Component manufacturing method

Abstract

To provide a technology to suppress component warpage in a component manufacturing method.SOLUTION: A component manufacturing method includes a preparation step of preparing a plurality of fired ceramic bodies and a plurality of pressurizing members, a division step of dividing the plurality of fired ceramic bodies into a plurality of groups and manufacturing a laminate in each of the plurality of groups in which the fired ceramic bodies and the pressurizing members are stacked, and a processing step of accommodating the plurality of laminates in each of a plurality of accommodation sections of a hot isostatic pressing device such that the stacking direction of the laminate is aligned vertically, and performing a hot isostatic pressing process on each of the plurality of fired ceramic bodies while applying a load using the weight of the pressurizing member.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a component. [Background technology]

[0002] BACKGROUND ART Conventionally, a method for manufacturing parts used in semiconductor manufacturing equipment by hot isostatic pressing has been known (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7245296 Summary of the Invention [Problem to be solved by the invention]

[0004] However, even with prior art such as that disclosed in Patent Document 1, there is still room for improvement in the technology for suppressing warpage of components in the component manufacturing method.

[0005] An object of the present invention is to provide a technique for suppressing warpage of a component in a component manufacturing method. [Means for solving the problem]

[0006] The present invention has been made to solve at least part of the above-mentioned problems, and can be realized in the following aspects.

[0007] (1) According to one aspect of the present invention, there is provided a method for manufacturing a component for use in semiconductor manufacturing equipment, comprising: a preparation step of preparing a plurality of fired ceramic bodies and a plurality of pressing members; a division step of dividing the plurality of fired ceramic bodies into a plurality of groups and producing a stack in each of the plurality of groups by stacking the fired ceramic bodies and the pressing members; and a processing step of accommodating the plurality of stacks in a plurality of accommodation units of a hot isostatic pressing apparatus so that the stacking direction of the stacks is aligned vertically, and performing a hot isostatic pressing process on each of the plurality of fired ceramic bodies while applying a load using the weight of the pressing member.

[0008] According to this configuration, when hot isostatic pressing is performed on a plurality of fired ceramic bodies, the fired ceramic bodies are divided into a plurality of groups, and a laminate is produced by stacking the fired ceramic bodies and a pressing member in each of the plurality of groups. In the processing step, the plurality of laminates are accommodated in each of a plurality of accommodation units of the hot isostatic pressing device so that the stacking direction of the laminates is aligned vertically, and the hot isostatic pressing is performed while applying a load to each of the fired ceramic bodies using the weight of the pressing member. This reduces the load applied to the lower fired ceramic bodies of the plurality of fired ceramic bodies included in the laminate compared to when the hot isostatic pressing is performed in a stacked state. This reduces warping of the ceramic member produced by the hot isostatic pressing.

[0009] (2) In the method for manufacturing a component according to the above aspect, the preparing step may include preparing a first pressing member and a second pressing member heavier than the first pressing member as the plurality of pressing members, and the dividing step may include stacking the fired ceramic bodies and the first pressing member in at least one of the plurality of groups, and then stacking the second pressing member vertically at the top of the stack produced for that group to produce the stack. This configuration allows an appropriate load to be applied to the fired ceramic body at the top of the stack in the vertical direction. This reduces variations in warpage in the stack due to differences in applied load, and also reduces warpage of each of the plurality of fired ceramic bodies included in the stack.

[0010] (3) In the method for manufacturing a component according to the above aspect, the dividing step may divide the fired ceramic bodies into a plurality of groups so that the number of fired ceramic bodies contained in each of the plurality of laminates is the same. According to this configuration, by making the number of fired ceramic bodies contained in each of the plurality of housing sections the same, the gas pressure inside each of the plurality of housing sections can be made approximately the same. This makes it possible to stabilize the pressurizing conditions in the hot isostatic pressing process.

[0011] (4) In the component manufacturing method of the above aspect, the component may be an electrostatic chuck, the preparation step may further include preparing a base, and the manufacturing method may further include a bonding step of bonding the sintered ceramic body that has been hot isostatically pressed in the treatment step to the base. According to this configuration, warping of the sintered ceramic body that has been isostatically pressed in the treatment step is suppressed. As a result, when a wafer is placed on the sintered ceramic body that has been isostatically pressed as an electrostatic chuck, the wafer and the sintered ceramic body can be brought into uniform contact with each other. Therefore, for example, when a wafer is heated using an electrostatic chuck, the wafer can be heated uniformly.

[0012] The present invention can be realized in various forms, for example, in the form of a component manufactured by a component manufacturing method, a semiconductor manufacturing apparatus including a component manufactured by a component manufacturing method, a semiconductor device manufacturing method including a component manufacturing method, a control method for an apparatus that executes a component manufacturing method, a computer program that causes an apparatus that executes a component manufacturing method to estimate a component manufacturing method, etc. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view of an electrostatic chuck manufactured by the component manufacturing method of the first embodiment. FIG. [Figure 2] FIG. 1 is a cross-sectional schematic view of an electrostatic chuck. [Figure 3] 4 is a flowchart of a method for manufacturing a component according to the first embodiment. [Figure 4] FIG. 2 is a first diagram illustrating a method for manufacturing a component according to the first embodiment. [Figure 5] FIG. 10 is a second diagram illustrating the method for manufacturing the component of the first embodiment. [Figure 6] FIG. 10 is a third diagram illustrating the method for manufacturing the component of the first embodiment. [Figure 7] FIG. 10 is a diagram illustrating the evaluation results of the ceramic part. [Figure 8] 10A to 10C are diagrams illustrating a method for manufacturing a component according to a second embodiment. [Figure 9] 10A to 10C are diagrams illustrating a modified example of the method for manufacturing a component according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] First Embodiment FIG. 1 is a perspective view of an electrostatic chuck manufactured by the component manufacturing method of the first embodiment. FIG. 2 is a cross-sectional schematic diagram of the electrostatic chuck. The electrostatic chuck 100 of the first embodiment is used, for example, to secure a wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a ceramic portion 10, a base portion 20, and a bonding portion 30. As shown in FIG. 1, the electrostatic chuck 100 is stacked in the order of the ceramic portion 10, the bonding portion 30, and the base portion 20 from the positive side of the z-axis. In this embodiment, the electrostatic chuck 100 is a columnar body having a substantially circular cross-section perpendicular to the z-axis. Note that each figure schematically illustrates the arrangement of each portion and does not accurately represent the dimensional ratios of the portions.

[0015] The ceramic portion 10 is a plate-like member having a circular shape and is made of ceramic. As the ceramic forming the ceramic portion 10, a ceramic containing, for example, alumina (Al2O3) or aluminum nitride (AlN) as a main component is used from the viewpoints of strength, abrasion resistance, plasma resistance, and its relationship with the material forming the base portion 20. Here, the term "main component" refers to the component with the largest content ratio by weight. The diameter of the ceramic portion 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the ceramic portion 10 is, for example, about 2 mm to 10 mm. Note that the material forming the ceramic portion 10 is not limited to alumina or aluminum nitride, and may be any ceramic.

[0016] The ceramic part 10 has an internal electrode 11 and a heater 12. The internal electrode 11 is made of a conductive material such as tungsten or molybdenum. When power is supplied from a power supply (not shown), the internal electrode 11 generates an electrostatic attraction. The wafer W is attracted and fixed to the mounting surface 10a of the ceramic part 10 by the electrostatic attraction generated by the internal electrode 11. The heater 12 is a resistance heating element made of a conductive material such as tungsten or molybdenum. When power is supplied from the power supply, the heater 12 generates heat and heats the wafer W mounted on the mounting surface 10a of the ceramic part 10.

[0017] The base portion 20 is a circular plate-like member having a diameter larger than that of the ceramic portion 10. The base portion 20 is formed from a metal or a composite material. Examples of metals that can be used to form the base portion 20 include aluminum (Al) and titanium (Ti). Examples of composite materials that can be used to form the base portion 20 include a composite material containing a porous ceramic primarily composed of silicon carbide (SiC) and an aluminum alloy. The aluminum alloy contained in the composite material may contain silicon (Si) or magnesium (Mg), or may contain other elements as long as they do not affect the properties, etc. The base portion 20 of this embodiment is formed from a composite material. The diameter of the base portion 20 is, for example, approximately 220 mm to 550 mm (usually approximately 220 mm to 350 mm), and the thickness of the base portion 20 is, for example, approximately 20 mm to 40 mm. The material that can be used to form the base portion 20 is not limited to a metal or a composite material. Furthermore, although the base portion 20 has a larger diameter than the ceramic portion 10, the relationship between the size of the ceramic portion 10 and the size of the base portion 20 is not limited to this.

[0018] The base portion 20 has a coolant flow path 21. When a coolant such as a fluorine-based inert liquid or water is flowed through the coolant flow path 21, the base portion 20 is cooled. When the base portion 20 is cooled, the wafer W that is fixed by suction to the mounting surface 10a of the ceramic portion 10 is cooled via the bonding portion 30 and the ceramic portion 10.

[0019] The bonding portion 30 is, for example, a silicone adhesive, and bonds the ceramic portion 10 and the base portion 20. The thickness of the bonding portion 30 is, for example, about 0.03 mm to 1 mm. Note that the material of the bonding portion 30 that bonds the ceramic portion 10 and the base portion 20 is not limited to a silicone adhesive.

[0020] Next, a method for manufacturing the electrostatic chuck 100 of this embodiment will be described. In the method for manufacturing the electrostatic chuck 100 of this embodiment, the ceramic portion 10 is manufactured by subjecting the fired ceramic body to a hot isostatic pressing (HIP) treatment. This reduces the number of pores in the ceramic structure, and the ceramic portion 10 can be densified.

[0021] 3 is a flowchart of a method for manufacturing a component according to this embodiment. The flowchart shown in FIG. 3 is a flowchart of a method for manufacturing an electrostatic chuck 100, including a method for manufacturing the ceramic portion 10. In the method for manufacturing the electrostatic chuck 100 according to this embodiment, first, as a "preparation step," a plurality of fired ceramic bodies, a plurality of pressing members, and a base portion 20 are prepared (step S11). In step S11, a plurality of fired ceramic bodies to be hot isostatically pressed, a plurality of pressing members for suppressing warping of the fired ceramic bodies during the hot isostatic pressing, and the base portion 20 of the electrostatic chuck 100 are prepared.

[0022] In preparing the plurality of fired ceramic bodies, first, an unfired plate-shaped ceramic body is prepared. In this embodiment, the unfired ceramic body can be prepared by using a sheet lamination method or a press molding method.

[0023] In the sheet lamination method, alumina particles with an average particle size of approximately 1.0 μm, butyral resin, a plasticizer, and a solvent are first mixed to prepare a slurry. The resulting slurry is then thinned using a doctor blade method to produce multiple green sheets. A solvent containing butyl carbitol and dibutyl phthalate is applied to one side of each of the prepared green sheets, and multiple green sheets are stacked to produce a sheet laminate. The sheet laminate is then thermocompressed at approximately 70°C under a predetermined molding pressure to produce an unfired ceramic compact. The ceramic compact is then printed and stacked with metallization such as tungsten using a known method, thereby incorporating the above-mentioned internal electrodes 11 and heater 12.

[0024] In the press molding method, alumina particles with an average particle size of approximately 1.0 μm, polyvinyl alcohol resin, and water are first mixed to prepare a slurry. The resulting slurry is spray-dried to produce spray granules. The spray granules are then press-molded at a predetermined molding pressure to produce an unfired ceramic molded body. Note that the method for producing an unfired ceramic molded body is not limited to this.

[0025] Next, the produced green ceramic compact is degreased in nitrogen, and then fired in a humidified hydrogen-nitrogen atmosphere at a predetermined firing temperature, for example, 1500° C. to 1600° C. This forms a fired ceramic body.

[0026] In step S11, a plurality of pressurizing members, each of which is a circular plate-shaped member slightly larger than the fired ceramic body, are prepared. In this embodiment, a first pressurizing member and a second pressurizing member heavier than the first pressurizing member are prepared. Both of the two types of pressurizing members prepared in this embodiment are made of molybdenum.

[0027] In step S11, the base portion 20 made of a composite material is prepared. The base portion 20 is produced by melting an aluminum alloy, the main component of which is aluminum, into a porous ceramic, the main component of which is silicon carbide, and then pressurizing and infiltrating the aluminum alloy into the porous ceramic.

[0028] Next, in a "dividing step," the plurality of fired ceramic bodies are divided into a plurality of groups, and a laminate is produced in each of the plurality of groups by stacking the fired ceramic bodies and pressurizing members (step S12). In step S12, the fired ceramic bodies are divided into a plurality of groups, the number of which can be processed in one run in a hot isostatic pressing apparatus (hereinafter referred to as "HIP furnace") described below. The fired ceramic bodies divided into each of the plurality of groups are stacked with pressurizing members for each group to produce a laminate.

[0029] FIG. 4 is a first diagram illustrating a method for manufacturing a component according to this embodiment. FIG. 4 schematically illustrates a process for dividing a plurality of fired ceramic bodies into a plurality of groups and then producing a laminate for each of the plurality of groups. Specifically, assuming that 30 fired ceramic bodies Cb can be processed in a single operation in a HIP furnace, for example, the 30 fired ceramic bodies Cb are divided into six groups G1 to G6. As a result, in this embodiment, each of the plurality of groups G1 to G6 contains five fired ceramic bodies Cb. The number of groups into which the plurality of fired ceramic bodies are divided is not limited to six.

[0030] Next, two types of pressurizing members are used to fabricate stacks for each of the six groups G1 to G6. The two types of pressurizing members used in this embodiment are a first pressurizing member Pm1 and a second pressurizing member Pm2, which is heavier than the first pressurizing member Pm1. Specifically, as shown in the stack L3 in FIG. 4, fired ceramic bodies Cb and the first pressurizing member Pm1 are stacked, and then the second pressurizing member Pm2 is stacked vertically at the top of the stack L3 fabricated for one group G3 to fabricate the stack L3. Here, the "vertical direction" does not necessarily mean the "vertical direction" in the strict sense, but may also mean a direction that appears vertical at a glance. In the stack L3 of this embodiment, fired ceramic bodies Cb and first pressurizing members Pm1 are alternately stacked. 4, a method for producing the laminate L3 using five fired ceramic bodies Cb included in group G3 has been described, but laminates L1, L2, L3 to L6 are produced in the same manner for the other groups G1, G2, G4 to G6 shown in Fig. 4. In the dividing step of this embodiment, the fired ceramic bodies Cb are divided into multiple groups G1 to G6 so that the number of fired ceramic bodies Cb included in each of the multiple laminates L1 to L6 is the same.

[0031] Next, in the "treatment step", a plurality of stacks are accommodated in each of a plurality of accommodation sections of the hot isostatic pressing device so that the stacking direction of the stacks is aligned vertically, and a hot isostatic pressing treatment is performed on each of the plurality of fired ceramic bodies while applying a load using the weight of the pressing member (step S13). In step S13, the fired ceramic bodies Cb included in the plurality of stacks L1 to L6 produced in step S12 are subjected to the hot isostatic pressing treatment.

[0032] FIG. 5 is a second diagram illustrating the manufacturing method of the component of this embodiment. FIG. 5 is a diagram illustrating the housing Ct that houses the laminate L3. In the processing step of step S13, first, each of the multiple laminates produced in step S12 is housed in the housing. Specifically, as shown in FIG. 5, a hollow cylindrical housing Ct is prepared. The housing Ct has a flat base Ct1, a cylindrical tube Ct2, and a flat cover Ct3. In this embodiment, the housing Ct is made of carbon. To house the laminate L3 in the housing Ct, for example, the laminate L3 is placed on the base Ct1, and then the tube Ct2 is placed at a predetermined position on the base Ct1. This results in the laminate L3 being surrounded by the tube Ct2. Finally, the cover Ct3 is placed on the upper end Ct21 of the tube Ct2. As a result, the stack L3 is accommodated in the inner side Ct0 of the accommodation portion Ct with the stacking direction of the stack L3 aligned with the axial direction Dc of the cylindrical portion Ct2. In this embodiment, the accommodation of the stack L3 in the accommodation portion Ct is performed in this manner for all of the multiple stacks L1 to L6. Note that the shape of the accommodation portion Ct shown in FIG. 5 is merely an example, and the shape of the accommodation portion Ct is not limited to this. Furthermore, the method of accommodating the stack L3 in the accommodation portion is not limited to this.

[0033] FIG. 6 is a third diagram illustrating a method for manufacturing a component according to this embodiment. FIG. 6 illustrates a method for performing a hot isostatic pressing process on the fired ceramic bodies Cb included in each of the plurality of laminates L1 to L6 housed in the housing Ct in one operation. A hot isostatic pressing (HIP) furnace 40 used in the method for manufacturing the electrostatic chuck 100 according to this embodiment includes a high-pressure vessel 41, a heat insulating section 42, and a plurality of heaters 43. The high-pressure vessel 41 has a lower lid 41a, a cylindrical section 41b, and an upper lid 41c. The interior 410 of the high-pressure vessel 41 is large enough to house the heat insulating section 42 and is formed to maintain airtightness. The upper lid 41c has a gas inlet / outlet 41d for allowing a pressure medium gas to flow in and out of the interior 410. The heat insulating section 42 has a cylindrical shape with a bottom and is disposed on the interior 410 with its opening positioned vertically downward. The heater 43 is disposed inside 420 of the heat insulating section 42, and is capable of heating the fired ceramic bodies Cb included in the stacks L1 to L6 disposed inside 420 of the heat insulating section 42.

[0034] In the processing step of step S13, as shown in FIG. 5, each of the multiple laminates L1 to L6 is accommodated in the inner side Ct0 of the accommodation unit Ct, and then the multiple accommodation units Ct are stacked inside the heat insulating unit 42. The multiple accommodation units Ct are stacked so that the stacking direction of each of the multiple laminates L1 to L6 accommodated in each accommodation unit Ct is aligned with the vertical direction Dv shown in FIG. 6. Here, the "vertical direction" does not necessarily mean the "vertical direction" in the strict sense, but may also mean a direction that appears vertical at first glance. A pressurized medium gas (argon gas) is introduced into the inside 410 of the high-pressure vessel 41 through the gas inlet / outlet 41d, and the heater 43 is activated (processing pressure: approximately 200 MPa, processing temperature: approximately 1400°C). The fired ceramic body Cb accommodated in the accommodation unit Ct is heated and uniformly compressed to the inside by the pressure of the pressurized gas, thereby increasing its density. At this time, the fired ceramic body Cb shrinks, which may cause warping of the fired ceramic body Cb. However, in the manufacturing method of the electrostatic chuck 100 of this embodiment, a load is applied to the fired ceramic body Cb by the first pressing member Pm1 and the second pressing member Pm2, which can prevent warping of the fired ceramic body Cb. In this way, the ceramic part 10 of the electrostatic chuck 100 is manufactured.

[0035] Next, in the "bonding step," the fired ceramic body and the base portion are bonded together (step S14). In step S14, the ceramic portion 10 fabricated in step S13 and the base portion 20 prepared in step S11 are bonded together with a silicone-based adhesive. Next, the ceramic portion 10 and the base portion 20 bonded together with the silicone-based adhesive are heated under pressure in a vacuum. This hardens the silicone-based adhesive, forming the bonded portion 30. Thereafter, post-processing such as polishing the outer periphery and top and bottom surfaces and forming terminals is performed as necessary, and the electrostatic chuck 100 is manufactured.

[0036] Next, an evaluation test for evaluating the characteristics of the ceramic part fabricated by the electrostatic chuck manufacturing method will be described. In this evaluation test, the flatness of the ceramic part fabricated by the manufacturing method of this embodiment was compared with that of the ceramic part fabricated by the manufacturing method of the comparative example. In the manufacturing method of the comparative example, the maximum number of sintered ceramic bodies that can be subjected to a single hot isostatic pressing process in a single HIP furnace was prepared, and the prepared sintered ceramic bodies and pressing members were alternately stacked to form a comparative laminate, which was then placed in the HIP furnace and subjected to hot isostatic pressing. Therefore, the comparative laminate had a greater number of layers, each consisting of a combination of sintered ceramic bodies and pressing members, than the laminate of this embodiment.

[0037] FIG. 7 is a diagram illustrating the evaluation results of the ceramic part. FIG. 7(a) shows the flatness of the ceramic part fabricated by the manufacturing method of this embodiment (hereinafter simply referred to as the "ceramic part of this embodiment"), and FIG. 7(b) shows the flatness of the ceramic part fabricated by the manufacturing method of the comparative example (hereinafter simply referred to as the "ceramic part of the comparative example"). For comparison with the ceramic part of this embodiment, FIG. 7(b) shows the flatness of the ceramic parts of the comparative example from the first to fifth layers, counting from the bottom in the vertical direction of the laminate. In this evaluation test, the flatness of the ceramic part was measured using a three-dimensional measuring device.

[0038] In each of Figures 7(a) and (b), a dotted line Ut corresponding to 0.10 mm is shown as the upper limit tolerance for flatness. As shown in Figure 7(a), in the ceramic part of this embodiment, the flatness was below the upper limit tolerance for all stages from the first to the fifth stage. On the other hand, in the ceramic part of the comparative example, it was confirmed that the flatness deteriorated as the number of stages decreased. In the ceramic part of the comparative example, it was confirmed that the flatness of the first to third stages exceeded the upper limit tolerance.

[0039] According to the manufacturing method of the ceramic part 10 of the present embodiment described above, when hot isostatic pressing is performed on a plurality of fired ceramic bodies Cb, the fired ceramic bodies Cb are divided into a plurality of groups G1 to G6, and in each of the groups G1 to G6, the fired ceramic bodies Cb and the pressing members Pm1 and Pm2 are stacked to form stacked bodies L1 to L6. In the hot isostatic pressing process, the stacked bodies L1 to L6 are accommodated in each of a plurality of accommodation units Ct of the hot isostatic pressing device 40 so that the stacking direction of the stacked bodies L1 to L6 is aligned vertically. The hot isostatic pressing is performed while applying a load to each of the fired ceramic bodies Cb using the weight of the pressing members Pm1 and Pm2. This reduces the load applied to the fired ceramic bodies Cb below the stacked bodies L1 to L6, compared to when hot isostatic pressing is performed on the fired ceramic bodies Cb stacked all together. This makes it possible to suppress warping of the ceramic member produced by hot isostatic pressing.

[0040] Furthermore, according to the manufacturing method for the ceramic part 10 of this embodiment, the stacks L1 to L6 are fabricated by stacking a second pressurizing member Pm2, which is heavier than the first pressurizing member Pm1, at the top in the vertical direction in each of the stacks L1 to L6. This allows an appropriate load to be applied to the fired ceramic body Cb, which is the top in the vertical direction, in each of the stacks L1 to L6. Therefore, in each of the stacks L1 to L6, variations in warpage due to differences in the applied load can be suppressed, and warpage of each of the fired ceramic bodies Cb included in the stacks L1 to L6 can be suppressed.

[0041] Furthermore, according to the manufacturing method of the ceramic part 10 of this embodiment, by making the number of fired ceramic bodies Cb accommodated in each of the plurality of accommodation portions Ct the same, it is possible to make the gas pressure inside the respective accommodation portions Ct0 approximately the same, thereby stabilizing the pressurizing conditions in the hot isostatic pressing process.

[0042] Furthermore, according to the manufacturing method of the ceramic portion 10 of this embodiment, warping of the fired ceramic body Cb (ceramic portion 10) that has been subjected to isostatic pressing in the processing step is suppressed. As a result, when a wafer W is placed on the ceramic portion 10 as the electrostatic chuck 100, the ceramic portion 10 and the wafer W can be brought into uniform contact with each other. Therefore, for example, when the wafer W is heated using the electrostatic chuck 100, the wafer W can be heated uniformly.

[0043] Second Embodiment 8A and 8B are diagrams illustrating a method for manufacturing an electrostatic chuck according to the second embodiment. The method for manufacturing an electrostatic chuck according to the second embodiment is different from the method for manufacturing an electrostatic chuck according to the first embodiment (FIGS. 3 and 5) in the type of pressurizing member used when manufacturing the stack.

[0044] In the manufacturing method for an electrostatic chuck according to the second embodiment, a stacked body is produced in which fired ceramic bodies and pressing members are stacked using two types of pressing members in the "dividing step." Specifically, as shown in the stacked body L3 in Fig. 8, after the fired ceramic bodies Cb and the first pressing member Pm1 are stacked, in the stacked body L3 produced for one group G3, the first pressing member Pm1 is also stacked at the top in the vertical direction, and then the second pressing member Pm2 is stacked, thereby producing the stacked body L3.

[0045] According to the manufacturing method of the ceramic part 10 of the present embodiment described above, the laminate L3 is fabricated by stacking the first pressurizing member Pm1 and the second pressurizing member Pm2 at the top in the vertical direction of the laminate L3. This allows an appropriate load to be applied to the fired ceramic body Cb, which is the topmost fired ceramic body in the vertical direction, of the laminate L3. Therefore, warping of each of the fired ceramic bodies Cb included in the laminate L3 can be suppressed.

[0046] <Modification of this embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0047] [Variation 1] In the first embodiment, the fired ceramic bodies Cb and the first pressing members Pm1 are alternately stacked in the laminate. However, the fired ceramic bodies Cb and the first pressing members Pm1 do not have to be alternately stacked. Depending on the warpage of the ceramic part after the fired ceramic bodies Cb are subjected to hot isostatic pressing, for example, the fired ceramic bodies Cb may be stacked so that a plurality of first pressing members Pm1 are sandwiched between two fired ceramic bodies Cb.

[0048] [Variation 2] In the first embodiment, the second pressurizing member Pm2 is stacked at the top in the vertical direction in one stack. In the second embodiment, the first pressurizing member Pm1 and the second pressurizing member Pm2 are stacked at the top in the vertical direction in one stack. The combination of pressurizing members stacked at the top in the vertical direction in one stack is not limited to this.

[0049] FIG. 9 is a diagram illustrating a modified example of the manufacturing method for the component of the second embodiment. The laminate L3 shown in FIG. 9 is produced using one type of pressurizing member. Specifically, fired ceramic bodies Cb and pressurizing members Pm3 are stacked, and then, in the laminate L3 produced for one group G3, two pressurizing members Pm3 are stacked at the top in the vertical direction to produce the laminate L3. Even with a laminate configured in this way, an appropriate load can be applied to the fired ceramic body Cb at the top in the vertical direction, thereby suppressing warpage of each of the multiple fired ceramic bodies Cb included in the laminate L3.

[0050] [Variation 3] In the above-described embodiment, the plurality of fired ceramic bodies Cb are divided into a plurality of groups in the dividing step so that the number of fired ceramic bodies Cb included in each of the plurality of laminates is the same. However, the number of fired ceramic bodies Cb in each of the plurality of groups does not have to be the same. The number may be different depending on the size of the HIP furnace, the size of the housing, etc.

[0051] [Variation 4] The component manufacturing method in the above-described embodiment is a method for manufacturing a ceramic part used in an electrostatic chuck. The component to be manufactured is not limited to the ceramic part of an electrostatic chuck. Any component made of ceramic may be used.

[0052] This aspect has been described above based on embodiments and modifications. However, the above-described embodiments are intended to facilitate understanding of this aspect and are not intended to limit this aspect. This aspect may be modified or improved without departing from the spirit and scope of the claims, and equivalents thereof are included in this aspect. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate.

[0053] <Application example 1> A method for manufacturing a component used in semiconductor manufacturing equipment, comprising: a preparation step of preparing a plurality of fired ceramic bodies and a plurality of pressurizing members; a dividing step of dividing the plurality of fired ceramic bodies into a plurality of groups, and producing a laminate in each of the plurality of groups, in which the fired ceramic bodies and the pressing members are laminated; and a processing step of accommodating a plurality of the laminated bodies in a plurality of accommodation sections of a hot isostatic pressing device so that the stacking direction of the laminated bodies is along a vertical direction, and performing a hot isostatic pressing process on each of the plurality of fired ceramic bodies while applying a load using the weight of the pressing member. Part manufacturing method. <Application example 2> A method for manufacturing a component according to Application Example 1, In the preparation step, a first pressurizing member and a second pressurizing member heavier than the first pressurizing member are prepared as the plurality of pressurizing members; In the dividing step, in at least one group among the plurality of groups, After stacking the fired ceramic body and the first pressing member, the second pressurizing member is stacked at the top in the vertical direction in the stack produced for the one group, thereby producing the stack; Part manufacturing method. <Application example 3> A method for manufacturing a component according to Application Example 1 or Application Example 2, In the dividing step, the plurality of fired ceramic bodies are divided into a plurality of groups so that the number of fired ceramic bodies included in each of the plurality of laminates is the same. Part manufacturing method. <Application Example 4> A method for manufacturing a component according to any one of Application Examples 1 to 3, the component is an electrostatic chuck; The preparation step further includes preparing a base portion; The manufacturing method further comprises: a joining step of joining the fired ceramic body that has been hot isostatically pressed in the treatment step to the base portion, Part manufacturing method. [Explanation of symbols]

[0054] 10...Ceramic section 20...Base 40...Hot isostatic pressing device 100...Electrostatic chuck Cb: fired ceramic Ct...container G1, G2, G3, G4, G5, G6...Group L1, L2, L3, L4, L5, L6...Laminate Pm1: First pressurizing member Pm2: Second pressurizing member Pm3...Pressure components Dv: vertical direction

Claims

1. A method for manufacturing a component used in semiconductor manufacturing equipment, comprising: a preparation step of preparing a plurality of fired ceramic bodies and a plurality of pressurizing members; a dividing step of dividing the plurality of fired ceramic bodies into a plurality of groups, and producing a laminate in each of the plurality of groups, in which the fired ceramic bodies and the pressing members are laminated; and a processing step of accommodating a plurality of the laminated bodies in a plurality of accommodation sections of a hot isostatic pressing device so that the stacking direction of the laminated bodies is along a vertical direction, and performing a hot isostatic pressing process on each of the plurality of fired ceramic bodies while applying a load using the weight of the pressing member. Part manufacturing method.

2. 2. A method for manufacturing a component according to claim 1, comprising: In the preparation step, a first pressurizing member and a second pressurizing member heavier than the first pressurizing member are prepared as the plurality of pressurizing members; In the dividing step, in at least one group among the plurality of groups, After stacking the fired ceramic body and the first pressing member, the second pressing member is stacked at the top in the vertical direction in the stack produced for the one group, thereby producing the stack; Part manufacturing method.

3. A method for manufacturing a component according to claim 1 or claim 2, comprising: In the dividing step, the plurality of fired ceramic bodies are divided into a plurality of groups so that the number of fired ceramic bodies included in each of the plurality of laminates is the same. Part manufacturing method.

4. A method for manufacturing a component according to claim 1 or claim 2, comprising: the component is an electrostatic chuck; The preparation step further includes preparing a base portion; The manufacturing method further comprises: a joining step of joining the fired ceramic body that has been hot isostatically pressed in the treatment step to the base portion, Part manufacturing method.

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