Chemical heat storage reactor

Abstract

To provide a chemical heat storage reactor capable of easily replacing a chemical heat storage body arranged so as to reduce thermal resistance to a flow passage member of a heat exchanger.SOLUTION: A chemical heat storage reactor 11 includes a chemical heat storage body 21, a heat exchanger 31 for exchanging heat with the chemical heat storage body 21, and an attaching member 41 for attaching the chemical heat storage body 21 to the heat exchanger 31. The chemical heat storage body 21 includes a chemical heat storage material HM and a holding member 22 that holds the chemical heat storage material HM. The heat exchanger 31 includes a flow path member 32 through which a heat medium flows. The chemical heat storage reactor 11 further includes a heat conduction layer 51 which is disposed in a heat transfer part 12 between the holding member 22 and the flow path member 32 for reducing the thermal resistance of the heat transfer part 12. The heat conductive layer 51 is non-adhesive to the holding member 22 and the flow path member 32. The attaching member 41 presses the holding member 22 against the heat conduction layer 51.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a chemical heat storage reactor. [Background technology]

[0002] As described in Patent Document 1, a chemical heat storage reactor equipped with a chemical heat storage material that generates heat by reacting with a reaction medium is known. The chemical heat storage reactor is equipped with a heat exchanger that exchanges heat with the chemical heat storage material. The chemical heat storage material is arranged around a flow path member through which the heat medium flows in the heat exchanger. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-040463 Summary of the Invention [Problem to be solved by the invention]

[0004] In the chemical heat storage reactor as described above, arranging the chemical heat storage body containing the chemical heat storage material and the flow path member of the heat exchanger so as to reduce the thermal resistance between them is advantageous in terms of accelerating the reaction rate of the chemical heat storage material. For example, the chemical heat storage body arranged in this manner is required to be easily replaceable when the chemical heat storage material deteriorates. [Means for solving the problem]

[0005] A chemical heat storage reactor that solves the above problem comprises a chemical heat storage body, a heat exchanger that exchanges heat with the chemical heat storage body, and an attachment member that attaches the chemical heat storage body to the heat exchanger, wherein the chemical heat storage body has a chemical heat storage material and a holding member that holds the chemical heat storage material, and the heat exchanger is a chemical heat storage reactor having a flow path member through which a heat medium flows, and further comprises a heat conductive layer that is arranged in a heat transfer section between the holding member and the flow path member and reduces the thermal resistance of the heat transfer section, the heat conductive layer is non-adhesive to the holding member and the flow path member, and the attachment member presses the holding member against the heat conductive layer.

[0006] According to this configuration, the chemical heat storage medium can be arranged so that the thermal resistance to the flow path member of the heat exchanger is small by the thermal conductive layer and the mounting member. Furthermore, since the thermal conductive layer is non-adhesive to the holding member and the flow path member, the chemical heat storage medium can be easily removed from the heat exchanger. [Effects of the Invention]

[0007] The present invention exhibits the effect of making it possible to easily replace a chemical heat storage medium that is arranged so as to reduce thermal resistance relative to a flow path member of a heat exchanger. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a chemical heat storage reactor according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view showing the main part of the chemical heat storage reactor. [Figure 3] FIG. 3 is a perspective view showing the main part of the chemical heat storage reactor. [Figure 4] FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. [Figure 5] FIG. 5 is a graph showing the relationship between the thermal resistance of the heat transfer part and the reaction rate of the chemical heat storage material. [Figure 6]Figures 6(a) and 6(b) are graphs showing the relationship between the position of the heat transfer section and the reaction rate of the chemical heat storage material, where Figure 6(a) shows the case where the thermal resistance of the upstream heat transfer section and the downstream heat transfer section is constant, and Figure 6(b) shows the case where the thermal resistance of the downstream heat transfer section is smaller than the thermal resistance of the upstream heat transfer section. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of a chemical heat storage reactor will be described with reference to the drawings. <Overall configuration of chemical heat storage reactor> As shown in Figures 1 to 4, the chemical heat storage reactor 11 includes a chemical heat storage body 21, a heat exchanger 31 that exchanges heat with the chemical heat storage body 21, and an attachment member 41 that attaches the chemical heat storage body 21 to the heat exchanger 31.

[0010] The chemical heat storage body 21 has a chemical heat storage material HM and a holding member 22 that holds the chemical heat storage material HM. The heat exchanger 31 has a flow path member 32 through which a heat medium flows. The chemical heat storage reactor 11 has a heat conduction layer 51 that is arranged in the heat transfer section 12 between the holding member 22 and the flow path member 32.

[0011] The chemical heat storage reactor 11 includes a pressure adjusting vessel 61. The chemical heat storage medium 21, the heat exchanger 31, the mounting member 41, and the heat conduction layer 51 are housed in the pressure adjusting vessel 61. In Figs. 2 to 4, the pressure adjusting vessel 61 is omitted, and the configuration around one of the plurality of flow path members 32 included in the heat exchanger 31 is shown. In the drawings, the thickness of the members may be exaggerated to make the structure easier to understand.

[0012] The chemical heat storage reactor 11 alternately performs a heat storage operation and a heat release operation. In the heat storage operation, heat transported by a heat medium from an external exhaust heat source is stored in the chemical heat storage body 21. In the heat release operation, heat generated from the chemical heat storage body 21 is transported by the heat medium to an external heating target.

[0013] <Chemical heat storage material> The chemical heat storage material HM of the chemical heat storage body 21 is a material that releases heat by reacting with a reaction medium. In this embodiment, a chemical heat storage material HM in which the reaction medium is water (water vapor) will be described as an example. The chemical heat storage material HM in which water is the reaction medium stores heat by a dehydration reaction and releases heat by a hydration reaction.

[0014] The chemical heat storage material HM is preferably a powder material. The chemical heat storage material HM may be composed only of a chemical heat storage substance that undergoes a dehydration reaction and a hydration reaction, or may be a material in which the chemical heat storage substance is bound with a water vapor permeable binder such as a water vapor permeable resin.

[0015] Examples of the chemical heat storage material include alkaline earth metal halides, etc. One type of chemical heat storage material HM may be used, or multiple types may be used in combination. The dehydration reaction and hydration reaction of calcium chloride, which is a type of chemical heat storage material, are represented by, for example, the following formula (A).

[0016] CaCl2·H2O+H2O⇔CaCl2·2H2O···(A) 4, the holding member 22 of this embodiment has a recess 23 into which the chemical thermal storage medium HM is inserted. The recess 23 is composed of a bottom wall 23a and a pair of side walls 23b protruding from the bottom wall 23a. The number of recesses 23 may be one or more.

[0017] Examples of materials for the holding member 22 include metal materials, resin materials, and ceramic materials. The shape of the holding member 22 is not limited to the shape shown in the figure. For example, a heat transfer fin formed from a metal plate can be used as the holding member 22. Examples of heat transfer fins include corrugated fins, offset fins, waving fins, and folding fins (product names).

[0018] The chemical heat storage body 21 of this embodiment includes a first chemical heat storage body 21a and a second chemical heat storage body 21b that are arranged so as to sandwich a flow path member 32 of a heat exchanger 31. More specifically, the first chemical heat storage body 21a and the second chemical heat storage body 21b are arranged so as to face each other. The bottom wall 23a of the holding member 22 in the first chemical heat storage body 21a and the bottom wall 23a of the holding member 22 in the second chemical heat storage body 21b are arranged so as to follow the flat surface of the flow path member 32.

[0019] <Heat exchanger> 1, the heat exchanger 31 is connected to an inlet pipe T1 through which the heat medium flows from the outside of the pressure regulating vessel 61 into the flow path member 32, and an outlet pipe T2 through which the heat medium flows from the flow path member 32 to the outside of the pressure regulating vessel 61. The heat exchanger 31 is made of, for example, a metal material. The heat exchanger 31 may have a plurality of flow path members 32 arranged to extend parallel to each other. A plurality of the chemical heat storage bodies 21 can be arranged corresponding to each of the plurality of flow path members 32.

[0020] As shown in FIGS. 2 to 4, the flow path member 32 has a heat medium flow path P1. The upstream side of the flow path member 32 in the flow direction of the heat medium flow path P1 is the lower side in the drawing, and the downstream side is the upper side in the drawing. The flow path member 32 is preferably a flat flow path pipe. That is, the outer peripheral surface of the flow path member 32 preferably has a flat surface to which the chemical heat storage body 21 is disposed so as to face. The flat surface forms the front and back surfaces of the flow path member 32 and is formed so as to extend along the heat medium flow path P1. The number of heat medium flow paths P1 in one flow path member 32 may be one or more. An example of a flow path member 32 having a plurality of heat medium flow paths P1 is a flat perforated pipe.

[0021] <Mounting parts> The mounting member 41 presses the holding member 22 of the chemical heat storage material 21 against the thermal conduction layer 51. The mounting member 41 of this embodiment includes a support member 42 and a fastening member 43. The support member 42 has a porous structure that allows the permeation of a reaction medium that reacts with the chemical heat storage material HM. Examples of materials for the support member 42 include metal materials and ceramic materials. The shape of the support member 42 is, for example, a plate shape. The support member 42 of this embodiment is made of a porous body having a porous structure.

[0022] The support member 42 includes a first support member 42a and a second support member 42b. The first chemical heat storage body 21a and the second chemical heat storage body 21b are disposed between the first support member 42a and the second support member 42b.

[0023] The fastening member 43 fastens the first support member 42a and the second support member 42b together. The fastening member 43 in this embodiment includes a stud bolt 43a and a pair of nuts 43b that are screwed onto both ends of the stud bolt 43a. More specifically, the first support member 42a and the second support member 42b have through holes into which the stud bolt 43a can be inserted. By screwing the nuts 43b onto the stud bolts 43a that have been inserted into the through holes of the first support member 42a and the second support member 42b, the chemical heat storage body 21 can be attached to the heat exchanger 31 with the holding member 22 of the chemical heat storage body 21 pressed against the thermal conduction layer 51.

[0024] <Thermal Conduction Layer> The thermally conductive layer 51 reduces the thermal resistance of the heat transfer section 12. The thermally conductive layer 51 is non-adhesive to the holding member 22 of the chemical heat storage medium 21 and the flow path member 32 of the heat exchanger 31. The thermally conductive layer 51 is preferably a layer that is deformable so as to follow the holding member 22 of the chemical heat storage medium 21 and the flow path member 32 of the heat exchanger 31.

[0025] The thermal conductivity of the thermally conductive layer 51 in the thickness direction is, for example, preferably 1 W / (m·K) or more, more preferably 2 W / (m·K) or more, and even more preferably 3 W / (m·K) or more. The thermal conductivity can be measured in accordance with, for example, ISO22007-2.

[0026] The thermally conductive layer 51 can be formed by incorporating a thermally conductive filler or the like into an organic base material as needed. Specific examples of the thermally conductive layer 51 include a thermally conductive grease layer and a thermally conductive sheet. The thermally conductive grease layer contains a base oil and a thermally conductive filler. Examples of the base oil include mineral oil, synthetic hydrocarbon oil, organic acid ester, phosphate ester, silicone oil, and fluorine oil. One type of base oil may be used, or multiple types may be used in combination.

[0027] Examples of thermally conductive fillers include carbon-based fillers and ceramic-based fillers. Examples of carbon-based fillers include graphite, carbon nanotubes, carbon nanofibers, and carbon fibers. Examples of ceramic fillers include silicon carbide, alumina, hexagonal boron nitride, and aluminum nitride. One type of thermally conductive filler may be used, or multiple types may be used in combination. For example, a fibrous filler having a diameter of 5 nm to 1000 nm and a length of 1 μm to 50 μm may be used. The thermally conductive filler may be surface-treated with a coupling agent such as a silane coupling agent.

[0028] The thermally conductive grease layer may also contain additives such as dispersants, antioxidants, rust inhibitors, corrosion inhibitors, thickeners, and thickeners. The content of the base oil in the thermally conductive grease layer is, for example, in the range of 1% by mass to 10% by mass, and the content of the thermally conductive filler in the thermally conductive grease layer is, for example, in the range of 20% by mass to 99% by mass.

[0029] The thermally conductive grease layer can be formed by applying thermally conductive grease containing the above-mentioned components to at least one of the holding member 22 of the chemical thermal storage medium 21 and the flow path member 32 of the heat exchanger 31. The consistency of the thermally conductive grease is preferably in the range of 100 or more and 300 or less in terms of worked penetration as defined in JIS K2220:2013. When this worked penetration is 100 or more, it is possible to further improve the conformability of the thermally conductive grease to the holding member 22 of the chemical thermal storage medium 21 and the flow path member 32 of the heat exchanger 31. When this worked penetration is 300 or less, it is possible to suppress displacement of the thermally conductive grease layer.

[0030] The thermally conductive sheet contains a binder and a thermally conductive filler, such as a fluororesin, an epoxy resin, a urethane resin, a silicone resin, a polyimide, a polyether ether ketone, a polyolefin, a fluororubber, a silicone rubber, an elastomer, or clay.

[0031] Examples of the thermally conductive filler contained in the thermally conductive sheet include those exemplified as the thermally conductive filler contained in the thermally conductive grease layer. The thermally conductive sheet can also contain additives. Examples of the additives for the thermally conductive sheet include those exemplified as the additives for the thermally conductive grease layer.

[0032] The content of the binder in the thermally conductive sheet is, for example, in the range of 10% by mass to 90% by mass, and the content of the thermally conductive filler in the thermally conductive sheet is, for example, in the range of 10% by mass to 90% by mass.

[0033] Next, the arrangement of the heat conduction layer 51 in the flow direction of the flow path member 32 will be described. 4, the heat transfer section 12 has an upstream heat transfer section 12a and a downstream heat transfer section 12b located downstream of the upstream heat transfer section 12a in the flow path member 32. The thermal conduction layer 51 has an upstream heat conduction layer 52 arranged in the upstream heat transfer section 12a and a downstream heat conduction layer 53 arranged in the downstream heat transfer section 12b. The downstream heat conduction layer 53 is configured so that the thermal resistance of the downstream heat transfer section 12b is smaller than the thermal resistance of the upstream heat transfer section 12a.

[0034] As the configuration of the upstream thermally conductive layer 52 and the downstream thermally conductive layer 53, for example, at least one configuration selected from the following (Configuration 1) to (Configuration 3) can be adopted. (Configuration 1) The upstream thermally conductive layer 52 and the downstream thermally conductive layer 53 contain a thermally conductive filler. The content of the thermally conductive filler in the downstream thermally conductive layer 53 is greater than the content of the thermally conductive filler in the upstream thermally conductive layer 52. In this case, the thermal resistance in the thickness direction of the downstream thermally conductive layer 53 can be made smaller than the thermal resistance in the thickness direction of the upstream thermally conductive layer 52. The upstream thermally conductive layer 52 and the downstream thermally conductive layer 53 shown in FIG. 4 have (Configuration 1).

[0035] (Configuration 2) The thickness dimension of the downstream thermally conductive layer 53 is smaller than the thickness dimension of the upstream thermally conductive layer 52. In this case as well, the thermal resistance of the downstream thermally conductive layer 53 in the thickness direction can be made smaller than the thermal resistance of the upstream thermally conductive layer 52 in the thickness direction.

[0036] (Configuration 3) The area of ​​the downstream heat conduction layer 53 is larger than the area of ​​the upstream heat conduction layer 52. For example, the upstream heat conduction layer 52 can be disposed on part of the upstream heat transfer section 12a, and the downstream heat conduction layer 53 can be disposed on the entire downstream heat transfer section 12b. In this case, the thermal resistance of the downstream heat transfer section 12b can be made lower than the thermal resistance of the upstream heat transfer section 12a.

[0037] The upstream heat transfer section 12a and the downstream heat transfer section 12b are separated at the center of the heat transfer section 12 in the heat medium flow direction. That is, the boundary between the upstream heat transfer section 12a and the downstream heat transfer section 12b is defined by a straight line that passes through the center of the heat transfer section 12 in the heat medium flow direction. The thermal resistance of the upstream heat transfer section 12a and the thermal resistance of the downstream heat transfer section 12b can be compared by the average value of the thermal resistance of the upstream heat transfer section 12a and the average value of the thermal resistance of the downstream heat transfer section 12b.

[0038] The upstream heat transfer section 12a may be divided into a plurality of areas with different thermal resistances in the flow direction of the heat medium. That is, the upstream thermal conduction layer 52 disposed in the upstream heat transfer section 12a may be configured to have a plurality of areas in which the thermal resistance of the upstream heat transfer section 12a decreases from the upstream side to the downstream side.

[0039] The downstream heat transfer section 12b may be divided into a plurality of areas with different thermal resistances in the flow direction of the heat medium. That is, the downstream thermal conduction layer 53 disposed in the downstream heat transfer section 12b may be configured to have a plurality of areas in which the thermal resistance of the downstream heat transfer section 12b decreases from the upstream side to the downstream side.

[0040] Next, the arrangement of the heat conduction layer 51 in the radial direction of the flow path member 32 will be described. The thermally conductive layer 51 includes a first thermally conductive layer 51a and a second thermally conductive layer 51b. The first thermally conductive layer 51a is disposed in the heat transfer section 12 between the holding member 22 of the first chemical heat storage body 21a and the flow path member 32. The second thermally conductive layer 51b is disposed in the heat transfer section 12 between the holding member 22 of the second chemical heat storage body 21b and the flow path member 32. The first thermally conductive layer 51a and the second thermally conductive layer 51b are disposed so as to sandwich the flow path member 32 therebetween.

[0041] The first thermally conductive layer 51a has an upstream thermally conductive layer 52 and a downstream thermally conductive layer 53. The second thermally conductive layer 51b has an upstream thermally conductive layer 52 and a downstream thermally conductive layer 53. The first thermally conductive layer 51a and the second thermally conductive layer 51b may have the same configuration as each other or different configurations from each other.

[0042] <Pressure regulating vessel> 1, the pressure adjusting vessel 61 has a pressure adjusting vessel main body 62 and a reaction medium flow pipe 63 through which the reaction medium flows. The reaction medium flow pipe 63 is configured to introduce the reaction medium (water vapor) from the outside of the pressure adjusting vessel main body 62 and to discharge the reaction medium (water vapor) inside the pressure adjusting vessel main body 62 to the outside. The inside of the pressure adjusting vessel main body 62 and the reaction medium flow pipe 63 form a reaction medium flow path P2 connected to the chemical heat storage body 21. The pressure adjusting vessel 61 has an opening / closing part (not shown). The above-mentioned chemical heat storage body 21 can be carried into the pressure adjusting vessel 61 through the opening / closing part in an open state.

[0043] <Method for installing a chemical heat storage medium and method for replacing a chemical heat storage medium> Next, an example of a method for attaching the chemical heat storage medium 21 and a method for replacing the chemical heat storage medium 21 will be described.

[0044] 2, to attach the chemical heat storage material 21 to the heat exchanger 31, the chemical heat storage material 21 is placed along the flow path member 32 of the heat exchanger 31. At this time, a thermally conductive layer 51 is placed in the heat transfer section 12 between the holding member 22 of the chemical heat storage material 21 and the flow path member 32 of the heat exchanger 31. Next, the chemical heat storage material 21 is attached to the heat exchanger 31 using an attachment member 41. At this time, by fastening the fastening members 43 of the attachment member 41, the holding member 22 of the chemical heat storage material 21 can be pressed against the thermally conductive layer 51.

[0045] To replace the chemical heat storage body 21, first, the mounting member 41 is removed, and then the chemical heat storage body 21 is removed from the heat exchanger 31. At this time, the heat conduction layer 51 is non-adhesive to the holding member 22 and the flow path member 32. In other words, the holding member 22 and the flow path member 32 are not bonded by the heat conduction layer 51. Therefore, the chemical heat storage body 21 can be easily removed from the heat exchanger 31. This allows the chemical heat storage body 21 to be easily replaced.

[0046] In this way, by configuring the chemical heat storage material 21 as a cartridge that is a replaceable part, it is possible to reduce the maintenance work for the chemical heat storage reactor 11. Furthermore, for example, when the thermally conductive layer 51 deteriorates, the thermally conductive layer 51 can also be easily replaced. The mounting member 41 can be reused.

[0047] <Operation of chemical heat storage reactor> Next, an example of the operation of the chemical heat storage reactor 11 will be described. (heat storage operation) The heat storage operation is performed by a dehydration reaction of the chemical heat storage material HM. The dehydration reaction of the chemical heat storage material HM can be performed by heating the chemical heat storage material HM with exhaust heat transported to the heat exchanger 31 of the chemical heat storage reactor 11 and by reducing the water vapor pressure around the chemical heat storage body 21. The water vapor generated from the chemical heat storage material HM passes through the reaction medium flow path P2 of the pressure regulating vessel 61 shown in Fig. 1 and the reaction medium flow pipe 63 in this order and is discharged to the outside of the chemical heat storage reactor 11.

[0048] During the heat storage operation, for example, an absorber containing an absorbent that absorbs water vapor or a condenser that condenses water vapor is connected to the pressure regulating vessel 61. This makes it possible to reduce the water vapor pressure inside the pressure regulating vessel 61. Calcium chloride, which is a type of chemical heat storage material, can store heat by utilizing exhaust heat of 80°C when the water vapor pressure is 2 kPa, for example.

[0049] (heat dissipation operation) The heat dissipation operation is performed by a hydration reaction of the chemical heat storage material HM. The hydration reaction of the chemical heat storage material HM can be performed by increasing the water vapor pressure around the chemical heat storage body 21. Water vapor can be brought into contact with the chemical heat storage material HM by passing through the reaction medium flow pipe 63 and the reaction medium flow path P2 of the pressure regulating vessel 61 shown in FIG. 1 in this order.

[0050] During heat dissipation, for example, an evaporator that generates water vapor by utilizing exhaust heat is connected to the pressure regulating vessel 61. This makes it possible to increase the water vapor pressure inside the pressure regulating vessel 61. Calcium chloride, which is a type of chemical heat storage material, can dissipate heat of 170°C when the water vapor pressure is 95 kPa, for example.

[0051] <Function of the thermal conduction layer> Next, the function of the thermally conductive layer 51 will be described. FIG. 5 shows the relationship between the thermal resistance of the heat transfer section 12 and the reaction rate of the chemical heat storage material HM. As shown in FIG. 5, the greater the thermal resistance of the heat transfer section 12, the slower the reaction rate of the chemical heat storage material HM. The chemical heat storage reactor 11 of this embodiment is provided with a heat conduction layer 51 that reduces the thermal resistance of the heat transfer section 12. This makes it possible to increase the reaction rate of the chemical heat storage material HM in the chemical heat storage body 21. In more detail, for example, in the heat dissipation operation, the thermal resistance of the heat transfer section 12 is reduced as described above, thereby facilitating heat transfer from the chemical heat storage material HM to the heat medium flowing through the heat medium flow path P1 of the flow path member 32. This makes it possible to promote the reaction (hydration reaction) of the chemical heat storage material HM. Furthermore, for example, it is possible to increase the efficiency of heat transport by the heat medium.

[0052] 6(a) and 6(b) show the relationship between the position of the heat transfer section 12 and the reaction rate of the chemical heat storage material HM. The upstream end and downstream end of the position of the heat transfer section 12 in FIGS. 6(a) and 6(b) respectively indicate the upstream end and downstream end in the flow direction of the heat medium of the flow path member 32. For example, in the heat dissipation operation, the temperature of the heat medium of the flow path member 32 increases from the upstream end to the downstream end. For this reason, the temperature difference between the temperature of the chemical heat storage material HM at the downstream end of the heat transfer section 12 and the temperature of the flow path member 32 is smaller than the temperature difference between the temperature of the chemical heat storage material HM at the upstream end of the heat transfer section 12 and the temperature of the flow path member 32. For this reason, the reaction rate of the chemical heat storage material HM slows down toward the downstream side.

[0053] Here, Fig. 6(a) shows the above relationship when the thermal resistances of the upstream heat transfer section 12a and the downstream heat transfer section 12b are constant. On the other hand, Fig. 6(b) shows the above relationship when the thermal resistance of the downstream heat transfer section 12b is smaller than the thermal resistance of the upstream heat transfer section 12a. As shown in Fig. 6(a) and Fig. 6(b), by making the thermal resistance of the downstream heat transfer section 12b smaller than the thermal resistance of the upstream heat transfer section 12a, it is possible to promote heat transfer from the chemical thermal storage medium HM to the flow path member 32 in the downstream heat transfer section 12b. This makes it possible to make the reaction rate of the chemical thermal storage medium HM on the downstream side closer to the reaction rate of the chemical thermal storage medium HM on the upstream side.

[0054] <Actions and Effects of the Embodiment> Next, the operation and effects of the embodiment will be described. (1) The chemical heat storage reactor 11 comprises a chemical heat storage body 21, a heat exchanger 31 that exchanges heat with the chemical heat storage body 21, and an attachment member 41 that attaches the chemical heat storage body 21 to the heat exchanger 31. The chemical heat storage body 21 comprises a chemical heat storage material HM and a holding member 22 that holds the chemical heat storage material HM. The heat exchanger 31 comprises a flow path member 32 through which a heat medium flows. The chemical heat storage reactor 11 further comprises a heat conduction layer 51 that is disposed in the heat transfer section 12 between the holding member 22 and the flow path member 32 and that reduces the thermal resistance of the heat transfer section 12. The heat conduction layer 51 is non-adhesive to the holding member 22 and the flow path member 32. The attachment member 41 presses the holding member 22 against the heat conduction layer 51.

[0055] According to this configuration, the heat conductive layer 51 and the mounting member 41 allow the chemical heat storage body 21 to be arranged so that the thermal resistance is small relative to the flow path member 32 of the heat exchanger 31. Furthermore, since the heat conductive layer 51 is non-adhesive to the holding member 22 and the flow path member 32, the chemical heat storage body 21 can be easily removed from the heat exchanger 31. Therefore, it becomes possible to easily replace the chemical heat storage body 21 arranged so that the thermal resistance is small relative to the flow path member 32 of the heat exchanger 31.

[0056] (2) The heat transfer section 12 has an upstream heat transfer section 12a and a downstream heat transfer section 12b located downstream of the upstream heat transfer section 12a on the flow path member 32. The thermal conduction layer 51 has an upstream heat conduction layer 52 arranged in the upstream heat transfer section 12a and a downstream heat conduction layer 53 arranged in the downstream heat transfer section 12b. The downstream heat conduction layer 53 is configured so that the thermal resistance of the downstream heat transfer section 12b is smaller than the thermal resistance of the upstream heat transfer section 12a.

[0057] In this case, as described above, it is possible to promote heat transfer from the chemical heat storage material HM to the flow path member 32 in the downstream heat transfer section 12b. Therefore, it is possible to make the reaction rate of the chemical heat storage material HM on the downstream side closer to the reaction rate of the chemical heat storage material HM on the upstream side. This makes it possible to increase the uniformity of the reaction rate of the chemical heat storage material HM.

[0058] By increasing the uniformity of the reaction rate of the chemical heat storage material HM, for example, the utilization rate of the chemical heat storage material HM can be increased. Furthermore, it is possible to easily avoid deterioration of the chemical heat storage material HM caused by excessive contact between the chemical heat storage material HM and the reaction medium. In particular, calcium chloride, which is a type of chemical heat storage material HM that releases heat through a hydration reaction, is deliquescent. When using a chemical heat storage material HM that is deliquescent in this way, if the uniformity of the reaction rate of the chemical heat storage material HM is low, there is a risk that a portion of the chemical heat storage material HM will come into excessive contact with water vapor, causing the chemical heat storage material HM to deliquesce. In this case, by increasing the uniformity of the reaction rate of the chemical heat storage material HM as described above, it is possible to suppress excessive contact between a portion of the chemical heat storage material HM and water vapor and increase the utilization rate of the chemical heat storage material HM. This makes it possible to suppress deliquescence of the chemical heat storage material HM and increase the utilization rate of the chemical heat storage material HM.

[0059] (3) The upstream heat conduction layer 52 and the downstream heat conduction layer 53 are preferably configured to have at least one configuration selected from (Configuration 1) to (Configuration 3). In this case, the thermal resistance of the heat transfer section 12 can be easily adjusted so that the thermal resistance of the downstream heat transfer section 12b is smaller than the thermal resistance of the upstream heat transfer section 12a.

[0060] (4) The thermally conductive layer 51 is preferably a thermally conductive grease containing a base oil and a thermally conductive filler. In this case, for example, the adhesion of the thermally conductive layer 51 to the holding member 22 and the flow path member 32 can be easily increased. This makes it possible to further reduce the thermal resistance of the heat transfer section 12. Therefore, the reaction rate of the chemical thermal storage medium HM can be easily increased.

[0061] (5) The chemical heat storage body 21 includes a first chemical heat storage body 21a and a second chemical heat storage body 21b that are arranged to sandwich the flow path member 32. The thermal conduction layer 51 includes a first thermal conduction layer 51a and a second thermal conduction layer 51b. The first thermal conduction layer 51a is arranged in the heat transfer section 12 between the holding member 22 of the first chemical heat storage body 21a and the flow path member 32. The second thermal conduction layer 51b is arranged in the heat transfer section 12 between the holding member 22 of the second chemical heat storage body 21b and the flow path member 32. The mounting member 41 includes a first support member 42a and a second support member 42b, and a fastening member 43 that fastens the first support member 42a and the second support member 42b. The first support member 42a and the second support member 42b have a porous structure that allows permeation of a reaction medium that reacts with the chemical heat storage material HM. The first chemical heat storage body 21a and the second chemical heat storage body 21b are disposed between the first support member 42a and the second support member 42b.

[0062] In this case, the first chemical heat storage body 21a, the second chemical heat storage body 21b, the first thermal conduction layer 51a, and the second thermal conduction layer 51b can be easily attached to and detached from the flow path member 32 by the mounting member 41. Furthermore, since a reaction medium flow path P2 that passes through the first support member 42a and the second support member 42b of the mounting member 41 can be secured, it is possible to increase the reaction efficiency of the chemical heat storage material HM, for example.

[0063] <Example of change> The above embodiment may be modified as follows: The above embodiment and the following modifications may be implemented in combination with each other within the scope of technical compatibility.

[0064] The chemical heat storage material HM is not limited to a chemical heat storage material HM that uses water as a reaction medium, and can be changed to a chemical heat storage material HM that uses a reaction medium other than water. Examples of chemical heat storage materials HM that use a reaction medium other than water include calcium carbonate that uses carbon dioxide as a reaction medium and strontium chloride that uses ammonia as a reaction medium.

[0065] The holding member 22 of the chemical heat storage body 21 may be a container that contains the chemical heat storage material HM and has a vapor permeable portion that allows the vapor of the reaction medium to pass through. The vapor permeable portion can be made of, for example, a non-porous vapor permeable film. When the reaction medium is water vapor, the water vapor permeability coefficient of the vapor permeable film is set to 1×10 from the viewpoint of making it easier to adjust the water vapor pressure conditions of the chemical heat storage material HM. -13 [mol m / (m 2 The upper limit of the water vapor permeability coefficient is not particularly limited, but is preferably 1×10 -7 [mol m / (m 2 ·sec·Pa)] or less. The water vapor permeability coefficient can be measured, for example, by a moisture sensor method (JIS K7129:2008). Examples of resin materials for the vapor-permeable film include polymethylpentene, ethylene-vinyl alcohol copolymer, polyamide, and polystyrene.

[0066] The holding member 22 of the chemical heat storage body 21 can also be configured, for example, by combining the above-mentioned container and heat transfer fins. In more detail, for example, a chemical heat storage body can be configured by further accommodating a container containing the chemical heat storage material HM in a recess of a heat transfer fin. Furthermore, for example, a chemical heat storage body can be configured by accommodating the chemical heat storage material HM in a recess of a heat transfer fin, and further accommodating the heat transfer fin and the chemical heat storage material HM in a container.

[0067] The fastening member 43 of the mounting member 41 may be a linear member such as a wire, or a threaded member such as a screw. At least one of the first support member 42a and the second support member 42b in the mounting member 41 may be omitted. That is, for example, the mounting member may be configured by a fastening member that fastens the holding member 22 of the first chemical heat storage body 21a and the holding member 22 of the second chemical heat storage body 21b. Furthermore, for example, the mounting member may be configured by a fastening member that fastens at least one of the first chemical heat storage body 21a and the second chemical heat storage body 21b and the flow path member 32. Even when the mounting member is configured in this way, the holding member 22 can be pressed against the thermal conduction layer 51.

[0068] The support member 42 of the mounting member 41 has a porous structure that allows the permeation of a reaction medium that reacts with the chemical thermal storage medium HM, but this porous structure can be omitted. In this case, it is preferable to provide through holes such as slits in the part of the support member that faces the chemical thermal storage medium HM, so that the reaction medium of the chemical thermal storage material HM can permeate.

[0069] The support member 42 of the mounting member 41 is entirely made of a porous material. That is, the entire support member 42 is made of a porous structure, but only a portion of the support member can be made of a porous structure. For example, the area around the through hole in the support member, into which the stud bolt 43a can be inserted, can be made of a non-porous structure.

[0070] The upstream heat transfer layer 52 is arranged in the upstream heat transfer section 12a, and the downstream heat transfer layer 53 is arranged in the downstream heat transfer section 12b. However, the heat transfer layer arranged in the upstream heat transfer section 12a and the heat transfer layer arranged in the downstream heat transfer section 12b may be heat transfer layers of the same configuration.

[0071] The planar shape of the heat conduction layer 51 is a rectangle, but it may be a polygon other than a rectangle, a circle, an ellipse, a frame shape, or the like. The upstream thermally conductive layer 52 may be divided into multiple layers. The downstream thermally conductive layer 53 may also be divided into multiple layers. [Explanation of symbols]

[0072] 11...Chemical heat storage reactor 12...Heat transfer section 12a...Upstream heat transfer section 12b...Downstream heat transfer section 21... Chemical heat storage body 21a...First chemical heat storage body 21b...Second chemical heat storage body 22...Holding member 31...Heat exchanger 32...Flow path member 41...Mounting member 42...Support member 42a...first support member 42b...second support member 43...Fastening member 51...Heat conduction layer 51a...first thermally conductive layer 51b...second thermally conductive layer 52...Upstream heat conduction layer 53...Downstream heat conduction layer HM…Chemical heat storage material

Claims

1. A chemical heat storage medium, a heat exchanger that exchanges heat with the chemical heat storage medium, and an attachment member that attaches the chemical heat storage medium to the heat exchanger, The chemical heat storage medium has a chemical heat storage material and a holding member that holds the chemical heat storage material, The heat exchanger is a chemical heat storage reactor having a flow path member through which a heat medium flows, a heat conduction layer disposed in a heat transfer section between the holding member and the flow path member, the heat conduction layer reducing the thermal resistance of the heat transfer section; the heat conduction layer is non-adhesive to the holding member and the flow path member; The mounting member presses the holding member against the thermally conductive layer.

2. the heat transfer section includes an upstream heat transfer section and a downstream heat transfer section located downstream of the flow path member relative to the upstream heat transfer section, the thermal conduction layer includes an upstream thermal conduction layer disposed on the upstream heat transfer portion and a downstream thermal conduction layer disposed on the downstream heat transfer portion, The chemical heat storage reactor according to claim 1 , wherein the downstream heat conduction layer is configured so that the thermal resistance of the downstream heat transfer portion is smaller than the thermal resistance of the upstream heat transfer portion.

3. the upstream thermally conductive layer and the downstream thermally conductive layer contain a thermally conductive filler; The chemical heat storage reactor according to claim 2 , wherein the content of the thermally conductive filler in the downstream thermally conductive layer is greater than the content of the thermally conductive filler in the upstream thermally conductive layer.

4. The chemical heat storage reactor of claim 2 , wherein a thickness dimension of the downstream heat conduction layer is smaller than a thickness dimension of the upstream heat conduction layer.

5. The chemical heat storage reactor of claim 2 , wherein the area of ​​the downstream heat conduction layer is greater than the area of ​​the upstream heat conduction layer.

6. The chemical heat storage reactor according to claim 1 , wherein the thermally conductive layer is a thermally conductive grease containing a base oil and a thermally conductive filler.

7. The chemical heat storage medium includes a first chemical heat storage medium and a second chemical heat storage medium that are arranged so as to sandwich the flow path member, the thermal conduction layer includes a first thermal conduction layer disposed in a heat transfer portion between the holding member of the first chemical heat storage body and the flow path member, and a second thermal conduction layer disposed in a heat transfer portion between the holding member of the second chemical heat storage body and the flow path member, The mounting member includes a first support member and a second support member having a porous structure that allows a reaction medium that reacts with the chemical thermal storage medium to pass through; a fastening member that fastens the first support member and the second support member, The chemical heat storage reactor according to claim 1 , wherein the first chemical heat storage body and the second chemical heat storage body are disposed between the first support member and the second support member.

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