Processing liquid supply system, processing liquid supply method, and storage medium

Abstract

To detect a supply abnormality in a processing liquid supply path.SOLUTION: A processing liquid supply system according to an embodiment of the present disclosure includes a processing liquid supply path, a pump, a pressure gauge, a flow meter, and a control unit. The processing liquid supply path supplies a processing liquid to a substrate processing unit that processes a substrate. The pump is provided in the processing liquid supply path. The pressure gauge and flow meter are provided in the processing liquid supply path downstream of the pump. The control unit controls each component. The control unit also detects a processing liquid supply abnormality on the basis of the measurement value of the pressure gauge and the measurement value of the flow meter.SELECTED DRAWING: Figure 12

Description

[Technical Field]

[0001] The disclosed embodiments relate to a processing liquid supply system, a processing liquid supply method, and a storage medium. [Background technology]

[0002] BACKGROUND ART Conventionally, a substrate processing apparatus has been disclosed in which a processing liquid is circulated in a processing tank for processing a substrate, and various processes are performed on the substrate immersed in the processing tank (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-022707 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique capable of detecting a supply abnormality in a treatment liquid supply path. [Means for solving the problem]

[0005] A processing liquid supply system according to one aspect of the present disclosure includes a processing liquid supply path, a pump, a pressure gauge, a flow meter, and a control unit. The processing liquid supply path supplies a processing liquid to a substrate processing unit that processes substrates. The pump is provided in the processing liquid supply path. The pressure gauge and flow meter are provided in the processing liquid supply path downstream of the pump. The control unit controls each component. The control unit also detects a supply abnormality of the processing liquid based on the measurement value of the pressure gauge and the measurement value of the flow meter. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to detect a supply abnormality in a treatment liquid supply path. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a block diagram showing an example of the configuration of a substrate processing apparatus according to an embodiment. [Figure 2] FIG. 2 is a diagram illustrating an example of the configuration of a liquid processing unit according to an embodiment. [Figure 3] FIG. 3 is a diagram illustrating an example of the configuration of a processing liquid supply system according to an embodiment. [Figure 4] FIG. 4 is a timing chart showing an example of the procedure of the start-up process executed by the substrate processing apparatus according to the embodiment. [Figure 5] FIG. 5 is a timing chart showing an example of the procedure of the detection process executed by the processing liquid supply system according to the embodiment. [Figure 6] FIG. 6 is a timing chart showing an example of the procedure of the detection process executed by the processing liquid supply system according to the embodiment. [Figure 7] FIG. 7 is a diagram showing an example of a monitoring table used in the detection process executed by the processing liquid supply system according to the embodiment. [Figure 8] FIG. 8 is a diagram illustrating an example of the configuration of a processing liquid supply system according to the first modification of the embodiment. [Figure 9] FIG. 9 is a diagram illustrating an example of the configuration of a processing liquid supply system according to the second modification of the embodiment. [Figure 10] FIG. 10 is a block diagram showing an example of the configuration of a liquid processing unit according to the third modification of the embodiment. [Figure 11] FIG. 11 is a diagram illustrating an example of the configuration of a processing liquid supply system according to the third modification of the embodiment. [Figure 12] FIG. 12 is a flowchart showing an example of a procedure of a control process executed by the processing liquid supply system according to the embodiment. [Figure 13] FIG. 13 is a flowchart showing an example of a procedure of a control process executed by the processing liquid supply system according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, with reference to the accompanying drawings, embodiments of a processing liquid supply system, a processing liquid supply method, and a storage medium disclosed herein will be described in detail. Note that the present disclosure is not limited to the embodiments described below. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of elements may differ from reality. Furthermore, the dimensional relationships and ratios may differ between the drawings.

[0009] Conventionally, a substrate processing apparatus has been disclosed in which a processing solution is circulated in a processing tank for processing substrates, and various processes are performed on the substrates immersed in the processing tank. In this technique, for example, flow rate feedback control is performed, in which the output of a pump is controlled based on the flow rate measured by a flow meter. This allows the processing solution to be stably supplied at a desired flow rate to a substrate processing section such as a processing tank.

[0010] On the other hand, if bubbles are generated in the processing liquid supply path that supplies the processing liquid and these bubbles adhere to the flow meter, the measured value of the flow meter may differ from the actual flow rate. In this way, when a processing liquid supply abnormality occurs in the processing liquid supply path, the above-mentioned conventional technology cannot detect this supply abnormality, and therefore there is a risk that control such as flow rate feedback control may not be performed correctly.

[0011] Therefore, it is desired to realize a technology that can overcome the above-mentioned problems and detect supply abnormalities in the processing liquid supply path.

[0012] <Configuration of the substrate processing apparatus> First, the configuration of a substrate processing apparatus 1 including a processing liquid supply system 3 of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a block diagram showing an example of the configuration of a substrate processing apparatus 1 according to an embodiment.

[0013] 1, a substrate processing apparatus 1 according to this embodiment includes a liquid processing unit 2, a processing liquid supply system 3, and a control device 4. The liquid processing unit 2 is an example of a substrate processing section.

[0014] The liquid processing unit 2 processes a substrate such as a semiconductor wafer (hereinafter also referred to as a "wafer") using a processing liquid L (see FIG. 2).

[0015] The treatment liquid L according to the embodiment includes, for example, an aqueous solution of phosphoric acid (H3PO4). In this disclosure, the aqueous solution of phosphoric acid is also simply referred to as "phosphoric acid." The treatment liquid L according to the embodiment may also include a silicate compound. This silicate compound can be added to the aqueous solution of phosphoric acid, for example, by using a solution in which colloidal silicon is dispersed.

[0016] In the present disclosure, the processing liquid L is not limited to one containing phosphoric acid, and various processing liquids for liquid processing of the wafer W can be used.

[0017] The processing liquid supply system 3 supplies the processing liquid L to the liquid processing units 2. An example of the configuration of the processing liquid supply system 3 will be described later.

[0018] Control device 4 controls liquid processing units 2 and processing liquid supply system 3. Control device 4 is, for example, a computer, and includes a control unit 5 and a storage unit 6. Storage unit 6 stores programs for controlling various processes executed in substrate processing apparatus 1. Control unit 5 controls the operations of liquid processing units 2 and processing liquid supply system 3 by reading and executing the programs stored in storage unit 6.

[0019] Such a program may be recorded on a computer-readable storage medium and installed from that storage medium into the storage unit 6 of the control device 4. Examples of computer-readable storage media include hard disks (HDs), flexible disks (FDs), compact disks (CDs), magnetic optical disks (MOs), and memory cards.

[0020] The substrate processing apparatus 1 may include a plurality of liquid processing units 2. In this case, the substrate processing apparatus 1 may include a plurality of processing liquid supply systems 3 corresponding to the plurality of liquid processing units 2, or may include one processing liquid supply system 3 corresponding to the plurality of liquid processing units 2.

[0021] <Configuration of liquid processing unit> Next, a configuration example of the liquid processing unit 2 will be described with reference to Fig. 2. Fig. 2 is a diagram showing an example of the configuration of the liquid processing unit 2 according to this embodiment.

[0022] 2 is a batch-type processing unit that processes a plurality of wafers W (only one wafer is shown in FIG. 2) at once. As shown in FIG. 2, liquid processing unit 2 includes a processing tank 21, a holder 22, and a plurality of (four in this example) discharge units 23. The number of discharge units 23 included in liquid processing unit 2 is not limited to four.

[0023] The processing tank 21 includes an inner tank 21a and an outer tank 21b. The inner tank 21a is a box-shaped tank that is open at the top and stores a processing liquid L therein. A lot formed by a plurality of wafers W is immersed in the inner tank 21a. The outer tank 21b is disposed around the inner tank 21a. The outer tank 21b is also open at the top. The processing liquid L that overflows from the inner tank 21a flows into the outer tank 21b.

[0024] The holding unit 22 holds a plurality of wafers W forming a lot in a vertical position. The holding unit 22 has an elevation mechanism (not shown) that raises and lowers the held lot, and lowers the lot from above the inner bath 21a in the processing bath 21 to immerse it in the inner bath 21a, or raises the lot immersed in the inner bath 21a to remove it from the processing bath 21.

[0025] The plurality of discharge units 23 are disposed inside the inner tank 21 a, specifically near the bottom of the inner tank 21 a. The plurality of discharge units 23 are connected to the processing liquid supply system 3, and discharge the processing liquid L supplied from the processing liquid supply system 3 into the inner tank 21 a.

[0026] Liquid processing unit 2 holds a lot using holder 22 and immerses the held lot in processing liquid L stored in inner bath 21a. In this way, a plurality of wafers W are processed by processing liquid L.

[0027] For example, in the embodiment, of the silicon nitride film and the silicon oxide film formed on the wafer W, the silicon nitride film is selectively etched by the phosphoric acid aqueous solution that is the processing liquid L.

[0028] <Configuration of processing liquid supply system> Next, a configuration example of the processing liquid supply system 3 will be described with reference to Fig. 3. Fig. 3 is a diagram showing an example of the configuration of the processing liquid supply system 3 according to the embodiment.

[0029] 3, the processing liquid supply system 3 includes a processing liquid supply unit 31 and a circulation path 32. The circulation path 32 is an example of a processing liquid supply path. The processing liquid supply unit 31 supplies the processing liquid L to the processing tank 21. The processing liquid supply unit 31 supplies unused processing liquid L to, for example, the inner tank 21a of the processing tank 21.

[0030] The processing liquid supply unit 31 includes a supply source 31a, a supply path 31b, and a flow rate regulator 31c. The supply source 31a is, for example, a tank that stores the processing liquid L. The supply path 31b connects the supply source 31a and the inner bath 21a and supplies the processing liquid L from the supply source 31a to the inner bath 21a. The supply path 31b may also be connected to the outer bath 21b.

[0031] The flow rate regulator 31c is provided in the supply path 31b and regulates the amount of the processing liquid L supplied to the processing tank 21. The flow rate regulator 31c is composed of, for example, an on-off valve, a flow control valve, a flow meter, and the like.

[0032] The circulation path 32 is connected to the liquid processing unit 2 and supplies the processing liquid L to the liquid processing unit 2. The circulation path 32 is a circulation line that causes the processing liquid L to flow out from the processing tank 21 and return to the processing tank 21.

[0033] Specifically, one end of the circulation path 32 is connected to a plurality of locations (two locations in FIG. 3) on the bottom of the outer bath 21b, and the other end of the circulation path 32 is connected to a plurality of discharge parts 23 located inside the inner bath 21a. In the processing liquid supply system 3, the processing liquid L sent from the outer bath 21b to the circulation path 32 passes through the circulation path 32 and is supplied from the discharge parts 23 into the inner bath 21a.

[0034] Furthermore, the processing liquid L supplied from the discharge portion 23 to the inner bath 21a overflows from the inner bath 21a and flows into the outer bath 21b. In this way, the circulation path 32 circulates the processing liquid L between the inner bath 21a and the outer bath 21b.

[0035] The circulation path 32 is provided with a pump 33, a pressure gauge 34, a check valve 35, a heater 36, a filter 37, a branching portion 38, and a flow meter 39 in this order from the upstream side with respect to the treatment tank 21.

[0036] The pump 33 forms a circulating flow of the treatment liquid L that leaves the treatment tank 21, passes through the circulation path 32, and returns to the treatment tank 21. The pump 33 is, for example, a magnetic levitation pump that pumps the treatment liquid L by rotating a rotating part while being magnetically levitated in the treatment liquid L. Note that the pump 33 of the present disclosure is not limited to a magnetic levitation pump, and may be a diaphragm pump or the like.

[0037] On the other hand, by using a magnetic levitation pump for the pump 33, which has a higher liquid transfer capacity than other types, the liquid transfer flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 can be increased.

[0038] The pressure gauge 34 measures the pressure of the processing liquid L flowing through the circulation path 32. The pressure measurement value of the processing liquid L measured by the pressure gauge 34 is output to the control unit 5 (see FIG. 1). The check valve 35 prevents backflow of the processing liquid L flowing through the circulation path 32. The check valve 35 is, for example, an air-operated valve.

[0039] The heater 36 heats the processing liquid L flowing through the circulation path 32. In the embodiment, by heating the processing liquid L with the heater 36, the processing liquid L stored in the processing tank 21 is heated to a processing temperature (for example, about 160°C to 170°C) when processing the wafer W.

[0040] The filter 37 removes contaminants such as particles contained in the processing liquid L flowing through the circulation path 32. The filter 37 may include a plurality of filter modules arranged in parallel.

[0041] The number of filter modules belonging to one filter 37 can be determined taking into consideration the filtering capacity required of the filter 37 and the allowable pressure drop in the filter 37. In the present disclosure, as shown in FIG. 3, the filter 37 is composed of two filter modules arranged in parallel.

[0042] A branch path 41 that is connected to the outer bath 21b of the treatment bath 21 branches off from the branching part 38. The flow meter 39 measures the flow rate of the treatment liquid L flowing through the circulation path 32. The measured value of the flow rate of the treatment liquid L measured by the flow meter 39 is output to the control part 5.

[0043] The branch path 41 is a flow path for sampling the concentration of the treatment liquid L flowing through the circulation path 32. This branch path 41 is provided with a flow meter 42, a concentration meter 43, and a valve 44, in this order from the upstream side with respect to the branch point 38.

[0044] The flow meter 42 measures the flow rate of the treatment liquid L flowing through the branch path 41. The measured value of the flow rate of the treatment liquid L measured by the flow meter 42 is output to the control unit 5.

[0045] The concentration meter 43 measures the concentration of the treatment liquid L flowing through the circulation path 32 by measuring the concentration of the treatment liquid L flowing through the branch path 41. The concentration meter 43 measures, for example, the phosphoric acid concentration of the treatment liquid L flowing through the branch path 41. The measured value of the concentration of the treatment liquid L measured by the concentration meter 43 is output to the control unit 5. The valve 44 controls whether or not the treatment liquid L is supplied from the branch part 38 to the outer bath 21b.

[0046] The processing liquid supply system 3 also includes a thermometer 45. The thermometer 45 measures the temperature of the processing liquid L stored in the processing tank 21, thereby measuring the temperature of the processing liquid L flowing through the circulation path 32. The thermometer 45 measures the temperature of the processing liquid L stored in, for example, the inner tank 21a. The measured value of the temperature of the processing liquid L measured by the thermometer 45 is output to the control unit 5.

[0047] The thermometer 45 of the present disclosure is not limited to measuring the temperature of the processing liquid L stored in the inner tank 21a, but may also measure the temperature of the processing liquid L stored in the outer tank 21b, or the temperature of the processing liquid L flowing through the circulation path 32.

[0048] <Startup process> Next, an overview of the start-up process of the substrate processing apparatus 1 according to the embodiment will be described with reference to Fig. 4. Fig. 4 is a timing chart showing an example of the procedure of the start-up process executed by the substrate processing apparatus 1 according to the embodiment.

[0049] First, from time T01, the control unit 5 (see Figure 1) performs a drainage process to drain all of the used processing liquid L (see Figure 3) from the inner tank 21a (see Figure 3) and the outer tank 21b (see Figure 3) of the processing tank 21 (see Figure 3).

[0050] Next, from time T02 when the drainage process is completed, the control unit 5 performs a storage process to store unused processing liquid L in the inner tank 21a and outer tank 21b of the processing tank 21. Specifically, the control unit 5 first supplies the processing liquid L from the processing liquid supply unit 31 (see FIG. 3) to the inner tank 21a, filling the inner tank 21a with the processing liquid L.

[0051] Next, the control unit 5 supplies the processing liquid L that has overflowed from the inner tank 21a to the outer tank 21b by further supplying the processing liquid L from the processing liquid supply unit 31 to the inner tank 21a. Then, at time T04 when the liquid level of the processing liquid L supplied to the outer tank 21b reaches a given second height, the control unit 5 ends the storage process.

[0052] The control unit 5 performs a circulation process of circulating the processing liquid L through the circulation path 32 (see FIG. 3) from time T03 when the liquid level of the processing liquid L supplied to the outer bath 21b reaches a given first height that is lower than the second height. During this circulation process, from time T05 when the processing liquid L meets the conditions described below, the control unit 5 performs a temperature control process of adjusting the temperature of the processing liquid L to a given processing temperature.

[0053] <Detection process details> Next, the details of the process for detecting abnormalities in the supply of the processing liquid L in the processing liquid supply system 3 according to the embodiment will be described with reference to Figures 5 to 7. Figure 5 is a timing chart showing an example of the procedure of the detection process executed by the processing liquid supply system 3 according to the embodiment.

[0054] As shown in FIG. 5, from the above-mentioned time T03, the control unit 5 (see FIG. 1) operates the pump 33 (see FIG. 3) to pass the processing liquid L (see FIG. 3) through the circulation path 32 (see FIG. 3), thereby performing a circulation process in which the processing liquid L is circulated through the circulation path 32.

[0055] When a magnetic levitation pump is used as the pump 33, there are two types of operation modes for the pump 33: flow rate feedback control (referred to as "flow rate FB control" in the drawings of this disclosure) and rotation speed control.

[0056] In flow rate feedback control, the rotation speed of the rotating part in the pump 33 is automatically controlled so that the flow rate of the processing liquid L measured by the flow meter 39 (see FIG. 3) becomes a designated flow rate.

[0057] For example, in the flow rate feedback control, if the measured flow rate of the processing liquid L is lower than the designated flow rate, the pump 33 increases the rotation speed of the rotating part. On the other hand, in the flow rate feedback control, if the measured flow rate of the processing liquid L is higher than the designated flow rate, the pump 33 decreases the rotation speed of the rotating part.

[0058] In the rotation speed control, the rotation speed of the rotating part in the pump 33 is controlled to be a designated rotation speed.

[0059] In the circulation process according to the embodiment, the control unit 5 operates the pump 33 under flow rate feedback control. Furthermore, in this circulation process, the control unit 5 sets the set flow rate of the treatment liquid L in the circulation path 32 to a given flow rate and operates the pump 33. As a result, the measurement value of the flow meter 39 gradually increases from zero, as shown in FIG.

[0060] Next, in this embodiment, from time T05 after the start of the circulation process, the control unit 5 operates the heater 36 (see FIG. 3) to perform a temperature control process for the processing liquid L. Note that at this time T05, the measurement value of the flow meter 39 reaches the minimum circulation flow rate F L This is the time a given period has elapsed since the time T11 at which the

[0061] In this way, the minimum circulation flow rate F L By allowing a margin for a given period before operating the heater 36, rather than operating the heater 36 immediately after the temperature reaches , the heater 36 can be operated after a sufficient circulation flow rate in the circulation path 32 is secured.

[0062] Therefore, according to the embodiment, it is possible to suppress problems caused by operating the heater 36 when the flow rate in the circulation path 32 is insufficient.

[0063] In this embodiment, from time T12, which is after time T05, a phenomenon occurs in which the measurement value measured by the flow meter 39 remains constant (hereinafter also referred to as a "flow meter hold phenomenon"). This flow meter hold phenomenon occurs due to bubbles generated in the processing liquid L adhering to the flow meter 39, for example.

[0064] In the example of Figure 5, the actual flow rate of the processing liquid L, shown by the dashed line, gradually decreases from time T12, but since the measurement value of the flow meter 39 does not change, the pump 33 performs flow rate feedback control so as not to change the rotation speed of the rotating part.

[0065] Since the rotation speed of the rotating part in the pump 33 does not change, the measurement value of the pressure gauge 34 (see FIG. 3) provided in the circulation path 32 also gradually decreases from time T12.

[0066] In this embodiment, the control unit 5 detects an abnormality in the supply of the treatment liquid L based on the measurement value of the pressure gauge 34 and the measurement value of the flow meter 39. For example, in the example of FIG. 5, if there is no change in the measurement value of the flow meter 39 and the measurement value of the pressure gauge 34 is below a given lower limit pressure P L When the following occurs (time T13 in the example of FIG. 5), the control unit 5 detects an abnormality in the supply of the treatment liquid L.

[0067] This makes it possible to detect abnormalities in the supply of the treatment liquid L even when the flow meter 39 is not outputting an appropriate measurement value due to the adhesion of bubbles or the like.

[0068] In this embodiment, the circulation process and the temperature control process are continued even after time T13 when the abnormality in the supply of the treatment liquid L is detected. As a result, if the flow meter 39 resumes outputting appropriate measurement values ​​after time T13, for example, because the bubbles have disappeared, the circulation process and the temperature control process can be continued as is.

[0069] However, in this embodiment, even at time T14, which is a given period D1 after time T13, there is no change in the measurement value of the flow meter 39 and the measurement value of the pressure meter 34 is below the given lower limit pressure P L The details are as follows.

[0070] In this case, controller 5 determines that flow meter 39 is unlikely to resume outputting valid measured values, and stops operation of pump 33 and heater 36, thereby stopping the circulation process and the temperature adjustment process, thereby preventing damage to processing liquid supply system 3 and liquid processing unit 2 due to an abnormality in the supply of processing liquid L.

[0071] 6 is a timing chart showing an example of the procedure of the detection process executed by the processing liquid supply system 3 according to the embodiment. In the example of FIG. 6, after the start-up process of the substrate processing apparatus 1 (see FIG. 1) is completed, the processing flow rate F S 3 shows a case where the processing liquid L (see FIG. 3) flows through the circulation path 32 (see FIG. 3).

[0072] In this case, the control unit 5 (see FIG. 1) designates the operation mode of the pump 33 (see FIG. 3) to be flow rate feedback control, as shown in FIG. 6, and operates the pump 33. Furthermore, in this flow rate feedback control, the set flow rate of the treatment liquid L in the circulation path 32 is set to the treatment flow rate F S As a result, the control unit 5 controls the liquid processing unit 2 to process a flow rate F S The processing liquid L can be supplied stably.

[0073] 6, the flow meter hold phenomenon occurs at time T21. In this case, the control unit 5 maintains control of the pump 33 by flow rate feedback control from time T21 until a given period D2 (for example, about 5 seconds) has elapsed.

[0074] In this way, by maintaining flow rate feedback control until the period D2 has elapsed, if the flow meter 39 resumes outputting valid measurement values ​​after time T21, for example, due to the bubbles being eliminated, the processing liquid L can continue to be delivered from the processing liquid supply system 3.

[0075] In the example of FIG. 6, the flow meter hold phenomenon is resolved at time T22 before the given period D2 has elapsed since time T21, so the control unit 5 continues to maintain the set flow rate at the processing flow rate F S The pump 33 continues to operate by the flow rate feedback control specified in .

[0076] 6, the flow meter hold phenomenon occurs again at time T23, which is after time T22. In this case, as in the above, the control unit 5 maintains control of the pump 33 using flow rate feedback control from time T23 until a given period D2 has elapsed.

[0077] 6, the flow meter hold phenomenon continues even at time T24, which is a given period D2 after time T23. In this case, the control unit 5 detects an abnormality in the supply of the treatment liquid L.

[0078] This makes it possible to detect abnormalities in the supply of the treatment liquid L even when the flow meter 39 is not outputting an appropriate measurement value due to the adhesion of bubbles or the like.

[0079] Then, as shown in FIG. 6, at time T24 when the control unit 5 detects the abnormality in the supply of the treatment liquid L, the control unit 5 switches the operation mode of the pump 33 from flow rate feedback control to rotation speed control.

[0080] In this case, the control unit 5 controls the pump 33 to process the flow rate F S The rotation speed R1 at which the liquid can be delivered is calculated from the following formula (1), and the pump 33 is operated at this rotation speed R1. R1(rpm)=F S (L / min) × B (1)

[0081] The parameter B included in the formula (1) is the rotation speed (rpm / L) of the pump 33 for delivering 1 L of liquid per minute, and is a value that is individually determined based on the liquid delivery capacity of the pump 33.

[0082] In this way, by switching the operation mode of the pump 33 to the rotational speed control, the processing flow rate F S The processing liquid L can be circulated at a flow rate close to .

[0083] Therefore, according to the embodiment, even if the flow meter 39 is not outputting an appropriate measurement value due to the adhesion of bubbles or the like, it is possible to continue to send the treatment liquid L.

[0084] 6, the flow meter hold phenomenon is resolved at time T25, which is after time T24. In this case, the control unit 5 switches the operation mode of the pump 33 from rotation speed control to flow rate feedback control at time T25 when the flow meter hold phenomenon is resolved. In this flow rate feedback control, the set flow rate of the treatment liquid L in the circulation path 32 is set to the treatment flow rate F S is set to.

[0085] As a result, when the flow meter 39 is operating normally, the flow rate of the processing liquid L in the circulation path 32 is measured as a processing flow rate F S can be maintained with good accuracy.

[0086] 7 is a diagram showing an example of a monitoring table used in the detection process executed by the processing liquid supply system 3 according to the embodiment. In the embodiment, the storage unit 6 (see FIG. 1) stores a monitoring table as shown in FIG. 7 in which pressure threshold values ​​corresponding to the temperatures of the processing liquid L are set.

[0087] Then, the control unit 5 (see Figure 1) detects an abnormality in the supply of the processing liquid L when the measurement value of the pressure gauge 34 exceeds the pressure threshold value corresponding to the temperature of the processing liquid L set in the monitoring table stored in the memory unit 6.

[0088] 7, when the temperature of the processing liquid L is lower than the temperature A1, the pressure threshold is pressure P7. When the measurement value of the thermometer 45 is lower than the temperature A1 and the measurement value of the pressure gauge 34 exceeds the pressure P7, the control unit 5 detects an abnormality in the supply of the processing liquid L and immediately stops the operation of the pump 33 and the heater 36.

[0089] This can prevent the processing liquid supply system 3 and the liquid processing units 2 from being damaged due to abnormalities in the supply of the processing liquid L.

[0090] 7, when the temperature of the processing liquid L is equal to or higher than temperature A1 and lower than temperature A2, the pressure threshold is pressure P6. When the measurement value of the thermometer 45 is equal to or higher than temperature A1 and lower than temperature A2, and the measurement value of the pressure gauge 34 exceeds pressure P6, the control unit 5 detects an abnormality in the supply of the processing liquid L and immediately stops the operation of the pump 33 and the heater 36.

[0091] This can prevent the processing liquid supply system 3 and the liquid processing units 2 from being damaged due to abnormalities in the supply of the processing liquid L.

[0092] 7, when the temperature of the processing liquid L is equal to or higher than temperature A2 and lower than temperature A3, the pressure threshold is pressure P5. When the measurement value of the thermometer 45 is equal to or higher than temperature A2 and lower than temperature A3, and the measurement value of the pressure gauge 34 exceeds pressure P5, the control unit 5 detects an abnormality in the supply of the processing liquid L and immediately stops the operation of the pump 33 and the heater 36.

[0093] This can prevent the processing liquid supply system 3 and the liquid processing units 2 from being damaged due to abnormalities in the supply of the processing liquid L.

[0094] 7, when the temperature of the processing liquid L is equal to or higher than temperature A3 and lower than temperature A4, the pressure threshold is pressure P4. When the measurement value of the thermometer 45 is equal to or higher than temperature A3 and lower than temperature A4, and the measurement value of the pressure gauge 34 exceeds pressure P4, the control unit 5 detects an abnormality in the supply of the processing liquid L and immediately stops the operation of the pump 33 and the heater 36.

[0095] This can prevent the processing liquid supply system 3 and the liquid processing units 2 from being damaged due to abnormalities in the supply of the processing liquid L.

[0096] 7, when the temperature of the processing liquid L is equal to or higher than temperature A4 and lower than temperature A5, the pressure threshold is pressure P3. When the measurement value of the thermometer 45 is equal to or higher than temperature A4 and lower than temperature A5, and the measurement value of the pressure gauge 34 exceeds pressure P3, the control unit 5 detects an abnormality in the supply of the processing liquid L and immediately stops the operation of the pump 33 and the heater 36.

[0097] This can prevent the processing liquid supply system 3 and the liquid processing units 2 from being damaged due to abnormalities in the supply of the processing liquid L.

[0098] 7, when the temperature of the processing liquid L is equal to or higher than temperature A5 and lower than temperature A6, the pressure threshold is pressure P2. When the measurement value of the thermometer 45 is equal to or higher than temperature A5 and lower than temperature A6 and the measurement value of the pressure gauge 34 exceeds pressure P2, the control unit 5 detects an abnormality in the supply of the processing liquid L and immediately stops the operation of the pump 33 and the heater 36.

[0099] This can prevent the processing liquid supply system 3 and the liquid processing units 2 from being damaged due to abnormalities in the supply of the processing liquid L.

[0100] 7, when the temperature of the processing liquid L is equal to or higher than temperature A6, the pressure threshold is pressure P1. When the measurement value of the thermometer 45 is equal to or higher than temperature A6 and the measurement value of the pressure gauge 34 exceeds pressure P1, the control unit 5 detects an abnormality in the supply of the processing liquid L and immediately stops the operation of the pump 33 and the heater 36.

[0101] This can prevent the processing liquid supply system 3 and the liquid processing units 2 from being damaged due to abnormalities in the supply of the processing liquid L.

[0102] Furthermore, in the monitoring table according to the embodiment, it is preferable that the pressure threshold value corresponding to the temperature of the processing liquid L gradually decreases as the temperature of the processing liquid L increases. Although the pressure resistance performance of the circulation path 32 gradually decreases as the temperature of the processing liquid L increases, by setting the monitoring table as described above, damage to the processing liquid supply system 3 and the liquid processing unit 2 can be prevented over any temperature range.

[0103] In the example of Figure 7, an example is shown in which the pressure threshold changes stepwise in the range of temperatures A1 to A6, but the present disclosure is not limited to such an example, and the pressure threshold may change linearly, or the pressure threshold may change in a curved manner such as a quadratic curve.

[0104] <Various modified examples> Next, a processing liquid supply system 3 according to various modified examples of the embodiment will be described with reference to Figures 8 to 11. Figure 8 is a diagram showing an example of the configuration of the processing liquid supply system 3 according to Modification 1 of the embodiment.

[0105] Modification 1 shown in Fig. 8 differs from the above-described embodiment in the configuration of the circulation path 32. Specifically, in this modification 1, a plurality of circulation paths 32 (two in the example of Fig. 8) are provided for one treatment tank 21. This makes it possible to increase the flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 compared to when one circulation path 32 is provided for one treatment tank 21.

[0106] Circulation path 32 according to Modification 1 includes circulation paths 32A and 32B. Circulation paths 32A and 32B are examples of processing liquid supply paths. Circulation paths 32A and 32B are each connected to liquid processing units 2 and supply processing liquid L to liquid processing units 2. Circulation paths 32A and 32B are each circulation lines that allow processing liquid L to flow out of processing tank 21 and return it to processing tank 21.

[0107] Specifically, one end of each of the circulation paths 32A and 32B is connected to the bottom of the outer tank 21b, and the other end of each of the circulation paths 32A and 32B is connected to a plurality of discharge ports 23 located inside the inner tank 21a.

[0108] In the processing liquid supply system 3, the processing liquid L sent from the outer bath 21b to the circulation paths 32A and 32B passes through the circulation paths 32A and 32B and is supplied from the discharge part 23 into the inner bath 21a.

[0109] Furthermore, the processing liquid L supplied from the discharge portion 23 to the inner tank 21a overflows from the inner tank 21a and flows into the outer tank 21b. In this manner, the circulation paths 32A and 32B circulate the processing liquid L between the inner tank 21a and the outer tank 21b.

[0110] In circulation path 32A, with treatment tank 21 as the reference, a pump 33A, a pressure gauge 34A, a check valve 35A, a heater 36A, a filter 37A, and a flow meter 39A are provided in this order from the upstream side.

[0111] The pump 33A forms a circulating flow of the treatment liquid L that leaves the treatment tank 21, passes through the circulation path 32A, and returns to the treatment tank 21. The pump 33A is, for example, a magnetic levitation pump. Note that the pump 33A of the present disclosure is not limited to a magnetic levitation pump, and may be a diaphragm pump or the like.

[0112] The pressure gauge 34A measures the pressure of the processing liquid L flowing through the circulation path 32A. The pressure measurement value of the processing liquid L measured by the pressure gauge 34A is output to the control unit 5 (see FIG. 1). The check valve 35A prevents backflow of the processing liquid L flowing through the circulation path 32A. The check valve 35A is, for example, an air-operated valve.

[0113] The heater 36A heats the processing liquid L flowing through the circulation path 32A. In the first modification, the processing liquid L stored in the processing tank 21 is heated to a processing temperature for processing the wafer W by heating the processing liquid L with the heater 36A.

[0114] The filter 37A removes contaminants such as particles contained in the processing liquid L flowing through the circulation path 32A. The filter 37A may include a plurality of filter modules arranged in parallel.

[0115] The flow meter 39A measures the flow rate of the processing liquid L flowing through the circulation path 32A. The measured value of the flow rate of the processing liquid L measured by the flow meter 39A is output to the control unit 5.

[0116] In circulation path 32B, with treatment tank 21 as the reference, a pump 33B, a pressure gauge 34B, a check valve 35B, a heater 36B, a filter 37B, a branching portion 38, and a flow meter 39B are provided in this order from the upstream side.

[0117] The pump 33B forms a circulating flow of the treatment liquid L that leaves the treatment tank 21, passes through the circulation path 32B, and returns to the treatment tank 21. The pump 33B is, for example, a magnetic levitation pump that delivers the treatment liquid L by rotating a rotating part while magnetically levitating in the treatment liquid L. Note that the pump 33B of the present disclosure is not limited to a magnetic levitation pump, and may be a diaphragm pump or the like.

[0118] The pressure gauge 34B measures the pressure of the processing liquid L flowing through the circulation path 32B. The pressure measurement value of the processing liquid L measured by the pressure gauge 34B is output to the control unit 5. The check valve 35B prevents backflow of the processing liquid L flowing through the circulation path 32B. The check valve 35B is, for example, an air-operated valve.

[0119] The heater 36B heats the processing liquid L flowing through the circulation path 32B. In the first modification, the processing liquid L stored in the processing tank 21 is heated to a processing temperature for processing the wafer W by heating the processing liquid L with the heater 36B.

[0120] The filter 37B removes contaminants such as particles contained in the processing liquid L flowing through the circulation path 32B. The filter 37B may include a plurality of filter modules arranged in parallel.

[0121] A branch path 41 that is connected to the outer bath 21b of the treatment bath 21 branches off from the branching portion 38. The flow meter 39B measures the flow rate of the treatment liquid L flowing through the circulation path 32B. The measured value of the flow rate of the treatment liquid L measured by the flow meter 39B is output to the control unit 5.

[0122] The branch path 41 is a flow path for sampling the concentration of the treatment liquid L flowing through the circulation path 32B. A flow meter 42, a concentration meter 43, and a valve 44 are provided in this branch path 41, in this order from the upstream side with respect to the branch point 38.

[0123] The flow meter 42 measures the flow rate of the treatment liquid L flowing through the branch path 41. The measured value of the flow rate of the treatment liquid L measured by the flow meter 42 is output to the control unit 5.

[0124] The concentration meter 43 measures the concentration of the treatment liquid L flowing through the circulation path 32 by measuring the concentration of the treatment liquid L flowing through the branch path 41. The concentration meter 43 measures, for example, the phosphoric acid concentration of the treatment liquid L flowing through the branch path 41. The measured value of the concentration of the treatment liquid L measured by the concentration meter 43 is output to the control unit 5. The valve 44 controls whether or not the treatment liquid L is supplied from the branch part 38 to the outer bath 21b.

[0125] In the processing liquid supply system 3 of the first modification described above, it is also possible to detect supply abnormalities in the circulation paths 32A and 32B by performing the same detection process as in the above-described embodiment.

[0126] In the example of Figure 8 described so far, an example has been shown in which the circulation path 32 includes two circulation paths 32A and 32B, but the present disclosure is not limited to such an example, and the circulation path 32 may be configured to include three or more circulation paths.

[0127] 9 is a diagram showing an example of the configuration of a processing liquid supply system 3 according to Modification 2 of the embodiment. Modification 2 shown in FIG. 9 differs from the above-described embodiment and Modification 1 in the configuration of the circulation path 32.

[0128] Specifically, in this modified example 2, one circulation path 32 branches at a branch point 50 midway to form a plurality of (two in the figure) branch circulation paths 32a, 32b. The branch circulation paths 32a, 32b are an example of a processing liquid supply path.

[0129] This allows the flow rate of the treatment liquid L returned from the circulation path 32 to the treatment tank 21 to be increased compared to when one circulation path 32 is provided from the most upstream to the most downstream for one treatment tank 21.

[0130] The circulation path 32 is provided with, in this order from the upstream side with respect to the treatment tank 21, a pump 33, a pressure gauge 34, a check valve 35, and a branching section 50. The circulation path 32 branches into branch circulation paths 32a and 32b at the branching section 50.

[0131] The pump 33 forms a circulation flow of the treatment liquid L that leaves the treatment tank 21, passes through the circulation path 32 and the branch circulation paths 32a and 32b, and returns to the treatment tank 21. The pump 33 is, for example, a magnetic levitation pump. Note that the pump 33 of the present disclosure is not limited to a magnetic levitation pump, and may be a diaphragm pump or the like.

[0132] The pressure gauge 34 measures the pressure of the processing liquid L flowing through the circulation path 32. The pressure measurement value of the processing liquid L measured by the pressure gauge 34 is output to the control unit 5 (see FIG. 1). The check valve 35 prevents backflow of the processing liquid L flowing through the circulation path 32. The check valve 35 is, for example, an air-operated valve.

[0133] In this way, by arranging the pump 33 upstream of the branching portion 50, the processing liquid L can be sent to the plurality of branch circulation paths 32a, 32b without increasing the number of pumps 33. Therefore, according to the second modification, the manufacturing cost of the processing liquid supply system 3 can be reduced.

[0134] In the branch circulation path 32a, a heater 36A, a filter 37A, and a flow meter 39A are provided in this order from the upstream side with respect to the branch portion 50.

[0135] The heater 36A heats the processing liquid L flowing through the branch circulation path 32a. In the second modification, the processing liquid L stored in the processing tank 21 is heated to a processing temperature for processing the wafer W by heating the processing liquid L with the heater 36A.

[0136] The filter 37A removes contaminants such as particles contained in the processing liquid L flowing through the branch circulation path 32a. The filter 37A may include a plurality of filter modules arranged in parallel.

[0137] The flow meter 39A measures the flow rate of the treatment liquid L flowing through the branch circulation path 32a. The measured value of the flow rate of the treatment liquid L measured by the flow meter 39A is output to the control unit 5.

[0138] In the branch circulation path 32b, a heater 36B, a filter 37B, a branch portion 38, and a flow meter 39B are provided in this order from the upstream side with respect to the branch portion 50.

[0139] The heater 36B heats the processing liquid L flowing through the branch circulation path 32b. In the second modification, the processing liquid L stored in the processing tank 21 is heated to a processing temperature for processing the wafer W by heating the processing liquid L with the heater 36B.

[0140] The filter 37B removes contaminants such as particles contained in the processing liquid L flowing through the branch circulation path 32b. The filter 37B may include a plurality of filter modules arranged in parallel.

[0141] A branch path 41 that is connected to the outer tank 21b of the processing tank 21 branches off from the branch portion 38. The flow meter 39B measures the flow rate of the processing liquid L that flows through the branch circulation path 32b. The measured value of the flow rate of the processing liquid L measured by the flow meter 39B is output to the control unit 5.

[0142] The branch path 41 is a flow path for sampling the concentration of the treatment liquid L flowing through the branch circulation path 32b. A flow meter 42, a concentration meter 43, and a valve 44 are provided in this branch path 41, in this order from the upstream side with respect to the branch point 38.

[0143] The flow meter 42 measures the flow rate of the treatment liquid L flowing through the branch path 41. The measured value of the flow rate of the treatment liquid L measured by the flow meter 42 is output to the control unit 5.

[0144] The concentration meter 43 measures the concentration of the treatment liquid L flowing through the circulation path 32 by measuring the concentration of the treatment liquid L flowing through the branch path 41. The concentration meter 43 measures, for example, the phosphoric acid concentration of the treatment liquid L flowing through the branch path 41. The measured value of the concentration of the treatment liquid L measured by the concentration meter 43 is output to the control unit 5. The valve 44 controls whether or not the treatment liquid L is supplied from the branch part 38 to the outer bath 21b.

[0145] In the processing liquid supply system 3 of the second modified example described above, it is also possible to detect supply abnormalities in the circulation path 32 and the branch circulation paths 32a and 32b by performing the same detection process as in the above-described embodiment.

[0146] In the example of Figure 9 described so far, an example is shown in which the circulation path 32 branches into two branch circulation paths 32a and 32b along the way, but the present disclosure is not limited to such an example, and the circulation path 32 may branch into three or more branch circulation paths along the way.

[0147] 10 is a block diagram showing an example of the configuration of a liquid processing unit 2 according to Modification 3 of the embodiment. As shown in Fig. 10, the liquid processing unit 2 according to Modification 3 is a single-wafer processing unit that processes wafers W one by one.

[0148] Liquid processing unit 2 according to Modification 3 has housing 110 whose interior can be sealed. A loading / unloading opening (not shown) for loading / unloading wafer W is formed on the side of housing 110, and an opening / closing shutter (not shown) is provided at this loading / unloading opening.

[0149] A spin chuck 120 that holds and rotates the wafer W is provided in the center of the housing 110. The spin chuck 120 has a horizontal upper surface, and this upper surface is provided with, for example, a suction port (not shown) that sucks the wafer W. The wafer W can be sucked and held on the spin chuck 120 by suction from this suction port.

[0150] The spin chuck 120 is configured to be rotatable at a desired speed by a chuck driver 121 such as a motor. The chuck driver 121 is provided with a lifting / lowering mechanism such as a cylinder (not shown), and the spin chuck 120 is configured to be able to move up and down by the lifting / lowering mechanism.

[0151] A cup 122 is provided around the spin chuck 120 to receive and collect the processing liquid L (see FIG. 3) that splashes or drops from the wafer W. A discharge pipe 123 for discharging the collected processing liquid L and an exhaust pipe 124 for exhausting the atmosphere inside the cup 122 are connected to the bottom of the cup 122.

[0152] A discharge nozzle 131 is provided at the upper part of the housing 110. The discharge nozzle 131 is configured to be movable from a waiting section 132 provided outside the upper part of the cup 122 to above the center of the wafer W positioned in the cup 122. The discharge nozzle 131 is connected to a processing liquid supply system 3, and discharges the processing liquid L supplied from the processing liquid supply system 3 onto the wafer W.

[0153] As in the embodiment, the liquid processing unit 2 and the processing liquid supply system 3 according to the third modification are controlled by a control device 4. The control device 4 is, for example, a computer, and includes a control unit 5 and a storage unit 6.

[0154] 11 is a diagram showing an example of the configuration of a processing liquid supply system 3 according to Modification 3 of the embodiment. As shown in FIG. 11, the processing liquid supply system 3 according to Modification 3 includes a processing liquid supply source 101 and a processing liquid supply path 102.

[0155] The processing liquid supply source 101 is, for example, a tank that stores a processing liquid L (see FIG. 3). The processing liquid supply path 102 connects the processing liquid supply source 101 and the discharge nozzle 131, and supplies the processing liquid L from the processing liquid supply source 101 to the discharge nozzle 131.

[0156] The processing liquid supply path 102 is provided with a valve 103, a pump 104, a pressure gauge 105, a heater 106, a filter 107, a flow meter 108, and a thermometer 109 in this order from the upstream side with respect to the processing liquid supply source 101.

[0157] The valve 103 controls whether or not the processing liquid L is supplied from the processing liquid supply source 101 to the discharge nozzle 131. The pump 104 forms a flow of the processing liquid L that comes out of the processing liquid supply source 101, passes through the processing liquid supply path 102, and reaches the discharge nozzle 131.

[0158] The pump 104 is, for example, a magnetic levitation pump that pumps the treatment liquid L by rotating a rotating part while being magnetically levitated in the treatment liquid L. Note that the pump 104 of the present disclosure is not limited to a magnetic levitation pump, and may be a diaphragm pump or the like.

[0159] On the other hand, by using a magnetic levitation pump for the pump 104, which has a higher liquid delivery capacity than other types, the flow rate of the treatment liquid L delivered from the treatment liquid supply channel 102 to the discharge nozzle 131 can be increased.

[0160] The pressure gauge 105 measures the pressure of the processing liquid L flowing through the processing liquid supply path 102. The pressure measurement value of the processing liquid L measured by the pressure gauge 105 is output to the control unit 5 (see FIG. 10).

[0161] The heater 106 heats the processing liquid L flowing through the processing liquid supply path 102. In the third modification, the processing liquid L is heated by the heater 106, so that the processing liquid L sent to the discharge nozzle 131 is heated to a processing temperature for processing the wafer W.

[0162] The filter 107 removes contaminants such as particles contained in the processing liquid L flowing through the processing liquid supply path 102. The filter 107 may include a plurality of filter modules arranged in parallel.

[0163] The flow meter 108 measures the flow rate of the processing liquid L flowing through the processing liquid supply path 102. The measured value of the flow rate of the processing liquid L measured by the flow meter 108 is output to the control unit 5. The thermometer 109 measures the temperature of the processing liquid L flowing through the processing liquid supply path 102. The measured value of the temperature of the processing liquid L measured by the thermometer 109 is output to the control unit 5.

[0164] In the processing liquid supply system 3 of the third modified example described above, a supply abnormality in the processing liquid supply path 102 can also be detected by performing the same detection process as in the above-described embodiment.

[0165] The processing liquid supply system 3 according to the embodiment includes a processing liquid supply path (circulation path 32, processing liquid supply path 102), a pump 33 (104), a pressure gauge 34 (105), a flow meter 39 (108), and a control unit 5. The processing liquid supply path (circulation path 32, processing liquid supply path 102) supplies the processing liquid L to a substrate processing unit (liquid processing unit 2) that processes a substrate (wafer W). The pump 33 (104) is provided in the processing liquid supply path (circulation path 32, processing liquid supply path 102). The pressure gauge 34 (105) and the flow meter 39 (108) are provided downstream of the pump 33 (104) in the processing liquid supply path (circulation path 32, processing liquid supply path 102). The control unit 5 controls each component. The control unit 5 also detects abnormalities in the supply of the processing liquid L based on the measured values ​​of the pressure gauge 34 (105) and the flow meter 39 (108). This makes it possible to detect abnormalities in the supply of the treatment liquid L.

[0166] In the processing liquid supply system 3 according to the embodiment, the control unit 5 determines whether the measured value of the flow meter 39 (108) is unchanged and whether the measured value of the pressure gauge 34 (105) is equal to or lower than the given lower limit pressure P L When the following occurs, a supply abnormality in the treatment liquid L is detected. This makes it possible to detect a supply abnormality in the treatment liquid L even when the flow meter 39 is not outputting an appropriate measurement value due to the adhesion of bubbles or the like.

[0167] Furthermore, in the treatment liquid supply system 3 according to the embodiment, the pump 33 (104) is a magnetic levitation pump that feeds the treatment liquid L by rotating while magnetically levitating a rotating part in the treatment liquid L. The control unit 5 feeds the treatment liquid L while controlling the rotation speed of the rotating part based on the measurement value of the flow meter 39 (108). This makes it possible to increase the flow rate of the treatment liquid L supplied to the liquid treatment unit 2.

[0168] Furthermore, in the processing liquid supply system 3 according to the embodiment, when there is no change in the measurement value of the flow meter 39 (108) during a given period D2, the control unit 5 detects an abnormality in the supply of the processing liquid L. This makes it possible to detect an abnormality in the supply of the processing liquid L even when the flow meter 39 is not outputting an appropriate measurement value due to the adhesion of bubbles or the like.

[0169] Furthermore, in the processing liquid supply system 3 according to the embodiment, the pump 33 (104) is a magnetic levitation pump that feeds the processing liquid L by rotating while magnetically levitating a rotating part in the processing liquid L. Furthermore, if there is no change in the measurement value of the flow meter 39 (108) during a given period D2, the control unit 5 fixes the rotation speed of the rotating part to a given rotation speed R1 and feeds the processing liquid L. This allows the processing flow rate F to be controlled even in the event of a flow meter hold phenomenon in which appropriate flow rate feedback control is not possible. S The processing liquid L can be supplied to the liquid processing unit 2 at a flow rate close to .

[0170] The processing liquid supply system 3 according to the embodiment includes a processing liquid supply path (circulation path 32, processing liquid supply path 102), a pump 33 (104), a heater 36 (106), a pressure gauge 34 (105), a thermometer 45 (109), and a control unit 5. The processing liquid supply path (circulation path 32, processing liquid supply path 102) supplies a processing liquid L to a substrate processing unit (liquid processing unit 2) that processes a substrate (wafer W). The pump 33 (104) is provided in the processing liquid supply path (circulation path 32, processing liquid supply path 102). The heater 36 (106) and the pressure gauge 34 (105) are provided downstream of the pump 33 (104) in the processing liquid supply path (circulation path 32, processing liquid supply path 102). The thermometer 45 (109) measures the temperature of the processing liquid L flowing through the processing liquid supply path (circulation path 32, processing liquid supply path 102). The control unit 5 controls each unit. The control unit 5 also detects abnormalities in the supply of the treatment liquid L based on the measurement value of the pressure gauge 34 (105) and the measurement value of the thermometer 45 (109). This makes it possible to detect abnormalities in the supply of the treatment liquid L.

[0171] The processing liquid supply system 3 according to the embodiment further includes a storage unit 6 that stores a monitoring table in which pressure thresholds corresponding to the temperatures of the processing liquid L are set. Furthermore, the control unit 5 detects a supply abnormality in the processing liquid L when the measurement value of the pressure gauge 34 (105) exceeds the pressure threshold corresponding to the temperature of the processing liquid L set in the monitoring table. This makes it possible to prevent damage to the processing liquid supply system 3 and the liquid processing unit 2 due to a supply abnormality in the processing liquid L.

[0172] The processing liquid supply system 3 according to the embodiment further includes a flow meter 39 (108) provided downstream of the pump 33 (105) in the processing liquid supply path (circulation path 32, processing liquid supply path 102). The pump 33 (104) is a magnetic levitation pump that delivers the processing liquid L by rotating while magnetically levitating a rotor in the processing liquid L. The control unit 5 delivers the processing liquid L while controlling the rotation speed of the rotor based on the measurement value of the flow meter 39 (108). This allows the flow rate of the processing liquid L supplied to the liquid processing unit 2 to be increased.

[0173] Furthermore, in the processing liquid supply system 3 according to the embodiment, when the control unit 5 detects a supply abnormality in the processing liquid L, it stops the rotation speed of the rotating part of the pump 33 (104) to stop the delivery of the processing liquid L. This makes it possible to prevent damage to the processing liquid supply system 3 and the liquid processing unit 2 due to the supply abnormality in the processing liquid L.

[0174] <Control processing procedure> Next, the procedure of the control process according to the embodiment will be described with reference to Figures 12 and 13. Figure 12 is a flowchart showing an example of the procedure of the control process executed by the processing liquid supply system 3 according to the embodiment.

[0175] In the control process according to the example of FIG. 12, first, the control unit 5 operates the pump 33 to cause the processing liquid L to flow through the circulation path 32, thereby supplying the processing liquid L to the liquid processing unit 2 (step S101).

[0176] Next, the control unit 5 determines whether there is any fluctuation in the measurement value of the flow meter 39 (step S102). For example, if the measurement value of the flow meter 39 is the same as the previous measurement value, the control unit 5 can determine that there is no fluctuation in the measurement value of the flow meter 39.

[0177] If it is determined that there is no fluctuation in the measurement value of the flow meter 39 (Yes in step S102), the control unit 5 determines whether the measurement value of the pressure meter 34 is equal to or lower than the lower limit pressure P L It is determined whether or not it is equal to or less (step S103).

[0178] Then, the measurement value of the pressure gauge 34 reaches the lower limit pressure P L If it is determined that the difference is equal to or less than the above (Yes at step S103), the control unit 5 detects an abnormality in the supply of the treatment liquid L in the circulation path 32 (step S104).

[0179] On the other hand, the measurement value of the pressure gauge 34 is the lower limit pressure P LIf it is determined that the value is not less than the above (step S103, No), the process returns to step S101. Also, if it is determined in step S102 that there is a fluctuation in the measurement value of the flow meter 39 (step S102, No), the process returns to step S101.

[0180] Following the process of step S104, the control unit 5 determines whether the measurement value of the pressure gauge 34 is lower than the lower limit pressure P L It is determined whether the following state continues for a given period D1 (step S105).

[0181] Then, the measurement value of the pressure gauge 34 reaches the lower limit pressure P L If it is determined that the following state continues for a given period D1 (step S105, Yes), the control unit 5 stops the supply process and temperature adjustment process of the treatment liquid L (step S106) and ends the series of detection processes.

[0182] On the other hand, the measurement value of the pressure gauge 34 is the lower limit pressure P L If it is determined that the following state has not continued for the given period D1 (step S105, No), the process returns to step S102.

[0183] FIG. 13 is a flowchart showing an example of the procedure of the control process executed by the processing liquid supply system 3 according to the embodiment.

[0184] In the control process according to the example of FIG. 13, first, the control unit 5 operates the pump 33 under flow rate feedback control to supply the processing liquid L to the liquid processing unit 2 (step S201).

[0185] Next, the control unit 5 determines whether there is any fluctuation in the measurement value of the flow meter 39 (step S202). For example, if the measurement value of the flow meter 39 is the same as the previous measurement value, the control unit 5 can determine that there is no fluctuation in the measurement value of the flow meter 39.

[0186] Then, if it is determined that there is no fluctuation in the measurement value of the flow meter 39 (step S202, Yes), the control unit 5 determines whether the state in which there is no fluctuation in the measurement value of the flow meter 39 continues for a given period D2 (step S203).

[0187] If it is determined that the state in which the measurement value of the flow meter 39 does not fluctuate continues for a given period D2 (step S203, Yes), the control unit 5 detects an abnormality in the supply of the treatment liquid L in the circulation path 32 (step S204). Furthermore, the control unit 5 switches the operation mode of the pump 33 from flow rate feedback control to rotation speed control (step S205).

[0188] On the other hand, if it is determined that the state in which the measurement value of the flow meter 39 does not fluctuate has not continued for the given period D2 (step S203, No), the process returns to step S202.

[0189] Furthermore, in the process of step S202, if it is determined that there is a fluctuation in the measurement value of the flow meter 39 (step S202, No), the process returns to the process of step S201.

[0190] Following the process of step S205, the control unit 5 determines whether or not there is a fluctuation in the measurement value of the flow meter 39 (step S206). If it is determined that there is a fluctuation in the measurement value of the flow meter 39 (step S206, Yes), the control unit 5 switches the operation mode of the pump 33 from rotation speed control to flow rate feedback control (step S207), and ends the series of detection processes.

[0191] On the other hand, if it is determined that there is no fluctuation in the measurement value of the flow meter 39 (No in step S206), the process of step S206 continues.

[0192] The processing liquid supply method according to the embodiment includes a detection step (step S104) of detecting a supply abnormality of the processing liquid L based on a measurement value of the pressure gauge 34 (105) and a measurement value of the flow meter 39 (108) in the processing liquid supply system 3. The processing liquid supply system 3 includes a processing liquid supply path (circulation path 32, processing liquid supply path 102), a pump 33 (104), the pressure gauge 34 (105), and the flow meter 39 (108). The processing liquid supply path (circulation path 32, processing liquid supply path 102) supplies the processing liquid L to a substrate processing section (liquid processing unit 2) that processes a substrate (wafer W). The pump 33 (104) is provided in the processing liquid supply path (circulation path 32, processing liquid supply path 102). The pressure gauge 34 (105) and the flow meter 39 (108) are provided downstream of the pump 33 (104) in the treatment liquid supply path (circulation path 32, treatment liquid supply path 102). This makes it possible to detect abnormalities in the supply of the treatment liquid L.

[0193] Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present disclosure.

[0194] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0195] 2. Liquid processing unit (an example of a substrate processing unit) 3 Processing liquid supply system 5. Control section 6 Memory section 32, 32A, 32B Circulation path (an example of a processing liquid supply path) 32a, 32b Branch circulation path (an example of a processing liquid supply path) 33, 33A, 33B pumps 34, 34A, 34B pressure gauges 36, 36A, 36B heaters 39, 39A, 39B flowmeter 45 Thermometer 102 Processing liquid supply path 104 Pump 105 Pressure Gauge 106 Heater 108 Flow meter 109 Thermometer D1, D2 period L processing liquid P L Lower Pressure Limit R1 rotation speed W wafer (an example of a substrate)

Claims

1. a processing liquid supply path that supplies a processing liquid to a substrate processing section that processes substrates; a pump provided in the processing liquid supply path; a pressure meter and a flow meter provided in the treatment liquid supply path downstream of the pump; a control unit that controls each unit; Equipped with The control unit detects an abnormality in the supply of the treatment liquid based on the measurement values ​​of the pressure gauge and the flow meter. Processing liquid supply system.

2. The control unit detects an abnormality in the supply of the processing liquid when there is no change in the measurement value of the flow meter and the measurement value of the pressure meter is equal to or lower than a given lower limit pressure. The processing liquid supply system according to claim 1 .

3. the pump is a magnetic levitation pump that pumps the treatment liquid by rotating a rotating part while being magnetically levitated in the treatment liquid, The control unit controls the rotation speed of the rotating unit based on the measurement value of the flow meter to feed the treatment liquid. The processing liquid supply system according to claim 2 .

4. The control unit detects an abnormality in the supply of the treatment liquid when there is no change in the measurement value of the flow meter for a given period of time. The processing liquid supply system according to claim 2 .

5. the pump is a magnetic levitation pump that pumps the treatment liquid by rotating a rotating part while being magnetically levitated in the treatment liquid, When the measured value of the flow meter does not change during the given period, the control unit fixes the rotation speed of the rotating unit to a given rotation speed and sends the treatment liquid. The processing liquid supply system according to claim 4 .

6. a processing liquid supply path that supplies a processing liquid to a substrate processing section that processes substrates; a pump provided in the processing liquid supply path; a heater and a pressure gauge provided in the processing liquid supply path downstream of the pump; a thermometer for measuring the temperature of the treatment liquid flowing through the treatment liquid supply path; a control unit that controls each unit; Equipped with The control unit detects an abnormality in the supply of the treatment liquid based on the measurement value of the pressure gauge and the measurement value of the thermometer. Processing liquid supply system.

7. a storage unit that stores a monitoring table in which a pressure threshold value corresponding to the temperature of the treatment liquid is set, The control unit detects a supply abnormality of the processing liquid when a measured value of the pressure gauge exceeds a pressure threshold value corresponding to a temperature of the processing liquid set in the monitoring table. The processing liquid supply system according to claim 6 .

8. a flow meter provided in the treatment liquid supply path downstream of the pump, the pump is a magnetic levitation pump that pumps the treatment liquid by rotating a rotating part while being magnetically levitated in the treatment liquid, The control unit controls the rotation speed of the rotating unit based on the measurement value of the flow meter to feed the treatment liquid. The processing liquid supply system according to claim 6 .

9. When the control unit detects an abnormality in the supply of the treatment liquid, the control unit stops the rotation speed of the rotating unit of the pump to stop the supply of the treatment liquid. The processing liquid supply system according to claim 3 or 8.

10. A processing liquid supply system including a processing liquid supply path that supplies a processing liquid to a substrate processing unit that processes substrates, a pump provided in the processing liquid supply path, and a pressure meter and a flow meter provided in the processing liquid supply path downstream of the pump, a detecting step of detecting an abnormality in the supply of the treatment liquid based on the measurement value of the pressure meter and the measurement value of the flow meter. Processing liquid supply method.

11. A computer-readable storage medium storing a program that runs on a computer and controls a processing liquid supply system, The program, when executed, causes a computer to control the processing liquid supply system so as to perform the processing liquid supply method according to claim 10. storage medium.

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