Heat storage device

Abstract

To provide a heat storage device which can improve thermal storage efficiency.SOLUTION: A heat storage device includes a ceramic part and a latent heat storage part provided inside the ceramic part, the ceramic part including a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface, with a first groove being formed in the third surface and connected to the first surface and the second surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a heat storage device. [Background technology]

[0002] A heat storage device using a latent heat storage material has been proposed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-048393 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there has been an increasing demand for improved thermal storage efficiency.

[0005] An object of the present disclosure is to provide a heat storage device that can improve heat storage efficiency. [Means for solving the problem]

[0006] According to one embodiment of the present disclosure, there is provided a heat storage device having a ceramic part and a latent heat storage medium provided within the ceramic part, wherein the ceramic part has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface, and a first groove connecting the first surface and the second surface is formed on the third surface. [Effects of the Invention]

[0007] According to the disclosed technology, it is possible to improve the heat storage efficiency. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a diagram illustrating a heat storage device according to a first embodiment. [Figure 2]1 is a cross-sectional view illustrating a composite heat storage device having a plurality of heat storage devices according to a first embodiment. [Figure 3] FIG. 10 is a perspective view illustrating a heat storage device according to a second embodiment. [Figure 4] FIG. 10 is a perspective view illustrating a heat storage device according to a third embodiment. [Figure 5] FIG. 10 is a cross-sectional view illustrating a composite heat storage device having a plurality of heat storage devices according to a third embodiment. [Figure 6] FIG. 10 is a perspective view illustrating a heat storage device according to a fourth embodiment. [Figure 7] FIG. 10 is a diagram illustrating a heat storage device according to a fifth embodiment. [Figure 8] FIG. 10 is a diagram illustrating a heat storage device according to a sixth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant explanations may be omitted.

[0010] (First embodiment) First, a first embodiment will be described. The first embodiment relates to a heat storage device. FIG. 1 is a diagram illustrating a heat storage device according to the first embodiment. FIG. 1(a) is a perspective view, FIG. 1(b) is a top view, and FIG. 1(c) is a cross-sectional view. FIG. 1(c) corresponds to a cross-sectional view taken along line Ic-Ic in FIG. 1(b).

[0011] As shown in FIG. 1 , the heat storage device 1 according to the first embodiment includes a ceramic portion 10, a latent heat storage material 21, and an electric heater 41. The ceramic portion 10 has a plurality of closed spaces 18 formed therein. The ceramic portion 10 is, for example, integrally configured. For example, the ceramic portion 10 does not have any joints connecting the closed spaces 18. The latent heat storage material 21 is provided within the closed spaces 18. In other words, the latent heat storage material 21 is sealed within the ceramic portion 10. It can also be said that the latent heat storage material 21 is airtightly covered by the ceramic portion 10, which is a continuous body. The ceramic portion 10 has the function of preventing leakage of the molten latent heat storage material 21. The latent heat storage material 21 has a columnar shape, such as a cylindrical shape. A latent heat storage material 21 is provided within each of the closed spaces 18. That is, a plurality of latent heat storage materials 21 are provided within the ceramic portion 10. The plurality of latent heat storage materials 21 are arranged with their long axes parallel to one another. As shown in FIG. 1(b), the plurality of latent heat storage materials 21 are densely arranged in, for example, a regular triangular lattice pattern.

[0012] The latent heat storage material 21 is made of, for example, metal and contains, for example, aluminum (Al), copper (Cu), silicon (Si), boron (B), or any combination thereof.

[0013] The main component of the latent heat storage material 21 may be aluminum. The latent heat storage material 21 may contain aluminum at a ratio of 99% by mass or more. In other words, the latent heat storage material 21 may be made of aluminum with a purity of 99% by mass or more.

[0014] The main component of the latent heat storage material 21 may be copper. The latent heat storage material 21 may contain copper at a ratio of 99% by mass or more. In other words, the latent heat storage material 21 may be made of copper with a purity of 99% by mass or more.

[0015] The main component of the latent heat storage material 21 may be silicon. The latent heat storage material 21 may contain silicon at a rate of 50% by mass or more. The latent heat storage material 21 may be made of silicon with a purity of 50% by mass or more. Preferably, the latent heat storage material 21 contains silicon at a rate of 99% by mass or more and is made of silicon at a rate of 99% by mass or more. The latent heat storage material 21 may contain boron (B), aluminum (Al), bismuth (Bi), antimony (Sb), gallium (Ga), copper (Cu), iron (Fe), titanium (Ti), yttrium (Y), indium (In), zinc (Zn), tin (Sn), or any combination thereof, in a total rate of less than 50% by mass.

[0016] The main component of the latent heat storage material 21 may be boron. The latent heat storage material 21 may contain boron at a ratio of 50% by mass or more. The latent heat storage material 21 may be made of boron with a purity of 50% by mass or more. Preferably, the latent heat storage material 21 contains 80% by mass or more of boron and is made up of 80% by mass or more of boron. More preferably, the latent heat storage material 21 contains 99% by mass or more of boron and is made up of 99% by mass or more of boron. The latent heat storage material 21 may contain silicon (Si), aluminum (Al), iron (Fe), copper (Cu), cobalt (Co), or any combination thereof in a total ratio of less than 20% by mass.

[0017] When the main component of the latent heat storage material 21 is aluminum, the ceramic portion 10 contains, for example, 96 mass % or more of aluminum oxide (Al2O3). In other words, the ceramic portion 10 may be made of aluminum oxide with a purity of 96 mass % or more.

[0018] When the main component of the latent heat storage material 21 is copper, the ceramic portion 10 contains, for example, 90% by mass or more of aluminum oxide, 90% by mass or more of mullite (3Al2O3·2SiO2), 95% by mass or more of aluminum nitride (AlN), or 95% by mass or more of a mixture of aluminum nitride and boron nitride (BN). The ceramic portion 10 may further contain a sintering aid. Examples of sintering aids include silicon, magnesium, and calcium. The particle size of the ceramic grains contained in the ceramic portion 10 is preferably 1 μm or less, and more preferably 0.3 μm or less.

[0019] When the main component of the latent heat storage medium 21 is silicon, the ceramic portion 10 contains, for example, mullite, aluminum oxide (Al2O3), cordierite (2MgO·2Al2O3·5SiO2), anorthite (CaAl2Si2O8), sillimanite (Al2SiO5), silicon nitride (Si3N4), boron nitride, aluminum nitride, a composite material of aluminum nitride and boron nitride (composite ceramic), silicon carbide (SiC), tungsten carbide (WC), boron carbide (B4C), molybdenum disilicide (MoSi2), tungsten disilicide (WSi2), or any combination thereof. The ceramic portion 10 may be composed of mullite, aluminum oxide, cordierite, anorthite, sillimanite, silicon nitride, boron nitride, aluminum nitride, a composite of aluminum nitride and boron nitride, silicon carbide, tungsten carbide, boron carbide, molybdenum disilicide, or tungsten disilicide, or any combination thereof.

[0020] When the main component of the latent heat storage medium 21 is boron, the ceramic portion 10 may contain boron nitride (BN), boron carbide (BC), aluminum nitride (AlN), a composite material of aluminum nitride and boron nitride, silicon nitride (SiN), silicon carbide (SiC), or any combination thereof. The ceramic portion 10 may be made of boron nitride, boron carbide, aluminum nitride, a composite material of aluminum nitride and boron nitride (composite ceramic), silicon nitride, silicon carbide, or any combination thereof.

[0021] When the main component of the latent heat storage medium 21 is boron, the ceramic portion 10 may contain a boride. The ceramic portion 10 may be made of a boride. The boride may be, for example, titanium boride (TiB2), zirconium boride (ZrB2), hafnium boride (HfB2), vanadium boride (VB2), niobium boride (NbB2), tantalum boride (TaB2), lanthanum boride (LaB6), or any combination thereof.

[0022] The electric heater 41 is provided within the ceramic portion 10. The electric heater 41 is provided between the surface of the ceramic portion 10 and the surface of the latent heat storage body 21. The electric heater 41 generates Joule heat when electricity is applied. The electric heater 41 has a substantially cylindrical shape around each latent heat storage body 21. The electric heater 41 can heat the latent heat storage body 21. To reduce heat loss, it is preferable that the distance between the electric heater 41 and the latent heat storage body 21 is small. The electric heater 41 contains, for example, tungsten, molybdenum, or both. The electric heater 41 may contain a mixture of tungsten and aluminum oxide, or a mixture of molybdenum and aluminum oxide. In this case, the electric heater 41 may further contain one or more of silicon oxide, magnesium oxide, calcium carbonate, etc. The thermal storage device 1 may have multiple electric heaters 41.

[0023] The ceramic portion 10 has a substantially hexahedral shape with faces 11, 12, 13, 14, 15, and 16. Faces 11 and 12 are parallel to each other, faces 13 and 14 are parallel to each other, and faces 15 and 16 are parallel to each other. That is, face 12 is the face opposite face 11, face 14 is the face opposite face 13, and face 16 is the face opposite face 15. Furthermore, faces 13, 14, 15, and 16 connect face 11 and face 12. The ceramic portion 10 may have a rectangular parallelepiped shape or a cubic shape. For example, the long axis of the latent heat storage material 21 is perpendicular to faces 11 and 12. Faces 11, 12, 13, 14, 15, and 16 are examples of a first face, a second face, a third face, a fourth face, a fifth face, and a sixth face, respectively.

[0024] A groove 31 is formed on the surface 13. A plurality of grooves 31 may be formed on the surface 13. The groove 31 is connected to the surfaces 11 and 12, and the surfaces 11 and 12 have recesses associated with the groove 31. The groove 31 may be formed linearly. The groove 31 is an example of a first groove.

[0025] Two terminals of the electric heating element 41 are provided on the surface 12. Pins to which lead wires are connected are attached to the terminals, and power is supplied to the electric heating element 41 from the outside via the lead wires.

[0026] When storing heat in the heat storage device 1, a heat medium such as air is supplied toward the heat storage device 1 substantially perpendicular to the surfaces 11 and 12. As a result, the heat medium contacts not only the surface 11 or 12 but also the surfaces 13, 14, 15, and 16, and the heat of the heat medium is transferred to the latent heat storage material 21 via the ceramic portion 10. When the latent heat storage material 21 is heated to a temperature higher than the solid-liquid phase change temperature, the latent heat associated with the phase change is stored in the latent heat storage material 21. In this embodiment, the grooves 31 are formed in the surface 13, and therefore the area of ​​the ceramic portion 10 that contacts the heat medium is larger than when the grooves 31 are not formed. This improves the heat storage efficiency.

[0027] Furthermore, instead of using a heat medium, electric power may also be used. In this case, pins are attached to the terminals of the electric heater 41, and electric power is supplied to the electric heater 41 from lead wires, causing the electric heater 41 to generate heat. The heat generated by the electric heater 41 is stored in the latent heat storage material 21. In this way, electric power applied from the outside can be converted into heat and stored in the latent heat storage material 21. For example, by generating heat from the electric heater 41 using surplus electric power, the surplus electric power can be stored as heat. The energy stored in the latent heat storage material 21 can then be supplied to factories, offices, commercial buildings, etc. as heat, steam (pressure), or electric power (such as turbine power generation using steam pressure).

[0028] Grooves 31 may also be formed in one, two or three of the surfaces 14, 15 and 16.

[0029] A plurality of heat storage devices 1 may be arranged vertically or horizontally. Fig. 2 is a cross-sectional view illustrating a composite heat storage device having a plurality of heat storage devices according to the first embodiment. Fig. 2 shows a cross section of the heat storage device 1 taken along line II-II in Fig. 1(b).

[0030] The composite heat storage device 61 shown in Fig. 2 has a plurality of heat storage devices 1. The plurality of heat storage devices 1 are arranged so that one surface 13 faces the other surface 14, and the plurality of heat storage devices 1 are arranged so that one surface 11 faces the other surface 12. Furthermore, the plurality of heat storage devices 1 may be arranged so that one surface 15 faces the other surface 16. Furthermore, a groove 31 connects the heat storage devices 1 whose surfaces 11 and 12 face each other.

[0031] In the composite heat storage device 61, when the heat medium is supplied toward the heat storage device 1 substantially perpendicular to the surfaces 11 and 12, the heat medium flows inside the grooves 31 and can come into contact with multiple heat storage devices 1. Therefore, even if the heat contained in the heat medium cannot be fully transferred to one heat storage device 1, it can be transferred to other heat storage devices 1.

[0032] (Second embodiment) A second embodiment will be described. The second embodiment differs from the first embodiment mainly in the arrangement of the grooves. Fig. 3 is a perspective view illustrating the heat storage device according to the second embodiment.

[0033] As shown in Fig. 3, in the heat storage device 2 according to the second embodiment, a groove 32 is formed on the surface 11. A plurality of grooves 32 may be formed on the surface 11. The groove 32 is connected to the surfaces 15 and 16, and the surfaces 15 and 16 have recesses associated with the groove 32. The groove 32 may be formed linearly. The groove 32 is an example of a second groove.

[0034] Other configurations of the second embodiment are similar to those of the first embodiment.

[0035] The second embodiment can also achieve the same effects as the first embodiment. Furthermore, since the grooves 32 are formed on the surface 11, even when the heat medium is supplied toward the heat storage device 1 substantially perpendicular to the surfaces 15 and 16, the area of ​​the ceramic part 10 that comes into contact with the heat medium can be increased.

[0036] Grooves 32 may also be formed in surface 12 .

[0037] Similar to the heat storage device 1, a plurality of heat storage devices 2 may be arranged vertically and horizontally. In this case, groove 31 connects the heat storage devices 3 whose surfaces 11 and 12 face each other, and groove 32 connects the heat storage devices 3 whose surfaces 15 and 16 face each other.

[0038] (Third embodiment) A third embodiment will be described. The third embodiment differs from the second embodiment mainly in the arrangement of the grooves. Fig. 4 is a perspective view illustrating the heat storage device according to the third embodiment.

[0039] As shown in Fig. 4, in the heat storage device 3 according to the third embodiment, a groove 33 is formed on the surface 11. A plurality of grooves 33 may be formed on the surface 11. The groove 33 is connected to the surfaces 13 and 14, and the surfaces 13 and 14 have recesses associated with the groove 33. The groove 33 may be formed linearly. The groove 31 and the groove 33 may be connected. The groove 33 is an example of a second groove.

[0040] Other configurations of the third embodiment are similar to those of the second embodiment.

[0041] The third embodiment can also provide the same effects as the second embodiment.

[0042] Grooves 33 may also be formed in surface 12 .

[0043] A plurality of heat storage devices 3 may be arranged vertically and horizontally, similarly to the heat storage device 1. Fig. 5 is a cross-sectional view illustrating a composite heat storage device having a plurality of heat storage devices according to the third embodiment.

[0044] The composite heat storage device 63 shown in Fig. 5 has a plurality of heat storage devices 3. The plurality of heat storage devices 3 are arranged so that one surface 13 faces the other surface 14, and the plurality of heat storage devices 3 are arranged so that one surface 11 faces the other surface 12. Furthermore, the plurality of heat storage devices 3 may be arranged so that one surface 15 faces the other surface 16. Furthermore, a groove 31 connects the heat storage devices 3 whose surfaces 11 and 12 face each other, and a groove 33 connects the heat storage devices 3 whose surfaces 13 and 14 face each other.

[0045] In the composite heat storage device 63, similarly to the composite heat storage device 61, when the heat medium is supplied toward the heat storage device 1 substantially perpendicular to the surfaces 11 and 12, the heat medium flows inside the grooves 31 and can come into contact with a plurality of heat storage devices 3. Furthermore, when the heat medium is supplied toward the heat storage device 1 substantially perpendicular to the surfaces 13 and 14, the heat medium flows inside the grooves 33 and can come into contact with a plurality of heat storage devices 3. Therefore, even if the heat contained in the heat medium cannot be fully transferred to one heat storage device 3, it can be transferred to another heat storage device 3.

[0046] (Fourth embodiment) A fourth embodiment will be described. The fourth embodiment differs from the second embodiment mainly in the arrangement of the grooves. Fig. 6 is a perspective view illustrating a heat storage device according to the fourth embodiment.

[0047] As shown in FIG. 6 , in the heat storage device 4 according to the fourth embodiment, grooves 32 and 33 are formed on the surface 11. A plurality of grooves 32 and 33 may be formed on the surface 11. On the other hand, no groove 31 is formed on the surface 13. In this embodiment, the groove 32 is an example of a first groove, the groove 33 is an example of a third groove, the surface 15 is an example of a first surface, the surface 16 is an example of a second surface, the surface 11 is an example of a third surface, the surface 13 is an example of a fifth surface, and the surface 14 is an example of a sixth surface. From another perspective, the groove 33 is an example of a first groove, the groove 32 is an example of a third groove, the surface 13 is an example of a first surface, the surface 14 is an example of a second surface, the surface 11 is an example of a third surface, the surface 15 is an example of a fifth surface, and the surface 16 is an example of a sixth surface.

[0048] Other configurations of the fourth embodiment are similar to those of the second embodiment.

[0049] When storing heat in the heat storage device 4, the heat medium is supplied toward the heat storage device 4 substantially perpendicular to the surfaces 13 and 14, or substantially perpendicular to the surfaces 15 and 16. As a result, the heat medium comes into contact with not only the surfaces 13, 14, 15, or 16, but also at least the surfaces 11 and 12, and the heat of the heat medium is transferred to the latent heat storage material 21 via the ceramic part 10. In addition, in this embodiment, the groove 32 or 33 is formed in the surface 11, and therefore the area of ​​the ceramic part 10 that comes into contact with the heat medium is larger than when the grooves 32 and 33 are not formed. Therefore, the heat storage efficiency can be improved.

[0050] (Fifth embodiment) A fifth embodiment will be described. The fifth embodiment differs from the first embodiment mainly in that a metal layer is provided. FIG. 7 is a diagram illustrating a heat storage device according to the fifth embodiment. FIG. 7(a) is a perspective view, FIG. 7(b) is a top view, and FIG. 7(c) is a cross-sectional view. FIG. 7(c) corresponds to a cross-sectional view taken along line VIIc-VIIc in FIG. 7(b).

[0051] As shown in Fig. 7, the heat storage device 5 according to the fifth embodiment has a metal layer 51. A plurality of grooves 31 are provided on the surface 13, and the metal layer 51 is provided in the grooves 31. The metal layer 51 is, for example, a copper (Cu) layer. As long as the metal layer 51 is provided in the grooves 31, it may cover other parts of the surface 13.

[0052] One metal layer 51 is electrically connected to one end of the electric heating element 41 , and the other metal layer 51 is electrically connected to the other end of the electric heating element 41 .

[0053] Other configurations of the fifth embodiment are similar to those of the first embodiment.

[0054] The fifth embodiment can also achieve the same effects as the first embodiment. Furthermore, since the metal layer 51 is provided in the groove 31, the thermal resistance between the heat medium and the ceramic portion 10 can be reduced, and the heat storage efficiency can be further improved.

[0055] Furthermore, power can be supplied to the electric heating element 41 from the outside via the metal layer 51. For example, power can be supplied to the electric heating element 41 by bringing a power supply terminal connected to an external power source into contact with the metal layer 51. The metal layer 51 is less susceptible to the thermal expansion and contraction of the heat storage device 1 than the terminals provided on the surface 12 of the heat storage device 1, and therefore the heat storage device 5 can achieve better long-term stability than the heat storage device 1.

[0056] It is not necessary for the electric heater 41 to be connected to the metal layer 51, and the terminals of the electric heater 41 may be provided on the surface 12, as in the first embodiment.

[0057] (Sixth embodiment) A sixth embodiment will be described. The sixth embodiment differs from the first embodiment mainly in the shape and arrangement of the latent heat storage material and the electric heating material. Fig. 8 is a diagram illustrating a heat storage device according to the sixth embodiment. Fig. 8(a) is a top view, and Fig. 8(b) is a cross-sectional view. Fig. 8(b) corresponds to a cross-sectional view taken along line VIIIb-VIIIb in Fig. 8(a).

[0058] As shown in FIG. 8, the heat storage device 6 according to the sixth embodiment has a latent heat storage material 22 instead of the latent heat storage material 21, and has electric heaters 42 and 43 instead of the electric heater 41.

[0059] The latent heat storage material 22 has, for example, a plate-like shape with two main surfaces 22A and 22B. The main surfaces 22A and 22B are parallel to the surfaces 11 and 12. The main surface 22A is on the surface 11 side, and the main surface 22B is on the surface 12 side. In other words, the distance between the main surface 22A and the surface 11 is smaller than the distance between the main surface 22B and the surface 11. The latent heat storage material 22 has a substantially rectangular planar shape.

[0060] The heating element 42 is provided between the main surface 22A and the surface 11, and the heating element 43 is provided between the main surface 22B and the surface 12. For example, the heating elements 42 and 43 are arranged in a serpentine pattern in a plane parallel to the main surfaces 22A and 22B. In this manner, the latent heat storage material 22 is located between the heating elements 42 and 43. The heating element 42 is an example of a first heating element, and the heating element 43 is an example of a second heating element.

[0061] Other configurations of the sixth embodiment are similar to those of the first embodiment.

[0062] The sixth embodiment can also achieve the same effects as the first embodiment. Furthermore, if the size of the ceramic part 10 is the same, the volume of the latent heat storage material 22 can be easily made larger than the total volume of the latent heat storage material 21, thereby increasing the amount of stored heat.

[0063] In the sixth embodiment, the metal layer 51 may be provided in the groove 31 as in the fifth embodiment, and the electric heaters 42 and 43 may be electrically connected to the metal layer 51.

[0064] In addition, multiple latent heat storage bodies 22 may be arranged within the ceramic part 10 so that the main surfaces 22A and 22B face each other between adjacent latent heat storage bodies 22, and electric heating bodies similar to electric heating bodies 42 and 43 may be provided between adjacent latent heat storage bodies 22.

[0065] Although the preferred embodiments have been described in detail above, the present disclosure is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims. [Explanation of symbols]

[0066] 1, 2, 3, 4, 5, 6 Heat storage device 10 Ceramic section 11, 12, 13, 14, 15, 16 sides 21, 22 Latent heat storage material 22A, 22B main surface 31, 32, 33 groove 41, 42, 43 Electric heating element 51 Metal layer 61, 63 Composite heat storage device

Claims

1. Ceramic part and a latent heat storage material provided in the ceramic portion; and The ceramic portion is The first page and a second surface opposite the first surface; a third surface connecting the first surface and the second surface; and a first groove formed in the third surface and connecting to the first surface and the second surface;

2. The heat storage device according to claim 1 , further comprising a metal layer disposed within the first groove.

3. an electric heating element provided in the ceramic portion and configured to heat the latent heat storage element; The heat storage device according to claim 2 , wherein the metal layer is electrically connected to the electric heating element.

4. the ceramic portion has a fourth surface that connects the first surface and the second surface and is opposite to the third surface; The heat storage device according to claim 1 , wherein a second groove is formed in the first surface, the second groove being connected to the third surface and the fourth surface.

5. The heat storage device according to claim 4 , wherein the first groove and the second groove are connected to each other.

6. The ceramic portion is a fifth surface that connects the first surface and the second surface and is connected to the third surface; a sixth surface connecting the first surface and the second surface, connecting to the third surface, and located opposite the fifth surface; and The heat storage device according to claim 1 , wherein a third groove is formed in the third surface, the third groove being connected to the fifth surface and the sixth surface.

7. a first electric heating element and a second electric heating element provided in the ceramic portion and configured to heat the latent heat storage material; The heat storage device according to claim 1 , wherein the latent heat storage material is located between the first electric heating material and the second electric heating material.

8. The latent heat storage material has a plate-like shape with two main surfaces, The heat storage device according to claim 7 , wherein the first electric heating element and the second electric heating element are disposed on a plane parallel to the main surface.

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