Substrate processing apparatus

Abstract

To improve manufacturing efficiency of a substrate processing apparatus.SOLUTION: A substrate processing apparatus comprises: a transfer chamber having a transfer space of a substrate; at least two processing chambers that are provided by sandwiching the transfer chamber; and a device that is arranged in at least one of an upper direction and a lower direction of the transfer chamber, and is used in common in substrate processing in the at least two processing chambers which are provided by sandwiching the transfer chamber.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus in which a plurality of processing modules are connected to a vacuum transfer module. One example of the substrate processing apparatus has a configuration in which a first vacuum transfer module and a second vacuum transfer module are connected, and six processing modules are connected to each vacuum transfer module. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-104056 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology according to the present disclosure improves the manufacturing efficiency of substrate processing apparatuses. [Means for solving the problem]

[0005] A substrate processing apparatus according to one embodiment of the present disclosure includes a transfer chamber having a substrate transfer space, at least two processing chambers arranged on either side of the transfer chamber, and equipment located at least either above or below the transfer chamber and shared for substrate processing in the at least two processing chambers arranged on either side of the transfer chamber. [Effects of the Invention]

[0006] According to the present disclosure, the manufacturing efficiency of substrate processing apparatuses can be improved. [Brief explanation of the drawings]

[0007] [Figure 1]1 is a perspective view showing an outline of the configuration of a wafer processing apparatus according to an embodiment of the present invention; [Figure 2] 1 is a plan view showing an outline of the configuration of a wafer processing apparatus according to an embodiment of the present invention; [Figure 3] FIG. 2 is an explanatory diagram illustrating a schematic configuration of a composite module. [Figure 4] 3A and 3B are explanatory views schematically illustrating the outline of the configuration of both end surfaces of a transfer chamber. [Figure 5] FIG. 2 is a plan view showing an outline of the configuration of a transport unit. [Figure 6] FIG. 2 is a side view showing the outline of the configuration of the composite module. [Figure 7] 1A and 1B are explanatory diagrams showing how a wafer processing apparatus is manufactured. [Figure 8] FIG. 10 is a plan view showing an outline of the configuration of a wafer processing apparatus according to another embodiment. [Figure 9] FIG. 10 is a plan view showing an outline of the configuration of a wafer processing apparatus according to another embodiment. [Figure 10] FIG. 10 is a plan view showing an outline of the configuration of a wafer processing apparatus according to another embodiment. [Figure 11] FIG. 10 is a plan view showing an outline of the configuration of a wafer processing apparatus according to another embodiment. [Figure 12] FIG. 10 is a plan view showing an outline of the configuration of a wafer processing apparatus according to another embodiment. [Figure 13A] FIG. 1 is a plan view showing an outline of the configuration of a conventional wafer processing apparatus. [Figure 13B] FIG. 1 is a plan view showing an outline of the configuration of a conventional wafer processing apparatus. [Figure 13C] FIG. 1 is a plan view showing an outline of the configuration of a conventional wafer processing apparatus. [Figure 13D] FIG. 1 is a plan view showing an outline of the configuration of a conventional wafer processing apparatus. [Figure 13E] FIG. 1 is a plan view showing an outline of the configuration of a conventional wafer processing apparatus. [Figure 14] 1 is an explanatory diagram showing a state in which a conventional wafer processing apparatus is manufactured. [Figure 15]FIG. 1 is a plan view showing an outline of the configuration of a conventional wafer processing apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0008] In the manufacturing process of semiconductor devices, various processing steps are performed in which a processing module containing semiconductor wafers (substrates: hereinafter simply referred to as "wafers") is evacuated (reduced pressure) and the wafers are processed. These processing steps are performed in a wafer processing apparatus (substrate processing apparatus) equipped with multiple processing modules.

[0009] This wafer processing apparatus has, for example, an atmospheric section equipped with an atmospheric module for processing and transporting wafers in an atmospheric atmosphere, and a vacuum section (reduced pressure section) equipped with a vacuum module (reduced pressure module) for processing and transporting wafers in a vacuum atmosphere (reduced pressure atmosphere). The atmospheric section and the vacuum section are connected together via a load lock module configured so that the interior can be switched between the atmospheric atmosphere and the vacuum atmosphere.

[0010] In designing a wafer processing apparatus, it is known to connect multiple processing modules to one transfer module in the vacuum section. Also, as disclosed in Patent Document 1, for example, there are cases where a transfer system has a configuration in which two transfer modules are connected.

[0011] An example of a conventional wafer processing apparatus 500 will be described with reference to FIGS. 13A to 13E. The wafer processing apparatus 500 has a configuration in which an atmospheric section 501 and a vacuum section 502 are connected via two load lock modules 503. The vacuum section 502 has a first transfer module 510. In this example, two types of first transfer modules 510a and 510b are prepared as the first transfer modules 510. Four processing modules 520 are connected to the first transfer module 510a. Six processing modules 520 are connected to the first transfer module 510b.

[0012] The vacuum section 502 may also have a second transfer module 511 connected to the first transfer module 510 on the opposite side of the load lock module 503 across the first transfer module 510. In this example, two types of second transfer modules 511a and 511b are prepared as the second transfer modules 511. Four processing modules 520 are connected to the second transfer module 511a. Six processing modules 520 are connected to the second transfer module 511b.

[0013] The wafer processing apparatus 500 has a configuration in which first transfer modules 510a, 510 and second transfer modules 511a, 511b are combined in any order. That is, the first transfer modules 510a, 510 and second transfer modules 511a, 511b are combined according to the required number of processing modules 520. FIG. 13A shows a case where four processing modules 520 are required, and the wafer processing apparatus 500 has a configuration in which the four processing modules 520 are connected to a first transfer module 510a. FIG. 13B shows a case where six processing modules 520 are required, and the wafer processing apparatus 500 has a configuration in which the six processing modules 520 are connected to the first transfer module 510b. FIG. 13C shows a case where eight processing modules 520 are required, and the wafer processing apparatus 500 has a configuration in which four processing modules 520 are connected to a first transfer module 510a and four processing modules 520 are connected to a second transfer module 511a. FIG. 13D shows a case where ten processing modules 520 are required, and the wafer processing apparatus 500 has a configuration in which six processing modules 520 are connected to the first transfer module 510b and four processing modules 520 are connected to the second transfer module 511a. FIG. 13E shows a case where 12 processing modules 520 are required, and the wafer processing apparatus 500 has a configuration in which six processing modules 520 are connected to the first transfer module 510b and six processing modules 520 are connected to the second transfer module 511b.

[0014] A method for manufacturing a conventional wafer processing apparatus 500 will be described using the wafer processing apparatus 500 shown in FIG. 13D as an example. As shown in FIG. 14, first, the transfer chamber of the first transfer module 510b is connected to the transfer chamber of the second transfer module 511a, and the first transfer module 510b and the second transfer module 511a are then linked. In this manner, the transfer system is prepared. At this time, the atmospheric section 501 and the load lock module 503 are connected to the first transfer module 510b.

[0015] Next, the processing chambers of the six processing modules 520 are connected (docked) to the transfer chamber of the first transfer module 510b, and the processing chambers of the four processing modules 520 are connected (docked) to the transfer chamber of the second transfer module 511a. In this way, the first transfer module 510b and the second transfer module 511a, which are the transfer system, and the ten processing modules 520 are prepared independently and connected to each other, thereby fabricating the wafer processing apparatus 500.

[0016] As described above, the conventional wafer processing apparatus 500 has an independent configuration for the transfer modules 510 and 511 and the processing module 520. This has led to the following problems.

[0017] (Task 1) It is necessary to prepare a plurality of types (variations) of transfer modules 510 and 511 according to the required number of processing modules 520. In this example, four types of transfer modules 510a, 510b, 511a, and 511b are prepared.

[0018] (Task 2) Since it is necessary to prepare multiple types of transfer modules 510 and 511 depending on the required number of processing modules 520, there are cases where wasted space or layout occurs. For example, as shown in Fig. 15, when an existing wafer processing apparatus 500 has a configuration in which six processing modules 520 are connected to a first transfer module 510b, two processing modules 520 are added. In such a case, it is necessary to connect a second transfer module 511a to the first transfer module 510b, and in this case, the space for connecting the two processing modules 520 in the second transfer module 511a is wasted.

[0019] (Assignment 3) This requires a lot of man-hours because it is necessary to connect a plurality of processing modules 520 individually to the transport modules 510 and 511. For example, as shown in FIG. 14, it is necessary to connect 10 processing modules 520 to the transport modules 510b and 511a, which requires a lot of man-hours.

[0020] (Assignment 4) Since multiple processing modules 520 are provided independently, independent equipment necessary for wafer processing is required for each processing module 520. The equipment includes devices necessary for performing desired processing on wafers inside the processing module 520, such as a power supply source, gas box, gas line, vacuum pump, vacuum line, cooling water supply mechanism, frame, caster device, etc.

[0021] Therefore, the technology disclosed herein improves the manufacturing efficiency of substrate processing apparatuses. Hereinafter, a wafer processing apparatus as a substrate processing apparatus according to this embodiment will be described with reference to the drawings. Note that in this specification and the drawings, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0022] <Wafer processing equipment> First, a wafer processing apparatus according to this embodiment will be described. Fig. 1 is a perspective view showing an outline of the configuration of the wafer processing apparatus 1. Fig. 2 is a plan view showing an outline of the configuration of the wafer processing apparatus 1. In the wafer processing apparatus 1, plasma processing such as etching, film formation, or diffusion is performed on a wafer W as a substrate.

[0023] 1 and 2, the wafer processing apparatus 1 has a configuration in which an atmospheric section 10 and a vacuum section (reduced pressure section) 11 are integrally connected via two load lock modules 20. The atmospheric section 10 includes an atmospheric module that performs desired processing on wafers W in an atmospheric atmosphere. The vacuum section 11 includes a vacuum module (reduced pressure module) that performs desired processing on wafers W in a vacuum atmosphere (reduced pressure atmosphere).

[0024] The load lock module 20 is provided to connect a loader module 30 (described later) in the atmospheric section 10 to a connection module 40 and a composite module 50 (described later) in the vacuum section 11 via gate valves 21, 21. The load lock module 20 is configured to temporarily hold a wafer W. The load lock module 20 is also configured so that its interior can be switched between an atmospheric pressure atmosphere and a vacuum atmosphere.

[0025] The atmospheric section 10 has a loader module 30 equipped with a transfer unit (not shown) for wafers W, and a load port 31 on which a FOUP (not shown) is placed. The FOUP is capable of storing multiple wafers W. The loader module 30 may be connected to an orienter module (not shown) that adjusts the horizontal orientation of the wafers W, a buffer module (not shown) that temporarily stores multiple wafers W, and the like.

[0026] The loader module 30 has a rectangular housing, the interior of which is maintained at atmospheric pressure. A plurality of, for example, five load ports 31 are arranged side by side on one side constituting the long side in the Y-axis direction of the housing of the loader module 30. Two load lock modules 20 are arranged side by side on the other side constituting the long side of the housing of the loader module 30.

[0027] The vacuum section 11 has a connection module 40 and multiple, for example, four, combination modules 50. The connection module 40 and the four combination modules 50 are connected side by side in the X-axis direction from the load lock module 20 side. In the following description, the negative side of the X-axis may be referred to as the front, and the positive side of the X-axis may be referred to as the rear.

[0028] The connection module 40 interconnects two load lock modules 20 and one foremost combined module 50. In this embodiment, the end faces of the two load lock modules 20 on the positive side of the X axis (end faces on the foremost combined module 50 side) are inclined in different directions. On the other hand, as will be described later, the front end face 55a (end face on the load lock module 20 side) of the foremost combined module 50 in the transfer chamber 51 is flat. For this reason, the two load lock modules 20 and the foremost transfer chamber 51 cannot be directly connected, and so the connection module 40 is provided to connect them. Note that if the two load lock modules 20 and the foremost transfer chamber 51 can be directly connected, the connection module 40 may be omitted.

[0029] An exhaust port 41 is formed on the bottom surface of the connection module 40 to evacuate the communicating transfer spaces of the four transfer chambers 51 described below. The exhaust port 41 is connected to a vacuum pump (not shown), such as a dry pump or a turbomolecular pump. Note that, if the connection module 40 is omitted as described above, the exhaust port 41 may be formed on the bottom surface of the frontmost transfer chamber 51.

[0030] Each of the four combined modules 50 has the same configuration. As shown in Fig. 3, the combined module 50 has a configuration in which one transfer chamber 51 and two processing chambers 52 are integrated. The two processing chambers 52 are provided on both sides (positive and negative Y-axis directions) of the transfer chamber 51 in a direction perpendicular to the connection direction (X-axis direction) of the transfer chamber 51. Spatial regions are formed above and below the transfer chamber 51 between the two processing chambers 52. In the following description, the spatial region above the transfer chamber 51 is referred to as an upper shared region 53, and the spatial region below the transfer chamber 51 is referred to as a lower shared region 54.

[0031] A transfer space for transferring the wafer W is formed inside the transfer chamber 51. The transfer chamber 51 is configured so that the transfer space can be maintained in a vacuum atmosphere by evacuating the transfer space through the exhaust port 41.

[0032] As shown in FIG. 4, the front end face 55a of the transfer chamber 51 in the connection direction (the end face in the negative X-axis direction) is flat, and an opening 56a is formed in the front end face 55a. The rear end face 55b of the transfer chamber 51 in the connection direction (the end face in the positive X-axis direction) is flat, and an opening 56b is formed in the rear end face 55b. The openings 56a and 56b have the same shape, and when adjacent transfer chambers 51 are directly connected, these openings 56a and 56b are continuous. When four transfer chambers 51 are connected, the four transfer spaces are communicated via the openings 56a and 56b. In the following description, the space in which the four transfer spaces are communicated may be referred to as a communicated transfer space.

[0033] Adjacent transfer chambers 51 may be connected by any method as long as they can be directly connected to each other. For example, the rear end face 55b of the front transfer chamber 51 and the front end face 55a of the rear transfer chamber 51 may be fixed with screws. In this case, the periphery of the opening 56a in the front end face 55a and the periphery of the opening 56b in the rear end face 55b are sealed.

[0034] 1 and 2, of the four transfer chambers 51, the frontmost transfer chamber 51 is connected to the connection module 40. At this time, a front end face 55a of the transfer chamber 51 is connected to the connection module 40, and an opening 56a of the front end face 55a is continuous with an opening (not shown) of the connection module 40. In addition, the peripheries of these openings are sealed.

[0035] Of the four transfer chambers 51, the opening 56b on the rear end surface 55b of the rearmost transfer chamber 51 is closed by a plate 57, for example.

[0036] As described above, the four transfer chambers 51 are connected, and a magnetic levitation type transfer unit 60 is provided in the communicating transfer space where the four transfer spaces are connected. As shown in FIG. 5, the transfer unit 60 has an end effector 61, two links 62, and two bases 63. The end effector 61 holds a wafer W. Each link 62 connects the end effector 61 to the base 63. One end of the link 62 is connected to the end effector 61 so as to be rotatable about a vertical rotation axis 62a. The other end of the link 62 is connected to the base 63 so as to be rotatable about a vertical rotation axis 62b. The two links 62 can extend and retract while maintaining the orientation of the end effector 61 by changing the distance D between the two rotation axes 62b (the two bases 63). The base 63 is provided with a plurality of permanent magnets.

[0037] A planar motor (not shown) is provided on the bottom surface of the communicating transport space. The planar motor is provided with multiple coils (not shown), which generate a magnetic field when supplied with current. The magnetic field generated by these coils causes a base 63 having a permanent magnet to levitate and move. In other words, the transport unit 60 is magnetically levitated on the planar motor and moves on the planar motor. In this case, the position, orientation, and amount of levitation of the base 63 can be controlled by controlling the current value of the coils.

[0038] The number of transport units 60 provided in the communicating transport space is not limited. One transport unit 60 may be provided, or multiple transport units 60 may be provided.

[0039] A processing space for processing the wafer W is formed inside the processing chamber 52. The processing chamber 52 is configured so that the processing space can be maintained in a vacuum atmosphere. In the processing space, plasma processing such as etching, film formation, or diffusion is performed on the wafer W. The processing space is also connected to the transfer space of the transfer chamber 51 via a wafer loading / unloading port (not shown). The wafer loading / unloading port is configured so that it can be freely opened and closed using a gate valve (not shown).

[0040] The processing chamber 52 is provided with equipment necessary for wafer processing. Of the equipment, equipment that can be shared by the two processing chambers 52 is provided in at least one of the upper shared area 53 and the lower shared area 54. Such equipment includes, for example, a utility supply source, a gas box, a gas line, a vacuum pump, a vacuum line, a cooling water supply mechanism, etc. Furthermore, whether these pieces of equipment are provided in either the upper shared area 53 or the lower shared area 54, or both, can be designed as desired.

[0041] The utility supply source is, for example, a power supply source that supplies power to various devices. The gas box supplies gases required for plasma processing to the processing space of the processing chamber 52. The gas line is a line that supplies gas from the gas box to the processing chamber 52. The vacuum pump includes, for example, a dry pump or a turbomolecular pump, and evacuates the processing space of the processing chamber 52. The vacuum line is a line that connects the vacuum pump to the processing chamber 52. The cooling water supply mechanism supplies cooling water to devices that require cooling water.

[0042] Of the equipment provided in the processing chambers 52, equipment that is not shared by the two processing chambers 52 is provided individually at the position of each processing chamber 52.

[0043] As described above, the composite module 50 has a configuration in which one transfer chamber 51 and two processing chambers 52 are integrated together. As shown in FIG. 6, the transfer chamber 51 and the two processing chambers 52 are supported by a frame 70.

[0044] Furthermore, detachable caster devices 80 are attached to the legs 71 of the frame 70. The caster devices 80 have a plurality of transport casters 81, and as will be described later, move the composite module 50 when fabricating the wafer processing apparatus 1. The configuration of the caster devices 80 is arbitrary, and for example, the caster device disclosed in Japanese Patent Application Laid-Open No. 2022-109094 can be used.

[0045] <Method for manufacturing wafer processing equipment> 7 is an explanatory diagram showing a method for manufacturing the wafer processing apparatus 1. As shown in FIG. 7, when manufacturing the wafer processing apparatus 1, first, the atmospheric section 10, the two load lock modules 20, and the connection module 40 are connected.

[0046] Additionally, caster devices 80 are attached to each of the four combined modules 50. Next, the four combined modules 50 are moved toward the connection module 40, and the four combined modules 50 are connected to the connection module 40. Specifically, first, the transport chamber 51 of the foremost combined module 50 is connected to the connection module 40. Next, the transport chamber 51 of the adjacent rear combined module 50 is connected to the transport chamber 51 of the front combined module 50, and the four combined modules 50 are connected.

[0047] Next, the transfer unit 60 is loaded into the communicating transfer spaces of the four transfer chambers 51. Thereafter, the opening 56b formed in the rear end face 55b of the transfer chamber 51 in the rearmost composite module 50 is closed with a plate 57.

[0048] After the wafer processing apparatus 1 is manufactured as described above, the caster devices 80 are finally removed from each of the four composite modules 50.

[0049] <Effects of this embodiment> According to the above embodiment, the combined module 50 has a configuration in which one transfer chamber 51 and two processing chambers 52 are integrated, so that the type (variation) of the transfer chamber 51 can be unified to one type. For example, in the conventional example shown in FIGS. 13A to 13E, four types of transfer modules 510a, 510b, 511a, and 511b were prepared depending on the required number of processing modules 520. In contrast, in this embodiment, the number of combined modules 50 can be increased or decreased depending on the required number of processing chambers 52, and only one type of transfer chamber 51 can be used.

[0050] Furthermore, since the composite module 50 has a configuration in which one transfer chamber 51 and two processing chambers 52 are integrated, it is possible to eliminate wasted space and layout, for example, as shown in the conventional example in Fig. 15. This allows for improved manufacturing efficiency of the wafer processing apparatus 1.

[0051] Moreover, since the opening 56a formed in the front end face 55a of the transfer chamber 51 and the opening 56b formed in the rear end face 55b have the same shape, one composite module 50 can be connected to any other composite module 50. This further improves the manufacturing efficiency of the wafer processing apparatus 1.

[0052] 14, it was necessary to individually connect a plurality of processing modules 520 to the transfer modules 510 and 511, which required a lot of man-hours. In contrast, in this embodiment, it is only necessary to connect a combined module 50 in which one transfer chamber 51 and two processing chambers 52 are integrated, which reduces the number of man-hours.

[0053] Furthermore, among the equipment required for wafer processing, a utility supply source, gas box, gas line, vacuum pump, vacuum line, cooling water supply, etc. can be provided in either the upper shared area 53 or the lower shared area 54, or both, and shared by the two processing chambers 52. Furthermore, one transfer chamber 51 and two processing chambers 52 are supported by a frame 70, and the frame 70 can be shared by the one transfer chamber 51 and the two processing chambers 52. Furthermore, one caster device 80 is detachably provided to the combined module 50, and the caster device 80 can be shared by the one transfer chamber 51 and the two processing chambers 52. As described above, in this embodiment, equipment that was previously provided individually for each processing chamber can be shared, thereby simplifying the wafer processing apparatus 1 and reducing the cost of the apparatus.

[0054] Furthermore, since the transfer unit 60 provided in the communicating transfer space of the four transfer chambers 51 is of a magnetic levitation type, when manufacturing the wafer processing apparatus 1, the transfer unit 60 can be carried in after the four composite modules 50 are connected. This improves the degree of freedom in the configuration of the transfer chambers 51.

[0055] Furthermore, when a fixed type transfer unit is used as in the past, maintenance of the transfer unit must be performed from above or below the transfer chamber. In contrast, when a magnetic levitation type transfer unit 60 is used as in this embodiment, maintenance can be performed by removing the transfer unit 60 from the rearmost transfer chamber 51, so the above or below the transfer chamber 51 can be used as shared areas 53, 54.

[0056] Furthermore, the magnetic levitation type transfer unit 60 can be installed regardless of the configuration of the transfer chamber 51, so the configuration of the transfer chamber 51 can be made the same. As a result, the order in which the four composite modules 50 are connected is not limited, and the degree of freedom in manufacturing the wafer processing apparatus 1 is improved.

[0057] Furthermore, conventionally, when connecting a first transfer module 510 and a second transfer module 511 as shown in Figures 13C to 13E, a pass module is required between the first transfer module 510 and the second transfer module 511. In contrast, when using a floating transfer type transfer unit 60 as in this embodiment, such a pass module is not required.

[0058] <Other embodiments> Although the wafer processing apparatus 1 in the above embodiment has four processing chambers 52, the number of processing chambers 52 is not limited to this. Furthermore, although the combined module 50 in the above embodiment has a configuration in which one transfer chamber 51 and two processing chambers 52 are integrated, the combined module 50 may have one processing chamber 52, or three or more processing chambers 52. For example, as shown in FIG. 8, the combined module 50 may have a configuration in which one transfer chamber 51 and four processing chambers 52 are integrated.

[0059] In the wafer processing apparatus 1 of the above embodiment, the opening 56b in the rear end face 55b of the rearmost transfer chamber 51 is closed by the plate 57. However, as shown in FIG. 9, a pit-in chamber 100 may be connected to the rearmost transfer chamber 51. A maintenance unit (not shown), for example, is housed inside the pit-in chamber 100. The maintenance unit is a rescue unit that replaces a broken transfer unit 60. Alternatively, the maintenance unit is a cleaning unit that cleans the communicating transfer space of the transfer chamber 51.

[0060] 9, one pit-in chamber 100 is provided, but the number of pit-in chambers 100 is not limited to this. In addition, the rearmost transfer chamber 51 may be connected to another processing chamber, for example, a post-processing chamber that performs an asher process on the wafer W after plasma processing.

[0061] In the above embodiment, the plasma processing is performed on the wafer W in the processing chamber 52, but other processing may be performed. For example, post-processing such as the above-mentioned asher processing may be performed in the processing chamber 52. Alternatively, the above-mentioned pit-in chamber may be provided instead of the processing chamber 52.

[0062] In the above embodiment, the lengths of the multiple processing chambers 52 in the X-axis direction (the direction in which the transfer chambers 51 are connected) are the same, but they may be different. As described above, when processing other than plasma processing is performed in the processing chamber 52, for example, when four wafers W are batch-processed as shown in FIG. 10, the length of the processing chamber 52 in the X-axis direction will be long. In addition, the length of the composite module 50 in the X-axis direction will also be long. On the other hand, when, for example, an asher process or the like is performed, the processing chamber 52 may be small, and the length of the processing chamber 52 in the X-axis direction will be short. In addition, the length of the composite module 50 in the X-axis direction will also be short. In either case, the width of the transfer chambers 51 in the Y-axis direction will be the same in the multiple composite modules 50.

[0063] In the above embodiment, a magnetic levitation type transfer unit 60 is provided in the communicating transfer space of the four transfer chambers 51. However, instead of the transfer unit 60, a fixed type transfer unit 110 may be provided as shown in FIG. 11. The transfer unit 110 is fixedly provided in one of the four transfer chambers 51. The transfer unit 110 has an arm (not shown) capable of holding and transferring a wafer W, and can transfer the wafer W to the two load lock modules 20 and the eight processing chambers 52 by the arm. The number of transfer units 110 in the communicating transfer space is arbitrary and may be two or more.

[0064] In the above embodiment, the exhaust port 41 is provided on the bottom surface of the connection module 40, but as shown in FIG. 12 , an exhaust port 120 may be provided on the bottom surface of the frontmost transfer chamber 51. The exhaust port 120 is connected to a vacuum pump (not shown), such as a dry pump or a turbomolecular pump. However, forming the exhaust port 41 on the connection module 40 as in the above embodiment allows the four transfer chambers 51 to have a common configuration, which improves the manufacturing efficiency of the wafer processing apparatus 1.

[0065] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0066] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0067] Note that the following configuration examples also fall within the technical scope of the present disclosure. (1) A substrate processing apparatus for processing a substrate, a plurality of combined modules each including a transfer chamber having a substrate transfer space and a processing chamber having a substrate processing space; In the substrate processing apparatus, adjacent transfer chambers are connected to each other, and a plurality of the composite modules are linked together. (2) The substrate processing apparatus according to (1), wherein the adjacent transfer chambers are directly connected to each other. (3) The substrate processing apparatus according to (1) or (2), wherein the transfer spaces of the plurality of connected transfer chambers communicate with each other. (4) The substrate processing apparatus according to (3), wherein a magnetic levitation type transport unit is provided in the transport space. (5) The substrate processing apparatus according to (3), wherein at least one of the transfer chambers is provided with a transfer unit fixed to the transfer chamber. (6) the transfer space is maintained in a vacuum atmosphere; The substrate processing apparatus includes: a load lock module configured to be switchable between an air atmosphere and a vacuum atmosphere; a connection module connecting the transfer chamber and the load lock module; The substrate processing apparatus according to any one of (2) to (5), wherein the connection module is formed with an exhaust port for evacuating the transfer space. (7) the transfer space is maintained in a vacuum atmosphere; The substrate processing apparatus according to any one of (2) to (5), wherein one of the transfer chambers is formed with an exhaust port for evacuating the transfer space. (8) The substrate processing apparatus according to any one of (1) to (7), wherein openings of the same shape are formed on both end surfaces of the transfer chamber. (9) The substrate processing apparatus according to any one of (1) to (8), wherein the composite module has a configuration in which one chamber is partitioned into one of the transfer chambers and two or more of the processing chambers. (10) The substrate processing apparatus according to any one of (1) to (9), wherein the composite module has two or more processing chambers. (11) The substrate processing apparatus according to (10), wherein the composite module has three or more processing chambers. (12) The substrate processing apparatus according to any one of (1) to (11), wherein the composite module has a pit-in chamber that houses a maintenance unit. (13) The substrate processing apparatus according to any one of (1) to (12), wherein equipment required for processing the substrate is shared by two or more of the processing chambers. (14) The substrate processing apparatus described in (13), wherein the equipment is arranged in at least one of an upper shared area formed above the transport chamber and a lower shared area formed below the transport chamber in the composite module. [Explanation of symbols]

[0068] 1. Wafer processing equipment 51 Transfer chamber 52 Processing Chamber W wafer

Claims

1. a transfer chamber having a transfer space for the substrate; at least two processing chambers provided on opposite sides of the transfer chamber; and a device disposed above or below the transfer chamber, the device being shared by the at least two processing chambers disposed on either side of the transfer chamber for substrate processing.

2. a plurality of composite modules each including the transfer chamber and the at least two processing chambers; 2. The substrate processing apparatus according to claim 1, wherein adjacent transfer chambers are connected to each other to couple a plurality of the composite modules, the transfer spaces of the connected transfer chambers are in communication with each other, and the transfer spaces are maintained in a vacuum atmosphere.

3. The substrate processing apparatus according to claim 2 , wherein the composite module has a pit-in chamber that houses a maintenance unit.

4. The plurality of composite modules are arranged side by side in one direction, The substrate processing apparatus according to claim 3 , wherein the pit-in chamber is connected to the transfer chamber at the end in the one direction among the plurality of transfer chambers.

5. The substrate processing apparatus according to claim 2 , wherein the transfer space is provided with a magnetic levitation type transfer unit that moves between the plurality of composite modules.

6. The substrate processing apparatus according to claim 2 , wherein the combined module has a configuration in which one chamber is partitioned into one of the transfer chamber and one of the processing chambers.

7. The substrate processing apparatus of claim 2 , wherein the combined module has two processing chambers.

8. 8. The substrate processing apparatus according to claim 1, wherein adjacent transfer chambers are directly connected to each other.

9. 8. The substrate processing apparatus according to claim 1, wherein at least one of the transfer chambers is provided with a transfer unit fixed to the transfer chamber.

10. a load lock module configured to be switchable between an air atmosphere and a vacuum atmosphere; a connection module connecting the transfer chamber and the load lock module, 8. The substrate processing apparatus according to claim 1, wherein the connection module is formed with an exhaust port for evacuating the transfer space.

11. The transfer space is maintained in a vacuum atmosphere, 8. The substrate processing apparatus according to claim 1, wherein one of the transfer chambers is formed with an exhaust port for evacuating the transfer space.

12. 8. The substrate processing apparatus according to claim 1, wherein openings of the same shape are formed on both end surfaces of the transfer chamber.

13. 8. The substrate processing apparatus according to claim 1, wherein the equipment includes at least one of a gas box and a gas line.

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