Resin material, laminated film, cured product, and multilayer printed wiring board

Abstract

To provide a resin material capable of improving tackiness and lowering the dielectric constant and dielectric loss tangent of a cured product.SOLUTION: The resin material according to the present invention contains a maleimide compound (A) having an indane skeleton, a radically polymerizable compound (B) having no indane skeleton and having a molecular weight of less than 1,000, and hollow inorganic particles (C).SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a resin material containing a maleimide compound. The present invention also relates to a laminate film using the resin material. The present invention also relates to a cured product of the resin material. Furthermore, the present invention also relates to a multilayer printed wiring board using the resin material. [Background technology]

[0002] Conventionally, various resin materials have been used to obtain electronic components such as semiconductor devices, laminates, and printed wiring boards. For example, in multilayer printed wiring boards, resin materials are used to form insulating layers for insulating between internal layers and to form insulating layers located on the surface. Wiring, which is generally made of metal, is laminated on the surface of the insulating layer. Furthermore, film-like resin materials (resin films) are sometimes used to form the insulating layers. The resin materials are used as insulating materials for multilayer printed wiring boards, including build-up films.

[0003] Patent Document 1 listed below discloses a resin composition containing a polyphenylene ether compound having a carbon-carbon unsaturated double bond at its terminal, a maleimide compound having an indane structure in the molecule, and an inorganic filler.

[0004] Patent Document 2 below discloses a resin composition containing (A) a silane compound having a specific structure, (B) an epoxy resin, and (C) an active ester compound. Patent Document 2 also describes an example of a resin composition containing hollow silica. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] WO2022 / 054303A1 [Patent Document 2] WO2023 / 149521A1 Summary of the Invention [Problem to be solved by the invention]

[0006] As described in Patent Document 1, a resin material containing a thermosetting compound and an inorganic filler (solid inorganic particles) is known. Also, as described in Patent Document 2, a resin material containing a thermosetting compound and hollow inorganic particles is known. By using hollow inorganic particles, the dielectric constant and dielectric loss tangent of the cured resin material can be lowered to a certain extent.

[0007] Incidentally, a film-like resin material (resin film) is usually laminated with a cover film to protect the surface until use. When manufacturing electronic components such as printed wiring boards, the cover film is peeled off and then the resin film is laminated onto a substrate or the like.

[0008] The present inventors have found that the use of hollow inorganic particles results in a problem of reduced tackiness of the resin film. This problem of reduced tackiness is unlikely to occur when hollow inorganic particles are not used, but is a new problem that arises significantly when hollow inorganic particles are used.

[0009] If the tackiness is low, the cover film may peel off unintentionally from the resin film, which may hinder the resin film's ability to protect the product, whereas if the tackiness is excessively high, it becomes difficult to peel the cover film off the resin film.

[0010] An object of the present invention is to provide a resin material that can improve tackiness and reduce the dielectric constant and dielectric loss tangent of the cured product. Another object of the present invention is to provide a laminate film using the resin material. Another object of the present invention is to provide a cured product of the resin material. A further object of the present invention is to provide a multilayer printed wiring board using the resin material. [Means for solving the problem]

[0011] This specification discloses the following resin material, laminate film, cured product, and multilayer printed wiring board.

[0012] Item 1. A resin material comprising: (A) a maleimide compound having an indane skeleton; (B) a radically polymerizable compound not having an indane skeleton and having a molecular weight of less than 1,000; and (C) hollow inorganic particles.

[0013] Item 2. The resin material according to Item 1, wherein the hollow inorganic particles (C) are hollow silica particles.

[0014] Item 3. The resin material according to Item 1 or 2, wherein the content of the maleimide compound (A) is 1% by weight or more and 80% by weight or less, based on 100% by weight of the components excluding the solvent in the resin material.

[0015] Item 4. The resin material according to any one of Items 1 to 3, wherein the content of the radical polymerizable compound (B) is 1% by weight or more and 40% by weight or less, based on 100% by weight of the components excluding the solvent in the resin material.

[0016] Item 5. The resin material according to any one of Items 1 to 4, wherein the radically polymerizable compound (B) includes a maleimide compound, a (meth)acrylate compound, a styrene compound, or an allyl compound.

[0017] Item 6. The resin material according to any one of Items 1 to 5, further comprising a maleimide compound (D) that does not have an indane skeleton and has a molecular weight of 1,000 or more.

[0018] Item 7. The resin material according to any one of Items 1 to 6, further comprising solid inorganic particles (E).

[0019] Item 8. The resin material according to Item 7, wherein the solid inorganic particles (E) are solid silica particles.

[0020] Item 9. The resin material according to any one of Items 1 to 8, further comprising a curing accelerator.

[0021] Item 10. The resin material according to any one of items 1 to 9, which is a resin film.

[0022] Item 11. The resin material according to any one of Items 1 to 10, which is used to form an insulating layer in a multilayer printed wiring board.

[0023] Item 12. A laminated film comprising a resin film and a cover film, wherein the cover film is disposed on a first surface of the resin film, and the resin film is made of the resin material according to any one of items 1 to 11.

[0024] Item 13. The laminate film according to Item 12, further comprising a base film, the base film being disposed on a second surface of the resin film opposite the first surface.

[0025] Item 14. A cured product of a resin material, wherein the resin material is the resin material according to any one of Items 1 to 11.

[0026] Item 15. A multilayer printed wiring board comprising a circuit board, a plurality of insulating layers arranged on the surface of the circuit board, and a metal layer arranged between the plurality of insulating layers, wherein at least one of the plurality of insulating layers is a cured product of the resin material according to any one of items 1 to 11. [Effects of the Invention]

[0027] The resin material according to the present invention comprises a maleimide compound (A) having an indane skeleton, a radically polymerizable compound (B) not having an indane skeleton and having a molecular weight of less than 1000, and hollow inorganic particles (C). Because the resin material according to the present invention has the above-described structure, it is possible to improve tackiness and reduce the dielectric constant and dielectric loss tangent of the cured product. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 is a cross-sectional view schematically showing a laminated film using a resin material according to one embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin material according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0029] The present invention will be described in detail below.

[0030] (resin material) The resin material according to the present invention contains a maleimide compound (A) having an indane skeleton, a radically polymerizable compound (B) having no indane skeleton and a molecular weight of less than 1,000, and hollow inorganic particles (C).

[0031] The resin material according to the present invention has the above-mentioned structure, and therefore can improve tackiness and reduce the dielectric constant and dielectric loss tangent of the cured product.

[0032] In the resin material according to the present invention, the maleimide compound (A), the radical polymerizable compound (B), and the hollow inorganic particles (C) are used in combination, and therefore the dielectric constant and the dielectric loss tangent of the cured product can be reduced.

[0033] Furthermore, although the resin material according to the present invention uses hollow inorganic particles (C), the maleimide compound (A), the radically polymerizable compound (B), and the hollow inorganic particles (C) are used in combination, thereby improving tackiness. Therefore, in a laminate film comprising a film-like resin material (resin film) and a cover film, unintentional peeling of the cover film from the resin film is unlikely to occur. Furthermore, during use, the cover film can be easily peeled from the resin film.

[0034] Furthermore, the resin material according to the present invention can increase the glass transition temperature of the cured product.

[0035] The resin material according to the present invention may be a resin composition or a resin film. The resin composition has fluidity. The resin composition may be in a paste form. The paste form includes a liquid form. The resin material according to the present invention is preferably a resin film because it is easy to handle.

[0036] The resin material according to the present invention is preferably a thermosetting resin material. When the resin material is a resin film, the resin film is preferably a thermosetting resin film.

[0037] In the following description, "100% by weight of the components in the resin material excluding the solvent" means 100% by weight of the components in the resin material excluding the solvent when the resin material contains a solvent, and means 100% by weight of the resin material when the resin material does not contain a solvent. "100% by weight of the components in the resin material excluding the solvent" means 100% by weight of the non-volatile components in the resin material. Furthermore, in the following description, "100% by weight of the components in the resin material excluding the hollow inorganic particles (C), solid inorganic particles (E), and solvent" means 100% by weight of the components in the resin material excluding the hollow inorganic particles (C), solid inorganic particles (E), and solvent when the resin material contains hollow inorganic particles (C), solid inorganic particles (E), and solvent. "100% by weight of components in the resin material excluding hollow inorganic particles (C), solid inorganic particles (E), and solvent" means 100% by weight of components in the resin material excluding hollow inorganic particles (C) and solvent when the resin material contains hollow inorganic particles (C) and solvent but does not contain solid inorganic particles (E). "100% by weight of components in the resin material excluding hollow inorganic particles (C), solid inorganic particles (E), and solvent" means 100% by weight of components in the resin material excluding hollow inorganic particles (C) when the resin material contains hollow inorganic particles (C) but does not contain solid inorganic particles (E) and solvent.

[0038] Hereinafter, details of each component used in the resin material according to the present invention and uses of the resin material according to the present invention will be described.

[0039] [Maleimide compound (A)] The resin material contains a maleimide compound having an indane skeleton (maleimide compound (A)). By using the maleimide compound (A), the effects of the present invention can be exerted. Furthermore, by using the maleimide compound (A), the glass transition temperature of the cured product can be increased. Only one type of maleimide compound (A) may be used, or two or more types may be used in combination.

[0040] The maleimide compound (A) has an indane skeleton, which may be a trimethylindane skeleton.

[0041] The maleimide compound (A) preferably has an indane skeleton represented by the following formula (A1). In this case, the effects of the present invention can be more effectively exhibited. The indane skeleton represented by the following formula (A1) has a trimethylindane skeleton.

[0042] [ka]

[0043] In the above formula (A1), each Rb independently represents an alkyl group having from 1 to 10 carbon atoms, an alkoxy group having from 1 to 10 carbon atoms, an alkylthio group having from 1 to 10 carbon atoms, an aryl group having from 6 to 10 carbon atoms, an aryloxy group having from 6 to 10 carbon atoms, an arylthio group having from 6 to 10 carbon atoms, a cycloalkyl group having from 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a thiol group. In the above formula (A1), r represents an integer of from 0 to 3.

[0044] The maleimide compound (A) may have only one indane skeleton represented by the above formula (A1), or may have a plurality of indane skeletons represented by the above formula (A1). The maleimide compound (A) may have one indane skeleton represented by the above formula (A1), or may have one or more indane skeletons, or may have 30 or less, or may have 20 or less indane skeletons.

[0045] In the above formula (A1), r is preferably 0. That is, the maleimide compound (A) preferably has an indane skeleton represented by the following formula (A11). In this case, the effects of the present invention can be more effectively exhibited.

[0046] [ka]

[0047] The maleimide compound (A) may have only one indane skeleton represented by the above formula (A11), or may have a plurality of indane skeletons represented by the above formula (A11). The maleimide compound (A) may have one indane skeleton represented by the above formula (A11), or may have one or more indane skeletons, or may have 30 or less, or may have 20 or less indane skeletons represented by the above formula (A11).

[0048] The maleimide compound (A) may have one maleimide group, two maleimide groups, two or more maleimide groups, three or more maleimide groups, four or more maleimide groups, or 800 or less maleimide groups, 500 or less maleimide groups, or 300 or less maleimide groups.

[0049] From the viewpoint of further reducing the dielectric constant and dielectric loss tangent of the cured product, the maleimide compound (A) preferably contains a maleimide compound having two maleimide groups, and more preferably is a maleimide compound having two maleimide groups. Therefore, the maleimide compound (A) preferably contains a bismaleimide compound, and more preferably is a bismaleimide compound.

[0050] The molecular weight of the maleimide compound (A) is preferably 200 or more, more preferably 500 or more, and preferably 100,000 or less, more preferably 50,000 or less. When the molecular weight is equal to or greater than the lower limit and equal to or less than the upper limit, a resin material with high fluidity during the formation of an insulating layer is easily obtained, and lamination properties can be improved. Furthermore, since lamination properties can be improved, the plating peel strength of the cured product can be further improved.

[0051] The molecular weight of the maleimide compound (A) means a molecular weight that can be calculated from the structural formula when the maleimide compound (A) is not a polymer and when the structural formula of the maleimide compound (A) can be identified. When the maleimide compound (A) is a polymer, the molecular weight means a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

[0052] Examples of the maleimide compound (A) include compounds represented by the following formula (1), (2), and (3).

[0053] [ka]

[0054] In the above formula (1), n ​​represents a number equal to or greater than 1. In the above formula (1), n ​​is preferably 10 or less, more preferably 8 or less, even more preferably 7 or less, and particularly preferably 6 or less.

[0055] [ka]

[0056] In the above formula (2), n represents a number equal to or greater than 1. In the above formula (2), n is preferably 10 or less, more preferably 8 or less, even more preferably 7 or less, and particularly preferably 6 or less.

[0057] [ka]

[0058] In the above formula (3), n represents a number of 1 or more. In the above formula (3), n is preferably 10 or less, more preferably 8 or less, even more preferably 7 or less, and particularly preferably 6 or less.

[0059] The content of the maleimide compound (A) in the resin material (100% by weight, excluding the solvent) is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, even more preferably 20% by weight or more, particularly preferably 30% by weight or more, preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the content of the maleimide compound (A) is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the effects of the present invention can be more effectively exhibited. Furthermore, when the content of the maleimide compound (A) is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the thermal dimensional stability of the cured product can be further improved.

[0060] The content of the maleimide compound (A) in the resin material, based on 100% by weight of all components excluding the hollow inorganic particles (C), the solid inorganic particles (E), and the solvent, is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, even more preferably 20% by weight or more, particularly preferably 30% by weight or more, and preferably 95% by weight or less, more preferably 90% by weight or less. When the content of the maleimide compound (A) is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the effects of the present invention can be more effectively exhibited. Furthermore, when the content of the maleimide compound (A) is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the thermal dimensional stability of the cured product can be further improved.

[0061] In the resin material, the weight ratio of the content of maleimide compound (A) to the content of radically polymerizable compound (B) (content of maleimide compound (A) / content of radically polymerizable compound (B)) is preferably 0.1 or more, more preferably 0.2 or more, even more preferably 1 or more, even more preferably 3 or more, particularly preferably 5 or more, and preferably 20 or less, more preferably 15 or less. When the weight ratio (content of maleimide compound (A) / content of radically polymerizable compound (B)) is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0062] In the resin material, the weight ratio of the content of the maleimide compound (A) to the content of the hollow inorganic particles (C) (content of maleimide compound (A) / content of hollow inorganic particles (C)) is preferably 0.01 or more, more preferably 0.05 or more, even more preferably 0.1 or more, even more preferably 0.5 or more, particularly preferably 1 or more, and preferably 10 or less, more preferably 5 or less. When the weight ratio (content of maleimide compound (A) / content of hollow inorganic particles (C)) is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0063] [Radical polymerizable compound (B)] The resin material contains a radical polymerizable compound (radical polymerizable compound (B)) that does not have an indane skeleton and has a molecular weight of less than 1,000. The radical polymerizable compound (B) does not have an indane skeleton. The radical polymerizable compound (B) has a molecular weight of less than 1,000. The radical polymerizable compound (B) is different from the maleimide compound (A). By using the radical polymerizable compound (B) in combination with the maleimide compound (A) and the hollow inorganic particles (C), the effects of the present invention can be exerted, and in particular, tackiness can be improved. Only one type of radical polymerizable compound (B) may be used, or two or more types may be used in combination.

[0064] The radical polymerizable compound (B) is capable of addition polymerization by radicals and has a radical polymerizable group, and is preferably a thermosetting compound.

[0065] Examples of the radical polymerizable group include a group containing an unsaturated double bond. Examples of the radical polymerizable group include a maleimide group, a (meth)acryloyl group, a vinyl group, and an allyl group. The (meth)acryloyl group refers to either or both of an acryloyl group and a methacryloyl group.

[0066] Examples of the radical polymerizable compound (B) include a maleimide compound, a (meth)acrylate compound, a styrene compound, and an allyl compound. Note that the (meth)acrylate compound refers to either or both of an acrylate compound and a methacrylate compound.

[0067] The radical polymerizable compound (B) preferably contains a maleimide compound, a (meth)acrylate compound, a styrene compound, or an allyl compound, and more preferably is a maleimide compound, a (meth)acrylate compound, a styrene compound, or an allyl compound. In this case, the effects of the present invention can be more effectively exhibited, and the glass transition temperature of the cured product can be increased.

[0068] The radical polymerizable compound (B) more preferably contains a maleimide compound, a styrene compound, or an allyl compound. In this case, the effects of the present invention can be more effectively exhibited, particularly, the dielectric loss tangent of the cured product can be further reduced. In addition, the glass transition temperature of the cured product can be further increased.

[0069] The maleimide compound may have one maleimide group, two maleimide groups, two or more maleimide groups, three or more maleimide groups, four or more maleimide groups, or 800 or less maleimide groups, 500 or less maleimide groups, or 300 or less maleimide groups.

[0070] From the viewpoint of further reducing the dielectric constant and dielectric loss tangent of the cured product, the maleimide compound preferably contains a maleimide compound having two maleimide groups, and more preferably is a maleimide compound having two maleimide groups. Accordingly, the maleimide compound preferably contains a bismaleimide compound, and more preferably is a bismaleimide compound.

[0071] Commercially available maleimide compounds include "BMI-689" manufactured by Designer Molecules Inc., and "BMI-1000," "BMI-4000," and "BMI-5100" manufactured by Daiwa Chemical Industry Co., Ltd.

[0072] Commercially available products of the (meth)acrylate compound include "Viscoat 230D," "Viscoat 230," "Viscoat 190," and "ISTA" manufactured by Osaka Organic Chemical Industry Co., Ltd., and "DCP" and "701" manufactured by Shin-Nakamura Chemical Co., Ltd.

[0073] Commercially available styrene compounds include "DVB960" manufactured by NS Styrene Monomer Co., Ltd.

[0074] Commercially available products of the allyl compound include "L-DAIC" manufactured by Shikoku Chemical Industry Co., Ltd. and "TAIC" manufactured by Mitsubishi Chemical Corporation.

[0075] The molecular weight of the radical polymerizable compound (B) is less than 1000. The molecular weight of the radical polymerizable compound (B) is preferably 100 or more, more preferably 200 or more, and preferably 950 or less, more preferably 900 or less. When the molecular weight of the radical polymerizable compound (B) is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0076] The molecular weight of the radical polymerizable compound (B) means a molecular weight that can be calculated from the structural formula when the radical polymerizable compound (B) is not a polymer and when the structural formula of the radical polymerizable compound (B) can be identified. When the radical polymerizable compound (B) is a polymer, the molecular weight means a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

[0077] The content of the radical polymerizable compound (B) in the resin material, based on 100% by weight of the components excluding the solvent, is preferably 1% by weight or more, more preferably 2% by weight or more, even more preferably 3% by weight or more, and preferably 40% by weight or less, more preferably 35% by weight or less, and even more preferably 30% by weight or less. When the content of the radical polymerizable compound (B) is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the effects of the present invention can be more effectively exhibited. Furthermore, when the content of the radical polymerizable compound (B) is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the thermal dimensional stability of the cured product can be further improved. Furthermore, when the content of the radical polymerizable compound (B) is equal to or less than the above-mentioned upper limit, the glass transition temperature of the cured product can be increased.

[0078] The content of the radical polymerizable compound (B) in the resin material, based on 100% by weight of components excluding the hollow inorganic particles (C), solid inorganic particles (E), and solvent, is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and preferably 80% by weight or less, more preferably 70% by weight or less, and even more preferably 60% by weight or less. When the content of the radical polymerizable compound (B) is above the above-mentioned lower limit and below the above-mentioned upper limit, the effects of the present invention can be more effectively exhibited. Furthermore, when the content of the radical polymerizable compound (B) is above the above-mentioned lower limit and below the above-mentioned upper limit, the thermal dimensional stability of the cured product can be further improved. Furthermore, when the content of the radical polymerizable compound (B) is below the above-mentioned upper limit, the glass transition temperature of the cured product can be increased.

[0079] In the resin material, the weight ratio of the content of the radical polymerizable compound (B) to the content of the hollow inorganic particles (C) (content of radical polymerizable compound (B) / content of hollow inorganic particles (C)) is preferably 0.01 or more, more preferably 0.05 or more, even more preferably 0.1 or more, and preferably 10 or less, more preferably 5 or less. When the weight ratio (content of radical polymerizable compound (B) / content of hollow inorganic particles (C)) is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0080] [Hollow inorganic particles (C)] The resin material contains hollow inorganic particles (hollow inorganic particles (C)). The hollow inorganic particles (C) may be used alone or in combination of two or more kinds.

[0081] The hollow inorganic particles (C) are inorganic particles having a hollow. The hollow inorganic particles (C) have a hollow and an outer shell surrounding the hollow. The number of the hollow surrounded by the outer shell is usually one.

[0082] The hollow inorganic particles (C) are formed of an inorganic material. More specifically, the outer shell of the hollow inorganic particles (C) is formed of an inorganic material.

[0083] Examples of inorganic substances that form the hollow inorganic particles (C) include silica, aluminosilicate, silsesquioxane, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. The above inorganic substances may be used alone or in combination of two or more.

[0084] The inorganic substance forming the hollow inorganic particles (C) preferably contains silica, aluminosilicate, or silsesquioxane, more preferably contains silica or aluminosilicate, even more preferably contains silica, and particularly preferably is silica. The hollow inorganic particles (C) preferably contain hollow silica particles, hollow aluminosilicate particles, or hollow silsesquioxane particles, more preferably contains hollow silica particles or hollow aluminosilicate particles, even more preferably contains hollow silica particles, and particularly preferably is hollow silica particles. In this case, the dielectric constant and dielectric loss tangent of the cured resin material can be further reduced.

[0085] The hollow inorganic particles (C) preferably have an average particle size of 50 nm or more, more preferably 75 nm or more, even more preferably 100 nm or more, particularly preferably 200 nm or more, and preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 2 μm or less. When the average particle size is equal to or greater than the lower limit and equal to or less than the upper limit, the surface roughness after etching can be reduced, the plating peel strength can be increased, and the adhesion between the insulating layer and the metal layer can be further improved. Also, short circuits between wirings can be further suppressed.

[0086] The median diameter (d50) at 50% is used as the average particle diameter of the hollow inorganic particles (C). The average particle diameter can be measured using a laser diffraction / scattering particle size distribution analyzer. When the hollow inorganic particles (C) are agglomerated particles, the average particle diameter of the hollow inorganic particles (C) refers to the primary particle diameter.

[0087] The shape of the hollow inorganic particles (C) is not particularly limited, but is preferably spherical. In this case, the surface roughness of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased. When the hollow inorganic particles (C) are spherical, the aspect ratio of the hollow inorganic particles (C) is preferably 2 or less, more preferably 1.5 or less.

[0088] The number of holes (number of hollows) contained inside the hollow inorganic particles (C) is not particularly limited, but it is preferable that the number is one.

[0089] The porosity of the hollow inorganic particles (C) is preferably 20% by volume or more, more preferably 30% by volume or more, even more preferably 40% by volume or more, and preferably 90% by volume or less, more preferably 85% by volume or less, and even more preferably 80% by volume or less. When the porosity is equal to or more than the lower limit and equal to or less than the upper limit, the dielectric constant and dielectric loss tangent of the cured product of the resin material can be further reduced.

[0090] When the number of voids (number of hollows) contained inside the hollow inorganic particles (C) is one, the porosity can be calculated as follows. Photograph the hollow inorganic particles (C) using a transmission electron microscope (TEM). From the obtained micrograph, the particle diameters of 50 arbitrarily selected hollow inorganic particles (C) are measured, and the average value is taken as the average particle diameter (X). Furthermore, the hollow inorganic particles (C) are cut in half, and the cut hollow inorganic particles (C) are photographed using a transmission electron microscope (TEM). From the obtained micrograph, the diameters of the cavities on the cross sections of 50 arbitrarily selected cut hollow inorganic particles (C) are measured, and the average value is taken as the average diameter of the cavities (Y). The porosity is calculated using the following formula:

[0091] Porosity (volume%) = (Y 3 / X 3 ) x 100 X: Average particle diameter (X) Y: Average diameter of the cavity (Y)

[0092] When the number of voids (number of hollows) contained inside the hollow inorganic particles (C) is two or more, the porosity can also be determined using a transmission electron microscope (TEM) from the volume of the hollow inorganic particles (C) determined from the particle diameter of the hollow inorganic particles (C) and the volume of the hollow portions determined from the diameter of the hollow portions.

[0093] The hollow inorganic particles (C) are preferably surface-treated, and more preferably surface-treated with a coupling agent. By surface-treating the hollow inorganic particles (C), the surface roughness of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased. Furthermore, by surface-treating the hollow inorganic particles (C), finer wiring can be formed on the surface of the cured product, and the cured product can be provided with better inter-wiring insulation reliability and inter-layer insulation reliability.

[0094] Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent, etc. Examples of the silane coupling agent include methacrylsilane, acrylsilane, phenylaminosilane, phenylsilane, imidazolesilane, vinylsilane, alkylaminosilane, and epoxysilane.

[0095] The hollow inorganic particles (C) are preferably hollow inorganic particles whose surface has been treated with a silane coupling agent, more preferably hollow inorganic particles whose surface has been treated with vinylsilane, phenylaminosilane, or phenylsilane. In this case, the lamination property can be further improved. Furthermore, since the lamination property can be improved, the plating peel strength of the cured product can be further improved.

[0096] The content of hollow inorganic particles (C) in the resin material, based on 100% by weight of the components excluding the solvent, is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, particularly preferably 25% by weight or more, preferably 60% by weight or less, more preferably 55% by weight or less, and even more preferably 50% by weight or less. When the content of hollow inorganic particles (C) is above the lower limit, the dielectric constant and dielectric dissipation factor of the cured resin material can be further reduced. Furthermore, thermal dimensional stability can be improved, effectively suppressing warping of the cured product. When the content of hollow inorganic particles (C) is above the lower limit and below the upper limit, the surface roughness of the cured product can be further reduced and short circuits between wirings can be further suppressed, resulting in the formation of finer wiring on the surface of the cured product. Furthermore, when the content of hollow inorganic particles (C) is above the lower limit and below the upper limit, the thermal expansion coefficient of the cured product can be reduced and smear removability can be improved. When the content of hollow inorganic particles (C) is below the upper limit, tackiness can be further improved.

[0097] [Maleimide compound (D)] The resin material may contain a maleimide compound (maleimide compound (D)) that does not have an indane skeleton and has a molecular weight of 1,000 or more. The maleimide compound (D) does not have an indane skeleton. The maleimide compound (D) has a molecular weight of 1,000 or more. The maleimide compound (D) is different from the maleimide compound (A). The maleimide compound (D) is different from the radically polymerizable compound (B). From the viewpoint of further reducing the dielectric constant and dielectric loss tangent of the cured product of the resin material, it is preferable that the resin material contains the maleimide compound (D). Only one type of maleimide compound (D) may be used, or two or more types may be used in combination.

[0098] The maleimide compound (D) may have one maleimide group, two maleimide groups, two or more maleimide groups, three or more maleimide groups, four or more maleimide groups, or up to 800 maleimide groups, up to 500 maleimide groups, or up to 300 maleimide groups.

[0099] From the viewpoint of further reducing the dielectric constant and dielectric loss tangent of the cured product, the maleimide compound (D) preferably contains a maleimide compound having two maleimide groups, and more preferably is a maleimide compound having two maleimide groups. Therefore, the maleimide compound (D) preferably contains a bismaleimide compound, and more preferably is a bismaleimide compound.

[0100] The maleimide compound (D) preferably has an aliphatic skeleton or an alicyclic skeleton, and more preferably has both an aliphatic skeleton and an alicyclic skeleton. In this case, the effects of the present invention can be more effectively exhibited. In addition, the desmear property and plating peel strength can be improved.

[0101] Examples of the aliphatic skeleton include linear aliphatic skeletons, such as saturated hydrocarbon groups and unsaturated hydrocarbon groups. The aliphatic skeleton is preferably an aliphatic skeleton having 4 or more carbon atoms. The number of carbon atoms in the aliphatic skeleton having 4 or more carbon atoms is preferably 5 or more, more preferably 6 or more, even more preferably 7 or more, and preferably 60 or less, more preferably 50 or less, and even more preferably 40 or less. More specifically, examples of the aliphatic skeleton include alkyl groups having 4 to 60 carbon atoms (preferably alkyl groups having 6 to 40 carbon atoms). The maleimide compound (D) may have only one type of the aliphatic skeleton, or two or more types.

[0102] Examples of the alicyclic skeleton include a monocycloalkane ring, a bicycloalkane ring, a tricycloalkane ring, a tetracycloalkane ring, and a dicyclopentadiene ring. The maleimide compound (D) may have only one type of the alicyclic skeleton, or two or more types.

[0103] From the viewpoint of further increasing the glass transition temperature of the cured product, the maleimide compound (D) preferably has an aromatic skeleton.

[0104] Examples of the aromatic skeleton include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a tetracene ring, a chrysene ring, a triphenylene ring, a tetraphene ring, a pyrene ring, a pentacene ring, a picene ring, and a perylene ring. The maleimide compound (D) may have only one type of the aromatic skeleton, or two or more types.

[0105] The maleimide compound (D) preferably has a skeleton derived from dimer diamine. Since the maleimide compound having a skeleton derived from dimer diamine has an aliphatic skeleton and an alicyclic skeleton, the use of the maleimide compound (D) can further reduce the dielectric constant and dielectric dissipation factor of the cured product.

[0106] Examples of the dimer diamine (commercially available dimer diamine) include "VERSAMINE 551" (3,4-bis(1-aminoheptyl)-6-hexyl-5-(1-octenyl)cyclohexene) manufactured by BASF Japan, "VERSAMINE 552" (a hydrogenated product of VERSAMINE 551) manufactured by Cognix Japan, and "PRIAMINE 1075" and "PRIAMINE 1074" manufactured by Croda Japan. Only one type of the dimer diamine may be used, or two or more types may be used in combination.

[0107] The maleimide compound (D) preferably has a skeleton derived from dimer diamine and a skeleton derived from a second diamine compound other than dimer diamine, which can more effectively exhibit the effects of the present invention.

[0108] Examples of the second diamine compound include tricyclodecanediamine, norbornanediamine, isophoronediamine, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, bis(aminomethyl)norbornane, 3(4),8(9)-bis(aminomethyl)tricyclo[5.2.1.02,6]decane, 1,3-cyclohexanediamine, 1,4-cyclohexanediamine, 4,4'-methylenebis(cyclohexylamine), 4,4'-methylenebis(2-methylcyclohexylamine), 1,4-diaminobutanediamine, ... Examples of the second diamine compound include benzene, 1,10-diaminodecane, 1,12-diaminododecane, 1,7-diaminoheptane, 1,6-diaminohexane, 1,5-diaminopentane, 1,8-diaminooctane, 1,3-diaminopropane, 1,11-diaminoundecane, 2-methyl-1,5-diaminopentane, 1,1-bis(4-aminophenyl)cyclohexane, 2,7-diaminofluorene, 4,4'-ethylenedianiline, 4,4'-methylenebis(2,6-diethylaniline), and 4,4'-methylenebis(2-ethyl-6-methylaniline). Only one type of the second diamine compound may be used, or two or more types may be used in combination.

[0109] The second diamine compound may or may not have an aliphatic skeleton. The second diamine compound may or may not have an alicyclic skeleton. The second diamine compound may or may not have an aromatic skeleton.

[0110] The second diamine compound preferably contains a diamine compound having an alicyclic skeleton other than dimer diamine. The maleimide compound (D) preferably has a skeleton derived from dimer diamine and a skeleton derived from a diamine compound having an alicyclic skeleton other than dimer diamine. In this case, the effects of the present invention can be more effectively exhibited.

[0111] The diamine compound having an alicyclic skeleton other than the dimer diamine is preferably tricyclodecane diamine, norbornane diamine, or isophorone diamine, in which case the effects of the present invention can be more effectively exhibited.

[0112] The maleimide compound (D) preferably has a skeleton derived from an acid dianhydride, more preferably has a skeleton derived from a reaction product of a diamine compound and an acid dianhydride, and further preferably has a skeleton derived from a reaction product of a dimer diamine and an acid dianhydride.

[0113] Examples of the acid dianhydride include tetracarboxylic dianhydrides, such as pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenylsulfonetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3',4,4'-biphenylethertetracarboxylic dianhydride, 3,3',4,4'-dimethyldiphenylsilanetetracarboxylic dianhydride, 3,3',4,4'-tetraphenylsilanetetracarboxylic dianhydride, 1,2,3,4-furantetracarboxylic dianhydride, 4,4'-bis(3,4-dicarboxyphenoxy)diphenylsulfonyl ether ... Examples of the dianhydride include 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl sulfone dianhydride, 4,4'-bis(3,4-dicarboxyphenoxy)diphenylpropane dianhydride, 3,3',4,4'-perfluoroisopropylidenediphthalic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, bis(phthalic acid)phenylphosphine oxide dianhydride, p-phenylene-bis(triphenylphthalic acid) dianhydride, m-phenylene-bis(triphenylphthalic acid) dianhydride, bis(triphenylphthalic acid)-4,4'-diphenyl ether dianhydride, and bis(triphenylphthalic acid)-4,4'-diphenylmethane dianhydride. The above-mentioned dianhydrides may be used alone or in combination of two or more.

[0114] The molecular weight of the maleimide compound (D) is at least 1000. The molecular weight of the maleimide compound (D) is preferably at least 1100, more preferably at least 1200, and is preferably at most 200,000, more preferably at most 100,000. When the molecular weight of the maleimide compound (D) is at least the above lower limit and at most the above upper limit, the effects of the present invention can be more effectively exhibited.

[0115] The molecular weight of the maleimide compound (D) means a molecular weight that can be calculated from the structural formula when the maleimide compound (D) is not a polymer and when the structural formula of the maleimide compound (D) can be identified. When the maleimide compound (D) is a polymer, the molecular weight means a weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

[0116] The content of the maleimide compound (D) in the resin material (100% by weight, excluding the solvent) is preferably 1% by weight or more, more preferably 2% by weight or more, and preferably 60% by weight or less, more preferably 50% by weight or less. When the content of the maleimide compound (D) is equal to or more than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the effects of the present invention can be more effectively exhibited.

[0117] The content of the maleimide compound (D) in the resin material is preferably 1% by weight or more, more preferably 2% by weight or more, and preferably 80% by weight or less, more preferably 70% by weight or less, based on 100% by weight of the components excluding the hollow inorganic particles (C), the solid inorganic particles (E), and the solvent. When the content of the maleimide compound (D) is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0118] [Solid inorganic particles (E)] The resin material may contain solid inorganic particles (solid inorganic particles (E)). From the viewpoint of further improving the thermal dimensional stability of the cured product, the resin material preferably contains solid inorganic particles (E). Only one type of solid inorganic particles (E) may be used, or two or more types may be used in combination.

[0119] The solid inorganic particles (E) are inorganic particles that do not have a hollow space.

[0120] Examples of the solid inorganic particles (E) include solid silica particles, solid talc particles, solid clay particles, solid mica particles, solid hydrotalcite particles, solid alumina particles, solid magnesium oxide particles, solid aluminum hydroxide particles, solid aluminum nitride particles, and solid boron nitride particles.

[0121] From the viewpoints of reducing the surface roughness of the cured product surface, further increasing the adhesive strength between the cured product and the metal layer, forming finer wiring on the cured product surface, and imparting better insulation reliability to the cured product, the solid inorganic particles (E) are preferably solid silica particles or solid alumina particles, and more preferably solid silica particles.

[0122] The solid inorganic particles (E) have an average particle size of preferably 50 nm or more, more preferably 100 nm or more, even more preferably 200 nm or more, and preferably 5 μm or less, more preferably 3 μm or less, and even more preferably 1 μm or less. When the average particle size of the solid inorganic particles (E) is equal to or greater than the above lower limit and equal to or less than the above upper limit, the surface roughness after etching can be reduced, the plating peel strength can be increased, and the adhesion between the insulating layer and the metal layer can be further improved.

[0123] The median diameter (d50) at 50% is used as the average particle size of the solid inorganic particles (E). The average particle size can be measured using a laser diffraction / scattering particle size distribution analyzer.

[0124] The shape of the solid inorganic particles (E) is not particularly limited, but spherical is preferred. In this case, the surface roughness of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased. When the solid inorganic particles (E) are spherical, the aspect ratio of the solid inorganic particles (E) is preferably 2 or less, more preferably 1.5 or less.

[0125] The solid inorganic particles (E) are preferably surface-treated, more preferably with a coupling agent, and even more preferably with a silane coupling agent. By surface-treating the solid inorganic particles (E), the surface roughness of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased. Furthermore, by surface-treating the solid inorganic particles (E), finer wiring can be formed on the surface of the cured product, and the cured product can be provided with better inter-wiring insulation reliability and inter-layer insulation reliability.

[0126] Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent, etc. Examples of the silane coupling agent include methacrylsilane, acrylsilane, aminosilane, imidazolesilane, vinylsilane, and epoxysilane.

[0127] The content of the solid inorganic particles (E) in the resin material, based on 100% by weight of the components excluding the solvent, is preferably 1% by weight or more, more preferably 5% by weight or more, and preferably 60% by weight or less, more preferably 50% by weight or less. When the content of the solid inorganic particles (E) is equal to or greater than the above-mentioned lower limit, the dielectric constant and dielectric dissipation factor of the cured product of the resin material can be further reduced. Furthermore, the thermal dimensional stability can be improved, and warping of the cured product can be effectively suppressed. When the content of the solid inorganic particles (E) is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the surface roughness of the cured product can be further reduced, and finer wiring can be formed on the surface of the cured product. Furthermore, when the content of the solid inorganic particles (E) is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the thermal expansion coefficient of the cured product can be reduced and smear removability can be improved.

[0128] The total content of the hollow inorganic particles (C) and the solid inorganic particles (E) in the resin material (100% by weight, excluding the solvent) is preferably 10% by weight or more, more preferably 20% by weight or more, and preferably 70% by weight or less, more preferably 65% ​​by weight or less. When the total is equal to or more than the lower limit and equal to or less than the upper limit, the effects of the present invention can be more effectively exhibited.

[0129] In the resin material, the weight ratio of the content of hollow inorganic particles (C) to the content of solid inorganic particles (E) (content of hollow inorganic particles (C) / content of solid inorganic particles (E)) is preferably 0.1 or more, more preferably 0.3 or more, even more preferably 0.7 or more, and preferably 10 or less, more preferably 8 or less, and even more preferably 5 or less. When the weight ratio (content of hollow inorganic particles (C) / content of solid inorganic particles (E)) is equal to or greater than the lower limit, the dielectric constant of the cured product can be further reduced. When the weight ratio (content of hollow inorganic particles (C) / content of solid inorganic particles (E)) is equal to or less than the upper limit, the tackiness can be further improved and the linear expansion coefficient of the cured product can be further reduced.

[0130] In the resin material, the volume ratio of the content of hollow inorganic particles (C) to the content of solid inorganic particles (E) (content of hollow inorganic particles (C) / content of solid inorganic particles (E)) is preferably 0.3 or more, more preferably 1 or more, even more preferably 2 or more, and preferably 30 or less, more preferably 20 or less, and even more preferably 10 or less. When the volume ratio (content of hollow inorganic particles (C) / content of solid inorganic particles (E)) is equal to or greater than the lower limit, the dielectric constant of the cured product can be further reduced. When the volume ratio (content of hollow inorganic particles (C) / content of solid inorganic particles (E)) is equal to or less than the upper limit, the tackiness can be further improved and the linear expansion coefficient of the cured product can be further reduced.

[0131] [Curing accelerator] The resin material preferably contains a curing accelerator. The use of a curing accelerator further accelerates the curing rate. Rapid curing of the resin material results in a uniform crosslinked structure in the cured product, a reduced number of unreacted functional groups, and a higher crosslink density. Furthermore, the use of a curing accelerator allows the resin material to be cured well even at a relatively low temperature. The curing accelerator may be used alone or in combination of two or more.

[0132] Examples of the curing accelerator include anionic curing accelerators such as imidazole compounds; cationic curing accelerators such as amine compounds; curing accelerators other than anionic and cationic curing accelerators such as organophosphorus compounds and organometallic compounds; and radical curing accelerators such as peroxides and azo compounds.

[0133] Examples of the imidazole compound include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole trimellitate, and 1-cyanoethyl-2-phenylimidazolium trimethylolate. limeritate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-dihydroxymethylimidazole.

[0134] Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine, diethylenetriamine, ethylenediamine, tris(dimethylaminomethyl)phenol, benzyldimethylamine, m-xylylenedi(dimethylamine), N,N'-dimethylpiperazine, N-methylpyrrolidine, N-methylhydroxypiperidine, m-xylylenediamine, isophoronediamine, N-aminoethylpiperazine, polyoxypropylenepolyamine, and 4,4-dimethylaminopyridine. The amine compound may also be a modified product of these amine compounds.

[0135] Examples of the organic phosphorus compound include organic phosphine compounds such as triphenylphosphine, tricyclohexylphosphine, tribenzylphosphine, diphenyl(alkylphenyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkylalkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, and alkyldiarylphosphine; and phosphonium salt compounds such as tetraphenylphosphonium tetraphenylborate.

[0136] Examples of the organometallic compound include zinc naphthenate, cobalt naphthenate, tin octoate, cobalt octoate, bisacetylacetonate cobalt(II), and trisacetylacetonate cobalt(III).

[0137] Examples of the peroxide include diacyl peroxides, peroxyesters, peroxydicarbonates, monoperoxycarbonates, peroxyketals, dialkyl peroxides, dibenzyl peroxide, dicumyl peroxide, hydroperoxides, and ketone peroxides.

[0138] The curing accelerator preferably contains an amine compound, an imidazole compound, a peroxide, an azo compound, or an organic phosphorus compound, and more preferably contains an imidazole compound or a peroxide, which can more effectively exert the effects of the present invention.

[0139] When the resin material does not contain a maleimide compound (D), the content of the curing accelerator in the resin material is preferably 0.01 part by weight or more, more preferably 0.05 part by weight or more, and preferably 10 parts by weight or less, more preferably 5 parts by weight or less, relative to 100 parts by weight of the total of the maleimide compound (A) and the radically polymerizable compound (B). When the content of the curing accelerator is equal to or more than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the effects of the present invention can be more effectively exhibited.

[0140] When the resin material contains a maleimide compound (D), the content of the curing accelerator in the resin material relative to 100 parts by weight of the total of the maleimide compound (A), the radically polymerizable compound (B), and the maleimide compound (D) is preferably 0.01 part by weight or more, more preferably 0.05 part by weight or more, and preferably 10 parts by weight or less, more preferably 5 parts by weight or less. When the content of the curing accelerator is equal to or more than the above lower limit and equal to or less than the above upper limit, the effects of the present invention can be more effectively exhibited.

[0141] [solvent] The resin material contains or does not contain a solvent. The resin material optionally contains a solvent. The resin material may or may not contain a solvent. By using the solvent, the viscosity of the resin material can be controlled within a suitable range, and the coatability of the resin material can be improved. The solvent may be used to obtain a slurry containing hollow inorganic particles (C), or may be used to obtain a slurry containing solid inorganic particles (E). Only one type of the solvent may be used, or two or more types may be used in combination.

[0142] Examples of the solvent include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, N,N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone, and naphtha, which is a mixture.

[0143] It is preferable that most of the solvent is removed when the resin composition is formed into a film. Therefore, the boiling point of the solvent is preferably 200°C or less, more preferably 180°C or less. The content of the solvent in the resin composition is not particularly limited. The content of the solvent can be appropriately changed taking into account the coatability of the resin composition, etc.

[0144] When the resin material is a B-stage film, the content of the solvent in 100% by weight of the B-stage film is preferably 1% by weight or more, more preferably 2% by weight or more, preferably 15% by weight or less, more preferably 10% by weight or less.

[0145] [Other ingredients] For the purpose of improving impact resistance, heat resistance, resin compatibility, workability, etc., the resin material may contain components other than the above-mentioned components (maleimide compound (A), radically polymerizable compound (B), hollow inorganic particles (C), maleimide compound (D), solid inorganic particles (E), curing accelerator, and solvent). Examples of the other components include curing agents, thermoplastic resins, organic fillers, leveling agents, flame retardants, coupling agents, colorants, antioxidants, UV inhibitors, antifoaming agents, thickeners, and thixotropic agents. One type of the other components may be used alone, or two or more types may be used in combination.

[0146] Examples of the curing agent include active ester compounds, phenol compounds, cyanate ester compounds, benzoxazine compounds, carbodiimide compounds, thiol compounds, phosphine compounds, dicyandiamide, and acid anhydrides.

[0147] Examples of the thermoplastic resin include styrene-butadiene-styrene block copolymers, styrene-ethylene-butadiene-styrene block copolymers, polyimide resins, phenoxy resins, polyvinyl acetal resins, etc. When the resin material contains the thermoplastic resin, the dielectric tangent of the cured product of the resin material can be further reduced, and the toughness of the cured product can be increased.

[0148] Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent, etc. Examples of the silane coupling agent include vinyl silane, amino silane, imidazole silane, and epoxy silane.

[0149] The resin material may or may not contain glass cloth. The resin material preferably does not contain glass cloth. The resin material preferably is not a prepreg.

[0150] (Resin film and laminated film) The resin composition described above can be molded into a film to obtain a resin film (B-staged product / B-stage film). The resin material is preferably a resin film. The resin film is preferably a B-stage film.

[0151] Examples of methods for forming a resin composition into a film to obtain a resin film include the following: an extrusion molding method in which a resin composition is melt-kneaded using an extruder, extruded, and then molded into a film using a T-die, circular die, or the like; a casting molding method in which a resin composition containing a solvent is cast into a film; and other conventionally known film molding methods. Extrusion molding and casting molding are preferred because they can be used to make thinner films. Films include sheets.

[0152] The resin composition is formed into a film and dried by heating at, for example, 50°C to 150°C for 1 minute to 10 minutes to an extent that curing by heat does not proceed too much, thereby obtaining a resin film that is a B-stage film.

[0153] The film-like resin composition obtained by the drying process described above is called a B-stage film. The B-stage film is in a semi-cured state. The semi-cured product is not completely cured, and curing can continue.

[0154] The resin film does not have to be a prepreg. When the resin film is not a prepreg, migration does not occur along the glass cloth or the like. Furthermore, when the resin film is laminated or precured, irregularities due to the glass cloth do not occur on the surface.

[0155] The resin film may be a laminated film having a cover film laminated thereon. The laminated film includes a resin film and a cover film, and the cover film is disposed on a first surface of the resin film. The cover film is a release film. The cover film is a film for protecting the surface of the resin film until the resin film is used. The resin film is used, for example, by peeling off the cover film and laminating the peeled surface onto an object such as a substrate. In the present invention, the tackiness can be improved, so that unintended peeling of the cover film from the resin film is unlikely to occur. Furthermore, the cover film can be easily peeled off from the laminated film during use.

[0156] As the cover film, a conventionally known cover film can be used.

[0157] The laminated film preferably includes a base film, which is preferably disposed on a second surface of the resin film opposite to the first surface.

[0158] Examples of the substrate film include polyester resin films such as polyethylene terephthalate film and polybutylene terephthalate film, olefin resin films such as polyethylene film and polypropylene film, and polyimide resin films. Examples of the substrate film also include metal foils (metal films). The surface of the substrate film may be subjected to a release treatment, if necessary.

[0159] The substrate film is preferably a polyester resin film, and more preferably a polyethylene terephthalate film.

[0160] The thickness of the base film is usually greater than the thickness of the cover film.

[0161] FIG. 1 is a cross-sectional view that schematically shows a laminated film that uses a resin material (resin film) according to one embodiment of the present invention.

[0162] The laminated film 5 shown in FIG. 1 includes a resin film 1, a cover film 2, and a base film 3. The resin film 1 has a first surface 1a and a second surface 1b. The first surface 1a and the second surface 1b are surfaces that face each other. The cover film 2 is disposed on the first surface 1a of the resin film 1. The base film 3 is disposed on the second surface 1b of the resin film 1.

[0163] From the viewpoint of controlling the degree of cure of the resin film more uniformly, the thickness of the resin film is preferably 5 μm or more and preferably 200 μm or less. When the resin film is used as an insulating layer of a circuit, the thickness of the insulating layer formed by the resin film is preferably equal to or greater than the thickness of the conductor layer (metal layer) that forms the circuit. The thickness of the insulating layer is preferably 5 μm or more and preferably 200 μm or less.

[0164] (Other details of resin materials) When the resin material is heated at 200° C. for 90 minutes to obtain a cured product of the resin material, the resulting cured product preferably has a dielectric constant (Dk) at 10 GHz of less than 3.0, more preferably less than 2.8.

[0165] The dielectric constant (Dk) of the cured product at 10 GHz can be measured as follows: The resin material is heated at 200°C for 90 minutes to obtain a cured product of the resin material. The dielectric constant (Dk) of the obtained cured product is measured by the cavity resonance method using a dielectric constant measuring device (for example, the "Cavity Resonance Perturbation Dielectric Constant Measuring Device CP521" manufactured by Kanto Electronics Application Development Co., Ltd.) at room temperature (23°C) and a frequency of 10 GHz.

[0166] When manufacturing electronic components such as multilayer substrates using the above resin material, the cured product may be obtained by heating at 200°C for 90 minutes, or the resin material may be heated under heating conditions other than these to obtain a cured product.

[0167] The resin material can be used for various purposes. For example, the resin material is preferably used to form a mold resin in which a semiconductor chip is embedded in a semiconductor device. The resin material is also preferably used as a replacement for liquid crystal polymer (LCP), a millimeter-wave antenna, or a rewiring layer. The resin material is not limited to the above purposes, but is preferably used for wiring formation purposes in general.

[0168] The resin material is preferably used as an adhesive material. The resin material is preferably used as, for example, an adhesive material for power overlay packages, an adhesive material for printed wiring boards, an adhesive material for coverlays of flexible printed circuit boards, or an adhesive material for semiconductor bonding. The resin material is preferably an adhesive material.

[0169] The resin material is preferably used as an insulating material. The resin material is preferably used to form an insulating layer in a printed wiring board, and more preferably to form an insulating layer in a multilayer printed wiring board. The resin material is preferably an insulating material, and more preferably an interlayer insulating material. The insulating material may also serve as an adhesive material.

[0170] The cured product according to the present invention is a cured product of a resin material obtained by curing the resin material described above. The cured product according to the present invention is a cured product of a resin material, and the resin material is the resin material described above. The cured product according to the present invention can be obtained by curing the resin material described above. The heating conditions for the resin material when obtaining the cured product according to the present invention are not particularly limited, as long as the resin material is cured.

[0171] (Laminated structures and copper-clad laminates) A laminated structure can be obtained by laminating a lamination target member having a metal layer on one or both sides of the resin film. The laminated structure comprises a lamination target member having a metal layer on its surface and a resin film laminated on the surface of the metal layer, the resin film being the resin material described above. The method for laminating the resin film and the lamination target member is not particularly limited, and known methods can be used. For example, the resin film can be laminated to the lamination target member using a device such as a parallel plate press or a roll laminator while applying pressure with or without heating.

[0172] The material of the metal layer is preferably copper.

[0173] The lamination target member having the metal layer on its surface may be a metal foil such as a copper foil.

[0174] The resin material is preferably used to obtain a copper-clad laminate. An example of the copper-clad laminate is a copper-clad laminate including a copper foil and a resin film laminated on one surface of the copper foil, the resin film being made of the resin material described above.

[0175] The thickness of the copper foil of the copper-clad laminate is not particularly limited. The thickness of the copper foil is preferably 1 μm or more and 100 μm or less. In addition, in order to increase the adhesive strength between the cured resin material and the copper foil, the copper foil preferably has fine irregularities on its surface. The method for forming the irregularities is not particularly limited. Examples of the method for forming the irregularities include a method using a known chemical solution, a known plasma treatment, and a known UV treatment.

[0176] (Insulating layer circuit board) The resin material is suitably used to obtain a circuit board with an insulating layer. One example of the circuit board with an insulating layer is a circuit board with an insulating layer that includes a circuit board and an insulating layer disposed on the surface of the circuit board, the insulating layer being a cured product of the resin material described above.

[0177] In the circuit board with an insulating layer, the insulating layer is preferably laminated on the surface of the circuit board on which the circuits are provided, and a portion of the insulating layer is preferably embedded between the circuits.

[0178] The above-mentioned circuit board with an insulating layer can be obtained by a conventionally known method.

[0179] (Multilayer boards and multilayer printed wiring boards) The resin material is preferably used to obtain a multilayer substrate. An example of the multilayer substrate is a multilayer substrate including a circuit board and an insulating layer laminated on the circuit board. The insulating layer of the multilayer substrate is a cured product of the resin material described above. The insulating layer is preferably laminated on the surface of the circuit board on which the circuits (metal layer) are provided. A portion of the insulating layer is preferably embedded between the circuits.

[0180] In the multilayer substrate, the surface of the insulating layer opposite to the surface on which the circuit board is laminated is preferably roughened.

[0181] The roughening treatment method is not particularly limited and may be a conventionally known roughening treatment method. The surface of the insulating layer may be subjected to swelling treatment before the roughening treatment. After the roughening treatment, it is preferable to perform ultrasonic treatment to remove the hollow inorganic particles (C) (and the solid inorganic particles (E)) from the surface of the insulating layer.

[0182] Preferably, the multilayer substrate further comprises a copper plating layer laminated on the roughened surface of the insulating layer.

[0183] Another example of the multilayer substrate is a multilayer substrate comprising a circuit board, an insulating layer laminated on the surface of the circuit board, and copper foil laminated on the surface of the insulating layer opposite to the surface on which the circuit board is laminated. Preferably, the insulating layer is formed by using a copper-clad laminate comprising copper foil and a resin film laminated on one surface of the copper foil and curing the resin film. Furthermore, the copper foil is preferably etched to form a copper circuit.

[0184] Another example of the multilayer substrate is a multilayer substrate including a circuit board and a plurality of insulating layers laminated on a surface of the circuit board. At least one of the insulating layers arranged on the circuit board is formed using the resin material. Preferably, the multilayer substrate further includes a circuit laminated on at least one surface of the insulating layer formed using the resin film.

[0185] The above resin material is preferably used to form an insulating layer in a printed wiring board, and more preferably used to form an insulating layer in a multilayer printed wiring board.

[0186] The multilayer printed wiring board includes, for example, a circuit board, a plurality of insulating layers disposed on a surface of the circuit board, and a metal layer disposed between the plurality of insulating layers, and at least one of the insulating layers is a cured product of the resin material described above.

[0187] FIG. 2 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin material according to one embodiment of the present invention.

[0188] In the multilayer printed wiring board 11 shown in FIG. 2, a plurality of insulating layers 13-16 are laminated on the upper surface 12a of a circuit board 12. The insulating layers 13-16 are cured layers. A metal layer 17 is formed on a partial region of the upper surface 12a of the circuit board 12. Of the plurality of insulating layers 13-16, the insulating layers 13-15 other than the insulating layer 16 located on the outer surface opposite the circuit board 12 have the metal layer 17 formed on a partial region of the upper surface. The metal layer 17 is a circuit. The metal layer 17 is disposed between the circuit board 12 and the insulating layer 13, and between each of the laminated insulating layers 13-16. The lower metal layer 17 and the upper metal layer 17 are connected to each other by at least one of via hole connection and through hole connection (not shown).

[0189] In the multilayer printed wiring board 11, the insulating layers 13 to 16 are formed from a cured product of the resin material. In this embodiment, the surfaces of the insulating layers 13 to 16 are roughened, and thus fine holes (not shown) are formed in the surfaces of the insulating layers 13 to 16. The metal layer 17 extends into the fine holes. In the multilayer printed wiring board 11, the width dimension (L) of the metal layer 17 and the width dimension (S) of the portion where the metal layer 17 is not formed can be reduced. In addition, the multilayer printed wiring board 11 provides good insulation reliability between upper and lower metal layers that are not connected by via hole connections or through hole connections (not shown).

[0190] The present invention will be specifically described below by way of examples and comparative examples, but the present invention is not limited to the following examples.

[0191] The following materials were prepared:

[0192] (Maleimide compound (A)) Maleimide compound having an indane skeleton (synthesized according to Synthesis Example 1 below)

[0193] <Synthesis Example 1> (1) Synthesis of intermediate amine compounds A 1 L flask equipped with a thermometer, condenser, Dean-Stark trap, and stirrer was charged with 48.5 g (0.4 mol) of 2,6-dimethylaniline, 272.0 g (1.4 mol) of α,α'-dihydroxy-1,3-diisopropylbenzene, 280 g of xylene, and 70 g of activated clay, and the mixture was heated to 120 °C with stirring. The mixture was then heated to 210 °C while removing the distillate using a Dean-Stark tube, and reacted for 3 hours. The mixture was then cooled to 140 °C, and 145.4 g (1.2 mol) of 2,6-dimethylaniline was added. The mixture was then heated to 220 °C and reacted for 3 hours. After the reaction, the mixture was air-cooled to 100 °C, diluted with 300 g of toluene, filtered to remove the activated clay, and low-molecular-weight substances such as the solvent and unreacted materials were distilled off under reduced pressure, yielding 364.1 g of an intermediate amine compound. The intermediate amine compound thus obtained had an amine equivalent of 298 and a softening point of 70°C.

[0194] (2) Maleimidation A 2-L flask equipped with a thermometer, condenser, Dean-Stark trap, and stirrer was charged with 131.8 g (1.3 mol) of maleic anhydride and 700 g of toluene and stirred at room temperature. Next, a mixed solution of 364.1 g of the intermediate amine compound and 175 g of DMF was added dropwise over 1 hour. After the dropwise addition was completed, the reaction was continued for another 2 hours at room temperature. Next, 37.1 g of p-toluenesulfonic acid monohydrate was added, and the reaction mixture was heated. The azeotropic water and toluene were cooled and separated under reflux, after which the toluene alone was returned to the system and the dehydration reaction was carried out for 8 hours. After air-cooling to room temperature, the mixture was concentrated under reduced pressure. The brown solution was dissolved in 600 g of ethyl acetate, washed three times with 150 g of ion-exchanged water and three times with 150 g of 2% aqueous sodium bicarbonate solution, and dried over sodium sulfate. The reaction mixture was then concentrated under reduced pressure, and the resulting reaction mixture was dried in vacuum at 80 °C for 4 hours to yield 413.0 g of a product containing a maleimide compound having an indane skeleton.

[0195] (Radical polymerizable compound (B)) Maleimide compound (Designer Molecules Inc. "BMI689", molecular weight 689) Acrylate compound (Osaka Organic Chemical Industry Co., Ltd. "Viscoat 230", molecular weight 226, 1,6-hexanediol diacrylate compound) Methacrylate compound ("DCP" manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight 332, tricyclodecanol methacrylate compound) Styrene compound (NS Styrene Monomer "DVB960", molecular weight 130, divinylbenzene compound) Allyl compound (Mitsubishi Chemical Corporation "TAIC", molecular weight 249, triallyl cyanurate compound)

[0196] (Hollow inorganic particles (C)) Hollow silica particles 1 (AGC "HS-070", average particle size: 0.6 μm, porosity: 70% by volume) Hollow silica particles 2 (Kao Corporation "KP-100-HS", average particle size: 1.0 μm, porosity: 66% by volume)

[0197] (Maleimide compound (D)) Maleimide compound (Designer Molecules Inc. "BMI3000J", number of maleimide groups: 2, weight-average molecular weight: 3000)

[0198] (Solid inorganic particles (E)) Solid silica particles (Admatechs "SC2050-HNG", average particle size: 0.5 μm)

[0199] (curing accelerator) Peroxide (NOF Corporation "Perbutyl P")

[0200] (thermoplastic resin) Styrene-based elastomer (Asahi Kasei Corporation "H1041") Polyimide resin (synthesized according to Synthesis Example 2 below, weight average molecular weight: 20,000)

[0201] <Synthesis Example 2> A reaction vessel equipped with a stirrer, a water divider, a thermometer, and a nitrogen gas inlet tube was charged with 300.0 g of tetracarboxylic dianhydride ("BisDA-1000" manufactured by SABIC Japan, LLC) and 665.5 g of cyclohexanone, and the solution was heated to 60°C. Next, 137.4 g of 4,4'-methylenebis(2-methylcyclohexylamine) (manufactured by Tokyo Chemical Industry Co., Ltd., aliphatic structure with 15 carbon atoms) was added dropwise. Subsequently, 121.0 g of methylcyclohexane and 423.5 g of ethylene glycol dimethyl ether were added, and the imidization reaction was carried out at 140°C for 10 hours, yielding a polyimide resin-containing solution (nonvolatile content: 26.6 wt%). The acid / amine molar ratio of the resulting polyimide resin was 1.04.

[0202] (Examples 1 to 12 and Comparative Examples 1 to 5) The components shown in Tables 1 to 3 below were mixed in the amounts (unit: parts by weight of solid content) shown in Tables 1 to 3 below, and stirred at room temperature until a uniform solution was obtained, to obtain a resin material.

[0203] Preparation of resin film: The resin material was applied to the release-treated surface of a release-treated polyethylene terephthalate film (PET film, Toray Industries, Inc., "XG284," 25 μm thick) using an applicator, and then dried in a gear oven at 100°C for 2 minutes and 30 seconds to volatilize the solvent. In this way, a 40 μm-thick resin film (B-stage film) placed on the PET film was obtained.

[0204] (evaluation) (1) Dielectric constant (Dk) and dielectric loss tangent (Df) of the cured product The resulting 40 μm-thick resin film (B-stage film) was heated at 200°C for 90 minutes to obtain a cured product. The resulting cured product was cut into a size of 2 mm wide and 80 mm long, and 10 sheets were stacked together to form a measurement sample. The dielectric constant (Dk) and dielectric loss tangent (Df) of the cured product were measured by the cavity resonance method at room temperature (23°C) and a frequency of 10 GHz using a Kanto Electronics Application Development Co., Ltd. "Cavity Resonance Perturbation Dielectric Constant Measurement Apparatus CP521" and a Keysight Technologies Inc. "Network Analyzer N5224A PNA."

[0205] [Criteria for dielectric constant (Dk) of cured product] ○: Dielectric constant is less than 2.8 △: Dielectric constant is 2.8 or more and less than 3.0 ×: Dielectric constant is 3.0 or more

[0206] [Criteria for dielectric loss tangent (Df) of cured product] ○○: Dielectric tangent is less than 0.003 ○: Dielectric tangent is 0.003 or more and less than 0.004 △: Dielectric tangent is 0.004 or more and less than 0.006 ×: Dielectric tangent is 0.006 or more

[0207] (2) Glass transition temperature (Tg) of the cured product The resulting 40 μm-thick resin film (B-stage film) was pre-cured by heating at 180°C for 30 minutes, followed by heating at 200°C for 90 minutes to obtain a cured product. The resulting cured product was cut into 5 mm x 50 mm pieces. Measurements were performed using a thermomechanical analyzer (SII NanoTechnology Inc., DMS6100) under the following conditions: chuck distance 20 mm, amplitude 10 μm, initial tension amplitude 400 mN, heating rate 5°C / min from 50°C to 330°C, and frequency 10 Hz. The peak temperature of the loss tangent was determined as the glass transition temperature (Tg) (°C).

[0208] [Criteria for determining the glass transition temperature (Tg) of the cured product] ○: Glass transition temperature is 150°C or higher △: Glass transition temperature is over 120℃ and less than 150℃ ×: Glass transition temperature is 120°C or less

[0209] (3) Average coefficient of linear expansion (CTE) of the cured product The resulting 40 μm-thick resin film (B-stage film) was pre-cured by heating at 180°C for 30 minutes, and then heated at 200°C for 60 minutes. The cured product was then cut into 3 mm x 25 mm pieces. The average linear expansion coefficient (ppm / °C) of the cut cured product from 25°C to 150°C was calculated using a thermomechanical analyzer (SII NanoTechnology, Inc., EXSTAR TMA / SS6100) under a tensile load of 33 mN and a heating rate of 5°C / min.

[0210] [Criteria for determining the average coefficient of linear expansion (CTE) of the cured product] ○○: Average linear expansion coefficient is 30 ppm / ℃ or less ○: Average linear expansion coefficient is more than 30 ppm / ℃ and 35 ppm / ℃ or less △: Average linear expansion coefficient is over 35 ppm / ℃ and 40 ppm / ℃ or less ×: Average linear expansion coefficient exceeds 40 ppm / ℃

[0211] (4) Tackiness The resulting 40 μm thick resin film (B-stage film) was cut into a size of 30 mm wide x 30 mm long to obtain a test piece. A probe tack test was performed on the surface of the resin film in the obtained test piece using a probe tack tester (RHESCA's "TAC-1000") under the conditions of 60 ° C, pressure of 98 gf, pressure rate of 100 mm / sec, pressure time of 10 seconds, and peel rate of 5 mm / sec. In this way, the probe tack value of the resin film at 60 ° C was measured.

[0212] [Criteria for determining tackiness] ○: Probe tack value is 30gf or more and less than 200gf △: Probe tack value is 10gf or more and less than 30gf ×: Probe tack value is less than 10 gf or 200 gf or more

[0213] Evaluation in laminated film: The resulting resin material was applied to the release-treated surface of a release-treated polyethylene terephthalate film (PET film, Toray Industries, Inc., "XG284," 25 μm thick) using an applicator, and then dried for 2 minutes and 30 seconds in a gear oven at 100°C to volatilize the solvent. A cover film (Oji F-Tex Co., Ltd., "MA-411") was then thermally laminated at 60°C. In this way, a laminate film (a laminate film of PET film, resin film, and cover film) was obtained in which a 40 μm-thick resin film (B-stage film) was disposed between the PET film (base film) and cover film. The following operations (1) and (2) were performed on the resulting laminate film.

[0214] Operation (1): Cut the laminated film. Step (2): Peel off the cover film from the laminated film.

[0215] For resin films having a probe tack value of 30 gf or more and less than 200 gf, the cover film did not unintentionally peel from the resin film when operation (1) was performed. Also, for resin films having a probe tack value of 30 gf or more and less than 200 gf, the cover film could be easily peeled from the resin film without adhering to the resin film when operation (2) was performed.

[0216] For resin films with a probe tack value of 10 gf or more and less than 30 gf, when operation (1) was performed, there were a few areas where the cover film unintentionally peeled from the resin film, but it was determined that this did not pose a problem in use. Furthermore, for resin films with a probe tack value of 10 gf or more and less than 30 gf, when operation (2) was performed, the resin film did not adhere to the cover film and the cover film could be easily peeled from the resin film.

[0217] When the resin film had a probe tack value of less than 10 gf, the cover film was often unintentionally peeled off from the resin film when operation (1) was performed. When the resin film had a probe tack value of 200 gf or more, the resin film was likely to adhere to the cover film when operation (2) was performed, making it difficult to peel the cover film from the resin film.

[0218] The compositions and results are shown in Tables 1 to 3 below.

[0219] [Table 1]

[0220] [Table 2]

[0221] [Table 3] [Explanation of symbols]

[0222] 1...Resin film 1a...First surface 1b...Second surface 2...Cover film 3...Base film 5...Laminated film 11...Multilayer printed wiring board 12...Circuit board 12a…Top surface 13~16...Insulating layer 17...Metal layer

Claims

1. a maleimide compound (A) having an indane skeleton; a radical polymerizable compound (B) that does not have an indane skeleton and has a molecular weight of less than 1,000; A resin material comprising hollow inorganic particles (C).

2. The resin material according to claim 1 , wherein the hollow inorganic particles (C) are hollow silica particles.

3. 3. The resin material according to claim 1, wherein the content of the maleimide compound (A) is 1% by weight or more and 80% by weight or less, based on 100% by weight of components excluding the solvent in the resin material.

4. 3. The resin material according to claim 1, wherein the content of the radical polymerizable compound (B) is 1% by weight or more and 40% by weight or less, based on 100% by weight of components excluding the solvent in the resin material.

5. The resin material according to claim 1 or 2, wherein the radical polymerizable compound (B) comprises a maleimide compound, a (meth)acrylate compound, a styrene compound, or an allyl compound.

6. The resin material according to claim 1 or 2, further comprising a maleimide compound (D) having no indane skeleton and having a molecular weight of 1,000 or more.

7. The resin material according to claim 1 or 2, further comprising solid inorganic particles (E).

8. The resin material according to claim 7 , wherein the solid inorganic particles (E) are solid silica particles.

9. The resin material according to claim 1 or 2, further comprising a curing accelerator.

10. The resin material according to claim 1 or 2, which is a resin film.

11. The resin material according to claim 1 or 2, which is used to form an insulating layer in a multilayer printed wiring board.

12. A resin film; and a cover film. the cover film is disposed on a first surface of the resin film; A laminated film, wherein the resin film is made of the resin material according to claim 1 or 2.

13. A substrate film is provided, The laminate film according to claim 12 , wherein the base film is disposed on a second surface of the resin film opposite to the first surface.

14. A cured product of a resin material, A cured product, wherein the resin material is the resin material according to claim 1 or 2.

15. A circuit board; a plurality of insulating layers disposed on a surface of the circuit board; a metal layer disposed between a plurality of the insulating layers; A multilayer printed wiring board, wherein at least one of the insulating layers is a cured product of the resin material according to claim 1 or 2.

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