Resin supply device, resin molding device, and method for manufacturing resin molded product

Abstract

To provide a resin supply device, a resin molding device, and a method for manufacturing a resin molded product, which are capable of suppressing the flowing of a resin during compression molding.SOLUTION: A resin supply device comprises: a first tray on which a resin material is placed; a second tray smaller than the first tray, on which the resin material is placed; a tray conveying unit that conveys the second tray onto the first tray; a resin supplying unit that supplies a resin material to the second tray; and a control unit. The control unit executes: a first step of the resin supply unit scattering the resin material onto the second tray; a second step of the resin supply unit scattering the resin material so as to overlap the outer edge of the resin material scattered in the first step; and a third step of transporting the second tray to the first tray, and placing the resin material onto the second tray in an area of the first tray where the resin material is not placed. The resin supply device is configured to arrange the resin material on the first tray by repeating the first to third steps.SELECTED DRAWING: Figure 10E

Description

[Technical Field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a resin molding method for wafer-level packages, which involves spraying resin material even in areas where no chips are placed, in order to prevent areas from being unfilled with resin. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 2022 / 115247 Summary of the Invention [Problem to be solved by the invention]

[0004] Among the panels that are subjected to resin molding by compression, there are large panels that are intended to be cut into multiple panels. In such large panels, multiple regions (hereinafter referred to as islands) containing multiple electronic components are formed in advance, with gaps between adjacent islands. After resin molding, the gaps between the islands are cut to divide the panel into multiple panels.

[0005] However, during resin molding, the molten resin tends to flow into the gaps between the islands, which can cause the electronic components to detach from the panel. The present invention has been made to solve this problem, and aims to provide a resin supply device, a resin molding device, and a method for manufacturing a resin molded product that can prevent the electronic components from detaching due to the flow of resin during compression molding. [Means for solving the problem]

[0006] The resin supplying device of the present invention is a resin supplying device for supplying resin material to a molding die that molds resin onto a substrate by compression molding, and comprises: a first tray on which the resin material is placed; at least one second tray that is smaller than the first tray and on which the resin material is placed; a tray transporting unit that transports the second tray onto the first tray; a resin supplying unit that supplies resin material to the second tray; and a control unit.The control unit is configured to perform the following steps: a first step of spraying the resin material onto the second tray using the resin supplying unit; a second step of spraying the resin material so that it overlaps the outer edge of the resin material sprayed in the first step using the resin supplying unit; and a third step of transporting the second tray to the first tray and placing the resin material on the second tray in an area of ​​the first tray where the resin material has not been placed, and to place the resin material on the first tray by repeating the first to third steps.

[0007] The resin supplying method of the present invention is a resin supplying method for supplying a resin material to a molding die that molds resin onto a substrate by compression molding, and includes a first step of preparing a first tray and a second tray smaller than the first tray, a second step of spreading resin material onto the second tray, a third step of spreading the resin material so that it overlaps the outer edge of the resin material spread in the first step, and a fourth step of transporting the second tray to the first tray and placing the resin material on the second tray in an area of ​​the first tray where the resin material has not been placed, and the resin material is placed on the first tray by repeating the second to fourth steps.

[0008] The method for manufacturing a resin molded product according to the present invention includes the steps of preparing a substrate comprising a carrier and a plurality of electronic components fixed on the carrier by temporary fixing material, with a plurality of islands containing the plurality of electronic components arranged with gaps on the carrier; supplying resin material to the first tray by the resin supply method described above; placing the resin material from the first tray in a molding mold; placing the substrate in the molding mold; and molding the resin material onto the substrate by compression molding in the molding mold. [Effects of the Invention]

[0009] According to the present invention, it is possible to prevent the electronic component from coming off due to the flow of resin during compression molding. [Brief explanation of the drawings]

[0010] [Figure 1A] FIG. 2 is a plan view of a panel on which electronic components are mounted. [Figure 1B] FIG. 1B is a cross-sectional view of FIG. 1A. [Figure 2A] FIG. 2 is a plan view of the panel after resin molding. [Figure 2B] FIG. 2B is a cross-sectional view of FIG. 2A. [Figure 3] FIG. 2 is a plan view showing an outline of a resin molding device. [Figure 4] FIG. 2 is a plan view showing an outline of a resin supply module. [Figure 5] FIG. 2 is a front view of a resin supply module provided with a resin material supply device. [Figure 6] FIG. [Figure 7] FIG. 7 is a side view of FIG. [Figure 8] FIG. 2 is a side cross-sectional view showing the configuration of a small tray and a large tray. [Figure 9A] FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 9B] FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 9C]FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 9D] FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 9E] FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 9F] FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 9G] FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 9H] FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 9I] FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 9J] FIG. 10 is a plan view showing a method for supplying a resin material to a small tray. [Figure 10A] FIG. 10 is a plan view showing a method of supplying resin material from a small tray to a large tray. [Figure 10B] FIG. 10 is a plan view showing a method of supplying resin material from a small tray to a large tray. [Figure 10C] FIG. 10 is a plan view showing a method of supplying resin material from a small tray to a large tray. [Figure 10D] FIG. 10 is a plan view showing a method of supplying resin material from a small tray to a large tray. [Figure 10E] FIG. 10 is a plan view showing a method of supplying resin material from a small tray to a large tray. [Figure 11A] FIG. [Figure 11B] FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] An embodiment of a resin molding apparatus according to the present invention will be described below with reference to the drawings. First, a panel (substrate) formed by the resin molding apparatus will be described, followed by a description of the resin molding apparatus for molding resin onto the panel. For ease of explanation, the following description will be given according to the directions indicated in the drawings, but the present invention is not limited to these directions.

[0012] <1. Panel> Fig. 1A is a plan view of a panel to be resin-molded, and Fig. 1B is a cross-sectional view of Fig. 1A. As shown in Figs. 1A and 1B, this panel P has a rectangular panel carrier 81 made of glass or the like, a rectangular double-sided tape 82 fixed on this panel carrier 81, and a plurality of electronic components 83, such as semiconductor chips, arranged on the double-sided tape 82. Four rectangular islands 83A-83D are formed on the double-sided tape 82, and a plurality of electronic components 83 are arranged at predetermined intervals in the vertical and horizontal directions in each island 83A-83D. For ease of explanation, the four islands will be referred to below as a first island 83A, a second island 83B, a third island 83C, and a fourth island 83D.

[0013] The first island 83A and the second island 83B are arranged side by side in the horizontal direction, with a gap 85 extending vertically therebetween. Similarly, the third island 83C and the fourth island 83D are arranged side by side in the horizontal direction, with a gap 85 extending vertically therebetween. Furthermore, a gap 86 extending horizontally is formed between the first island 83A and the third island 83C, and between the second island 83B and the fourth island 83D. That is, in this embodiment, the four islands 83A to 83D are arranged with cross-shaped gaps 85, 86 interposed therebetween. Furthermore, a gap 87 is formed around the outer peripheries of the four islands 83A to 83D. That is, a frame-shaped gap 87 is formed between the outer edge of the double-sided tape 82 and the four islands 83A to 83D.

[0014] In this embodiment, it is assumed to use a relatively large panel P. For example, the panel P is formed in the shape of a rectangular plate with one side measuring 450 mm or more, 500 mm or more, or 600 mm or more.

[0015] In this embodiment, a resin material is molded onto the panel P configured as described above. FIG. 2A is a plan view of the panel molded with the resin material, and FIG. 2B is a cross-sectional view of FIG. 2A. As shown in FIGS. 2A and 2B, a resin material having a rectangular shape in plan view is molded onto the panel P so as to cover all of the electronic components. The panel P molded with resin in this way corresponds to a resin molded product.

[0016] <2.Resin molding equipment> The resin molding apparatus 1 according to this embodiment is an apparatus for resin-sealing the electronic components 83 on the panel P described above and manufacturing a resin molded product. In particular, this embodiment illustrates a resin molding apparatus 1 that employs a compression molding method (compression method) in which a resin material in a cavity is compressed and molded, as will be described later. Note that this embodiment assumes the use of a granular resin material, but the resin material can be in any form, such as powder or liquid, in addition to granular form.

[0017] Fig. 3 is a schematic diagram of a resin molding apparatus. As shown in Fig. 3, this resin molding apparatus 1 has, as its components, a substrate loading / unloading module 10, a substrate transfer module 20, a molding module 30, a resin supply module (resin supply device) 40, and a control unit 50. Each component is detachable and replaceable with respect to the other components. Each component will be described below.

[0018] <2-1. Circuit board loading / unloading module> The substrate loading / unloading module 10 is a module that unloads the panel P before resin molding and loads the panel P after resin molding. The substrate loading / unloading module 10 mainly includes a loading section 11, an unloading section 12, an inspection section 13, and an arm mechanism 14.

[0019] The loading section 11 is a section where the panel P is placed before being resin molded, and the unloading section 12 is a section where the panel P is placed after being resin molded. The loading section 11 and the unloading section 12 can each accommodate a plurality of panels P.

[0020] The inspection unit 13 is a part that inspects the panel P after resin molding. The inspection unit 13 includes a placement unit (not shown) on which the panel P after resin molding is placed, an inspection mechanism (not shown) that inspects the panel P, and the like.

[0021] The arm mechanism 14 is a mechanism for moving the panel P. The arm mechanism 14 includes a suction hand unit 14a that suctions the panel P, an arm unit 14b to which the suction hand unit 14a is attached, and a drive unit 14c that appropriately rotates and moves the arm unit 14b.

[0022] <2-2. Substrate Transfer Module> The substrate transfer module 20 is a module that transfers the panel P between the substrate load / unload module 10 and a molding module 30 (described later). The substrate transfer module 20 mainly includes a loader 21 and an unloader 22.

[0023] The loader 21 receives the panel P before resin sealing from the arm mechanism 14 and transports it to a molding die 31 of a molding module 30, which will be described later. The unloader 22 receives the panel P after resin molding from the molding die 31, which will be described later, and transports it to the substrate load / unload module 10. The loader 21 and unloader 22 can move along rails L that extend in the left-right direction. In this embodiment, the loader 21 and unloader 22 are connected to each other so that they can move together.

[0024] <2-3. Molding module> The molding module 30 is a module that resin-seals electronic components mounted on the panel P using a resin material supplied from a resin supply module 40, which will be described later. In this embodiment, two molding modules 30 are arranged side by side. The two molding modules 30 can perform resin sealing of the panel P in parallel, thereby improving the manufacturing efficiency of resin molded products. The molding module 30 mainly includes a molding die 31, a mold clamping mechanism (not shown), etc.

[0025] The molding die 31 performs compression molding on the panel P using molten resin material. The molding die 31 has a pair of upper and lower dies (upper and lower dies), and a concave cavity (not shown) for accommodating the resin material is formed in the lower die. Meanwhile, the upper die holds the panel P before resin molding, with the electronic components facing the cavity side. The molding die 31 is also provided with a heater (not shown) for melting the resin material.

[0026] <2-4. Molding module> The control unit 50 is configured to control the operation of each module of the resin molding apparatus 1. The control unit 50 controls the operations of the substrate load / unload module 10, the substrate transfer module 20, the molding module 30, and a resin supply module 40 (described later). The control unit 50 can also be used to arbitrarily change (adjust) the operation of each module.

[0027] <3. Resin supply module> The resin supply module 40 will be described in detail below. Fig. 4 is a schematic plan view of the resin supply module 40. The resin supply module 40 is a module for supplying resin material to the molding die 31 of the molding module 30. As shown in Figs. 3 and 4, the resin supply module 40 mainly includes two resin material supply devices 100, four small trays (second trays) 411-414, a small tray transport mechanism (not shown), a dust collection table 43, a large tray (first tray) 44, and a large tray transport mechanism 45.

[0028] A dust collection table 43 is disposed between the two resin material supply devices 100 and the large tray 44. Each of the small trays 411-414 can be moved between the resin material supply devices 100, the dust collection table 42, and the large tray 44 by a small tray transport mechanism. During this movement, each of the small trays 411-414 waits on the dust collection table 43, and dust adhering to the bottom surface of each of the trays 411-414 is collected.

[0029] As will be described later, this resin supply module 40 is configured to use four rectangular small trays 411-414 to supply resin material to one rectangular large tray 44. In other words, the resin material placed on the small trays 411-414 is supplied to the large tray 44. Therefore, the size of each of the small trays 411-414 is approximately 1 / 4 the size of the large tray. For ease of explanation, the small trays will be referred to as the first to fourth small trays 411-414 below. Each component will be described in detail below.

[0030] <3-1. Resin material supply device> Fig. 5 is a front view of a resin material supplying device arranged in a resin supplying module. As shown in Fig. 5, two resin material supplying devices 100 are arranged side by side on the left and right within the housing 40a of the resin supplying module 40. The two resin material supplying devices 100 have roughly the same configuration, except that they are arranged roughly symmetrically on the left and right. Therefore, the configuration of one (right) resin material supplying device 100 will be described in detail below, and a description of the configuration of the other (left) resin material supplying device 100 will be omitted.

[0031] Each resin material supplying apparatus 100 is provided with two troughs 130. For ease of explanation, the troughs provided in one of the resin material supplying apparatuses 100 will be referred to as the first trough 130A and the second trough 130B below. The troughs provided in the other of the resin material supplying apparatuses 100 will be referred to as the third trough 130C and the fourth trough 130D below. As shown in FIG. 4, the first trough 130A and the second trough 130B supply resin material to the first small tray 411 and the third small tray 413, respectively. Meanwhile, the third trough 130C and the fourth trough 130D supply resin material to the second small tray 412 and the fourth small tray 414, respectively.

[0032] Fig. 6 is a front view of the resin material supplying apparatus, and Fig. 7 is a side view of Fig. 6. As shown in Fig. 6 and Fig. 7, the resin material supplying apparatus 100 mainly includes a stocker 110, a first vibration unit 120, two troughs 130A and 130B, a second vibration unit 140, a weighing scale 150, and a distributor 160. In Fig. 6 and Fig. 7, the resin material stored in the stocker 110 and the troughs 130A and 130B is shown in gray.

[0033] The stocker 110 stores the resin material and supplies the resin material to a trough 130 (described later). The stocker 110 mainly includes a storage section 111 and a supply section 112.

[0034] The container 111 has an opening at the top and an internal space for containing a resin material, and the resin material is supplied (replenished) at a predetermined timing.

[0035] The supply unit 112 is a part that supplies the resin material stored in the storage unit 111 to the troughs 130A and 130B. The supply unit 112 is formed hollow so that the resin material can move inside. The supply unit 112 extends from the lower part of one side of the storage unit 111 to above the distributor 160, which will be described later. A supply port 112a is provided near the tip (left end) of the supply unit 112 to discharge the resin material inside the supply unit 112 downward.

[0036] First vibration unit 120 is used to discharge the resin material from stocker 110. First vibration unit 120 is provided below stocker 110 and vibrates stocker 110. This causes the resin material in storage unit 111 to move to supply unit 112 and be discharged downward from supply port 112a.

[0037] Each of the troughs 130A, 130B has the same structure, stores resin material, and supplies the resin material to each of the small trays 411 to 414. As shown in Fig. 6, the troughs 130 are arranged side by side below the stocker 110 (in plan view, at positions symmetrical on the left and right with respect to the supply port 112a of the stocker 110). Each of the troughs 130A, 130B mainly includes a storage section 131 and a supply section 132.

[0038] The storage section 131 has an opening at the top and an internal space for storing the resin material. The supply section 132 is a section that supplies the resin material stored in the storage section 131 to each of the small trays 411 to 414, and is formed hollow so that the resin material can move inside. The supply section 132 extends in one direction (rearward) from the lower part of one side of the storage section 131, and a supply port 132a is provided near the tip of the supply section 132 for discharging the resin material inside the supply section 132 downward.

[0039] The two troughs 130A, 130B are arranged at positions somewhat close to each other so that they can simultaneously supply resin material to one small tray 41. Specifically, the two troughs 130A, 130B (particularly the supply port 132a) are arranged so that the distance between them in the left-right direction is approximately half the left-right width of the small trays 411-414.

[0040] 7 is used to discharge the resin from each of the troughs 130A, 130B. The second vibration unit 140 is provided below each of the troughs 130A, 130B and vibrates them. This causes the resin material in the storage unit 131 to move toward the supply unit 132 and be discharged downward from the supply port 132a.

[0041] Weighing scale 150 measures the weight of the resin material contained in troughs 130A and 130B. Weighing scale 150 is provided below second vibrating section 140 and can measure the weight of troughs 130A and 130B and second vibrating section 140. Because the weights of troughs 130A and 130B and second vibrating section 140 are known, the weight of the resin material contained in troughs 130A and 130B can be measured by subtracting the weight of trough 130 and second vibrating section 140 from the measurement value of weighing scale 150.

[0042] The distributor 160 is used to distribute the resin material supplied from the stocker 110 to the two troughs 130A and 130B. A rotatable guide plate (not shown) is provided inside the distributor 160, and this guide plate is configured to tilt at a predetermined timing to guide the resin material supplied from the stocker 110 to one of the troughs 130. This allows the resin material to be supplied to the two troughs 130A and 130B by one stocker 110.

[0043] <3-2. Small and large trays> Next, the small trays 411 to 414 and the large tray 44 will be described with reference to Fig. 8. Note that Fig. 8 is a schematic cross-sectional view for explaining the configuration of each member, and the relative positional relationship of each member shown in the figure differs from the actual positional relationship.

[0044] 8, the small tray 41 mainly includes a resin holding portion 41a and a shutter 41b. The resin holding portion 41a is a portion that holds the resin material. The resin holding portion 41a is formed in a substantially square plate shape in a plan view, and has multiple slits 41c extending left and right, lined up front and back.

[0045] The shutter 41b is a part that can close the slits 41c of the resin holding portion 41a from below. The shutter 41b is formed in the shape of a substantially square plate in a plan view. The shutter 41b has slits 41d formed therein that correspond to the slits 41c of the resin holding portion 41a. That is, the slits 41d of the shutter 41b are formed so as to extend left and right and to be lined up front and back. The spacing between the front and back of the slits 41d of the shutter 41b is also formed so as to be the same as the spacing between the front and back of the slits 41c of the resin holding portion 41a. The shutter 41b is disposed immediately below the resin holding portion 41a and can be moved back and forth relative to the resin holding portion 41a by a movement mechanism (not shown).

[0046] As shown in FIG. 8, when the slit 41d of the shutter 41b is not vertically opposed to the slit 41c of the resin holding unit 41a, the slit 41c of the resin holding unit 41a is blocked from below by the shutter 41b. In this state, the resin material can be held on the upper surface of the small tray 41 (specifically, in the slit 41c of the resin holding unit 41a). In addition, by moving the shutter 41b so that the slit 41c of the resin holding unit 41a faces the slit 41d of the shutter 41b, the resin material held in the slit 41c of the resin holding unit 41a can be discharged downward. The resin material discharged from the small tray 41 is supplied to the storage unit 44b of the large tray 44, which will be described later.

[0047] The large tray 44 mainly includes a frame member 44a and a plurality of storage sections 44b. The frame member 44a is a member that supports the storage sections 44b and is formed in a substantially square frame shape in a plan view. That is, the frame member 44a is formed so that it is open substantially at the center in a plan view.

[0048] Each storage section 44b is a portion for storing resin material and is formed in a substantially cylindrical shape. The multiple storage sections 44b are arranged side by side inside (at the opening) of the frame member 44a with their longitudinal directions facing left and right. Both left and right ends of each storage section 44b are supported by the frame member 44a so as to be rotatable about their axes. Grooves 44c capable of storing resin material are formed on the outer peripheral surface of each storage section 44b and extend in the axial direction (longitudinal direction). The front-to-back spacing (pitch) between adjacent storage sections 44b is formed to be the same as the front-to-back spacing (pitch) of the slits 41c of the small tray 41. The storage sections 44b can be rotated at any angle relative to the frame member 44a by a drive mechanism (not shown).

[0049] 8, when the groove 44c of the storage portion 44b faces upward, the resin material can be stored inside the groove 44c. Furthermore, by rotating the storage portion 44b and facing the groove 44c downward, the resin material stored in the groove 44c can be discharged downward.

[0050] Here, the left-right length of the slits 41c of each of the small trays 411-414 is formed to be approximately half the left-right length of the storage section 44b (groove 44c) of the large tray 44. Furthermore, the number of slits 41c of each of the small trays 411-414 is formed to be half the number of storage sections 44b of the large tray 44. In this way, the size of the small trays 411-414 in a plan view is formed to be approximately one-fourth the size of the large tray 44. Therefore, in order to supply resin material to the entire storage section 44b of the large tray 44 using the small trays 411-414, a total of four small trays 411-414 must be used.

[0051] <4. How to supply resin material to the small tray> Next, a method for supplying the resin material from the resin material supplying device 100 to the small trays 411 to 414 will be described.

[0052] First, when the weight scale 150 detects that the weight of the resin material contained in each trough 130A to 130D falls below a predetermined value, the control unit 50 controls the operation of the first vibration unit 120 and the distributor 160, and the resin material is supplied to each trough 130A to 130D.

[0053] That is, when the weight of the resin material contained in each of the troughs 130A to 130D falls below a predetermined value, the resin material contained in the stocker 110 is automatically supplied to the troughs 130A to 130D. As a result, each of the troughs 130A to 130D always contains a resin material with a weight equal to or greater than the predetermined value.

[0054] Next, we will explain the method of supplying resin material to the first small tray 411 by the first trough 130A and the second trough 130B. Note that the method of supplying resin material to the third small tray 413 by the first trough 130A and the second trough 130B and the method of supplying resin material to the second small tray 412 and the fourth small tray 414 by the third trough 130C and the fourth trough 130D are the same, so explanations will be omitted.

[0055] 9A, when the resin material is supplied to the first small tray 411, the small tray transport mechanism moves the first small tray 411 below the first and second troughs 130A, 130B before the resin material is supplied. At this time, the position of the first small tray 411 is adjusted so that the supply ports 132a of the two troughs 130A, 130B are positioned directly above the predetermined start position S.

[0056] Next, the second vibration unit 140 is operated, and the resin material is supplied from each of the supply ports 132a of the two troughs 130A, 130B to the first small tray 411. The operation of the second vibration unit 140 is controlled so that the flow rate (supply weight per unit time) of the resin material supplied from each of the troughs 130A, 130B to the first small tray 411 is approximately constant.

[0057] Simultaneously with the activation of the second vibration unit 140, the first small tray 411 starts to move horizontally. Specifically, the small tray transport mechanism moves the first small tray 411 appropriately back and forth and left and right. The small tray transport mechanism moves the first small tray 411 so that the supply ports 132a of each trough 130A, 130B pass through half (the front half) of the first small tray 411. The small tray transport mechanism also moves the first small tray 411 so that the supply ports 132a of each trough 130A, 130B eventually return to directly above the start position S. FIG. 9A shows an example of the relative movement trajectories of the two troughs 130A, 130B with respect to the first small tray 411. As the supply ports 132a of each trough 130A, 130B pass through this trajectory, the resin material can be sprayed over half of the first small tray 411.

[0058] When the supply ports 132a of the troughs 130A, 130B return to directly above the start position S, the second vibration unit 140 is stopped, and the supply of the resin material from the troughs 130A, 130B to the first small tray 411 is stopped.

[0059] In this way, as shown in FIG. 9B, the resin material is supplied to half (the front half) of the first small tray 411. In FIG. 9, the area to which the resin material has been supplied is shown in gray. Note that the weight of the resin material supplied to the first small tray 411 in one supply of resin material by each trough 130A, 130B (the supply of resin material from when the second vibration unit 140 is activated until it is stopped) is controlled to be a preset target value (target supply amount). Specifically, by appropriately controlling the operation of the second vibration unit 140 and the small tray transport mechanism, the target supply amount of resin material is supplied to the first small tray 411.

[0060] Next, as shown in FIG. 9C, the small tray conveying mechanism reverses the front-to-back orientation of the first small tray 411. Then, resin material is supplied from the two troughs 130A, 130B to the remaining half of the first small tray 411 to which no resin material has been supplied. In this case, too, the first small tray 411 is moved along the movement trajectory shown in FIG. 9A, and resin material is supplied from each of the troughs 130A, 130B to the first small tray 411. As a result, as shown in FIG. 9D, the resin material is distributed over the entire first small tray 411. In this way, when supplying resin material to the first small tray 411, the front-to-back orientation of the first small tray 411 is reversed, and the resin material is supplied in two batches.

[0061] As described above, since the resin material is supplied to the first small tray 411 using the plurality of (two) troughs 130A and 130B, the time required to supply the resin material to the first small tray 411 can be shortened.

[0062] Next, additional resin material is supplied along the outer edge of the first small tray 411. This will be described with reference to FIGS. 9E to 9J. First, as shown in FIG. 9E, the position of the first small tray 411 is adjusted so that the supply ports 132a of the two troughs 130A and 130B are positioned directly above the predetermined start position S. The supply port 132a of the first trough 30A is positioned near the center of the right side of the first small tray 411, and the supply port 132a of the second trough 30B is positioned near the center of the first small tray 411.

[0063] Next, while only the second vibration unit 140 of the first trough 130A is operated, the first small tray 411 is moved forward. As a result, as shown in FIG. 9F, additional resin material D is supplied from near the center of the left side of the first small tray 411 to the rear end of the left side. This additional resin material D is layered on top of the resin material supplied over the entire surface of the first small tray 411. This point remains the same in the subsequent operations.

[0064] Next, the second vibration units 140 of both troughs 130A and 130B are operated, and the first small tray 411 is moved to the left, thereby supplying additional resin material D along the rear edge of the first small tray 411, as shown in FIG. 9G.

[0065] Next, while only the second vibration unit 140 of the second trough 130B is operated, the first small tray 411 is moved rearward. As a result, as shown in Fig. 9H, additional resin material D is supplied from the rear end of the right side of the first small tray 411 to near the center of the right side. In this way, the additional resin material D is supplied to half of the outer edge of the first small tray 411.

[0066] Following this, as shown in Fig. 9I, the small tray transport mechanism reverses the front-to-back orientation of the first small tray 411. Then, additional resin material D is supplied from the two troughs 130A, 130B to the outer edge of the remaining half of the first small tray 411 to which additional resin material D has not been supplied, in the procedure shown in Figs. 9E to 9H. As a result, as shown in Fig. 9J, additional resin material D is layered all around the outer edge of the resin material arranged on the entire surface of the first small tray 411.

[0067] As described above, while the resin material is being supplied to the first small tray 411, the third and fourth troughs 130C and 130D also supply the resin material to the second small tray 412. Therefore, the resin material as shown in FIG. 9J is also placed on the second small tray 412.

[0068] <5. How to supply resin material from small tray to large tray> Next, a method for supplying resin material from a small tray to a large tray will be described with reference to FIGS. 10A to 10E. As shown in FIG. 10A, in the initial state, the first small tray 411 and the second small tray 412 are disposed on the resin material supplying device 100 side, and the third small tray 413 and the fourth small tray 414 are disposed on the dust collection table 43. After the resin material is placed on the first small tray 411 and the second small tray 412, the small tray transport mechanism moves the first small tray 411 and the second small tray 412 above the large tray 44. As shown in FIG. 10B, the first small tray 411 is moved to the right front side of the large tray 44, and the second small tray 412 is moved to the left front side of the large tray 44. Then, as shown in FIG. 8, the shutter 41b is moved horizontally to discharge the resin material held in the slit 41c downward. This allows the resin material to be supplied to the grooves 44c of each storage section 44b of the large tray 44. In this way, the resin material is supplied to the front half of the large tray 44.

[0069] At this time, the third small tray 413 and the fourth small tray 414 are moved to the resin material supplying device 100 side.

[0070] 10C, after the resin material has been supplied to the large tray 44, the first small tray 411 and the second small tray 412 are moved onto the dust collection table 43. Then, dust adhering to the bottom surfaces of the small trays 411 and 412 is collected on the dust collection table 43.

[0071] Subsequently, as shown in Fig. 10D, the resin material supplying device 100 supplies the resin material to the third small tray 413 and the fourth small tray 414. This procedure is as shown in Figs. 9A to 9J.

[0072] Following this, as shown in FIG. 10E, the small tray transport mechanism moves the third small tray 413 and the fourth small tray 414 above the large tray 44. At this time, the third small tray 413 is moved to the right rear side of the large tray 44, and the fourth small tray 414 is moved to the left rear side of the large tray 44. Then, the resin material held in the third small tray 413 and the fourth small tray 414 is supplied to the large tray 44. In this way, the resin material is supplied to the rear half of the large tray 44. As a result, the resin material is distributed over the entire large tray 44.

[0073] At this time, the resin material is placed over the entire surface of the large tray 44, and additional resin material D is placed in a cross-shaped area passing through the center of the large tray 44 and around the entire outer edge of the large tray 44. The positions where the additional resin material D is placed correspond to the gaps 85 to 87 on the panel shown in FIG.

[0074] <6. Molding process in molding module and subsequent processes> Once the resin material has been placed on the large tray 44 as described above, the loader 21 moves along the rail L and transports the panel P to one of the molding modules 30. As shown in FIG. 11A, the panel P transported to the molding module 30 is adsorbed and held by the upper mold 311 of the molding mold 31.

[0075] Next, a release film (not shown) is placed so as to cover cavity 313 of lower die 312 of molding die 31.

[0076] Next, the large tray transport mechanism 45 moves along the rail L, transporting the large tray 44 holding the resin material to the molding die 31 of the molding module 30. Then, as shown in Fig. 11A, the resin material on the large tray 44 is supplied to the cavity 313 of the lower die 312. After supplying the resin material to the molding die 31, the large tray transport mechanism 45 returns to the resin supply module 40.

[0077] Following this, the resin material is melted by the heater of the molding die 31. Thereafter, as shown in FIG. 11B, the clamping mechanism brings the lower die 312 and the upper die 311 closer to each other (clamps them), and the electronic components 83 of the panel P are immersed in the molten resin material. In this state, an appropriate amount of pressure is applied to the resin material. Then, the resin material hardens, thereby obtaining the panel P in which the electronic components are resin-encapsulated.

[0078] Next, the lower mold 312 and the upper mold 311 are separated from each other (the molds are opened) by the mold clamping mechanism. Furthermore, the unloader 22 moves along the rails L and receives the resin-molded panel P from the molding mold 31. At this time, the loader 21, which has moved together with the unloader 22, can place a new panel P before resin molding into the molding mold 31. The unloader 22 then moves along the rails L and returns to the substrate transfer module 20.

[0079] Subsequently, the panel P held by the unloader 22 is transported by the arm mechanism 14 to the inspection unit 13. In the inspection unit 13, the panel P after resin molding is inspected.

[0080] After the inspection, the panel P is transported to the discharge section 12 by the arm mechanism 14. The panel P placed in the discharge section 12 is then transported to the outside as appropriate.

[0081] <7. Features> In the above-described panel, gaps 85 to 87 are formed between adjacent islands 83A to 83D and around the outer peripheries of islands 83A to 83D, and therefore, when resin molding is performed by compression, molten resin flows into the above-described gaps 85 to 87. This flow causes a problem in that electronic components may come off the panel.

[0082] 11A, in this embodiment, additional resin material D is laminated in the resin material placed in cavity 313 of lower mold 312 at portions corresponding to gaps 85 to 87. Therefore, additional resin material D prevents the resin from flowing into gaps 85 to 87, thereby preventing electronic component 83 from coming off.

[0083] <8. Variations> Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention. For example, the following modifications are possible. Furthermore, the gist of the following modifications can be combined as appropriate.

[0084] (1) The components (such as the substrate loading / unloading module 10) used in the resin molding apparatus 1 of the above embodiment are examples and can be attached, detached, or replaced as appropriate. For example, it is also possible to manually load and unload the panel P without providing the substrate loading / unloading module 10.

[0085] (2) In the above embodiment, the large tray is formed to be four times the size of the small tray, and the resin material is placed on the large tray by supplying it four times using the small tray, but this is not limited to this. For example, the large tray can be formed to be twice the size of the small tray, and the resin material can be placed on the large tray by supplying it twice using the small tray. In other words, the large tray can be formed to be n times the size of the small tray (n is a natural number greater than or equal to 2), and the resin material can be placed over the entire surface of the large tray by supplying it n times using the small tray.

[0086] (3) The configurations of the small tray 41 and the large tray 44 shown in the above embodiment are merely examples, and the method of supplying and holding the resin material can be changed as appropriate.

[0087] (4) In the above embodiment, a resin material supply device 100 having two troughs 130 (resin supply sections) was exemplified, but the present invention is not limited to this and may have one or three or more troughs 130.

[0088] (5) The resin molding apparatus 1 according to the above embodiment is equipped with two resin material supply devices 100, but the present invention is not limited to this and may be equipped with one, or three or more resin material supply devices 100.

[0089] (6) In addition, in this embodiment, the operation of each module is controlled by a single control unit 50, but the present invention is not limited to this, and it is also possible to provide multiple control units 50. For example, it is also possible to provide a control unit 50 for each module or device, and to control the operation of each module individually while linking them together. [Explanation of symbols]

[0090] 1:Resin molding equipment 30: Molding module 31: Molding mold 40: Resin supply module 50: Control unit 83: Electronic parts 83A~83D: Island 85~87: Gap 411~414: Small tray (second tray) 43: Large tray (1st tray)

Claims

1. A resin supplying device for supplying a resin material to a molding die that molds a resin onto a substrate by compression molding, a first tray on which the resin material is placed; at least one second tray smaller than the first tray and on which the resin material is placed; a tray conveying unit that conveys the second tray onto the first tray; at least one resin supply unit that supplies a resin material to the second tray; A control unit; Equipped with The control unit a first step of scattering the resin material onto the second tray by the resin supply unit; a second step of scattering the resin material by the resin supply unit so as to overlap the outer edge of the resin material scattered in the first step; a third step of transporting the second tray to the first tray and placing the resin material on the second tray in an area of ​​the first tray where the resin material is not placed; Run The resin supplying device is configured to arrange the resin material on the first tray by repeating the first to third steps.

2. two or more of the second trays; The resin supplying device according to claim 1 , wherein the resin material is supplied to each of the second trays by a plurality of the resin supplying sections.

3. the second tray has a first area on the resin supply unit side and a second area on the opposite side to the first area, The control unit A resin supply device as described in claim 1 or 2, wherein in the first step and the second step, after the resin material is sprayed onto the first area of ​​the second tray, the second area of ​​the second tray is rotated so that it faces the resin supply section, and the resin material is supplied to the second area.

4. The first tray and the second tray are formed in a rectangular shape, The first tray is formed to be four times larger than the second tray, 3. The resin supplying device according to claim 1, wherein the first tray is divided into four regions vertically and horizontally, and the resin material conveyed by the second tray is supplied to each of the four regions.

5. The substrate is Career and a plurality of electronic components fixed on the carrier by temporary fixing materials; Equipped with a plurality of islands each including a plurality of electronic components are arranged on the carrier with gaps between them; the resin material is disposed in the molding die so as to face the substrate; The resin supplying device according to claim 1 , wherein the additional resin material is disposed at a position corresponding to the gap of the substrate.

6. a molding module having a molding die for compression molding; a resin supply module including the resin supply device according to claim 1 or 2, which supplies the resin material from the first tray to a molding die of the molding module; A resin molding device comprising:

7. A resin supplying method for supplying a resin material to a molding die that molds a resin onto a substrate by compression molding, comprising: a first step of preparing a first tray and a second tray smaller than the first tray; a second step of scattering a resin material onto the second tray; a third step of scattering the resin material so as to overlap the outer edge of the resin material scattered in the first step; a fourth step of transporting the second tray to the first tray and placing the resin material on the second tray in an area of ​​the first tray where the resin material is not placed; Equipped with The resin supplying method further comprises repeating the second to fourth steps to place the resin material on the first tray.

8. preparing a substrate including a carrier and a plurality of electronic components fixed on the carrier by a temporary fixing material, wherein a plurality of islands each including a plurality of electronic components are arranged on the carrier with gaps therebetween; supplying a resin material to the first tray by the resin supplying method according to claim 7; placing the first tray of resin material in a mold; placing the substrate in the mold; molding the resin material onto the substrate by compression molding in the molding die; A method for manufacturing a resin molded product, comprising:

Images