Substrate holding device and substrate processing device

Abstract

To provide a substrate holding device and a substrate processing device capable of supplying power to a substrate holding unit.SOLUTION: A substrate holding device 150 includes a substrate holding unit 200, a rotation drive unit 300, and a power supply unit 400. The rotation drive unit 300 rotates the substrate holding unit 200. The power supply unit 400 supplies power to the substrate holding unit 200. The substrate holding unit 200 includes a spin base 210, a chuck member 220, and an opening / closing drive unit 230. The opening / closing drive unit 230 moves the chuck member 220. The power supply unit 400 includes a power receiving unit 420 and a power transmitting unit 410. The power receiving unit 420 is disposed in the substrate holding unit 200 and supplies power to the opening / closing drive unit 230. The power transmitting unit 410 supplies power to the power receiving unit 420 in a non-contact manner. The spin base 210 has an internal space S that accommodates the power receiving unit 420.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate holding device and a substrate processing apparatus. [Background technology]

[0002] Conventionally, there is known a substrate processing apparatus that includes a substrate holding unit that holds and rotates a substrate, and a rotation drive unit that rotates the substrate holding unit (see, for example, Patent Document 1). Patent Document 1 describes a substrate processing apparatus that includes a turntable that is configured to be rotatable about a vertical axis, a rotation drive means that rotates the turntable in a horizontal plane, and a holding mechanism that holds the substrate in a horizontal position while spaced apart from the upper surface of the turntable. The holding mechanism includes a plurality of support pins that contact the periphery of the substrate, a first magnetic force unit that rotates the support pins, and a second magnetic force unit that applies a magnetic field to the first magnetic force unit to rotate the support pins. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-86362 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in substrate processing apparatuses such as those disclosed in Patent Document 1, the substrate holder rotates while holding the substrate, making it difficult to supply power to the substrate holder from outside the substrate holder. While a slip ring could be used as a method of supplying power to the substrate holder, dust would be generated as the slip ring wears.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate holding device and a substrate processing apparatus that are capable of supplying power to a substrate holding portion. [Means for solving the problem]

[0006] According to a first aspect of the present invention, a substrate holding device includes a substrate holding unit, a rotation drive unit, and a power supply unit. The substrate holding unit holds the substrate and rotates it. The rotation drive unit rotates the substrate holding unit. The power supply unit supplies power to the substrate holding unit. The substrate holding unit has a spin base, a contact holding unit, and an opening / closing drive unit. The spin base faces the substrate. The contact holding unit is disposed on the spin base and holds the substrate by contacting the substrate. The opening / closing drive unit moves the contact holding unit between a closed position where it contacts the substrate to hold the substrate, and an open position where it is spaced apart from the substrate and does not hold the substrate. The power supply unit includes a power receiving unit and a power transmitting unit. The power receiving unit is disposed on the substrate holding unit and supplies power to the opening / closing drive unit. The power transmitting unit is disposed spaced apart from the substrate holding unit and supplies power to the power receiving unit in a non-contact manner. The spin base has an internal space for accommodating the power receiving unit.

[0007] In one embodiment, the opening / closing drive unit detects the force applied to the contact holder from the substrate, and adjusts the force with which the contact holder holds the substrate.

[0008] In one embodiment, the substrate holder has a temperature sensor for detecting the temperature of the substrate, and the opening / closing driver adjusts the force with which the contact holder holds the substrate based on the detection result of the temperature sensor.

[0009] In one embodiment, the substrate holder includes a power storage unit electrically connected to the open / close drive unit, the power storage unit supplying power to the open / close drive unit when power is not being supplied to the open / close drive unit from the power receiving unit.

[0010] In one embodiment, the abutting holder is maintained in the closed position when power is not supplied from the power receiving unit to the opening / closing drive unit.

[0011] In one embodiment, the contact holder includes a plurality of movable holders that move between the closed position and the open position, and the opening / closing driver is provided for each of the movable holders.

[0012] In one embodiment, the spin base has a bottom wall facing the rotation drive unit. The power receiving unit is disposed above the bottom wall and has a power receiving coil wound around the rotation axis of the substrate holding unit. The rotation drive unit has an upper wall facing the substrate holding unit. The power transmitting unit is disposed below the upper wall and has a power transmitting coil wound around the rotation axis of the substrate holding unit.

[0013] According to a second aspect of the present invention, a substrate processing apparatus includes the substrate holding device described above and a nozzle, the nozzle discharging a processing liquid onto the substrate held by the substrate holding unit.

[0014] In one embodiment, after the processing liquid, a rinse liquid, is ejected from the nozzle, the rotation drive unit rotates the substrate holder to perform a spin dry process in which the rinse liquid is shaken off the substrate and the substrate is dried. [Effects of the Invention]

[0015] According to the present invention, it is possible to provide a substrate holding device and a substrate processing apparatus capable of supplying power to a substrate holding part. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a side cross-sectional view schematically showing the inside of a substrate processing apparatus including a substrate holding device of the present embodiment. [Figure 2] 2 is a side cross-sectional view schematically showing the structure around a substrate holding portion of the substrate holding device of the present embodiment. FIG. [Figure 3] FIG. 2 is a plan view schematically showing a substrate holding section of the present embodiment. [Figure 4] FIG. 4 is an enlarged plan view showing the periphery of a chuck member of the substrate holding portion. [Figure 5]FIG. 2 is a plan view schematically illustrating a power transmitting unit and a power receiving unit. [Figure 6] FIG. 2 is a block diagram of the substrate processing apparatus. [Figure 7] FIG. 10 is a plan view showing a state in which one of the four chuck members is worn. [Figure 8] FIG. 10 is an enlarged plan view showing a worn chuck member. [Figure 9] FIG. 11 is a side cross-sectional view that schematically shows the structure around a substrate holding portion of a substrate holding device according to a third modified example. [Figure 10] FIG. 11 is a side cross-sectional view that schematically shows the structure around a substrate holding portion of a substrate holding device according to a fourth modified example. [Figure 11] FIG. 13 is an enlarged plan view showing the periphery of a chuck member of a substrate holding device according to a fifth modified example. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of a substrate holding device and a substrate processing apparatus according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, a Z-axis may be mentioned to facilitate understanding of the invention. Typically, the Z-axis is parallel to the vertical direction.

[0018] First, a substrate processing apparatus 100 including a substrate holding device 150 of the present embodiment will be described with reference to Fig. 1. Fig. 1 is a side cross-sectional view that schematically shows the inside of a substrate processing apparatus 100 including a substrate holding device 150 of the present embodiment.

[0019] 1, the substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, property imparting, treatment film formation, removal of at least a portion of a film, and cleaning on the substrate W.

[0020] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W has a substantially circular disk shape. Here, the substrate processing apparatus 100 processes the substrates W one by one.

[0021] The substrate processing apparatus 100 includes a chamber 110, a substrate holding unit 200, a rotation drive unit 300, and a processing liquid supply unit 130. The chamber 110 accommodates the substrate holding unit 200 and at least a part of the processing liquid supply unit 130.

[0022] The chamber 110 has a generally box-like shape with an internal space. The chamber 110 accommodates the substrates W. Here, the substrate processing apparatus 100 is a single-wafer type that processes the substrates W one by one, and the chamber 110 accommodates the substrates W one by one.

[0023] The substrate holding unit 200 holds the substrate W. The substrate holding unit 200 holds the substrate W horizontally so that the upper surface (front surface) Wa of the substrate W faces upward and the lower surface (back surface) Wb of the substrate W faces vertically downward. The substrate holding unit 200 also rotates the substrate W while holding it. The upper surface Wa of the substrate W may be flattened. Alternatively, a device surface may be provided on the upper surface Wa of the substrate W, or a pillar-shaped laminate with a recess may be provided. The detailed structure of the substrate holding unit 200 will be described later.

[0024] The rotation drive unit 300 rotates the substrate holder 200. The rotation drive unit 300 includes a shaft 310, an electric motor 320, and a housing 330.

[0025] The shaft 310 is, for example, a hollow shaft. The shaft 310 extends vertically along a rotation axis AX1. The substrate holder 200 is coupled to the upper end of the shaft 310.

[0026] The electric motor 320 applies a rotational force to the shaft 310. The electric motor 320 rotates the shaft 310 in a rotational direction, thereby rotating the substrate W and the substrate holding unit 200 about the rotation axis AX1. The housing 330 surrounds the shaft 310 and the electric motor 320. Specifically, the housing 330 has an upper wall 331 facing the substrate holding unit 200 and a side wall 332 extending downward from the periphery of the upper wall 331. An opening through which the shaft 310 is inserted is formed in the center of the upper wall 331. The side wall 332 has a generally cylindrical shape that surrounds the sides of the shaft 310 and the electric motor 320.

[0027] In this embodiment, the maximum speed at which the rotation drive unit 300 rotates the substrate holding unit 200 is, for example, 1500 rpm or higher. The maximum speed at which the rotation drive unit 300 rotates the substrate holding unit 200 is, for example, preferably 2000 rpm or higher, and more preferably 2500 rpm or higher.

[0028] The processing liquid supply unit 130 supplies the processing liquid to the substrate W. Specifically, the processing liquid supply unit 130 supplies the processing liquid to the upper surface Wa of the substrate W held by the substrate holder 200.

[0029] The processing liquid may be an etching liquid for etching the substrate W. Examples of the etching liquid include hydrofluoric nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), and phosphoric acid (H3PO4). The type of etching liquid is not particularly limited, and may be, for example, acidic or alkaline.

[0030] Alternatively, the processing liquid may be a rinse liquid, such as deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, diluted hydrochloric acid water, and reduced water (hydrogen water).

[0031] Alternatively, the treatment liquid may be an organic solvent. Typically, the volatility of the organic solvent is higher than that of the rinse liquid. Examples of organic solvents include isopropyl alcohol (IPA), methanol, ethanol, acetone, hydrofluoroether (HFE), propylene glycol monoethyl ether (PGEE), and propylene glycol monomethyl ether acetate (PGMEA).

[0032] The processing liquid supply unit 130 includes a pipe 132 and a nozzle 136. The processing liquid flows through the pipe 132 from a supply source. The nozzle 136 is connected to the downstream end of the pipe 132. The processing liquid supply unit 130 may include, for example, a valve that opens and closes a flow path in the pipe 132, and / or a pump (not shown) that sends out the processing liquid from the supply source. As the processing liquid flows through the nozzle 136, the nozzle 136 ejects the processing liquid onto the upper surface Wa of the substrate W. The processing liquid supply unit 130 may have multiple nozzles 136 that eject multiple types of processing liquid, respectively.

[0033] Furthermore, the nozzle 136 is configured to be movable relative to the substrate W. Specifically, the substrate processing apparatus 100 includes a movement mechanism (not shown) that moves the nozzle 136 horizontally and / or vertically relative to the substrate W. For example, the movement mechanism includes a ball screw mechanism and an electric motor that provides a driving force to the ball screw mechanism.

[0034] The substrate processing apparatus 100 further includes a cup 180. The cup 180 collects the processing liquid that has splashed from the substrate W. The cup 180 moves up and down. For example, the cup 180 moves up vertically to the side of the substrate W during the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W. In this case, the cup 180 collects the processing liquid that has splashed from the substrate W due to the rotation of the substrate W. Furthermore, when the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W ends, the cup 180 moves down vertically from the side of the substrate W.

[0035] The substrate processing apparatus 100 includes a power supply unit 400. The power supply unit 400 supplies power to the substrate holding unit 200. Specifically, the power supply unit 400 includes a power transmission unit 410 and a power receiving unit 420. The power transmission unit 410 is disposed below the substrate holding unit 200. In this embodiment, the power transmission unit 410 is disposed in the rotation drive unit 300. Meanwhile, the power receiving unit 420 is disposed in the substrate holding unit 200. The power transmission unit 410 and the power receiving unit 420 are disposed spaced apart from each other. The power transmission unit 410 supplies power to the power receiving unit 420 in a non-contact manner. In this embodiment, the power transmission unit 410 can transmit and receive signals to and from the power receiving unit 420. The detailed structure of the power supply unit 400 will be described later.

[0036] The substrate processing apparatus 100 includes a control device 101. The control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 includes a processor. The control unit 102 includes, for example, a central processing unit (CPU). Alternatively, the control unit 102 may include a general-purpose computer.

[0037] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may include removable media. The control unit 102 executes computer programs stored in the storage unit 104 to perform substrate processing operations.

[0038] The storage unit 104 stores data. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing procedure for the substrate W.

[0039] In this embodiment, the substrate holding unit 200, the rotation drive unit 300, the power supply unit 400, and the control unit 101 constitute a substrate holding device 150.

[0040] Next, the substrate holding part 200 will be further described with reference to Figures 2 to 4. Figure 2 is a side cross-sectional view that schematically shows the structure around the substrate holding part 200 of the substrate holding device 150 of this embodiment.

[0041] As shown in FIG. 2 , the substrate holding unit 200 includes a spin base 210, a chuck member 220, and an opening / closing drive unit 230. The chuck member 220 is an example of the "contact holding unit" of the present invention. The spin base 210 has, for example, a hollow, approximately disk-like shape, a hollow, approximately cylindrical shape, or a hollow donut-like shape. The spin base 210 faces the substrate W. The spin base 210 has a diameter slightly larger than that of the substrate W. Specifically, the spin base 210 has an upper wall 211, an inner wall 212, an outer wall 213, and a bottom wall 214.

[0042] The upper wall 211 has a substantially circular plate facing the lower surface Wb of the substrate W. A circular opening is formed in the center of the upper wall 211. The inner wall 212 has a substantially cylindrical shape and extends downward from the inner peripheral edge of the upper wall 211. The outer wall 213 has a substantially cylindrical shape and extends downward from the outer peripheral edge of the upper wall 211. In this embodiment, for example, the upper wall 211, the inner wall 212, and the outer wall 213 are formed from a single member. The bottom wall 214 has a substantially circular plate that covers the lower part of the upper wall 211. A circular opening is formed in the center of the bottom wall 214. The bottom wall 214 connects the inner wall 212 and the outer wall 213. An internal space S is formed by the upper wall 211, the inner wall 212, the outer wall 213, and the bottom wall 214. In this embodiment, the internal space S is an enclosed space. For example, a sealing member (not shown) is disposed between the bottom wall 214 and the inner wall 212, and a sealing member (not shown) is disposed between the bottom wall 214 and the outer wall 213.

[0043] Fig. 3 is a plan view schematically showing the substrate holding unit 200 of this embodiment. Fig. 4 is an enlarged plan view showing the periphery of the chuck member 220 of the substrate holding unit 200. As shown in Figs. 2 and 3, the chuck member 220 is provided on the spin base 210. Typically, the spin base 210 is provided with a plurality of chuck members 220 (four in this example). The chuck members 220 are arranged around the substrate W and hold the substrate W horizontally by abutting against the outer periphery of the substrate W.

[0044] Specifically, as shown in Fig. 4, the chuck member 220 has a plurality of movable chucks 220a that are rotatable about a rotation axis AX2 that extends in the vertical direction. The movable chucks 220a are an example of the "movable holding portion" of the present invention. The movable chucks 220a move (rotate) between a closed position (positions indicated by solid and dashed lines in Fig. 4) in which they abut against the outer peripheral surface of the substrate W to hold the substrate W, and an open position (position indicated by two-dot chain line in Fig. 4) in which they are separated from the outer peripheral surface of the substrate W and do not hold the substrate W. In this embodiment, all of the plurality of (here, four) chuck members 220 are movable chucks 220a.

[0045] 2, there are provided a plurality (four in this example) of opening and closing drive parts 230. In this embodiment, an opening and closing drive part 230 is provided for each movable chuck 220a.

[0046] The opening / closing drive unit 230 has a drive motor 231 and a shaft 232. The drive motor 231 is, for example, a servo motor. The drive motor 231 rotates the shaft 232. The shaft 232 is fixed to the chuck member 220. When the drive motor 231 rotates the shaft 232 by a predetermined angle, the chuck member 220 rotates by the predetermined angle around the rotation axis AX2.

[0047] Furthermore, at least a portion of the opening / closing drive unit 230 is housed within the internal space S of the spin base 210. In this embodiment, a portion of the opening / closing drive unit 230 is housed within the internal space S of the spin base 210. Specifically, the entire drive motor 231 is housed within the internal space S of the spin base 210. A lower portion of the shaft 232 is housed within the internal space S, while an upper portion of the shaft 232 protrudes outside the internal space S.

[0048] The substrate holding unit 200 further includes a control device 240. In this embodiment, the control device 240 is accommodated in the internal space S of the spin base 210. In this embodiment, the power receiving unit 420 is configured to be smaller than the diameter of the spin base 210 in a plan view. This makes it easy to ensure space for arranging the control device 240 within the internal space S of the spin base 210. According to the configuration of this embodiment, even in a configuration without wiring connecting the outside and inside of the spin base 210, the control device 240 can easily control and drive the opening / closing drive unit 230. The control device 240 controls each unit of the substrate holding unit 200. In this embodiment, the control device 240 controls the opening / closing drive unit 230. The control device 240 is configured using, for example, a microcomputer. Details of the control device 240 will be described later.

[0049] Next, the power supply unit 400 will be further described with reference to Figures 2 and 5. Figure 5 is a plan view that schematically shows the power transmitting unit 410 and the power receiving unit 420. Note that the power transmitting unit 410 and the power receiving unit 420 have similar structures, and therefore the power transmitting unit 410 and the power receiving unit 420 are depicted in a single figure.

[0050] 2 and 5, the power transmitting unit 410 is disposed in the rotation drive unit 300. The power transmitting unit 410 has a power transmitting coil wound around the rotation axis AX1 of the substrate holding unit 200. The center of the power transmitting coil substantially coincides with the rotation axis AX1.

[0051] Specifically, the power transmitter 410 is disposed within the rotary drive unit 300. In this embodiment, the power transmitter 410 is disposed below an upper wall 331 of the rotary drive unit 300. The power transmitter 410 is disposed substantially horizontally and substantially parallel to the upper wall 331. At least a portion of the upper wall 331 above the power transmitter 410 is formed of, for example, resin.

[0052] The power receiving unit 420 is electrically connected to the opening / closing drive unit 230 and supplies power to the opening / closing drive unit 230. The power receiving unit 420 has a power receiving coil wound around the rotation axis AX1 of the substrate holding unit 200. The center of the power receiving coil substantially coincides with the rotation axis AX1.

[0053] Specifically, the power receiving unit 420 is disposed within the internal space S of the spin base 210. In this embodiment, the power receiving unit 420 is disposed above the bottom wall 214 of the substrate holding unit 200. The power receiving unit 420 is disposed substantially horizontally and substantially parallel to the bottom wall 214. At least a portion of the bottom wall 214 below the power receiving unit 420 is formed of, for example, resin.

[0054] Next, the substrate processing apparatus 100 will be further described with reference to Fig. 6. Fig. 6 is a block diagram of the substrate processing apparatus 100.

[0055] 6, the control unit 102 controls the rotation drive unit 300, the processing liquid supply unit 130, the cup 180, and the power supply unit 400. Specifically, the control unit 102 controls the rotation drive unit 300, the processing liquid supply unit 130, the cup 180, and the power supply unit 400 by sending control signals to the rotation drive unit 300, the processing liquid supply unit 130, the cup 180, and the power supply unit 400. In this embodiment, the control unit 102 also controls the substrate holding unit 200. Specifically, the control unit 102 controls the substrate holding unit 200 by sending a control signal to the substrate holding unit 200 via the power supply unit 400.

[0056] The control unit 102 controls the rotation drive unit 300 to start rotation of the substrate holding unit 200, change the rotation speed, and stop rotation of the substrate holding unit 200. For example, the control unit 102 can control the rotation drive unit 300 to change the rotation speed of the substrate holding unit 200. Specifically, the control unit 102 can change the rotation speed of the substrate holding unit 200 by changing the rotation speed of the electric motor 320 of the rotation drive unit 300. For example, the control unit 102 can rotate the substrate holding unit 200 at a rotation speed of at least several tens of rpm and at most several hundred rpm, or at a rotation speed of at least one thousand rpm and at most several thousand rpm.

[0057] The control unit 102 can control the processing liquid supply unit 130 to cause the nozzle 136 to discharge the processing liquid onto the substrate W or to stop discharging the processing liquid.

[0058] For example, the control unit 102 executes a step of discharging a rinsing liquid, which is a processing liquid, onto the substrate W from the nozzle 136, and then rotates the substrate holding unit 200 using the rotation drive unit 300 to execute a spin-dry process in which the rinsing liquid is shaken off from the substrate W and the substrate W is dried. In this case, the control unit 102 may also cause an etching liquid or the like to be discharged onto the substrate W from the nozzle 136 before discharging the rinsing liquid onto the substrate W. Furthermore, when executing the spin-dry process, the control unit 102 rotates the substrate holding unit 200 at a rotational speed of, for example, 2000 rpm or more and 2500 rpm or less.

[0059] The control unit 102 controls the cup 180 to move the cup 180 relative to the substrate W. Specifically, the control unit 102 raises the cup 180 vertically upward to the side of the substrate W during the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W. Furthermore, when the period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W ends, the control unit 102 lowers the cup 180 vertically downward from the side of the substrate W.

[0060] The control unit 102 controls the power supply unit 400 to supply power to the substrate holding unit 200. Specifically, the control unit 102 controls the power supply unit 400 to supply power from the power transmitting unit 410 to the power receiving unit 420 in a contactless manner.

[0061] In this embodiment, the control unit 102 controls the power supply unit 400 to supply power from the power transmitting unit 410 to the power receiving unit 420 both while the substrate holding unit 200 and the power receiving unit 420 are stopped from rotating and while the substrate holding unit 200 and the power receiving unit 420 are rotating. Specifically, the control unit 102 controls the power transmitting unit 410 to supply power to the power receiving unit 420 even while the spin dry process is being performed. This makes it possible to prevent the opening / closing drive unit 230 from being unable to be supplied with power or the control unit 242 from being unable to control it.

[0062] The control unit 102 controls the substrate holder 200 by controlling the control device 240. The control device 240 includes a control unit 242 and a memory unit 244. The control unit 242 has a processor. The control unit 242 has, for example, a central processing unit (CPU). Alternatively, the control unit 242 may have a general-purpose computer.

[0063] The storage unit 244 includes a main storage unit and an auxiliary storage unit. The main storage unit is, for example, a semiconductor memory. The auxiliary storage unit is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 244 may include removable media. The control unit 242 executes a computer program stored in the storage unit 244 to control the open / close drive unit 230. Specifically, the control unit 242 controls the open / close drive unit 230 to move (rotate) the chuck member 220 between the closed position and the open position.

[0064] The control unit 102 controls the control unit 242, thereby controlling the substrate holding unit 200. Specifically, the control unit 102 controls the control unit 242, thereby controlling the substrate holding unit 200, by transmitting a control signal from the power transmitting unit 410 to the power receiving unit 420.

[0065] The control unit 242 controls the opening / closing drive unit 230 to move (rotate) the chuck member 220 between the open position and the closed position.

[0066] In this embodiment, as described above, the power supply unit 400 includes the power receiving unit 420 disposed in the substrate holding unit 200 and the power transmitting unit 410 that supplies power to the power receiving unit 420 in a contactless manner. Therefore, power can be easily supplied to the substrate holding unit 200. Furthermore, because power is supplied to the power receiving unit 420 in a contactless manner, it is possible to suppress the generation of dust due to wear of the contact-type member, unlike when a contact-type member such as a slip ring is used.

[0067] The spin base 210 also has an internal space S that houses the power receiving unit 420. Therefore, unlike when the power receiving unit 420 is disposed outside the spin base 210, for example, there is no need to provide a through-hole in the spin base 210 for passing a wire that supplies power from the power receiving unit 420 to the opening / closing drive unit 230. This prevents the atmosphere outside the spin base 210 from entering the spin base 210. As a result, it is possible to prevent the atmosphere outside the spin base 210 from adversely affecting components disposed inside the spin base 210, such as the opening / closing drive unit 230 and / or the power receiving unit 420. This is particularly effective in a substrate processing apparatus 100 that uses a processing liquid such as an etching liquid, as in this embodiment.

[0068] As described above, the chuck member 220 has a plurality of movable chucks 220a that move between the closed position and the open position, and the open / close drive unit 230 is provided for each movable chuck 220a. Therefore, the movable chucks 220a can be operated individually.

[0069] As described above, the power receiving unit 420 is disposed above the bottom wall 214 and has a power receiving coil wound around the rotation axis AX1 of the substrate holding unit 200. The power transmitting unit 410 is disposed below the top wall 331 and has a power transmitting coil wound around the rotation axis AX1 of the substrate holding unit 200. Therefore, even while the substrate holding unit 200 and the power receiving unit 420 are rotating, the positional relationship between the power transmitting unit 410 and the power receiving unit 420 does not change, so power can be easily supplied from the power transmitting unit 410 to the power receiving unit 420.

[0070] As described above, the substrate processing apparatus 100 rotates the substrate holding unit 200 using the rotation drive unit 300 to perform a spin-dry process in which the rinse liquid is shaken off from the substrate W and the substrate W is dried. In this embodiment, the power transmitting unit 410 supplies power to the power receiving unit 420 in a non-contact manner. Therefore, even when the substrate holding unit 200 and the power receiving unit 420 rotate at high speeds (e.g., 2000 rpm or higher), power can be stably transmitted from the power transmitting unit 410 to the power receiving unit 420. Therefore, power can be supplied from the power transmitting unit 410 to the power receiving unit 420 even during the spin-dry process. Note that, for example, when a slip ring is used, the rotation speed of the substrate holding unit 200 needs to be approximately 100 rpm or less in order to stably transmit power.

[0071] (First Modification) Next, a substrate holding device 150 according to a first modified example of the present invention will be described. In the first modified example, unlike the above embodiment, an example in which the force for holding the substrate W is adjusted will be described.

[0072] In the first modified example, the open / close drive unit 230 detects the force applied to the chuck member 220 from the substrate W. The detection result of the open / close drive unit 230 is transmitted to the control unit 242. Specifically, a predetermined relationship is established between the force applied to the chuck member 220 from the substrate W and the torque applied to the drive motor 231. Also, a predetermined relationship is established between the torque applied to the drive motor 231 and the value of the current flowing through the drive motor 231. The open / close drive unit 230 then transmits a signal corresponding to the value of the current flowing through the drive motor 231 to the control unit 242. This allows the control unit 242 to calculate the force applied to the chuck member 220 from the substrate W.

[0073] The open / close drive unit 230 adjusts the force with which the chuck member 220 holds (grabs) the substrate W. Specifically, the control unit 242 controls the open / close drive unit 230 to, for example, keep constant the force with which the chuck member 220 holds the substrate W. The control unit 242 also controls the open / close drive unit 230 to, for example, change the force with which the chuck member 220 holds the substrate W depending on the material of the substrate W.

[0074] In the first modified example, as described above, the open / close drive unit 230 adjusts the force with which the chuck member 220 holds the substrate W. Therefore, for example, it is possible to prevent the force with which the chuck member 220 holds the substrate W from increasing or decreasing. Furthermore, for example, since it is possible to change the force with which the chuck member 220 holds the substrate W depending on the material of the substrate W, it is possible to prevent chipping or cracking from occurring on the outer periphery of the substrate W.

[0075] The other configurations and other effects of the first modified example are similar to those of the above embodiment.

[0076] (Second Modification) Next, a substrate holding device 150 according to a second modified example of the present invention will be described with reference to Figures 7 and 8. In the second modified example, an example will be described in which the center of the substrate W is prevented from shifting from the center of the substrate holding part 200.

[0077] In the second modified example, the open / close drive part 230 detects the force applied from the substrate W to the chuck member 220, as in the first modified example.

[0078] In the second modified example, the open / close drive unit 230 detects a rotation angle, which is the amount of movement of the chuck member 220. Specifically, the open / close drive unit 230 detects the rotation angle of the chuck member 220 based on the amount of rotation of the drive motor 231. The detection result of the open / close drive unit 230 is transmitted to the control unit 242.

[0079] When the substrate W is held by the chuck members 220, the control unit 242 controls the opening / closing drive unit 230 to move each chuck member 220 from the open position to the closed position, so that the center of the substrate W is positioned at the center of the substrate holding unit 200 and the force with which each chuck member 220 holds the substrate W becomes equal.

[0080] Here, a case where the chuck member 220 is worn will be described. Fig. 7 is a plan view showing a state in which one chuck member 221 of the four chuck members 220 is worn. Fig. 8 is an enlarged plan view showing the worn chuck member 221. For ease of understanding, hereinafter, the worn chuck member 220 will be referred to as chuck member 221, and the members clockwise from chuck member 221 will be referred to as chuck member 222, chuck member 223, and chuck member 224. Note that chuck members 222 to 224 are not worn.

[0081] As described above, when the substrate W is held by the chuck members 220, the control unit 242 controls the opening / closing drive unit 230 to move each chuck member 220 from the open position to the closed position.

[0082] 7 and 8, even if chuck members 222 to 224 come into contact with substrate W, worn chuck member 221 does not come into contact with substrate W. At this time, the force applied from substrate W to chuck members 221 and 223 is lower than the set value, so chuck members 221 and 223 continue to move (rotate). Therefore, substrate W is pushed by chuck member 223, and the center of substrate W moves toward chuck member 221 relative to the center of substrate holder 200. Note that as substrate W moves, chuck members 222 and 224 also move (rotate) slightly.

[0083] Therefore, in the second modified example, the control unit 242 calculates the amount of positional deviation of the center of the substrate W relative to the center of the substrate holding unit 200 based on the rotation angle of each chuck member 220 and the force applied to each chuck member 220 from the substrate W. Then, the control unit 242 calculates a rotation angle correction amount for each chuck member 220 based on the calculated amount of positional deviation. The control unit 242 controls each open / close drive unit 230 based on the rotation angle correction amount to move (rotate) each chuck member 220 so that the center of the substrate W coincides with the center of the substrate holding unit 200. Therefore, it is possible to prevent the center of the substrate W from deviating from the center of the substrate holding unit 200. Note that, in the second modified example, an example in which the control unit 242 performs various calculations has been described, but the present invention is not limited to this. For example, the control unit 242 may transmit a signal indicating the detection result to the control unit 102, and the calculation result calculated by the control unit 102 may be transmitted from the control unit 102 to the control unit 242.

[0084] The other configurations and other effects of the second modified example are similar to those of the first modified example.

[0085] (Third Modification) Next, a substrate holding device 150 according to a third modified example of the present invention will be described with reference to Fig. 9. Fig. 9 is a side cross-sectional view that schematically shows the structure around the substrate holding part 200 of the substrate holding device 150 according to the third modified example. In the third modified example, an example will be described in which the substrate holding part 200 has a temperature sensor 500.

[0086] In the third modified example, the open / close drive part 230 detects the force applied from the substrate W to the chuck member 220, as in the first and second modified examples.

[0087] As shown in FIG. 9 , in the third modified example, the substrate holding unit 200 has a temperature sensor 500. The temperature sensor 500 detects the temperature of the substrate W. Specifically, the temperature sensor 500 is housed in the internal space S of the substrate holding unit 200. A window 215 is formed in a portion of the upper wall 211 of the spin base 210 facing the temperature sensor 500. For example, the window 215 transmits at least infrared light. The temperature sensor 500 faces the substrate W via the window 215 and detects the temperature of the substrate W. The temperature sensor 500 detects the temperature of the substrate W, for example, by detecting infrared light. The detection result of the temperature sensor 500 is transmitted to the control unit 242.

[0088] The control unit 242 adjusts the force with which the chuck member 220 holds the substrate W based on the detection result of the temperature sensor 500. For example, if the temperature of the substrate W is higher than a predetermined value, a predetermined warp occurs in the substrate W. For this reason, for example, the control unit 242 controls the open / close drive unit 230 based on the detection result of the temperature sensor 500 to reduce the force with which the chuck member 220 holds the substrate W by a predetermined value. Furthermore, for example, the control unit 242 may control the open / close drive unit 230 based on the detection result of the temperature sensor 500 to adjust the rotation angle of the chuck member 220 while maintaining a constant force with which the chuck member 220 holds the substrate W.

[0089] In the third modified example, as described above, the control unit 242 adjusts the force with which the chuck members 220 hold the substrate W based on the detection result of the temperature sensor 500. Therefore, for example, it is possible to prevent the load on the substrate W from becoming too large, or to adjust the rotation angle of each chuck member 220 in accordance with the warpage of the substrate W.

[0090] The other configurations and other effects of the third modified example are similar to those of the first and second modified examples.

[0091] (Fourth Modification) Next, a substrate holding device 150 according to a fourth modified example of the present invention will be described with reference to Fig. 10. Fig. 10 is a side cross-sectional view that schematically shows the structure around a substrate holding unit 200 of substrate holding device 150 according to the fourth modified example. In the fourth modified example, an example will be described in which substrate holding unit 200 has a power storage unit 600.

[0092] 10, the substrate holding unit 200 has a power storage unit 600 that stores electricity. The power storage unit 600 is a battery. The type of the power storage unit 600 is not particularly limited, but is, for example, a lithium ion battery. The power storage unit 600 may also be a primary battery.

[0093] The power storage unit 600 is housed in the internal space S of the substrate holding unit 200. The power storage unit 600 is connected to each opening and closing drive unit 230 by wiring 610. In other words, the power storage unit 600 is electrically connected to each opening and closing drive unit 230.

[0094] In the fourth modification, the power storage unit 600 is connected to the control unit 242 via wiring (not shown).

[0095] In the fourth modified example, the power storage unit 600 supplies power to the open / close drive unit 230 when power is not supplied from the power receiving unit 420 to the open / close drive unit 230. Specifically, when power is not supplied from the power receiving unit 420 to the open / close drive unit 230 due to, for example, a power outage, the control unit 242 controls the power storage unit 600 to supply power from the power storage unit 600 to the open / close drive unit 230. Therefore, for example, it is possible to prevent the chuck member 220 from moving (rotating) from the closed position to the open position while the substrate holding unit 200 is rotating. In other words, the chuck member 220 is maintained in the closed position when power is not supplied from the power receiving unit 420 to the open / close drive unit 230.

[0096] In the fourth modification, the power storage unit 600 is connected to the power supply unit 400 via wiring (not shown). The control unit 242 controls the power supply unit 400 to supply surplus power from the power supply unit 400 to the power storage unit 600. This makes it possible to prevent the remaining amount (level) of the power storage unit 600 from becoming zero.

[0097] The other configurations and other effects of the fourth modified example are similar to those of the above-described embodiment and the first to third modified examples.

[0098] (Fifth Modification) Next, a substrate holding device 150 according to a fifth modified example of the present invention will be described with reference to Fig. 11. Fig. 11 is an enlarged plan view showing the periphery of a chuck member 220 of a substrate holding device 150 according to the fifth modified example. In the fifth modified example, unlike the fourth modified example, an example will be described in which the substrate holding unit 200 does not have a power storage unit 600 and the chuck member 220 is maintained in a closed position.

[0099] As shown in FIG. 11 , in the fifth modified example, the substrate holder 200 includes a biasing member 700. The biasing member 700 biases the shaft 232 of the open / close drive unit 230 or the chuck member 220 in a direction in which the chuck member 220 moves from the open position to the closed position. In the fifth modified example, the biasing member 700 biases the shaft 232 of the open / close drive unit 230 in a direction in which the chuck member 220 moves from the open position to the closed position. Note that in FIG. 11 , the clockwise direction is the direction in which the chuck member 220 moves from the open position to the closed position. On the other hand, the counterclockwise direction is the direction in which the chuck member 220 moves from the closed position to the open position. Hereinafter, the direction in which the chuck member 220 moves from the open position to the closed position may be referred to as the closing direction A1, and the direction in which the chuck member 220 moves from the closed position to the open position may be referred to as the opening direction A2.

[0100] Specifically, a lever 233 is provided on the shaft 232 of the open / close drive unit 230. The lever 233 is a shaft or plate extending radially from the shaft 232. The biasing member 700 is not particularly limited, but may be, for example, a compression coil spring. The biasing member 700 biases the lever 233 in the closing direction A1. As a result, a force is constantly applied to the lever 233 in the closing direction. Therefore, the chuck member 220 is maintained in the closed position when power is not supplied from the power receiving unit 420 to the open / close drive unit 230. Specifically, even if power is not supplied from the power receiving unit 420 to the open / close drive unit 230 due to, for example, a power outage, the biasing force of the biasing member 700 maintains the chuck member 220 in the closed position. Therefore, for example, the chuck member 220 can be prevented from moving (rotating) from the closed position to the open position while the substrate holder 200 is rotating.

[0101] The other configurations and other effects of the fifth modified example are similar to those of the above-described embodiment and the first to third modified examples.

[0102] The above describes the embodiments and modifications of the present invention with reference to the drawings. However, the present invention is not limited to the above embodiments and modifications, and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments and modifications. For example, some components may be omitted from all components shown in the embodiments and modifications. Furthermore, components from different embodiments and modifications may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each component shown may differ from the actual components due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments and modifications are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention.

[0103] For example, in the above embodiment, an example has been described in which all the chuck members 220 are movable chucks 220a, but the present invention is not limited to this. For example, the multiple contact holding portions (chuck members 220) may have movable holding portions (movable chucks 220a) that move between a closed position and an open position, and non-movable holding portions (non-movable chucks) that do not move. Specifically, for example, the four chuck members 220 may have two movable chucks 220a and two non-movable chucks.

[0104] In the above embodiment, for example, the chuck member 220 moves between the open and closed positions by rotating, but the present invention is not limited to this. For example, the chuck member may move linearly between the open and closed positions by providing a mechanism that converts rotational motion into linear motion. Also, for example, the opening / closing drive unit may have a linear motor, and the chuck member may move linearly between the open and closed positions.

[0105] Furthermore, for example, in the third modified example, an example has been described in which the substrate holding device 150 has the temperature sensor 500, but the present invention is not limited to this. For example, the substrate holding device 150 may have various sensors. Specifically, the substrate holding device 150 may have a detection sensor that detects the environment (humidity, oxygen concentration, etc.) inside or outside the substrate holding device 150. In this case, the detection result of the detection sensor may be transmitted from the substrate holding unit 200 to the control unit 102. Alternatively, the open / close drive unit 230 may adjust the force with which the chuck member 220 holds the substrate W based on the detection result of the detection sensor.

[0106] Furthermore, for example, in the above embodiment, an example has been described in which the substrate holding device 150 has the control unit 242, but the present invention is not limited to this. For example, the substrate holding device 150 does not have to have the control unit 242. In this case, the control unit 102 may directly control the open / close drive unit 230, etc., by sending a control signal to the open / close drive unit 230, etc. via the power supply unit 400.

[0107] Furthermore, in the above embodiment, for example, an example has been described in which the power transmitter 410 has one power transmitting coil wound around the rotation axis AX1, and the power receiver 420 has one power receiving coil wound around the rotation axis AX1, but the present invention is not limited to this. For example, the power transmitter 410 may have multiple power transmitting coils that are smaller than the radius of the substrate holding device 150, and the multiple power transmitting coils may be arranged at approximately equal angular intervals around the rotation axis AX1. Furthermore, the power receiver 420 may have multiple power receiving coils that are smaller than the radius of the substrate holding device 150, and the multiple power receiving coils may be arranged at approximately equal angular intervals around the rotation axis AX1. [Industrial Applicability]

[0108] The present invention is suitably used in a substrate holding device and a substrate processing device. [Explanation of symbols]

[0109] 100: Substrate processing apparatus 136: Nozzle 150:Substrate holding device 200: Board holding part 210: Spin Base 214: Bottom wall 220, 221, 222, 223, 224: Chuck members (contact holding parts) 220a: Movable chuck (movable holding part) 230: Opening and closing drive unit 300: Rotation drive unit 331: Upper wall 400: Power supply section 410: Power transmission unit 420: Power receiving unit 500: Temperature sensor 600: Power storage unit AX1: Rotation axis S:Internal space W: Substrate

Claims

1. a substrate holder that holds a substrate and rotates the substrate; a rotation drive unit that rotates the substrate holder; a power supply unit that supplies power to the substrate holder; Equipped with The substrate holder includes: a spin base facing the substrate; a contact holding part that is disposed on the spin base and that holds the substrate by contacting the substrate; an open / close drive unit that moves the contact holding unit between a closed position where the contact holding unit contacts the substrate and holds the substrate, and an open position where the contact holding unit is separated from the substrate and does not hold the substrate; and The power supply unit a power receiving unit disposed on the substrate holding unit and supplying power to the opening / closing drive unit; a power transmitting unit that is disposed apart from the substrate holding unit and that supplies power to the power receiving unit in a non-contact manner; and The spin base has an internal space for accommodating the power receiving unit.

2. The opening / closing drive unit is detecting a force applied to the contact holding portion from the substrate; The substrate holding device according to claim 1 , wherein the force with which the substrate is held by the contact holding portion is adjusted.

3. the substrate holder has a temperature sensor that detects the temperature of the substrate; The substrate holding device according to claim 2 , wherein the opening / closing drive unit adjusts the force with which the contact holding unit holds the substrate based on the detection result of the temperature sensor.

4. the substrate holder has a power storage unit electrically connected to the opening / closing drive unit, The substrate holding device according to claim 1 , wherein the power storage unit supplies power to the open / close drive unit when power is not supplied from the power receiving unit to the open / close drive unit.

5. The substrate holding device according to claim 1 , wherein the contact holding portion is maintained in the closed position when power is not supplied from the power receiving portion to the opening / closing drive portion.

6. the contact holding portion has a plurality of movable holding portions that move between the closed position and the open position, The substrate holding device according to claim 1 , wherein the opening / closing drive unit is provided for each of the movable holding units.

7. the spin base has a bottom wall facing the rotation drive unit, the power receiving unit is disposed above the bottom wall and has a power receiving coil wound around a rotation axis of the substrate holding unit; the rotation drive unit has an upper wall facing the substrate holder, The substrate holding device according to claim 1 , wherein the power transmitting unit is disposed below the upper wall and includes a power transmitting coil wound around a rotation axis of the substrate holding unit.

8. The substrate holding device according to claim 1 ; a nozzle that ejects a processing liquid onto the substrate held by the substrate holder; A substrate processing apparatus comprising:

9. 9. The substrate processing apparatus according to claim 8, wherein after the rinse liquid as the processing liquid is discharged from the nozzle, the rotation drive unit rotates the substrate holding unit to perform a spin dry process in which the rinse liquid is shaken off from the substrate and the substrate is dried.

Images