Prober

Abstract

To provide a prober equipped with a transport unit that transports an object between a transport object storage portion and a measurement portion, capable of improving throughput in the measurement portion.SOLUTION: A prober 10 includes a transport unit 16 that transports transported objects (e.g., wafers and probe cards) between a transported object storage portion 12 and a plurality of measurement portions 14. The transport unit 16 has environment control means that controls the transport environment of the transported object such that the transport environment of the transported object approaches the environment of the transported object storage portion 12 when transporting the object from the measurement portion 14 to the transported object storage portion 12.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a prober that inspects the electrical characteristics of multiple semiconductor elements (chips) formed on a semiconductor wafer, and in particular to a transport unit that moves between a transport item storage section and multiple measurement sections to transport the transport items to the transport item storage section or each measurement section, and a prober equipped with the transport unit. [Background technology]

[0002] Conventionally, a prober (wafer inspection device) has been proposed that includes a transport object storage section (a cassette stock section that stores multiple wafers) that stores multiple transport objects, multiple measurement sections (wafer inspection sections), and a transport unit (self-propelled carriage) that moves between the transport object storage section and each measurement section to transport the transport object to the transport object storage section or each measurement section (see, for example, Patent Document 1). According to the prober described in Patent Document 1, for example, when N measurement sections are used, the inspection time can be reduced to 1 / N compared to when one measurement section is used.

[0003] Furthermore, conventional probers have been used to test the electrical properties of wafers at high (or low) temperatures (high-temperature test or low-temperature test). This test is usually performed by transporting the wafer from a cassette to a wafer chuck using a transfer arm, heating (or cooling) the wafer on the wafer chuck to a test temperature, testing the electrical properties, and then cooling (or heating) the wafer on the wafer chuck after the test is complete, and then returning the wafer to the cassette using the transfer arm after the temperature has returned to room temperature. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 5-343497 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the prober described in Patent Document 1, when high-temperature or low-temperature testing is performed in each measurement section, the following problem arises due to the difference between the environment of the transported item storage section (usually a room temperature environment) and the environment of each measurement section (a high-temperature or low-temperature environment).

[0006] For example, when performing high-temperature testing, a waiting time is required at each measurement unit before starting the test (for preheating) to bring the wafer or probe card from room temperature to the testing temperature, resulting in a problem of reduced throughput (processing capacity per unit time) at each measurement unit. In particular, when performing high-temperature testing again after replacing the wafer or probe card, it takes time for the wafer chuck to heat up to high temperature again, which further extends the waiting time until the next high-temperature testing can be performed, further reducing the throughput at each measurement unit. In addition, when performing high-temperature testing, when replacing the wafer or probe card after the testing is completed, a waiting time is required at each measurement unit to bring the hot wafer or probe card to room temperature, which also reduces the throughput at each measurement unit.

[0007] Similarly, when performing low-temperature testing, a waiting time is required at each measurement unit before starting testing to bring the wafer or probe card, which is at room temperature, up to the testing temperature, resulting in a problem of reduced throughput at each measurement unit. In particular, when performing low-temperature testing again after replacing the wafer or probe card, it takes time for the wafer chuck to cool down again, which further extends the waiting time until the next low-temperature testing can be performed, further reducing throughput at each measurement unit. In addition, when performing low-temperature testing, a waiting time is required after the testing is completed to bring the low-temperature wafer or probe card, which is at a temperature that does not cause condensation (usually room temperature), resulting in a problem of reduced throughput at each measurement unit.

[0008] As described above, in the prober described in Patent Document 1, when high-temperature testing or low-temperature testing is performed in each measurement section, the environment of the transported object storage section (usually a room temperature environment) differs from the environment of each measurement section (a high-temperature environment or a low-temperature environment), resulting in a long waiting time for the transported object to approach a predetermined temperature (e.g., the testing temperature or room temperature) in each measurement section, resulting in a decrease in throughput at each measurement section.There is a demand for improving this problem and increasing the throughput at each measurement section.

[0009] The present invention has been made in consideration of the above circumstances, and aims to provide a prober and a transport unit that can improve the throughput at each measurement section in a prober equipped with a transport unit that moves between a transport item storage section and multiple measurement sections to transport transport items (e.g., at least one of a wafer and a probe card) to the transport item storage section or each measurement section. [Means for solving the problem]

[0010] In order to achieve the above-mentioned object, the prober of the present invention comprises a transport object storage section for storing a plurality of transport objects, a plurality of measurement sections, a housing for storing the transport objects, and an environmental control means for controlling the environment within the housing, a transport unit that moves between the transport object storage section and each measurement section to transport the transport objects within the transport object storage section or each measurement section, and a moving device that moves the transport unit between the transport object storage section and each measurement section, and the environmental control means controls the environment within the housing to create an environment that corresponds to the environment of the destination of the transport objects.

[0011] The transport unit of one aspect of the prober of the present invention further includes a sensor for detecting an environment inside the housing, and the environment control means controls the environment inside the housing to a target environment based on the detection result of the sensor.

[0012] In one aspect of the prober of the present invention, when the destination of the transport unit is a measurement section, the environmental control means controls the environment within the housing so that it becomes an environment appropriate for the test to be performed within the measurement section at the destination.

[0013] In one aspect of the prober of the present invention, when the destination of the transport unit is a measurement section where high-temperature testing is performed, the environmental control means controls the environment within the housing so that the transported item stored within the housing is heated.

[0014] In one aspect of the prober of the present invention, when the destination of the transport unit is the transport item storage section and the transport unit transports the transport item that has become hot due to high-temperature testing into the transport item storage section, the environmental control means controls the environment within the housing so that the transport item stored within the housing is cooled.

[0015] In one aspect of the prober of the present invention, when the destination of the transport unit is a measurement section where low-temperature testing is performed, the environmental control means controls the environment within the housing so that the transported item stored within the housing is cooled.

[0016] In one aspect of the prober of the present invention, when the destination of the transport unit is the transported item storage section and the transport unit transports the transported item that has been brought to a low temperature state by low-temperature testing into the transported item storage section, the environmental control means controls the environment within the housing so that the transported item stored within the housing is heated.

[0017] In one aspect of the prober of the present invention, when the destination of the transport unit is a measurement section where inspection is performed under a specified gas atmosphere, the environmental control means controls the environment within the housing so that the specified gas atmosphere is created within the housing.

[0018] One aspect of the prober of the present invention is a transport object holding arm that is provided on the transport unit and holds the transport object, the transport object holding arm entering and exiting through an opening formed in the housing, and being stored in the housing together with the transport object while holding the transport object.

[0019] In one embodiment of the prober of the present invention, the transported item storage section and each measurement section are arranged at a fixed interval with the surfaces accessed by the transport unit facing each other, and the transport unit is arranged between the transported item storage section and each measurement section.

[0020] One aspect of the prober of the present invention includes a transport unit rotating mechanism that rotates the transport unit so that the opening through which the transported object holding arm enters and exits faces the transported object storage section or each measurement section.

[0021] In one embodiment of the prober of the present invention, the measurement units are arranged two-dimensionally in the horizontal and vertical directions.

[0022] In one aspect of the prober of the present invention, the moving device comprises a first movable body that moves horizontally between the transported object storage section and each measurement section, which is the arrangement direction of each measurement section; a first movable body moving mechanism that moves the first movable body horizontally; a second movable body that is attached to the first movable body so as to be movable in the vertical direction, which is the arrangement direction of each measurement section, and that supports the transport unit so as to be rotatable around a vertical axis; a second movable body moving mechanism that moves the second movable body vertically; and a transport unit rotation mechanism that is attached to the second movable body and rotates the transport unit around the vertical axis.

[0023] In one aspect of the prober of the present invention, the transported object is at least one of a wafer and a probe card, and the transported object holding arm is at least one of a wafer arm that holds the wafer and a probe card arm that holds the probe card.

[0024] In one aspect of the prober of the present invention, each of the plurality of measuring units includes a wafer chuck that is adjusted to a target temperature, and a probe card holding unit to which a probe card is detachably attached.

[0025] In one aspect of the prober of the present invention, the environmental control means is provided on the upper surface inside the housing.

[0026] In one aspect of the prober of the present invention, the environmental control means is provided approximately at the center of the upper surface.

[0027] Another aspect of the present invention is a transport unit that moves between a transport item storage section that stores multiple transport items and multiple measurement sections, and transports the transport items into the transport item storage section or into each measurement section, and is equipped with a housing that stores the transport items, and an environmental control means that controls the environment within the housing so that the environment within the housing is appropriate to the environment of the destination of the transport items. [Effects of the Invention]

[0028] According to the present invention, in a prober equipped with a transport unit that moves between a transport item storage section and multiple measurement sections to transport transport items (e.g., at least one of a wafer and a probe card) to the transport item storage section or each measurement section, it is possible to provide a prober and transport unit that can improve throughput at each measurement section. [Brief explanation of the drawings]

[0029] [Figure 1] FIG. 1 is a perspective view showing a schematic configuration of a prober according to an embodiment of the present invention; [Figure 2] Front view of each measuring unit [Figure 3] Perspective view of the transport unit [Figure 4] FIG. 1 is a vertical cross-sectional view showing a schematic configuration of a transport unit; [Figure 5] A perspective view of a moving device [Figure 6] Partially enlarged perspective view of the moving device [Figure 7] A longitudinal cross-sectional view showing the schematic configuration of the transport unit and the measurement unit. [Figure 8] FIG. 1 is a vertical cross-sectional view showing a schematic configuration of a transport unit; DETAILED DESCRIPTION OF THE INVENTION

[0030] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings.

[0031] FIG. 1 is a perspective view showing a schematic configuration of a prober 10 according to the present embodiment.

[0032] As shown in Figure 1, the prober 10 of this embodiment includes a transport item storage section 12, multiple measurement sections 14, a transport unit 16 that moves between the transport item storage section 12 and each measurement section 14 to transport an item (in this embodiment, at least one of a wafer and a probe card) into the transport item storage section 12 or into each measurement section 14, and a moving device (transport unit moving device) 22 that moves the transport unit 16 between the transport item storage section 12 and each measurement section 14.

[0033] The transport object storage section 12 and each measurement section 14 are arranged at a fixed interval in the Y direction with the surfaces accessed by the transport unit 16 facing each other (that is, facing each other).

[0034] The transport unit 16 is disposed between the transport object storage section 12 and each measurement section 14 .

[0035] The transported object storage section 12 includes a wafer storage section 12a that stores a plurality of wafers and a probe card storage section 12b that stores a plurality of probe cards. The number and arrangement of the transported object storage sections 12 are not particularly limited, and in this embodiment, four transported object storage sections 12 including the wafer storage section 12a and the probe card storage section 12b are arranged horizontally (in the X-axis direction) with the side accessed by the transport unit 16 (the right side in FIG. 1) facing in the same direction. The side opposite to the side accessed by the transport unit 16 (the left side in FIG. 1) is accessed by an operator when retrieving wafers or probe cards, etc.

[0036] Each of the multiple measurement units 14 is a rectangular parallelepiped measurement chamber (also called a prober chamber) constructed by combining multiple frames extending in the X-axis direction, multiple frames extending in the Y-axis direction, and multiple frames extending in the Z-axis direction, as shown in Figure 1, and inside the chamber are arranged a wafer chuck 18 that holds a wafer, a head stage 20, a test head (not shown) placed on the head stage 20, and a first probe card holding mechanism 36 that holds a probe card PC, as shown in Figure 7.

[0037] FIG. 2 is a front view of each measuring unit 14.

[0038] The number and arrangement of the measurement units 14 are not particularly limited, and in this embodiment, as shown in Figures 1 and 2, a group of measurement units consisting of four measurement units 14 arranged horizontally (X-axis direction) are stacked in three layers vertically (Z-axis direction), and are arranged two-dimensionally with the surface accessed by the transport unit 16 (the surface on the left in Figure 1) facing the same direction.

[0039] Each measurement section 14 (the surface accessed by the transfer unit 16) has an opening 14a through which the wafer holding arm (wafer arm: transfer object holding arm) 16b and the probe card holding arm (probe card arm) 16c of the transfer unit 16 enter and exit. The surfaces of each measurement section 14 other than the surface on which the opening 14a is formed may be closed, or an opening may be formed.

[0040] The wafer chuck 18 is adjusted to a high or low target temperature (inspection temperature) by a known temperature adjustment device (for example, a heat plate or chiller device built into the wafer chuck 18).

[0041] The environment within each measurement unit 14 is controlled as follows. For example, the temperature within each measurement unit 14 is controlled to a target temperature (inspection temperature) by the temperature of the wafer chuck 18 disposed within each measurement unit 14. The humidity within each measurement unit 14 is controlled to a target humidity by purging dry air into each measurement unit 14 using a well-known mechanism. The environment within each measurement unit 14 is controlled by purging a predetermined gas (e.g., nitrogen gas) into each measurement unit 14 using a well-known mechanism. Each measurement unit 14 performs multiple types of inspections, such as high-temperature inspections, low-temperature inspections, and inspections under a predetermined gas (e.g., nitrogen gas) atmosphere, as described below. The environment within each measurement unit 14 is controlled to be an environment appropriate for the inspection performed therein. The inspections performed in each measurement unit 14 may be the same or different between the measurement units.

[0042] The first probe card holding mechanism 36 is a means for detachably holding the probe card PC, and is provided above the wafer chuck 18, for example, on the head stage 20 side. The first probe card holding mechanism 36 detachably holds the probe card PC that has been transported to the first probe card holding mechanism 36 by a probe card transport mechanism described below. The first probe card holding mechanism 36 is well known (see, for example, Japanese Patent Application Laid-Open No. 2000-150596), and therefore further description thereof will be omitted.

[0043] Each measurement unit group is provided with an alignment device 38 that aligns the relative positions of the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and a moving device (not shown) that moves the alignment device 38 between the four measurement units 14. The alignment device 38 is moved between the four measurement units 14 included in the measurement unit group in which it is arranged, and is shared among the four measurement units 14. As for the moving device that moves the alignment device 38 between the four measurement units 14, for example, one described in Japanese Patent Application Laid-Open No. 2014-150168 can be applied.

[0044] The alignment device 38 is a means for performing relative alignment between the probe card PC held by the first probe card holding mechanism 36 and the wafer held by the wafer chuck 18, and is composed of a movement / rotation mechanism for moving the wafer chuck 18 in the XYZ-θ directions, including a Z-axis movable part 38a that moves up and down in the Z-axis direction, a Z-axis fixed part 38b, and an XY movable part 38c. The alignment device 38 is mainly used to align the wafer W held by the wafer chuck 18 with the probes of the probe card PC held above the wafer chuck 18 by a well-known method while moving in the XYZ-θ directions, to electrically contact the wafer W and the probes, and to perform an electrical characteristic test of the wafer W via the test head.

[0045] The alignment device 38, while holding the wafer chuck 18 within the measurement unit 14, moves between a probe card receiving position P1 (see FIG. 7(a)) near the opening 14a and a preheating position P2 (see FIG. 7(b)) below the first probe card holding mechanism 36. This movement is achieved by a well-known alignment device moving device (not shown).

[0046] The alignment device moving device moves the alignment device 38, holding the wafer chuck 18 heated to the target temperature, to the probe card receiving position P1 when receiving the probe card PC, and moves the alignment device 38, holding the probe card PC and the wafer chuck 18 heated to the target temperature, to the preheating position P2 when transporting the probe card PC to the first probe card holding mechanism 36.

[0047] The alignment device 38 includes a second probe card holding mechanism 40 (also called a card lifter).

[0048] The second probe card holding mechanism 40 is a means for receiving and holding the probe card PC from the probe card holding arm 16c, and is composed of, for example, a holding portion 40a (e.g., a ring-shaped member or multiple pins) attached to the Z-axis movable portion 38a while surrounding the wafer chuck 18, and a lifting mechanism (not shown) for raising and lowering the holding portion 40a in the Z-axis direction relative to the Z-axis movable portion 38a.

[0049] The probe card PC is received and held by, with the alignment device 38 having moved to the probe card receiving position P1, lifting the holding part 40a in the Z-axis direction relative to the Z-axis movable part 38a to abut against the probe card PC (the outer peripheral edge of the lower surface), and then lifting the probe card PC from the probe card holding arm 16c with the holding part 40a rising in the Z-axis direction. The probe card PC is held directly above the wafer chuck 18.

[0050] The probe card transport mechanism is a means for transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36, and is composed of, for example, a Z-axis movable part 38a provided in the alignment device 38 that can be raised and lowered in the Z-axis direction.

[0051] The probe card PC is transported to the first probe card holding mechanism 36 by raising the Z-axis movable part 38a in the Z-axis direction while the alignment device 38 is moved to the preheat position P2.

[0052] FIG. 3 is a perspective view of the transport unit 16, and FIG. 4 is a vertical cross-sectional view showing a schematic configuration of the transport unit 16.

[0053] The transfer unit 16 is a device for moving in the X-axis and Z-axis directions between the transfer object storage section 12 and each measurement section 14 to transfer the wafer W or the probe card PC into the transfer object storage section 12 or each measurement section 14. As shown in FIGS. 3 and 4, the transfer unit 16 is a housing for storing the wafer W and the probe card PC and includes a housing 16a having an opening 16f through which the wafer W and the probe card PC (wafer holding arm 16b and probe card holding arm 16c) enter and exit. The housing 16a has a rectangular parallelepiped shape, and inside the housing 16a are disposed the wafer holding arm 16b, the probe card holding arm 16c, an arm moving mechanism (not shown) for individually moving each arm 16b, 16c, an environment control unit 16d for controlling the environment within the housing 16a, and a sensor 16e for detecting the environment within the housing 16a. The number of transfer units 16 is not particularly limited, and in this embodiment, one transfer unit 16 is used. Figure 1 shows two transport units 16, which represent one transport unit 16 accessing the transport item storage section 12 (probe card storage section 12b) (see transport unit 16 drawn in the lower right of Figure 1) and the other transport unit 16 accessing the measurement section 14 (see transport unit 16 drawn in the upper left of Figure 1).

[0054] Wafer holding arm 16b is a means for holding wafer W, and is disposed within housing 16a so as to be movable horizontally along, for example, a guide rail (not shown) provided within housing 16a. Wafer holding arm 16b is housed within housing 16a together with wafer W while holding the wafer W.

[0055] The probe card holding arm 16c is a means for holding the probe card PC, and is arranged inside the housing 16a so as to be movable horizontally along a guide rail (not shown) provided inside the housing 16a. The probe card holding arm 16c is housed inside the housing 16a together with the probe card PC while holding the probe card PC. The probe card PC includes a card holder CH. In some cases, a seal ring may be included instead of the card holder CH.

[0056] The number and arrangement of the arms 16b and 16c are not particularly limited, and in this embodiment, as shown in FIG. 4, two wafer holding arms 16b and one probe card holding arm 16c are arranged in three vertical stages.

[0057] The arm movement mechanism is a well-known mechanism, for example, a drive motor (not shown) provided in the housing 16a. By rotating this drive motor forward and backward, each arm 16b, 16c moves back and forth in the horizontal direction and moves in and out through an opening 16f formed in the housing 16a.

[0058] The conveying unit 16 is equipped with an air curtain forming means 42 .

[0059] The air curtain forming means 42 is a means for forming an air curtain that blocks the opening 16f formed in the housing 16a, thereby making the inside of the housing 16a an airtight or nearly airtight space, and is composed of, for example, a well-known air injection port.

[0060] The number, shape, and arrangement of the air ejection ports are not particularly limited, and in this embodiment, as shown in Fig. 4, a plurality of air ejection ports are arranged near the upper edge of opening 16f and along the upper edge (in a direction perpendicular to the paper surface in Fig. 4) with an attitude that ejects air downward. Note that arrow 44 in Fig. 4 shows an example of the flow of dry air ejected from environment control means 16d, and indicates wafer chuck 18.

[0061] The environment within the housing 16a is controlled as follows. For example, the temperature and humidity within the housing 16a are controlled to a predetermined gas atmosphere and target temperature and humidity by purging each measurement unit 14 with dry air (high-temperature or low-temperature dry air) or a predetermined gas (nitrogen gas). This is achieved by a well-known environment control unit 16d, such as a temperature-adjusted gas supply source including a heater and a cooler, a blower, and a duct (not shown) connecting the blower (none of which are shown) to the housing 16a. The environment control unit 16d may also include a dehumidifier. The gas (high-temperature or low-temperature dry air) whose temperature (and humidity) has been adjusted by the temperature-adjusted gas supply source is supplied into the housing 16a via the duct by the blower, and is sprayed from an air outlet to form an air curtain that closes the opening 16f formed in the housing 16a. This creates a sealed or nearly sealed space within the housing 16a. The supply source of the gas supplied into the housing 16a and the supply source of the gas sprayed from the air nozzle may be the same or different. The surfaces of the housing 16a other than the surface on which the opening 16f is formed may be closed, or may have openings. The environmental control means 16d may be attached to the housing 16a or to the arms 16b and 16c.

[0062] The sensor 16e is a sensor that detects the environment inside the housing 16a, and is, for example, a temperature sensor or a humidity sensor. The sensor 16e may be included in the environment control means 16d.

[0063] The environmental control means 16d controls the environment within the housing 16a to match the environment of the destination of the transported object. Specifically, the environmental control means 16d controls the environment within the housing 16a to a target environment based on the detection results of the sensor 16e. For example, the environmental control means 16d controls the temperature-adjusted gas supply source based on the detection results of the sensor 16e so that the temperature and humidity within the housing 16a reach the target temperature and humidity. The function of the environmental control means 16d is realized, for example, by feedback control using a controller (not shown) electrically connected to the sensor 16e and the temperature-adjusted gas supply source (heater and cooler). The environmental control means 16d and the air curtain generating means 42 may be integrated. That is, in a single device, an air outlet facing downward to block the opening 16f and an air outlet for dry air to control the environment within the housing 16a may be provided. Here, the air outlet for dry air to control the environment within the housing 16a is preferably oriented so that the injected dry air circulates well within the housing 16a. By integrating the environmental control means 16d and the air curtain forming means 42, the space required to provide the environmental control means 16d and the air curtain forming means 42 is reduced, allowing for effective use of the space in the housing 16a. Furthermore, by integrating the environmental control means 16d and the air curtain forming means 42, it is possible to share the same temperature-adjusted gas supply source including a heater and a cooler, as well as a blower, between the environmental control means 16d and the air curtain forming means 42.

[0064] FIG. 5 is a perspective view of the moving device 22, and FIG. 6 is an enlarged perspective view of a part of the moving device 22. As shown in FIG.

[0065] The moving device 22 is a means for moving the transport unit 16 in the X-axis and Z-axis directions between the transported object storage section 12 and each measuring section 14, and is composed of, for example, as shown in Figures 5 and 6, a first movable body 24 that moves in the horizontal direction (X-axis direction), which is the arrangement direction of each measuring section 14, between the transported object storage section 12 and each measuring section 14, a first movable body moving mechanism (not shown) that moves the first movable body 24 in the horizontal direction (X-axis direction), a second movable body 26 that is attached to the first movable body 24 so as to be movable in the vertical direction (Z-axis direction), which is the arrangement direction of each measuring section 14, and supports the transport unit 16 so as to be rotatable around the vertical axis (Z-axis) as the center of rotation, a second movable body moving mechanism (not shown) that moves the second movable body 26 in the vertical direction (Z-axis direction), and a transport unit rotation mechanism 28 that is attached to the second movable body 26 and rotates the transport unit 16 around the vertical axis (Z-axis) as the center of rotation.

[0066] The first movable body 24 is, for example, a frame body constructed by connecting the four corners of each of a pair of upper and lower rectangular frames 24a with four frames 24b extending in the Z-axis direction, and its lower part is movably connected to two guide rails 30 extending in the X-axis direction and arranged parallel to each other on a base 34 between the transported item storage section 12 and each measuring section 14.

[0067] The first movable body movement mechanism is configured with a well-known movement mechanism, such as a ball screw connected to the first movable body 24 and a drive motor for rotating the ball screw (neither of which is shown). By rotating this drive motor forward or backward, the first movable body 24 (transport unit 16) moves in the X-axis direction along the guide rail 30. Of course, the first movable body movement mechanism is not limited to this, and may also be a mechanism for self-propelling the first movable body 24, such as wheels provided on the first movable body 24 and a drive motor for rotating the wheels.

[0068] The second movable body 26 is movably connected to two guide rails 32 that are arranged parallel to each other on the first movable body 24 and extend in the Z-axis direction.

[0069] The second movable body movement mechanism is configured with a well-known movement mechanism, such as a ball screw connected to the second movable body 26 and a drive motor for rotating the ball screw (neither of which is shown). By rotating this drive motor forward or backward, the second movable body 26 (transport unit 16) moves in the Z-axis direction along the guide rail 32. Of course, the second movable body movement mechanism is not limited to this, and may also be a mechanism for self-propelling the second movable body 26, such as wheels provided on the second movable body 26 and a drive motor for rotating the wheels.

[0070] The transport unit rotation mechanism 28 is configured with a known rotation mechanism, for example, a rotation shaft (vertical shaft) provided on the second movable body 26, a drive motor 28a that rotates the rotation shaft, and the like. The upper surface of the transport unit 16 is fixed to the rotation shaft (vertical shaft). By rotating this drive motor 28a forward and backward, the transport unit 16 rotates 180° around the vertical axis (Z axis) as the center of rotation, and an opening 16f formed in the transport unit 16, through which the arms 16b and 16c enter and exit, faces the transported object storage section 12 or each measurement section 14.

[0071] In addition, each device and mechanism such as the alignment device 38, arm moving mechanism, environmental control means 16d, moving device 22 (first movable body moving mechanism, second movable body moving mechanism, transport unit rotation mechanism 28) is driven by control means (controller, etc.) not shown.

[0072] Next, an example of the operation of the transport unit 16 in the prober 10 of this embodiment will be described.

[0073] <Wafer transfer operation example 1> First, an example of operation will be described in which the transfer unit 16 transfers the wafer W from the wafer storage section 12a (for example, room temperature 23° C.) into the measurement section 14 where high-temperature inspection (for example, inspection temperature 80° C.) is performed.

[0074] First, the transport unit 16 is moved to a position where it can access the wafer storage section 12a (a position where the wafer W can be removed), and then the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16, through which the arms 16b and 16c move in and out, faces the wafer storage section 12a.

[0075] Next, the wafer holding arm 16b advances into the wafer storage unit 12a, removes one wafer W from the wafer storage unit 12a, and stores it in the housing 16a. At the same time, the environment inside the housing 16a is controlled to match the environment of the measurement unit 14 (here, a high-temperature test at 80°C to be performed in the measurement unit 14), which is the destination of the wafer W. Specifically, a gas (e.g., dry air or nitrogen temperature-adjusted to 60°C) adjusted in temperature by a temperature-adjusted gas supply source is supplied into the housing 16a, and an air curtain is formed by the gas being sprayed from the air outlet to close the opening 16f formed in the housing 16a. This creates a sealed or nearly sealed space inside the housing 16a. The target temperature adjusted by the temperature-adjusted gas supply source is not limited to 60°C, but can be any appropriate temperature taking into consideration the distance and time required for the wafer W to be transported from the wafer storage unit 12a to the measurement unit 14, the test temperature at the measurement unit 14, and other factors.

[0076] Next, the transfer unit 16 is moved to a position accessible to the measurement unit 14 at the transfer destination (a position where the wafer W can be handed over), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the arms 16b, 16c enter and exit faces the measurement unit 14 at the transfer destination. During this time, the wafer W stored in the transfer unit 16 continues to be heated by the gas supplied into the housing 16a (a sealed or substantially sealed space).

[0077] Next, wafer holding arm 16b is advanced into measurement section 14 through opening 16f on the transfer unit 16 side where an air curtain is formed and opening 14a on the measurement section 14 side, and wafer W is loaded onto wafer chuck 18. Wafer holding arm 16b, while holding wafer W, passes through opening 16f, which is closed by the air curtain, and advances into measurement section 14. At this time, wafer W is further heated by the air curtain.

[0078] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, the following effects can be achieved.

[0079] First, just as in the case where opening 16f is closed with a physical door or shutter, the inside of housing 16a can be made into a sealed or nearly sealed space, and by supplying temperature-controlled gas into this sealed housing 16a, the environment inside housing 16a can be made to correspond to the environment of the measurement unit 14 to which it is being transported (in this case, a high-temperature test at 80°C performed within measurement unit 14).

[0080] Second, the probe card holding arm 16c can be advanced into the measurement unit 14 while the inside of the housing 16a is kept sealed.

[0081] Third, compared to when the opening 16f is blocked by a physical door or shutter, the time required to open and close a physical door or shutter is eliminated, so the probe card holding arm 16c can be quickly advanced into the measurement section 14.

[0082] Fourth, when the probe card PC is handed over, the probe card PC can be heated by the action of an air curtain blown onto the probe card PC.

[0083] Fifth, when opening 16f is closed with a physical door or shutter, the gas supplied to the inside of housing 16a comes into contact with the physical door or shutter and is dissipated to the external environment through the physical door or shutter, which causes a drop in the temperature of the gas supplied to the inside of housing 16a. On the other hand, when opening 16f is closed with an air curtain as in this example, the gas supplied to the inside of housing 16a comes into contact with an air curtain of the same temperature, which prevents the temperature of the gas supplied to the inside of housing 16a from dropping.

[0084] The loaded wafer W is held by vacuum suction on the wafer chuck 18. The wafer W is then heated by the wafer chuck 18 and waits until it reaches the inspection temperature (80° C. in this case). Once the inspection temperature is reached, the alignment device 38 moves in the X, Y, and Z-θ directions to align the wafer W held on the wafer chuck 18 with the probes of the probe card PC held above the wafer chuck 18 in a well-known manner. Next, the wafer chuck 18 moves in the Z-axis direction due to the action of the alignment device 38, bringing the wafer W into electrical contact with the probes, thereby conducting an electrical characteristic inspection of the wafer W via the test head.

[0085] In this way, the time taken for the wafer to be transported from the wafer storage section 12a to the destination measuring section 14 is used to control the environment within the transport unit 16 (to heat the wafer) and reduce the difference with the inspection temperature at the destination measuring section 14. This makes it possible to shorten (or eliminate) the waiting time required for the wafer to approach the inspection temperature in the destination measuring section 14, compared to conventional technology. This makes it possible to improve the throughput at the measuring section 14.

[0086] <Wafer transfer operation example 2> Next, an example of operation will be described in which the transfer unit 16 transfers a wafer W that has reached a high temperature (for example, 80° C.) due to a high temperature inspection from the measurement unit 14 into the wafer storage unit 12a (for example, room temperature 23° C.).

[0087] First, the wafer W is removed from the measurement unit 14 by the wafer holding arm 16b immediately after the high-temperature inspection and stored in the housing 16a. This is performed in the reverse order of the wafer transfer operation example 1 described above. At the same time, the environment inside the housing 16a is controlled to correspond to the environment of the wafer storage unit 12a (room temperature 23°C in this case). Specifically, a gas (e.g., dry air or nitrogen temperature-adjusted to 40°C) adjusted by the temperature-adjusted gas supply source is supplied into the housing 16a, and an air curtain is formed by spraying the gas from the air outlet to close the opening 16f formed in the housing 16a. This creates a sealed or nearly sealed space inside the housing 16a. The target temperature adjusted by the temperature-adjusted gas supply source is not limited to 40°C, but can be any appropriate temperature taking into account the distance and time required for the wafer W to be transferred from the measurement unit 14 to the wafer storage unit 12a, the temperature in the wafer storage unit 12a, and other factors. Immediately after the high-temperature inspection is completed, the wafer W, while held by the wafer holding arm 16b, passes through the opening 16f, which is closed by the air curtain, and is taken out of the measurement unit 14 and stored in the housing 16a. At this time, the wafer W is cooled by the air curtain blown onto it, and is further cooled by the gas supplied into the housing 16a.

[0088] Next, the transfer unit 16 is moved to a position accessible to the destination wafer storage unit 12a (a position where the wafer W can be handed over), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16 through which the arms 16b, 16c enter and exit faces the destination wafer storage unit 12a. During this time, the wafer W stored in the transfer unit 16 continues to be cooled by the gas supplied into the housing 16a (a sealed or nearly sealed space).

[0089] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, it is possible to achieve the same effect as in the wafer transfer operation example 1 described above.

[0090] Next, the wafer holding arm 16b is advanced into the wafer storage section 12a to return the wafer W into the wafer storage section 12a.

[0091] In this way, by controlling the environment within the transfer unit 16 (cooling the wafer) during the time it takes for the wafer to be transferred from the measurement section 14 to the destination wafer storage section 12a, and reducing the temperature difference with the destination wafer storage section 12a, it is possible to eliminate (or shorten) the waiting time required for the wafer to approach room temperature within the measurement section 14, and wafers that have completed high-temperature inspection can be immediately removed from the measurement section 14 and returned to the wafer storage section 12a, compared to conventional technology. This improves the throughput of the measurement section 14. It also eliminates (or shortens) the waiting time required for an operator to retrieve the wafer after it has been stored.

[0092] <Wafer transfer operation example 3> Next, an example of operation when the transfer unit 16 transfers the wafer W from the wafer storage section 12a (for example, room temperature 23° C.) into the measurement section 14 where low-temperature inspection (for example, inspection temperature −10° C.) is performed will be described.

[0093] First, the transport unit 16 is moved to a position where it can access the wafer storage section 12a (a position where the wafer W can be removed), and then the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16, through which the arms 16b and 16c move in and out, faces the wafer storage section 12a.

[0094] Next, the wafer holding arm 16b advances into the wafer storage unit 12a, removes one wafer W from the wafer storage unit 12a, and stores it in the housing 16a. At the same time, the environment inside the housing 16a is controlled to match the environment of the measurement unit 14 (here, a low-temperature test at −10°C to be performed in the measurement unit 14), which is the destination of the wafer W. Specifically, a temperature- or humidity-adjusted gas (e.g., dry air or nitrogen adjusted to −15°C) is supplied into the housing 16a by a temperature-adjusted gas supply source, and an air curtain is formed by the gas supply source, blocking the opening 16f formed in the housing 16a. This creates a sealed or nearly sealed space inside the housing 16a. The target temperature adjusted by the temperature-adjusted gas supply source is not limited to −15°C, but may be any appropriate temperature taking into account the distance and time required for the wafer W to be transported from the wafer storage unit 12a to the measurement unit 14, the test temperature at the measurement unit 14, and other factors.

[0095] Next, the transfer unit 16 is moved to a position accessible to the measurement unit 14 at the transfer destination (a position where the wafer W can be handed over), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16, through which the arms 16b and 16c enter and exit, faces the measurement unit 14 at the transfer destination. During this time, the wafer W stored in the transfer unit 16 continues to be temperature-controlled (e.g., cooled) and dried by the gas supplied into the housing 16a (a sealed or substantially sealed space). This prevents condensation from forming on the wafer W while the wafer W is being transferred to the measurement unit 14 at the transfer destination.

[0096] Next, wafer holding arm 16b is advanced into measurement unit 14 through opening 16f on the transfer unit 16 side, where an air curtain is formed, and opening 14a on the measurement unit 14 side, and wafer W is loaded onto wafer chuck 18. Wafer holding arm 16b, while holding wafer W, passes through opening 16f, which is closed by the air curtain, and advances into measurement unit 14. At this time, wafer W is further cooled and dried by the air curtain. This prevents condensation from forming on wafer W when it is transferred.

[0097] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, it is possible to achieve the same effect as in the wafer transfer operation example 1 described above.

[0098] The loaded wafer W is held by vacuum suction on the wafer chuck 18. The wafer W is then cooled by the wafer chuck 18 and waits until it reaches the inspection temperature (−10° C. in this example). Once the inspection temperature is reached, the alignment device 38 moves in the X, Y, Z-θ directions to align the wafer W held on the wafer chuck 18 with the probes of the probe card PC held above the wafer chuck 18 by a well-known method. The wafer chuck 18 then moves in the Z-axis direction by the alignment device 38 to electrically contact the wafer W with the probes, thereby inspecting the electrical characteristics of the wafer W via the test head. Note that, to prevent condensation on the wafer or probe card during the low-temperature inspection, a gas with a dew point that does not condense at the cooling temperature of the wafer or probe card (e.g., dry air at 20° C.) is supplied into the measurement unit 14 to which the wafer is transferred by well-known means. The low-temperature inspection is performed in an environment where this gas is supplied.

[0099] In this way, the time taken for the wafer to be transported from the wafer storage section 12a to the destination measuring section 14 is used to control the environment within the transport unit 16 (to cool the wafer) and reduce the difference with the inspection temperature of the destination measuring section 14. This makes it possible to shorten (or eliminate) the waiting time required for the wafer to approach the inspection temperature within the destination measuring section 14, compared to conventional technology. This makes it possible to improve the throughput of the measuring section 14.

[0100] <Wafer Transfer Operation Example 4> Next, an example of operation will be described in which the transfer unit 16 transfers the wafer W, which has been brought to a low temperature state (for example, -40°C) by the low temperature inspection, from the measurement unit 14 into the wafer storage unit 12a (for example, room temperature 23°C).

[0101] First, the wafer W is removed from the measurement unit 14 by the wafer holding arm 16b immediately after the low-temperature inspection and stored in the housing 16a. This is performed in the reverse order of the wafer transfer operation example 3 described above. At the same time, the environment inside the housing 16a is controlled to correspond to the environment of the wafer storage unit 12a (room temperature 23°C in this example) to which the wafer W is to be transferred. Specifically, a temperature- or humidity-adjusted gas (e.g., dry air or nitrogen adjusted to 15°C) is supplied into the housing 16a by a temperature-adjusted gas supply source, and an air curtain is sprayed from the air outlet to close the opening 16f formed in the housing 16a. This creates an airtight or nearly airtight space inside the housing 16a. The target temperature adjusted by the temperature-adjusted gas supply source is not limited to 15°C, but can be any appropriate temperature taking into account the distance and time required for the wafer W to be transferred from the measurement unit 14 to the wafer storage unit 12a, the temperature in the wafer storage unit 12a, and other factors. Immediately after the low-temperature inspection, the wafer W, while held by wafer holding arm 16b, passes through opening 16f, which is closed by an air curtain, and is taken out of measurement unit 14 and stored in housing 16a. At this time, the wafer W is heated by the air curtain blown onto it, and is further heated by the gas supplied into housing 16a. This makes it possible to prevent condensation from forming on the wafer W when it is transferred.

[0102] Next, the transfer unit 16 is moved to a position accessible to the destination wafer storage unit 12a (a position where the wafer W can be handed over), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16, through which the arms 16b and 16c enter and exit, faces the destination wafer storage unit 12a. During this time, the wafer W stored in the transfer unit 16 continues to be heated by the gas supplied into the housing 16a (a sealed or nearly sealed space). This prevents condensation from forming on the wafer W while the wafer W is being transferred to the wafer storage unit 12a.

[0103] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, it is possible to achieve the same effect as in the wafer transfer operation example 1 described above.

[0104] Next, the wafer holding arm 16b is advanced into the wafer storage section 12a to return the wafer W into the wafer storage section 12a.

[0105] In this way, by controlling the environment within the transfer unit 16 (heating the wafer) during the time it takes for the wafer to be transferred from the measurement unit 14 to the destination wafer storage unit 12a, and reducing the temperature difference with the destination wafer storage unit 12a, it is possible to eliminate (or shorten) the waiting time required for the wafer to approach room temperature within the measurement unit 14, and the wafer after low-temperature inspection can be immediately removed from the measurement unit 14 and returned to the wafer storage unit 12a, compared to conventional technology. This improves the throughput of the measurement unit 14. It also makes it possible to create a temperature environment that prevents condensation from forming on the wafer before it is transferred into the wafer storage unit 12a.

[0106] <Wafer Transfer Operation Example 5> Next, an example of operation will be described in which the transport unit 16 transports the wafer W from the wafer storage section 12a (e.g., room temperature 23°C) into the measurement section 14 where inspection is performed under a predetermined gas (e.g., nitrogen gas) atmosphere.

[0107] First, the transport unit 16 is moved to a position where it can access the wafer storage section 12a (a position where the wafer can be removed), and then the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16, through which the arms 16b and 16c move in and out, faces the wafer storage section 12a.

[0108] Next, wafer holding arm 16b advances into wafer storage section 12a, removes one wafer W from wafer storage section 12a, and stores it in housing 16a. At the same time, the environment inside housing 16a is controlled to match the environment of measurement section 14 (here, testing in a predetermined gas (e.g., nitrogen gas) atmosphere) to which the wafer is transferred. Specifically, a gas (e.g., nitrogen gas) for preventing oxidation of wiring (especially copper wiring) exposed on the wafer surface and probes of a probe card is supplied into housing 16a, and an air curtain is formed by being sprayed from an air outlet to close opening 16f formed in housing 16a. This creates a sealed or nearly sealed space inside housing 16a.

[0109] Next, the transfer unit 16 is moved to a position accessible to the measurement unit 14 at the transfer destination (a position where the wafer W can be handed over), and the transfer unit 16 is rotated 180° so that the opening 16f formed in the transfer unit 16, through which the arms 16b and 16c enter and exit, faces the measurement unit 14 at the transfer destination. During this time, an anti-oxidation gas continues to be supplied into the transfer unit 16 (a sealed or substantially sealed space). This prevents the wafer W from being oxidized while being transferred to the measurement unit 14 at the transfer destination. The anti-oxidation gas is also supplied into the measurement unit 14 at the transfer destination by a well-known means.

[0110] Next, wafer holding arm 16b is advanced into measurement section 14 through opening 16f on the transfer unit 16 side where an air curtain is formed and opening 14a on the measurement section 14 side, and wafer W is loaded onto wafer chuck 18. Wafer holding arm 16b, while holding wafer W, passes through opening 16f, which is closed by the air curtain, and advances into measurement section 14. At this time, the action of the air curtain prevents wafer W from being oxidized.

[0111] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, it is possible to achieve the same effect as in the wafer transfer operation example 1 described above.

[0112] The loaded wafer W is held by vacuum suction on the wafer chuck 18. Then, while the alignment device 38 moves in the X, Y, Z-θ directions, it aligns the wafer W held on the wafer chuck 18 with the probes of the probe card PC held above the wafer chuck 18 using a well-known method, and then the wafer chuck 18 moves in the Z-axis direction by the action of the alignment device 38 to bring the wafer W into electrical contact with the probes, thereby inspecting the electrical characteristics of the wafer W via the test head. The inspection is carried out in an environment where an anti-oxidation gas is supplied.

[0113] In this way, even during the time the wafer is transported from the wafer storage section 12a to the destination measuring section 14, the wafer is placed in an environment similar to that of the measuring section 14 where inspection is carried out in an atmosphere of a specified gas (e.g., nitrogen gas), so that the wiring (especially copper wiring) exposed on the wafer surface is prevented from oxidizing during transportation and delivery.

[0114] This fifth operation example can also be carried out in combination with the first to fourth wafer transfer operation examples.

[0115] <Probe card transport operation example 1> Next, an operation example will be described in which the transport unit 16 transports the probe card PC from the probe card storage section 12b (for example, room temperature 23° C.) into the measurement section 14 where high-temperature inspection (for example, inspection temperature 80° C.) is performed.

[0116] First, the transport unit 16 is moved to a position where the probe card storage section 12b is accessible (a position where the probe card PC can be removed), and the transport unit 16 is rotated 180 degrees so that the opening 16f formed in the transport unit 16 through which each arm 16b, 16c enters and exits faces the probe card storage section 12b.

[0117] Next, the probe card holding arm 16c advances into the probe card storage unit 12b, removes one probe card PC from the probe card storage unit 12b, and stores it in the housing 16a. At the same time, the environment inside the housing 16a is controlled to match the environment of the measurement unit 14 (here, a high-temperature test at 80°C to be performed in the measurement unit 14). Specifically, a gas (e.g., dry air or nitrogen temperature-adjusted to 60°C) adjusted in temperature by a temperature-adjusted gas supply source is supplied into the housing 16a, and an air curtain is formed by the gas being ejected from the air ejection port to close the opening 16f formed in the housing 16a. This makes the inside of the housing 16a a sealed or nearly sealed space. The target temperature adjusted by the temperature-adjusted gas supply source is not limited to 60°C, but can be any appropriate temperature taking into consideration the distance and time required for the probe card PC to be transported from the probe card storage unit 12b to the measurement unit 14, the test temperature at the measurement unit 14, and the like.

[0118] Next, the transport unit 16 is moved to a position accessible to the destination measurement unit 14 (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16 through which the arms 16b and 16c enter and exit faces the destination measurement unit 14. During this time, the probe card PC stored in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (a sealed or nearly sealed space).

[0119] Next, the probe card holding arm 16c is advanced into the measurement unit 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measurement unit 14 side (see FIG. 7(a)). The probe card holding arm 16c, while holding the probe card PC, passes through the opening 16f that is blocked by the air curtain and advances into the measurement unit 14. At this time, the probe card PC is further heated by the air curtain blown onto it.

[0120] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, it is possible to achieve the same effect as in the wafer transfer operation example 1 described above.

[0121] Next, the holding part 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds it. Specifically, when the alignment device 38, holding the wafer chuck 18 heated to the target temperature (here, the inspection temperature of 80°C), moves to the probe card receiving position P1, the holding part 40a is raised in the Z-axis direction relative to the Z-axis movable part 38a to abut against the probe card PC (the outer peripheral edge of the lower surface), and the holding part 40a, rising in the Z-axis direction, lifts the probe card PC from the probe card holding arm 16c. As a result, the probe card PC is transferred to the holding part 40a and held directly above the wafer chuck 18 by the holding part 40a. During this time, the probe card PC is heated by radiant heat from the wafer chuck 18 below.

[0122] Next, the alignment device 38, which holds the probe card PC and the wafer chuck 18 heated to the target temperature (here, the inspection temperature of 80°C), is moved to the preheat position P2 (see FIG. 7(b)). During this time, the probe card PC is also heated by the radiant heat of the wafer chuck 18 below it.

[0123] Next, the probe card PC is transported to the first probe card holding mechanism 36 (see FIG. 7(b)). Specifically, the alignment device 38, which holds the wafer chuck 18 heated to the target temperature (here, the inspection temperature of 80° C.), moves to the preheat position P2, and the Z-axis movable part 38a (second probe card holding mechanism 40) is raised in the Z-axis direction, thereby transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36. The probe card PC transported to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. During this time, the probe card PC is heated by radiant heat from the wafer chuck 18 below it.

[0124] As described above, the probe card PC is not only heated within the transport unit 16, but also continues to be seamlessly heated (preheated) by the radiant heat of the wafer chuck 18 until it is handed over from the probe card holding arm 16c and held by the first probe card holding mechanism 36.

[0125] As a result, even if it takes 10 to several tens of seconds for the probe card PC heated in the transport unit 16 to be transferred from the probe card holding arm 16c and held by the first probe card holding mechanism 36, the temperature of the probe card PC does not decrease along the way, and the preheated probe card PC can be held by the first probe card holding mechanism 36.

[0126] In this way, the time taken to transport the probe card from the probe card storage section 12b to the destination measurement section 14 is used to control the environment in the transport unit 16 (to heat the probe card) and reduce the difference in temperature with the test temperature at the destination measurement section 14, thereby shortening (or eliminating) the waiting time required to bring the probe card closer to the test temperature (to preheat) in the destination measurement section 14 compared to the conventional technology. This allows the throughput at the measurement section 14 to be improved.

[0127] <Probe card transport operation example 2> Next, an operation example will be described in which the transport unit 16 transports the probe card PC, which has reached a high temperature (for example, 80° C.) due to a high-temperature inspection, from the measurement unit 14 into the probe card storage unit 12b (for example, room temperature 23° C.).

[0128] First, the probe card PC is removed from the measurement unit 14 by the probe card holding arm 16c immediately after the high-temperature test and stored in the housing 16a. This is performed in the reverse order of the probe card transport operation example 1. At the same time, the environment inside the housing 16a is controlled to correspond to the environment of the probe card storage unit 12b (room temperature 23°C in this case) to which the probe card PC is to be transported. Specifically, a gas (e.g., dry air or nitrogen temperature-adjusted to 40°C) adjusted by the temperature-adjusted gas supply source is supplied into the housing 16a, and an air curtain is formed by the gas being sprayed from the air outlet to close the opening 16f formed in the housing 16a. This makes the inside of the housing 16a a sealed or nearly sealed space. Note that the target temperature adjusted by the temperature-adjusted gas supply source is not limited to 40°C, but can be any appropriate temperature taking into consideration the distance and time required for the probe card PC to be transported from the measurement unit 14 to the probe card storage unit 12b, the temperature in the probe card storage unit 12b, and other factors. Immediately after the high-temperature test is completed, the probe card PC, while held by the probe card holding arm 16c, passes through the opening 16f, which is closed by an air curtain, and is taken out of the measurement unit 14 and stored in the housing 16a. At this time, the probe card PC is cooled by the air curtain blown against it, and is further cooled by the gas supplied into the housing 16a.

[0129] Next, the transport unit 16 is moved to a position accessible to the destination probe card storage unit 12b (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16 through which the arms 16b and 16c move in and out faces the destination probe card storage unit 12b. During this time, the probe card PC stored in the transport unit 16 continues to be cooled by the gas supplied into the housing 16a (a sealed or nearly sealed space).

[0130] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, it is possible to achieve the same effect as in the wafer transfer operation example 1 described above.

[0131] Next, the probe card holding arm 16c is advanced into the probe card storage section 12b to return the probe card PC to the inside of the probe card storage section 12b.

[0132] In this way, by controlling the environment in the transport unit 16 (cooling the probe card) during the time it takes for the probe card to be transported from the measurement unit 14 to the destination probe card storage unit 12b, and reducing the temperature difference with the destination probe card storage unit 12b, it is possible to eliminate (or shorten) the waiting time required for the probe card to approach room temperature in the measurement unit 14, and after the high-temperature inspection is completed, the probe card can be immediately removed from the measurement unit 14 and returned to the probe card storage unit 12b. This improves the throughput in the measurement unit 14. In addition, it is possible to eliminate (or shorten) the waiting time required for the operator to retrieve the probe card after storing the probe card.

[0133] <Probe card transport operation example 3> Next, an example of operation when the transport unit 16 transports the probe card PC from the probe card storage section 12b (for example, room temperature 23°C) into the measurement section 14 where low-temperature inspection (for example, inspection temperature -10°C) is performed will be described.

[0134] First, the transport unit 16 is moved to a position where the probe card storage section 12b is accessible (a position where the probe card can be removed), and the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16, through which the arms 16b and 16c move in and out, faces the probe card storage section 12b.

[0135] Next, the probe card holding arm 16c advances into the probe card storage unit 12b, removes one probe card PC from the probe card storage unit 12b, and stores it in the housing 16a. At the same time, the environment inside the housing 16a is controlled to match the environment of the measurement unit 14 (here, a low-temperature test at −10°C to be performed in the measurement unit 14). Specifically, a temperature- or humidity-adjusted gas (e.g., dry air or nitrogen adjusted to −15°C) is supplied into the housing 16a by a temperature-adjusted gas supply source, and an air curtain is formed by the gas being sprayed from the air outlet to close the opening 16f formed in the housing 16a. This creates a sealed or nearly sealed space inside the housing 16a. The target temperature adjusted by the temperature-adjusted gas supply source is not limited to −15°C, but can be any appropriate temperature taking into account the distance and time required for the probe card PC to be transported from the probe card storage unit 12b to the measurement unit 14, the test temperature at the measurement unit 14, and the like.

[0136] Next, the transport unit 16 is moved to a position accessible to the destination measurement unit 14 (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16, through which the arms 16b and 16c enter and exit, faces the destination measurement unit 14. During this time, the probe card PC stored in the transport unit 16 continues to be cooled and dried by the gas supplied into the housing 16a (a sealed or nearly sealed space). This makes it possible to prevent condensation from forming on the probe card PC while the probe card PC is being transported to the destination measurement unit 14.

[0137] Next, the probe card holding arm 16c is advanced into the measurement unit 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measurement unit 14 side (see FIG. 7(a)). The probe card holding arm 16c, while holding the probe card PC, passes through the opening 16f, which is closed by the air curtain, and advances into the measurement unit 14. At this time, the probe card PC is further cooled and dried by the air curtain blown onto it. This makes it possible to prevent condensation from forming on the probe card PC when the probe card PC is transferred.

[0138] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, it is possible to achieve the same effect as in the wafer transfer operation example 1 described above.

[0139] Next, the holding part 40a of the second probe card holding mechanism 40 receives the probe card PC from the probe card holding arm 16c and holds it. Specifically, when the alignment device 38, holding the wafer chuck 18 cooled to the target temperature (here, the inspection temperature of −10° C.), moves to the probe card receiving position P1, the holding part 40a is raised in the Z-axis direction relative to the Z-axis movable part 38a to abut against the probe card PC (the outer peripheral edge of the lower surface), and the holding part 40a, rising in the Z-axis direction, lifts the probe card PC from the probe card holding arm 16c. As a result, the probe card PC is transferred to the holding part 40a and held directly above the wafer chuck 18 by the holding part 40a. During this time, the probe card PC is cooled by the wafer chuck 18 below.

[0140] Next, the alignment device 38, which holds the probe card PC and the wafer chuck 18 cooled to the target temperature (here, the inspection temperature -10°C), is moved to position P2 (see FIG. 7(b)). During this time, the probe card PC is also cooled by the wafer chuck 18 below it.

[0141] Next, the probe card PC is transported to the first probe card holding mechanism 36 (see FIG. 7(b)). Specifically, the alignment device 38, which is holding the wafer chuck 18 cooled to the target temperature (here, the inspection temperature of −10° C.), moves to position P2, and the Z-axis movable part 38a (second probe card holding mechanism 40) is raised in the Z-axis direction, thereby transporting the probe card PC held by the second probe card holding mechanism 40 to the first probe card holding mechanism 36. The probe card PC transported to the first probe card holding mechanism 36 is detachably held by the first probe card holding mechanism 36. During this time, the probe card PC is cooled by the wafer chuck 18 below it.

[0142] As described above, the probe card PC is not only cooled within the transport unit 16, but also continues to be seamlessly cooled by the wafer chuck 18 from the time it is handed over from the probe card holding arm 16c until it is held by the first probe card holding mechanism 36.

[0143] As a result, even if it takes about 10 to several tens of seconds for the probe card PC cooled in the transport unit 16 to be transferred from the probe card holding arm 16c and held by the first probe card holding mechanism 36, the temperature of the probe card PC does not rise along the way, and the cooled probe card PC can be held by the first probe card holding mechanism 36. Note that a gas with a dew point that does not condense at the cooling temperature of the wafer and probe card (e.g., dry air at 20°C) is supplied by a well-known means into the measurement unit 14 at the transport destination.

[0144] In this way, by controlling the environment in the transport unit 16 (cooling the wafer) during the time it takes for the probe card to be transported from the probe card storage unit 12b to the destination measurement unit 14, and reducing the difference with the inspection temperature of the destination measurement unit 14, it is possible to shorten (or eliminate) the waiting time required for the probe card to approach the inspection temperature in the destination measurement unit 14, compared to the conventional technology. This makes it possible to improve the throughput of the measurement unit 14.

[0145] <Probe card transport operation example 4> Next, an example of operation will be described in which the transport unit 16 transports the probe card PC, which has been brought to a low temperature state (for example, −40° C.) by a low-temperature inspection, from the measurement unit 14 into the probe card storage unit 12b (for example, room temperature 23° C.).

[0146] First, the probe card PC is removed from the measurement unit 14 by the probe card holding arm 16c immediately after the low-temperature test and stored in the housing 16a. This is performed in the reverse order of the probe card transport operation example 3. At the same time, the environment inside the housing 16a is controlled to correspond to the environment of the probe card storage unit 12b (room temperature 23°C in this case) to which the probe card PC is to be transported. Specifically, a temperature- or humidity-adjusted gas (e.g., dry air or nitrogen adjusted to 15°C) is supplied into the housing 16a by a temperature-adjusted gas supply source, and an air curtain is formed by the gas being sprayed from the air outlet to close the opening 16f formed in the housing 16a. This creates an airtight or nearly airtight space inside the housing 16a. The target temperature adjusted by the temperature-adjusted gas supply source is not limited to 15°C, but can be any appropriate temperature taking into consideration the distance and time required for the probe card PC to be transported from the measurement unit 14 to the probe card storage unit 12b, the temperature in the probe card storage unit 12b, and other factors. Immediately after the low-temperature test is completed, the probe card PC, while held by the probe card holding arm 16c, passes through the opening 16f, which is closed by an air curtain, and is taken out of the measurement unit 14 and stored in the housing 16a. At this time, the probe card PC is heated by the air curtain blown onto it, and is further heated by the gas supplied into the housing 16a. This makes it possible to prevent condensation from forming on the probe card PC when the probe card PC is handed over.

[0147] Next, the transport unit 16 is moved to a position accessible to the destination probe card storage unit 12b (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16 through which the arms 16b and 16c enter and exit faces the destination probe card storage unit 12b. During this time, the probe card PC stored in the transport unit 16 continues to be heated by the gas supplied into the housing 16a (a sealed or nearly sealed space). This makes it possible to prevent condensation from occurring on the probe card PC while the probe card PC is being transported to the probe card storage unit 12b.

[0148] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, it is possible to achieve the same effect as in the wafer transfer operation example 1 described above.

[0149] Next, the probe card holding arm 16c is advanced into the probe card storage section 12b to return the probe card PC to the inside of the probe card storage section 12b.

[0150] In this way, by utilizing the time taken for the probe card to be transported from the measurement unit 14 to the destination probe card storage unit 12b, the environment in the transport unit 16 is controlled (by heating the probe card) to reduce the temperature difference with the destination probe card storage unit 12b. This makes it possible to eliminate (or shorten) the waiting time required for the probe card to approach room temperature in the measurement unit 14, and after the low-temperature test is completed, the probe card can be immediately removed from the measurement unit 14 and returned to the probe card storage unit 12b. This improves the throughput of the measurement unit 14. Furthermore, it becomes possible to prepare a temperature environment that prevents condensation from occurring on the probe card before the probe card is transported into the probe card storage unit 12b.

[0151] <Probe card transport operation example 5> Next, we will explain an example of operation when the transport unit 16 transports the probe card PC from the probe card storage section 12b (e.g., room temperature 23°C) into the measurement section 14 where inspection is performed under a predetermined gas (e.g., nitrogen gas) atmosphere.

[0152] First, the transport unit 16 is moved to a position where the probe card storage section 12b is accessible (a position where the probe card can be removed), and the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16, through which the arms 16b and 16c move in and out, faces the probe card storage section 12b.

[0153] Next, the probe card holding arm 16c advances into the probe card storage section 12b, removes one probe card PC from the probe card storage section 12b, and stores it in the housing 16a. At the same time, the environment inside the housing 16a is controlled to match the environment of the measurement section 14 to which the probe card is transferred (here, testing is performed under a predetermined gas (e.g., nitrogen gas) atmosphere). Specifically, a gas (e.g., nitrogen gas) for preventing oxidation of the wiring (especially copper wiring) exposed on the wafer surface and the probes of the probe card is supplied into the housing 16a, and an air curtain is formed by being sprayed from an air outlet to close the opening 16f formed in the housing 16a. This creates a sealed or substantially sealed space inside the housing 16a.

[0154] Next, the transport unit 16 is moved to a position accessible to the destination measurement unit 14 (a position where the probe card PC can be handed over), and the transport unit 16 is rotated 180° so that the opening 16f formed in the transport unit 16 through which the arms 16b, 16c enter and exit faces the destination measurement unit 14. During this time, an anti-oxidation gas is continuously supplied into the transport unit 16 (a sealed or nearly sealed space). This prevents the probe card PC from oxidizing while being transported to the destination measurement unit 14. Note that an anti-oxidation gas is also supplied into the destination measurement unit 14 by well-known means.

[0155] Next, the probe card holding arm 16c is advanced into the measurement unit 14 through the opening 16f on the transport unit 16 side where the air curtain is formed and the opening 14a on the measurement unit 14 side. The probe card holding arm 16c, while holding the probe card PC, passes through the opening 16f that is closed by the air curtain and advances into the measurement unit 14. At this time, the action of the air curtain prevents the probe card PC from being oxidized.

[0156] In this way, by closing the opening 16f with an air curtain instead of a physical door or shutter as in the prior art, it is possible to achieve the same effect as in the wafer transfer operation example 1 described above.

[0157] Thereafter, the probe card PC is transported to the first probe card holding mechanism 36 in the same manner as in the above-mentioned probe card transport operation examples 1 and 3, and is detachably held by the first probe card holding mechanism 36 .

[0158] In this way, even during the time the probe card is transported from the probe card storage section 12b to the destination measurement section 14, the probe card is placed in an environment similar to that of the measurement section 14 where testing is carried out under a specified gas (e.g., nitrogen gas) atmosphere, thereby preventing the probes of the probe card from oxidizing during transportation and delivery.

[0159] This fifth operation example can also be carried out in combination with the first to fourth probe card transport operation examples.

[0160] As described above, according to this embodiment, in a prober 10 equipped with a transport unit 16 that moves between the transport item storage section 12 and multiple measurement sections 14 to transport items (e.g., at least one of a wafer and a probe card) to the transport item storage section 12 or each measurement section 14, a prober can be provided that can improve the throughput at each measurement section 14.

[0161] This is because the environment (e.g., temperature and humidity) within the transport unit 16 (housing 16a) is controlled using the time it takes for the transported item to be transported to its destination (measurement section 14 or transported item storage section 12), and this makes it possible to shorten (or eliminate) the waiting time required for the transported item to approach a predetermined temperature (e.g., inspection temperature or room temperature) within each measurement section compared to conventional technology.

[0162] Furthermore, according to this embodiment, the environment of the entire prober 10 is not controlled, but the environment within the housing 16a, which is smaller than the entire prober 10, is controlled, i.e., the environment within the housing 16a is controlled locally, which can achieve energy savings compared to controlling the environment of the entire prober 10. Also, the amount of gas (dry air or nitrogen gas) supplied into the housing 16a can be reduced.

[0163] Furthermore, according to this embodiment, it is possible to minimize the installation area of the prober 10. Furthermore, it is possible to minimize the time required for the transport unit 16 to access the transport object storage section 12 or each measurement section 14.

[0164] This is because the transported item storage section 12 and each measurement section 14 are arranged at a fixed interval in the Y direction with the surfaces accessed by the transport unit 16 facing each other (i.e., facing each other), and the transport unit 16 is arranged between the transported item storage section 12 and each measurement section 14.

[0165] Next, other embodiments of the transport unit 16 will be described.

[0166] 8 is a vertical cross-sectional view showing a schematic configuration of a transport unit 16 according to another embodiment. Note that the same reference numerals are used to denote the same parts as those already described in FIG.

[0167] In the transfer unit 16 shown in Fig. 8, the environmental control means 16d and the air curtain forming means 42 are provided separately. By providing the environmental control means 16d and the air curtain forming means 42 separately (independently) in this way, the environmental control means 16d and the air curtain forming means 42 can be operated independently. For example, the environmental control means 16d and the air curtain forming means 42 can be operated independently, such that the environmental control means 16d controls the environment inside the housing 16a with hot air, and the air curtain forming means 42 closes the opening 16f with cold air. Furthermore, when the environmental control means 16d and the air curtain forming means 42 are provided separately, the environmental control means 16d can be provided on the upper surface inside the housing 16a, allowing the environmental control means 16d to efficiently control the environment inside the housing 16a. Furthermore, when the environmental control means 16d and the air curtain forming means 42 are provided separately, the environmental control means 16d can more efficiently control the environment inside the housing 16a by providing the environmental control means 16d approximately in the center of the top surface of the housing 16a. Here, approximately in the center means that it does not have to be in the exact center, but rather that it is sufficient if it is near or in the vicinity of the center.

[0168] Next, a modified example will be described.

[0169] In this embodiment, the arms 16b and 16c of the transport unit 16 enter and exit through the opening 16f formed in the housing 16a. However, this is not limiting. For example, a similar opening (not shown) may be formed on the surface of the housing 16a of the transport unit 16 opposite the side on which the opening 16f is formed, and the arms 16b and 16c may independently reciprocate horizontally to enter and exit through the opening 16f and the opening on the opposite side. In this way, the transport unit rotation mechanism 28 can be omitted. Furthermore, even if the transport unit rotation mechanism 28 is omitted, that is, without rotating the transport unit 16, the arms 16b and 16c can access the transported object storage section 12 or the measurement sections 14. In this case, in addition to the air curtain forming means 42 that forms an air curtain that blocks the opening 16f formed in the housing 16a of the conveying unit 16, by providing a similar air curtain forming means in the conveying unit 16 that forms an air curtain that blocks the opening formed on the opposite side of the opening 16f, the inside of the housing 16a can be made into an airtight or nearly airtight space, and the same effect as in the above embodiment can be achieved.

[0170] Furthermore, in this embodiment, a configuration in which the measurement units 14 are two-dimensionally arranged in the horizontal direction (X-axis direction) and the vertical direction (Z-axis direction) has been exemplified, but this is not limiting, and the measurement units 14 may be arranged only in a single row in the horizontal direction (X-axis direction), or only in a single row in the vertical direction (Z-axis direction). By arranging the measurement units 14 only in a single row in the horizontal direction (X-axis direction), the second movable body moving mechanism can be omitted. Furthermore, by arranging the measurement units 14 only in a single row in the vertical direction (Z-axis direction), the first movable body moving mechanism can be omitted.

[0171] Furthermore, in this embodiment, a configuration using one transport unit 16 and one moving device 22 has been exemplified, but this is not limiting, and multiple transport units 16 and multiple moving devices 22 may be used. In this way, the throughput of each measurement section 14 can be further improved.

[0172] In addition, in this embodiment, a configuration using wafer holding arm 16b and probe card holding arm 16c has been exemplified, but this is not limited to this, and only wafer holding arm 16b may be used, or only probe card holding arm 16c may be used.

[0173] Furthermore, in this embodiment, the configuration in which the arms 16b and 16c are provided on the transport unit 16 has been exemplified, but this is not limiting, and the arms 16b and 16c (or arms equivalent thereto) may be provided on the transport object storage section 12 side and on the measurement section 14 side. This also allows the arms to remove the transport object from the transport object storage section 12 or the measurement section 14 and store it in the transport unit 16, and also allows the transport object to be removed from the transport unit 16 and delivered to the transport object storage section 12 or the measurement section 14.

[0174] In addition, in this embodiment, the configuration in which the opening 16f formed in the housing 16a is closed with an air curtain has been exemplified, but this is not limiting, and an opening opening / closing means such as a shutter or door that is opened when the transported object is taken out or delivered and closed while the transported object is being transported may be provided in the transport unit 16, and the opening 16f may be opened and closed by this opening opening / closing means. Furthermore, the openings 14a formed in each measurement unit 14 may be closed with a similar air curtain, or the openings 14a may be opened and closed by a similar opening opening / closing means.

[0175] As explained above, the idea of controlling the environment inside the transport unit (housing) so that it is appropriate for the environment of the destination of the transported object by utilizing the time it takes for the transported object to be transported to the destination (measurement section or transported object storage section) can be applied not only to the prober of the above embodiment, but also to probers equipped with any type of transport unit (for example, the self-propelled carriage described in Patent Publication No. 5-343497) that moves between the transported object storage section and multiple measurement sections and transports the transported object into the transported object storage section or multiple measurement sections.

[0176] The prober of the present invention has been described in detail above, but the present invention is not limited to the above examples, and various improvements and modifications may be made without departing from the spirit of the present invention. [Explanation of symbols]

[0177] 10...prober, 12...transported object storage section, 12a...wafer storage section, 12b...probe card storage section, 14...measurement section, 14a...opening, 16...transport unit, 16a...housing, 16b...wafer holding arm, 16c...probe card holding arm, 16d...environment control means, 16e...sensor, 16f...opening, 18...wafer chuck, 20...head stage, 22...moving device, 24...first movable body, 26...second movable body, 28...transport unit rotation mechanism, 28a...drive motor, 30, 32...guide rails, 34...base, CH...card holder, PC...probe card, W...wafer

Claims

[Claim 1] a transported object storage section for storing transported objects; a plurality of measuring units having an environment different from that of the transported object storage unit and arranged opposite to each other at a predetermined distance from the transported object storage unit; a transport unit that transports the object between the object storage unit and the measurement unit, the transport unit has an environment control means for controlling a transport environment of the transported object, When the object is transported from the measurement unit to the object storage unit, the environment control unit controls the transport environment of the object so that the transport environment of the object approaches the environment of the object storage unit. Prover.

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