Electronic component device

Abstract

To provide an electronic component device that, even when an electronic component having leads is mounted on a wiring member in an inclined state, can stabilize the connection between the leads and the wiring member and avoid contact with peripheral components.SOLUTION: An electronic component device comprises an electronic component having a plurality of leads, and a wiring member including a mounting surface on which the electronic component is mounted and having a plurality of conductive members and an insulating layer built therein in layers. The plurality of leads are connected to the plurality of conductive members, respectively through a plurality of lead insertion holes formed in the wiring member. A projection projecting from the mounting surface of the wiring member is provided on the mounting surface, and the electronic component is supported by the projection, with the plurality of leads being inserted into the plurality of insertion holes, respectively.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to electronic component devices. [Background technology]

[0002] In general, an electronic component device has an electronic component with multiple leads mounted on a wiring member, and the multiple leads of the electronic component are connected to multiple conductive members layered inside the wiring member. One such electronic component device is used in a filter circuit, in which multiple leads of a capacitor are positioned in the axial direction of the capacitor and connected to multiple bus bars with different potentials (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-524413 Summary of the Invention [Problem to be solved by the invention]

[0004] When an electronic component device, such as a capacitor having a plurality of leads, is mounted on a bus bar in the axial direction thereof, the leads may be inserted in an inclined state. In this case, the leads that protrude from the busbar may be longer or shorter, and leads that protrude too short may require less soldering, impairing mechanical strength and electrical reliability, while leads that protrude too long may come into contact with opposing components. Furthermore, tilting of the capacitor may cause contact with adjacent components in the direction of the tilt. Furthermore, when performing image inspection to determine whether or not a capacitor is mounted as required, if the capacitor is tilted, differences in shading on the inspection screen will occur, the focus will be shifted, and other factors will affect the image judgment, making it impossible to accurately detect whether or not a capacitor is mounted.

[0005] The present disclosure has been made to solve the above-mentioned problems, and aims to obtain an electronic component device that can stabilize the connection between the leads and the wiring member and avoid contact with surrounding components by suppressing tilt when an electronic component having multiple leads is mounted on a wiring member. [Means for solving the problem]

[0006] An electronic component device according to the present disclosure includes: The electronic component has a plurality of leads, and a wiring member including a mounting surface on which the electronic component is placed and having a plurality of conductive members and an insulating member layered therein, and the plurality of leads are connected to the plurality of conductive members via a plurality of lead insertion holes formed in the wiring member, The mounting surface of the wiring member is provided with a convex portion that protrudes from the mounting surface, and the electronic component is supported by the convex portion with multiple leads inserted into multiple lead insertion holes, respectively. [Effects of the Invention]

[0007] According to the present disclosure, by suppressing tilting when an electronic component having multiple leads is mounted on a wiring member, it is possible to obtain an electronic component device that stabilizes the connection between the leads and the wiring member and avoids contact with surrounding components. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is an exploded view showing a main part of an electronic component device according to a first embodiment. [Figure 2] 1 is a cross-sectional view showing a main part of an electronic component device according to a first embodiment. [Figure 3] 3 is a cross-sectional view of a main part of the electronic component device according to the first embodiment, showing a state in which the electronic component is tilted before a protrusion is provided thereon. FIG. [Figure 4] 3 is a cross-sectional view showing a main part of the electronic component device according to the first embodiment in a state where the electronic component is tilted after a protrusion is provided thereon. FIG. [Figure 5] FIG. 10 is a cross-sectional view showing a main part of an electronic component device according to a second embodiment. [Figure 6] FIG. 10 is a cross-sectional view showing a main part of an electronic component device according to a third embodiment. [Figure 7] FIG. 10 is a cross-sectional view showing a main part of an electronic component device according to a fourth embodiment. [Figure 8] FIG. 10 is a cross-sectional view showing a main part of an electronic component device according to a fifth embodiment. [Figure 9] FIG. 13 is a cross-sectional view showing a main part of an electronic component device according to a sixth embodiment. [Figure 10] FIG. 13 is an exploded view showing a main part of an electronic component device according to a seventh embodiment. [Figure 11] FIG. 13 is a cross-sectional view showing a main part of an electronic component device according to a seventh embodiment, viewed from an orthogonal direction. [Figure 12] 3 is a cross-sectional view showing a main part of the electronic component in the electronic component device according to the first embodiment when the electronic component is tilted, viewed from an orthogonal direction. FIG. [Figure 13] 13 is a cross-sectional view showing a main part of an electronic component device according to a seventh embodiment in a state where the electronic component is tilted. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment will be described with reference to the drawings. In each drawing, the same reference numerals indicate the same or corresponding parts. Furthermore, FIGS. 1 to 13 relate to one embodiment, and the present disclosure is not limited by these drawings. In comparison between the drawings, the size and scale of corresponding components are independent of each other. In this disclosure, unless otherwise specified, when the terms "axial direction," "lateral direction," and "vertical direction" are used, the "axial direction" refers to the direction perpendicular to the mounting surface on which electronic components are mounted, the "lateral direction" refers to the direction parallel to the mounting surface and crossing a line described below, and the "vertical direction" refers to the direction parallel to the mounting surface and extending a line described below. In other words, the "lateral direction" and the "vertical direction" are orthogonal to each other.

[0010] Embodiment 1 Fig. 1 is an exploded view showing the main parts of an electronic component device 1 according to embodiment 1, and Fig. 2 is a cross-sectional view showing the main parts of the electronic component device 1 according to embodiment 1. In Figs. 1 and 2, the electronic component device 1 includes an electronic component 5 having conductive leads 3 and 4 protruding from an electronic component body 2, and a wiring member 11 in which conductive members 8 and 9 are layered and integrated with an insulating member 10 that holds them, and the wiring member 11 includes a mounting surface 10a on which the electronic component 5 is disposed, and has lead insertion holes 6 and 7 formed therethrough. Furthermore, on mounting surface 10a of wiring member 11, protrusions 13 are provided that protrude vertically from mounting surface 10a and face electronic component 5, and electronic component 5 is supported by protrusions 13 with its leads 3 and 4 inserted into lead insertion holes 6 and 7, respectively. Furthermore, leads 3 and 4 of electronic component 5 are connected by connecting members 12 to conductive members 8 and 9, which have different potentials.

[0011] Here, leads 3 and 4 of electronic component 5 are thinner than electronic component body 2, and protrude from electronic component body 2 with a gap between them so that leads 3 and 4 do not come into contact with each other. The direction in which leads 3 and 4 protrude is the axial direction that is the central axis of lead insertion holes 6 and 7, i.e., the vertical direction from mounting surface 10a, but they may also protrude horizontally from mounting surface 10a. Depending on the required function, for example, a capacitor, transistor, coil, crystal oscillator, resistor, etc. may be used as the electronic component 5. Furthermore, for the leads 3 and 4, tin-plated wire or enameled wire, which is made of a conductive material such as copper or aluminum with good conductivity and coated with tin plating or enamel paint, may be used.

[0012] Conductive members 8 and 9 of wiring member 11 are set to different potentials, for example, one at a low potential and the other at a high potential, and are integrally formed between insulating member 10. Lead insertion holes 6 and 7 are formed to a size required to penetrate wiring member 11 on which electronic component 5 is placed and to insert leads 3 and 4, and the number of holes provided corresponds to the number of leads of electronic component 5. For example, if electronic component 5 has three leads, wiring member 11 requires three lead insertion holes. Electrical conductors with good electrical conductivity and high thermal conductivity, such as copper, aluminum, copper alloys, or aluminum alloys, are used for the conductive members 8 and 9. The insulating member 10 is formed using any resin material with insulating properties, such as polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), or polyamide (PA).

[0013] Furthermore, the conductive members 8 and 9 are sandwiched between the insulating member 10 and integrally formed, but the insulating member 10 on the side of the mounting surface 10a on which the electronic component 5 is arranged may be omitted. If insulating member 10 is provided on both the mounting surface 10a of the wiring member 11 and the bottom surface behind it, the insulation of the wiring member 11 is improved, and if insulating member 10 is provided only on the bottom surface to hold the conductive members 8 and 9, the amount of insulating member 10 used is reduced, resulting in cost reduction. The connecting member 12 is made of solder or brazing filler metal, which has good electrical conductivity and high thermal conductivity.

[0014] In addition, the convex portion 13 is provided on the mounting surface 10a of the wiring member 11, facing the electronic component 5 between the lead insertion holes 6 and 7, and has a rectangular shape extending horizontally across the straight line connecting the central axes of the lead insertion holes 6 and 7. The convex portion 13 is formed using an electrical conductor such as copper, aluminum, a copper alloy, or an aluminum alloy, which has good electrical conductivity and high thermal conductivity, or any insulating resin material, such as polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), or polyamide (PA). Although the protrusions 13 may be separate from the wiring member 11, if they are integrated with the wiring member 11, the number of parts in the electronic component device 1 can be reduced. Furthermore, since the protrusions 13 and the wiring member 11 can be molded at one time compared to when they are molded separately, costs can be reduced.

[0015] Next, the function of the protrusion 13 will be described. FIG. 3 is a cross-sectional view of the main part of the electronic component device 1 according to the first embodiment, showing a state in which the electronic component 5 is tilted before the protrusion 13 is provided. FIG. 4 is a cross-sectional view of the main part of the electronic component device 1 according to the first embodiment, showing a state in which the electronic component 5 is tilted after the protrusion 13 is provided. In FIG. 4, the protrusion 13 serves as a means for preventing the electronic component 5 from tilting. The width, length, and height dimensions of the rectangular shape and the diameters of the lead insertion holes 6 and 7 are determined so that the protrusion 13 supports the bottom surface of the electronic component body 2 and the side surfaces of the leads 3 or 4 before the side surfaces of the electronic component body 2, leads 3, or leads 4 come into contact with the end surfaces of the lead insertion holes 6 or 7 when the electronic component 5 is tilted. At this time, the leads 3 and 4 are inserted into the lead insertion holes 6 and 7, respectively.

[0016] Before the protrusion 13 is provided, as shown in Figure 3, when the electronic component 5 is tilted, the side of the electronic component body 2, lead 3, or lead 4 comes into contact with the end face of the lead insertion hole 6 or lead insertion hole 7, shortening the length that the lead 3 protrudes from the conductive member 8 and lengthening the length that the lead 4 protrudes from the conductive member 9, causing the lead 4 to protrude from the bottom surface 14 of the insulating member 10. In contrast, after providing the convex portion 13, as shown in Figure 4, when the electronic component 5 tilts, the bottom surface of the electronic component body 2, the side surface of the lead 3, or the side surface of the lead 4 contacts and is supported by the convex portion 13 before the side surface of the electronic component body 2, the lead 3, or the lead 4 contacts the end surface of the lead insertion hole 6 or the lead insertion hole 7, thereby preventing the electronic component 5 from tilting.

[0017] Therefore, also in embodiment 1, the length of lead 3 that protrudes from conductive member 8 is relatively short, and the length of lead 4 that protrudes from conductive member 9 is relatively long, but as is clear from a comparison between Figures 3 and 4, by providing protrusion 13, the length of lead 3 that protrudes from conductive member 8 is longer than when protrusion 13 is not present, and the length of lead 4 that protrudes from conductive member 9 is shorter than when protrusion 13 is not present, thereby balancing the lengths of lead 3 and lead 4. Although the case where the electronic component 5 has two leads has been described, the same effect can be obtained with an electronic component 5 having three or more leads.

[0018] According to the electronic component device 1 of the first embodiment, as a means for suppressing tilting when mounting the electronic component 5, rectangular convex portions 13 are provided between the lead insertion holes 6 and 7 on the mounting surface 10a to support the electronic component 5, so that the lengths of the leads 3 protruding from the conductive member 8 and the leads 4 protruding from the conductive member 9 can be balanced, and as a result, a sufficient amount of solder can be applied. This stabilizes the connection between the electronic component 5 and the wiring member 11, thereby improving the mechanical strength and electrical reliability of the electronic component device 1.

[0019] Furthermore, since lead 3 or lead 4 does not protrude from the bottom surface 14 of insulating member 10, contact with opposing components can be prevented, and since the range of tilt of electronic component 5 can be restricted in the vertical direction extending left and right from the straight line connecting the central axis of lead insertion hole 6 and the central axis of lead insertion hole 7, contact with adjacent components can also be prevented. This also means that the distance between the electronic component 5 and the surrounding components can be reduced in design, leading to a reduction in size and cost of the electronic component device 1. Furthermore, if necessary, when performing an image inspection to check whether or not an electronic component 5 is mounted, imaging problems such as differences in shading and focus deviation that occur on the inspection screen due to the tilt of the electronic component 5 can be suppressed, thereby improving the accuracy of the image inspection.

[0020] Embodiment 2 The second embodiment will be described with reference to the drawings, focusing on the differences from the first embodiment as a means for suppressing tilting when mounting the electronic component 5. Fig. 5 is a cross-sectional view showing the main part of the electronic component device 1 according to the second embodiment, in which the shape of the protrusion 13a is changed from the configuration in the first embodiment.

[0021] In Figure 5, the convex portion 13a is located on the mounting surface 10a of the wiring member 11, facing the electronic component 5 between the lead insertion holes 6 and 7, and has a trapezoidal shape extending horizontally across the straight line connecting the central axes of the lead insertion holes 6 and 7. The trapezoidal shape of the convex portion 13a has a taper 15 formed from the mounting surface 10a toward the electronic component 5 in the vertical direction, and the width, length, and height dimensions of the trapezoidal shape, the angle of the taper 15, and the diameters of the lead insertion holes 6 and 7 are determined so that when the electronic component 5 is tilted, the bottom surface of the electronic component body 2 and the side of the lead 3 or lead 4 are supported before the side of the electronic component body 2, lead 3, or lead 4 comes into contact with the end face of the lead insertion hole 6 or lead insertion hole 7.

[0022] The trapezoidal shape of the protrusion 13a may be provided with a gradient as needed instead of the symmetrical taper 15. Although the protrusion 13a has a trapezoidal shape, its material and structure are basically the same as those in the first embodiment, and it is formed using any resin material that is electrically conductive or insulating, and is molded as a separate member from the wiring member 11 or as an integral part of the wiring member 11. Here, the taper angle means the relative extent of the symmetrical taper of the trapezoidal shape, and the gradient means the inclination with respect to the plane perpendicular to the mounting surface 10a.

[0023] According to the electronic component device 1 of embodiment 2, as a means for suppressing tilting when mounting the electronic component 5, a trapezoidal convex portion 13a is provided between the lead insertion holes 6 and 7 on the mounting surface 10a to support the electronic component 5. Therefore, in addition to the same effect as in embodiment 1, when mounting the electronic component 5 on the wiring member 11, the lead 3 or lead 4 comes into contact with the trapezoidal taper 15, thereby improving the ease of insertion into the lead insertion hole 6 or lead insertion hole 7.

[0024] Embodiment 3 The third embodiment will be described with reference to the drawings, focusing on the differences from the first embodiment as a means for suppressing tilting when mounting the electronic component 5. Fig. 6 is a cross-sectional view showing the main part of the electronic component device 1 according to the third embodiment, in which the shape of the protrusion 13b is changed from the configuration in the first embodiment.

[0025] In Figure 6, the convex portion 13b is located on the mounting surface 10a of the wiring member 11, facing the electronic component 5 between the lead insertion holes 6 and 7, and has a trapezoidal shape extending horizontally across the straight line connecting the central axes of the lead insertion holes 6 and 7. Here, the trapezoidal shape of the protrusion 13b has two tapers 15a and 15b with different taper angles formed from the mounting surface 10a toward the electronic component 5 in the vertical direction, and Fig. 6 shows a case where the taper angle of the first taper 15a continuing from the mounting surface 10a is larger than the taper angle of the second taper 15b. The taper angles of the tapers 15a and 15b may be reversed.

[0026] Furthermore, the trapezoidal shape of the convex portion 13b has width, length and height dimensions, angles of the tapers 15a and 15b, and diameters of the lead insertion holes 6 and 7 determined so that when the electronic component 5 is tilted, the trapezoidal shape supports the bottom surface of the electronic component body 2 and the side surface of the lead 3 or 4 before the side surface of the electronic component body 2, lead 3 or 4 comes into contact with the end surface of the lead insertion hole 6 or 7. The trapezoidal shape of the protrusion 13b may be provided with a gradient as needed, instead of the symmetrical tapers 15a and 15b. Although the protrusion 13 has a trapezoidal shape, its material and structure are basically the same as those in the first embodiment, and it is formed using any resin material that is electrically conductive or insulating, and is molded as a separate member from the wiring member 11 or as an integral part of the wiring member 11.

[0027] 6, when the taper angle of first-step taper 15a is larger than the taper angle of second-step taper 15b, first-step taper 15a improves the insertability of leads 3 and 4, and second-step taper 15b contributes to improving the insulation that maintains the distance between electronic component 5 and wiring member 11. On the other hand, when the taper angle of first-step taper 15a is smaller than the taper angle of second-step taper 15b, first-step taper 15a contributes to improving the insulation that maintains the distance between electronic component 5 and wiring member 11, and second-step taper 15b improves the insertability of leads 3 and 4. Furthermore, when the leads 3 and 4 of the electronic component 5 are not straight but have a kink shape where they are bent partway, the kink-shaped portion is likely to come into contact with the side surface of the taper 15a or the taper 15b of the convex portion 13b and is unlikely to ride up onto the flat portion of the convex portion 13b, so that the tilt of the electronic component 5 can be more stably suppressed compared to the rectangular shape of the first embodiment.

[0028] According to the electronic component device 1 of embodiment 3, as a means for suppressing tilting when mounting the electronic component 5, a trapezoidal, two-step tapered convex portion 13b is provided between the lead insertion holes 6 and 7 on the mounting surface 10a, and is configured to support the electronic component 5. Therefore, in addition to the same effects as those of embodiments 1 and 2, the insertability of the leads 3 and 4 is improved, and the insulation that maintains the distance between the electronic component 5 and the wiring member 11 is improved.

[0029] Embodiment 4 The fourth embodiment will be described with reference to the drawings, focusing on the differences from the first embodiment as a means for suppressing tilting when mounting the electronic component 5. Fig. 7 is a cross-sectional view showing the main part of the electronic component device 1 according to the fourth embodiment, which is different from the configuration of the first embodiment in that a protrusion 16 and a protrusion 17 are provided in addition to the protrusion 13.

[0030] In Figure 7, the convex portion 13 is located on the mounting surface 10a of the wiring member 11, between the lead insertion holes 6 and 7, facing the electronic component 5, and has a rectangular shape extending horizontally across the straight line connecting the central axes of the lead insertion holes 6 and 7. Furthermore, protrusions 16 and 17 are arranged parallel to protrusion 13 in the direction in which lead insertion holes 6 and 7 are aligned, i.e., on the outside of the line extending to the left and right from the straight line connecting their respective central axes, and have a rectangular shape like protrusion 13, and are provided higher than protrusion 13 in the vertical direction from mounting surface 10a. The material and structure of the convex portions 16 and 17 are formed using any resin material that is electrically conductive or insulating, similar to the convex portion 13, and similar to the convex portion 13, they may be separate members from the wiring member 11 or may be integrated with the wiring member 11.

[0031] Next, the functions of protrusions 16 and 17 will be described. Their function is basically the same as that of protrusion 13, and the length and height dimensions of the rectangular shape and the diameters of lead insertion holes 6 and 7 are determined so that when electronic component 5 is tilted, the side surfaces of electronic component body 2, leads 3, or leads 4 will come into contact with and be supported by protrusion 16 or protrusion 17 before the side surfaces of electronic component body 2, leads 3, or leads 4 come into contact with the end faces of lead insertion holes 6 or 7.

[0032] According to the electronic component device 1 of embodiment 4, as a means for suppressing tilting when mounting the electronic component 5, a convex portion 13 is provided between the lead insertion holes 6 and 7 on the mounting surface 10a, and convex portions 16 and 17 are provided on the outside thereof, so as to support the electronic component 5. Therefore, in addition to the same effects as those of embodiment 1, the effect of supporting the electronic component 5 by the convex portions 16 and 17 is improved, and contact between the electronic component 5 and adjacent components can be actively prevented.

[0033] Embodiment 5 The fifth embodiment will be described with reference to the drawings, focusing on the differences from the fourth embodiment as a means for suppressing tilting when mounting the electronic component 5. Fig. 8 is a cross-sectional view showing the main part of the electronic component device 1 according to the fifth embodiment, in which the shape of the convex portion 13a and the shapes of the convex portions 16a and 17a are changed from the configuration in the fourth embodiment.

[0034] In Figure 8, the convex portion 13a is located on the mounting surface 10a of the wiring member 11, facing the electronic component 5, between the lead insertion holes 6 and 7, and has a trapezoidal shape extending horizontally across the straight line connecting the central axes of the lead insertion holes 6 and 7. The protrusions 16a and 17a are arranged parallel to the protrusion 13a on the outside of the direction in which the lead insertion holes 6 and 7 are aligned, i.e., the vertical direction extending left and right from the straight line connecting their respective center axes, and are provided higher than the height of the protrusion 13a in the vertical direction from the mounting surface 10a. Here, the shapes of the protrusions 16a and 17a are basically rectangular, and slopes 18 and 19 continuing from the mounting surface 10a are formed on parts of the surfaces facing the taper 15 of the protrusion 13a, respectively. The material and structure of the convex portions 13a, 16a, and 17a are the same as those of the first to fourth embodiments, and are formed using any resin material that is electrically conductive or insulating, and may be separate from the wiring member 11 or may be integrated with the wiring member 11.

[0035] Next, with regard to the function of convex portions 13a, 16a, and 17a, as in embodiments 1 to 4, the width, length, and height dimensions of convex portion 13a and the angle of taper 15, the length, height dimensions and angles of slope 18 and slope 19 of convex portions 16a and 17a, and the diameters of lead insertion holes 6 and 7 are determined so that when electronic component 5 is tilted, the side of electronic component body 2, lead 3, or lead 4 will come into contact with and be supported by convex portion 13a, 16a, or 17a before the side of electronic component body 2, lead 3, or lead 4 comes into contact with the end face of lead insertion hole 6 or lead insertion hole 7, as in embodiments 1 to 4.

[0036] According to the electronic component device 1 of embodiment 5, as a means for suppressing tilting when mounting the electronic component 5, a convex portion 13a having a taper 15 formed between the lead insertion holes 6 and 7 on the mounting surface 10a is provided with convex portions 16a and 17a having slopes 18 and 19 formed on the outside thereof, respectively, to support the electronic component 5. Therefore, in addition to the same effects as those of embodiments 1, 2, and 4, the slope 18 of the convex portion 16a and the slope 19 of the convex portion 17a can further improve the insertability of the leads 3 and 4.

[0037] Embodiment 6 The sixth embodiment will be described with reference to the drawings, focusing on the differences from the fifth embodiment as a means for suppressing tilting when mounting the electronic component 5. Fig. 9 is a cross-sectional view showing the main part of the electronic component device 1 according to the sixth embodiment, in which the shape of the convex portion 13b and the shapes of the convex portions 16b and 17b are changed from the configuration in the fifth embodiment.

[0038] In Figure 9, the convex portion 13b is provided on the mounting surface 10a of the wiring member 11, between the lead insertion holes 6 and 7, facing the electronic component 5, and has a trapezoidal shape extending horizontally across the straight line connecting the central axes of the lead insertion holes 6 and 7, and the trapezoidal shape has two-stage tapers 15a and 15b with different taper angles. Furthermore, the protrusions 16b and 17b are arranged parallel to the protrusion 13b on the outside of the direction in which the lead insertion holes 6 and 7 are aligned, i.e., the vertical direction extending left and right from the straight line connecting their respective center axes, and are provided higher than the height of the protrusion 13b in the vertical direction from the mounting surface 10a. Here, the shapes of the protrusions 16b and 17b are basically rectangular, and slopes 18a and 19a continuing from the mounting surface 10a are formed on parts of the surfaces facing the taper 15a of the protrusion 13b, respectively. The material and structure of convex portion 13b, convex portion 16b, and convex portion 17b are formed using any resin material that is electrically conductive or insulating, as in embodiments 1 to 5, and may be separate from wiring member 11 or may be integrated with wiring member 11.

[0039] Next, with regard to the functions of convex portions 13b, 16b, and 17b, as in embodiments 1 to 5, the width, length, and height dimensions of convex portion 13b and the angles of taper 15a and taper 15b, the length, height dimensions and angles of slope 18a and slope 19a of convex portions 16b and 17b, and the diameters of lead insertion holes 6 and 7 are determined so that when electronic component 5 is tilted, the bottom or side of electronic component body 2, or the side of lead 3 or lead 4 comes into contact with and is supported by convex portion 13b, 16b, and 17b before the side of electronic component body 2, lead 3, or lead 4 comes into contact with the end face of lead insertion hole 6 or lead insertion hole 7, as in embodiments 1 to 5.

[0040] According to the electronic component device 1 of embodiment 6, as a means for suppressing tilting when mounting the electronic component 5, a convex portion 13b having a two-step taper formed between the lead insertion hole 6 and the lead insertion hole 7 on the mounting surface 10a is provided, and convex portions 16b and 17b having slopes 18a and 19a formed on the outside thereof are provided to support the electronic component 5, thereby achieving the same effects as those of embodiments 1 to 5.

[0041] Embodiment 7 The seventh embodiment will be described with reference to the drawings, focusing on the differences from the first embodiment as a means for suppressing tilting when mounting the electronic component 5. FIG. 10 is an exploded view showing the main parts of the electronic component device 1 according to the seventh embodiment, and FIG. 11 is a cross-sectional view showing the main parts of the electronic component device 1 according to the seventh embodiment from an orthogonal direction. Here, the shape of the protrusion 13c is changed from the configuration in the first embodiment. The location of the wiring member 11 will be described with reference to the cross-sectional view of FIG. 2.

[0042] 10 and 11, the convex portion 13c is provided on the mounting surface 10a of the wiring member 11, facing the electronic component 5, between the lead insertion holes 6 and 7, and has a rectangular longitudinal portion extending horizontally across the straight line connecting the central axes of the lead insertion holes 6 and 7. Furthermore, at both ends of the longitudinal portion along which the protrusion 13c extends, two projections 20 are formed in a continuous manner in the vertical direction from the surface of the longitudinal portion facing the electronic component 5 so as to sandwich the electronic component 5 therebetween. The material and structure of the convex portion 13c and the protrusion 20 are formed using any resin material that is electrically conductive or insulating, as in embodiment 1, and may be separate from the wiring member 11 or may be integrated with the wiring member 11.

[0043] Next, the function of the protrusion 20 will be described. For comparison with the seventh embodiment, Fig. 12 is a cross-sectional view showing a main part of the electronic component device 1 according to the first embodiment when the electronic component 5 is tilted, as viewed from an orthogonal direction. Fig. 13 is a cross-sectional view showing a main part of the electronic component device 1 according to the seventh embodiment when the electronic component 5 is tilted. In Fig. 13, the protrusion 20 serves as a means for suppressing tilt of the electronic component 5. The width and height dimensions of the protrusion 20 and the diameters of the lead insertion holes 6 and 7 are determined so that when the electronic component 5 tilts in the lateral direction across the space between the lead insertion holes 6 and 7, the protrusion 20 supports the side surfaces of the electronic component body 2 and the leads 3 or 4 before the leads 3 or 4 come into contact with the end faces of the lead insertion holes 6 or 7.

[0044] In embodiment 1, sufficient measures can be taken to prevent tilt of electronic component 5 in the vertical direction in which lead insertion holes 6 and 7 are aligned. However, as shown in FIG. 12, if electronic component 5 tilts in the horizontal direction across the space between lead insertion holes 6 and 7, lead 3 or lead 4 may come into contact with the end face of lead insertion hole 6 or lead insertion hole 7. In contrast, in embodiment 7, as shown in Figure 13, when electronic component 5 tilts laterally, the side surfaces of electronic component body 2, lead 3, or lead 4 come into contact with and are supported by protrusion 20 before lead 3 or lead 4 contacts the end face of lead insertion hole 6 or lead insertion hole 7, thereby preventing lateral tilt of electronic component 5. As a result, the connection between the electronic component 5 and the wiring member 11 is stabilized, improving mechanical strength and electrical reliability, and the lateral tilt is shortened, thereby avoiding contact with adjacent components. Furthermore, if necessary, when performing image inspection, imaging defects can be suppressed, improving the accuracy of the image inspection.

[0045] According to the electronic component device 1 of embodiment 7, as a means for suppressing tilt when mounting the electronic component 5, a rectangular convex portion 13c is provided between the lead insertion holes 6 and 7 on the mounting surface 10a, and vertical protrusions 20 are provided on both ends of the convex portion 13c to support the electronic component 5. Therefore, the same effect as in embodiment 1 can be obtained not only for the vertical tilt of the electronic component 5 in the direction in which the lead insertion holes 6 and 7 are aligned, but also for the horizontal tilt that crosses between the lead insertion holes 6 and 7. In addition, when the height of the protrusion 20 is equal to or greater than the height of the electronic component 5 when the electronic component 5 is mounted, i.e., the height of the electronic component main body 2, in the vertical direction from the plane of the longitudinal part of the convex portion 13c, the distance until the electronic component main body 2 contacts the side of the protrusion 20 is shorter than the distance until it contacts the head of the protrusion 20, compared to when the height is less than the height of the electronic component main body 2, and this is effective in suppressing tilting of the electronic component 5.

[0046] While the present disclosure describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments are not limited to application to a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless variations not exemplified are conceivable within the scope of the technology disclosed in this specification, including, for example, cases where at least one component is modified, added, or omitted, and cases where at least one component is extracted and combined with components of another embodiment. Various aspects of the present disclosure are summarized below as appendices.

[0047] (Appendix 1) An electronic component device comprising: an electronic component having a plurality of leads; and a wiring member including a mounting surface on which the electronic component is placed, the wiring member having a plurality of conductive members and an insulating member layered therein; the plurality of leads being connected to the plurality of conductive members via a plurality of lead insertion holes formed in the wiring member, an electronic component device characterized in that the mounting surface of the wiring member is provided with a convex portion protruding from the mounting surface, and the electronic component is supported by the convex portion with the multiple leads inserted into the multiple lead insertion holes, respectively. (Appendix 2) 2. The electronic component device according to claim 1, wherein the protrusions facing the electronic component are provided between the plurality of lead insertion holes. (Appendix 3) 3. The electronic component device according to claim 1, wherein the protrusion has a rectangular shape extending in a direction crossing the lead insertion holes. (Appendix 4) 3. The electronic component device according to claim 1, wherein the protrusion has a trapezoidal shape extending in a direction crossing the lead insertion holes. (Appendix 5) The electronic component device described in Appendix 4, characterized in that the convex portion has a trapezoidal shape and is formed with two tapers with different taper angles from the mounting surface toward the electronic component in a vertical direction. (Appendix 6) 6. The electronic component device according to claim 5, wherein the convex portion is trapezoidal in shape, and the taper angle of a first taper continuing from the mounting surface is larger than the taper angle of a second taper. (Appendix 7) The electronic component device according to any one of Supplementary Note 1 to Supplementary Note 6, characterized in that a first convex portion is provided between a plurality of the lead insertion holes, and a second convex portion is provided on the outside in the direction in which the plurality of the lead insertion holes are arranged. (Appendix 8) The electronic component device described in Appendix 7, wherein the second convex portion is arranged in parallel with the first convex portion and is provided at a height higher than the height of the first convex portion in the vertical direction from the mounting surface. (Appendix 9) The electronic component device according to claim 7 or 8, wherein the first convex portion has a trapezoidal shape extending in a direction crossing between the plurality of lead insertion holes, and the second convex portion has a slope formed on a portion of the surface facing the first convex portion, the slope continuing from the mounting surface. (Appendix 10) The electronic component device according to any one of Supplementary Note 1 to Supplementary Note 9, characterized in that the convex portion facing the electronic component is provided between the plurality of lead insertion holes, and the convex portion has a longitudinal portion extending in a direction crossing between the plurality of lead insertion holes, and two protrusions formed at both ends of the longitudinal portion in a perpendicular direction from the longitudinal portion toward the electronic component. (Appendix 11) The electronic component device according to claim 10, wherein the electronic component is supported by the protrusions while being mounted between the two protrusions on the longitudinal portion. (Appendix 12) 12. The electronic component device according to claim 11, wherein the protrusion is formed at a height perpendicular to the longitudinal portion that is equal to or greater than the height of the electronic component when mounted. [Explanation of symbols]

[0048] 1: electronic component device, 2: electronic component body, 3, 4: lead, 5: electronic component, 6, 7: lead insertion hole, 8, 9: conductive member, 10: insulating member, 10a: mounting surface, 11: wiring member, 12: connecting member, 13, 13a, 13b, 13c, 16, 16a, 16b, 17, 17a, 17b: convex portion, 14: bottom surface, 15, 15a, 15b: taper, 18, 18a, 19, 19a: gradient, 20: protrusion.

Claims

1. An electronic component device comprising: an electronic component having a plurality of leads; and a wiring member including a mounting surface on which the electronic component is placed, the wiring member having a plurality of conductive members and an insulating member layered therein; the plurality of leads being connected to the plurality of conductive members via a plurality of lead insertion holes formed in the wiring member, an electronic component device characterized in that the mounting surface of the wiring member is provided with a convex portion protruding from the mounting surface, and the electronic component is supported by the convex portion with the multiple leads inserted into the multiple lead insertion holes, respectively.

2. 2. The electronic component device according to claim 1, wherein the protrusions facing the electronic component are provided between the plurality of lead insertion holes.

3. 3. The electronic component device according to claim 2, wherein the protrusion has a rectangular shape extending in a direction crossing the lead insertion holes.

4. 3. The electronic component device according to claim 2, wherein the protrusion has a trapezoidal shape extending in a direction crossing the lead insertion holes.

5. 5. The electronic component device according to claim 4, wherein the convex portion has a trapezoidal shape and is tapered in two steps with different taper angles from the mounting surface toward the electronic component in the vertical direction.

6. 6. The electronic component device according to claim 5, wherein the convex portion has a trapezoidal shape, and a taper angle of a first taper continuing from the mounting surface is larger than a taper angle of a second taper.

7. 2. The electronic component device according to claim 1, wherein a first convex portion is provided between the plurality of lead insertion holes, and a second convex portion is provided on the outside in the direction in which the plurality of lead insertion holes are arranged.

8. 8. The electronic component device according to claim 7, wherein the second convex portion is arranged in parallel with the first convex portion and is provided at a height higher than the height of the first convex portion in the direction perpendicular to the mounting surface.

9. 9. The electronic component device according to claim 8, wherein the first convex portion has a trapezoidal shape extending in a direction crossing between the plurality of lead insertion holes, and the second convex portion has a slope formed on a portion of a surface facing the first convex portion that continues from the mounting surface.

10. 2. The electronic component device according to claim 1, wherein the convex portion facing the electronic component is provided between the plurality of lead insertion holes, and the convex portion has a longitudinal portion extending in a direction crossing between the plurality of lead insertion holes and two protrusions formed at both ends of the longitudinal portion in a perpendicular direction from the longitudinal portion toward the electronic component.

11. 11. The electronic component device according to claim 10, wherein the electronic component is supported by the two protrusions in a state where the electronic component is mounted between the two protrusions on the longitudinal portion.

12. 12. The electronic component device according to claim 11, wherein the protrusion is formed to a height that is equal to or greater than the height of the electronic component mounted in the direction perpendicular to the longitudinal portion.

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