High-frequency module and communication apparatus

Abstract

To achieve both a low profile and miniaturization.SOLUTION: In a high-frequency module 100, an external shield layer 2 has a first shield portion 21 and a second shield portion 22. The first shield portion 21 is separated from a main surface 101 of a mounting substrate 1 in a thickness direction D1 of the mounting substrate 1. The second shield portion 22 is connected to the first shield portion 21 and covers at least a part of an outer peripheral surface 103 of the mounting substrate 1. A power amplifier 3 has a first main surface 31 and a second main surface 32. The power amplifier 3 is separated from the main surface 101 of the mounting substrate 1 in the thickness direction D1 of the mounting substrate 1, and the second main surface 32 is in contact with the first shield portion 21. A plurality of conductor members 4 connect the power amplifier 3 and the mounting substrate 1. The plurality of conductor members 4 have lengths greater than a thickness H3 of the power amplifier 3 and are separated from each other.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention generally relates to a high frequency module and a communication device, and more particularly to a high frequency module including a power amplifier and a communication device including the high frequency module. [Background technology]

[0002] Patent Document 1 discloses a high-frequency module including a mounting substrate, a power amplifier, a controller, a shielding layer, and bonding wires. The mounting substrate has a first main surface and a second main surface facing each other. The power amplifier is mounted on the first main surface of the mounting substrate. The controller is disposed on the power amplifier. The high-frequency module disclosed in Patent Document 1 also includes bonding wires connecting external electrodes of the controller to the mounting substrate.

[0003] Furthermore, in the high-frequency module disclosed in Patent Document 1, the mounting board has a heat dissipation conductor formed along the thickness direction of the mounting board in an area that overlaps the power amplifier in the thickness direction of the mounting board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2022 / 138514 Summary of the Invention [Problem to be solved by the invention]

[0005] In the high-frequency module disclosed in Patent Document 1, it may be difficult to achieve both a low profile and a small size of the high-frequency module.

[0006] An object of the present invention is to provide a high-frequency module and a communication device that can achieve both a low profile and a small size. [Means for solving the problem]

[0007] A high-frequency module according to one aspect of the present invention comprises a mounting substrate, an external shield layer, a power amplifier, and multiple conductor members. The mounting substrate has a main surface. The external shield layer has a first shield portion and a second shield portion. The first shield portion is spaced apart from the main surface of the mounting substrate in the thickness direction of the mounting substrate. The second shield portion is connected to the first shield portion and covers at least a portion of the outer periphery of the mounting substrate. The power amplifier has a first main surface and a second main surface. The power amplifier is spaced apart from the main surface of the mounting substrate in the thickness direction of the mounting substrate, and the second main surface is in contact with the first shield portion. The multiple conductor members connect the power amplifier to the mounting substrate. The multiple conductor members have lengths greater than the thickness of the power amplifier and are spaced apart from each other.

[0008] A communication device according to one aspect of the present invention includes the high-frequency module according to the above aspect and a signal processing circuit, wherein the signal processing circuit is connected to the high-frequency module. [Effects of the Invention]

[0009] The high-frequency module and communication device according to the above aspects of the present invention can achieve both a low profile and a small size. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional view of the high-frequency module according to the first embodiment. [Figure 2] 2A to 2D are cross-sectional views illustrating steps in a method for manufacturing the high-frequency module. [Figure 3] 3A to 3D are cross-sectional views illustrating steps in a method for manufacturing the high-frequency module. [Figure 4] FIG. 4 is a circuit block diagram of a communication device including the high-frequency module. [Figure 5]FIG. 5 is a cross-sectional view of the high-frequency module according to the second embodiment. [Figure 6] FIG. 6 is a cross-sectional view of the high-frequency module according to the third embodiment. [Figure 7] FIG. 7 is a cross-sectional view of the high-frequency module according to the fourth embodiment. [Figure 8] FIG. 8 is a cross-sectional view of the high-frequency module according to the fifth embodiment. [Figure 9] FIG. 9 is a cross-sectional view of the high-frequency module according to the sixth embodiment. [Figure 10] FIG. 10 is a plan view of a main part of the high-frequency module according to the seventh embodiment. [Figure 11] 11 is a cross-sectional view of the high-frequency module taken along line XI-XI of FIG. [Figure 12] FIG. 12 is a cross-sectional view of a main part of a high-frequency module according to the eighth embodiment. [Figure 13] FIG. 13 is a cross-sectional view of the high-frequency module according to the ninth embodiment. [Figure 14] FIG. 14 is a cross-sectional view of the high-frequency module according to the tenth embodiment. [Figure 15] 15A to 15D are cross-sectional views illustrating steps in a method for manufacturing the high-frequency module. [Figure 16] 16A to 16D are cross-sectional views illustrating steps in a method for manufacturing the high-frequency module. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments 1 to 10 will be described with reference to the drawings. The drawings referred to in the following embodiments 1 to 10 are schematic diagrams, and the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensions, and the size ratios and thickness ratios between the components do not necessarily reflect the actual dimensional ratios.

[0012] (Embodiment 1) (1) High-frequency module A high-frequency module 100 according to the first embodiment will be described with reference to FIGS.

[0013] As shown in FIG. 1 , the high-frequency module 100 according to the first embodiment includes a mounting substrate 1, an external shield layer 2, a power amplifier 3, and a plurality of conductor members 4 (hereinafter also referred to as a plurality of first conductor members 4). The mounting substrate 1 has a main surface 101 (hereinafter also referred to as a first main surface 101). The external shield layer 2 has a first shield section 21 and a second shield section 22. The first shield section 21 is separated from the main surface 101 of the mounting substrate 1 in a thickness direction D1 of the mounting substrate 1. The second shield section 22 is connected to the first shield section 21 and covers at least a portion of an outer peripheral surface 103 of the mounting substrate 1. The power amplifier 3 is a power amplification IC die. The power amplifier 3 has a first main surface 31 and a second main surface 32. The power amplifier 3 is separated from the main surface 101 of the mounting substrate 1 in the thickness direction D1 of the mounting substrate 1, and the second main surface 32 is in contact with the first shield section 21. The plurality of conductor members 4 connect the power amplifier 3 and the mounting board 1. The plurality of conductor members 4 have a length greater than the thickness of the power amplifier 3 and are spaced apart from one another.

[0014] 1, the high-frequency module 100 further includes an electronic component 5 (hereinafter also referred to as a first electronic component 5). The first electronic component 5 is disposed on the main surface 101 of the mounting board 1. The first electronic component 5 is located between the mounting board 1 and the power amplifier 3 in the thickness direction D1 of the mounting board 1. The power amplifier 3 is spaced apart from the first electronic component 5 in the thickness direction D1 of the mounting board 1. In this embodiment, the first electronic component 5 is, for example, a matching element (hereinafter also referred to as a first matching element) included in the output matching circuit 14 (see FIG. 4) for matching the impedance between the power amplifier 3 and the transmit filter 151. The first matching element is, for example, an inductor.

[0015] The high-frequency module 100 further includes a controller 11 and a plurality of second conductor members 12. The controller 11 is an IC die including a control circuit that controls the power amplifier 3. The controller 11 has a third main surface 111 and a fourth main surface 112 that face each other. The controller 11 is spaced apart from the main surface 101 of the mounting board 1 in the thickness direction D1 of the mounting board 1, and the fourth main surface 112 is in contact with the first shield section 21. The controller 11 is spaced apart from the main surface 101 of the mounting board 1 in the thickness direction D1 of the mounting board 1, and the fourth main surface 112 is in contact with the first shield section 21. The controller 11 controls the power amplifier 3.

[0016] The high-frequency module 100 further includes a second electronic component 13. The second electronic component 13 is disposed on the main surface 101 of the mounting board 1. The second electronic component 13 is located between the mounting board 1 and the controller 11 in the thickness direction D1 of the mounting board 1. The controller 11 is spaced apart from the second electronic component 13 in the thickness direction D1 of the mounting board 1. In this embodiment, the second electronic component 13 is, for example, a second matching element included in the output matching circuit 14 (see FIG. 4). The second matching element is, for example, a capacitor.

[0017] The high-frequency module 100 further includes a resin layer 8. The resin layer 8 is disposed on the main surface 101 of the mounting substrate 1.

[0018] The high-frequency module 100 further includes a plurality of external connection terminals T0 arranged on a second main surface 102 that faces the first main surface 101, which is the main surface 101 in the thickness direction D1 of the mounting substrate 1.

[0019] The high-frequency module 100 according to the first embodiment is used in a communication device 300, for example, as shown in FIG. 4. The communication device 300 is, for example, a mobile phone (for example, a smartphone), but is not limited thereto and may be, for example, a wearable terminal (for example, a smart watch). The high-frequency module 100 is a module that is compatible with, for example, the 4G (fourth generation mobile communication) standard, the 5G (fifth generation mobile communication) standard, etc. The 4G standard is, for example, the 3GPP (Third Generation Partnership Project, registered trademark) LTE (Long Term Evolution, registered trademark) standard. The 5G standard is, for example, the 5G NR (New Radio) standard. The high-frequency module 100 is a module that is compatible with, for example, carrier aggregation and dual connectivity. 4, the high-frequency module 100 includes a high-frequency circuit including a power amplifier 3, a controller 11, a duplexer 15, an output matching circuit 14, a transformer 7, a low-noise amplifier 16, an input matching circuit 17, a matching circuit 18, a first power supply circuit 191, a first capacitor C1, a second power supply circuit 192, and a second capacitor C2. The duplexer 15 includes a transmit filter 151 and a receive filter 152. The circuit configuration of the high-frequency circuit included in the high-frequency module 100 is not limited to the example shown in FIG.

[0020] (1.1) Mounting board 1, the mounting substrate 1 has a first main surface 101 and a second main surface 102 that face each other in a thickness direction D1 of the mounting substrate 1. When viewed from above in the thickness direction D1 of the mounting substrate 1, the outer edge of the mounting substrate 1 is, for example, rectangular, but may have a shape other than rectangular.

[0021] The mounting substrate 1 is, for example, a multilayer substrate in which multiple dielectric layers and multiple conductive layers (not shown) are stacked. The multiple conductive layers are formed in a predetermined pattern defined for each layer. Each of the multiple conductive layers includes one or multiple conductor portions in a plane perpendicular to the thickness direction D1 of the mounting substrate 1. The material of each conductive layer is, for example, copper. The multiple conductive layers include a ground layer. The ground layer of the mounting substrate is electrically connected to at least one ground terminal included in the multiple external connection terminals T0 via via conductors or the like provided in the mounting substrate 1.

[0022] The mounting substrate 1 is, for example, a low temperature co-fired ceramics (LTCC) substrate. Note that the mounting substrate 1 is not limited to an LTCC substrate, and may be, for example, a printed wiring board, a high temperature co-fired ceramics (HTCC) substrate, or a resin multilayer substrate.

[0023] (1.2) Electronic Components The high-frequency module 100 includes a plurality of electronic components. The plurality of electronic components includes the first electronic component 5 and the second electronic component 13 described above. In this embodiment, the plurality of electronic components are disposed on the first main surface 101 of the mounting substrate 1. "Electronic components are disposed on the first main surface 101 of the mounting substrate 1" means that the electronic components are mounted on (mechanically connected to) the first main surface 101 of the mounting substrate 1, and that the electronic components are electrically connected to (appropriate conductor portions of) the mounting substrate 1. The plurality of electronic components are mechanically and electrically connected to the first main surface 101 of the mounting substrate 1 by a plurality of joints. The plurality of electronic components are circuit components of the high-frequency circuit included in the high-frequency module 100. The material of the plurality of joints corresponding to the plurality of electronic components is, for example, solder. The plurality of joints may be components of the electronic components, or may be components interposed between the electronic components and the first main surface 101 of the mounting substrate 1.

[0024] In this embodiment, the plurality of electronic components include, in addition to the first electronic component 5 and the second electronic component 13, for example, a duplexer 15, a plurality of circuit elements (matching elements) of the output matching circuit 14, a low-noise amplifier 16, a plurality of circuit elements (matching elements) of the input matching circuit 17, a plurality of circuit elements (matching elements) of the matching circuit 18, circuit components of the first power supply circuit 191, a first capacitor C1, circuit components of the second power supply circuit 192, and a second capacitor C2.

[0025] In a plan view from the thickness direction D1 of the mounting board 1, the outer edge of each of the multiple electronic components is, for example, rectangular. Therefore, in a plan view from the thickness direction D1 of the mounting board 1, the outer edges of each of the first electronic component 5 and the second electronic component 13 are rectangular. The first electronic component 5 has a main surface 51 on the side opposite to the mounting board 1 side, and an outer peripheral surface 53. The outer peripheral surface 53 of the first electronic component 5 includes four side surfaces of the first electronic component 5, but does not include the main surface 51. The second electronic component 13 has a main surface 131 on the side opposite to the mounting board 1 side, and an outer peripheral surface 133. The outer peripheral surface 133 of the second electronic component 13 includes four side surfaces of the second electronic component 13, but does not include the main surface 131.

[0026] (1.3) Transformer In this embodiment, the transformer 7 is disposed within the mounting substrate 1. The transformer 7 includes a first coil 71 and a second coil 72. In this embodiment, the first coil 71 and the second coil 72 are spaced apart from each other and face each other in the thickness direction D1 of the mounting substrate 1.

[0027] (1.4) Power Amplifier As described above, the power amplifier 3 is a power amplification IC die. If the amplification transistor included in the power amplifier 3 is a bipolar transistor, the power amplifier 3 is, for example, a GaAs-based IC die. Also, if the amplification transistor is a FET (Field Effect Transistor), the power amplifier 3 is, for example, a Si-based IC die.

[0028] In plan view from the thickness direction D1 of the mounting board 1, the outer edge of the power amplifier 3 is, for example, rectangular.

[0029] The power amplifier 3 has a first main surface 31 and a second main surface 32 that face each other in the thickness direction of the power amplifier 3. The power amplifier 3 also has an outer peripheral surface 33. The outer peripheral surface 33 of the power amplifier 3 includes four side surfaces of the power amplifier 3, but does not include the first main surface 31 or the second main surface 32. The power amplifier 3 also has a plurality of terminals 34 (hereinafter also referred to as first terminals 34) to which the plurality of first conductor members 4 are connected. Each of the plurality of first terminals 34 includes a pad electrode. Each of the plurality of first terminals 34 may further include a solder bump bonded to the pad electrode. In the power amplifier 3, the plurality of first terminals 34 face the first main surface 101 of the mounting substrate 1. Furthermore, the first main surface 31 of the power amplifier 3 faces the first main surface 101 of the mounting substrate 1.

[0030] The power amplifier 3 is spaced apart from the first main surface 101 of the mounting board 1 in the thickness direction D1 of the mounting board 1. In the present embodiment, the power amplifier 3 overlaps with the first electronic component 5 in a plan view from the thickness direction D1 of the mounting board 1. In the present embodiment, a part of the power amplifier 3 overlaps with the entire first electronic component 5 in a plan view from the thickness direction D1 of the mounting board 1. In the thickness direction D1 of the mounting board 1, the first main surface 31 of the power amplifier 3 is spaced apart from the main surface 51 of the first electronic component 5. The power amplifier 3 is not in contact with the first electronic component 5. The second main surface 32 of the power amplifier 3 is in contact with the first shield part 21. In the present embodiment, the entire second main surface 32 of the power amplifier 3 is in contact with the first shield part 21.

[0031] (1.5) First conductive member The multiple first conductor members 4 connect the power amplifier 3 and the mounting board 1. The multiple first conductor members 4 have a length greater than the thickness H3 of the power amplifier 3 and are spaced apart from one another. In a plan view from the thickness direction D1 of the mounting board 1, the multiple first conductor members 4 are spaced apart from one another in a direction along the outer edge of the power amplifier 3. The multiple first conductor members 4 are not in contact with the first electronic component 5.

[0032] Each of the plurality of first conductive members 4 is a linear wire. That is, each of the plurality of first conductive members 4 is a thin metal wire. The material of each of the plurality of first conductive members 4 is, for example, gold, aluminum alloy, or copper.

[0033] The multiple first conductor members 4 correspond one-to-one to the multiple first terminals 34. Each of the multiple first conductor members 4 is connected to a corresponding one of the multiple first terminals 34. The mounting board 1 also has multiple first conductor portions (not shown) that correspond one-to-one to the multiple first conductor members 4. Each of the multiple first conductor members 4 connects a corresponding one of the multiple first terminals 34 to a corresponding one of the multiple first conductor portions.

[0034] (1.6) Controller As described above, the controller 11 is an IC die including a control circuit that controls the power amplifier 3. For example, it is a Si-based IC die.

[0035] In a plan view from the thickness direction D1 of the mounting board 1, the outer edge of the controller 11 is, for example, rectangular.

[0036] The controller 11 has a third main surface 111 and a fourth main surface 112 that face each other in the thickness direction of the controller 11. The controller 11 also has an outer circumferential surface 113. The outer circumferential surface 113 of the controller 11 includes four side surfaces of the controller 11, but does not include the third main surface 111 or the fourth main surface 112. The controller 11 also has a plurality of second terminals 114 to which the plurality of second conductor members 12 are connected. Each of the plurality of second terminals 114 includes a pad electrode. Each of the plurality of second terminals 114 may further include a solder bump bonded to the pad electrode. In the controller 11, the plurality of second terminals 114 face the first main surface 101 of the mounting substrate 1. The third main surface 111 of the controller 11 faces the first main surface 101 of the mounting substrate 1.

[0037] The controller 11 is spaced apart from the first main surface 101 of the mounting board 1 in the thickness direction D1 of the mounting board 1. In the present embodiment, the controller 11 overlaps with the second electronic component 13 in a plan view from the thickness direction D1 of the mounting board 1. In the present embodiment, a part of the controller 11 overlaps with the entire second electronic component 13 in a plan view from the thickness direction D1 of the mounting board 1. In the thickness direction D1 of the mounting board 1, the third main surface 111 of the controller 11 is spaced apart from the main surface 131 of the second electronic component 13. The controller 11 is not in contact with the second electronic component 13. A fourth main surface 112 of the controller 11 is in contact with the first shield part 21. In the present embodiment, the entire fourth main surface 112 of the controller 11 is in contact with the first shield part 21.

[0038] (1.7) Second conductive member The multiple second conductor members 12 connect the controller 11 and the mounting board 1. The multiple second conductor members 12 have a length greater than the thickness H11 of the controller 11 and are spaced apart from one another. In a plan view from the thickness direction D1 of the mounting board 1, the multiple second conductor members 12 are spaced apart from one another in a direction along the outer edge of the controller 11. The multiple second conductor members 12 are not in contact with the second electronic component 13.

[0039] Each of the second conductive members 12 is a linear wire. That is, each of the second conductive members 12 is a thin metal wire. The material of each of the second conductive members 12 is, for example, gold, aluminum alloy, or copper.

[0040] The multiple second conductor members 12 correspond one-to-one to the multiple second terminals 114. Each of the multiple second conductor members 12 is connected to a corresponding second terminal 114 among the multiple second terminals 114. The mounting board 1 also has multiple second conductor portions (not shown) that correspond one-to-one to the multiple second conductor members 12. Each of the multiple second conductor members 12 connects a corresponding second terminal 114 among the multiple second terminals 114 to a corresponding second conductor portion among the multiple second conductor portions.

[0041] (1.8) Resin layer The resin layer 8 is disposed on the first main surface 101 of the mounting board 1, and covers a plurality of electronic components including the first electronic component 5 and the second electronic component 13. The resin layer 8 also covers the first main surface 31 of the power amplifier 3, the outer peripheral surface 33 of the power amplifier 3, and a plurality of first conductor members 4. The resin layer 8 also covers the fourth main surface 112 of the controller 11, the outer peripheral surface 113 of the controller 11, and a plurality of second conductor members 12. The resin layer 8 does not cover the second main surface 32 of the power amplifier 3. In other words, the resin layer 8 exposes the second main surface 32 of the power amplifier 3. The resin layer 8 also does not cover the fourth main surface 112 of the controller 11. In other words, the resin layer 8 exposes the fourth main surface 112 of the controller 11.

[0042] The resin layer 8 has electrical insulation properties. The resin layer 8 contains a resin (for example, an epoxy resin). The resin layer 8 may contain a filler in addition to the resin.

[0043] (1.9) Outer shield layer The external shield layer 2 covers the resin layer 8 and the outer peripheral surface 103 of the mounting substrate 1. More specifically, the external shield layer 2 covers the second main surface 32 of the power amplifier 3, the fourth main surface 112 of the controller 11, a main surface 801 of the resin layer 8 opposite the mounting substrate 1 side, the outer peripheral surface 803 of the resin layer 8, and the outer peripheral surface 103 of the mounting substrate 1. The external shield layer 2 has a first shield section 21 and a second shield section 22. The first shield section 21 is separated from the main surface 101 of the mounting substrate 1 in the thickness direction D1 of the mounting substrate 1. The second shield section 22 is connected to the first shield section 21 and covers at least a portion of the outer peripheral surface 103 of the mounting substrate 1. In this embodiment, the first shield section 21 covers the second main surface 32 of the power amplifier 3, the fourth main surface 112 of the controller 11, and the main surface 801 of the resin layer 8. The second shield part 22 covers the outer peripheral surface 803 of the resin layer 8 and the outer peripheral surface 103 of the mounting substrate 1.

[0044] The external shield layer 2 is electrically conductive. In the high-frequency module 100, the external shield layer 2 is provided, for example, for the purpose of electromagnetic shielding between the inside and outside of the high-frequency module 100. The external shield layer 2 has a multilayer structure in which multiple metal layers are stacked, but is not limited to this and may be a single metal layer. The metal layer contains one or more types of metal. When the shield layer has a multilayer structure in which multiple metal layers are stacked, it includes, for example, a first stainless steel layer, a Cu layer on the first stainless steel layer, and a second stainless steel layer on the Cu layer. The material of each of the first stainless steel layer and the second stainless steel layer is an alloy containing Fe, Ni, and Cr. When the external shield layer 2 is a single metal layer, it is, for example, a Cu layer.

[0045] In the external shield layer 2, the second shield section 22 is in contact with the ground layer (not shown) of the mounting board 1. By being in contact with the ground layer of the mounting board 1, the external shield layer 2 is directly connected to the ground layer of the mounting board 1. Therefore, the external shield layer 2 is connected to a ground terminal included in the plurality of external connection terminals T0, for example, via the ground layer of the mounting board 1.

[0046] (1.10) External connection terminal The multiple external connection terminals T0 are arranged on the second main surface 102 of the mounting substrate 1. "The external connection terminals T0 are arranged on the second main surface 102 of the mounting substrate 1" means that the external connection terminals T0 are mechanically connected to the mounting substrate 1, and that the external connection terminals T0 are electrically connected to (appropriate conductor portions of) the mounting substrate 1.

[0047] In this embodiment, each of the plurality of external connection terminals T0 is a pad electrode (land electrode).The material of the plurality of external connection terminals T0 includes, for example, copper.

[0048] The plurality of external connection terminals T0 includes a ground terminal. The ground terminal is, for example, a terminal electrically connected to a ground electrode of a circuit board included in the communication device 300 (see FIG. 4) and supplied with a ground potential. The plurality of external connection terminals T0 also includes an antenna terminal T1 connected to an external antenna 310 included in the communication device 300 (see FIG. 5), a signal input terminal T2 connected to a signal processing circuit 301 of the communication device 300, a signal output terminal T3, a plurality of control terminals T4 (only one control terminal T4 is shown in FIG. 4), and a power supply terminal T5.

[0049] (2) High-frequency circuit In the high-frequency circuit of the high-frequency module 100, the signal input terminal T2 is connected to an input terminal included in the plurality of first terminals 34 of the power amplifier 3. In the high-frequency module 100, the signal output terminal T3 is connected to an output terminal of the low-noise amplifier 16. In the high-frequency module 100, the control terminal T4 is connected to an input terminal included in the plurality of second terminals 114 of the controller 11. In the high-frequency module 100, the power supply terminal T5 is connected to a first power supply circuit 191 that supplies a first power supply voltage to the power amplifier 3 and a second power supply circuit 192 that supplies a second power supply voltage to the transformer 7. The power supply terminal T5 is connected to, for example, a battery of the communication device 300. In the high-frequency circuit, the output terminal of the power amplifier 3 is connected to a transmit filter 151 via an output matching circuit 14 and a transformer 7. In the high-frequency circuit, the receive filter 152 is connected to an input terminal of the low-noise amplifier 16 via an input matching circuit 17. The transmit filter 151 and the receive filter 152 are connected to the antenna terminal T1 via the matching circuit 18. The output terminal of the first power supply circuit 191 is connected to a power supply terminal included in the plurality of first terminals 34 of the power amplifier 3. The first capacitor C1 is connected between the output terminal of the first power supply circuit 191 and ground. The output terminal of the second power supply circuit 192 is connected to the transformer 7. The second capacitor C2 is connected between the output terminal of the second power supply circuit 192 and ground.

[0050] The high-frequency circuit in the high-frequency module 100 may have a circuit configuration other than that shown in FIG.

[0051] (3) Manufacturing Method of High-Frequency Module 100 A method for manufacturing the high-frequency module 100 will be described below with reference to FIGS. 2A to 2D and 3A to 3D.

[0052] In the method for manufacturing the high-frequency module 100, after preparing the mounting substrate 1, the first to eighth steps are performed in order. Note that in the manufacturing method of this embodiment, the transformer 7 is formed in advance in the mounting substrate 1, and a plurality of external connection terminals T0 are arranged on the second main surface 102 of the mounting substrate 1.

[0053] In the first step, as shown in FIG. 2A, a plurality of electronic components (first electronic component 5, second electronic component 13, etc.) are arranged on first main surface 101 of mounting substrate 1.

[0054] In the second step, as shown in FIG. 2B , arch-shaped bonding wires 40, which will become the bases of two of the multiple first conductor members 4, are formed on the first main surface 101 of the mounting substrate 1 in half the number of first conductor members 4, and arch-shaped bonding wires 128, which will become the bases of two of the multiple second conductor members 12, are formed on the first main surface 101 of the mounting substrate 1 in half the number of second conductor members 12. Each bonding wire 40 formed in the second step has a first end and a second end. The first end and the second end of each bonding wire 40 formed in the second step are bonded to the mounting substrate 1. Furthermore, each bonding wire 128 formed in the second step has a first end and a second end. The first end and the second end of each bonding wire 128 formed in the second step are bonded to the mounting substrate 1.

[0055] 2C , in the third step, a first resin layer 81, which will be the basis for part of the resin layer 8, is formed on the first main surface 101 of the mounting substrate 1. In the third step, the first resin layer 81 is formed so as to cover the multiple electronic components (the first electronic component 5, the second electronic component 13, etc.) and the bonding wires 40 and 128.

[0056] In the fourth step, as shown in FIG. 2D, the first resin layer 81 is polished so that each bonding wire 40 is cut to form two first conductive members 4, and each bonding wire 128 is cut to form two second conductive members 12.

[0057] 3A, the power amplifier 3 is arranged so that the power amplifier 3 is connected to a plurality of first conductor members 4, and the controller 11 is arranged so that the controller 11 is connected to a plurality of second conductor members 12. The order of arrangement of the power amplifier 3 and the controller 11 may be reversed.

[0058] In a sixth step, as shown in FIG. 3B, a second resin layer 82 is formed on the first resin layer 81 so as to cover the power amplifier 3 and the controller 11.

[0059] 3C, in the seventh step, a portion of the second resin layer 82 is polished, and the power amplifier 3 and the controller 11 are polished together with the second resin layer 82 so as to further reduce the thickness of each of the power amplifier 3 and the controller 11. In FIG. 3C, the first resin layer 81 and the second resin layer 82 are collectively represented as the resin layer 8.

[0060] In the eighth step, the outer shield layer 2 is formed as shown in Fig. 3D. In the eighth step, the outer shield layer 2 is formed by, for example, sputtering.

[0061] In the method for manufacturing the high-frequency module 100, the high-frequency module 100 is manufactured by performing the first to eighth steps.

[0062] (4) Communications equipment As shown in FIG. 4 , the communication device 300 includes, for example, a high-frequency module 100 and a signal processing circuit 301 to which the high-frequency module 100 is connected. The communication device 300 further includes an antenna 310. The communication device 300 further includes a circuit board (not shown) on which the high-frequency module 100 is mounted. The circuit board is, for example, a printed wiring board. The circuit board has a ground electrode to which a ground potential is applied. The high-frequency module 100 is configured to, for example, amplify a received signal input from the antenna 310 and output the amplified signal to the signal processing circuit 301. The high-frequency module 100 is also configured to, for example, amplify a transmission signal input from the signal processing circuit 301 and output the amplified signal to the antenna 310. The high-frequency module 100 is controlled, for example, by the signal processing circuit 301 included in the communication device 300.

[0063] The signal processing circuit 301 includes an RF signal processing circuit 302 and a baseband signal processing circuit 303. The RF signal processing circuit 302 is, for example, an RFIC (Radio Frequency Integrated Circuit) and performs signal processing on a high-frequency signal. The RF signal processing circuit 302 performs signal processing such as up-conversion on a high-frequency signal (transmission signal) output from the baseband signal processing circuit 303 and outputs the processed high-frequency signal. The RF signal processing circuit 302 also performs signal processing such as down-conversion on a high-frequency signal (reception signal) output from the high-frequency module 100 and outputs the processed high-frequency signal to the baseband signal processing circuit 303. The baseband signal processing circuit 303 is, for example, a BBIC (Baseband Integrated Circuit). The baseband signal processing circuit 303 generates an I-phase signal and a Q-phase signal from the baseband signal. The baseband signal is, for example, an audio signal or an image signal input from an external device. The baseband signal processing circuit 303 performs IQ modulation processing by combining the I-phase signal and the Q-phase signal, and outputs a transmission signal. At this time, the transmission signal is generated as a modulated signal (IQ signal) in which a carrier signal of a predetermined frequency is amplitude-modulated at a period longer than the period of the carrier signal. The received signal processed by the baseband signal processing circuit 303 is used, for example, as an image signal for image display or as an audio signal for a call between the user of the communication device 300.

[0064] (5) Effects The high-frequency module 100 according to the first embodiment includes a mounting substrate 1, an external shield layer 2, a power amplifier 3, and multiple conductor members 4. The mounting substrate 1 has a main surface 101. The external shield layer 2 has a first shield section 21 and a second shield section 22. The first shield section 21 is spaced apart from the main surface 101 of the mounting substrate 1 in a thickness direction D1 of the mounting substrate 1. The second shield section 22 is connected to the first shield section 21 and covers at least a portion of an outer circumferential surface 103 of the mounting substrate 1. The power amplifier 3 has a first main surface 31 and a second main surface 32. The power amplifier 3 is spaced apart from the main surface 101 of the mounting substrate 1 in the thickness direction D1 of the mounting substrate 1, and the second main surface 32 is in contact with the first shield section 21. The multiple conductor members 4 connect the power amplifier 3 and the mounting substrate 1. The multiple conductor members 4 have lengths greater than a thickness H3 of the power amplifier 3 and are spaced apart from each other.

[0065] The above configuration makes it possible to achieve both a low profile and a compact design. More specifically, with the above configuration, because the second main surface 32 of the power amplifier 3 is in contact with the first shield part 21, heat generated by the power amplifier 3 is easily dissipated through the external shield layer 2. This eliminates the need to arrange a heat dissipation conductor in a region of the mounting board 1 that overlaps with the power amplifier 3 in the thickness direction D1 of the mounting board 1, thereby increasing the degree of freedom in the wiring layout of the mounting board 1 and the arrangement of electronic components and circuit elements. Furthermore, with the above configuration, the multiple conductor members 4 connecting the power amplifier 3 to the mounting board 1 have a length greater than the thickness H3 of the power amplifier 3 and are spaced apart from each other. Therefore, with the above configuration, it is possible to arrange an electronic component (e.g., the first electronic component 5) between the mounting board 1 and the power amplifier 3 in the thickness direction D1 of the mounting board 1, and to arrange a circuit element (e.g., the transformer 7) in a region of the mounting board 1 that overlaps with the power amplifier 3 in a plan view from the thickness direction D1 of the mounting board 1, thereby enabling a compact design. Furthermore, with the above configuration, because the second main surface 32 of the power amplifier 3 is in contact with the first shield part 21, it is possible to achieve a lower profile compared to a case in which the power amplifier and the mounting board are connected by a looped bonding wire and the distance between the top of the looped bonding wire and the mounting board is longer than the distance between the mounting board and the power amplifier. Therefore, with the above configuration, it is possible to achieve a lower profile without forming a recess in the mounting board, which increases the degree of freedom in the wiring layout on the mounting board 1 and the arrangement of electronic components and circuit elements. Therefore, with the above configuration, it is possible to achieve both a low profile and a compact size.

[0066] Moreover, the high-frequency module 100 according to the first embodiment further includes an electronic component 5 that is disposed on the first main surface 101 of the mounting board 1 and is located between the mounting board 1 and the power amplifier 3 in the thickness direction D1 of the mounting board 1. The power amplifier 3 is spaced apart from the electronic component 5 in the thickness direction D1 of the mounting board 1.

[0067] According to the above configuration, it is possible to achieve miniaturization.

[0068] Moreover, the high-frequency module 100 according to the first embodiment further includes a transformer 7 connected to an output terminal included in the plurality of terminals 34 of the power amplifier 3. The electronic component 5 is a matching element connected to the output terminal of the power amplifier 3. The transformer 7 is disposed within the mounting substrate 1.

[0069] According to the above configuration, it is possible to achieve miniaturization.

[0070] The high-frequency module 100 according to the first embodiment further includes a resin layer 8 disposed on the main surface 101 of the mounting substrate 1. The resin layer 8 covers the electronic components 5, the first main surface 31 of the power amplifier 3, an outer peripheral surface 33 of the power amplifier 3, and the plurality of conductor members 4. The second main surface 32 of the power amplifier 3 is exposed from the resin layer 8 and is in contact with the first shield part 21.

[0071] According to the above configuration, since a part of the resin layer 8 is interposed between the power amplifier 3 and the electronic component 5, the heat generated in the power amplifier 3 is less likely to be transmitted to the electronic component 5.

[0072] Moreover, the high-frequency module 100 in the first embodiment further includes a controller 11 that controls the power amplifier 3, and a plurality of second conductor members 12. Unlike the plurality of first conductor members 4, the plurality of second conductor members 12 connect the controller 11 to the mounting board 1. The controller 11 has a third main surface 111 and a fourth main surface 112 that face each other, and a plurality of second terminals 114. The controller 11 is separated from the main surface 101 of the mounting board 1 in the thickness direction D1 of the mounting board 1, and the fourth main surface 112 is in contact with the first shield part 21.

[0073] According to the above configuration, further miniaturization can be achieved.

[0074] The communication device 300 according to the first embodiment includes the high-frequency module 100 and a signal processing circuit 301. The signal processing circuit 301 is connected to the high-frequency module 100.

[0075] According to the above configuration, it is possible to achieve both a low profile and a small size.

[0076] (Embodiment 2) A high-frequency module 100A according to the second embodiment will be described with reference to Fig. 5. Regarding the high-frequency module 100A according to the second embodiment, the same components as those in the high-frequency module 100 according to the first embodiment (see Figs. 1 to 4) are denoted by the same reference numerals, and description thereof will be omitted.

[0077] (1) Composition The high-frequency module 100A according to the second embodiment differs from the high-frequency module 100 according to the first embodiment in that some (for example, two) electronic components (hereinafter also referred to as third electronic components) of the plurality of electronic components are arranged on the second main surface 102 of the mounting substrate 1. Note that the number of third electronic components arranged on the second main surface 102 of the mounting substrate 1 is not limited to two, and may be one, or three or more.

[0078] The two third electronic components arranged on the second main surface 102 of the mounting board 1 include, for example, a controller 11 and a low-noise amplifier (see FIG. 4 ). "The third electronic components are arranged on the second main surface 102 of the mounting board 1" means that the third electronic components are mounted on (mechanically connected to) the second main surface 102 of the mounting board 1, and that the third electronic components are electrically connected to (appropriate conductor portions of) the mounting board 1. The two third electronic components are mechanically and electrically connected to the second main surface 102 of the mounting board 1 by multiple joints. The two third electronic components are circuit components of the high-frequency circuit included in the high-frequency module 100. The multiple joints corresponding to the two third electronic components are made of, for example, solder. The multiple joints may be components of the third electronic components, or may be components interposed between the third electronic components and the second main surface 102 of the mounting board 1. In this embodiment, the transformer 7 (see FIGS. 1 and 4) is disposed inside the mounting board 1, but may be disposed on the second main surface 102 of the mounting board 1 as a third electronic component.

[0079] In plan view in the thickness direction D1 of the mounting board 1, the outer edges of each of the two third electronic components are, for example, rectangular.

[0080] In the high-frequency module 100A, the controller 11 is disposed on the second main surface 102 of the mounting substrate 1. In the high-frequency module 100A, the controller 11 overlaps with the power amplifier 3 in a plan view from the thickness direction D1 of the mounting substrate 1. In this embodiment, a portion of the controller 11 overlaps with a portion of the power amplifier 3, but a portion of the controller 11 may overlap with the entire power amplifier 3, or the entire controller 11 may overlap with a portion of the power amplifier 3, or the entire controller 11 may overlap with the entire power amplifier 3.

[0081] In addition, in this embodiment, the controller 11 overlaps with the electronic components 5 in a plan view from the thickness direction D1 of the mounting board 1. In this embodiment, part of the controller 11 overlaps with part of the electronic components 5, but part of the controller 11 may overlap with all of the electronic components 5, all of the controller 11 may overlap with part of the electronic components 5, or all of the controller 11 may overlap with all of the electronic components 5.

[0082] In this embodiment, the controller 11 overlaps with the electronic components 5 and the power amplifier 3 in plan view in the thickness direction D1 of the mounting board 1.

[0083] The plurality of external connection terminals T0 are arranged on the second main surface 102 of the mounting substrate 1. The material of the plurality of external connection terminals T0 is, for example, a metal (for example, copper, copper alloy, etc.). Each of the plurality of external connection terminals T0 is a columnar electrode (for example, a cylindrical electrode).

[0084] The high-frequency module 100A also includes a resin layer 6 different from the resin layer 8. The resin layer 6 is disposed on the second main surface 102 of the mounting substrate 1 and covers the two third electronic components. The resin layer 6 also covers the side surfaces of each of the multiple external connection terminals T0. The resin layer 6 has electrical insulation properties. The resin layer 6 has electrical insulation properties. The resin layer 6 contains a resin (e.g., epoxy resin). The resin layer 6 may contain a filler in addition to the resin. The material of the resin layer 6 is the same as or may be a different material from the material of the resin layer 8. Note that the resin layer 6 covers the main surface of the third electronic component opposite the mounting substrate 1 side, but may not cover the main surface of the third electronic component opposite the mounting substrate 1 side.

[0085] Furthermore, in the high-frequency module 100A, the external shield layer 2 covers the second main surface 32 of the power amplifier 3, the main surface 801 of the resin layer 8, the outer peripheral surface 103 of the mounting substrate 1, the outer peripheral surface 803 of the resin layer 8, and the outer peripheral surface 603 of the resin layer 6. In the external shield layer 2, the second shield section 22 also covers the outer peripheral surface 603 of the resin layer 6. In the high-frequency module 100, the main surface 601 of the resin layer 6 opposite to the mounting substrate 1 side is not covered by the external shield layer 2 and is exposed.

[0086] (2) Effects In the high-frequency module 100A according to the second embodiment, similar to the high-frequency module 100 according to the first embodiment, the power amplifier 3 is spaced apart from the main surface 101 of the mounting board 1 in the thickness direction D1 of the mounting board 1, the second main surface 32 of the power amplifier 3 is in contact with the first shield part 21, and the multiple conductor members 4 connecting the power amplifier 3 to the mounting board 1 have a length greater than the thickness H3 of the power amplifier 3 (see FIG. 1 ) and are spaced apart from each other. Thus, similar to the high-frequency module 100 according to the first embodiment, the high-frequency module 100A according to the second embodiment can be made both low-profile and compact. More specifically, the high-frequency module 100A according to the second embodiment can be made both low-profile and compact compared to a high-frequency module in which a power amplifier is disposed on a first main surface of the mounting board, a controller is stacked on the power amplifier, the controller is connected to the mounting board via bonding wires, and electronic components are disposed on a second main surface of the mounting board.

[0087] Moreover, the high-frequency module 100A according to the second embodiment includes a controller 11 disposed on the second main surface 102 of the mounting substrate 1, and the power amplifier 3 and the controller 11 overlap in a plan view from the thickness direction D1 of the mounting substrate 1.

[0088] According to the above configuration, it is possible to achieve miniaturization.

[0089] In addition, in the high-frequency module 100A according to the second embodiment, some of the plurality of conductor members 4 overlap with part of the controller 11 in plan view in the thickness direction D1 of the mounting substrate 1.

[0090] According to the above configuration, the length of the wiring between the power amplifier 3 and the controller 11 can be easily shortened.

[0091] (Embodiment 3) A high-frequency module 100B according to the third embodiment will be described with reference to Fig. 6. Regarding the high-frequency module 100B according to the third embodiment, the same components as those in the high-frequency module 100 according to the first embodiment (see Figs. 1 to 4) are denoted by the same reference numerals, and description thereof will be omitted.

[0092] (1) Composition The high-frequency module 100B according to the third embodiment differs from the high-frequency module 100 according to the first embodiment in that the transformer 7 overlaps with the power amplifier 3 in plan view in the thickness direction D1 of the mounting substrate 1.

[0093] Furthermore, in the high-frequency module 100B, the second electronic component 13 adjacent to the first electronic component 5 is an inductor (matching element) included in the input matching circuit 17 (see FIG. 4 ) that is connected to the input terminal of the low-noise amplifier 16. The second electronic component 13 is adjacent to the first electronic component 5. The phrase "the second electronic component 13 is adjacent to the first electronic component 5" refers to the multiple electronic components arranged on the first main surface 101 of the mounting board 1, and means that the second electronic component 13 and the first electronic component 5 are arranged without any other electronic component between them in a plan view from the thickness direction D1 of the mounting board 1.

[0094] The mounting board 1 includes a ground layer 104. The multiple conductor members 4 include a ground conductor member 45 connected to the ground layer 104. The ground layer 104 is connected to at least one ground terminal T6 out of two or more ground terminals T6 included in the multiple external connection terminals T0. In a plan view of the mounting board 1 in the thickness direction D1, the ground conductor member 45 is located between the first electronic component 5 and the second electronic component 13.

[0095] Furthermore, in the high-frequency module 100B according to the third embodiment, the transformer 7 overlaps with the power amplifier 3 in a plan view in the thickness direction D1 of the mounting substrate 1. In this embodiment, the entire transformer 7 overlaps with part of the power amplifier 3, but a part of the transformer 7 may overlap with a part of the power amplifier 3.

[0096] Furthermore, in the high-frequency module 100B according to the third embodiment, the ground layer 104 is adjacent to the transformer 7. "The ground layer 104 is adjacent to the transformer 7" means that the ground layer 104 and the transformer 7 are arranged without any other conductors between them.

[0097] (2) Effects In the high-frequency module 100B according to the third embodiment, similarly to the high-frequency module 100 according to the first embodiment, the power amplifier 3 is spaced apart from the main surface 101 of the mounting board 1 in the thickness direction D1 of the mounting board 1, a second main surface 32 of the power amplifier 3 is in contact with the first shield part 21, and multiple conductor members 4 connecting the power amplifier 3 to the mounting board 1 have a length greater than the thickness H3 (see FIG. 1) of the power amplifier 3 and are spaced apart from each other. Thus, similarly to the high-frequency module 100 according to the first embodiment, the high-frequency module 100B according to the third embodiment can be made both low-profile and compact.

[0098] In the high-frequency module 100B according to the third embodiment, the second electronic component 13 is disposed on the main surface 101 of the mounting board 1 and is adjacent to the first electronic component 5. The mounting board 1 includes a ground layer 104. The multiple conductor members 4 include a ground conductor member 45 connected to the ground layer 104. In a plan view of the mounting board 1 in the thickness direction D1, the ground conductor member 45 is located between the first electronic component 5 and the second electronic component 13.

[0099] According to the above configuration, the isolation between the first electronic component 5 and the second electronic component 13 can be improved.

[0100] Furthermore, in the high-frequency module 100B according to the third embodiment, the transformer 7 overlaps with the power amplifier 3 in plan view in the thickness direction D1 of the mounting substrate 1.

[0101] According to the above configuration, it is possible to achieve miniaturization.

[0102] (Embodiment 4) A high-frequency module 100C according to the fourth embodiment will be described with reference to Fig. 7. Regarding the high-frequency module 100C according to the fourth embodiment, the same components as those of the high-frequency module 100B according to the third embodiment (see Fig. 6) are denoted by the same reference numerals, and description thereof will be omitted.

[0103] (1) Composition The high-frequency module 100C according to the fourth embodiment differs from the high-frequency module 100B according to the third embodiment in that the first electronic component 5 is a transformer 7.

[0104] (2) Effects In the high-frequency module 100C according to the fourth embodiment, similarly to the high-frequency module 100 according to the first embodiment, the power amplifier 3 is spaced apart from the main surface 101 of the mounting board 1 in the thickness direction D1 of the mounting board 1, the second main surface 32 of the power amplifier 3 is in contact with the first shield part 21, and the multiple conductor members 4 connecting the power amplifier 3 to the mounting board 1 have a length greater than the thickness H3 (see FIG. 1) of the power amplifier 3 and are spaced apart from each other. Thus, similarly to the high-frequency module 100 according to the first embodiment, the high-frequency module 100C according to the fourth embodiment can be made both low-profile and compact.

[0105] Furthermore, in the high-frequency module 100C according to the fourth embodiment, similarly to the high-frequency module 100B according to the third embodiment, the ground conductor member 45 is located between the first electronic component 5 and the second electronic component 13 when viewed in a plan view from the thickness direction D1 of the mounting substrate 1.

[0106] According to the above configuration, it is possible to improve the isolation between the transformer 7, which is the first electronic component 5, and the second electronic component 13 (the matching element of the input matching circuit 17 connected to the input terminal of the low-noise amplifier 16).

[0107] (Embodiment 5) A high-frequency module 100D according to the fifth embodiment will be described with reference to Fig. 8. Regarding the high-frequency module 100D according to the fifth embodiment, the same components as those of the high-frequency module 100A according to the second embodiment (see Fig. 5) are denoted by the same reference numerals, and the description thereof will be omitted.

[0108] (1) Composition The high-frequency module 100D according to the fifth embodiment differs from the high-frequency module 100A according to the second embodiment in that, in a plan view in the thickness direction D1 of the mounting substrate 1, only part of the first electronic component 5, but not all of the first electronic component 5, overlaps with part of the power amplifier 3.

[0109] (2) Effects Like the high-frequency module 100A according to the second embodiment, the high-frequency module 100D according to the fifth embodiment can achieve both a low profile and a small size.

[0110] (Embodiment 6) A high-frequency module 100E according to the sixth embodiment will be described with reference to Fig. 9. Regarding the high-frequency module 100E according to the sixth embodiment, the same components as those of the high-frequency module 100A according to the second embodiment (see Fig. 5) are denoted by the same reference numerals, and the description thereof will be omitted.

[0111] (1) Composition The high-frequency module 100E according to the sixth embodiment differs from the high-frequency module 100A according to the second embodiment in that a plurality of conductor members 4 are connected to the power amplifier 3 on the outer peripheral surface 33 of the power amplifier 3.

[0112] (2) Effects Like the high-frequency module 100A according to the second embodiment, the high-frequency module 100E according to the sixth embodiment can achieve both a low profile and a small size.

[0113] (Embodiment 7) A high-frequency module 100F according to the seventh embodiment will be described with reference to Figs. 10 and 11. In the high-frequency module 100F according to the seventh embodiment, components similar to those of the high-frequency module 100A according to the second embodiment (see Fig. 5) are denoted by the same reference numerals, and description thereof will be omitted. Fig. 11 is a cross-sectional view corresponding to the cross section taken along line XI-XI in Fig. 10. In Fig. 10, the second resin layer 82 and the outer shield layer 2 are not shown.

[0114] (1) Composition The high-frequency module 100F according to the seventh embodiment differs from the high-frequency module 100A according to the second embodiment in that it further includes a plurality of re-wiring sections 9. The plurality of re-wiring sections 9 correspond one-to-one to the plurality of conductor members 4. The plurality of re-wiring sections 9 also correspond one-to-one to the plurality of terminals 34 of the power amplifier 3. The plurality of re-wiring sections 9 connect the plurality of conductor members 4 to the plurality of terminals 34. In other words, each of the plurality of re-wiring sections 9 connects a corresponding conductor member 4 among the plurality of conductor members 4 to a corresponding terminal 34 among the plurality of terminals 34.

[0115] Each of the multiple rewiring portions 9 has a pad 91 to which a corresponding one of the multiple conductor members 4 is connected. In a plan view from the thickness direction D1 of the mounting substrate 1, the pad 91 of each of the multiple conductor members 4 is larger than the connection area with the conductor member 4 of the multiple conductor members 4 that is connected to the pad 91.

[0116] The resin layer 8 includes a first resin layer 81 and a second resin layer 82. The first resin layer 81 is located between the main surface 101 of the mounting substrate 1 and the power amplifier 3. The first resin layer 81 has a main surface 811 opposite the mounting substrate 1 side. The second resin layer 82 is laminated on the first resin layer 81. A plurality of rewiring sections 9 are arranged on the main surface 811 of the first resin layer 81. The second resin layer 82 covers the multiple rewiring sections 9 and the outer peripheral surface 33 of the power amplifier 3. The second main surface 32 of the power amplifier 3 is exposed from the second resin layer 82 and is in contact with the first shield section 21.

[0117] (2) Effects Like the high-frequency module 100A according to the second embodiment, the high-frequency module 100F according to the seventh embodiment can achieve both a low profile and a small size.

[0118] Furthermore, the high-frequency module 100F according to the seventh embodiment further includes a plurality of rewiring sections 9 connecting the plurality of conductor members 4 and the plurality of terminals 34, thereby increasing the degree of freedom in the layout of the plurality of terminals 34 of the power amplifier 3, the degree of freedom in the layout of the power amplifier 3 relative to the mounting board 1, and the degree of freedom in the layout of the plurality of conductor members 4.

[0119] Furthermore, in the high-frequency module 100F according to the seventh embodiment, each of the multiple rewiring sections 9 has a pad 91 to which a corresponding one of the multiple conductor members 4 is connected. In a plan view in the thickness direction D1 of the mounting substrate 1, the pad 91 of each of the multiple conductor members 4 is larger than the connection area with the conductor member 4 of the multiple conductor members 4 that is connected to the pad 91.

[0120] According to the above configuration, the degree of freedom in the layout of the plurality of conductor members 4 is increased.

[0121] (Embodiment 8) A high-frequency module 100G according to the eighth embodiment will be described with reference to Fig. 12. Regarding the high-frequency module 100G according to the eighth embodiment, the same components as those of the high-frequency module 100F according to the seventh embodiment (see Figs. 10 and 11) are denoted by the same reference numerals, and description thereof will be omitted.

[0122] (1) Composition The high-frequency module 100G according to the eighth embodiment differs from the high-frequency module 100F according to the seventh embodiment in that the controller 11 is separated from the main surface 101 of the mounting substrate 1 in the thickness direction D1 of the mounting substrate 1, and the fourth main surface 112 of the controller 11 is in contact with the first shield part 21.

[0123] The high-frequency module 100G of embodiment 8 differs from the high-frequency module 100F of embodiment 7 in that it further comprises a plurality of second rewiring sections 90 that are different from the first rewiring sections 9 and are arranged on the main surface 811 of the first resin layer 81, and a wiring section 94 that is arranged on the main surface 811 of the first resin layer 81 and connects one first terminal 34 of the plurality of first terminals 34 of the power amplifier 3 and one second terminal 114 of the plurality of second terminals 114 of the controller 11.

[0124] The multiple second rewiring sections 90 correspond to the multiple second conductor members 12 and the multiple terminals 114 of the controller 11. The multiple second rewiring sections 90 also correspond to the multiple second terminals 114 of the controller 11. The multiple second rewiring sections 90 connect the multiple second conductor members 12 and the multiple second terminals 114. In other words, each of the multiple second rewiring sections 90 connects a corresponding second conductor member 12 of the multiple second conductor members 12 to a corresponding second terminal 114 of the multiple second terminals 114.

[0125] (2) Effects Like the high-frequency module 100F according to the seventh embodiment, the high-frequency module 100G according to the eighth embodiment can achieve both a low profile and a small size.

[0126] Furthermore, similar to the high-frequency module 100 according to the first embodiment, the high-frequency module 100G according to the eighth embodiment further includes a controller 11 that controls the power amplifier 3 and a plurality of second conductor members 12, and the controller 11 is spaced apart from the main surface 101 of the mounting board 1 in the thickness direction D1 of the mounting board 1, and a fourth main surface 112 of the controller 11 is in contact with the first shield part 21.

[0127] According to the above configuration, it is possible to achieve miniaturization.

[0128] (Embodiment 9) A high-frequency module 100H according to the ninth embodiment will be described with reference to Fig. 13. Regarding the high-frequency module 100H according to the ninth embodiment, the same components as those of the high-frequency module 100A according to the second embodiment (see Fig. 5) are denoted by the same reference numerals, and the description thereof will be omitted.

[0129] (1) Composition The high-frequency module 100H according to the ninth embodiment differs from the high-frequency module 100A according to the second embodiment in that the controller 11 is separated from the main surface 101 of the mounting substrate 1 in the thickness direction D1 of the mounting substrate 1, and the fourth main surface 112 of the controller 11 is in contact with the first shield part 21.

[0130] The high-frequency module 100H also differs from the high-frequency module 100A according to the second embodiment in that each of the plurality of conductor members 4 is cylindrical and the power amplifier 3 is supported by the plurality of conductor members 4.

[0131] Furthermore, the high-frequency module 100H according to the ninth embodiment further includes second conductor members 12 that connect the mounting board 1 and the controller 11, in addition to the plurality of first conductor members 4 that are the plurality of conductor members 4. The high-frequency module 100H differs from the high-frequency module 100A according to the second embodiment in that each of the plurality of second conductor members 12 is cylindrical and the controller 11 is supported by the plurality of second conductor members 12.

[0132] (2) Effects Like the high-frequency module 100A according to the second embodiment, the high-frequency module 100H according to the ninth embodiment can achieve both a low profile and a small size.

[0133] (Embodiment 10) A high-frequency module 100I according to the tenth embodiment will be described with reference to Fig. 14. Regarding the high-frequency module 100I according to the tenth embodiment, the same components as those of the high-frequency module 100H according to the ninth embodiment (see Fig. 13) are denoted by the same reference numerals, and the description thereof will be omitted.

[0134] (1) Composition The high-frequency module 100I according to the tenth embodiment differs from the high-frequency module 100 according to the first embodiment in that each of the plurality of first conductor members 4 is columnar and the power amplifier 3 is supported by the plurality of first conductor members 4. The high-frequency module 100I according to the tenth embodiment also differs from the high-frequency module 100 according to the first embodiment in that each of the plurality of second conductor members 12 is columnar and the controller 11 is supported by the plurality of second conductor members 12.

[0135] (2) Manufacturing method of high frequency module A method for manufacturing the high-frequency module 100I will be described below with reference to FIGS. 15A to 15D and 16A to 16D.

[0136] In the method for manufacturing the high-frequency module 100I, after preparing the mounting substrate 1, the first to eighth steps are performed in order. Note that in the manufacturing method of this embodiment, the transformer 7 is formed in advance in the mounting substrate 1, and a plurality of external connection terminals T0 are arranged on the second main surface 102 of the mounting substrate 1.

[0137] In the first step, as shown in FIG. 15A, a plurality of electronic components (first electronic component 5, second electronic component 13, etc.) are arranged on first main surface 101 of mounting substrate 1.

[0138] 15B , in the second step, a table-like first metal member 410 is placed on the first main surface 101 of the mounting board 1 so as to surround the first electronic component 5, and a table-like second metal member 120 is placed on the first main surface 101 of the mounting board 1 so as to surround the second electronic component 13. The first metal member 410 has a plurality of legs 414 that become the plurality of first conductor members 4, and a top plate portion 411 to which the plurality of legs 414 are connected. The second metal member 120 has a plurality of legs 124 that become the plurality of second conductor members 12, and a top plate portion 121 to which the plurality of legs 124 are connected.

[0139] 15C , in the third step, a first resin layer 81, which will be the basis for part of the resin layer 8, is formed on the first main surface 101 of the mounting substrate 1. In the third step, the first resin layer 81 is formed so as to cover the multiple electronic components (the first electronic component 5, the second electronic component 13, etc.), the first metal member 410, and the second metal member 120.

[0140] In the fourth step, as shown in FIG. 15D, the first resin layer 81 and each top plate portion 411 and top plate portion 121 are polished so that the first metal member 410 is polished and separated into a plurality of leg portions 414 to form a plurality of first conductor members 4, and the second metal member 120 is polished and separated into a plurality of leg portions 124 to form a plurality of second conductor members 12.

[0141] 16A, the power amplifier 3 is arranged so that it is connected to a plurality of first conductor members 4, and the controller 11 is arranged so that it is connected to a plurality of second conductor members 12. The order of arranging the power amplifier 3 and the controller 11 may be reversed.

[0142] In a sixth step, as shown in FIG. 16B, a second resin layer 82 is formed on the first resin layer 81 so as to cover the power amplifier 3 and the controller 11.

[0143] 16C, in the seventh step, a portion of the second resin layer 82 is polished to further reduce the thickness of the power amplifier 3 and the controller 11, and the power amplifier 3 and the controller 11 are polished together with the second resin layer 82. In FIG. 16C, the first resin layer 81 and the second resin layer 82 are collectively represented as the resin layer 8.

[0144] In the eighth step, the outer shield layer 2 is formed as shown in Fig. 16D. In the eighth step, the outer shield layer 2 is formed by, for example, sputtering.

[0145] In the method for manufacturing the high-frequency module 100I, the high-frequency module 100I is manufactured by performing the first to eighth steps.

[0146] (Variation) The above-described first to tenth embodiments are merely examples of various embodiments of the present invention. The above-described first to tenth embodiments can be modified in various ways depending on the design and the like, and may be combined as appropriate, as long as the object of the present invention can be achieved.

[0147] Furthermore, in the high-frequency modules 100A, 100D, 100E, 100F, 100G, and 100H, the resin layer 6 disposed on the second main surface 102 of the mounting substrate 1 covers the main surface of the third electronic component opposite to the mounting substrate 1 side, but the resin layer 6 may not cover the main surface of the third electronic component opposite to the mounting substrate 1 side.

[0148] In the high-frequency modules 100, 100A to 100H, each of the external connection terminals T0 may be a ball bump.

[0149] The transformer 7 may be disposed on the second main surface 102 of the mounting substrate 1.

[0150] The communication device 300 may include multiple antennas including the antenna 310, and the multiple antennas may be connected to the high-frequency module 100.

[0151] Moreover, the communication device 300 may include, instead of the high-frequency module 100, any of the high-frequency modules 100A to 100I.

[0152] (Aspect) The present specification discloses the following aspects.

[0153] A high-frequency module (100; 100A; 100B; 100C; 100D; 100E; 100F; 100H; 100I) according to a first aspect includes a mounting substrate (1), an external shield layer (2), a power amplifier (3), and a plurality of conductor members (4). The mounting substrate (1) has a main surface (101). The external shield layer (2) has a first shield section (21) and a second shield section (22). The first shield section (21) is spaced apart from the main surface (101) of the mounting substrate (1) in a thickness direction (D1) of the mounting substrate (1). The second shield section (22) is connected to the first shield section (21) and covers at least a portion of an outer peripheral surface (103) of the mounting substrate (1). The power amplifier (3) has a first main surface (31) and a second main surface (32). The power amplifier (3) is spaced apart from the main surface (101) of the mounting board (1) in the thickness direction (D1) of the mounting board (1), and its second main surface (32) is in contact with the first shield part (21). A plurality of conductor members (4) connect the power amplifier (3) to the mounting board (1). The plurality of conductor members (4) have a length greater than the thickness (H3) of the power amplifier (3) and are spaced apart from each other.

[0154] According to this aspect, it is possible to achieve both a low profile and a small size.

[0155] In the high-frequency module (100; 100A; 100B; 100C; 100D; 100F; 100G; 100H; 100I) according to the second aspect, the power amplifier (3) in the first aspect has a plurality of terminals (34) to which a plurality of conductor members (4) are connected. The plurality of terminals (34) face the main surface (101) of the mounting substrate (1).

[0156] According to this embodiment, it is possible to achieve a smaller size than when a plurality of terminals (34) are arranged on the outer peripheral surface (33) of the power amplifier (3).

[0157] In a high-frequency module (100; 100A; 100B; 100C; 100D) according to the third aspect, in the second aspect, each of the plurality of conductor members (4) is a linear wire. The plurality of conductor members (4) correspond one-to-one to the plurality of terminals (34). Each of the plurality of conductor members (4) is connected to a corresponding one of the plurality of terminals (34).

[0158] A high-frequency module (100; 100A; 100B; 100C; 100D; 100E; 100F; 100G; 100H; 100I) according to a fourth aspect is the second or third aspect, and further includes an electronic component (5). The electronic component (5) is disposed on a main surface (101) of the mounting board (1). The electronic component (5) is located between the mounting board (1) and the power amplifier (3) in a thickness direction (D1) of the mounting board (1). The power amplifier (3) is spaced apart from the electronic component (5) in the thickness direction (D1) of the mounting board (1).

[0159] According to this aspect, it is possible to achieve miniaturization.

[0160] In the high-frequency module (100; 100A; 100B; 100C; 100D; 100E; 100F; 100G; 100H; 100I) according to the fifth aspect, in the fourth aspect, the electronic component (5) is a matching element or a transformer (7) connected to the output terminal of the power amplifier (3).

[0161] A high-frequency module (100; 100A; 100B; 100C; 100D; 100E; 100F; 100G; 100H; 100I) according to a sixth aspect is the fourth aspect, and further includes a transformer (7). The transformer (7) is connected to an output terminal included in the plurality of terminals (34) of the power amplifier (3). The mounting substrate (1) has a second main surface (102) different from the first main surface (101), which is the main surface (101). The electronic component (5) is a matching element connected to the output terminal of the power amplifier (3). The transformer (7) is disposed within the mounting substrate (1) or on the second main surface (102) of the mounting substrate (1).

[0162] According to this aspect, it is possible to achieve miniaturization.

[0163] In the high-frequency module (100B) according to the seventh aspect, the transformer (7) overlaps with the power amplifier (3) in plan view in the thickness direction (D1) of the mounting board (1).

[0164] According to this aspect, it is possible to achieve miniaturization.

[0165] A high-frequency module (100; 100A; 100B; 100C; 100D; 100E; 100F; 100G; 100H; 100I) according to an eighth aspect is any one of the fourth to seventh aspects, and further includes a resin layer (8). The resin layer (8) is disposed on a main surface (101) of the mounting board (1). The resin layer (8) covers the electronic components (5), a first main surface (31) of the power amplifier (3), an outer peripheral surface (33) of the power amplifier (3), and a plurality of conductor members (4). A second main surface (32) of the power amplifier (3) is exposed from the resin layer (8) and is in contact with a first shield part (21).

[0166] According to this embodiment, a part of the resin layer (8) is interposed between the power amplifier (3) and the electronic component (5), so that heat generated in the power amplifier (3) is less likely to be transmitted to the electronic component (5).

[0167] A high-frequency module (100F; 100G) according to a ninth aspect is the eighth aspect, further comprising a plurality of rewiring sections (9). The plurality of rewiring sections (9) connect the plurality of conductor members (4) and the plurality of terminals (34). The resin layer (8) includes a first resin layer (81) and a second resin layer (82). The first resin layer (81) is located between the main surface (101) of the mounting board (1) and the power amplifier (3). The first resin layer (81) has a main surface (811). The second resin layer (82) is laminated on the first resin layer (81). The plurality of rewiring sections (9) are arranged on the main surface (811) of the first resin layer (81). The second resin layer (82) covers the plurality of rewiring sections (9) and the outer peripheral surface (33) of the power amplifier (3). The second main surface (32) of the power amplifier (3) is exposed from the second resin layer (82) and is in contact with the first shield part (21).

[0168] According to this embodiment, the degree of freedom in the layout of the terminals (34) of the power amplifier (3), the degree of freedom in the layout of the power amplifier (3) relative to the mounting board (1), and the degree of freedom in the layout of the conductor members (4) are increased.

[0169] In a high-frequency module (100F; 100G) according to a tenth aspect, in the ninth aspect, each of the plurality of rewiring portions (9) has a pad (91) to which a corresponding one of the plurality of conductor members (4) is connected. In a plan view in the thickness direction (D1) of the mounting board (1), the pad (91) of each of the plurality of conductor members (4) has a larger connection area with the conductor member (4) of the plurality of conductor members (4) connected to the pad (91).

[0170] According to this embodiment, the degree of freedom in the layout of the plurality of conductor members (4) is increased.

[0171] A high-frequency module (100G) according to an eleventh aspect is the same as the ninth or tenth aspect, and further includes a controller (11) and a plurality of second conductor members (12). The controller (11) controls the power amplifier (3). The plurality of second conductor members (12), unlike the plurality of first conductor members (4), connect the controller (11) to the mounting board (1). The controller (11) has a third main surface (111) and a fourth main surface (112) facing each other, and a plurality of second terminals (114) different from the plurality of first terminals (34), which are the plurality of terminals (34). The controller (11) is separated from the main surface (101) of the mounting board (1) in a thickness direction (D1) of the mounting board (1), and the fourth main surface (112) is in contact with the first shield part (21).

[0172] According to this aspect, it is possible to achieve miniaturization.

[0173] A high-frequency module (100G) according to a twelfth aspect is the eleventh aspect, further including a wiring portion (94). The wiring portion (94) is disposed on a main surface (811) of the first resin layer (81). The wiring portion (94) connects the power amplifier (3) and the controller (11).

[0174] According to this embodiment, the length of the wiring between the power amplifier (3) and the controller (11) can be further shortened.

[0175] A high-frequency module (100C; 100F) according to a thirteenth aspect is any one of the eighth to twelfth aspects, and further includes a second electronic component (13). The second electronic component (13) is disposed on a main surface (101) of the mounting board (1) and is adjacent to a first electronic component (5) that is an electronic component (5). A resin layer (8) covers the second electronic component (13). The mounting board (1) includes a ground layer (104). The plurality of conductor members (4) includes a ground conductor member (45) connected to the ground layer (104). In a plan view in a thickness direction (D1) of the mounting board (1), the ground conductor member (45) is located between the first electronic component (5) and the second electronic component (13).

[0176] According to this embodiment, it is possible to improve the isolation between the first electronic component (5) and the second electronic component (13).

[0177] A high-frequency module (100A; 100D; 100E; 100G; 100H) according to a fourteenth aspect is any one of the eighth to tenth aspects and further includes a controller (11) that controls the power amplifier (3). The controller (11) is disposed on a second main surface (102) of the mounting substrate (1) that faces the first main surface (101), which is the main surface (101). In a plan view from the thickness direction (D1) of the mounting substrate (1), the power amplifier (3) and the controller (11) overlap.

[0178] According to this aspect, it is possible to achieve miniaturization.

[0179] In the high-frequency module (100A; 100D; 100E; 100G; 100H) according to the fifteenth aspect, in the fourteenth aspect, some of the conductor members (4) overlap with a portion of the controller (11) when viewed in a plan view from the thickness direction (D1) of the mounting board (1).

[0180] According to this embodiment, the length of the wiring between the power amplifier (3) and the controller (11) can be easily shortened.

[0181] A communication device (300) according to a sixteenth aspect includes a high-frequency module (100; 100A; 100B; 100C; 100D; 100E; 100F; 100G; 100H; 100I) according to any one of the first to fifteenth aspects, and a signal processing circuit (301). The signal processing circuit (301) is connected to the high-frequency module (100; 100A; 100B; 100C; 100D; 100E; 100F; 100G; 100H; 100I).

[0182] According to this aspect, it is possible to achieve both a low profile and a small size. [Explanation of symbols]

[0183] 1 Mounting board 101 First main surface 102 Second main surface 103 Outer surface 104 Ground Layer 2. Outer shield layer 21 First Shield Section 22 Second shield section 3. Power Amplifier 31 First main surface 32 Second main surface 33 Outer surface 34 terminal (1st terminal) 4 Conductive member (first conductive member) 45 Ground conductor member 40 Bonding Wire 410 First metal member 411 Top plate 414 Legs 5 Electronic Components (First Electronic Components) 51 Main Surface 53 Outer surface 7. Transformer 71 First Coil 72 Second coil 8 Resin layer 801 Main surface 803 Outer surface 81 1st resin layer 811 Main surface 82 Second resin layer 9 Rewiring section (1st rewiring section) 90 2nd rewiring section 91 Pad 94 Wiring section 11 Controller 111 Third main surface 112 Fourth main surface 113 Outer surface 114 2nd terminal 12 Second conductive member 120 Second metal member 121 Top plate 124 Legs 128 Bonding Wire 13 Secondary Electronic Components 131 Main Surface 133 Outer surface 14 Output matching circuit 15 Duplexer 151 Outbound Filter 152 Receive Filter 16 Low-noise amplifier 17 Input matching circuit 18 Matching circuit 191 1st power supply circuit 192 2nd power supply circuit 100, 100A, 100B, 100C, 100D, 100E, 100F, 100H, 100I High-frequency modules 300 Communication Equipment 301 Signal Processing Circuit 302 RF signal processing circuit 303 Baseband signal processing circuit 310 Antenna C1 First capacitor C2 Second capacitor D1 thickness direction T0 external connection terminal T1 antenna terminal T2 signal input terminal T3 signal output terminal T4 control terminal T5 power terminal T6 Ground Terminal H3 Thickness H11 Thickness

Claims

1. a mounting substrate having a main surface; an outer shield layer including a first shield portion spaced apart from the main surface of the mounting substrate in a thickness direction of the mounting substrate, and a second shield portion connected to the first shield portion and covering at least a portion of an outer peripheral surface of the mounting substrate; a power amplifier having a first main surface and a second main surface, the power amplifier being spaced apart from the main surface of the mounting substrate in the thickness direction of the mounting substrate, the second main surface being in contact with the first shield portion; a plurality of conductor members that connect the power amplifier and the mounting board, have a length greater than a thickness of the power amplifier, and are spaced apart from each other; High frequency module.

2. the power amplifier has a plurality of terminals to which the plurality of conductor members are connected, the plurality of terminals face the main surface of the mounting substrate; The high frequency module according to claim 1 .

3. each of the plurality of conductor members is a linear wire, the plurality of conductor members correspond one-to-one to the plurality of terminals, Each of the plurality of conductor members is connected to a corresponding one of the plurality of terminals. The high frequency module according to claim 2 .

4. an electronic component disposed on the main surface of the mounting board and positioned between the mounting board and the power amplifier in the thickness direction of the mounting board; the power amplifier is spaced apart from the electronic component in the thickness direction of the mounting board; 4. The high frequency module according to claim 2.

5. the electronic component is a matching element or a transformer connected to an output terminal of the power amplifier; The high frequency module according to claim 4 .

6. a transformer connected to an output terminal included in the plurality of terminals of the power amplifier; the mounting substrate has a second main surface different from the first main surface, the electronic component is a matching element connected to the output terminal of the power amplifier, the transformer is disposed within the mounting substrate or on the second main surface of the mounting substrate; The high frequency module according to claim 4 .

7. the transformer overlaps with the power amplifier in a plan view in the thickness direction of the mounting board. The high frequency module according to claim 6.

8. a resin layer disposed on the main surface of the mounting substrate; the resin layer covers the electronic components, the first main surface of the power amplifier, an outer peripheral surface of the power amplifier, and the plurality of conductor members; the second main surface of the power amplifier is exposed from the resin layer and is in contact with the first shield part. The high frequency module according to claim 4 .

9. a plurality of rewiring portions connecting the plurality of conductor members and the plurality of terminals; The resin layer is a first resin layer having a main surface and positioned between the main surface of the mounting substrate and the power amplifier; a second resin layer laminated on the first resin layer, the plurality of rewiring portions are disposed on the main surface of the first resin layer, the second resin layer covers the plurality of rewiring portions and an outer peripheral surface of the power amplifier, the second main surface of the power amplifier is exposed from the second resin layer and is in contact with the first shield part. The high frequency module according to claim 8 .

10. each of the plurality of rewiring portions has a pad to which a corresponding one of the plurality of conductor members is connected; In a plan view in the thickness direction of the mounting board, the pad of each of the plurality of conductor members has a larger connection area with a conductor member of the plurality of conductor members that is connected to the pad. The high frequency module according to claim 9 .

11. a controller for controlling the power amplifier; a plurality of second conductor members that are different from the plurality of first conductor members and connect the controller and the mounting board; The controller a third main surface and a fourth main surface facing each other, and a plurality of second terminals different from the plurality of first terminals, the fourth main surface is spaced apart from the main surface of the mounting substrate in the thickness direction of the mounting substrate and is in contact with the first shield portion; The high frequency module according to claim 9 .

12. a wiring portion disposed on a main surface of the first resin layer and connecting the power amplifier and the controller; The high frequency module according to claim 11.

13. a second electronic component disposed on the main surface of the mounting substrate and adjacent to the first electronic component, the resin layer covers the second electronic component, the mounting board includes a ground layer; the plurality of conductor members include a ground conductor member connected to the ground layer, the ground conductor member is located between the first electronic component and the second electronic component in a plan view in the thickness direction of the mounting board. The high frequency module according to claim 8 .

14. Further comprising a controller for controlling the power amplifier, the controller is disposed on a second main surface of the mounting substrate that faces the first main surface, the power amplifier and the controller overlap each other in a plan view from the thickness direction of the mounting board. The high frequency module according to claim 8 .

15. some of the plurality of conductor members overlap with a portion of the controller in a plan view in the thickness direction of the mounting board; The high frequency module according to claim 14.

16. a high-frequency module according to any one of claims 1 to 3; a signal processing circuit connected to the high-frequency module. Communication equipment.

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