Liquid immersion cooling platform and components thereof

Abstract

To optimize a temperature of a liquid immersion cooling system adapted to house computing devices.SOLUTION: A liquid immersion cooling system 100 comprises: a vessel 105 configured to hold thermally conductive, condensable dielectric fluid 113; a pressure controller 117 to reduce or increase an interior pressure of the vessel 105; a computer component 114 configured to be at least partially submerged in the dielectric fluid 113; a sump area 112 of the vessel 105; and a pump 115 configured to draw the dielectric fluid 113 from the sump area 112, pass the dielectric fluid 113 through a filter 118, and deliver the dielectric fluid 113 to a solution bath area 111 of the vessel 105.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application is owned by TMG Core, LLC, which is incorporated herein by reference. "Liquid Immersion Cooling," filed on November 11, 2019 The pamphlet for International Publication No. 2020 / 102090, entitled "The 2020 Digital Platform" This application is further related to U.S. Provisional Patent Application No. 63 / 209,258, U.S. Provisional Patent Application No. No. 63 / 278,223, U.S. Provisional Patent Application No. 63 / 278,175, U.S. Provisional Patent Application No. 63 / 278,178, U.S. Provisional Patent Application No. 63 / 278,167, U.S. Provisional Patent Application No. 63 / 278,312, U.S. Provisional Patent Application No. 63 / 278,358, U.S. Provisional Patent Application No. 63 / 278,365, and U.S. Provisional Patent Application No. 63 / 278,330 .

[0002] Field of Disclosure The present disclosure relates to an immersion cooling system adapted to house a computing device, e.g. , a control system and a computing device for optimizing the temperature of the system. Regarding the cooling system. [Background technology]

[0003] Conventional computing systems and / or server systems are subject to various configurations of these systems. It uses air to cool the components. uses a flowing liquid to extract heat from computer components, Avoid direct contact between components and the liquid itself. Developments in dielectric fluids and / or immersion cooling have made it possible to utilize immersion cooling, where the structure Computer components and other electronic devices to extract heat directly from the components into a liquid The device may be submerged in a dielectric liquid or a liquid that is electrically non-conductive. This can be utilized to reduce the total energy required to cool the components of the It also reduces the amount of space and equipment required for cooling. Summary of the Invention

[0004] Immersion cooling systems are implemented for a variety of computing needs. Easily adapted for any hardware specifications for the controller, fluid input and fluid output It is instructive to describe an immersion cooling system that can be implemented.

[0005] Advantageously, the present application provides an exemplary immersion cooling system and a method for operating the system. In one exemplary embodiment, the system is a thermally conductive, condensable dielectric. thermally conductive, condensable d a vessel configured to hold an electric fluid; a pressure control device for reducing or increasing the internal pressure; and a dielectric fluid and a computer component configured to be submerged in a reservoir area ( Dielectric fluid is drawn in from the sump area and passed through the filter. The dielectric fluid is passed through the vessel and delivered to a bath area of ​​the vessel. and a fluid circulation system formed therein.

[0006] In one exemplary embodiment, the system receives a dielectric fluid from a source external to the vessel. In one exemplary embodiment, the system may include an inlet for receiving A valve system may be provided for connecting or disconnecting the fluid circulation system to the inlet. In one exemplary embodiment, the fluid circulation system can include a pump. In an exemplary embodiment, the system operates in a first operating mode with a pump connected to the inlet. and to instruct the valve system to operate at a The pump may include a management system configured to instruct the pump to In one exemplary embodiment, the system includes a retractable hose connected to the supply. The device may include a retractable hose that includes a sensor for detecting whether the hose is in use or not.

[0007] In one exemplary embodiment, the management system includes a retractable hose connection to the supply source. to instruct the pump to draw dielectric fluid from the source only if In one exemplary embodiment, the system is configured such that the pump is instructing the valve system to operate in the connected second operating mode; and a management system configured to instruct a pump to draw fluid from a supply; It can be equipped with:

[0008] In one exemplary embodiment, the system includes a plurality of pipes and at least one box. In one exemplary embodiment, the pressure control device includes a heat exchanger. The pressure control device includes a heat exchanger including a plurality of pipes and at least one box. In one exemplary embodiment, a plurality of pipes or at least one bottle At least one of the boxes may include a vibration damper. In this case, the vibration damper can be a metal weight.

[0009] In one exemplary embodiment, the system includes a plurality of sensors and a computer component. to receive temperature-related sensor data and to measure the temperature of computer components; and a management system configured to determine a filter failure based on the In one exemplary embodiment, the sensor data may include the temperature of a computer component. temperature, power consumption at the vessel, external temperature, dielectric fluid temperature, incoming cooling medium temperature temperature, exiting coolant temperature, coolant flow rate, temperature in the area above the bath area, The number of computer components present in the vessel, or each computer configuration in the vessel It can contain the position of the element.

[0010] In one exemplary embodiment, the management system detects when a computer component is overheating. The system may be configured to use a machine learning model to determine whether the device is In an embodiment, the machine learning model is trained using sensor data received from the vessel. It can be refined.

[0011] In one exemplary embodiment, the pressure control device is configured to receive a dielectric vapor. In one exemplary embodiment, the bellows includes a bellows to define the volume of the bellows. and a management system configured to receive data from the sensor. In one exemplary embodiment, the management system may be configured to receive temperature data. In one exemplary embodiment, the management system determines the state of operation of the vessel. In one exemplary embodiment, the operating conditions include: 1) a heat exchanger; 1) Start-up or shutdown of the device, 2) combustion of the dielectric fluid, and 3) leakage of the dielectric fluid. In one exemplary embodiment, the management system processes the data received from the sensors and the temperature data. The method is further configured to determine the state of operation of the vessel using a machine learning model based on the data. It can be done.

[0012] In one exemplary embodiment, the computer components are configured with a two-phase heat sink. In one exemplary embodiment, a two-phase heat pump may be used. The sink may include a hollow box with a liquid medium and two elongated metal surfaces. In one exemplary embodiment, the vessel may be protected by a secondary layer. In an embodiment, the secondary layer may be parallel to the inner layer. The sir may be disposed between the secondary layer and the inner layer.

[0013] In one exemplary embodiment, the system contains a dielectric fluid that is thermally conductive and condensable. a vessel configured to hold a dielectric fluid; and a dielectric fluid configured to be at least partially submerged in the dielectric fluid. and a computer component configured to hold the computer component and the dielectric fluid. and a chassis configured to draw a dielectric fluid from a reservoir area of ​​the vessel. configured to pass the dielectric fluid through the filter and deliver the dielectric fluid to the chassis; and a fluid circulation system.

[0014] In one embodiment, the chassis includes a fluid conduit for receiving the dielectric fluid from the fluid circulation system. In one embodiment, the fluid connector may include a chassis disposed within the vessel. In one embodiment, the fluid connector may be configured to open when the chassis is placed The device may be configured to close when configured to be removed from the chassis.

[0015] In one embodiment, the chassis can include a heat exchanger. The heat exchanger may be configured to receive a cooling medium from the cooling medium connector. In one embodiment, the chassis is configured to maintain a level of the dielectric fluid. The chassis is constructed so that the vapor of the dielectric fluid does not escape from the chassis. It can be opened to allow entry into the vessel.

[0016] In one embodiment, the system includes a fluid level sensor for determining the level of the dielectric fluid. In one embodiment, the fluid level sensor may be located within the chassis. In one embodiment, the system receives the dielectric fluid from a source external to the vessel. The facility may include an entrance for

[0017] In one embodiment, the system includes a switch for connecting or disconnecting the fluid circulation system to the inlet. In one embodiment, the fluid circulation system may include a pump. In one embodiment, the system may detect when the level of the dielectric fluid drops below a threshold amount. to instruct the valve system to operate in a first operating mode and a management system configured to direct the pump to draw dielectric fluid from the It can include.

[0018] In one embodiment, the source may include a source fluid level sensor. The management system notifies the central server when the source fluid level drops below a threshold amount. In one embodiment, the threshold amount may be configured to transmit a signal. In one embodiment, the threshold amount is a threshold value determined by artificial intelligence over a predetermined period of time. The amount of fluid required to operate the system.

[0019] In one exemplary embodiment, the system receives the dielectric fluid from a source external to the vessel. In one exemplary embodiment, the system may include an inlet for receiving fluid. A valve system may be provided for connecting or disconnecting the circulation system to the inlet In one exemplary embodiment, the fluid circulation system may include a pump. In the illustrated embodiment, the system operates in a first mode of operation with a pump connected to the inlet. and to direct the valve system to operate and to draw dielectric fluid from the source. The pump may include a management system configured to instruct the pump to: In one exemplary embodiment, the system includes a retractable hose connected to the supply. The device may include a retractable hose that includes a sensor for detecting whether the device is in operation.

[0020] In one exemplary embodiment, the management system includes a retractable hose connection to the supply source. to instruct the pump to draw dielectric fluid from the source only if In one exemplary embodiment, the system is configured such that the pump is connected to the reservoir area. and to instruct the valve system to operate in a second operating mode connected to the A management system configured to instruct a pump to draw fluid from a supply. It can be prepared.

[0021] In one exemplary embodiment, the computer component includes a releasable rail. In one embodiment, the computer may be connected to one or more adapters capable of The element can slide into the rack using rails.

[0022] In one embodiment, the system includes a thermally conductive, condensable dielectric fluid holding a tank, a pressure control device for reducing or increasing the internal pressure of the tank, and a dielectric fluid and a computer component that can be at least partially submerged in a gas phase dielectric fluid. a robot capable of picking up computer components; and a Raman spectrometer operably connected to the controller. The controller receives test results from the Raman spectrometer and triggers corrective action based on the test results. You can do this.

[0023] In one embodiment, the system is adapted to hold a dielectric fluid that is thermally conductive and condensable. 1. A tank configured, wherein the tank can be operably connected to a bellows. a tank and one or more computers at least partially immersed in a dielectric fluid. a rack configured to hold the controller components; and a dielectric fluid for condensing the dielectric fluid in a gas phase. a metal retaining plate configured to be attached to the bottom of the tank; configured to be releasably attached to the retaining plate and to one or more a plurality of filler plates configured to underlie the computer components; It can be done.

[0024] In one embodiment, the system is adapted to hold a dielectric fluid that is thermally conductive and condensable. a tank configured, wherein the tank is operably connected to a bellows; a tank and one or more computers at least partially submerged in the dielectric fluid. a rack configured to hold the dielectric fluid; and a dielectric fluid for condensing the dielectric fluid in a gas phase. a condenser and a platform configured to be attached to the bottom of the tank using a shock absorber; vehicle configured to provide data connectivity to the form and power and tanks and

[0025] The exemplary system includes a battery to provide power and a data connection to the tank. and an antenna for providing connectivity. In this exemplary system, the vehicle is driven from the condenser outside the tank. The heater may include heat vents for transferring heat from the heater.

[0026] This Summary is presented in a simplified form to illustrate certain selection criteria that are further described below in the Detailed Description. This summary is provided to introduce some concepts of the claimed subject matter. are not intended to identify essential or characteristic features, and are not intended to limit or limit the scope of the claimed subject matter. It is not intended to be used as an aid in determining the scope of

[0027] To describe how the above-mentioned or other advantages and features may be achieved. For this purpose, reference will now be made to specific embodiments, as briefly described above, which are illustrated in the accompanying drawings. The subject matter will now be more particularly described. It should be understood that these drawings depict only exemplary embodiments. Therefore, the accompanying drawings should be used with the understanding that they should not be considered limiting in scope. The embodiments will now be described and explained with additional specificity and detail. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 illustrates an immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 2] FIG. 1 illustrates another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 3] FIG. 1 illustrates another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 4] FIG. 1 illustrates another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 5] FIG. 1 illustrates an exemplary two-phase heat sink according to an example embodiment. [Figure 6] FIG. 1 illustrates an exemplary immersion cooling system including an inner layer and a secondary layer. [Figure 7] FIG. 1 illustrates an immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 8] 1 illustrates an exemplary chassis according to an exemplary embodiment of the present disclosure. [Figure 9] FIG. 1 illustrates another immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 10A] 1 is an exemplary top view arrangement showing chassis within a storage area according to an exemplary embodiment. [Figure 10B] 10 is another exemplary top view arrangement showing chassis within a storage area according to an exemplary embodiment. [Figure 11] FIG. 1 illustrates an immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 12] FIG. 1 illustrates an immersion cooling system according to an exemplary embodiment of the present disclosure. [Figure 13] 1 illustrates an exemplary embodiment of a heating element according to an exemplary embodiment. [Figure 14A]1 illustrates an exemplary adapter for both sides of a computer component in an unmounted position. [Figure 14B] 1A and 1B show exemplary adapters for both sides of a computer component in a mounting position. [Figure 15] 1 illustrates an exemplary adapter for both sides of a computer component in an attached position on the right side of the computer component and in an unattached position on the left side of the computer component. [Figure 16] 1 illustrates a rail assembly for an example adapter of the present application. [Figure 17] 1 illustrates an exemplary carrier bracket assembly. [Figure 18] 1 illustrates an example computer component with an adapter described herein being slid into an immersion cooling rack. [Figure 19] FIG. 1 illustrates an exemplary immersion cooling system including a Raman spectrometer. [Figure 20] 1 illustrates an exemplary bottom support plate attached to the bottom or floor of an immersion cooling fluid tank. [Figure 21] FIG. 1 illustrates an exemplary immersion cooling system installed on a truck. DETAILED DESCRIPTION OF THE INVENTION

[0029] Illustrative embodiments of the present invention will now be described to illustrate various features of the present invention. The embodiments described herein are not intended to limit the scope of the invention, but rather to provide a general understanding of the invention. The examples are intended to provide examples of components, uses, and operations.

[0030] Immersion Cooling System In one exemplary embodiment, an immersion cooling system or vessel includes a bath area and a reservoir area. a tank area, a computing device, a robot, a pressure control system, and a management system. The vessel may be at atmospheric pressure (or The computing device may be a pressure-controlled tank that maintains the pressure within the vessel's solution. The computing device may be immersed in a dielectric fluid within the bath area. Various processing and computational tasks can be performed while immersed in a solvent. The system may include a lid for accessing the bath area, the computing device, and the reservoir area. The vessel can be fluidly connected to a pressure control system. When the robot is in use, the computing device can be lifted out of the bath area of ​​the vessel. The vehicle may be lifted into a magazine provided for storage of the computing device or on the vehicle. The robot can also place the computing device in the magazine (or The computing device can be lifted from the vehicle and the lifted computing device can be lifted from the solution bath area. This computing device can be placed at the location of the device. The robot can It may be mounted on both or in other locations.

[0031] In one embodiment, the management system may be configured with or without software. The signal may be generated by any of the sensors included in the immersion cooling system. In one embodiment, the management system may be configured to receive any data that has been adjusted. , can provide warnings, and / or can provide information such as sensor readings Based on this, other appropriate actions can be taken. For example, the management system may Can regulate or control, can regulate fluid flow or temperature, can regulate pressure The system may also include information about fluid level, fluid purity, and / or any number of other system parameters. Such adjustments are often made to one or more of the immersion cooling systems. is based on a plurality of sensed parameters.

[0032] FIG. 1 illustrates an immersion cooling system 100 according to an exemplary embodiment of the present disclosure. In an embodiment, the immersion cooling system 100 may include a vessel 105 and a vehicle 130. The vessel 105 includes a solution bath area 111, a reservoir area 112, and a fluid 113. , a computer component 114, a pump 115, a filter 118, and a door 116. , a tank 11 including a management system 117, a heat exchanger 119, and a perforated plate 120. 0. The computer components 114 can be submerged in the fluid 113 The vehicle 130 may include a robot 131. The robot 131 may The computer component 114 can be lifted while the computer is in use, The element 114 may be disposed on the vehicle 130 .

[0033] Fluid Transfer Systems In one exemplary embodiment, the vessel receives the dielectric fluid from a source external to the tank. A device for removing and / or disposing of fluids from a tank outside the tank. A fluid transfer system may be included to remove the fluid from the dielectric fluid. Often, the dielectric fluid is The fluid is delivered in large containers. From these containers, the fluid is transported to the tanks of the immersion cooling system. Transferring the tanks from the container can be tedious and time-consuming. External pumps and hoses are used to transport fluid to the pump. Could the dielectric fluid spill because the components may not be properly sealed? or may evaporate and thus become wasted. Furthermore, pumps and hoses may Because they are external to the system, these components can collect dust and debris; Dust and debris are a critical component for the dielectric fluid and are cooled by the dielectric fluid. It is detrimental to the computational components.

[0034] In one exemplary embodiment, the fluid transfer system includes an inlet, a pump, and a fluid transfer system connecting the inlet to the pump and and various pipes connecting to the tanks (e.g., the solution bath area or the reservoir area). In this exemplary embodiment, the inlet may be attached to and detached from the container using a hose. The pump can be connected to the inlet using a hose to transfer the dielectric flow from the container. The pump can then be used to pull the body in. can be used to transfer fluid to a tank (e.g., a solution bath area or a reservoir area). In one exemplary embodiment, the pump is configured to draw fluid from the tank and and may be configured to transfer fluid through the inlet to outside the tank. , the pump can be a bidirectional pump, e.g., in one mode of operation, the pump pumps from the container In a second mode of operation, the pump draws fluid from the tank. It can be done.

[0035] In one exemplary embodiment, the fluid transfer system includes multiple inlets and / or outlets. Each inlet and / or outlet may be connected to a pump. In this embodiment, the pump may be dedicated to drawing fluid from In another example, the inlet (or outlet) can be , may be dedicated to transporting fluid out of the tank using a pump. The transfer system may include multiple inlets, with two or more of the inlets being connected to the pump. In this embodiment, the pump may connect one or more of the inlets to the pump. may be fluidly coupled to two or more inlets through a valve system configured to connect to The pump draws fluid from a container or transfers fluid out of the tank. It can be configured as follows.

[0036] In one exemplary embodiment, the fluid transfer system can include a filter. In an exemplary embodiment, the fluid transfer system may be configured to filter the fluid before delivering it to the tank. In another embodiment, the fluid transfer system may include a As the stem transports the fluid to the outside of the tank, it passes through a dielectric fluid filter. can be passed.

[0037] In one exemplary embodiment, the fluid transfer system can include multiple modes of operation. In a first mode of operation, the fluid transfer system receives fluid from a container located outside the tank. The fluid transfer system may optionally include a In this embodiment, the filter can be located before the pump or after the pump. In the second mode of operation, The fluid transfer system can draw fluid from the tank and deliver the fluid to the outside of the tank. The fluid transfer system can optionally transfer fluid to the outside of the tank. In this embodiment, the fluid can be passed through a filter before The pump can be located either before or after the pump. The fluid transfer system can circulate the fluid within the tank. For example, a pump can This allows fluid to be drawn in from the bath area and transported to the solution bath area. As another example, the pump can draw fluid from the reservoir area, The fluid transfer system can optionally include a filter. In this embodiment, the filter is It can be located in front of or behind the pump.

[0038] In one exemplary embodiment, the fluid transfer system includes a plurality of pumps, a valve system, and a In one embodiment, the valve system may include a plurality of inlets and / or outlets. The system can use pipes to connect any inlet and / or outlet to any pump. In one embodiment, the valve system may be configured to couple any pump to the bath area and / or reservoir. In this exemplary embodiment, the management system can be connected to a user interface. The user interface may be located on the vessel. or can be located remotely from the vessel (e.g., (These are connected via a network such as the Internet.) The user can start or stop any pump. to instruct the fluid delivery system to start or stop the pump, as well as to control the pump to any specified to instruct the valve system to connect to the appropriate area and / or inlet / outlet. A user interface can be used.

[0039] FIG. 2 illustrates an immersion cooling system 200 according to an exemplary embodiment of the present disclosure. In an embodiment, the immersion cooling system 200 includes an inlet 230, a valve system 240, and a pump 2. 15 and a filter 218. The pump 215 and / or valve system The system 240 may be in communication with the management system 117, such that the pump 215 and / or Alternatively, the valve system 240 may receive signals and commands from the management system 117. The inlet 230 can be in fluid communication with a valve system 240 using a pipe. The valve 240 may be connected to the reservoir area 112 and the pump 215 using pipes. The system 240 fluidly connects the pump 215 to the inlet 230 or reservoir area 112. The inlet 230 can be a three-way valve that can be connected to, for example, a hose 250. It may be connected to a container 260 outside the tank 110 .

[0040] In one mode of operation, the management system 117 connects the inlet 230 to the pump 215. In this mode of operation, the valve system 240 can be commanded to 15 can draw fluid from a container through inlet 230 and deliver fluid to the bath In another mode of operation, the management system 117 may Commanding the valve system 240 to connect the reservoir area 112 to the pump 215 In this mode of operation, the pump 215 draws fluid from the reservoir area 112. The fluid can be transported to the solution bath area 111.

[0041] In this exemplary embodiment, the filter 218 is located upstream of the pump 215. The pump 215 draws fluid from the inlet 230 or reservoir area 112. As the fluid enters the filter, it can filter the incoming fluid. Other arrangements are possible. For example, , filter 218 may be bypassed in certain modes of operation but not used in other modes of operation. As another example, the filter 218 may be located downstream of the pump 215.

[0042] In one exemplary embodiment, the hose 250 is a retractable hose that can be stored within the vessel 105. In this exemplary embodiment, the dielectric fluid is drawn from the container 260. When it is necessary to insert the hose 250 into the vessel 105, the user can pull the hose 250 out of the vessel 105. and the hose 250 can be connected to the container 260. In this state, the hose 260 may be pulled out of the vessel 105, for example, when the hose 250 is pulled out of the vessel 105. or a sensor 255 that can be activated when the hose 250 is connected to the container 260. In this example embodiment, the sensors are in communication with the management system 117. It could be.

[0043] In one exemplary embodiment, the management system 117 pumps the water into the container 26 via the pump 215. Pull hose 250 out or hose 250 out before allowing fluid to be drawn in from 50 to the container 260. In this example embodiment, , when the valve system 240 is in a mode in which the inlet 230 is connected to the pump 215, The management system either pulls the hose 250 to the outside or connects the hose 250 to the container 260. In one exemplary embodiment, the valve system 240 When the reservoir area 112 is in a connected mode to the pool 215, the management system 11 7 may not interfere with the operation of the pump 215, i.e., the pump 215 is in the sump area. Fluid can be drawn from 112.

[0044] In one exemplary embodiment, the management system 17 may be configured to initiate a policy change when a trigger condition is met. A valve system 240 can be commanded to connect pump 215 to inlet 230. An exemplary trigger condition can be a change in the acidity of the conducting fluid 113. In one embodiment, the vessel 105 includes a sensor capable of determining the acidity of the dielectric fluid 113. If a change in acidity is detected, the computer component 114 may There is a risk that the fluid 113 may be damaged. Therefore, the management system 117 must quickly dispose of the fluid 113. For example, the fluid 113 can be removed from the bath area 111 to the outside of the tank 110. It can be pumped out with

[0045] In one exemplary embodiment, the trigger condition may be a change in fluid level within the tank 110. In this exemplary embodiment, the vessel 105 may include a fluid level sensor. When the fluid level in the tank 110 or in the bath area 111 drops below a threshold amount , the management system 117 can draw fluid, for example, into a reservoir area If fluid is present in 112, the management system 117 pumps the reservoir area 112 to the pump 21. 5. As another example, the valve system 240 can be commanded to connect For example, when hose 250 is connected to container 260, management system 117 may The management system 117 can also issue commands to the portal 230 for the 215. A pump is used to draw fluid into a tank to increase the level of the fluid in the tank. You can also issue commands to the 215.

[0046] Vibration Control System In one exemplary embodiment, the heat exchanger in the immersion cooling system is located outside the vessel. It may include a plurality of pipes capable of receiving a cooling medium from a source. The medium can travel through pipes, for example above the bath area, In one exemplary embodiment, the pipes are Each box may be fluidly connected to a source of cooling medium. In some operating modes, the cooling medium is High flow rates can create stresses and vibrations in the box and / or pipes It can travel through pipes and boxes. Often, boxes and / or Pipes or structures are connected to each other and to other structures via welding. Movement can cause mechanical failures within the system, for example, failure of some of the pipes and boxes. The welded connection of any one of the boxes can be broken, allowing the cooling medium to escape into the bath outlet of the vessel. When the cooling medium is mixed with the dielectric fluid, the dielectric fluid This can lead to a deterioration in the quality of the electrical system and subsequent electrical failures.

[0047] Thus, in one exemplary embodiment, the stresses and at one or more boxes or pipes to neutralize the harmful effects of vibration In one exemplary embodiment, the vibration damper is a mass. ) or weight, for example a metal mass. In one embodiment, the pipe A vibration sensor may be included to measure vibrations, and if the vibrations exceed a threshold, The sensor can send a signal to the management system. Upon receiving the signal, the management system A warning notice may be displayed to the operator of the immersion cooling system or the management system may The system can notify a central server, e.g. It can indicate that inspection and repair is required.

[0048] FIG. 3 illustrates an immersion cooling system 300 according to an exemplary embodiment of the present disclosure. In an embodiment, the immersion cooling system 300 includes a vessel 305. The vessel 305 is The system may include a computer component 314, a robot 331, and a heat exchanger 319. The heat exchanger 319 includes a plurality of pipes (or coils) 361, a box 362, and a duct. In this exemplary embodiment, the damper 363 is a metal weight. The damper 363 can be, for example, plastic, polycarbonate, or a dielectric It may also be made from other substances, such as any material that is compatible with the fluid. Alternatively, the damper 364 may be attached to the pipe. In one exemplary embodiment, the damper It may be inside or outside the type or box.

[0049] Fluid Quality Detection Device In one exemplary embodiment, the immersion cooling system includes a dielectric fluid within the bath area. The bath area may be comprised of one or more containers that are submerged within the bath area. computer components and other components such as wires, electrical circuits, connectors, etc. These components can be washed away using a dielectric fluid, thus May contain dust, debris, grease, and other contaminants that can contaminate the dielectric fluid Heat-generating components of computer components (e.g., CPU, GPU, or RA) M) vaporizes the contaminated fluid, these contaminants generate heat. It can accumulate as a residue on the components, but the residue is not a heat generating component. the heat transfer from the heat-generating components to the dielectric fluid. The rate at which heat is generated can be reduced. There is a possibility of heat.

[0050] Filtration can be used to control contamination in tanks, but filters can become Currently, it is not possible to accurately determine whether a filter's effectiveness has been compromised. The sensors that can provide live data are There is no pressure sensor that can be used to check the pressure drop in the filter. These changes are not significant enough to detect a slight decrease in filtration quality. Periodic analytical testing of the fluid will determine whether the fluid has become contaminated (and therefore whether the fluid is contaminated). (whether the filter is no longer able to function as intended) However, these tests do not provide live data.

[0051] According to an exemplary embodiment, the dielectric fluid may contain contaminants and the filter may A heat generating component is used as an indicator of whether the fluid can no longer be cleaned. In one exemplary embodiment, each computer component may be configured Temperatures can be determined for elements (e.g., thermometers, sensors, power consumption information, or using other devices, technology, or information). Computer components may use this information The management system can then send the information to the management system. Temperature information can be received from the element.

[0052] In addition, the management system may monitor, for example, power consumption, external temperature, and external pressure at the vessel. , the temperature of the dielectric fluid, the temperature of the incoming cooling medium, the temperature of the outgoing cooling medium, flow rate, temperature in the area above the bath area, and computer components present within the vessel The system may receive additional information such as the number of Some or all of this information (and / or other information) may be used by each or some of the computer components temperature predictions If the temperature of a computer component exceeds the predicted temperature by more than a threshold, the management system The system can indicate that a computer component is overheating.

[0053] Depending on how many computer components are overheating, the management system can have a variety of consequences. For example, one of the computer components If a computer is overheating, the management system will It can be inferred that the computer components require manual inspection. If a majority of components (e.g., more than 50%) are overheating, indicates that the dielectric fluid is contaminated and / or the filter needs replacing. We can infer that various numbers of computer components are overheating. Those skilled in the art will recognize that a management system can reach a similar conclusion based on In one embodiment, if the number of overheating components is less than a first threshold, In this case, the management system will detect that an overheating computer component requires manual inspection. In another embodiment, a computer that is overheating may be indicated. If the number of components exceeds a second threshold, the management system determines that the quality of the dielectric fluid has deteriorated. and / or the filter needs replacing. .

[0054] In one exemplary embodiment, the model may be a machine learning model. Or it can be trained using historical data received from other vessels. For example, the temperature of each calculation component, the power consumption at the vessel, the external temperature, and the temperature of the dielectric fluid. ,Incoming cooling medium temperature,Outgoing cooling medium flow rate,Cooling medium flow rate,Solution bath area the temperature of the area above the vessel, the number of computer components present in the vessel, or the These data (and and / or other data) to predict temperatures for computer components. It can be used to train a learning model.

[0055] In one exemplary embodiment, a sensor is used to determine whether the fluid is contaminated. For example, the sensor can include a heater, a surface, or a thermometer. The heater is capable of generating a predetermined amount of heat. In one embodiment, the thermometer measures the temperature of the surface. The model can be provided with data on the change in temperature of a surface for a given amount of heat. Based on this behavior, the model determines whether the sensor is overheating and / or It is possible to predict whether or not contaminants are present in the

[0056] Heat Exchanger Control and Detection System In one exemplary embodiment, the immersion cooling system can include a pressure control system. The pressure control system consists of a heat exchanger, bellows, and a vapor-air separator. r separator). In one embodiment, the computer configuration element When the element generates heat, the dielectric fluid evaporates and the pressure in the tank increases. can perform one or more procedures in response to evaporation and increased pressure. For example, the control system may be configured to allow steam to condense and to prevent pressure drops. Instructs the heat exchanger to circulate the cooling medium at a higher rate as possible In another example, the management system may detect when a portion of the air in the tank is released. and thus allowing the pressure to drop again. In another example, the control system may be configured to control the amount of excess steam. to allow the pressure in the tank to drop. The valve can be opened to allow

[0057] In one embodiment, the immersion cooling system can operate at atmospheric pressure. The processing demands for the elements (and thus the power consumed by the computer components) The bottom line is that it can be unpredictable. As the processing demands on computer components fluctuate, The computer components may generate dielectric vapors, or the dielectric vapors may condense (i.e., (It can become a liquid.) Because the tank has a fixed volume, the bellows The volume of the cylinder can be expanded or contracted to maintain the internal pressure at atmospheric pressure. Therefore, the bellows both accepts the dielectric vapor and returns the vapor to the tank. For example, if there is a sudden increase in processing demand, the bellows When process demand decreases, the bellows returns the steam to the tank. For optimal performance of the bellows, i.e. to effectively receive vapors from the tank, The bellows shall be fitted with a positive For example, the bellows may be approximately 50% filled during normal operation. For example, if a sudden increase in processing demand is expected rather than a decrease in processing demand, The bellows may be about 30% filled, for example less than half filled.

[0058] In one exemplary embodiment, the management system monitors at least one condition of the immersion cooling system. The ideal gas law is used to make predictions about the state and / or to implement responsive procedures. For example, an immersion cooling system can be used in a tank. a temperature sensor located within the bellows and a sensor for determining the change in volume of the bellows (e.g. It includes multiple sensors, including a sensor to determine changes in bellows height. The management system can receive data from each sensor.

[0059] The temperature sensor indicates an increase in tank temperature and the volume sensor indicates an increase in bellows volume. If the temperature reading is too high, the control system will detect that steam has been generated in the tank and that the heat exchanger has started. It can be determined that the cooling medium flow rate can be increased. In this exemplary embodiment, the volume of the bellows regulates the amount of cooling medium circulating within the heat exchanger. For example, increasing the flow rate of the cooling medium can cause the steam to condense, Similarly, a temperature sensor may indicate a drop in tank temperature, causing the volume to decrease. If the vapor sensor indicates a reduction in the volume of the bellows, the control system will detect the vapor buildup in the tank. Condensation may occur and the heat exchanger may be shut down (i.e., the cooling medium flow rate is reduced). In this exemplary embodiment, the volume of the bellows is determined by the thermal The amount of cooling medium circulating in the exchanger can be controlled by adjusting the amount of cooling medium. A reduction in the volume of the bellows may allow more vapor to be produced, increasing the volume of the bellows. do.

[0060] In one embodiment, the flow rate of the cooling medium is controlled by the volume of the bellows and / or the change in the volume of the bellows. In one embodiment, the flow rate of the cooling medium may be adjusted based on the temperature of the tank and the rate of The temperature of the tank may be adjusted based on the rate of change of the temperature of the dielectric and / or the temperature of the tank. The temperature sensor can be located anywhere in the tank. It is possible.

[0061] In one exemplary embodiment, the temperature of the tank is changed (or the lack of temperature is changed) and / or a control system based on the change in bellows volume (or lack thereof). The system can determine if there is a leak in the system or if the dielectric fluid is burning. In one embodiment, it can be determined that the dielectric fluid or vapor leaks from the tank. When the tank is in any given operating state (e.g., temperature, power consumption, etc.), In one embodiment, when the dielectric fluid burns, the pressure of the tank may drop. During operation, the pressure in the tank can increase.

[0062] In one embodiment, if the temperature of the tank does not change but the volume of the bellows increases, the control system The system can infer that the dielectric fluid is burning. If the temperature does not change but the volume of the bellows decreases, the control system determines that the dielectric fluid is It can be inferred that the information is leaking from

[0063] In one embodiment, the temperature of the tank increases but the volume of the bellows increases to a level higher than the predetermined level. If the temperature rises, the control system can infer that the dielectric fluid is burning. In one embodiment, the tank temperature increases but the bellows volume remains below a predetermined volume. If the dielectric fluid level increases at the source, the management system can infer that the dielectric fluid is leaking. In one embodiment, the temperature of the tank increases and the volume of the bellows increases at a predetermined rate. If so, the management system will determine that the heat exchanger needs to be started (or the cooling medium flow rate It can be inferred that (needs to be increased)

[0064] In one embodiment, the temperature of the tank decreases but the volume of the bellows is less than the predetermined volume. If the temperature drops to a constant value, the control system can infer that the dielectric fluid is burning. In one embodiment, the tank temperature decreases but the bellows volume increases above a predetermined rate. If the leak is reduced in size, the control system can infer that the dielectric fluid is leaking. In one embodiment, the temperature of the tank decreases and the volume of the bellows decreases at a predetermined rate. If this occurs, the management system will know that the heat exchanger needs to be shut down (or the cooling medium flow rate It can be inferred that the

[0065] In one exemplary embodiment, the predetermined pace may be determined by a machine learning model. The machine learning model analyzes various aspects of the control system and the immersion cooling tank during previous operating cycles. It can receive data from sensors and parameters recorded for previous operating conditions. The predetermined pace can be determined based on the data. For example, a predicted rate of change of temperature or volume based on the most recent operating conditions received. It is possible.

[0066] In one exemplary embodiment, the immersion cooling system can exhaust gas, e.g., steam. Using a gas-air separator, the system can collect dielectric vapors and release air In one embodiment, the immersion cooling system is configured to: The above-described procedure can be implemented. In one embodiment, the immersion cooling system can be, for example, After the tank has vented air or reached a steady temperature for a specified period of time , the procedure described above can be carried out while the tank reaches steady state.

[0067] In one exemplary embodiment, the immersion cooling system uses a volume of air expelled from the tank. In this exemplary embodiment, air is exhausted from the immersion cooling system. The volume change of the bellows can be determined after the air is released from the system. The change in volume can be used as a benchmark to determine the amount of qi. The management system may receive sensor data indicating the concentration of vapors in the tank. Using the concentration and volume change, the management system releases a portion of the volume change from the tank. A portion of the volume change can be attributed to the air that has been absorbed, and another portion of the volume change can be attributed to steam. It can be done.

[0068] FIG. 4 illustrates an immersion cooling system 400 according to an exemplary embodiment of the present disclosure. In an embodiment, the immersion cooling system 400 includes a vessel 40 which may include a tank 410. The tank 410 may include a solution bath area 411, a reservoir area 412, and , fluid 413, computer components 414, pump 415, filter 418, and , a door 416, a management system 417, a heat exchanger 419, and a through plate 420. The computer components 414 may be submerged in the fluid 413.

[0069] The tank 410 may be connected to an eductor 440, which in turn is connected to a bellows 430. and may be connected to a steam-air separator 460 through a pressure control valve 450. In the exemplary embodiment, the steam-air separator 460 may be coupled to a steam condenser 470, The condenser 470 may be connected to a desiccant 480. The desiccant 480 may be connected to an air inlet / outlet 490. The exemplary tank 410 may include one or more of the components described above. It can include.

[0070] In this exemplary embodiment, the tank 410 includes a volume sensor located within the bellows 430. The volume may include a temperature sensor 431 and a temperature sensor 432 located within the tank 410. Room sensor 431 and temperature sensor 432 provide data to management system 417 For example, the data may include the latest volume of the bellows 430 and the temperature of the tank 410. Using the data, the management system 417 may The rate of change of the product and the rate of change of the temperature of the tank 410 can be calculated. The rate of change of product deviates from the expected rate of change of volume (e.g., a predetermined rate). If the rate is met or an expected rate (e.g., a predetermined rate), the management system , e.g., a heat exchanger needs to be started or stopped, a tank is leaking It can be determined that the dielectric fluid is burning. If the dielectric fluid is burning, the management system can send a warning signal. As an example, the warning signal may be sent to a user interface of the vessel 405 . As another example, the warning signal may be transmitted to a remote monitoring station.

[0071] Two-phase heat sink In one exemplary embodiment, the computer components of the immersion cooling system are heat sinks. The heat sink can be attached to the immersion cooling system to remove heat from the computer components. This can help transfer heat to the dielectric fluid within the enclosure. A heat sink can be a solid copper sheet that can be attached to a computer component. In one exemplary embodiment, the heat sink is a two-phase heat sink. It is possible.

[0072] In one embodiment, the two-phase heat sink may contain a liquid medium therein. In one embodiment, the hollow box includes two elongated sides. Each of the sides can be made from a metal with high thermal conductivity, such as copper or silver. In one embodiment, the two-phase heat sink may be formed by It can receive heat from a computer device on one side. The liquid medium in the tube can be evaporated. The vapor can reach the other narrow side. and transfer its heat. Thus, the steam can be cooled, and / or A two-phase heat sink can condense This can allow for more effective thermal conductivity at the surface. may include water, alcohol, ammonia, or even a dielectric fluid.

[0073] FIG. 5 illustrates an exemplary two-phase heat sink according to an exemplary embodiment. In this exemplary embodiment, a computer component 520 is attached to a heat sink 510. The heat sink 510 may have a metal plate 512 on the elongated side of the heat sink 510. and 513. The heat sink 510 may further include a liquid medium 511. On one side, the heat sink 510 is in thermal contact with the computer component 520. On the other side, the heat sink 51 0 can be in thermal contact with the dielectric fluid 530 provided in the tank of the immersion cooling system. (through the metal plate 512).

[0074] Heat generated by computer components 520 may be transferred to metal plate 513, The liquid medium 511 can then be transferred to the other metal plate 512. When in contact with the metal plate 512, the liquid medium 511 can transfer its heat to the metal plate 512. The metal plate 512 can then transfer the heat to the dielectric fluid 530. In an embodiment, the heat generated by the computer components 520 may be unevenly distributed. The heat sink 510 receives heat that is irregularly distributed on one metal plate. This heat can be effectively transferred to the other metal plate. One metal plate distributes heat evenly, improving the thermal conductivity of the heat sink. This can be done.

[0075] Secondary Contaminant Systems One concern with immersion cooling systems is the risk of fluid leaking from the tank due to a malfunction or accident. In one exemplary embodiment, the immersion cooling system The secondary layer may include a secondary layer on the vessel and / or tank. and / or may provide an additional layer of protection for the tank.

[0076] In one exemplary embodiment, the secondary layer serves as a wall for a vessel and / or tank. For vessels and / or tanks, there may be a separation region between the secondary layer and the inner layer. In one exemplary embodiment, the fluid detection sensor is located in a separation region between the secondary layer and the inner layer. The fluid detection sensor may be in communication with the management system, and the inner layer and the secondary layer may be in communication with the management system. If there is any fluid leakage between the user interface and the management layer, Or, a warning signal can be sent to a remote monitoring station. The reservoir may be a tub or tray located below the reservoir. In this embodiment, the reservoir may be In the event of a leak, fluid can accumulate within the tub or tray.

[0077] 6 illustrates an exemplary immersion cooling system including an inner layer and a secondary layer. In this embodiment, the immersion cooling system 600 includes a vessel 605 that may include a tank 610. The vessel 605 may include a sensor 625 for detecting fluid leaks. It can be done.

[0078] The vessel 605 includes an inner layer 623, a secondary layer 621, and a separation region 630. The secondary layer can surround the vessel 605 and the inner layer 623. In one embodiment, In other words, the secondary layer 621 is attached to only one side (or multiple sides) of the vessel 605 and the inner layer 623. In one embodiment, the tank 610 may include an inner layer 624 and a secondary layer 626. In this embodiment, the secondary layer 622 may include a tank 610 and may cover only one side (or multiple sides) of the inner layer 624. In one embodiment, a sensor may be provided in the separation area between the secondary layer 622 and the inner layer 624. do.

[0079] In one exemplary embodiment, each secondary layer may be parallel to the inner layer. There may be one or more columns between the layer and the sublayer.

[0080] Chassis-Based Cooling System In one exemplary embodiment, an immersion cooling system is provided for each computer component, e.g. By providing dielectric fluid within the chassis for An exemplary immersion cooling system or vessel may include a storage area and a reservoir. Bath area, computer components, robots, and (optional) pressure control system , and a management system. The vessel may (optionally) use a heat exchanger. It is a pressure-controlled tank maintained at (or within) atmospheric pressure that can be cooled by The computer components may be disposed within a chassis, which may be connected to the computer through a fluid connector. The computer components are connected to a network. and performing various processing and computational tasks while the dielectric fluid is present within the chassis. The vessel can be placed in a storage area, computer components, and reservoir area. The vessel may include a lid for access. The vessel may (optionally) include a pressure control system. The robot can be fluidly coupled to the computer components when the lid is open. The robot can be lifted from the storage area of ​​the vessel. Lifted computers in magazines provided for storage or on vehicles The robot can also place components from the magazine (or vehicle). Computer components can be lifted and the computer lifted from the storage area This computer component can be placed in the place of the data component. The dielectric fluid may be attached to a vessel, a vehicle, or another location. The solution may be provided in the bath area.

[0081] FIG. 7 illustrates an immersion cooling system 700 according to an exemplary embodiment of the present disclosure. In an embodiment, the immersion cooling system 700 may include a vessel 705 and a vehicle 130. The vessel 705 includes a storage area 711, a reservoir area 112, a fluid 113, and a computer component 114, a pump 115, a filter 118, a door 116, Management system 117, heat exchanger 719, penetration plate 120, and fluid connector 721 The tank 710 may include a chassis 722 and a steam tank 723. The chassis 722 can be placed in the storage area 711. The chassis 722 can be connected to the fluid connector 721. The computer component 114 can receive the dielectric fluid from the chassis 722. The vehicle 130 may be submerged in a fluid 113. The vehicle 130 may include a robot 131. The bot 131 lifts the computer component 114 when the door 116 is open. The computer component 114 may be located on the vehicle 130. In one embodiment, reservoir area 112 is separated from tank 710 or other areas of vessel 105. It can be sealed from the inside.

[0082] Chassis with fluid connector In one exemplary embodiment, the chassis 722 can include a chassis heat exchanger. In this exemplary embodiment, the chassis 722 does not emit vapor 723; instead, 722 cools the vapor 723 for condensation. In this example embodiment, the chassis The exchanger receives the cooling medium, for example, through a fluid connector, and transfers the cooling medium from the chassis 722 to the The cooling medium can be, for example, water. The cooling medium can be, for example, a heat exchanger. It can be cooled in the tank using a cooler 719 or transported to a cooling facility outside the tank. In this exemplary embodiment, the chassis 722 may include one or more fluid connectors. 721 to receive a dielectric fluid and a cooling medium to cool the computer components 114. The chassis 722 can also provide power and and receive data.

[0083] 8 illustrates an example chassis 722 according to an example embodiment of the present disclosure. In one embodiment, the chassis 722 includes the computer components 114 and the chassis heat exchanger 810. a cooling medium connector 821, a cooling medium transfer pipe 822, and a fluid connector 721; and one or more other connectors 823. The electrical conductive fluid can enter the chassis 722 through the fluid connector 721. The electrical component 114 is electrically connected to the fluid 113 when the chassis has a sufficient amount of dielectric fluid. In one embodiment, the cooling medium is passed through the cooling medium connector 821 to the chassis. The cooling medium can enter the chassis 722 and flow through the cooling medium transfer pipe 822 to the chassis heat exchanger 810 When computer components 114 generate heat, fluid 113 vaporizes. The steam 723 can rise through the chassis 722. This allows the steam 723 to condense. This allows heat from the steam 732 to be transferred to the cooling medium in the chassis heat exchanger 810. The cooling medium can transfer heat away from the chassis 722. In this embodiment, the cooling medium travels to a heat exchanger 719 within the vessel 705 to be cooled. can be sent.

[0084] In one embodiment, the heat exchanger rejects heat within the tank 710 (removing heat from the chassis). In this exemplary embodiment, the electric cooler is a cooling medium transport pipe. In one embodiment, the heat exchanger can be a heat sink. In some applications, the heat sink may be large enough to transfer a sufficient amount of heat away from the chassis 722. In this exemplary embodiment, heat from each chassis 722 is dissipated in a tank. A heat exchanger 719 can cool the air in the tank 710.

[0085] In one exemplary embodiment, the dielectric fluid is capable of transferring heat out of the sheath 722. For example, the chassis 722 can receive an inflow of dielectric fluid through a connector. The dielectric fluid can remove heat from the computer components. Through the connector (or the same connector), the dielectric fluid can exit the chassis 722. In this manner, the dielectric fluid can function as a cooling medium. In this state, the chassis 722 may not require a chassis heat exchanger (although (A heat exchanger may optionally be provided.) In this exemplary embodiment, the tank 710 There may be a heat exchanger 719 to cool the warm dielectric fluid.

[0086] In one exemplary embodiment, the fluid connector 721 (and / or the coolant connector 821) can be a valve (e.g., a mechanical valve or an electrically operated valve), e.g., a fluid connector 721 can be opened when chassis 722 is placed in storage area 711. As another example, the fluid connector 721 may be configured to adjust the fluid level within the chassis 722 to a particular level. In this exemplary embodiment, the chassis 722 may include a sensor for determining the level of fluid within the chassis 722. The fluid connector 721 closes when the fluid in the chassis 722 reaches a threshold height. can be done.

[0087] In one embodiment, the chassis can include a controller 830. The controller 830 controls the flow A set of instructions may be provided for the body connector 721 and / or the cooling medium connector 821. For example, the control device 830 may be configured to allow the robot 131 to place the shears in the storage area 711. When chassis 722 is deployed, instructions can be provided. When 722 is placed in storage area 711, fluid 113 is present within chassis 722. The control device 830 opens to allow fluid 113 to enter the chassis 722. The controller 830 can issue commands to the fluid connector 721 so that the chassis 72 When the fluid inside the chassis reaches a threshold level, such as 95% of the chassis height, The connector 721 can be closed. The controller 830 commands the flow in the chassis 722. This can be based on sensor readings to determine body fluid levels. 22 can optionally allow fluid 113 to exit chassis 722 A chassis 722 is disposed within the storage area 711. The chassis 722 may include a second fluid connector. When the second fluid is released (e.g., by the robot 131), the controller 830 controls the second fluid to close. The connector can be commanded, resulting in fluid flow into the chassis 722 (e.g., , through the fluid connector 721), the fluid 113 may not exit the chassis 722. be.

[0088] In another embodiment, the control device 830 may be configured to be lifted by the robot 131. When the chassis 722 is configured, instructions can be provided to the fluid connector 721 . In this embodiment, the controller 830 controls the fluid connector 721 to empty the chassis 722. (and / or the second fluid connector), so that the chassis There will be no fluid 113 (or very little) left inside.

[0089] In one embodiment, the controller 830 provides similar instructions to the coolant connector 821. For example, the control device 830 may detect that the chassis 722 is located in the storage area 711. Coolant connectors that open when the power is turned on (or allow the coolant to circulate) In another example, the controller 830 can issue commands to the robot 13. 1 to close when the chassis 722 is set up (also can issue a command to the cooling medium connector 821 (to empty the cooling medium). As an example, the controller 830 may be configured to open or close in response to the temperature of the fluid 113 within the chassis 722. The cooling medium connector 821 can be commanded to open or close. If the temperature is below the value, the controller 830 can close the cooling medium connector 821. (to prevent circulation of the cooling medium). If the temperature exceeds the threshold temperature, the control device 83 0 can open the cooling medium connector 821 (to allow circulation of the cooling medium) In this embodiment, the chassis 722 may include a temperature sensor.

[0090] In one exemplary embodiment, the chassis 722 is configured to vent the steam 723 out of the chassis 722. In this embodiment, the cooling of the steam 723 is performed by a connector. For example, steam 723 may be used to transfer heat to the outside of vessel 705. In this embodiment, the steam 723 can be transferred to a heat exchanger 719 for transfer. The transport may be through one or more pipes or conduits.

[0091] In one exemplary embodiment, the chassis 772 may be sealed. The system 722 can exchange fluid only through a connector (e.g., fluid connector 721). In another embodiment, the chassis 722 can have an orifice (e.g., In this exemplary embodiment, the computer configuration When the component 114 heats the fluid 113, the fluid 113 evaporates and exits the chassis 722. The steam 723 can be cooled, for example, by a heat exchanger 119. 722 can include a fluid level sensor. When the fluid 113 evaporates, the control device , for example, by adding fluid 113 through fluid connector 721 to chassis 722 9 is a perspective view of a liquid level controller according to an exemplary embodiment of the present disclosure. 9 shows an immersion cooling system 900. In this exemplary embodiment, the chassis 922 includes an orifice 930, and steam 723 can exit the chassis through orifice 930. The vapor can be diffused in the tank 910. The heat exchanger 919 cools the vapor. The fluid 113 can be stored in the reservoir area 112 or the storage area 911. When the fluid 113 is returned to the storage area 111, the pump collects the fluid and The immersion cooling system can be returned to the bath area 112. In one exemplary embodiment, the immersion cooling system , may include a plurality of open chassis 922 and a plurality of enclosed chassis 722. can.

[0092] Chassis Placement Configuration In one exemplary embodiment, one or more of the chassis 722 However, to save space, the storage area 711 (or bath area) may be configured in a specific location. 10A shows a shutter located in storage area 711 according to an example embodiment. 7 shows an example top view arrangement of a chassis 722. In this example embodiment, one or more Each of the chassis 722 is positioned substantially parallel to the wall of the storage area 711. FIG. 10B shows another example of a chassis 722 in storage area 711 according to an example embodiment. 1 illustrates an exemplary top view arrangement of one or more chassis. 722 may be positioned so as not to be substantially parallel to the walls of the storage area 711. In an embodiment, one or more of chassis 722 are stored in storage area 71 For example, one of the chassis 722 may have a relative angle to one wall. or multiple chassis 722 may be tilted at 5°, 10°, 15°, or It may be tilted by 20 degrees, or 25 degrees or more. Chassis 722 may be stored in storage area 711 .

[0093] Fluid Transfer Systems In one exemplary embodiment, the vessel receives the dielectric fluid from a source external to the tank. To remove fluid from a tank and / or to discard the fluid outside the tank A fluid transfer system may be included to remove the dielectric fluid from the chamber. This can reduce the power consumption of computer components to below the desired level, thereby causing undesirable overheating. In one exemplary embodiment, the fluid transfer system includes an inlet and a pump. and connecting the inlet to the pump and tank (e.g., bath area or reservoir area). In this exemplary embodiment, the inlet is connected to the pipe. The pump can be connected to the container using a pipe to pump water from the container through the inlet. The pump can then draw the dielectric fluid into the tank. Use a separate pipe to transfer the fluid to a tank (e.g., a bath area or reservoir area). In one exemplary embodiment, the pump draws fluid from a tank. and to transfer fluid to the outside of the tank through the inlet. In one embodiment, the pump may be a bi-directional pump, e.g., in one mode of operation, the pump In the first mode, the pump can draw fluid from a container, and in the second mode, the pump draws fluid from a tank. Fluid can be drawn in through the

[0094] In one exemplary embodiment, the fluid transfer system can include multiple modes of operation. In a first mode of operation, the fluid transfer system receives fluid from a container located outside the tank. The fluid transfer system can optionally In this embodiment, the filter can be located before the pump or after the pump. In the second mode of operation, The fluid transfer system draws fluid from the tank and transfers the fluid to the outside of the tank. The fluid transfer system may optionally include a filter before sending the fluid outside the tank. In this embodiment, the filter is In the third mode of operation, the fluid transfer system The system can circulate fluid within the tank. For example, the pump can move fluid from the sump area to the Fluid can be drawn in to transport the fluid to the bath area. The pump can draw fluid from the bath area and transport the fluid to the reservoir area. The fluid transfer system may optionally pass the fluid through a filter. In this embodiment, the filter can be located before the pump or after the pump. This can be done.

[0095] 11 illustrates an immersion cooling system 1100 according to an exemplary embodiment of the present disclosure. In this embodiment, the immersion cooling system 1100 includes an inlet 1130, a valve system 1140, and , a pump 1115, and a filter 1118. The pump 1115 and and / or valve system 1140 may be in communication with management system 1117, such that: The pump 1115 and / or valve system 1140 receive signals and The inlet 1130 is connected to a valve system 1140 using pipes. The valve system 1140 can be in fluid communication with the reservoir area 112 and the and pump 1115. Valve system 1140 couples pump 1115 to inlet 113. 0 or a three-way valve that can be fluidly connected to the reservoir area 112. 1130 is connected to the container 11 outside the tank 110 using, for example, a pipe 1150. It can be connected to 60.

[0096] In one mode of operation, the management system 117 connects the inlet 1130 to the pump 1115. In this mode of operation, the valve system 1140 can be commanded to The pump 1115 can draw fluid from a container through an inlet 1130, can be transported to the bath area 1111. In another mode of operation, the management system 117 is connected to a valve system 1140 to connect the reservoir area 112 to the pump 1115. In this mode of operation, the pump 1115 pumps the water in the reservoir area 11 2 and transport the fluid to the solution reservoir area 1111. Cut.

[0097] In one exemplary embodiment, the management system 117 may: Commanding the valve system 1140 to connect the pump 1115 to the inlet 1130 In one exemplary embodiment, the trigger condition is a change in the fluid level in the tank 110. In this exemplary embodiment, the vessel 105 includes a fluid level sensor. The fluid level in the tank 110 or in the bath area 1111 can be adjusted to below a threshold amount. If it does drop, the management system 117 can draw in fluid. For example, when a fluid is present in the reservoir area 112, the system 117 to the pump 1115. The management system 117 also draws fluid to raise the level of the fluid in the tank. The pump 1115 can be commanded to

[0098] In one exemplary embodiment, the container 1160 includes a fluid level sensor 1155. For example, if more than a threshold amount of fluid is present or for a period of time that exceeds a threshold period. If there is enough fluid present to use the fluid level sensor 1155 (and / or The control system 117 determines whether there is a sufficient amount of fluid in the container 11160. The sensor 1155 can determine if there is an insufficient amount of fluid in the container 1160. If it is determined that the sensor 1155 is not present, the sensor 1155 sends a signal to the management system 117. The management system 117 detects that there is insufficient fluid in the container 1160. Send a signal to a central unit (or central server) to notify the user It is possible.

[0099] In one exemplary embodiment, the management system uses artificial intelligence or machine learning programs. This can be used to determine whether there is a sufficient amount of dielectric fluid in the container. For example, an artificial intelligence program could use data from past use of a liquid immersion cooling system. the amount of liquid required to operate the system for a threshold amount of time. The liquid level detected by the sensor can be determined or predicted. If the amount is less than the threshold, the management system sends a signal to the central unit (or central server). The number can be sent.

[0100] In one exemplary embodiment, the management system may require the fluid in the tank to be emptied. It can be determined whether an accident or other event has occurred that could cause a The management system detects an incident when the fluid level in the tank drops below a threshold level. In another example, the management system may detect when the fluid level in the tank exceeds a threshold level. In another example, a fault can be detected when the The control system can detect an accident if fluid is present in the secondary layer. In this case, the management system may be configured to draw fluid from the tank and transfer fluid to the container. This allows the pump to be commanded to do so, so that no fluid is wasted. The system also uses a central unit (or In one embodiment, the management system may send a signal to a In the event of an accident, the immersion cooling system can be shut down.

[0101] Heat Exchanger System 12 illustrates an immersion cooling system 1200 according to an exemplary embodiment of the present disclosure. In this embodiment, the vessel 105 transfers heat from the interior of the tank 110 to the exterior of the vessel 105. The heat exchanger 119 may include a heat exchanger 119 that can transfer heat to the heat exchanger side. For example, one or more coils 1222, a radiator 1223, a fan 1221, In one embodiment, the coil 1222 is fluidly connected to the radiator 1223. The coil 1222 and The coil 1222 and the radiator 1223 are connected to each other. The cooling system may include a moving cooling medium.

[0102] In one exemplary embodiment, the coil 1222 can reside within the tank 110. However, the radiator 1223 and fan 1221 can be outside the tank. In one exemplary embodiment, the fan 1221, the radiator 1223, and the coil 122 2 is located within the vessel 105. In one exemplary embodiment, the heat exchanger 119 is located within the vessel It can be a self-contained unit within the cell 105. In this exemplary embodiment, the heat exchanger 11 9 can be a self-contained unit within vessel 105. 5 is provided for maintaining the temperature of the dielectric fluid in the tank 110 by a cooling tower or other cooling equipment. No connection to the network is required.

[0103] In one embodiment, fan 1221 forces ambient air through radiator 1223. For example, if a computer component 114 generates heat, The fluid 113 can be evaporated. The vapor can exchange heat with the coil 1222 and condense. This heat exchange can transfer heat from the steam to the cooling medium in the coil 1222. The medium is optionally pumped through various pipes 1224, for example, by the regulator. The cooling medium can be transported to the radiator 1223. In the radiator 1223, the cooling medium exchanges heat with the surrounding air. It can assist in the heat exchange between the ambient air and the cooling medium in the radiator 1223. To achieve this, in one embodiment, fan 1221 forces air through radiator 1223. In one embodiment, the cooling medium can be water or other fluid.

[0104] In one exemplary embodiment, the coil 1222 is connected to a condenser-based cooling system. The cooling system can cool the working medium in the coil, thereby cooling the tank. In one embodiment, the management system may include a temperature predictor. The management system may include a temperature predictor for the fluid in the tank. The operation of the cooling system can be adjusted based on predictions about the temperature or outside temperature. In one embodiment, the cooling system can be a dry cooling system. The system can cool the tank in addition to the heat exchange located remotely to the tank. can.

[0105] heater element In one exemplary embodiment, the vessel may include a heating element. The plurality of heating rods may include a plurality of heating rods, some of which may be immersed in the dielectric fluid. The heating rod can provide heat to the vessel on demand. For example, when a computer component is removed from the tank, the heating element may to generate heat comparable to that of a computer heating element or to heat-generating panels of computer components A computer component can be substituted to recreate the turn. In the illustrated embodiment, the heating element may be located within the chassis or housing. The housing is the chassis or housing into which the computer components are placed. The heating unit can be removed using a robot. It can be removed.

[0106] In one exemplary embodiment, the heating elements operate independently of the management system 117. In this exemplary embodiment, the heating element includes a power input, a processor, and a memory. The memory can store a thermal pattern, and based on the thermal pattern, The processor can then issue commands to the heater rod to generate heat. The heating element can replicate the heating pattern of a computer component. In an exemplary embodiment, the heating pattern may be, for example, 10 watts for 1 minute and 20 watts for 2 minutes. This can include a time function of the amount of heat that will be generated over a period of time, such as In one exemplary embodiment, the heating element may also be connected to, for example, The heating program (or pattern) is stored in a wireless unit outside the vessel. The device may include a transmitter for receiving commands from the device.

[0107] 13 illustrates an example heating element 1300 according to an example embodiment. 1, the heating element 1300 includes a heating rod 1310 (which may include copper wire) and a processor 1320, memory 1330, power input 1340, and chassis 1350. This example heating rod can replace a computer component. For example, a robot can lift a heating element and replace a computer component. In this exemplary embodiment, the heating element is an interface for coupling to a robot. It may include a display interface and an optional data entry interface.

[0108] computer adapter In one exemplary embodiment, a computer configuration may be constructed to operate in a horizontal orientation. The components are mounted in a substantially vertical or vertical orientation using one or more adapters. In some embodiments, the adapter may be used in any shape, Adapters can be adaptable to computer components of various shapes and sizes. Releasable rails configured to be attached to the sides of a computer component. This allows the computer components to slide into the rack, Here, the racks may be designed for a vertical configuration within the immersion cooling tank. Using the rails, the adapter allows computer components to be placed in the rack and / or Or it may be possible to remove the computer components from the rack. The adapter allows for racking of computer components of almost any size. This can be done.

[0109] FIG. 14A shows an exemplary adapter for both sides of a computer component in an unmounted position. In this embodiment, each of the adapters 1405 includes a rail 1410. FIG. 14B shows an example of a mounting position for both sides of a computer component. This shows the adapter.

[0110] FIG. 15 shows the right side of the computer components in the mounting position. Example for both sides of a computer component, with the left side of the element in the unattached position In this embodiment, the adapter 1405 includes a rail 1410 and a mounting bracket. The fixture 1515 may include a laser beam 1515. The fixture 1515 may mount the computer component 1414 to a laser beam 1515. It can be connected to the router 1410.

[0111] FIG. 16 shows a rail assembly for an example adapter of the present application.

[0112] 17 shows an exemplary carrier bracket assembly. In this embodiment, the carrier bracket The carrier bracket assembly can be mounted in a rack. Rails 1410 are connected to the carrier bracket assembly. 14. The rail 1410 may be connected to the carrier bracket assembly and the rack for sliding movement. It can be made possible.

[0113] FIG. 18 illustrates a cooling rack with an adapter as described herein that can be slid into the cooling rack. In this example, the level of each computer component is The carrier bracket assemblies are connected to the carrier bracket assemblies to support the computer components up into the rack. Allows sliding.

[0114] Dielectric fluid monitoring Immersion cooling of computer components such as servers uses liquid cooling such as NOVEC™. Halocarbons, such as perfluorocarbon dielectric fluids, are frequently employed. Under the conditions employed, halocarbons can degrade into other substances such as acids and bases. For computer components and / or other aspects of the immersion cooling system, These changes and degradations that can be harmful to the Therefore, it is possible to determine whether the composition of the fluid in the immersion cooling system has changed. In an exemplary embodiment, a dielectric fluid is used to detect the composition of the dielectric fluid and / or to measure the dielectric A Raman spectrometer can be implemented within the immersion cooling system to detect changes in the composition of the reactive fluid. do.

[0115] FIG. 19 shows an exemplary immersion cooling system 1900 including a Raman spectrometer 1931. In the illustrated embodiment, the Raman spectrometer 1931 is located in the tank of the immersion cooling system 1900. The Raman spectrometer 1931 may be operably connected to the rear 110 or reservoir area 112. excites the fluid 113 into an upper excited state During relaxation, the chemical bonds can emit radiation at frequencies corresponding to the current. In one embodiment, a fiber optic cable 1932 is connected to the Raman spectrometer. The light meter 1931 can be connected to the tank area 110 or the sump area 112 . Other connections may also be employed to excite the molecules and analyze the results. One connection can be employed to excite the molecule and a separate connection to analyze any results. In addition, the location of the spectrometer is not particularly important and it may be located in an immersion cooling system. 1900, or may be located on an immersion cooling system 1900, or In one embodiment, the Raman spectrometer or another spectrometer may be located in any convenient location. Using a spectrophotometer or another analytical method, any of the components in the fluid 113, together with their respective concentrations, This helps to understand the contaminant composition. In law, corrective action may be initiated manually or automatically, as explained later.

[0116] In some embodiments, the Raman spectrometer is connected to a management system 117 (or controller). The management system 117 can transmit test results from the Raman spectrometer 1931. It can receive test results and trigger corrective actions based on the test results. The test results may also indicate that no corrective action needs to be taken, and furthermore, the control device This can be recognized and / or implemented.

[0117] Fluid Reducing Spacer Two-phase immersion cooling may employ expensive dielectric fluids. The vapor of the reactive fluid occupies a bellows that allows pressure management within the immersion cooling tank. Bellows can be very large and therefore can be difficult to install for systems Therefore, the use of immersion cooling systems is It may be desirable to reduce the amount of fluid that is drawn in. In addition, reducing the size of the bellows may also be desirable. The vapor burden on the system is reduced to allow Furthermore, such a solution is not particularly expensive and It is desirable that it be relatively easy to implement and not affect the performance of the fluid.

[0118] In one exemplary embodiment, the immersion cooling system is mounted at the bottom of the immersion cooling tank. The filler plate may include a metal retainer plate configured to be held in place by the filler plate. may be releasably attached to a metal retaining plate, and one or more computers may be mounted within the tank. The sensor may be configured to be located below the data component.

[0119] In another embodiment, the present application provides a method for manufacturing a computer-implemented method for a thermally conductive and condensable dielectric fluid. The present invention relates to a method that involves at least partially submerging a component in water. The elements may be installed in a chassis with a backplane for receiving power from the rack. Computer components release heat into the dielectric fluid as the computer components operate. The gas phase dielectric fluid can be condensed to form a liquid phase dielectric fluid. A vessel may be employed. The rack resides in a tank operatively connected to a bellows. A metal retaining plate is configured to be attached to the bottom of the tank. The rack is configured so that the port is releasably attached to the metal retaining plate and can accommodate up to one A filler plate is not required. This serves to reduce the amount of fluid required and also reduces the required size of the bellows. It can also be done as follows.

[0120] In one embodiment, a metal retaining plate is configured to be attached to the bottom of the immersion cooling tank. and a plurality of filler plates are releasably attached to the metal retainer plate. and configured to be located within the tank below one or more computer components. In this way, the filler plate reduces the amount of immersion fluid that is required.

[0121] The filler plate may be made of any material that does not interfere with the operation of the disclosed immersion cooling system. For example, the plate may be made of, but is not limited to, metal, rubber, silicone, and / or The dielectric fluid may be made of a material including a polymer. Suitable materials are substantially insoluble in the dielectric fluid. In some embodiments, one or more of up to all of the filler plates Some of the filler plates include a material that is less dense than the dielectric fluid. For example, polyoxyethylene terephthalate (DELRIN®) available from DuPont Includes thermoplastics such as methylene.

[0122] In some embodiments, the filler plate is metal-retaining without the use of tools. The plate may be configured to be selectively attached and detached from the plate. The exact mounting mechanism is not critical, provided it does not prevent displacement during operation. For example, the interlocking section may be made to have a recess and / or the rail A sliding mechanism may be employed.

[0123] If desired, other filler plates may be used in addition to the filler plates below the computer components. A filler plate may also be employed. For example, a second filler plate may be attached to the metal retainer plate. configured to be releasably attached and / or laterally within the tank configured adjacent to one or more computer components, e.g., a second The filler plate is positioned vertically to occupy the space between the server and the side wall of the tank. It can be horizontally adjacent on either side of a group of deployed servers. Filler plates can also be present at the front or rear of the server if required. In such cases, the second filler plate may additionally or alternatively be The side walls and / or metal retaining plate may be attached to the housing.

[0124] A sample system is shown in Figure 20, but many different variations may be employed. As shown in FIG. 1, a bottom support plate 10 is attached to the bottom or floor of the immersion cooling fluid tank. The dielectric fluid 20 may be installed to cool the computer components during use. , can enclose a computer component such as a server 30. There can be 14 servers in a vertical configuration arranged horizontally, as shown, but in any configuration Any number of servers may be employed. Further, as shown in FIG. 20, server 30 The sizes can vary, so that a longer filler plate 50 can be The bottom support plate 10 can be inserted between the bottom support plate 60. If desired, side filler plates 40 may be attached to either side of the tank. It can be used laterally and / or anteriorly or posteriorly. The filler plate 40 is attached to the bottom support plate 10 and / or the filler plate 40 Advantageously, this selective attachment and detachment mechanism The configuration allows for filler plugging without tools when server configuration is changed within the tank. The rate is configured to be easily attached and removed. Reduced fluid usage by using the systems and methods described herein and / or may allow the size of the bellows to be reduced. .

[0125] Mobile Immersion Cooling System In one exemplary embodiment, the immersion cooling system may be installed on a mobile body. The body may be a vehicle, automobile, boat, plane, train, container, or any other transportable body. In this exemplary embodiment, the majority of the operation of the immersion cooling system is performed by the Other exemplary embodiments may be the same as or similar to other immersion cooling systems. The main part of the operation of the immersion cooling system is the immersion cooling system disclosed herein. may be different from

[0126] In one embodiment, the immersion cooling system includes a tank, a cooling system, and a plurality of computers. In one embodiment, the immersion cooling system includes a vehicle cooling system. In other embodiments, the power can be received from, for example, a generator (e.g., , gasoline), batteries, solar panels, wind turbines, wave energy generators, or any of these may be obtained from any combination of

[0127] In one embodiment, the wall between the bath area and the reservoir area is formed by a submerged bath mounted on the vehicle. In this example, the higher walls allow for a more efficient cooling system. Even if the fluid in the system is subject to turbulence or stress, more fluid is transported into the bath area. In one embodiment, the bath area is a bath area and a reservoir area. In one embodiment, the reservoir area can be accessed only through a small hole in the wall between the reservoir and the tank. The pump can draw fluid from the bath area and transfer the fluid to the reservoir area. In these embodiments, turbulence caused by vehicle movement can be prevented by insufficient levels of fluid flow. This may not occur in bath areas that do not have a bath.

[0128] In one embodiment, the immersion cooling system can be wireless. For example, the immersion cooling system can The data signal can be sent and / or received wirelessly. The immersion cooling system can be connected via Wi-Fi, satellite, cellular, or other wireless connections. Wireless connectivity can be achieved using a cellular connection, a cellular connection, or a combination of these. In an embodiment, the immersion cooling system or vehicle may include a In one embodiment, the immersion cooling system or vehicle may include a wireless device. It may include other equipment necessary to implement data communication. The cooling system or vehicle may include an interface for receiving the data signal. The interface may provide, for example, Ethernet connectivity or other types of connectivity. It is possible.

[0129] In one embodiment, the immersion cooling system and its components are subject to impact and shock as the vehicle moves. To minimize such stresses on the immersion cooling system, The immersion cooling system may be mounted on the platform via a damping means. Some or all of the stresses transmitted from the cooling system to the immersion cooling system and / or its components The platform may be a spring or other similar device that can absorb shock. and the damping means is located in the vehicle, the box, An immersion cooling system can be connected to the box or container.

[0130] FIG. 21 shows an exemplary immersion cooling system 2100 installed on a truck 2105. In this example, a truck 2105 is used to provide power to the immersion cooling system 2100. The track 2105 may include a power supply 2114 for receiving data communications. and an antenna 2113 for connecting the immersion cooling system 2100 to a network. The track 2105 may further include a cooling system (e.g., an immersion cooling system). Heat outlets 2102 for transferring heat to the outside of the track 2105 (if including the condenser above) The immersion cooling system 2100 may further include a platform 21 11 and the immersion cooling system 2100. The spring 2112 acts to absorb some of the shock transmitted from the track 2105 to the immersion cooling system 2100. Part can be absorbed.

[0131] In one embodiment, the immersion cooling system is mounted on a transportation vehicle, such as a truck or boat. The immersion cooling system can be installed on a platform. The container may be cooled by immersion while on the platform. It can include

[0132] In some embodiments, the system may be reconfigured by moving the system or system components. Fluid transfer is required to ensure there is no significant adverse effect on computational or cooling performance. and one or more mechanisms for minimizing unwanted movement of other components. Such mechanisms include, for example, gyros. Exemplary System 1. A vessel configured to hold a thermally conductive, condensable, dielectric fluid; a pressure control device for reducing or increasing the internal pressure of the vessel; A computer component configured to be at least partially immersed in a dielectric fluid With the ingredients, The dielectric fluid is drawn from the reservoir area of ​​the vessel and passed through the filter. a fluid circulation system configured to deliver a dielectric fluid through the body to a bath area of ​​the vessel; The stem and A system comprising: 2. Further comprising an inlet for receiving a dielectric fluid from a source external to the vessel. , the system in paragraph 1. 3. Further comprising a valve system for connecting or disconnecting the fluid circulation system to the inlet. The system in paragraph 2. 4. A system according to paragraph 3, in which the fluid circulation system includes a pump. 5. Configuring the valve system to operate in a first operating mode with the pump connected to the inlet. To give instructions, and directing the pump to draw dielectric fluid from the source; The system of paragraph 4, further comprising a configured management system. 6. The system of paragraph 5 further comprising a retractable hose. 7. The retractable hose is connected to the supply source. 6. The system of paragraph 6, including a sensor for detecting 8. The control system is only supplied with a retractable hose connected to the supply source. Paragraph 6, configured to direct the pump to draw dielectric fluid from the source. system. 9. Adjust the valve system to operate in a second operating mode with the pump connected to the sump area. to give instructions to the stem, and to instruct the pump to draw fluid from the source; The system of paragraph 4, further comprising a configured management system. 10. The pressure control device comprises a heat exchanger having a plurality of pipes and at least one box. The system of paragraph 1, including the vessel. 11. The pressure control device comprises a heat exchanger having a plurality of pipes and at least one box. The system of paragraph 1, including the vessel. 12. At least one of the multiple pipes or at least one box is a vibrating The system in paragraph 11, including the 13. The system of paragraph 12, in which the vibration damper is a metal weight. 14. Multiple sensors and 1. A management system comprising: receiving sensor data relating to the temperature of a computer component; and Determining filter failure based on the temperature of computer components A management system configured as 10. The system of paragraph 1, further comprising: 15. Sensor data includes temperature of computer components, power consumption at the vessel, , external temperature, dielectric fluid temperature, incoming cooling medium temperature, outgoing cooling medium temperature, the flow rate of the cooling medium, the temperature of the area above the bath area, and the computer present in the vessel. The sequence of paragraph 14, including the number of components or the location of each computer component within the vessel Stem. 16. The management system will automatically determine if a computer component is overheating. The system of paragraph 14 configured to determine using a learning model. 17. A machine learning model is trained using sensor data received from the vessel. The system in paragraph 16. 18. Paragraph 18, wherein the pressure control device includes a bellows configured to receive the dielectric vapor. System 1. 19. The bellows includes a sensor for determining the volume of the bellows and the control system 19. The system of paragraph 18, configured to receive data from the sensor. 20. The system of paragraph 19, wherein the management system is further configured to receive temperature data. Tem. 21. The management system is further configured to determine a state of operation of the vessel. Fall 20 system. 22. The operating conditions are: 1) starting or stopping a heat exchanger; 2) burning a dielectric fluid; and 3) The system in paragraph 21, which is a leakage of dielectric fluid. 23. The management system monitors the machine based on the data received from the sensors and the temperature data. paragraph 2, further configured to determine a state of operation of the vessel using the learning model. System 1. 24. Paragraph 1, in which the computer component includes a two-phase heat sink. system. 25. A two-phase heat sink consists of a liquid medium and two elongated metal surfaces. 25. The system of paragraph 24, including a hollow box comprising: 26. The vessel is protected by a secondary layer, system of paragraph 1. 27. The system of paragraph 26 in which the secondary layer is parallel to the inner layer. 28. The system of paragraph 27, wherein the fluid sensor is disposed between the secondary layer and the inner layer. 29. A vessel configured to hold a thermally conductive, condensable, dielectric fluid; , A computer component configured to be at least partially immersed in a dielectric fluid With the ingredients, a chassis configured to hold computer components and a dielectric fluid; The dielectric fluid is drawn from the reservoir area of ​​the vessel and passed through the filter. a fluid circulation system configured to deliver a dielectric fluid through the body to the chassis; A system comprising: 30. The chassis includes a fluid connector for receiving dielectric fluid from a fluid circulation system. Including, the system of paragraph 29. 31. The fluid connector is configured to open when the chassis is placed in the vessel. The system in paragraph 30. 32. The fluid connector is set when the chassis is removed from the vessel. The system of paragraph 30, configured to close. 33. The system of paragraph 29, wherein the chassis includes a heat exchanger. 34. A paragraph in which the heat exchanger is configured to receive the cooling medium from the cooling medium connector. 33 systems. 35. The system of paragraph 33, in which the heat exchanger is an electric heat exchanger. 36. The chassis is the chassis being configured to hold a level of dielectric fluid; and to allow vapor of the dielectric fluid to exit the chassis and enter the vessel; Openable, paragraph 29 system. 37. Paragraph 29, further comprising a fluid level sensor for determining the level of the dielectric fluid. system. 38. The system of paragraph 37, wherein the fluid level sensor is located within the chassis. 39. The device further comprises an inlet for receiving a dielectric fluid from a source external to the vessel. The system in paragraph 37. 40. A valve system for connecting or disconnecting the fluid circulation system to the inlet. The system in paragraph 39. 41. The system of paragraph 40, in which the fluid circulation system includes a pump. 42. When the level of the dielectric fluid drops below a threshold amount: instructing the valve system to operate in a first mode of operation; and directing the pump to draw dielectric fluid from the source; The system of paragraph 41, further comprising a configured management system. 43. The system of paragraph 39, wherein the source includes a source fluid level sensor. 44. The system further includes a control system, wherein the control system controls the supply fluid level to be below a threshold amount. The system of paragraph 43 is configured to send a signal to a central server if the Tem. 45. The system of paragraph 44, wherein the threshold amount is a height level for the dielectric fluid. 46. ​​A threshold amount of time is used to operate the system for a predetermined period of time determined by artificial intelligence. The amount of fluid required to make the system of paragraph 44. 47. A vessel configured to hold a thermally conductive, condensable, dielectric fluid; , a pressure control device for reducing or increasing the internal pressure of the vessel; A computer component configured to be at least partially immersed in a dielectric fluid With the ingredients, The dielectric fluid is drawn from the reservoir area of ​​the vessel and passed through the filter. a fluid circulation system configured to deliver a dielectric fluid through the body to a bath area of ​​the vessel; Stem and A system comprising: 48. The system of paragraph 47, in which the pressure control device is a self-contained heat exchanger. 49. The system of paragraph 48, wherein the self-contained heat exchanger includes a coil, a radiator, and a fan. Tem. 50. The system of paragraph 49, in which a fan is configured to force air through a radiator. Tem. 51. The system of paragraph 47, further comprising a heating element. 52. The system of paragraph 51, wherein the heating element includes a processor and a memory. 53. The system of paragraph 52, wherein the processor executes a program stored in the memory. configured to issue a command to a heating rod of the heating element to heat the vessel using the do. 54. A system according to paragraph 53, further comprising a transmitter for receiving commands wirelessly. Prepare. 55. Releasable rails allow the server to slide into the server rack One or more releasable A server adapter with rails that can be used to cool a server rack in an immersion cooling tank. A server adapter designed for vertical configurations. 56. A thermally conductive, condensable, dielectric fluid is placed in the bath area of ​​the vessel. at least partially submerging the data component in water, The computer component includes a backplane for receiving power from the rack. It is installed in the chassis The computer components transfer heat to the dielectric fluid when the computer components are operating. configured to dissipate a submersion step; condensing the gas phase dielectric fluid into a liquid phase dielectric fluid using a condenser; testing the dielectric fluid using a Raman spectrometer; A method comprising: 57. The method of paragraph 56 further includes transmitting a signal to a control device based on the test. Law. 58. The method of paragraph 57, in which the control device triggers corrective action based on the test. 59. A tank configured to hold a thermally conductive, condensable dielectric fluid; a pressure control device for reducing or increasing the internal pressure of the tank; a computer component at least partially immersed in a dielectric fluid; a condenser for condensing the dielectric fluid in the gas phase; a robot configured to pick up a computer component; a Raman spectrometer operably connected to a controller, said controller controlling the Raman spectrometer; configured to receive test results from the instrument and trigger corrective actions based on the test results. , Raman spectrometer and A system comprising: 60. System for reducing the amount of dielectric fluid employed in an immersion cooling tank having a bottom. a tank configured to cool one or more computer components; The system a metal retaining plate configured to be attached to the bottom of the immersion cooling tank; configured to be releasably attached to a metal retaining plate and to hold one or more a plurality of filler plates configured to underlie a plurality of computer components; A system comprising: 61. One or more filler plates out of up to all filler plates 61. The system of paragraph 60, wherein the system comprises a material that is less dense than the dielectric fluid. 62. One or more of the filler plates, up to and including all of the filler plates The system of paragraph 60, wherein the system comprises a thermoplastic material. 63. One or more of the filler plates, up to and including all of the filler plates The system of paragraph 60, wherein the compound comprises polyoxymethylene. 64. A tank tank configured to be releasably attached to a metal retaining plate and positioned laterally within the tank. a second computer component configured adjacent to the second computer component in a direction The system of paragraph 60, further comprising a filler plate. 65. A tank configured to hold a thermally conductive, condensable dielectric fluid. a tank, wherein the tank is operatively connected to the bellows; One or more computer components at least partially immersed in a dielectric fluid a rack configured to hold the substrate; a condenser for condensing the dielectric fluid in the gas phase; a metal retaining plate configured to be attached to the bottom of the tank; configured to be releasably attached to a metal retaining plate and to be mounted in a rack a plurality of filler plates configured to underlie a plurality of computer components; A system comprising: 66. A computer component is at least partially immersed in a thermally conductive and condensable dielectric fluid. a step of partially flooding the The computer component includes a backplane for receiving power from the rack. It is installed in the chassis The computer components transfer heat to the dielectric fluid when the computer components are operating. configured to dissipate a submersion step; condensing the gas phase dielectric fluid into a liquid phase dielectric fluid using a condenser; Including, The rack is within the tank operatively connected to the bellows, and the metal retaining plate is attached to the tank. a plurality of filler plates attached to the metal retainer plate; configured to be releasably mounted to one or more computer configurations within a rack configured to be located below the component element, method. 67. A tank configured to hold a thermally conductive, condensable dielectric fluid. a tank, wherein the tank is operatively connected to the bellows; One or more computer components at least partially immersed in a dielectric fluid a rack configured to hold the substrate; a condenser for condensing the dielectric fluid in the gas phase; A platform configured to be attached to the bottom of the tank using a shock absorber. and, a vehicle configured to provide power and data connectivity to the tank; A system comprising: 68. Batteries to provide power and data connectivity to the tank. 68. The system of paragraph 67, further comprising an antenna for 69. The system of paragraph 67 in which the shock absorber is a spring. 70. Paragraph 6, where the vehicle includes a heat outlet for transferring heat from the condenser on the outside of the tank. 7 system.

[0133] Up to this point in the specification, various embodiments have been described with reference to the accompanying drawings. , without departing from the broad scope of the invention as set forth in the following claims. Various modifications and alterations may be made to the various embodiments of the present invention, and additional embodiments may be It will be apparent that the present specification and drawings are therefore to be regarded as illustrative only. shall be deemed to be inclusive and not limiting. [Explanation of symbols]

[0134] 100 Immersion Cooling System 105 Vessel 110 Tank 111 Solution tank area 112 Reservoir area 113 Fluid 114 Computer Components 115 Pump 116 doors 117 Management System 118 filters 119 Heat exchanger 120 Through Plate 130 vehicles 131 Robot 200 Immersion Cooling System 215 Pump 218 filters 230 Entrance 240 Valve System 250 hose 255 sensors 260 containers 300 Immersion Cooling System 305 Vessel 314 Computer Components 319 Heat exchanger 331 Robot 361 Pipe 362 Box 363 Damper 364 Damper 400 Immersion Cooling System 405 Vessel 410 Tank 411 Solution tank area 412 Reservoir area 413 Fluid 414 Computer Components 415 Pump 416 Doors 417 Management System 418 filters 419 Heat exchanger 420 Through Plate 430 Bellows 431 Volume Sensor 432 Temperature Sensor 440 Ejector 450 Pressure Control Valve 460 Steam-air separator 470 Steam Condenser 480 Desiccant 490 Air inlet / outlet 510 Heatsink 511 Liquid medium 512 Metal Plate 513 Metal Plate 520 Computer Components 530 Dielectric Fluid 600 Immersion Cooling System 605 Vessel 610 Tank 621 Secondary Layer-Vessel 622 Secondary Layer - Tank 623 Inner Layer - Vessel 624 Inner Layer - Tank 625 Sensor 630 Separation area 700 Immersion Cooling System 705 Vessel 710 Tank 711 Storage Area 719 Heat exchanger 721 Fluid Connector 722 chassis 723 Steam 741 Second Heat Exchanger 810 Chassis Heat Exchanger 821 Cooling medium connector 822 Coolant transfer pipe 823 Other Connectors 830 Control Device 900 Immersion Cooling System 905 Vessel 910 Tank 911 Storage Area 919 Heat exchanger 922 chassis 930 Orifice 1100 Immersion Cooling System 1111 Solution tank area 1115 Pump 1118 Filter 1130 Entrance 1140 Valve System 1150 Pipe 1155 Sensor 1160 Container 1200 Immersion Cooling System 1221 Fan 1222 Coil 1223 Radiator 1224 Pipe 1300 heating element 1310 heating rod 1320 processor 1330 memory 1340 power input 1350 chassis 1405 adapter 1410 Rail 1414 Computer Components 1515 Mounting fixture 1900 Immersion Cooling System 1931 Raman spectrometer 1932 Fiber optic cable 2100 Immersion Cooling System 2105 Truck 2110 Thermal vent 2111 Platform 2112 Spring 2113 Antenna 2114 Power supply

Claims

1. a vessel configured to hold a thermally conductive, condensable dielectric fluid; a pressure control device for decreasing or increasing the internal pressure of the vessel; a computer structure configured to be at least partially submerged in the dielectric fluid; and The dielectric fluid is drawn from a reservoir area of ​​the vessel and passed through a filter. and passing said dielectric fluid through said vessel to deliver said dielectric fluid to a bath area of ​​said vessel. a fluid circulation system configured as a A system comprising:

2. and an inlet for receiving the dielectric fluid from a source external to the vessel. The system of claim 1 .

3. a valve system for connecting or disconnecting the fluid circulation system to the inlet; The system of claim 2 , comprising:

4. The system of claim 3 , wherein the fluid circulation system includes a pump.

5. The valve system is adapted to operate in a first mode of operation with the pump connected to the inlet. to give instructions to the stem, and directing the pump to draw dielectric fluid from the source; The system of claim 4 further comprising a configured management system.

6. The system of claim 5 further comprising a retractable hose.

7. The retractable hose is connected to the supply source.

7. The system of claim 6, further comprising a sensor for detecting whether

8. When the management system is connected to the supply source, the retractable hose and instructing the pump to draw the dielectric fluid from the source only at The system of claim 6, comprising:

9. and operating in a second operating mode in which the pump is connected to the reservoir area. instructing the valve system; and directing the pump to draw fluid from the source; The system of claim 4 further comprising a configured management system.

10. The pressure control device includes a heat exchanger having a plurality of pipes and at least one box. The system of claim 1 , comprising:

11. The pressure control device includes a heat exchanger having a plurality of pipes and at least one box. The system of claim 1 , comprising:

12. At least one of the plurality of pipes or the at least one box is vibrating. The system of claim 11 including a damper.

13. The system of claim 12 , wherein the vibration damper is a metal weight.

14. Multiple sensors and 1. A management system comprising: receiving sensor data relating to the temperature of the computer component; and Beauty, determining a fault in the filter based on the temperature of the computer component; Sea urchin, A management system configured as The system of claim 1 further comprising:

15. The sensor data may include the temperature of the computer components, the temperature of the vessel, Power consumption, external temperature, dielectric fluid temperature, incoming cooling medium temperature, outgoing cooling medium temperature temperature, the flow rate of the cooling medium, the temperature of the area above the bath area, the temperature of the liquid present in the vessel, the number of computer components in the vessel or the location of each computer component within the vessel. The system of claim 14 .

16. The management system automatically detects whether the computer component is overheating. The system of claim 14 configured to determine using a machine learning model.

17. The machine learning model is trained using the sensor data received from the vessel. The system of claim 16 .

18. 10. The method of claim 9, wherein the pressure control device comprises a bellows configured to receive a dielectric vapor.

2. The system described in 1.

19. the bellows includes a sensor for determining the volume of the bellows, and the management system The system of claim 18 configured to receive data from the sensor.

20. 20. The method of claim 19, wherein the management system is further configured to receive temperature data. system.

21. the management system is further configured to determine a state of operation of the vessel. Item 21. The system according to item 20.

22. The operating conditions are: 1) starting or stopping the heat exchanger; 2) combustion of the dielectric fluid; and 3) 22. The system of claim 21, wherein:

23. The management system determines whether or not the temperature data is received from the sensor. and determining the state of operation of the vessel using a machine learning model.

22. The system of claim 21 .

24. 10. The method of claim 1, wherein the computer component comprises a two-phase heat sink. The system described.

25. The two-phase heat sink comprises a liquid medium and two elongated metal surfaces.

25. The system of claim 24, comprising a hollow box comprising:

26. The system of claim 1 , wherein the vessel is protected by a secondary layer.

27. 27. The system of claim 26, wherein the secondary layer is parallel to the inner layer.

28. 28. The system of claim 27, wherein a fluid sensor is disposed between the secondary layer and the inner layer. Tem.

29. a vessel configured to hold a thermally conductive, condensable dielectric fluid; a computer structure configured to be at least partially submerged in the dielectric fluid; and a chassis configured to hold the computer components and the dielectric fluid; and, The dielectric fluid is drawn from a reservoir area of ​​the vessel and passed through a filter. a fluid passage configured to pass the dielectric fluid and deliver the dielectric fluid to the chassis; Circulatory system and A system comprising:

30. The chassis includes a fluid connector for receiving dielectric fluid from the fluid circulation system.

30. The system of claim 29.

31. The fluid connector is configured to open when the chassis is placed within the vessel. The system of claim 30,

32. The fluid connector is configured to allow the chassis to be removed from the vessel.

31. The system of claim 30, configured to close when

33. 30. The system of claim 29, wherein the chassis includes a heat exchanger.

34. 10. The heat exchanger according to claim 9, wherein the heat exchanger is configured to receive a cooling medium from a cooling medium connector.

33. The system according to claim 33.

35. 34. The system of claim 33, wherein the heat exchanger is an electric heat exchanger.

36. The chassis is the chassis being configured to hold a level of dielectric fluid; and Beauty, The dielectric fluid is then vaporized to allow vapor to exit the chassis and enter the vessel. Sea urchin, 30. The system of claim 29, which is openable.

37. 30. The method of claim 29, further comprising a fluid level sensor for determining the level of the dielectric fluid. The system described in

38. 38. The system of claim 37, wherein the fluid level sensor is located within the chassis.

39. and an inlet for receiving the dielectric fluid from a source external to the vessel.

38. The system of claim 37.

40. The apparatus further includes a valve system for connecting or disconnecting a fluid circulation system to the inlet.

40. The system of claim 39.

41. 41. The system of claim 40, wherein the fluid circulation system includes a pump.

42. when the level of the dielectric fluid drops below a threshold amount; instructing the valve system to operate in a first mode of operation; and directing the pump to draw dielectric fluid from the source; 42. The system of claim 41, further comprising a configured management system.

43. 40. The system of claim 39, wherein the source includes a source fluid level sensor.

44. a management system, the management system configured to detect when the source fluid level is reduced below a threshold amount; 44. The method of claim 43, wherein the method is configured to transmit a signal to a central server when system.

45. 45. The system of claim 44, wherein the threshold amount is a height level for the dielectric fluid. 。

46. The threshold amount is determined by artificial intelligence to operate the system for a predetermined period of time.

45. The system of claim 44, wherein the amount of fluid required to

47. a vessel configured to hold a thermally conductive, condensable dielectric fluid; a pressure control device for decreasing or increasing the internal pressure of the vessel; a computer structure configured to be at least partially submerged in the dielectric fluid; and The dielectric fluid is drawn from a reservoir area of ​​the vessel and passed through a filter. and passing said dielectric fluid through said vessel to deliver said dielectric fluid to a bath area of ​​said vessel. A fluid circulation system configured A system comprising:

48. 48. The system of claim 47, wherein the pressure control device is a self-contained heat exchanger.

49. 49. The method of claim 48, wherein the self-contained heat exchanger includes a coil, a radiator, and a fan. system.

50. 50. The method of claim 49, wherein the fan is configured to force air through the radiator. The system described.

51. 48. The system of claim 47, further comprising a heating element.

52. 52. The system of claim 51, wherein the heating element includes a processor and a memory.

53. A processor uses a program stored in the memory to heat the vessel.

53. The method of claim 52, configured to command the heating rods of the heating element to system.

54. 54. The system of claim 53, further comprising a transmitter for wirelessly receiving commands. 。

55. Releasable rails allow the server to slide into the server rack One or more of the releases configured to be attached to the side of the server A server adapter with rails that can be mounted on a server rack, the server rack being configured to accommodate an immersion cooling tank. A server adapter designed for vertical configuration within a

56. A computer-constructed thermally conductive, condensable dielectric fluid is placed in the bath area of ​​the vessel. at least partially submerging the component in water, The computer component includes a backplane for receiving power from the rack. It is installed in a chassis that can The computer component, when operating, configured to dissipate heat to the conductive fluid; a submersion step; A condenser is used to condense the gas phase of the dielectric fluid into the liquid phase of the dielectric fluid. Top and testing the dielectric fluid using a Raman spectrometer; A method comprising:

57. 57. The method of claim 56, further comprising the step of transmitting a signal to a controller based on said test. How to post.

58. 58. The method of claim 57, wherein the controller triggers corrective action based on the test. 。

59. a tank configured to hold a thermally conductive, condensable dielectric fluid; a pressure control device for reducing or increasing the internal pressure of the tank; a computer component at least partially immersed in the dielectric fluid; a condenser for condensing the dielectric fluid in a gas phase; a robot configured to pick up the computer component; a Raman spectrometer operably connected to a controller, the controller controlling the Raman configured to receive test results from the spectrometer and trigger corrective action based on said test results. The Raman spectrometer and A system comprising:

60. System for reducing the amount of dielectric fluid employed in an immersion cooling tank having a bottom wherein the tank is configured to cool one or more computer components. , the system a metal retaining plate configured to be attached to the bottom of the immersion cooling tank; 、 configured to be releasably attached to the metal retaining plate, a plurality of filler plates configured to underlie one or more computer components; Rate and A system comprising:

61. one or more of up to all of the filler plates 61. The system of claim 60, comprising a material that is less dense than the dielectric fluid.

62. one or more of up to all of said filler plates 61. The system of claim 60, wherein comprises a thermoplastic material.

63. one or more of up to all of said filler plates The system of claim 60, wherein comprises polyoxymethylene.

64. configured to be releasably attached to the metal retaining plate and a second sensor configured to be adjacent to one or more computer components in a direction 61. The system of claim 60, further comprising a filler plate.

65. 1. A tank configured to hold a thermally conductive, condensable dielectric fluid, comprising: a tank, the tank operably connected to a bellows; one or more computer components at least partially immersed in said dielectric fluid; a rack configured to hold components; a condenser for condensing the dielectric fluid in a gas phase; a metal retaining plate configured to be attached to the bottom of the tank; configured to be releasably attached to the metal retaining plate and a plurality of fillers configured to underlie one or more computer components; -plate and A system comprising:

66. At least partially immersing a computer component in a thermally conductive and condensable dielectric fluid A submerging step, The computer component includes a backplane for receiving power from the rack. It is installed in a chassis that can The computer component, when operating, configured to dissipate heat to the conductive fluid; a submersion step; A condenser is used to condense the gas phase of the dielectric fluid into the liquid phase of the dielectric fluid. Top and Including, The rack is in a tank operatively connected to a bellows, and a metal retaining plate is attached to the front A plurality of filler plates are configured to be attached to the bottom of the tank, and the metal support a support plate configured to be releasably attached to the one or configured to underlie a plurality of computer components; method.

67. 1. A tank configured to hold a thermally conductive, condensable dielectric fluid, comprising: a tank, the tank operably connected to a bellows; one or more computer components at least partially immersed in said dielectric fluid; a rack configured to hold components; a condenser for condensing the dielectric fluid in a gas phase; a platform configured to be attached to the bottom of the tank using a shock absorber; Room and a vehicle configured to provide power and data connectivity to the tank; A system comprising:

68. A battery for providing the power and data connectivity to the tank.

68. The system of claim 67, further comprising: an antenna for transmitting the signal.

69. 68. The system of claim 67, wherein the shock absorber is a spring.

70. the vehicle including a heat outlet for transferring heat from the condenser outside the tank; 68. The system of claim 67.

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