Substrate placement stage and substrate processing apparatus

Abstract

To provide a space-saving technology for a structure that supplies power to an electrostatic chuck.SOLUTION: A substrate placement stage comprises an electrostatic chuck; and a power supply connection member having a first contact part connecting a power supply and the electrostatic chuck and connected to the electrostatic chuck, a second contact part connected to the power supply, a coil spring contact provided between the first contact part and the second contact part, and an elastic member pushing the coil spring contact toward the second contact part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a substrate mounting stage and a substrate processing apparatus. [Background technology]

[0002] Patent Document 1 discloses a stage device that holds a substrate in a processing vessel that is maintained under vacuum in a processing apparatus that processes the substrate. Patent Document 1 discloses that the stage device has a power supply mechanism that supplies power to the chucking electrode from a DC power supply provided below the stage.

[0003] Patent Document 2 discloses a plasma processing apparatus having a power supply connector. Patent Document 2 discloses that the power supply connector is connected to terminals at the upper and lower ends and has elasticity that allows it to expand and contract when biased in the vertical direction. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2021-128976 [Patent Document 2] Japanese Patent Application Publication No. 2019-114591 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique for reducing the space required for a structure that supplies power to an electrostatic chuck. [Means for solving the problem]

[0006] According to the present disclosure, there is provided a substrate mounting table comprising: an electrostatic chuck; and a power supply connection member that connects a power supply to the electrostatic chuck, the power supply connection member comprising: a first contact portion connected to the electrostatic chuck; a second contact portion connected to the power supply; a coil spring contact provided between the first contact portion and the second contact portion; and an elastic member for pressing the coil spring contact toward the second contact portion. [Effects of the Invention]

[0007] The present disclosure provides a technique for reducing the space required for a structure that supplies power to an electrostatic chuck. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing an outline of a temperature control device in which a substrate mounting table according to this embodiment is used. [Figure 2] FIG. 2 is a diagram illustrating the connection between the electrostatic chuck and the power supply in the substrate mounting table according to this embodiment. [Figure 3] FIG. 3 is a perspective view of a power supply connection member in the substrate mounting table according to this embodiment. [Figure 4] FIG. 4 is a cross-sectional view of a power supply connection member in the substrate mounting table according to this embodiment. [Figure 5] FIG. 5 is a cross-sectional view of a gas connection member in the substrate stage according to this embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described with reference to the accompanying drawings. Note that the present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0010] In addition, with regard to the description of the specification and drawings of each embodiment, components having substantially the same or corresponding functional configurations may be designated by the same or corresponding reference numerals to avoid redundant explanation. In addition, the scale of each part in the drawings may differ from the actual scale to facilitate understanding.

[0011] A substrate mounting table according to this embodiment will be described. The substrate mounting table according to this embodiment includes an electrostatic chuck and a connecting member that connects a power supply to the electrostatic chuck. The connecting member in the substrate mounting table according to this embodiment includes a first contact portion that is connected to the electrostatic chuck and a second contact portion that is connected to the power supply. The connecting member in the substrate mounting table according to this embodiment also includes a coil spring contact that is provided between the first connecting member and the second connecting member, and an elastic member that presses the coil spring contact toward the second contact portion.

[0012] First, a temperature control device in which a substrate mounting table according to this embodiment is used will be described in detail with reference to the drawings. Fig. 1 is a diagram showing an outline of a temperature control device 1 in which a substrate mounting table 20, which is an example of a substrate mounting table according to this embodiment, is used.

[0013] The temperature adjustment device 1 is an example of a substrate processing apparatus. The temperature adjustment device 1 is an apparatus that adjusts the temperature of a substrate to a desired temperature before processing in a substrate processing apparatus such as a CVD (Chemical Vapor Deposition) apparatus or an ALD (Atomic Layer Deposition) apparatus. The temperature adjustment device 1 heats or cools the substrate W to a desired temperature. For example, the temperature adjustment device 1 cools the substrate W to a temperature set in the range of 0°C to -223°C. The temperature adjustment device 1 heats the substrate W to a temperature set in the range of 50°C to 200°C. The temperature adjustment device 1 may adjust the temperature of the substrate W to a temperature set in the range of 0°C to 50°C by repeating heating and cooling.

[0014] The temperature control device 1 includes a chamber 10, a substrate mounting table 20, a heating / cooling unit 30, a power supply 40, and a gas supply unit 50.

[0015] [Chamber 10] The chamber 10 is a container capable of maintaining a predetermined pressure inside. The chamber 10 also houses a substrate mounting table 20 and a heating / cooling unit 30 inside. A substrate W to be temperature-controlled is carried into the chamber 10 using a transfer device or the like. The temperature-controlled substrate W is then carried out of the chamber 10 by the transfer device or the like.

[0016] The interior of the chamber 10 is maintained at a predetermined pressure during processing of the substrate W. The interior of the chamber 10 is maintained, for example, at a vacuum. The chamber 10 is evacuated by an exhaust unit 11 constituted, for example, by a vacuum pump or the like.

[0017] Chamber 10 has a generally cylindrical sidewall 10a, a top wall 10b that closes the upper side of sidewall 10a, and a bottom wall 10c that closes the lower side of sidewall 10a. A portion of the lower side of sidewall 10a is recessed inward to form a step 10S. Chamber 10 has a horizontal wall 10c1 and a vertical wall 10d at step 10S.

[0018] The chamber 10 has a loading / unloading port 12 in a side wall 10a. The loading / unloading port 12 can be opened and closed by a gate valve 13. The gate valve 13 is opened, and an unprocessed substrate W is loaded into the chamber 10 through the loading / unloading port 12 by a transfer device or the like. After the substrate W is loaded, the gate valve 13 is closed. Then, the temperature of the substrate W is adjusted inside the chamber 10. After the temperature of the substrate W is adjusted, the gate valve 13 is opened, and the substrate W is unloaded from the chamber 10 by a transfer device or the like.

[0019] A current introduction terminal 14 for connecting power from a power supply 40 is provided on a side wall 10c1 of the chamber 10. The current introduction terminal 14 connects the power supply 40 to a power supply connection member 23 inside the chamber 10 while insulating the chamber 10 from the power supply 40.

[0020] Although only one current introduction terminal 14 is shown in FIG. 1, the temperature adjustment device 1 has two current introduction terminals 14 on the positive and negative sides of the power source 40.

[0021] Furthermore, a vertical wall 10d of the chamber 10 is provided with a flow path 15 through which gas flows from a gas supply unit 50. The flow path 15 is connected to the gas supply unit 50 from the side of the vertical wall 10d. The connection between the flow path 15 and the gas supply unit 50 is sealed by, for example, a carbon gasket or the like.

[0022] [Board mounting table 20] The substrate W to be processed is placed on the substrate placing table 20. The substrate placing table 20 also holds the substrate W by suction onto a placing surface 20S.

[0023] The substrate mounting table 20 includes an electrostatic chuck 21, a base plate 22, a power supply connection member 23, and a gas connection member 24.

[0024] (Electrostatic Chuck 21) The electrostatic chuck 21 electrostatically attracts the substrate W. The electrostatic chuck 21 includes an electrode 21a and a dielectric 21b. The electrostatic chuck 21 has a structure in which the electrode 21a is sandwiched between the dielectrics 21b. When a high voltage is applied to the electrode 21a from the power supply 40, the electrostatic chuck 21 attracts the substrate W to the mounting surface 20S by electrostatic force. The electrostatic chuck 21 attracts the substrate W to the mounting surface 20S, thereby fixing the substrate W to the mounting surface 20S.

[0025] The electrostatic chuck 21 also has a through-hole 21h that penetrates the center of the electrostatic chuck 21 in the thickness direction in order to supply a heat transfer gas between the substrate W and the mounting surface 20S.

[0026] The following describes the connection between the electrostatic chuck 21 and the power supply 40. Fig. 2 is a diagram illustrating the connection between the electrostatic chuck 21 and the power supply 40 in the substrate mounting table 20, which is an example of the substrate mounting table according to this embodiment.

[0027] The electrode 21a of the electrostatic chuck 21 has a positive electrode 21ap and a negative electrode 21am. The positive electrode 21ap and the negative electrode 21am are each formed in a spiral shape from the center of the electrostatic chuck 21. The positive electrode 21ap has a connection terminal 21tp at one end. The negative electrode 21am has a connection terminal 21tm at one end.

[0028] Each of the connection terminals 21tp and 21tm has a contact plane so that the contact terminal 23t of the power supply connection member 23 comes into contact with and is connected to the connection terminal 21tp and 21tm.

[0029] The contact terminal 23t of the power supply connection member 23 is connected to the connection terminal 21tp and the connection terminal 21tm via, for example, a coil spring contact. The coil spring contact is made of a conductive material and has a diagonally wound spring shape. Electrical conduction is achieved by pressing the coil spring contact having a diagonally wound spring shape between the contact terminal 23t and the connection terminal 21tp and the connection terminal 21tm.

[0030] (Base plate 22) The base plate 22 mounts the electrostatic chuck 21. The base plate 22 also transfers heat from the heating / cooling unit 30 to the electrostatic chuck 21. A part of a gas connection member 24 for supplying a heat transfer gas is disposed on the base plate 22.

[0031] (power supply connection member 23) The power supply connection member 23 applies a DC voltage from the power supply 40 to the electrode 21 a of the electrostatic chuck 21 .

[0032] The power supply connection member 23 will now be described in detail. Fig. 3 is a perspective view of the power supply connection member 23 on the substrate mounting table 20, which is an example of a substrate mounting table according to this embodiment. Fig. 4 is a cross-sectional view of the power supply connection member 23 on the substrate mounting table 20, which is an example of a substrate mounting table according to this embodiment. Note that each of Figs. 3 and 4 shows a main part of the power supply connection member 23.

[0033] The power supply connection member 23 includes a contact portion 23a, a contact portion 23b, a coil spring contact 23c, and a pressing portion 23d. The contact portion 23a, the contact portion 23b, the coil spring contact 23c, and the pressing portion 23d are each formed of a conductive material, for example, a metal. Since the contact portion 23a, the contact portion 23b, the coil spring contact 23c, and the pressing portion 23d are each formed of a conductive material, the power supply connection member 23 is capable of conducting electricity. An end portion 23C1 of the power supply connection member 23 is connected to a power supply 40. The end portion 23C1 of the power supply connection member 23 is connected to an electrode 21a of the electrostatic chuck 21.

[0034] The contact portion 23a is connected to the electrostatic chuck 21 via the pressing portion 23d etc. The contact portion 23b is connected to the power supply 40 via the current introduction terminal 14 etc.

[0035] Coil spring contact 23c is provided between contact portion 23a and contact portion 23b. Coil spring contact 23c is made of a conductive material and has a diagonally wound spring shape. When coil spring contact 23c is pressed against contact portion 23a and contact portion 23b, electrical current flows between contact portion 23a and contact portion 23b.

[0036] The pressing portion 23d presses the contact portion 23a and brings the coil spring contact 23c into contact with the contact portion 23b. The pressing portion 23d includes a moving portion 23d1, a lower plate portion 23d2, an upper plate portion 23d3, and an elastic member 23d4.

[0037] The moving portion 23d1 is connected to the contact portion 23a with a screw or the like. The moving portion 23d1 is movable relative to the lower plate portion 23d2 and the upper plate portion 23d3. A force is applied to the moving portion 23d1 toward the contact portion 23b by the elastic member 23d4. When the moving portion 23d1 presses toward the contact portion 23b, the power connection member 23 can press the coil spring contact 23c against the contact portion 23b.

[0038] The lower plate portion 23d2 and the upper plate portion 23d3 are fixed to the substrate mounting table 20. In other words, the positions of the lower plate portion 23d2 and the upper plate portion 23d3 are fixed. The lower plate portion 23d2 and the upper plate portion 23d3 house the moving portion 23d1. The lower plate portion 23d2 and the upper plate portion 23d3 movably hold the moving portion 23d1. The lower plate portion 23d2 and the upper plate portion 23d3 hold the elastic member 23d4 so that the elastic member 23d4 can push the moving portion 23d1.

[0039] The elastic member 23d4 presses the moving part 23d1. The elastic member 23d4 is, for example, a helical spring. Alternatively, the elastic member 23d4 may be, for example, a leaf spring.

[0040] A high voltage is applied to the power supply connection member 23. Therefore, it is desirable to provide an insulating member surrounding the power supply connection member 23.

[0041] When the substrate mounting table 20 is placed on the heating / cooling unit 30 from above, the contact portion 23b connected to the chamber 10 and the contact portion 23a connected to the electrostatic chuck 21 are connected at a contact point CP1. When the contact portions 23a and 23b are connected at the contact point CP1, the elastic member 23d4 deforms, thereby maintaining the contact state between the contact portions 23a and 23b. The elastic member 23d4 also presses the coil spring contact 23c against the contact portion 23b.

[0042] The contact portion 23a is an example of a first contact portion, and the contact portion 23b is an example of a second contact portion.

[0043] (gas connection member 24) The gas connection member 24 supplies the heat transfer gas from the gas supply unit 50 to the electrostatic chuck 21 .

[0044] The gas connection member 24 will now be described in detail. Fig. 5 is a cross-sectional view of the gas connection member 24 in the substrate mounting stage 20, which is an example of a substrate mounting stage according to this embodiment. Note that Fig. 5 shows a main part of the gas connection member 24.

[0045] The gas connection member 24 includes a plate 24a, a pipe 24b, and a plate 24c that are provided on the base plate 22. The gas connection member 24 also includes an expandable portion 24d, an elastic member 24e, a gasket 24f, and a gas pipe 24g.

[0046] The plate 24a is inserted from above into the base plate 22. The plate 24a causes the heat transfer gas flowing from the pipe 24b to flow into the through-holes 21h in the electrostatic chuck 21.

[0047] The pipe 24b connects the plate 24a and the plate 24c. The pipe 24b allows the heat transfer gas to flow from the plate 24c to the plate 24a. The pipe 24b is inserted into the base plate 22 from above.

[0048] Plate 24c is inserted into base plate 22 from above. Plate 24c penetrates base plate 22. Plate 24c discharges heat transfer gas flowing from lower expansion section 24d laterally. Plate 24c directs the heat transfer gas to pipe 24b.

[0049] The expandable portion 24d has a heat transfer gas flowing therethrough. The expandable portion 24d also expands and contracts in the vertical direction. In other words, the expandable portion 24d can expand and contract in the vertical direction. The expandable portion 24d has a flange 24d1, a bellows 24d2, and a flange 24d3. The flange 24d1 is connected to the plate 24c. The flange 24d3 is connected to the gas pipe 24g. The heat transfer gas flows through the bellows 24d2. The bellows 24d2 also expands and contracts in the vertical direction.

[0050] The elastic member 24e is provided between the flange 24d1 and the flange 24d3. The elastic member 24e presses the flange 24d1 and the flange 24d3 in directions away from each other.

[0051] The gasket 24f ensures airtightness between the flange 24d3 and the flange of the gas pipe 24g. The gasket 24f is made of, for example, carbon.

[0052] The gas pipe 24g is connected to a flow path 15 provided in the vertical wall 10d of the chamber 10. The flow path 15 is formed along the vertical wall 10d. The flow path 15 is also connected to a gas supply unit 50 from the side of the vertical wall 10d.

[0053] When the substrate mounting table 20 is placed on the heating / cooling unit 30 from above, the flange of the gas pipe 24g connected to the chamber 10 and the flange 24d3 of the expandable portion 24d connected to the plate 24c provided on the base plate 22 are connected at a contact point CP2. When the flange 24d3 of the expandable portion 24d and the flange of the gas pipe 24g are connected at the contact point CP2, the expandable portion 24d deforms, thereby maintaining contact between the flange 24d3 of the expandable portion 24d and the flange of the gas pipe 24g. In addition, the elastic member 24e presses the flange 24d3 of the expandable portion 24d against the flange of the gas pipe 24g.

[0054] [Heating and cooling section 30] The heating and cooling unit 30 heats or cools the substrate mounting table 20. The heating and cooling unit 30 mounts the base plate 22 of the substrate mounting table 20. The heating and cooling unit 30 heats or cools the base plate 22. The heating and cooling unit 30 heats or cools the base plate 22, thereby heating or cooling the electrostatic chuck 21. The heating or cooling of the electrostatic chuck 21 heats or cools the substrate W.

[0055] The heating and cooling unit 30 includes, for example, a heat transfer heater for heating, and also includes, for example, a refrigerator using a GM (Gifford-Mahon) cycle for cooling.

[0056] [Power 40] The power supply 40 supplies a high DC voltage to the electrode 21 a of the electrostatic chuck 21 .

[0057] [Gas supply unit 50] The gas supply unit 50 supplies the temperature adjustment device 1 with a heat transfer gas to be supplied between the electrostatic chuck 21 and the substrate W. The heat transfer gas is, for example, helium gas or argon gas.

[0058] The substrate mounting table according to this embodiment allows for a space-saving structure for supplying power to the electrostatic chuck. In the substrate mounting table according to this embodiment, the power connection member includes a coil spring contact provided between the first contact portion and the second contact portion, so that wiring to the electrostatic chuck can be routed by moving the electrostatic chuck from above. According to the substrate mounting table according to this embodiment, wiring to the electrostatic chuck can be routed by moving the electrostatic chuck from above, so that the electrostatic chuck can be installed in a chamber that is approximately the same size as the electrostatic chuck when viewed from above.

[0059] For example, when wiring to an electrostatic chuck is screwed from the side, a working space is required on the side, and providing the working space requires the chamber to be made larger by that amount.

[0060] The substrate mounting table according to this embodiment allows the electrostatic chuck to be installed in a chamber having a size substantially equal to that of the electrostatic chuck when viewed from above, thereby reducing the space required for supplying power to the electrostatic chuck.

[0061] Furthermore, in the substrate mounting table according to this embodiment, the gas connection member is provided with a bellows, so that the heat transfer gas can be piped by moving the electrostatic chuck from above.

[0062] The substrate mounting table according to this embodiment can be used in various substrate processing apparatuses, including, for example, a CVD apparatus, an ALD apparatus, a PVD (Physical Vapor Deposition) apparatus, and the like, in addition to the temperature control apparatuses given above as examples of the substrate processing apparatus.

[0063] The substrate support according to the present embodiment disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments can be modified and improved in various ways without departing from the spirit and scope of the appended claims. The features described in the above-described embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent. [Explanation of symbols]

[0064] 1 Temperature control device 10 Chambers 10a side wall 10b Upper wall 10c bottom wall 10c1 side wall 10d vertical wall 10S step 14 Current introduction terminal 15 Flow path 20 Board mounting table 20S Placement surface 21 Electrostatic chuck 21a electrode 21am Negative electrode 21ap Positive electrode 21h through hole 22 Base Plate 23 Power supply connection parts 23a Contact part 23b Contact part 23c coil spring contact 23d Pressing part 23d1 Moving part 23d2 Lower plate part 23d3 Upper plate 23d4 Elastic members 24 Gas connection parts 24a, 24c plates 24b pipe 24d Telescopic part 24d1, 24d3 flange 24d2 Bellows 24e Elastic member 24g gas pipe 30 Heating / cooling section 40 Power supply 50 Gas supply unit W substrate

Claims

1. an electrostatic chuck; a power supply connection member that connects a power supply and the electrostatic chuck, the power supply connection member including: a first contact portion connected to the electrostatic chuck; a second contact portion connected to the power supply; a coil spring contact provided between the first contact portion and the second contact portion; and an elastic member that presses the coil spring contact toward the second contact portion; Equipped with Board mounting table.

2. The power supply connection member is an upper plate portion and a lower plate portion that house the elastic member and whose positions are fixed; a moving portion provided movably relative to the upper plate portion and the lower plate portion, connected to the first contact portion, and pushed by the elastic member; Equipped with The substrate mounting table according to claim 1 .

3. the upper plate portion, the lower plate portion, the moving portion, and the elastic member are formed of a conductive material; The substrate mounting table according to claim 2 .

4. the electrostatic chuck has a through-hole for introducing a heat transfer gas to a mounting surface; a gas connection member that allows the heat transfer gas to flow from a gas supply unit to the through hole; The gas connection member has an expandable portion that can expand and contract in the vertical direction. The substrate mounting table according to claim 1 .

5. The expansion / contraction section includes a bellows through which the heat transfer gas flows. The substrate mounting table according to claim 4 .

6. The electrostatic chuck is mounted on a base plate, The gas connection member is provided on the base plate. The substrate mounting table according to claim 4 .

7. A substrate mounting table according to any one of claims 1 to 6, Substrate processing equipment.

8. further comprising a chamber; The chamber has a step on the bottom side, a current introduction terminal connected to the power supply connection member is provided on a side wall of the step; The substrate processing apparatus according to claim 7 .

9. A substrate mounting table according to any one of claims 4 to 6, Substrate processing equipment.

10. further comprising a chamber; The chamber has a step on the bottom side, a flow path formed along a vertical wall of the step, through which the heat transfer gas flows; The substrate processing apparatus according to claim 9 .

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