Manufacturing method of individual module

Abstract

To achieve both efficient production and improved shielding properties.SOLUTION: A manufacturing method of an individual module includes steps of: providing information on an insulating resin layer in a module component including a substrate, an electronic component disposed on the substrate, and an insulating resin layer covering each of the substrate and the electronic component; singulating the module component into two or more individual modules; and disposing a conductive layer so as to cover a side surface of each of the two or more individual modules. The information is information corresponding to each of the two or more individual modules.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing an individual module. [Background technology]

[0002] BACKGROUND ART Individual modules are known which are obtained by dividing a module component that includes a substrate, two or more electronic components arranged on the substrate, and insulating resin layers that cover the substrate and each of the two or more electronic components.

[0003] For example, Patent Document 1 discloses a circuit module in which a plurality of components are arranged on a substrate and each of the components is covered with an insulating layer, the circuit module having a conductive layer that shields electromagnetic waves and the like. Summary of the Invention [Problem to be solved by the invention]

[0004] However, in individual modules separated from the circuit module described in Patent Document 1, there are portions on the sides of the individual module where no conductive layer is arranged, and electromagnetic waves etc. may pass through these portions, resulting in reduced shielding against electromagnetic waves etc.

[0005] An object of the present invention is to achieve both improved production efficiency and improved shielding properties. [Means for solving the problem]

[0006] A method for manufacturing an individual module according to one embodiment of the present invention includes the steps of: providing information on an insulating resin layer in a module component including a substrate, electronic components arranged on the substrate, and an insulating resin layer covering each of the substrate and the electronic components; singulating the module component into two or more individual modules; and arranging a conductive layer to cover the side surfaces of each of the two or more individual modules, wherein the information corresponds to each of the two or more individual modules. [Effects of the Invention]

[0007] According to the present invention, it is possible to achieve both improved production efficiency and improved shielding properties. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic top view showing an individual module according to a first embodiment of the present invention; [Figure 2] FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. [Figure 3] 4 is a flowchart showing a method for manufacturing an individual module according to the first embodiment of the present invention. [Figure 4] 3A to 3C are schematic top views of a module component in the manufacturing method for an individual module according to the first embodiment of the present invention. [Figure 5] FIG. 5 is a schematic cross-sectional view taken along line VV in FIG. [Figure 6] 3A and 3B are schematic top views of a module component illustrating a step of arranging a conductive layer on the upper surface of an insulating resin layer in the method for manufacturing an individual module according to the first embodiment of the present invention. [Figure 7] FIG. 7 is a schematic cross-sectional view taken along line VII-VII in FIG. 6. [Figure 8] 3A to 3C are schematic top views of the individual module illustrating a step of dividing module components into individual modules in the manufacturing method for the individual module according to the first embodiment of the present invention. [Figure 9] FIG. 9 is a schematic cross-sectional view taken along line IX-IX in FIG. 8. [Figure 10] 3A and 3B are schematic top views of the individual module, illustrating a step of arranging a conductive layer on a side surface of the individual module in the manufacturing method for the individual module according to the first embodiment of the present invention. [Figure 11] FIG. 11 is a schematic cross-sectional view taken along line XI-XI in FIG. [Figure 12] 10A and 10B are schematic top views of a module component illustrating a step of providing information on the top surface of an insulating resin layer in a method for manufacturing an individual module according to a second embodiment of the present invention. [Figure 13]FIG. 13 is a schematic cross-sectional view taken along line XIII-XIII in FIG. [Figure 14] 10A and 10B are schematic top views of the individual module illustrating a step of providing information in a manufacturing method for the individual module according to the third embodiment of the present invention. [Figure 15A] FIG. 15 is a schematic cross-sectional view taken along line XV-XV in FIG. [Figure 15B] FIG. 10 is a schematic top view showing a first example of a module component to which information has been imparted by disposing a conductive layer on a portion of an insulating resin layer in a step of imparting information. [Figure 15C] FIG. 10 is a schematic top view showing a second example of a module component to which information has been imparted by disposing a conductive layer on a portion of an insulating resin layer in the step of imparting information. [Figure 15D] This is a schematic top view showing an example of an individual module in which information is imparted by placing a conductive layer of a different color from the conductive layer of a predetermined shape in an area on the insulating resin layer where the conductive layer of a predetermined shape is not placed, after the singulation process. [Figure 16] FIG. 10 is a schematic top view showing an individual module according to a fourth embodiment of the present invention. [Figure 17] FIG. 17 is a schematic cross-sectional view taken along line XVII-XVII in FIG. [Figure 18] 10A and 10B are schematic top views of a module component, illustrating a step of arranging a conductive layer on the upper surface of an insulating resin layer in a method for manufacturing an individual module according to a fourth embodiment of the present invention. [Figure 19] FIG. 19 is a schematic cross-sectional view taken along line XIX-XIX in FIG. 18. [Figure 20] 10A and 10B are schematic top views of a module component illustrating a step of providing information on the upper surface of a conductive layer in a method for manufacturing an individual module according to a fourth embodiment of the present invention. [Figure 21] FIG. 21 is a schematic cross-sectional view taken along line XXI-XXI in FIG. 20. [Figure 22] FIG. 10 is a schematic top view showing an individual module according to a fifth embodiment of the present invention. [Figure 23]FIG. 23 is a schematic cross-sectional view taken along line XXIII-XXIII in FIG. 22. [Figure 24] 13A and 13B are schematic top views of the individual module illustrating a step of arranging a protective layer on the side surface of the individual module in the method for manufacturing the individual module according to the fifth embodiment of the present invention. [Figure 25] FIG. 25 is a schematic cross-sectional view taken along line XXV-XXV in FIG. 24. [Figure 26] 1 is a schematic top view showing a plurality of individual modules arranged on a transfer mechanism provided in an individual module manufacturing apparatus according to a first example. FIG. [Figure 27] 1 is a schematic cross-sectional view showing the configuration of an individual module manufacturing apparatus according to a first example. [Figure 28] FIG. 10 is a diagram showing an example of an individual module manufacturing apparatus according to a second example. DETAILED DESCRIPTION OF THE INVENTION

[0009] A method for manufacturing an individual module according to an embodiment of the present invention will be described in detail with reference to the drawings. However, the following embodiments are merely examples of the method for manufacturing an individual module according to an embodiment of the present invention, and are not intended to be limiting.

[0010] Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of components described in the embodiments of the present invention are not intended to limit the scope of the embodiments of the present invention, but are merely illustrative examples. The sizes, positional relationships, etc. of components shown in each drawing may be exaggerated for clarity. In the following description, the same names and symbols indicate the same or similar components, and detailed descriptions will be omitted as appropriate.

[0011] In the following, for ease of understanding, the arrangement and configuration of each part may be described using an XYZ Cartesian coordinate system. The three axes in the XYZ Cartesian coordinate system are mutually orthogonal. In the XYZ Cartesian coordinate system, the direction in which the X axis extends is referred to as the "X direction," the direction in which the Y axis extends is referred to as the "Y direction," and the direction in which the Z axis extends is referred to as the "Z direction." The direction in which the arrow indicating the X axis points is referred to as the +X direction, and the direction opposite to the +X direction is referred to as the -X direction. The direction in which the arrow indicating the Y axis points is referred to as the +Y direction, and the direction opposite to the +Y direction is referred to as the -Y direction. The direction in which the arrow indicating the Z axis points is referred to as the +Z direction, and the direction opposite to the +Z direction is referred to as the -Z direction. In this specification, the +Z direction is referred to as "top" and the -Z direction is referred to as "bottom." Viewing an object from the +Z direction is referred to as a top view. A view of an object viewed from the +Z direction is referred to as a top view. However, these directional expressions merely describe the relationship of relative position, orientation, direction, etc., and do not necessarily correspond to the relationship during use. Furthermore, these directions are unrelated to the direction of gravity. Furthermore, "to place" does not only mean a direct contact, but also includes a case where it is placed indirectly, for example, via another member.

[0012] [First embodiment] <Configuration of Individual Module According to First Embodiment of the Present Invention> The configuration of a component module according to a first embodiment of the present invention will be described with reference to Figures 1 and 2. Figure 1 is a schematic top view showing an example of a component module 100 according to the first embodiment of the present invention. Figure 2 is a schematic cross-sectional view taken along line II-II in Figure 1.

[0013] The module component 100 includes a substrate 1, electronic components 2 arranged on the substrate 1, and an insulating resin layer 3 that covers the substrate 1 and the electronic components 2. The module component 100 also includes information 4 provided on the insulating resin layer 3, and a conductive layer 5 arranged to cover a side surface 102 of the module component 100. The information 4 corresponds to each of the two or more modules component 100.

[0014] The module 100 is a module separated from a module component such as a circuit module including a substrate, two or more electronic components arranged on the substrate, and an insulating resin layer covering the substrate and each of the two or more electronic components. The module 100 includes at least a portion of the substrate and at least some of the two or more electronic components arranged on at least a portion of the substrate.

[0015] In the individual module 100 shown in Fig. 2, the substrate 1 is a laminated circuit board on which electronic components 2, including a first electronic component 2-1 to a third electronic component 2-3, are mounted via solder or the like. Ground patterns 12 are arranged inside the substrate 1 in accordance with the arrangement of the first electronic component 2-1 to the third electronic component 2-3. Each of the first electronic component 2-1 to the third electronic component 2-3 is connected to the ground via this ground pattern 12. The substrate 1 and each of the first electronic component 2-1 to the third electronic component 2-3 are covered with an insulating resin layer 3, and are thereby insulated from one another.

[0016] The electronic component 2 includes at least one of a semiconductor integrated circuit, a resistor, a capacitor, a light-emitting element, a light-receiving element, etc. Examples of the semiconductor integrated circuit include an integrated circuit (IC) or a large-scale integration (LSI). The number of layers of the stacked substrate 1 can be changed as appropriate depending on the specifications of the individual module 100. The type of the substrate 1 is not limited to a stacked type and can be changed as appropriate depending on the specifications of the individual module 100. The number of electronic components 2 mounted on the substrate 1 is not limited to three and can be any number equal to or greater than one depending on the specifications of the individual module 100. The size of the substrate 1 can be changed as appropriate depending on the number of electronic components 2 mounted on the substrate 1. The multiple electronic components 2 mounted on the substrate 1 may have the same specifications, or at least one may have a different specification.

[0017] The information 4 is information about the individual module 100. By forming a conductive layer or resin layer of a predetermined shape, the information 4 can be read as letters, numbers, two-dimensional codes (QR Code (registered trademark)), etc., when viewed in a plan view. In recent years, in the field of mobile devices and the like, efforts have been made to make individual modules placed inside mobile devices smaller, thinner, and more densely packed. For such individual modules, displaying information has become increasingly important from various perspectives, such as the Product Liability Act (PL Act), security to prevent counterfeiting, and traceability. In the individual module 100, either a conductive material or an insulating material is disposed on the insulating resin layer 3, and the information 4 is attached to display various pieces of information 4 about the individual module 100. Specifically, the information 4 includes legally required information such as the model, specifications, date of manufacture, manufacturer's logo, and place of origin of the individual module 100, as well as customer-requested specifications. The information 4 includes alphanumeric characters, non-alphanumeric symbols, code information, etc.

[0018] The conductive layer 5 has functions such as heat dissipation, static electricity countermeasures, and EMI (Electromagnetic Interference) countermeasures by shielding electromagnetic waves. The conductive layer 5 is made up of a conductive material. The conductive layer 5 is mainly used for electromagnetic wave applications. The conductive layer 5 that shields electromagnetic waves is mainly made up of a conductive material. For example, the conductive layer 5 can be made up of an alloy such as Au, Ag, Cu, Al, stainless steel (SUS), or nickel.

[0019] The conductive layer 5 shields the module 100 from electromagnetic waves incident from the outside, and also shields electromagnetic waves emitted from inside the module 100. By shielding the electromagnetic waves incident from the outside with the conductive layer 5, the module 100 can reduce noise, stabilize the operation of the electronic component 2, and prevent malfunctions. Furthermore, by shielding the electromagnetic waves emitted from the inside with the conductive layer 5, the module 100 can reduce noise emitted to the outside, stabilize the operation of devices or components other than the module 100, and prevent malfunctions.

[0020] For example, Patent Document 1 discloses a circuit module having a conductive layer that shields electromagnetic waves, in which multiple components are arranged on a substrate and each component is covered with an insulating layer. However, in the circuit module described in Patent Document 1, after the circuit module is cut into a half-cut state (i.e., not completely cut), a conductive layer is arranged on a portion of the side surface of the circuit module that is exposed by cutting. The circuit module is then cut into a full-cut state (i.e., the circuit module is completely cut), to produce an individual module. As a result, the conductive layer is not arranged on the portion of the side surface of the individual module that was not exposed in the half-cut state, and electromagnetic waves pass through this portion, which may degrade the electromagnetic wave shielding properties of the individual module.

[0021] In the first embodiment of the present invention, the conductive layer 5 is disposed so as to cover the side surface 102 of the individual module 100. As a result, in the first embodiment of the present invention, it is possible to provide an individual module 100 with better shielding properties than an individual module in which a conductive layer is not disposed on part of the side surface.

[0022] <Method for manufacturing individual module 100> Next, a method for manufacturing the individual module 100 will be described with reference to Figures 3 to 11. Figure 3 is a flowchart showing an example of a method for manufacturing the individual module 100 according to the first embodiment of the present invention.

[0023] The method for manufacturing the individual module 100 includes a step (S11) of providing information 4 on the insulating resin layer 3 of a module component including a substrate 1, electronic components 2 arranged on the substrate 1, and an insulating resin layer 3 covering each of the substrate 1 and the electronic components 2. The method for manufacturing the individual module 100 then includes a step (S12) of dividing the module component into two or more individual modules 100, and a step (S13) of arranging a conductive layer 5 so as to cover the side surface 102 of each of the two or more individual modules 100.

[0024] (S11: Step of adding information 4) In S11, the manufacturing method for the individual module 100 provides information 4 on the insulating resin layer 3 in a module component including a substrate 1, an electronic component 2 arranged on the substrate 1, and an insulating resin layer 3 covering each of the substrate 1 and the electronic component 2.

[0025] The step (S11) of providing information 4 will be described with reference to FIGS. 4 to 7. FIG. 4 is a schematic top view showing an example of a module component 10 in the method for manufacturing an individual module 100 according to the first embodiment of the present invention. FIG. 5 is a schematic cross-sectional view taken along line VV in FIG. 4. FIG. 6 is a schematic top view of the module component 10 showing the step of arranging a conductive layer 5 on the upper surface 31 of the insulating resin layer 3 in the method for manufacturing an individual module 100 according to the first embodiment of the present invention. FIG. 7 is a schematic cross-sectional view taken along line VII-VII in FIG. 6.

[0026] 4 and 5 includes a substrate 1, electronic components 2 arranged on the substrate 1, and an insulating resin layer 3 that covers the substrate 1 and the electronic components 2. The electronic components 2 also include a first electronic component 2-1, a second electronic component 2-2, a third electronic component 2-3, a fourth electronic component 2-4, a fifth electronic component 2-5, and a sixth electronic component 2-6.

[0027] The substrate 1 is a laminated circuit board on which electronic components 2, including a first electronic component 2-1 to a sixth electronic component 2-6, are mounted via a bonding material such as solder. A ground pattern 12 is arranged inside the substrate 1, corresponding to the arrangement of the first electronic component 2-1 to the sixth electronic component 2-6. Each of the first electronic component 2-1 to the sixth electronic component 2-6 is connected to ground via this ground pattern 12. The substrate 1 and each of the first electronic component 2-1 to the sixth electronic component 2-6 are insulated from each other by being covered with an insulating resin layer 3. The number of electronic components 2 mounted on the substrate 1 is not limited to six, and any number greater than or equal to two can be appropriately selected depending on the specifications of the individual module 100. The size of the substrate 1 can be appropriately changed depending on the number of electronic components 2 mounted on the substrate 1. The electronic components 2 mounted on the substrate 1 may have the same specifications, or at least one may have a different specification.

[0028] In the method for manufacturing the individual module 100, before performing step S11, the module component 10 is prepared by manufacturing or purchasing it. In manufacturing the module component 10, for example, the first electronic component 2-1 to the sixth electronic component 2-6 are mounted on the substrate 1, and the substrate 1 and the first electronic component 2-1 to the sixth electronic component 2-6 are each covered with an insulating resin layer 3, thereby manufacturing the module component 10.

[0029] 6 and 7, for example, while changing the relative position between the liquid ejection head and the module component 10 in the direction along the upper surface 31 of the insulating resin layer 3, a liquid containing a material constituting the conductive layer 5 is ejected from the liquid ejection head, and the conductive layer 5 is disposed on the upper surface 31 of the insulating resin layer 3, thereby applying the information 4. No conductive layer 5 is disposed in the area where the information 4 is applied.

[0030] The liquid ejection head has a nozzle, a liquid chamber that communicates with the nozzle and stores liquid, and a pressure generating unit that applies pressure to the liquid in the liquid chamber. The liquid ejection head ejects the liquid from the nozzle by applying pressure to the liquid in the liquid chamber with the pressure generating unit.

[0031] Here, methods for imparting information to individual modules include plate-based printing methods such as gravure printing, flexographic printing, offset printing, and silkscreen printing, as well as variable printing methods such as stamp printing, thermal transfer ribbon printing, and engraving printing (laser marker). However, when applying various information using plate-based printing methods, it is necessary to prepare and manage a large number of expensive plates, which can increase the manufacturing cost of individual modules. Furthermore, the stamp printing and thermal transfer ribbon methods in the variable printing methods have limitations on the size, surface condition, and material of the individual modules to be printed, and depending on these conditions, it may not be possible to impart information. Furthermore, the engraving printing method in the variable printing method requires the individual modules to be thick in order to remove the surface of the individual modules, which may make it difficult to thin the individual modules. Note that the thickness of the individual modules refers to the height of the individual modules in the direction normal to the upper surface 31 of the insulating resin layer 3.

[0032] In the first embodiment of the present invention, the information 4 is applied to the insulating resin layer 3 by ejecting a liquid constituting the information 4 from a liquid ejection head. This allows various information 4 to be applied without using a plate, thereby reducing the manufacturing cost of the individual module 100. Furthermore, in the first embodiment of the present invention, there are no particular restrictions on the size, surface condition, material, etc. of the individual module 100, which is the object to which the information 4 is applied, so the information 4 can be applied to individual modules 100 of various sizes, surface conditions, materials, etc. Furthermore, in the first embodiment of the present invention, the surface of the individual module 100 is not removed and therefore there is no need to ensure a large thickness for the individual module 100, and the individual module 100 can be made thinner.

[0033] Cutting lines L shown in FIGS. 6 and 7 indicate the portions along which the module component 10 is cut in the singulation step described below.

[0034] (S12: Individualization process) In S12, following the step (S11) of assigning information 4, the module component 10 is singulated into two or more individual modules 100. Fig. 8 is a schematic top view of the individual module 100, illustrating an example of the step of singulating the module component 10 in the method of manufacturing the individual module 100 according to the first embodiment of the present invention. Fig. 9 is a schematic cross-sectional view taken along line IX-IX in Fig. 8.

[0035] 8 and 9 show individual modules 100 that have been separated by cutting the module component 10 along cutting lines L. In the example shown in Fig. 8 and 9, the individual module 100 includes a first individual module 100-1 and a second individual module 100-2.

[0036] In the singulation process, the module component 10 is cut into a fully cut state in which the module component 10 is completely cut. If a conductive layer is disposed on the side surface of a module component in a half-cut state, the conductive layer is not disposed on the unexposed portion of the side surface of the module component. The shielding property of the individual module deteriorates depending on the area of the portion where the conductive layer is not disposed. By cutting the module component 10 into a fully cut state, the conductive layer 5 can be disposed on the entire side surface of the individual module 100 in the process of disposing the conductive layer 5 on the side surface of the individual module 100, which will be described later. This makes it possible to provide an individual module 100 with good shielding properties. Note that in the method of manufacturing the individual module 100, the module component 10 may first be put into a state other than the full-cut state, such as a half-cut state, and then put into the full-cut state.

[0037] In the singulation step, the module components 10 are cut by dicing. However, the cutting method is not limited to dicing, and other methods such as laser processing, cutting methods using a blade such as a saw, or melting and cutting with an arc or the like can also be used.

[0038] (S13: Step of disposing conductive layer 5 so as to cover side surface 102 of individual module 100) In S13, a conductive layer 5 is disposed so as to cover the side surfaces 102 of each of the two or more individual modules 100. Fig. 10 is a schematic top view of the individual module 100 illustrating the step of disposing a conductive layer 5 on the side surfaces 102 of the individual module 100 in the method for manufacturing the individual module 100 according to the first embodiment of the present invention. Fig. 11 is a schematic cross-sectional view taken along line XI-XI in Fig. 10.

[0039] In the step of arranging the conductive layer 5, the liquid constituting the conductive layer 5 is ejected from a liquid ejection head onto each of the side surfaces 102 of the first individual module 100-1 and the second individual module 100-2, thereby arranging the conductive layer 5 so as to cover each of the side surfaces 102 of the first individual module 100-1 and the second individual module 100-2.

[0040] 3 to 11, the thickness of the conductive layer 5 in the manufacturing method of the individual module 100 is 0.5 μm or more and 6.0 μm or less. This allows for sufficient shielding performance against electromagnetic waves. The thickness of the conductive layer 5 refers to the height of the conductive layer 5 in the normal direction to the upper surface 31 of the insulating resin layer 3.

[0041] As described above, the method for manufacturing the module 100 according to the first embodiment of the present invention makes it possible to manufacture module 100 with good shielding properties. Furthermore, in the method for manufacturing the module 100 according to the first embodiment of the present invention, information 4 corresponding to each of two or more modules 100 is provided, and a conductive layer 5 is disposed on the side surface 102 of the module 100. This allows the module 100 to be produced efficiently. As described above, the first embodiment of the present invention makes it possible to achieve both improved production efficiency and improved shielding properties.

[0042] [Second embodiment] Next, a method for manufacturing an individual module according to a second embodiment of the present invention will be described. Note that the same names and symbols as those in the previously described embodiments indicate the same or similar components or configurations, and detailed descriptions will be omitted as appropriate. This also applies to the following embodiments.

[0043] The second embodiment of the present invention is different from the first embodiment mainly in that in the step (S11) of providing the information 4 shown in Fig. 3, the information 4 is provided by disposing a conductive layer on a part of the insulating resin layer 3. The second embodiment of the present invention can also achieve the same effects as the first embodiment of the present invention.

[0044] Fig. 12 is a schematic top view of a module component 10 illustrating an example of a step of providing information 4 on an insulating resin layer 3 in a manufacturing method for an individual module 100 according to a second embodiment of the present invention. Fig. 13 is a schematic cross-sectional view taken along line XIII-XIII in Fig. 12. Note that cutting line L shown in Figs. 12 and 13 indicates the portion along which the module component 10 is cut in the individualization step.

[0045] 12 and 13, the information 4 is provided by disposing a conductive layer having an outer edge shape of a substantially square in top view on the insulating resin layer 3. For example, while changing the relative position between the liquid ejection head and the module component 10 in the direction along the upper surface 31 of the insulating resin layer 3, a liquid containing a material that constitutes the conductive layer that functions as the information 4 can be ejected from the liquid ejection head, thereby disposing the conductive layer that functions as the information 4 on the upper surface 31 of the insulating resin layer 3.

[0046] [Third embodiment] Next, a method for manufacturing an individual module according to a third embodiment of the present invention will be described.

[0047] 3, the third embodiment of the present invention differs from the first embodiment of the present invention in that it includes a step of arranging a conductive layer 7 having a color different from that of the conductive layer 5 of the predetermined shape in an area on the insulating resin layer 3 where the conductive layer 5 of the predetermined shape is not arranged, after the singulation step (S12) shown in FIG. The third embodiment of the present invention also provides the same effects as the first embodiment of the present invention.

[0048] Fig. 14 is a schematic top view of module component 100 illustrating a step of arranging conductive layer 7 having a color different from conductive layer 5 in a manufacturing method for module component 100 according to a third embodiment of the present invention. Fig. 15A is a schematic cross-sectional view taken along line XI-XI in Fig. 14.

[0049] 14 and 15A, a conductive layer 7 having a color different from that of the conductive layer 5 is disposed in an area where the conductive layer 5 is not disposed. In the examples shown in FIGS. 14 and 15A, the symbols for the information 4 and the conductive layer 7 are written together to indicate that the information 4 and the conductive layer 7 overlap. Hereinafter, the symbols may be written together for the same purpose.

[0050] 14 and 15A, conductive layer 7 is formed of a liquid metal material containing Ag nanoparticles, and conductive layer 5 is formed of a liquid metal material containing Cu nanoparticles. There is a color difference between the Ag nanoparticles and the Cu nanoparticles. The color difference between conductive layer 5 and conductive layer 7 makes it easy to view and read information 4.

[0051] By providing the conductive layer 7, it is possible to shield electromagnetic waves and the like even in areas where the conductive layer 5 is not provided, and therefore it is possible to provide an individual module 100 with good shielding properties.

[0052] 14 and 15A, the thickness of the conductive layer 7 is 0.5 μm or more and 6.0 μm or less, which makes it easy to view and read the information 4. The thickness of the conductive layer 7 refers to the height of the conductive layer 7 in the normal direction to the upper surface 31 of the insulating resin layer 3.

[0053] Here, various states in which the information 4 is provided to the module component 10 or the individual module 100 will be described with reference to FIGS. 15B, 15C, and 15D.

[0054] 15B is a schematic top view showing a first example of a module component 10 to which the information 4 has been added by disposing a conductive layer on a portion of the insulating resin layer 3 in the step of adding the information 4. In FIG. 15B, an area 360 shown in black indicates an area to which the information 4 has been added by disposing a conductive layer on the insulating resin layer 3. On the other hand, in FIG. 15B, an area 362 shown in white indicates an area to which the information 4 has not been added by not disposing a conductive layer on the insulating resin layer 3.

[0055] 15C is a schematic top view showing a second example of a module component 10 in which the information 4 is provided by disposing a conductive layer on a portion of the insulating resin layer 3 in the step of providing the information 4. In FIG. 15C, a region 371 shown in white indicates a region in which the information 4 is provided because no conductive layer is provided on the insulating resin layer 3. On the other hand, in FIG. 15C, a region 372 shown in black indicates a region in which the information 4 is not provided because a conductive layer is provided on the insulating resin layer 3.

[0056] 15D is a schematic top view showing an example of an individual module 100 in which, after the singulation process, information 4 is provided by disposing a conductive layer 7 of a different color from the conductive layer 5 of the predetermined shape in an area on the insulating resin layer 3 where the conductive layer 5 of the predetermined shape is not provided. In FIG. 15D, a gray area 381 indicates an area where information 4 is provided by disposing a conductive layer 7 of a different color from the conductive layer 5 of the predetermined shape in an area on the insulating resin layer 3 where the conductive layer 5 of the predetermined shape is not provided. On the other hand, in FIG. 15D, a black area 382 indicates an area where information 4 is not provided due to the conductive layer 5 being provided on the insulating resin layer 3.

[0057] [Fourth embodiment] <Configuration of Individual Module According to Fourth Embodiment of the Present Invention> The configuration of a component module according to a fourth embodiment of the present invention will be described with reference to Fig. 16 and Fig. 17. Fig. 16 is a schematic top view showing an example of a component module 100a according to the fourth embodiment of the present invention. Fig. 17 is a schematic cross-sectional view taken along line XVII-XVII in Fig. 16.

[0058] The individual module 100a differs mainly from the individual module 100 according to the first embodiment of the present invention described above in that it has a conductive layer 5 arranged over the entire surface of the insulating resin layer 3 and information 4 provided on the conductive layer 5.

[0059] <Method of Manufacturing Individual Module 100a> In the manufacturing method of the individual module 100a, the process (S11) of providing information shown in Figure 3 differs mainly from that of the individual module 100 according to the first embodiment of the present invention in that a conductive layer 5 is placed on the entire surface of the insulating resin layer 3, and then a conductive layer or insulating layer of a predetermined shape is placed on the conductive layer 5.

[0060] In the fourth embodiment of the present invention, the information 4 can be easily provided by disposing a conductive layer 5 on the entire surface of the insulating resin layer 3, and then disposing a conductive layer or insulating layer of a predetermined shape on the conductive layer 5. The following will mainly describe the differences from the manufacturing method of the individual module 100 shown in FIG.

[0061] Fig. 18 is a schematic top view of a module component 10 illustrating an example of a step of disposing a conductive layer 5 over the entire surface of an insulating resin layer 3 in a method for manufacturing an individual module 100a according to a fourth embodiment of the present invention. Fig. 19 is a schematic cross-sectional view taken along line XIX-XIX in Fig. 18.

[0062] 18 and 19, the conductive layer 5 is disposed over the entire surface of the insulating resin layer 3. For example, in the example shown in FIG. 19, the liquid constituting the conductive layer 5 is discharged from the liquid discharge head onto the entire upper surface 31 of the insulating resin layer 3 while changing the relative position between the liquid discharge head and the module component 10 in the direction along the upper surface 31 of the insulating resin layer 3. This allows the conductive layer 5 to be disposed over the entire surface of the insulating resin layer 3. Note that the cutting line L shown in FIGS. 18 and 19 indicates the portion along which the module component 10 is cut in the singulation process described below.

[0063] Fig. 20 is a schematic top view of a module component illustrating an example of a step of arranging a conductive layer or insulating layer of a predetermined shape on conductive layer 5 in a manufacturing method of individual module 100a according to the fourth embodiment of the present invention. Fig. 21 is a schematic cross-sectional view taken along line XXI-XXI in Fig. 20.

[0064] 21 , a conductive layer 8 having a predetermined shape is disposed on the upper surface 51 of a conductive layer 5 disposed on the upper surface 31 of the insulating resin layer 3. For example, while changing the relative position of the liquid discharge head and the module component 10 in the direction along the upper surface 31 of the insulating resin layer 3, a liquid containing a conductive material that constitutes the conductive layer 8 is discharged from the liquid discharge head to a predetermined position on the upper surface 51 of the conductive layer 5. This allows the conductive layer 8 having a predetermined shape to be disposed on the upper surface 51 of the conductive layer 5 disposed on the upper surface 31 of the insulating resin layer 3. In the example shown in FIG. 20 , a conductive layer 8 having an outer edge shape that is approximately square when viewed from above is formed.

[0065] As described above, in the method for manufacturing the module piece 100a, by disposing the conductive layer 5 on the entire surface of the insulating resin layer 3, it is possible to manufacture and provide the module piece 100a with good shielding properties.

[0066] [Fifth embodiment] <Configuration of Individual Module According to Fifth Embodiment of the Present Invention> The configuration of an individual module according to a fifth embodiment of the present invention will be described with reference to Fig. 22 and Fig. 23. Fig. 22 is a schematic top view showing an example of an individual module 100b according to the fifth embodiment of the present invention. Fig. 23 is a schematic cross-sectional view taken along line XXIII-XXIII in Fig. 22.

[0067] The individual module 100b differs from the individual module 100 according to the first embodiment of the present invention mainly in that a protective layer 6 is provided to cover the periphery of the individual module 100b. The protective layer 6 is configured to include an insulating material. Various resin materials can be used as the insulating material. By providing the protective layer 6, corrosion or oxidation of the conductive material that constitutes the conductive layer 5 can be reduced.

[0068] <Method of Manufacturing Individual Module 100b> The fifth embodiment of the present invention differs from the manufacturing method of the individual module 100 of the first embodiment of the present invention in that after the step of arranging the conductive layer 5 so as to cover the side surfaces of each of the two or more individual modules 100b, a further step of covering the periphery of each of the two or more individual modules 100b with a protective layer is included.

[0069] Fig. 24 is a schematic top view of the module 100b illustrating an example of a step of arranging a protective layer 6 on the side surface of the module 100b in a method for manufacturing the module 100b according to the fifth embodiment of the present invention. Fig. 25 is a schematic cross-sectional view taken along line XXV-XXV in Fig. 24.

[0070] In the example shown in FIGS. 24 and 25 , after the step of arranging the conductive layer 5 so as to cover the side surface of each of the individual modules 100b, the periphery of each of the individual modules 100b is covered with the protective layer 6. For example, while changing the relative position between the liquid ejection head and the individual modules 100b, a liquid containing an insulating material that forms the protective layer 6 around the periphery of the individual modules 100b is ejected from the liquid ejection head. This makes it possible to cover the periphery of each of the individual modules 100b with the protective layer 6. Note that the arrangement of the protective layer 6 is not limited to the method using the liquid ejection head, and a method using a coater, etc., can also be used.

[0071] <Manufacturing Device for Individual Module 100b> A manufacturing device for the individual module 100b will be described with reference to FIGS.

[0072] (First example) Fig. 26 is a schematic top view showing a plurality of piece modules 100b arranged in a transfer mechanism 211 provided in a manufacturing apparatus 200a for manufacturing piece modules 100b according to a first example. Fig. 27 is a schematic cross-sectional view showing the configuration of the manufacturing apparatus 200a for piece modules 100b according to a first example. The transfer mechanism 211 and piece modules 100b in Fig. 27 show a cross section taken along line XXVII-XXVII in Fig. 26.

[0073] 26 , each of the multiple individual modules 100b has a substantially rectangular outer edge shape in a top view. The multiple individual modules 100b are arranged on the transport mechanism 211 so that their respective upper surfaces 103 face upward and their respective side surfaces 102 are parallel to a direction perpendicular to the transport direction 210. The multiple individual modules 100b are also arranged on the transport mechanism 211 so that their respective side surfaces 102 are inclined with respect to the transport direction 210 in a top view. With this arrangement, two of the four side surfaces 102 of each of the multiple individual modules 100b can be seen from a direction along the transport direction 210.

[0074] 27, the manufacturing apparatus 200a includes a transport mechanism 211 capable of transporting the individual module 100b back and forth in a transport direction 210, and a plurality of liquid ejection heads 212, each of which ejects a liquid containing either a conductive material or an insulating material. The manufacturing apparatus 200a also includes irradiation units 213a and 213b, each of which irradiates with ultraviolet light the liquid containing the insulating material that is ejected from the liquid ejection head 212 and applied to the individual module 100b.

[0075] The liquid ejection heads 212 include liquid ejection heads 212a-1 and 212a-2, each of which ejects a liquid containing a conductive material, and liquid ejection heads 212b-1 and 212b-2, each of which ejects a liquid containing an insulating material. The liquid ejection heads 212a-1, 212a-2, 212b-1, and 212b-2 are arranged side by side in the transport direction 210.

[0076] The irradiation unit 213a and the irradiation unit 213b are arranged in the transport direction 210 so as to sandwich the liquid ejection head 212a-1, the liquid ejection head 212a-2, the liquid ejection head 212b-1, and the liquid ejection head 212b-2 between them.

[0077] The liquid ejection head 212a-1 and the liquid ejection head 212b-1 are disposed in the middle of the liquid ejection head 212a-1, the liquid ejection head 212a-2, the liquid ejection head 212b-1, and the liquid ejection head 212b-2 in the transport direction 210. The liquid ejection head 212a-1 and the liquid ejection head 212b-1 eject liquid directly downward, that is, in a direction perpendicular to the transport direction 210. By ejecting liquid downward in a direction perpendicular to the transport direction 210, the liquid ejection head 212a-1 and the liquid ejection head 212b-1 can apply liquid to the upper surface 103 of the individual module 100b that has been transported by the transport mechanism 211 to a position directly below the liquid ejection head 212a-1 and the liquid ejection head 212b-1.

[0078] Liquid ejection head 212a-2 and liquid ejection head 212b-2 are arranged outside liquid ejection head 212a-1 and liquid ejection head 212b-1 in transport direction 210. Liquid ejection head 212a-2 and liquid ejection head 212b-2 are arranged at an angle with respect to transport direction 210 so that the ejected liquid can be applied to side surface 102 of individual module 100b transported by transport mechanism 211.

[0079] Liquid ejection head 212b-1 and liquid ejection head 212b-2 each eject an ultraviolet-light-curable liquid. The liquid ejected from liquid ejection head 212b-1 and liquid ejection head 212b-2 constitutes protective layer 6 in individual module 100b. Irradiation unit 213a and irradiation unit 213b irradiate the ultraviolet-light-curable liquid applied to individual module 100b by liquid ejection head 212b-1 and liquid ejection head 212b-2 with ultraviolet light, thereby curing the ultraviolet-light-curable liquid and fixing it to individual module 100b.

[0080] The manufacturing apparatus 200a has liquid ejection heads 212a-1, 212a-2, 212b-1, and 212b-2, and is therefore able to apply liquid to both the top surface 103 and the side surface 102 of the individual module 100b. The manufacturing apparatus 200a can form a conductive layer that shields electromagnetic waves on both the top surface 103 and the side surface 102 of the individual module 100b using the liquid ejected from the liquid ejection heads 212a-1 and 212a-2. The manufacturing apparatus 200a also can form a protective layer 6 that protects the conductive layer on both the top surface 103 and the side surface 102 of the individual module 100b using the liquid ejected from the liquid ejection heads 212b-1 and 212b-2.

[0081] 26, in the manufacturing apparatus 200a, the plurality of individual modules 100b are arranged on the transport mechanism 211 so that the respective side surfaces 102 are inclined with respect to the transport direction 210 in a top view, thereby making it possible to apply liquid to two side surfaces 102 in one transport in either the forward or backward direction. This makes it possible to efficiently apply liquid to the side surfaces 102 of the plurality of individual modules 100b, thereby forming the conductive layer and the protective layer 6.

[0082] In addition, when the protective layer 6 is not formed on the upper surface 103 and the side surface 102 of the individual module, i.e., when manufacturing the individual module 100 or the individual module 100a, the manufacturing apparatus 200a does not need to have the liquid ejection head 212b-1, the liquid ejection head 212b-2, the irradiation unit 213a, and the irradiation unit 213b. (Second example) 28 is a diagram showing an example of a manufacturing apparatus 200b for manufacturing an individual module 100b according to Example 2. The manufacturing apparatus 200b according to Example 2 differs from the manufacturing apparatus 200a according to Example 1 in that the manufacturing apparatus 200b applies liquid ejected from the liquid ejection head 212 to the upper surface 103 or the side surface 102 of each of the multiple individual modules 100b that are arranged with their orientations changed so that the upper surface 103 or the side surface 102 faces the liquid ejection head 212.

[0083] 28 includes a liquid ejection head 212, and irradiation units 213a and 213b. The liquid ejection head 212 includes a liquid ejection head 212a that ejects a liquid containing a conductive material, and a liquid ejection head 212b that ejects a liquid containing an insulating material. The irradiation units 213a and 213b irradiate the ultraviolet light-curable liquid ejected from the liquid ejection head 212b with ultraviolet light to cure the liquid.

[0084] 28, when applying liquid to the side surface 102, the manufacturing apparatus 200b is disposed so that the side surface 102 faces the liquid ejection head 212, and ejects the liquid onto the side surface 102 of the individual module 100b being transported in the transport direction 210. When applying liquid to the top surface 103, the manufacturing apparatus 200b is disposed so that the top surface 103 faces the liquid ejection head 212, and ejects the liquid onto the top surface 103 of the individual module 100b being transported in the transport direction 210. The orientation of the individual module 100b may be changed manually by an operator, or automatically by a driving unit such as a robot.

[0085] In addition, when the protective layer 6 is not formed on the upper surface 103 and side surface 102 of the individual module, i.e., when manufacturing the individual module 100 or the individual module 100a, the manufacturing apparatus 200b does not need to have the liquid ejection head 212b, the irradiation unit 213a, and the irradiation unit 213b.

[0086] As described above, the method for manufacturing the individual module 100b can manufacture and provide the individual module 100b with good shielding properties.

[0087] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments of the present invention without departing from the scope of the claims.

[0088] All ordinal numbers, quantitative numbers, and other figures used in the description of the embodiments of the present invention are provided as examples to specifically explain the technology of the present invention, and the present invention is not limited to the illustrated figures. Furthermore, the connection relationships between components are provided as examples to specifically explain the technology of the present invention, and do not limit the connection relationships that realize the functions of the present invention.

[0089] The liquid ejection head according to the embodiment may be any functional component that ejects or sprays liquid from a nozzle. The energy source for ejecting the liquid may be a piezoelectric actuator, a thermal actuator using an electrothermal conversion element such as a heating resistor, or an electrostatic actuator consisting of a vibration plate and an opposing electrode. However, the ejection energy generating means used is not limited to these examples.

[0090] The method for manufacturing a module according to the present invention can provide a module with good shielding properties, and therefore can be suitably used for manufacturing modules used in mobile devices such as smartphones, tablet terminals, and notebook PCs (Personal Computers), as well as in PCs and home appliances, etc. However, the method for manufacturing a module according to the present invention is not limited to the above applications, and can be used for manufacturing modules used in a variety of applications.

[0091] For example, aspects of the present invention are as follows. <1> A method for manufacturing an individual module includes the steps of: providing information on an insulating resin layer in a module component including a substrate, electronic components arranged on the substrate, and an insulating resin layer covering each of the substrate and the electronic components; singulating the module component into two or more individual modules; and arranging a conductive layer to cover the side surfaces of each of the two or more individual modules, wherein the information corresponds to each of the two or more individual modules. <2> In the step of providing information, the information is provided by disposing the conductive layer on a part of the insulating resin layer. <1> 1 is a method for manufacturing the individual module described in <3> the step of arranging a conductive layer having a color different from that of the conductive layer of the predetermined shape in an area on the insulating resin layer where the conductive layer of the predetermined shape is not arranged after the step of dividing the insulating resin layer into individual pieces, <1> or the above <2> 1 is a method for manufacturing the individual module described in <4> In the step of providing information, the conductive layer is disposed on the entire surface of the insulating resin layer, and then the conductive layer or insulating layer having a predetermined shape is disposed on the conductive layer. <1> From the above <3> 1 is a method for manufacturing the individual module described in any one of the above. <5> the step of arranging a conductive layer so as to cover the side surfaces of each of the two or more individual modules, and then further covering the periphery of each of the two or more individual modules with a protective layer, <1> From the above <4> One of these is a method for manufacturing individual modules. <6> the information is provided on the upper surface of the insulating resin layer by ejecting a liquid containing either a conductive material or an insulating material from a liquid ejection head; <1> From the above <5> 1 is a method for manufacturing the individual module described in any one of the above. <7> A method for manufacturing an individual module described in any one of claims 1 to 6, in which a conductive layer is disposed on the upper surface of the insulating resin layer and on each of the side surfaces of the individual module by ejecting a conductive material from a liquid ejection head. <8> a liquid ejection head for disposing the conductive layer on each side surface of the individual module is tilted relative to a head for disposing the conductive layer on the top surface of the individual module; <7> 1 is a method for manufacturing the individual module described in [Explanation of symbols]

[0092] 1 board 12 Ground Pattern 2. Electronic Components 2-1 First electronic component 2-2 Secondary Electronic Components 2-3 Third electronic component 2-4 The fourth electronic component 2-5 The fifth electronic component 2-6 The Sixth Electronic Component 3. Insulating resin layer 31 Upper surface of insulating resin layer 4. Information 5, 7, 8 Conductive layers 51 Upper surface of conductive layer 6 Protective layer 10 Module Components 100, 100a, 100b individual modules 100-1 First individual module 100-2 Second individual module 102 Side of individual module 103 Top surface of individual module 200a, 200b Individual module manufacturing equipment 210 Conveying direction 211 Transport mechanism 212, 212a, 212b liquid ejection head 213, 213a, 213b irradiation unit 360, 371, 381 Areas where information was given 362, 372, 382 Areas where no information is provided L cutting line [Prior art documents] [Patent documents]

[0093] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-172176

Claims

1. a step of providing information on an insulating resin layer in a module component including a substrate, an electronic component disposed on the substrate, and an insulating resin layer covering the substrate and the electronic component; Next, a step of singulating the module component into two or more individual modules; and disposing a conductive layer so as to cover a side surface of each of the two or more individual modules; A method for manufacturing an individual module, wherein the information corresponds to each of two or more of the individual modules.

2. The method for manufacturing an individual module according to claim 1 , wherein in the step of providing the information, the information is provided by disposing the conductive layer on a portion of the insulating resin layer.

3. 2. The method for manufacturing an individual module according to claim 1, further comprising, after the singulation step, a step of arranging a conductive layer having a color different from the conductive layer of the predetermined shape in an area on the insulating resin layer where the conductive layer of the predetermined shape is not arranged.

4. 2. The method for manufacturing an individual module according to claim 1, wherein in the step of providing information, the conductive layer is placed over the entire surface of the insulating resin layer, and then the conductive layer or insulating layer of a predetermined shape is placed on the conductive layer.

5. 2. The method for manufacturing an individual module according to claim 1, further comprising the step of covering the periphery of each of the two or more individual modules with a protective layer after the step of arranging a conductive layer so as to cover a side surface of each of the two or more individual modules.

6. The method for manufacturing an individual module according to claim 1 , wherein the information is provided on the upper surface of the insulating resin layer by ejecting a liquid containing either a conductive material or an insulating material from a liquid ejection head.

7. The method for manufacturing an individual module according to claim 1 , wherein the conductive layer is disposed on the upper surface of the insulating resin layer and on the side surface of the individual module by discharging a conductive material from a liquid discharge head.

8. The method for manufacturing an individual module according to claim 7 , wherein a liquid ejection head for disposing the conductive layer on each side surface of the individual module is tilted relative to a head for disposing the conductive layer on the top surface of the individual module.

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