Substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of easily aligning a plurality of substrates face-to-face at a pitch narrower than a half pitch.SOLUTION: An attitude conversion unit 19 of a substrate processing apparatus 1 includes vertical holding units 39, 40 having standard pitch holding grooves 63A, 63B and 2 / 3 pitch holding grooves 65A, 65B, and a holding groove switching drive unit 71. The standard pitch holding grooves 63A, 63B are arranged at the standard pitch. The 2 / 3 pitch holding grooves 65A, 65B are arranged at a 2 / 3 pitch that is 2 / 3 times the standard pitch. The holding groove switching drive unit 71 makes the standard pitch holding grooves 63A, 63B usable when forming 50 substrates W aligned face-to-back on the pusher member, and makes the 2 / 3 pitch holding grooves 65A, 65B usable when rearranging the 50 substrates W held by the pusher member face-to-face.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] Conventionally, there has been known a substrate processing apparatus that processes a plurality of substrates by immersing them all at once in a processing solution. This substrate processing apparatus includes a position change mechanism (position change unit) and a pusher (pusher mechanism) (see, for example, Patent Document 1). The position change mechanism changes the position of the substrates between a horizontal position and a vertical position. The pusher can transfer a plurality of substrates in a vertical position to and from the position change mechanism by vertical movement of a lifting and lowering holding unit (pusher member).

[0003] After 25 substrates are handed over from the position change mechanism to the lifting holder, the lifting holder rotates 180 degrees around its vertical axis. This 180-degree rotation moves the 25 held substrates by a half-pitch. In this state, another 25 substrates are handed over to the lifting holder from the position change mechanism. As a result, the 25 substrates handed over later are inserted between the 25 substrates handed over earlier, forming a group of 50 substrates in total on the lifting holder. At this point, two adjacent substrates are in a face-to-face position, with their front surfaces (or back surfaces) facing each other. The 50 substrates held by the lifting holder are also aligned at a half-pitch, half the substrate holding pitch within the carrier. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-093230 Summary of the Invention [Problem to be solved by the invention]

[0005] In order to reduce the amount of processing liquids (chemicals and cleaning liquids) used in substrate processing equipment, there is a demand for aligning multiple substrates at a pitch narrower than half the pitch and processing multiple substrates aligned at this narrow pitch all at once. However, in this case, it can be difficult to place multiple substrates aligned at a pitch narrower than half the pitch face-to-face.

[0006] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate processing apparatus that can easily align multiple substrates face-to-face at a pitch narrower than half pitch. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention has the following configuration: A substrate processing apparatus according to the present invention is a substrate processing apparatus for collectively processing a plurality of substrates, comprising: a substrate handling mechanism having a plurality of hands arranged vertically at a reference pitch and each holding one horizontally oriented substrate; a posture changing unit that converts N substrate groups, where N is a natural number greater than or equal to 3, received in order from the substrate handling mechanism, each group consisting of two or more substrates aligned at the reference pitch, from a horizontal posture to a vertical posture; a pusher mechanism having a pusher member that holds the plurality of substrates aligned at a 1 / N pitch in a vertical position, the pusher member being configured to align the group of N substrates received from the position change unit in a single row on the pusher member while shifting the pusher member by 1 / N pitch in an alignment direction in which the plurality of substrates are aligned, thereby forming the plurality of substrates on the pusher member; and the position change unit being configured to hold the plurality of substrates in a vertical position, the pusher member being configured to align the group of N substrates in a single row on the pusher member while shifting the pusher member by 1 / N pitch in an alignment direction in which the plurality of substrates are aligned, a pair of horizontal holding parts that hold one of the substrate groups in a horizontal position; a pair of vertical holding parts that are provided to extend perpendicular to the support surface of the support base and have multiple pairs of reference pitch holding grooves and multiple pairs of 2 / N pitch holding grooves; a rotation drive part that rotates the support base around a horizontal axis; and a switch drive part that switches between a state in which the multiple pairs of reference pitch holding grooves can be used and a state in which the multiple pairs of 2 / N pitch holding grooves can be used, and the multiple pairs of reference pitch holding grooves are arranged in an extension direction in which the pair of vertical holding parts extend. The plurality of pairs of 2 / N pitch retaining grooves are arranged at a standard pitch, and the plurality of pairs of 2 / N pitch retaining grooves are arranged at a 2 / N pitch that is 2 / N times the standard pitch in the extension direction, and the switching drive unit makes the plurality of pairs of standard pitch retaining grooves usable when forming the plurality of substrates aligned face-to-back on the pusher member, and also makes the plurality of pairs of 2 / N pitch retaining grooves usable when rearranging the plurality of substrates held by the pusher member face-to-face.

[0008] In the substrate processing apparatus according to the present invention, the pair of vertical holding units of the posture conversion unit have multiple pairs of standard pitch holding grooves and multiple pairs of 2 / N pitch holding grooves. The multiple pairs of standard pitch holding grooves are arranged at a standard pitch. Furthermore, the multiple pairs of 2 / N pitch holding grooves are arranged at a 2 / N pitch that is 2 / N times the standard pitch. The switching drive unit switches the multiple pairs of standard pitch holding grooves to a usable state. This allows the pusher mechanism to move the pusher member by 1 / N pitch, thereby holding a group of multiple substrates, each aligned at the standard pitch, on the pusher member. Therefore, the pusher member temporarily holds multiple substrates aligned at 1 / N pitch and face-to-back.

[0009] The switching drive unit of the attitude change unit then switches the multiple pairs of 2 / N pitch holding grooves to a usable state. This allows the attitude change unit to extract two or more first substrates from the multiple substrates held by the pusher member, among the multiple substrates in which two or more first substrates and two or more second substrates are alternately arranged. The pusher mechanism then rotates the two or more second substrates remaining on the pusher member 180 degrees around the vertical axis. The two or more first substrates extracted by the attitude change unit are then returned to the pusher member. This allows the pusher member to hold multiple substrates aligned face-to-face at a 1 / N pitch. This makes it easy to align multiple substrates face-to-face at a 1 / N pitch that is narrower than a half pitch.

[0010] In the substrate processing apparatus described above, a first vertical holding part of the pair of vertical holding parts is rotatable about a first rotation axis that passes through the first vertical holding part and extends perpendicular to the support surface, and the first vertical holding part has a first outer peripheral surface and a second outer peripheral surface that are provided about the first rotation axis, and a second vertical holding part of the pair of vertical holding parts is rotatable about a second rotation axis that passes through the first vertical holding part and extends perpendicular to the support surface, and the second vertical holding part has a third outer peripheral surface and a fourth outer peripheral surface that are provided about the second rotation axis. It is preferable that the rotary shaft has a peripheral surface, the first and third peripheral surfaces are provided with the multiple pairs of reference pitch retaining grooves, and the second and fourth peripheral surfaces are provided with the multiple pairs of 2 / N pitch retaining grooves, and the switching drive unit rotates the first vertical retaining unit around the first rotation axis and rotates the second vertical retaining unit around the second rotation axis, thereby switching between a state in which the multiple pairs of reference pitch retaining grooves can be used and a state in which the multiple pairs of 2 / N pitch retaining grooves can be used.

[0011] The switching drive unit rotates the first vertical holding unit about a first rotation axis and rotates the second vertical holding unit about a second rotation axis, thereby enabling the switching drive unit to switch between a state in which multiple pairs of standard pitch holding grooves can be used and a state in which multiple pairs of 2 / N pitch holding grooves can be used.

[0012] In the above-described substrate processing apparatus, the first vertical holding unit has, in addition to the first outer peripheral surface and the second outer peripheral surface, a fifth outer peripheral surface and a sixth outer peripheral surface provided around the first rotation axis, the second vertical holding unit has, in addition to the third outer peripheral surface and the fourth outer peripheral surface, a seventh outer peripheral surface and an eighth outer peripheral surface provided around the second rotation axis, the fifth outer peripheral surface and the seventh outer peripheral surface are provided with a plurality of pairs of post-processing standard pitch holding grooves arranged at the standard pitch in the extension direction, the sixth outer peripheral surface and the eighth outer peripheral surface are provided with a plurality of pairs of post-processing 2 / N pitch holding grooves arranged at the 2 / N pitch in the extension direction, and the switching drive unit is and rotating the second vertical holding unit about the second rotation axis, thereby switching between a state in which the multiple pairs of reference pitch holding grooves can be used, a state in which the multiple pairs of 2 / N pitch holding grooves can be used, a state in which the multiple pairs of post-processing reference pitch holding grooves can be used, and a state in which the multiple pairs of post-processing 2 / N pitch holding grooves can be used, and it is preferable that the switching drive unit sets the multiple pairs of post-processing 2 / N pitch holding grooves to a state in which they can be used when the multiple substrates held by the pusher member are to be rearranged face-to-back, and sets the multiple pairs of post-processing reference pitch holding grooves to a state in which they can be used when the multiple substrates held by the pusher member are to be disassembled into the N substrate groups.

[0013] The switching drive unit rotates the first vertical holding unit about a first rotation axis and rotates the second vertical holding unit about a second rotation axis, thereby enabling the switching drive unit to switch among four states, namely, a state in which multiple pairs of reference pitch holding grooves can be used, a state in which multiple pairs of 2 / N pitch holding grooves can be used, a state in which multiple pairs of post-processing reference pitch holding grooves can be used, and a state in which multiple pairs of post-processing 2 / N pitch holding grooves can be used.

[0014] The substrate processing apparatus further includes a control unit, wherein the control unit causes the switching drive unit to make the plurality of pairs of reference pitch holding grooves usable, receives the N substrate groups from the substrate handling mechanism in order by the attitude conversion unit, and converts the N substrate groups individually from a horizontal attitude to a vertical attitude by the attitude conversion unit, and causes the pusher mechanism to shift the pusher member by 1 / N pitch in the alignment direction while causing the pusher member to receive the N substrate groups in order, thereby pushing the plurality of substrates formed from the N substrate groups and aligned at the 1 / N pitch and face-to-back, through the pusher mechanism. It is preferable that the pusher member holds the two or more first substrates, the switching drive unit makes the multiple pairs of 2 / N pitch holding grooves usable, the pair of vertical holding units receives the two or more first substrates aligned at the 2 / N pitch from the plurality of substrates in which two or more first substrates and two or more second substrates are alternately arranged, and the pusher mechanism rotates the pusher member holding the two or more second substrates in a vertical position by 180 degrees around a vertical axis, and while the two or more first substrates and the two or more second substrates rotated 180 degrees are alternately arranged, the pusher member receives the two or more first substrates from the pair of vertical holding units.

[0015] It is preferable that the above-mentioned substrate processing apparatus further comprises a substrate processing section that collectively processes the plurality of substrates aligned face-to-face at the 1 / N pitch, and a main transport mechanism that transports the plurality of substrates aligned face-to-face at the 1 / N pitch to the substrate processing section.

[0016] The substrates to be processed in a batch are aligned at a pitch narrower than the half pitch. This allows the size of the substrate processing unit that accommodates the substrates to be reduced. For example, if the substrate processing unit is a batch processing tank, the amount of processing liquids (chemicals and cleaning liquids) used can be reduced.

[0017] Furthermore, in the above-mentioned substrate processing apparatus, for example, the N substrate groups are three substrate groups, the 1 / N pitch is a 1 / 3 pitch that is 1 / 3 times the reference pitch, and the multiple pairs of 2 / N pitch retaining grooves are multiple pairs of 2 / 3 pitch retaining grooves arranged at a 2 / 3 pitch that is 2 / 3 times the reference pitch in the extension direction.

[0018] Furthermore, in the above-mentioned substrate processing apparatus, for example, the N substrate groups are 3 substrate groups, the 1 / N pitch is 1 / 3 pitch which is 1 / 3 times the reference pitch, the multiple pairs of 2 / N pitch holding grooves are multiple pairs of 2 / 3 pitch holding grooves arranged at 2 / 3 pitch which is 2 / 3 times the reference pitch in the extension direction, and the multiple pairs of post-processing 2 / N pitch holding grooves are multiple pairs of post-processing 2 / 3 pitch holding grooves arranged at 2 / 3 pitch in the extension direction. [Effects of the Invention]

[0019] The substrate processing apparatus according to the present invention can easily align a plurality of substrates face-to-face at a pitch narrower than half pitch. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a side view of the substrate handling mechanism. [Figure 3] FIG. [Figure 4] 10 is a plan view showing the attitude conversion unit when a pair of vertical holding parts are separated from a pair of horizontal holding parts. FIG. [Figure 5] 10 is a plan view showing the attitude conversion unit in a state where a pair of vertical holding parts are approaching a pair of horizontal holding parts. FIG. [Figure 6] 6 is a plan view mainly showing a pair of vertical holding parts in a horizontal position in a first state in which a plurality of pairs of reference pitch holding grooves can be used, as seen in the direction of arrow AA in FIGS. 4 and 5. FIG. [Figure 7]6 is a plan view mainly showing a pair of vertical holding parts in a horizontal position in a second state in which multiple pairs of 2 / 3 pitch holding grooves can be used, as viewed in the direction of arrow AA in FIGS. 4 and 5. FIG. [Figure 8] FIG. 10 is a side view of the pusher mechanism. [Figure 9] FIG. 10 is a longitudinal cross-sectional view showing a pusher member that holds, in a vertical position, a plurality of substrates aligned face-to-face at a 1 / 3 pitch. [Figure 10] 10 is a flowchart illustrating the first half of the operation of the substrate processing apparatus. [Figure 11] 10 is a flowchart illustrating a second half of the operation of the substrate processing apparatus. [Figure 12] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 13] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 14] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 15] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 16] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 17] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 18] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 19] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 20] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 21] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 22] 1A and 1B are diagrams for explaining the operation of the substrate processing apparatus. [Figure 23] FIG. 10 is a plan view showing a posture change unit according to a second embodiment. [Figure 24] 10(a) and 10(b) are side views showing a posture change unit according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0021] The present invention will be described below with reference to various examples. [Example]

[0022] First Embodiment A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment.

[0023] For convenience, in this specification, the direction in which the transfer block 5 and the processing block 7 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, for example, the direction from the processing block 7 toward the transfer block 5 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0024] <1. Configuration of the substrate processing apparatus> Please refer to FIG. 1. The substrate processing apparatus 1 processes substrates W. The substrate processing apparatus 1 is a batch-type substrate processing apparatus that processes a plurality of substrates W (for example, 50, 75, or 100) at once. In this embodiment, a case where 50 substrates W are processed at once will be described. When substrates W1, W2, W3, W11, W12, etc. are not particularly distinguished from one another, they will be referred to as substrates W.

[0025] The substrate processing apparatus 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on substrates W. The substrate processing apparatus 1 includes a stocker 2, a loading shelf 3, a transfer block 5, a processing block 7, and a batch substrate transport area 8.

[0026] <1-1. Stocker> The stocker 2 accommodates at least one carrier C. The stocker 2 is adjacent to the front of the transfer block 5. The carrier C stores a plurality of (e.g., 25) substrates W in a horizontal position at a predetermined interval (e.g., 10 mm). In other words, the carrier C stores a plurality of substrates W in a horizontal position aligned in the vertical direction Z at a reference pitch (e.g., 10 mm pitch). The plurality of substrates W in the carrier C are aligned in the thickness direction of each substrate W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited to this.

[0027] The stocker 2 is equipped with a plurality of (for example, two) load ports 9. The two load ports 9 are arranged in the width direction Y. In this embodiment, the two load ports 9 are used to load and unload carriers C. The stocker 2 also is equipped with at least one storage shelf 11 and a carrier transport robot 13. The carriers C are placed on the storage shelf 11.

[0028] The carrier transport robot 13 transports the carrier C between the two load ports 9, the storage shelf 11, and the loading shelf 3. The carrier transport robot 13 is equipped with a gripping unit 15 that grips a protrusion provided on the top surface of the carrier C, for example. The carrier transport robot 13 can move the gripping unit 15 in the horizontal direction (front-back direction X and width direction Y) and the vertical direction Z. The carrier transport robot 13 is driven by one or more electric motors.

[0029] The loading shelf 3 is arranged in the area of ​​the stocker 2. The loading shelf 3 is adjacent to the front of the transfer block 5. On the loading shelf 3, a carrier C is placed.

[0030] <1-2. Transfer block> 1, the transfer block 5 includes a substrate handling mechanism (robot) HTR, a posture conversion unit 19, a pusher mechanism 21, and a transfer mechanism 23.

[0031] The substrate handling mechanism HTR is disposed behind the loading shelf 3. The substrate handling mechanism HTR transports a plurality of substrates W (e.g., 17 or 16) in a horizontal position between a carrier C placed on the loading shelf 3 and the position conversion unit 19. As shown in FIG. 2, the substrate handling mechanism HTR is equipped with a plurality of hands 27 (e.g., 25 or 17). Each hand 27 holds one substrate W in a horizontal position. The plurality of hands 27 are arranged in the vertical direction Z at a reference pitch (e.g., 10 mm pitch). Therefore, for example, 25 substrates W held by 25 hands 27 are aligned at the reference pitch. The reference pitch is a repeating reference interval TN9 (e.g., 10 mm).

[0032] 2 and other figures, for convenience of illustration, the substrate handling mechanism HTR is shown to have four hands 27. Furthermore, a pair of horizontal holding units 37, 38 and a pair of vertical holding units 39, 40, which will be described later, are each shown to hold three substrates W. Furthermore, a pusher member 81 (see FIG. 9), which will be described later, is shown to support eight substrates W.

[0033] The substrate handling mechanism HTR further includes a hand support unit 29, an advancing / retreating unit 31, and an elevation / rotation unit 33. The hand support unit 29 supports the multiple hands 27. The advancing / retreating unit 31 moves the multiple hands 27 forward and backward via the hand support unit 29. The elevation / rotation unit 33 rotates the advancing / retreating unit 31 about a vertical axis AX1 to change the orientation of the hands 27. The elevation / rotation unit 33 is fixed to the floor surface. The advancing / retreating unit 31 and the elevation / rotation unit 33 each include an electric motor. The substrate handling mechanism HTR may also include a movable hand (not shown) for transporting only one substrate W, separate from the hand 27.

[0034] The attitude conversion unit 19 converts a plurality of substrates W (for example, 17 or 16 substrates) between a horizontal attitude and a vertical attitude. Specifically, the attitude conversion unit 19 converts three substrate groups (first substrate group, second substrate group, and third substrate group) received in order from the substrate handling mechanism HTR from a horizontal attitude to a vertical attitude individually. Each of the three substrate groups is made up of two or more substrates W (for example, 17 or 16 substrates) aligned at a reference pitch (for example, a 10 mm pitch).

[0035] The attitude changing unit 19 is disposed on the left side of the substrate handling mechanism HTR. As shown in FIGS. 3 to 5, the attitude changing unit 19 includes a support base 35, a pair of horizontal holding units 37 and 38, a pair of vertical holding units 39 and 40, and a rotation driving unit 41.

[0036] The support base 35 is supported rotatably about a horizontal axis AX2 extending in the front-to-rear direction X. The pair of horizontal holding parts 37, 38 and the pair of vertical holding parts 39, 40 are each provided to extend perpendicular to the support surface 35A. The pair of horizontal holding parts 37, 38 hold, in a horizontal position, for example, 17 or 16 substrates W of one substrate group. That is, the pair of horizontal holding parts 37, 38 hold the peripheral portions of, for example, 17 or 16 substrates W in a horizontal position. Furthermore, the pair of vertical holding parts 39, 40 hold, in a vertical position, for example, 17 or 16 substrates W of one substrate group.

[0037] The rotation drive unit 41 rotates the support base 35 around the horizontal axis AX2. This allows the substrates W held by the pair of horizontal holding units 37, 38 and the pair of vertical holding units 39, 40 to be converted between a horizontal position and a vertical position. The rotation drive unit 41 includes, for example, an electric motor.

[0038] Next, the pair of horizontal holding portions 37, 38 will be described in detail. The pair of horizontal holding portions 37, 38 are arranged in the front-rear direction X. The first horizontal holding portion 37 is rotatable about a rotation axis AX3 that passes through it and extends perpendicular to the support surface 35A. The first horizontal holding portion 37 has a first surface 43A, a second surface 45A, and a first retraction surface 47A that are arranged around the rotation axis AX3. The first surface 43A is arranged on the opposite side of the second surface 45A.

[0039] Second horizontal holding portion 38 is rotatable about a rotation axis AX4 that passes through second horizontal holding portion 38 and extends perpendicular to support surface 35A. Second horizontal holding portion 38 includes a third surface 43B, a fourth surface 45B, and a second retraction surface 47B that are arranged around rotation axis AX4. Third surface 43B is located on the opposite side of fourth surface 45B.

[0040] The pair of horizontal holding parts 37, 38 includes multiple pairs (e.g., 17 pairs) of pre-processing shelves 49A, 49B and multiple pairs (e.g., 17 pairs) of post-processing shelves 51A, 51B. The multiple pairs of pre-processing shelves 49A, 49B and the multiple pairs of post-processing shelves 51A, 51B are each arranged at a standard pitch (e.g., 10 mm pitch) in the direction DR1 (see FIG. 3) in which the pair of horizontal holding parts 37, 38 (each of the horizontal holding parts 37, 38) extends.

[0041] The first surface 43A and the third surface 43B are provided with a plurality of pairs of pre-processing shelves 49A, 49B. In contrast, the second surface 45A and the fourth surface 45B are provided with a plurality of pairs of post-processing shelves 51A, 51B. The first retraction surface 47A and the second retraction surface 47B are not provided with shelves such as the shelf 49A. Furthermore, when the first retraction surface 47A and the second retraction surface 47B are opposed to each other (i.e., when the first retraction surface 47A and the second retraction surface 47B are usable), the width WD1 between the first retraction surface 47A and the second retraction surface 47B is larger than the diameter of the substrate W (see FIG. 5).

[0042] The position change unit 19 further includes a shelf switching drive unit 53. The shelf switching drive unit 53 includes at least one electric motor. The shelf switching drive unit 53 rotates the first horizontal holder 37 about the rotation axis AX3 and rotates the second horizontal holder 38 about the rotation axis AX4. This allows switching among a state in which multiple pairs of pre-processing shelves 49A, 49B can be used, a state in which multiple pairs of post-processing shelves 51A, 51B can be used, and a state in which the first retraction surface 47A and the second retraction surface 47B can be used. In other words, the shelf switching drive unit 53 can switch among three states.

[0043] When the pairs of pre-processing shelves 49A, 49B are ready to be used, the pairs of pre-processing shelves 49A, 49B face each other (see FIG. 4). When the pairs of post-processing shelves 51A, 51B are ready to be used, the pairs of post-processing shelves 51A, 51B face each other.

[0044] For example, when receiving a plurality of unprocessed substrates from the substrate handling mechanism HTR, the shelf switching drive unit 53 sets the pairs of pre-processing shelves 49A, 49B to a usable state. Furthermore, when holding three groups of processed substrates W individually in a horizontal position, the shelf switching drive unit 53 sets the pairs of post-processing shelves 51A, 51B to a usable state. Furthermore, when transferring a plurality of substrates W between a pair of vertical holders 39, 40 (position conversion unit 19) and a pusher member 81 (pusher mechanism 21), the shelf switching drive unit 53 sets the first retraction surface 47A and the second retraction surface 47B to a usable state. This prevents the pair of horizontal holders 37, 38 from rubbing against the substrates W.

[0045] The attitude conversion unit 19 may include a drive unit that moves the pair of horizontal holding units 37, 38 toward or away from the support surface 35A along the rotation axes AX3, AX4. The drive unit includes, for example, an electric actuator or an air cylinder.

[0046] Next, the pair of vertical holding parts 39, 40 will be described in detail. The pair of vertical holding parts 39, 40 are arranged in the front-rear direction X. The first vertical holding part 39 is rotatable around a rotation axis AX5 that passes through it and extends perpendicular to the support surface 35A. The first vertical holding part 39 has four outer peripheral surfaces 55A, 57A, 59A, and 61A arranged around the rotation axis AX5. The outer peripheral surface 55A is arranged on the opposite side of the outer peripheral surface 59A. The outer peripheral surface 57A is arranged on the opposite side of the outer peripheral surface 61A. The arrangement of the four outer peripheral surfaces 55A, 57A, 59A, and 61A is not particularly limited.

[0047] The second vertical holding part 40 is rotatable about a rotation axis AX6 that passes through the second vertical holding part 40 and extends perpendicular to the support surface 35A. The second vertical holding part 40 has four outer peripheral surfaces 55B, 57B, 59B, and 61B that are arranged around the rotation axis AX6. The outer peripheral surface 55B is arranged on the opposite side of the outer peripheral surface 59B. The outer peripheral surface 57B is arranged on the opposite side of the outer peripheral surface 61B. There is no particular limitation on the arrangement of the four outer peripheral surfaces 55B, 57B, 59B, and 61B.

[0048] 6 and 7 are plan views mainly showing the pair of vertical holding parts 39, 40 in a horizontal position when viewed in the direction of arrow AA in Figures 4 and 5. The pair of vertical holding parts 39, 40 are provided with multiple pairs (e.g., 17 pairs) of reference pitch holding grooves 63A, 63B and multiple pairs (e.g., 25 pairs) of 2 / 3 pitch holding grooves 65A, 65B for handling unprocessed substrates W.

[0049] As shown in Fig. 6, the multiple pairs of standard pitch retaining grooves 63A, 63B are arranged at a standard pitch (e.g., 10 mm pitch) in the extension direction DR2 in which a pair of vertical retaining portions 39, 40 (each vertical retaining portion 39, 40) extends. In contrast, the multiple pairs of 2 / 3 pitch retaining grooves 65A, 65B are arranged at a 2 / 3 pitch (e.g., 6.666 mm pitch) that is 2 / 3 times the standard pitch in the extension direction DR2, as shown in Fig. 7. The 2 / 3 pitch repeats a second interval TN2 (e.g., 6.666 mm) that is twice the first interval TN1 (e.g., 3.333 mm).

[0050] The two outer circumferential surfaces 55A, 55B are provided with a plurality of pairs (for example, 17 pairs) of reference pitch retaining grooves 63A, 63B. The two outer circumferential surfaces 57A, 57B are provided with a plurality of pairs (for example, 25 pairs) of 2 / 3 pitch retaining grooves 65A, 65B.

[0051] Furthermore, the pair of vertical holding parts 39, 40 further include multiple pairs (e.g., 17 pairs) of reference pitch holding grooves 67A, 67B and multiple pairs (e.g., 25 pairs) of 2 / 3 pitch holding grooves 69A, 69B for handling processed substrates W. The two outer circumferential surfaces 59A, 59B are provided with multiple pairs of reference pitch holding grooves 67A, 67B arranged at a reference pitch in the extension direction DR2. The two outer circumferential surfaces 61A, 61B are provided with multiple pairs of 2 / 3 pitch holding grooves 69A, 69B arranged at a 2 / 3 pitch in the extension direction DR2.

[0052] The reference pitch holding grooves 67A, 67B are used to hold a group of substrates (e.g., 17 or 16 substrates W) that have been processed in, for example, the chemical liquid processing tank BT1 (described later). The 2 / 3 pitch holding grooves 69A, 69B are used to hold two or more (e.g., 25) first substrates W11 and two or more (e.g., 25) second substrates W12 that are alternately arranged and two or more (e.g., 25) first substrates W11 (second substrates W12) out of a plurality (e.g., 50) of substrates W (W11, W12) that have been processed in, for example, the chemical liquid processing tank BT1.

[0053] The posture conversion unit 19 further includes a groove switching drive unit 71. The groove switching drive unit 71 includes at least one electric motor. The groove switching drive unit 71 rotates the first vertical holder 39 around the rotation axis AX5 and rotates the second vertical holder 40 around the rotation axis AX6. This allows switching between a first state in which multiple pairs of reference pitch grooves 63A, 63B can be used, a second state in which multiple pairs of 2 / 3 pitch grooves 65A, 65B can be used, a third state in which multiple pairs of reference pitch grooves 67A, 67B can be used, and a fourth state in which multiple pairs of 2 / 3 pitch grooves 69A, 69B can be used. In other words, the groove switching drive unit 71 can switch between four states.

[0054] In a first state in which multiple pairs of reference pitch retaining grooves 63A, 63B can be used, the multiple pairs of reference pitch retaining grooves 63A, 63B face each other (see FIG. 4). Similarly, in a second state in which multiple pairs of 2 / 3 pitch retaining grooves 65A, 65B can be used, the multiple pairs of 2 / 3 pitch retaining grooves 65A, 65B face each other (see FIG. 5). In a third state in which multiple pairs of reference pitch retaining grooves 67A, 67B can be used, the multiple pairs of reference pitch retaining grooves 67A, 67B face each other. In a fourth state in which multiple pairs of 2 / 3 pitch retaining grooves 69A, 69B can be used, the multiple pairs of 2 / 3 pitch retaining grooves 69A, 69B face each other.

[0055] 6, each pair of vertical holding portions 39, 40 includes multiple pairs (e.g., 17 pairs) of reference pitch holding grooves 63A, 63B as well as multiple pairs (e.g., 18 pairs) of passing grooves 64A, 64B. The multiple pairs of reference pitch holding grooves 63A, 63B and the multiple pairs of passing grooves 64A, 64B are arranged alternately. The multiple pairs of passing grooves 64A, 64B are provided on the two outer peripheral surfaces 55A, 55B. Similarly, each pair of vertical holding portions 39, 40 includes multiple pairs (e.g., 17 pairs) of reference pitch holding grooves 67A, 67B as well as multiple pairs (e.g., 18 pairs) of passing grooves 68A, 68B. The multiple pairs of reference pitch holding grooves 67A, 67B and the multiple pairs of passing grooves 68A, 68B are arranged alternately.

[0056] For example, in Figure 6, for convenience of illustration, a pair of vertical holding parts 39, 40 has three pairs of reference pitch holding grooves 63A, 63B and four pairs of passing grooves 64A, 64B. The three pairs of reference pitch holding grooves 63A, 63B and the four pairs of passing grooves 64A, 64B are arranged alternately. The width WD2 between each pair of passing grooves 64A, 64B is set to be larger than the diameter of the substrate W. Therefore, each pair of passing grooves 64A, 64B can pass two substrates W held by the pusher member 81. Similarly, when each pair of passing grooves 68A, 68B faces each other, the width of each pair of passing grooves 68A, 68B is also set to be larger than the diameter of the substrate W.

[0057] In FIG. 7, each pair of vertical holding portions 39, 40 includes multiple pairs (e.g., 25 pairs) of 2 / 3 pitch holding grooves 65A, 65B as well as multiple pairs (e.g., 26 pairs) of passing grooves 66A, 66B. The multiple pairs of 2 / 3 pitch holding grooves 65A, 65B and the multiple pairs of passing grooves 66A, 66B are arranged alternately. The multiple pairs of passing grooves 66A, 66B are provided on the two outer peripheral surfaces 57A, 57B. Similarly, each pair of vertical holding portions 39, 40 includes multiple pairs (e.g., 25 pairs) of 2 / 3 pitch holding grooves 69A, 69B as well as multiple pairs (e.g., 26 pairs) of passing grooves 70A, 70B. The multiple pairs of 2 / 3 pitch holding grooves 69A, 69B and the multiple pairs of passing grooves 70A, 70B are arranged alternately.

[0058] For example, in Figure 7, for convenience of illustration, a pair of vertical holding parts 39, 40 has four pairs of 2 / 3 pitch holding grooves 65A, 65B and five pairs of passing grooves 66A, 66B. The four pairs of 2 / 3 pitch holding grooves 65A, 65B and the five pairs of passing grooves 66A, 66B are arranged alternately. The width WD3 of each pair of passing grooves 66A, 66B is also set to be larger than the diameter of the substrate W. Therefore, each pair of passing grooves 66A, 66B can pass one substrate W held by the pusher member 81. Similarly, when each pair of passing grooves 70A, 70B faces each other, the width of each pair of passing grooves 70A, 70B is also set to be larger than the diameter of the substrate W.

[0059] The holding groove switching drive unit 71 sets the holding groove switching drive unit 71 to a first state in which multiple pairs of standard pitch holding grooves 63A, 63B can be used when forming multiple substrates W aligned face-to-back on the pusher member 81. Furthermore, the holding groove switching drive unit 71 sets the holding groove switching drive unit 71 to a second state in which multiple pairs of 2 / 3 pitch holding grooves 65A, 65B can be used when rearranging multiple substrates W held by the pusher member 81 face-to-face.

[0060] "Face-to-back" refers to an alignment state in which all surfaces (front surfaces, main surfaces, or device surfaces) of multiple (e.g., 50) substrates W face the same direction. Also, "face-to-face" refers to an alignment state in which the back surfaces or front surfaces of two adjacent substrates W face each other. In other words, face-to-face refers to an alignment state in which, when two or more first substrates W11 and two or more second substrates W12 are alternately arranged, the surfaces of two or more first substrates W11 face in the opposite direction to the surfaces of two or more second substrates W12. The device surface is the surface on which a device is formed or the surface on which a device is in the process of being formed.

[0061] Furthermore, the holding groove switching drive unit 71 switches to a fourth state in which multiple pairs of 2 / 3 pitch holding grooves 69A, 69B can be used when rearranging multiple substrates W held by the pusher member 81 from face-to-face to face-to-back. Furthermore, the holding groove switching drive unit 71 switches to a third state in which multiple pairs of standard pitch holding grooves 67A, 67B can be used when separating multiple substrates W held by the pusher member 81 into groups of three substrates.

[0062] As shown in Fig. 3, the attitude changing unit 19 further includes a storage movement unit 73. The storage movement unit 73 moves the pair of vertical holding units 39, 40 toward or away from the pair of horizontal holding units 37, 38. For example, when the pair of horizontal holding units 37, 38 hold multiple substrates W in a horizontal attitude, the storage movement unit 73 can move the pair of vertical holding units 39, 40 in the width direction Y. The storage movement unit 73 includes, for example, an electric actuator or an air cylinder. The electric actuator includes an electric motor.

[0063] See Figure 4. When the storage and movement unit 73 moves the vertical holding units 39, 40 away from the horizontal holding units 37, 38, the multiple substrates W in the horizontal position are held only by the horizontal holding units 37, 38, without using the vertical holding units 39, 40. See Figure 5. When the storage and movement unit 73 moves the vertical holding units 39, 40 closer to the horizontal holding units 37, 38, at the position of the substrates W shown in Figure 4, the peripheral edges of the multiple substrates W can be stored by, for example, multiple pairs of 2 / 3 pitch holding grooves 65A, 65B.

[0064] The rotating axis AX5 corresponds to the first rotating axis of the present invention. The rotating axis AX6 corresponds to the second rotating axis of the present invention. The outer peripheral surface 55A corresponds to the first outer peripheral surface of the present invention. The outer peripheral surface 57A corresponds to the second outer peripheral surface of the present invention. The outer peripheral surface 59A corresponds to the fifth outer peripheral surface of the present invention. The outer peripheral surface 61A corresponds to the sixth outer peripheral surface of the present invention. The outer peripheral surface 55B corresponds to the third outer peripheral surface of the present invention. The outer peripheral surface 57B corresponds to the fourth outer peripheral surface of the present invention. The outer peripheral surface 59B corresponds to the seventh outer peripheral surface of the present invention. The outer peripheral surface 61B corresponds to the eighth outer peripheral surface of the present invention.

[0065] The multiple pairs of reference pitch holding grooves 67A, 67B correspond to the multiple pairs of post-processing reference pitch holding grooves of the present invention. The multiple pairs of 2 / 3 pitch holding grooves 69A, 69B correspond to the multiple pairs of post-processing 2 / 3 pitch holding grooves of the present invention. The holding groove switching drive unit 71 corresponds to the switching drive unit of the present invention.

[0066] Next, details of the pusher mechanism 21 will be described. Reference is made to Figures 8 and 9. The pusher mechanism 21 includes a pusher member 81 that holds, in a vertical position, a plurality of substrates W (e.g., 50 substrates) aligned at a 1 / 3 pitch (e.g., 3.333 mm pitch), which is 1 / 3 of the reference pitch (e.g., 10 mm pitch). The pusher mechanism 21 aligns a group of three substrates received from the position changing unit 19 in a single row on the pusher member 81 while shifting the pusher member by 1 / 3 pitch in the alignment direction (width direction Y) in which the plurality of substrates W are aligned. In this way, a plurality of substrates W (e.g., 50 substrates) are formed on the pusher member 81. The 1 / 3 pitch is a repeat of a first interval TN1 (3.333 mm).

[0067] The pusher mechanism 21 is disposed to the left of the attitude conversion unit 19 (see FIG. 1). As shown in FIG. 8, the pusher mechanism 21 includes a pusher member 81, a pusher rotation unit 85, a pusher horizontal movement unit 87, a lifting platform 89, and a pusher lifting unit 91. The pusher member 81 includes a plurality of (e.g., 50 or 51) vertical holding grooves 93 arranged at a 1 / 3 pitch in order to hold a plurality of substrates W in a vertical attitude aligned at a 1 / 3 pitch.

[0068] The pusher rotation unit 85 rotates the pusher member 81 about a vertical axis AX7 that passes through the center of the pusher member 81. As a result, the multiple substrates W that the pusher member 81 supports in a vertical position are rotated about the vertical axis AX7. The pusher rotation unit 85 includes, for example, an electric motor. The pusher rotation unit 85 is connected to the underside of the pusher member 81. The pusher rotation unit 85 is also attached to the upper surface of the lifting platform 89 via a pusher horizontal movement unit 87.

[0069] The pusher horizontal movement unit 87 includes two guide rails 87A each extending in the width direction Y, a slider 87B, and an electric motor (not shown). The two guide rails 87A are provided on the upper surface of the lifting platform 89. The slider 87B moves in the width direction Y along the two guide rails 87A. The slider 87B is driven by the electric motor. The pusher lifting unit 91 raises and lowers the lifting platform 89 in the vertical direction Z, thereby raising and lowering the pusher member 81. The pusher lifting unit 91 includes, for example, an electric actuator.

[0070] Referring to Figure 1, the transfer mechanism 23 receives a plurality of substrates W aligned at a 1 / 3 pitch from the pusher member 81 and transports the received plurality of substrates W to a transfer position P. At the transfer position P, the plurality of substrates W held by the transfer mechanism 23 are handed over to the main transport mechanism WTR. The transfer mechanism 23 includes a chuck 95, a width direction moving unit 97, and a guide rail 101. The width direction moving unit 97 can move the chuck 95 horizontally along the guide rail 101 extending in the width direction Y. The width direction moving unit 97 includes, for example, an electric actuator.

[0071] The chuck 95 holds, in a vertical position, a plurality of substrates W aligned at a 1 / 3 pitch in the width direction Y. The chuck 95 includes a pair of chuck members 95A, 95B each extending in the width direction Y. Each pair of chuck members 95A, 95B includes multiple pairs (e.g., 50 pairs) of holding grooves arranged at a 1 / 3 pitch in the width direction Y.

[0072] When the plurality of vertical holding grooves 93 are arranged in the width direction Y, the pusher member 81 can pass between the pair of chuck members 95A, 95B in the vertical direction Z. The pair of chuck members 95A, 95B may also be opened and closed in the front-rear direction X.

[0073] <1-4. Processing Block> The processing block 7 includes a plurality of (for example, four) batch processing tanks BT1 to BT4 and a drying section 103. The four batch processing tanks BT1 to BT4 and the drying section 103 are arranged in the front-rear direction X along which the substrate processing apparatus 1 extends. Each of the four batch processing tanks BT1 to BT4 immerses and processes a plurality of (for example, 50) substrates W at once. Each of the four batch processing tanks BT1 to BT4 stores a processing liquid (for example, a chemical liquid or pure water) in which the plurality of substrates W are immersed.

[0074] The four batch processing tanks BT1 to BT4 are, for example, composed of two chemical processing tanks BT1 and BT3 and two cleaning processing tanks BT2 and BT4. The chemical processing tank BT1 and the cleaning processing tank BT2 form one set, and the chemical processing tank BT3 and the cleaning processing tank BT4 form another set. Note that the combination of chemical processing tanks and cleaning processing tanks is not limited to this example. Furthermore, the number of batch processing tanks is not limited to four, and may be one or more. At least one of the four batch processing tanks BT1 to BT4 corresponds to the substrate processing section of the present invention.

[0075] Each of the two chemical treatment tanks BT1 and BT3 performs an etching process using a chemical solution. The chemical solution may be, for example, a phosphoric acid solution, but is not limited to, a phosphoric acid solution. The chemical solution is heated to a preset temperature. A chemical solution jetting pipe (not shown) is provided at the bottom of the inside of each of the chemical treatment tanks BT1 and BT3. Each of the chemical treatment tanks BT1 and BT3 stores the chemical solution supplied from the chemical solution jetting pipe.

[0076] Each of the two cleaning processing tanks BT2 and BT4 performs a cleaning process in which chemical solutions adhering to multiple substrates W are washed away with a cleaning liquid (rinse liquid). Pure water such as deionized water (DIW) is used as the cleaning liquid. Each of the cleaning processing tanks BT2 and BT4 stores pure water supplied from a pure water jet pipe (not shown).

[0077] The processing block 7 includes a lifter LF1 as a dedicated transport mechanism for transferring substrates W that have been chemically processed in the chemical processing tank BT1 to the cleaning processing tank BT2, and a lifter LF2 for transferring substrates W that have been chemically processed in the chemical processing tank BT3 to the cleaning processing tank BT4. Each of the two lifters LF1 and LF2 includes a substrate holding unit that holds, in a vertical position, a plurality of substrates W aligned at 1 / 3 pitch in the width direction Y, a lifting unit that raises and lowers the substrate holding unit, and a horizontal moving unit that moves the substrate holding unit in the front-to-rear direction X.

[0078] The drying unit 103 includes a substrate holding mechanism that holds, in a vertical position, a plurality of substrates W (e.g., 50 substrates) aligned at a 1 / 3 pitch in the width direction Y, and a processing chamber that accommodates the plurality of substrates W held by the substrate holding mechanism. The drying unit 103 dries the substrates W by supplying an organic solvent (e.g., isopropyl alcohol) to the substrates W in a reduced pressure atmosphere and by shaking off liquid components on the surfaces of the substrates W by centrifugal force.

[0079] <1-5. Batch substrate transport area> The batch substrate transport area 8 is disposed behind the stocker 2 and adjacent to the transfer block 5 and the processing block 7 on the left side. The batch substrate transport area 8 extends in the front-to-rear direction X. The batch substrate transport area 8 is equipped with a main transport mechanism WTR (main transport robot). The main transport mechanism WTR transports a plurality of substrates W (e.g., 50 substrates) in a vertical position aligned at 1 / 3 pitch in the width direction Y in the front-to-rear direction X. The main transport mechanism WTR also transports the plurality of substrates W between the transfer position P, a plurality of batch processing baths BT1 to BT4 (e.g., four substrates), and the drying section 103.

[0080] The main transport mechanism WTR includes a chuck 105, a chuck lifting unit (not shown), a chuck horizontal moving unit (not shown), and guide rails 107. The chuck 105 holds, in a vertical position, a plurality of substrates W aligned at 1 / 3 pitches in the width direction Y. The chuck 105 includes a pair of chuck members 105A, 105B each extending in the width direction Y. Each pair of chuck members 105A, 105B includes multiple pairs (e.g., 50 or 51 pairs) of holding grooves arranged at 1 / 3 pitches in the width direction Y. The pair of chuck members 105A, 105B is opened and closed by a chuck opening / closing unit (not shown).

[0081] The chuck 105 is movable in the front-rear direction X along the guide rail 107. The chuck 105 is moved in the front-rear direction X by a chuck horizontal movement unit. The chuck 105 is raised and lowered in the vertical direction Z by a chuck lifting unit. The chuck horizontal movement unit and the chuck lifting unit include, for example, an electric actuator. The chuck opening / closing unit includes, for example, an air cylinder or an electric actuator.

[0082] <1-6. Control Unit> The substrate processing apparatus 1 includes a control unit 111 and a storage unit (not shown). The control unit 111 controls each component of the substrate processing apparatus 1. The control unit 111 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0083] <2. Operation of the substrate processing device> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowcharts of FIGS.

[0084] In Figure 12(a) and other figures, the symbol TA indicates the surface (device surface or main surface) of the substrates W (W1, W2, W3). For convenience of illustration, in Figure 12(a) and other figures, the 17 substrates W1 are shown as three substrates W1, the 17 substrates W2 are shown as three substrates W2, and the 16 substrates W3 are shown as two substrates W3.

[0085] The substrate handling mechanism HTR has 25 hands 27. Each pair of horizontal holding parts 37, 38 has 17 pairs of pre-processing shelves 49A, 49B and 17 pairs of post-processing shelves 51A, 51B. The pusher member 81 has 51 vertical holding grooves 93.

[0086] The pair of vertical holding units 39, 40 includes 17 pairs of reference pitch holding grooves 63A, 63B and 25 pairs of 2 / 3 pitch holding grooves 65A, 65B for handling unprocessed substrates W. The pair of vertical holding units 39, 40 also includes 17 pairs of reference pitch holding grooves 67A, 67B and 25 pairs of 2 / 3 pitch holding grooves 69A, 69B for handling processed substrates W.

[0087] Referring to Figure 1, an external transfer robot (not shown) sequentially transfers two carriers C to the load port 9. A carrier transfer robot 13 transfers a first carrier C from the load port 9 to the mounting shelf 3. The first carrier C stores 25 substrates W1 and W2 (17 substrates W1 and 8 substrates W2) aligned at a standard pitch (e.g., 10 mm).

[0088] [Step S01] Switching to multiple pairs of reference pitch holding grooves First, the holding groove switching drive unit 71 of the posture changing unit 19 rotates the first vertical holding unit 39 about the rotation axis AX5 and also rotates the second vertical holding unit 40 about the rotation axis AX6. As a result, the holding groove switching drive unit 71 sets the 17 pairs of reference pitch holding grooves 63A, 63B to a first state in which they can be used. Also, the shelf switching drive unit 53 of the posture changing unit 19 sets the 17 pairs of pre-processing shelves 49A, 49B to a state in which they can be used.

[0089] Here, an overview of the operations of steps S02 to S12 will be explained. The attitude conversion unit 19 sequentially receives three substrate groups (first substrate group, second substrate group, and third substrate group) from the substrate handling mechanism HTR. The attitude conversion unit 19 also individually converts the three substrate groups from a horizontal attitude to a vertical attitude. The pusher mechanism 21 causes the pusher member 81 to sequentially receive the three substrate groups while shifting the pusher member 81 by 1 / 3 pitch in the alignment direction (width direction Y) of the 50 substrates W (W1, W2, W3). In this way, the 50 substrates W formed from the three substrate groups and aligned face-to-back at 1 / 3 pitch are held by the pusher member 81. These operations will be explained in order.

[0090] [Step S02] Receiving the first group of substrates by the attitude change unit 1 and 12(a), the substrate handling mechanism HTR takes out 25 substrates W1, W2 from the first carrier C placed on the mounting shelf 3. The substrate handling mechanism HTR then transports 17 substrates W1 of the 25 taken out substrates W1, W2 to the attitude changing unit 19. The attitude changing unit 19 receives the 17 substrates W1 (first substrate group) from the substrate handling mechanism HTR using the 17 pairs of pre-processing shelves 49A, 49B of the horizontal holders 37, 38.

[0091] The carrier transport robot 13 moves the empty first carrier C from which the 25 substrates W1, W2 have been removed to the storage shelf 11 from the loading shelf 3. The carrier transport robot 13 also transports the second carrier C from the load port 9 to the loading shelf 3. It is assumed that the second carrier C stores 25 substrates W2, W3 (9 substrates W2 and 16 substrates W3).

[0092] See Figure 12(b). A pair of horizontal holding units 37, 38 hold 17 substrates W1 in a horizontal position. At this time, the surfaces of the 17 substrates W1 face upward, as indicated by the symbol TA. The substrate handling mechanism HTR also holds the remaining eight substrates W2 with eight of the 25 hands 27. Thereafter, the storage and movement unit 73 (see Figure 3) of the position conversion unit 19 moves the vertical holding units 39, 40 closer to the horizontal holding units 37, 38. As a result, the 17 pairs of reference pitch holding grooves 63A, 63B of the vertical holding units 39, 40 store the peripheral portions of the 17 horizontally positioned substrates W1 held (placed) by the horizontal holding units 37, 38.

[0093] [Step S03] Vertical position change of the first substrate group 13(a), the rotation drive unit 41 of the attitude conversion unit 19 rotates the horizontal holding units 37, 38 and the vertical holding units 39, 40 by 90 degrees around the horizontal axis AX2. As a result, the 17 substrates W1 (first substrate group) held by the horizontal holding units 37, 38 and the vertical holding units 39, 40 are converted from a horizontal attitude to a vertical attitude.

[0094] Thereafter, the shelf switching drive unit 53 rotates the first horizontal holder 37 about the rotation axis AX3, and also rotates the second horizontal holder 38 about the rotation axis AX4. As a result, the shelf switching drive unit 53 switches from a state in which the 17 pairs of pre-processing shelves 49A, 49B are available to a state in which the first retraction surface 47A and the second retraction surface 47B are available. In other words, the shelf switching drive unit 53 retracts the 17 pairs of pre-processing shelves 49A, 49B from their positions on the backsides of the 17 substrates W1.

[0095] [Step S04] Receiving the first group of substrates by the pusher mechanism See Figure 13(b). Thereafter, the pusher mechanism 21 raises the pusher member 81, which is not holding a substrate, to a position higher than the horizontal holding units 37, 38. As a result, the pusher member 81 receives the 17 substrates W1 (first substrate group) from the 17 pairs of standard pitch holding grooves 63A, 63B of the vertical holding units 39, 40. The pusher member 81 holds the 17 substrates W1 aligned at the standard pitch (10 mm pitch) in a vertical position. At this time, the surfaces of the 17 substrates W1 face left.

[0096] [Step S05] The pusher mechanism advances the pusher member by 1 / 3 pitch See FIG. 14(a). The pusher horizontal movement unit 87 (see FIG. 8) of the pusher mechanism 21 is moved leftward by a first interval TN1 (e.g., 3.333 mm). The first interval TN1 is 1 / 3 of the reference interval TN9 that constitutes the reference pitch. This movement allows the pusher member 81 to receive the next 17 substrates W2 (second substrate group) at a position spaced apart from the 17 substrates W1 by the first interval TN1. Furthermore, the 17 substrates W1 (first substrate group) and the 17 substrates W2 (second substrate group) can be arranged alternately.

[0097] Additionally, the rotation drive unit 41 of the attitude change unit 19 rotates the horizontal holders 37, 38 and the vertical holders 39, 40 by 90 degrees around the horizontal axis AX2. This raises the horizontal holders 37, 38, etc. Furthermore, the storage / movement unit 73 (see FIG. 3) of the attitude change unit 19 moves the vertical holders 39, 40 away from the horizontal holders 37, 38. Furthermore, the shelf switching drive unit 53 rotates the first horizontal holder 37 around the rotation axis AX3 and rotates the second horizontal holder 38 around the rotation axis AX4. This causes the shelf switching drive unit 53 to switch from a state in which the first retraction surface 47A and the second retraction surface 47B are available to a state in which the 17 pairs of pre-processing shelves 49A, 49B are available. This allows the 17 pairs of pre-processing shelves 49A, 49B to receive the next 17 substrates W2.

[0098] [Step S06] Receiving the second group of substrates by the attitude change unit 14(b), the substrate handling mechanism HTR transports the remaining eight substrates W2 in the first carrier C held by eight of the 25 hands 27 to the attitude changing unit 19. The attitude changing unit 19 receives the eight substrates W2 from the substrate handling mechanism HTR using eight pairs of pre-processing shelves 49A, 49B out of the 17 pairs of pre-processing shelves 49A, 49B.

[0099] 15(a). Thereafter, the substrate handling mechanism HTR removes 25 substrates W2, W3 from the second carrier C placed on the mounting shelf 3. Thereafter, the substrate handling mechanism HTR transports 9 substrates W2 of the removed 25 substrates W2, W3 to the attitude changing unit 19. The attitude changing unit 19 receives the 9 substrates W2 from the substrate handling mechanism HTR using 9 pairs of pre-processing shelves 49A, 49B out of the 17 pairs of pre-processing shelves 49A, 49B. The horizontal holding units 37, 38 of the attitude changing unit 19 hold the 17 substrates W2 (second substrate group) consisting of the 8 substrates W2 from the first carrier C and the 9 substrates W2 from the second carrier C in a horizontal position.

[0100] The pusher mechanism 21 lowers the pusher member 81, which holds the 17 substrates W1 in a vertical position, to a height position at which the next 17 substrates W2 can be received.

[0101] 15(b). Thereafter, the accommodation movement section 73 (see FIG. 3) of the attitude conversion section 19 moves the vertical holding sections 39, 40 closer to the horizontal holding sections 37, 38. As a result, the 17 pairs of reference pitch holding grooves 63A, 63B accommodate the peripheral edges of the 17 substrates W1 in a horizontal attitude that are held (placed) by the horizontal holding sections 37, 38.

[0102] [Step S07] Change the vertical position of the second substrate group See Figure 16(a). After bringing the vertical holding units 39, 40 closer to the horizontal holding units 37, 38, the position changing unit 19 rotates the horizontal holding units 37, 38 and the vertical holding units 39, 40 by 90 degrees around the horizontal axis AX2. As a result, the position changing unit 19 changes the position of the 17 substrates W2 (second substrate group) from horizontal to vertical. Thereafter, the shelf switching drive unit 53 switches from a state in which the 17 pairs of pre-processing shelves 49A, 49B can be used to a state in which the first retraction surface 47A and the second retraction surface 47B can be used.

[0103] [Step S08] Receiving the second group of substrates by the pusher mechanism See Figure 16(b). Thereafter, the pusher mechanism 21 raises the pusher member 81. As a result, the pusher member 81 receives the 17 substrates W2 (second substrate group) from the vertical holding units 39, 40. The pusher member 81 further holds the 17 substrates W2 aligned at the reference pitch (10 mm pitch) in a vertical position. In other words, the pusher member 81 holds the 17 substrates W1 and 17 substrates W2 that are arranged alternately. At this time, the surfaces of the 17 substrates W2 face left.

[0104] [Step S09] The pusher mechanism advances the pusher member by 1 / 3 pitch See Figure 17(a). The pusher mechanism 21 is further moved to the left by the first distance TN1 (3.333 mm). This movement enables the pusher member 81 to receive the next 16 substrates W3 (third substrate group) at a position spaced apart from the 17 substrates W2 by the first distance TN1. The pusher member 81 can also repeatedly arrange the 17 substrates W1, 17 substrates W2, and 16 substrates W3 one by one in sequence.

[0105] Additionally, the attitude conversion unit 19 rotates the horizontal holding units 37, 38 and the vertical holding units 39, 40 by 90 degrees around the horizontal axis AX2. This raises the horizontal holding units 37, 38, etc. Furthermore, the storage transfer unit 73 (see FIG. 3) moves the vertical holding units 39, 40 away from the horizontal holding units 37, 38. Furthermore, the shelf switching drive unit 53 switches from a state in which the first retraction surface 47A and the second retraction surface 47B are available to a state in which the 17 pairs of pre-processing shelves 49A, 49B are available. This allows the 17 pairs of pre-processing shelves 49A, 49B to receive the next 16 substrates W3.

[0106] [Step S10] Receipt of the third group of substrates by the attitude change unit 17(b), the substrate handling mechanism HTR transports the remaining 16 substrates W3 from the second carrier C held by 16 of the 25 hands 27 to the attitude changing unit 19. The attitude changing unit 19 receives the 16 substrates W3 (third substrate group) from the substrate handling mechanism HTR using 16 pairs of pre-processing shelves 49A, 49B from the 17 pairs of pre-processing shelves 49A, 49B. The horizontal holding units 37, 38 hold the 16 substrates W3 (third substrate group) from the second carrier C in a horizontal attitude.

[0107] The pusher mechanism 21 lowers the pusher member 81, which holds the 34 substrates W1, W2 in a vertical position, to a height position at which the next 16 substrates W3 can be received.

[0108] 18(a), the storage / movement unit 73 (see FIG. 3) then moves the vertical holding units 39 and 40 closer to the horizontal holding units 37 and 38.

[0109] [Step S11] Vertical position change of the third substrate group 18(b). Then, the attitude changing unit 19 rotates the horizontal holding units 37, 38 and the vertical holding units 39, 40 by 90 degrees around the horizontal axis AX2. As a result, the attitude changing unit 19 changes the 16 substrates W3 (third substrate group) from a horizontal attitude to a vertical attitude. Then, the shelf switching drive unit 53 switches from a state in which the 17 pairs of pre-processing shelves 49A, 49B can be used to a state in which the first retraction surface 47A and the second retraction surface 47B can be used.

[0110] [Step S12] Receiving the third group of substrates by the pusher mechanism 19(a). Then, the pusher mechanism 21 raises the pusher member 81. As a result, the pusher member 81 receives 16 substrates W3 (third substrate group) from the vertical holders 39 and 40. The pusher member 81 further holds the 16 substrates W3 aligned at the standard pitch (10 mm pitch) in a vertical position. The pusher member 81 holds 50 substrates W (processing substrate group) in which 17 substrates W1, 17 substrates W2, and 16 substrates W3 are arranged one by one in order. At this time, the surfaces of the 16 substrates W3 face left. In other words, all surfaces of the 50 substrates W face left. Therefore, the pusher member 81 holds 50 substrates W aligned face-to-back. The pusher member 81 also holds 50 substrates W aligned at a 1 / 3 pitch.

[0111] [Step S13] Switching to multiple pairs of 2 / 3 pitch holding grooves 19(b), the holding groove switching drive unit 71 rotates the first vertical holding unit 39 about the rotation axis AX5, and also rotates the second vertical holding unit 40 about the rotation axis AX6. As a result, the holding groove switching drive unit 71 changes the state from a first state in which 17 pairs of standard pitch holding grooves 63A, 63B are available to a second state in which 25 pairs of 2 / 3 pitch holding grooves 65A, 65B are available.

[0112] The pusher mechanism 21 also moves the pusher member 81, which holds the 50 substrates W in a vertical position, horizontally in the alignment direction (width direction Y) of the 50 substrates W. At this time, the pusher member 81 is moved, for example, to the right. As a result, as shown in FIG. 20(a), the 25 pairs of ⅔-pitch holding grooves 65A, 65B of the vertical holding units 39, 40 can extract, for example, 25 first substrates W11 from the 50 substrates W (W1, W2, W3). Note that the 50 substrates W (W1, W2, W3) are assumed to be composed of 25 first substrates W11 and 25 second substrates W12, which are alternately arranged. In other words, the 50 substrates W consisting of the substrates W1, W2, and W3 are grouped into 25 first substrates W11 and 25 second substrates W12.

[0113] [Step S14] Receiving two or more first substrates from the two or more alternatingly arranged first substrates and two or more second substrates 20(a), the pusher mechanism 21 lowers the pusher member 81, which holds 50 substrates W in a vertical position, to a height position lower than the vertical holding units 39, 40. The vertical holding units 39, 40 are in a second state in which the 25 pairs of 2 / 3 pitch holding grooves 65A, 65B face each other, thereby enabling the 25 pairs of 2 / 3 pitch holding grooves 65A, 65B to be used.

[0114] Therefore, the vertical holding units 39, 40 receive from the pusher member 81 25 first substrates W11 aligned at a 2 / 3 pitch (for example, a 6.666 mm pitch) out of 50 substrates W, in which 25 first substrates W11 and 25 second substrates W12 are alternately arranged. At this time, the 25 first substrates W11 are held by 25 pairs of 2 / 3 pitch holding grooves 65A, 65B. Also, the 25 second substrates W12 pass through, for example, 26 pairs of passage grooves 66A, 66B shown in FIG. 7. The 25 first substrates W11 are aligned at a 2 / 3 pitch, and the 25 second substrates W12 are also aligned at a 2 / 3 pitch. The 2 / 3 pitch is repeated at the second interval TN2 (6.666 mm).

[0115] In this description, the vertical holding units 39, 40 received 25 first substrates W11 out of the 50 substrates W from the pusher member 81. In this regard, the vertical holding units 39, 40 may also receive 25 second substrates W12 out of the 50 substrates W from the pusher member 81.

[0116] [Step S15] Rotate two or more second substrates 180 degrees around the vertical axis See Figure 20(b). The pusher rotation unit 85 (see Figure 8) of the pusher mechanism 21 rotates the pusher member 81, which holds the 25 second substrates W12 in a vertical position, 180 degrees around the vertical axis AX7. As a result, the surfaces of the 25 second substrates W12 face from left to right. The pusher horizontal movement unit 87 of the pusher mechanism 21 may also horizontally move the pusher member 81, which holds the 25 second substrates W12, to the left. This allows the 25 vertical holding grooves 93, which are not holding a substrate W, to receive the 25 first substrates W11 held by the vertical holding units 39 and 40.

[0117] [Step S16] Alternately arrange two or more first substrates and two or more second substrates rotated 180 degrees. 21(a), the pusher mechanism 21 raises the pusher member 81 holding the 25 second substrates W12 rotated 180 degrees. As a result, the pusher member 81 receives the 25 first substrates W11 from the vertical holders 39, 40. The 25 first substrates W11 are received while the 25 first substrates W11 and the 25 second substrates W12 rotated 180 degrees are alternately arranged.

[0118] As shown in Figure 20(b), the surfaces of the 25 first substrates W11 that are not rotated 180 degrees face left. In contrast, the surfaces of the 25 second substrates W12 that are rotated 180 degrees face right. Therefore, the pusher member 81 shown in Figure 21(a) holds 50 substrates W aligned face-to-face. The pusher member 81 also holds 50 substrates W aligned at a 1 / 3 pitch.

[0119] [Step S17] Substrate processing See Figure 21(b). The delivery mechanism 23 moves the chuck 95 horizontally below the pusher member 81, which holds the 50 substrates W in a vertical position. See Figure 22(a). The pusher mechanism 21 then lowers the pusher member 81. This allows the chuck 95 to receive the 50 substrates W, which are aligned face-to-face and at a 1 / 3 pitch, in a vertical position, from the pusher member 81. See Figure 22(b). The delivery mechanism 23 then moves the chuck 95, which holds the 50 substrates W, to the delivery position P.

[0120] See FIG. 1. Then, the main transport mechanism WTR receives the 50 substrates W in a vertical position from the chuck 95 using the chuck 105 at the transfer position P. The main transport mechanism WTR then transports the 50 substrates W, aligned face-to-face at a 1 / 3 pitch, to one of the two chemical treatment baths BT1, BT3. For example, when the main transport mechanism WTR transports the 50 substrates W to the chemical treatment bath BT1, the lifter LF1 receives the 50 substrates W, aligned face-to-face at a 1 / 3 pitch, from the main transport mechanism WTR at a position above the chemical treatment bath BT1. These 50 substrates W are aligned face-to-face. The lifter LF1 then lowers the 50 substrates W, immersing them in the chemical solution stored in the chemical treatment bath BT1. This allows the 50 substrates W to be chemically treated all at once.

[0121] Furthermore, after a preset chemical treatment time has elapsed, the lifter LF1 raises the 50 substrates W, thereby lifting them out of the chemical solution in the chemical treatment tank BT1. The lifter LF1 then horizontally moves the 50 substrates W from a position above the chemical treatment tank BT1 to a position above the cleaning treatment tank BT2. The lifter LF1 then lowers the 50 substrates W, thereby immersing the 50 substrates W in the pure water stored in the cleaning treatment tank BT2. In this way, the 50 substrates W are cleaned all at once. After a preset cleaning treatment time has elapsed, the lifter LF1 lifts the 50 substrates W out of the pure water in the cleaning treatment tank BT2.

[0122] When the main transport mechanism WTR transports 50 substrates W to the chemical treatment tank BT3, the lifter LF2 receives the 50 substrates W from the main transport mechanism WTR. The lifter LF2 then transports the 50 substrates W to the chemical treatment tank BT3 and the cleaning treatment tank BT4 in that order.

[0123] The main transport mechanism WTR uses the chucks 105 to receive the 50 substrates W from one of the two lifters LF1, LF2, and transports the 50 substrates W to the drying section 103. The drying section 103 dries the 50 substrates W. The main transport mechanism WTR then receives the 50 dried substrates W from the drying section 103. The main transport mechanism WTR transports the 50 dried substrates W to the transfer position P.

[0124] Next, a description will be given of the transport operation of the 50 processed substrates W. This transport operation is performed in the reverse order of Figures 12(a) to 22(b).

[0125] First, the delivery mechanism 23 uses the chucks 95 to receive the 50 processed substrates W from the main transport mechanism WTR at the delivery position P. These 50 vertically oriented substrates W are aligned face-to-face at a 1 / 3 pitch. Then, the delivery mechanism 23 moves the chucks 95 holding the 50 substrates W above the pusher members 81. Then, the pusher mechanism 21 raises the pusher members 81. As a result, the pusher members 81 receive the 50 substrates W from the chucks 95.

[0126] Thereafter, the 50 substrates W aligned face-to-face are aligned face-to-back as shown in the order of Figures 21(a), 20(b), and 20(a). At this time, the horizontal holding units 37, 38, etc. are tilted (see Figure 21(a)). Also, the vertical holding units 39, 40 are moved closer to the horizontal holding units 37, 38. Also, the holding groove switching drive unit 71 sets the 25 pairs of 2 / 3 pitch holding grooves 69A, 69B for post-processing use to a fourth state in which they can be used.

[0127] Thereafter, as shown in the order of Figures 19(b), 19(a), 18(b), 18(a), 17(b), 17(a), 16(b), 16(a), 15(b), 15(a), 14(b), 14(a), 13(b), 13(a), 12(b) and 12(a), the 50 substrates W are disassembled into three substrate groups: a first substrate group (17 substrates W1), a second substrate group (17 substrates W2) and a third substrate group (16 substrates W3).

[0128] When disassembling the substrate groups into three groups held by the pusher member 81, the holding groove switching drive unit 71 sets the 17 pairs of standard pitch holding grooves 67A, 67B for post-processing to a third state in which they can be used. When holding three groups of 50 processed substrates W individually in horizontal positions, the shelf switching drive unit 53 sets multiple pairs of post-processing shelves 51A, 51B in a state in which they can be used. When transferring multiple substrates W between the pair of vertical holders 39, 40 (position conversion unit 19) and the pusher member 81 (pusher mechanism 21), the shelf switching drive unit 53 sets the first retraction surface 47A and the second retraction surface 47B in a state in which they can be used.

[0129] Thereafter, the substrate handling mechanism HTR stores the 25 processed substrates W2, W3 (9 substrates W2 and 16 substrates W3) in the second carrier C placed on the mounting shelf 3. The substrate handling mechanism HTR also stores the 25 processed substrates W1, W2 (17 substrates W1 and 8 substrates W2) in the first carrier C placed on the mounting shelf 3.

[0130] The carrier transport robot 13 transports the first carrier C storing the 25 processed substrates W1, W2 from the loading shelf 3 to the load port 9. The carrier transport robot 13 also transports the second carrier C storing the 25 processed substrates W2, W3 from the loading shelf 3 to the load port 9. An external transport robot (not shown) transports the two carriers C in turn from the load port 9 to the next destination.

[0131] According to this embodiment, the pair of vertical holding units 39, 40 of the posture conversion unit 19 have multiple pairs of standard pitch holding grooves 63A, 63B and multiple pairs of 2 / 3 pitch holding grooves 65A, 65B. The multiple pairs of standard pitch holding grooves 63A, 63B are arranged at the standard pitch. Furthermore, the multiple pairs of 2 / 3 pitch holding grooves 65A, 65B are arranged at a 2 / 3 pitch, which is 2 / 3 times the standard pitch. The holding groove switching drive unit 71 switches the multiple pairs of standard pitch holding grooves 63A, 63B to a usable state. This allows the pusher mechanism 21 to move the first, second, and third substrate groups, each aligned at the standard pitch, on the pusher member 81 while moving the pusher member 81 by 1 / 3 pitch. Therefore, the pusher member 81 temporarily holds multiple substrates W aligned face-to-back at 1 / 3 pitch.

[0132] Then, the holding groove switching drive unit 71 of the posture changer 19 switches the multiple pairs of 2 / 3 pitch holding grooves 65A, 65B to a usable state. This allows the posture changer 19 to remove two or more first substrates W11 from the multiple substrates W held by the pusher member 81, among the multiple substrates W in which two or more first substrates W11 and two or more second substrates W12 are alternately arranged. The pusher mechanism 21 then rotates the two or more second substrates W12 remaining on the pusher member 81 by 180 degrees about the vertical axis AX7. The two or more first substrates W11 removed by the posture changer 19 are then returned to the pusher member 81. This allows the pusher member 81 to hold multiple substrates aligned face-to-face at a 1 / 3 pitch. This makes it possible to easily align multiple substrates face-to-face at a 1 / 3 pitch, which is narrower than the half pitch.

[0133] The holding groove switching drive unit 71 rotates the first vertical holding unit 39 about the rotation axis AX5 and rotates the second vertical holding unit 40 about the rotation axis AX6. This allows the holding groove switching drive unit 71 to switch between four states: a first state in which multiple pairs of reference pitch holding grooves 63A, 63B can be used; a second state in which multiple pairs of 2 / 3 pitch holding grooves 65A, 65B can be used; a third state in which multiple pairs of reference pitch holding grooves 67A, 67B can be used; and a fourth state in which multiple pairs of 2 / 3 pitch holding grooves 69A, 69B can be used.

[0134] The substrates W to be processed in batches are aligned at a pitch narrower than half the pitch (in this embodiment, 1 / 3 pitch). This makes it possible to reduce the size of, for example, the batch processing tank BT1 that accommodates the substrates W. As a result, the amount of processing liquid (chemical liquid and cleaning liquid) used can be reduced. [Example]

[0135] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions that overlap with those of the first embodiment will be omitted. Fig. 23 is a plan view showing a posture change unit 19 according to the second embodiment.

[0136] In Example 1, the vertical holding units 39, 40 are provided with reference pitch holding grooves 63A, 63B and 2 / 3 pitch holding grooves 65A, 65B for handling unprocessed substrates W. The vertical holding units 39, 40 are also provided with multiple pairs of reference pitch holding grooves 67A, 67B and multiple pairs of 2 / 3 pitch holding grooves 69A, 69B for handling processed substrates W. This allows switching between four states.

[0137] In this regard, for example, if there is no need to distinguish between unprocessed and processed substrates W, the vertical holding parts 39, 40 do not need to have the multiple pairs of reference pitch holding grooves 67A, 67B and the multiple pairs of 2 / 3 pitch holding grooves 69A, 69B.

[0138] See Figure 23. The vertical holding portions 39, 40 do not have multiple pairs of reference pitch holding grooves 67A, 67B and multiple pairs of 2 / 3 pitch holding grooves 69A, 69B, but instead have multiple pairs of reference pitch holding grooves 63A, 63B and multiple pairs of 2 / 3 pitch holding grooves 65A, 65B.

[0139] The retaining groove switching drive unit 71 switches between a first state in which multiple pairs of standard pitch retaining grooves 63A, 63B can be used and a second state in which multiple pairs of 2 / 3 pitch retaining grooves 65A, 65B can be used. In other words, the retaining groove switching drive unit 71 may be configured to switch between the two states.

[0140] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0141] (1) In each of the above-described embodiments, the substrate processing apparatus 1 processed 50 substrates W in a batch. However, the substrate processing apparatus 1 may also process 75 substrates W in a batch. In this case, a total of 75 substrates W in three carriers C forms a batch-processed substrate group. In other words, the 75 substrates W are aligned face-to-face at a 1 / 3 pitch.

[0142] The processing substrate groups are formed based on the flowcharts of Figures 10 and 11. The 25 substrates W1 on the first carrier C are used as the first substrate group. The 25 substrates W2 on the second carrier C are used as the second substrate group. The 25 substrates W3 on the third carrier C are used as the third substrate group.

[0143] For example, one pair of horizontal holding portions 37, 38 includes 25 pairs of pre-processing shelves 49A, 49B and 25 pairs of post-processing shelves 51A, 51B. The pusher member 81 includes 75 or 76 vertical holding grooves 93.

[0144] Furthermore, the pair of vertical holding parts 39, 40 are provided with 25 pairs of standard pitch holding grooves 63A, 63B and 38 pairs of 2 / 3 pitch holding grooves 65A, 65B for handling unprocessed substrates W. Furthermore, the pair of vertical holding parts 39, 40 are provided with 25 pairs of standard pitch holding grooves 67A, 67B and 38 pairs of 2 / 3 pitch holding grooves 69A, 69B for handling processed substrates W.

[0145] (2) In each of the above-described embodiments, the substrate processing apparatus 1 processed 50 substrates W in a batch. However, the substrate processing apparatus 1 may also process 100 substrates W in a batch. In this case, a total of 100 substrates W in four carriers C forms a batch-processed substrate group. In other words, the 100 substrates W are aligned face-to-face at a 1 / 3 pitch.

[0146] The processing substrate groups are formed based on the flowcharts in Figures 10 and 11. The 25 substrates W1 on the first carrier C and the 9 substrates W1 on the second carrier C (34 substrates W1) are used as the first substrate group. The remaining 16 substrates W2 on the second carrier C and the 17 substrates W2 on the third carrier C (33 substrates W2) are used as the second substrate group. The remaining 8 substrates W3 on the third carrier C and the 25 substrates W3 on the fourth carrier C (33 substrates W3) are used as the third substrate group.

[0147] For example, one pair of horizontal holding portions 37, 38 includes 34 pairs of pre-processing shelves 49A, 49B and 34 pairs of post-processing shelves 51A, 51B. The pusher member 81 includes 100 vertical holding grooves 93.

[0148] Furthermore, the pair of vertical holding parts 39, 40 are provided with 34 pairs of reference pitch holding grooves 63A, 63B and 50 pairs of 2 / 3 pitch holding grooves 65A, 65B for handling unprocessed substrates W. Furthermore, the pair of vertical holding parts 39, 40 are provided with 34 pairs of reference pitch holding grooves 67A, 67B and 50 pairs of 2 / 3 pitch holding grooves 69A, 69B for handling processed substrates W.

[0149] (3) In the above-described embodiments and modifications, the groove switching drive unit 71 of the posture conversion unit 19 rotates the first vertical holder 39 about the rotation axis AX5 and rotates the second vertical holder 40 about the rotation axis AX6. As a result, for example, the groove switching drive unit 71 switches from a first state in which multiple pairs of reference pitch grooves 63A, 63B can be used to a second state in which multiple pairs of 2 / 3 pitch grooves 65A, 65B can be used. This switching may be performed not by rotation of the vertical holders 39, 40 but by horizontal movement, for example.

[0150] For example, as shown in Figures 24(a) and 24(b), the attitude conversion unit 19 has two pairs of vertical holding units 121, 122, 123, and 124. One pair of vertical holding units 121 and 122 has, for example, 17 pairs of reference pitch holding grooves 63A and 63B. The other pair of vertical holding units 123 and 124 has, for example, 25 pairs of 2 / 3 pitch holding grooves 65A and 65B. The pair of vertical holding units 121 and 122 can move in the front-rear direction X. The other pair of vertical holding units 123 and 124 can also move in the front-rear direction X.

[0151] The holding groove switching drive unit 71 includes, for example, an electric actuator or an air cylinder. As shown in FIG. 24(a), the holding groove switching drive unit 71 moves a pair of vertical holding units 121, 122 closer to each other. This allows the pair of vertical holding units 121, 122 to hold 17 substrates W in a vertical position aligned at the standard pitch. Furthermore, as shown in FIG. 24(b), the holding groove switching drive unit 71 moves another pair of vertical holding units 123, 124 closer to each other. This allows the other pair of vertical holding units 123, 124 to hold 25 substrates W aligned at a 2 / 3 pitch.

[0152] (4) In the above-described embodiments and modifications, the transfer mechanism 23 transports, for example, 50 substrates W between the pusher mechanism 21 and the main transport mechanism WTR. That is, the transfer mechanism 23 transports 50 substrates W from the pusher member 81 to the transfer position P with the main transport mechanism WTR. However, the pusher mechanism 21 may directly transport 50 substrates W to the transfer position P. In this case, the transfer mechanism 23 may not be provided.

[0153] (5) In the above-described embodiments and modifications, the transfer block 5 includes one transfer mechanism 23. However, the transfer block 5 may include multiple transfer mechanisms 23. For example, when two transfer mechanisms 23 are included, the first transfer mechanism 23 may transport 50 substrates W from the pusher member 81 to the transfer position P with the main transport mechanism WTR. The second transfer mechanism 23 may transport 50 substrates W from another substrate transfer position with the main transport mechanism WTR to the pusher member 81.

[0154] (6) In the above-described embodiments and modifications, the pusher member 81 holds a plurality of substrates W formed from three substrate groups. The plurality of substrates W are aligned at a 1 / 3 pitch. However, the plurality of substrates W to be processed collectively (processing substrate group) may be aligned at a 1 / 4 pitch or a 1 / 5 pitch.

[0155] For example, when multiple substrates W are aligned at a 1 / 4 pitch (e.g., 2.5 mm pitch), the multiple substrates W are formed into four substrate groups. Accordingly, the vertical holding units 39, 40 may be provided with multiple pairs of 1 / 2 pitch holding grooves aligned at a 1 / 2 pitch (2 / 4 pitch) (e.g., 5 mm pitch) in the extension direction DR2, instead of the 2 / 3 pitch holding grooves 65A, 65B (69A, 69B). Furthermore, when multiple substrates W are aligned at a 1 / 5 pitch (e.g., 2 mm pitch), the multiple substrates W are formed into five substrate groups. Accordingly, the vertical holding units 39, 40 may be provided with multiple pairs of 2 / 5 pitch holding grooves aligned at a 2 / 5 pitch (e.g., 4 mm pitch) in the extension direction DR2, instead of the 2 / 3 pitch holding grooves 65A, 65B (69A, 69B).

[0156] That is, multiple substrates W to be processed collectively are aligned at a 1 / N pitch. In this case, the multiple substrates W are formed by a group of N substrates. Accordingly, the vertical holding parts 39, 40 may be provided with multiple pairs of 2 / N pitch holding grooves aligned at a 2 / N pitch in the extension direction DR2, instead of the 2 / 3 pitch holding grooves 65A, 65B (69A, 69B). Note that "N" in 1 / N pitch, 2 / N pitch, and N is a natural number greater than or equal to 3. [Explanation of symbols]

[0157] 1... Substrate processing equipment 3... Shelf HTR: Substrate handling mechanism 19 ... Posture conversion unit 21 ... Pusher mechanism 27...Hand 35 … Support stand 35A … Support surface 37,38 … Horizontal holding part 39,40 … Vertical holding section 41 ... Rotation drive unit 55A,57A,59A,61A … Outer surface 55B, 57B, 59B, 61B … Outer surface 63A, 63B ... Reference pitch retaining groove 65A, 65B ... 2 / 3 pitch retaining groove 67A, 67B ... Reference pitch retaining groove 69A, 69B ... 2 / 3 pitch retaining groove 71 ... Retaining groove switching drive unit 81 ... Pusher member 85 ... Pusher rotating part 87 ... Pusher horizontal movement part 91 ... Pusher lifting section 93 ... Vertical holding groove WTR: Main transport mechanism BT1~BT4 ... Batch processing tanks 111 ... Control unit 121, 122, 123, 124 ... Vertical holding section DR2: Extension direction AX2…Horizontal axis AX5, AX6 ... Rotation axis AX7: Vertical axis P... Handover position C...Career W(W1,W2,W3,W11,W12) … Board

Claims

1. In a substrate processing apparatus for processing a plurality of substrates at once, a substrate handling mechanism having a plurality of hands arranged vertically at a reference pitch and each holding one substrate in a horizontal position; a posture conversion unit that converts N substrate groups, where N is a natural number greater than or equal to three, received in order from the substrate handling mechanism, each of the N substrate groups consisting of two or more substrates aligned at the reference pitch, from a horizontal posture to a vertical posture individually; a pusher mechanism having a pusher member that holds the plurality of substrates aligned at a 1 / N pitch that is 1 / N times the reference pitch in a vertical position, the pusher mechanism forming the plurality of substrates on the pusher member by aligning the group of N substrates received from the position conversion unit in a single row on the pusher member while shifting the pusher member by 1 / N pitch in an alignment direction in which the plurality of substrates are aligned; Equipped with The posture conversion unit is A support base; a pair of horizontal holding portions that are provided to extend perpendicular to the support surface of the support table and that hold one of the N substrate groups in a horizontal position; a pair of vertical holding portions each having a plurality of pairs of reference pitch holding grooves and a plurality of pairs of 2 / N pitch holding grooves, the vertical holding portions being provided so as to extend perpendicular to the support surface of the support base; a rotation drive unit that rotates the support base around a horizontal axis; a switching drive unit that switches between a state in which the plurality of pairs of reference pitch holding grooves can be used and a state in which the plurality of pairs of 2 / N pitch holding grooves can be used, the plurality of pairs of standard pitch holding grooves are arranged at the standard pitch in an extension direction in which the pair of vertical holding portions extend, The plurality of pairs of 2 / N pitch retaining grooves are arranged at a 2 / N pitch that is 2 / N times the reference pitch in the extension direction, The switching drive unit is When forming the plurality of substrates aligned face-to-back on the pusher member, the plurality of pairs of reference pitch holding grooves are made usable, and The substrate processing apparatus is characterized in that, when the plurality of substrates held by the pusher member are rearranged face-to-face, the plurality of pairs of 2 / N pitch holding grooves are made usable.

2. 2. The substrate processing apparatus according to claim 1, a first vertical holding portion of the pair of vertical holding portions is rotatable about a first rotation axis that passes through the first vertical holding portion and extends perpendicular to the support surface; the first vertical holding portion has a first outer circumferential surface and a second outer circumferential surface provided around the first rotation axis, a second vertical support portion of the pair of vertical support portions is rotatable about a second rotation axis that passes through the second vertical support portion and extends perpendicular to the support surface; the second vertical holding portion has a third outer peripheral surface and a fourth outer peripheral surface provided around the second rotation axis, the first outer peripheral surface and the third outer peripheral surface are provided with the plurality of pairs of reference pitch retaining grooves, The second outer peripheral surface and the fourth outer peripheral surface are provided with the plurality of pairs of 2 / N pitch retaining grooves, The substrate processing apparatus is characterized in that the switching drive unit rotates the first vertical holding unit around the first rotation axis and rotates the second vertical holding unit around the second rotation axis, thereby switching between a state in which the multiple pairs of standard pitch holding grooves can be used and a state in which the multiple pairs of 2 / N pitch holding grooves can be used.

3. 3. The substrate processing apparatus according to claim 2, the first vertical holding portion has, in addition to the first outer peripheral surface and the second outer peripheral surface, a fifth outer peripheral surface and a sixth outer peripheral surface provided around the first rotation axis, the second vertical holding portion has, in addition to the third outer peripheral surface and the fourth outer peripheral surface, seventh and eighth outer peripheral surfaces provided around the second rotation axis, a plurality of pairs of post-processing reference pitch retaining grooves arranged at the reference pitch in the extension direction are provided on the fifth outer peripheral surface and the seventh outer peripheral surface; The sixth outer peripheral surface and the eighth outer peripheral surface are provided with a plurality of pairs of post-processing 2 / N pitch retaining grooves arranged at the 2 / N pitch in the extension direction, the switching drive unit rotates the first vertical holding unit around the first rotation axis and rotates the second vertical holding unit around the second rotation axis, thereby switching between a state in which the plurality of pairs of reference pitch holding grooves can be used, a state in which the plurality of pairs of 2 / N pitch holding grooves can be used, a state in which the plurality of pairs of post-processing reference pitch holding grooves can be used, and a state in which the plurality of pairs of post-processing 2 / N pitch holding grooves can be used; The switching drive unit is When rearranging the plurality of substrates held by the pusher member face-to-back, the plurality of pairs of post-processing 2 / N pitch holding grooves are made available for use, and a plurality of pairs of post-processing reference pitch holding grooves that are brought into a usable state when the plurality of substrates held by the pusher member are separated into the N substrate groups;

4. 2. The substrate processing apparatus according to claim 1, a control unit, The control unit The switching drive unit causes the plurality of pairs of reference pitch holding grooves to be in a usable state, The attitude conversion unit receives the group of N substrates in order from the substrate handling mechanism, and The posture changing unit changes the posture of each of the N substrate groups from a horizontal posture to a vertical posture, the pusher mechanism shifts the pusher member by the 1 / N pitch in the alignment direction, and causes the pusher member to receive the N substrate groups in order, thereby holding the plurality of substrates formed from the N substrate groups and aligned face-to-back at the 1 / N pitch on the pusher member; The switching drive unit causes the plurality of pairs of 2 / N pitch holding grooves to be in a usable state, the pair of vertical holding portions receive, from the pusher member, the two or more first substrates aligned at the 2 / N pitch among the plurality of substrates in which two or more first substrates and two or more second substrates are alternately arranged; the pusher mechanism rotates the pusher member, which holds the two or more second substrates in a vertical position, by 180 degrees around a vertical axis; A substrate processing apparatus characterized in that the two or more first substrates and the two or more second substrates rotated 180 degrees are alternately arranged, and the pusher member receives the two or more first substrates from the pair of vertical holding parts.

5. 2. The substrate processing apparatus according to claim 1, a substrate processing section for collectively processing the plurality of substrates aligned face-to-face at the 1 / N pitch; a main transport mechanism that transports the plurality of substrates aligned face-to-face at the 1 / N pitch to the substrate processing section; The substrate processing apparatus further comprises:

6. 6. The substrate processing apparatus according to claim 1, wherein the N substrate groups are three substrate groups, The 1 / N pitch is a 1 / 3 pitch that is 1 / 3 times the reference pitch, The substrate processing apparatus is characterized in that the plurality of pairs of 2 / N pitch holding grooves are a plurality of pairs of 2 / 3 pitch holding grooves arranged at a 2 / 3 pitch that is 2 / 3 times the reference pitch in the extension direction.

7. 4. The substrate processing apparatus according to claim 3, the N substrate groups are three substrate groups, The 1 / N pitch is a 1 / 3 pitch that is 1 / 3 times the reference pitch, The plurality of pairs of 2 / N pitch retaining grooves are a plurality of pairs of 2 / 3 pitch retaining grooves that are arranged at a 2 / 3 pitch that is 2 / 3 times the reference pitch in the extension direction, The substrate processing apparatus, wherein the plurality of pairs of post-processing 2 / N pitch holding grooves are a plurality of pairs of post-processing 2 / 3 pitch holding grooves arranged at 2 / 3 pitches in the extension direction.

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