Manufacturing method for holding tool and jig to be used in the same

Abstract

To provide a manufacturing method for a holding tool configured so that an inner peripheral wall of a frame material and a holding surface of a holding pad are suppressed from being contaminated by an adhesive.SOLUTION: A manufacturing method for a holding tool includes: an arranging step S11 of arranging a sheet-like jig, in a through-hole of a frame material having the through-hole at a central part thereof; an applying step S12 of applying an adhesive onto an upper surface of the frame material; a removing step S13 of removing the jig from the inside of the through-hole; and an adhering step S14 of making the frame material adhere to a holding pad through the adhesive. The holding pad has a holding surface for holding an object to be ground thereon, and the holding surface has a surface that is made to adhere to the frame material. In the arrangement step S11, the outer peripheral wall of the jig and of the inner peripheral wall of the frame material at least partially contact each other.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a holder and a jig used therefor. [Background technology]

[0002] Conventionally, flatness is required for the surfaces (machined surfaces) of materials such as semiconductor devices and electronic components, particularly thin substrates (workpieces to be polished) such as Si substrates (silicon wafers), GaAs (gallium arsenide) substrates, optical materials such as lenses, plane-parallel plates, and reflecting mirrors, and LCD (liquid crystal display) substrates. To obtain such surfaces, mechanical polishing (lapping) and chemical mechanical polishing (CMP), which uses a polishing pad together with a polishing slurry, have been performed.

[0003] In such polishing processes, a holder is generally used to hold the workpiece to be polished. The holder includes a holding pad having a holding surface that adsorbs the workpiece to be polished, and a frame material fixed to the inner edge of the surface of the holding pad, and can prevent the workpiece from shifting sideways. For example, Patent Document 1 discloses a holder for holding an workpiece to be polished during polishing, the holder including a holding sheet that holds the surface of the workpiece opposite to the surface to be polished, a frame material fixed on the holding sheet and that holds the side of the workpiece during polishing, and an adhesive for fixing the frame material to the holding sheet.

[0004] In such holders, the holding pad and the frame material are generally fixed via an adhesive. Examples of such adhesives include double-sided tape in which an adhesive is applied to both sides of a substrate, and adhesive tape in which an adhesive is processed into a tape shape. For example, Patent Document 1 discloses a method for manufacturing a holder in which a polyurethane foam sheet and a frame material are bonded by thermocompression bonding at 120°C and a pressure of 1.5 MPa via a heat-welding adhesive, in which the heat-welding adhesive is preferably in sheet form. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 7139125 Summary of the Invention [Problem to be solved by the invention]

[0006] When an adhesive that cannot be processed into double-sided tape or adhesive tape due to its adhesive properties, chemical resistance, or other factors is used, a liquid adhesive is used. When using such a liquid adhesive, the adhesive must be precisely applied to the adhesive surface of the frame to ensure sufficient adhesion between the frame and the holding pad. If the adhesive is not applied sufficiently to the adhesive surface, the frame will easily peel off due to contact between the workpiece and the frame during polishing. Furthermore, if the adhesion between the frame and the holding pad is insufficient and gaps are formed, polishing slurry will penetrate through the gaps during chemical mechanical polishing, dissolving the adhesive and contaminating the workpiece. On the other hand, if an attempt is made to apply the adhesive over a sufficient area to ensure sufficient adhesion between the frame and the holding pad, the adhesive will adhere to the inner wall of the frame and the holding surface of the holding pad in the area that comes into contact with the workpiece, and the dried or hardened adhesive will cause scratches that damage the workpiece. Furthermore, in the case of chemical mechanical polishing, a part of the dried or hardened adhesive may dissolve in the polishing slurry, becoming an impurity and contaminating the workpiece to be polished.

[0007] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a method for manufacturing a holder that prevents the inner wall of the frame material and the holding surface of the holding pad from being contaminated by adhesive, and a jig to be used therefor. [Means for solving the problem]

[0008] The inventors conducted extensive research to solve the above problems and discovered that the above object could be achieved by manufacturing a holder through a specific process using a sheet-like jig, thereby completing the present invention.

[0009] That is, the present invention is as follows.

[0010] [1] an arrangement step of arranging the sheet-like jig in a through hole of a frame material having a through hole in a central portion thereof; a coating step of coating an adhesive on the upper surface of the frame material; a removing step of removing the jig from the through hole; an adhering step of adhering the frame material to the holding pad via the adhesive; A method for manufacturing a holder, comprising: the holding pad has a holding surface for holding the object to be polished, the holding surface having a surface to be bonded to the frame material, In the arranging step, the outer peripheral wall of the jig and the inner peripheral wall of the frame material are at least partially in contact with each other.

[0011] [2] a placement step of placing the sheet-like jig on a holding surface of a holding pad having a holding surface for holding an object to be polished so that an inner edge portion of the holding surface is exposed; applying an adhesive to the inner edge of the holding surface; a bonding step of bonding a frame member having a through hole in the center to the holding pad via the adhesive; a removing step of removing the jig from the holding surface; A method for manufacturing a holder, comprising: In the bonding step, the outer peripheral wall of the jig and the inner peripheral wall of the frame material are at least partially in contact with each other.

[0012] [3] The method for manufacturing a holder according to [1], wherein in the application step, at least a portion of the adhesive is applied to the upper surface of the jig.

[0013] [4] The method for manufacturing a holder according to [2], wherein in the application step, at least a portion of the adhesive is applied to the upper surface of the jig.

[0014] [5] The jig has, on its upper surface, a surface that slopes downward from the outer periphery toward the center of the jig. A method for manufacturing the holder according to any one of [1] to [4].

[0015] [6] The inclination angle of the inclined surface is 1° or more and 30° or less. [5] A method for manufacturing the holder described in [5].

[0016] [7] The cross section of the inclined surface is linear. [5] A method for manufacturing the holder described in [5].

[0017] [8] The adhesive is a photocurable resin. A method for manufacturing the holder according to any one of [1] to [4].

[0018] [9] The thickness of the outer peripheral wall of the jig is 90% or more and 110% or less of the thickness of the inner peripheral wall of the frame material, A method for manufacturing the holder according to any one of [1] to [4].

[0019]

[10] The shape of the outer peripheral wall of the jig and the shape of the inner peripheral wall of the frame material are the same. A method for manufacturing the holder according to any one of [1] to [4].

[0020]

[11] The method for producing the holder according to any one of [1] to [4], which is a holder for chemical mechanical polishing.

[0021]

[12] A sheet-like jig used in the method for manufacturing a holder according to any one of [1] to [4].

[0022]

[13] the jig has, on its upper surface, a surface that slopes downward from the outer periphery toward the center of the jig, The inclination angle of the inclined surface is 1° or more and 30° or less, The cross section of the inclined surface is linear.

[12] The jig described in

[12] . [Effects of the Invention]

[0023] According to the present invention, it is possible to provide a method for manufacturing a holder that prevents the inner wall of the frame material and the holding surface of the holding pad from being contaminated by adhesive, and a jig used therefor. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a flowchart showing an example of a method for manufacturing a holder according to the present invention. [Figure 2] FIG. 2 is a schematic cross-sectional view showing an example of a frame material in the holder according to the present invention. [Figure 3] 5A to 5C are schematic cross-sectional views for explaining an arrangement step in the method for manufacturing a holder according to the present invention. [Figure 4A] FIG. 10 is a schematic plan view for explaining another example of the arrangement step. [Figure 4B] FIG. 10 is a schematic plan view for explaining yet another example of the arrangement step. [Figure 4C] FIG. 10 is a schematic plan view for explaining still another example of the arrangement step. [Figure 5] FIG. 10 is a partial schematic cross-sectional view illustrating an example of a sheet-like jig. [Figure 6A] 10A and 10B are schematic cross-sectional views for explaining examples of cross-sectional shapes of inclined surfaces in a sheet-like jig. [Figure 6B] 10A and 10B are schematic cross-sectional views for explaining another example of the cross-sectional shape of an inclined surface in a sheet-like jig. [Figure 6C] FIG. 10 is a schematic cross-sectional view for explaining yet another example of the cross-sectional shape of an inclined surface in a sheet-like jig. [Figure 7] 10 is a schematic cross-sectional view for explaining still another example of the cross-sectional shape of an inclined surface in a sheet-like jig. FIG. [Figure 8]5A to 5C are schematic cross-sectional views illustrating a coating step in the method for manufacturing a holder according to the present invention. [Figure 9] 5A to 5C are schematic cross-sectional views illustrating a removing step in the manufacturing method of the holder according to the present invention. [Figure 10] FIG. 2 is a schematic cross-sectional view showing an example of a holding pad in the holder according to the present invention. [Figure 11] 5A to 5C are schematic cross-sectional views illustrating a bonding step in the manufacturing method of the holder according to the present invention. [Figure 12] 1 is a schematic cross-sectional view showing an example of a holder according to the present invention. [Figure 13] 10 is a flowchart showing another example of a method for manufacturing a holder according to the present invention. [Figure 14] 10A and 10B are schematic cross-sectional views for explaining another example of the arrangement step in the manufacturing method of the holder according to the present invention. [Figure 15] 10A and 10B are schematic cross-sectional views for explaining another example of the application step in the method for manufacturing a holder according to the present invention. [Figure 16] 10A and 10B are schematic cross-sectional views for explaining another example of the bonding step in the manufacturing method of the holder according to the present invention. [Figure 17] 10A and 10B are schematic cross-sectional views for explaining another example of the removing step in the manufacturing method of the holder according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, an embodiment of the present invention (hereinafter referred to as "the present embodiment") will be described in detail with reference to the drawings. Unless otherwise specified, positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings. Furthermore, the dimensional ratios of the drawings are not limited to those shown. However, the following embodiments are examples for explaining the present invention, and the present invention is not limited to these. In other words, the present invention can be implemented with any modifications within the scope of the gist thereof. In this specification, for example, the expression of a numerical range such as "1 to 100" includes both the lower limit "1" and the upper limit "100". The same applies to the expression of other numerical ranges.

[0026] [Method for manufacturing the holder] A method for manufacturing a holder according to one aspect of this embodiment (hereinafter referred to as "first embodiment") includes an arrangement step of arranging a sheet-shaped jig in a through hole of a frame material having a through hole in the center, an application step of applying an adhesive to the upper surface of the frame material, a removal step of removing the jig from the through hole, and an adhesion step of adhering the frame material to a holding pad via the adhesive, wherein the holding pad has a holding surface for holding an object to be polished, the holding surface having a surface that adheres to the frame material, and in the arrangement step, at least a portion of the outer peripheral wall of the jig and the inner peripheral wall of the frame material are in contact with each other. This manufacturing method will be described in more detail below.

[0027] Fig. 1 is a flowchart showing a manufacturing method of a holder 100 according to a first embodiment of the present invention. Figs. 2 to 12 are schematic cross-sectional views or schematic plan views illustrating the manufacturing method according to the first embodiment. The manufacturing method of the holder 100 according to the first embodiment includes an arrangement step S11 in which a sheet-like jig 30 is arranged in a through hole 43 of a frame material 40 having the through hole 43 in its central portion, an application step S12 in which an adhesive 60 is applied to an upper surface 41 of the frame material 40, a removal step S13 in which the jig 30 is removed from the through hole 43, and an adhesion step S14 in which the frame material 40 is adhered to a holding pad 50 via the adhesive 60. The holding pad 50 has a holding surface 51 for holding a workpiece, and the holding surface 51 has a surface that adheres to the frame material 40. In the arrangement step S11, at least a portion of the outer peripheral wall 32 of the jig 30 and the inner peripheral wall 42 of the frame material 40 are in contact with each other.

[0028] In the method for manufacturing a holder of the first embodiment, by positioning the jig 30 and the frame material 40 so that at least a portion of the outer peripheral wall 32 of the jig 30 and the inner peripheral wall 42 of the frame material 40 are in contact with each other, when applying the adhesive 60 to the upper surface 41 of the frame material 40, the adhesive 60 can be applied without dripping onto the inner peripheral wall 42 of the frame material 40 or the holding surface 51 of the holding pad 50. As a result, contamination of the inner peripheral wall 42 of the frame material 40 and the holding surface 51 of the holding pad 50 by the adhesive 60 can be suppressed.

[0029] <Jig placement process S11> In the jig placement step S11, as shown in FIG. 3, the jig 30 is placed in the through-hole 43 of the frame material 40. The frame material 40 has a frame shape when viewed from above. As shown in FIG. 2, the cross section of the frame material 40 has an upper surface 41, a lower surface 44, and an outer peripheral wall 45 and an inner peripheral wall 42 connecting the upper surface 41 and the lower surface 44. The through-hole 43 is formed so as to be surrounded by the inner peripheral wall 42. The jig 30 is placed so that the outer peripheral wall 32 of the jig and the inner peripheral wall 42 of the frame material are in contact with each other at least in part. This placement prevents adhesive from dripping onto the inner peripheral wall 42 of the frame material at the contact points between the outer peripheral wall 32 of the jig and the inner peripheral wall 42 of the frame material during the application step S12 described below. As a result, the inner peripheral wall 42 of the frame material 40 and the holding surface 51 of the holding pad 50 can be prevented from being contaminated by the adhesive. Furthermore, in the application step S12, it is possible to prevent the adhesive from dripping onto the surface of the work table (not shown) on which the frame material 40 and the jig 30 are placed. This eliminates the need to clean the work table during and after manufacturing the holder, thereby improving work efficiency.

[0030] The positioning of the jig 30 and the frame material 40 is not particularly limited as long as the outer peripheral wall 32 of the jig and the inner peripheral wall 42 of the frame material are in at least partial contact with each other. This may be adjusted appropriately depending on the ease of handling the jig by an operator and work efficiency, as long as the effects of the present invention are not impaired. For example, as shown in FIG. 4A , the outer peripheral wall 32a of a disk-shaped jig 30a and the inner peripheral wall 42 of the frame material may be in contact along the entire periphery. This arrangement is preferable from the viewpoint of work efficiency. Alternatively, as shown in FIG. 4B , the entire arc-shaped outer peripheral wall 32b of a jig 30b, whose outer peripheral wall has a semicircular shape in plan view from above, may be in contact with the inner peripheral wall 42 of the frame material. Alternatively, as shown in FIG. 4C , the entire arc-shaped outer peripheral wall 32c of a jig 30c, whose outer peripheral wall has a fan-shaped shape in plan view from above, may be in contact with the inner peripheral wall 42 of the frame material. 4B and 4C do not need to be fixed in place, and may be used while changing its position depending on the location where adhesive 60 is to be applied in application step S12, which will be described later. In other words, the jig may be moved so that at least a portion of the outer peripheral wall of the jig and the inner peripheral wall of the frame material come into contact at the location where adhesive 60 is to be applied. Furthermore, the number of jigs 30 to be arranged is not particularly limited, and from the standpoint of work efficiency, for example, a plurality of fan-shaped jigs 30c as shown in FIG. 4C may be arranged.

[0031] [Sheet-shaped jig 30] The sheet-like jig 30 has an upper surface 31, a lower surface 33, and an outer peripheral wall 32 connecting them. The lower surface 33 is the surface that comes into contact with a workbench or the like when the jig 30 is placed on the workbench or the like and used for work. By arranging the jig 30 within the through-hole 43 of the frame material, when adhesive 60 is applied to the upper surface 41 of the frame material in the application step S12 described below, it is possible to prevent the adhesive 60 from dripping and adhering to the inner peripheral wall 42 of the frame material or to the surface of the workbench or the like.

[0032] The upper surface 31 of the jig 30 may be flat over its entirety, as shown in FIG. 3. FIG. 5 is a partial schematic cross-sectional view illustrating an example of the jig, and the cross-section is a cross-section obtained by cutting along the inclination direction of the inclined surface 31a (the same applies to FIGS. 6A to 6C and 7 below). As shown in FIG. 5, the jig 30 may have, without limitation, a surface 31a that slopes downward from its outer periphery toward its center. The inclined surface 31a slopes preferably from a position within 3 mm, more preferably within 2 mm, even more preferably within 1 mm, and particularly preferably from a position of 0 mm, from the outer periphery toward the center of the jig 30. By having the inclined surface 31a, when the adhesive 60 is applied in the application step S12 described below, excess adhesive 60 adhering to the jig 30 flows along the inclined surface 31a of the jig 30 toward the center of the jig 30. This makes it difficult for adhesive 60 present near the boundary between inclined surface 31a of the jig and upper surface 41 of the frame material to drip onto inner peripheral wall 42 of the frame material. This is particularly noticeable when jig 30 is lifted and removed before adhesive 60 dries or hardens.

[0033] The inclination angle θ of the inclined surface 31a (see FIG. 5) is not particularly limited and may be set appropriately within the range of 0.1 to 89.9° depending on the type, viscosity, amount of adhesive 60, application area, application precision, etc. From the viewpoint of ease of handling the jig by an operator and prevention of chipping or cracking of the jig, the inclination angle is preferably 1 to 30°, more preferably 2 to 20°, and even more preferably 3 to 10°.

[0034] The shape of the inclined surface 31a is not particularly limited. However, from the viewpoint of ease of processing, it is preferable that the cross section (hereinafter simply referred to as the "cross section" in this paragraph) obtained by cutting the inclined surface 31a along the inclination direction of the inclined surface 31a be linear. The shape of the upper surface of the jig 30, including the inclined surface 31a, is not particularly limited and may be appropriately determined depending on the type, viscosity, application amount, application area, application accuracy, etc. of the adhesive 60 used. The upper surface may have, for example, a V-shaped groove as shown in FIG. 6A or a trapezoidal groove as shown in FIGS. 6B and 6C. A sheet-like jig having such a groove can collect the adhesive flowing along the inclined surface 31a in the groove. The upper surface 31 of the jig 30 may have a substantially rectangular groove as shown in FIG. 7.

[0035] The thickness of the outer peripheral wall 32 of the jig 30 is not particularly limited and may be set appropriately depending on the thickness of the inner peripheral wall 42 of the frame material 40 and the ease of applying the adhesive 60. For example, from the standpoint of preventing the adhesive 60 from dripping onto the inner peripheral wall 42 of the frame material 40 and the ease of applying the adhesive 60, the thickness of the outer peripheral wall 32 of the jig 30 is preferably 90% to 110% of the thickness of the inner peripheral wall 42 of the frame material 40, more preferably 95% to 105%, and even more preferably 97% to 103%. Here, "thickness" refers to the thickness of the outer peripheral wall 32 or the inner peripheral wall 42 in the vertical direction in FIGS. 3, 5, 6A to 6C, and 7.

[0036] The planar shape of the jig 30 is not particularly limited and may be appropriately set depending on factors such as the ease of application of the adhesive 60 and the shape of the through hole 43, as long as the effects of the present invention are not impaired. For example, when the planar shape of the through hole 43 is circular, the planar shape of the jig 30 is preferably a circle as shown in FIG. 4A , a semicircle as shown in FIG. 4B , or a sector shape as shown in FIG. 4C . Note that for ease of explanation, the planar shape of the jig 30 is circular, but is not limited to a circular shape. From the perspective of more reliably and effectively achieving the effects of the present invention and from the perspective of ease of application of the adhesive 60, it is more preferable that the planar shape of the jig 30 and the planar shape of the through hole 43 are the same, and it is most preferable that the planar shape of the jig 30 be a shape that is 99.900 to 99.999% of the planar shape of the through hole 43.

[0037] The shape of the jig 30 other than the outer peripheral wall 32 that contacts the frame material 40 can be set appropriately within a range that does not impair the effects of the present invention, and is not particularly limited. For example, from the viewpoint of work efficiency, such as ease of placement and removal of the jig 30, a gripping protrusion may be provided near the center of the top surface, or a through hole may be formed near the center.

[0038] Although not particularly limited, it is preferable that the jig 30 has a surface 31a on its upper surface 31 that slopes downward from the outer periphery toward the center, the slope angle θ of the slope 31a being between 1° and 30°, and the cross section of the slope 31a being linear. This makes it possible to more reliably and effectively achieve the effects of the present invention, improves ease of processing, and improves the ease of handling of the jig by workers, and further prevents chipping or cracking of the jig.

[0039] The material of the jig 30 is not particularly limited and can be appropriately set within a range that does not impair the effects of the present invention. Examples of the material include resin, metal, wood, and ceramic.

[0040] [Frame material] As described above, the frame 40 has an upper surface 41, an inner peripheral wall 42, a lower surface 44, and an outer peripheral wall 45. The through-hole 43 is formed so as to be surrounded by the inner peripheral wall 42. The upper surface 41 is the surface opposite the lower surface 44. The inner peripheral wall 42 is the surface on which the through-hole 43 is formed, and the opposite surface is the outer peripheral wall 45. The frame 40 is intended to prevent the workpiece from shifting laterally during polishing and falling off the holding surface of the holding pad (by restricting the extent of lateral shift). The planar shape and dimensions of the frame are not particularly limited as long as the through-hole prevents the workpiece from falling out of the polishing area. For convenience of explanation, it is assumed that the frame 40 has only one circular through-hole 43, but the shape and number can be arbitrarily determined depending on the polishing conditions. The planar shape of the through-hole 43 in the frame 40 can be any shape to match the shape of the workpiece, and the frame may have multiple through-holes. For example, when a circular object to be polished is to be held, the frame material may have a circular through-hole formed therein whose inner diameter is slightly larger than that of the object to be polished.

[0041] The thickness of the frame material 40 is not particularly limited, but is preferably equal to or less than the thickness of the object to be polished. Furthermore, the thickness of the frame material 40 is preferably within a range that allows for optical transparency, as described below. From these viewpoints, the thickness of the frame material 40 may be 100 μm or more and 1000 μm or less.

[0042] The material of the frame material 40 is not particularly limited, but is preferably light-transmitting. Examples of materials for the frame material 40 include light-transmitting resins, more specifically polyurethane resins, polyester resins, phenolic resins, urea resins, melamine resins, epoxy resins, and acrylic resins. More specifically, examples of such materials include polyurethane resins, polyester resins, polyamide resins, cellulose-based resins, polycarbonate resins, halogen-based resins (such as polyvinyl chloride resins, polytetrafluoroethylene resins, and polyvinylidene fluoride resins), polystyrene resins, olefin-based resins (such as polyethylene resins and polypropylene resins), butadiene rubber, and isoprene rubber. Among these, acrylic resins or polycarbonate resins are preferred, and polycarbonate resins are more preferred, from the viewpoints of light transmittance and the hardness, chemical resistance, and precision required during polishing.

[0043] When a light-curable resin is used as the adhesive 60, the light-transmitting frame material 40 can transmit light when light is irradiated onto the adhesive 60 disposed between the holding pad 50 and the frame material 40, which will be described in detail later. As a result, the light-curable resin can be sufficiently cured, which leads to even better adhesion between the holding pad 50 and the frame material 40 and also results in a holder with even better flatness.

[0044] The light transmittance of the frame material 40 need only be such that the photocurable resin can be cured through the frame material. For example, the light transmittance may be 20% or more at any wavelength between 1 nm and 700 nm, but it is preferable that the light transmittance be 20% or more over the entire wavelength range between 1 nm and 700 nm. From the viewpoint of productivity, the light transmittance is preferably 50% or more, more preferably 70% or more, even more preferably 80% or more, and particularly preferably 85% or more.

[0045] From the viewpoint of light transmittance, the proportion of air bubbles inside frame material 40 is preferably 5.0 area % or less, more preferably 1.0 area % or less, and even more preferably 0.1 area % or less. Here, the proportion of air bubbles means the proportion of air bubbles in a unit area of a cross section of frame material 40 perpendicular to the surface of frame material 40.

[0046] The upper surface 41 of the frame material may have openings. The opening diameter is not particularly limited, but is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 2 μm or less, from the viewpoints of durability and chemical resistance. The opening diameter can be measured by any known method, and is not particularly limited. For example, the opening diameter is measured by the following method. The image is observed at 200x magnification using a laser microscope (for example, "VK-X105" manufactured by KEYENCE Corporation) to obtain an image. The image is then binarized using image analysis software (for example, "WinRoof" manufactured by Mitani Shoji Co., Ltd.) to distinguish the openings from other areas. The circle-equivalent diameter, i.e., the opening diameter is calculated from the area of each distinguished opening, assuming that the openings are perfect circles. The opening diameters of each opening are then averaged to obtain the average opening diameter (μm).

[0047] Furthermore, the deflection temperature under load of the frame material 40 at 1.80 MPa is preferably 100°C or higher, more preferably 110°C or higher, even more preferably 120°C or higher, and particularly preferably 130°C or higher. This makes it possible to prevent warping caused by reaction heat when the photocurable resin hardens, and tends to further improve the flatness of the obtained holder 100. The deflection temperature under load can be measured based on ISO 75-1, 2 (2020).

[0048] <Step S12 of applying adhesive to frame material> In step S12 of applying adhesive 60 to the frame material 40, as shown in FIG. 8 , adhesive 60 is applied to the upper surface 41 of the frame material 40 arranged in the above-described arrangement step S11 by a known method, such as screen printing. The upper surface 41 of the frame material will be the bonding surface for the holding pad 50 in step S14, which will be described later. From the viewpoint of adhesion between the frame material 40 and the holding pad 50, it is preferable to apply adhesive 60 sufficiently to the inner peripheral wall 42 of the upper surface 41 of the frame material. To sufficiently apply adhesive 60 to the inner peripheral wall 42 of the upper surface 41 of the frame material, the adhesive 60 may be applied so that a portion of the adhesive protrudes onto the upper surface 31 of the jig. In other words, a portion of the adhesive 60 may be applied to the upper surface 31 of the jig. On the other hand, from the viewpoint of adhesion between the frame material 40 and the holding pad 50 and to the viewpoint of suppressing scratches on the workpiece to be polished, the adhesive 60 may be left unapplied on the outer peripheral wall 45 of the upper surface 41 of the frame material. That is, there may be portions on the upper surface 41 of the frame material where the adhesive 60 is not applied. Furthermore, as a result of attempting to sufficiently apply the adhesive 60 up to the outer peripheral wall 45 side, the adhesive 60 may drip onto the outer peripheral wall 45.

[0049] 〔glue〕 The adhesive 60 is used to bond the holding pad 50 and the frame material 40. The type of adhesive 60 is not particularly limited as long as it is liquid, and examples include curing adhesives such as photocuring resins, thermosetting resins, and moisture-curing resins, solvent-evaporating adhesives, and hot-melt adhesives. Among these, curing adhesives are preferred, and those containing photocuring resins are more preferred. The use of a photocuring resin allows for stronger bonding between the frame material 40 and the holding pad 50. Furthermore, the use of a photocuring resin eliminates the need for a thermocompression bonding process or the like during bonding, thereby avoiding thermal shrinkage of the material due to heating or pressure application, and further improving the flatness of the resulting holder 100.

[0050] Examples of the photocurable resin include a photoradical polymerizable resin and a photocationic polymerizable resin. Among them, from the viewpoint of ease of handling, it is preferable that the photocurable resin is a photoradical polymerizable resin.

[0051] From the viewpoint of ease of handling, etc., the photo-radical polymerizable resin preferably contains a monomer having an ethylenically unsaturated double bond. From the viewpoint of adhesiveness, the photo-radical polymerizable resin is preferably an ultraviolet-curable resin. When the photo-curable resin is an ultraviolet-curable resin, the frame material only needs to have a light transmittance sufficient to allow the ultraviolet-curable resin to be cured. The light transmittance may be 20% or more at any wavelength between 1 nm and 400 nm, but is preferably 20% or more over the entire wavelength range between 1 nm and 400 nm. From the viewpoint of productivity, the light transmittance is preferably 50% or more, more preferably 70% or more, even more preferably 80% or more, and particularly preferably 85% or more.

[0052] From the viewpoint of adhesiveness, etc., the ultraviolet-curable resin is preferably an acrylate-based resin having an acryloyl group in the molecule. Examples of ultraviolet-curable resins include ultraviolet-curable urethane acrylate-based resins, ultraviolet-curable polyester acrylate-based resins, ultraviolet-curable epoxy acrylate-based resins, ultraviolet-curable polyol acrylate-based resins, and ultraviolet-curable epoxy resins. These may be used alone or in combination of two or more.

[0053] The photocurable resin may contain a photopolymerization initiator. The photopolymerization initiator is not particularly limited as long as it generates radicals upon light absorption, and examples thereof include benzophenone-based compounds, acetophenone-based compounds, and thioxanthone-based compounds.

[0054] The photocurable resin is preferably used in conjunction with the holding pad 50 which contains an elastic resin foam, more preferably a polyurethane resin, and even more preferably a polyurethane resin obtained by a wet solidification method. When the photocurable resin is used in conjunction with the holding pad 50 which contains an elastic resin foam, the adhesion between the holding pad 50 and the frame material 40 tends to be even better. The mechanism is not particularly limited, but it is thought that the photocurable resin fills in the irregularities on the surface of the elastic resin foam in the holding pad 50 which is the adherend, and when cured, forms a covalent bond or the like with the functional groups on the surface of the elastic resin foam, thereby firmly fixing the elastic resin foam.

[0055] The photocurable resin is preferably used in conjunction with a frame material 40 containing an acrylic resin or a polycarbonate resin, and more preferably a polycarbonate resin. When the photocurable resin is used in conjunction with a frame material 40 containing an acrylic resin or a polycarbonate resin, the adhesion between the holding pad 50 and the frame material 40 tends to be better. The mechanism behind this is not particularly limited, but it is thought that, for example, when hardened, the photocurable resin forms a covalent bond or the like with a functional group on the surface of the acrylic resin or polycarbonate resin in the frame material 40, thereby more firmly fixing the holding pad 50.

[0056] The adhesive 60 can be applied to the upper surface 41 of the frame material by any conventionally known method. Examples include printing, such as screen printing, spray application, and application with a roller or brush. Among these, a method including a step of printing the adhesive is preferred. Specific printing techniques are not particularly limited, but include, for example, screen printing, relief printing, intaglio printing, offset printing, and inkjet printing. Among these, screen printing is preferred from the standpoints of ease of high-mix, low-volume production, ease of forming surface shapes such as grooves, equipment costs, productivity, the variety of compatible resins, thickness, and precision.

[0057] Here, screen printing is a technique for forming a pattern through a very fine mesh (screen) called gauze. By applying screen printing to the forming process in this embodiment, a thin adhesive having a thickness of approximately several tens to several hundreds of micrometers can be suitably formed on the upper surface of the frame material.

[0058] The screen printing process is not particularly limited. For example, the process may include a silk screen preparation process, which involves selecting the count of the silk screen mesh and transferring the design to the silk screen mesh (a process of masking the areas not to be printed and dissolving the mask from the areas to be printed), and a process of applying adhesive to the upper surface of the frame material through the screen. This allows the desired design to be printed, and the adhesive can be applied to the desired thickness after printing. The silk screen mesh is not limited to those containing natural fibers such as silk, but may also contain synthetic fibers such as polyester or metal fibers such as stainless steel. Other known screen meshes can also be used depending on the required performance.

[0059] The thickness of the adhesive 60 to be applied is not particularly limited, but from the standpoint of adhesiveness and work efficiency, it is preferably 0.03 mm or more and 1.18 mm or less, more preferably 0.05 mm or more and 1.15 mm or less, and even more preferably 0.08 mm or more and 1.12 mm or less.

[0060] <Jig removal process S13> In the jig removal step S13, the jig 30 placed in the above-mentioned placement step S11 is removed from inside the through-hole 43 of the frame material. The removal method is not particularly limited, but for example, the frame material 40 may be lifted and removed from the jig 30 as shown in Fig. 9, or the jig 30 may be lifted and removed. From the viewpoint of work efficiency, it is preferable to lift the frame material 40 and remove it from the jig 30.

[0061] The removed jig 30 may be reused when manufacturing the next holder, or may be discarded after a single use.

[0062] <Holding pad bonding step S14> In the bonding step S14 of the holding pad 50, the frame material 40 to which the adhesive 60 has been applied in the above-mentioned application step S12 is bonded to the holding pad 50, thereby bonding the frame material 40 and the holding pad 50. The adhesive 60 usually becomes adhesive when it dries or hardens. For example, when an adhesive 60 containing a photocurable resin is used as the adhesive 60, the frame material 40 and the holding pad 50 can be bonded to each other by hardening the adhesive 60 using a method including a light irradiation step or the like after the frame material 40 and the holding pad 50 have been bonded together.

[0063] The holding pad 50 has a holding surface 51. In the bonding step S14, for example, the holding pad 50 is bonded to the upper surface 41 of the frame material to which the adhesive 60 was applied in the above-mentioned application step S12 via the adhesive 60, and then the adhesive 60 is cured to bond the frame material 40 and the holding pad 50 together, thereby obtaining the holder 100. The method for bonding the frame material 40 and the holding pad 50 may be appropriately determined depending on work efficiency as long as the effects of the invention are not impaired, and is not particularly limited. For example, as shown in FIG. 11 , the frame material 40 may be turned upside down with the upper surface 41 facing downward and bonded to the holding surface 51 of the holding pad 50, or the holding surface 51 of the holding pad 50 may be faced downward and bonded from above the upper surface 41 of the frame material 40. The bonding surface between the holding pad 50 and the frame material 40 is the holding surface 51 of the holding pad, and typically, the inner edge of the holding surface 51 of the holding pad serves as the bonding surface. The order of the removing step S13 and the adhering step S14 is not particularly limited. The removing step S13 may be performed after the adhering step S14, but from the viewpoint of preventing excess adhesive from adhering to the holding surface, it is preferable to perform the adhering step S14 after the removing step S13.

[0064] The method for drying or curing the adhesive 60 is not particularly limited and may be selected appropriately depending on the type of adhesive, etc., but examples include methods including steps of pressurizing, heating, cooling, light irradiation, leaving to stand, air blowing, etc. Among these, from the viewpoint of the adhesiveness between the frame material 40 and the holding pad 50, a method in which the adhesive 60 contains a photocurable resin and the method for drying or curing the adhesive 60 includes a light irradiation step of irradiating with light is preferred.

[0065] The light irradiation process is a process of curing the photocurable resin by light irradiation. The light irradiation process can firmly bond the frame material 40 and the holding pad 50, and can provide adhesiveness similar to that achieved when a heat-sealing adhesive is used. Furthermore, there is no need to go through a thermocompression bonding process or the like during the above bonding, which can avoid thermal shrinkage of the material due to heating or pressure application, and the resulting holder 100 has excellent flatness. The light to be irradiated is not particularly limited as long as it can cure the photocurable resin, but from the perspective of adhesiveness of the cured product, it is preferable that the irradiation wavelength be ultraviolet light.

[0066] The light source can be any known light source, and is not particularly limited. Examples include sunlight, a xenon lamp, a fluorescent lamp, a light-emitting diode (LED), a low-pressure mercury lamp, a high-pressure mercury lamp, and a metal halide lamp.

[0067] The irradiance during the light irradiation process was 180 mW / cm 2 More than 300mW / cm 2 Preferably, it is 200 mW / cm or less. 2 More than 280mW / cm 2 More preferably, it is 220 mW / cm or less. 2 More than 260mW / cm 2 More preferably, it is 230 mW / cm or less. 2 More than 250mW / cm 2 It is even more preferable that the irradiance is 180 mW / cm or less. 2 By setting the irradiance at 300mW / cm or more, the adhesiveness tends to be excellent. 2 By satisfying the condition below, deterioration of the holding surface 51 due to the light irradiation process itself is prevented, and the flatness tends to be excellent.

[0068] [Holding pad] As shown in FIG. 10, the holding pad 50 has a holding surface 51 for holding an object to be polished.

[0069] The holding pad 50 is not particularly limited in terms of its material as long as it has a holding surface 51. The holding pad 50 is not particularly limited, but is preferably in the form of a sheet, in which case the surface of the sheet serves as the holding surface 51.

[0070] The planar shape of the holding pad 50 is not particularly limited as long as it prevents the object to be polished from protruding from the polishing area. The planar shape may be, for example, circular. The dimensions of the holding pad 50 are not particularly limited, and desired dimensions can be adopted depending on the polishing conditions. From the viewpoint of adhesion to the frame material 40, the dimensions are preferably larger than the outer diameter of the frame material 40, and more preferably the same. For example, when the frame material 40 has a circular planar shape, the holding pad 50 is also circular, and it is preferable that the outer diameter of the frame material 40 and the outer diameter of the holding pad 50 are the same.

[0071] The holding pad 50, preferably with an appropriate amount of water impregnated on its holding surface 51, presses the workpiece against it, thereby enabling the workpiece to be held better by the interaction between the holding surface 51 and the surface of the workpiece, the surface tension of the water, and, if there are pores on the surface of the holding surface 51, the suction force of the pores. The holding surface 51 may be designed to be slightly larger than the surface of the workpiece that comes into contact with the holding pad 50, so as to facilitate holding the workpiece. Furthermore, the holding pad 50 may be configured to hold multiple works simultaneously. From the viewpoint of further suppressing the occurrence of polishing scratches on the surface of the workpiece due to impact during polishing, the holding pad 50 preferably contains a resin, more preferably contains an elastic resin, and even more preferably contains an elastic resin foam.

[0072] In this specification, "elastic resin foam" refers to a material having an elastic resin and a plurality of bubbles present within the elastic resin. The elastic resin foam having such a structure can absorb the impact that the workpiece receives from the polishing pad during polishing. Therefore, the occurrence of polishing scratches on the surface of the workpiece due to the impact during polishing tends to be effectively suppressed. The structure of the elastic resin foam will be described in detail below.

[0073] The method for producing the elastic resin foam is not particularly limited, but examples include wet solidification and molding. Among these, those produced by the wet solidification method tend to have better holding power for the polished object, and are therefore particularly suitable for use in the present invention. Furthermore, elastic resin foams produced by the wet solidification method tend to be soft, and as a holder, they tend to be prone to warping and loss of flatness. However, in the holder of this embodiment, even when such an elastic resin foam is used for the holding pad, the holding surface can have excellent flatness. Details of the wet solidification method will be described later.

[0074] The elastic resin is not particularly limited, but examples thereof include polyurethane resin, polynorbornene resin, trans-polyisoprene resin, and styrene-butadiene resin. Among these, polyurethane resin is preferred from the viewpoints of hardness, adjustment of viscoelastic properties, good foaming property, and abrasion resistance. These resins may be used alone or in combination of two or more. The elastic resin refers to a resin having elasticity, and elasticity refers to the property of returning to its original shape when deformation caused by an external force is removed.

[0075] The polyurethane resin is not particularly limited, but examples thereof include polyester-based polyurethane resins, polyether-based polyurethane resins, and polycarbonate-based polyurethane resins. These may be used alone or in combination of two or more. Among these, polyester-based polyurethane resins are preferred from the viewpoints of the holding power of the polished object and the adhesiveness to the frame material.

[0076] The polyurethane resin may be synthesized by a conventionally known method, or may be commercially available. Examples of commercially available products include, but are not limited to, SMP (trade name, manufactured by SMP Technologies Co., Ltd.), Diaplex (trade name, manufactured by Mitsubishi Heavy Industries, Ltd.), CRISBON (trade name, manufactured by DIC Corporation), SANPREN (trade name, manufactured by Sanyo Chemical Industries, Ltd.), and LEZAMIN (trade name, manufactured by Dai-Nippon Fine Chemicals Co., Ltd.).

[0077] The polynorbornene resin may be synthesized by a conventionally known method, or may be commercially available. Examples of commercially available products include, but are not limited to, Norsolex (trade name, manufactured by Zeon Corporation).

[0078] The trans-polyisoprene resin may be synthesized by a conventionally known method, or may be commercially available. Examples of commercially available products include, but are not limited to, Kuraray TPI (trade name, manufactured by Kuraray Co., Ltd.).

[0079] The styrene-butadiene resin may be synthesized by a conventionally known method, or may be commercially available. Examples of commercially available products include, but are not limited to, Asmer (trade name, manufactured by Asahi Kasei Corporation).

[0080] The content of the polyurethane resin is preferably 50% by mass or more, more preferably 80% by mass or more, even more preferably 90% by mass or more, and particularly preferably 95% by mass or more, based on the total amount of the elastic resin. It is highly preferable that the elastic resin is made of a polyurethane resin.

[0081] The elastic resin is preferably produced by a wet coagulation method. The wet coagulation method refers to a method in which a polyurethane resin to be formed into a film is dissolved in an organic solvent, the resin solution is applied to a sheet-like substrate, and the resin solution is then passed through a coagulation liquid in which the organic solvent dissolves but the resin does not, thereby replacing the organic solvent, coagulating the resin, and drying to form a foamed layer. When a polyurethane sheet is produced by the wet coagulation method, an open-cell structure is usually formed within the polyurethane sheet, in which teardrop-shaped cells are interconnected through finer cells.

[0082] The elastic resin may be produced by a molding method. When producing a polyurethane resin by a molding method, there are no particular limitations. For example, a mixed solution is first prepared by mixing an isocyanate group-containing compound and an active hydrogen compound having an active hydrogen group that reacts with the terminal isocyanate group of the isocyanate group-containing compound. The isocyanate group-containing compound can be produced by reacting a polyol compound having two or more hydroxyl groups in its molecule with a diisocyanate compound having a diisocyanate group with two isocyanate groups in its molecule. The resulting mixed solution is poured into a mold, and the isocyanate group-containing compound and the active hydrogen compound react and harden in the mold to form a block-shaped polyurethane molded body. This polyurethane molded body is then sliced into sheets to form a polyurethane sheet. Alternatively, instead of slicing the block-shaped polyurethane molded body, it is also possible to mold polyurethane sheets of the desired thickness one by one by changing the mold size. The support pad may include the polyurethane sheet thus obtained.

[0083] When the holding pad 50 contains a resin, it may contain one or more additives other than the resin as needed. Examples of such additives include, but are not limited to, foaming agents, catalysts, surfactants, antioxidants, antistatic agents, hydrophilic agents, hydrophobic agents, dyes, and pigments.

[0084] When the holding pad 50 includes an elastic resin foam, the type of cells present in the elastic resin foam is not particularly limited. Examples of such cells include closed cells, in which multiple cells exist independently, and open cells, in which multiple cells are connected by communicating holes, and these may be mixed. Among these, it is preferable that the elastic resin foam have open cells, from the viewpoint of more easily ensuring the cushioning properties and adhesion (retention performance) required for the holding pad 50. The shape of the cells is not particularly limited, but examples include spherical, approximately spherical, a shape flattened in the plane direction of the elastic resin foam (flat shape), and teardrop-shaped. Of these, the teardrop-shaped shape is preferable, from the viewpoint of more easily ensuring the cushioning properties and adhesion (retention performance) required for the holding pad.

[0085] The density (bulk density) of the resin is preferably 0.10 g / cm 3 More than 1.0g / cm 3 More preferably, it is 0.30 g / cm or less. 3 More than 0.95g / cm 3 or less, and more preferably 0.50 g / cm 3 More than 0.90g / cm 3 The density of the resin is 0.10 g / cm or less. 3 By setting the density of the resin to 1.0 g / cm or more, sinking is suppressed even when processed under high polishing pressure, and a higher level of planarization of the polished object tends to be achieved. 3 By satisfying the above condition, the occurrence of polishing scratches on the surface of the polishing object due to impact during polishing tends to be further suppressed. The density can be adjusted, for example, by selecting the type of resin or, when an elastic resin foam is used, by controlling the amount of air bubbles contained in the elastic resin foam. The density can be measured in accordance with JIS-K-7222 (2005).

[0086] When the holding pad includes an elastic resin foam, the elastic resin foam may have openings on its surface (the holding surface of the workpiece). These openings are formed by exposing air bubbles in the elastic resin foam to the surface, and are formed by slicing or buffing the elastic resin foam.

[0087] In this embodiment, the hardness of the holding pad is preferably 10° Shore A or more and 70° Shore D or less, more preferably 20° Shore A or more and 90° Shore A or less, and even more preferably 30° Shore A or more and 80° Shore A or less. A Shore A hardness of 10° or more effectively prevents the holding pad from sinking during polishing at high polishing pressure, tending to achieve a higher level of planarization of the workpiece. Furthermore, a Shore D hardness of 70° or less effectively prevents the occurrence of polishing scratches on the surface of the workpiece due to impact during polishing. The hardness of the holding pad is not particularly limited, but can be adjusted by, for example, selecting the type of resin or, when using an elastic resin foam, controlling the amount of air bubbles contained in the elastic resin foam. The Shore A hardness and Shore D hardness can be measured in accordance with JIS-K-6253 (2012).

[0088] The compressibility of the holding pad is preferably 0.10% or more and 60% or less, more preferably 1.0% or more and 50% or less, and even more preferably 5.0% or more and 40% or less. When the compressibility of the holding pad is 0.10% or more, the occurrence of polishing scratches on the surface of the workpiece caused by impact during polishing tends to be further suppressed. Furthermore, when the compressibility of the holding pad is 60% or less, the polishing rate tends to be further improved. The compressibility can be measured by the following method. Incidentally, whether the holding pad contains an elastic resin foam can be confirmed, for example, by the above-mentioned compressibility being 0.10 to 60%.

[0089] Here, the compression ratio can be determined using a Schopper-type thickness measuring device (pressure surface: circular with a diameter of 1 cm) in accordance with the Japanese Industrial Standards (JIS-L-1021 (2020)). Specifically, the thickness t0 is measured after applying an initial load for 30 seconds from an unloaded state, and then the thickness t1 is measured after applying a final pressure for 60 seconds from the thickness t0 state. The compression ratio is calculated using the formula compression ratio (%) = 100 × (t0 - t1) / t0. In this case, the initial load is 100 g / cm 2 , final pressure is 1120g / cm2 (Wet coagulation resin sheet) or initial load is 300g / cm 2 , final pressure is 1800g / cm 2 (Molded resin sheet).

[0090] The compressive elastic modulus of the holding pad is preferably 60% or more and 100% or less, more preferably 70% or more and 100% or less, and even more preferably 80% or more and 100% or less. When the compressive elastic modulus of the holding pad is 60% or more, the occurrence of polishing scratches on the surface of the workpiece caused by impact during polishing tends to be further suppressed. The compressive elastic modulus can be measured by the following method. Note that the presence of an elastic resin foam in the holding pad can be confirmed, for example, by the compressive elastic modulus being 60% or more and 100% or less.

[0091] The compressive modulus can be determined using a Schopper-type thickness gauge (pressure surface: circular, 1 cm diameter) in accordance with the Japanese Industrial Standards (JIS-L-1021 (2020)). Specifically, the thickness t0 is measured after applying an initial load for 30 seconds from an unloaded state, and then the thickness t1 is measured after applying a final pressure for 60 seconds from the thickness t0 state. From the thickness t1 state, all loads are removed, the material is left for 60 seconds (unloaded), and the thickness t1 is measured after applying the initial load again for 30 seconds. 0’ The compressive modulus is calculated as follows: Compressive modulus (%) = 100 × (t 0’ Calculate using the formula (t0-t1) / (t0-t1). At this time, the initial load is 100g / cm 2 , final pressure is 1120g / cm 2 (Wet coagulation resin sheet) or initial load is 300g / cm 2 , final pressure is 1800g / cm 2 (Molded resin sheet).

[0092] The thickness of the holding pad 50 is not particularly limited, but is preferably 0.10 mm to 5.0 mm, more preferably 0.20 mm to 2.0 mm, and even more preferably 0.30 mm to 0.70 mm. A holding pad 50 thickness of 0.10 mm or greater improves the amount of compressive deformation, thereby improving the holding performance (adhesion) of the workpiece. It also tends to absorb impacts to the workpiece during polishing, thereby reducing defects such as breakage. A holding pad 50 thickness of 5.0 mm or less tends to further suppress deterioration of flatness and a decrease in polishing rate, which are caused by excessive compressive deformation. The thickness of the holding pad 50 refers to the distance from the surface of the holding pad 50 that contacts the surface platen to the workpiece holding surface 51 of the holding pad, and is measured in accordance with the Japanese Industrial Standard (JIS-K-6505 (1995)). If the surface that contacts the surface platen has an adhesive layer, such as double-sided tape, the thickness of the adhesive layer is subtracted using known image processing techniques.

[0093] If necessary, the method may further include a lamination step of bonding a substrate to the surface of the holding pad 50 opposite the holding surface 51.

[0094] The lamination method is not particularly limited, but examples include a method of laminating via an adhesive layer. The method may further include a step of laminating a release layer via an adhesive layer on the surface of the substrate opposite to the surface on which the holding pad 50 is laminated. The substrate may include, but is not limited to, polyurethane sheets obtained by a wet coagulation method, polyurethane sheets obtained by a molding method, sponge foams such as polyethylene, films such as polyethylene terephthalate (PET), nonwoven fabrics, woven fabrics, etc. Alternatively, without using a substrate, a release layer may be directly laminated via an adhesive layer on the surface of the holding pad opposite to the surface on which the frame material is formed.

[0095] Furthermore, if necessary, the method for manufacturing a holder may further include other known steps, such as a processing step for processing the frame material or holding pad so that it has the desired dimensions and / or so that it becomes a holder with the desired groove, planar shape, etc.; a cleaning step for the jig and the obtained holder, etc.; a quality inspection step for checking that the obtained holder is free of dirt or foreign matter; and a step for applying known chemicals such as a water repellent or hydrophilic agent to the obtained holder, etc.

[0096] A method for manufacturing a holder according to another aspect of this embodiment (hereinafter referred to as the "second embodiment") includes the steps of: placing a sheet-like jig on a holding surface of a holding pad having a holding surface for holding a workpiece so that the inner edge of the holding surface is exposed; applying an adhesive to the inner edge of the holding surface; adhering a frame having a through hole in the center to the holding pad via the adhesive so that the jig is positioned within the through hole; and removing the jig from the through hole, wherein in the adhering step, at least a portion of the outer peripheral wall of the jig contacts the inner peripheral wall of the frame. This method will be described in more detail below.

[0097] [Method for manufacturing the holder] Fig. 13 is a flowchart showing a manufacturing method of a holder 200 according to a second embodiment of the present invention. Figs. 14 to 17 are schematic cross-sectional views or schematic plan views illustrating the manufacturing method according to the second embodiment. The manufacturing method of the holder 200 according to the second embodiment includes an arrangement step S21 in which a sheet-like jig 30 is arranged on a holding surface 51 of a holding pad 50 having a holding surface 51 for holding a workpiece such that an inner edge of the holding surface 51 is exposed; an application step S22 in which an adhesive 60 is applied to the inner edge of the holding surface 51; an adhesion step S23 in which a frame material 40 having a through hole 43 in a central portion thereof is bonded to the holding pad 50 via the adhesive 60 so that the jig 30 is positioned within the through hole 43; and a removal step S24 in which the jig 30 is removed from the through hole 43, so that in the adhesion step S23, at least a portion of the outer peripheral wall 32 of the jig and the inner peripheral wall 42 of the frame material are in contact with each other.

[0098] <Jig placement process S21> In the jig placement step S21, as shown in FIG. 14 , for example, the jig 30 is placed on the holding surface 51 of the holding pad 50 so that the lower surface 33 of the jig 30 and the holding surface 51 of the holding pad are in contact. The position of the sheet-like jig 30 on the holding surface 51 of the holding pad is not particularly limited as long as it allows the frame material 40 to be later attached to the holding pad 50, and may be appropriately set depending on the shapes of the sheet-like jig 30, the frame material 40, and the holding pad 50, etc. By placing the jig 30 in this manner, during the application step S22 described below, adhesive can be prevented from being applied to the portion of the holding surface 51 of the holding pad 50 where the jig 30 is placed. Furthermore, during the bonding step S23 described below, when the frame material 40 is placed on the portion where adhesive 60 has been applied, excess adhesive can be prevented from flowing onto the holding surface 51 of the holding pad 50. As a result, contamination of the inner circumferential wall 42 of the frame material 40 and the holding surface 51 of the holding pad 50 by adhesive can be prevented.

[0099] The sheet-like jig 30 and the holding pad 50 according to the second embodiment may be the same as those described in the first embodiment.

[0100] <Step S22 of applying adhesive to holding pad> In the adhesive application step S22 to the holding pad 50, as shown in FIG. 15 , adhesive 60 is applied to the inner edge 51 a of the holding surface 51 of the holding pad 50 arranged in the above-described arrangement step S21 by a known method such as screen printing. Typically, the adhesive 60 is applied to the portions of the holding surface 51 of the holding pad 50 that are not in contact with the jig 30, i.e., the exposed portions. From the viewpoint of adhesion between the holding pad 50 and the frame material 40, it is preferable to apply a sufficient amount of adhesive 60 to the inner edge 51 a of the holding surface 51. The above-described arrangement step S21 can prevent the adhesive 60 from adhering to the holding surface 51 of the holding pad 50 that is in contact with the jig 30. Therefore, when applying the adhesive 60 to the inner edge 51 a of the holding surface, the adhesive 60 may be applied so that a portion of the adhesive 60 protrudes onto the upper surface 31 of the jig. In other words, a portion of the adhesive 60 may be applied to the upper surface 31 of the jig. As a result, the adhesive 60 can be sufficiently applied to the inner edge 51 a of the holding surface.

[0101] The adhesive 60 according to the second embodiment, the application method and the amount of application may be the same as those described in the first embodiment.

[0102] <Frame material adhesion process S23> In the frame material 40 bonding step S23, the frame material 40 is bonded to the holding pad 50 to which the adhesive 60 has been applied in the above-described application step S22, thereby bonding the frame material 40 and the holding pad 50 together. For example, as shown in FIG. 16 , the lower surface 44 of the frame material 40 is bonded to the inner edge portion 51 a of the holding surface of the holding pad 50 so that the jig 30 is placed inside the through-hole 43 of the frame material 40, and then the adhesive 60 is dried or cured to bond the frame material 40 and the holding pad 50 together. The method for bonding the frame material 40 and the holding pad 50 is not particularly limited and may be set as appropriate depending on work efficiency as long as the effects of the invention are not impaired.

[0103] The method for drying or curing the frame material 40 and adhesive 60 according to the second embodiment may be the same as that described in the first embodiment.

[0104] <Jig removal process S24> In the jig removal step S24, the jig 30 placed in the above-described placement step S21 is removed from the holding surface 51 of the holding pad, as shown in Fig. 17, for example. In this way, the holder 200 is obtained. The removal method is not particularly limited, but for example, the frame material 40 and the holding pad 50 may be fixed together and the sheet-like jig 30 may be removed by lifting it up. The removed jig 30 may be reused when manufacturing the next holder, or may be discarded after one use.

[0105] [Holder] The holder 100 and holder 200 according to the present embodiment thus obtained comprise a frame 40 and a holding pad 50 having a holding surface 51, as shown in Figs. 12 and 17, with the frame 40 being bonded to the holding surface 51 of the holding pad 50 via a dried or hardened adhesive 60. Furthermore, the holder according to the present embodiment, in which contamination of the inner peripheral wall 42 of the frame 40 and / or the holding surface 51 of the holding pad 50 by the adhesive is suppressed, can be used to hold a workpiece when polishing the workpiece by mechanical polishing (lapping) or chemical mechanical polishing (CMP) using a polishing slurry during polishing. It is particularly suitable for chemical mechanical polishing (CMP) using a polishing slurry.

[0106] The object to be polished is not particularly limited, but examples thereof include materials for semiconductor devices, electronic components, etc., particularly thin substrates (objects to be polished) such as Si substrates (silicon wafers), SiC (silicon carbide) substrates, GaAs (gallium arsenide) substrates, optical materials such as lenses, plane-parallel plates, and reflective mirrors, and LCD (liquid crystal display) substrates. Among these, the method can be suitably used as a method for producing Si substrates (silicon wafers). [Example]

[0107] The present invention will be described in more detail below using examples and comparative examples, but the present invention is not limited to the following examples.

[0108] Example 1 A PET sheet-like jig with a circular disk shape (300.96 mm diameter) and an outer wall thickness of 0.8 mm was placed inside a through-hole in a 390 mm circular polycarbonate resin frame with an inner wall thickness of 0.8 mm and a central through-hole (301.00 mm diameter) so that the outer wall of the jig and the inner wall of the polycarbonate resin mold frame were in contact. An acrylic UV-curable resin adhesive was applied to the top surface of the frame using a screen printing method to a thickness of 0.1 mm. The adhesive was applied to the top surface of the frame so that it was sufficiently coated and also protruded onto the top surface of the jig. The sheet-like jig was then lifted and removed from the through-hole in the frame. The top surface of the frame was then bonded to the holding surface of a 410 mm diameter circular disk-shaped holding pad (0.6 mm thick) via the applied adhesive. Next, ultraviolet light was irradiated through the frame material under the following irradiation conditions to cure the UV-curable resin adhesive and bond the frame material and the holding pad. Finally, the holder of Example 1 was obtained by cutting to an outer diameter of 355 mm. This holder had less adhesive adhesion to the inner peripheral wall of the frame material than Comparative Example 1 described below. Furthermore, adhesive adhesion to the workbench used in the above work was also less than Comparative Example 1. <Irradiation conditions> Irradiation device: CCS Inc. UV-LED irradiation device MUB-068 Wavelength: 395nm Dimming value: 150 Irradiation distance: 10mm Irradiance: 240mW / cm 2 Irradiation time: 30sec

[0109] Example 2 The holder of Example 2 was obtained in the same manner as in Example 1, except that a PET sheet-like jig with a 300.96 mm diameter, a 0.8 mm outer wall thickness, and a PET sheet-like jig with a 300.96 mm diameter, a 0.8 mm outer wall thickness, and an inclined surface with an inclination angle of 6° from the 0 mm position from the outer periphery of the jig toward the center was used instead of the 300.96 mm diameter, circular jig. This holder suppressed adhesion of adhesive to the inner periphery wall of the frame material compared to Comparative Example 1 described below, and the degree of suppression was better than in Example 1. Furthermore, adhesion of adhesive to the workbench used during the above work was also suppressed compared to Comparative Example 1.

[0110] Example 3 A PET sheet-like jig with a circular shape (300.96 mm diameter) and an outer peripheral wall thickness of 0.8 mm was placed on the holding surface of a circular shape (410 mm diameter) and a 0.6 mm thick holding pad, with their centers overlapping. An acrylic UV-curable resin adhesive was applied to the exposed inner edge of the holding surface of the holding pad using a screen printing method to a thickness of 0.1 mm. The adhesive was applied to the top surface of the jig so that the adhesive was applied sufficiently to the exposed inner edge of the holding pad, and also to the upper surface of the jig. Next, a circular polycarbonate resin frame with an outer diameter of 390 mm, an inner peripheral wall thickness of 0.8 mm, and a central through-hole with a diameter of 301 mm was bonded to the holding pad using the adhesive. The jig was then lifted and removed from the holding surface of the holding pad. Ultraviolet light was then irradiated through the frame under the following irradiation conditions to cure the UV-curable resin adhesive. Finally, the holder of Example 3 was obtained by cutting to an outer diameter of 355 mm. In this holder, adhesion of adhesive to the holding surface of the holding pad was suppressed compared to Comparative Example 2 described below.

[0111] Example 4 A holder of Example 4 was obtained in the same manner as Example 3, except that instead of the PET sheet-like jig with a disk shape having a diameter of 300.96 mm and an outer peripheral wall thickness of 0.8 mm, a PET sheet-like jig with a diameter of 300.96 mm, an outer peripheral wall thickness of 0.8 mm, and an inclined surface on its upper surface that was inclined at an angle of 6° from the position 0 mm from the outer periphery of the jig toward the center, was used. Compared to Comparative Example 2 described below, this holder had reduced adhesion of adhesive to the holding surface of the holding pad, and the degree of reduction was better than that of Example 3.

[0112] Comparative Example 1 A holder for Comparative Example 1 was obtained in the same manner as in Example 1, except that a PET sheet-like jig with a disk shape and a 0.8 mm outer wall thickness, 300.96 mm in diameter, was not placed in the through-hole of a 0.8 mm inner wall-thick, annular, 390 mm outer diameter, polycarbonate resin frame material with a 0.8 mm inner wall thickness and a 301.00 mm diameter through-hole in the center. Adhesive was found to be adhered to the inner wall of the frame material of this holder. Adhesive was also found to be adhered to the workbench used during the above procedure.

[0113] Comparative Example 2 A holder for Comparative Example 2 was obtained in the same manner as in Example 3, except that the PET sheet-like jig, which was a disk-shaped jig with a diameter of 300.96 mm and an outer wall thickness of 0.8 mm, was not placed on the holding surface of the disk-shaped holding pad, which was a disk-shaped jig with a diameter of 390 mm and a thickness of 0.6 mm. Adhesive was adhered to the holding surface of the holding pad of this holder.

[0114] The holding pad used was a holding pad manufactured by a wet solidification method (manufactured by Fujibo Ehime Co., Ltd., BP102). [Industrial Applicability]

[0115] INDUSTRIAL APPLICABILITY The present invention relates to a holder used when polishing an object to be polished, and therefore has industrial applicability in such fields. [Explanation of symbols]

[0116] S11, S21... placement process, S12, S22... application process, S13, S24... removal process, S14, S23... adhesion process, 30... sheet-shaped jig, 40... frame material, 50... holding pad, 60... adhesive, 100, 200... holding tool.

Claims

1. an arrangement step of arranging the sheet-like jig in a through hole of a frame material having a through hole in a central portion thereof; a coating step of coating an adhesive on the upper surface of the frame material; a removing step of removing the jig from the through hole; an adhering step of adhering the frame material to the holding pad via the adhesive; A method for manufacturing a holder, comprising: the holding pad has a holding surface for holding the object to be polished, the holding surface having a surface to be bonded to the frame material, In the arranging step, the outer peripheral wall of the jig and the inner peripheral wall of the frame material are at least partially in contact with each other.

2. a placement step of placing the sheet-like jig on a holding surface of a holding pad having a holding surface for holding an object to be polished so that an inner edge portion of the holding surface is exposed; applying an adhesive to the inner edge of the holding surface; a bonding step of bonding a frame member having a through hole in the center to the holding pad via the adhesive; a removing step of removing the jig from the holding surface; A method for manufacturing a holder, comprising: In the bonding step, the outer peripheral wall of the jig and the inner peripheral wall of the frame material are at least partially in contact with each other.

3. In the application step, at least a portion of the adhesive is applied to an upper surface of the jig. A method for manufacturing the holder according to claim 1.

4. In the application step, at least a portion of the adhesive is applied to an upper surface of the jig. A method for manufacturing the holder according to claim 2.

5. The jig has, on its upper surface, a surface that slopes downward from the outer periphery toward the center of the jig. A method for manufacturing the holder according to any one of claims 1 to 4.

6. The inclination angle of the inclined surface is 1° or more and 30° or less. A method for manufacturing the holder according to claim 5 .

7. The cross section of the inclined surface is linear. A method for manufacturing the holder according to claim 5 .

8. The adhesive is a photocurable resin. A method for manufacturing the holder according to any one of claims 1 to 4.

9. The thickness of the outer peripheral wall of the jig is 90% or more and 110% or less of the thickness of the inner peripheral wall of the frame material. A method for manufacturing the holder according to any one of claims 1 to 4.

10. The shape of the outer peripheral wall of the jig and the shape of the inner peripheral wall of the frame material are the same. A method for manufacturing the holder according to any one of claims 1 to 4.

11. The method for manufacturing the holder according to any one of claims 1 to 4, which is a holder for chemical mechanical polishing.

12. A sheet-like jig used in the method for manufacturing a holder according to any one of claims 1 to 4.

13. the jig has, on its upper surface, a surface that slopes downward from the outer periphery toward the center of the jig, The inclination angle of the inclined surface is 1° or more and 30° or less, The cross section of the inclined surface is linear. The jig of claim 12.

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