Manufacturing method for polishing member

Abstract

To provide a manufacturing method for a polishing member that is excellent in environmental performance.SOLUTION: The manufacturing method for a polishing member comprises: a water-soaking step of soaking a base material which is a woven cloth or a non-woven cloth in water; an applying step of applying powder resin and polishing particles to a region soaked in water of the base material; and a heating step of heating the base material so that the powder resin is melted and the polishing particles are fixed to the base material.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a polishing member. [Background technology]

[0002] Many methods for manufacturing abrasive members have been proposed (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 05-253851 [Patent Document 2] Japanese Patent Application Laid-Open No. 2005-144628 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, abrasive members are manufactured by coating a substrate with a binder resin and then attaching abrasive particles to the binder resin. Organic solvents are used in this type of binder resin. These organic solvents have a significant environmental impact because they are released into the atmosphere during the manufacturing process.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method for producing an abrasive member that is environmentally friendly. [Means for solving the problem]

[0006] The above object can be achieved by a method for manufacturing an abrasive member, which includes a hydration step of hydrating a substrate, which is a woven or nonwoven fabric; an application step of applying powder resin and abrasive particles to the hydrated area of ​​the substrate; and a heating step of heating the substrate so that the powder resin melts and the abrasive particles are fixed to the substrate.

[0007] The application step may include applying the powder resin to the substrate, applying the abrasive particles toward the powder resin on the substrate, and then applying the powder resin again toward the abrasive particles on the substrate.

[0008] The coating step may coat the base material with a mixture of the powder resin and the abrasive particles.

[0009] The heating step may be carried out during the application step.

[0010] The heating step may heat the substrate using a heating element heated by induction heating.

[0011] The substrate may be a sheet, a film, or a continuous strip-shaped member.

[0012] The powder resin may be thermosetting and contain at least one of epoxy-based, epoxy polyester-based, polyester-based, acrylic-based, and fluororesin-based powders.

[0013] The powder resin may be thermoplastic and may contain powder of at least one of vinyl chloride, polyethylene, and nylon.

[0014] The powder resin may be thermoplastic and may include powder of an engineering plastic.

[0015] The engineering plastic may be PPS, PEEK, or PI. [Effects of the Invention]

[0016] According to the present invention, it is possible to provide an environmentally friendly method for producing a polishing member. [Brief explanation of the drawings]

[0017] [Figure 1] 3A to 3C are explanatory diagrams of a method for manufacturing a polishing member. DETAILED DESCRIPTION OF THE INVENTION

[0018] FIG. 1 is an explanatory diagram of the manufacturing method of the polishing member of this embodiment. The substrate W is wound into a roll. One end of the substrate W is transported to the right in FIG. 1 by a roller or the like (not shown). The substrate W is a woven or nonwoven fabric. The coating devices 5, 10, 20, and 30 are installed so as to face the substrate W in the order of the transport direction of the substrate W. The coating devices 5, 10, 20, and 30 are arranged at predetermined intervals from each other in the transport direction of the substrate W. The heating device 40 is installed so as to face the substrate W across the area where the coating devices 10, 20, and 30 are installed.

[0019] The coating device 5 coats the upper surface of the substrate W with water. This causes the substrate W to absorb water. The process performed by the coating device 5 is an example of a water impregnation process. The process of hydrating the substrate W is not limited to the application of water by the coating device, and for example, water vapor may be sprayed onto the substrate W, or the substrate W may be immersed in water stored in a container.

[0020] Next, the coating device 10 applies powder resin to the upper surface of the substrate W. The process performed by the coating device 10 is a so-called undercoating process. Next, the coating device 20 applies abrasive particles to the surface of the substrate W that has been applied with the powder resin. Next, the coating device 30 applies powder resin again to the surface of the substrate W that has been applied with the abrasive particles. The process performed by the coating device 30 is a so-called topcoating process. The specific coating method used by the coating devices 10, 20, and 30 may be a coating method using compressed air, or may be electrostatic coating using, for example, an electrostatic gun.

[0021] Furthermore, during the application process performed by the application devices 10, 20, and 30, the substrate W is heated by the heating device 40. The heating device 40 includes a coil through which an alternating current flows and a conductive heating element that generates heat when an induced current flows when electricity is applied to the coil. The substrate W is heated by the heat from this heating element. The process performed by the heating device 40 corresponds to a heating process. As a result, the powdered resin sprayed onto the substrate W from the application devices 10 and 30 melts. As a result, when the substrate W separates from the heating device 40, the substrate W cools and the powdered resin on the substrate W solidifies. The abrasive particles applied to the substrate W in this manner are fixed to the substrate W. The substrate W is then cut to a desired size to produce a sheet-like abrasive member.

[0022] As described above, this manufacturing method is environmentally friendly because it does not use organic solvents. Furthermore, compared to when organic solvents are used, when powder resins are used, maintenance and management are easier. Therefore, the manufacturing of abrasive members using this manufacturing method can be carried out unmanned.

[0023] As described above, the substrate W is a woven or nonwoven fabric. Therefore, when the substrate W is hydrated by the application device 5, the fibers of the substrate W absorb water. Then, the powdered resin is applied to the substrate W. This improves the adhesion rate of the powdered resin to the fibers of the substrate W. Therefore, after the powdered resin melts and hardens, the abrasive particles are stably fixed to the substrate W. In this way, the quality of the abrasive member is stabilized.

[0024] Furthermore, before the abrasive particles are applied, powder resin is applied to the base material W, and after the abrasive particles are applied, powder resin is again applied to the base material W. This improves the fixation of the abrasive particles.

[0025] Furthermore, the substrate W is heated while the powder resin and abrasive particles are being applied to the substrate W. This reduces the manufacturing time. Note that the substrate W may be heated while water is being applied by the application device 5, as long as the water contained in the substrate W, which has been saturated with water by the application device 5, is not evaporated. As a result, the substrate W is heated to a certain temperature before the powder resin is applied, and the powder resin applied thereafter can be melted quickly, reducing the manufacturing time.

[0026] The applicators 10, 20, and 30 are spaced apart from one another. Therefore, even if, for example, the powder resin sprayed from the applicator 10 or 30 falls off the substrate W, and the abrasive particles sprayed from the applicator 20 fall off the substrate W, the powder resin and the abrasive particles are prevented from mixing around the applicators 10, 20, and 30. As a result, the powder resin and the abrasive particles can be easily collected separately. The collected powder resin and the abrasive particles can be reused. In this way, the material reuse rate is improved. The powder resin and the abrasive particles may be mixed in advance, and the mixture may be applied to the substrate W. In this case, the number of applications is reduced.

[0027] The powder resins applied by the application devices 10 and 30 may be the same or different types of powder resins. The amounts of the powder resins applied by the application devices 10 and 30 may be the same or different.

[0028] The powder of the powder resin may be thermosetting or thermoplastic. Thermosetting powders include epoxy-based powder resins, polyester-based powder resins, epoxy-polyester-based powder resins, fluororesin-based powder resins, and acrylic-based powder resins. Thermoplastic powders include vinyl chloride, polyethylene, nylon, and the like.

[0029] The shape of the substrate is not limited. Commercially available alumina (Al2O3), silica (SiO2), silicon carbide (SiC), diamond, cubic boron nitride (cBN), etc. can be used as abrasive particles. Abrasive particles of various particle sizes can be selected to suit the object to be polished.

[0030] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and variations are possible within the scope of the gist of the present invention as defined in the claims. [Explanation of symbols]

[0031] W Base material 5, 10, 20, 30 Coating equipment 40 Heating device

Claims

1. a hydration step of hydrating a substrate that is a woven fabric or a nonwoven fabric; a coating step of coating a powdered resin and abrasive particles onto the moistened area of ​​the substrate; a heating step of heating the substrate so that the powder resin melts and the abrasive particles are fixed to the substrate; A method for manufacturing a polishing member comprising:

2. 2. The method for manufacturing an abrasive member of claim 1, wherein the coating step includes coating the powder resin onto the substrate, coating the abrasive particles toward the powder resin on the substrate, and then coating the powder resin again toward the abrasive particles on the substrate.

3. The method for manufacturing an abrasive member according to claim 1 , wherein the coating step comprises coating the base material with a mixture of the powdered resin and the abrasive particles.

4. 4. The method for manufacturing an abrasive member according to claim 1, wherein the heating step is carried out during the application step.

5. The method for manufacturing a polishing member according to claim 4 , wherein the heating step heats the substrate using a heating element heated by induction heating.

6. 4. The method for manufacturing an abrasive member according to claim 1, wherein the substrate is a sheet, a film, or a continuous strip-shaped member.

7. 4. The method for manufacturing an abrasive member according to claim 1, wherein the powder resin is thermosetting and contains at least one powder selected from the group consisting of epoxy, epoxy polyester, polyester, acrylic, and fluororesin.

8. 4. The method for manufacturing an abrasive member according to claim 1, wherein the powdered resin is thermoplastic and contains at least one powder of vinyl chloride, polyethylene, or nylon.

9. 4. The method for manufacturing an abrasive member according to claim 1, wherein the powdered resin is thermoplastic and contains powder of engineering plastic.

10. The method for manufacturing an abrasive member according to claim 9, wherein the engineering plastic is PPS, PEEK, or PI.

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