Semiconductor device testing apparatus and deformation estimate method

Abstract

To provide a semiconductor device testing apparatus that can predict a deformation amount of a contactor when a terminal of a DUT is pressed against the contactor of a contacting device.SOLUTION: A semiconductor device testing apparatus 1 comprises: a holding unit 30 for holding a DUT 100; a probe card 10 having a contactor 12 that contacts a terminal 101 of the DUT 100; a pressing unit 35 provided with a driving part 37 for moving the holding unit 30 in a +Z direction to press the terminal 101 toward the contactor 12 and a lower base 36 for supporting the driving part 37; a support part 40 for supporting the probe card 10 so that the probe card 10 faces the holding unit 30 and being supported by the lower base 36; and an estimation device 60 for estimating an AOD of the contactor 12 in a Z direction based on thrust force T of the driving part 37 in the Z direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device testing apparatus for testing a DUT (Device Under the Test), and a deformation amount estimation method for estimating the deformation amount of a contact when a terminal of the DUT is pressed in the semiconductor device testing apparatus. [Background technology]

[0002] There is known an electronic device testing device that tests the electrical characteristics of electronic circuits built into bare dies (bare chips) after dicing a semiconductor wafer (see, for example, Patent Document 1). This electronic device testing device includes a test head with a probe card and a handler that moves the bare die and presses it against the probe card.

[0003] This handler includes a transfer device that transfers the DUT from the tray onto an alignment unit, and an alignment unit that positions the bare die transferred by the transfer device relative to the probe card and then presses the pads of the bare die against the contactors of the probe card. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-85203 Summary of the Invention [Problem to be solved by the invention]

[0005] In electronic device test equipment such as the one described above, when the pads of the bare die are pressed against the contactors of the probe card, the contactors are deformed. Excessive contactor deformation can damage the contactors and pads, so it is necessary to predict the amount of contactor deformation. However, conventional electronic device test equipment such as the one described above has the problem of being unable to predict the amount of contactor deformation.

[0006] The problem that the present invention aims to solve is to provide a semiconductor device testing apparatus that can predict the amount of deformation of a contactor when a terminal of a DUT is pressed against the contactor of a contact device, and a method for estimating the amount of deformation of the contactor. [Means for solving the problem]

[0007] [1] A first aspect of the present invention is a semiconductor device testing apparatus comprising: a holding device for holding a DUT; a connection device having contacts for contacting terminals of the DUT; a pressing device including a drive unit for moving the holding device in a first direction to press the terminals toward the contacts; and a base unit for supporting the drive unit; a support unit supported on the base unit for supporting the connection device so that the connection device faces the holding device; and an estimation device for estimating a first deformation amount of the contacts in the first direction based on the thrust of the drive unit in the first direction.

[0008] [2] A second aspect of the present invention may be a semiconductor device testing apparatus according to the first aspect, further comprising a drive control device that controls the drive unit so that the drive unit moves the holding device by an instructed movement amount in the first direction, and the estimation device may calculate an estimate of the first deformation amount from the instructed movement amount based on a first elastic deformation amount of the holding device, a second elastic deformation amount of the pressing device, and a third elastic deformation amount of the support portion.

[0009] [3] A third aspect of the present invention may be a semiconductor device testing apparatus according to the second aspect, wherein the estimation device includes a memory unit that stores a first spring constant of the holding device, a second spring constant of the pressing device, and a third spring constant of the support portion, a calculation unit that calculates the first to third elastic deformation amounts based on the first to third spring constants and the thrust, and an estimation unit that calculates the estimated value by subtracting the first to third elastic deformation amounts from the command movement amount.

[0010] [4] A fourth aspect of the present invention may be a semiconductor device testing apparatus according to the third aspect, wherein the memory unit further stores a commanded movement amount associated with the thrust force, and the estimation unit uses the commanded movement amount associated with the thrust force as the commanded movement amount.

[0011] [5] A fifth aspect of the present invention may be a semiconductor device testing apparatus according to the third aspect, wherein the driving unit further includes a first measuring device that measures the thrust of the driving unit, and the calculation unit uses the thrust measured by the first measuring device as the thrust.

[0012] [6] A sixth aspect of the present invention may be a semiconductor device testing apparatus according to the third or fifth aspect, wherein the driving unit further includes a second measuring device that measures the amount of movement of the holding device caused by the driving unit, and the estimation unit uses the amount of movement measured by the second measuring device as the instructed amount of movement.

[0013] [7] A seventh aspect of the present invention may be a semiconductor device testing apparatus according to the third aspect, wherein the drive control device is capable of controlling the drive unit so that the contact is deformed in the first direction by a preset deformation amount when pressed by the drive unit, the memory unit further stores a thrust force associated with the set deformation amount, the calculation unit uses the thrust force associated with the set deformation amount as the thrust, and the estimation unit uses the set deformation amount as the command movement amount.

[0014] [8] Aspect 8 of the present invention may be a semiconductor device testing apparatus according to any one of aspects 1 to 7, wherein the holding device includes a holding section that holds the DUT and adjusts the temperature of the DUT, and an alignment stage that supports the holding section and positions the DUT relative to the connection device.

[0015] [9] A ninth aspect of the present invention may be a semiconductor device testing apparatus according to any one of the first to eighth aspects, wherein the support portion includes a bridge beam to which the connection device is attached, and a pillar member erected on the base portion and supporting the bridge beam.

[0016]

[10] A tenth aspect of the present invention may be a semiconductor device testing apparatus according to any one of the first to ninth aspects, further comprising a determination device that determines whether the estimated value of the first deformation amount calculated by the estimation device is normal or abnormal.

[0017]

[11] Aspect 11 of the present invention may be a semiconductor device testing apparatus according to aspect 10, further comprising a drive control device that controls the drive unit, and when the determination device determines that the estimated value is abnormal, the drive control device controls the drive unit so that the drive unit stops moving the holding device in the first direction.

[0018]

[12] A twelfth aspect of the present invention may be a semiconductor device testing apparatus according to the tenth or eleventh aspect, further comprising an alarm device that notifies the user that the estimated value is abnormal.

[0019]

[13] A thirteenth aspect of the present invention is a semiconductor device testing apparatus according to any one of aspects 1 to 12, further comprising a drive control device that controls the drive unit so that the contact is deformed in the first direction by a preset set deformation amount when pressed by the drive unit, and the estimation device further comprises a recommended value calculation unit that calculates a recommended value of the set deformation amount at which the estimated value of the first deformation amount becomes the optimal value based on an optimal value of the first deformation amount according to the type of the connection device and the thrust force, and the drive control device may be a semiconductor device testing apparatus that controls the drive unit based on the recommended value.

[0020]

[14] Aspect 14 of the present invention may be a semiconductor device testing apparatus according to any one of aspects 1 to 13, wherein the DUT includes an individualized die, and the connection device includes a probe card having contacts that contact the terminals of the die.

[0021]

[15] A fifteenth aspect of the present invention is a deformation amount estimation method for estimating the first deformation amount in a semiconductor device testing apparatus according to any one of aspects 1 to 14, comprising an estimation step of estimating the first deformation amount based on the thrust force.

[0022]

[16] A sixteenth aspect of the present invention may be a deformation amount estimation method according to the fifteenth aspect, wherein the estimation step includes calculating an estimated value of the first deformation amount by subtracting a first elastic deformation amount of the holding device, a second elastic deformation amount of the pressing device, and a third elastic deformation amount of the support part from an instructed movement amount of the holding part in the first direction assumed in accordance with control by the drive control device.

[0023]

[17] A seventeenth aspect of the present invention may be a deformation amount estimation method according to the sixteenth aspect, further comprising an acquisition step of acquiring a first spring constant of the holding device, a second spring constant of the pressing device, and a third spring constant of the support portion, and a calculation step of calculating the first to third elastic deformation amounts based on the first to third spring constants and the thrust force.

[0024]

[18] Aspect 18 of the present invention may be a deformation amount estimation method according to aspect 17, wherein the acquisition step includes moving the holding device from a first position to a second position using the driving unit, acquiring a change in the thrust when the holding device moves from the first position to the second position, acquiring a second deformation amount of the holding device in the first direction when the holding device moves from the first position to the second position, and calculating the first spring constant based on the change in thrust and the second deformation amount.

[0025]

[19] A nineteenth aspect of the present invention may be a deformation estimation method according to the eighteenth aspect, wherein the support portion includes a bridge beam having a dummy board attached thereto and a pillar member erected on the base portion and supporting the bridge beam, and the acquisition step includes holding a load cell in the holding device, moving the holding device to the first position using the driving unit to bring the load cell into contact with the dummy board, acquiring a third deformation amount of the load cell in the first direction when the holding device is located at the second position, and acquiring the second deformation amount by subtracting the third deformation amount from the distance between the first position and the second position.

[0026]

[20] Aspect 20 of the present invention may be a deformation amount estimation method according to aspect 18 or 19, wherein the acquisition step includes acquiring a fourth deformation amount of the support part in the first direction when the drive part moves the holding device from the first position to the second position, and calculating a third spring constant of the support part based on the change in thrust and the fourth deformation amount.

[0027]

[21] A twenty-first aspect of the present invention may be a deformation amount estimation method according to the twenty-first aspect, wherein the acquisition step includes calculating a fifth deformation amount of the pressing device in the first direction by subtracting the distance between the first position and the second position and the fourth deformation amount from a preset deformation amount of the contact, and calculating a second spring constant of the pressing device based on the change in thrust and the fifth deformation amount.

[0028]

[22] Aspect 22 of the present invention may be a deformation amount estimation method according to any one of aspects 15 to 21, further comprising a determination step of determining whether the estimated value of the first deformation amount is normal or abnormal.

[0029]

[23] Aspect 23 of the present invention is a deformation amount estimation method according to aspect 22, which may further include a stop step of stopping the movement of the holding device in the first direction by the drive unit when the estimated value is determined to be abnormal in the determination step.

[0030]

[24] Aspect 24 of the present invention may be a deformation amount estimation method according to aspect 22 or 23, further comprising a notification step of notifying the user that the estimated value is abnormal if the determination step determines that the estimated value is abnormal.

[0031]

[25] Aspect 25 of the present invention may be a deformation amount estimation method according to any one of aspects 15 to 24, further comprising a recommended value calculation step of calculating a recommended value of a set deformation amount at which the estimated value of the first deformation amount becomes the optimal value based on the optimal value of the first deformation amount according to the type of the connection device and the thrust, and a movement step of controlling the drive unit based on the recommended value after the recommended value calculation step. [Effects of the Invention]

[0032] The semiconductor device testing apparatus and deformation estimation method of the present invention can estimate a first deformation amount of a contactor in a first direction based on the thrust force of a driving part in the first direction, and therefore can predict the deformation amount of the contactor when a terminal of a DUT is pressed against the contactor. [Brief explanation of the drawings]

[0033] [Figure 1] FIG. 1 is a cross-sectional view showing a semiconductor device testing apparatus according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view showing a state in which the terminals of the DUT and the contactors of the probe card begin to come into contact with each other in the semiconductor device testing apparatus of FIG. [Figure 3] FIG. 3 is a cross-sectional view showing a state in which the DUT is further elevated from the state shown in FIG. [Figure 4] FIG. 4 is a block diagram illustrating the configuration of a drive unit and its control device in the first embodiment of the present invention. [Figure 5] FIG. 5 is a graph showing the relationship between the amount of elastic deformation and the height, and the thrust force, in the first embodiment of the present invention. [Figure 6] FIG. 6 is a flowchart illustrating the pre-measuring step of the spring constant in the first embodiment of the present invention. [Figure 7] FIG. 7 is a cross-sectional view showing a state in which the holding unit is raised to a first position when the spring constant is measured in advance in the semiconductor device testing apparatus of FIG. [Figure 8]FIG. 8 is a cross-sectional view showing a state in which the holding unit is raised to a second position when the spring constant is measured in advance in the semiconductor device testing apparatus of FIG. [Figure 9] FIG. 9 is a flowchart illustrating the AOD estimation method according to the first embodiment of the present invention. [Figure 10] FIG. 10 is a flowchart illustrating a method for calculating a recommended value of POD in the first embodiment of the present invention. [Figure 11] FIG. 11 is a block diagram illustrating the configuration of a drive unit and its control device in the second embodiment of the present invention. [Figure 12] FIG. 12 is a flowchart illustrating another AOD estimation method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0034] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0035] [First embodiment]

[0036] FIG. 1 is a cross-sectional view showing a semiconductor device testing apparatus 1 according to this embodiment. FIG. 2 is a cross-sectional view showing a state in which a terminal 101 of a DUT 100 and a contactor 12 of a probe card 10 begin to come into contact with each other in the semiconductor device testing apparatus 1 of FIG. 1. That is, FIG. 2 shows the semiconductor device testing apparatus 1 and the DUT 100 when the position of the terminal 101 of the DUT 100 in FIG. 1 has been raised by a distance d shown in FIG. 1. The dashed line in FIG. 2 shows the semiconductor device testing apparatus 1 of FIG. 1. FIG. 3 is a cross-sectional view showing a state in which the DUT 100 has been further raised from the state shown in FIG. 2. The dashed line in FIG. 3 shows the semiconductor device testing apparatus 1 of FIG. 2. FIG. 4 is a block diagram illustrating the configuration of a driving unit 37 and its control device 50 according to this embodiment.

[0037] 1 to 3, the semiconductor device testing apparatus 1 in this embodiment is an apparatus for testing the electrical characteristics of a DUT 100. In this semiconductor device testing apparatus 1, a terminal 101 of the DUT 100 is brought into contact with a contactor 12 of a probe card 10, and then a test of the DUT 100 is performed.

[0038] In this embodiment, the DUT 100 may be, for example, a bare die (bare chip) obtained by dicing a semiconductor wafer, and the semiconductor device testing apparatus 1 tests the electrical characteristics of an electronic circuit built into the bare die. The terminals 101 are, for example, pads.

[0039] Furthermore, although the DUT 100 in this embodiment is a diced bare die, the DUT 100 may be a die formed on a semiconductor wafer before being diced. Furthermore, although this embodiment will be described taking an example in which one die is tested, multiple dies may also be tested simultaneously.

[0040] 1, the semiconductor device testing apparatus 1 includes a probe card 10, a test head 15, and a handler 20. The probe card 10 in this embodiment corresponds to an example of the "connection device" in the present invention.

[0041] The probe card 10 is attached to a bridge beam 41 (described later) of a support portion 40 (described later) of the handler 20, and faces the internal space of the handler 20. The probe card 10 is also electrically connected to a test head 15, and electrically connects the DUT 100 and the test head 15 when testing the DUT 100.

[0042] The probe card 10 includes a substrate 11 and a plurality of contactors 12. The substrate 11 is a printed circuit board, and in this embodiment, the substrate 11 is attached to a bridge beam 41. The plurality of contactors 12 in this embodiment correspond to an example of the "contactor" in the present invention.

[0043] The plurality of contactors 12 are arranged on the underside of the substrate 11 so as to correspond to the positions of the plurality of terminals 101 of the DUT 100. The contactors 12 are needle-shaped members that are elastically deformable in the Z direction in the figure. Specific examples of such contactors 12 include vertical probe needles, pogo pins, cantilever probe needles, bumps on a membrane, and contactors fabricated using MEMS technology.

[0044] The handler 20 includes a holding unit 30, a pressing unit 35, a support unit 40, and a control device 50. The holding unit 30 in this embodiment corresponds to an example of the "holding device" in the present invention, and the pressing unit 35 in this embodiment corresponds to an example of the "pressing device" in the present invention.

[0045] The holding unit 30 holds the DUT 100. The holding unit 30 includes a thermal head 31 and an alignment stage 32. The thermal head 31 holds the DUT 100 and adjusts the temperature of the DUT 100. The thermal head 31 in this embodiment corresponds to an example of the "holding section" in the present invention.

[0046] The method by which the thermal head 31 holds the DUT 100 is not particularly limited, and an example thereof is a method in which the DUT 100 is vacuum-sucked onto the upper surface of the thermal head 31. Furthermore, the method by which the thermal head 31 adjusts the temperature of the DUT 100 is not particularly limited, and an example thereof is a method in which the DUT 100 is heated by a temperature adjustment device such as a heater provided within the thermal head 31. Note that this temperature adjustment device may include, in addition to the heater, a cooling source capable of cooling the heater.

[0047] Although not specifically shown, the handler 20 may also include a transfer device for transferring the DUT 100 onto the thermal head 31. As an example, the handler 20 may include a transfer arm that can pick and place the DUT 100 mounted on a tray using a suction head or the like, and the DUT 100 may be transferred from the tray onto the thermal head 31 by this transfer arm.

[0048] The alignment stage 32 supports the thermal head 31 from below. This alignment stage 32 is a stage that positions the DUT 100 with respect to the probe card 10. Specifically, the alignment stage 32 positions the DUT 100 with respect to the probe card 10 by adjusting the relative position and attitude of the DUT 100 with respect to the probe card 10 so that the terminals 101 of the DUT 100 face the contactors 12 of the probe card 10. Such an alignment stage 32 is not particularly limited, but for example, an XYθ stage or the like can be used.

[0049] The pressing unit 35 moves the holding unit 30 holding the DUT 100 along the Z direction in the figure. The pressing unit 35 includes a lower base 36 and a drive unit 37. The lower base 36 in this embodiment corresponds to an example of the "base unit" in the present invention, and the +Z direction in this embodiment corresponds to an example of the "first direction" in the present invention.

[0050] The lower base supports from below the drive unit 37. The drive unit 37 is erected on the lower base and extends upward (in the +Z direction in the drawing) from the upper surface of the lower base .

[0051] 1 to 3, the driving unit 37 is a device that raises and lowers the holding unit 30 in the Z direction, and presses the DUT 100 against the probe card 10. When testing the DUT 100, the driving unit 37 raises the holding unit 30 in the +Z direction to press the terminals 101 of the DUT 100 toward the contactor 12. After testing the DUT 100 is completed, the driving unit 37 lowers the holding unit 30 in the -Z direction to move the terminals 101 of the DUT 100 away from the contactor 12.

[0052] Although not specifically shown, the drive unit 37 may be capable of driving in the X direction or the Y direction in the drawing. For example, the pressing unit 35 may include a rail or the like laid on the lower base 36, and the drive unit 37 may further include a drive mechanism that allows it to move along the rail.

[0053] 4, the drive unit 37 includes a motor 371, a thrust sensor 372, and a stroke sensor 373. The motor 371 generates power for the drive unit 37 to raise and lower the holding unit 30. The motor 371 receives a drive signal S from a drive control device 55 (described later) of the control device 50. d This drive signal S d Based on this, power for raising and lowering the holding unit 30 is generated.

[0054] The thrust sensor 372 measures the thrust T in the Z direction of the driving unit 37. The thrust sensor 372 also measures the measured thrust T REAL to a first calculation unit 62 (described later) or a second calculation unit 80 (described later) of the control device 50.

[0055] The motor 371 in this embodiment includes a ball screw mechanism (not shown). The thrust sensor 372 measures the thrust T based on the driving torque of the motor 371, the lead of the feed screw of the ball screw mechanism, and the forward efficiency of the feed screw.

[0056] The stroke sensor 373 detects the estimated movement amount (stroke amount) L of the holding unit 30 in the Z direction, which is estimated in accordance with the control by the drive control device 55. z This stroke sensor 373 measures the measured movement amount L z is output to the estimation unit 63 of the control device 50.

[0057] The drive unit 37 measures the amount of movement L z The drive control device 55 controls the holding unit 30 to rise until the displacement (or displacement) of the contactor 12 becomes equal to a POD (Programmed Over Drive). The POD is a preset amount of deformation of the contactor 12, and is set depending on the type of probe card 10, the type of DUT 100, etc.

[0058] This POD is not particularly limited, but is a value determined by a prior measurement or the like. For example, the drive control device 55 controls the drive unit 37 to press the DUT 100 against the contactor 12, thereby measuring in advance the amount of movement by which the terminals 101 of the DUT 100 are pressed against the contactor 12 to an extent that enables testing of the DUT 100. The value of this measured amount of movement can be used as the POD. Note that the POD in this embodiment corresponds to an example of the "set deformation amount" in the present invention.

[0059] However, in reality, this POD does not match the deformation amount of the contactor 12 in the +Z direction when the lifting of the holding unit 30 is completed, as shown in FIG. 3. This deformation amount is also called AOD (Actual Over Drive), the pushing amount, or the overdrive amount. Hereinafter, this deformation amount will be referred to as AOD. Note that the AOD in this embodiment corresponds to an example of the "first deformation amount" in the present invention.

[0060] If only considering the movement amount of the holding unit 30 by the driving unit 37, when the ascent of the holding unit 30 is completed, AOD should be identical to POD (AOD = POD). However, at this time, actually, due to the elastic deformation of the holding unit 30, the pressing unit 35, and the support unit 40, AOD becomes smaller than POD (AOD < POD). Therefore, in the semiconductor device test apparatus 1 in the present embodiment, as will be described later, a control device 50 including an estimation device 60 capable of estimating such AOD is provided.

[0061] Also, regarding the movement amount L measured by the stroke sensor 373 z as shown in FIGS. 1 and 2, from the start of the ascent of the holding unit 30 until the terminal 101 of the DUT 100 starts to contact the contactor 12 of the probe card 10 (-d ≦ L z ≦ 0), the movement amount L z is equal to the actual movement amount L of the holding unit 30 in the +Z direction REAL (L z = L REAL ). In the present embodiment, as a reference for the movement amount L z , the movement amount when the holding unit 30 ascends by a distance d from the initial position is used.

[0062] On the contrary, when the terminal 101 is pressed against the contactor 12, due to the above-described elastic deformation, the movement amount L z is not equal to the movement amount L REAL , and an error is included with respect to the movement amount L REAL . Such a movement amount L z in the present embodiment corresponds to an example of the "assumed movement amount" in the present invention.

[0063] As shown in FIGS. 1 to 3, the support unit 40 supports the probe card 10 so that the probe card 10 faces the holding unit 30, and is supported by the lower base 36. This support unit 40 includes a bridge beam 41 and a column member 42.

[0064] Although not particularly limited, the bridge beam 41 is located inside an opening provided in an upper base (not shown) that forms the ceiling of the support part 40. The probe card 10 is attached to the underside of this bridge beam 41.

[0065] The pillar members 42 are erected on the lower base 36 and support the bridge beam 41. In this embodiment, the pillar members 42 are interposed between the lower base 36 and the bridge beam 41 and are in direct contact with the lower base 36 and the bridge beam 41.

[0066] As shown in Fig. 4, the control device 50 controls the driving of the drive unit 37. The control device 50 is composed of an arithmetic processing device including a CPU, a ROM, a RAM, an input / output interface, etc. The control device 50 includes a drive control device 55, an estimation device 60, a determination device 70, a notification device 75, and a second calculation unit 80.

[0067] As described above, the drive control device 55 outputs the drive signal S d This drive signal S d contains information specifying the torque of the motor 371. The drive control device 55 generates the drive signal S d After receiving the POD, the control unit 37 controls the torque of the motor 371 to instruct the driving unit 37 to lift the holding unit 30 by a distance corresponding to the POD.

[0068] The estimation device 60 estimates the AOD based on the thrust T of the drive unit 37 in the +Z direction. The estimation device 60 includes a storage unit 61, a first calculation unit 62, an estimation unit 63, and a recommended value calculation unit 64. The first calculation unit 62 in this embodiment corresponds to an example of the "calculation unit" in the present invention.

[0069] The storage unit 61 stores a first spring constant k1 of the holding unit 30, a second spring constant k2 of the pressing unit 35, and a third spring constant k3 of the support unit 40. The first to third spring constants k1 to k3 may differ for each handler 20, so it is preferable to acquire the first to third spring constants k1 to k3 in advance for each handler 20 before using the handler 20 to test the DUT 100. A method for acquiring the first to third spring constants k1 to k3 in advance will be described later.

[0070] The storage unit 61 outputs first to third spring constants k1 to k3 to the first calculation unit 62. Based on the first to third spring constants k1 to k3 and the thrust T, the first calculation unit 62 calculates a first elastic deformation amount x1 of the holding unit 30, a second elastic deformation amount x2 of the pressing unit 35, and a third elastic deformation amount x3 of the support part 40, as shown in FIG.

[0071] In this embodiment, the first calculation unit 62 calculates the thrust T as the thrust T measured by the thrust sensor 372 when the terminal 101 presses the contactor 12. REAL Here, when the terminal 101 presses the contactor 12, the travel amount L output from the stroke sensor 373 is used. z is greater than 0 (0 <L z ), at this time, thrust T REAL increases in real time until the holding unit 30 finishes rising.

[0072] The first to third elastic deformation amounts x1 to x3 can be calculated based on Hooke's law using the following equations (1) to (3). Note that since the thrust force T can be expressed as a linear function using the torque of the driving unit 37, the elastic deformation amounts may be calculated using the torque value instead of the thrust force T.

[0073] x1=T REAL / k1… (1) x2=T REAL / k2… (2) x3=T REAL / k3… (3)

[0074] FIG. 5 shows the elastic deformation amount x and the movement amount L z 5 is a graph showing the relationship between the thrust force T and the elastic deformation amount x. The horizontal axis in FIG. 5 represents the thrust force T. The vertical axis on the left side in FIG. 5 represents the elastic deformation amount x, and the vertical axis on the right side represents the movement amount L. z Shows.

[0075] The first straight line (1) shown in FIG. 5 is a proportional line expressed by the above formula (1), the second straight line (2) is a proportional line expressed by the above formula (2), and the third straight line (3) is a proportional line expressed by the above formula (3). The first to third elastic deformation amounts x1 to x3 are calculated by applying the measured value T REAL It should be noted that the magnitude relationship between the first to third lines (1) to (3) is not limited to that shown in Fig. 5. The magnitude relationship between the first to third lines (1) to (3) changes depending on the first to third spring constants k1 to k3.

[0076] As shown in FIG. 4, the first calculation unit 62 outputs the first to third elastic deformation amounts x1 to x3 to the estimation unit 63. The estimation unit 63 calculates the movement amount L as shown in the following equation (4): z (0 <L z The estimated AOD is calculated by subtracting the first to third elastic deformation amounts x1 to x3 from the E Calculate.

[0077] AOD E =L z -x1-x2-x3… (4)

[0078] The above formula (4) has the following physical meaning. That is, as shown in FIG. 3, when the DUT 100 presses the probe card 10, the thermal head 31 and alignment stage 32 of the holding unit 30 are pressed in the -Z direction via the DUT 100, and are deformed so as to be crushed in the Z direction. Therefore, the holding unit 30 is deformed so as to be crushed in the Z direction by a first elastic deformation amount x1. Similarly, the lower base 36 and drive unit 37 of the pressing unit 35 are also deformed so as to be crushed in the Z direction, and the pressing unit 35 is deformed so as to be crushed in the Z direction by a second elastic deformation amount x2.

[0079] Furthermore, the bridge beam 41 and the pillar members 42 of the support part 40 are pushed up in the +Z direction via the probe card 10, so that the bridge beam 41 is deformed so as to bend in the +Z direction, and the pillar members 42 are deformed so as to extend in the +Z direction. As a result, the support part 40 is deformed so as to escape in the +Z direction by the third elastic deformation amount x3.

[0080] Therefore, the AOD is z Since the displacement L at a specific point in time is smaller than the sum of the first to third elastic deformation amounts x1 to x3, by using the above formula (4), z and thrust T REAL Based on the estimated AOD E can be calculated.

[0081] Note that the thickness of the DUT 100 and the substrate 11 are thinner than the components of the handler 20, and therefore the DUT 100 and the substrate 11 hardly undergo elastic deformation. For this reason, in this embodiment, the amount of elastic deformation of the DUT 100 and the substrate 11 is not taken into consideration.

[0082] The recommended value calculation unit 64 calculates the AOD input from the AOD input unit 300. O The recommended POD value is R The recommended value calculation unit 64 is not directly related to the AOD estimation described in this embodiment, and will be described in detail later.

[0083] The estimation unit 63 outputs the estimated AOD to the determination device 70. E The determination device 70 outputs the calculated estimated AOD E Although not particularly limited, the determination device 70 determines whether the estimated AOD is normal or abnormal based on a preset AOD threshold. E If the estimated AOD is smaller than the threshold, it is judged to be normal. E If it is larger, it is determined to be abnormal.

[0084] The determination device 70 estimates the AOD E If it is determined that there is an abnormality, the drive control device 55 sends a stop signal S S The drive control device 55 outputs a stop signal S S After the command is input, the drive control device 55 controls the drive unit 37 so that the drive unit 37 stops moving the holding unit 30 in the +Z direction. Specifically, the drive control device 55 controls the drive unit 37 so that the motor 371 of the drive unit 37 stops.

[0085] The determination device 70 also determines the estimated AOD E If it is determined that there is an abnormality, the alarm device 75 outputs a signal S j This alarm device 75 outputs the estimated AOD E The notification device 75 is, for example, a device that can output light or sound to the outside, and specifically may be a display, a warning light, a speaker, etc. Such a notification device 75 notifies the worker, etc., of the estimated AOD by light or sound. E It is possible to notify that an abnormality has occurred.

[0086] The second calculation unit 80 calculates the above-mentioned first to third spring constants k1 to k3 in advance before the AOD is estimated by the estimation device 60. Then, the second calculation unit 80 outputs the calculated first to third spring constants k1 to k3 to the storage unit 61. Below, a method for measuring the first to third spring constants k1 to k3 in advance using the second calculation unit 80 will be described.

[0087] Fig. 6 is a flowchart illustrating a pre-measurement step of the spring constants k1 to k3 in this embodiment. Fig. 7 is a cross-sectional view showing a state in which the holding unit 30 is raised to a first position P1 when the spring constants k1 to k3 are pre-measured in the semiconductor device testing apparatus 1 of Fig. 1, and Fig. 8 is a cross-sectional view showing a state in which the holding unit 30 is raised to a second position P2 when the spring constants k1 to k3 are pre-measured in the semiconductor device testing apparatus 1 of Fig. 1. The dashed lines in Fig. 8 indicate the semiconductor device testing apparatus 1, load cell 400, first measuring apparatus 500, second measuring apparatus 600, and dummy board 700 in Fig. 7. The pre-measurement step shown in Fig. 6 corresponds to an example of the "acquisition step" in the present invention.

[0088] In the preliminary measurement step in this embodiment, as shown in FIG. 7, the load cell 400, the first measuring device 500, the second measuring device 600, and the dummy board 700 are used to calculate the spring constants k1 to k3.

[0089] 4, the load cell 400 measures the thrust (load) in the Z direction applied to the load cell 400 and outputs it to the second calculation unit 80. In this pre-measurement step, the probe card 10 is not attached to the bridge beam 41, and the third deformation amount ΔD3 of the load cell 400 can be regarded as the AOD of the contactor 12 of the probe card 10.

[0090] As shown in Fig. 7, the first measuring device 500 is attached to the holding unit 30. The first measuring device 500 measures the distance from the first measuring device 500 to the dummy board 700. As shown in Fig. 4, the first measuring device 500 outputs the measured distances H1 and H2 (described later) to the second calculation unit 80. Although not particularly limited, a laser displacement meter or the like can be used as the first measuring device 500.

[0091] 7, the second measuring device 600 measures the distance from the second measuring device 600 to the upper surface of the support part 40. The second measuring device 600 includes a gate-shaped frame 601 provided outside the handler 20, and a laser displacement meter 602 attached to the gate-shaped frame 601 so as to face the upper surface of the bridge beam 41. As shown in FIG. 4, the laser displacement meter 602 outputs the measured distances H3 and H4 (described later) to the second calculation unit 80.

[0092] 7, the dummy board 700 is a printed circuit board. As described above, in this pre-measurement step, the probe card 10 is not attached to the bridge beam 41, and the dummy board 700 is attached to the bridge beam 41 instead of the substrate 11 of the probe card 10. The dummy board 700 is provided to make the pressure applied to the bridge beam 41 via the load cell 400 similar to the pressure applied to the bridge beam 41 via the substrate 11 of the probe card 10. This makes it possible to reproduce the deformation of the bridge beam 41 when the probe card 10 is attached in the pre-measurement step.

[0093] In the preliminary measurement process, first, as shown in FIG. 6, in step S101, the load cell 400 is held on the upper surface of the holding unit 30. Next, in step S102, the driving unit 37 raises the holding unit 30 to a first position P1, thereby bringing the load cell 400 into contact with the dummy board 700, as shown in FIG. 7. In this embodiment, the first position P1 is set by the above-mentioned movement amount L z is set to a position where the load cell 400 is 0. However, the first position P1 is not particularly limited, and may be any position where the load cell 400 can be brought into contact with the dummy board 700.

[0094] In step S102 in this embodiment, the distance H measured by the first measuring device 500 is H1 (H=H1). In addition, in this step S102, deformation of the load cell 400, deformation of the holding unit 30, deformation of the pressing unit 35, and elastic deformation of the support part 40 do not occur.

[0095] Next, in step S103 shown in FIG. 6, the drive unit 37 raises the holding unit 30 from the first position P1 to the second position P2, as shown in FIG. 7. At this time, the distance H measured by the first measuring device 500 is H2, which is shorter than H1 (H=H2 d This is the position after the drive unit 37 drives the holding unit 30 to rise by the set deformation amount POD according to the above. There are no particular limitations on the second position P2, and it may be any position higher than the first position P1.

[0096] 6, the change amount ΔT in the thrust T is acquired. As shown in FIG. 4, the second calculation unit 80 can calculate the change amount ΔT from the output of the load cell 400. Note that ΔT may also be calculated based on the change amount in the measurement value of the thrust sensor 372 of the drive unit 37.

[0097] Figure 5 shows the movement amount L obtained in this preliminary measurement process. z In step S102, the thrust T output by the load cell 400 is 0. Then, in step S103, the drive control device 55 controls the holding unit 30 to move by the amount L ZP In this embodiment, the drive unit 37 is controlled so that the thrust force T p is the amount of change ΔT (ΔT=T P ).

[0098] 6, a third deformation amount ΔD3 in the Z direction of the load cell 400 is acquired. In this embodiment, the spring constant k4 of the load cell 400 is a known value, and this spring constant k4 is stored in the memory unit 61. The second calculation unit 80 calculates the third deformation amount ΔD3 of the load cell 400 based on Hooke's law using the known spring constant k4 acquired from the memory unit 61 and the amount of change ΔT.

[0099] ​6, the second deformation amount ΔD2 of the holding unit 30 is obtained. As shown in FIG. 8, the second deformation amount ΔD2 can be obtained by subtracting the third deformation amount ΔD3 of the load cell 400 from the distance ΔH between the first position P1 and the second position P2.

[0100] The second calculation unit 80 in this embodiment first calculates a distance ΔH between the first position P1 and the second position P2 (ΔH=H1−H2) by subtracting H2 obtained from the first measuring device 500 in step S103 from the height H1 obtained from the first measuring device 500 in step S102. Then, the second calculation unit 80 calculates a second deformation amount ΔD2 of the holding unit 30 by subtracting a third deformation amount ΔD3 from this distance ΔH (ΔD2=ΔH−ΔD3).

[0101] Next, in step S107 shown in FIG. 6, the first spring constant k1 of the holding unit 30 is calculated based on the amount of change ΔT in thrust and the second amount of deformation ΔD2.

[0102] 6, a fourth deformation amount ΔD4 of the support portion 40 is obtained. The fourth deformation amount ΔD4 of the support portion 40 is the sum of the deflection amount of the bridge beam 41 in the +Z direction and the extension amount of the pillar member 42 in the +Z direction, and as shown in FIG. 8, the fourth deformation amount ΔD4 can be calculated from the measurement value of the laser displacement meter 602.

[0103] In this embodiment, the second calculation unit 80 calculates the fourth deformation amount ΔD4 by subtracting the distance H4 output by the laser displacement meter 602 in step S103 from the distance H3 output by the laser displacement meter 602 in step S102 (ΔD4 = H3 - H4).

[0104] Next, in step S109 shown in FIG. 6, a third spring constant k3 of the support portion 40 is calculated based on the amount of change ΔT in thrust and the fourth amount of deformation ΔD4.

[0105] 6, the second calculation unit 80 acquires a fifth deformation amount ΔD5 of the pressing unit 35. The fifth deformation amount ΔD5 is calculated by multiplying the movement amount L ZP It can be calculated by subtracting the distance ΔH and the fourth deformation amount ΔD4 from ZP Here, the distance ΔH is the sum of the second change amount ΔD2 and the third change amount ΔD3, so the fifth deformation amount ΔD5 is the movement amount L ZP The calculation is performed by subtracting the sum of the third elastic deformation amount ΔD3 of the load cell 400, the second elastic deformation amount ΔD2 of the holding unit 30, and the fourth elastic deformation amount ΔD4 of the support portion 40 in step S103 from the above (ΔD5=L ZP -ΔD2-ΔD3-ΔD4).

[0106] 6, the second calculation unit 80 calculates the second spring constant k2 of the pressing unit 35 based on the change in thrust ΔT and the fifth deformation amount ΔD5. If the driving unit 37 is equipped with a drive belt that transmits power from the motor 371, the second spring constant k2 also takes into account the elongation of the drive belt.

[0107] In this manner, the first to third spring constants k1 to k3 can be calculated by the second calculation unit 80. The second calculation unit 80 outputs the first to third spring constants k1 to k3 calculated in this manner to the storage unit 61, and the storage unit 61 stores the first to third spring constants k1 to k3.

[0108] Next, a description will be given of an AOD estimation method using the above-described semiconductor device testing apparatus 1. This AOD estimation method corresponds to an example of the "deformation amount estimation method" in the present invention.

[0109] 9 is a flowchart illustrating the AOD estimation method according to this embodiment. This AOD estimation method is executed after the alignment stage 32 has completed positioning of the DUT 100.

[0110] First, in step S201 in FIG. 9, the drive control device 55 calculates the movement amount L z Next, in step S202, as shown in FIGS. 2 to 4, the thrust sensor 372 detects the thrust T REAL While measuring the amount of movement L z As shown in Figure 4, the measured thrust T REAL and the amount of movement L z is output from the first calculation unit 62 of the estimation device 60.

[0111] Next, as shown in FIG. 9, in step S203, the first calculation unit 62 calculates the measured thrust T REAL and the first to third spring constants k1 to k3, the first to third elastic deformation amounts x1 to x3 are calculated. This step S203 corresponds to an example of the "calculation step" in the present invention.

[0112] Next, in step S204, the estimation unit 63 calculates the movement amount L based on the above equation (4). z and the estimated AOD from the first to third elastic deformation amounts x1 to x3. E This step S203 corresponds to an example of the "estimation step" in the present invention.

[0113] Next, in step S205, the estimated AOD calculated by the determination device 70 is E It is determined whether the signal is normal or abnormal.

[0114] In step S205, the determination device 70 determines the estimated AOD E If it is determined that the movement amount L obtained by the stroke sensor 373 is normal, in step S206, the drive control device 55 z Determine whether or not the POD has been reached.

[0115] In step S206, the movement amount L zIf it is determined that the moving amount L has reached the POD, then in step S207, the drive control device 55 controls the drive unit 37 to complete the lifting of the holding unit 30. On the other hand, in step S206, z If it is determined that the holding unit 30 has not reached the POD, the drive control device 55 controls the drive section 37 to continue raising the holding unit 30.

[0116] In step S205, the estimated AOD E If it is determined that the estimated value AOD is abnormal, in step S208, the drive control device 55 controls the drive unit 37 to stop raising the holding unit 30. At the same time, the notification device 75 notifies the operator of the estimated value AOD E is abnormal.

[0117] In the semiconductor device testing apparatus 1 and the AOD estimation method according to the present embodiment, the thrust T acquired from the thrust sensor 372 REAL Based on this, the AOD of the holding unit 30 during its ascent can be estimated.

[0118] Furthermore, with the semiconductor device testing apparatus 1 and the AOD estimation method according to this embodiment, the AOD can be constantly monitored when the terminal 101 is pressed against the contactor 12, making it possible to determine whether the AOD at that time is normal or abnormal. This makes it possible to prevent the AOD from becoming excessive when the terminal 101 is pressed against the contactor 12, thereby reducing damage to the terminal 101 and the contactor 12. This allows the lifespan of the terminal 101 and the contactor 12 to be extended.

[0119] Furthermore, with the semiconductor device testing apparatus 1 and the AOD estimation method according to this embodiment, it is possible to estimate a desired AOD. D Recommended POD value corresponding to POD R The desired AOD can also be calculated. D This is, for example, the optimum value of AOD set according to the type of probe card 10.

[0120] FIG. 10 shows the recommended POD value POD in this embodiment. R 10 is a flowchart illustrating a method for calculating a desired AOD. D Enter the AOD D As with the POD described above, the AOD input unit 300 may be a value set in a test program stored in the semiconductor device testing apparatus 1, or may be a value input by an operator to the semiconductor device testing apparatus 1 before executing a test on the DUT 100. The AOD input unit 300 is not particularly limited, and may be a storage medium that stores a test program, or may be a user interface.

[0121] Next, in step 302, the AOD input unit 300 inputs the desired AOD to the recommended value calculation unit 64. D The recommended value calculation unit 64 inputs the AOD D Specifically, in this case, the storage unit 61 shown in FIG. 4 stores a table showing the relationship between the POD and the thrust T in addition to the first to third spring constants k1 to k3. For example, in the equation of the fourth straight line (4) shown in FIG. 5, the movement amount L Z By regarding this as a POD, a table containing the POD and the thrust T associated with this POD can be obtained.

[0122] Then, the recommended value calculation unit 64 substitutes the combinations of the PODs included in this table and the thrust forces T associated with those PODs, in addition to the first to third spring constants k1 to k3 described above, into the following equation (5) to calculate multiple AODs corresponding to those combinations.

[0123] AOD=POD-T / k1-T / k2-T / k3… (5)

[0124] Then, the recommended value calculation unit 64 selects the AOD from the plurality of AODs calculated by the above formula (5). D Select the POD value used when calculating the AOD value closest to the value.

[0125] Next, in step S303, the recommended value calculation unit 64 calculates the selected POD as the recommended value POD R to the drive control device 55.

[0126] Next, in step S304, the drive control device 55 calculates the recommended value POD R The drive unit 37 is controlled so as to raise the holding unit 30 by the amount of the arrow A.

[0127] With the semiconductor device testing apparatus 1 and the AOD estimation method according to the present embodiment as described above, it is possible to estimate a desired AOD. D Recommended POD value corresponding to R Therefore, the AOD value can be increased by the desired AOD. D Therefore, the terminal 101 can be pressed against the contactor 12 so as to obtain an AOD suitable for the type of probe card, thereby reducing damage to the terminal 101 and the contactor 12. Therefore, the life of the terminal 101 and the contactor 12 can be extended.

[0128] [Second embodiment]

[0129] 11 is a block diagram illustrating the configuration of a drive unit 37 and its control device 50 in the second embodiment. The drive unit 37 in the second embodiment does not have a thrust sensor 372 or a stroke sensor 373. That is, the second embodiment differs from the first embodiment in that the AOD value is estimated without using the measurement results of the sensors, but the other configurations are the same. Below, only the differences between the first embodiment and the second embodiment in terms of AOD estimation will be described, and parts that are the same as those in the first embodiment will be assigned the same reference numerals and will not be described again.

[0130] As shown in FIG. 11, in this embodiment, the drive control device 55 outputs a drive signal S dto the motor 371. More specifically, the drive control device 55 supplies a current to the motor 371 such that the motor 371 generates a predetermined torque TQ. The drive control device 55 also outputs a signal including information about the torque TQ to the storage unit 61.

[0131] The storage unit 61 in this embodiment stores a table showing the relationship between the torque TQ and the thrust T, and acquires the thrust T corresponding to the torque TQ from the table. Although not particularly limited, the relationship between the torque TQ and the thrust T can be acquired based on the torque of the motor 371 and the thrust detected by the load cell 400 when the preliminary measurement step (see FIG. 6) is performed.

[0132] Furthermore, similarly to the first embodiment, the storage unit 61 stores the instructed movement amount L in addition to the above-mentioned first to third spring constants k1 to k3. ZI The storage unit 61 also stores a table showing the relationship between the input torque TQ and the thrust T. The storage unit 61 stores the command movement amount L associated with the thrust T based on the thrust T corresponding to the input torque TQ and the equation of the fourth line (4) shown in FIG. ZI Then, the storage unit 61 acquires a thrust T corresponding to the torque TQ and an instructed movement amount L corresponding to the thrust T. ZI and the above-mentioned first to third spring constants k1 to k3 are output to the first calculation unit 62. As described above,

[0133] As in the first embodiment, the first calculation unit 62 calculates the first to third elastic deformation amounts x1 to x3 based on the first to third spring constants k1 to k3 and the thrust T. Then, the first calculation unit 62 calculates the instructed movement amount L ZI and the first to third elastic deformation amounts x1 to x3 are output to the estimation unit 63. Note that, as described above, the thrust force T can be expressed as a linear function using the torque of the motor 371 of the drive unit 37, and therefore the elastic deformation amounts may be calculated using the value of the torque TQ instead of the thrust force T.

[0134] The estimation unit 63 calculates the movement amount L as shown in the following equation (6). ziThe estimated value of AOD is calculated by subtracting the first to third elastic deformation amounts x1 to x3 from E Calculate.

[0135] AOD E =L zi -x1-x2-x3… (6)

[0136] As described above, with the semiconductor device testing apparatus 1 and the AOD estimation method according to the second embodiment, the AOD during the ascent of the holding unit 30 can be estimated based on the torque TQ of the motor 371.

[0137] It should be noted that the above-described embodiments have been described to facilitate understanding of the present invention, and are not intended to limit the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0138] For example, the AOD estimation methods described in the first and second embodiments are methods for estimating the AOD in real time when the DUT 100 is pressed. However, before the DUT 100 is pressed, it is possible to estimate the AOD in real time. D The AOD may be estimated based on the above.

[0139] 12 is a flowchart illustrating another AOD estimation method according to this embodiment. This AOD estimation method is executed before the holding unit 30 starts to rise.

[0140] As shown in FIG. 12, first, in step S401, a desired POD is stored in the storage unit 61. D Although not shown in the figure, the desired POD D can be input to the storage unit 61 by the POD input unit 200.

[0141] Next, in step S402, the storage unit 61 stores the desired POD D Thrust T corresponding to D Get the desired POD D Thrust T corresponding to Dis the amount of movement L z POD D This is an estimate of the thrust obtained when the thrust T D can be obtained from the fourth straight line (4) shown in FIG. 5, and specifically, the movement amount L Z The value of POD D The thrust force when

[0142] Next, in step S403, the first calculation unit 62 calculates the thrust T D and the first to third spring constants k1 to k3, the first to third elastic deformation amounts x D1 ~x D3 At this time, the first calculation unit 62 may use the above formulas (1) to (3).

[0143] Next, in step S404, the estimation unit 63 D and the first to third elastic deformation amounts x D1 ~x D3 Based on the following equation (7), the estimated AOD E Calculate.

[0144] AOD E =POD D -x D1 -x D2 -x D3 … (7)

[0145] Next, in step S405, the estimated AOD calculated by the determination device 70 is E It is determined whether the signal is normal or abnormal.

[0146] In step S405, the determination device 70 determines the estimated AOD E If it is determined that the holding unit 30 is normal, the drive control device 55 moves the holding unit 30 to the POD in step S406. D Then, the control of the drive unit 37 is started so as to raise the height by the specified amount.

[0147] On the other hand, in step S405, the determination device 70 determines the estimated AODE If it is determined that the estimated value AOD is abnormal, in step S407, the drive control device 55 controls the drive unit 37 to stop the start of raising the holding unit 30. At the same time, the notification device 75 notifies the operator of the estimated value AOD E is abnormal.

[0148] As described above, the semiconductor device testing apparatus 1 and AOD estimation method in this embodiment can estimate the AOD when the holding unit 30 has completed lifting before the terminal 101 of the DUT 100 comes into contact with the contactor 12.

[0149] Furthermore, with this semiconductor device testing apparatus 1 and AOD estimation method, if the estimated AOD is abnormal, the POD D By correcting this, it is possible to prevent the AOD from becoming excessive, and therefore the life of the terminal 101 and the contactor 12 can be extended. [Explanation of symbols]

[0150] 1...Semiconductor device testing equipment 10...Probe card 11... Circuit board 12...Contactor 15...Test head 20...Handler 30...Holding unit 31...Thermal head 311…Holding surface 32...Alignment stage 35...Pressing unit 36...Lower base 37...Drive unit 371...Motor 372...Thrust sensor 373...Stroke sensor 40...Support part 41...Bridge beam 42...Column member 50...Control device 55...Drive control device 60…Estimation device 61...Storage section 62...first calculation unit 63…Estimation part 64...Recommended value calculation section 70...Judgment device 75...Alarm device 80...second calculation unit 100...DUT 101...Terminal 200...POD input section 300...AOD input section 400...load cell 500...First measuring device 600...Second measuring device 601...Gate frame 602...Laser displacement meter 700...Dummy board

Claims

1. a holding device for holding the DUT; a connection device having contacts for contacting terminals of the DUT; a pressing device including a drive unit that moves the holding device in a first direction to press the terminal toward the contact, and a base unit that supports the drive unit; a support portion supported by the base portion and supporting the connection device so that the connection device faces the holding device; an estimation unit that estimates a first deformation amount of the contactor in the first direction based on a thrust force of the driving unit in the first direction.

2. 2. The semiconductor device testing apparatus according to claim 1, the semiconductor device testing apparatus further includes a drive control device that controls the drive unit so that the drive unit moves the holding device by a specified movement amount in the first direction; The estimation device calculates an estimated value of the first deformation amount from the commanded movement amount based on a first elastic deformation amount of the holding device, a second elastic deformation amount of the pressing device, and a third elastic deformation amount of the support portion.

3. 3. The semiconductor device testing apparatus according to claim 2, The estimation device includes: a storage unit that stores a first spring constant of the holding device, a second spring constant of the pressing device, and a third spring constant of the support portion; a calculation unit that calculates the first to third elastic deformation amounts based on the first to third spring constants and the thrust; an estimation unit that calculates the estimated value based on the instructed movement amount and the first to third elastic deformation amounts.

4. 4. The semiconductor device testing apparatus according to claim 3, the storage unit further stores the instructed movement amount associated with the thrust, The semiconductor device testing apparatus, wherein the estimation unit uses the instructed movement amount associated with the thrust force as the instructed movement amount.

5. 2. The semiconductor device testing apparatus according to claim 1, The semiconductor device testing apparatus further includes a determining device that determines whether the estimated value of the first deformation amount calculated by the estimating device is normal or abnormal.

6. 6. The semiconductor device testing apparatus according to claim 5, the semiconductor device testing apparatus further includes a drive control device that controls the drive unit; A semiconductor device testing apparatus, wherein when the determination device determines that the estimated value is abnormal, the drive control device controls the drive unit so that the drive unit stops moving the holding device in the first direction.

7. 6. The semiconductor device testing apparatus according to claim 5, The semiconductor device testing apparatus further includes a notification device that notifies that the estimated value is abnormal.

8. 2. The semiconductor device testing apparatus according to claim 1, the semiconductor device testing apparatus further includes a drive control device that controls the drive unit so that the contact is deformed in the first direction by a preset deformation amount when pressed by the drive unit; the estimation device further includes a recommended value calculation unit that calculates a recommended value of the set deformation amount at which the estimated value of the first deformation amount becomes the optimal value, based on the optimal value of the first deformation amount according to the type of the connection device and the thrust; The drive control device controls the drive unit based on the recommended value.

9. 2. The semiconductor device testing apparatus according to claim 1, the DUT includes a singulated die; The connection device is a semiconductor device testing device that includes a probe card having the contacts that come into contact with the terminals of the die.

10. A deformation amount estimation method for estimating the first deformation amount in the semiconductor device testing apparatus according to any one of claims 1 to 9, comprising: A deformation amount estimation method comprising: an estimation step of estimating the first deformation amount based on the thrust.

11. The deformation amount estimation method according to claim 10, The estimation step is a deformation amount estimation method that includes calculating an estimated value of the first deformation amount based on an instructed movement amount of the holding device in the first direction instructed by a drive control device, a first elastic deformation amount of the holding device, a second elastic deformation amount of the pressing device, and a third elastic deformation amount of the support portion.

12. The deformation amount estimation method according to claim 11, The deformation amount estimation method includes an acquisition step of acquiring a first spring constant of the holding device, a second spring constant of the pressing device, and a third spring constant of the support portion; The displacement amount estimation method further includes a calculation step of calculating the first to third elastic deformation amounts based on the first to third spring constants and the thrust force.

13. The displacement estimation method according to claim 12, The obtaining step includes: moving the holding device from a first position to a second position by the drive unit; acquiring a change in the thrust when the holding device moves from the first position to the second position; obtaining a second deformation amount of the holding device in the first direction when the holding device moves from the first position to the second position; calculating the first spring constant based on the change in the thrust and the second deformation amount.

14. The deformation estimation method according to claim 13, The support portion is A bridge beam with a dummy board attached; a pillar member erected on the base portion and supporting the bridge beam, The obtaining step includes: holding the load cell in the holding device; moving the holding device to the first position by the drive unit to bring the load cell into contact with the dummy board; acquiring a third deformation amount of the load cell in the first direction when the holding device is located at the second position; and obtaining the second deformation amount by subtracting the third deformation amount from the distance between the first position and the second position.

15. The deformation estimation method according to claim 13, The obtaining step includes: acquiring a fourth deformation amount of the support portion in the first direction when the drive portion moves the holding device from the first position to the second position; calculating a third spring constant of the support portion based on the change in thrust and the fourth deformation amount.

16. The deformation estimation method according to claim 15, The obtaining step includes: calculating a fifth deformation amount of the pressing device in the first direction by subtracting the distance between the first position and the second position and the fourth deformation amount from a preset set deformation amount of the contact; calculating a second spring constant of the pressing device based on the change in thrust and the fifth deformation amount.

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