Filler for electronic material and production method thereof, slurry composition for electronic equipment, electronic material, and electronic equipment production method

Abstract

To provide a filler for electronic materials which is different from a conventional filler for electronic materials.SOLUTION: Thin plate-shaped amorphous silica has been found to have a preferred property for a filler for electronic materials. That is, it has been found that controlling an orientation direction of the amorphous silica in a resin composition, with the amorphous silica being formed into a thin plate shape, results in the resultant resin composition which exhibits anisotropy in thermal expansion coefficient. Thus, it has been found that an electronic material having a desirable property can be attained by orienting a thin plate-shaped material to a direction in which low thermal expansion coefficient is required. The filler for electronic materials of the present invention includes the thin plate-shaped material including amorphous silica which is a plate-shaped matter and has (long side particle diameter in an extending direction) / (thickness) of 5 to 50.SELECTED DRAWING: Figure 1

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