, the upper surface 16b of the turntable 16, the upper surface 4b of the base 4, etc.

[0077] When the turntable 16 is stationary, the front side plate 66b1 and the partition plate 16a on the turntable 16 located directly below the front side plate 66b1 are slightly spaced apart in the Z-axis direction, and a slit-shaped gap 108 (see Figure 4) is formed along the X-axis direction between the lower end of the front side plate 66b1 and the upper end of the partition plate 16a.

[0078] Similarly, when the turntable 16 is stationary, the central side plate 66b3 and the partition plate 16a on the turntable 16 located directly below the central side plate 66b3 are slightly separated in the Z-axis direction, and a slit-shaped gap 38 is formed along the Y-axis direction between the lower end of the central side plate 66b3 and the upper end of the partition plate 16a.

[0079] The finish grinding chamber 64 is not completely closed due to a gap 108 between the front side plate 66b1 and the partition plate 16a, and a gap 38 between the central side plate 66b3 and the partition plate 16a, but these gaps allow the turntable 16 to rotate without the partition plate 16a interfering with the second processing chamber cover 66.

[0080] Furthermore, the rough grinding chamber 34 and the finish grinding chamber 64 are spatially connected via a gap 38, with the central side plate 36b3 of the first machining chamber cover 36 and the central side plate 66b3 of the second machining chamber cover 66 as the boundaries.

[0081] A through opening 80 is formed in the rear side plate 66b2, and one end of a second suction pipe section 82 is connected to the through opening 80 of the rear side plate 66b2. The other end of the second suction pipe section 82 is connected to the first vacuum generator 44 via a vacuum regulator 84.

[0082] The vacuum regulator 84 maintains the pressure in the finish grinding chamber 64 at a negative pressure (i.e., a pressure lower than the ambient pressure, such as atmospheric pressure, in which the grinding / polishing apparatus 2 is located) and at a predetermined pressure higher than the pressure in the rough grinding chamber 34. In other words, the pressure difference between the rough grinding chamber 34 and the finish grinding chamber 64 is adjusted by the vacuum regulator 84.

[0083] For example, the vacuum regulator 84 maintains the pressure in the finish grinding chamber 64 at a negative pressure that is at least 5 Pa higher than the pressure in the rough grinding chamber 34. In a specific example, the pressure in the finish grinding chamber 64 is −105 Pa relative to atmospheric pressure, and the pressure in the rough grinding chamber 34 is −110 Pa relative to atmospheric pressure.

[0084] In other words, during operation of the rough grinding unit 20 and the finish grinding unit 50, the gauge pressures in the rough grinding chamber 34 and the finish grinding chamber 64 are negative, and the pressure in the finish grinding chamber 64 is adjusted to be higher than the pressure in the rough grinding chamber 34.

[0085] This allows the fluid containing machining chips and mist-like machining water generated in the rough grinding chamber 34 and the finish grinding chamber 64 to be discharged outside the rough grinding chamber 34 and the finish grinding chamber 64, respectively, and generates an airflow from the finish grinding chamber 64 toward the rough grinding chamber 34.

[0086] Therefore, when the workpiece 11 is machined with the rough grinding wheel 32 and the workpiece 11 is machined with the finish grinding wheel 62, it is possible to prevent machining chips from entering the finish grinding chamber 64 from the rough grinding chamber 34.

[0087] In this embodiment, the operation of the vacuum regulator 84 is controlled by a controller 122, which will be described later, but the vacuum regulator 84 may also be adjusted by an operator adjusting a handle, screw, or the like to adjust the pressure in the finish grinding chamber 64.

[0088] Instead of the vacuum regulator 84, a leak valve (not shown) may be provided in the second suction pipe section 82, and air may be supplied to the second suction pipe section 82 at a predetermined flow rate, thereby maintaining the pressure in the finish grinding chamber 64 at a negative pressure higher than that in the rough grinding chamber 34 (i.e., closer to the atmospheric pressure).

[0089] The operation of the leak valve is controlled, for example, by a control signal from the controller 122, and the amount of air flowing into the second suction pipe section 82 per unit time is adjusted to a predetermined value. Note that the amount of air flowing into the second suction pipe section 82 may also be adjusted by the operator adjusting a handle, screw, rotary knob, or the like.

[0090] 1, a rectangular pillar-shaped third support structure (not shown) is provided in front of the polishing area A4 so as to protrude from the upper surface 4b of the base 4. A polishing feed unit (not shown) is provided on the rear surface of the third support structure.

[0091] Like the first grinding feed unit, the polishing feed unit also includes a pair of Z-axis guide rails, a Z-axis moving plate, a nut, a screw shaft, a drive source, etc. A polishing unit (third processing unit) 90 is provided on the rear surface of the Z-axis moving plate located behind the third support structure. The polishing unit 90 has a holding member (not shown) fixed to the Z-axis moving plate and having a cylindrical cavity.

[0092] A cylindrical spindle housing 94 is arranged in the hollow portion of the holding member, and the spindle housing 94 is fixed to the holding member. As shown in Figure 4, a portion of a cylindrical spindle (third spindle) 96 is rotatably accommodated within the spindle housing 94.

[0093] The spindle 96 is also disposed substantially parallel to the Z-axis direction. A rotational drive source 98 such as a motor is provided in the longitudinal center of the spindle 96. The upper surface of a disk-shaped wheel mount 100 is fixed to the lower end of the spindle 96.

[0094] A disk-shaped polishing tool (third processing tool) 102 is attached to the underside of the wheel mount 100. In this manner, the polishing tool 102 is attached to the lower end of the spindle 96 via the wheel mount 100.

[0095] The polishing tool 102 has an annular base 102a made of a metal material. A polishing pad 102b that is continuous and annular in plan view, or a plurality of polishing pads 102b that are arranged along the circumferential direction of the base 102a in plan view, is fixed to the underside of the base 102a.

[0096] The lower surface of the polishing pad 102b is disposed approximately parallel to the XY plane. The polishing pad 102b has abrasive grains made of, for example, diamond, cerium oxide, or silicon oxide, and a foamed hard plastic for securing the abrasive grains. Typically, the average grain size of the abrasive grains in the polishing pad 102b is smaller than the average grain size of the abrasive grains in the finish grinding wheel 62b.

[0097] Therefore, when the workpiece 11 is ground with the polishing pad 102b, chips of smaller size (for example, smaller average particle size) are generated compared to when the workpiece 11 is ground with the finish grinding wheel 62.

[0098] In other words, due to the differences between the finish grinding wheel 62 and the polishing tool 102, the polishing chamber 104 described below is a space where smaller chips may be generated than in the finish grinding chamber 64; in other words, the finish grinding chamber 64 is a space where larger chips may be generated than in the polishing chamber 104.

[0099] When polishing the workpiece 11, the wheel mount 100 and the polishing tool 102 are placed inside a third processing chamber cover 106 that defines a polishing chamber (third processing chamber) 104. In other words, the polishing tool 102 is housed in the polishing chamber 104 during polishing.

[0100] The third processing chamber cover 106 has a substantially rectangular third top plate 106a. In this embodiment, the third top plate 106a is rectangular, but the third top plate 106a may be a square, pentagon, hexagon, or other shape. The third top plate 106a is provided with a through-opening 106a1 having substantially the same diameter as the wheel mount 100 and the polishing tool 102.

[0101] The wheel mount 100 and the polishing tool 102 can pass through the through opening 106a1 and enter and exit the polishing chamber 104. A front side plate 106b1, a rear side plate (third side plate) 106b2, a center side plate 106b3, and an outer side plate 106b4 are provided on each end of the third top plate 106a, each of which hangs down along the Z-axis direction (see FIG. 2).

[0102] In this embodiment, the rear side plate 106b2 of the third processing chamber cover 106 and the front side plate 66b1 of the second processing chamber cover 66 correspond to the front half and rear half of one and the same plate member. However, the rear side plate 106b2 and the front side plate 66b1 may each be separate and independent plate members.

[0103] As shown in FIG. 4, at least the rear side plate 106b2 and the third top plate 106a define a polishing chamber 104 in the grinding / polishing apparatus 2.

[0104] More specifically, the polishing chamber 104, which is an approximately closed space, is defined by the third top plate 106a, front side plate 106b1, rear side plate 106b2, central side plate 106b3 and outer side plate 106b4, which each constitute the third processing chamber cover 106, two partition plates 16a located directly below the third processing chamber cover 106, the upper surface 16b of the turntable 16, the upper surface 4b of the base 4, etc.

[0105] When the turntable 16 is stationary, the rear side plate 106b2 and the partition plate 16a on the turntable 16 located directly below the rear side plate 106b2 are slightly spaced apart in the Z-axis direction, and a slit-shaped gap 108 is formed along the X-axis direction between the lower end of the rear side plate 106b2 and the upper end of the partition plate 16a.

[0106] Similarly, when the turntable 16 is stationary, the central side plate 106b3 and the partition plate 16a on the turntable 16 located directly below the central side plate 106b3 are slightly separated in the Z-axis direction, and a slit-shaped gap (not shown) is formed along the Y-axis direction between the lower end of the central side plate 106b3 and the upper end of the partition plate 16a.

[0107] The polishing chamber 104 is not completely closed due to the gap 108 between the rear side plate 106b2 and the partition plate 16a, and the gap between the central side plate 106b3 and the partition plate 16a, but these gaps allow the turntable 16 to rotate without the partition plate 16a interfering with the third processing chamber cover 106.

[0108] The polishing chamber 104 and the finish grinding chamber 64 are spatially connected via a gap 108, with the rear side plate 106b2 of the third processing chamber cover 106 and the front side plate 66b1 of the second processing chamber cover 66 as the boundaries.

[0109] A through opening 110 is formed in the outer side plate 106b4, and one end of a third suction pipe section 112 is connected to the through opening 110 of the outer side plate 106b4. A second vacuum generator 114 is connected to the other end of the third suction pipe section 112.

[0110] The second vacuum generating device 114 is different from the first vacuum generating device 44, but like the first vacuum generating device 44, the second vacuum generating device 114 is not a component of the grinding and polishing device 2 but is installed in the building.

[0111] The second vacuum generator 114 includes, for example, a vacuum pump, but may also include an ejector, a vacuum blower, etc. The second vacuum generator 114 of this embodiment supplies the generated negative pressure only to the polishing chamber 104.

[0112] The pressure difference between the finish grinding chamber 64 and the polishing chamber 104 reflects the difference between the negative pressure generated by the first vacuum generator 44 and regulated by the vacuum regulator 84 and the negative pressure generated by the second vacuum generator 114.

[0113] The second vacuum generator 114 maintains the pressure in the polishing chamber 104 at a level, for example, 5 Pa or more higher than the pressure in the finish grinding chamber 64. In a specific example, when the pressure in the finish grinding chamber 64 is −105 Pa relative to atmospheric pressure, the second vacuum generator 114 sets the pressure in the polishing chamber 104 to −100 Pa relative to atmospheric pressure.

[0114] In other words, while the finish grinding unit 50 and the polishing unit 90 are operating, the gauge pressures in the finish grinding chamber 64 and the polishing chamber 104 are negative, and the pressure in the polishing chamber 104 is adjusted to be higher than the pressure in the finish grinding chamber 64.

[0115] This allows fluid containing machining waste and mist-like machining water generated in the finish grinding chamber 64 and the polishing chamber 104 to be discharged outside the finish grinding chamber 64 and the polishing chamber 104, respectively, and generates an airflow from the polishing chamber 104 toward the finish grinding chamber 64.

[0116] Therefore, when the workpiece 11 is machined by the finish grinding wheel 62 and also by the polishing tool 102, it is possible to prevent chips from entering the polishing chamber 104 from the finish grinding chamber 64.

[0117] 5 is a block diagram showing the connection relationship between multiple processing chambers (rough grinding chamber 34, finish grinding chamber 64, polishing chamber 104) and multiple vacuum generators (first vacuum generator 44, second vacuum generator 114). Arrows in FIG. 5 indicate the flow of air.

[0118] In this embodiment, the pressure P in the rough grinding chamber 34 is maintained by the first vacuum generator 44, the second vacuum generator 114, and the vacuum regulator 84. A2 , the pressure P in the finish grinding chamber 64 A3 , and the pressure P of the polishing chamber 104 A4 Both are made negative pressure, and pressure P A2 The lowest pressure P A3 Then, the pressure P A4 Make it the highest.

[0119] 1 and 2, a description will be given of other components of the grinding and polishing apparatus 2. A carry-in arm 116 is provided near the positioning table 12 to carry the workpiece 11 from the positioning table 12 to the chuck table 14 arranged in the carry-in / carry-out area A1.

[0120] The carry-in arm 116 has two plate members 116a at the tip of the arm that grip the workpiece 11 by approaching along the Z-axis direction and release the workpiece 11 by moving away along the Z-axis direction. A moving block 116b is fixed to the base end of the arm.

[0121] The moving block 116b is connected to a moving mechanism (not shown) including a ball screw, and is movable along the Z-axis and Y-axis directions. The workpiece 11, whose position in the XY plane has been adjusted by the positioning table 12, is carried by the carry-in arm 116 into the chuck table 14 arranged in the carry-in / carry-out area A1.

[0122] The workpieces 11 are suction-held by a chuck table 14 arranged in a carry-in / carry-out area A1 so that their back surfaces are exposed upward and their front surfaces including the devices face a holding surface 14a. The first workpiece 11 is transported to a rough grinding area A2 by the turntable 16 rotating 90 degrees clockwise in a plan view, and then roughly ground in a rough grinding unit 20.

[0123] While the first workpiece 11 is being roughly ground, the second workpiece 11 is held by suction on the chuck table 14 arranged in the loading / unloading area A1. The first workpiece 11 is transported to the finish grinding area A3 by the turntable 16 rotating 90 degrees clockwise in a plan view, and then finish-ground in the finish grinding unit 50.

[0124] While the first workpiece 11 is being finish-ground, the second workpiece 11 is rough-ground by the rough grinding unit 20 in the rough grinding area A2, and the third workpiece 11 is suction-held by the chuck table 14 located in the loading / unloading area A1.

[0125] During the finish grinding of the first workpiece 11 and the rough grinding of the second workpiece 11, as described above, an airflow is generated from the finish grinding chamber 64 toward the rough grinding chamber 34, thereby preventing chips from entering the finish grinding chamber 64 from the rough grinding chamber 34.

[0126] After the finish grinding of the first workpiece 11 and the rough grinding of the second workpiece 11 are completed, the turntable 16 rotates 90 degrees clockwise in a plan view, and the first workpiece 11 is transported to the polishing area A4, the second workpiece 11 is transported to the finish grinding area A3, and the third workpiece 11 is transported to the rough grinding area A2.

[0127] While the first workpiece 11 is being polished, the second workpiece 11 is being finish ground, the third workpiece 11 is being roughly ground, and the fourth workpiece 11 is being suction-held by the chuck table 14 located in the loading / unloading area A1.

[0128] During the polishing of the first workpiece 11 and the finish grinding of the second workpiece 11, as described above, an air flow is generated from the polishing chamber 104 toward the finish grinding chamber 64, thereby preventing processing debris from entering the polishing chamber 104 from the finish grinding chamber 64.

[0129] Of course, during the finish grinding of the second workpiece 11 and the rough grinding of the third workpiece 11, an air flow can be generated from the finish grinding chamber 64 toward the rough grinding chamber 34 to prevent chips from entering the finish grinding chamber 64 from the rough grinding chamber 34.

[0130] After polishing of the first workpiece 11 is completed, the chuck table 14 is rotated 270 degrees counterclockwise in a plan view, so that the first workpiece 11 is placed in the loading / unloading area A1, the second workpiece 11 is placed in the polishing area A4, the third workpiece 11 is placed in the finish grinding area A3, and the fourth workpiece 11 is placed in the rough grinding area A2.

[0131] While the second workpiece 11 is being polished, the third workpiece 11 is being finish ground, and the fourth workpiece 11 is being rough ground, the first workpiece 11 is transported by the discharge arm 118 to the spinner cleaning device 120.

[0132] The carry-out arm 118 has a disk-shaped holding unit 118a (see FIG. 2) that suction-holds the processed workpiece 11. The carry-out arm 118 is connected to a movement mechanism (not shown) including a ball screw, and is movable along the Z-axis and Y-axis directions.

[0133] The unloading arm 118 is movable without interfering with the loading arm 116, and transports the workpiece 11 from the chuck table 14 located in the loading / unloading area A1 to the spinner cleaning device 120.

[0134] The workpiece 11 cleaned by the spinner cleaning device 120 is transferred from the spinner cleaning device 120 to the cassettes 10a and 10b from which it was taken out by the transfer robot 6. Each component of the grinding / polishing device 2 is controlled by a controller 122.

[0135] The controller 122 is configured by a computer including, for example, a processor 122a represented by a CPU (Central Processing Unit) and a memory 122b. The storage device includes a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a flash memory.

[0136] The auxiliary storage device stores software, and the functions of the controller 122 are realized by operating the processor 122a etc. in accordance with this software. The auxiliary storage device stores a predetermined program for maintaining the pressure difference between the rough grinding chamber 34, the finish grinding chamber 64, and the polishing chamber 104.

[0137] By reading and executing a predetermined program in the processor 122a, the program functions as a pressure control unit (not shown) for maintaining the pressure difference between the rough grinding chamber 34, the finish grinding chamber 64, and the polishing chamber 104.

[0138] As described above, in this embodiment, it is possible to prevent machining chips from entering the finish grinding chamber 64 from the rough grinding chamber 34, and it is also possible to prevent machining chips from entering the polishing chamber 104 from the finish grinding chamber 64.

[0139] (Second Embodiment) Next, a second embodiment will be described with reference to Fig. 6. Fig. 6 is a block diagram showing the connection relationship between multiple processing chambers (rough grinding chamber 34, finish grinding chamber 64, polishing chamber 104) and one vacuum generator (first vacuum generator 44) in the second embodiment. Arrows in Fig. 6 indicate the flow of air currents.

[0140] In the second embodiment, one end of the third suction pipe section 112 is connected to the third processing chamber cover 106, and the other end of the third suction pipe section 112 is connected to the first vacuum generating device 44 via another vacuum regulator 124 different from the vacuum regulator 84.

[0141] In other words, the first suction pipe section 42, the second suction pipe section 82, and the third suction pipe section 112 are connected to the first vacuum generating device 44, and the pressure difference between the rough grinding chamber 34 and the finish grinding chamber 64 is adjusted by the vacuum regulator 84, and the pressure difference between the finish grinding chamber 64 and the polishing chamber 104 is adjusted by the vacuum regulator 124.

[0142] (Modification) Next, a modification of the second embodiment will be described with reference to Fig. 7. Fig. 7 is a block diagram showing a modification of the second embodiment. In this modification, one end of the third suction pipe section 112 is connected to the third machining chamber cover 106, but the other end of the third suction pipe section 112 is connected to the first vacuum generator 44 via the second suction pipe section 82 located between the vacuum regulator 84 and the finish grinding chamber 64. This is what makes this modification different from the second embodiment.

[0143] In the second embodiment shown in FIG. 6, if a malfunction or the like occurs in the vacuum regulator 124 and the negative pressure generated by the first vacuum generator 44 is transmitted to the polishing chamber 104 almost as it is, the pressure P A4 is the pressure P in the rough grinding chamber 34 A2Therefore, an air flow is generated from the finish grinding chamber 64 to the polishing chamber 104.

[0144] In contrast to this, in this modified example, even if a malfunction or the like occurs in the vacuum regulator 124 and the negative pressure generated by the first vacuum generating device 44 is transmitted to the polishing chamber 104 almost as it is, the pressure P A4 is the pressure P in the finish grinding chamber 64 A3 Therefore, there is an advantage that no air current is generated from the finish grinding chamber 64 to the polishing chamber 104.

[0145] Furthermore, even if a malfunction or the like occurs in the vacuum regulator 84 and the negative pressure generated by the first vacuum generating device 44 is transmitted almost as is to both the rough grinding chamber 34 and the finish grinding chamber 64, there is an advantage that as long as the vacuum regulator 124 is operating normally, the airflow from the polishing chamber 104 to the finish grinding chamber 64 can be maintained.

[0146] However, if a problem occurs in the vacuum regulator 84 and the vacuum regulator 124 is operating normally, the pressure P A2 and the pressure P in the finish grinding chamber 64 A3 Therefore, no air flow is generated from the rough grinding chamber 34 to the finish grinding chamber 64.

[0147] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. Of course, a leak valve (not shown) may be used instead of the vacuum regulator 84, and a leak valve (not shown) may be used instead of the vacuum regulator 124.

[0148] The operation of the leak valve is controlled, for example, by a control signal from the controller 122. However, the amount of air flowing into the second suction pipe portion 82 and the third suction pipe portion 112 may also be adjusted by the operator adjusting a handle, a screw, a rotary knob, or the like. [Explanation of symbols]

[0149] 2: Grinding and polishing equipment (processing equipment) 4: base, 4a: recess, 4b: upper surface 6: Transport robot 8a, 8b: mounting table, 10a, 10b: cassette 11: Workpiece 12: Positioning table, 12a: Table, 12b: Positioning pin 14: chuck table, 14a: holding surface 16: turntable, 16a: partition plate, 16b: top surface 20: Rough grinding unit (first processing unit) 22: Holding member, 24: Spindle housing 26: Spindle (first spindle), 28: Rotation drive source, 30: Wheel mount 32: rough grinding wheel (first processing tool), 32a: wheel base, 32b: rough grinding stone 34: Rough grinding room (1st processing room) 36: First processing chamber cover 36a: first top plate, 36a1: through opening 36b1: Front side plate, 36b2: Back side plate 36b3: Center side plate (first side plate), 36b4: Outer side plate 38: Gap, 40: Through opening 42: First suction tube section, 44: First vacuum generator 50: Finish grinding unit (second processing unit) 52: Holding member, 54: Spindle housing 56: Spindle (second spindle), 58: Rotation drive source, 60: Wheel mount 62: Finishing grinding wheel (second processing tool) 62a: Wheel base, 62b: Finishing grinding wheel 64: Finishing grinding room (second processing room) 66: Second processing chamber cover 66a: second top plate, 66a1: through opening 66b1: Front side plate (4th side plate), 66b2: Back side plate 66b3: Center side plate (second side plate), 66b4: Outer side plate 80:Through opening 82: second suction tube section, 84: vacuum regulator 90: Polishing unit (third processing unit), 94: Spindle housing 96: Spindle (third spindle), 98: Rotation drive source, 100: Wheel mount 102: polishing tool (third processing tool), 102a: base, 102b: polishing pad 104: Polishing room (3rd processing room) 106: Third processing chamber cover 106a: third top plate, 106a1: through opening 106b1: Front side plate, 106b2: Rear side plate (third side plate) 106b3: Center side plate, 106b4: Outer side plate 108: Gap, 110: Through-hole 112: third suction tube section, 114: second vacuum generator 116: Loading arm, 116a: Plate member, 116b: Moving block 118: carrying-out arm, 118a: holding unit 120: Spinner cleaning device 122: Controller, 122a: Processor, 122b: Memory 124: Vacuum regulator A1: Loading / unloading area, A2: Rough grinding area, A3: Finish grinding area, A4: Polishing area P A2 ,P A3 ,P A4 :pressure

Claims

1. A processing device for processing a workpiece, a first machining unit having a first spindle and a first machining tool attached to a lower end of the first spindle; a second machining unit having a second spindle and a second machining tool attached to a lower end of the second spindle; a first machining chamber cover having a first side plate and a first top plate, and capable of accommodating the first machining tool in a first machining chamber defined by at least the first side plate and the first top plate; a second processing chamber cover having a second side plate and a second top plate, capable of accommodating the second processing tool in a second processing chamber partitioned at least by the second side plate and the second top plate, the first processing chamber and the second processing chamber being spatially connected with each other across the first side plate and the second side plate; a first suction pipe portion connected to the first processing chamber cover; a second suction pipe portion connected to the second processing chamber cover; Equipped with the first machining chamber is a space in which machining chips larger in size than those in the second machining chamber may be generated due to a difference between the first machining tool and the second machining tool; A processing apparatus characterized in that, while the first processing unit and the second processing unit are operating, the gauge pressures of the first processing chamber and the second processing chamber are negative, the pressure of the second processing chamber is adjusted to be higher than the pressure of the first processing chamber, and an air flow is generated from the second processing chamber toward the first processing chamber.

2. a third processing unit having a third spindle and a polishing tool attached to a lower end of the third spindle; a third processing chamber cover having a third side plate and a third top plate, capable of accommodating the polishing tool in a third processing chamber defined at least by the third side plate and the third top plate, the second processing chamber and the third processing chamber being spatially connected to each other at the boundary between the third side plate and a fourth side plate constituting the second processing chamber cover; a third suction pipe portion connected to the third processing chamber cover; Further provided with the second processing chamber is a space in which larger chips may be generated than the third processing chamber due to differences between the second processing tool and the polishing tool; The processing apparatus according to claim 1, characterized in that, during operation of the second processing unit and the third processing unit, the gauge pressures of the second processing chamber and the third processing chamber are negative, and the pressure of the third processing chamber is adjusted to be higher than the pressure of the second processing chamber, so that an air flow is generated from the third processing chamber toward the second processing chamber.

3. the first suction tube portion and the second suction tube portion are connected to a first vacuum generating device that generates a negative pressure; the third suction tube portion is connected to a second vacuum generator different from the first vacuum generator; a pressure difference between the first processing chamber and the second processing chamber is adjusted by a vacuum regulator or a leak valve provided in the second suction pipe portion; 3. The processing apparatus according to claim 2, wherein the pressure difference between the second processing chamber and the third processing chamber reflects the difference between the negative pressure generated by the first vacuum generating device and adjusted by a vacuum regulator or a leak valve, and the negative pressure generated by the second vacuum generating device.

4. 3. The processing apparatus according to claim 2, wherein the first suction pipe section, the second suction pipe section, and the third suction pipe section are connected to a first vacuum generating device that generates negative pressure, the pressure difference between the first processing chamber and the second processing chamber is adjusted by a vacuum regulator or a leak valve provided in the second suction pipe section, and the pressure difference between the second processing chamber and the third processing chamber is adjusted by a vacuum regulator or a leak valve provided in the third suction pipe section.

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