Electronic device

Abstract

To provide an electronic device in which cracks are unlikely to occur in a laminate.SOLUTION: An electronic device includes a frame 10 having at least one opening 11, a laminate 20 having an electrode film and at least one functional film laminated on the electrode film, and a conductive pattern 30 electrically connected to the laminate 20. The laminate 20 includes a first laminate that does not overlap with the frame 10 when viewed from the stacking direction of the laminate 20, and the first laminate is connected to the frame 10 via at least the conductive pattern 30.SELECTED DRAWING: Figure 2A

Description

[Technical Field]

[0001] The present disclosure relates to an electronic device that can be used as an antenna or the like. [Background technology]

[0002] Known examples of functional materials capable of converting mechanical energy into electrical (magnetic) energy include piezoelectric materials and magnetostrictive materials. Piezoelectric materials are materials that exhibit the piezoelectric effect, converting external forces into electrical power in response to the application of external forces. Magnetostrictive materials are materials that exhibit the magnetostrictive effect, converting external magnetic fields into distortion in response to the application of external magnetic fields. These functional materials are made into thin films and incorporated into electronic devices such as pressure sensors, magnetic sensors, antennas, and energy conversion devices.

[0003] For example, in the electronic device of Patent Document 1, a thin film made of a functional material (hereinafter referred to as a functional film) is laminated on a conductive electrode film to form a laminate together with the electrode film. The laminate is placed in a frame with an opening and forms a vibrating body that can vibrate based on the piezoelectric effect and the magnetostrictive effect. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2021-64733 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when tensile stress occurs in the laminate due to distortion or residual stress, there is a risk of cracks occurring in the laminate, and there is a need for a technology to prevent this.

[0006] The present disclosure provides an electronic device in which cracks are less likely to occur in the laminate. [Means for solving the problem]

[0007] An electronic device according to an embodiment of the present disclosure includes: a frame having at least one opening; a laminate having an electrode film and at least one functional film laminated on the electrode film; a conductive pattern electrically connected to the laminate, the stack includes a first stack that does not overlap with the frame when viewed from a stacking direction of the stack, The first laminate is connected to the frame at least via the conductive pattern.

[0008] The laminate may have at least one of a piezoelectric film and a magnetostrictive film as the at least one functional film.

[0009] The laminate may have, as at least one of the functional films, the piezoelectric film and the magnetostrictive film, and the electrode film, the piezoelectric film, and the magnetostrictive film may be laminated in this order.

[0010] The laminate may be made up of a plurality of the laminates, the plurality of laminates being arranged in a first direction perpendicular to the stacking direction, and the conductive pattern may bridge between the plurality of the laminates in the first direction.

[0011] A gap may be formed between the plurality of laminates in the first direction, and the gap may be located at a position that does not overlap the conductive pattern when viewed from the stacking direction.

[0012] The frame may not be disposed between the plurality of stacks in the first direction.

[0013] The frame may have an inner frame portion in the first direction that is located between the plurality of laminates when viewed from the stacking direction, and at least a portion of the conductive pattern overlaps with the inner frame portion when viewed from the stacking direction, and a gap is formed between the plurality of laminates and the inner frame portion, and the gap may be located in a position that does not overlap with the conductive pattern when viewed from the stacking direction.

[0014] The conductive pattern may be made up of a plurality of the conductive patterns, the laminate may be made up of a plurality of laminates, the plurality of laminates may be arranged in a first direction perpendicular to the stacking direction and a second direction perpendicular to the stacking direction and the first direction, and the plurality of laminates arranged in the first direction may be electrically connected in series by at least one of the conductive patterns so that the plurality of laminates form a plurality of series circuits, and the plurality of series circuits may be electrically connected in parallel.

[0015] A gap may be formed between the plurality of laminated bodies in the first direction, and the gap may be located at a position that does not overlap with the plurality of conductive patterns when viewed from the stacking direction.

[0016] The frame may not be disposed between the plurality of stacks in the first direction.

[0017] The frame may have a plurality of inner frame portions in the first direction that are located between the plurality of laminates when viewed from the stacking direction, and the plurality of conductive patterns may at least partially overlap with the plurality of inner frame portions when viewed from the stacking direction, and gaps may be formed between the plurality of laminates and the plurality of inner frame portions, and the gaps may be located in positions that do not overlap with the plurality of conductive patterns when viewed from the stacking direction.

[0018] The frame may have a plurality of inner frame portions in the second direction that are located between the plurality of laminates when viewed from the stacking direction, and the plurality of conductive patterns may at least partially overlap with the plurality of inner frame portions when viewed from the stacking direction, and gaps may be formed between the plurality of laminates and the plurality of inner frame portions, and the gaps may be located in positions that do not overlap with the plurality of conductive patterns when viewed from the stacking direction.

[0019] The conductive pattern may be made up of a plurality of the conductive patterns, the laminate may be made up of a plurality of laminates, the plurality of laminates may be arranged in a first direction perpendicular to the stacking direction and a second direction perpendicular to the stacking direction and the first direction, the plurality of laminates arranged in the second direction may be electrically connected in parallel by the plurality of the conductive patterns so that the plurality of laminates form a plurality of parallel circuits, and the plurality of parallel circuits may be electrically connected in series.

[0020] A gap may be formed between the plurality of laminates in the second direction, and the gap may be located at a position that does not overlap with the plurality of conductive patterns when viewed from the stacking direction.

[0021] The frame may not be disposed between the plurality of stacks in the second direction.

[0022] The frame may have a plurality of inner frame portions in the second direction that are located between the plurality of laminates when viewed from the stacking direction, and the plurality of conductive patterns may at least partially overlap with the plurality of inner frame portions when viewed from the stacking direction, and gaps may be formed between the plurality of laminates and the plurality of inner frame portions, and the gaps may be located in positions that do not overlap with the plurality of conductive patterns when viewed from the stacking direction.

[0023] The conductive pattern may be bent along an in-plane direction of the laminate. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1 is a perspective view of an element used in the electronic device of the first embodiment. [Figure 2A] FIG. 2A is a plan view of the device shown in FIG. [Figure 2B] FIG. 2B is an enlarged plan view of a portion of the element shown in FIG. 2A. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III shown in FIG. 2A. [Figure 4] FIG. 4 is a conceptual diagram showing an example of application of the electronic device of the first embodiment to an electronic device. [Figure 5] FIG. 5 is a plan view of an element used in the electronic device of the second embodiment. [Figure 6] FIG. 6 is a plan view of an element used in the electronic device of the third embodiment. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII shown in FIG. [Figure 8] FIG. 8 is a plan view of an element used in the electronic device of the fourth embodiment. [Figure 9] FIG. 9 is a plan view of an element used in the electronic device of the fifth embodiment. [Figure 10] FIG. 10 is a cross-sectional view taken along the line XX shown in FIG. [Figure 11] FIG. 11 is a plan view of an element used in the electronic device of the sixth embodiment. [Figure 12] FIG. 12 is a plan view of an element used in the electronic device of the seventh embodiment. [Figure 13] FIG. 13 is a plan view of an element used in the electronic device of the eighth embodiment. [Figure 14] FIG. 14 is a plan view of an element used in the electronic device of the ninth embodiment. [Figure 15] FIG. 15 is a plan view of a modified example of an element used in the electronic device of the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the contents shown in the drawings are merely schematic and illustrative for understanding the present disclosure, and the appearance and dimensional ratios may differ from the actual product. Furthermore, the present disclosure is not limited to the following embodiments.

[0026] First embodiment The element 1 of the first embodiment shown in FIG. 1 has the function of converting mechanical energy and electrical (magnetic) energy into each other, and is incorporated into electronic devices such as pressure sensors, magnetic sensors, antennas, and energy conversion devices. These electronic devices are also incorporated into electronic devices such as wearable terminals, hearable terminals, and cardiac pacemakers. The element 1 has a frame 10, at least one laminate 20 (in this embodiment, multiple laminates 20), and multiple conductive patterns 30. In this embodiment, the conductive pattern 30 is, for example, composed of multiple first conductive patterns 40 and multiple second conductive patterns 50a and 50b.

[0027] The frame 10 is a flat, plate-like structure and is made of, for example, an insulating material. The material constituting the frame 10 is not particularly limited, but may be, for example, silicon (Si), glass, magnesium oxide (MgO), strontium titanate (SrTiO3), or lithium niobate (LiNbO3). The frame 10 may be provided with a lid-like plate that covers the frame 10 and the laminate 20 from above or below.

[0028] The frame 10 has a first surface 10a, a second surface 10b, a third surface 10c, a fourth surface 10d, a fifth surface 10e, and a sixth surface 10f. The first surface 10a and the second surface 10b are opposite each other, the third surface 10c and the fourth surface 10d are opposite each other, and the fifth surface 10e and the sixth surface 10f are opposite each other.

[0029] In the following description, the axis along the direction in which the third surface 10c and the fourth surface 10d face each other is referred to as the X-axis, the axis along the direction in which the fifth surface 10e and the sixth surface 10f face each other is referred to as the Y-axis, and the axis along the direction in which the first surface 10a and the second surface 10b face each other is referred to as the Z-axis. The Z-axis corresponds to the stacking direction of the laminate 20. The X-axis, Y-axis, and Z-axis are perpendicular to each other. In the following description, the positive side of the Z-axis is referred to as the upper side, and the negative side of the Z-axis is referred to as the lower side. However, the upper side in the Z-axis direction does not necessarily coincide with the upper side in the vertical direction. Furthermore, the lower side in the Z-axis direction does not necessarily coincide with the lower side in the vertical direction.

[0030] The frame 10 has at least one opening 11. In this embodiment, there is one opening 11, but as will be described later, there may be multiple openings 11. In the example shown in FIG. 1, the opening 11 is configured as a through-hole extending from the first surface 10a to the second surface 10b of the frame 10. However, the configuration of the opening 11 is not limited to a through-hole, and the opening 11 may be, for example, a recess with a bottom that is recessed downward from the first surface 10a. In this case, a plate-shaped substrate that closes the opening 11 from below may be attached to the second surface 10b of the frame 10.

[0031] The shape of opening 11 is a square in plan view, but may be a rectangle, another polygon, or another shape (circle, ellipse, etc.). When opening 11 has an n-sided shape (n is 3 or more) in plan view, at least one of the n corners of opening 11 may be rounded in plan view.

[0032] The widths of the frame 10 in the X-axis direction and the Y-axis direction are not particularly limited, but are, for example, 1 to 10 mm. The width of the frame 10 in the Z-axis direction is not particularly limited, but is, for example, 0.1 to 1 mm. The Young's modulus of the frame 10 is not particularly limited, but is, for example, 50 to 500 GPa.

[0033] The multiple laminates 20 are two-dimensionally arranged at positions overlapping with the multiple openings 11 when viewed from the stacking direction of the laminates 20. More specifically, the multiple laminates 20 are arranged in a matrix of n rows and m columns (n ​​and m are natural numbers) along the X-axis direction and the Y-axis direction. In the example shown in FIG. 1, the values ​​of n and m are both 6. However, the values ​​of n and m may both be natural numbers other than 6. Furthermore, the values ​​of n and m may be different values, in which case one of n and m may be 1.

[0034] For ease of explanation, in FIG. 2A and other figures, the multiple (six in this embodiment) stacks 20 arranged along the Y-axis on the most negative side of the X-axis are referred to as the stacks 20 in the first row. The multiple stacks 20 arranged along the Y-axis on the positive side of the X-axis of the stacks 20 in the first row are referred to as the stacks 20 in the second row. The multiple stacks 20 arranged along the Y-axis on the positive side of the X-axis of the stacks 20 in the second row are referred to as the stacks 20 in the third row. The multiple stacks 20 arranged along the Y-axis on the positive side of the X-axis of the stacks 20 in the third row are referred to as the stacks 20 in the fourth row. The multiple stacks 20 arranged along the Y-axis on the positive side of the X-axis of the stacks 20 in the fourth row are referred to as the stacks 20 in the fifth row. The multiple stacks 20 arranged along the Y-axis on the most positive side of the X-axis are referred to as the stacks 20 in the sixth row.

[0035] Furthermore, the plurality of stacks 20 (six in this embodiment) arranged along the X-axis on the most negative side of the Y-axis are referred to as the first row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the positive side of the first row of stacks 20 on the Y-axis are referred to as the second row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the positive side of the second row of stacks 20 on the Y-axis are referred to as the third row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the positive side of the third row of stacks 20 on the Y-axis are referred to as the fourth row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the positive side of the fourth row of stacks 20 on the Y-axis are referred to as the fifth row of stacks 20. The plurality of stacks 20 arranged along the X-axis on the most positive side of the Y-axis are referred to as the sixth row of stacks 20.

[0036] As shown in FIG. 2B, the laminate 20 has an electrode film 21 and at least one functional film laminated on the electrode film 21. In the present disclosure, a functional film refers to a film made of a material (hereinafter, functional material) that has at least one of the following functions: converting electrical energy into mechanical energy, converting magnetic energy into mechanical energy, converting mechanical energy into electrical energy, and converting mechanical energy into magnetic energy. Examples of functional films include a piezoelectric film made of a piezoelectric material, a magnetostrictive film made of a magnetostrictive material, and a film that constitutes an electrostatically driven vibrator such as a silicon vibrator.

[0037] The laminate 20 has at least one functional film, a piezoelectric film 22 and a magnetostrictive film 23. The piezoelectric film 22 exhibits a piezoelectric effect that converts an external force into electric power in response to the application of external force. The piezoelectric film 22 also exhibits an inverse piezoelectric effect that converts electric power into strain in response to the application of electric power. The magnetostrictive film 23 exhibits a magnetostrictive effect that converts an external magnetic field into strain in response to the application of external magnetic field. The magnetostrictive film 23 also exhibits an inverse magnetostrictive effect that converts an external force into a magnetic field in response to the application of external force. The laminate 20, which combines the piezoelectric film 22 and the magnetostrictive film 23, exhibits a magnetoelectric effect that converts an external magnetic field into electric power due to the interaction between the magnetostrictive film 23 and the piezoelectric film 22, thereby forming a vibrating body.

[0038] More specifically, when an external magnetic field is applied to the laminate 20, the magnetostrictive film 23 converts the external magnetic field into strain due to the magnetostrictive effect. The strain of the magnetostrictive film 23 is propagated to the piezoelectric film 22, and when an external force is applied to the piezoelectric film 22, the piezoelectric film 22 converts the external force into electric power due to the piezoelectric effect. When the external magnetic field applied to the laminate 20 is an AC magnetic field, the magnetostrictive film 23 vibrates together with the piezoelectric film 22 and the electrode film 21, and the piezoelectric film 22 outputs AC power.

[0039] Furthermore, the laminate 20, which combines the piezoelectric film 22 and the magnetostrictive film 23, can convert electric power into a magnetic field through the interaction between the magnetostrictive film 23 and the piezoelectric film 22, and can radiate the magnetic field or electromagnetic waves to the outside. In this case, the laminate 20 also constitutes a vibrating body. More specifically, when electric power (electric field) is applied to the piezoelectric film 22 of the laminate 20, the piezoelectric film 22 converts the electric power into strain due to the inverse piezoelectric effect. The strain of the piezoelectric film 22 is propagated to the magnetostrictive film 23, and when an external force is applied to the magnetostrictive film 23, the magnetostrictive film 23 converts the external force into a magnetic field due to the inverse magnetostrictive effect. When the electric power (electric field) applied to the piezoelectric film 22 is AC power (AC electric field), the piezoelectric film 22 vibrates together with the magnetostrictive film 23 and the electrode film 21, and the magnetostrictive film 23 radiates an AC magnetic field (electromagnetic waves). In this case, an electronic device having the laminate 20 can be used, for example, as a transmitting antenna.

[0040] In this disclosure, the term "laminated body" refers not only to (1) the portion in the Z-axis direction where all functional films overlap the electrode film, but also to (2) the portion in the Z-axis direction where at least one functional film does not overlap the electrode film, and (3) the portion in the Z-axis direction where at least one functional film does not overlap the electrode film.

[0041] For example, in FIG. 2B, the laminate 20 is made up of the following parts (i) to (v). (i) A portion where the piezoelectric film 22 and the magnetostrictive film 23 overlap the electrode film 21 in the Z-axis direction. (ii) In the Z-axis direction, the portion where the piezoelectric film 22 overlaps the electrode film 21 but the magnetostrictive film 23 does not overlap. (iii) A portion in the Z-axis direction where neither the piezoelectric film 22 nor the magnetostrictive film 23 overlaps the electrode film 21. (iv) A portion in the Z-axis direction where the electrode film 21 does not overlap the piezoelectric film 22 and the magnetostrictive film 23. (v) A portion in the Z-axis direction where the electrode film 21 does not overlap the piezoelectric film 22.

[0042] Although detailed illustration is omitted, in another embodiment, if there is a portion in the Z-axis direction where the magnetostrictive film 23 overlaps the electrode film 21 but the piezoelectric film 22 does not overlap, this portion constitutes a part of the laminate 20. Also, if there is a portion in the Z-axis direction where the electrode film 21 does not overlap the magnetostrictive film 23, this portion constitutes a part of the laminate 20.

[0043] The width of the laminate 20 in the X-axis direction is not particularly limited, but is, for example, 100 μm to 1000 μm. The width of the laminate 20 in the Y-axis direction is not particularly limited, but is, for example, 50 μm to 1000 μm.

[0044] 2A, the outer edge of the laminate 20 and the edge of the opening 11 of the frame 10 are not in contact with each other, and a gap is formed between the outer edge of the laminate 20 and the edge of the opening 11 of the frame 10. In other words, the laminate 20 is disposed at a position that does not overlap with the first surface 10a of the frame 10 when viewed from the stacking direction of the laminate 20, but overlaps with the opening 11 when viewed from the stacking direction of the laminate 20.

[0045] As shown in Figure 3, the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 are laminated in this order. In this embodiment, there are multiple functional films, but there may be only one functional film. For example, the functional film may be either the piezoelectric film 22 or the magnetostrictive film 23. A laminate 20 made up of the electrode film 21 and the piezoelectric film 22 is incorporated into an electronic device such as a pressure sensor. A laminate 20 made up of the electrode film 21 and the magnetostrictive film 23 is also incorporated into an electronic device such as a magnetic sensor.

[0046] The electrode film 21 is located in the lowest layer of the laminate 20, and the lower main surface (hereinafter referred to as the bottom surface) of the electrode film 21 is exposed to the outside. The height position of the electrode film 21 is not particularly limited, but is approximately equal to the height position of the first surface 10a (FIG. 1) of the frame 10. However, the term "approximately equal" is used to refer not only to cases where these height positions are perfectly aligned, but also to cases where there is a deviation of ±5% or less between these height positions. As shown in FIG. 2B, the shape of the electrode film 21 is rectangular in plan view, but may also be a square, another polygon, or another shape.

[0047] The electrode film 21 is a conductive film (metal film) made of a metal such as Pt, Ir, Ag, Cu, Au, or Al. The electrode film 21 may be an oxide conductor film with a perovskite structure such as SrRuO3 (SRO) or LaNiO3. The thickness (average thickness) of the electrode film 21 is not particularly limited, but is, for example, 10 to 300 nm.

[0048] Note that another film such as an SiO2 film may be formed below the electrode film 21. In this case, in the manufacturing process of the device 1, when the opening 11 (FIG. 1) is formed in the film-formation substrate that serves as the base of the frame 10, the film below the electrode film 21 functions as an etching stopper. The thickness (average thickness) of the etching stopper layer is not particularly limited, but is, for example, 5 to 100 nm.

[0049] 3, the piezoelectric film 22 is laminated on the electrode film 21. The thickness (average thickness) of the piezoelectric film 22 is not particularly limited, but is, for example, 0.1 to 10 μm. The piezoelectric film 22 has a laminated portion 220 and an end portion 221.

[0050] The laminated portion 220 overlaps the electrode film 21 in the Z-axis direction and is disposed on top of the electrode film 21. The laminated portion 220 is sandwiched between the electrode film 21 and the magnetostrictive film 23. The laminated portion 220 is disposed directly on top of the electrode film 21 so as to be in contact with the electrode film 21, although other films may be disposed between the electrode film 21 and the laminated portion 220. The end portion 221 does not overlap the electrode film 21 in the Z-axis direction and is located outside the electrode film 21 in the X-axis direction. The end portion 221 covers the end portion of the electrode film 21 on the negative X-axis direction side.

[0051] 2B, the shape of the piezoelectric film 22 is rectangular in plan view, but may be square, another polygon, or another shape. The area of ​​the main surface of the piezoelectric film 22 is smaller than the area of ​​the main surface of the electrode film 21, but may be equal to or larger than the area of ​​the main surface of the electrode film 21. The center position of the piezoelectric film 22 is offset to one side in the X-axis direction with respect to the center position of the electrode film 21. This is to ensure space for connecting the first conductive pattern 40 on the other side of the electrode film 21 in the X-axis direction.

[0052] The piezoelectric material constituting the piezoelectric film 22 is not particularly limited, but may be, for example, quartz crystal, lithium niobate, aluminum nitride (AlN), zinc oxide (ZnO), lead zirconate titanate (PZT: Pb(Zr,Ti)O3), potassium sodium niobate (KNN: (K,Na)NbO3), or barium calcium zirconate titanate (BCZT: (Ba,Ca)(Zr,Ti)O3). From the viewpoint of ensuring excellent piezoelectric properties and high reliability, piezoelectric materials having a perovskite structure such as PZT, KNN, or BCZT may be used, and other elements may be added to the above piezoelectric materials.

[0053] As shown in Fig. 3, the magnetostrictive film 23 is laminated on the piezoelectric film 22. The magnetostrictive film 23 is disposed directly on the piezoelectric film 22 so as to be in contact with the piezoelectric film 22, but another film (e.g., a conductive film) may be disposed between the piezoelectric film 22 and the magnetostrictive film 23. The thickness (average thickness) of the magnetostrictive film 23 is not particularly limited, but is, for example, 0.1 to 10 µm. In Fig. 3, the thickness of the magnetostrictive film 23 is shown to be equal to the thickness of the piezoelectric film 22, but it may be thinner or thicker.

[0054] 2B, the shape of the magnetostrictive film 23 is rectangular in plan view, but it may be square, another polygon, or another shape. The area of ​​the main surface of the magnetostrictive film 23 is smaller than the area of ​​the main surface of the piezoelectric film 22, but may be equal to or larger than the area of ​​the main surface of the piezoelectric film 22.

[0055] The magnetostrictive material constituting the magnetostrictive film 23 is not particularly limited, but may be, for example, an iron (Fe)-cobalt (Co)-silicon (Si)-boron (B) alloy, an Fe-Si-B alloy, an Fe-Co-B alloy, an Fe-chromium (Cr)-Si-B alloy, an Fe-nickel (Ni)-molybdenum (Mo)-B alloy, an Fe-Si-B-copper (Cu)-niobium (Nb) alloy, or a Co-Fe-Ni-Si-B-Mo alloy.

[0056] 2A, the first conductive pattern 40 is made of a conductive film and is physically and electrically connected to the laminate 20. The thickness (average thickness) of the first conductive pattern 40 is not particularly limited, but is, for example, 3 to 500 nm. The material constituting the first conductive pattern 40 is not particularly limited, but is, for example, Au, Pt, Ag, Cu, or Al.

[0057] The first conductive patterns 40 physically and electrically connect the laminates 20 adjacent to each other in the X-axis direction. The laminates 20 in the first row are electrically connected in series by a plurality of (five in this embodiment) first conductive patterns 40 arranged in the first row. The laminates 20 in the second row are electrically connected in series by a plurality of first conductive patterns 40 arranged in the second row. The laminates 20 in the third row are electrically connected in series by a plurality of first conductive patterns 40 arranged in the third row. The laminates 20 in the fourth row are electrically connected in series by a plurality of first conductive patterns 40 arranged in the fourth row. The laminates 20 in the fifth row are electrically connected in series by a plurality of first conductive patterns 40 arranged in the fifth row. The laminates 20 in the sixth row are electrically connected in series by a plurality of first conductive patterns 40 arranged in the sixth row.

[0058] The element 1 is provided with a plurality of first conductive patterns 40, but may have a single first conductive pattern 40. For example, if the element 1 has two laminates 20, the element 1 may have a single first conductive pattern 40 that physically and electrically connects the two laminates 20.

[0059] The width of the first conductive pattern 40 in the plane of the laminate 20 in a direction perpendicular to the extending direction thereof (hereinafter referred to as the lateral width of the first conductive pattern 40) is smaller than the width of the laminate 20 in the Y-axis direction. The lateral width of the first conductive pattern 40 is not particularly limited, but is, for example, 10 to 50 μm. The lateral width of the first conductive pattern 40 is not particularly limited, but may be 20% or less, or 10% or less, of the width of the laminate 20 in the Y-axis direction. The length of the first conductive pattern 40 along the X-axis is not particularly limited, but is, for example, 50 to 300 μm.

[0060] As shown in FIG. 2B , the first conductive pattern 40 has a bent portion 44. The bent portion 44 is bent in an S-shape (crank-like or meander-like) along the in-plane direction of the laminate 20. The bent portion 44 is located between one laminate 20 and the other laminate 20 adjacent to each other in the X-axis direction, and is bent between the one laminate 20 and the other laminate 20. The bending amplitude W of the bent portion 44 is not particularly limited, but is, for example, 1.5 times or more the width of the first conductive pattern 40. The bending shape of the bent portion 44 is not limited to an S-shape and may be a C-shape, a ring-shape, or another shape. The first conductive pattern 40 may extend linearly along the X-axis.

[0061] As shown in FIG. 3 , the first conductive pattern 40 bridges (connects) one laminate 20 and the other laminate 20 adjacent to each other in the X-axis direction. The first conductive pattern 40 supports the one laminate 20 and the other laminate 20 adjacent to each other in the X-axis direction so that the first conductive pattern 40 can vibrate at a position overlapping the opening 11 when viewed from the stacking direction of the laminate 20. In the example shown in FIG. 3 , the bent portion 44 extends parallel to the electrode film 21, but may extend non-parallel to the electrode film 21. The height position of the bottom surface of the bent portion 44 is not particularly limited, but is approximately equal to the height position of the bottom surface of the electrode film 21. However, the term "approximately equal" is intended to encompass not only a case where these height positions are perfectly aligned, but also a case where there is a deviation of ±5% or less between these height positions.

[0062] One end of the first conductive pattern 40 in the extension direction is connected to the end on the positive X-axis direction of one of the laminates 20 adjacent to it in the X-axis direction. More specifically, one end of the first conductive pattern 40 in the extension direction overlaps in a stepped manner on the upper surface of the electrode film 21 so as to cover a part of the end of the electrode film 21 on the positive X-axis direction side. In this way, the first conductive pattern 40 is electrically connected to the electrode film 21 of one of the laminates 20 adjacent to it in the X-axis direction. One end of the first conductive pattern 40 in the extension direction is disposed directly on the electrode film 21, but another film may be disposed between the one end of the first conductive pattern 40 in the extension direction and the electrode film 21.

[0063] The other end of the first conductive pattern 40 in the extension direction is connected to the end on the negative X-axis direction side of the other laminate 20 adjacent to it in the X-axis direction. More specifically, the other end of the first conductive pattern 40 in the extension direction overlaps in a stepped manner on the upper surface of the magnetostrictive film 23 so as to cover part of the ends of the piezoelectric film 22 and the magnetostrictive film 23 on the negative X-axis direction side. This electrically connects the first conductive pattern 40 to the magnetostrictive film 23 of the other laminate 20 adjacent to it in the X-axis direction. The other end of the first conductive pattern 40 in the extension direction is disposed directly on the magnetostrictive film 23, but another film may be disposed between the other end of the first conductive pattern 40 in the extension direction and the magnetostrictive film 23.

[0064] The laminate 20 is suspended (hanging in mid-air) by the first conductive pattern 40 connected to both ends of the laminate 20 in the X-axis direction, and is positioned so as to overlap with the opening 11 when viewed from the stacking direction of the laminate 20.

[0065] The bottom surface of the bent portion 44 is exposed downward, but another film (for example, an etching stopper layer) may be disposed on the bottom surface of the bent portion 44. The upper main surface (hereinafter referred to as the top surface) of the bent portion 44 is exposed upward, but may be covered with, for example, an insulating resin film (protective film). The material constituting the resin film is not particularly limited, but may be an organic material such as polyimide, polyethylene terephthalate, polyethylene, polypropylene, polyester, polyamideimide, or epoxy resin. The thickness (average thickness) of the resin film is not particularly limited, but is 0.1 to 10 μm.

[0066] The elastic modulus (Young's modulus) or rigidity of the first conductive pattern 40 is smaller than that of the laminate 20. The elastic modulus (Young's modulus) or rigidity of the first conductive pattern 40 is also smaller than that of the frame 10. The Young's modulus of the first conductive pattern 40 is not particularly limited, but is, for example, less than 100 GPa. The Young's modulus of the laminate 20 is not particularly limited, but is, for example, 100 to 500 GPa. However, the Young's modulus of the laminate 20 is the average value of the Young's moduli of the electrode film 21 and at least one functional film (in this embodiment, the piezoelectric film 22 and the magnetostrictive film 23) that constitute the laminate 20. The elastic modulus (Young's modulus) of the first conductive pattern 40 may be smaller than that of the electrode film 21, the piezoelectric film 22, or the magnetostrictive film 23.

[0067] As shown in FIG. 2A, each end of the first conductive pattern 40 in the extension direction is disposed at the center of the laminate 20 in the Y-axis direction, but the position of each end of the first conductive pattern 40 in the Y-axis direction is not particularly limited.

[0068] 2A, no frame 10 is disposed between the multiple laminates 20 in the X-axis direction (between one laminate 20 and the other laminate 20 adjacent to each other in the X-axis direction). Therefore, a gap 70 is formed between the multiple laminates 20 in the X-axis direction. The gap 70 is located at a position that does not overlap with the first conductive pattern 40 (bent portion 44 in FIG. 2B) when viewed from the stacking direction of the laminate 20.

[0069] The laminates 20 in the first row do not overlap with the first surfaces 10a of the frames 10 when viewed from the stacking direction of the laminates 20. Therefore, a gap 70 is formed between the laminates 20 in the first row and the frames 10. Furthermore, the laminates 20 in the sixth row do not overlap with the first surfaces 10a of the frames 10 when viewed from the stacking direction of the laminates 20. Therefore, a gap 70 is formed between the laminates 20 in the sixth row and the frames 10.

[0070] The second conductive pattern 50a is made of a conductive film and is physically and electrically connected to the laminate 20 in the first row. The second conductive pattern 50b is made of a conductive film and is physically and electrically connected to the laminate 20 in the sixth row. The second conductive patterns 50a and 50b are conductive patterns for supplying input power to the multiple laminates 20 or obtaining output power from the multiple laminates 20.

[0071] The thickness (average thickness) of the second conductive pattern 50a or 50b is equal to, or may be thicker or thinner than, the thickness (average thickness) of the first conductive pattern 40. The material constituting the second conductive patterns 50a and 50b is the same as, or may be different from, the material constituting the first conductive pattern 40.

[0072] The width (horizontal width) of the second conductive pattern 50a or 50b in the plane of the laminate 20 in a direction perpendicular to the extending direction is equal to the horizontal width of the first conductive pattern 40, but may be narrower or wider. The elastic modulus (Young's modulus) or rigidity of the second conductive patterns 50a and 50b is equal to the elastic modulus (Young's modulus) or rigidity of the first conductive pattern 40, but may be greater or smaller. The elastic modulus (Young's modulus) or rigidity of the second conductive patterns 50a and 50b is smaller than the elastic modulus or rigidity of the laminate 20. The elastic modulus (Young's modulus) or rigidity of the second conductive patterns 50a and 50b is also smaller than the elastic modulus or rigidity of the frame 10. The Young's modulus of the second conductive patterns 50a and 50b is not particularly limited, but is, for example, less than 100 GPa. The elastic modulus (Young's modulus) of the second conductive patterns 50a and 50b may be smaller than that of the electrode film 21, the piezoelectric film 22, or the magnetostrictive film .

[0073] The second conductive pattern 50a has a connection portion 51a and a lead portion 52a. The second conductive pattern 50a is composed of a single conductive pattern, but may be composed of multiple conductive patterns. The second conductive pattern 50b has a connection portion 51b and a lead portion 52b. The second conductive pattern 50b is composed of a single conductive pattern, but may be composed of multiple conductive patterns.

[0074] The connecting portions 51a and 51b extend linearly along the Y-axis, but may be bent or curved. One end of the connecting portion 51a in the extension direction is connected to the first surface 10a on the fifth surface 10e side of the frame 10. The other end of the connecting portion 51a in the extension direction is connected to the first surface 10a on the sixth surface 10f side of the frame 10. In other words, the connecting portion 51a spans the frame 10 from the fifth surface 10e side to the sixth surface 10f side. Each end of the connecting portion 51a in the extension direction is directly disposed on the first surface 10a, but another film may be disposed between each end of the connecting portion 51a in the extension direction and the first surface 10a.

[0075] One end of connecting portion 51b in the extension direction is connected to first surface 10a on the fifth surface 10e side of frame 10. The other end of connecting portion 51b in the extension direction is connected to first surface 10a on the sixth surface 10f side of frame 10. In other words, connecting portion 51b spans frame 10 from the fifth surface 10e side to the sixth surface 10f side. Each end of connecting portion 51b in the extension direction is directly disposed on first surface 10a, but another film may be disposed between each end of connecting portion 51b in the extension direction and first surface 10a.

[0076] The connection portion 51a overlaps the laminates 20 in the first row when viewed in the stacking direction of the laminates 20, and physically and electrically connects the laminates 20 in the first row. The connection portion 51a extends along the Y-axis while contacting the end of the laminates 20 in the first row on the negative side of the X-axis. However, the position at which the connection portion 51a is connected to the laminates 20 is not limited to the end of the laminates 20 on the negative side of the X-axis. The connection portion 51a bridges (connects) between the frame 10 and the laminates 20, and also bridges (connects) between multiple laminates 20 (between one laminate 20 and the other laminate 20 adjacent in the Y-axis direction).

[0077] That is, for the laminates 20 in the first row, the connection portions 51a bridge between the frame 10 and the laminates 20 in the first column, bridge between the laminates 20 in the first column and the laminates 20 in the second column, bridge between the laminates 20 in the second column and the laminates 20 in the third column, bridge between the laminates 20 in the third column and the laminates 20 in the fourth column, bridge between the laminates 20 in the fourth column and the laminates 20 in the fifth column, bridge between the laminates 20 in the fifth column and the laminates 20 in the sixth column, and bridge between the laminates 20 in the sixth column and the frame 10. Therefore, the laminates 20 in the first row are connected to the frame 10 in the Y-axis direction via the connection portions 51a.

[0078] The first row of laminates 20 is suspended (hanging in mid-air) by connecting portions 51a and is disposed at a position overlapping with openings 11 as viewed from the stacking direction of laminates 20. Connecting portions 51a support the first row of laminates 20 in a vibratory manner at a position overlapping with openings 11 as viewed from the stacking direction of laminates 20.

[0079] The connection portion 51b overlaps the laminate 20 in the sixth row when viewed from the stacking direction of the laminates 20, and physically and electrically connects the laminates 20 in the sixth row. The connection portion 51b extends along the Y-axis while contacting the end of the laminate 20 in the sixth row on the positive side of the X-axis. However, the position at which the connection portion 51b is connected to the laminate 20 is not limited to the end of the laminate 20 on the positive side of the X-axis. The connection portion 51b bridges (connects) between the frame 10 and the laminate 20, and also bridges (connects) between multiple laminates 20 (between one laminate 20 and the other laminate 20 adjacent in the Y-axis direction).

[0080] That is, for the laminate 20 in the sixth row, the connection portion 51b bridges between the frame 10 and the laminate 20 in the first column, between the laminate 20 in the first column and the laminate 20 in the second column, between the laminate 20 in the second column and the laminate 20 in the third column, between the laminate 20 in the third column and the laminate 20 in the fourth column, between the laminate 20 in the fourth column and the laminate 20 in the fifth column, between the laminate 20 in the fifth column and the laminate 20 in the sixth column, and between the laminate 20 in the sixth column and the frame 10. Therefore, the laminate 20 in the sixth column is connected to the frame 10 via the connection portion 51b in the Y-axis direction.

[0081] The laminate 20 in the sixth row is suspended (hanging in mid-air) by the connecting portion 51b and is disposed at a position overlapping with the opening 11 as viewed from the stacking direction of the laminate 20. The connecting portion 51b supports the laminate 20 in the sixth row at a position overlapping with the opening 11 as viewed from the stacking direction of the laminate 20 so that the laminate 20 can vibrate.

[0082] As described above, the laminates 20 in the first column are connected via the plurality of first conductive patterns 40, and are further connected to the frame 10 via the second conductive patterns 50a and 50b. In the laminates 20 in the first column, for example, the laminates 20 in the first row are connected to the frame 10 via the second conductive pattern 50a. The laminates 20 in the first row are also connected to the frame 10 via the plurality of first conductive patterns 40, the plurality of laminates 20, and the second conductive pattern 50b.

[0083] Furthermore, among the laminates 20 in the first column, for example, the laminate 20 in the second row is connected to the frame 10 via one first conductive pattern 40, one laminate 20, and the second conductive pattern 50a. Furthermore, the laminate 20 in the second row is connected to the frame 10 via a plurality of first conductive patterns 40, a plurality of laminates 20, and the second conductive pattern 50b. In this manner, in this embodiment, all of the laminates 20 are connected to the frame 10 via at least the first conductive pattern 40, the second conductive pattern 50a, or the second conductive pattern 50b.

[0084] The plurality of laminates 20, each consisting of 6 rows and 6 columns and connected by the plurality of first conductive patterns 40, is connected to the frame 10 via connection portions 51a and 51b. The connection portions 51a and 51b cooperate to support the plurality of laminates 20, each consisting of 6 rows and 6 columns and connected by the plurality of first conductive patterns 40, so that the laminates 20 can vibrate.

[0085] As described above, the laminates 20 in the first column are connected in series by a plurality of first conductive patterns 40 to form a first series circuit. Similarly, the laminates 20 in the second column form a second series circuit, the laminates 20 in the third column form a third series circuit, the laminates 20 in the fourth column form a fourth series circuit, the laminates 20 in the fifth column form a fifth series circuit, and the laminates 20 in the sixth column form a sixth series circuit. The connecting portions 51a and 51b electrically connect the first to sixth series circuits in parallel. That is, the plurality of (six in this embodiment) laminates 20 arranged in the X-axis direction are electrically connected in series by at least one (five in this embodiment) first conductive pattern 40 so that the plurality of laminates 20 arranged in six rows and six columns form a plurality of (six in this embodiment) series circuits. The plurality of series circuits are then electrically connected in parallel. 2A, the plurality of series circuits are electrically connected in parallel by the plurality of second conductive patterns 50a and 50b. However, the means for electrically connecting the plurality of series circuits in parallel is not limited to the plurality of conductive patterns and may be, for example, wire bonding.

[0086] As shown in FIG. 3, the connection portion 51a is disposed directly on the magnetostrictive film 23 of the laminate 20 in the first row. In the example shown in FIG. 3, the connection portion 51a is physically and electrically connected to the magnetostrictive film 23 at the end of the magnetostrictive film 23 on the negative side of the X-axis. Another film (e.g., a conductive film) may be disposed between the connection portion 51a and the magnetostrictive film 23. Furthermore, the connection portion 51b is disposed directly on the electrode film 21 of the laminate 20 in the sixth row. In the example shown in FIG. 3, the connection portion 51b is physically and electrically connected to the electrode film 21 at the end of the electrode film 21 on the positive side of the X-axis. Another film (e.g., a conductive film) may be disposed between the connection portion 51b and the electrode film 21.

[0087] 2A, no frame 10 is disposed between the laminates 20 in the first row in the Y-axis direction (between one laminate 20 and the other laminate 20 adjacent to each other in the Y-axis direction). Also, a gap 70 is formed between the laminates 20 in the first row in the Y-axis direction (between one laminate 20 and the other laminate 20 adjacent to each other in the Y-axis direction). The gap 70 is located at a position that does not overlap with the connection portion 51a when viewed from the stacking direction of the laminates 20.

[0088] In the Y-axis direction, no frame 10 is disposed between the laminates 20 in the sixth row (between one laminate 20 and the other laminate 20 adjacent to each other in the Y-axis direction). In addition, in the Y-axis direction, a gap 70 is formed between the laminates 20 in the sixth row (between one laminate 20 and the other laminate 20 adjacent to each other in the Y-axis direction). The gap 70 is located at a position that does not overlap with the connection portion 51b when viewed from the stacking direction of the laminates 20.

[0089] In the Y-axis direction, no frame 10 is disposed between the laminates 20 in the second row (between one laminate 20 and the other laminate 20 adjacent to each other in the Y-axis direction). In addition, in the Y-axis direction, gaps 70 are formed between the laminates 20 in the second row (between one laminate 20 and the other laminate 20 adjacent to each other in the Y-axis direction). In the Y-axis direction, gaps 70 are also formed between the laminates 20 in the third row, between the laminates 20 in the fourth row, and between the laminates 20 in the fifth row.

[0090] The laminates 20 in the first row do not overlap the first surface 10a of the frame 10 when viewed from the stacking direction of the laminates 20. A gap 70 is formed between the laminates 20 in the first row and the frame 10 in the Y-axis direction. The laminates 20 in the sixth row do not overlap the first surface 10a of the frame 10 when viewed from the stacking direction of the laminates 20. A gap 70 is formed between the laminates 20 in the sixth row and the frame 10 in the Y-axis direction.

[0091] The lead portion 52a is continuous with the connection portion 51a and extends along the X-axis. The lead portion 52a extends linearly along the X-axis, but may be bent or curved. The lead portion 52a is continuous with the terminal 80a. The terminal 80a is an input terminal or an output terminal and is connected to an external circuit by, for example, wire bonding.

[0092] The lead-out portion 52b is continuous with the connection portion 51b and extends along the X-axis. The lead-out portion 52b extends linearly along the X-axis, but may be bent or curved. The lead-out portion 52b is continuous with the terminal 80b. The terminal 80b is an input terminal or an output terminal and is connected to an external circuit by, for example, wire bonding.

[0093] 4, the element 1 is incorporated into an electronic device 2 and used as an antenna in, for example, a contactless power supply system 3. In the contactless power supply system 3, a transmitting antenna 7 is a dipole antenna, a monopole antenna, a loop antenna, or the like, and transmits an AC magnetic field to the electronic device 2. In addition to the element 1, the electronic device 2 also has a power management IC 4, a capacitor 5, and a plurality of power consumption units 6.

[0094] When the element 1 receives an AC magnetic field transmitted from the transmitting antenna 7, the laminate 20 (FIG. 3) vibrates due to the magnetoelectric effect and outputs power. The output power of the laminate 20 is supplied to the power management IC 4 from the laminate 20 via the first conductive pattern 40, the second conductive pattern 50a, and the second conductive pattern 50b (FIG. 2A), etc. The power management IC 4 stores the power supplied from the laminate 20 in the capacitor 5 and supplies the power stored in the capacitor 5 to the power consumption unit 6 as needed. The power consumption unit 6 operates based on the power supplied from the power management IC 4. For example, if the electronic device 2 is an in-ear type earphone worn on the outer ear, the power consumption unit 6 may be a piezoelectric speaker, a piezoelectric microphone, a pressure sensor, an audio IC, a memory device, etc.

[0095] Next, a method for manufacturing the element 1 shown in FIG. 1 will be described. First, a film-forming substrate, such as a silicon substrate, which will serve as the base of the frame 10, is prepared. Next, an electrode film is formed on the film-forming substrate and patterned. Next, a piezoelectric film and a magnetostrictive film are formed in this order on the electrode film, forming a laminate of these films. Examples of film-forming methods include vapor deposition, sputtering, sol-gel, CVD, and PLD.

[0096] Next, the piezoelectric film and the magnetostrictive film are patterned to form the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 shown in Figures 1 and 2A. The patterning is performed by, for example, an etching method (photoetching, laser dry etching, etc.) or a lift-off method. As a result, a plurality of laminates 20, each having the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23, are formed on the film-formation substrate.

[0097] Next, a conductive film is formed on the film-forming substrate by vapor deposition, sputtering, or the like so as to cover the multiple laminates 20. The conductive film is a film that serves as the base for the first conductive pattern 40, the second conductive pattern 50a, and the second conductive pattern 50b. Next, the conductive film is subjected to a patterning process such as lift-off to form the first conductive pattern 40, the second conductive pattern 50a, and the second conductive pattern 50b shown in FIGS. 1 and 2A.

[0098] Next, a portion of the film-formation substrate is removed by, for example, dry etching (such as a deep-RIE method) or anisotropic wet etching to form a frame 10 having an opening 11. In this manner, the device 1 shown in FIG.

[0099] As shown in FIGS. 2A and 2B , in the device 1 of this embodiment, the laminate 20 includes a first laminate (in this embodiment, any laminate 20 among the plurality of laminates 20 arranged in six rows and six columns) that does not overlap with the frame 10 when viewed in the stacking direction of the laminate 20. The first laminate is connected to the frame 10 via at least the conductive patterns 30 (in this embodiment, the first conductive pattern 40, the second conductive pattern 50a, and the second conductive pattern 50b). Therefore, when the laminate 20 vibrates, the conductive patterns 30 expand and contract in response to the vibration of the laminate 20, absorbing the tensile stress of the laminate 20 due to distortion or residual stress. This weakens the tensile stress of the laminate 20, preventing the laminate 20 from cracking.

[0100] The laminate 20 also includes at least one functional film, which is a piezoelectric film 22 or a magnetostrictive film 23. In particular, in this embodiment, the laminate 20 includes at least one functional film, which is a piezoelectric film 22 or a magnetostrictive film 23, and the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 are stacked in this order. By configuring the laminate 20 with the electrode film 21 and the piezoelectric film 22 and applying the laminate 20 to an electronic device such as a pressure sensor, the electronic device can be made smaller. By configuring the laminate 20 with the electrode film 21 and the magnetostrictive film 23 and applying the laminate 20 to an electronic device such as a magnetic sensor, the electronic device can be made smaller. By configuring the laminate 20 with the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23, the interaction between the magnetostrictive film 23 and the piezoelectric film 22 produces a magnetoelectric effect that converts an external magnetic field into electric power. By incorporating such a laminate 20 of the electrode film 21, the piezoelectric film 22, and the magnetostrictive film 23 into an electronic device such as an antenna, it is possible to reduce the size of the electronic device.

[0101] The element 1 also has a plurality of laminates 20, which are arranged in a direction (X-axis direction) perpendicular to the stacking direction of the laminates 20. The conductive patterns 30 (first conductive patterns 40) bridge the plurality of laminates 20 in the X-axis direction. Therefore, one laminate 20 connected to the conductive patterns 30 is connected to the frame 10 via the conductive patterns 30 and the other laminate 20 connected thereto. Therefore, when each laminate 20 connected to the conductive patterns 30 vibrates, the conductive patterns 30 expand and contract in response to the vibration of each laminate 20, absorbing the tensile stress of each laminate 20 due to distortion or residual stress. This weakens the tensile stress of each laminate 20, preventing defects such as cracks from occurring in each laminate 20.

[0102] Furthermore, gaps 70 are formed between the multiple laminates 20 in the X-axis direction. The gaps 70 are located at positions that do not overlap with the conductive patterns 30 (first conductive patterns 40) when viewed from the stacking direction of the laminates 20. Therefore, the multiple laminates 20 are less likely to be constrained by the conductive patterns 30 in the X-axis direction, and can freely expand and contract while connected to the conductive patterns 30. This increases the power output from the multiple laminates 20, enabling the electronic device to have a higher output.

[0103] Furthermore, in the X-axis direction, the frame 10 is not disposed between the multiple laminates 20. Therefore, the conductive pattern 30 is disposed between the multiple laminates 20 in a suspended state without being fixed to the frame 10, so as to overlap with the opening 11. Therefore, the multiple laminates 20 are less likely to be constrained by the conductive pattern 30, and can freely expand and contract in the X-axis direction while connected to the conductive pattern 30. This increases the power output from the multiple laminates 20, enabling the electronic device to have a higher output.

[0104] The conductive pattern 30 is composed of at least a plurality of first conductive patterns 40. The element 1 also has a plurality of laminates 20. The plurality of laminates 20 are arranged in the X-axis direction and the Y-axis direction. The plurality of laminates 20 arranged in the X-axis direction are electrically connected in series by at least one (five in this embodiment) first conductive pattern 40 so that the plurality of laminates 20 arranged in six rows and six columns form a plurality of (six in this embodiment) series circuits. Furthermore, the plurality of series circuits are electrically connected in parallel. Therefore, power can be efficiently supplied to the plurality of laminates 20. A fail-safe circuit is also configured, and even if an abnormality occurs in one of the plurality of laminates 20, the influence of the abnormality can be minimized and the operation of the electronic device can be continued.

[0105] Furthermore, the conductive pattern 30 (first conductive pattern 40) is bent along the in-plane direction of the laminate 20. Therefore, the conductive pattern 30 has elasticity that allows it to expand and contract in response to the vibration of the laminate 20. When the conductive pattern 30 expands and contracts in response to the vibration of the laminate 20, the tensile stress of the laminate 20 caused by distortion or residual stress is weakened, and the problem of cracks occurring in the laminate 20 can be effectively prevented.

[0106] Second embodiment 5 has the same configuration as the element 1 of the first embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 1 of the first embodiment, and detailed descriptions thereof will be omitted.

[0107] 5, in this embodiment, the laminates 20 in the first row are physically and electrically connected by a plurality (seven in this embodiment) of first conductive patterns 40. The laminates 20 in the first row are electrically connected in series to form a series circuit. The same applies to the plurality of laminates 20 arranged in the second to sixth rows.

[0108] The laminates 20 in the first row are each connected to the first surface 10a of the frame 10 via the first conductive patterns 40. That is, the element 101 has a plurality of first conductive patterns 40 that bridge between the laminates 20 in the first row and the frame 10. The laminates 20 in the sixth row are each connected to the first surface 10a of the frame 10 via the first conductive patterns 40. That is, the element 101 has a plurality of first conductive patterns 40 that bridge between the laminates 20 in the sixth row and the frame 10.

[0109] When viewed from the stacking direction of the laminate 20, the second conductive patterns 50a and 50b do not overlap the opening 11, and as a whole overlap the first surface 10a of the frame 10. The second conductive pattern 50a is disposed directly on the first surface 10a of the frame 10, but another film may be disposed between the second conductive pattern 50a and the first surface 10a. Furthermore, the second conductive pattern 50b is disposed directly on the first surface 10a, but another film may be disposed between the second conductive pattern 50b and the first surface 10a.

[0110] The connection portion 51a is continuous with the plurality of first conductive patterns 40 connected to the laminate 20 in the first row. The connection portion 51b is continuous with the plurality of first conductive patterns 40 connected to the laminate 20 in the sixth row.

[0111] In this embodiment, the same effects as in the first embodiment can be obtained. In addition, in this embodiment, the laminate 20 in the first row is connected to the frame 10 via the first conductive pattern 40, not via the second conductive pattern 50a. Furthermore, the laminate 20 in the sixth row is connected to the frame 10 via the first conductive pattern 40, not via the second conductive pattern 50b. Therefore, the laminates 20 in the first and sixth rows can vibrate in the same vibration mode as the laminates 20 in the second to fifth rows. This increases the power output from the laminate 20, thereby enabling the electronic device to have a higher output.

[0112] Third embodiment 6 has the same configuration as the element 1 of the first embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 1 of the first embodiment, and detailed descriptions thereof will be omitted.

[0113] 6, the element 201 has a conductive pattern 230. The conductive pattern 230 has a second conductive pattern 50a, a second conductive pattern 50b, and second conductive patterns 250c to 250g. The second conductive patterns 250c to 250g have connecting portions 51c_1 to 51g_1, connecting portions 51c_2 to 51g_2, and folded portions 53c to 53g.

[0114] The connection portion 51c_1 physically and electrically connects the ends of the laminates 20 in the first row on the positive side of the X-axis along the Y-axis. The connection portion 51c_2 physically and electrically connects the ends of the laminates 20 in the second row on the negative side of the X-axis along the Y-axis. The connection portion 51d_1 physically and electrically connects the ends of the laminates 20 in the second row on the positive side of the X-axis along the Y-axis. The connection portion 51d_2 physically and electrically connects the ends of the laminates 20 in the third row on the negative side of the X-axis along the Y-axis. The connection portion 51e_1 physically and electrically connects the ends of the laminates 20 in the third row on the positive side of the X-axis along the Y-axis. The connection portion 51e_2 physically and electrically connects the ends of the laminates 20 in the fourth row on the negative side of the X-axis along the Y-axis. The connection portion 51f_1 physically and electrically connects the ends of the laminates 20 in the fourth row on the positive side of the X-axis along the Y-axis. The connection portion 51f_2 physically and electrically connects the ends of the laminates 20 in the fifth row on the negative side of the X-axis along the Y-axis. The connection portion 51g_1 physically and electrically connects the ends of the laminates 20 in the fifth row on the positive side of the X-axis along the Y-axis. The connection portion 51g_2 physically and electrically connects the ends of the laminates 20 in the sixth row on the negative side of the X-axis along the Y-axis.

[0115] 7, the connection portions 51c_1, 51d_1, 51e_1, 51f_1, and 51g_1 are physically and electrically connected to the electrode films 21 of the laminate 20. The connection portions 51c_2, 51d_2, 51e_2, 51f_2, and 51g_2 are physically and electrically connected to the magnetostrictive films 23 of the laminate 20.

[0116] As shown in FIG. 6, the folded portions 53c to 53g extend along the X-axis. The folded portions 53c to 53g extend linearly along the X-axis, but may be bent or curved. The folded portion 53c is continuous with the connecting portions 51c_1 and 51c_2. The folded portion 53d is continuous with the connecting portions 51d_1 and 51d_2. The folded portion 53e is continuous with the connecting portions 51e_1 and 51e_2. The folded portion 53f is continuous with the connecting portions 51f_1 and 51f_2. The folded portion 53g is continuous with the connecting portions 51g_1 and 51g_2.

[0117] The laminates 20 in the first row are connected to the frame 10 via the connection portions 51a and 51c_1. The laminates 20 in the first row are electrically connected in parallel by the connection portions 51a and 51c_1 to form a first parallel circuit.

[0118] The laminates 20 in the second row are connected to the frame 10 via the connection portions 51c_2 and 51d_1. The laminates 20 in the second row are electrically connected in parallel by the connection portions 51c_2 and 51d_1 to form a second parallel circuit.

[0119] The laminates 20 in the third row are connected to the frame 10 via the connection portions 51d_2 and 51e_1. The laminates 20 in the third row are electrically connected in parallel by the connection portions 51d_2 and 51e_1 to form a third parallel circuit.

[0120] The laminates 20 in the fourth row are connected to the frame 10 via the connection portions 51e_2 and 51f_1. The laminates 20 in the fourth row are electrically connected in parallel by the connection portions 51e_2 and 51f_1 to form a fourth parallel circuit.

[0121] The laminates 20 in the fifth row are connected to the frame 10 via the connection portions 51f_2 and 51g_1. The laminates 20 in the fifth row are electrically connected in parallel by the connection portions 51f_2 and 51g_1 to form a fifth parallel circuit.

[0122] The laminates 20 in the sixth row are connected to the frame 10 via the connection portions 51g_2 and 51b. The laminates 20 in the sixth row are electrically connected in parallel by the connection portions 51g_2 and 51b to form a sixth parallel circuit.

[0123] The first parallel circuit and the second parallel circuit are electrically connected in series via the folded portion 53c. The second parallel circuit and the third parallel circuit are electrically connected in series via the folded portion 53d. The third parallel circuit and the fourth parallel circuit are electrically connected in series via the folded portion 53e. The fourth parallel circuit and the fifth parallel circuit are electrically connected in series via the folded portion 53f. The fifth parallel circuit and the sixth parallel circuit are electrically connected in series via the folded portion 53g. In other words, the first to sixth parallel circuits are electrically connected in series by the folded portions 53c to 53g.

[0124] This embodiment also provides the same effects as the first embodiment. Additionally, in this embodiment, the plurality of laminates 20 (six in this embodiment) arranged in the Y-axis direction are electrically connected in parallel by the plurality of (two in this embodiment) conductive patterns 230 so that the plurality of laminates 20 arranged in six rows and six columns constitutes the plurality of (six in this embodiment) parallel circuits. Furthermore, the plurality of parallel circuits are electrically connected in series. Therefore, power can be efficiently supplied to the plurality of laminates 20. Furthermore, a fail-safe circuit is configured, so that even if an abnormality occurs in one of the plurality of laminates 20, the influence of the abnormality can be minimized and the operation of the electronic device can continue. In the example shown in FIG. 6, the plurality of parallel circuits are electrically connected in series by the plurality of conductive patterns 230 (folded portions 53c to 53g). However, the means for electrically connecting the plurality of parallel circuits in series is not limited to the conductive patterns, and may be, for example, wire bonding.

[0125] Furthermore, gaps 70 are formed between the multiple laminates 20 in the Y-axis direction. The gaps 70 are located at positions that do not overlap with the multiple second conductive patterns 230 when viewed from the stacking direction of the laminates 20. Therefore, the multiple laminates 20 are less likely to be constrained by the multiple second conductive patterns 230, and can freely expand and contract in the Y-axis direction while connected to the multiple second conductive patterns 230. This increases the power output from the multiple laminates 20, enabling the electronic device to have a higher output.

[0126] Furthermore, in the Y-axis direction, the frame 10 is not disposed between the multiple laminates 20. Therefore, the multiple second conductive patterns 230 are disposed between the multiple laminates 20 so as to overlap with the openings 11 in a suspended state without being fixed to the frame 10. Therefore, the multiple laminates 20 are less likely to be constrained by the multiple second conductive patterns 230, and can freely expand and contract in the Y-axis direction while connected to the second conductive patterns 230. This increases the power output from the multiple laminates 20, enabling the electronic device to have a higher output.

[0127] Fourth embodiment 8 has the same configuration as the element 201 of the third embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 201 of the third embodiment, and detailed descriptions thereof will be omitted.

[0128] 8, the element 301 has a conductive pattern 330. The conductive pattern 330 has second conductive patterns 350a to 350g. The second conductive patterns 350a to 350g have a connection portion 351a, a connection portion 351b, connection portions 351c_1 to 351g_1, and connection portions 351c_2 to 351g_2.

[0129] The connecting portions 351a and 351b each have a plurality of bent portions 54 (seven in this embodiment). The connecting portions 351c_1 to 351g_1 each have a plurality of bent portions 54 (seven in this embodiment). The connecting portions 351c_2 to 351g_2 each have a plurality of bent portions 54 (seven in this embodiment). The bent portions 54 have the same configuration as the bent portions 44 of the first embodiment. The bent portions 54 are arranged between one stack 20 and the other stack 20 adjacent to each other in the Y-axis direction. Alternatively, the bent portions 54 are arranged between the frame 10 and the stack 20 in the Y-axis direction.

[0130] In this embodiment, the same effects as in the third embodiment can be obtained. Additionally, in this embodiment, the second conductive pattern 330 is bent along the in-plane direction of the laminate 20 so as to deflect toward the positive and negative sides of the X-axis. Therefore, the second conductive pattern 330 has elasticity that allows it to expand and contract in the Y-axis direction in response to vibration of the laminate 20. As the second conductive pattern 330 expands and contracts in response to vibration of the laminate 20, the tensile stress of the laminate 20 caused by distortion or residual stress is weakened, and the problem of cracks occurring in the laminate 20 can be effectively prevented.

[0131] Fifth embodiment 9 has the same configuration as the element 1 of the first embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 1 of the first embodiment, and detailed descriptions thereof will be omitted.

[0132] As shown in FIG. 9, the element 401 has a frame 410. The frame 410 has a plurality of (six in this embodiment) openings 11, a main body 12, and a plurality of (five in this embodiment) inner frame portions 13. The configuration of the main body 12 is similar to that of the frame 10 of the first embodiment (FIG. 2A). The plurality of inner frame portions 13 are formed inside the main body 12 and are spaced apart along the X axis. The plurality of inner frame portions 13 also extend along the Y axis. One end of each of the inner frame portions 13 in the extension direction is connected to the main body 12 (the inner wall of the main body 12) on the fifth surface 10e side. The other end of each of the inner frame portions 13 in the extension direction is connected to the main body 12 (the inner wall of the main body 12) on the sixth surface 10f side. The upper surface (first surface 10a) of the inner frame portions 13 is, but is not limited to, flush with the upper surface of the main body 12.

[0133] The width of inner frame portion 13 in the plane of laminate 20 in a direction perpendicular to the extending direction (hereinafter referred to as the horizontal width of inner frame portion 13) is smaller than the distance between adjacent laminates 20 in the X-axis direction. In the example shown in FIG. 9, the horizontal width of inner frame portion 13 is narrower than the horizontal width of first conductive pattern 40, but it may be equal to or wider than that. As shown in FIG. 10, inner frame portion 13 extends downward along the Z-axis. The length of inner frame portion 13 in the Z-axis direction is longer than the thickness of laminate 20. The length of inner frame portion 13 in the Z-axis direction is approximately equal to the thickness of main body 12 and is not particularly limited, and is, for example, 0.05 to 0.7 mm. However, the length of inner frame portion 13 in the Z-axis direction may be different from the thickness of main body 12. Furthermore, the term "almost equal" is used to refer not only to cases where the length of the inner frame portion 13 in the Z-axis direction and the thickness of the main body 12 are completely the same, but also to cases where there is a deviation of within ±5% between the length of the inner frame portion 13 in the Z-axis direction and the thickness of the main body 12.

[0134] 9, in a plan view, the multiple openings 11 are adjacent to each other in the X-axis direction, with multiple inner frame portions 13 interposed between them. The laminates 20 in the first and sixth rows are arranged at positions that overlap with the openings 11 when viewed from the stacking direction of the laminates 20, without overlapping with the upper surfaces of the main body 12 and the inner frame portions 13. The laminates 20 in the second to fifth rows are arranged at positions that overlap with the openings 11 when viewed from the stacking direction of the laminates 20, without overlapping with the upper surfaces of the multiple inner frame portions 13 when viewed from the stacking direction of the laminates 20.

[0135] In this embodiment, the same effects as in the first embodiment can be obtained. In addition, in this embodiment, the frame 410 has a plurality of inner frame portions 13 located between the plurality of laminates 20 in the X-axis direction when viewed from the stacking direction of the laminates 20. Furthermore, the plurality of first conductive patterns 40 (bent portions 44) at least partially overlap with the plurality of inner frame portions 13 when viewed from the stacking direction of the laminates 20. Furthermore, gaps 70 are formed between the plurality of laminates 20 and the plurality of inner frame portions 13. The gaps 70 are located at positions that do not overlap with the plurality of first conductive patterns 40 when viewed from the stacking direction of the laminates 20. Therefore, the plurality of first conductive patterns 40 are fixed to the plurality of inner frame portions 13, and disconnection of the plurality of first conductive patterns 40 can be prevented.

[0136] Sixth embodiment 11 has the same configuration as the element 1 of the first embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 1 of the first embodiment, and detailed descriptions thereof will be omitted.

[0137] The element 501 has a frame 510 and a conductive pattern 530. The frame 510 has a plurality of (six in this embodiment) openings 11, a main body 12, and a plurality of (five in this embodiment) inner frame portions 513. The inner frame portions 513 have the same configuration as the inner frame portion 13 of the fifth embodiment, except for the points described below. The plurality of inner frame portions 513 are formed inside the main body 12 and are spaced apart along the Y axis. The plurality of inner frame portions 513 also extend along the X axis. One end of each of the inner frame portions 513 in the extension direction is connected to the main body 12 (the inner wall of the main body 12) on the third surface 10c side. The other end of each of the inner frame portions 513 in the extension direction is connected to the main body 12 (the inner wall of the main body 12) on the fourth surface 10d side. The upper surface of the inner frame portion 513 is, but is not limited to, flush with the upper surface of the main body 12.

[0138] The conductive pattern 530 includes a second conductive pattern 50a, a second conductive pattern 50b, and a plurality of first conductive patterns 540. The first conductive pattern 540 includes a connection portion 41_1, a connection portion 41_2, and a folded portion 43. The connection portion 41_1 extends along the Y-axis and is physically and electrically connected to an end portion on the positive X-axis side of one of the laminates 20 (electrode film 21 in FIG. 10) adjacent to it in the X-axis direction. The connection portion 41_2 extends along the Y-axis and is physically and electrically connected to an end portion on the negative X-axis side of the other laminate 20 (magnetostrictive film 23 in FIG. 10) adjacent to it in the X-axis direction. The folded portion 43 extends along the X-axis and is continuous with the connection portion 41_1 and the connection portion 41_2. The folded portion 43 extends linearly along the X-axis, but may be bent or curved.

[0139] The connection portions 41_1 and 41_2 electrically connected to the laminates 20 in the first row (similarly to the sixth row) bridge along the Y axis between the main body 12 and the inner frame portion 513. The connection portions 41_1 and 41_2 electrically connected to the laminates 20 in the second row (similarly to the third to fifth rows) bridge along the Y axis between the multiple inner frame portions 513 (between one inner frame portion 513 and the other inner frame portion 513 adjacent in the Y axis direction).

[0140] Furthermore, the folded portion 43 electrically connected to the laminates 20 in the first row (similarly for the second to fifth rows) overlaps with the inner frame portion 513 when viewed from the stacking direction of the laminates 20. Furthermore, the folded portion 43 electrically connected to the laminates 20 in the sixth row overlaps with the main body 12 when viewed from the stacking direction of the laminates 20.

[0141] The plurality of laminates 20 (six in this embodiment) arranged in the X-axis direction are electrically connected in series by at least one (five in this embodiment) first conductive pattern 540 so that the plurality of laminates 20 arranged in six rows and six columns form a plurality of (six in this embodiment) series circuits. The plurality of series circuits are then electrically connected in parallel. In the example shown in FIG. 11, the plurality of series circuits are electrically connected in parallel by the plurality of second conductive patterns 50a and 50b. However, the means for electrically connecting the plurality of series circuits in parallel is not limited to conductive patterns and may be, for example, wire bonding.

[0142] In this embodiment, the same effects as in the first embodiment can be obtained. In addition, in this embodiment, the frame 510 has a plurality of inner frame portions 513 located between the plurality of laminates 20 in the Y-axis direction when viewed from the stacking direction of the laminates 20. Furthermore, the plurality of conductive patterns 530 at least partially overlap with the plurality of inner frame portions 513 when viewed from the stacking direction of the laminates 20. Furthermore, gaps 70 are formed between the plurality of laminates 20 and the plurality of inner frame portions 513. The gaps 70 are located at positions where they do not overlap with the plurality of conductive patterns 530 when viewed from the stacking direction of the laminates 20. Therefore, the plurality of conductive patterns 530 are fixed to the plurality of inner frame portions 513, and disconnection of the plurality of conductive patterns 530 can be prevented.

[0143] Seventh embodiment 12 has the same configuration as the element 201 of the third embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 201 of the third embodiment, and detailed descriptions thereof will be omitted.

[0144] As shown in FIG. 12 , the frame 510 has a plurality of inner frame portions 513 located between the plurality of laminates 20 in the Y-axis direction, as viewed from the stacking direction of the laminates 20. The inner frame portions 513 of this embodiment have a configuration similar to that of the inner frame portion 513 of the sixth embodiment. The plurality of conductive patterns 230 at least partially overlap with the plurality of inner frame portions 513, as viewed from the stacking direction of the laminates 20. More specifically, the connection portions 51a, 51b, 51c_1 to 51g_1 and 51c_2 to 51g_2 at least partially overlap with the plurality of inner frame portions 513, as viewed from the stacking direction of the laminates 20. A gap 70 is formed between the plurality of laminates 20 and the plurality of inner frame portions 513. The gap 70 is located at a position where it does not overlap with the plurality of conductive patterns 230, as viewed from the stacking direction of the laminates 20.

[0145] This embodiment also provides the same effects as those of Embodiment 3. In addition, in this embodiment, since the plurality of conductive patterns 230 are fixed to the plurality of inner frame portions 513, disconnection of the plurality of conductive patterns 230 can be prevented.

[0146] Eighth embodiment 13 has the same configuration as the element 401 of the fifth embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 401 of the fifth embodiment, and detailed descriptions thereof will be omitted.

[0147] As shown in FIG. 13 , the element 701 has a frame 710. The frame 710 has a plurality of inner frame portions 13 and a plurality of inner frame portions 513. The inner frame portion 513 of this embodiment has a configuration similar to that of the inner frame portion 513 of the sixth embodiment. In FIG. 13 , the width of the inner frame portion 513 in a direction perpendicular to the extension direction within the plane of the laminate 20 (hereinafter referred to as the horizontal width of the inner frame portion 513) is shown as being narrower than the horizontal width of the inner frame portion 13. However, the width may be equal to or wider than the horizontal width of the inner frame portion 13. In this embodiment, the plurality of first conductive patterns 40 are fixed to the plurality of inner frame portions 13, thereby preventing disconnection of the plurality of first conductive patterns 40. Furthermore, the second conductive patterns 50a and 50b (connection portions 51a and 51b) are fixed to the plurality of inner frame portions 513, thereby preventing disconnection of the second conductive patterns 50a and 50b.

[0148] Ninth embodiment 14 has the same configuration as the element 1 of the first embodiment, except for the following points: The same reference numerals are used to designate parts that overlap with the element 1 of the first embodiment, and detailed descriptions thereof will be omitted.

[0149] 14, in this embodiment, each laminate 20 in the first row overlaps with the first surface 10a of the frame 10 at one location when viewed from the stacking direction of the laminates 20. More specifically, the end of each laminate 20 in the first row on the negative X-axis direction side overlaps with the first surface 10a at one location. In other words, each laminate 20 in the first row does not overlap with the first surface 10a of the frame 10 at multiple locations (for example, two locations) when viewed from the stacking direction of the laminates 20.

[0150] Furthermore, each laminate 20 in the sixth row overlaps with the first surface 10a of the frame 10 at one location when viewed from the stacking direction of the laminates 20. More specifically, the end of each laminate 20 in the sixth row on the positive X-axis direction side overlaps with the first surface 10a at one location. In other words, each laminate 20 in the sixth row does not overlap with the first surface 10a of the frame 10 at multiple locations (for example, two locations) when viewed from the stacking direction of the laminates 20.

[0151] The second conductive patterns 50a and 50b overlap the first surface 10a of the frame 10 when viewed from the stacking direction of the laminate 20. The connecting portions 51a physically and electrically connect the laminates 20 in the first row (the magnetostrictive films 23 in FIG. 10). The connecting portions 51b physically and electrically connect the laminates 20 in the sixth row (the electrode films 21 in FIG. 10).

[0152] In this embodiment, the same effects as in the first embodiment can be obtained. Additionally, in this embodiment, the laminates 20 in the first and sixth rows are directly connected to the first surface 10a of the frame 10. Therefore, the plurality of laminates 20 arranged in six rows and six columns can be firmly connected to the frame 10 via the laminates 20 in the first and sixth rows.

[0153] The present invention is not limited to the above-described embodiment and can be modified in various ways within the scope of the present invention. For example, the element 1 shown in FIG. 1 has multiple laminates 20, but as shown in FIG. 15, the number of laminates 20 may be single. The laminate 20 shown in FIG. 15 is connected to the frame 10 via two first conductive patterns 40. The connection portion 51a is continuous with the first conductive pattern 40 connected to the end of the laminate 20 facing the negative X-axis direction. The connection portion 51b is continuous with the first conductive pattern 40 connected to the end of the laminate 20 facing the positive X-axis direction.

[0154] 2A, the connection portion 51a is configured with a single conductive pattern extending continuously along the Y-axis, but may be configured with a plurality of conductive patterns. For example, the connection portion 51a may be divided into a conductive pattern bridging between the frame 10 and the first row of laminates 20, a conductive pattern bridging between the first row of laminates 20 and the second row of laminates 20, a conductive pattern bridging between the second row of laminates 20 and the third row of laminates 20, a conductive pattern bridging between the third row of laminates 20 and the fourth row of laminates 20, a conductive pattern bridging between the fourth row of laminates 20 and the fifth row of laminates 20, a conductive pattern bridging between the fifth row of laminates 20 and the sixth row of laminates 20, and a conductive pattern bridging between the sixth row of laminates 20 and the frame 10. The same applies to connection portion 51b, connection portions 51c_1 to 51g_1 (FIG. 6), connection portions 51c_2 to 51g_2 (FIG. 6), connection portion 351a (FIG. 8), connection portion 351b (FIG. 8), connection portions 351c_1 to 351g_1 (FIG. 8), connection portions 351c_2 to 351g_2 (FIG. 8), connection portion 41_1 (FIG. 11) and connection portion 41_2 (FIG. 11).

[0155] 2A, in the first embodiment, the number of first conductive patterns 40 is plural, but it may be single. In this case, for example, two laminates 20 may be connected via one first conductive pattern 40, and the two laminates 20 connected via the first conductive pattern 40 may be connected to the frame 10 via second conductive patterns 50a and 50b. The same applies to the fifth, eighth, and ninth embodiments.

[0156] The laminate 20 shown in FIG. 2B has two functional films (a piezoelectric film 22 and a magnetostrictive film 23) as at least one functional film, but may have one or three or more functional films. For example, the laminate 20 may have a piezoelectric film 22 or a magnetostrictive film 23 as one functional film. The laminate 20 made up of the electrode film 21 and the piezoelectric film 22 forms a vibrating body that can vibrate due to the inverse piezoelectric effect of the piezoelectric film 22. Furthermore, the laminate 20 made up of the electrode film 21 and the magnetostrictive film 23 forms a vibrating body that can vibrate due to the magnetostrictive effect of the magnetostrictive film 23.

[0157] As shown in FIG. 2A, the shape of the laminate 20 is rectangular in plan view, but it may be square, circular, elliptical, or any other shape.

[0158] As shown in FIG. 1, the plurality of laminates 20 are arranged in a matrix, but may also be arranged in a concentric or radial pattern, for example.

[0159] The positional relationship between the piezoelectric film 22 and the magnetostrictive film 23 shown in FIG. 3 may be reversed upside down, and in the laminate 20, the electrode film 21, the magnetostrictive film 23, and the piezoelectric film 22 may be laminated in this order.

[0160] As will be described below, the techniques of the first to ninth embodiments may be applied to one another. For example, the inner frame portion 13 of the fifth embodiment may be provided on the frame 10 of the second embodiment (FIG. 5) and the frame 10 of the ninth embodiment (FIG. 14).

[0161] Furthermore, for example, the inner frame portion 513 of the sixth embodiment may be provided on the frame 10 of the first embodiment (FIG. 2A) or the frame 10 of the fourth embodiment (FIG. 8).

[0162] Furthermore, for example, the technique of the second embodiment (technique of connecting the stacked body 20 in the first or sixth row to the frame 10 by the first conductive pattern 40) may be applied to the third embodiment and the fifth to eighth embodiments.

[0163] Furthermore, for example, the technique of the fourth embodiment (the technique of providing the second conductive patterns 350a and / or 350b with the bent portions 54) may be applied to the second conductive patterns 50a and / or 50b of the sixth embodiment (FIG. 11), the second conductive patterns 50a and / or 50b of the seventh embodiment (FIG. 12), and the second conductive patterns 50a and / or 50b of the eighth embodiment (FIG. 13).

[0164] Furthermore, for example, the technique of the above-mentioned ninth embodiment (a technique in which, when viewed from the stacking direction of the laminate 20, (i) the first and / or sixth row laminate 20 is superimposed on the frame 10, and (ii) the second conductive patterns 50a and / or 50b are superimposed on the first and / or sixth row laminate 20 and the frame 10) may be applied to the above-mentioned third embodiment and fifth to eighth embodiments. [Explanation of symbols]

[0165] 1,101,201,301,401,501,601,701,801...elements 2…Electronic equipment 3. Wireless power supply system 4...Power management IC 5...Capacitor 6…Power consumption part 7...Transmitting antenna 10,410,510,710…frame 10a~10f…1st side~6th side 11...Opening 12...Main unit 13,513…Inner frame 20...Laminate 21...electrode film 22...Piezoelectric film 220...Laminated section 221...End 23...Magnetostrictive film 30, 230, 330, 530...Conductive pattern 40,540...First conductive pattern 41_1, 41_2...Connection 43...Folded section 44...Bend 50a, 50b, 250c to 250g, 350a to 350g...Second conductive pattern 51a, 51b, 51c_1~51g_1, 51c_2~51g_2, 351a, 351b, 351c_1~351g_1, 351c_2~351g_2...Connection 52...Drawer part 53c~53g...Folded section 54...Bend 70...Void 80a, 80b...Terminals

Claims

1. a frame having at least one opening; a laminate having an electrode film and at least one functional film laminated on the electrode film; a conductive pattern electrically connected to the laminate, the stack includes a first stack that does not overlap with the frame when viewed from a stacking direction of the stack, The first laminate is connected to the frame via at least the conductive pattern.

2. 2. The electronic device according to claim 1, wherein the laminate has at least one of a piezoelectric film and a magnetostrictive film as the at least one functional film.

3. the laminate has the piezoelectric film and the magnetostrictive film as at least one of the functional films, The electronic device according to claim 2 , wherein the electrode film, the piezoelectric film, and the magnetostrictive film are laminated in this order.

4. the laminate is made up of a plurality of the laminates, The plurality of stacked bodies are arranged in a first direction perpendicular to the stacking direction, 4. The electronic device according to claim 1, wherein the conductive pattern bridges between the plurality of laminates in the first direction.

5. A gap is formed between the plurality of laminated bodies in the first direction, The electronic device according to claim 4 , wherein the void is located at a position that does not overlap the conductive pattern when viewed from the stacking direction.

6. The electronic device according to claim 5 , wherein the frame is not disposed between the plurality of laminates in the first direction.

7. the frame has an inner frame portion located between the plurality of stacks in the first direction as viewed from the stacking direction, At least a portion of the conductive pattern overlaps with the inner frame portion when viewed from the stacking direction, a gap is formed between the plurality of laminates and the inner frame portion, The electronic device according to claim 4 , wherein the void is located at a position that does not overlap the conductive pattern when viewed from the stacking direction.

8. the conductive pattern is made up of a plurality of the conductive patterns, The laminate is composed of a plurality of laminates, The plurality of stacked bodies are arranged in a first direction perpendicular to the stacking direction and in a second direction perpendicular to the stacking direction and the first direction, the plurality of laminates arranged in the first direction are electrically connected in series by at least one of the conductive patterns so that the plurality of laminates form a plurality of series circuits; 4. The electronic device according to claim 1, wherein a plurality of the series circuits are electrically connected in parallel.

9. A gap is formed between the plurality of laminated bodies in the first direction, The electronic device according to claim 8 , wherein the void is located at a position where it does not overlap with the plurality of conductive patterns when viewed from the stacking direction.

10. The electronic device according to claim 9 , wherein the frame is not disposed between the plurality of laminated bodies in the first direction.

11. the frame has a plurality of inner frame portions located between the plurality of stacks in the first direction as viewed from the stacking direction, the plurality of conductive patterns at least partially overlap with the plurality of inner frame portions when viewed from the stacking direction, a gap is formed between the plurality of stacks and the plurality of inner frame portions, The electronic device according to claim 8 , wherein the void is located at a position where it does not overlap with the plurality of conductive patterns when viewed from the stacking direction.

12. the frame has a plurality of inner frame portions located between the plurality of stacks in the second direction as viewed from the stacking direction, the plurality of conductive patterns at least partially overlap with the plurality of inner frame portions when viewed from the stacking direction, a gap is formed between the plurality of stacks and the plurality of inner frame portions, The electronic device according to claim 8 , wherein the void is located at a position where it does not overlap with the plurality of conductive patterns when viewed from the stacking direction.

13. the conductive pattern is made up of a plurality of the conductive patterns, The laminate is composed of a plurality of laminates, The plurality of stacked bodies are arranged in a first direction perpendicular to the stacking direction and in a second direction perpendicular to the stacking direction and the first direction, the plurality of laminates arranged in the second direction are electrically connected in parallel by the plurality of conductive patterns so that the plurality of laminates form a plurality of parallel circuits; 4. The electronic device according to claim 1, wherein the plurality of parallel circuits are electrically connected in series.

14. A gap is formed between the plurality of laminated bodies in the second direction, The electronic device according to claim 13 , wherein the void is located at a position that does not overlap with the plurality of conductive patterns when viewed from the stacking direction.

15. The electronic device according to claim 14 , wherein the frame is not disposed between the plurality of laminates in the second direction.

16. the frame has a plurality of inner frame portions located between the plurality of stacks in the second direction as viewed from the stacking direction, the plurality of conductive patterns at least partially overlap with the plurality of inner frame portions when viewed from the stacking direction, a gap is formed between the plurality of stacks and the plurality of inner frame portions, The electronic device according to claim 13 , wherein the void is located at a position that does not overlap with the plurality of conductive patterns when viewed from the stacking direction.

17. 4. The electronic device according to claim 1, wherein the conductive pattern is bent along an in-plane direction of the laminate.

Images