Method for manufacturing electronic component

Abstract

To provide a method for manufacturing an electronic component capable of suppressing stacking misalignment of sheets in a stacked body.SOLUTION: A method for manufacturing a coil component 1 includes a step of forming a plurality of green sheets. In the step of forming the plurality of green sheets, a process of forming, using an insulating paste, an element-body pattern EP having a defective portion K and a process of forming, using a conductor paste, a conductor pattern CP having protrusions 30A, 30B protruding from a surface S of the element-body pattern EP in the defective portion K of the element-body pattern EP are performed to form at least one first green sheet GS1 among the plurality of green sheets. The conductor pattern CP includes a plurality of regions A having different height positions with respect to the surface S of the element-body pattern EP, and the protrusions 30A, 30B are formed in the conductor pattern CP by the region A protruding from the surface S of the element-body pattern EP in the plurality of regions A.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing an electronic component. [Background technology]

[0002] Electronic components are manufactured by a process including a step of forming a sheet including an insulating layer and a conductive layer, and a step of laminating a plurality of sheets to form a laminate (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-113309 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of one aspect of the present invention is to provide a method for manufacturing an electronic component that can suppress misalignment of sheets in a laminate. [Means for solving the problem]

[0005] (1) A method for manufacturing an electronic component according to one aspect of the present invention includes forming a plurality of sheets and stacking the plurality of sheets to form a laminate, wherein the forming the plurality of sheets is performed on at least one first sheet of the plurality of sheets, using an insulating paste to form a first insulating layer having an opening, and using a conductive paste to form a first conductor layer having a convex portion that protrudes above the surface of the first insulating layer at the opening of the first insulating layer, thereby forming the first sheet, wherein the first conductor layer includes a plurality of regions at different height positions relative to the surface of the first insulating layer, and the convex portions are formed in the first conductor layer by the regions that protrude above the surface of the first insulating layer in the plurality of regions.

[0006] In one embodiment of the method for manufacturing an electronic component according to the present invention, a first sheet having a first conductor layer is formed as at least one of a plurality of sheets. The first conductor layer has a convex portion that protrudes above the surface of the first insulating layer. As a result, when the first sheet and another sheet are stacked in the method for manufacturing an electronic component, the convex portion of the first conductor layer digs into the other sheet. Therefore, in the method for manufacturing an electronic component, the anchor effect can prevent the first sheet from moving in a direction perpendicular to the stacking direction (a direction along the insulating layer of the sheet) relative to the other sheet. Therefore, in the method for manufacturing an electronic component, stacking misalignment of the sheets in the laminate can be suppressed.

[0007] (2) In the method for manufacturing an electronic component described in (1) above, the step of forming the multiple sheets may include forming a second insulating layer having an opening using an insulating paste on at least one second sheet among the multiple sheets, and forming a second conductor layer in the opening of the second insulating layer using a conductor paste. In the step of forming the second sheet and forming a laminate, the first sheet and the second sheet may be laminated so that the convex portion of the first conductor layer of the first sheet overlaps the second conductor layer of the second sheet. In this method, the convex portion of the first conductor layer bites into the second conductor layer. This more reliably restricts movement of the first sheet relative to the second sheet.

[0008] (3) In the method for manufacturing an electronic component according to (1) or (2), the step of forming a plurality of sheets may include forming a second insulating layer on at least one second sheet among the plurality of sheets using an insulating paste, and forming the second sheet. In the step of forming the laminate, the first sheet and the second sheet may be laminated so that the convex portions of the first conductive layer of the first sheet overlap the second insulating layer of the second sheet. In this method, the convex portions of the first conductive layer dig into the second insulating layer. This more reliably restricts movement of the first sheet relative to the second sheet.

[0009] (4) In the method for manufacturing an electronic component according to any one of (1) to (3) above, in the step of forming the plurality of sheets, at least one third sheet among the plurality of sheets may be formed by a process of forming a third insulating layer using an insulating paste, and the third sheet may be laminated so as to be the outermost layer in the lamination direction of the laminate, thereby forming the outer surface of the laminate with the third sheet. In this method, the outer surface of the laminate can be formed with the third sheet.

[0010] (5) In the method for manufacturing an electronic component according to any one of (1) to (4), a convex portion may be formed on the first sheet so as to cover at least a portion of an edge of the first insulating layer that forms an opening in the first insulating layer. In this method, the convex portion is also formed on the edge of the first insulating layer. This improves the bonding strength between the first insulating layer and the first conductor layer.

[0011] (6) In the method for manufacturing an electronic component described in (1) above, a first conductor layer having a recess that is recessed below the surface of the first insulating layer may be formed in the first sheet, and the recesses may be formed in the first conductor layer in a plurality of regions that are recessed below the surface of the first insulating layer. In this method, the surface area of ​​the first conductor layer can be increased by forming the recesses in the first conductor layer.

[0012] (7) In the method for manufacturing an electronic component according to (1), the first conductor layer may constitute a coil conductor. This method allows the manufacture of a coil component as the electronic component. [Effects of the Invention]

[0013] According to one aspect of the present invention, it is possible to suppress stacking displacement of sheets in a laminate. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view of a coil component manufactured by a method for manufacturing an electronic component according to one embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the coil component shown in FIG. [Figure 3] FIG. 3 is a side view of the coil device shown in FIG. [Figure 4] FIG. 4 is a flowchart showing a method for manufacturing a coil component. [Figure 5] 5(a), 5(b), 5(c), 5(d) and 5(e) are diagrams illustrating a method for manufacturing the first green sheet. [Figure 6] FIG. 6 is a diagram showing the first green sheet. [Figure 7] FIG. 7 is a diagram illustrating a method for manufacturing the third green sheet. [Figure 8] FIG. 8 is a cross-sectional view showing a part of the laminate. [Figure 9] 9(a), 9(b), 9(c), 9(d) and 9(e) are diagrams illustrating a method for manufacturing the second green sheet. [Figure 10] FIG. 10 is a cross-sectional view showing a part of the laminate. [Figure 11] 11(a), 11(b), 11(c), 11(d) and 11(e) are diagrams illustrating a method for manufacturing a green sheet for a coil component according to another embodiment. [Figure 12] 12(a), 12(b), 12(c) and 12(d) are diagrams showing the first green sheet. [Figure 13] 13(a), 13(b), 13(c), 13(d) and 13(e) are diagrams illustrating a method for manufacturing a green sheet for a coil component according to another embodiment. [Figure 14] 14(a) and 14(b) are diagrams showing the first green sheet. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and redundant description will be omitted.

[0016] Fig. 1 is a perspective view of a coil component manufactured by a method for manufacturing an electronic component according to one embodiment. As shown in Fig. 1, the coil component (electronic component) 1 includes a rectangular parallelepiped element body 2 and a pair of terminal electrodes 4, 5. The pair of terminal electrodes 4, 5 are disposed at both ends of the element body 2. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0017] The element body 2 has a pair of end faces 2a, 2b facing each other, a pair of main faces 2c, 2d facing each other, and a pair of side faces 2e, 2f facing each other. The direction in which the pair of main faces 2c, 2d face each other, i.e., the direction parallel to the end faces 2a, 2b, is the first direction D1. The direction in which the pair of end faces 2a, 2b face each other, i.e., the direction parallel to the main faces 2c, 2d, is the second direction D2. The direction in which the pair of side faces 2e, 2f face each other is the third direction D3. In this embodiment, the first direction D1 is the height direction of the element body 2. The second direction D2 is the longitudinal direction of the element body 2 and is perpendicular to the first direction D1. The third direction D3 is the width direction of the element body 2 and is perpendicular to the first direction D1 and the second direction D2.

[0018] The pair of end faces 2a, 2b extend in a first direction D1 to connect the pair of principal faces 2c, 2d together. The pair of end faces 2a, 2b also extend in a third direction D3, i.e., in the direction of the short sides of the pair of principal faces 2c, 2d. The pair of side faces 2e, 2f also extend in the first direction D1 to connect the pair of principal faces 2c, 2d together. The pair of side faces 2e, 2f also extend in a second direction D2, i.e., in the direction of the long sides of the pair of end faces 2a, 2b. The coil component 1 is mounted, for example, by soldering to an electronic device (for example, a circuit board or electronic component). In the coil component 1, the principal face 2c forms a mounting surface facing the electronic device.

[0019] As shown in FIG. 2, the element body 2 is configured by stacking multiple insulator layers 6 in the third direction D3. The element body 2 has multiple stacked insulator layers 6. In the element body 2, the direction in which the multiple insulator layers 6 are stacked coincides with the third direction D3. In the actual element body 2, the insulator layers 6 are integrated to the extent that the boundaries between the insulator layers 6 are not visible.

[0020] Each insulator layer 6 is formed of a dielectric material containing a glass component. That is, the element body 2 contains a dielectric material containing a glass component as a compound of elements that constitute the element body 2. The glass component is, for example, borosilicate glass. The dielectric material is, for example, a dielectric ceramic such as a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based material. Each insulator layer 6 is formed of a sintered ceramic green sheet containing a glass ceramic material.

[0021] As shown in FIG. 3, the element body 2 has recesses 7 and 8. The recess 7 is provided on the end face 2a side of the element body 2. The recess 7 is a space recessed inward from the outer surface of the element body 2. The recess 7 has a shape corresponding to the shape of the terminal electrode 4. In this embodiment, the recess 7 has an L-shape when viewed from the third direction D3. The recess 8 is provided on the end face 2b side of the element body 2. The recess 8 is a space recessed inward from the outer surface of the element body 2. The recess 8 has a shape corresponding to the shape of the terminal electrode 5. In this embodiment, the recess 8 has an L-shape when viewed from the third direction D3.

[0022] As shown in FIG. 3 , the terminal electrodes 4 and 5 are embedded in the element body 2. The terminal electrode 4 is arranged on the end face 2a side of the element body 2. The terminal electrode 4 is arranged in a recess 7 of the element body 2. The terminal electrode 5 is arranged on the end face 2b side of the element body 2. The terminal electrode 5 is arranged in a recess 8 of the element body 2.

[0023] The terminal electrode 4 is disposed across the end face 2a and the main surface 2d. The terminal electrode 5 is disposed across the end face 2b and the main surface 2d. In this embodiment, the surface of the terminal electrode 4 is substantially flush with both the end face 2a and the main surface 2d. The surface of the terminal electrode 5 is substantially flush with both the end face 2b and the main surface 2d.

[0024] The terminal electrode 4 has an L-shape when viewed from the third direction D3. The terminal electrode 4 has a plurality of electrode portions 4a, 4b. In this embodiment, the terminal electrode 4 has a pair of electrode portions 4a, 4b. The electrode portion 4a and the electrode portion 4b are connected at a ridge portion of the element body 2 and are electrically connected to each other. In this embodiment, the electrode portion 4a and the electrode portion 4b are integrally formed. The electrode portion 4a extends along the first direction D1. The electrode portion 4a has a rectangular shape when viewed from the second direction D2. The electrode portion 4b extends along the second direction D2. The electrode portion 4b has a rectangular shape when viewed from the first direction D1. Each of the electrode portions 4a, 4b extends along the third direction D3.

[0025] 2, the terminal electrode 4 is configured by stacking a plurality of electrode layers 10 and a plurality of electrode layers 11. In this embodiment, the number of electrode layers 10 is "2", and the number of electrode layers 11 is "4". The electrode layers 10 are arranged at positions sandwiching the electrode layer 11 in the third direction D3.

[0026] Each electrode layer 10 is provided in a defect formed in the corresponding insulator layer 6. The defect forms a recess 7. The electrode layer 10 is formed by firing a conductive paste. The conductive paste contains a metal component. The metal component is contained in a conductive material, such as Ag or Pd. The conductive paste may contain a glass component. The glass component is a compound of elements that constitute the element body 2 and may be the same component as the glass component contained in the element body 2. The content of the glass component may be set appropriately. Each electrode layer 10 is L-shaped when viewed from the third direction D3. The electrode layer 10 has layer portions 10a and 10b. The layer portion 10a extends along the first direction D1. The layer portion 10b extends along the second direction D2.

[0027] Each electrode layer 11 is provided in a defect formed in the corresponding insulator layer 6. The defect forms a recess 7. The electrode layer 11 is formed by firing a conductive paste. The conductive paste contains a conductive material. The conductive material is, for example, Ag or Pd. Each electrode layer 11 is L-shaped when viewed from the third direction D3. The electrode layer 11 has layer portions 11a and 11b. The layer portion 11a extends along the first direction D1. The layer portion 11b extends along the second direction D2.

[0028] The electrode portion 4a is formed by laminating layer portions 10a and 11a of the electrode layers 10 and 11. In the electrode portion 4a, the layer portions 10a and 11a are integrated to the extent that the boundary between the layer portions 10a and 11a is not visible. The electrode portion 4b is formed by laminating layer portions 10b and 11b of the electrode layers 10 and 11. In the electrode portion 4b, the layer portions 10b and 11b are integrated to the extent that the boundary between the layer portions 10b and 11b is not visible.

[0029] As shown in FIG. 3 , the terminal electrode 5 has an L-shape when viewed from the third direction D3. The terminal electrode 5 has a plurality of electrode portions 5a, 5b. In this embodiment, the terminal electrode 5 has a pair of electrode portions 5a, 5b. The electrode portion 5a and the electrode portion 5b are connected at a ridge portion of the element body 2 and are electrically connected to each other. In this embodiment, the electrode portion 5a and the electrode portion 5b are integrally formed. The electrode portion 5a extends along the first direction D1. The electrode portion 5a has a rectangular shape when viewed from the second direction D2. The electrode portion 5b extends along the second direction D2. The electrode portion 5b has a rectangular shape when viewed from the first direction D1. Each of the electrode portions 5a, 5b extends along the third direction D3.

[0030] 2, the terminal electrode 5 is configured by stacking a plurality of electrode layers 12 and a plurality of electrode layers 13. In this embodiment, the number of electrode layers 12 is "2", and the number of electrode layers 13 is "4". The electrode layers 12 are arranged at positions sandwiching the electrode layer 13 in the third direction D3.

[0031] Each electrode layer 12 is provided in a defect formed in the corresponding insulator layer 6. The defect forms a recess 8. The electrode layer 12 is formed by firing a conductive paste. The conductive paste contains a metal component. The metal component is contained in a conductive material, such as Ag or Pd. The conductive paste may contain a glass component. The glass component is a compound of elements that constitute the element body 2 and may be the same component as the glass component contained in the element body 2. Each electrode layer 12 is L-shaped when viewed from the third direction D3. The electrode layer 12 has layer portions 12a and 12b. The layer portion 12a extends along the first direction D1. The layer portion 12b extends along the second direction D2.

[0032] Each electrode layer 13 is provided in a defect formed in the corresponding insulator layer 6. The defect forms a recess 8. The electrode layer 13 is formed by firing a conductive paste. The conductive paste contains a conductive material. The conductive material is, for example, Ag or Pd. Each electrode layer 13 is L-shaped when viewed from the third direction D3. The electrode layer 13 has layer portions 13a and 13b. The layer portion 13a extends along the first direction D1. The layer portion 13b extends along the second direction D2.

[0033] The electrode portion 5a is formed by laminating layer portions 12a and 13a of the electrode layers 12 and 13. In the electrode portion 5a, the layer portions 12a and 13a are integrated to the extent that the boundary between the layer portions 12a and 13a is not visible. The electrode portion 5b is formed by laminating layer portions 12b and 13b of the electrode layers 12 and 13. In the electrode portion 5b, the layer portions 12b and 13b are integrated to the extent that the boundary between the layer portions 12b and 13b is not visible.

[0034] 3, the coil device 1 includes a coil 9 disposed in the element body 2. A coil axis AX of the coil 9 extends along the third direction D3.

[0035] As shown in Fig. 2, the coil 9 includes a first coil conductor 22, a second coil conductor 23, a third coil conductor 24, and a fourth coil conductor 25. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are arranged in this order along the third direction D3. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 each have a shape in which a portion of a loop is interrupted, and each have one end and the other end. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are formed with a predetermined width.

[0036] The first coil conductor 22 is located in the same layer as one electrode layer 11 and one electrode layer 13. The first coil conductor 22 is connected to the electrode layer 13 via a connecting conductor 26. The connecting conductor 26 is located in the same layer as the first coil conductor 22. One end of the first coil conductor 22 is connected to the connecting conductor 26. The connecting conductor 26 is connected to the layer portion 13a. The connecting conductor 26 connects the first coil conductor 22 and the electrode layer 13. The connecting conductor 26 may be connected to the layer portion 13b. The first coil conductor 22 is separated from the electrode layer 11 that is located in the same layer. In this embodiment, the first coil conductor 22, the connecting conductor 26, and the electrode layer 13 are integrally formed.

[0037] The second coil conductor 23 is located in the same layer as one electrode layer 11 and one electrode layer 13. The second coil conductor 23 is spaced apart from the electrode layers 11 and 13 that are located in the same layer. The first coil conductor 22 and the second coil conductor 23 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the first coil conductor 22 and one end of the second coil conductor 23 overlap each other.

[0038] The third coil conductor 24 is located in the same layer as one electrode layer 11 and one electrode layer 13. The third coil conductor 24 is spaced apart from the electrode layers 11 and 13 that are located in the same layer. The second coil conductor 23 and the third coil conductor 24 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the second coil conductor 23 and one end of the third coil conductor 24 overlap each other.

[0039] The fourth coil conductor 25 is located in the same layer as one electrode layer 11 and one electrode layer 13. The fourth coil conductor 25 is connected to the electrode layer 11 via a connecting conductor 27. The connecting conductor 27 is located in the same layer as the fourth coil conductor 25. The other end of the fourth coil conductor 25 is connected to the connecting conductor 27. The connecting conductor 27 is connected to the layer portion 11a. The connecting conductor 27 connects the fourth coil conductor 25 and the electrode layer 11. The connecting conductor 27 may be connected to the layer portion 11b. The fourth coil conductor 25 is separated from the electrode layer 13 that is located in the same layer. In the present embodiment, the fourth coil conductor 25, the connecting conductor 27, and the electrode layer 11 are integrally formed.

[0040] The third coil conductor 24 and the fourth coil conductor 25 are adjacent to each other in the third direction D3. When viewed from the third direction D3, the other end of the third coil conductor 24 and one end of the fourth coil conductor 25 overlap each other.

[0041] The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 are electrically connected to each other. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25 form a coil 9. The coil 9 is electrically connected to the terminal electrode 5 through a connecting conductor 26. The coil 9 is electrically connected to the terminal electrode 4 through a connecting conductor 27.

[0042] The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 27, 27 contain a conductive material. The conductive material includes Ag or Pd. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 27, 27 are configured as a sintered body of a conductive paste containing conductive material powder. The conductive material powder includes, for example, Ag powder or Pd powder.

[0043] In this embodiment, the first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 26 and 27 contain the same conductive material as the terminal electrodes 4 and 5. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 26 and 27 may contain a conductive material different from that of the terminal electrodes 4 and 5. The first coil conductor 22, the second coil conductor 23, the third coil conductor 24, the fourth coil conductor 25, and the connecting conductors 27 and 27 are provided in cutouts (openings) K (see FIG. 6 ) formed in the corresponding insulator layers 6.

[0044] Next, a description will be given of a method for manufacturing the coil device 1. Fig. 4 is a flowchart showing the method for manufacturing the coil device 1.

[0045] 4, a plurality of green sheets are formed (step S01). The green sheets are configured to include an element pattern and a conductor pattern. First, a method for forming a first green sheet out of the plurality of green sheets will be described.

[0046] In the first green sheet formation process, an element pattern (first insulating layer) is first formed. As shown in FIG. 5(a), the element pattern is formed by applying an element paste (insulating paste) P1 containing the constituent materials of the insulator layer 6 and a photosensitive material onto a substrate B (e.g., a PET film). The photosensitive material contained in the element paste P1 may be either a negative or positive type, and a known material can be used. Next, the element formation layer is exposed and developed by photolithography using, for example, a Cr mask M1, to form an element pattern EP on the substrate, as shown in FIG. 5(b), which includes a missing portion K in which a shape corresponding to the shape of the conductor pattern CP described below has been removed. The missing portion K is formed through the element pattern EP. The element pattern EP is a layer that will become the insulator layer 6 after heat treatment.

[0047] The "photolithography method" of this embodiment refers to a method of processing a layer containing a photosensitive material into a desired pattern by exposing and developing it, and the type of mask is not limited. Exposure may be performed using a mask exposure device having a UV wavelength or the like as a light source, or a direct imaging device using laser light or the like. During irradiation, multiple or more outputs may be used for each shot.

[0048] Next, a conductor pattern (first conductor layer) is formed. As shown in FIG. 5(c), the conductor pattern is formed by applying a conductor paste P2 containing the constituent materials of the electrode layers 10, 11, 12, and 13, the first coil conductor 22, the second coil conductor 23, the third coil conductor 24, and the fourth coil conductor 25, and the connecting conductors 26 and 27, as well as a photosensitive material, onto the element pattern EP to form a conductor material layer. Specifically, the conductor material layer is formed on the element pattern EP and the missing portion K (including on the substrate B in the missing portion K). The photosensitive material contained in the conductor paste P2 may be either negative or positive, and any known photosensitive material can be used. Next, as shown in FIG. 5(d), the conductor material layer is exposed and developed by photolithography using a mask M2 corresponding to the missing portion K. As a result, a conductor pattern CP corresponding to the shape of the missing portion K is formed, as shown in FIG. 5(e).

[0049] In this way, a first green sheet (first sheet) GS1 having an element pattern EP and a conductor pattern CP is formed. FIG. 6 is a diagram showing a portion of the first green sheet GS1. As shown in FIG. 6, in the first green sheet GS1, the conductor pattern CP has protrusions 30A and 30B and a recess 31. In this embodiment, the conductor pattern CP has two protrusions 30A and 30B. In this embodiment, the two protrusions 30A and 30B are provided at both ends of the conductor pattern CP in the width direction of the conductor pattern CP. The protrusions 30A and 30B protrude from the surface S of the element pattern EP.

[0050] The conductor pattern CP includes a plurality of regions A at different height positions relative to the surface S of the element body pattern EP. The protrusions 30A, 30B are formed by a plurality of regions A. The protrusions 30A, 30B are configured by regions A that are higher than the surface S of the element body pattern EP in the plurality of regions A. In this embodiment, the protrusions 30A, 30B have edge portions 30Ae, 30Be. The edge portions 30Ae, 30Be are arranged on the edges of the element body pattern EP that form the missing portion K in the element body pattern EP. The edge portions 30Ae, 30Be may be formed continuously or discontinuously in the extension direction of the conductor pattern CP.

[0051] The recess 31 is recessed below the surface S of the element pattern EP. The lowest position of the recess 31 is lower than the height position of the surface of the element pattern EP. The recess 31 is made up of multiple regions A, each of which has a height lower than the surface S of the element pattern EP. In this embodiment, the recess 31 has a curved shape.

[0052] Next, a method for forming the second green sheet GS2 (see FIG. 8) among the plurality of green sheets will be described. In this embodiment, the second green sheet GS2 has the same structure as the first green sheet GS1. The second green sheet GS2 can be formed in the same manner as the first green sheet GS1.

[0053] Next, a method for forming a third green sheet out of the plurality of green sheets will be described. In the third green sheet forming step, an element body pattern (third insulating layer) EP is formed. As shown in Fig. 7, the element body pattern EP is formed by applying element body paste onto a substrate. In this way, a third green sheet (third sheet) GS3 composed of the element body pattern EP is formed.

[0054] Next, a laminate is formed (step S02). The laminate 100 is formed by laminating a first green sheet GS1, a second green sheet GS2, and a third green sheet GS3. Figure 9 is a cross-sectional view showing a portion of the laminate 100.

[0055] In the example shown in FIG. 8, the first green sheet GS1 and the second green sheet GS2 are stacked adjacent to each other. As shown in FIG. 8, in the laminate 100, the first green sheet GS1 and the second green sheet GS2 are stacked so that the conductive patterns CP of the adjacent first and second green sheets GS1 and GS2 overlap each other. The convex portions 30A and 30B of the conductive pattern CP of the first green sheet GS1 (third from the top in FIG. 8) are embedded in the conductive pattern CP of the second green sheet GS2 (fourth from the top in FIG. 8). The convex portions 30A and 30B of the conductive pattern CP of the second green sheet GS2 (fourth from the top in FIG. 8) are embedded in the element pattern EP of the first green sheet GS1 (fifth from the top in FIG. 8). The third green sheet GS3 is stacked so as to be the outermost layer in the stacking direction of the laminate 100. The third green sheet GS3 constitutes the outer surface 100S of the laminate 100.

[0056] Next, as shown in FIG. 4, the laminate 100 is cut (step S03). In this embodiment, the laminate 100 is cut using a cutting machine (for example, a dicing blade). Specifically, the laminate 100 is cut based on cutting marks (not shown) provided on the laminate 100. This results in a plurality of green chips having a predetermined size.

[0057] Next, the green chip is fired (step S04). By firing the green chip, the convex portions 30A, 30B and the concave portions 31 melt in the portions where the conductive patterns CP overlap, and the conductive patterns CP are joined (integrated). Therefore, after firing the green chip, the convex portions 30A, 30B and the concave portions 31 may disappear in the portions where the conductive patterns CP overlap.

[0058] Then, a plating layer is formed on the surface of each of the terminal electrodes 4, 5 (step S05). The plating layer is formed by, for example, electroplating or electroless plating. The plating layer contains, for example, Ni, Sn, or Au. In this way, the coil component 1 is obtained.

[0059] In the above manufacturing method, the first green sheet GS1 and the second green sheet GS2 have the same configuration, that is, the second green sheet GS2 has the conductor pattern CP including the convex portions 30A, 30B and the concave portions 31. However, the second green sheet GS2 may have a configuration that does not include the convex portions 30A, 30B and the concave portions 31.

[0060] A method for forming a second green sheet GS2 that does not have the convex portions 30A, 30B and the concave portions 31 will be described. In the process of forming the second green sheet GS2, first, an element body pattern (second insulating layer) is formed. As shown in FIG. 9(a), the element body pattern is formed by applying an element body paste P1 containing the constituent material of the insulating layer 6 and a photosensitive material onto a substrate B. Next, the element body formation layer is exposed and developed by photolithography using, for example, a Cr mask M3, to form an element body pattern EP on the substrate, including a missing portion K in which a shape corresponding to the shape of a conductor pattern CP (described later) has been removed, as shown in FIG. 9(b).

[0061] Next, a conductor pattern (second conductor layer) is formed. As shown in FIG. 9(c), the conductor pattern is formed by applying a conductor paste P2 onto the element body pattern EP to form a conductor material layer. Specifically, the conductor material layer is formed in the defect K (including on the substrate B in the defect K) so as to be approximately flush (flat) with the surface S of the element body pattern EP. This forms a conductor pattern CP corresponding to the shape of the defect K. In this way, a second green sheet (second sheet) GS2 having the element body pattern EP and the conductor pattern CP is formed.

[0062] Fig. 10 is a cross-sectional view showing a portion of the laminate 100. In the example shown in Fig. 10, a first green sheet GS1 and a second green sheet GS2 are laminated adjacent to each other. As shown in Fig. 10, in the laminate 100, the first green sheet GS1 and the second green sheet GS2 are laminated so that the conductor pattern CP of the first green sheet GS1 and the conductor pattern CP (which does not have convex portions 30A, 30B and concave portions 31) of the second green sheet GS2 overlap. The convex portions 30A, 30B of the conductor pattern CP of the first green sheet GS1 (second from the top in Fig. 10) are embedded in the conductor pattern CP of the second green sheet GS2 (third from the top in Fig. 10).

[0063] 8 and 10 show a configuration in which the second green sheet (second sheet) GS2 adjacent to the first green sheet GS1 has a conductive pattern CP, but the second green sheet GS2 does not have to have the conductive pattern CP. In other words, the second green sheet GS2 may be composed of only the element pattern EP.

[0064] As described above, in the manufacturing method of the coil component 1 according to this embodiment, a first green sheet GS1 having a conductor pattern CP is formed as at least one of the multiple green sheets. The conductor pattern CP has protrusions 30A and 30B that protrude from the surface S of the element pattern EP. As a result, in the manufacturing method of the coil component 1, when the first green sheet GS1 and other green sheets are stacked, the protrusions 30A and 30B of the conductor pattern CP dig into the other green sheets. Therefore, in the manufacturing method of the coil component 1, the anchor effect can prevent the first green sheet GS1 from moving in a direction perpendicular to the stacking direction (a direction along the insulating layers of the green sheets) relative to the other green sheets. Therefore, in the manufacturing method of the coil component 1, stacking misalignment of the green sheets in the laminate 100 can be suppressed.

[0065] In the method for manufacturing the coil component 1 according to this embodiment, the convex portions 30A and 30B of the conductor pattern CP of the first green sheet GS1 are embedded in the conductor pattern CP of an adjacent first green sheet GS1. Therefore, in the method for manufacturing the coil component 1, adjacent conductor patterns CP in the stacking direction are firmly connected to each other. Therefore, in the method for manufacturing the coil component 1, it is possible to suppress stacking misalignment of the green sheets in the laminate 100.

[0066] In the method for manufacturing the coil component 1 according to this embodiment, the convex portions 30A and 30B of the conductor pattern CP of the first green sheet GS1 are embedded in, for example, the element pattern EP of the adjacent first green sheet GS1. Therefore, in the method for manufacturing the coil component 1, stacking misalignment of the green sheets in the laminate 100 can be suppressed.

[0067] In the method for manufacturing the coil component 1 according to this embodiment, the protrusions 30A, 30B are formed on the first green sheet GS1 so as to cover at least a portion of the edge of the element body pattern EP that forms the missing portion K in the element body pattern EP. In this method, the edge portions 30Ae, 30Be are formed on the protrusions 30A, 30B. This improves the bonding strength between the element body pattern EP and the conductor pattern CP.

[0068] In the method for manufacturing the coil component 1 according to this embodiment, an element pattern EP having recesses 31 recessed below the surface S of the element pattern EP is formed in the first green sheet GS1. In this method, by forming the recesses 31 in the conductor pattern CP, the surface area of ​​the conductor pattern CP can be increased.

[0069] Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0070] In the above embodiment, the electronic component is a coil component, but the electronic component manufactured by the electronic component manufacturing method according to the present invention may be a capacitor component or the like.

[0071] In the above embodiment, the conductive pattern CP of the first green sheet GS1 has a recess 31. However, the conductive pattern CP does not have to have a recess. The area between the two protrusions 30A, 30B may be flat, and in this case, this area may be at the same height as the surface S of the element pattern EP.

[0072] In the above embodiment, the conductive pattern CP of the first green sheet GS1 has two protrusions 30A, 30B. However, the shape of the protrusions is not limited to this. For example, there may be only one protrusion.

[0073] A method for manufacturing a green sheet for a coil component according to another embodiment will now be described. As shown in Fig. 11(a), the element pattern is formed by applying element paste P1 onto a substrate B. Next, the element formation layer is exposed and developed by photolithography using, for example, a Cr mask M1, to form an element pattern EP on the substrate, including a missing portion K in which a shape corresponding to the shape of the conductor pattern CP has been removed, as shown in Fig. 11(b).

[0074] Next, as shown in Fig. 11(c), a conductive paste P2 is applied onto the element body pattern EP to form a conductive material layer. Specifically, a conductive material layer is formed on the element body pattern EP and the missing portion K (including on the substrate B in the missing portion K). Next, as shown in Fig. 11(d), a mask M4 corresponding to the missing portion K is used, and the conductive material layer is exposed and developed by photolithography. As a result, a conductive pattern CP corresponding to the shape of the missing portion K is formed, as shown in Fig. 11(e).

[0075] In this way, a first green sheet (first sheet) GS1 having an element pattern EP and a conductor pattern CP is formed. In the first green sheet GS1, the conductor pattern CP has a protrusion 32. In the example shown in Fig. 11(e), the conductor pattern CP has one protrusion 32. The protrusion 32 protrudes from the surface S of the element pattern EP.

[0076] In the first green sheet GS1, examples of one convex portion may be convex portion 33, in which the cross-sectional shape of the upper part of the conductor pattern CP is trapezoidal, as shown in Figure 12(a), convex portion 34, in which the cross-sectional shape of the upper part of the conductor pattern CP is triangular, as shown in Figure 12(b), convex portion 35, in which the cross-sectional shape of the upper part of the conductor pattern CP is triangular, as shown in Figure 12(c), or convex portion 36, in which the cross-sectional shape of the upper part of the conductor pattern CP is semicircular, as shown in Figure 12(d).

[0077] The number of protrusions may be three or more. A method for manufacturing a green sheet for a coil component according to another embodiment will now be described. The element body pattern is formed by applying element body paste P1 onto a substrate B, as shown in FIG. 13(a). The element body formation layer is then exposed and developed by photolithography using, for example, a Cr mask M1, to form an element body pattern EP on the substrate, as shown in FIG. 13(b), which includes a missing portion K in which a shape corresponding to the shape of the conductor pattern CP has been removed.

[0078] Next, as shown in Fig. 13(c), a conductive paste P2 is applied onto the element body pattern EP to form a conductive material layer. Specifically, a conductive material layer is formed on the element body pattern EP and the missing portion K (including on the substrate B in the missing portion K). Next, as shown in Fig. 13(d), a mask M5 corresponding to the missing portion K is used, and the conductive material layer is exposed and developed by photolithography. As a result, a conductive pattern CP corresponding to the shape of the missing portion K is formed, as shown in Fig. 13(e).

[0079] In this way, a first green sheet GS1 having an element pattern EP and a conductor pattern CP is formed. In the first green sheet GS1, the conductor pattern CP has protrusions 37A, 37B, and 37C. In the example shown in FIG. 13(e), the conductor pattern CP has three protrusions 37A, 37B, and 37C. The protrusions 37A, 37B, and 37C protrude from the surface S of the element pattern EP.

[0080] In the above embodiment, the conductive pattern CP of the first green sheet GS1 has edge portions 30Ae and 30Be at the convex portions 30A and 30B. However, the convex portions do not have to have edge portions. As shown in FIG. 14(a), the conductive pattern CP may have convex portions 38A and 38B, or as shown in FIG. 14(b), the conductive pattern CP may have convex portions 39A and 39B.

[0081] In the above embodiment, in the step of forming the conductor patterns (step S02 in FIG. 4), the conductor patterns of the electrode layers 10, 11, 12, and 13 that constitute the terminal electrodes 4 and 5 are formed as an example. However, depending on the configuration of the terminal electrodes, the terminal electrodes may be formed after firing the green chip.

[0082] In the above embodiment, an example has been described in which, after the step of firing the green chip (step S04 in FIG. 4), a plating layer is formed (step S05 in FIG. 4) on the surface of each of the terminal electrodes 4 and 5. However, it is not necessary to form a plating layer on the surface of the terminal electrodes 4 and 5.

[0083] In the above embodiment, the shapes of the terminal electrodes 4 and 5 can be changed as appropriate depending on the design. The shape of the coil 9 and the number of coil conductors can also be changed as appropriate depending on the design. [Explanation of symbols]

[0084] 1...coil component (electronic component), 30A, 30B...convex portion, 31...concave portion, 100...laminated body, A...region, CP...conductor pattern (first conductor layer, second conductor layer), EP...element pattern (first insulating layer, second insulating layer, third insulating layer), GS1...first green sheet (first sheet), GS2...second green sheet (second sheet), GS3...third green sheet (third sheet), K...defective portion (opening), P1...element paste (insulating paste), P2...conductor paste, S...surface.

Claims

1. forming a plurality of sheets; and stacking a plurality of the sheets to form a laminate, In the step of forming the plurality of sheets, a first sheet is formed as at least one of the plurality of sheets by performing a process of forming a first insulating layer having an opening using an insulating paste and a process of forming a first conductor layer having a protrusion protruding from a surface of the first insulating layer in the opening using a conductor paste, the first conductor layer includes a plurality of regions at different height positions relative to the surface of the first insulating layer, A method for manufacturing an electronic component, wherein the convex portions are formed in the first conductor layer by the regions that protrude above the surface of the first insulating layer in a plurality of the regions.

2. In the step of forming the plurality of sheets, a process of forming a second insulating layer having an opening using an insulating paste and a process of forming a second conductor layer in the opening of the second insulating layer using a conductor paste are performed to form the second sheet; 2. The method for manufacturing an electronic component according to claim 1, wherein in the step of forming the laminate, the first sheet and the second sheet are laminated so that the convex portion of the first conductor layer of the first sheet overlaps the second conductor layer of the second sheet.

3. In the step of forming the plurality of sheets, a process of forming a second insulating layer using an insulating paste is performed on at least one second sheet among the plurality of sheets to form the second sheet; 2. The method for manufacturing an electronic component according to claim 1, wherein in the step of forming the laminate, the first sheet and the second sheet are laminated so that the convex portion of the first conductor layer of the first sheet overlaps the second insulating layer of the second sheet.

4. In the step of forming the plurality of sheets, a process of forming a third insulating layer using an insulating paste is performed on at least one third sheet among the plurality of sheets to form the third sheet; The method for manufacturing an electronic component according to claim 1 or 2, wherein the third sheet is laminated so as to be the outermost layer in the lamination direction of the laminate, and the third sheet forms an outer surface of the laminate.

5. The method for manufacturing an electronic component according to claim 1 or 2, wherein the convex portion is formed in the first sheet so as to cover at least a part of an edge portion of the first insulating layer that forms the opening in the first insulating layer.

6. forming the first conductor layer in the first sheet, the first conductor layer having a recess recessed below the surface of the first insulating layer; The method for manufacturing an electronic component according to claim 1 or 2, wherein the recesses are formed in the first conductor layer by the regions that are recessed from the surface of the first insulating layer in a plurality of the regions.

7. The method for manufacturing an electronic component according to claim 1 , wherein the first conductor layer constitutes a coil conductor.

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