Tape application device

Abstract

To shorten the process of applying tape to a workpiece.SOLUTION: In a tape application device 10, a tape material 18 is applied to a workpiece, and a dicing tape 18A of the tape material 18 is adhered to the workpiece W by a die attachment film 18B of the tape material 18. Here, a hot air device 38 heats the tape material 18. This increases the heating speed of the die attachment film 18B, shortens the time required to heat the die attachment film 18B, and thereby shortens the process of applying the tape material to the workpiece.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a tape application device for applying a tape material to a workpiece. [Background technology]

[0002] In the wafer fastening device described in Patent Document 1 below, an adhesive layer is integrally provided on the dicing tape, and the dicing tape is adhered to the wafer by the adhesive layer while the wafer is held on a wafer table.

[0003] In this wafer fixing device, the wafer table is heated by a heater, and the adhesive layer is heated through the wafer, softening the adhesive layer and increasing the adhesive strength of the adhesive layer of the dicing tape to the wafer. However, when the wafer table is heated, it takes time for the dicing tape to warm up, and the wafer with the dicing tape attached cannot be subjected to the next process until the wafer table reaches the appropriate temperature. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-308033 Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION In consideration of the above, an object of the present invention is to provide a tape applying device that can shorten the process of applying tape to a workpiece. [Means for solving the problem]

[0006] A tape application device according to a first aspect of the present invention includes an application mechanism that applies a tape material, which has an adhesive layer integrally formed on a dicing tape, to a workpiece, thereby adhering the dicing tape to the workpiece by the adhesive layer, and a heating mechanism that heats the tape material.

[0007] A tape application device according to a second aspect of the present invention is the tape application device according to the first aspect of the present invention, wherein the heating mechanism blows hot air onto the tape to heat the tape.

[0008] A tape application device of a third aspect of the present invention is a tape application device of the first or second aspect of the present invention, which is provided in the application mechanism, and which peels off the release material on the adhesive layer side of the tape material before the application mechanism applies the tape material to the workpiece, and which the heating mechanism uses to heat the tape material.

[0009] A fourth aspect of the tape application device of the present invention is the tape application device of any one of the first to third aspects of the present invention, wherein the application mechanism includes a pressing member that presses the tape material against the workpiece to apply the tape material to the workpiece, and the heating mechanism heats the tape material.

[0010] A tape application device of a fifth aspect of the present invention is a tape application device of any one of the first to fourth aspects of the present invention, further comprising a holder that holds the workpiece when the application mechanism applies the tape to the workpiece and cools the tape. [Effects of the Invention]

[0011] In the tape application device of the first aspect of the present invention, an adhesive layer is integrally provided on the dicing tape of the tape material, and the application mechanism applies the tape material to the workpiece, so that the dicing tape is adhered to the workpiece by the adhesive layer.

[0012] Here, the heating mechanism heats the tape, which increases the heating speed of the adhesive layer of the tape, shortens the time it takes to heat the adhesive layer, and shortens the process of applying the tape to the workpiece.

[0013] In the tape application device of the second aspect of the present invention, the heating mechanism blows hot air onto the tape to heat it, which makes it easy to heat the tape.

[0014] In the tape application device of the third aspect of the present invention, before the application mechanism applies the tape to the workpiece, the peeling member of the application mechanism peels off the release material on the adhesive layer side of the tape.

[0015] Here, the heating mechanism heats the tape material through the peeling member, so that the heating mechanism can heat the tape material.

[0016] In the tape application device of the fourth aspect of the present invention, the pressing member of the application mechanism presses the tape against the workpiece, and the tape is applied to the workpiece.

[0017] Here, the heating mechanism heats the tape material via the pressing member, so that the heating mechanism can heat the tape material.

[0018] In the tape applying device of the fifth aspect of the present invention, the holder holds the workpiece when the applying mechanism applies the tape to the workpiece.

[0019] Here, the holder cools the tape, so that the tape attached to the workpiece can be cooled. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a front view showing a tape application device according to a first embodiment of the present invention. [Figure 2] 1 is a front perspective view showing a tape application device according to a first embodiment of the present invention, viewed diagonally from the right. [Figure 3] FIG. 2 is a perspective view showing a mount table unit of the tape applying device according to the first embodiment of the present invention, viewed diagonally from the front right. [Figure 4] FIG. 10 is a front view showing a tape application device according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0021] [First embodiment] Fig. 1 shows a front view of a tape application device 10 according to a first embodiment of the present invention, and Fig. 2 shows a perspective view of the tape application device 10 as seen from diagonally right in front. In the drawings, the front of the tape application device 10 is indicated by an arrow FR, the right of the tape application device 10 is indicated by an arrow RH, and the top of the tape application device 10 is indicated by an arrow UP.

[0022] As shown in FIGS. 1 and 2, a tape application device 10 according to this embodiment is provided with an application mechanism 12.

[0023] The application mechanism 12 is provided with an unwinder 14 that can rotate to unwind the tape. A long tape body 16 is wound around the unwinder 14, and a tape material 18 is provided on the tape body 16. A dicing tape 18A is provided on the tape material 18, and the dicing tape 18A is provided with a base layer and an adhesive layer. A die attachment film (DAF) 18B serving as an adhesive layer is integrally formed on the adhesive layer side of the dicing tape 18A, and the die attachment film 18B is a tacky adhesive layer and has thermoplastic properties. In addition, a separator 20 serving as a release material is attached to the die attachment film 18B side of the tape material 18 (the side of the die attachment film 18B opposite the dicing tape 18A).

[0024] The joining mechanism 12 is rotatably provided with an upper roller 22, a pair of first nip rollers 24, and a guide roller 26, and the tape body 16 pulled out from the unwinder 14 is wound around the upper roller 22, then wound around the pair of first nip rollers 24 while sandwiched between them, and then wound around the guide roller 26.

[0025] A plate-shaped peel plate 28 (knife plate) serving as a peeling member is provided at the lower end of the joining mechanism 12, and the peel plate 28 is disposed near the lower side of the guide roller 26. The tip of the peel plate 28 is oriented downward toward the left, and the thickness of the tip of the peel plate 28 becomes thinner toward the tip side of the peel plate 28. The separator 20 of the tape body 16 coming from the guide roller 26 is folded back at the tip of the peel plate 28 and peeled off from the tape material 18 of the tape body 16, and the tape material 18 extends to the left from the tip of the peel plate 28.

[0026] The bonding mechanism 12 is provided with a pair of second nip rollers 30 and a dancer roller 32 that are rotatable, and the separator 20 folded back by the leading end of the peel plate 28 is sandwiched between the pair of second nip rollers 30, wound around the pair of second nip rollers 30, and then wound around the dancer roller 32.

[0027] The joining mechanism 12 is provided with a winder 34 (shaft) that can rotate to wind up the tape, and the separator 20 from the dancer roller 32 is connected to the winder 34. The winder 34 is rotatably driven, and when the winder 34 is rotated and the separator 20 is wound onto the winder 34, the tape body 16 is pulled out (unwound) from the unwinder 14, and the tape body 16 is moved in the longitudinal direction.

[0028] The joining mechanism 12 is rotatably provided with a press roller 36 (pressing roller or pressing roller) as a pressing member, and the press roller 36 is disposed near the left side of the peel plate 28. The lower end of the press roller 36 protrudes below the joining mechanism 12, and the press roller 36 is capable of pressing downward the tape material 18 that extends leftward from the tip of the peel plate 28.

[0029] The application mechanism 12 is provided with a hot air device 38 as a heating mechanism, and the hot air device 38 generates hot air using, for example, a far-infrared heater, and blows the hot air onto the tape body 16 near and above the tip of the peel plate 28.

[0030] A mount table unit 40 (see FIG. 3) serving as a holder is provided below the attachment mechanism 12, and the upper wall of the mount table unit 40 serves as a mount table 40A serving as a holding member.

[0031] An approximately annular concave outer table 42A is provided on the outer periphery of the mount table 40A, and an approximately annular plate-shaped ring frame 44 (dicing ring) serving as an outer peripheral member is transported to, placed on, and fitted to the outer table 42A.

[0032] A substantially circular inner table 42B is provided on the inner periphery of the mount table 40A, and the inner table 42B is arranged coaxially with the outer table 42A. A circular suction body 46 is provided coaxially above the inner periphery of the inner table 42B, and a circular workpiece W, which is a semiconductor substrate such as a silicon wafer, is transported and placed on the upper surface of the suction body 46. The suction body 46 is made of a porous material and has numerous pores. A vacuum source and a compressed air source (not shown) are switchably connected to the suction body 46. When the vacuum source is connected to the suction body 46 and activated, a negative pressure is generated between the workpiece W and the upper surface (suction surface) of the suction body 46, and the workpiece W is suction-held on the upper surface of the suction body 46. Thereafter, a compressed air source is connected to the adsorber 46, and when the compressed air source is activated, compressed air (release air) is supplied between the workpiece W and the upper surface of the adsorber 46, thereby releasing the workpiece W from its adsorption onto the upper surface of the adsorber 46.

[0033] The mount table unit 40 is provided with a transport mechanism (not shown), and the mount table unit 40 is made movable (slidable) in the left-right direction by the transport mechanism.

[0034] Next, the operation of this embodiment will be described.

[0035] In the tape application device 10 configured as described above, the ring frame 44 is transported to, placed on, and fitted to the outer peripheral table 42A of the mount table 40A in the mount table unit 40. Then, the workpiece W is transported to and placed on the upper surface of the adsorption body 46 on the inner peripheral table 42B of the mount table 40A. Furthermore, a vacuum source is connected to the adsorption body 46, and when the vacuum source is activated, the workpiece W is adsorbed and held on the upper surface of the adsorption body 46.

[0036] Thereafter, in the joining mechanism 12, the winder 34 is rotationally driven, and the separator 20 of the tape body 16 is wound onto the winder 34, thereby pulling out the tape body 16 from the unwinder 14 and moving the tape body 16 in the longitudinal direction. As a result, the leading edge of the peel plate 28 peels the separator 20 from the tape material 18 of the tape body 16, and the tape material 18 extends to the left from the leading edge of the peel plate 28. At this time, the mount table unit 40 is moved to the left by the transport mechanism. As a result, the tape material 18 extending to the left from the leading edge of the peel plate 28 is pressed against the upper surface (including the ring frame 44 and the workpiece W) of the mount table 40A by the press roller 36 of the joining mechanism 12, and extends from the left end to the right end of the upper surface of the mount table 40A. As a result, the tape material 18 is attached to the ring frame 44 and the workpiece W, and the dicing tape 18A of the tape material 18 is attached to the ring frame 44 and the workpiece W by the die attach film 18B of the tape material 18.

[0037] Therefore, in the subsequent semiconductor manufacturing process, when the workpiece W (semiconductor substrate) is cleaved into chips, the ring frame 44 can be held to position the workpiece W, and the dicing tape 18A can restrain the position of the chips.

[0038] When the tape material 18 is attached to the ring frame 44 and the workpiece W, the die attachment film 18B is heated and softened, and then when the die attachment film 18B is cooled and hardened, the adhesive strength of the die attachment film 18B of the dicing tape 18A to the ring frame 44 and the workpiece W is increased.

[0039] Here, the hot air device 38 of the attachment mechanism 12 blows hot air onto the tape material 18 (tape body 16) near and above the tip of the peel plate 28, heating the tape material 18 and thereby heating the die attachment film 18B. Therefore, unlike when the die attachment film 18B is heated by heating the mount table unit 40, the heating rate of the die attachment film 18B can be increased, and the heating time for the die attachment film 18B to increase the adhesion strength of the die attachment film 18B can be shortened. Furthermore, unlike when the die attachment film 18B is cooled by cooling the mount table unit 40, the cooling rate of the die attachment film 18B can be increased, and the cooling time for the die attachment film 18B can be shortened. This reduces the downtime required to heat and cool the die attachment film 18B during the process of attaching the tape material 18 to the ring frame 44 and the workpiece W, thereby shortening the process time for attaching the tape material 18 to the ring frame 44 and the workpiece W.

[0040] Furthermore, the hot air device 38 heats the tape material 18 immediately before it is attached to the ring frame 44 and the workpiece W. Therefore, when the tape material 18 is attached to the ring frame 44 and the workpiece W, a decrease in the temperature of the die attachment film 18B can be suppressed.

[0041] Furthermore, the hot air device 38 sends hot air to the tape 18 to heat the tape 18. Therefore, the tape 18 can be easily heated.

[0042] [Second embodiment] FIG. 4 shows a front view of a tape application device 50 according to a second embodiment of the present invention.

[0043] The tape application device 50 according to this embodiment has almost the same configuration as the first embodiment, but differs in the following respects.

[0044] As shown in Figure 4, in the tape application device 50 of this embodiment, in the application mechanism 12, the hot air device 38 sends (blows) hot air onto the tape material 18 extending to the left from the tip of the peel plate 28, thereby heating the tape material 18.

[0045] Here, this embodiment can also achieve the same functions and effects as the first embodiment.

[0046] (Variation) In this modified example, in the tape application devices 10 and 50 according to the first and second embodiments, a heater 60 (see Figures 1 and 4) is built into the peel plate 28 of the application mechanism 12 as a heating mechanism, and the heater 60 heats the tape body 16 that contacts the peel plate 28 via the peel plate 28, thereby heating the tape material 18 of the tape body 16.

[0047] In this modified example, the heater 60 heats the tape material 18 via the peel plate 28. This allows the heating speed of the die attachment film 18B of the tape material 18 to be increased, and the time required to heat the die attachment film 18B to increase the adhesive strength of the die attachment film 18B can be reduced.

[0048] In the above-described first and second embodiments (including modified examples), the tape material 18 is heated by a heating mechanism (hot air device 38 and heater 60) before being applied to the ring frame 44 and the workpiece W. However, for example, the heater 60 may be built into the press roller 36, and the heater 60 may heat the tape material 18 that comes into contact with the press roller 36 via the press roller 36, thereby heating the tape material 18 when it is applied to the ring frame 44 and the workpiece W. Furthermore, for example, the hot air device 38 may send (blow) hot air to the tape material 18 on the left side of the press roller 36 to heat the tape material 18, thereby heating the tape material 18 after it has been applied to the ring frame 44 and the workpiece W.

[0049] Furthermore, in the above-described first and second embodiments (including the modified examples), a cooling mechanism may be provided in the mount table unit 40 (particularly the mount table 40A), so that the cooling mechanism cools the mount table unit 40, which then cools the tape material 18 after it has been attached to the ring frame 44 and the workpiece W. This makes it possible to further increase the cooling rate of the die attachment film 18B of the tape material 18, and further shorten the time it takes for the die attachment film 18B to cool.

[0050] Furthermore, in the above-described first and second embodiments (including the modified examples), the tape material 18 is attached to the ring frame 44 and the workpiece W. However, the tape material 18 may be attached to the workpiece W without providing the ring frame 44. [Explanation of symbols]

[0051] 10 Tape application device 12. Attachment mechanism 18 Tape material 18A dicing tape 18B Die attach film (adhesive layer) 20 Separator (release material) 28 Peel plate (peeling member) 36 Press roller (pressing member) 38 Warm air device (heating mechanism) 40 Mount table unit (holding body) 50 Tape application device 60 Heater (heating mechanism) double work

Claims

1. a sticking mechanism for sticking a tape material, which is a dicing tape integrally provided with an adhesive layer, to a workpiece, so that the dicing tape is stuck to the workpiece by the adhesive layer; a heating mechanism for heating the tape material; A tape application device comprising:

2. 2. The tape applying device according to claim 1, wherein said heating mechanism heats said tape by blowing hot air onto said tape.

3. 2. The tape application device according to claim 1, further comprising a peeling member provided in the application mechanism, which peels off the release material on the adhesive layer side of the tape material before the application mechanism applies the tape material to the workpiece, and which the heating mechanism heats the tape material.

4. 2. The tape applying device according to claim 1, further comprising a pressing member provided in the applying mechanism for pressing the tape against the workpiece to apply the tape to the workpiece, and the heating mechanism for heating the tape.

5. 2. The tape applying device according to claim 1, further comprising a holder that holds the workpiece when the applying mechanism applies the tape to the workpiece and cools the tape.

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