Substrate processing device and substrate processing method

Abstract

To provide a substrate processing device with a pitch conversion part capable of easily keeping each substrate at a vertical posture, and a substrate processing method.SOLUTION: A substrate processing device 1 comprises a pitch conversion part 25 for converting a pitch of plural substrates W between an unequal pitch, at which a first interval TN1 and a second interval TN2 larger than the first interval TN1 are alternately repeated, and a narrow pitch at which the first interval TN1 is repeated. The pitch conversion part 25 comprises: plural holding members 113 for holding the plural substrates W aligned at the unequal pitch; and a movement part 115 for moving the plural holding members 113 in an alignment direction of the plural substrates W so that it is changed between an unequal pitch condition under which the plural substrates W are aligned at the unequal pitch and a narrow pitch condition under which the plural substrates W are aligned at the narrow pitch. each of the plural holding members 113 has two holding grooves 117 for individually holding two substrates W. The two holding grooves 117 are separated from each other in the first interval TN1.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for processing substrates, such as semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. FPDs include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] Conventionally, there has been known a substrate processing apparatus that processes a plurality of substrates by immersing them all at once in a processing solution. This substrate processing apparatus includes a position change mechanism (position change unit) and a pusher (pusher mechanism) (see, for example, Patent Document 1). The position change mechanism changes the position of the substrates between a horizontal position and a vertical position. The pusher can transfer a plurality of substrates in a vertical position to and from the position change mechanism by vertical movement of a lifting and lowering holding unit (pusher member).

[0003] After 25 substrates are handed over from the position change mechanism to the lifting holder, the lifting holder rotates 180 degrees around its vertical axis. This 180-degree rotation moves the 25 held substrates by a half-pitch. In this state, another 25 substrates are handed over to the lifting holder from the position change mechanism. As a result, the 25 substrates handed over later are inserted between the 25 substrates handed over earlier, forming a group of 50 substrates in total on the lifting holder. At this point, two adjacent substrates are in a face-to-face position, with their front surfaces (or back surfaces) facing each other. The 50 substrates held by the lifting holder are also aligned at a half-pitch, half the substrate holding pitch within the carrier.

[0004] Patent Document 2 discloses a pitch conversion unit. The pitch conversion unit has a base member, 25 chucks (holding members) slidably mounted on the base member, and a pitch change mechanism that changes the spacing between the chucks. Each chuck vacuum-sucks part of the peripheral edge of one substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-093230 [Patent Document 2] Japanese Patent Publication No. 2022-077177 Summary of the Invention [Problem to be solved by the invention]

[0006] In order to reduce the amount of processing liquids (chemicals and cleaning liquids) used in a substrate processing apparatus, there is a demand for aligning multiple substrates at a pitch even narrower than half pitch and processing multiple substrates aligned at this narrow pitch all at once. In this case, for example, if a pitch conversion unit attempts to hold 50 substrates with 50 holding members, the width of each holding member in the alignment direction of the 50 substrates will be thin. This makes it difficult to ensure dimensional accuracy for each holding member, which in turn makes it difficult to hold each substrate in a vertical position.

[0007] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate processing apparatus and a substrate processing method equipped with a pitch conversion unit that can easily hold each substrate in a vertical position. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention has the following configuration: That is, a substrate processing apparatus according to the present invention is a substrate processing apparatus for processing a plurality of substrates, comprising: a pitch conversion unit that converts the pitch of the plurality of substrates between an uneven pitch, in which a first interval and a second interval wider than the first interval are alternately repeated, and a narrow pitch, in which the first interval is repeated, a substrate processing unit that collectively processes the plurality of substrates aligned at the narrow pitch, and a main transport mechanism that transports the plurality of substrates aligned at the narrow pitch to the substrate processing unit, wherein the pitch conversion unit comprises a plurality of holding members that hold the plurality of substrates aligned at the uneven pitch, and a movement unit that moves the plurality of holding members in an alignment direction of the plurality of substrates to change the state between the uneven pitch state in which the plurality of substrates are aligned at the uneven pitch and the narrow pitch state in which the plurality of substrates are aligned at the narrow pitch, and each of the plurality of holding members has two holding grooves that individually hold two of the plurality of substrates, the two holding grooves being spaced apart by the first interval.

[0009] In the substrate processing apparatus according to the present invention, the pitch conversion unit includes a plurality of holding members that hold a plurality of substrates aligned at an irregular pitch, and a moving unit that moves the plurality of holding members in the alignment direction to change between an irregular pitch state in which the plurality of substrates are aligned at an irregular pitch and a narrow pitch state in which the plurality of substrates are aligned at a narrow pitch. Each of the plurality of holding members has two holding grooves that individually hold two of the plurality of substrates. The two holding grooves are separated by a first distance (first distance < second distance). By each holding member having two holding grooves that hold two substrates, the width of each holding member in the alignment direction of the plurality of substrates can be relatively large. This ensures dimensional accuracy of each holding member, and the plurality of holding members can easily hold each substrate in a vertical position.

[0010] In the substrate processing apparatus described above, the two holding grooves are preferably spaced apart by a first distance that is smaller than half the second distance. The uneven pitch is defined by alternating first distances and second distances that are larger than the first distance. Here, it is assumed that there is a predetermined distance that is composed of one first distance and one second distance. For example, if the predetermined distance is 10 mm, and the first distance is smaller than half the second distance, the first distance can be smaller than one-third of 10 mm, and the first distance can be any length, such as 3 mm with no decimal points.

[0011] In the substrate processing apparatus described above, the two holding grooves are preferably configured to be spaced apart by the first interval, which is half the second interval. The uneven pitch is achieved by alternately arranging the first interval and a second interval, which is wider than the first interval. Here, assume that there is a predetermined interval consisting of one first interval and one second interval. If the predetermined interval is, for example, 10 mm, and the first interval is half the second interval, the first interval can be set to 1 / 3 of 10 mm, and the second interval can be set to 2 / 3 of 10 mm.

[0012] In the substrate processing apparatus described above, the moving unit preferably includes a guide rail that supports the plurality of holding members movably in the alignment direction, an extension / contraction mechanism that extends and contracts the plurality of holding members in the alignment direction, and a drive unit that drives the extension / contraction mechanism. The guide rail can support the plurality of holding members movably in the alignment direction. The extension / contraction mechanism driven by the drive unit can extend and contract the plurality of holding members.

[0013] In the substrate processing apparatus described above, the extension / contraction mechanism preferably includes: a storage portion provided on a first holding member of the plurality of holding members; a protrusion protruding from the second holding member toward the first holding member adjacent to the second holding member of the plurality of holding members, the protrusion being stored in the storage portion when the plurality of holding members contract in the alignment direction; and a stopper provided at a tip of the protrusion, the stopper preventing the protrusion from coming off the storage portion when the plurality of holding members expand in the alignment direction. The extension / contraction mechanism can extend or contract the plurality of holding members using the storage portion, the protrusion, and the stopper.

[0014] In the substrate processing apparatus described above, it is preferable that the extension / contraction mechanism further includes an elastic member provided between the first holding member and the second holding member. When the multiple holding members are extended in the alignment direction and contracted in the alignment direction, the positions of the respective holding members are in a free state. By providing the elastic member, the movement of each holding member in a free state can be suppressed. As a result, the vibration of the multiple substrates held in a vertical position by the multiple holding grooves can be suppressed. This can prevent, for example, two adjacent substrates from coming into contact with each other.

[0015] Furthermore, it is preferable that the above-mentioned substrate processing apparatus further comprises a posture change mechanism that changes the posture of the plurality of substrates between a horizontal posture and a vertical posture, a pusher mechanism that has a pusher member that holds the plurality of substrates aligned at the uneven pitch in a vertical posture and is capable of transferring substrates to and from the posture change mechanism, and a transfer mechanism that transports the plurality of substrates aligned at the uneven pitch between the pusher member and the pitch change section.

[0016] The substrate processing apparatus further includes a control unit, wherein the control unit causes the posture conversion mechanism to convert two or more first substrates held at a standard pitch, where the standard pitch is a repeating reference interval that is the sum of the first interval and the second interval, from a horizontal posture to a vertical posture all at once, causes the pusher member to receive the two or more first substrates converted to the vertical posture and hold the two or more first substrates aligned at the standard pitch in a vertical posture, causes the pusher mechanism to move the two or more first substrates held by the pusher member at the first interval in the alignment direction of the two or more first substrates, causes the posture conversion mechanism to convert two or more second substrates held at the standard pitch all at once from a horizontal posture to a vertical posture, and It is preferable that the pusher member receives the two or more second substrates converted to a vertical position, the pusher member holds the plurality of substrates consisting of the two or more first substrates and the two or more second substrates arranged alternately and aligned at the uneven pitch, the delivery mechanism transports the plurality of substrates aligned at the uneven pitch from the pusher member to the pitch conversion unit, the pitch conversion unit converts the pitch of the plurality of substrates from the uneven pitch to the narrow pitch, the main transport mechanism transports the plurality of substrates aligned at the narrow pitch to the substrate processing unit, and the substrate processing unit processes the plurality of substrates aligned at the narrow pitch all at once.

[0017] Two or more first substrates are aligned at a reference pitch, and two or more second substrates are aligned at the reference pitch. The two or more second substrates are positioned offset from the two or more first substrates by a first distance in the alignment direction. As a result, the multiple substrates, in which the two or more first substrates and the two or more second substrates are alternately arranged, are aligned at an uneven pitch. The pitch conversion unit then narrows the multiple substrates aligned at the uneven pitch. That is, a first pitch conversion is performed by aligning the two or more first substrates and the two or more second substrates at an uneven pitch, and a second pitch conversion is performed to narrow the uneven pitch. By performing the pitch conversion in two stages, the two or more first substrates and the two or more second substrates, each aligned at the reference pitch, can be easily converted to a narrow pitch.

[0018] Furthermore, in the above-mentioned substrate processing apparatus, it is preferable that the apparatus further comprises a carrier mounting shelf for mounting carriers that store N substrates, where N is a natural number greater than or equal to 2, aligned at a reference pitch at which a reference interval that is the sum of the first interval and the second interval is repeated, and the posture conversion mechanism comprises a posture conversion unit that individually converts two or more first substrates and two or more second substrates between a horizontal posture and a vertical posture, and a substrate handling mechanism that transports the N substrates between the carriers mounted on the carrier mounting shelf and the posture conversion unit.

[0019] The substrate processing apparatus further includes a control unit, and the control unit causes the substrate handling mechanism to transport the N substrates in the first carrier in the horizontal orientation aligned at the reference pitch from a first carrier placed on the carrier mounting shelf to the orientation conversion unit, causes the substrate handling mechanism to transport P substrates in the horizontal orientation aligned at the reference pitch from a second carrier placed on the carrier mounting shelf to the orientation conversion unit, and causes the orientation conversion unit to transfer P substrates in the horizontal orientation aligned at the reference pitch from the N substrates in the second carrier. The two or more first substrates having the N substrates and the P substrates of the first carrier are converted from a horizontal position to a vertical position all at once, the pusher member receives the two or more first substrates converted to the vertical position and holds the two or more first substrates aligned at the reference pitch, the pusher mechanism moves the two or more first substrates held by the pusher member at the first interval in the alignment direction of the two or more first substrates, and the substrate handling mechanism aligns the N substrates of the second carrier at the reference pitch. the remaining Q substrates in the horizontal orientation aligned at the reference pitch are transported to the orientation conversion unit by the substrate handling mechanism, the N substrates in the third carrier in the horizontal orientation aligned at the reference pitch are transported from a third carrier placed on the carrier mounting shelf to the orientation conversion unit by the substrate handling mechanism, the two or more second substrates having the Q substrates held at the reference pitch and the N substrates in the third carrier are collectively converted from the horizontal orientation to a vertical orientation by the orientation conversion unit, the two or more second substrates having the Q substrates held at the reference pitch and the N substrates in the third carrier are collectively converted from the horizontal orientation to a vertical orientation by the pusher member, and the two or more second substrates converted to the vertical orientation are then transported to the orientation conversion unit by the substrate handling mechanism, a pusher member holds the plurality of substrates consisting of the two or more first substrates and the two or more second substrates arranged alternately, the plurality of substrates being aligned at the uneven pitch; the delivery mechanism transports the plurality of substrates aligned at the uneven pitch from the pusher member to the pitch conversion unit; the pitch conversion unit converts the pitch of the plurality of substrates from the uneven pitch to the narrow pitch; the main transport mechanism transports the plurality of substrates aligned at the narrow pitch to the substrate processing unit; and the substrate processing unitIt is preferable that the plurality of substrates aligned at the narrow pitch are processed collectively.

[0020] The first pitch conversion is performed by aligning N substrates with a standard pitch stored in each of the three carriers at an uneven pitch, and the second pitch conversion is performed to change the uneven pitch to a narrow pitch. By performing pitch conversion in two stages, the N substrates with a standard pitch stored in each of the three carriers can be easily converted to a narrow pitch.

[0021] The substrate processing apparatus further includes a control unit, wherein the control unit causes the main transport mechanism to transport the plurality of substrates that have been processed collectively in the substrate processing unit and are aligned in a vertical position at the narrow pitch to a position above the pitch conversion unit, causes the pitch conversion unit to hold the plurality of substrates that have been aligned in a vertical position at the narrow pitch, causes the pitch conversion unit to convert the pitch of the plurality of substrates from the narrow pitch to the uneven pitch, causes the delivery mechanism to transport the plurality of substrates aligned at the uneven pitch from the pitch conversion unit to the pusher member, and causes the pusher member to hold the substrates aligned at the uneven pitch. It is preferable that the plurality of substrates, in which two or more first substrates and two or more second substrates are arranged alternately, are held in a vertical position, the position change mechanism receives the two or more first substrates, which are aligned at a reference pitch, from the pusher member and converts the two or more first substrates from the vertical position to a horizontal position, and the position change mechanism receives the two or more second substrates, which are aligned at a reference pitch, from the pusher member and converts the two or more second substrates from the vertical position to a horizontal position, and the reference pitch is a repeating reference interval which is the sum of the first interval and the second interval.

[0022] A first pitch conversion is performed to align multiple substrates with narrow pitches that have been processed collectively in a substrate processing unit at an uneven pitch. Then, the multiple substrates aligned at an uneven pitch, with two or more first substrates and two or more second substrates alternately arranged, are disassembled into two or more first substrates and two or more second substrates, each arranged at a standard pitch. This results in a second pitch conversion. By performing pitch conversion in two stages, multiple substrates aligned at a narrow pitch (two or more first substrates and two or more second substrates) can be easily converted to the standard pitch.

[0023] Furthermore, a substrate processing method according to the present invention is a substrate processing method for processing a plurality of substrates, and includes a pitch conversion step of converting the pitch of the plurality of substrates from an uneven pitch, in which a first interval and a second interval wider than the first interval are alternately arranged, to a narrow pitch, in which the first interval is repeated, by a pitch conversion unit; a substrate transport step of transporting the plurality of substrates aligned at the narrow pitch to a substrate processing unit by a main transport mechanism; and a substrate processing step of processing the plurality of substrates aligned at the narrow pitch collectively by the substrate processing unit, wherein the pitch conversion step The method is characterized by comprising: a holding process for holding the plurality of substrates aligned at the uneven pitch using the plurality of holding members, while individually holding two of the plurality of substrates using two holding grooves separated by the first interval that each of the plurality of holding members has; and a pitch conversion execution process for moving the plurality of holding members in the alignment direction of the plurality of substrates using a moving unit, so as to change the uneven pitch state in which the plurality of substrates are aligned at the uneven pitch to a narrow pitch state in which the plurality of substrates are aligned at the narrow pitch. [Effects of the Invention]

[0024] According to the substrate processing apparatus and substrate processing method of the present invention, the pitch changing section can easily hold each substrate in a vertical position. [Brief explanation of the drawings]

[0025] [Figure 1]1 is a plan view showing a schematic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a plan view showing the configuration of a transfer block and its surroundings. [Figure 3] FIG. 2 is a side view showing the substrate handling mechanism. [Figure 4] FIG. [Figure 5] FIG. 10 is a side view showing the pusher mechanism. [Figure 6] FIG. 4 is a side view showing a vertical cross section of the pusher member. [Figure 7] 3 is a side view showing the delivery mechanism, two pitch conversion units, etc., as seen in the direction of arrow AA in FIG. 2. [Figure 8] FIG. 2 is a plan view mainly showing a carry-in mechanism and a carry-out mechanism. [Figure 9] FIG. [Figure 10] 10 is a side view showing a schematic configuration of a pitch conversion unit that holds a plurality of substrates aligned at unequal pitches. FIG. [Figure 11] 10 is a side view showing a schematic configuration of a pitch conversion unit that holds a plurality of substrates aligned at a narrow pitch. FIG. [Figure 12] 10 is a bottom view mainly showing the expansion and contraction mechanism of the pitch conversion unit that holds a plurality of substrates aligned at unequal pitches. FIG. [Figure 13] 10 is a bottom view mainly showing the expansion and contraction mechanism of the pitch conversion unit that holds a plurality of substrates aligned at a narrow pitch. FIG. [Figure 14] 10 is a flowchart illustrating the first half of the operation of the substrate processing apparatus. [Figure 15] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 16] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 17] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 18] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 19] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 20] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 21] 10 is a flowchart illustrating a second half of the operation of the substrate processing apparatus. [Figure 22] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 23] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 24] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus. [Figure 25] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 26] 1(a) to 1(c) are side views illustrating the operation of the substrate processing apparatus. [Figure 27] FIG. 10 is a bottom view mainly showing the expansion and contraction mechanism of the pitch conversion unit that holds a plurality of substrates aligned at unequal pitches according to the second embodiment. [Figure 28] FIG. 10 is a bottom view mainly showing the expansion and contraction mechanism of the pitch conversion unit that holds a plurality of substrates aligned at a narrow pitch according to the second embodiment. [Figure 29] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus according to the third embodiment. [Figure 30] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus according to the third embodiment. [Figure 31] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus according to the third embodiment. [Figure 32] 10(a) and 10(b) are side views for explaining the operation of the substrate processing apparatus according to the third embodiment. Example 1

[0026] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to the first embodiment. Fig. 2 is a plan view showing a transfer block 5 and its surrounding configuration.

[0027] For convenience, in this specification, the direction in which the transfer block 5 and the processing block 7 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, for example, the direction from the processing block 7 toward the transfer block 5 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0028] <1. Configuration of the substrate processing apparatus> Referring to Figure 1, the substrate processing apparatus 1 processes substrates W. The substrate processing apparatus 1 is a batch-type substrate processing apparatus that processes a plurality of substrates W (e.g., 50, 75, or 100) at once. The substrate processing apparatus 1 performs, for example, chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 includes a stocker 2, a loading shelf 3, a transfer block 5, a processing block 7, and a batch substrate transport area 8.

[0029] <1-1. Stocker> The stocker 2 accommodates at least one carrier C. The stocker 2 is adjacent to the front of the transfer block 5. The carrier C stores multiple (e.g., 25) substrates W in a horizontal position with a predetermined interval (e.g., 10 mm) between them. In other words, the carrier C stores N (e.g., 25) substrates W aligned at a standard pitch in a horizontal position. N is a natural number equal to or greater than 2. The standard pitch is a repeated standard interval TN9 (e.g., 10 mm (millimeters)). In other words, when the standard interval TN9 is 10 mm, the standard pitch is 10 mm. The N substrates W in the carrier C are aligned in the vertical direction Z or the thickness direction of each substrate W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited to this.

[0030] The stocker 2 is equipped with a plurality of (for example, two) load ports 9. The two load ports 9 are arranged in the width direction Y. In this embodiment, the two load ports 9 are used to load and unload carriers C. The stocker 2 also is equipped with at least one storage shelf 11 and a carrier transport robot 13. The carriers C are placed on the storage shelf 11.

[0031] The carrier transport robot 13 transports the carrier C between the two load ports 9, the storage shelf 11, and the loading shelf 3. The carrier transport robot 13 is equipped with a gripping unit 15 that grips a protrusion provided on the top surface of the carrier C, for example. The carrier transport robot 13 can move the gripping unit 15 in the horizontal direction (front-back direction X and width direction Y) and the vertical direction Z. The carrier transport robot 13 is driven by one or more electric motors.

[0032] The loading shelf 3 is arranged in the area of ​​the stocker 2. The loading shelf 3 is adjacent to the front of the transfer block 5. The loading shelf 3 has the carrier C loaded thereon. The loading shelf 3 corresponds to the carrier loading shelf of the present invention.

[0033] <1-2. Transfer block> See Figures 1 and 2. The transfer block 5 includes a substrate handling mechanism (robot) HTR, a posture conversion unit 19, a pusher mechanism 21, a transfer mechanism 23, and two pitch conversion units 25 and 26. The posture conversion unit 19 corresponds to the posture conversion mechanism of the present invention. One of the two pitch conversion units 25 and 26 corresponds to the pitch conversion unit of the present invention.

[0034] The substrate handling mechanism HTR is disposed behind the loading shelf 3. The substrate handling mechanism HTR transports a plurality of (e.g., 25) substrates W in a horizontal position between a carrier C placed on the loading shelf 3 and the position conversion unit 19. As shown in FIG. 3, the substrate handling mechanism HTR is equipped with a plurality of (e.g., 25 or 13) hands 27. Each hand 27 holds one substrate W. The plurality of hands 27 are arranged at a reference pitch in the vertical direction Z. Therefore, for example, 25 substrates W held by 25 hands 27 are aligned at the reference pitch. The reference pitch is a repeating reference interval TN9 (e.g., 10 mm).

[0035] 3 and the like, for convenience of illustration, the substrate handling mechanism HTR is shown to have five hands 27. A pair of horizontal holding parts 37 and a pair of vertical holding parts 39, which will be described later, are each shown to hold five substrates W. A pusher member 55 (see FIG. 6), which will be described later, is shown to support ten substrates W.

[0036] The substrate handling mechanism HTR further includes a hand support unit 29, an advancing / retreating unit 31, and an elevation / rotation unit 33. The hand support unit 29 supports the multiple hands 27. The advancing / retreating unit 31 moves the multiple hands 27 forward and backward via the hand support unit 29. The elevation / rotation unit 33 rotates the advancing / retreating unit 31 about a vertical axis AX1 to change the orientation of the hands 27. The elevation / rotation unit 33 is fixed to the floor surface. The advancing / retreating unit 31 and the elevation / rotation unit 33 each include an electric motor. The substrate handling mechanism HTR may also include a movable hand (not shown) for transporting only one substrate W, separate from the hand 27.

[0037] The attitude conversion unit 19 converts a plurality of (e.g., 25) substrates W between a horizontal attitude and a vertical attitude. The attitude conversion unit 19 is disposed to the left of the substrate handling mechanism HTR. As shown in FIG. 4 , the attitude conversion unit 19 includes a support base 35, a pair of horizontal holding units 37, a pair of vertical holding units 39, and a rotation drive unit 41.

[0038] The support base 35 is supported rotatably about a horizontal axis AX2 extending in the front-rear direction X. The pair of horizontal holding parts 37 and the pair of vertical holding parts 39 are provided to extend perpendicular to the support surface 35A. When the plurality of substrates W are in a horizontal position, the pair of horizontal holding parts 37 hold the plurality of substrates W. In other words, when the plurality of substrates W are in a horizontal position, the plurality of substrates W are placed on the pair of horizontal holding parts 37. When the plurality of substrates W are in a vertical position, the pair of vertical holding parts 39 hold the plurality of substrates W.

[0039] The pair of horizontal holding parts 37 and the pair of vertical holding parts 39 are both arranged in the front-rear direction X (see FIG. 2). Furthermore, when the pair of horizontal holding parts 37 hold multiple substrates W in a horizontal position, the pair of vertical holding parts 39 are arranged closer to the pusher mechanism 21 than the pair of horizontal holding parts 37. The pair of horizontal holding parts 37 have multiple pairs (e.g., 25 pairs, 38 pairs, 50 pairs) of shelves 37A arranged at a standard pitch in the direction DR1 in which the pair of horizontal holding parts 37 extend. The pair of vertical holding parts 39 have multiple pairs (e.g., 25 pairs, 38 pairs, 50 pairs) of holding grooves 39A arranged at a standard pitch in the direction DR1 in which the pair of vertical holding parts 39 extend.

[0040] The posture conversion unit 19 also includes an axial movement unit 51 and a storage movement unit 53. The axial movement unit 51 moves the pair of horizontal holding units 37 a preset small distance in the direction DR1 in which the pair of horizontal holding units 37 extend. The storage movement unit 53 moves the pair of vertical holding units 39 toward or away from the pair of horizontal holding units 37. For example, when the pair of horizontal holding units 37 hold multiple substrates W in a horizontal posture, the storage movement unit 53 can move the pair of vertical holding units 39 in the width direction Y. The rotation drive unit 41 converts the multiple substrates W held by the pair of horizontal holding units 37 and the pair of vertical holding units 39 between a horizontal posture and a vertical posture.

[0041] The rotation drive unit 41 includes, for example, an electric motor. The axial movement unit 51 and the housing movement unit 53 each include an air cylinder or an electric actuator. The electric actuator includes an electric motor.

[0042] The pusher mechanism 21 is disposed to the left of the position conversion unit 19. As shown in FIG. 5 , the pusher mechanism 21 includes a pusher member 55, a rotating shaft 57, a pusher rotating unit 59, a pusher horizontal moving unit 61, a lifting platform 63, and a pusher lifting unit 65.

[0043] 6, the pusher member 55 holds, in a vertical position, a plurality of substrates W (e.g., 50, 75, or 100) aligned at an irregular pitch in which a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm) are alternately repeated. The second interval TN2 is wider than the first interval TN1 (second interval TN2 > first interval TN1). The first interval TN1 is also called the narrow interval, and the second interval TN2 is also called the wide interval.

[0044] 6, the pusher member 55 has a plurality of (e.g., 50, 75, or 100) vertical holding grooves 67 for holding a plurality of substrates W in a vertical position. The plurality of vertical holding grooves 67 are arranged, for example, at an unequal pitch in which a first interval TN1 and a second interval TN2 are alternately repeated. The sum of the first interval TN1 (e.g., 3.333 mm) and the second interval TN2 (e.g., 6.666 mm) is a reference interval TN9 (e.g., 10 mm).

[0045] See Figure 5. The lower surface of the pusher member 55 is connected to the upper end of the rotating shaft 57. The pusher rotation unit 59 rotates the pusher member 55 and the rotating shaft 57 about a vertical axis AX3 that passes through the rotating shaft 57. As a result, the multiple substrates W that the pusher member 55 supports in a vertical position are rotated about the vertical axis AX3. The pusher rotation unit 59 includes, for example, an electric motor. The pusher rotation unit 59 is provided below the pusher member 55. The pusher rotation unit 59 is also attached to the upper surface of the lifting platform 63 via a pusher horizontal movement unit 61.

[0046] The pusher horizontal movement unit 61 includes two guide rails 61A each extending in the width direction Y, a slider 61B, and an electric motor (not shown). The two guide rails 61A are provided on the upper surface of the lifting platform 63. The slider 61B moves in the width direction Y along the two guide rails 61A. The slider 61B is driven by the electric motor. The pusher lifting unit 65 raises and lowers the lifting platform 63 in the vertical direction Z. This raises and lowers the pusher member 55. The pusher lifting unit 65 includes, for example, an electric actuator.

[0047] 2, the two pitch conversion units 25, 26 are arranged to the left of the pusher mechanism 21. Furthermore, if the two pitch conversion units 25, 26 were arranged in the vertical direction Z, the substrate processing apparatus 1 would become unnecessarily tall. In contrast, the two pitch conversion units 25, 26 are arranged in the front-rear direction X. That is, the first pitch conversion unit 25 is arranged behind the second pitch conversion unit 26 in a plan view. This prevents the substrate processing apparatus 1 from becoming unnecessarily tall. The delivery mechanism 23 transports a plurality of substrates W aligned at unequal pitches, for example, between the pusher member 55 and the two pitch conversion units 25, 26.

[0048] Please refer to Figures 2 and 7. Figure 7 is a side view showing the transfer mechanism 23 and the two pitch conversion units 25, 26, etc., as viewed in the direction of arrow AA in Figure 2. The transfer mechanism 23 includes a carry-in mechanism 71, an intermediary mechanism 73, and an unloading mechanism 75. The carry-in mechanism 71 transports multiple substrates W aligned at an uneven pitch from the pusher member 55 to the first pitch conversion unit 25. The intermediary mechanism 73 transports multiple substrates W aligned at a narrow pitch from the first pitch conversion unit 25 to the first transfer position P1. The unloading mechanism 75 transports multiple substrates W aligned at an uneven pitch from the second pitch conversion unit 26 to the pusher member 55. The carry-in mechanism 71, the intermediary mechanism 73, and the unloading mechanism 75 include chucks 77, 78, and 79, respectively.

[0049] As shown in FIG. 7 , the carry-in mechanism 71 is disposed at a carry-in height position H1. The carry-in mechanism 71 is disposed, for example, to the side of the lifting unit 141 of the second pitch conversion unit 26. The chuck 78 of the intermediary mechanism 73 is provided at a position above the first pitch conversion unit 25. The chuck 78 of the intermediary mechanism 73 is disposed between the carry-in height position H1 and the first transfer position P1. The first transfer position P1 is higher than the carry-in height position H1 and the transfer height position H2. The transfer mechanism 75 is disposed at a transfer height position H2 that is higher than the carry-in height position H1. The carry-in mechanism 71 and the transfer mechanism 75 are each configured so that the plurality of substrates W held by the transfer mechanism 75 and the plurality of other substrates W held by the carry-in mechanism 71 and the transfer mechanism 75 do not interfere with each other.

[0050] 8 is a plan view mainly showing the load mechanism 71 and the unload mechanism 75. The load mechanism 71 is disposed behind the unload mechanism 75. That is, the load mechanism 71 is disposed on the processing block 7 side, and the unload mechanism 75 is disposed on the stocker 2 side. The load mechanism 71 includes a chuck 77, an opening / closing unit 81, a front-rear direction moving unit 83, and a width direction moving unit 85.

[0051] The chuck 77 holds a plurality of substrates W aligned at an irregular pitch in a vertical position. The chuck 77 has a pair of chuck members 77A, 77B each extending in the width direction Y. Each pair of chuck members 77A, 77B has a plurality of pairs (e.g., 50 pairs, 75 pairs, 100 pairs) of holding grooves 87, 88 arranged at an irregular pitch. The irregular pitch is formed by alternating first intervals TN1 (e.g., 3.333 mm) and second intervals TN2 (e.g., 6.666 mm). The first chuck member 77A has a plurality of holding grooves 87 arranged at an irregular pitch. The second chuck member 77B has a plurality of holding grooves 88 arranged at an irregular pitch.

[0052] The opening / closing unit 81 supports the two chuck members 77A, 77B so that they can move in the front-to-rear direction X. The opening / closing unit 81 also opens and closes the two chuck members 77A, 77B in the front-to-rear direction X. Specifically, the opening / closing unit 81 moves the two chuck members 77A, 77B closer to or farther apart. When the opening / closing unit 81 closes the chuck 77, the chuck 77 can hold multiple substrates W in a vertical position. On the other hand, when the opening / closing unit 81 opens the chuck 77, the chuck 77 can pass multiple substrates W in a vertical position between the two chucks 77A, 77B in the vertical direction Z. The opening / closing unit 81 includes an air cylinder or an electric actuator that drives the two chuck members 77A, 77B.

[0053] The front-rear direction moving unit 83 is disposed closer to the two pitch conversion units 25, 26 than the width direction moving unit 85. The front-rear direction moving unit 83 moves the chuck 77 and the opening / closing unit 81 horizontally in the front-rear direction X. The width direction moving unit 85 moves the chuck 77, the opening / closing unit 81, and the front-rear direction moving unit 83 horizontally in the width direction Y. That is, the front-rear direction moving unit 83 and the width direction moving unit 85 can move the chuck 77 in the front-rear direction X and the width direction Y (two-dimensional directions). The front-rear direction moving unit 83 includes, for example, an air cylinder or an electric actuator. The width direction moving unit 85 includes an electric actuator.

[0054] The discharge mechanism 75 includes a chuck 79, an opening / closing unit 89, a front-rear direction moving unit 91, and a width direction moving unit 93. The chuck 79 has the same configuration as the chuck 77. Specifically, the chuck 79 includes a pair of chuck members 79A and 79B each extending in the width direction Y. Each pair of chuck members 79A and 79B includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves 95 and 96 arranged at unequal pitches. The front-rear direction moving unit 91 is disposed closer to the two pitch conversion units 25 and 26 than the width direction moving unit 93. Otherwise, the opening / closing unit 89, the front-rear direction moving unit 91, and the width direction moving unit 93 have the same configuration as the opening / closing unit 81, the front-rear direction moving unit 83, and the width direction moving unit 85, respectively.

[0055] 9 is a plan view mainly showing the intermediary mechanism 73. The intermediary mechanism 73 includes a chuck 78, an opening / closing unit 101, an arm 103, and an elevating unit 105. The chuck 78 includes a pair of chuck members 78A and 78B each extending in the width direction Y. The pair of chuck members 78A and 78B includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves 107 and 108 arranged at a narrow pitch (e.g., 3.333 mm pitch (⅓ pitch)). Specifically, the first chuck member 78A is provided with a plurality of holding grooves 107 arranged at a narrow pitch in the width direction Y. The second chuck member 78B is provided with a plurality of holding grooves 108 arranged at a narrow pitch.

[0056] The opening / closing unit 101 is provided to the right of the chuck 78 (on the pusher mechanism 21 side). Otherwise, the opening / closing unit 101 is configured similarly to the opening / closing unit 81. To be more specific, the opening / closing unit 101 supports a pair of chuck members 78A, 78B so that they can move in the front-to-rear direction X. The opening / closing unit 101 also opens and closes the pair of chuck members 78A, 78B in the front-to-rear direction X. When the opening / closing unit 101 closes the chuck 78, the chuck 78 can hold multiple substrates W aligned at a narrow pitch in a vertical position. On the other hand, when the opening / closing unit 101 opens the chuck 78, the chuck 78 can pass multiple substrates W in a vertical position between the two chuck members 78A, 78B in the vertical direction Z.

[0057] The opening / closing unit 101 is attached to the lifting unit 105 via an arm 103 so that it can be raised and lowered. The lifting unit 105 raises and lowers the chuck 78 and the opening / closing unit 101 in the vertical direction Z. The lifting unit 105 includes, for example, an electric actuator. This enables the intermediary mechanism 73 to receive the multiple substrates W in a vertical position aligned at a narrow pitch from the first pitch conversion unit 25, and move the multiple substrates W to the first transfer position P1 (see FIG. 7) in order to transfer the multiple substrates W to the main transport mechanism WTR.

[0058] The transfer block 5 has two transport paths for transporting multiple substrates W between the pusher member 55 (pusher mechanism 21) and the main transport mechanism WTR. Specifically, the first transport path is a path that passes through the carry-in mechanism 71, the first pitch conversion unit 25, and the intermediate mechanism 73. The second transport path is a path that passes through the second pitch conversion unit 26 and the carry-out mechanism 75. For example, when 50 substrates W are held by the intermediate mechanism 73, the carry-out mechanism 75 can transport 50 substrates W that have been treated in the chemical treatment tank BT1 or the like to the pusher member 55. This allows for smooth transport of the 50 substrates W (group of treated substrates).

[0059] <1-2-1. Pitch conversion section> See Figures 7 and 10 to 13. Each of the two pitch conversion units 25, 26 converts the pitch of the multiple substrates W between an irregular pitch and a narrow pitch. The irregular pitch is a repeat of a first interval TN1 (e.g., 3.333 mm) and a second interval TN2 (e.g., 6.666 mm) that is wider than the first interval TN1. The narrow pitch is a repeat of the first interval TN1.

[0060] The first pitch conversion unit 25 aligns the multiple substrates W aligned at an uneven pitch at a narrow pitch. That is, the first pitch conversion unit 25 converts the pitch of the multiple substrates W before they are processed in the processing block 7 to a narrow pitch. In contrast, the second pitch conversion unit 26 aligns the multiple substrates W aligned at a narrow pitch at an uneven pitch. That is, the second pitch conversion unit 26 converts the pitch of the multiple substrates W after they have been processed in the processing block 7 to an uneven pitch.

[0061] Each of the two pitch changers 25 and 26 includes a pitch change main body 111. The pitch change main body 111 includes a plurality of holding members 113 and moving parts 115 (for example, 25, 38, or 50).

[0062] The plurality of holding members 113 hold the plurality of substrates W aligned at unequal pitches in a vertical position. Each of the plurality of holding members 113 has two holding grooves 117 that individually hold two of the plurality of substrates W. The two holding grooves 117 are separated by a first distance TN1 (e.g., 3.333 mm). The two holding grooves 117 of each holding member 113 are arranged in the width direction Y. For example, if the pitch conversion unit 25 has 25 holding members 113, the 25 holding members 113 can hold 50 substrates W with 50 holding grooves 117. Note that in Figures 10 to 13, for convenience of illustration, each of the two pitch conversion units 25 and 26 is shown to have five holding members 113 (113A to 113E).

[0063] The moving unit 115 moves the plurality of holding members 113 in the alignment direction (width direction Y) of the plurality of substrates W so as to change between an uneven pitch state in which the plurality of substrates W are aligned at uneven pitches and a narrow pitch state in which the plurality of substrates W are aligned at narrow pitches. The moving unit 115 includes a base member 119, two guide rails 121, an extension / contraction mechanism 123, a drive unit 125, and a connection unit 127.

[0064] The two guide rails 121 support the multiple holding members 113 so that they can move in the alignment direction (width direction Y). Each of the two guide rails 121 extends in the width direction Y. The two guide rails 121 are attached to the upper surface of the base member 119. Note that a central holding member 113C of the multiple holding members 113 is fixed to the base member 119 by, for example, a screw SW. In other words, the central holding member 113C does not move in the width direction Y. Note that the number of guide rails 121 is not limited to two, and may be one, or three or more. In other words, it is sufficient for the moving unit 115 to be equipped with one or more guide rails 121.

[0065] The extension mechanism 123 extends and retracts the plurality of holding members 113 in the alignment direction (width direction Y). The extension mechanism 123 is connected to each holding member 113. The extension mechanism 123 is configured, for example, as a link mechanism. Specifically, the extension mechanism 123 is configured, for example, as a lazy tongs type, a zigzag line type, or a type similar thereto. The extension mechanism 123 includes, for example, a plurality of link members 129 (25, 5 in FIG. 10, etc.), a plurality of pins 131 (25, 5 in FIG. 10, etc.), and a plurality of joints 133 (24, 4 in FIG. 10, etc.). In FIGS. 12 and 13, for example, five pins 131 are provided on the bottom surfaces of the five holding members 113. The five link members 129 are respectively attached to the five pins 131 so as to be rotatable about vertical axes. The five pins 131 are located at the five central portions of the five link members 129. The four joints 133 each connect the ends of two adjacent link members 129.

[0066] For example, a first end of link member 129B is connected to a second end of link member 129A at joint 133A, and a second end of link member 129B is connected to a first end of link member 129C at joint 133B.

[0067] The drive unit 125 drives the extension / retraction mechanism 123. The drive unit 125 is attached to the lower surface of the base member 119. The drive unit 125 extends and retracts a rod 125A extending in the width direction Y. The drive unit 125 includes an air cylinder or an electric actuator. The connection unit 127 connects the end holding member 113E of the multiple holding members 113 to the tip of the rod 125A of the drive unit 125. The connection unit 127 is passed through an opening 119A of the base member 119.

[0068] 10 and 12, for example, when the rod 125A of the drive unit 125 extends, the end holding member 113E is moved away from the central holding member 113C, and the extension mechanism 123 moves the other three holding members 113A, 113B, and 113D away from the central holding member 113C. This allows the multiple substrates W to be aligned at an uneven pitch. Also, in FIGS. 11 and 13, for example, when the rod 125A of the drive unit 125 retracts, the end holding member 113E approaches the central holding member 113C, and the extension mechanism 123 moves the other three holding members 113A, 113B, and 113D toward the central holding member 113C. This allows the multiple substrates W to be aligned at a narrow pitch (first interval TN1).

[0069] 7, each of the pitch conversion units 25 and 26 includes an elevator unit 141. The elevator unit 141 raises and lowers the pitch conversion main body 111 (the multiple holding members 113 and the moving unit 115). The elevator unit 141 includes an air cylinder or an electric actuator.

[0070] The lifting / lowering unit 141 of the first pitch conversion unit 25 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 77 of the carry-in mechanism 71 and a lower position lower than the chuck 77. The lifting / lowering unit 141 of the second pitch conversion unit 26 raises and lowers the plurality of holding members 113 between an upper position higher than (the upper surface of) the chuck 79 of the carry-out mechanism 75 and a lower position lower than the chuck 79.

[0071] <1-3. Processing Block> Referring to Figure 1, the processing block 7 includes a plurality of (for example, four) batch processing tanks BT1 to BT4 and a drying section 143. The four batch processing tanks BT1 to BT4 and the drying section 143 are arranged in the front-rear direction X along which the substrate processing apparatus 1 extends. Each of the four batch processing tanks BT1 to BT4 immerses and processes a plurality of substrates W (for example, 50, 75, or 100 substrates W) at once. Each of the four batch processing tanks BT1 to BT4 stores a processing liquid (for example, a chemical liquid or pure water) in which the plurality of substrates W are immersed.

[0072] The four batch processing tanks BT1 to BT4 are, for example, composed of two chemical processing tanks BT1 and BT3 and two cleaning processing tanks BT2 and BT4. The chemical processing tank BT1 and the cleaning processing tank BT2 form one set, and the chemical processing tank BT3 and the cleaning processing tank BT4 form another set. Note that the combination of chemical processing tanks and cleaning processing tanks is not limited to this example. Furthermore, the number of batch processing tanks is not limited to four, and may be one or more. At least one of the four batch processing tanks BT1 to BT4 corresponds to the substrate processing section of the present invention.

[0073] Each of the two chemical treatment tanks BT1 and BT3 performs an etching process using a chemical solution. The chemical solution may be, for example, a phosphoric acid solution, but is not limited to, a phosphoric acid solution. The chemical solution is heated to a preset temperature. A chemical solution jetting pipe (not shown) is provided at the bottom of the inside of each of the chemical treatment tanks BT1 and BT3. Each of the chemical treatment tanks BT1 and BT3 stores the chemical solution supplied from the chemical solution jetting pipe.

[0074] Each of the two cleaning processing tanks BT2 and BT4 performs a cleaning process in which chemical solutions adhering to multiple substrates W are washed away with a cleaning liquid (rinse liquid). Pure water such as deionized water (DIW) is used as the cleaning liquid. Each of the cleaning processing tanks BT2 and BT4 stores pure water supplied from a pure water jet pipe (not shown).

[0075] The processing block 7 includes a lifter LF1 as a dedicated transport mechanism for transferring substrates W that have been chemically processed in the chemical processing tank BT1 to the cleaning processing tank BT2, and a lifter LF2 for transferring substrates W that have been chemically processed in the chemical processing tank BT3 to the cleaning processing tank BT4. Each of the two lifters LF1 and LF2 includes a substrate holding unit that holds, in a vertical position, a plurality of substrates W (e.g., 50, 75, or 100) aligned at narrow pitches in the width direction Y, a lifting unit that raises and lowers the substrate holding unit, and a horizontal moving unit that moves the substrate holding unit in the front-to-rear direction X.

[0076] The drying unit 143 includes a substrate holding mechanism that holds, in a vertical position, a plurality of substrates W (e.g., 50, 75, or 100) aligned at a narrow pitch in the width direction Y, and a processing chamber that accommodates the plurality of substrates W held by the substrate holding mechanism. The drying unit 143 dries the substrates W by supplying an organic solvent (e.g., isopropyl alcohol) to the substrates W in a reduced pressure atmosphere or by shaking off liquid components on the surfaces of the substrates W by centrifugal force.

[0077] <1-4. Batch substrate transport area> The batch substrate transport area 8 is disposed behind the stocker 2 and adjacent to the transfer block 5 and the processing block 7 on the left side. The batch substrate transport area 8 extends in the front-to-rear direction X. The batch substrate transport area 8 is equipped with a main transport mechanism WTR (main transport robot). The main transport mechanism WTR transports a plurality of substrates W (e.g., 50, 75, or 100) in a vertical position aligned at a narrow pitch in the width direction Y in the front-to-rear direction X. The main transport mechanism WTR also transports the plurality of substrates W between the first transfer position P1, the second transfer position P2, the plurality of batch processing baths BT1 to BT4 (e.g., four), and the drying section 143.

[0078] The main transport mechanism WTR includes a chuck 145, a chuck lifting unit (not shown), a chuck horizontal moving unit (not shown), and guide rails 147. The chuck 145 holds, in a vertical position, a plurality of substrates W aligned at a narrow pitch in the width direction Y. The chuck 145 includes a pair of chuck members 145A, 145B each extending in the width direction Y. Each pair of chuck members 145A, 145B includes multiple pairs (e.g., 50 pairs, 75 pairs, or 100 pairs) of holding grooves arranged at a narrow pitch in the width direction Y. The pair of chuck members 145A, 145B are opened and closed by a chuck opening / closing unit (not shown).

[0079] The chuck 145 is movable in the front-rear direction X along the guide rail 147. The chuck 145 is moved in the front-rear direction X by a chuck horizontal movement unit. The chuck 145 is raised and lowered in the vertical direction Z by a chuck lifting unit. The chuck horizontal movement unit and the chuck lifting unit include, for example, an electric actuator. The chuck opening / closing unit includes, for example, an air cylinder or an electric actuator.

[0080] <1-5. Control Unit> The substrate processing apparatus 1 includes a control unit 151 (see FIG. 1) and a storage unit (not shown). The control unit 151 controls each component of the substrate processing apparatus 1. The control unit 151 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0081] <2. Operation of the substrate processing device> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowcharts of Figures 14 and 21. First, the first half of the operation from transporting the carriers C to the load port 9 to the drying process will be described with reference to Figure 14. In this embodiment, the substrate processing apparatus 1 processes 50 substrates W taken out from two carriers C in a batch.

[0082] In Figure 15(a) and other figures, the symbol TA indicates the surface (device surface or main surface) of the substrate W (W1, W2). The back surface of the substrate W is the surface opposite to the front surface of the substrate W. The device surface is the surface on which devices are formed or the surface on which devices are in the process of being formed. In Figure 15(a) and other figures, for convenience of illustration, the 25 substrates W1 are represented by five substrates W1, and the 25 substrates W2 are represented by five substrates W2.

[0083] [Step S01] Vertical position change of the first substrate group Referring to FIG. 1, an external transfer robot (not shown) sequentially transfers two carriers C to the load port 9. The carrier transfer robot 13 of the stocker 2 transfers the first carrier C from the load port 9 to the loading shelf 3. The first carrier C stores, for example, 25 substrates W1 (first substrate group) aligned at a reference pitch (for example, 10 mm pitch) at which the reference interval TN9 is repeated. The substrate handling mechanism HTR of the transfer block 5 uses, for example, 25 hands 27 to remove the 25 substrates W1 in a horizontal position from the first carrier C placed on the loading shelf 3. The substrate handling mechanism HTR then transfers the removed 25 substrates W1 to the position conversion unit 19. The carrier transfer robot 13 then moves the empty first carrier C from which the 25 substrates W1 have been removed from the loading shelf 3 to the storage shelf 11.

[0084] See Figure 15(a). The attitude changing unit 19 receives 25 substrates W1 aligned at the reference pitch from the substrate handling mechanism HTR. In the attitude changing unit 19, the 25 substrates W1 are held (placed) on the 25 pairs of shelves 37A of the pair of horizontal holding units 37. See Figure 15(b). Thereafter, the storing / moving unit 53 (see Figure 4) of the attitude changing unit 19 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37. As a result, the peripheral edges of the 25 substrates W1 are stored and held in the 25 pairs of holding grooves 39A of the pair of vertical holding units 39.

[0085] 15(c). Then, the attitude changing unit 19 collectively changes the 25 substrates W1 (first substrate group) held at the reference pitch from a horizontal attitude to a vertical attitude. Specifically, the rotation drive unit 41 of the attitude changing unit 19 changes the 25 substrates W1 held by the pair of horizontal holding units 37 and the pair of vertical holding units 39 from a horizontal attitude to a vertical attitude. Then, the axial movement unit 51 (see FIG. 4) of the attitude changing unit 19 moves the pair of horizontal holding units 37 in a direction in which the pair of horizontal holding units 37 approaches the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding units 37 move away from the 25 substrates W1 in the vertical attitude.

[0086] [Step S02] Receiving the first group of substrates by the pusher member See Figure 16(a). Thereafter, the pusher lifting section 65 of the pusher mechanism 21 (see Figure 5) raises the pusher member 55 to a position higher than the pair of horizontal holding sections 37 and the pair of vertical holding sections 39. As a result, the pusher member 55 receives the 25 substrates W1 (first substrate group) that have been converted to a vertical position. The pusher member 55 also holds the 25 substrates W1 aligned at the standard pitch in a vertical position. The 50 vertical holding grooves 67 are arranged at unequal pitches.

[0087] [Step S03] Movement of the first substrate group at the first interval 16(b). The pusher mechanism 21 moves the 25 substrates W1 held by the pusher members 55 at a first interval TN1 (3.333 mm) in the alignment direction of the 25 substrates W1. Specifically, the pusher rotation unit 59 (see FIG. 5) of the pusher mechanism 21 rotates the pusher members 55 by 180 degrees about the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher members 55 are moved to the left at the first interval TN1. Furthermore, the orientation of the surfaces of the 25 substrates W1 is changed from left to right. Note that this movement at the first interval TN1 may be achieved by rotating the pusher members 55 by 180 degrees using the pusher rotation unit 59 and moving the pusher members 55 in the width direction Y using the pusher horizontal movement unit 61 (see FIG. 5).

[0088] Additionally, the attitude change unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2. This raises the pair of horizontal holding units 37, etc. The axial movement unit 51 (see FIG. 4) of the attitude change unit 19 moves the pair of horizontal holding units 37 in a direction away from the support surface 35A. Additionally, the storage movement unit 53 (see FIG. 4) of the attitude change unit 19 moves the pair of vertical holding units 39 away from the pair of horizontal holding units 37.

[0089] [Step S04] Vertical position change of second substrate group The carrier transport robot 13 shown in FIG. 1 transports a second carrier C from the load port 9 to the loading shelf 3. The second carrier C stores, for example, 25 substrates W2 aligned at a standard pitch (10 mm pitch) like the first carrier C. The substrate handling mechanism HTR uses the 25 hands 27 to remove the 25 substrates W2 in a horizontal position from the second carrier C placed on the loading shelf 3. The substrate handling mechanism HTR then transports the removed 25 substrates W2 to the position conversion unit 19. The carrier transport robot 13 then moves the empty second carrier C from which the 25 substrates W2 have been removed to the storage shelf 11.

[0090] See Figure 16(c). The attitude changing unit 19 receives 25 substrates W2 aligned at the reference pitch from the substrate handling mechanism HTR. In the attitude changing unit 19, the 25 substrates W2 are held on 25 pairs of shelves 37A of a pair of horizontal holding units 37. See Figure 17(a). Thereafter, the storage transfer unit 53 (see Figure 4) of the attitude changing unit 19 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37.

[0091] 17(b). Thereafter, the attitude changing unit 19 collectively changes the 25 substrates W2 (second substrate group) held at the reference pitch from a horizontal attitude to a vertical attitude. Thereafter, the axial movement unit 51 (see FIG. 4) of the attitude changing unit 19 moves the pair of horizontal holding units 37 in a direction in which the pair of horizontal holding units 37 approaches the support surface 35A so that the 25 pairs of shelves 37A of the pair of horizontal holding units 37 move away from the 25 substrates W1 in the vertical attitude.

[0092] [Step S05] Receiving the second group of substrates by the pusher member See Figure 17(c). Thereafter, the pusher lifting unit 65 (see Figure 5) of the pusher mechanism 21 raises the pusher member 55 to a position higher than the pair of horizontal holding units 37 and the pair of vertical holding units 39. As a result, the pusher member 55 receives the 25 substrates W2 (second substrate group) that have been converted to a vertical position. The pusher member 55 also holds 50 substrates W (W1, W2) aligned at an uneven pitch. The 50 substrates W are formed by alternatingly arranging 25 substrates W1 and 25 substrates W2.

[0093] 17(b) and 17(c), the surfaces (device surfaces or main surfaces) of the 25 substrates W1 face a predetermined direction (to the right). In contrast, the surfaces of the 25 substrates W2 face the opposite direction (to the left). In other words, the 50 substrates W are arranged face-to-face.

[0094] [Step S06] Transporting the group of processed substrates to the pitch conversion unit by the loading mechanism Thereafter, the carry-in mechanism 71 transports the 50 substrates W (group of substrates to be processed) aligned at an irregular pitch from the pusher member 55 to the first pitch conversion unit 25. This operation will be described in detail with reference to FIG. 18(a). First, the attitude conversion unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2. This raises the pair of horizontal holding units 37, etc. Then, the carry-in mechanism 71 horizontally moves the chuck 77 from a position above the first pitch conversion unit 25 to a position below the pusher member 55. The chuck 77 is in a closed state in which it can hold 50 substrates W.

[0095] 18(b). Thereafter, the pusher mechanism 21 lowers the pusher member 55 that holds the 50 substrates W in a vertical position. When the pusher member 55 passes between the pair of chuck members 77A, 77B of the chuck 77, the 50 substrates W are transferred from the pusher member 55 to the chuck 77. The chuck 77 holds the 50 substrates W aligned at an uneven pitch in a vertical position.

[0096] See Figure 19(a). Thereafter, the carry-in mechanism 71 moves the chuck 77 from a position above the pusher member 55 to a position above the first pitch conversion unit 25. See Figure 19(b). Thereafter, the lifting unit 141 (see Figure 7) of the first pitch conversion unit 25 raises the pitch conversion main body 111 including the 25 holding members 113. As a result, the first pitch conversion unit 25 receives the 50 substrates W from the carry-in mechanism 71.

[0097] [Step S07] Pitch conversion of the processed substrate group from unequal pitch to narrow pitch See Figure 20(a). Thereafter, the first pitch conversion unit 25 converts the pitch of the 50 substrates W from the uneven pitch to a narrow pitch (3.333 mm pitch). In other words, the first pitch conversion unit 25 aligns the 50 substrates W aligned at the uneven pitch at a narrow pitch. This operation will be described in detail.

[0098] Each of the 25 holding members 113 of the first pitch conversion unit 25 has two holding grooves 117 spaced apart by a first distance TN1 (3.333 mm). The first pitch conversion unit 25 uses the two holding grooves 117 of each of the 25 holding members 113 to hold two of the 50 substrates W, W1 and W2, while using the 25 holding members 113 to hold the 50 substrates W aligned at an uneven pitch.

[0099] Furthermore, the moving unit 115 (see FIG. 10) of the first pitch conversion unit 25 moves the 25 holding members 113 in the alignment direction (width direction Y) of the 50 substrates W so as to change the uneven pitch state in which the 50 substrates W are aligned at uneven pitches to a narrow pitch state in which the 50 substrates W are aligned at narrow pitches. Note that the intermediary mechanism 73 keeps the chucks 78 in an open state.

[0100] [Step S08] Transporting the group of substrates to the first transfer position by the intermediary mechanism 20(b). Thereafter, the intermediary mechanism 73 lowers the chucks 78 as indicated by the dashed lines in order to receive the 50 substrates W aligned at a narrow pitch held by the first pitch conversion unit 25. The intermediary mechanism 73 then closes the chucks 78, thereby enabling the chucks 78 to hold 50 substrates W.

[0101] Thereafter, the intermediary mechanism 73 raises the chucks 78 to the first transfer position P1. This allows the intermediary mechanism 73 to receive the 50 substrates W from the first pitch conversion unit 25 and deliver the 50 substrates W to the main transport mechanism WTR. The chucks 78 hold the 50 substrates W aligned at a narrow pitch in a vertical position.

[0102] [Step S09] Substrate processing and drying processing Thereafter, the main transport mechanism WTR uses chucks 145 to receive the 50 substrates W from the intermediate mechanism 73 and transports the 50 substrates W to one of the two chemical liquid treatment tanks BT1, BT3. For example, when the main transport mechanism WTR transports the 50 substrates W to the chemical liquid treatment tank BT1, the lifter LF1 receives the 50 substrates W, aligned at a narrow pitch, from the main transport mechanism WTR at a position above the chemical liquid treatment tank BT1. The lifter LF1 then lowers the 50 substrates W, thereby immersing the 50 substrates W in the chemical liquid stored in the chemical liquid treatment tank BT1. As a result, the 50 substrates W are chemically treated all at once.

[0103] Furthermore, after a preset chemical treatment time has elapsed, the lifter LF1 raises the 50 substrates W, thereby lifting them out of the chemical solution in the chemical treatment tank BT1. The lifter LF1 then horizontally moves the 50 substrates W from a position above the chemical treatment tank BT1 to a position above the cleaning treatment tank BT2. The lifter LF1 then lowers the 50 substrates W, thereby immersing the 50 substrates W in the pure water stored in the cleaning treatment tank BT2. In this way, the 50 substrates W are cleaned all at once. After a preset cleaning treatment time has elapsed, the lifter LF1 lifts the 50 substrates W out of the pure water in the cleaning treatment tank BT2.

[0104] When the main transport mechanism WTR transports 50 substrates W to the chemical treatment tank BT3, the lifter LF2 receives the 50 substrates W from the main transport mechanism WTR. The lifter LF2 then transports the 50 substrates W to the chemical treatment tank BT3 and the cleaning treatment tank BT4 in that order.

[0105] The main transport mechanism WTR uses the chuck 145 to receive the 50 substrates W from one of the two lifters LF1, LF2, and transports the 50 substrates W to the drying section 143. The drying section 143 dries the 50 substrates W. Thereafter, the main transport mechanism WTR receives the dried 50 substrates W from the drying section 143.

[0106] Next, with reference to FIG. 21, the latter half of the operation from the drying process to the transfer of the carrier C from the load port 9 will be described.

[0107] [Step S11] The main transport mechanism transports the group of substrates to the second transfer position. 2 and 22(a), the main transport mechanism WTR transports 50 substrates W in a vertical position that have been collectively processed in the chemical processing tank BT1 or the like and aligned at a narrow pitch, to a position above the second pitch conversion unit 26. In other words, the main transport mechanism WTR transports 50 substrates W that have been dried in the drying unit 143 to a position above the second pitch conversion unit 26.

[0108] Thereafter, the main transport mechanism WTR lowers the 50 substrates W held by the chucks 145 to the second transfer position P2. As a result, the main transport mechanism WTR transports the 50 substrates W in a vertical position and aligned at a narrow pitch to the second pitch conversion unit 26. The second pitch conversion unit 26 also receives the 50 substrates W in a vertical position and aligned at a narrow pitch from the main transport mechanism WTR. When receiving the 50 substrates W, the second pitch conversion unit 26 moves the 25 holding members 113 so that the 50 holding grooves 117 are arranged at a narrow pitch.

[0109] [Step S12] Changing the pitch of the processed substrate group from a narrow pitch to an unequal pitch See Figure 22(b). Thereafter, the second pitch conversion unit 26 converts the pitch of the 50 substrates W from the narrow pitch to an uneven pitch. This operation will be described in detail. The second pitch conversion unit 26 holds the 50 substrates W aligned at the narrow pitch using the 25 holding members 113, while holding two substrates W at the first interval TN1 using two holding grooves 117 separated by a first interval TN1 that each of the 25 holding members 113 has. The movement unit 115 (see Figure 10) moves the 25 holding members 113 in the alignment direction of the 50 substrates W (width direction Y) so as to change from the narrow pitch state to the uneven pitch state.

[0110] [Step S13] Transporting the group of substrates to be processed to the pusher member by the unloading mechanism See Figure 23(a). Thereafter, the unloading mechanism 75 of the delivery mechanism 23 transports the 50 substrates W aligned at an uneven pitch in a vertical position from the second pitch conversion unit 26 to the pusher member 55. This operation will be described in detail. The chuck 79 of the unloading mechanism 75 is in a closed state. First, the lifting unit 141 (see Figure 7) of the second pitch conversion unit 26 lowers the pitch conversion main body 111 including the 25 holding members 113. During this lowering, the unloading mechanism 75 uses the chuck 79 to receive and hold the 50 substrates W aligned at an uneven pitch in a vertical position.

[0111] 23(b). Thereafter, the unloading mechanism 75 transports the 50 substrates W held by the chucks 79 from a position above the second pitch conversion unit 26 to a position above the pusher members 55. Thereafter, the pusher mechanism 21 raises the pusher members 55 to a position higher than the chucks 79. During this raising, the pusher mechanism 21 uses the pusher members 55 to receive and hold the 50 substrates W from the chucks 79 of the unloading mechanism 75. The pusher members 55 hold the 50 substrates W aligned at an uneven pitch in a vertical position.

[0112] [Step S14] Receipt of the second group of substrates by the attitude change unit 24(a). Then, the unloading mechanism 75 moves the chuck 79 to a position above the second pitch conversion unit 26. Then, the rotation drive unit 41 of the attitude conversion unit 19 rotates the pair of horizontal holding units 37 and the like by 90 degrees about the horizontal axis AX2 so that the pair of vertical holding units 39 can receive the 25 substrates W2 (second substrate group). This causes the pair of horizontal holding units 37 and the pair of vertical holding units 39 to fall down. Furthermore, the axial movement unit 51 moves the pair of horizontal holding units 37 closer to the support surface 35A, and the accommodation movement unit 53 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37.

[0113] 24(b). Then, the pusher mechanism 21 lowers the pusher member 55 from the position above the pair of vertical holders 39 to the position below them. During this lowering, the posture conversion unit 19 receives 25 substrates W2 (second substrate group) of the 50 substrates W (processing substrate group) from the pusher member 55 using the pair of horizontal holders 37 and the pair of vertical holders 39. The pair of vertical holders 39 hold the 25 substrates W2 aligned at the reference pitch (10 mm pitch). Then, the axial movement unit 51 moves the pair of horizontal holders 37 away from the support surface 35A. As a result, the 25 pairs of shelves 37A of the pair of horizontal holders 37 come into contact with the backsides of the 25 substrates W2, respectively.

[0114] 24(a), the moving unit 115 of the second pitch conversion unit 26 moves the 25 (24) holding members 113 so that the 50 holding grooves 117 are arranged at a narrow pitch. Also, as shown in FIG. 24(b), the lifting unit 141 of the second pitch conversion unit 26 lifts the pitch conversion main body 111 including the 25 holding members 113 so that the 50 holding grooves 117 are arranged at a position higher than the chuck 79.

[0115] [Step S15] Change the vertical position of the second group of substrates 25(a). The attitude changing unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2. As a result, the attitude changing unit 19 changes the 25 substrates W2 from a vertical attitude to a horizontal attitude. Thereafter, the storage transfer unit 53 moves the pair of vertical holding units 39 away from the pair of horizontal holding units 37. As a result, the peripheral portions of the 25 substrates W2 are removed from the 25 pairs of holding grooves 39A of the pair of vertical holding units 39.

[0116] The carrier transport robot 13 shown in FIG. 1 transports an empty second carrier C from the storage shelf 11 to the loading shelf 3. The substrate handling mechanism HTR takes out, from the loading shelf 3, the 25 substrates W2 that have been converted to a horizontal position by the loading shelf 3 (see FIG. 25(b)). The substrate handling mechanism HTR then transports the 25 substrates W2 into the second carrier C placed on the loading shelf 3. The carrier transport robot 13 then transports the second carrier C containing the 25 processed substrates W2 from the loading shelf 3 to the load port 9.

[0117] [Step S16] Move the first substrate group at the first interval See Figure 25(b). After the attitude changing unit 19 changes the attitude of the 25 substrates W2 to a horizontal attitude, the pusher mechanism 21 raises the pusher members 55 that hold the 25 substrates W1 (first substrate group).

[0118] Furthermore, the pusher mechanism 21 moves the 25 substrates W1 held by the pusher members 55 at a first interval TN1 (3.333 mm) in the alignment direction of the 25 substrates W1. Specifically, the pusher rotation unit 59 (see FIG. 5) of the pusher mechanism 21 rotates the pusher members 55 180 degrees about the vertical axis AX3. As a result, the 25 substrates W1 held by the pusher members 55 are moved to the right at the first interval TN1. Furthermore, the orientation of the surfaces of the 25 substrates W1 is changed from right to left. Note that this movement at the first interval TN1 may be achieved by rotating the pusher members 55 180 degrees by the pusher rotation unit 59 and moving the pusher members 55 in the width direction Y by the pusher horizontal movement unit 61 (see FIG. 5).

[0119] [Step S17] Receipt of the first group of substrates by the attitude change unit 25(c), the attitude conversion unit 19 causes the pair of horizontal holding units 37 and the pair of vertical holding units 39 to lie down. The axial movement unit 51 also moves the pair of horizontal holding units 37 closer to the support surface 35A, and the storage movement unit 53 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37.

[0120] 26(a). Then, the pusher mechanism 21 lowers the pusher member 55 from a position above the pair of vertical holding units 39 to a position below them. During this lowering, the posture conversion unit 19 receives the remaining 25 substrates W1 from the pusher member 55 using the pair of horizontal holding units 37 and the pair of vertical holding units 39. The pair of vertical holding units 39 hold the 25 substrates W1 aligned at a reference pitch (for example, 10 mm pitch). Then, the axial movement unit 51 brings the 25 pairs of shelves 37A of the pair of horizontal holding units 37 into contact with the backsides of the 25 substrates W1, respectively.

[0121] [Step S18] Change the vertical position of the first substrate group See Figure 26(b). The attitude changing unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2. As a result, the attitude changing unit 19 changes the 25 substrates W1 from a vertical attitude to a horizontal attitude. See Figure 26(c). Thereafter, the storage transfer unit 53 moves the pair of vertical holding units 39 away from the pair of horizontal holding units 37.

[0122] The carrier transport robot 13 shown in FIG. 1 transports an empty first carrier C from the storage shelf 11 to the loading shelf 3. The substrate handling mechanism HTR removes from the loading shelf 3 the 25 substrates W1 that have been converted to a horizontal position by the loading shelf 3 (see FIG. 26(c)). The substrate handling mechanism HTR then transports the 25 substrates W1 into the first carrier C placed on the loading shelf 3. The carrier transport robot 13 then transports the first carrier C containing the 25 processed substrates W1 from the loading shelf 3 to the load port 9. An external transport robot (not shown) then transports the two carriers C in sequence from the load port 9 to their next destination.

[0123] According to this embodiment, each pitch conversion unit 25, 26 includes a plurality of holding members 113 that hold a plurality of substrates W aligned at an uneven pitch, and a movement unit 115 that moves the plurality of holding members 113 in the alignment direction (width direction) so as to change between an uneven pitch state in which the plurality of substrates W are aligned at an uneven pitch and a narrow pitch state in which the plurality of substrates W are aligned at a narrow pitch. Each of the plurality of holding members 113 has two holding grooves 117 that individually hold two of the plurality of substrates W. The two holding grooves 117 are separated by a first distance TN1 (first distance TN1<second distance TN2). Since each holding member 113 has two holding grooves 117 that hold two substrates W, the width of each holding member 113 in the alignment direction (width direction Y) of the plurality of substrates W can be relatively large. This ensures dimensional accuracy of each holding member 113, and the plurality of holding members 113 can easily hold each substrate W in a vertical position.

[0124] Furthermore, the two holding grooves 117 of each holding member 113 are configured to be spaced apart by a first distance TN1 (e.g., 3.333 mm), which is half the distance between the first distance TN1 and the second distance TN2 (e.g., 6.666 mm). The uneven pitch alternates between the first distance TN1 and the second distance TN2, which is wider than the first distance TN1. Assume that there is a predetermined distance (reference distance TN9) consisting of one first distance TN1 and one second distance TN2. If the predetermined distance is, for example, 10 mm, and the first distance TN1 is equal to half the distance between the second distance TN2, then the first distance TN1 can be set to 1 / 3 of 10 mm, and the second distance TN2 can be set to 2 / 3 of 10 mm.

[0125] Furthermore, two or more (e.g., 25) substrates W1 are aligned at a standard pitch (e.g., 10 mm pitch), and two or more (e.g., 25) substrates W2 are aligned at the standard pitch. Furthermore, the 25 substrates W2 are arranged offset in the alignment direction from the 25 substrates W1 by a first interval TN1 (e.g., 3.333 mm). As a result, 50 substrates W, in which 25 substrates W1 and 25 substrates W2 are alternately arranged, are aligned at an uneven pitch. Thereafter, the first pitch conversion unit 25 converts the 50 substrates W aligned at an uneven pitch into a narrow pitch (e.g., 3.333 mm pitch). That is, a first pitch conversion is performed by aligning the 25 substrates W1 and the 25 substrates W2 at an uneven pitch, and a second pitch conversion is performed to convert the uneven pitch into a narrow pitch. By performing pitch conversion in two stages, the 25 substrates W1 and the 25 substrates W2, each aligned at the standard pitch, can be easily converted to a narrow pitch.

[0126] Furthermore, a first pitch conversion is performed in which 50 substrates W, which have been processed collectively in a chemical processing tank BT1 or the like at a narrow pitch (for example, a 3.333 mm pitch), are aligned at an irregular pitch. The 50 substrates W, which are aligned at an irregular pitch and in which 25 substrates W1 and 25 substrates W2 are alternately arranged, are then disassembled into 25 substrates W1 and 25 substrates W2, each arranged at a standard pitch (for example, a 10 mm pitch). This allows a second pitch conversion to be performed. By performing pitch conversion in two stages, the 50 substrates W aligned at a narrow pitch (25 substrates W1 and 25 substrates W2) can be easily converted to the standard pitch. Example 2

[0127] Next, a second embodiment of the present invention will be described with reference to the drawings. Descriptions that overlap with those of the first embodiment will be omitted. Fig. 27 is a bottom view mainly showing the extension / contraction mechanism 123 of the pitch conversion unit 25 that holds a plurality of substrates W aligned at an uneven pitch. Fig. 28 is a bottom view mainly showing the extension / contraction mechanism 123 of the pitch conversion unit 25 that holds a plurality of substrates W aligned at a narrow pitch.

[0128] In the first embodiment, each of the two pitch change units 25 and 26 includes a link mechanism shown in Figures 12 and 13 as the extension / contraction mechanism 123. In this regard, in the second embodiment, each of the two pitch change units 25 and 26 may include a storage unit 161, a protrusion 163, and a stopper 165 as the extension / contraction mechanism 160 as shown in Figures 27 and 28.

[0129] 27 and 28, the extension mechanism 160 includes a plurality of housing portions 161, a plurality of protrusions 163, and a plurality of stoppers 165. When the pitch changing body 111 includes 25 holding members 113, the extension mechanism 160 includes 24 housing portions 161, 24 protrusions 163, and 24 stoppers 165. For every combination of two adjacent holding members 113, one housing portion 161, one protrusion 163, and one stopper 165 is provided. In FIGS. 27 and 28, for example, attention is focused on two adjacent holding members 113A and 113B. Note that the holding member 113A corresponds to the first holding member of the present invention. The holding member 113B corresponds to the second holding member of the present invention.

[0130] The storage section 161 is provided in, for example, the holding member 113A. As shown in the enlarged circular view of FIG. 27, the storage section 161 includes a storage section main body 161A and a connecting passage 161B. The connecting passage 161B communicates with the storage section main body 161A. The connecting passage 161B opens facing the holding member 113B.

[0131] The protrusion 163 is provided on the side surface of the holding member 113B facing the holding member 113A. In other words, the protrusion 163 protrudes from the holding member 113B toward the holding member 113A. For example, when the multiple holding members 113 are contracted in the alignment direction (width direction Y), the protrusion 163 is accommodated in the accommodation portion 161 of the holding member 113A, as shown in FIG. 28 . Furthermore, the width WD of each holding member 113 in the width direction Y determines the distance between the two holding members 113A and 113B as a predetermined distance. As a result, for example, 50 holding grooves 117, each consisting of two holding grooves 117 in each holding member 113, are aligned at a narrow pitch (for example, a pitch of 3.333 mm).

[0132] The stopper 165 is provided at the tip of the protrusion 163. The stopper 165 is accommodated in the accommodation portion 161. The diameter DM1 (or width) of the stopper 165 is larger than the diameter DM2 of the protrusion 163. The inner diameter DM3 of the connecting passage 161B of the accommodation portion 161 is smaller than the diameter DM1 of the stopper 165 and larger than the diameter DM2 of the protrusion 163. Therefore, the stopper 165 cannot pass through the connecting passage 161B, but the protrusion 163 can pass through the connecting passage 161B. For example, when the multiple holding members 113 extend in the alignment direction (width direction Y), as shown in FIG. 27, the stopper 165 prevents the protrusion 163 from coming off the accommodation portion 161. Furthermore, the distance between the two holding members 113A and 113B is a preset distance. As a result, for example, 50 holding grooves 117 are aligned at irregular intervals.

[0133] In the above description, the accommodation portion 161 is provided in the holding member 113A, and the protrusion 163 is provided in the holding member 113B. However, the accommodation portion 161 may be provided in the holding member 113B, and the protrusion 163 may be provided in the holding member 113A. Furthermore, as shown in FIGS. 27 and 28, two protrusions 163 and two stoppers 165 may be provided on the central holding member 113C that is fixed in the width direction Y.

[0134] Furthermore, the expansion / contraction mechanism 160 includes a plurality of holes 167 and a plurality of elastic members 169. When the pitch changing main body 111 includes 25 holding members 113, the expansion / contraction mechanism 160 includes 24 holes 167 and 24 elastic members 169. One hole 167 and one elastic member 169 are provided for each combination of two adjacent holding members 113. Focus is now focused on two adjacent holding members 113A and 113B.

[0135] The hole 167 is provided in, for example, the holding member 113B. Specifically, the hole 167 is provided in the side surface of the holding member 113B facing the holding member 113A. The hole 167 opens into the space between the two holding members 113A and 113B. The elastic member 169 is, for example, a spring, but may also be a sponge. The elastic member 169 is provided between the two holding members 113A and 113B, and one end of the elastic member 169 is housed in the hole 167. For example, when the multiple holding members 113 contract in the alignment direction (width direction Y), almost all of the elastic member 169 is housed in the housing portion 161, as shown in FIG. 28 .

[0136] The elastic member 169 generates a repulsive force when an external force is applied. For example, as shown in Figures 27 and 28, when the plurality of holding members 113 expand in the alignment direction (width direction Y) and when they contract in the alignment direction (width direction Y), the elastic member 169 is preferably provided between the two holding members 113A and 113B in a state in which a repulsive force is applied to the elastic member 169.

[0137] When the multiple holding members 113 are extended in the alignment direction (width direction Y) and when they are contracted in the alignment direction (width direction Y) (intermediate between opening and closing), the position of each holding member 113 is free. By providing multiple elastic members 169, it is possible to suppress the movement of each holding member 113 (including two holding members 113A and 113B) in the free state. As a result, it is possible to suppress the shaking of, for example, 50 substrates W held in a vertical position by 50 holding grooves 117. This makes it possible to suppress, for example, contact between two adjacent substrates W.

[0138] In the above description, the holes 167 are provided in the holding member 113B. However, the holes 167 may be provided in the holding member 113A. Furthermore, two holes 167 may be provided in the central holding member 113C.

[0139] The moving unit 115 of the second embodiment includes a base member 119, two guide rails 121, the extension / contraction mechanism 160 shown in FIGS. 27 and 28, the driving unit 125, and the connecting unit 127, as well as a second driving unit 171 and a second connecting unit 173. Like the driving unit 125, the second driving unit 171 is also attached to the lower surface of the base member 119. The second driving unit 171 extends and contracts a rod 171A extending in the width direction Y. The second driving unit 171 includes an air cylinder or an electric actuator.

[0140] The connecting portion 127 connects the first end holding member 113E of the plurality of holding members 113 to the tip of the rod 125A of the driving portion 125. Similarly, the second connecting portion 173 connects the second end holding member 113A of the plurality of holding members 113 to the tip of the rod 171A of the second driving portion 171. The second connecting portion 173 is passed through an opening (not shown) of the base member 119, similar to the connecting portion 127 shown in FIGS.

[0141] The second driver 171 extends and retracts the rod 171A in synchronization with the extension and retraction of the rod 125A by the driver 125. In FIGS. 27 and 28, when the driver 125 extends the rod 125A and the second driver 171 extends the rod 171A, the four holding members 113A, 113B, 113D, and 113E move away from the central holding member 113C. This causes the substrates W held by the multiple holding members 113 to be aligned at irregular intervals. Furthermore, when the driver 125 retracts the rod 125A and the second driver 171 retracts the rod 171A, the four holding members 113A, 113B, 113D, and 113E move closer to the central holding member 113C. This causes the substrates W held by the multiple holding members 113 to be aligned at narrow intervals.

[0142] According to this embodiment, the extension mechanism 160 can extend and retract the plurality of holding members 113 using the accommodation portion 161, the protrusion 163, and the stopper 165.

[0143] A modified example of the second embodiment will be described. In the second embodiment, the moving section 115 of each pitch conversion section 25, 26 includes an extension mechanism 160 having a storage section 161, a protrusion 163, and a stopper 165. In this regard, the moving section 115 may include the extension mechanism 123 (e.g., a link mechanism) of the first embodiment in addition to the extension mechanism 160. In this case, the moving section 115 does not need to include the second driving section 171. As a result, the holding members 113 are moved in conjunction with each other along the guide rail 121 by the single driving section 125. Furthermore, the stopper 165 and the width WD of each holding member 113 ensure that the two adjacent holding members 113 are spaced a predetermined distance apart. Therefore, the positional accuracy of the two holding members 113 at both ends (two holding members 113A, 113E shown in FIGS. 12 and 27) achieved by the extension mechanism 123 can be further improved. Example 3

[0144] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that the description overlapping with the first and second embodiments will be omitted.

[0145] In the first embodiment, the operation of the substrate processing apparatus 1 for collectively processing 50 substrates W is described. In contrast, in the third embodiment, the operation of the substrate processing apparatus 1 for collectively processing 75 substrates W is described.

[0146] The substrate handling mechanism HTR has, for example, 25 or 13 hands 27 arranged at a standard pitch (for example, 10 mm pitch) in the vertical direction Z. The pair of horizontal holding parts 37 of the attitude changing part 19 has, for example, 38 pairs of shelves 37A arranged at the standard pitch. The pair of vertical holding parts 39 of the attitude changing part 19 has, for example, 38 pairs of holding grooves 39A arranged at the standard pitch. The pusher member 55 has, for example, 75 or 76 vertical holding grooves 67 arranged at unequal pitches.

[0147] The chuck 77 of the loading mechanism 71 has 75 or 76 pairs of holding grooves 87, 88 arranged at an uneven pitch. The chuck 78 of the intermediary mechanism 73 has 75 or 76 pairs of holding grooves 107, 108 arranged at a narrow pitch (e.g., 3.333 mm pitch). The chuck 79 of the unloading mechanism 75 has 75 or 76 pairs of holding grooves 95, 96 arranged at an uneven pitch. Each of the two pitch conversion units 25, 26 has 38 holding members 113. Each of the 38 holding members 113 has two holding grooves 117 spaced apart by a first interval (e.g., 3.333 mm). That is, the 38 holding members 113 have a total of 76 holding grooves 117. Note that the 38 holding members 113 may have a total of 75 holding grooves 117.

[0148] <3. Operation of the substrate processing apparatus> The operation of the substrate processing apparatus 1 will be described with reference to the flowchart in Fig. 14. Figs. 29(a) to 32(b) are side views for explaining the operation of the substrate processing apparatus 1. In Figs. 29(a) to 32(b), for convenience of illustration, the pair of horizontal holding parts 37 of the attitude changing part 19 are provided with eight pairs of shelves 37A. Furthermore, the pair of vertical holding parts 39 of the attitude changing part 19 are provided with eight pairs of holding grooves 39A. The pusher member 55 is provided with 16 vertical holding grooves 67.

[0149] Refer to FIG. 1. An external transfer robot (not shown) transfers three carriers C in sequence. The first carrier C stores N (e.g., 25) substrates W1. The second carrier C stores N (e.g., 25) substrates W2. The third carrier C stores N (e.g., 25) substrates W3. N is a natural number greater than or equal to 2. The carrier transfer robot 13 of the stocker 2 transfers the first carrier C from the load port 9 to the mounting shelf 3.

[0150] [Step S01] Vertical position change of the first substrate group 29(a). The substrate handling mechanism HTR transports 25 substrates W1 in horizontal orientations aligned at a reference pitch (for example, 10 mm pitch) from a first carrier C placed on the loading shelf 3 to the orientation conversion unit 19. In other words, the substrate handling mechanism HTR uses the 25 hands 27 to remove the 25 substrates W1 from the first carrier C placed on the loading shelf 3. The substrate handling mechanism HTR then transports the removed 25 substrates W1 to the orientation conversion unit 19. The orientation conversion unit 19 receives the 25 substrates W1 from 25 pairs of shelves 37A out of the 38 pairs of shelves 37A. Thereafter, the carrier transport robot 13 transports the empty first carrier C from the loading shelf 3 to the storage shelf 11. Thereafter, the carrier transport robot 13 transports the second carrier C from the load port 9 to the loading shelf 3.

[0151] 29(b). The substrate handling mechanism HTR transports P (e.g., 13 or 12) substrates W2 of the 25 (N) substrates W2 in horizontal orientations aligned at the reference pitch from the second carrier C placed on the mounting shelf 3 to the orientation conversion unit 19. Note that P is a natural number of 1 or greater. In other words, the substrate handling mechanism HTR removes the 25 substrates W2 from the second carrier C placed on the mounting shelf 3. The substrate handling mechanism HTR then transports 13 substrates W2, which is approximately half of the removed 25 substrates W2, to the orientation conversion unit 19.

[0152] The position changer 19 already holds 25 substrates W1. The position changer 19 receives 13 substrates W2 on 13 pairs of shelves 37A out of the 38 pairs of shelves 37A. As a result, the position changer 19 holds 38 substrates W1, W2 (25 substrates W1 and 13 substrates W2). These 38 substrates W1, W2 are called the first substrate group. Then, the storage transfer unit 53 (see FIG. 4) of the position changer 19 moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37.

[0153] See FIG. 30(a). The posture conversion unit 19 converts 38 (two or more) substrates W1, W2, including 25 (N) substrates W1 and 13 (P) substrates W2 held at the reference pitch, from a horizontal posture to a vertical posture all at once. Specifically, the rotation drive unit 41 rotates the pair of horizontal holding units 37, etc., by 90 degrees around the horizontal axis AX2. As a result, the 38 substrates W1, W2 held by the pair of horizontal holding units 37 and the pair of vertical holding units 39 are converted from a horizontal posture to a vertical posture. Thereafter, the axial movement unit 51 (see FIG. 4) moves the pair of horizontal holding units 37 in a direction that moves the pair of horizontal holding units 37 closer to the support surface 35A so that the 38 pairs of shelves 37A of the pair of horizontal holding units 37 move away from the 38 substrates W1, W2 held in the vertical posture.

[0154] The substrate handling mechanism HTR is on standby while holding 12 substrates W2. The carrier transport robot 13 also transports an empty second carrier C from the loading shelf 3 to the storage shelf 11. After transporting the empty second carrier C from the loading shelf 3, the carrier transport robot 13 transports a third carrier C from the load port 9 to the loading shelf 3.

[0155] [Step S02] Receiving the first group of substrates by the pusher member See Figure 30(b). Thereafter, the pusher lifting unit 65 (see Figure 5) raises the pusher member 55 to a position higher than the pair of horizontal holding units 37 and the pair of vertical holding units 39. As a result, the pusher member 55 receives the 38 substrates W1, W2 (first substrate group) that have been converted to a vertical position. The pusher member 55 also holds the 38 substrates W1, W2 aligned at the reference pitch.

[0156] [Step S03] Movement of the first substrate group at the first interval See Figure 31(a). The pusher mechanism 21 moves the 38 substrates W1, W2 held by the pusher members 55 at a first interval TN1 (e.g., 3.333 mm) in the alignment direction of the 38 substrates W1, W2. Specifically, the pusher rotation unit 59 (see Figure 5) rotates the pusher members 55 180 degrees around the vertical axis AX3. As a result, the surfaces of the 38 substrates W1, W2 face rightward. Furthermore, the 38 substrates W1, W2 held by the pusher members 55 are moved leftward at the first interval TN1.

[0157] Additionally, the attitude change unit 19 rotates the pair of horizontal holding units 37, etc. by 90 degrees around the horizontal axis AX2. This raises the pair of horizontal holding units 37, etc. The axial movement unit 51 (see FIG. 4) of the attitude change unit 19 moves the pair of horizontal holding units 37 in a direction away from the support surface 35A. Additionally, the storage movement unit 53 (see FIG. 4) of the attitude change unit 19 moves the pair of vertical holding units 39 away from the pair of horizontal holding units 37.

[0158] [Step S04] Vertical position change of second substrate group Thereafter, the substrate handling mechanism HTR transports the remaining 12 (Q) substrates W2 in the horizontal orientation aligned at the reference pitch out of the 25 (N) substrates W2 in the second carrier C to the orientation conversion unit 19. In other words, the substrate handling mechanism HTR transports the 12 (Q) substrates W2 already held to the orientation conversion unit 19. Twelve pairs of shelves 37A out of the 38 pairs of shelves 37A of the horizontal holding unit 37 receive the 12 substrates W2. Note that Q is a natural number of 1 or greater.

[0159] 31(b), the substrate handling mechanism HTR transports 25 substrates W3 in a horizontal position aligned at the reference pitch from the third carrier C placed on the mounting shelf 3 to the position conversion unit 19. Specifically, the substrate handling mechanism HTR removes the 25 substrates W3 from the third carrier C placed on the mounting shelf 3. The substrate handling mechanism HTR then transports the removed 25 substrates W3 to the position conversion unit 19. The 25 pairs of shelves 37A of the horizontal holding unit 37 receive the 25 substrates W3. As a result, the position conversion unit 19 holds 37 substrates W2 and W3 (12 substrates W2 and 25 substrates W3). The 37 substrates W2 and W3 are called the second substrate group.

[0160] Thereafter, the storage transfer unit 53 (see FIG. 4) moves the pair of vertical holding units 39 closer to the pair of horizontal holding units 37. The pusher mechanism 21 also lowers the pusher members 55 holding the 38 substrates W1, W2. The carrier transport robot 13 also transports the empty third carrier C from the loading shelf 3 to the storage shelf 11.

[0161] 32(a). Then, the posture changing unit 19 changes 37 (two or more) substrates W2, W3, including 12 (Q) substrates W2 and 25 (N) substrates W3 held at the reference pitch, from a horizontal posture to a vertical posture all at once. Then, the axial moving unit 51 (see FIG. 4) moves the pair of horizontal holding units 37 in a direction that brings them closer to the support surface 35A.

[0162] [Step S05] Receiving the second group of substrates by the pusher member See Figure 32(b). Thereafter, the pusher lifting unit 65 (see Figure 5) raises the pusher member 55. As a result, the pusher member 55 receives the 37 substrates W2, W3 (second substrate group) that have been converted to a vertical position. The pusher member 55 also holds, in a vertical position, 75 substrates W (W1, W2, W3) consisting of the 38 substrates W1, W2 and the 37 substrates W2, W3 that are alternately arranged. The 75 substrates W (processing substrate group) held by the pusher member 55 are aligned at irregular pitches, as shown in Figure 32(b).

[0163] As shown in Figures 32(a) and 32(b), the surfaces of the 38 substrates W1 and W2 face a predetermined direction (to the right). In contrast, the surfaces of the 37 substrates W2 and W3 face the opposite direction (to the left). That is, the 75 substrates W are aligned face-to-face. As shown in Figure 32(b), a dummy substrate DW may be held in the vertical holding groove 67 that does not hold a substrate W. That is, the pusher member 55 may hold 75 substrates W and one dummy substrate DW (a total of 76 substrates).

[0164] Thereafter, the carry-in mechanism 71 of the transfer mechanism 23 transports the 75 substrates W aligned at an uneven pitch from the pusher member 55 to the first pitch conversion unit 25 (step S06). Thereafter, the first pitch conversion unit 25 converts the pitch of the 75 substrates W (group of substrates to be processed) from the uneven pitch to a narrow pitch (step S07). Thereafter, the intermediary mechanism 73 receives the 75 substrates W aligned at a narrow pitch from the first pitch conversion unit 25. Thereafter, the intermediary mechanism 73 transports the 75 substrates W to a first transfer position P1 (step S08). Note that the first transfer position P1 is a position where the intermediary mechanism 73 can transfer the 75 substrates W to the main transport mechanism WTR.

[0165] The main transport mechanism WTR then transports the 75 substrates W aligned at a narrow pitch to, for example, the chemical liquid treatment tank BT1. The chemical liquid treatment tank BT1 collectively treats the 75 substrates W aligned at a narrow pitch with a chemical liquid (step S09). Specifically, the main transport mechanism WTR transports the 75 substrates W to, for example, the lifter LF1 responsible for the chemical liquid treatment tank BT1. The lifter LF1 immerses the 75 substrates W in the chemical liquid stored in the chemical liquid treatment tank BT1, and then immerses the 75 substrates W in pure water stored in the cleaning treatment tank BT2. The main transport mechanism WTR then transports the 75 substrates W from the lifter LF1 to the drying unit 143. The drying unit 143 then dries the 75 substrates W.

[0166] The subsequent latter half of the operation of the substrate processing apparatus 1 is performed as shown in the flowchart of Fig. 21. At that time, the 75 substrates W are subjected to posture changes and the like in the order of Fig. 32(b), Fig. 32(a), Fig. 31(b), Fig. 31(a), Fig. 30(b), Fig. 30(a), Fig. 29(b), and Fig. 29(a). Twenty-five substrates W3 are stored in the third carrier C. Furthermore, 25 substrates W2 are stored in the second carrier C, and 25 substrates W1 are stored in the first carrier C.

[0167] According to this embodiment, a first pitch conversion is performed by aligning N (e.g., 25) substrates W1, W2, W3 stored in each of the three carriers C at a standard pitch (e.g., 10 mm pitch) at an uneven pitch, and a second pitch conversion is performed to change the uneven pitch to a narrow pitch (e.g., 3.333 mm pitch). By performing pitch conversion in two stages, the N substrates W1, W2, W3 stored in each of the three carriers C at the standard pitch can be easily converted to a narrow pitch.

[0168] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0169] (1) In the above-described embodiments, when the reference interval TN9 is, for example, 10 mm, the first interval TN1 is, for example, 3.333 mm, and the second interval TN2 is, for example, 6.666 mm. In this case, the first interval TN1 is equal to half the second interval TN2. In this regard, the first interval TN1 may be smaller than half the second interval TN2 (larger than 0 (zero) mm). For example, when the reference interval TN9 is, for example, 10 mm, the first interval TN1 may be 3 mm, and the second interval TN2 may be 7 mm. Alternatively, the first interval TN1 may be 2.5 mm, and the second interval TN2 may be 7.5 mm. Preferably, the second interval TN2 is two to three times the first interval TN1.

[0170] For example, the two retaining grooves 117 of each retaining member 113 may be configured to be spaced apart by a first spacing TN1 (e.g., 3 mm) that is less than half the second spacing TN2 (e.g., 7 mm) and greater than 0 mm. The uneven pitch alternates between the first spacing TN1 and a second spacing TN2 that is greater than the first spacing TN1. Assume that there is a predetermined spacing (reference spacing TN9) that is composed of one first spacing TN1 and one second spacing TN2. If the predetermined spacing is, for example, 10 mm, and the first spacing TN1 is smaller than half the second spacing TN2, the first spacing TN1 can be smaller than 1 / 3 of 10 mm, and the first spacing TN1 can be any length, such as 3 mm, with no decimal points.

[0171] In addition, the two holding grooves 117 of each holding member 113 may be configured to be spaced apart by a first distance TN1 (e.g., 3 mm) that is greater than or equal to 1 / 3 and less than or equal to 1 / 2 of the second distance TN2 (e.g., 7 mm).

[0172] (2) In the above-described embodiments and modified example (1), when the reference interval TN9 is, for example, 10 mm, the first interval TN1 is, for example, 3.333 mm, and the second interval TN2 is, for example, 6.666 mm. In this regard, the first interval TN1 may be larger than 1 / 3 the reference interval TN9 (for example, 3.333 mm) and smaller than 1 / 2 the reference interval TN9 (for example, 5 mm).

[0173] (3) In each of the above-described embodiments and modifications, the carry-in mechanism 71 is provided behind the carry-out mechanism 75. However, the carry-in mechanism 71 may be provided in front of the carry-out mechanism 75. That is, the positions of the carry-in mechanism 71 and the carry-out mechanism 75 may be reversed. In this case, the carry-in mechanism 71 transports multiple substrates W from the pusher member 55 to the second pitch conversion unit 26, and the carry-out mechanism 75 transports multiple substrates W from the first pitch conversion unit 25 to the pusher member 55.

[0174] (4) In the above-described embodiments and modifications, the intermediary mechanism 73 transports multiple substrates W aligned at a narrow pitch from the first pitch conversion unit 25 to the main transport mechanism WTR. However, the intermediary mechanism 73 may transport multiple substrates W aligned at a narrow pitch from the main transport mechanism WTR to the second pitch conversion unit 26.

[0175] (5) In the above-described embodiments and modifications, the chuck 77 (a pair of chuck members 77A, 77B) of the carry-in mechanism 71 is opened and closed by the opening / closing unit 81. In this regard, the chuck 77 does not have to be configured to be opened and closed.

[0176] (6) In the above-described embodiments and modifications, the chuck 79 (a pair of chuck members 79A, 79B) of the carry-out mechanism 75 is opened and closed by the opening / closing unit 89. In this regard, the chuck 79 does not have to be configured to be opened and closed.

[0177] (7) In the above-described embodiments and modifications, the substrate processing apparatus 1 collectively processes, for example, 50 substrates W aligned face-to-face. However, the substrate processing apparatus 1 may also collectively process 50 substrates W aligned face-to-back. "Face-to-back" refers to an alignment state in which the 25 substrates W1 of the first substrate group and the 25 substrates W2 of the second substrate group face the same direction (e.g., leftward). In this case, in step S03 of the flowchart shown in FIG. 14 , the pusher mechanism 21 does not rotate the pusher member 55 180 degrees around the vertical axis AX3, but instead moves the pusher member 55 in the width direction Y at a first interval TN1 (e.g., 3.333 mm) using the pusher horizontal movement unit 61.

[0178] (8) In each of the above-described embodiments and modifications, the substrate processing apparatus 1 may collectively process 100 substrates W. In this case, the substrate processing apparatus 1 is configured as follows.

[0179] The substrate handling mechanism HTR has, for example, 25 or 13 hands 27 arranged at a standard pitch (for example, 10 mm pitch) in the vertical direction Z. The pair of horizontal holding parts 37 of the attitude changing part 19 has, for example, 50 pairs of shelves 37A arranged at the standard pitch. The pair of vertical holding parts 39 of the attitude changing part 19 has, for example, 50 pairs of holding grooves 39A arranged at the standard pitch. The pusher member 55 has 100 vertical holding grooves 67 arranged at unequal pitches.

[0180] The chuck 77 of the loading mechanism 71 has 100 pairs of holding grooves 87, 88 arranged at an uneven pitch. The chuck 78 of the intermediary mechanism 73 has 100 pairs of holding grooves 107, 108 arranged at a narrow pitch (for example, 3.333 mm pitch). The chuck 79 of the unloading mechanism 75 has 100 pairs of holding grooves 95, 96 arranged at an uneven pitch. Each of the two pitch conversion units 25, 26 has 50 holding members 113. Each of the 50 holding members 113 has two holding grooves 117 spaced apart by a first interval (for example, 3.333 mm). That is, the 50 holding members 113 have a total of 100 holding grooves 117.

[0181] The substrate processing apparatus 1 also creates groups of 100 processed substrates as follows: The first substrate group is composed of 25 substrates W1 on the first carrier C and 25 substrates W2 on the second carrier C. The second substrate group is composed of 25 substrates W3 on the third carrier C and 25 substrates W4 on the fourth carrier C. Note that substrate W4 is not shown. The first and second substrate groups are individually converted from a horizontal position to a vertical position by the position conversion unit 19. The pusher member 55 holds the 100 substrates W aligned at an irregular pitch. These 100 substrates W are aligned alternately, with 50 substrates W1, W2 and 50 substrates W3, W4 aligned, for example, face-to-face.

[0182] (9) In the above-described embodiments and modifications, the transfer block 5 is provided with the substrate handling mechanism HTR and the attitude changing unit 19, separately. In this regard, the substrate handling mechanism HTR may have the function of the attitude changing unit 19. In other words, the attitude changing unit 19 may have the function of the substrate handling mechanism HTR. For example, the substrate handling mechanism HTR (or the attitude changing unit 19) uses the thirteen hands 27 to pick up thirteen substrates W from a carrier C placed on the mounting shelf 3 and change the attitude of the picked-up thirteen substrates W from a horizontal attitude to a vertical attitude. Thereafter, the substrate handling mechanism HTR (or the attitude changing unit 19) may arrange the thirteen vertically oriented substrates W in the plurality of vertical holding grooves 67 on the pusher member 55. The attitude changing unit 19 having the function of the substrate handling mechanism HTR corresponds to the attitude changing mechanism of the present invention.

[0183] (10) In the above-described embodiments and modifications, the transfer mechanism 23 includes the intermediary mechanism 73, but the transfer mechanism 23 does not necessarily include the intermediary mechanism 73. In this case, the main transport mechanism WTR receives the plurality of substrates W aligned at a narrow pitch directly from the first pitch conversion unit 25.

[0184] (11) In the above-described embodiments and modifications, the transfer block 5 includes two pitch conversion units 25, 26. However, the transfer block 5 may include one or three or more pitch conversion units. For example, if the transfer block 5 includes a single pitch conversion unit 25, the transfer block 5 may not include, for example, the carry-out mechanism 75. Furthermore, the single pitch conversion unit 25 converts the pitch of the multiple substrates W between an unequal pitch and a narrow pitch.

[0185] (12) In each of the above-described embodiments and modifications, the carry-in mechanism 71 includes a front-rear direction moving unit 83 that moves the chuck 77 and other components horizontally in the front-rear direction X. The carry-out mechanism 75 includes a front-rear direction moving unit 91 that moves the chuck 79 and other components horizontally in the front-rear direction X. In these embodiments and modifications, the carry-in mechanism 71 does not necessarily have to include the front-rear direction moving unit 83, and the carry-out mechanism 75 does not necessarily have to include the front-rear direction moving unit 91. In this case, the pusher mechanism 21 may further include a front-rear direction moving unit (not shown) that moves the pusher member 55 horizontally in the front-rear direction X. For example, the pusher member 55 may be moved horizontally in the front-rear direction X while the chuck 77 of the carry-in mechanism 71 is moved in the width direction Y, so that the carry-in mechanism 71 receives from the pusher member 55 a plurality of substrates W that are aligned vertically at unequal pitches. [Explanation of symbols]

[0186] 1... Substrate processing equipment 3... Shelf HTR: Substrate handling mechanism 19 ... Posture conversion unit 21 ... Pusher mechanism 23...Delivery mechanism 25,26 ... Pitch conversion section 55 ... Pusher member 113 (113A to 113E) ... Holding member 115 ... Mobile section 117 … Retaining groove 121 ... guide rail 123,160 … Telescopic mechanism 125 ... Drive unit BT1~BT4 ... Batch processing tanks WTR: Main transport mechanism 151 ... control section 161 ... Storage area 163 … Protrusion 165 ... Stopper 169 ... Elastic member NT1 … 1st interval NT2 … 2nd interval NT9…Reference interval C...Career W(W1,W2,W3,W4) ... Substrate

Claims

1. A substrate processing apparatus for processing a plurality of substrates, a pitch conversion unit that converts the pitch of the plurality of substrates between an unequal pitch in which a first interval and a second interval wider than the first interval are alternately repeated, and a narrow pitch in which the first interval is repeated; a substrate processing section that collectively processes the plurality of substrates aligned at the narrow pitch; a main transport mechanism that transports the plurality of substrates aligned at the narrow pitch to the substrate processing section, The pitch conversion unit a plurality of holding members for holding the plurality of substrates aligned at an irregular pitch; a moving unit that moves the plurality of holding members in the alignment direction of the plurality of substrates so as to change between an uneven pitch state in which the plurality of substrates are aligned at the uneven pitch and a narrow pitch state in which the plurality of substrates are aligned at the narrow pitch, A substrate processing apparatus characterized in that each of the plurality of holding members has two holding grooves that individually hold two of the plurality of substrates, the two holding grooves being spaced apart by the first distance.

2. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the two holding grooves are configured to be spaced apart by the first interval which is smaller than half the second interval.

3. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the two holding grooves are configured to be spaced apart by the first interval, which is half the second interval.

4. 2. The substrate processing apparatus according to claim 1, The moving unit is a guide rail that supports the plurality of holding members so that the holding members are movable in the alignment direction; an expansion / contraction mechanism that expands and contracts the plurality of holding members in the alignment direction; a drive unit that drives the extension / contraction mechanism.

5. 5. The substrate processing apparatus according to claim 4, The extension mechanism is a receiving portion provided in a first holding member of the plurality of holding members; a protrusion protruding from the second holding member toward the first holding member adjacent to the second holding member among the plurality of holding members, the protrusion being accommodated in the accommodation portion when the plurality of holding members contract in the alignment direction; a stopper provided at the tip of the protrusion, the stopper preventing the protrusion from coming off the accommodation portion when the plurality of holding members extend in the alignment direction.

6. 6. The substrate processing apparatus according to claim 5, The substrate processing apparatus according to claim 1, wherein the extension mechanism further includes an elastic member provided between the first holding member and the second holding member.

7. 7. The substrate processing apparatus according to claim 1, a posture change mechanism that changes the posture of the plurality of substrates between a horizontal posture and a vertical posture; a pusher mechanism having a pusher member that holds the plurality of substrates aligned at the uneven pitch in a vertical position and that is capable of transferring the plurality of substrates to and from the position conversion mechanism; a transfer mechanism that transfers the plurality of substrates aligned at the non-uniform pitch between the pusher member and the pitch changing section.

8. 8. The substrate processing apparatus according to claim 7, Further comprising a control unit, The control unit the posture changing mechanism changes the posture of two or more first substrates held at a reference pitch in which a reference interval that is the sum of the first interval and the second interval is repeated from a horizontal posture to a vertical posture at the same time; the pusher member receives the two or more first substrates that have been converted into a vertical position, and holds the two or more first substrates that have been aligned at the reference pitch in a vertical position; the pusher mechanism moves the two or more first substrates held by the pusher member at the first interval in an alignment direction of the two or more first substrates; the posture changing mechanism changes the two or more second substrates held at the reference pitch from a horizontal posture to a vertical posture at the same time; the pusher member receives the two or more second substrates converted into a vertical position; the pusher member holds the plurality of substrates, which are made up of the two or more first substrates and the two or more second substrates that are alternately arranged and aligned at the uneven pitch; transporting the plurality of substrates aligned at the uneven pitch from the pusher member to the pitch conversion unit by the delivery mechanism; converting the pitch of the plurality of substrates from the unequal pitch to the narrow pitch by the pitch converting unit; transporting the plurality of substrates aligned at the narrow pitch to the substrate processing section by the main transport mechanism; a substrate processing apparatus, characterized in that the substrate processing section processes the plurality of substrates aligned at the narrow pitch all at once;

9. 8. The substrate processing apparatus according to claim 7, a carrier mounting shelf for mounting carriers each storing N substrates, the N substrates being a natural number equal to or greater than 2, aligned at a reference pitch in which a reference interval that is the sum of the first interval and the second interval is repeated; The attitude conversion mechanism includes: a posture change unit that changes the two or more first substrates and the two or more second substrates individually between a horizontal posture and a vertical posture; a substrate handling mechanism that transports the N substrates between the carrier placed on the carrier mounting shelf and the attitude changing unit.

10. 10. The substrate processing apparatus according to claim 9, Further comprising a control unit, The control unit transporting the N substrates in the first carrier in a horizontal orientation aligned at the reference pitch from the first carrier placed on the carrier mounting shelf to the orientation conversion unit by the substrate handling mechanism; transporting P substrates in horizontal orientations aligned at the reference pitch from the second carrier placed on the carrier mounting shelf to the orientation conversion unit by the substrate handling mechanism; The posture changing unit changes the N substrates and the two or more first substrates having the P substrates of the first carrier held at the reference pitch from a horizontal posture to a vertical posture at the same time, the pusher member receives the two or more first substrates that have been converted into a vertical position and holds the two or more first substrates that have been aligned at the reference pitch; the pusher mechanism moves the two or more first substrates held by the pusher member at the first interval in an alignment direction of the two or more first substrates; transporting the remaining Q substrates of the N substrates in the second carrier that are aligned at the reference pitch and have a horizontal orientation to the orientation conversion unit by the substrate handling mechanism; transporting the N substrates in the third carrier in a horizontal orientation aligned at the reference pitch from the third carrier placed on the carrier mounting shelf to the orientation conversion unit by the substrate handling mechanism; the posture changing unit changes the Q substrates held at the reference pitch and the two or more second substrates having the N substrates of the third carrier from a horizontal posture to a vertical posture at the same time; the pusher member receives the two or more second substrates converted into a vertical position; the pusher member holds the plurality of substrates, which are made up of the two or more first substrates and the two or more second substrates that are alternately arranged and aligned at the uneven pitch; transporting the plurality of substrates aligned at the uneven pitch from the pusher member to the pitch conversion unit by the delivery mechanism; converting the pitch of the plurality of substrates from the unequal pitch to the narrow pitch by the pitch converting unit; transporting the plurality of substrates aligned at the narrow pitch to the substrate processing section by the main transport mechanism; a substrate processing apparatus, characterized in that the substrate processing section processes the plurality of substrates aligned at the narrow pitch all at once;

11. 8. The substrate processing apparatus according to claim 7, Further comprising a control unit, The control unit transporting the plurality of substrates, which have been collectively processed in the substrate processing unit and which are aligned at the narrow pitch and have a vertical posture, to a position above the pitch conversion unit by the main transport mechanism; the pitch conversion unit holds the plurality of substrates aligned at the narrow pitch in a vertical position; converting the pitch of the plurality of substrates from the narrow pitch to the unequal pitch by the pitch converting unit; the delivery mechanism transports the plurality of substrates aligned at the unequal pitch from the pitch conversion unit to the pusher member; the pusher member holds the plurality of substrates, which are aligned at the unequal pitch and in which two or more first substrates and two or more second substrates are alternately arranged, in a vertical position; the posture conversion mechanism receives the two or more first substrates aligned at a reference pitch from the pusher member and converts the two or more first substrates from a vertical posture to a horizontal posture; the posture conversion mechanism receives two or more second substrates from the pusher member, the two or more second substrates being aligned at a reference pitch, and converts the two or more second substrates from a vertical posture to a horizontal posture; The substrate processing apparatus is characterized in that the reference pitch is a reference interval that is a sum of the first interval and the second interval, and is repeated.

12. A substrate processing method for processing a plurality of substrates, comprising: a pitch conversion step of converting the pitch of the plurality of substrates from an unequal pitch in which a first interval and a second interval wider than the first interval are alternately repeated to a narrow pitch in which the first interval is repeated by a pitch conversion unit; a substrate transport step of transporting the plurality of substrates aligned at the narrow pitch to a substrate processing section by a main transport mechanism; a substrate processing step of collectively processing the plurality of substrates aligned at the narrow pitch by the substrate processing unit, The pitch shifting step includes: a holding step of holding two of the plurality of substrates at the first interval using two holding grooves separated by the first interval that each of the plurality of holding members has, while holding the plurality of substrates aligned at the uneven pitch using the plurality of holding members; a pitch change execution step of moving the plurality of holding members in the alignment direction of the plurality of substrates by a moving unit so as to change the uneven pitch state in which the plurality of substrates are aligned at the uneven pitch to a narrow pitch state in which the plurality of substrates are aligned at the narrow pitch; A substrate processing method comprising:

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