Tray for large-size semiconductor integrated circuit

Abstract

PURPOSE: To prevent terminals on a bottom surface of a substrate from contacting an inner bottom surface of a pocket of a tray for semiconductor integrated circuit that should store the substrate of a large semiconductor integrated circuit, and to provide a tray for large-size semiconductor integrated circuit that can be operated with an existing semiconductor manufacturing apparatus (including minimal apparatus modifications) for operating the substrate of a JEDEC-standard semiconductor integrated circuit.SOLUTION: There is provided a tray 1 for large-sized semiconductor integrated circuit in which protrusions are formed so as to project in the short-side direction from edges extending in the longitudinal direction of the tray for semiconductor integrated circuit having one or more pockets, and a concave curved surface 10 having a circular contour is formed on an inner bottom surface 4 of one or more pockets 2 formed on a front surface of the tray 1 for semiconductor integrated circuit. In one embodiment, the concave curved surface 10 may be formed of a spherical crown curved surface having a predetermined radius of curvature.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a tray for semiconductor integrated circuits (ICs, etc.) for accommodating substrates of semiconductor integrated circuits, and more particularly to a tray for large-sized semiconductor integrated circuits for accommodating substrates (including packages) of semiconductor integrated circuits having particularly large dimensions. [Background technology]

[0002] A tray for semiconductor integrated circuits (hereinafter simply referred to as a "tray") is formed with one or more pockets for accommodating semiconductor integrated circuit substrates. Support steps for supporting the peripheral edge of the semiconductor integrated circuit substrate from below are formed to extend horizontally from the peripheral wall of the pocket, so that even when a grid array type semiconductor integrated circuit substrate such as a PGA or BGA is accommodated in the tray pocket, the terminals on the bottom surface of the substrate do not normally come into contact with the inner bottom surface of the pocket.

[0003] In addition, trays for semiconductor integrated circuits generally have dimensions (rectangles of approximately 315.0 mm (to 322.6 mm) x approximately 135.9 mm) that comply with the standards of the Joint Electronic Devices and Communications (JEDEC) Semiconductor Engineering Consortium (hereinafter simply referred to as "JEDEC"), and are configured so that they can be operated by semiconductor manufacturing equipment (including minimal equipment modifications) made in accordance with the JEDEC standards.

[0004] However, the substrate of a large-sized semiconductor integrated circuit may have some distortion (deformation) due to manufacturing errors, etc., and if a person handling a tray for a large-sized semiconductor integrated circuit that contains a substrate of such a large-sized semiconductor integrated circuit accidentally applies too much external force to the tray, the tray may bend, causing the terminals on the bottom of the substrate to come into contact with the inner bottom surface of the tray pocket and be damaged. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2022-142375 Summary of the Invention [Problem to be solved by the invention]

[0006] When a tray for a large semiconductor integrated circuit substrate near the upper limit of the JEDEC standard (for example, a substrate having dimensions of 120 mm x 120 mm in plan view) is deflected by an external force, the terminals of the substrate (particularly those near the center of the substrate) may come into contact with the inner bottom surface of the tray pocket. Furthermore, there is a problem that trays for accommodating such large substrates (having dimensions larger than 120 mm x 120 mm in plan view) are difficult to handle using existing semiconductor manufacturing equipment that is used to handle trays for semiconductor integrated circuits that comply with the JEDEC standard. [Means for solving the problem]

[0007] In one embodiment, a tray for large-sized semiconductor integrated circuits is provided, which has one or more pockets for accommodating semiconductor integrated circuits of a generally rectangular shape, and the inner bottom surface of the pocket formed on the front side of the tray for the semiconductor integrated circuit has a concave curved surface with a circular outline.

[0008] Another feature is that the center of the circle and the center of the pocket (the intersection of two diagonals of the rectangular pocket) are formed roughly concentrically.

[0009] The tray for semiconductor integrated circuits is also characterized in that a concave curved surface having a circular contour is formed on the rear side of the inner bottom surface of the pocket.

[0010] Another feature is that the center of the circle on the back side surface and the center of the pocket (the intersection of two diagonals of the rectangular pocket) are formed roughly concentrically.

[0011] Furthermore, the concave curved surface is characterized by being a spherical crown curved surface having a predetermined radius of curvature.

[0012] In another embodiment, the tray for large-size semiconductor integrated circuits is characterized in that a protrusion protruding in the lateral direction is formed from a side edge extending in the longitudinal direction.

[0013] The protrusion is also characterized in that it is formed in a generally rectangular shape.

[0014] The protrusion is also characterized in that it is formed in a generally trapezoidal shape.

[0015] The protrusion is also characterized in that it is formed in a generally arcuate shape.

[0016] Furthermore, the protrusions are formed at positions spaced apart by a predetermined distance or more from each end of the longitudinal edge of the tray for large-size semiconductor integrated circuits. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a diagram showing an example of a tray for a large-sized semiconductor integrated circuit according to the present invention; [Figure 2] FIG. 2 is a diagram showing a cross section taken along line AA in FIG. 1. [Figure 3] FIG. 10 is a diagram showing a tray in which a concave curved surface is formed on the inner bottom surface of the pocket. [Figure 4] FIG. 10 is a diagram showing a tray having a concave curved surface formed on the rear side of the inner surface. [Figure 5] 10 is a diagram showing a tray in which concave curved surfaces are formed on the inner bottom surface and rear side surface of the pocket. FIG. [Figure 6] A diagram showing the arched cross section of the concave curved surface of the inner bottom surface of the pocket on the front side of the tray. [Figure 7] A diagram showing the arched cross section of the concave curved surface on the back side of the inner bottom surface of the tray pocket. [Figure 8] A diagram showing the arched cross section of the concave curved surface of the inner bottom surface and back side surface of the tray pocket. [Figure 9] FIG. 10 shows a tray having a generally rectangular protrusion formed thereon. [Figure 10] FIG. 10 shows a tray having a generally trapezoidal protrusion formed thereon. [Figure 11] FIG. 10 shows a tray having a generally arcuate shaped protrusion formed thereon. DETAILED DESCRIPTION OF THE INVENTION

[0018] The tray for large-sized semiconductor integrated circuits of the present invention will be described with reference to the accompanying drawings.

[0019] 1 is a perspective view of a tray 1 for semiconductor integrated circuits in one embodiment of the present invention. One or more pockets 2 are formed on the front side of the tray 1 according to the size of the semiconductor integrated circuit substrate. In addition, each pocket 2 has a support step 6 extending horizontally to support the peripheral edge of the semiconductor integrated circuit substrate from below so that the terminals on the bottom surface of the semiconductor integrated circuit substrate do not come into contact with the inner bottom surface 4 of the pocket 2.

[0020] In one embodiment, a concave curved surface having a circular contour 8 is formed on the inner bottom surface of each of the two pockets 2 on the front side of the tray 1 .

[0021] FIG. 2(a) shows a cross section taken along line AA in FIG.

[0022] Figure 2(b) is an exaggerated drawing to make the concave curved surface 10 visible (the actual curved surface 8 is so slightly curved that it is difficult to see with the naked eye), and as shown in Figure 2(b), a concave curved surface 10 can be formed on the inner bottom surface 4 of the pocket 2 of the tray 1.

[0023] FIG. 2(c) is a perspective view showing a case where the concave curved surface 10 is formed from the curved surface of an imaginary spherical crown (a part of a sphere cut by the inner bottom surface 4). FIG. 2(c) is drawn in an exaggerated manner so that the curved surface of the spherical crown can be clearly seen. If the concave curved surface 10 is formed on the inner bottom surface 4 of the pocket 2 in this way, the terminals of the substrate of the semiconductor integrated circuit to be accommodated in the pocket 2 (particularly the terminals near the center of the substrate) are separated from the inner bottom surface 4 of the pocket 2, and therefore do not come into contact with the inner bottom surface 4 of the pocket 2. Note that the dashed dotted lines in FIG. 2 indicate corresponding parts in FIGS. 2(a) to 2(c).

[0024] FIG. 3 shows one embodiment of the tray 1, and FIG. 3(a) is a cross-sectional view taken along line AA in FIG. 1. In this embodiment, as shown in FIG. 3(b), a concave curved surface 10 is formed on the inner bottom surface 4 of the pocket 2 of the tray 1. FIG. 3(b) also shows a circular outline 8 of the concave curved surface 10 in one embodiment, and the center of this circle and the center of the pocket 2 are formed approximately concentrically. In other embodiments, the circular outline 8 may have a radius different from the radius of the circle shown in the figure. In addition, in a specific embodiment, the concave curved surface 10 may be a spherical surface having a predetermined radius of curvature (in one embodiment, a radius of curvature of 1000 mm to 5000 mm, for example, a spherical radius of approximately 3000 mm).

[0025] FIG. 4 shows another embodiment of the tray 1, and FIG. 4(a) is a cross-sectional view taken along line AA in FIG. 1. In this embodiment, as shown in FIG. 4(b), a concave curved surface 10 is formed on the back side of the inner bottom surface 4 of the pocket 2 of the tray 1. FIG. 4(b) also shows a circular outline 8 of the concave curved surface 10 in one embodiment, and the center of this circle and the center of the pocket 2 are formed approximately concentrically. In other embodiments, the circular outline 8 may have a radius different from the radius of the circle shown in the figure. In addition, in certain embodiments, the concave curved surface 10 may be formed as the curved surface of a spherical crown (a part of a sphere cut by the back side) having a predetermined radius of curvature.

[0026] FIG. 5 shows yet another embodiment of the tray 1, and FIG. 5(a) is a cross-sectional view taken along line AA in FIG. 1. In this embodiment, as shown in FIGS. 5(b) and 5(c), concave curved surfaces 10 are formed on the inner bottom surface 4 of the pocket 2 of the tray 1 and on the underside of the inner bottom surface 4. FIG. 5(b) shows the concave curved surface 10 formed on the inner bottom surface 4 of the pocket 2 of the tray 1. FIG. 5(c) shows the concave curved surface 10 formed on the underside of the inner bottom surface 4 of the pocket 2 of the tray 1. Also, FIGS. 5(b) and 5(c) show the circular contour 8 of the concave curved surface 10 in one embodiment, and the center of this circle and the center of the pocket 2 are generally concentric. In other embodiments, the circular contour 8 may have a radius different from the radius of the circle shown. This tray 1 has a structure that supports the weight of the semiconductor integrated circuit substrate with a bridge structure, and therefore is less likely to deform (warp or bend) when storing large substrates, compared to conventional trays. Also, in a particular embodiment, each concave curved surface 10 may comprise a spherical crown curved surface having a radius of curvature of a predetermined magnitude.

[0027] Figure 6 shows a tray 1 in one embodiment, and Figure 6(a) is a cross-sectional view taken along line AA in Figure 1. Figure 6(b) is a diagram showing the arched cross section 12 of the concave curved surface 10 formed on the inner bottom surface 4 of the pocket 2 of the tray 1, and is drawn exaggerated so that the arched cross section 12 can be clearly seen. If the concave curved surface 10 is formed on the inner bottom surface 4 of the pocket 2 in this way, the terminals of the substrate of the semiconductor integrated circuit housed in the pocket 2 (particularly the terminals near the center of the substrate) are separated from the inner bottom surface 4 of the pocket 2 and will not come into contact with the inner bottom surface 4 of the pocket 2.

[0028] Figure 7 shows a tray 1 in another embodiment, and Figure 7(a) is a cross-sectional view taken along line AA in Figure 1. Figure 7(b) is a diagram showing the arched cross section 12 of the concave curved surface 10 formed on the back side of the inner bottom surface 4 of the pocket 2 of the tray 1, and is drawn exaggerated so that the arched cross section 12 can be clearly seen. In this way, if the concave curved surface 10 is formed on the back side of the inner bottom surface 4 of the pocket 2 of the tray 1, the weight of the large semiconductor integrated circuit board to be housed in the pocket 2 can be supported by a bridge structure, which has the advantage that the tray 1 is strong and resistant to breakage even though it is thin.

[0029] Figure 8 shows a tray 1 in yet another embodiment, and Figure 8(a) is a cross-sectional view taken along line AA in Figure 1. Figure 8(b) shows the arched cross section 12 of the concave curved surface 10 formed on the inner bottom surface 4 of the pocket 2 of the tray 1. Figure 8(c) shows the arched cross section 12 of the concave curved surface 10 formed on the back side of the inner bottom surface 4 of the pocket 2 of the tray 1. Figures 8(b) and (c) are drawn exaggeratedly so that the arched cross section 12 can be clearly seen.

[0030] The tray 1 for semiconductor integrated circuits shown in Figures 9 to 11 has protrusions 14 protruding in the lateral direction of the tray 1 so that it can accommodate large semiconductor integrated circuit substrates (substrates with dimensions larger than 120 mm x 120 mm in plan view). The shape and dimensions of these protrusions 14 can be designed depending on the size and weight of the semiconductor integrated circuit substrate to be accommodated in the tray 1. Furthermore, even if the tray 1 is modified to accommodate large semiconductor integrated circuit substrates, if each end of the tray 1's longitudinal edge 16 can be held by existing semiconductor manufacturing equipment that complies with the JEDEC standard, it can be operated using existing semiconductor manufacturing equipment in the same way as a tray that complies with the JEDEC standard. To achieve this, it is necessary to form the protrusions 14 at a location at least a predetermined distance (e.g., 20 mm to 70 mm) from each end of the tray 1's longitudinal edge 16, so that the width (length in the lateral direction) of the tray 1 at its end remains unchanged.

[0031] 9 shows a tray 1 on which a generally rectangular protrusion 14 is formed so that the tray 1 has a generally cross shape in plan view. In this tray 1, the position 18 where the protrusion 14 begins to protrude in the short direction is a predetermined distance or more from each end of the edge 16.

[0032] FIG. 10 shows a tray 1 formed with a protrusion 14 that is generally trapezoidal in shape.

[0033] FIG. 11 shows a tray 1 on which a protrusion 14 is formed that is generally arcuate (a shape surrounded by an arc with a central angle of less than 180° and a chord connecting both end points of the arc). [Explanation of symbols]

[0034] 1...Tray (for large-size semiconductor integrated circuits) 2...Pocket 4...Inner bottom (of pocket) 6...Support step part 8...Circular outline 10...Concave curved surface 12...Arched cross section 14...Protrusion 16...Edge (extending in the longitudinal direction of the tray) 18...(Protruding part) starting position

Claims

1. A tray having one or more pockets for receiving semiconductor integrated circuits of generally rectangular shape, A tray for large-size semiconductor integrated circuits, wherein a concave curved surface having a circular outline is formed on the inner bottom surface of the pocket formed on the front side surface of the tray for semiconductor integrated circuits.

2. 2. The tray for large-size semiconductor integrated circuits according to claim 1, wherein the center of said circle and the center of said pocket are formed substantially concentrically.

3. 3. The tray for large-size semiconductor integrated circuits according to claim 2, wherein a concave curved surface having a circular contour is formed on the back side of the inner bottom surface of the pocket of the tray for large-size semiconductor integrated circuits.

4. 4. The tray for large-size semiconductor integrated circuits according to claim 3, wherein the center of the circle on the rear side surface and the center of the pocket are formed substantially concentrically.

5. 5. The tray for large-size semiconductor integrated circuits according to claim 1, wherein the concave curved surface is a spherical crown curved surface having a predetermined radius of curvature.

6. 2. The tray for a large-size semiconductor integrated circuit according to claim 1, wherein a protrusion protruding in a lateral direction is formed from a side edge extending in a longitudinal direction of the tray for a large-size semiconductor integrated circuit.

7. 7. The tray for a large-sized semiconductor integrated circuit according to claim 6, wherein said protrusion is formed in a generally rectangular shape.

8. 7. The tray for a large-sized semiconductor integrated circuit according to claim 6, wherein said protrusion is formed in a generally trapezoidal shape.

9. 7. The tray for a large-sized semiconductor integrated circuit according to claim 6, wherein said protrusion is formed in a generally arcuate shape.

10. A tray for large-size semiconductor integrated circuits as described in any one of claims 7 to 9, characterized in that the protrusions are formed at positions that are a predetermined distance or more away from each end of the longitudinal edge of the tray for large-size semiconductor integrated circuits.

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