Processing device

Abstract

To provide a processing device capable of reducing grinding chips attaching to a protective cover which covers a spindle housing.SOLUTION: A processing device 1 includes: a holding table 10; a grinding unit 20 having a spindle 22, a spindle housing 24, a protective cover 50 and a mount part 25 fixed to a lower end part of the spindle 22, and for grinding and processing an object 200 to be processed held by the holding table 10 using a grinding wheel 21; a grinding feed unit for moving the grinding unit 20 in the vertical direction; a processing chamber cover 60 containing a top plate 63 having a wheel inlet / outlet 66, and for covering a processing chamber 61 in which the holding table 10, the mount part 25 and the grinding wheel 21 are arranged; and a fluid supply unit 70 disposed on a lower surface of the top plate 63 of the processing chamber cover 60, and having a plurality of supply ports 73 for supplying the fluid toward an outer peripheral surface 52 of the protective cover 50.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a processing device for processing a workpiece. [Background technology]

[0002] Grinding machines are used to grind workpieces such as semiconductor wafers. For example, grinding machines that perform in-feed grinding on workpieces have a chuck table that can rotate while holding the workpiece by suction.

[0003] Above the chuck table is a grinding unit with a spindle covered by a spindle housing, with its longitudinal direction aligned along the Z-axis. A disk-shaped mount is fixed to the bottom end of the spindle, and an annular grinding wheel is attached to the underside of the mount. A protective cover surrounds the sides of the spindle housing to protect it from debris, water, etc.

[0004] When grinding a workpiece, the chuck table and grinding wheel are placed inside the processing chamber cover, and grinding is performed while grinding water such as pure water is supplied to the processing point. Therefore, grinding water containing grinding dust splashes onto the inner wall of the processing chamber cover and the protective cover.

[0005] In addition, some of the grinding water becomes mist and floats inside the machining chamber cover, containing grinding debris. When grinding water containing grinding debris adheres to the machining chamber cover or protective cover and forms relatively large droplets, they may fall due to gravity.

[0006] The chuck table is placed in the internal space of the processing chamber cover (i.e., the processing chamber), and it is not desirable for the above-mentioned water droplets to fall and adhere to the workpiece held by suction on the chuck table before or after processing.

[0007] For this reason, a processing device has been proposed that supplies liquid to the top or side of the mount portion and uses the centrifugal force of the rotating mount portion to splash the liquid onto the inner wall of the processing chamber cover for cleaning (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 2023-154464 Summary of the Invention [Problem to be solved by the invention]

[0009] However, the cleaning method shown in Patent Document 1 and other publications can splash liquid onto the inner walls of the processing chamber cover to clean them, but cannot supply liquid to the outer side of the protective cover that covers the side of the spindle housing.

[0010] If grinding water containing grinding chips is left on the protective cover, when the grinding water dries, the grinding chips will become contaminants and fall onto the top plate of the processing chamber cover, for example. Contamination inside the processing equipment can cause contamination of the location where the processing equipment is installed (clean room) and can also cause contamination of workers working near the top plate of the processing chamber cover when replacing grinding wheels.

[0011] Therefore, in a processing device that processes a workpiece, there is a need to reduce the amount of grinding dust that adheres to a protective cover that covers the side surface of a spindle housing.

[0012] An object of the present invention is to provide a processing device that can reduce grinding debris that adheres to a protective cover that covers a spindle housing. [Means for solving the problem]

[0013] In order to solve the above-mentioned problems and achieve the object, the processing apparatus of the present invention is a processing apparatus for processing a workpiece, and is characterized by comprising: a holding table for holding the workpiece, a spindle arranged in an up-down direction, a spindle housing for rotatably holding the spindle, a protective cover that surrounds one side of the side of the spindle housing, and a circular mount portion fixed to the lower end of the spindle that protrudes downward from the spindle housing; a processing unit that processes the workpiece held by the holding table with a processing tool attached to the underside of the mount portion; a moving unit that moves the processing unit in an up-down direction; a processing chamber cover that includes a top plate having an opening through which the spindle housing and the protective cover are inserted, and that covers the processing chamber in which the holding table, the mount portion, and the processing tool are arranged; and a fluid supply unit that is arranged on the top plate of the processing chamber cover or within the processing chamber and has one or more supply ports that supply fluid toward the other side of the protective cover.

[0014] In the processing apparatus, the fluid supplied from the fluid supply unit may be air or water.

[0015] In the processing apparatus, the fluid supplied from the fluid supply unit does not need to be supplied when the workpiece held on the holding table is processed by the processing tool. [Effects of the Invention]

[0016] The present invention has the effect of reducing grinding debris that adheres to the protective cover that covers the spindle housing. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a processing device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view showing the processing apparatus shown in FIG. 1 with a protective cover removed. [Figure 3]3 is a cross-sectional view that schematically shows a holding table at the processing position of the processing apparatus shown in FIG. 1, a mount portion, a processing chamber cover that covers a processing chamber in which a grinding wheel is disposed, and the like. [Figure 4] FIG. 4 is a cross-sectional view that schematically shows a machining chamber cover and the like, partially in cross section, of the grinding unit shown in FIG. [Figure 5] FIG. 5 is a perspective view schematically showing the processing chamber cover shown in FIG. [Figure 6] FIG. 6 is a perspective view schematically showing a processing chamber cover of a processing apparatus according to Modification 1. As shown in FIG. [Figure 7] FIG. 7 is a cross-sectional view schematically showing a holding table at a processing position of a processing apparatus according to Modification 2, a mount portion, a processing chamber cover that covers a processing chamber in which a grinding wheel is disposed, and the like. DETAILED DESCRIPTION OF THE INVENTION

[0018] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0019] [Embodiment 1] A processing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of the processing apparatus according to the first embodiment. FIG. 2 is a perspective view showing the processing apparatus shown in FIG. 1 with a protective cover removed. FIG. 3 is a cross-sectional view schematically showing a processing chamber cover that covers a processing chamber in which a holding table, a mount, and a grinding wheel are disposed at a processing position of the processing apparatus shown in FIG. 1. FIG. 4 is a cross-sectional view schematically showing the processing chamber cover and the like, partially in cross section, of the grinding unit shown in FIG. 3. FIG. 5 is a perspective view schematically showing the processing chamber cover shown in FIG. 3.

[0020] (Workpiece) The processing apparatus 1 according to the first embodiment is a grinding apparatus that performs grinding on a workpiece 200. The workpiece 200 to be processed by the processing apparatus 1 according to the first embodiment is, for example, a disk-shaped semiconductor wafer having a substrate made of silicon, sapphire, gallium, SiC, or the like, or a wafer such as an optical device wafer. The workpiece 200 has a surface 201 divided into regions in a lattice pattern by a plurality of mutually intersecting planned dividing lines, and devices are formed in each of the regions.

[0021] The device is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), or a memory (semiconductor storage device). A tape 210 having the same diameter as the workpiece 200 is attached to a front surface 201 of the workpiece 200, and a back surface 202 behind the front surface 201 is ground.

[0022] (Processing equipment) The processing apparatus 1 according to the first embodiment is a grinding apparatus that performs grinding on the back surface 202 of a workpiece 200. As shown in FIGS. 1 and 2 , the processing apparatus 1 includes an apparatus base 2, a holding table 10, a grinding unit 20, a processing feed unit 30, a grinding feed unit 40, and a control unit 100.

[0023] The holding table 10 holds the workpiece 200 with a holding surface 11 holding the front surface 201 side on which the device is formed, leaving the back surface 202 of the workpiece 200 exposed. The holding table 10 is disk-shaped, and the holding surface 11 that holds the workpiece 200 is made of porous ceramic or the like.

[0024] The holding table 10 has a holding surface 11 connected to a suction source (not shown), and the holding surface 11 is sucked by the suction source, thereby suction-holding the workpiece 200 placed on the holding surface 11. The holding table 10 is also rotatable about an axis parallel to the Z-axis direction by a rotation drive source (not shown). The Z-axis direction is parallel to the vertical direction (also referred to as the up-down direction) and is perpendicular to the holding surface 11. The holding table 10 suction-holds the workpiece 200 on the holding surface 11, and is rotated about the axis by the rotation drive source, thereby supporting the workpiece 200 so that it can rotate about the axis.

[0025] The grinding unit 20 is a processing unit that grinds the workpiece 200 held by the holding table 10 with a grinding wheel 21, which is a processing tool. The grinding unit 20 is supported by an erected pillar 3 erected from one end of the device base 2 in the Y-axis direction parallel to the horizontal direction, via a grinding feed unit 40.

[0026] As shown in Figure 2, the grinding unit 20 has a spindle 22 extending along the Z-axis direction, a spindle motor 23 that rotates the spindle 22 around its axis, a spindle housing 24 that holds the spindle 22 rotatably around its axis, a mount portion 25 that protrudes downward from the spindle housing 24, and a grinding wheel 21.

[0027] The axis of the spindle 22 is disposed along the Z-axis direction, which is the up-down direction. The mount portion 25 is fixed to the lower end of the spindle 22 and is formed in a disk shape. The grinding wheel 21 is attached to the underside of the mount portion 25. The grinding wheel 21 includes a wheel base 26 formed in an annular shape and attached to the underside of the mount portion 25, and a plurality of grinding stones 27 arranged in an annular shape on the underside of the wheel base 26. The grinding stones 27 are arranged at equal intervals in the circumferential direction of the wheel base 26, and a plurality of grinding stones 27 are fixed to the underside of the wheel base 26.

[0028] The grinding wheel 27 is configured as a so-called segment grinding wheel formed into a single mass by mixing abrasive grains such as diamond or CBN (Cubic Boron Nitride) with a bonding material (also called a bond material) made of metal, ceramic, resin, etc. The grinding wheel 27 grinds the back surface 202 of the workpiece 200.

[0029] The processing feed unit 30 is installed on the device base 2, and moves the holding table 10 relative to the grinding unit 20 in the Y-axis direction, which is the processing feed direction parallel to the holding surface 11. By moving the holding table 10 in the Y-axis direction, the processing feed unit 30 moves the holding table 10 between a carry-in / out position where the workpiece 200 is carried in and out of the holding table 10 away from the grinding unit 20, and a processing position located below the grinding unit 20 where the workpiece 200 is ground by the grinding unit 20.

[0030] The grinding feed unit 40 is attached to an upright column 3 that stands upright from the device base 2, and is a moving unit that moves the grinding unit 20 in the Z-axis direction, which is the vertical direction perpendicular to the holding surface 11. The grinding feed unit 40 lowers the cylindrical holding member 28 attached to the outer peripheral surface 241, which is the side surface of the spindle housing 24 of the grinding unit 20, to bring the grinding wheel 27 closer to the workpiece 200 held on the holding table 10 at the processing position, and raises the holding member 28 to move the grinding wheel 27 away from the workpiece 200 held on the holding table 10 at the processing position.

[0031] The machining feed unit 30 and the grinding feed unit 40 are equipped with a well-known ball screw that is rotatable around its axis, a well-known pulse motor that rotates the ball screw around its axis, and a well-known guide rail that supports the holding table 10 or the grinding unit 20 so that it can move freely in the X-axis or Z-axis direction.

[0032] 1, 2, and 3, the grinding unit 20, which is a processing unit, is provided with a protective cover 50. The protective cover 50 is formed in a cylindrical shape with an inner diameter larger than the outer diameter of the spindle housing 24 and an outer diameter smaller than the outer diameter of the holding member 28. The upper end of the protective cover 50 is attached to the spindle housing 24, and as shown in FIG. 4, the protective cover 50 houses the spindle housing 24, the spindle 22, the mount 25, and the grinding wheel 21 inside. The protective cover 50 also moves up and down integrally with the spindle housing 24 in accordance with the up and down movement of the spindle housing 24. In the first embodiment, a door (not shown) that opens in the circumferential direction is attached to the protective cover 50, and opening the door allows an operator or the like to access the mount 25 and the grinding wheel 21 housed inside.

[0033] The protective cover 50 accommodates the spindle housing 24, spindle 22, mount 25, and grinding wheel 21 inside, and surrounds the outer peripheral surface 241 of the spindle housing 24 with one side, that is, the inner peripheral surface 51. The protective cover 50 also exposes at least the grinding wheel 27 at its lower end. In the grinding unit 20, grinding water (pure water in the first embodiment) is supplied to the grinding wheel 21 from a grinding water supply source during grinding processing.

[0034] 1 and 2, the processing apparatus 1 also includes a processing chamber cover 60. The processing chamber cover 60 defines a processing chamber 61 inside in which at least the holding table 10 at the processing position and the mount portion 25 and grinding wheel 21 of the lowered grinding unit 20 are disposed. That is, the processing chamber cover 60 covers the processing chamber 61. In the first embodiment, as shown in FIG. 5, the processing chamber cover 60 includes a plurality of partition walls 62 surrounding the holding table 10 at the processing position and the grinding wheel 27 of the lowered grinding unit 20, and a flat top plate 63 connected to the upper ends of the plurality of partition walls 62. The processing chamber cover 60 does not accommodate the holding table 10 at the load / unload position. That is, the holding table 10 at the load / unload position is located outside the processing chamber cover 60.

[0035] Furthermore, one partition wall 62 that constitutes the processing chamber cover 60 and is closest to the load / unload position is formed with an entrance / exit port 64 that allows the holding table 10 to enter and exit the processing chamber cover 60. The holding table 10 is moved through the entrance / exit port 64 along the Y-axis direction by the processing feed unit 30 between the load / unload position and the processing position. Furthermore, when the holding table 10 is positioned at the processing position, the entrance / exit port 64 is closed by a shutter 65. The shutter 65 opens and closes the entrance / exit port 64, and opens the entrance / exit port 64 when the holding table 10 passes through the entrance / exit port 64.

[0036] Furthermore, a top plate 63 constituting the machining chamber cover 60 is formed with a wheel entrance / exit 66, which is an opening that allows the spindle housing 24, protective cover 50, mount portion 25, and grinding wheel 21 of the grinding unit 20 to enter and exit the machining chamber cover 60. The spindle housing 24, protective cover 50, mount portion 25, and grinding wheel 21 of the grinding unit 20 are inserted through the wheel entrance / exit 66.

[0037] The spindle housing 24, protective cover 50, mount portion 25 and grinding wheel 21 of the grinding unit 20 are moved in and out of the machining chamber 61 in the machining chamber cover 60 along the Z-axis direction by the grinding feed unit 40 through the wheel entrance / exit 66.

[0038] 3, 4, and 5, the processing apparatus 1 is equipped with a fluid supply unit 70. The fluid supply unit 70 is disposed inside the processing chamber 61 in the processing chamber cover 60, and supplies a fluid 71 (shown in FIG. 5) toward the outer peripheral surface 52, which is the other surface of the protective cover 50. In the first embodiment, the fluid supply unit 70 is attached to the underside of the top plate 63, is formed in an annular shape with an inner diameter larger than that of the wheel entrance 66, and is equipped with a unit main body 72 disposed coaxially with the wheel entrance 66, and a supply port 73 provided on the inner peripheral surface of the unit main body 72.

[0039] A flow path for flowing a fluid supplied from a fluid supply source (not shown) is provided around the entire periphery of the unit body 72. The supply ports 73 are round holes that open on the inner circumferential surface of the unit body 72 and communicate with the flow path inside the unit body 72, and in the first embodiment, a plurality of supply ports 73 are provided at intervals (at equal intervals in the first embodiment) around the periphery of the unit body 72, i.e., the fluid supply unit 70.

[0040] The fluid supply unit 70 sprays the fluid 71 supplied from a fluid supply source from a supply port 73 toward the outer peripheral surface 52, which is the other surface of the protective cover 50 inside the processing chamber 61, thereby supplying the fluid 71 to the outer peripheral surface 52. In the first embodiment, the fluid 71 is a so-called two-fluid, which is air, water, or a mixture of air and water. Therefore, the fluid 71 supplied from the fluid supply unit 70 is a so-called two-fluid, which is air, water, or a mixture of air and water.

[0041] The control unit 100 controls each of the above-mentioned components constituting the machining apparatus 1. That is, the control unit 100 causes the machining apparatus 1 to execute a machining operation on the workpiece 200. The control unit 100 is a computer that has an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or RAM (random access memory), and an input / output interface device, and is capable of executing a computer program.

[0042] The arithmetic processing unit of the control unit 100 executes a computer program stored in the ROM on the RAM to generate control signals for controlling the machining device 1. The arithmetic processing unit of the control unit 100 outputs the generated control signals to each component of the machining device 1 via the input / output interface device. The control unit 100 is also connected to a display means (not shown) configured by a liquid crystal display device or the like for displaying the status and images of the machining operation, and to an input means used by the operator to register machining conditions. The input means is configured by at least one of a touch panel provided on the display means, a keyboard, or the like.

[0043] (Machining operation) Next, a description will be given of the processing operation of the processing device 1 according to embodiment 1. In the processing device 1 having the above-described configuration, an operator or the like places the front surface 201 side of the workpiece 200 before grinding on the holding surface 11 of the holding table 10 at the carry-in / out position via tape 210, and the control unit 100 receives the processing conditions input by the operator or the like. The processing device 1 starts the processing operation when the control unit 100 receives the instruction to start the processing operation input by the operator.

[0044] When the processing operation is started, the control unit 100 of the processing apparatus 1 drives the spindle motor 23 to start rotating the spindle 22 and the grinding wheel 21 around their axes. Also, when the processing operation is started, the control unit 100 of the processing apparatus 1 operates the suction source to suck and hold the front surface 201 of the workpiece 200 on the holding surface 11 of the holding table 10, thereby exposing the back surface 202 of the workpiece 200 upward. During the processing operation, the control unit 100 controls the processing feed unit 30 to move the holding table 10, which sucks and holds the workpiece 200, to the processing position.

[0045] In the processing operation, when the control unit 100 positions the holding table 10 at the processing position, the processing apparatus 1 closes the entrance / exit 64 with the shutter 65 and rotates the holding table 10 around its axis at the processing position. In the processing operation, the control unit 100 supplies grinding water to the grinding wheel 21 of the grinding unit 20 and controls the grinding feed unit 40 to lower the grinding wheel 21 rotated around its axis. In the processing operation, the processing apparatus 1 brings the grinding stone 27 of the grinding wheel 21 rotating around its axis into contact with the back surface 202 of the workpiece 200 held on the holding table 10 rotating around its axis while supplying the machining fluid 107, and grinds the back surface 202 of the workpiece 200 with the grinding stone 27. Thus, in the first embodiment, the processing device 1 grinds the rear surface 202 of the workpiece 200 to thin the workpiece 200 to a predetermined thickness.

[0046] In the processing operation, when the workpiece 200 is thinned to a predetermined thickness by the grinding wheel 27, the control unit 100 controls the grinding feed unit 40 to raise the grinding wheel 21. In the processing operation, the control unit 100 stops the rotation of the holding table 10 around its axis.

[0047] During the processing operation, the control unit 100 of the processing device 1 controls the processing feed unit 30 to transport the holding table 10, which is holding by suction the workpiece 200 that has been ground, to the loading / unloading position, and then stops the suction holding of the holding table 10 at the loading / unloading position, thereby completing the processing operation.

[0048] Furthermore, in the first embodiment, when the workpiece 200 is not being ground, i.e., when the workpiece 200 held by the holding table 10 is not being ground by the grinding wheel 21, the processing apparatus 1 supplies fluid from the fluid supply source to the fluid supply unit 70 at a predetermined timing while the control unit 100 raises and lowers the grinding unit 20 by the grinding feed unit 40 with the lower end of the protective cover 50 positioned within the processing chamber 61. Thus, in the first embodiment, when the workpiece 200 is not being ground, i.e., when the workpiece 200 held by the holding table 10 is not being ground by the grinding wheel 21, the processing apparatus 1 supplies fluid 71 from the supply port 73 to the outer peripheral surface 52 of the protective cover 50 while moving the grinding unit 20 in the vertical direction by the grinding feed unit 40, thereby cleaning the outer peripheral surface 52 of the protective cover 50.

[0049] As described above, in the first embodiment, the fluid 71 supplied from the fluid supply unit 70 is not supplied when the workpiece 200 held on the holding table 10 is ground by the grinding wheel 21 .

[0050] As described above, the processing apparatus 1 of embodiment 1 is provided with a fluid supply unit 70 that is disposed on the underside of the top plate 63 of the processing chamber cover 60 and within the processing chamber 61, and has a plurality of supply ports 73 that supply fluid 71 toward the outer surface 52 of the protective cover 50.

[0051] Therefore, the processing apparatus 1 of embodiment 1 moves the grinding unit 20 vertically using the grinding feed unit 40 while supplying fluid 71 from the fluid supply unit 70 toward the outer surface 52 of the protective cover 50, thereby removing grinding water containing grinding chips adhering to the protective cover 50.

[0052] As a result, the processing device 1 according to the first embodiment has the effect of reducing grinding dust that adheres to the protective cover 50 that covers the outer peripheral surface 241 of the spindle housing 24.

[0053] Furthermore, the processing apparatus 1 according to embodiment 1 does not supply the fluid 71 supplied from the fluid supply unit 70 when the workpiece 200 held on the holding table 10 is ground with the grinding wheel 21, thereby preventing the fluid 71 from mixing with the flow rate of the grinding water supplied to the workpiece 200 and the grinding wheel 21 during processing, resulting in fluctuations.

[0054] [Modification] A processing apparatus 1 according to a modified example will be described with reference to the drawings. Fig. 6 is a perspective view that schematically shows a processing chamber cover of a processing apparatus according to modified example 1. Fig. 7 is a cross-sectional view that schematically shows a processing chamber cover that covers a processing chamber in which a holding table, a mount unit, and a grinding wheel are disposed at a processing position of a processing apparatus according to modified example 2. In Figs. 6 and 7, the same parts as those in embodiment 1 are assigned the same reference numerals and will be described in detail.

[0055] 6, the processing apparatus 1 is the same as that of the first embodiment, except that the supply port 73-1 is formed as a slit provided around the entire inner circumferential surface of the unit body 72 of the fluid supply unit 70. Thus, in the first modification, the fluid supply unit 70 of the processing apparatus 1 has one supply port 73-1.

[0056] In variant 2, the processing apparatus 1 is the same as embodiment 1, except that the unit body 72 of the fluid supply unit 70 is attached to the underside of the top plate 63 of the processing chamber cover 60 via a hanging member 74, as shown in Figure 7.

[0057] As in embodiment 1, the processing apparatus 1 according to these modified examples 1 and 2 is provided with a fluid supply unit 70 that is disposed under the top plate 63 of the processing chamber cover 60 and within the processing chamber 61, and has supply ports 73, 73-1 that supply fluid 71 toward the outer peripheral surface 52 of the protective cover 50, thereby achieving the effect of reducing grinding chips that adhere to the protective cover 50 that covers the outer peripheral surface 241 of the spindle housing 24.

[0058] The present invention is not limited to the above-described embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the present invention, the processing device 1 is not limited to a grinding device, but may be a processing device that performs various processes on the workpiece 200, such as a polishing device or a cutting tool device. [Explanation of symbols]

[0059] 1 Processing equipment 10 Holding table 20 Grinding unit (processing unit) 21 Grinding wheels (machining tools) 22 Spindle 24 Spindle housing 25 Mounting section 40 Grinding feed unit (moving unit) 50 Protective Cover 51 Inner surface (one side) 52 Outer surface (other surface) 60 Processing chamber cover 61 Processing room 63 Top plate 66 Wheel entrance (opening) 70 Fluid supply unit 71 Fluid 73,73-1 Supply port 200 Workpiece 241 Outer surface (side surface)

Claims

1. A processing device for processing a workpiece, a holding table for holding the workpiece; a machining unit including a spindle arranged along the vertical direction, a spindle housing for rotatably holding the spindle, a protective cover for enclosing one side of the side of the spindle housing, and a disk-shaped mount portion fixed to a lower end of the spindle protruding downward from the spindle housing, the machining unit machining the workpiece held by the holding table with a machining tool attached to the underside of the mount portion; a moving unit that moves the processing unit in a vertical direction; a machining chamber cover including a top plate having an opening into which the spindle housing and the protective cover are inserted, the top plate covering a machining chamber in which the holding table, the mount portion, and the machining tool are disposed; a fluid supply unit disposed on the top plate of the processing chamber cover or within the processing chamber, the fluid supply unit having one or more supply ports for supplying a fluid toward the other surface of the protective cover; A processing device comprising:

2. 2. The processing apparatus according to claim 1, wherein the fluid supplied from the fluid supply unit is air or water.

3. 3. The processing apparatus according to claim 1, wherein the fluid supplied from the fluid supply unit is not supplied when the workpiece held by the holding table is processed by the processing tool.

Images