Method for manufacturing electronic component

Abstract

To provide a method for manufacturing an electronic component, the method increasing the accuracy of the position of a cutting mark on a laminate.SOLUTION: A method for manufacturing a coil component 1 includes: forming a laminate 100 in which a plurality of laminate layers are stacked, the laminate 100 having a positioning mark 102 exposed on an outer surface 100S of the laminate 100; forming a cutting mark 106 on the outer surface 100S based on the positioning mark 102; and cutting the laminate 100 on the basis of the cutting mark 106.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing an electronic component. [Background technology]

[0002] The method for manufacturing an electronic component includes a step of forming a laminate and a step of cutting the laminate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-154716 Summary of the Invention [Problem to be solved by the invention]

[0004] In the manufacturing process of electronic components, deviations in the cutting position of a laminate can affect the characteristics of the electronic components. The accuracy of the cutting position of the laminate can depend on the positional accuracy of the cutting marks. If the positional accuracy of the cutting marks is low, the accuracy of the cutting position can also be low. Therefore, in order to improve the accuracy of the cutting position of the laminate, it is necessary to improve the positional accuracy of the cutting marks on the laminate.

[0005] An object of one aspect of the present invention is to provide a method for manufacturing an electronic component that can improve the positional accuracy of cutting marks in a laminate. [Means for solving the problem]

[0006] (1) A method for manufacturing an electronic component according to one aspect of the present invention includes the steps of forming a laminate formed by stacking a plurality of insulating layers, the laminate having a positioning mark exposed on the outer surface of the laminate, forming a cutting mark on the outer surface based on the positioning mark, and cutting the laminate based on the cutting mark.

[0007] In a method for manufacturing an electronic component according to one aspect of the present invention, a laminate is formed having a positioning mark that is exposed on the outer surface of the laminate. The cutting mark is formed based on the positioning mark. This allows the cutting mark to be formed based on the positioning mark in the method for manufacturing an electronic component, thereby improving the positional accuracy of the cutting mark on the laminate. As a result, the accuracy of the cutting position of the laminate can be improved, and highly reliable electronic components can be manufactured.

[0008] (2) In the method for manufacturing an electronic component according to (1) above, in the step of forming the laminate, an opening that exposes the positioning mark on the outer surface of the laminate may be formed. In this method, the positioning mark can be exposed on the outer surface of the laminate.

[0009] (3) In the method for manufacturing an electronic component according to (1) or (2) above, the step of forming the laminate may include laminating a first laminate layer portion including a plurality of laminate layers, constituting an outer surface and having an opening, and a second laminate layer continuous with the first laminate layer portion to form the laminate, forming a positioning mark in the second laminate layer, and forming an opening in the first laminate layer portion to expose the positioning mark. With this method, even if the first laminate portion having the opening is configured to include a plurality of laminate layers, the positioning mark can be exposed on the outer surface of the laminate.

[0010] (4) In the method for manufacturing an electronic component described in (3) above, the step of forming a laminate includes stacking multiple laminate layers each including a conductor pattern to form the laminate, and the positioning mark and a portion of the conductor pattern may be positioned in the second laminate layer. In this method, the conductor pattern and the positioning mark are positioned in the same position (layer). This allows the method for manufacturing an electronic component to set the position of the positioning mark in relation to the conductor pattern to be placed in the portion that will become the electronic component. Therefore, the method for manufacturing an electronic component can improve the positional accuracy of the positioning mark relative to the conductor pattern, thereby improving the positional accuracy of the cutting mark formed based on the positioning mark.

[0011] (5) In the method for manufacturing an electronic component described in (4) above, the positioning mark and the conductor pattern may be formed from the same material. In this method, the positioning mark can be formed from the material that forms the conductor pattern without the need for a separate material for forming the positioning mark. This avoids an increase in the cost of manufacturing the positioning mark. Furthermore, by forming the positioning mark and the conductor pattern from the same material, the positioning mark and the conductor pattern can be formed in the same process (timing). This simplifies the manufacturing process.

[0012] (6) In the method for manufacturing an electronic component described in (1) or (2) above, the step of forming a laminate may include laminating a first laminate layer constituting the outer surface and a second laminate layer continuous with the first laminate layer to form a laminate, forming a positioning mark in the second laminate layer, and forming an opening in the first laminate layer to expose the positioning mark. If the positioning mark is formed at the bottom of the laminate (away from the outer surface), the positioning mark may be difficult to see during lamination. In the above method, the opening is formed in the first laminate layer constituting the outer surface, and the positioning mark is formed in the second laminate layer (lower layer) continuous with the first laminate layer, thereby preventing misalignment of the cutting mark. Therefore, the method for manufacturing an electronic component improves the positional accuracy of the cutting mark in the laminate.

[0013] (7) In the method for manufacturing an electronic component described in (6) above, the step of forming a laminate includes stacking multiple laminate layers each including a conductor pattern to form the laminate, and the positioning mark and a portion of the conductor pattern may be positioned in the second laminate layer. In this method, the conductor pattern and the positioning mark are positioned in the same position (layer). This allows the method for manufacturing an electronic component to set the position of the positioning mark in relation to the conductor pattern to be placed in the portion that will become the electronic component. Therefore, the method for manufacturing an electronic component can improve the positional accuracy of the positioning mark relative to the conductor pattern, thereby improving the positional accuracy of the cutting mark formed based on the positioning mark.

[0014] (8) In the method for manufacturing an electronic component described in (7) above, the positioning mark and the conductor pattern may be formed from the same material. In this method, the positioning mark can be formed from the material that forms the conductor pattern without the need for a separate material for forming the positioning mark. This avoids an increase in the cost of manufacturing the positioning mark. Furthermore, by forming the positioning mark and the conductor pattern from the same material, the positioning mark and the conductor pattern can be formed in the same process (timing). This simplifies the manufacturing process.

[0015] (9) In the method for manufacturing an electronic component according to any one of (1) to (8) above, in the step of forming the cutting marks, the cutting marks may be formed so as to be arranged side by side at positions on the laminate where cutting is planned.

[0016] (10) In the method for manufacturing an electronic component according to any one of (1) to (9), the step of forming the cutting marks may involve forming the cutting marks by photolithography using a photosensitive paste. This method allows the cutting marks to be formed with high precision in shape and size. Therefore, the method for manufacturing an electronic component allows the cutting marks to be formed with high precision. [Effects of the Invention]

[0017] According to one aspect of the present invention, it is possible to improve the positional accuracy of cutting marks in a laminate. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a perspective view of a coil component manufactured by a method for manufacturing an electronic component according to one embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the electronic component shown in FIG. [Figure 3] FIG. 3 is a side view of the electronic component shown in FIG. [Figure 4] FIG. 4 is a flowchart showing a method for manufacturing an electronic component. [Figure 5] FIG. 5 is a view of the laminate as seen from above. [Figure 6] FIG. 6 is a diagram schematically showing a part of a cross section of the laminate. [Figure 7] FIG. 7 is a diagram schematically showing a part of a cross section of a laminate according to another embodiment. [Figure 8] FIG. 8 is a diagram schematically showing a part of a cross section of a laminate according to another embodiment. [Figure 9] FIG. 9 is a diagram schematically showing a part of a cross section of a laminate according to another embodiment. [Figure 10] 10(a), 10(b), and 10(c) are diagrams showing positioning marks according to modified examples. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and redundant description will be omitted.

[0020] Fig. 1 is a perspective view of a coil component manufactured by a method for manufacturing an electronic component according to one embodiment. As shown in Fig. 1, the coil component (electronic component) 1 includes a rectangular parallelepiped element body 2 and a pair of terminal electrodes 4, 5. The pair of terminal electrodes 4, 5 are disposed at both ends of the element body 2. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0021] The element body 2 has a pair of end faces 2a, 2b facing each other, a pair of main faces 2c, 2d facing each other, and a pair of side faces 2e, 2f facing each other. The direction in which the pair of main faces 2c, 2d face each other, i.e., the direction parallel to the end faces 2a, 2b, is the first direction D1. The direction in which the pair of end faces 2a, 2b face each other, i.e., the direction parallel to the main faces 2c, 2d, is the second direction D2. The direction in which the pair of side faces 2e, 2f face each other is the third direction D3. In this embodiment, the first direction D1 is the height direction of the element body 2. The second direction D2 is the longitudinal direction of the element body 2 and is perpendicular to the first direction D1. The third direction D3 is the width direction of the element body 2 and is perpendicular to the first direction D1 and the second direction D2.

[0022] The pair of end faces 2a, 2b extend in a first direction D1 to connect the pair of principal faces 2c, 2d together. The pair of end faces 2a, 2b also extend in a third direction D3, i.e., in the direction of the short sides of the pair of principal faces 2c, 2d. The pair of side faces 2e, 2f also extend in the first direction D1 to connect the pair of principal faces 2c, 2d together. The pair of side faces 2e, 2f also extend in a second direction D2, i.e., in the direction of the long sides of the pair of end faces 2a, 2b. The coil component 1 is mounted, for example, by soldering to an electronic device (for example, a circuit board or electronic component). In the coil component 1, the principal face 2c forms a mounting surface facing the electronic device.

[0023] As shown in FIG. 2, the element body 2 is configured by stacking multiple insulator layers 6 in the third direction D3. The element body 2 has multiple stacked insulator layers 6. In the element body 2, the direction in which the multiple insulator layers 6 are stacked coincides with the third direction D3. In the actual element body 2, the insulator layers 6 are integrated to the extent that the boundaries between the insulator layers 6 are not visible.

[0024] Each insulator layer 6 is formed of a dielectric material containing a glass component. That is, the element body 2 contains a dielectric material containing a glass component as a compound of elements that constitute the element body 2. The glass component is, for example, borosilicate glass. The dielectric material is, for example, a dielectric ceramic such as a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based material. Each insulator layer 6 is formed of a sintered ceramic green sheet containing a glass ceramic material.

[0025] As shown in FIG. 3, the element body 2 has recesses 7 and 8. The recess 7 is provided on the end face 2a side of the element body 2. The recess 7 is a space recessed inward from the outer surface of the element body 2. The recess 7 has a shape corresponding to the shape of the terminal electrode 4. In this embodiment, the recess 7 has an L-shape when viewed from the third direction D3. The recess 8 is provided on the end face 2b side of the element body 2. The recess 8 is a space recessed inward from the outer surface of the element body 2. The recess 8 has a shape corresponding to the shape of the terminal electrode 5. In this embodiment, the recess 8 has an L-shape when viewed from the third direction D3.

[0026] As shown in FIG. 3 , the terminal electrodes 4 and 5 are embedded in the element body 2. The terminal electrode 4 is arranged on the end face 2a side of the element body 2. The terminal electrode 4 is arranged in a recess 7 of the element body 2. The terminal electrode 5 is arranged on the end face 2b side of the element body 2. The terminal electrode 5 is arranged in a recess 8 of the element body 2.

[0027] The terminal electrode 4 is disposed across the end face 2a and the main surface 2c. The terminal electrode 5 is disposed across the end face 2b and the main surface 2c. In this embodiment, the surface of the terminal electrode 4 is substantially flush with both the end face 2a and the main surface 2c. The surface of the terminal electrode 5 is substantially flush with both the end face 2b and the main surface 2c.

[0028] The terminal electrode 4 has an L-shape when viewed from the third direction D3. The terminal electrode 4 has a plurality of electrode portions 4a, 4b. In this embodiment, the terminal electrode 4 has a pair of electrode portions 4a, 4b. The electrode portion 4a and the electrode portion 4b are connected at a ridge portion of the element body 2 and are electrically connected to each other. In this embodiment, the electrode portion 4a and the electrode portion 4b are integrally formed. The electrode portion 4a extends along the first direction D1. The electrode portion 4a has a rectangular shape when viewed from the second direction D2. The electrode portion 4b extends along the second direction D2. The electrode portion 4b has a rectangular shape when viewed from the first direction D1. Each of the electrode portions 4a, 4b extends along the third direction D3.

[0029] 2, the terminal electrode 4 is configured by stacking a plurality of electrode layers 10 and a plurality of electrode layers 11. In this embodiment, the number of electrode layers 10 is "2", and the number of electrode layers 11 is "4". The electrode layers 10 are arranged at positions sandwiching the electrode layer 11 in the third direction D3.

[0030] Each electrode layer 10 is provided in a defect formed in the corresponding insulator layer 6. The defect forms a recess 7. The electrode layer 10 is formed by firing a conductive paste. The conductive paste contains a metal component. The metal component is contained in a conductive material, such as Ag or Pd. The conductive paste may contain a glass component. The glass component is a compound of elements that constitute the element body 2 and may be the same component as the glass component contained in the element body 2. The content of the glass component may be set appropriately. Each electrode layer 10 is L-shaped when viewed from the third direction D3. The electrode layer 10 has layer portions 10a and 10b. The layer portion 10a extends along the first direction D1. The layer portion 10b extends along the second direction D2.

[0031] Each electrode layer 11 is provided in a defect formed in the corresponding insulator layer 6. The defect forms a recess 7. The electrode layer 11 is formed by firing a conductive paste. The conductive paste contains a conductive material. The conductive material is, for example, Ag or Pd. Each electrode layer 11 is L-shaped when viewed from the third direction D3. The electrode layer 11 has layer portions 11a and 11b. The layer portion 11a extends along the first direction D1. The layer portion 11b extends along the second direction D2.

[0032] The electrode portion 4a is formed by laminating layer portions 10a and 11a of the electrode layers 10 and 11. In the electrode portion 4a, the layer portions 10a and 11a are integrated to the extent that the boundary between the layer portions 10a and 11a is not visible. The electrode portion 4b is formed by laminating layer portions 10b and 11b of the electrode layers 10 and 11. In the electrode portion 4b, the layer portions 10b and 11b are integrated to the extent that the boundary between the layer portions 10b and 11b is not visible.

[0033] As shown in FIG. 3 , the terminal electrode 5 has an L-shape when viewed from the third direction D3. The terminal electrode 5 has a plurality of electrode portions 5a, 5b. In this embodiment, the terminal electrode 5 has a pair of electrode portions 5a, 5b. The electrode portion 5a and the electrode portion 5b are connected at a ridge portion of the element body 2 and are electrically connected to each other. In this embodiment, the electrode portion 5a and the electrode portion 5b are integrally formed. The electrode portion 5a extends along the first direction D1. The electrode portion 5a has a rectangular shape when viewed from the second direction D2. The electrode portion 5b extends along the second direction D2. The electrode portion 5b has a rectangular shape when viewed from the first direction D1. Each of the electrode portions 5a, 5b extends along the third direction D3.

[0034] 2, the terminal electrode 5 is configured by stacking a plurality of electrode layers 12 and a plurality of electrode layers 13. In this embodiment, the number of electrode layers 12 is "2", and the number of electrode layers 13 is "4". The electrode layers 12 are arranged at positions sandwiching the electrode layer 13 in the third direction D3.

[0035] Each electrode layer 12 is provided in a defect formed in the corresponding insulator layer 6. The defect forms a recess 8. The electrode layer 12 is formed by firing a conductive paste. The conductive paste contains a metal component. The metal component is contained in a conductive material, such as Ag or Pd. The conductive paste may contain a glass component. The glass component is a compound of elements that constitute the element body 2 and may be the same component as the glass component contained in the element body 2. Each electrode layer 12 is L-shaped when viewed from the third direction D3. The electrode layer 12 has layer portions 12a and 12b. The layer portion 12a extends along the first direction D1. The layer portion 12b extends along the second direction D2.

[0036] Each electrode layer 13 is provided in a defect formed in the corresponding insulator layer 6. The defect forms a recess 8. The electrode layer 13 is formed by firing a conductive paste. The conductive paste contains a conductive material. The conductive material is, for example, Ag or Pd. Each electrode layer 13 is L-shaped when viewed from the third direction D3. The electrode layer 13 has layer portions 13a and 13b. The layer portion 13a extends along the first direction D1. The layer portion 13b extends along the second direction D2.

[0037] The electrode portion 5a is formed by laminating layer portions 12a and 13a of the electrode layers 12 and 13. In the electrode portion 5a, the layer portions 12a and 13a are integrated to the extent that the boundary between the layer portions 12a and 13a is not visible. The electrode portion 5b is formed by laminating layer portions 12b and 13b of the electrode layers 12 and 13. In the electrode portion 5b, the layer portions 12b and 13b are integrated to the extent that the boundary between the layer portions 12b and 13b is not visible.

[0038] 3, the coil device 1 includes a coil 9 disposed in the element body 2. A coil axis AX of the coil 9 extends along the third direction D3.

[0039] As shown in Fig. 2, the coil 9 includes a first coil conductor 22, a second coil conductor 23, a third coil conductor 24, and a fourth coil conductor 25. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are arranged in this order along the third direction D3. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 each have a shape in which a portion of a loop is interrupted, and each have one end and the other end. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are formed with a predetermined width.

[0040] The first coil conductor 22 is located in the same layer as one electrode layer 11 and one electrode layer 13. The first coil conductor 22 is connected to the electrode layer 13 via a connecting conductor 26. The connecting conductor 26 is located in the same layer as the first coil conductor 22. One end of the first coil conductor 22 is connected to the connecting conductor 26. The connecting conductor 26 is connected to the layer portion 13a. The connecting conductor 26 connects the first coil conductor 22 and the electrode layer 13. The connecting conductor 26 may be connected to the layer portion 13b. The first coil conductor 22 is separated from the electrode layer 11 that is located in the same layer. In this embodiment, the first coil conductor 22, the connecting conductor 26, and the electrode layer 13 are integrally formed.

[0041] The second coil conductor 23 is located in the same layer as one electrode layer 11 and one electrode layer 13. The second coil conductor 23 is spaced apart from the electrode layers 11 and 13 that are located in the same layer. The first coil conductor 22 and the second coil conductor 23 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the first coil conductor 22 and one end of the second coil conductor 23 overlap each other.

[0042] The third coil conductor 24 is located in the same layer as one electrode layer 11 and one electrode layer 13. The third coil conductor 24 is spaced apart from the electrode layers 11 and 13 that are located in the same layer. The second coil conductor 23 and the third coil conductor 24 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the second coil conductor 23 and one end of the third coil conductor 24 overlap each other.

[0043] The fourth coil conductor 25 is located in the same layer as one electrode layer 11 and one electrode layer 13. The fourth coil conductor 25 is connected to the electrode layer 11 via a connecting conductor 27. The connecting conductor 27 is located in the same layer as the fourth coil conductor 25. The other end of the fourth coil conductor 25 is connected to the connecting conductor 27. The connecting conductor 27 is connected to the layer portion 11a. The connecting conductor 27 connects the fourth coil conductor 25 and the electrode layer 11. The connecting conductor 27 may be connected to the layer portion 11b. The fourth coil conductor 25 is separated from the electrode layer 13 that is located in the same layer. In the present embodiment, the fourth coil conductor 25, the connecting conductor 27, and the electrode layer 11 are integrally formed.

[0044] The third coil conductor 24 and the fourth coil conductor 25 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the third coil conductor 24 and one end of the fourth coil conductor 25 overlap each other.

[0045] The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are electrically connected to each other. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 form a coil 9. The coil 9 is electrically connected to the terminal electrode 5 through a connecting conductor 26. The coil 9 is electrically connected to the terminal electrode 4 through a connecting conductor 27.

[0046] The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 27, 27 contain a conductive material. The conductive material includes Ag or Pd. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 27, 27 are configured as a sintered body of a conductive paste containing conductive material powder. The conductive material powder includes, for example, Ag powder or Pd powder.

[0047] In this embodiment, the first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 26 and 27 contain the same conductive material as the terminal electrodes 4 and 5. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 26 and 27 may contain a conductive material different from that of the terminal electrodes 4 and 5. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 27 and 27 are provided in recesses formed in the corresponding insulator layers 6.

[0048] Next, a description will be given of a method for manufacturing the coil device 1. Fig. 4 is a flowchart showing the method for manufacturing the coil device 1.

[0049] As shown in Fig. 4, first, a green sheet is formed (step S01). The green sheet is formed by applying an element paste containing the constituent materials of the insulator layer 6 and a photosensitive material onto a substrate (e.g., a PET film). The photosensitive material contained in the element paste may be either negative or positive, and any known material may be used.

[0050] Next, the green sheet is processed (step S02). In this embodiment, for example, the element formation layer is exposed and developed by photolithography using a Cr mask, and an element pattern is formed on the substrate, with a shape corresponding to the shape of the conductor formation layer described below removed. The element pattern is a layer that will become the insulator layer 6 after heat treatment. Note that the "photolithography method" in this embodiment is not limited to any particular method, as long as it exposes and develops a layer to be processed that contains a photosensitive material to process it into a desired pattern, and the type of mask is not limited thereto.

[0051] Furthermore, the element formation layer is exposed and developed by photolithography to form an element pattern having openings 104 (see FIG. 5) that expose the positioning marks 102 (see FIG. 5). As shown in FIG. 5, in this embodiment, for example, 16 positioning marks 102 are formed in the laminate 100. Therefore, 16 openings 104 are formed in the green sheet. In this embodiment, the openings 104 are formed in a circular shape. The size of the openings 104 is, for example, the same as that of the positioning marks 102.

[0052] Next, as shown in FIG. 4, a conductor pattern is formed (step S03). The conductor pattern is formed by applying a conductor paste containing the constituent materials of the electrode layers 10, 11, 12, and 13, the first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25, and the connecting conductors 26 and 27, as well as a photosensitive material, onto a substrate (e.g., a PET film), to form a conductor material layer. The photosensitive material contained in the conductive paste may be either negative or positive, and any known photosensitive material can be used. Next, using a mask corresponding to the missing portion, the conductor material layer is exposed and developed by photolithography, forming a conductor pattern corresponding to the shape of the missing portion on the substrate.

[0053] A conductive paste containing the constituent material of the positioning mark 102 and a photosensitive material is applied to the substrate to form a conductive material layer. In this embodiment, the same conductive paste as that used to form the coil conductor is used. That is, the positioning mark 102 is formed from the same material as the coil conductor. Next, using a mask corresponding to the opening 104, the conductive material layer is exposed and developed by photolithography to form a conductive pattern corresponding to the shape of the opening 104 on the substrate. In this embodiment, the positioning mark 102 is formed in a circular shape.

[0054] As shown in FIG. 5, the laminate 100 is defined with a product area A1 (the area surrounded by dashed line DL1 in FIG. 5) including multiple product portions P (the areas indicated by dashed lines in FIG. 5) that will become coil components 1, and an outer area A2 outside the product area A1. Positioning marks 102 (openings 104) are provided in each of the product area A1 and the outer area A2. In the product area A1, for example, four positioning marks 102 are arranged. In the product area A1, the positioning marks 102 are arranged on the planned cutting positions (cutting lines). That is, in the product area A1, the positioning marks 102 are arranged in portions that will be removed by cutting the laminate 100. In the outer area A2, some of the positioning marks 102 are arranged on the planned cutting positions. The positioning marks 102 (openings 104) can be formed as appropriate according to the design.

[0055] Next, as shown in FIG. 4, a laminate 100 (see FIG. 5) is formed (step S04). The laminate 100 is formed by repeatedly transferring the element pattern and the conductor pattern onto the support 200, thereby laminating the conductor pattern and element pattern. Specifically, first, the conductor pattern is transferred from the substrate onto the element pattern formation layer. Next, the element pattern is transferred from the substrate onto the element pattern formation layer. The conductor pattern is combined with the missing part of the element pattern, and the element pattern and the conductor pattern are on the same layer on the element pattern formation layer. Furthermore, the transfer process of the conductor pattern and element pattern is repeated, and the conductor pattern and element pattern are laminated in a combined state. In this way, the laminate 100 is formed.

[0056] 6, in this embodiment, the laminate 100 includes, for example, an element body formation layer L1, an element body formation layer L2, an element body formation layer L3, an element body formation layer L4, an element body formation layer L5, an element body formation layer L6, an element body formation layer L7, an element body formation layer L8, an element body formation layer (second laminate layer) L9, and an element body formation layer (first laminate layer) L10. In the example shown in FIG. 6, from the support body 200 side, the elements are arranged in this order: element body formation layer L1, element body formation layer L2, element body formation layer L3, element body formation layer L4, element body formation layer L5, element body formation layer L6, element body formation layer L7, element body formation layer L8, element body formation layer L9, and element body formation layer L10. The element body formation layer L10 forms the outer surface 100S of the laminate 100.

[0057] In FIG. 6, the product portion P surrounded by a dashed line is a portion that will become the coil component 1 after the laminate 100 is cut. The conductor pattern CP is formed within the product portion P. In the example shown in FIG. 6, the conductor pattern CP is shown in element body formation layer L2, element body formation layer L5, element body formation layer L6, element body formation layer L8, and element body formation layer L9, but the conductor pattern CP is also formed in element body formation layer L3, element body formation layer L4, and element body formation layer L7. The positioning mark 102 and the opening 104 are formed outside the product portion P. That is, the positioning mark 102 and the opening 104 are arranged in a portion that will not be formed into the coil component 1. The positioning mark 102 and the opening 104 are formed, for example, on the cutting line (including the cutting margin). The positioning mark 102 is formed in the element body formation layer L9. That is, the positioning mark 102 is formed in the same layer as a portion of the conductor pattern CP that forms the coil conductor. The opening 104 is formed in the element body formation layer L10. In FIG. 6, hatching of the cross section is omitted.

[0058] Further, as shown in FIG. 4, a cutting mark 106 (see FIG. 5) is formed (step S05). In this embodiment, the cutting mark 106 is formed by applying a mark paste (photosensitive paste) containing the constituent material of the cutting mark 106 and a photosensitive material onto a substrate (e.g., a PET film) to form a mark formation layer. In this embodiment, the constituent material contained in the mark paste is the same as the constituent material contained in the base paste. The photosensitive material contained in the mark paste may be either negative or positive, and a known material can be used. Next, the mark formation layer is exposed and developed by photolithography using, for example, a Cr mask, to form the cutting mark 106 on the substrate. The cutting mark 106 may be formed by stacking multiple layers.

[0059] Next, the cutting marks 106 are transferred to the laminate 100 (step S06), and the cutting marks 106 and the laminate 100 are integrated. The cutting marks 106 are formed based on the positioning marks 102. Specifically, for example, the positions of the cutting marks 106 are acquired using a camera or the like, and the cutting marks 106 are formed on the outer surface 100S of the laminate 100 based on the positions of the cutting marks 106. As shown in FIG. 5, for example, the cutting marks 106 are formed so as to be arranged side by side on a straight line SL (planned cutting position) connecting the two positioning marks 102. The cutting marks 106 are formed in positions other than the portions that will become the coil components 1.

[0060] The color tone (brightness, saturation) of the cut mark 106 is different from that of the outer surface 100S of the laminate 100 onto which the cut mark 106 is transferred. The color of the cut mark 106 is a color that can be distinguished from the color of the outer surface 100S of the laminate 100. In the example shown in FIG. 5, the color of the cut mark 106 is darker than the color of the outer surface 100S of the laminate 100.

[0061] 4, the laminate 100 is cut (step S06). In this embodiment, the laminate 100 is cut using a cutting machine (for example, a dicing blade). Specifically, the laminate 100 is cut based on cutting marks 106 provided on the laminate 100. This results in a plurality of green chips having a predetermined size.

[0062] Next, the green chip is fired (step S07). Then, a plating layer is formed on the surface of each of the terminal electrodes 4, 5 (step S08). The plating layer is formed by, for example, electroplating or electroless plating. The plating layer contains, for example, Ni, Sn, or Au. In this way, the coil component 1 is obtained.

[0063] As described above, in the method for manufacturing the coil component 1 according to this embodiment, the laminate 100 is formed having the positioning marks 102 that are exposed on the outer surface 100S of the laminate 100. The cutting marks 106 are formed based on the positioning marks 102. As a result, in the method for manufacturing the coil component 1, the cutting marks 106 can be formed using the positioning marks 102 as a reference, thereby improving the positional accuracy of the cutting marks 106 in the laminate 100. As a result, the accuracy of the cutting position of the laminate 100 can be improved, and a highly reliable coil component 1 can be manufactured.

[0064] In the method for manufacturing the coil component 1 according to this embodiment, as shown in FIG. 6 , a positioning mark 102 is formed in the element body formation layer L9, and an opening 104 is formed in the element body formation layer L10 to expose the positioning mark 102. If the positioning mark 102 were formed in the lower part of the laminate 100 (at a position away from the outer surface 100S), the positioning mark 102 may be difficult to see during lamination. In the above method, the opening 104 is formed in the element body formation layer L10 that constitutes the outer surface 100S, and the positioning mark 102 is formed in the element body formation layer L9 (a lower layer) that is continuous with the element body formation layer L10, thereby preventing the position of the cutting mark 106 from shifting. Therefore, the method for manufacturing the coil component 1 improves the positional accuracy of the cutting mark 106 in the laminate 100.

[0065] Furthermore, if the positioning mark 102 is formed at the bottom of the laminate 100, the openings 104 exposing the positioning mark 102 must be formed across multiple element body formation layers. In this case, if the laminate 100 is misaligned, the positions of the multiple openings 104 will be misaligned, which may make it impossible to see the positioning mark 102 from the outer surface 100S side of the laminate 100. In contrast, in the manufacturing method of the coil component 1 according to this embodiment, the openings 104 are formed in the element body formation layer L10 that constitutes the outer surface 100S of the laminate 100. That is, in the laminate 100, the openings 104 are formed only in the top layer. Therefore, in the manufacturing method of the coil component 1, problems such as misalignment of the multiple openings 104 do not occur, and the shapes of the openings 104 can be maintained. Therefore, the positioning mark 102 can be seen from the outer surface 100S side of the laminate 100.

[0066] In the method for manufacturing the coil component 1 according to this embodiment, as shown in Fig. 6, the positioning mark 102 and a portion of the conductor pattern CP are positioned in the element body formation layer L9. In this method, the conductor pattern CP and the positioning mark 102 are arranged in the same position (layer). As a result, in the method for manufacturing the coil component 1, the position of the positioning mark 102 can be set in relation to the conductor pattern CP arranged in the product portion P that will become the coil component 1. Therefore, in the method for manufacturing the coil component 1, the positional accuracy of the positioning mark 102 with respect to the conductor pattern CP can be improved, and therefore the positional accuracy of the cutting mark 106 formed based on the positioning mark 102 can be improved.

[0067] In the manufacturing method of the coil component 1 according to this embodiment, the positioning marks 102 and the conductor patterns CP are formed from the same material. With this method, the positioning marks 102 can be formed from the material that forms the conductor patterns CP, without the need to prepare a separate material for forming the positioning marks 102. This makes it possible to avoid an increase in the cost associated with manufacturing the positioning marks 102. Furthermore, by forming the positioning marks 102 and the conductor patterns CP from the same material, the positioning marks 102 and the conductor patterns CP can be formed in the same process (timing). This makes it possible to simplify the manufacturing process.

[0068] In the method for manufacturing the coil component 1 according to this embodiment, the cutting marks 106 are formed by photolithography using a photosensitive paste. This allows the method for manufacturing the coil component 1 to form the shape and dimensions of the cutting marks 106 with high precision. Therefore, the cutting marks 106 can be formed with high accuracy. As a result, the accuracy of the cutting position of the laminate 100 can be improved, and a highly reliable coil component 1 can be manufactured.

[0069] Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0070] In the above embodiment, the electronic component is a coil component, but the electronic component manufactured by the electronic component manufacturing method according to the present invention may be a capacitor component or the like.

[0071] In the above embodiment, an example has been described in which the laminate 100 is cut based on the cutting marks 106. However, in the step of cutting the laminate 100, the laminate 100 may be cut based on the positioning marks 102 and the cutting marks 106. Specifically, the amount of deviation of the cutting marks 106 from the positioning marks 102 is obtained from the positions of the positioning marks 102 and the cutting marks 106, and the cutting position is corrected based on the amount of deviation, and the laminate 100 is cut.

[0072] In the above embodiment, the positioning marks 102 are formed on the element body formation layer L9 as shown in Fig. 6. However, the positions where the positioning marks 102 are formed are not limited to this.

[0073] As shown in Figure 7, the positioning mark 102 may be formed in the element body formation layer L6. Part of the conductor pattern CP is formed in the element body formation layer L6. That is, the positioning mark 102 is located in the same layer as the conductor pattern CP. The opening 104 is formed across the element body formation layer L7, element body formation layer L8, element body formation layer L9, and element body formation layer L10. The element body formation layer L7, element body formation layer L8, element body formation layer L9, and element body formation layer L10 form the outer surface 100S of the laminate 100 and form a first laminate layer portion having the opening 104. The element body formation layer L6 forms the second laminate layer.

[0074] As shown in FIG. 8, the positioning mark 102 may be formed in the element body formation layer L2. Part of the conductor pattern CP is formed in the element body formation layer L2. That is, the positioning mark 102 is located on the same layer as the conductor pattern CP. The opening 104 is formed across the element body formation layer L3, element body formation layer L4, element body formation layer L5, element body formation layer L6, element body formation layer L7, element body formation layer L8, element body formation layer L9, and element body formation layer L10. The element body formation layer L3, element body formation layer L4, element body formation layer L5, element body formation layer L6, element body formation layer L7, element body formation layer L8, element body formation layer L9, and element body formation layer L10 form the outer surface 100S of the laminate 100 and constitute a first laminate layer portion having the opening 104. The element body formation layer L2 constitutes the second laminate layer.

[0075] In the above embodiment, an example has been described in which the positioning mark 102 is formed on the same layer as part of the conductive pattern CP. However, as shown in Fig. 9, the positioning mark 102 may be formed on a different layer from part of the conductive pattern CP.

[0076] In the above embodiment, an example has been described in which the positioning mark 102 is circular. However, the shape of the positioning mark 102 is not limited to this. As shown in Fig. 10(a), the positioning mark 102 may be annular, as shown in Fig. 10(b), the positioning mark 102 may be rectangular, or as shown in Fig. 10(c), the positioning mark 102 may be triangular.

[0077] In the above embodiment, an example has been described in which the positioning mark 102 and the opening 104 are equal in size. However, the opening 104 may be larger than the positioning mark 102.

[0078] In the above embodiment, an example has been described in which the positioning mark 102 and the opening 104 have the same shape (similar shapes). However, the positioning mark 102 and the opening 104 may have different shapes. In this case, it is preferable that the positioning mark 102 is entirely exposed in the opening 104.

[0079] In the above embodiment, an example has been described in which the conductive pattern CP is made of the same material as the positioning mark 102. However, the positioning mark 102 may be made of a different material.

[0080] In the above embodiment, an example has been described in which the cutting mark 106 is formed (step S05 in FIG. 4) after the laminate 100 is formed (step S04 in FIG. 4). However, the cutting mark 106 may be formed at the same timing as other processes, or may be formed in advance. The cutting mark 106 may be formed before it is transferred to the laminate 100.

[0081] In the above embodiment, an example has been described in which the cutting mark 106 is transferred to the laminate 100 (step S05 in FIG. 4) after the laminate 100 is formed (step S04 in FIG. 4). However, the laminate 100 may be formed after the cutting mark 106 is formed. Specifically, after the cutting mark 106 is transferred onto a support, an element pattern and a conductor pattern may be repeatedly transferred onto the support onto the cutting mark 106. In this way, the cutting mark 106 and the laminate 100 are integrated.

[0082] In the above embodiment, an example has been described in which the color of the cutting mark 106 is darker than the outer surface 100S of the laminate 100. However, the color of the cutting mark 106 may be lighter than the color of the outer surface 100S of the laminate 100. It is sufficient that the color tone of the cutting mark 106 is different from that of the outer surface 100S of the laminate 100 to which the cutting mark 106 is transferred.

[0083] In the above embodiment, the cutting marks 106 are formed by photolithography, but the cutting marks 106 may be formed by other methods.

[0084] In the above embodiment, the cutting mark 106 has a cross shape as an example, but the shape of the cutting mark 106 is not limited to this and various shapes can be adopted.

[0085] In the above embodiment, an example has been described in which the constituent material of the insulating layer 6 is the same as the constituent material of the cutting mark 106. However, the constituent material of the insulating layer 6 and the constituent material of the cutting mark 106 may be different materials.

[0086] In the above embodiment, in the step of forming the conductor patterns (step S02 in FIG. 4), the conductor patterns of the electrode layers 10, 11, 12, and 13 that constitute the terminal electrodes 4 and 5 are formed as an example. However, depending on the configuration of the terminal electrodes, the terminal electrodes may be formed after firing the green chip.

[0087] In the above embodiment, an example has been described in which, after the step of firing the green chip (step S07 in FIG. 4), a plating layer is formed (step S08 in FIG. 4) on the surface of each of the terminal electrodes 4 and 5. However, it is not necessary to form a plating layer on the surface of the terminal electrodes 4 and 5.

[0088] In the above embodiment, the shapes of the terminal electrodes 4 and 5 can be changed as appropriate depending on the design. The shape of the coil 9 and the number of coil conductors can also be changed as appropriate depending on the design. [Explanation of symbols]

[0089] 1...coil component (electronic component), 100...laminate, 100S...outer surface, 102...positioning mark, 104...opening, 106...cutting mark, CP...conductor pattern, L2, L6, L9...element body forming layer (second laminate layer), L10...element body forming layer (first laminate layer).

Claims

1. forming a laminate formed by stacking a plurality of laminate layers, the laminate having a positioning mark exposed on an outer surface of the laminate; forming a cutting mark on the outer surface based on the positioning mark; and cutting the laminate based on the cutting marks.

2. The method for manufacturing an electronic component according to claim 1 , wherein the step of forming the laminate includes forming an opening that exposes the positioning mark on the outer surface of the laminate.

3. In the step of forming the laminate, a first laminate layer portion including a plurality of the laminate layers, constituting the outer surface and having an opening, and a second laminate layer continuous with the first laminate layer portion are laminated to form the laminate; forming the positioning mark in the second laminate layer; The method for manufacturing an electronic component according to claim 1 or 2, further comprising forming an opening in the first laminate layer portion to expose the positioning mark.

4. In the step of forming the laminate, the laminate is formed by stacking a plurality of the laminate layers, each including a conductor pattern; The method for manufacturing an electronic component according to claim 3 , wherein the positioning mark and a part of the conductor pattern are positioned in the second laminate layer.

5. The method for manufacturing an electronic component according to claim 4 , wherein the positioning mark and the conductive pattern are formed from the same material.

6. In the step of forming the laminate, a first laminate layer constituting the outer surface and a second laminate layer continuous with the first laminate layer are laminated to form the laminate, forming the positioning mark in the second laminate layer; The method for manufacturing an electronic component according to claim 1 , further comprising forming an opening in the first laminate layer to expose the positioning mark.

7. In the step of forming the laminate, the laminate is formed by stacking a plurality of the laminate layers, each including a conductor pattern; The method for manufacturing an electronic component according to claim 6 , wherein the positioning mark and a part of the conductor pattern are positioned in the second laminate layer.

8. The method for manufacturing an electronic component according to claim 7 , wherein the positioning mark and the conductive pattern are formed from the same material.

9. The method for manufacturing an electronic component according to claim 1 , wherein in the step of forming the cutting marks, the cutting marks are formed so as to be arranged side by side at planned cutting positions in the laminate.

10. 3. The method for manufacturing an electronic component according to claim 1, wherein in the step of forming the cutting marks, the cutting marks are formed by photolithography using a photosensitive paste.

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