Barrel plating apparatus

Abstract

To maximize the use of a central space within a barrel to increase an input of a plated object while maintaining or improving the plating quality and efficiency.SOLUTION: A barrel plating apparatus comprises: a plating tank 3 filled with a plating solution 2; a first barrel 10 which has a first housing part 11 for accommodating a plated object 1, and is provided with a first fluid passage opening 12 through which the plating solution 2 flows; a second barrel 20 which is positioned centrally within the first barrel 10, has a second housing part 21 accommodated in the plated object 1, and is provided with a second fluid passage opening 22 for the plating solution 2 to pass through; a rotation mechanism 30 that rotates the first barrel 10 and / or the second barrel 20; and a power supply 40 that applies a positive potential to the plating solution 2 while using the plated object 1 placed within the first barrel 10 and the second barrel 20 as a minus potential, where the first barrel 10 and the second barrel 20 rotate at the immersion position to perform plating.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a barrel plating apparatus. [Background technology]

[0002] Barrel plating (rotary plating) is one type of electroplating technique. In rotary barrel plating, the workpiece is placed in a cylindrical barrel-shaped container and plated while the barrel rotates. Barrel plating equipment requires the workpiece to be properly tumbled and mixed within the barrel and exposed to the surface of the deposit. To maintain uniform plating thickness and plating quality, the amount of workpiece introduced into the barrel is limited to a certain amount. When an appropriate amount of workpiece is introduced into the barrel, it accumulates in clumps at the bottom of the barrel. As it is lifted in the direction of rotation, it is properly tumbled, mixed, and exposed to the surface, thereby achieving uniform plating thickness and maintaining plating quality. The appropriate amount of workpiece varies depending on the shape and size of the workpiece, and is typically approximately 1 / 4 to 1 / 3 of the barrel's volume. However, if the amount of workpiece introduced is limited to an appropriate amount, a large dead space (i.e., a space where no workpiece is present and plating cannot be performed) will result, accounting for approximately 3 / 4 to 2 / 3 of the barrel's volume. Since the material to be plated accumulates in clumps at the bottom of the barrel, there is a problem in that the space in the center of the barrel cannot be fully utilized.

[0003] On the other hand, if more than the appropriate amount of material is placed in the barrel, the material will not tumble or mix properly, and will remain inside the accumulated mass and not be exposed to the surface, resulting in a long period of time in which the material is not energized. This also results in insufficient and unstable contact with the plating solution, making it difficult to achieve a uniform plating thickness and maintaining plating quality. Furthermore, plating will take a long time, resulting in reduced plating efficiency. Effective use of the space within the barrel and improving or maintaining plating quality or efficiency are contradictory in terms of whether or not to limit the amount of material to be plated, making them difficult to achieve simultaneously. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 5-214597 [Patent Document 2] Japanese Patent Application Publication No. 5-222593 Summary of the Invention [Problem to be solved by the invention]

[0005] The barrel plating apparatus 800 disclosed in Patent Document 1, as shown in FIG. 9, has a plating drum (barrel) with a double-walled spiral periphery that rotates around a horizontal axis. This facilitates the loading and unloading of workpieces, automating barrel plating. However, it does not effectively utilize the central space within the barrel, preventing an increased input capacity of workpieces. In fact, by providing a double-walled spiral periphery, the capacity of workpieces that can be accommodated (input volume) is reduced compared to a single-wall barrel at the outermost periphery. A smaller barrel radius (or half the diagonal) reduces the capacity, and the capacity reduction is greater at the outer periphery than at the center. Furthermore, this reduces the surface area of the deposits on the workpieces, reducing the rolling, movement, and mixing of the workpieces, affecting plating quality and / or reducing the capacity that can maintain quality.

[0006] The barrel plating apparatus 900 disclosed in Patent Document 2, as shown in FIG. 10, has a wire mesh cathode fixed to the inner surface of the barrel container. While this barrel plating apparatus can prevent damage to the objects contained within the wire mesh due to collisions to some extent, it does not effectively utilize the space in the center and cannot increase the amount of objects placed in the barrel. The stirring, rolling, movement, and position change of the objects within the wire mesh are limited, which affects plating quality and requires time to maintain quality. It is not easy to achieve the same plating quality and plating time for the objects within the wire mesh and the objects within the barrel. The barrel plating apparatus of Patent Document 2 does not solve the problem of maintaining or improving plating quality and efficiency while effectively utilizing the space in the center of the barrel to increase the amount of objects placed in the barrel.

[0007] The present invention was developed with the aim of eliminating the above-mentioned drawbacks, and one of the objects of the present invention is to effectively utilize the space in the center of the barrel to increase the amount of materials to be plated while maintaining or improving plating quality and efficiency. [Means for solving the problem]

[0008] A barrel plating apparatus according to one embodiment of the present disclosure comprises a plating tank filled with plating solution, a first barrel having a first storage section for storing an object to be plated therein and provided with a first liquid passage opening through which the plating solution passes, a second barrel positioned in the center of the first barrel having a second storage section for storing the object to be plated and provided with a second liquid passage opening through which the plating solution passes, a rotation mechanism for rotating the first barrel and / or the second barrel, and a power source that sets the object to be plated placed in the first barrel and the second barrel at a negative potential and the plating solution at a positive potential, and the first barrel and the second barrel rotate at an immersion position where they are immersed in the plating solution in the plating tank to plate the object to be plated. [Effects of the Invention]

[0009] The above-described barrel plating apparatus has the advantage that it can effectively utilize the space in the center of the barrel to increase the amount of workpieces to be plated while maintaining or improving plating quality and efficiency. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic perspective view showing a barrel plating apparatus according to an embodiment of the present disclosure. [Figure 2] FIG. 10 is a schematic cross-sectional view showing another example of a barrel plating apparatus. [Figure 3] FIG. 10 is a schematic cross-sectional view showing another example of the barrel. [Figure 4] FIG. 10 is a schematic cross-sectional view showing a barrel plating apparatus according to another embodiment of the present disclosure. [Figure 5] FIG. 10 is a schematic cross-sectional view showing a barrel plating apparatus according to another embodiment of the present disclosure. [Figure 6]FIG. 10 is a schematic cross-sectional view showing a barrel plating apparatus according to another embodiment of the present disclosure. [Figure 7] FIG. 10 is a schematic cross-sectional view showing a barrel plating apparatus according to another embodiment of the present disclosure. [Figure 8] FIG. 10 is a schematic cross-sectional view showing a barrel plating apparatus according to another embodiment of the present disclosure. [Figure 9] FIG. 1 is a schematic diagram of a conventional barrel-type electroplating apparatus disclosed in Patent Document 1. [Figure 10] FIG. 1 is a schematic diagram of a conventional barrel-type electroplating apparatus disclosed in Patent Document 2. DETAILED DESCRIPTION OF THE INVENTION

[0011] A barrel plating apparatus according to one embodiment of the present disclosure comprises a plating tank filled with plating solution, a first barrel having a first storage section for storing an object to be plated therein and provided with a first liquid passage opening through which the plating solution passes, a second barrel arranged in the center of the first barrel having a second storage section for storing the object to be plated and provided with a second liquid passage opening through which the plating solution passes, a rotation mechanism for rotating the first barrel and / or the second barrel, and a power source that sets the object to be plated placed in the first barrel and the second barrel to a negative potential and the plating solution to a positive potential, and the first barrel and the second barrel rotate at an immersion position where they are immersed in the plating solution in the plating tank to plate the object to be plated.

[0012] The above structure has the advantage of effectively utilizing the central space within the outer first barrel, allowing for an increased input capacity of the workpieces while maintaining or improving plating quality and efficiency. This is because the central location of the second barrel allows for effective utilization of the central space within the first barrel. Furthermore, workpieces can be input and stored in both the first storage section of the first barrel and the second storage section of the second barrel. By inputting and storing workpieces in both the first and second storage sections, the total input capacity of the workpieces can be increased compared to a system without a second barrel, improving plating efficiency and productivity. Workpieces of appropriate size, shape, and quantity can be stored and plated in the first and second storage sections. The first storage section of the first barrel and the second storage section of the second barrel can store workpieces separately, promoting the rolling, mixing, and stirring of the workpieces within each of the first and second storage sections, resulting in a uniform plating thickness and maintaining or improving plating quality. Multiple objects to be plated can be rolled, mixed, and stirred at the bottoms of the first barrel (first storage section) and the second barrel (second storage section) separately, at positions spaced apart at different distances from the central axis, increasing the total surface area of the objects to be plated that are stacked, accumulated, or formed into clumps, increasing the number of objects to be plated that are exposed to the surface, and promoting contact of each surface of the objects to be plated with the plating solution, thereby suppressing or preventing a decrease in metal ion concentration, achieving uniform plating film thickness, maintaining or improving plating quality, and improving plating efficiency.In addition, the rotation of the two barrels, the first and second barrels, and the rotation of the second barrel that rotates in the center of the first barrel, promote efficient circulation, inflow, outflow, and stirring of the plating solution.

[0013] The amount of material to be plated (appropriate amount) is not constant and varies depending on the shape and size of the material to be plated and the shape and size of the barrel, but the barrel plating machine can add the appropriate amount of material to be plated in the second barrel to the appropriate amount in the first barrel, thereby increasing the amount of material to be plated by approximately 10 to 40%. If it is possible to increase the amount of material to be plated in the second barrel by the amount of material to be plated, for example, if the appropriate amount in the cylindrical barrel is 1 / 4 of the capacity and the radius (r / 2) of the second barrel is 1 / 2 of the radius (r) of the first barrel, then the appropriate amount of material to be plated in the first barrel is πr 2 h / 4(cross-sectional area πr 2× height h × 1 / 4), and the appropriate amount of the second barrel is πr 2 h / 16(cross-sectional area πr 2 When only the first barrel is used (comparison example), the appropriate amount of material to be plated is πr 2 For h / 4, the appropriate amount for the barrel plating machine is 5πr, which is the appropriate amount for the first barrel plus the appropriate amount for the second barrel. 2 h / 16(πr 2 h / 4+πr 2 h / 16), and this barrel plating machine can theoretically increase the amount of material to be plated by 25% compared to when only the first barrel is used.

[0014] In this disclosure, the "center of the first barrel" is based on the central axis of rotation of the first barrel. The "center of the first barrel" is the region that includes the central axis of the first barrel and excludes the area along the outer periphery of the first barrel. The central axis of the first barrel is the axis around which the first barrel rotates. The central axis of the first barrel is the intersection of multiple diagonals or the midpoint of the diameter in a cross section perpendicular to the side wall. When multiple diagonals intersect at different intersections, the intersection of the most diagonals is the central axis. When the most diagonals have the same number of intersections, the midpoint of each intersection is the central axis. The same applies when the midpoints of the diameters are located at different positions.

[0015] In another embodiment of the barrel plating apparatus according to the present disclosure, the center axis of the second barrel may be located within 20% of the diameter or diagonal of the first barrel from the center axis of the first barrel. This configuration, by locating the center axis of the second barrel near or at the same position as the center axis of the first barrel and locating the second barrel in the center of the first barrel, has the advantage of effectively utilizing the space in the center of the first barrel, increasing the amount of workpieces to be plated while maintaining or improving plating quality and efficiency. Furthermore, this configuration has the advantage of being simple and low-cost. For example, this configuration allows the first and second barrels to rotate coaxially by sharing, integrating, or connecting the rotating shafts of the first and second barrels. Furthermore, the rotating shaft of the second barrel can be located close to the rotating shaft of the first barrel, allowing for the use of multiple rotation mechanisms, and the rotational torque of one barrel can be used to rotate the other. This simplifies the structure required to achieve either of these functions, prevents or minimizes a decrease in rotation and transmission efficiency, reduces parts and manufacturing costs, and reduces or eliminates running costs. The central axis of the second barrel indicates the center of the rotation axis of the second barrel, similar to the first barrel.

[0016] In another embodiment of the barrel plating apparatus according to the present disclosure, the diameter or diagonal (L2) of the second barrel can be set to at least 1 / 5 of the diameter or diagonal (L1) of the first barrel. This configuration has the advantage of effectively utilizing the space in the center of the first barrel to increase the amount of workpieces to be plated while maintaining or improving plating quality and efficiency. Increasing the diameter (L2) of the second barrel expands the volume of the second storage section, thereby increasing the amount of workpieces to be plated that can be placed in the second barrel, thereby expanding the area in the center of the first barrel that can be effectively utilized. Furthermore, the distance between the workpieces to be plated in the first storage section and the second barrel (the workpieces to be plated in the second storage section) can be appropriately determined, increasing the total surface area of the workpieces to be plated, increasing the amount of workpieces exposed on the surface, and promoting contact of each surface of the workpieces with the plating solution. This suppresses or prevents a decrease in metal ion concentration, resulting in uniform plating film thickness, maintaining or improving plating quality, and increasing plating efficiency. In addition, the rotation of the first and second barrels and the agitator connected to the outer surface or outer side of the second barrel can promote the rolling, mixing, and agitation of the objects to be plated in the first storage section, thereby promoting efficient circulation, inflow, outflow, and agitation of the plating solution.The above structure can maintain and improve plating quality, and the diameter (L2) and size of the second barrel can be determined to maximize and optimize the total input volume of the first and second barrels.

[0017] In another embodiment of the barrel plating apparatus according to the present disclosure, the second barrel can rotate in the same direction as the first barrel. The barrel plating apparatus described above has the advantage of being able to maintain or improve plating quality while effectively utilizing the space in the center of the first barrel. The barrel plating apparatus described above has the advantage of being able to simplify the structure and reduce the cost of parts and manufacturing. By rotating the first barrel and the second barrel in the same direction, the objects to be plated in the first and second storage sections can be lifted, rolled, mixed, and stirred in the same direction, facilitating the stirring of the plating solution.

[0018] In another embodiment of the barrel plating apparatus according to the present disclosure, the second barrel can rotate in a different direction from the first barrel. The barrel plating apparatus described above has the advantage of being able to maintain or improve plating quality while effectively utilizing the space within the barrel. By rotating the first barrel and the second barrel in different directions, the objects to be plated in the first and second storage sections are lifted in opposite directions, increasing the separation distance and relative positional movement of the objects to be plated in the first and second storage sections. This promotes the rolling, mixing, and stirring of the objects to be plated, and promotes the inflow, outflow, circulation, and mixing of the plating solution. This prevents a decrease in metal ion concentration and improves the efficiency of contact of the objects to the plating solution.

[0019] In another embodiment of the barrel plating apparatus according to the present disclosure, the first barrel and the second barrel are rotated by the same rotation mechanism, or the rotation of either the first barrel or the second barrel can be used to rotate the other. The above configuration, by rotating the first barrel and the second barrel by the same rotation mechanism, eliminates the need for separate rotation mechanisms for rotating the first barrel and the second barrel, simplifying the structure and rotation structure of the second barrel located in the center of the first barrel and reducing costs. The above configuration, by using the rotation of either the first barrel or the second barrel to rotate the other, eliminates the need for separate rotation mechanisms for rotating the first barrel and the second barrel, simplifying the structure and rotation structure of the second barrel located in the center of the first barrel and reducing costs. In either case, the rotation of each barrel can be matched, and the rotation positions and rotation speeds of each barrel can be determined.

[0020] In another embodiment of the barrel plating apparatus according to the present disclosure, the second barrel may have a stirring unit that stirs the objects to be plated in the first storage unit. The above-described barrel plating apparatus has the advantage of being able to maintain or improve plating quality while effectively utilizing the space in the center of the first barrel. This is because the stirring unit stirs the objects to be plated in the first storage unit, promoting the rolling and mixing of the objects to be plated. The rotation of the first barrel and / or the second barrel can be used to stir the objects to be plated in the first storage unit, thereby improving stirring efficiency and maintaining and improving plating quality.

[0021] The barrel plating apparatus of another embodiment according to the present disclosure can further include one or more second barrels within the first barrel. This configuration has the advantage of being able to maintain or improve plating quality while effectively utilizing the space in the center of the first barrel.

[0022] Another embodiment of a barrel plating apparatus according to the present disclosure includes a current-carrying circuit connected to the negative electrode terminal of a power source to provide a negative potential to the object to be plated, the current-carrying circuit including a first cathode in contact with the object to be plated in the first storage unit, a first introduction part connecting the first cathode to the negative electrode terminal of the power source, a second cathode in contact with the object to be plated in the second storage unit, and a second introduction part connecting the second cathode to the negative electrode terminal of the power source, and a rotating shaft disposed on the end surface of the first barrel and / or the second barrel includes an insertion part that passes through the second introduction part, and the insertion part can be connected to the second storage unit. This configuration has the advantage of being able to maintain or improve plating quality while effectively utilizing the space in the center of the first barrel. The above configuration separately disposes the first cathode in the first container and the second cathode in the second container, and the first cathode and first introduction part can set the object to be plated in the first container to a negative potential, and the second cathode and second introduction part can set the object to be plated in the second container to a negative potential, stabilizing the flow of electricity to each object to be plated and maintaining or improving plating quality. Furthermore, the rotating shaft is disposed on the end face of the first barrel and / or the second barrel, communicates with the second container, and has an insertion part through which the second introduction part passes, resulting in a structure in which the second barrel is disposed in the center of the first barrel, and simplifies and simplifies the connection between the second cathode and the negative electrode terminal of the power supply, and the wiring of the second introduction part.

[0023] In another embodiment of the barrel plating apparatus according to the present disclosure, the first introduction part and / or the second introduction part can have a power-supply-side cathode introduction part that is connected to the negative electrode terminal of the power supply, a cathode-side cathode introduction part that is separated from the power-supply-side cathode introduction part and is connected to the first cathode and / or the second cathode, and a connection part that electrically connects the power-supply-side cathode introduction part and the cathode-side cathode introduction part. This configuration has the advantage of being able to maintain or improve plating quality while making effective use of the space in the center of the first barrel. The above configuration allows the first introduction part to have a connection part electrically connecting the power supply-side cathode introduction part connected to the negative electrode terminal of the power supply and the cathode-side cathode introduction part connected to the first cathode, and / or the second introduction part to have a connection part electrically connecting the power supply-side cathode introduction part connected to the negative electrode terminal of the power supply and the cathode-side cathode introduction part connected to the second cathode, allowing the first barrel and the second barrel to rotate freely while preventing twisting and tangling of the power supply-side and / or cathode-side cathode introduction parts, positioning the power supply-side and / or cathode-side cathode introduction parts within a predetermined position or range, preventing excessive load on the power supply-side and / or cathode-side cathode introduction parts, and maintaining a stable and preferable current-carrying state of the connection parts, thereby maintaining or improving plating quality. Furthermore, the configuration has the advantage of simplifying and facilitating the wiring of the first introduction part and / or second introduction part, as well as the positioning of the second barrel in the center of the first barrel, the connection of the first cathode and / or second cathode to the negative electrode terminal of the power supply, and the wiring of the first introduction part and / or second introduction part.

[0024] The present invention will be described in detail below with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "upper," "lower," and other terms incorporating these terms) will be used as necessary. However, the use of these terms is intended to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the present invention. Furthermore, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or components. Furthermore, the embodiments described below are illustrative examples of the technical concept of the present invention and do not limit the scope of the present invention to the following. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative positions, and the like of the components described below are intended for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, the content described in one embodiment or example may also be applicable to other embodiments or examples. Furthermore, the sizes and positional relationships of components shown in the drawings may be exaggerated for clarity. (Embodiment 1)

[0025] The barrel plating apparatus 100 shown in FIGS. 1 and 2 includes a plating tank 2 filled with plating solution 3, a first barrel 10 having a first storage section 11 for storing the object 1 to be plated, a second barrel 20 located in the center of the first barrel 10 and having a second storage section 21 for storing the object 1 to be plated, a rotation mechanism 30 for rotating the first barrel 10 and / or the second barrel 20, and a power supply 40 for setting the object 1 to be plated placed in the first barrel 10 and the second barrel 20 at a negative potential and the plating solution 3 at a positive potential. The barrel plating apparatus 100 stores the object 1 to be plated in the first storage section 11 of the first barrel 10 and the second storage section 21 of the second barrel 20, respectively. The first barrel 10 and the second barrel 20 rotate at an immersion position where they are immersed in the plating solution 3 in the plating tank 2, thereby plating the object 1 to be plated that they each store. (Plating tank 2)

[0026] The plating tank 2 is filled with a plating solution 3. In the barrel plating apparatus 100, the first barrel 10 and the second barrel 20 are rotated at an immersion position where all or a predetermined portion of them are immersed in the plating solution in the plating tank, thereby plating the object 1 to be plated. The plating tank 2 is sized, shaped, and structured so that the first barrel 10 and the second barrel 20 can be placed at an immersion position where the object 1 to be plated in the rotating first barrel 10 and second barrel 20 is immersed in the plating solution 3. The amount of plating solution 3 is equal to or greater than the amount by which the object 1 to be plated contained in the first barrel 10 and the second barrel 20 is immersed at their immersion positions. The plating solution is of various types depending on the plating layer to be plated on the object 1 to be plated. (1st barrel 10)

[0027] The first barrel 10 rotates to plate the object 1 to be plated. The first barrel 10 is a rotating body that rotates at an immersion position immersed in the plating solution 3 while plating the object 1 to be plated. The first barrel 10 includes a hollow cylindrical portion 10A and a pair of end faces 10B and 10C connected to the cylindrical portion 10A and closing both ends of the cylindrical portion 10A. The cylindrical portion 10A may be, for example, a cylinder or a rectangular tube. The cross-sectional shape of the cylindrical portion 10A perpendicular to the central axis 16 can be a regular shape such as a circle ( FIG. 1 ), ellipse, triangle, square, pentagon, hexagon ( FIG. 2 ), heptagon, octagon, dodecagon, or polygon, or can be an irregular shape. For example, the inner surface 10a of the hexagonal cylindrical portion 10A is composed of six flat surfaces and six corners where adjacent flat surfaces 6 are connected. When the cross-sectional shape of the cylindrical portion 10A is polygonal, the lengths of the line segments connecting the midpoints of the diagonal and the opposing sides are different, and as the cylindrical portion 10A rotates, the flat surfaces and corners alternate and connect, facilitating lifting, rolling, mixing, and stirring of the object to be plated in the direction of rotation, and facilitating the inflow, outflow, circulation, and stirring of the plating solution. Furthermore, the polygonal cylindrical portion 10A can improve the strength of the flat surfaces and corners. When the cross-sectional shape of the cylindrical portion 10A is circular, the diameter remains constant even when the cylindrical portion 10A rotates, allowing for repeated stable contact with the object to be plated 1 at a constant contact angle and manner. The cylindrical portion 10A can be formed, for example, by bending a single sheet of plate material, or it can be manufactured by connecting, adhering, and fixing multiple components.

[0028] The first barrel 10 has a first storage section 11 that stores the object 1 to be plated. The first storage section 11 is a storage space that stores the object 1 to be plated within the first barrel 10. The cylindrical portion 10A and the end face portions 10B and 10C each have an inner surface 10a and an outer surface 10b. The inner surface 10a of the cylindrical portion 10A forms the first storage section 11, and the outer surface 10b of the cylindrical portion 10A forms the outer shape of the first barrel 10. The first storage section 11 is covered by the inner surface 10a of the cylindrical portion 10A, the inner surfaces 10a of the end face portions 10B and 10C, and the outer surface 20b of the cylindrical portion 20A of the second barrel 20, and extends in a ring shape along the central axis 16 on the outside of the cylindrical portion 20A of the second barrel 20. In the first storage section 11, the inner surface 10a of the cylindrical section 10A extends along the central axis 16, the length of the central axis 16 within the first storage section 11 is the width of the first storage section 11, and the height (depth) of the first storage section 11 is half the difference between the diagonal (or diameter) of the first barrel 10 and the diagonal (or diameter) of the second barrel 20, and the capacity and shape of the first storage section 11 are determined by the width and height (depth).

[0029] In the barrel plating apparatus 100 shown in Figures 1 and 2, the rotation axis 5 of the first barrel 10 is positioned horizontally. By vertically rotating the barrel around the rotation axis 5, the inner surface 10a of the cylindrical portion 10A lifts the object 1 to be plated in the direction of rotation, sending it to the surface layer (fluidized layer) of the stacked mass, where it is exposed. The object 1 then rolls and slides down the inclined surface in an orderly and continuous manner from top to bottom, depositing a plating layer. By repeating this process, the object 1 can be randomly stirred and mixed vertically and horizontally by repeatedly moving it vertically in the direction of rotation and horizontally in the axial direction. The shape of the inner surface 10a of the first barrel 10 can be incorporated into the rotation of the first barrel 10 to promote random rolling, stirring, and mixing of the object 1 to be plated. For example, the inside of the first barrel 10 can be flat, curved, uneven, stepped, tapered, inclined, or non-parallel to the outer surface. The first barrel 10 can be configured with the same or different thicknesses. The inner surface 10a and the outer surface 10b can be configured with the same (similar) or different shapes. For example, the tubular portion 10 can have a polygonal inner shape and a cylindrical outer shape. The inner surface 10a of this tubular portion 10 has a polygonal shape in a cross section perpendicular to the rotation axis 5, and the outer surface 10b is configured with a curved surface.

[0030] The first barrel 10 is formed from a material that is strong enough to accommodate and rotate the objects 1 to be plated, and that is resistant to the plating solution. The first barrel 10 can be formed from synthetic resins such as polypropylene resin (PP), polyvinyl chloride resin (PVC), acrylic resin, fluororesin, and PEEK resin. It can also be molded using any of these synthetic resins, or it can be formed as a multi-layer structure using a combination of multiple synthetic resins. The first barrel 10 is sized to accommodate a predetermined number of objects 1 to be plated, depending on the shape, size, and quantity of the objects 1, and to rotate the objects 1 in a immersion position within the plating tank 4 where they can be plated. The resin first barrel 10 is non-conductive and easy to mold and process.

[0031] The first barrel 10 has a cylindrical portion 10A provided with a plurality of first liquid passage openings 12 through which the plating solution 3 passes. They may also be provided on the end surfaces 10B and 10C. The first liquid passage openings 12 are through-holes that penetrate the inner and outer surfaces of the first barrel 10 and connect the first storage portion 11 and the plating tank 2 inside and outside the first barrel 10, allowing the plating solution to pass through and flow. When the first barrel 10 is immersed, the plating solution 3 in the plating tank 2 flows into the first storage portion 11 through the first liquid passage openings 12, allowing the object 1 to come into contact with the plating solution 3 in the first storage portion 11, and the plating solution 3 flows out of the first liquid passage openings 12 into the plating tank 2. The shape, size, and number of the first liquid passage openings 12 are not specified, and they must be such that the object 1 to be plated and other components (such as dummy balls that promote stirring and current flow) contained in the first storage portion 11 do not fall out or become trapped. For example, the first liquid passage opening 12 can be circular or polygonal. The first liquid passage openings 12 can be the same or different shapes and sizes, and a perforated plate, mesh, or the like can be used.

[0032] The first barrel 10 has an opening 13 through which the object 1 to be plated can be put in and taken out, and an openable / closable lid 14 that opens and closes the opening 13 to put in and take out the object 1 to be plated. As shown in Fig. 1, the openable / closable lid 14 can be provided on the cylindrical portion 10A, which is the side surface of the first barrel 10, or it can also be provided on the end surface portions 10B and 10C. The first barrel 10 can have a structure in which the end surface portions 10B and 10C can be removed, so that the object 1 to be plated can be put in and taken out.

[0033] The end surfaces 10B and 10C are located at the axial ends of the central axis 16 of the first barrel 10 and close the openings at both opposing ends of the tubular portion 10. The end surfaces 10B and 10C can be detachably connected or fixed to the tubular portion 10A by, for example, engagement, a fitting structure, or bolts. Alternatively, one or both of the end surfaces 10B and 10C can be integral with the tubular portion 10A. The end surfaces 10B and 10C have shapes corresponding to the openings at both ends of the tubular portion 10A and can be symmetrical or asymmetrical. The end surfaces 10B and 10C of the first barrel 10 can also be used in conjunction with the end surfaces 20B and 20C of the second barrel 20.

[0034] The first barrel 10 and the second barrel 20 in FIG. 1 have rotation shafts 5 on both end surface portions 10B and 10C. The first barrel 10 in FIG. 1 has end surface portions 10B and 10C integral with end surface portions 20B and 20C of the second barrel 20, and the rotation shaft 5 is located on the outer surface 10b of the end surface portions 10B and 10C, on an extension of the central axis 16. The rotation shaft 5 is connected to a support portion 7 that rotatably supports the first barrel 10 and the second barrel 20. The support portion 7 rotatably supports the first barrel 10 and the second barrel 20. The support parts 7 can be provided on end face parts 10B, 10C, 20B, and 20C on both sides or one side of the first barrel 10 and the second barrel 20, and the support parts 7 arranged on both sides facing the end face parts 10B, 10C, 20B, and 20C on both sides can rotatably support the first barrel 10 and the second barrel 20 via the rotation shaft 5. The first barrel 10 and the second barrel 20 can also be rotatably connected to a non-rotating rotation shaft 5.

[0035] The barrel plating apparatus 100 has one or more insertion portions 45 through which cathode introduction portions 44 (first introduction portion 44a, second introduction portion 44b) described below are inserted into the first barrel 10 and the second barrel 20. The first introduction portion 44a of the insertion portion 45 is inserted into the first barrel 10 and communicates with the first storage portion 11, and the second introduction portion 44b is inserted into the second barrel 20 and communicates with the second storage portion 21. The insertion portion 45 is provided on at least one of the end surface portions 10B, 10C, 20B, and 20C including the rotation shaft 5 of the first barrel 10 and the second barrel 20, or the cylindrical portions 10A and 20A. The first introduction portion 44a and the second introduction portion 44b can be inserted into the same insertion portion 45 (see, for example, FIG. 1), or separate insertion portions 45 can be provided and inserted into the respective portions (see, for example, FIG. 4). In FIG. 1, an insertion portion 45 is provided on a rotating shaft 5. The rotating shaft 5 is hollow and cylindrical, and two cathode introduction portions 44, a first introduction portion 44a and a second introduction portion 44b, are inserted through the hollow portion as the insertion portion 45. The insertion portion 45 of the rotating shaft 5 can simplify the structure for rotation, support, and insertion, and the cathode introduction portion 44 can be disposed at a predetermined position and within a predetermined range within the hollow portion. The cathode introduction portion 44 in FIG. 1 is inserted through the insertion portion 45 of the rotating shaft 5 and connects the negative electrode terminal 40a of the power source 40 to the cathodes 41 (first cathode 41a and second cathode 41b) disposed in the first and second barrels 10 and 20, respectively. (2nd barrel 20)

[0036] The second barrel 20 is located in the center of the first barrel 10 and rotates to plate the object 1 to be plated therein. The second barrel 20 is a rotating body that rotates at an immersion position immersed in the plating solution 3 to plate the object 1 to be plated. The second barrel 20 has a hollow cylindrical portion 20A and a pair of end surfaces 20B and 20C connected to the cylindrical portion 20A and closing both ends of the cylindrical portion 20A. The cylindrical portion 20A and the end surfaces 20B and 20C each have an inner surface 20a and an outer surface 20b. The same contents and parts of the second barrel 20 as those of the first barrel 10 are described above for the first barrel 10.

[0037] The second barrel 20 has a second storage section 21 that houses and accommodates the object 1 to be plated. The second storage section 21 is a storage space within the second barrel 20 that houses the object 1 to be plated. The inner surface 20a of the cylindrical section 20A forms the second storage section 21, and the outer surface 20b of the cylindrical section 20A forms the outer shape of the second barrel 20. The second storage section 21 has a cylindrical shape that is covered by the inner surface 20a of the cylindrical section 20A and the inner surfaces 20a of the end surfaces 20B and 20C. The bottom area of the cylindrical second storage section 21 is determined by the diagonal line (or diameter) of the end surfaces 20B and 20C of the second barrel 20, and the volume is determined by the length (height) of the central axis 16 within the second storage section 21. In FIG. 1, the central axis 16 of the first barrel 10 and the second barrel 20 is the same. The second barrel 20 has a plurality of second liquid passage openings 22 in its cylindrical portion 20A, through which the plating solution 3 passes, and can also be provided in its end surface portion 20B. The second liquid passage openings 22 allow the plating solution 3 to flow in and out directly from the plating tank 2 or via the first barrel 10. The second barrel 20 has an opening 23 through which the object 1 to be plated can be introduced and removed, and an open / close lid 24 that opens and closes the opening 23 to introduce and remove the object 1 to be plated. The opening 23 and the open / close lid 24 can be provided in the cylindrical portion 20A (FIG. 1), which is the side surface of the second barrel 20, or in the end surface portions 20B and 20C; the end surface portions 20B and 20C can also be configured to be removable to introduce and remove the object 1 to be plated.

[0038] The second barrel 20 can have the same similar shape as the first barrel 10 or a different dissimilar shape. The cylindrical portion 20A of the second barrel 20 can have the same or different thickness, the inner surface 20a and the outer surface 20b can have the same or different shapes, and the corners 6 can be located in the same or different positions as the first barrel 10. For example, if the first barrel 10 and the second barrel 20 are both polygonal cylindrical, they can have the same shape (similar shape), the same position, and angle, as shown in FIG. 2, and the corners 6 of each cylindrical portion 10A can be located on the same diagonal of the first barrel 10. In this case, the second storage portion 21 can have a shape that connects the same inner shapes, allowing for repeated, stable rolling and mixing of the objects to be plated 1. Furthermore, the corners 6 of the cylindrical portion 20A of the second barrel 20, which have a similar shape, can be positioned offset from the corners 6 of the first barrel 10, and the corners 6 of the second barrel 20 can be positioned other than diagonally from the corners 6 of the first barrel 10. Furthermore, the first barrel 10 and the second barrel 20 can be formed into different non-similar shapes, such as a hexagon and an octagon, and all or some of the corners 6 of the cylindrical portions 10A and 20A can be positioned offset from each other. The outer surface 20b of the cylindrical portion 20A of the second barrel 20, and the corners 6 of the square tube that protrude toward the first storage portion 11, come into contact with the object 1 to be plated in the first storage portion 11, thereby promoting rolling, movement, stirring, and mixing.

[0039] The second barrel 20 is disposed in the center of the first barrel 10, which is disposed on the outside (outermost shell). In this configuration, the cylindrical second storage section 21 is disposed in the center of the first barrel 10, making effective use of the central portion of the first barrel 10. The ring-shaped or annular first storage section 11 is disposed on the outside of the second barrel 20, making it possible to increase the total amount of objects 1 to be plated that can be introduced. Meanwhile, the barrel plating apparatus 100 increases the volume of the second barrel 20 (second storage section 21), making it possible to effectively utilize the space in the central portion of the first barrel 10 and increase the amount of objects 1 to be plated that can be introduced into the second barrel 20. Therefore, the diameter or diagonal (L2) of the second barrel 20 is, for example, 1 / 5 or more of the diameter or diagonal (L1) of the first barrel 10. On the other hand, if the second barrel 20 in the center becomes too large, the volume of the first barrel 10 and the amount of objects 1 to be plated that can be put into the first storage section 11 will decrease, so the diameter or diagonal (L2) of the second barrel 20 is set to, for example, 2 / 3 or less of the diameter or diagonal (L1) of the first barrel 10. Within the above range, the space in the center of the first barrel 10 can be effectively utilized while ensuring the volumes of the first storage section 11 and the second storage section 21. This makes it possible to efficiently increase the total appropriate amount of objects 1 to be plated that can be put into each of the first barrel 10 and the second barrel 20, thereby maximizing and optimizing the total amount that can be put into each barrel. In addition, the outer surface 20b, corner 6, and stirring portion 8 of the second barrel 20, which are closer to the central axis 16, can stir the object 1 to be plated in the first storage portion 11, promoting the inflow and outflow and stirring of the plating solution 3.Furthermore, the second barrel 20 can separate the object 1 to be plated in the second storage portion 21 from the object 1 to be plated in the first storage portion 11, promoting contact with the plating solution 3 and suppressing a decrease in metal ion concentration, thereby maintaining and improving plating quality and efficiency.

[0040] At the immersion positions of the first barrel 10 and the second barrel 20, the central axes 16 of the first barrel 10 and the second barrel 20 can be positioned at the same position, or they can be positioned close to each other so that they overlap, or they can be positioned at different positions. By positioning the central axis 16 of the second barrel 20 at the same position as the central axis 16 of the first barrel 10 ( FIG. 1 ) or close to it, the space in the center of the first barrel 10 can be effectively utilized, the amount of workpieces 1 to be plated can be increased, and coaxial rotation and the need for multiple rotation mechanisms 30 can be eliminated, simplifying the structure and reducing costs. Therefore, it is preferable to position the central axis 16 of the second barrel 20, for example, within 20% of the diameter of the first barrel 10 from the central axis 16 of the first barrel 10.

[0041] The second barrel 20 may have one or more agitators 8 for agitating the object 1 to be plated and / or the plating solution 3 in the first storage section 11. The agitators are members that protrude from the outer surface 20a of the second barrel 20 into the first storage section 11 and may be, for example, protruding, rod-shaped, plate-shaped, mesh-shaped, linear, planar, uneven, conical, or hemispherical, or may be elastic. The agitators 8 promote the rolling, mixing, and agitation of the object 1 to be plated and the flow and agitation of the plating solution 3. Figure 3 shows an example in which the agitators 8 are located at the corners of the rectangular cylindrical section 20A of the second barrel 20. The agitators 8 protrude from a position closer to the object 1 to be plated than the central axis 16 of the second barrel 20 and are positioned so that they can contact the object 1 to agitate the object 1 to be plated and the plating solution 3 in the first storage section 11 together with the outer surface 20b of the cylindrical section 20A. The agitators 8 may be located on corners 8, flat surfaces, or curved surfaces. Furthermore, the stirring unit 8 is removable, allowing the shape, length, posture, arrangement, number, etc. of the stirring unit 8 to be adjusted or changed, and can also be replaced depending on the object to be plated 1. In addition, a first introduction unit 44a and a first cathode 41a, which will be described later, can be used in combination with the stirring unit 8, and the first introduction unit 44a can be arranged to extend from the outer surface 20a of the second barrel 20 to the bottom of the first barrel 10. Furthermore, the first introduction unit 44a and the first cathode 41a can be arranged on the back side of the stirring unit 8, so that the object to be plated 1 can be stirred on the front side of the stirring unit 8 and the first introduction unit 44a and the first cathode 41a can be protected from the object to be plated 1 that may come into contact with or collide with them. (Rotation mechanism 30)

[0042] The rotation mechanism 30 rotates the first barrel 10 and / or the second barrel 20. The rotation mechanism 30 is, for example, a motor 31, and may have a rotation transmission unit 32 composed of parts and members that transmit the rotational drive of the motor 31 to the first barrel 10 or the second barrel 20. The rotation transmission unit 32 may include, for example, a gear 33, projections and recesses, a sprocket, a cam, rubber, a belt, or a chain. The rotation mechanism 30 is directly or indirectly coupled to the first barrel 10 or the second barrel 20 to rotate them. The rotation mechanism 30 in FIG. 1 rotates the integrated first barrel 10 and second barrel 20 via the motor 31, the gear 33, and peripheral gears 33d provided on the peripheries of the end surfaces 10B and 10C of the first barrel 10. The rotation mechanism 30 can also rotate the first barrel 10 and the second barrel 20 via the rotation shaft 5. The rotation mechanism 30 can rotate at a rotation speed that allows plating to be performed properly and efficiently on the object to be plated 1. The rotation mechanism 30 can also rotate the first barrel 10 and the second barrel 20 using, for example, a servo motor without using the rotation transmission unit 32. The rotation mechanism 30 can be provided with a speed change mechanism that can change the rotation speed in accordance with the object to be plated 1, the input amount, the plating solution 3, etc., as well as rotate at a constant speed in one direction. Furthermore, the rotation direction can be changed periodically at a predetermined number of rotations, time, or central angle.

[0043] The rotation mechanism 30 can rotate the first barrel 10 and the second barrel 20 in the same or different rotational directions. The rotation mechanism 30 in FIG. 1 rotates the first barrel 10 and the second barrel 20 in the same rotational direction (counterclockwise). The rotation mechanism 30 can rotate the first barrel 10 and the second barrel 20 using one or more motors 31, which may be the same or different. A configuration using the same motor 31 for rotation eliminates the need for separate motors 31 for rotating the first barrel 10 and the second barrel 20, reducing costs and enabling the rotation of each barrel to correspond to the rotation of each barrel, thereby determining their respective rotational positions and rotational speeds. Furthermore, by integrating the end surfaces 10B, 10C of the first barrel 10 with the end surfaces 20B, 20C of the second barrel 20, or by fixing the end surfaces 20B, 20C of the second barrel 20 to the end surfaces 10B, 10C of the first barrel 10, the first barrel 10 and the second barrel 20 can be easily rotated using the same motor 31.

[0044] Furthermore, the rotation mechanism 30 can use the rotation of either the first barrel 10 or the second barrel 20 to rotate the other. For example, the first barrel 10 can be rotated by a motor 31, and the rotation of the first barrel 10 can be transmitted to the second barrel 20 via a rotation transmission unit 32, such as a gear 33 or a sprocket, provided on the outer surfaces 10b, 20b or the rotating shaft 5. This configuration also eliminates the need for separate motors 31 to rotate the first barrel 10 and the second barrel 20, reducing costs and enabling the rotations of each barrel to be matched and their respective rotation positions and rotation speeds to be determined. The rotation mechanism 30 can rotate the first barrel 10 and the second barrel 20 in the same or different directions via gears, and can also rotate them at different rotational speeds via gears. The rotation mechanism 30 can also be configured to rotate the first barrel 10 and the second barrel 20 independently.

[0045] The barrel plating apparatus 100 can have an immersion position where the first barrel 10 and the second barrel 20 are immersed in the plating solution 3, and an up / down mechanism that lifts them out of the plating solution 3 and places them in a non-immersion position when moving to a different plating tank 2 or after the plating process is completed. (power supply 40)

[0046] The power supply 40 applies a negative potential to the object 1 housed in the first container 11 and the second container 21, and a positive potential to the plating solution 3. The power supply 40 is a DC power supply having negative and positive electrode terminals 40a, 40b. The object 1 is connected to the negative electrode terminal 40a of the power supply 40 via a current-carrying circuit 43, and the barrel plating apparatus 100 is equipped with a current-carrying circuit 43 that applies current to the object 1. For example, the current-carrying circuit 43 in FIG. 1 applies current to the object 1 by placing a conductive wire, such as a flexible lead wire, inside the first barrel 10. The negative electrode terminal 40a of the power supply 40 is electrically connected to the object 1 via the current-carrying circuit 43, applying a negative potential to the object 1. In the power supply 40 in FIG. 1, the negative electrode terminal 40a is connected to the cathode 41 via the current-carrying circuit 43. The cathode 41 has a first cathode 41a and a second cathode 41b that are arranged at positions that contact the object 1 to be plated in the first storage section 11 and the second storage section 21, respectively, and the object 1 to be plated that is in contact with the first cathode 41a and the second cathode 41b is set to a negative potential via an energization circuit 43. The stacked objects 1 to be plated come into contact with each other, giving the stacked objects 1 to be plated a negative potential, and the objects 1 to be plated constitute a part of the energization circuit 43.

[0047] The current-carrying circuit 43 is connected to the negative electrode terminal 40a of the power source 40, thereby providing a negative potential to the object 1 to be plated. The current-carrying circuit 43 has one or more cathodes 41 in contact with the object 1 to be plated and a cathode introduction part 44 connected to the cathodes 41. The cathodes 41 can be made of, for example, a conductive metal plate or metal wire. The cathodes 41 in FIG. 1 are separately disposed in the first storage part 11 and the second storage part 21, and have a first cathode 41a disposed in the first storage part 11 and a second cathode 41b disposed in the second storage part 21. The cathode introduction part 44 connects the power source 40 to the cathodes 41 and introduces the cathodes 41 into the first barrel 10 or the second barrel 20. The cathode introduction part 44 can be made of a conductive material such as a conductive metal plate or metal wire, and a conductive material such as a flexible conductive wire or plate can be disposed inside, and the surface can be entirely or partially covered with an insulating material such as resin (e.g., a lead wire). The cathode introduction part 44 in FIG. 1 is connected to the first cathode 41a and the second cathode 41b, which are separately disposed in the first housing part 11 and the second housing part 21, and introduces the first cathode 41a and the second cathode 41b into the first barrel 10 and the second barrel 20, respectively. The cathode introduction part 44 in FIG. 1 has a first introduction part 44a connected to the first cathode 41a disposed in the first housing part 11, and a second introduction part 44b connected to the second cathode 41b disposed in the second housing part 21.

[0048] As shown in FIG. 1, the positive electrode terminal 40b of the power source 40 is connected to an anode 42 via a conductive member, and the anode 42 is immersed in a plating solution 5 to set the plating solution 5 to a positive potential. An object 1 to be plated, which is at a negative potential, is immersed in the positive plating solution 5, and metal ions in the plating solution 5 are adsorbed onto the object 1 to be plated, which is at a negative potential, resulting in a plating layer. One or more anodes 42 can be provided, and they can be rod-shaped, plate-shaped, or have a shape and size appropriate for the device. In FIG. 2, two anodes 42 are placed on both sides outside the first barrel 10. However, the anodes 42 can also be placed inside the first barrel 10 or the second barrel 20.

[0049] The cathode introduction part 44 penetrates or passes through at least one of the end surface parts 10B, 10C of the first barrel 10, the end surface parts 20B, 20C of the second barrel 20, and the cylindrical parts 10A, 20A, and is inserted into the first storage part 11 and the second storage part 21. The first barrel 10 and the second barrel 20 have insertion parts 45 that insert the cathode introduction part 44 into the first storage part 11 and the second storage part 21. Of the insertion parts 45, the first introduction part 44a is inserted into the first storage part 11, and the second introduction part 44b is inserted into the second storage part 21. The insertion part 45 is, for example, a through hole, a slit, a gap, or the like that allows the cathode introduction part 44 to be inserted therethrough, and is in communication with the first storage part 11 and the second storage part 21. The insertion portion 45 can be provided on end surfaces 10B, 10C, 20B, and 20C of the first barrel 10 and the second barrel 20, and on the rotating shaft 5. In FIG. 1, the hollow portion of a hollow cylindrical (cylindrical) rotating shaft 5 serves as the first insertion portion 45, through which both the first introduction portion 44a and the second introduction portion 44b are inserted. In FIG. 4, the rotating shaft 5 is a double cylinder having an outer cylindrical portion 5a on the outer edge side and an inner cylindrical portion 5b on the center side, and is provided with a first insertion portion 45a through which the first introduction portion 44a is inserted and a second insertion portion 45b through which the second introduction portion 44b is inserted. In this rotating shaft 5, the second insertion portion 45b is provided on the center side, and the hollow portion of the central cylindrical portion 5b serves as the second insertion portion 45b, which communicates with the second housing portion 21. Furthermore, the first insertion portion 45a is provided outside the second insertion portion 45b, and the gap between the central cylinder 5b and the outer edge cylinder 5a serves as the first insertion portion 45a, which communicates with the first housing portion 11. This rotating shaft 5 allows the first barrel 10 and the second barrel 20 to rotate freely, while disposing the first introduction portion 44a and the second introduction portion 44b in a horizontal position within a predetermined range, thereby preventing twisting or entanglement between them or with each other and preventing excessive load on the first introduction portion 44a and the second introduction portion 44b.

[0050] 4, when the rotating shaft 5 penetrates through the end face portions 10B, 10C, 20B, and 20C, the second introduction portion 44b is inserted into the second insertion portion 45b on the center side of the rotating shaft 5, inserted into the second housing portion 21, and connected to the second cathode 41b inside the second housing portion 21. The first insertion portion 45a on the outer edge side of the rotating shaft 5 communicates with the inside of the first housing portion 11, and the first insertion portion 45a can communicate with the inside of the first housing portion 11 via any of the following: the gap between the first barrel 10 and the second barrel 20; the inner surface 10a or the outer surface 10b of the end face portions 10B and 10C of the first barrel 10 or a communicating space within the end face portions 10B and 10C; or the inner surface 20a or the outer surface 20b of the end face portions 20B and 20C of the second barrel 20 or a communicating space within the end face portions 20B and 20C. 4 is connected to a gap 45c between end surfaces 10B, 10C of the first barrel 10 and end surfaces 20B, 20C of the second barrel 20, and is connected to the first housing portion 11 via the gap 45c. The first introduction portion 44a in FIG. 4 is connected to the first cathode 41a disposed in the first housing portion 11 through the first insertion portion 45a and the gap 45c.

[0051] The cathode introduction portion 44 may have a connection portion 46 that electrically connects the divided cathode introduction portion 44 and the energizing circuit 43. The connection portion 46 in FIG. 5 electrically connects the divided cathode introduction portion 44X on the power supply side and the cathode introduction portion 44Y on the cathode side. The connection portion 46 has two or more conductive members with shapes that allow them to be connected to each other. The connection portion 46 can be, for example, two metal plates that can connect the divided cathode introduction portion 44 while allowing the rotation shaft 5 to rotate freely. The connection portion 46 can have a flat, plate-like, uneven, protruding, grooved, stepped, or cup-shaped configuration, and can further have a fitting, locking, or clamping structure that allows them to be fitted, locked, or clamped together. The connection portion 46 enables surface contact, stabilizes the contact surface, increases the contact area, and ensures a good connection state. Connection part 46 can connect the separated cathode introduction part 44 inside and outside of first barrel 10 and / or second barrel 20 while allowing first barrel 10 and second barrel 20 to rotate, can prevent twisting or tangling of cathode introduction part 44, and can position cathode introduction part 44 at a predetermined position or within a predetermined range to prevent excessive load on cathode introduction part 44. Connection part 46 can be rotatable in whole or in part to connect power supply-side cathode introduction part 44X and cathode side cathode introduction part 44Y. For example, connection part 46 can be rotatable together with rotation shaft 5, with power supply connection part 46a fixed to support part 7 and cathode connection part 46b fixed to rotation shaft 5, to connect power supply-side cathode introduction part 44X and cathode side cathode introduction part 44Y. The rotating shaft 5 or the second barrel 20 (or the first barrel 10) rotates, but the cathode connection part 46b can be made non-rotating, which makes it possible to more stabilize the position and posture of the cathode introduction part 44Y on the cathode side. The connection part 46 can be provided on the end faces 10B, 10C, 20B, and 20C of the rotating shaft 5, the first barrel 10, and the second barrel 20, which simplifies and simplifies the structure, connections, and wiring.

[0052] 5 illustrates a first connection portion 46A and a second connection portion 47 as examples of connection portion 46. Although the cathode introduction portion 44 in FIG. 5 has the first connection portion 46A provided on the inlet side (support portion 7 side) of the rotating shaft 5, it may be provided at another position, such as the middle of the rotating shaft 5 or on the side of end faces 10B and 10C of the rotating shaft 5. The cathode introduction portion 44 in FIG. 5 has the first connection portion 46A that connects the cathode introduction portion 44 that is separated inside and outside the rotating shaft 5 to allow the rotating shaft 5 or the second barrel 20 or the first barrel 10 to rotate freely. 5 includes a cathode introduction portion 44 (power supply-side cathode introduction portion 44X) outside the rotating shaft 5 that is connected to the power supply 40, a cathode introduction portion 44 (cathode-side cathode introduction portion 44Y) inside the rotating shaft 5 that is connected to the second cathode 41b, and a first connection portion 46A that electrically connects the power supply-side cathode introduction portion 44X and the cathode-side cathode introduction portion 44Y. The first connection portion 46A has a power supply connection portion 46a that is connected to the power supply-side cathode introduction portion 44X and a cathode connection portion 46b that is connected to the cathode-side cathode introduction portion 44Y, and by connecting the power supply connection portion 46a and the cathode connection portion 46b, the cathode-side cathode introduction portion 44Y, which is a divided cathode introduction portion 44 inside and outside the rotating shaft 5, the first barrel 10, and the second barrel 20, is connected to the power supply-side cathode introduction portion 44X. 5 connects the power supply-side cathode introduction part 44X and the cathode-side cathode introduction part 44Y inserted into the second barrel 20, but it is also possible to connect the power supply-side cathode introduction part 44X and the cathode-side cathode introduction part 44Y inserted into the first barrel 10. The power supply connection part 46a and the cathode connection part 46b can separate the cathode-side cathode introduction part 44Y inserted into the second barrel 20 and the cathode-side cathode introduction part 44Y inserted into the first barrel 10 and connect them to the power supply-side cathode introduction part 44X.

[0053] For example, the cathode connector 46b on the rotating shaft 5 side can be shaped (circular) to match the rotating shaft 5, and the power connector 46a of the same or similar shape can be arranged outside the cathode connector 46b (on the support 7 side), or can be arranged as a wide ring on the outer periphery of the cathode connector 46b. Increasing the contact area between the power connector 46a and the cathode connector 46b or achieving surface contact can stabilize the electrical connection. The cathode connector 46b and / or the power connector 46a can be arranged outside the rotating shaft 5 (on the support 7 side), and one or both of them can have a protrusion that protrudes into the hollow portion of the rotating shaft 5. Alternatively, one or both of the cathode connector 46b and the power connector 46a can be configured with a T-, I-, or L-shaped fitting or locking structure to stabilize the connection of the first connector 46A and increase the contact area.

[0054] The second connection portion 47 in FIG. 5 has an inner exposed portion 47b and an outer exposed portion 47a that are partially exposed on the inner surface 10a and the outer surface 10b of the end surface portions 10B, 10C, 20B, and 20C of the first barrel 10 and the second barrel 20, respectively, and a connecting portion 47c that connects the outer exposed portion 47a and the inner exposed portion 47b. The outer exposed portion 47a is connected to the negative electrode terminal 40a of the power source 40 via a cathode lead-in portion 44X on the power source side, and the inner exposed portion 47b is connected to the cathode 41 via a cathode lead-in portion 44Y on the cathode side. The second connection portion 47 in FIG. 5 has an integral structure of the end surface portions 10B, 10C, 20B, and 20C of the first barrel 10 and the second barrel 20, thereby simplifying the structure and improving strength. However, the end surfaces 10B, 10C, 20B, and 20C of the first barrel 10 and the second barrel 20 may be formed by connecting and fixing separate members.

[0055] In the second connection portion 47 shown in FIG. 5, the outer exposed portion 47a is disposed inside the inner exposed portion 47b (toward the central axis 16), the outer exposed portion 47a extends along the outer periphery of the rotating shaft 5, and is connected to the power supply connection portion 46a (or the cathode connection portion 46b) of the first connection portion 46A, and is connected to the power supply-side cathode introduction portion 44X and the power supply 40. The inner exposed portion 47b is disposed outside the outer exposed portion 47a (toward the tubular portion 10A of the first barrel 10) and is connected to the cathode 41 via the cathode-side cathode introduction portion 44Y. The connecting portion 47c connects the outer exposed portion 47a and the inner exposed portion 47b. The second connection portion 47 shown in FIG. 5 can be disposed by providing insertion portions 45 on the end surface portions 20B, 20C in accordance with the shape, insertion, and arrangement position of the second connection portion 47. The second connection portion 47 is shaped and positioned to conform to the outer surface 20b and inner surface 20a of the end faces 20B, 20C of the second barrel 20. However, it can also conform to the end faces 20B, 20C and / or the inner surface 20a of the tubular portion 20A of the second barrel 20, thereby reducing the area exposed to the outside or inside. The outer exposed portion 47a, the inner exposed portion 47b, and the connecting portion 47c of the second connection portion 47 can be an integral structure, or can connect or couple separate members, such as a bent or curved conductive member, plate, or lead wire. The second connection portion 47 in FIG. 5 is positioned non-rotatably and does not rotate together with the second barrel 20 and the first barrel 10, and can connect the cathode introduction portion 44X on the power supply side to the cathode introduction portion 44Y on the cathode side. Furthermore, second connection portion 47 may be ring-shaped, annular, cup-shaped, or the like, and may be rotatable together with end surface portions 10B, 10C, 20B, and 20C to connect power supply-side cathode introduction portion 44X and cathode-side cathode introduction portion 44Y. While second connection portion 47 in FIG. 5 connects power supply-side cathode introduction portion 44X and cathode-side cathode introduction portion 44Y inserted into first barrel 10, it may also connect power supply-side cathode introduction portion 44X and cathode-side cathode introduction portion 44Y inserted into first barrel 10. The cathode-side cathode introduction portion 44Y inserted into first barrel 10 and the cathode-side cathode introduction portion 44Y inserted into second barrel 20 may be separated and connected to power supply-side cathode introduction portion 44X.

[0056] Although the connection portion 46 in FIG. 5 includes both the first connection portion 46A and the second connection portion 47, it may include only one of them. The first connection portion 46A or the second connection portion 47 can connect one or both of the power supply-side cathode introduction portion 44X and the cathode-side cathode introduction portion 44Y inserted into the second barrel 20 or the first barrel 10. Furthermore, connections different from those shown in the drawings can be made, such as by partially combining the configurations of the first connection portion 46A and the second connection portion 47. For example, the inner exposed portion 47b can be connected to the cathode introduction portion 44 inserted into the first insertion portion 45a on the outer edge side of the double-cylinder rotating shaft 5. (Embodiment 2)

[0057] The rotation mechanism 30 of the barrel plating apparatus 100 in Fig. 1 rotates the first barrel 10 and the second barrel 20 in the same rotational direction, but as shown in a barrel plating apparatus 200 of embodiment 2 in Figs. 6 and 7, for example, the rotation mechanism 30 can rotate the first barrel 10 and the second barrel 20 in opposite rotational directions. By rotating the first barrel 10 and the second barrel 20 in opposite directions, the barrel plating apparatus 200 can lift the separately arranged objects 1 to be plated in the first storage section 11 and the second storage section 21 in different directions (opposite directions) by rotating in opposite directions, thereby increasing the separation distance and allowing the objects 1 to move apart in different directions, thereby reducing the degree of interference and adverse effects between them and, in particular, suppressing a decrease in and unevenness in the metal ion concentration due to plating adhesion to each object 1 to be plated. This promotes the rolling, mixing, and agitation of the objects 1 to be plated, and the inflow and outflow, circulation, and mixing of the plating solution 3, due to the counter-rotation of the first barrel 10 and the second barrel 20, and can further exert one or more of the following effects: an expansion of the surface area of each of the objects 1 to be plated that are arranged separately in the first barrel 10 and the second barrel 20; an increase in the amount of the objects 1 to be plated that are exposed on the surface; and efficient contact of the objects 1 to be plated with the plating solution 3. The barrel plating apparatus 200 has a structure in which the first barrel 10 and the second barrel 20 are connected so that they can rotate freely relative to each other, and the first barrel 10 and the second barrel 20 can rotate in different directions and at different rotational speeds.

[0058] The rotation mechanism 30 can rotate the first barrel 10 and the second barrel 20 in opposite directions using one or more motors 31, which can be the same or different. The rotation mechanism 30 can specify the direction and speed of rotation of each of the first barrel 10 and the second barrel 20 by rotating them using different motors 31. The rotation mechanism 30 can also rotate the first barrel 10 and the second barrel 20 in opposite directions using the same motor 31. The rotation mechanism 30 in FIG. 6 is an example in which the same motor 31 rotates the first barrel 10 and the second barrel 20 in opposite directions via a gear 33. Motor 31 directly or indirectly rotates first gear 33a, which meshes with peripheral gear 33d provided on the periphery of end face portions 10B and 10C of first barrel 10 to rotate first barrel 10 clockwise, and first gear 33a meshes with peripheral gear 33e provided on the periphery of end face portions 20B and 20C of second barrel 20 via second gear 33b to rotate second barrel 20 in the opposite direction, counterclockwise.

[0059] Furthermore, the rotation mechanism 30 can rotate either the first barrel 10 or the second barrel 20 while using the rotational torque of one barrel to rotate the other barrel in the opposite direction. For example, the rotational torque of one barrel, generated by a motor 31, can be transmitted to the other barrel via a rotation transmission unit 32, such as one or more gears 33, to rotate the other barrel in the opposite direction. The rotation mechanism 30 of FIG. 7 rotates the first barrel 10 using the motor 31 and uses the rotational torque of the first barrel 10 to rotate the second barrel 20 in the opposite direction. In the rotation mechanism 30 of FIG. 7, the motor 31 rotates the first barrel 10 clockwise, and the third gear 33c meshes with the inner peripheral gear 33f provided on the inner peripheral edge of the end face portions 10A and 10B of the first barrel 10, which then meshes with the peripheral gear 33e provided on the periphery of the end face portions 20B and 20C of the second barrel 20 via the third gear 33c, thereby rotating the second barrel 20 in the opposite direction, counterclockwise. The rotation mechanism 30 can rotate the second barrel 20 using the motor 31 and rotate the first barrel 10 in the opposite direction using the rotational torque of the second barrel 20. (Embodiment 3)

[0060] While the barrel plating apparatuses 100 and 200 shown in FIGS. 1 and 6 each include one second barrel 20 within the first barrel 10, the barrel plating apparatus 300 of the third embodiment, as shown in FIG. 8, can include multiple second barrels 20 within the first barrel 10. By including two or more second barrels 20, the central space within the first barrel 10 can be effectively utilized, maintaining and improving plating quality. Multiple second barrels 20 allow each second storage compartment 21 to store an appropriate number of objects 1 to be plated. This reduces the height and thickness of the stacked objects 1, increasing the proportion of the surface area, maintaining and improving plating quality, and streamlining the plating process. Multiple second barrels 20 effectively utilize the central portion of the outermost first barrel 10, increasing the total number of objects 1 that can be stored in the first barrel 10 and the second barrel 20.

[0061] The barrel plating apparatus 300 of FIG. 8 has a first barrel 10 and two second barrels 20. The second barrel 20 has an inner second barrel 20X and an outer second barrel 20Y arranged outside the inner second barrel 20X. The barrel plating apparatus 300 of FIG. 8 has a first storage section 11 between the outermost first barrel 10 and the outer second barrel 20Y, an outer second storage section 21Y between the outer second barrel 20Y and the inner second barrel 20X, and an inner second storage section 21X in the inner space of the inner second barrel 20X. The object to be plated 1 is stored in each of the three divided first storage sections 11, outer second storage section 21Y, and inner second storage section 21X, and the object to be plated 1 can be plated by applying a negative potential to each of the cathodes 41 arranged in the storage sections 11, 21X, and 21Y. The barrel plating apparatus 300 shown in Figure 8, which has two (multiple) second barrels 20, can accommodate and plate objects 1 of a size, shape, and number appropriate for each of the first storage unit 11, the outer second storage unit 21Y, and the inner second storage unit 21X. Rotation of the first barrel 10, the outer second barrel 20Y, and the inner second barrel 20X promotes rolling, mixing, and agitation of the objects 1 to be plated, as well as the inflow / outflow, circulation, and mixing of the plating solution 3. The outer surface 20b of the inner second barrel 20X (outer second barrel 20Y) located on the inside or the agitator 8 connected to the outer surface 20b promotes rolling, mixing, and agitation of the objects 1 to be plated in the outer second storage unit 21Y (first storage unit 11), as well as the inflow / outflow, circulation, and mixing of the plating solution 3. The object 1 to be plated is spaced apart in each of the three divided first storage sections 11, the outer second storage section 21Y, and the inner second storage section 21X, which expands the surface area and increases the amount of object 1 to be plated exposed to the surface, allowing for efficient contact with the plating solution 3, suppressing or preventing a decrease in metal ion concentration, and enabling the plating film thickness to be uniform, plating quality to be maintained or improved, and plating efficiency to be improved.

[0062] In the barrel plating apparatus 300, the first barrel 10 and all or any of the outer and inner second barrels 20X, 20Y can rotate in the same or different directions and at the same or different rotational speeds. For example, as shown by the arrows in Figure 8, the first barrel 10 and the inner second barrel 20X can rotate counterclockwise, and the outer second barrel 20Y can rotate clockwise. This configuration more efficiently rolls, mixes, and stirs the objects 1 to be plated stored in each storage section 11, 21Y, 21X, and stirs and flows the plating solution 3. This reduces and suppresses the decrease and imbalance of metal ion concentration, thereby improving and maintaining plating quality. The outer surface 20b and stirring part 8 of the outer second barrel 20Y, which rotates in the opposite direction to the first barrel 10, promote the rolling, mixing, and stirring of the object 1 to be plated in the first storage part 11, and the outer surface 20b and stirring part 8 of the inner second barrel 20X, which rotates in the opposite direction to the outer second barrel 20Y, promote the rolling, mixing, and stirring of the object 1 to be plated in the outer second storage part 21Y. The presence of the outer second barrel 20Y, which rotates in a different rotational direction, promotes the inflow and outflow of the plating solution 3 and stirring, and also alternates the directions in which the object 1 to be plated is lifted, allowing the object 1 to be separated by a large distance and in different directions in each storage part 11, 21X, 21Y. [Industrial Applicability]

[0063] The present disclosure can be effectively used as a barrel plating device that effectively utilizes the space in the center of the first barrel while maintaining or improving plating quality. [Explanation of symbols]

[0064] 100, 200, 300, 800, 900...Barrel plating equipment 1...Item to be plated 2...Plating tank 3...Plating solution 5...Rotation axis 5a...Cylindrical outer edge 5b...Cylindrical part at the center 6...Corner 7...Support part 8...Mixing section 10...1st barrel 10A...Cylindrical part 10B, 10C...end face part 10a...Inner surface 10b...outer surface 11...First storage section 12…1st liquid passage opening 13...Opening 14...Opening and closing lid 16...Central axis 20...Second barrel 20X: Second inner barrel 20Y: Second outer barrel 20A...Cylindrical part 20B, 20C...end face part 20a...Inner surface 20b…Outer surface 21...Second storage section 21X...Second inner compartment 21Y: Second outer storage compartment 22…Second liquid passage opening 23...Opening 24...Opening and closing lid 30...Rotation mechanism 31...Motor 32...Rotation transmission part 33...Gear 33a...1st gear 33b...2nd gear 33c...3rd gear 33d...peripheral gear 33e...peripheral gear 33f...Inner peripheral gear 40...Power supply 40a...Negative electrode terminal 40b...Positive electrode terminal 41...Cathode 41a...first cathode 41b...Second cathode 42...Anode 43...Electrified circuit 44...Cathode introduction part 44a...First Introduction 44b...Second introduction 44X...Cathode lead-in part on the power supply side 44Y: Cathode introduction part on the cathode side 45...Passage part 45a...First insertion part 45b...Second insertion part 45c...Void part 46...Connection 46A...First connection part 46a...Power connection 46b...Cathode connection 47...Second connection part 47a...Outer exposed part 47b...Inner surface 47c...Connection part

Claims

1. a plating tank filled with a plating solution; a first barrel having a first accommodation portion for accommodating an object to be plated and provided with a first liquid passage opening through which the plating solution passes; Located in the center of the first barrel, a second barrel having a second accommodation portion for accommodating an object to be plated and provided with a second liquid passage opening through which the plating solution passes; a rotation mechanism that rotates the first barrel and / or the second barrel; a power supply that sets the object to be plated placed in the first barrel and the second barrel at a negative potential and the plating solution at a positive potential, A barrel plating apparatus in which the first barrel and the second barrel rotate at an immersion position immersed in the plating solution in the plating tank to plate the object to be plated.

2. The barrel plating apparatus according to claim 1, A barrel plating apparatus in which the central axis of the second barrel is located within 20% of the diameter or diagonal of the first barrel from the central axis of the first barrel.

3. The barrel plating apparatus according to claim 1, A barrel plating apparatus, wherein the diameter or diagonal (L2) of the second barrel is 1 / 5 or more of the diameter or diagonal (L1) of the first barrel.

4. The barrel plating apparatus according to claim 1, The second barrel rotates in the same direction as the first barrel.

5. The barrel plating apparatus according to claim 1, A barrel plating apparatus in which the second barrel rotates in a different direction than the first barrel.

6. The barrel plating apparatus according to claim 1, the first barrel and the second barrel are rotated by the same rotation mechanism; Alternatively, a barrel plating apparatus in which the rotation of one of the first barrel and the second barrel is used to rotate the other.

7. The barrel plating apparatus according to claim 1, The second barrel has a stirring section that stirs the object to be plated in the first storage section.

8. The barrel plating apparatus according to claim 1, A barrel plating apparatus including one or more second barrels within the first barrel.

9. The barrel plating apparatus according to any one of claims 1 to 8, a current-carrying circuit connected to a negative electrode terminal of the power source to set the object to a negative potential; The energizing circuit is a first cathode in contact with the object to be plated in the first accommodation portion; a first introduction part that connects the first cathode and a negative electrode terminal of the power source; a second cathode in contact with the object to be plated in the second accommodation portion; a second introduction part that connects the second cathode and a negative electrode terminal of the power source; and A barrel plating device in which a rotating shaft arranged on an end surface portion of the first barrel or / and the second barrel has an insertion portion that passes through the second introduction portion, and the insertion portion is connected to the second storage portion.

10. The barrel plating apparatus according to claim 9, The first introduction part and / or the second introduction part are a power supply-side cathode lead-in portion connected to the negative electrode terminal of the power supply; a cathode-side cathode introduction portion separated from the power supply-side cathode introduction portion and connected to the first cathode and / or the second cathode; a barrel plating apparatus having a connection portion that electrically connects the cathode introduction portion on the power supply side with the cathode introduction portion on the cathode side.

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