Trimming processing device and trimming processing method

Abstract

To provide a trimming processing device and a trimming processing method that can simultaneously measure the shape of a processed portion during trimming of a workpiece.SOLUTION: A trimming processing device includes a processing table that holds a wafer and is rotatable around the θ axis, a first processing unit that is arranged on a first axis that intersects the θ axis and is capable of adjusting the amount and depth of cut, a second processing unit that is arranged on a second axis that intersects the first axis and also the θ axis and is capable of adjusting the amount and depth of cut, and a measuring unit that is arranged such that the wafer can be measured during trimming processing.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a trimming device and a trimming method. [Background technology]

[0002] A plurality of streets, called streets, are formed in a grid pattern on the surface of a roughly circular disk-shaped wafer (hereinafter sometimes referred to as the workpiece), and semiconductor devices such as ICs and LSIs are formed in these partitioned areas. The workpiece is cut along the streets to separate the semiconductor devices. To prevent cracks and dust generation during the process of forming the semiconductor devices, the outer periphery of the workpiece surrounding the area where the semiconductor devices are formed is trimmed.

[0003] To reduce the size and weight of semiconductor devices, the back surface of the workpiece is ground to a predetermined thickness before the workpiece is cut along the streets and divided into individual devices. However, grinding the back surface of the workpiece forms a so-called knife edge on the periphery of the workpiece. This can cause chipping from the periphery, potentially damaging the workpiece.

[0004] As a device for preventing damage to a workpiece, a trimming device has been proposed in which a grinding blade and a grinding wheel are arranged opposite each other on a line passing through the center of rotation of a processing table (i.e., a chuck table). With this trimming device, before grinding the back surface of the workpiece to a predetermined thickness, the outer periphery of the workpiece is cut and trimmed with a grinding blade. After trimming, the shape of the machined portion is measured to confirm the accuracy of the machined portion. After measuring the shape of the machined portion, the workpiece is removed from the processing table. By grinding the removed workpiece to a predetermined thickness, acute angles can be removed from the outer peripheral wall of the workpiece, resulting in a smooth outer peripheral wall. This prevents chipping from occurring on the outer peripheral wall of the workpiece and prevents damage to the workpiece (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-182366 Summary of the Invention [Problem to be solved by the invention]

[0006] However, conventional trimming devices require measuring the shape of the trimmed area after trimming to confirm the accuracy of the trimmed area, which increases the time required to trim the workpiece, including the shape measurement, and is therefore insufficient in terms of productivity.

[0007] The present invention has been made in consideration of the above-mentioned circumstances, and aims to provide a trimming device and a trimming method that can simultaneously measure the shape of the workpiece being trimmed while it is being trimmed, thereby enabling improved productivity. [Means for solving the problem]

[0008] In order to solve the above problems, the present invention proposes the following means. <1> A trimming device according to one embodiment of the present invention comprises a processing table that holds a workpiece and is rotatable around a rotation axis; a first processing unit that is arranged so that the workpiece can be trimmed on a first axis that intersects the rotation axis and that is capable of adjusting the amount of cut and depth of cut into the workpiece; a second processing unit that is arranged so that the workpiece trimmed by the first processing unit can be continuously processed on a second axis that intersects the first axis and the rotation axis and that is capable of adjusting the amount of cut and depth of cut into the workpiece; and a measuring unit that is arranged so that the workpiece can be measured during trimming of the workpiece and that is capable of adjusting the measurement position relative to the workpiece. <2> the above <1> In the trimming apparatus described in the above, the processing table may be movable in the X direction and the Y direction on an XY plane that forms a plane intersecting the rotation axis. <3> the above <1> or <2> In the trimming device described in , a processing axis column supporting the first processing unit and the second processing unit and a measurement axis column supporting the measuring unit may be independent. <4> the above <1> ~ <3> In the trimming processing device described in any one of the above, the measurement unit may be an optical line sensor that can simultaneously measure the outer peripheral wall and steps of the workpiece trimmed by the first processing unit and the second processing unit. <5> the above <1> ~ <4> The trimming processing apparatus described in any one of the above items may include a protective wall that protects the measuring section from processing water. <6> the above <1> ~ <5> In any one of the trimming apparatuses described above, the first processing unit and the second processing unit may be provided with a truing stage. <7> the above <1> ~ <6> In any one of the trimming apparatuses described above, the truing stage may be a rotary stage.

[0009] <8> In addition, in a trimming method according to another aspect of the present invention, a first processing and measurement and a second processing are performed consecutively while the wafer is rotating. <9> the above <8> In the trimming method described in the above, the grinding accuracy of the wafer may be checked continuously after the second processing. [Effects of the Invention]

[0010] According to the present invention, the shape of the workpiece can be measured simultaneously during trimming of the workpiece. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view showing a basic configuration of a trimming device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a plan view showing the basic configuration of the trimming device according to the embodiment. [Figure 3] 3 is a plan view showing a state in which each component of the trimming device according to the embodiment is arranged at a trimming position. FIG. [Figure 4]4 is a cross-sectional view showing a state in which a wafer is being trimmed by a first processing unit of the trimming apparatus according to the embodiment. FIG. [Figure 5] FIG. 4 is a cross-sectional view showing a state in which a wafer is being trimmed by a second processing unit of the trimming apparatus according to the embodiment. [Figure 6] FIG. 10 is a plan view illustrating a first trimming step in which the outer periphery of the wafer is trimmed by a first processing unit of the trimming apparatus according to the embodiment. [Figure 7] 10 is a plan view illustrating an example of measuring a first step portion by a second measuring unit of the trimming device according to the embodiment. FIG. [Figure 8] 10 is a plan view illustrating an example in which a first step portion is trimmed into a second step portion by a second processing unit of the trimming device according to the embodiment. FIG. [Figure 9] 10 is a plan view illustrating an example in which the second processing unit of the trimming device according to the embodiment continuously trims the first step portion to the second step portion. FIG. [Figure 10] 10 is a plan view illustrating an example in which the second processing unit of the trimming device according to the embodiment continues to trim the first step portion to a second step portion. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, a trimming device according to one embodiment of the present invention will be described with reference to the drawings. In the following embodiments, when the number, numerical value, amount, range, etc. of components are mentioned, unless otherwise specified or when it is clearly limited to a specific number in principle, the number is not limited to the specific number, and may be more or less than the specific number.

[0013] Furthermore, when referring to the shape or positional relationship of components, etc., it includes things that are substantially similar or approximate to those shapes, etc., unless otherwise specified or when it is clearly considered otherwise in principle.

[0014] In addition, the drawings may exaggerate characteristic parts to make the features easier to understand, and the dimensional proportions of the components may not be the same as in reality. In addition, in cross-sectional views, hatching of some components may be omitted to make the cross-sectional structure of the components easier to understand.

[0015] FIG. 1 is a perspective view showing the basic configuration of a trimming apparatus according to an embodiment of the present invention. FIG. 2 is a plan view showing the basic configuration of the trimming apparatus. FIG. 3 is a plan view showing the components of the trimming apparatus arranged at the trimming position. As shown in FIGS. 1 to 3, the trimming apparatus 1 is an apparatus that trims the outer periphery Wa of a wafer (workpiece) W. The trimming apparatus 1 includes a processing table 2, a first processing unit 3, a second processing unit 4, a measuring unit 5, a first truing stage 6, and a second truing stage 7.

[0016] The processing table 2 is mounted on a stage 10 on a base 8. In a plan view, the processing table 2 has an upper surface 2a formed in a circular shape from a porous ceramic material. The processing table 2 is a chuck table that can hold a wafer W placed on the upper surface 2a by sucking it with a suction means (not shown). The stage 10 is configured to be able to move the processing table 2 in the X, Y, and Z directions, and also to be able to rotate the processing table 2 in the direction of arrow A (e.g., clockwise) around the θ axis (rotation axis) 12, as shown in FIG.

[0017] Hereinafter, the directions of one side 10a and the other side 10b of the stage 10 are designated as the X direction and the Y direction, respectively, and are indicated by arrows X and Y. Here, the XY plane forms a plane that intersects (in the embodiment, is perpendicular to) the θ axis 12. The up-down direction perpendicular to the XY plane is designated as the Z direction and is indicated by arrow Z. Furthermore, one side and the other side of the X direction, Y direction, and Z direction are designated by (Xa, Xb, Ya, Yb, Za, Zb).

[0018] The stage 10 can move the processing table 2 in the X and Y directions. That is, by moving the processing table 2 in the X and Y directions, the stage 10 can align the wafer W held on the upper surface 2a of the processing table 2 with the θ-axis 12. Therefore, if the center Wo of the wafer W held on the upper surface 2a is misaligned with the θ-axis 12, the stage 10 can correct the misalignment with the θ-axis 12 by moving the processing table 2 in the X and Y directions. This allows the center Wo of the wafer W to be aligned with the θ-axis 12, as shown in FIG. 3.

[0019] Here, as shown in Fig. 2, the wafer W is loaded onto the processing table 2 toward the arrow Yb side as indicated by the arrow B. Furthermore, when being unloaded, the wafer W is unloaded from the upper surface 2a of the processing table 2 toward the arrow Ya side as indicated by the arrow C as shown in Fig. 3. Hereinafter, the area on the processing table 2 where the wafer W is loaded and unloaded may be referred to as the "loading / unloading area E."

[0020] 2 and 3, the first processing unit 3 is disposed on the arrow Xb side of the processing table 2 at a position avoiding the loading / unloading area E. The first processing unit 3 performs trimming by roughly cutting the outer periphery Wa of the wafer W held on the processing table 2. The first processing unit 3 includes a first spindle 21 and a rough grinding blade 23.

[0021] The first spindle 21 is supported by the processing axis column 25 so as to be movable in the X and Z directions. In detail, as shown in FIG. 1, the first spindle 21 is movable in the X direction by a first X carriage 251, and movable in the Z direction by a first Z carriage 252. The first spindle 21 is disposed on a straight line 26 (hereinafter sometimes referred to as the first axis 26) that intersects with (or is perpendicular to in the embodiment) the θ axis 12 of the stage 10. The first spindle 21 is rotatable by a drive source (not shown).

[0022] FIG. 4 is a cross-sectional view showing a state in which a wafer is trimmed in the first processing unit of the trimming device. As shown in FIGS. 3 and 4, a rough grinding blade 23 is provided at the tip of the first spindle 21. The rough grinding blade 23 can be moved in the X and Z directions by moving the first spindle 21 in the X and Z directions. The rough grinding blade 23 is rotated by the first spindle 21 so as to be able to roughly grind the outer periphery Wa of the wafer W. The rough grinding blade 23 can perform trimming by roughly grinding the outer periphery Wa of the wafer W. The outer periphery Wa of the wafer W is a surplus region surrounding a device region in which devices are formed on the wafer W. The rough grinding blade 23 roughly grinds the outer periphery Wa of the wafer W, thereby trimming the outer periphery Wa into a stepped shape.

[0023] Hereinafter, the portion trimmed into a stepped shape by the rough grinding blade 23 may be referred to as the "first stepped portion Wb." The first stepped portion Wb is formed in a stepped shape by a first outer peripheral wall (outer peripheral wall) Wc and a first step (step) Wd. The rough grinding blade 23 can adjust the amount of cut into the first outer peripheral wall Wc by moving in the X direction. The rough grinding blade 23 can adjust the cutting depth of the first step Wd by moving in the Z direction.

[0024] 2 and 3, the second processing unit 4 is disposed on the arrow Yb side of the processing table 2 at a position avoiding the loading / unloading area E. The second processing unit 4 performs trimming by precision grinding the outer periphery Wa of the wafer W held on the processing table 2. The second processing unit 4 includes a second spindle 31 and a precision grinding blade 33.

[0025] The second spindle 31 is supported by the processing axis column 25 so as to be movable in the Y and Z directions. In detail, as shown in FIG. 1, the second spindle 31 is movable in the Y direction by a first Y carriage 253 and in the Z direction by a second Z carriage 254. The second spindle 31 is disposed on a straight line 36 (hereinafter sometimes referred to as the second axis 36) that intersects (orthogonal in the embodiment) the θ axis 12 of the stage 10. The second spindle 31 is rotatable by a drive source (not shown). The first axis 26 of the first spindle 21 and the second axis 36 of the second spindle 31 intersect at the θ axis 12. Hereinafter, the point where the first axis 26 and the second axis 36 intersect will be referred to as the "intersection 38."

[0026] 2 and 3, the second spindle 31 is disposed on a second axis 36 that is perpendicular to the first axis 26 of the first spindle 21. That is, the first axis 26 of the first spindle 21 and the second axis 36 of the second spindle 31 intersect at a point 38 so as to be perpendicular to each other. In the embodiment, an example will be described in which the first axis 26 of the first spindle 21 and the second axis 36 of the second spindle 31 are perpendicular to each other at the point 38, but this is not limiting. The angle at which the first axis 26 and the second axis 36 intersect at the point 38 can be selected arbitrarily.

[0027] 5 is a cross-sectional view showing a state in which a wafer is trimmed in the second processing unit of the trimming device. As shown in FIGS. 3 and 5, a precision grinding blade 33 is provided at the tip of the second spindle 31. The precision grinding blade 33 can be moved in the Y and Z directions by moving the second spindle 31 in the Y and Z directions. The precision grinding blade 33 is rotated by the second spindle 31 so as to be able to precision grind the outer periphery Wa of the wafer W. The precision grinding blade 33 can trim the first step Wb by continuously precision grinding the first step Wb in the outer periphery Wa of the wafer W.

[0028] Hereinafter, the portion of the first step portion Wb trimmed by the precision grinding blade 33 may be referred to as the "second step portion We." The second step portion We is formed in a stepped shape by a second outer peripheral wall (outer peripheral wall) Wf and a second step (step) Wg. The precision grinding blade 33 can adjust the amount of cut of the second outer peripheral wall Wf by moving in the Y direction. The precision grinding blade 33 can adjust the depth of cut of the second step Wg by moving in the Z direction.

[0029] Here, when the outer peripheral portion Wa of the wafer W is ground with the rough grinding blade 23 of the first processing unit 3 and the fine grinding blade 33 of the second processing unit 4, processing water is supplied to the area to be ground. Therefore, it is preferable that the trimming processing device 1 is provided with a protective wall that protects the measuring unit 5, which will be described later, from the processing water.

[0030] As shown in FIGS. 2 and 3, the measurement unit 5 is disposed on the arrow Xa side of the processing table 2 at a position avoiding the carry-in / out area E. The measurement unit 5 is supported by a measurement axis column 41 so as to be movable in the X and Z directions. In detail, as shown in FIG. 1, the measurement unit 5 is movable in the X direction by a second X carriage 411, and movable in the Z direction by a third Z carriage 412. The measurement unit 5 includes a first measurement unit 43 and a second measurement unit 44.

[0031] The first measurement unit 43 is positioned so as to be able to measure the outer periphery Wa of the wafer W during trimming of the outer periphery Wa. The first measurement unit 43 can adjust its measurement position relative to the wafer W by moving the measurement unit 5 in the X and Z directions. The first measurement unit 43 measures the position of the outer periphery Wa of the wafer W. For example, an optical microscope is used for the first measurement unit 43. By using an optical microscope for the first measurement unit 43, the first outer periphery wall Wc and the first step Wd trimmed by the rough grinding blade 23 can be simultaneously measured. Furthermore, the second outer periphery wall Wf and the second step Wg trimmed by the fine grinding blade 33 can be simultaneously measured. The first measurement unit 43 is not limited to an optical microscope, and other measuring devices such as an optical line sensor may also be used.

[0032] The first measurement unit 43 detects the position of the center Wo of the wafer W, for example, by measuring three points on the outer periphery Wa of the wafer W. Based on the detected position of the center Wo of the wafer W, the processing table 2 is moved in the X and Y directions by the stage 10. This makes it possible to correct the misalignment between the center Wo of the wafer W and the center of the θ axis 12. This allows the center Wo of the wafer W to be aligned with the center of the θ axis 12 and also with the intersection 38 of the first axis 26 of the first spindle 21 and the second axis 36 of the second spindle 31.

[0033] The second measurement unit 44 is positioned so as to be able to measure the outer periphery Wa of the wafer W during trimming of the outer periphery Wa. The second measurement unit 44 can adjust its measurement position relative to the wafer W by moving the measurement unit 5 in the X and Z directions. The second measurement unit 44 measures the first step Wb and the second step We during trimming of the outer periphery Wa of the wafer W. The second measurement unit 44 may be, for example, an optical line sensor. By using an optical line sensor in the second measurement unit 44, the first step Wd and the first outer periphery wall We trimmed by the rough grinding blade 23 can be simultaneously measured. Furthermore, the second step Wg and the second outer periphery wall Wf trimmed by the fine grinding blade 33 can be simultaneously measured. The second measurement unit 44 is not limited to an optical line sensor, and other measuring devices such as a camera may also be used.

[0034] The second measuring unit 44 measures, for example, the first outer peripheral wall Wc and first step Wd of the first step portion Wb, and the second outer peripheral wall Wf and second step Wg of the second step portion We. Based on the measured first step portion Wb and second step portion We, the cutting amount and cutting depth of the rough grinding blade 23 of the first processing unit 3 are calculated. The cutting amount and cutting depth of the fine grinding blade 33 of the second processing unit 4 are also calculated. Based on the calculated cutting amount and cutting depth, the rough grinding blade 23 is moved in the X and Z directions. The fine grinding blade 33 is also moved in the Y and Z directions. This makes it possible to correct the cutting amount and cutting depth of the first step portion Wb and the second step portion We.

[0035] The first truing stage 6 is disposed below the first processing unit 3 (i.e., on the arrow Za side). Specifically, the first truing stage 6 is disposed on the arrow Xb side of the processing table 2 at a position avoiding the loading / unloading area E. The first truing stage 6 trues the rough grinding blade 23 provided in the first processing unit 3, thereby finishing the rough grinding blade 23 into a shape that allows for accurate trimming of the first step portion Wb. The first truing stage 6 is preferably a rotary stage.

[0036] The second truing stage 7 is disposed below the second processing unit 4 (i.e., on the arrow Za side). Specifically, the second truing stage 7 is disposed on the arrow Yb side of the processing table 2 at a position avoiding the load / unload area E. The second truing stage 7 trues the precision grinding blade 33 provided in the second processing unit 4, thereby finishing the precision grinding blade 33 into a shape that can be used to trim the second step portion We. The second truing stage 7 is preferably a rotary stage.

[0037] As described above, the first processing unit 3 and the first truing stage 6 are disposed at positions avoiding the carry-in / out area E on the arrow Xb side of the processing table 2. The second processing unit 4 and the second truing stage 7 are disposed at positions avoiding the carry-in / out area E on the arrow Yb side of the processing table 2. The measuring unit 5 is disposed at a position avoiding the carry-in / out area E on the arrow Xa side of the processing table 2. In other words, the trimming device 1 is provided with the first processing unit 3, the second processing unit 4, the measuring unit 5, the first truing stage 6, and the second truing stage 7 at positions avoiding the carry-in / out area E.

[0038] Next, an example of trimming the outer periphery Wa of the wafer W using the trimming device 1 will be described with reference to FIGS. 2 and 3, in the wafer holding step, the wafer W is placed on the upper surface 2a of the processing table 2. The wafer W placed on the upper surface 2a is sucked by a suction means (not shown), thereby holding the wafer W on the upper surface 2a.

[0039] In the wafer positioning process, the position of the center Wo of the wafer W is detected by measuring the outer periphery Wa of the wafer W with the first measurement unit 43. Based on the detected position of the center Wo of the wafer W, the processing table 2 is moved in the X and Y directions by the stage 10. As a result, the center Wo of the wafer W is aligned with the center of the θ axis 12 and also with the intersection 38 of the first axis 26 of the first spindle 21 and the second axis 36 of the second spindle 31. Furthermore, while the wafer W is rotating, the stage 10 is controlled so that the center Wo of the wafer W is always positioned at the intersection 38.

[0040] 6 is a plan view illustrating the first trimming step in which the outer periphery of the wafer is trimmed by the first processing unit of the trimming device. As shown in FIGS. 4 and 6, in the first trimming step, the rough grinding blade 23 is rotated by the first spindle 21 of the first processing unit 3. In this state, the rough grinding blade 23 is moved in the X direction to position the outer periphery Wa of the wafer W at a predetermined cutting depth. The rough grinding blade 23 is also moved in the Z direction to position the outer periphery Wa at a predetermined cutting depth.

[0041] After positioning the rough grinding blade 23, the wafer W is rotated in the direction of arrow A (clockwise direction) on the processing table 2. The outer peripheral portion Wa of the wafer W is roughly ground into a first step portion Wb by the rough grinding blade 23. In the first trimming step, processing water is supplied to the portion where the outer peripheral portion Wa is roughly ground by the rough grinding blade 23 (i.e., the first step portion Wb).

[0042] The wafer W continues to rotate in the direction of arrow A. Therefore, the first step portion Wb continues to be roughly ground by the rough grinding blade 23. As the wafer W continues to rotate, the first trimming start position Wh, where the first trimming process started, rotates together with the wafer W in the direction of arrow A. By rotating the wafer W 1 / 2 turn from the first processing unit 3 in the direction of arrow A, the first trimming start position Wh reaches the second measuring unit 44 of the measuring unit 5.

[0043] FIG. 7 is a plan view illustrating an example of measuring the first step portion using the second measurement unit of the trimming device. As shown in FIGS. 4 and 7, during the measurement process, the wafer W continues to rotate in the direction of arrow A. In this state, the second measurement unit 44 is moved in the X and Z directions to position the second measurement unit 44 at the measurement position for the first step portion Wb. The first outer peripheral wall Wc and first step Wd of the first step portion Wb are measured by the second measurement unit 44. The measurement results of the first step portion Wb are reflected in the cutting amount, cutting depth, etc. of the precision grinding blade 33 in the second processing unit 4. After measuring the first step portion Wb, the wafer W continues to rotate. By rotating the wafer W a quarter turn in the direction of arrow A from the second measurement unit 44, the first trimming start position Wh arrives at the second processing unit 4.

[0044] 8 is a plan view illustrating an example of trimming the first step portion to the second step portion by the second processing unit of the trimming device. As shown in FIGS. 5 and 8, in the second trimming step, the wafer W continues to rotate in the direction of arrow A. In this state, the second spindle 31 of the second processing unit 4 rotates the precision grinding blade 33. While the precision grinding blade 33 is rotating, the precision grinding blade 33 is moved in the Y and Z directions based on the measurement results of the first step portion Wb measured by the second measurement unit 44.

[0045] The precision grinding blade 33 is moved in the Y direction to position the first step portion Wb at a position where it will be precision ground with a predetermined cutting depth. Furthermore, the precision grinding blade 33 is moved in the Z direction to position the first step portion Wb at a position where it will be precision ground with a predetermined cutting depth. With the precision grinding blade 33 positioned, the first step portion Wb of the wafer W is precision ground into a second step portion We by the precision grinding blade 33. In the second trimming step, processing water is supplied to the area where the first step portion Wb is ground by the precision grinding blade 33 (i.e., the second step portion We).

[0046] FIG. 9 is a plan view illustrating an example in which the second processing unit of the trimming device continues trimming the first step portion to the second step portion. As shown in FIG. 9, the wafer W continues to rotate in the direction of arrow A. Therefore, the second step portion We is continuously precision ground by the precision grinding blade 33. As the wafer W continues to rotate, the second trimming start position Wi, where the second trimming process began, rotates together with the wafer W in the direction of arrow A. By rotating the wafer W a quarter turn in the direction of arrow A from the second processing unit 4, the second trimming start position Wi reaches the first processing unit 3. As a result, the wafer W rotates one full turn about the θ-axis 12. As the wafer W makes one rotation, three-quarters of the region Wj of the outer periphery Wa of the wafer W is roughly ground into the first step portion Wb by the rough grinding blade 23. In this state, rough grinding of the outer periphery Wa by the rough grinding blade 23 is stopped.

[0047] FIG. 10 is a plan view illustrating an example in which the second processing unit of the trimming device continues trimming the first step portion to a second step portion. As shown in FIG. 10, the wafer W continues to rotate in the direction of arrow A by 3 / 4 rotation. By continuing to rotate the wafer W by 3 / 4 rotation, the second trimming start position Wi moves from the first processing unit 3 to the second processing unit 4. Therefore, the entire circumference of the outer periphery Wa of the wafer W is precision ground to the second step portion We by the precision grinding blade 33. As a result, by rotating the wafer W by [1 + (3 / 4)] about the θ axis 12, the entire circumference of the outer periphery Wa is precision ground to the second step portion We by the precision grinding blade 33.

[0048] 3, in the unloading step, the rotation of the wafer W is stopped after the wafer W has been rotated by [1 + (3 / 4)]. After the rotation of the wafer W is stopped, the wafer W is unloaded from the processing table 2 as shown by arrow C through the loading / unloading area E. This completes the step of trimming the wafer W by the trimming device 1.

[0049] Here, in the step of trimming the wafer W, the grinding accuracy of the second step portion We may be confirmed in a state in which the wafer W is rotated [1 + (3 / 4)] and the entire circumference of the outer periphery Wa of the wafer W is precision ground into the second step portion We by the precision grinding blade 33. Specifically, after precision grinding of the second step portion We by the precision grinding blade 33 of the second processing unit 4 is completed, the second measuring unit 44 may measure the second step portion We to confirm that the second step portion We has been precision ground with high accuracy.

[0050] 2, after the wafer W is carried out from the processing table 2, the rough grinding blade 23 may be trued as needed on the first truing stage 6. Also, the fine grinding blade 33 may be trued as needed on the second truing stage 7.

[0051] In the embodiment, an example is described in which the outer peripheral portion Wa of the wafer W is trimmed into a stepped shape using the rough grinding blade 23 of the first processing unit 3 and the fine grinding blade 33 of the second processing unit 4. However, this is not limited to this. As another example, the outer peripheral portion Wa of the wafer W may be trimmed into a groove. Alternatively, the outer peripheral portion Wa of the wafer W may be trimmed by cutting it off. The same blade, for example, a rough grinding blade or a fine grinding blade, may be used for both the first processing unit 3 and the second processing unit 4. In this case, trimming may be started by the first processing unit 3, and the second processing unit 4 may start trimming after rotating the wafer W 1 / 4 of a turn (90°). After the second processing unit 4 starts trimming and rotates the wafer W 1 / 2 of a turn (180°), i.e., after a total of 3 / 4 of a turn, the rotation of the wafer W may be stopped.

[0052] According to the trimming apparatus 1 described above, as shown in FIGS. 2 and 3, the first axis 26 and the second axis 36 are intersected, allowing the first processing unit 3 and the second processing unit 4 to be positioned so as to intersect. This allows the measurement unit 5 to be positioned to avoid the wafer W loading / unloading area E. This allows the first step Wb trimmed by the rough grinding blade 23 of the first processing unit 3 to be simultaneously measured by the first measurement unit 43 and the second measurement unit 44 of the measurement unit 5 during trimming of the wafer W. Furthermore, the second step We trimmed by the fine grinding blade 33 of the second processing unit 4 to be simultaneously measured by the first measurement unit 43 and the second measurement unit 44 of the measurement unit 5 during trimming of the wafer W. Furthermore, while the wafer W is rotating, the first processing (processing by the first processing unit 3) and measurement and the second processing (processing by the second processing unit 4) can be performed consecutively. Furthermore, the grinding accuracy of the wafer W can be continuously confirmed after the second processing. Therefore, the time required for trimming the outer peripheral portion Wa of the wafer W can be shortened, thereby improving productivity.

[0053] In addition, the processing table 2 is movable in the X and Y directions. Therefore, by moving the processing table 2 in the X and Y directions, it is possible to correct the deviation of the center Wo of the wafer W with respect to the θ-axis 12. In other words, it is possible to align the center Wo of the wafer W with the θ-axis 12. This allows the rough grinding blade 23 of the first processing unit 3 and the fine grinding blade 33 of the second processing unit 4 to trim the outer periphery Wa of the wafer W with high precision.

[0054] Furthermore, the first measuring unit 43 of the measuring unit 5 is an optical microscope, and the second measuring unit 44 is an optical line sensor. Therefore, the first step Wd and second outer wall Wf of the first stepped portion Wb trimmed by the rough grinding blade 23 of the first processing unit 3 can be measured simultaneously. Also, the second step Wg and second outer wall Wf of the second stepped portion We trimmed by the fine grinding blade 33 of the second processing unit 4 can be measured simultaneously. This improves the measurement accuracy of the first measuring unit 43 and the second measuring unit 44. Furthermore, the optical microscope can also measure chipping that occurs in the inner region.

[0055] The measurement results from the first measuring unit 43 and the second measuring unit 44 are reflected in the positioning of the rough grinding blade 23 in the first processing unit 3 and the positioning of the fine grinding blade 33 in the second processing unit 4. This improves the precision of trimming the outer periphery Wa of the wafer W by the rough grinding blade 23 in the first processing unit 3 and the fine grinding blade 33 in the second processing unit 4. Furthermore, the condition of the blade grindstone can be estimated from the measurement results, and it can be determined whether truing is necessary.

[0056] The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

[0057] For example, in the above-described embodiment, an example has been described in which the measurement unit 5 is provided with the first measurement unit 43 and the second measurement unit 44, but this is not limiting. For example, the first measurement unit 43 may be separated from the measurement unit 5 and provided at another position that avoids the carry-in / out area E.

[0058] For example, the first measurement unit 43 and the second measurement unit 44 are arranged in the radial direction of the wafer, but this is not limiting. For example, the first measurement unit 43 and the second measurement unit 44 may be arranged in the circumferential direction of the wafer so that both measurement units can measure the wafer simultaneously while the wafer is rotating.

[0059] In addition, the components in this embodiment can be replaced with well-known components as appropriate, without departing from the spirit of the present invention. [Explanation of symbols]

[0060] 1 Trimming equipment 2 Processing table 3 1st processing section 4 2nd processing section 5 Measuring part 12 θ axis (rotation axis) 23 Rough grinding blade 26 1st axis 33 Precision grinding blade 36 2nd axis 43 1st measurement section 44 Second measurement section E Loading / unloading area W Wafer (work) Wa: Outer periphery of wafer Wb First step Wc 1st outer wall (outer wall) Wd 1st step (step) We 2nd step Wf 2nd outer wall (outer wall) Wg 2nd Step (Step)

Claims

1. a processing table that holds a workpiece and is rotatable around a rotation axis; a first processing unit that is disposed so as to be able to trim the workpiece on a first axis that intersects with the rotation axis, and that is capable of adjusting the cutting amount and cutting depth of the workpiece; a second machining unit that is disposed on a second axis that intersects the first axis and the rotation axis so as to be able to continuously machine the workpiece that has been trimmed by the first machining unit, and that is capable of adjusting the amount and depth of cut into the workpiece; a measuring unit that is arranged so as to be able to measure the workpiece during trimming of the workpiece, and that is capable of adjusting a measurement position relative to the workpiece.

2. 2. The trimming apparatus according to claim 1, wherein the processing table is movable in the X and Y directions on an XY plane that forms a plane intersecting the rotation axis.

3. 3. The trimming device according to claim 1, wherein a processing axis column supporting the first processing unit and the second processing unit and a measuring axis column supporting the measuring unit are independent from each other.

4. 3. The trimming device according to claim 1, wherein the measuring unit is an optical line sensor that can simultaneously measure the outer peripheral wall and steps of the workpiece trimmed by the first processing unit and the second processing unit.

5. The trimming device according to claim 1 or 2, further comprising a protective wall for protecting the measuring unit from processing water.

6. The trimming device according to claim 1 or 2, wherein the first processing unit and the second processing unit are provided with a truing stage.

7. 7. The trimming apparatus according to claim 6, wherein the truing stage is a rotary stage.

8. A trimming method in which the first processing and measurement and the second processing are performed consecutively while the wafer is rotating.

9. 9. The trimming method according to claim 8, further comprising the step of continuously checking the grinding accuracy of the wafer after the second processing.

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