Substrate processing system, substrate processing method, and program

The substrate processing system uses imaging and control units to detect liquid shortages and adjust valve speeds, addressing the challenge of substrate defects from liquid variations in processing apparatuses.

JP2025125110AActive Publication Date: 2025-08-27SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
JP2024020962
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-02-15
Publication Date
2025-08-27
Estimated Expiration
2044-02-15

AI Technical Summary

Technical Problem

In substrate processing apparatuses, variations in valve opening and closing speeds and liquid delivery timing due to factors like distance and power fluctuations can lead to liquid shortages, causing substrate drying and defects such as particles, which are difficult to identify and address.

Method used

A substrate processing system with imaging devices to capture processing liquid discharge, generating video data for analyzing liquid ejection, and control units to generate ejection data, allowing for easy detection of liquid shortages and adjustments to valve speeds.

Benefits of technology

Facilitates easy detection of liquid shortages and potential defects, enabling timely identification and prevention of substrate defects.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a substrate processing system, a substrate processing method, and a program that can easily confirm or detect whether a liquid shortage has occurred.SOLUTION: A substrate processing system 1 includes a first nozzle 136, a second nozzle 146, and an imaging device 510. The imaging device 510 captures images of a first processing liquid discharged from the first nozzle 136 and a second processing liquid discharged from the second nozzle 146 to generate video data. A control unit 102 or 532 starts supplying the first processing liquid to the first nozzle 136 and then starts supplying the second processing liquid to the second nozzle 146. On the basis of the video data, the control unit 102 or 532 generates first discharge data indicating in chronological order whether the first processing liquid is being discharged from the first nozzle 136 and second discharge data indicating in chronological order whether the second processing liquid is being discharged from the second nozzle 146.SELECTED DRAWING: Figure 8
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Description

[Technical Field]

[0001] The present invention relates to a substrate processing system, a substrate processing method, and a program. [Background technology]

[0002] A single-wafer type substrate processing apparatus is known that processes substrates by sequentially discharging a plurality of types of processing liquid onto the substrate. In the single-wafer type substrate processing apparatus, the substrates are processed one by one with the processing liquid. For example, Patent Document 1 discloses a single-wafer type substrate processing apparatus.

[0003] The substrate processing apparatus of Patent Document 1 includes an organic solvent valve that opens and closes an organic solvent pipe and a hydrophobizing agent valve that opens and closes a hydrophobizing agent pipe. After a delay time has elapsed since the organic solvent valve began closing, the hydrophobizing agent valve begins opening while the discharge of IPA (isopropyl alcohol) from the organic solvent nozzle has not yet completely stopped. As a result, substrate processing can be transitioned from organic solvent processing to hydrophobizing agent processing without causing liquid shortage on the substrate, while suppressing or preventing splashing due to interference between the organic solvent and the hydrophobizing agent. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2019-192799 Summary of the Invention [Problem to be solved by the invention]

[0005] In a substrate processing apparatus such as that described in Patent Document 1, the organic solvent valve and the hydrophobizing agent valve are provided for each of multiple chambers, resulting in variations in their opening and closing speeds. Furthermore, the timing at which the processing liquid reaches the nozzle from the organic solvent valve and the hydrophobizing agent valve varies due to factors such as the distance and / or elevation difference between the organic solvent valve and the hydrophobizing agent valve and the nozzle. Furthermore, variations in the opening and closing speeds of the organic solvent valve and the hydrophobizing agent valve and / or the timing at which the processing liquid reaches the nozzle also occur due to fluctuations in the power usage of the factory in which the substrate processing apparatus is installed. As a result, the discharge of the hydrophobizing agent may start after the discharge of the organic solvent has stopped. In other words, the substrate may run out of liquid. This causes the surface of the substrate to dry out, resulting in defects such as particles.

[0006] However, when a defect such as particles occurs, it is necessary to identify the cause and take measures, but since there are various factors that cause particles, it takes time to identify them.

[0007] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate processing system, a substrate processing method, and a program that can easily confirm or detect whether or not liquid has run out. [Means for solving the problem]

[0008] According to a first aspect of the present invention, a substrate processing system includes a substrate holding unit, a first nozzle, a first valve, a second nozzle, a second valve, an imaging device, and a controller. The substrate holding unit holds a substrate and rotates the substrate. The first nozzle discharges a first processing liquid onto an upper surface of the substrate held by the substrate holding unit. The first valve starts and stops supplying the first processing liquid to the first nozzle. The second nozzle discharges a second processing liquid onto the upper surface of the substrate held by the substrate holding unit. The second valve starts and stops supplying the second processing liquid to the second nozzle. The imaging device captures images of the first processing liquid discharged from the first nozzle and the second processing liquid discharged from the second nozzle to generate video data. The controller controls the first valve to start supplying the first processing liquid to the first nozzle, and then controls the second valve to start supplying the second processing liquid to the second nozzle. The control unit generates, based on the video data, first ejection data indicating in chronological order whether the first processing liquid is being ejected from the first nozzle, and second ejection data indicating in chronological order whether the second processing liquid is being ejected from the second nozzle.

[0009] In one embodiment, the control unit adds the first discharge data and the second discharge data to time-series data that indicates a substrate processing state in time series.

[0010] In one embodiment, the control unit includes a first control unit that controls the first valve and the second valve, and a second control unit that controls the imaging device. The second control unit generates the first ejection data and the second ejection data. The second control unit transmits the generated first ejection data and the second ejection data to the first control unit.

[0011] In one embodiment, the substrate processing system includes a display unit that displays the first discharge data and the second discharge data.

[0012] In one embodiment, the control unit transmits a first control signal to the first valve to control opening and closing of the first valve. The control unit transmits a second control signal to the second valve to control opening and closing of the second valve. The display unit displays first control data indicating the first control signal and second control data indicating the second control signal alongside the first ejection data and the second ejection data.

[0013] In one embodiment, the display section displays the first control data and the second control data, and the first ejection data and the second ejection data side by side as a timing chart.

[0014] In one embodiment, the control unit determines, based on the first ejection data and the second ejection data, whether or not there is a non-ejection period in which the first processing liquid and the second processing liquid are not ejected between a first ejection period in which the first processing liquid is ejected from the first nozzle and a second ejection period in which the second processing liquid is ejected from the second nozzle.

[0015] In one embodiment, the inkjet head further comprises a notification unit that notifies a user of the existence of the non-ejection period when the control unit determines that the non-ejection period exists.

[0016] In one embodiment, the substrate processing system includes a speed controller that adjusts the opening and closing speed of the second valve, and when the control unit determines that the non-discharge period exists, the control unit controls the speed controller to increase the opening and closing speed of the second valve.

[0017] According to a second aspect of the present invention, a substrate processing method includes the steps of holding a substrate and rotating the substrate, starting a supply of a first processing liquid to a first nozzle that discharges the first processing liquid onto an upper surface of the substrate, starting a supply of the second processing liquid to a second nozzle that discharges the second processing liquid onto an upper surface of the substrate after the step of starting the supply of the first processing liquid, capturing images of the first processing liquid discharged from the first nozzle and the second processing liquid discharged from the second nozzle to generate video data, and generating, based on the video data, first discharge data that indicates in chronological order whether the first processing liquid is being discharged from the first nozzle and second discharge data that indicates in chronological order whether the second processing liquid is being discharged from the second nozzle.

[0018] According to a third aspect of the present invention, a program causes a computer to perform the following steps: capturing an image of a first processing liquid ejected from a first nozzle that ejects the first processing liquid onto an upper surface of a substrate; and capturing an image of a second processing liquid ejected from a second nozzle that starts ejecting the second processing liquid onto the upper surface of the substrate after the first nozzle starts ejecting the first processing liquid, thereby generating video data; and generating, based on the video data, first ejection data that indicates in chronological order whether the first processing liquid is being ejected from the first nozzle, and second ejection data that indicates in chronological order whether the second processing liquid is being ejected from the second nozzle. [Effects of the Invention]

[0019] According to the present invention, it is possible to provide a substrate processing system, a substrate processing method, and a program that can easily confirm or detect whether or not a liquid shortage has occurred. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 2 is a schematic plan view of a substrate processing apparatus of the substrate processing system of the present embodiment. [Figure 2] 1 is a schematic diagram of a substrate processing unit and a discharge analysis device of a substrate processing system. [Figure 3]FIG. 2 is a diagram schematically illustrating an example of a captured image generated by an imaging device. [Figure 4] FIG. 2 is a diagram schematically illustrating an example of a captured image generated by an imaging device. [Figure 5] FIG. 1 is a block diagram of a substrate processing system. [Figure 6] FIG. 2 is a flow chart of a substrate processing method according to the present embodiment. [Figure 7] FIG. 4 is a schematic diagram showing an example of time-series data displayed on a display unit. [Figure 8] FIG. 2 is a flow diagram of the discharge analysis device of the present embodiment. [Figure 9] FIG. 10 is a diagram showing a processing flow of the substrate processing apparatus when the first discharge data and the second discharge data are displayed on the display unit. [Figure 10] FIG. 4 is a schematic diagram showing an example of time-series data displayed on a display unit. [Figure 11] FIG. 10 is a block diagram of a substrate processing system according to a first modified example. [Figure 12] FIG. 10 is a block diagram of a substrate processing system according to a second modified example. [Figure 13] FIG. 11 is a block diagram of a substrate processing apparatus according to a third modified example. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, embodiments of a substrate processing system, a substrate processing method, and a program according to the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this specification, to facilitate understanding of the invention, mutually orthogonal X-, Y-, and Z-axes may be described. Typically, the X- and Y-axes are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0022] First, a substrate processing apparatus 100 of a substrate processing system 1 of this embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic plan view of the substrate processing apparatus 100 of the substrate processing system 1 of this embodiment.

[0023] 1, the substrate processing system 1 includes a substrate processing apparatus 100 and a discharge analysis apparatus 500 (see FIG. 2). The substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface treatment, property imparting, treatment film formation, removal of at least a portion of a film, and cleaning.

[0024] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W has a substantially circular disk shape. Here, the substrate processing apparatus 100 processes the substrates W one by one.

[0025] 1, the substrate processing apparatus 100 includes a plurality of substrate processing units 110, a fluid cabinet 10A, a fluid box 10B, a plurality of load ports LP, an indexer robot IR, a center robot CR, and a controller 101. The controller 101 controls the load ports LP, the indexer robot IR, the center robot CR, and the substrate processing units 110.

[0026] Each load port LP accommodates a plurality of stacked substrates W. The indexer robot IR transports substrates W between the load port LP and the center robot CR. Note that a placement stage (path) on which the substrate W is temporarily placed may be provided between the indexer robot IR and the center robot CR, and the device may be configured so that the substrate W is indirectly transferred between the indexer robot IR and the center robot CR via the placement stage. The center robot CR transports substrates W between the indexer robot IR and the substrate processing units 110. Each of the substrate processing units 110 processes the substrate W by discharging a processing liquid onto the substrate W. The fluid cabinet 10A contains a processing liquid. Note that the fluid cabinet 10A may contain a gas.

[0027] The substrate processing units 110 form a plurality of towers TW (four towers TW in FIG. 1) arranged to surround the center robot CR in a plan view. Each tower TW includes vertically stacked substrate processing units 110 (three substrate processing units 110 in FIG. 1). Each fluid box 10B corresponds to a plurality of towers TW. The processing liquid in the fluid cabinet 10A is supplied to all of the substrate processing units 110 included in the tower TW corresponding to the fluid box 10B via one of the fluid boxes 10B. Furthermore, the gas in the fluid cabinet 10A is supplied to all of the substrate processing units 110 included in the tower TW corresponding to the fluid box 10B via one of the fluid boxes 10B.

[0028] The control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 includes a control unit 102 and a memory unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (CPU). Alternatively, the control unit 102 may have a general-purpose computer. The control unit 102 is an example of a "first control unit" in the present invention.

[0029] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may include removable media. The control unit 102 executes computer programs stored in the storage unit 104 to perform substrate processing operations.

[0030] The memory unit 104 stores data. The data includes recipe data. The recipe data includes information indicating a plurality of recipes. Each of the plurality of recipes defines the processing content and processing procedure for the substrate W. The memory unit 104 also stores data received from the discharge analysis device 500.

[0031] Next, the substrate processing unit 110 and the discharge analysis device 500 of the substrate processing system 1 of this embodiment will be described with reference to Fig. 2. Fig. 2 is a schematic diagram of the substrate processing unit 110 and the discharge analysis device 500 of the substrate processing system 1.

[0032] 2, the substrate processing unit 110 includes a chamber 112, a substrate holding part 120, a first processing liquid supply part 130, and a second processing liquid supply part 140. The chamber 112 accommodates the substrate holding part 120 and at least a part of the first processing liquid supply part 130 and the second processing liquid supply part 140. At least a part of the discharge analysis device 500 may be disposed inside the chamber 112, but in this embodiment, the entire discharge analysis device 500 is disposed outside the chamber 112.

[0033] The chamber 112 has a generally box-like shape with an internal space. The chamber 112 accommodates the substrates W. Here, the substrate processing unit 110 is a single-wafer type that processes the substrates W one by one, and the chamber 112 accommodates the substrates W one by one. The substrates W are accommodated in the chamber 112 and are processed in the chamber 112.

[0034] The substrate holding unit 120 holds the substrate W. The substrate holding unit 120 holds the substrate W horizontally so that the upper surface (front surface) Wa of the substrate W faces upward and the lower surface (back surface) Wb of the substrate W faces vertically downward. The substrate holding unit 120 also rotates the substrate W while holding it. The upper surface Wa of the substrate W may be flattened. Alternatively, the upper surface Wa of the substrate W may be provided with a device surface or a pillar-shaped stacked body with a recess. The substrate holding unit 120 rotates the substrate W while holding it.

[0035] For example, the substrate holding unit 120 may be a clamping type that clamps the edge of the substrate W. Alternatively, the substrate holding unit 120 may have any mechanism that holds the substrate W from its lower surface Wb. For example, the substrate holding unit 120 may be a vacuum type. In this case, the substrate holding unit 120 holds the substrate W horizontally by adsorbing the central portion of the lower surface Wb of the substrate W, which is the surface on which devices are not formed, to its upper surface. Alternatively, the substrate holding unit 120 may be a combination of a clamping type that brings multiple chuck pins into contact with the peripheral edge surface of the substrate W, and a vacuum type.

[0036] For example, the substrate holder 120 includes a spin base 121, a chuck member 122, a shaft 123, an electric motor 124, and a housing 125. The chuck member 122 is provided on the spin base 121. The chuck member 122 chucks the substrate W. Typically, the spin base 121 is provided with a plurality of chuck members 122.

[0037] The shaft 123 is a hollow shaft. The shaft 123 extends vertically along the rotation axis Ax. The spin base 121 is coupled to the upper end of the shaft 123. The substrate W is placed above the spin base 121.

[0038] The spin base 121 is disk-shaped. The chuck member 122 supports the substrate W horizontally. The shaft 123 extends downward from the center of the spin base 121. The electric motor 124 applies a rotational force to the shaft 123. The electric motor 124 rotates the shaft 123 in a rotational direction, thereby rotating the substrate W and the spin base 121 around the rotation axis Ax. The housing 125 surrounds the shaft 123 and the electric motor 124.

[0039] The first processing liquid supply unit 130 and the second processing liquid supply unit 140 supply the processing liquid to the substrate W. Typically, the first processing liquid supply unit 130 and the second processing liquid supply unit 140 supply the processing liquid to the upper surface Wa of the substrate W held by the substrate holder 120.

[0040] The processing liquid may be an etching liquid for etching the substrate W. Examples of the etching liquid include hydrofluoric nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), and phosphoric acid (H3PO4). The type of etching liquid is not particularly limited, and may be, for example, acidic or alkaline.

[0041] Alternatively, the processing liquid may be a rinse liquid, such as deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, diluted hydrochloric acid water, and reduced water (hydrogen water).

[0042] Alternatively, the treatment liquid may be an organic solvent. Typically, the volatility of the organic solvent is higher than that of the rinse liquid. Examples of organic solvents include isopropyl alcohol (IPA), methanol, ethanol, acetone, hydrofluoroether (HFE), propylene glycol monoethyl ether (PGEE), and propylene glycol monomethyl ether acetate (PGMEA).

[0043] The first processing liquid supply unit 130 includes a pipe 132, a first valve 134, a flow meter 135, and a first nozzle 136. The first processing liquid flows through the pipe 132 from a supply source. In this embodiment, the first processing liquid is, for example, hydrofluoric acid. The first valve 134 starts and stops the supply of the first processing liquid to the first nozzle 136. Specifically, the first valve 134 opens and closes a flow path within the pipe 132. The first valve 134 is not particularly limited, but may be, for example, an air valve. The flow meter 135 measures the flow rate of the first processing liquid flowing through the pipe 132. The first nozzle 136 is connected to the downstream end of the pipe 132. The first processing liquid supply unit 130 may include, for example, a pump (not shown) that pumps the first processing liquid from the supply source. As the first processing liquid flows through the first nozzle 136, the first nozzle 136 discharges the first processing liquid onto the upper surface Wa of the substrate W.

[0044] The second processing liquid supply unit 140 includes a pipe 142, a second valve 144, a flow meter 145, and a second nozzle 146. The second processing liquid flows through the pipe 142 from a supply source. In this embodiment, the second processing liquid is, for example, a rinse liquid. The second valve 144 starts and stops the supply of the second processing liquid to the second nozzle 146. Specifically, the second valve 144 opens and closes a flow path in the pipe 142. The second valve 144 is not particularly limited, but may be, for example, an air valve. The flow meter 145 measures the flow rate of the second processing liquid flowing through the pipe 142. The second nozzle 146 is connected to the downstream end of the pipe 142. The second processing liquid supply unit 140 may include, for example, a pump (not shown) that pumps the second processing liquid from the supply source. As the second processing liquid flows through the second nozzle 146, the second nozzle 146 discharges the second processing liquid onto the upper surface Wa of the substrate W.

[0045] In this embodiment, the first nozzle 136 and the second nozzle 146 are configured to be movable relative to the substrate W. Specifically, the substrate processing unit 110 includes a moving mechanism 150 that moves the first nozzle 136 and the second nozzle 146 relative to the substrate W.

[0046] The movement mechanism 150 moves the first nozzle 136 and the second nozzle 146 in the horizontal and vertical directions. Specifically, the movement mechanism 150 moves the first nozzle 136 and the second nozzle 146 in the circumferential direction around a rotation axis that extends in the vertical direction. The movement mechanism 150 also raises and lowers the first nozzle 136 and the second nozzle 146 in the vertical direction.

[0047] In this embodiment, the first nozzle 136 and the second nozzle 146 are fixed to a fixed member 155. The moving mechanism 150 moves the fixed member 155 relative to the substrate W. As a result, the first nozzle 136, the second nozzle 146, and the fixed member 155 move together relative to the substrate W. For example, the moving mechanism 150 includes a ball screw mechanism and an electric motor that provides a driving force to the ball screw mechanism. Note that the fixed member 155 may not be provided, and the moving mechanism 150 may be configured to move the first nozzle 136 and the second nozzle 146 separately.

[0048] In this embodiment, the substrate processing unit 110 also includes a first adjuster 160 that adjusts the opening / closing speed of the first valve 134, and a second adjuster 170 that adjusts the opening / closing speed of the second valve 144. Each of the first adjuster 160 and the second adjuster 170 includes, for example, a solenoid valve and a speed controller. The solenoid valve opens and closes the flow path of air supplied to the first valve 134 or the second valve 144, for example. The speed controller includes, for example, a needle valve that adjusts the opening of the air flow path. In this embodiment, the speed controllers of the first adjuster 160 and the second adjuster 170 are manually operated by the user.

[0049] In this embodiment, the substrate processing apparatus 100 further includes a liquid return unit 210 and a liquid return unit 220. The liquid return unit 210 is connected to the pipe 132. The liquid return unit 210 is capable of sucking back (sucking back) the first processing liquid in the first nozzle 136 toward the upstream side (the pipe 132 side) when the supply of the first processing liquid from the supply source to the first nozzle 136 is stopped. The liquid return unit 220 is connected to the pipe 142. The liquid return unit 220 is capable of sucking back (sucking back) the second processing liquid in the second nozzle 146 toward the upstream side (the pipe 142 side) when the supply of the second processing liquid from the supply source to the second nozzle 146 is stopped. Each of the liquid return unit 210 and the liquid return unit 220 includes, for example, a return pipe branching from the pipe 132 or the pipe 142, and a sucking back valve that opens and closes the flow path of the return pipe. The configurations of the liquid return unit 210 and the liquid return unit 220 that perform the suck back are well known, and therefore detailed description thereof will be omitted.

[0050] The substrate processing apparatus 100 further includes a cup 180. The cup 180 collects the processing liquid that has splashed from the substrate W. The cup 180 moves up and down. For example, the cup 180 moves up vertically to the side of the substrate W during the period in which the first processing liquid supply unit 130 or the second processing liquid supply unit 140 supplies the processing liquid to the substrate W. In this case, the cup 180 collects the processing liquid that has splashed from the substrate W due to the rotation of the substrate W. Furthermore, when the period in which the first processing liquid supply unit 130 or the second processing liquid supply unit 140 supplies the processing liquid to the substrate W ends, the cup 180 moves down vertically from the side of the substrate W.

[0051] The discharge analysis device 500 includes an imaging device 510, an illumination device 520, and a control device 530. The imaging device 510 and the illumination device 520 are provided, for example, for each chamber 112. The control device 530 is provided, for example, for each substrate processing apparatus 100.

[0052] The imaging device 510 has, for example, an imaging element, an electronic shutter, and an optical system. The imaging element may be, for example, a CCD (Charge Coupled Device). The optical system includes, for example, a lens. The imaging device 510 captures an image of the inside of the chamber 112 and generates video data. The video data includes a plurality of consecutive captured images. The imaging device 510 outputs the video data to the control device 530. Specifically, the imaging device 510 outputs the video data to the control device 530. The operation of the imaging device 510 is controlled by the control device 530.

[0053] In this embodiment, the imaging device 510 is disposed outside the chamber 112. The chamber 112 has a sidewall 112a facing the imaging device 510, and the sidewall 112a is provided with a window (not shown) facing the imaging device 510. The imaging device 510 captures an image of the inside of the chamber 112 through the window in the sidewall 112a. The window transmits light. For example, the window transmits visible light.

[0054] The imaging device 510 generates video data by capturing an image of an area including an area below the tip 136a of the first nozzle 136 and an area below the tip 146a of the second nozzle 146. Therefore, the imaging device 510 can capture an image of the processing liquid discharged from the first nozzle 136 and the second nozzle 146 and generate video data. In this embodiment, the imaging device 510 captures an image of an area including the tip 136a of the first nozzle 136, the tip 146a of the second nozzle 146, and the upper surface Wa of the substrate W and generates video data.

[0055] The frame rate of the imaging device 510 may be 30 fps or 60 fps. Alternatively, the frame rate may be 120 fps. Note that the imaging device 510 has sensitivity to visible light, for example.

[0056] The illumination device 520 irradiates light (e.g., visible light) into the chamber 112. Specifically, the illumination device 520 irradiates light (hereinafter, sometimes referred to as illumination light) onto an area including an area below the tip 136a of the first nozzle 136 and an area below the tip 146a of the second nozzle 146. In this embodiment, the illumination device 520 irradiates illumination light onto an area including the tip 136a of the first nozzle 136, the tip 146a of the second nozzle 146, and the upper surface Wa of the substrate W. Therefore, the imaging device 510 images the first nozzle 136, the second nozzle 146, the processing liquid, the substrate W, and the like, which are illuminated by the illumination light. Therefore, the imaging device 510 can easily capture images of the processing liquid, etc.

[0057] The control device 530 controls various operations of the discharge analysis device 500. The control device 530 includes a control unit 532 and a memory unit 534. The control unit 532 has a processor. The control unit 532 has, for example, a central processing unit (CPU). Alternatively, the control unit 532 may have a general-purpose computer. The control unit 532 is an example of a "second control unit" in the present invention.

[0058] The storage unit 534 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 534 may include removable media. The control unit 532 executes a computer program stored in the storage unit 534 to perform the discharge analysis operation. The storage unit 534 stores various data. The data includes, for example, video data captured by the imaging device 510.

[0059] The control unit 532 generates, based on the moving image data, first ejection data that indicates in chronological order whether the first treatment liquid is being ejected from the first nozzle 136. The control unit 532 also generates, based on the moving image data, second ejection data that indicates in chronological order whether the second treatment liquid is being ejected from the second nozzle 146. The generated first ejection data and second ejection data are stored in the storage unit 534.

[0060] The control unit 532 transmits the moving image data and the generated first and second discharge data to the control unit 102 of the substrate processing apparatus 100.

[0061] Next, a specific method for generating the first discharge data and the second discharge data by the discharge analysis device 500 will be described with reference to FIGS. 3 and 4. FIG. 3 is a diagram schematically illustrating an example of a captured image (one frame of video data) generated by the imaging device 510, illustrating a state in which the discharge of the first treatment liquid from the first nozzle 136 has started. FIG. 4 is a diagram schematically illustrating an example of a captured image generated by the imaging device 510, illustrating a state in which a predetermined time has elapsed since the discharge of the first treatment liquid from the first nozzle 136 has started. Note that in FIGS. 3 and 4, the first treatment liquid is hatched for ease of understanding. Furthermore, the state in which the second treatment liquid is discharged from the second nozzle 146 is similar to the state in which the first treatment liquid is discharged from the first nozzle 136, and therefore a description thereof will be omitted.

[0062] 3, when the first nozzle 136 starts to discharge the first processing liquid, the first processing liquid is discharged in a substantially cylindrical shape from the first nozzle 136. The diameter φ of the substantially cylindrical first processing liquid increases over time. As a result, the discharge amount of the first processing liquid discharged from the first nozzle 136 increases over time.

[0063] 4, when a predetermined time has elapsed since the first nozzle 136 started to discharge the first processing liquid, the diameter φ of the substantially cylindrical first processing liquid is maintained substantially constant. As a result, the amount of the first processing liquid discharged from the first nozzle 136 is maintained substantially constant.

[0064] Furthermore, when the discharge of the first processing liquid from the first nozzle 136 is stopped, the diameter φ of the substantially cylindrical first processing liquid decreases over time. As a result, the discharge amount of the first processing liquid discharged from the first nozzle 136 decreases over time. Then, the first processing liquid stops being discharged from the first nozzle 136.

[0065] The imaging device 510 transmits captured video data to the control unit 532. The control unit 532 determines whether the first treatment liquid is being discharged from the first nozzle 136 based on the video data. Specifically, the control unit 532 determines whether the diameter φ of the first treatment liquid being discharged from the first nozzle 136 is equal to or greater than a predetermined threshold. The predetermined threshold is not particularly limited, but is 0 mm or greater. In this embodiment, the predetermined threshold is, for example, approximately half the maximum diameter (the diameter φ shown in FIG. 4).

[0066] When the control unit 532 determines that the diameter φ of the first treatment liquid is equal to or greater than a predetermined threshold (for example, the state shown in FIG. 4), it determines that the first treatment liquid is being discharged from the first nozzle 136. On the other hand, when the control unit 532 determines that the diameter φ of the first treatment liquid is less than the predetermined threshold (for example, the state shown in FIG. 3), it determines that the first treatment liquid is not being discharged from the first nozzle 136. Then, the control unit 532 generates first discharge data based on the determination result. That is, the control unit 532 binarizes the diameter φ of the first treatment liquid to generate first discharge data that indicates, in a binary time series, whether or not the first treatment liquid is being discharged from the first nozzle 136. In this embodiment, the first discharge data indicates a state in which the first treatment liquid is not being discharged from the first nozzle 136 by "0" and a state in which the first treatment liquid is being discharged from the first nozzle 136 by "1."

[0067] Similarly, the control unit 532 determines whether the second treatment liquid is being discharged from the second nozzle 146 based on the video data. Specifically, the control unit 532 determines whether the diameter φ of the second treatment liquid being discharged from the second nozzle 146 is equal to or greater than a predetermined threshold. If the control unit 532 determines that the diameter φ of the second treatment liquid is equal to or greater than the predetermined threshold, the control unit 532 determines that the second treatment liquid is being discharged from the second nozzle 146. On the other hand, if the control unit 532 determines that the diameter φ of the second treatment liquid is less than the predetermined threshold, the control unit 532 determines that the second treatment liquid is not being discharged from the second nozzle 146. Then, the control unit 532 generates second discharge data based on the determination result. That is, the control unit 532 binarizes the diameter φ of the second treatment liquid to generate second discharge data that indicates, in a binary time series, whether the second treatment liquid is being discharged from the second nozzle 146. In this embodiment, the second ejection data indicates a state in which the second processing liquid is not ejected from the second nozzle 146 by "0", and indicates a state in which the second processing liquid is ejected from the second nozzle 146 by "1".

[0068] According to the substrate processing system 1 of this embodiment, the control unit 532 generates, based on the video data, first discharging data indicating, in time series, whether or not the first processing liquid is being discharged from the first nozzle 136, and second discharging data indicating, in time series, whether or not the second processing liquid is being discharged from the second nozzle 146. Therefore, by using the first discharging data and the second discharging data, it is possible to easily determine whether or not a liquid shortage has occurred on the substrate W. Therefore, if a defect such as particles occurs due to a liquid shortage, the cause of the defect can be easily identified. Even if video data is generated by capturing an image of the first processing liquid discharged from the first nozzle 136 and the second processing liquid discharged from the second nozzle 146, it is difficult to easily determine whether or not a liquid shortage has occurred by viewing the video data, because a liquid shortage occurs only for a short period of time.

[0069] Next, the substrate processing system 1 of this embodiment will be described with reference to Fig. 5. Fig. 5 is a block diagram of the substrate processing system 1.

[0070] 5 , the control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 controls the indexer robot IR, the center robot CR, the substrate holding unit 120, the first processing liquid supply unit 130, the second processing liquid supply unit 140, the movement mechanism 150, the liquid return unit 210, the liquid return unit 220, and the cup 180. Specifically, the control device 101 controls the indexer robot IR, the center robot CR, the substrate holding unit 120, the first processing liquid supply unit 130, the second processing liquid supply unit 140, the movement mechanism 150, the liquid return unit 210, the liquid return unit 220, and the cup 180 by transmitting control signals to the indexer robot IR, the center robot CR, the substrate holding unit 120, the first processing liquid supply unit 130, the second processing liquid supply unit 140, the movement mechanism 150, the liquid return unit 210, the liquid return unit 220, and the cup 180.

[0071] The substrate processing apparatus 100 further includes a display unit 300 and an input unit 310. The display unit 300 displays various types of information. For example, the display unit 300 displays various setting screens (input screens). In this embodiment, the display unit 300 displays, for example, first discharge data and second discharge data. The display unit 300 includes, for example, a liquid crystal display or an organic EL (electroluminescence) display.

[0072] The input unit 310 accepts input from a user. For example, the input unit 310 accepts inputs such as execution of processing on a substrate W, stopping of processing on a substrate W, and changes to processing conditions and various setting values. The input unit 310 also includes, for example, a touch panel and a pointing device. The touch panel is disposed, for example, on the display surface of the display unit 300. The input unit 310 and the display unit 300 together constitute, for example, a graphical user interface.

[0073] The control unit 102 controls the indexer robot IR to transfer the substrate W by the indexer robot IR.

[0074] The control unit 102 controls the center robot CR to transfer the substrate W by the center robot CR. For example, the center robot CR receives an unprocessed substrate W and transports the substrate W into one of the plurality of chambers 112. The center robot CR also receives a processed substrate W from the chamber 112 and transports the substrate W out.

[0075] The control unit 102 controls the substrate holding unit 120 to start rotation of the substrate W, change the rotation speed, and stop rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 120 to change the rotation speed of the substrate holding unit 120. Specifically, the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 124 of the substrate holding unit 120.

[0076] The control unit 102 controls the first valve 134 of the first treatment liquid supply unit 130 to switch the state of the first valve 134 between an open state and a closed state. Specifically, the control unit 102 transmits a first control signal to the first valve 134 to control the opening and closing of the first valve 134. The control unit 102 controls the first valve 134 of the first treatment liquid supply unit 130 to open the first valve 134, thereby allowing the first treatment liquid flowing through the pipe 132 toward the first nozzle 136 to pass. Furthermore, the control unit 102 controls the first valve 134 of the first treatment liquid supply unit 130 to close the first valve 134, thereby stopping the supply of the treatment liquid flowing through the pipe 132 toward the first nozzle 136.

[0077] The control unit 102 controls the second valve 144 of the second treatment liquid supply unit 140 to switch the state of the second valve 144 between an open state and a closed state. Specifically, the control unit 102 transmits a second control signal to the second valve 144 to control the opening and closing of the second valve 144. The control unit 102 controls the second valve 144 of the second treatment liquid supply unit 140 to open the second valve 144, thereby allowing the second treatment liquid flowing through the pipe 142 toward the second nozzle 146 to pass. Furthermore, the control unit 102 controls the second valve 144 of the second treatment liquid supply unit 140 to close the second valve 144, thereby stopping the supply of the treatment liquid flowing through the pipe 142 toward the second nozzle 146.

[0078] The control unit 102 can control the moving mechanism 150 to move the first nozzle 136 and the second nozzle 146. Specifically, the control unit 102 can control the moving mechanism 150 to move the first nozzle 136 and the second nozzle 146 above the upper surface Wa of the substrate W. The control unit 102 can also control the moving mechanism 150 to move the first nozzle 136 and the second nozzle 146 to a retracted position away from above the upper surface Wa of the substrate W.

[0079] The control unit 102 controls the liquid return unit 210 to draw back the first processing liquid in the first nozzle 136 to the upstream side (the piping 132 side). That is, the control unit 102 controls the liquid return unit 210 to perform suck back. Specifically, the control unit 102 controls the first valve 134 to stop the supply of the first processing liquid to the first nozzle 136, and then controls the liquid return unit 210 to draw back the first processing liquid in the first nozzle 136 to the upstream side (the piping 132 side).

[0080] The control unit 102 controls the liquid return unit 220 to draw back the second processing liquid in the second nozzle 146 to the upstream side (the piping 142 side). That is, the control unit 102 controls the liquid return unit 220 to perform suck back. Specifically, the control unit 102 controls the second valve 144 to stop the supply of the second processing liquid to the second nozzle 146, and then controls the liquid return unit 220 to draw back the second processing liquid in the second nozzle 146 to the upstream side (the piping 142 side).

[0081] The control unit 102 controls the cup 180 to move the cup 180 relative to the substrate W. Specifically, the control unit 102 raises the cup 180 vertically upward to the side of the substrate W during the period in which the first processing liquid supply unit 130 or the second processing liquid supply unit 140 supplies the processing liquid to the substrate W. Furthermore, when the period in which the first processing liquid supply unit 130 or the second processing liquid supply unit 140 supplies the processing liquid to the substrate W ends, the control unit 102 lowers the cup 180 vertically downward from the side of the substrate W.

[0082] In this embodiment, the control unit 102 controls the display unit 300 to display the first ejection data and the second ejection data. In this embodiment, the control unit 102 controls the display unit 300 to display the first control data, the second control data, and the first ejection data, and the second ejection data.

[0083] Specifically, the control unit 102 controls the display unit 300 to display time-series data indicating the substrate processing state in time series. This time-series data is data indicating the state of the substrate processing apparatus 100 during the substrate processing operation in time series.

[0084] The time-series data includes, for example, signals transmitted by the control unit 102 to each unit of the substrate processing apparatus 100. The signals transmitted to each unit include, for example, a first control signal and a second control signal transmitted by the control unit 102 to the first processing liquid supply unit 130 and the second processing liquid supply unit 140 during the substrate processing operation.

[0085] The time-series data also includes, for example, signals received by the control unit 102 from sensors in various parts of the substrate processing apparatus 100. The sensors in various parts include, for example, a temperature sensor (not shown) that measures the temperature of the substrate W, a rotation speed sensor that measures the rotation speed of the substrate W, and flow meters 135 and 145 that measure the flow rate of the processing liquid.

[0086] In this embodiment, the control unit 102 adds the first discharge data and the second discharge data received from the control unit 532 to the time-series data. Then, the control unit 102 controls the display unit 300 to display the first control data indicating the first control signal, the second control data indicating the second control signal, the first discharge data, and the second discharge data side by side on one screen (see FIG. 7). In this embodiment, the control unit 102 controls the display unit 300 to display the first control data indicating the first control signal, the second control data indicating the second control signal, the measurement data of the flowmeter 135 and the measurement data of the flowmeter 145, and the first discharge data and the second discharge data side by side on one screen. More specifically, the control unit 102 controls the display unit 300 to display the first control data, the second control data, the measurement data of the flowmeter 135 and the measurement data of the flowmeter 145, and the first discharge data and the second discharge data side by side in the vertical direction as a timing chart.

[0087] Next, the substrate processing method of this embodiment will be described with reference to FIGS. 6 and 7. FIG. 6 is a flow diagram of the substrate processing method of this embodiment. FIG. 7 is a schematic diagram showing an example of time-series data displayed on the display unit 300. Steps S101 to S112 are executed by the control unit 102. Step S102 is an example of the "step of rotating the substrate" of the present invention. Step S104 is an example of the "step of starting the supply of the first processing liquid" of the present invention. Step S105 is an example of the "step of starting the supply of the second processing liquid" of the present invention.

[0088] 6, in step S101, the substrate W is loaded into the substrate processing apparatus 100. Specifically, the substrate W is loaded into the chamber 112 of the substrate processing unit 110 via the indexer robot IR and the center robot CR.

[0089] In step S102, the substrate holding part 120 holds the substrate W. Specifically, when the substrate W is loaded into the chamber 112, it is held by the substrate holding part 120. Then, the control part 102 starts rotating the substrate W by the substrate holding part 120.

[0090] In step S103, the control unit 102 instructs the discharge analysis device 500 to start imaging. Specifically, the control unit 102 transmits to the discharge analysis device 500 an imaging start signal for starting imaging.

[0091] In step S104, the control unit 102 starts supplying the first processing liquid. Specifically, the control unit 102 starts sending a first control signal indicating an open signal to the first valve 134 (T1 in FIG. 7). This opens the first valve 134, and the supply of the first processing liquid to the first nozzle 136 starts (T2 in FIG. 7). At this time, the flow rate of the first processing liquid passing through the flow meter 135 gradually increases from zero to the first flow rate. Then, after a predetermined time has elapsed since the supply of the first processing liquid to the first nozzle 136 started, the first processing liquid is discharged from the first nozzle 136 onto the substrate W (T3 in FIG. 7).

[0092] In step S105, the control unit 102 starts supplying the second processing liquid. Specifically, when a predetermined time has elapsed since the control unit 102 started sending the first control signal to the first valve 134, the control unit 102 starts sending a second control signal indicating an open signal to the second valve 144 (T4 in FIG. 7). This opens the second valve 144, and the supply of the second processing liquid to the second nozzle 146 starts (T5 in FIG. 7). At this time, the flow rate of the second processing liquid passing through the flow meter 145 gradually increases from zero to the second flow rate. Then, after a predetermined time has elapsed since the supply of the second processing liquid to the second nozzle 146 started, the second processing liquid is discharged from the second nozzle 146 onto the substrate W (T6 in FIG. 7).

[0093] In step S106, the control unit 102 stops the supply of the first processing liquid. Specifically, when a predetermined time has elapsed since the control unit 102 started transmitting the first control signal to the first valve 134, the control unit 102 stops transmitting the first control signal to the first valve 134 (T7 in FIG. 7). In other words, when a predetermined time has elapsed since the control unit 102 started transmitting the second control signal to the second valve 144, the control unit 102 stops transmitting the first control signal to the first valve 134. This closes the first valve 134, and the supply of the first processing liquid to the first nozzle 136 is stopped (T8 in FIG. 7). At this time, the amount of the first processing liquid passing through the flow meter 135 gradually decreases. Then, after a predetermined time has elapsed, the discharge of the first processing liquid from the first nozzle 136 to the substrate W is stopped (T9 in FIG. 7). In this embodiment, the control unit 102 controls the liquid returning unit 210 to return the first processing liquid in the first nozzle 136 to the upstream side (the piping 132 side). This makes it possible to prevent the first processing liquid from dropping onto the substrate W from the first nozzle 136.

[0094] In step S107, the control unit 102 stops the supply of the second processing liquid. Specifically, when a predetermined time has elapsed since the control unit 102 started sending the second control signal to the second valve 144, the control unit 102 stops sending the second control signal to the second valve 144 (T10 in FIG. 7). This closes the second valve 144, and the supply of the second processing liquid to the second nozzle 146 is stopped (T11 in FIG. 7). At this time, the amount of the second processing liquid passing through the flow meter 145 gradually decreases. Then, after a predetermined time has elapsed, the discharge of the second processing liquid from the second nozzle 146 onto the substrate W is stopped (T12 in FIG. 7). Note that in this embodiment, the control unit 102 controls the liquid return unit 220 to return the second processing liquid in the second nozzle 146 to the upstream side (the pipe 142 side). This makes it possible to prevent the second processing liquid from dropping onto the substrate W from the second nozzle 146.

[0095] In step S108, the control unit 102 instructs the discharge analysis device 500 to stop capturing images. Specifically, the control unit 102 transmits an image capturing stop signal to the discharge analysis device 500 to stop capturing images.

[0096] In step S109, the control unit 102 receives the first discharge data and the second discharge data from the discharge analysis device 500. In this embodiment, the control unit 102 receives the first discharge data, the second discharge data, and the video data from the discharge analysis device 500.

[0097] In step S110, the control unit 102 adds the received first and second ejection data to the time-series data. The time-series data to which the first and second ejection data have been added is stored in the storage unit 104.

[0098] In step S111, the control unit 102 stops the rotation of the substrate W by the substrate holder 120 and releases the substrate W from the substrate holder 120.

[0099] In step S112, the substrate W is unloaded from the substrate processing apparatus 100. Specifically, the substrate W is unloaded from the chamber 112 of the substrate processing unit 110 via the center robot CR and the indexer robot IR.

[0100] In this embodiment, an example in which steps S108 to S110 are performed before the rotation of the substrate W by the substrate holder 120 is stopped has been described, but the present invention is not limited to this. For example, one or more of steps S108 to S110 may be performed after step S111 or step S112.

[0101] In addition, in the present embodiment, an example has been described in which the control unit 102 receives the first and second ejection data after transmitting an imaging stop signal, but the present invention is not limited to this. For example, the control unit 102 may receive the first and second ejection data sequentially after transmitting an imaging start signal.

[0102] Next, the processing flow of the discharge analysis device 500 of this embodiment will be described with reference to Fig. 8. Fig. 8 is a flow diagram of the discharge analysis device 500 of this embodiment. Steps S201 to S208 are executed by the control unit 532. Note that steps S202 and S203 are an example of the "step of capturing an image of the second processing liquid and generating video data" of the present invention. Step S207 is an example of the "step of generating first discharge data and second discharge data" of the present invention.

[0103] As shown in FIG. 8, in step S201, the control unit 532 receives an imaging start signal from the control unit .

[0104] In step S202, the control unit 532 starts capturing an image by controlling the imaging device 510. At this time, the control unit 532 controls the lighting device 520 to start irradiating the imaging range with light.

[0105] In step S203, the image capturing device 510 starts generating video data. The video data is stored in the storage unit 534.

[0106] In step S204, the control unit 532 receives an image capture stop signal from the control unit .

[0107] In step S205, the control unit 532 controls the imaging device 510 to stop capturing images. At this time, the control unit 532 controls the lighting device 520 to stop emitting light onto the imaging range.

[0108] In step S206, the image capture device 510 stops generating video data.

[0109] In step S207, the control unit 532 generates first and second ejection data based on the imaging data.

[0110] In step S208, the control unit 532 transmits the generated first and second ejection data to the control unit 102.

[0111] In the present embodiment, an example has been described in which the control unit 532 transmits the first and second ejection data to the control unit 102 after stopping image capture by the image capture device 510, but the present invention is not limited to this. For example, the control unit 532 may start generating the first and second ejection data after starting generation of video data, and transmit the generated data to the control unit 102 sequentially.

[0112] Next, a method for utilizing the first and second discharge data will be described with reference to Figures 7, 9, and 10. Figure 9 is a diagram showing a processing flow of the substrate processing apparatus 100 when the first and second discharge data are displayed on the display unit 300. Figure 10 is a schematic diagram showing an example of time-series data displayed on the display unit 300.

[0113] For example, as shown in FIG. 7, if the discharge of the first processing liquid from the first nozzle 136 onto the substrate W stops (T9) and then the second processing liquid is discharged from the second nozzle 146 onto the substrate W (T6), the upper surface Wa of the substrate W dries, resulting in processing defects and particles.

[0114] Therefore, in order to find out the cause, the user operates the input unit 310 to display the first and second ejection data on the display unit 300. In this embodiment, as shown in Fig. 7, the display unit 300 displays the time-series data to which the first and second ejection data have been added.

[0115] 9, in step S301, the user operates the input unit 310 so that the first ejection data and the second ejection data are displayed, thereby causing the input unit 310 to accept instructions from the user.

[0116] In step S302, the display unit 300 displays the first and second ejection data. In this embodiment, the display unit 300 displays the time-series data to which the first and second ejection data have been added.

[0117] In this embodiment, by looking at the first discharge data and the second discharge data, the user can easily determine whether the second processing liquid was discharged from the second nozzle 146 onto the substrate W (T6) after the discharge of the first processing liquid from the first nozzle 136 onto the substrate W stopped (T9).

[0118] When the second processing liquid is being ejected from the second nozzle 146 onto the substrate W (T6) after the ejection of the first processing liquid from the first nozzle 136 onto the substrate W has stopped (T9), in this embodiment, the user increases the opening and closing speed of the second valve 144 by adjusting the second adjustment part 170.

[0119] 10, when the next substrate W is processed, the time from when the transmission of the second control signal to the second valve 144 starts (T4) to when the second valve 144 opens and the supply of the second processing liquid to the second nozzle 146 starts (T5) is shortened. Furthermore, since the rate of increase in the amount of the second processing liquid passing through the flow meter 145 increases, the rate of increase in the amount of the second processing liquid discharged from the second nozzle 146 also increases. As a result, the timing at which the second processing liquid is discharged from the second nozzle 146 onto the substrate W is advanced. Therefore, after the second processing liquid is discharged from the second nozzle 146 onto the substrate W (T6), it is possible to stop the discharge of the first processing liquid from the first nozzle 136 onto the substrate W (T9). In other words, it is possible to eliminate the non-discharge period.

[0120] In this embodiment, as described above, the control unit 102 adds the first and second dispensing data to the time-series data that indicates the substrate processing state in a time-series manner. Therefore, for example, when a user attempts to check the time-series data, the user can also check the first and second dispensing data.

[0121] As described above, the control unit 532 transmits the generated first and second discharge data to the control unit 102. Therefore, the substrate processing apparatus 100 can receive the first and second discharge data.

[0122] Furthermore, as described above, the display unit 300 displays the first and second discharge data, allowing the user to easily check whether or not the liquid has run out.

[0123] As described above, the display unit 300 displays the first control data indicating the first control signal, the second control data indicating the second control signal, and the first and second ejection data side by side. This allows the user to simultaneously check both the first and second control data and the first and second ejection data. This allows the user to more easily check whether or not the ink is running out of liquid.

[0124] Furthermore, as described above, the display unit 300 displays the first control data and the second control data, and the first ejection data and the second ejection data side by side as a timing chart, allowing the user to more easily check whether or not the liquid has run out.

[0125] Next, a substrate processing system 1 according to a first modified example of the present embodiment will be described with reference to Fig. 11. Fig. 11 is a block diagram of the substrate processing system 1 of the first modified example. In the first modified example, unlike the above embodiment, an example will be described in which the substrate processing system 1 includes a notification unit 320.

[0126] 11, the substrate processing system 1 further includes a notification unit 320. In the first modified example, the control unit 102 determines, based on the first discharge data and the second discharge data, whether or not a non-discharge period tc (the period between T9 and T6 in FIG. 7) in which the first processing liquid and the second processing liquid are not discharged exists between a first discharge period ta (T3 to T9 in FIG. 7) in which the first processing liquid is discharged from the first nozzle 136 and a second discharge period tb (T6 to T12 in FIG. 7) in which the second processing liquid is discharged from the second nozzle 146.

[0127] When the control unit 102 determines that a non-ejection period tc exists between the first ejection period ta and the second ejection period tb, it transmits a notification signal to the notification unit 320. The notification signal is a signal that notifies the user that a non-ejection period tc exists between the first ejection period ta and the second ejection period tb. In other words, the notification signal is a signal that notifies the user that a liquid shortage has occurred.

[0128] Upon receiving the notification signal, the notification unit 320 notifies the user that a non-ejection period tc exists between the first ejection period ta and the second ejection period tb. The notification unit 320 is not particularly limited, but may have, for example, a display screen that displays the notification content. The notification unit 320 may also have an indicator lamp or a speaker that emits sound. The display unit 300 may also function as the notification unit 320.

[0129] The other configurations of the first modified example are the same as those of the above embodiment.

[0130] In the first modified example, as described above, the control unit 102 determines whether or not there is a non-ejection period tc, during which the first treatment liquid and the second treatment liquid are not ejected, between the first ejection period ta and the second ejection period tb, based on the first ejection data and the second ejection data. Therefore, it is possible to easily detect whether or not the liquid has run out.

[0131] Furthermore, as described above, when the control unit 102 determines that a non-ejection period tc exists, the notification unit 320 notifies the user that a non-ejection period tc exists. Therefore, the user can easily know that the liquid has run out.

[0132] Other effects of the first modified example are similar to those of the above embodiment.

[0133] Next, a substrate processing system 1 according to a second modified example of this embodiment will be described with reference to Fig. 12. Fig. 12 is a block diagram of the substrate processing system 1 of the second modified example. Unlike the above embodiment and the first modified example, the second modified example describes an example in which the control unit 102 controls at least the second speed controller 171 of the second adjustment unit 170. The second speed controller 171 is an example of the "speed controller" of the present invention.

[0134] 12, the first adjustment unit 160 has a first speed controller 161 that adjusts the opening / closing speed of the first valve 134. The second adjustment unit 170 has a second speed controller 171 that adjusts the opening / closing speed of the second valve 144. In the second modification, the first speed controller 161 and the second speed controller 171 are controlled by the control unit 102. Specifically, each of the first speed controller 161 and the second speed controller 171 has, for example, a needle valve (not shown) and a drive motor (not shown) that drives the needle valve. In the second modification, the control unit 102 controls the drive motor to drive the needle valve.

[0135] In the second variant, similar to the first variant, the control unit 102 determines whether or not a non-ejection period tc exists between the first ejection period ta and the second ejection period tb based on the first ejection data and the second ejection data.

[0136] In the second variant, when the control unit 102 determines that a non-ejection period tc exists between the first ejection period ta and the second ejection period tb, it controls the second speed controller 171 to increase the opening and closing speed of the second valve 144.

[0137] The storage unit 104 may previously store an adjustment table that associates the length of the non-ejection period tc with the adjustment amount of the second speed controller 171. The control unit 102 may calculate the length of the non-ejection period tc, and control the second speed controller 171 based on the calculated non-ejection period tc and the adjustment table. With this configuration, the control unit 102 can easily and appropriately adjust the ejection timing of the second treatment liquid.

[0138] The other configurations of the second modified example are the same as those of the above embodiment and the first modified example.

[0139] In the second modified example, as described above, when the control unit 102 determines that a non-discharge period tc exists between the first discharge period ta and the second discharge period tb, the control unit 102 controls the second speed controller 171 to increase the opening and closing speed of the second valve 144. Therefore, when a liquid shortage occurs, the discharge timing of the second processing liquid can be automatically adjusted so that a liquid shortage does not occur from the next substrate processing.

[0140] In the second modified example, even if the user does not check for the existence of the non-ejection period tc, the control unit 102 automatically adjusts the opening and closing speed of the second valve 144 so that liquid shortage does not occur, so the display unit 300 does not need to display the first ejection data and the second ejection data.

[0141] Other effects of the second modified example are similar to those of the above embodiment and the first modified example.

[0142] Next, a substrate processing apparatus 100 according to a third modified example of the present embodiment will be described with reference to Fig. 13. Fig. 13 is a block diagram of the substrate processing apparatus 100 of the third modified example. In the third modified example, unlike the above embodiment, the first modified example, and the second modified example, the substrate processing apparatus 100 is provided with an imaging device 510 and an illumination device 520.

[0143] 13, in the third modification, unlike the above-described embodiment, first modification, and second modification, the substrate processing apparatus 100 includes an imaging device 510 and an illumination device 520. The control unit 102 controls the imaging device 510 and the illumination device 520. In other words, the control unit 102 also functions as the control unit 532. For example, the control unit 102 generates first and second discharge data based on video data. In the third modification, the substrate processing apparatus 100 corresponds to the "substrate processing system" of the present invention.

[0144] The other configurations, control methods, and effects of the third modified example are similar to those of the above-described embodiment, first modified example, and second modified example.

[0145] The above describes the embodiments and modifications of the present invention with reference to the drawings. However, the present invention is not limited to the above embodiments and modifications, and can be embodied in various forms without departing from the spirit and scope of the present invention. Furthermore, various inventions can be formed by appropriately combining multiple components disclosed in the above embodiments and modifications. For example, some components may be omitted from all components shown in the embodiments and modifications. Furthermore, components from different embodiments and modifications may be appropriately combined. The drawings mainly show each component in a schematic manner to facilitate understanding. The thickness, length, number, spacing, etc. of each component shown may differ from the actual components due to the convenience of drawing. Furthermore, the materials, shapes, dimensions, etc. of each component shown in the above embodiments and modifications are merely examples and are not particularly limited. Various modifications are possible within a scope that does not substantially deviate from the effects of the present invention.

[0146] For example, in the above embodiment, an example has been described in which the display unit 300 displays the first control data and the second control data and the first ejection data and the second ejection data side by side, but the present invention is not limited to this. For example, the display unit 300 may display the first ejection data and the second ejection data without displaying the first control data and the second control data. Furthermore, the display unit 300 may display data other than the first control data and the second control data side by side with the first ejection data and the second ejection data.

[0147] In the above embodiment, for example, the display unit 300 displays the first control data and the second control data and the first ejection data and the second ejection data as a timing chart, but the present invention is not limited to this. For example, the display unit 300 may display the first control data and the second control data and the first ejection data and the second ejection data using a display method other than a timing chart.

[0148] In addition, for example, in the above embodiment, an example has been described in which the first ejection data and the second ejection data are added to the time-series data, but the present invention is not limited to this. The first ejection data and the second ejection data do not have to be added to the time-series data.

[0149] Furthermore, for example, in the second modified example described above, the control unit 102 controls the second speed controller 171 to automatically adjust the discharge timing of the second processing liquid, and the substrate processing system 1 does not have the notification unit 320. However, the present invention is not limited to this. For example, in a configuration in which the control unit 102 automatically adjusts the discharge timing of the processing liquid, the substrate processing system 1 may have the notification unit 320.

[0150] Furthermore, for example, in the above embodiment and second modified example, an example has been described in which the non-ejection period tc is eliminated by increasing the opening / closing speed of the second valve 144. That is, an example has been described in which the non-ejection period tc is eliminated by advancing the start timing of the second ejection period tb. However, the present invention is not limited to this. For example, the non-ejection period tc may be eliminated by delaying the end timing of the first ejection period ta. In this case, for example, a delay time for delaying the end timing of the first ejection period ta may be set in the recipe or software parameters.

[0151] In addition, for example, in the above embodiment, the substrate processing apparatus 100 is described as having the display unit 300 that displays the first and second discharge data, but the present invention is not limited to this. For example, the substrate processing apparatus 100 does not have to have the display unit 300 that displays the first and second discharge data. [Industrial Applicability]

[0152] The present invention is suitably used in a substrate processing system, a substrate processing method, and a program. [Explanation of symbols]

[0153] 1: Substrate processing system 102: Control unit (first control unit) 120: Board holding part 134: First valve 136: First nozzle 144: Second valve 146: Second nozzle 171: Second speed controller (speed controller) 300:Display section 320: Information Department 510: Imaging device 532: Control unit (second control unit) S102: Step (substrate rotation step) S104: Step (Step of starting supply of first processing liquid) S105: Step (Step of starting supply of second processing liquid) S202: Step (Step of capturing an image of the second processing liquid and generating video data) S203: Step (Step of capturing an image of the second processing liquid and generating video data) S207: Step (Process of generating first and second ejection data) ta: 1st discharge period tb: 2nd discharge period tc: non-discharge period W: Substrate Wa: Top

Claims

1. a substrate holder that holds a substrate and rotates the substrate; a first nozzle that ejects a first processing liquid onto an upper surface of the substrate held by the substrate holder; a first valve that starts and stops supplying the first processing liquid to the first nozzle; a second nozzle that ejects a second processing liquid onto an upper surface of the substrate held by the substrate holder; a second valve that starts and stops the supply of the second processing liquid to the second nozzle; an imaging device that captures an image of the first treatment liquid discharged from the first nozzle and the second treatment liquid discharged from the second nozzle to generate video data; a control unit that controls the first valve to start supplying the first processing liquid to the first nozzle, and then controls the second valve to start supplying the second processing liquid to the second nozzle; Equipped with The control unit A substrate processing system that generates first ejection data indicating in chronological order whether the first processing liquid is being ejected from the first nozzle and second ejection data indicating in chronological order whether the second processing liquid is being ejected from the second nozzle based on the video data.

2. The substrate processing system according to claim 1 , wherein the control unit adds the first discharge data and the second discharge data to time-series data that indicates a substrate processing state in time series.

3. the control unit includes a first control unit that controls the first valve and the second valve, and a second control unit that controls the imaging device, The second control unit is generating the first ejection data and the second ejection data; 3. The substrate processing system according to claim 1, wherein the generated first discharge data and second discharge data are transmitted to the first controller.

4. 3. The substrate processing system according to claim 1, further comprising a display unit that displays the first discharge data and the second discharge data.

5. The control unit transmitting a first control signal to the first valve to control opening and closing of the first valve; transmitting a second control signal to the second valve to control opening and closing of the second valve; 5. The substrate processing system of claim 4, wherein the display unit displays first control data indicating the first control signal and second control data indicating the second control signal, along with the first ejection data and the second ejection data.

6. 6. The substrate processing system according to claim 5, wherein the display unit displays the first control data and the second control data, and the first ejection data and the second ejection data side by side as timing charts.

7. 3. The substrate processing system of claim 1, wherein the control unit determines, based on the first ejection data and the second ejection data, whether or not there is a non-ejection period in which the first processing liquid and the second processing liquid are not ejected between a first ejection period in which the first processing liquid is ejected from the first nozzle and a second ejection period in which the second processing liquid is ejected from the second nozzle.

8. 8. The substrate processing system according to claim 7, further comprising: a notification unit that notifies a user of the existence of the non-discharge period when the control unit determines that the non-discharge period exists.

9. a speed controller for adjusting the opening and closing speed of the second valve; The substrate processing system according to claim 7 , wherein the control unit controls the speed controller to increase the opening and closing speed of the second valve when it determines that the non-discharge period exists.

10. holding a substrate and rotating said substrate; starting a supply of the first processing liquid to a first nozzle that discharges the first processing liquid onto the upper surface of the substrate; after the step of starting the supply of the first processing liquid, starting the supply of the second processing liquid to a second nozzle that ejects the second processing liquid onto the upper surface of the substrate; capturing an image of the first treatment liquid discharged from the first nozzle and the image of the second treatment liquid discharged from the second nozzle to generate video data; generating first ejection data indicating in time series whether the first processing liquid is being ejected from the first nozzle and second ejection data indicating in time series whether the second processing liquid is being ejected from the second nozzle based on the video data; A substrate processing method comprising:

11. generating video data by capturing an image of a first processing liquid discharged from a first nozzle that discharges the first processing liquid onto an upper surface of a substrate and a second processing liquid discharged from a second nozzle that starts discharging the second processing liquid onto the upper surface of the substrate after the first nozzle starts discharging the first processing liquid; generating first ejection data indicating in time series whether the first processing liquid is being ejected from the first nozzle and second ejection data indicating in time series whether the second processing liquid is being ejected from the second nozzle based on the video data; A program that causes a computer to execute the following.

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