Sensor module

Abstract

To provide a sensor module that allows a plurality of inertial sensor devices to be easily arranged in parallel orientations with respect to each other.SOLUTION: The sensor module includes: a first inertial sensor device group having a first inertial sensor device, a second inertial sensor device, and a third inertial sensor device each having a detection axis oriented in the same direction; and a base including a first mounting surface on which the first inertial sensor device is disposed, a second mounting surface, parallel to the first mounting surface, on which the second inertial sensor device is disposed, and a third mounting surface, parallel to the first mounting surface, on which the third inertial sensor device is disposed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a sensor module. [Background technology]

[0002] The sensor device described in Patent Document 1 has a circuit board and two X-axis angular velocity sensor devices, two Y-axis angular velocity sensor devices, and two Z-axis angular velocity sensor devices mounted on the circuit board. The X-axis angular velocity is calculated from the average value of the output signals of each X-axis angular velocity sensor device, the Y-axis angular velocity is calculated from the average value of the output signals of each Y-axis angular velocity sensor device, and the Z-axis angular velocity is calculated from the average value of the output signals of each Z-axis angular velocity sensor device, thereby reducing noise and improving the detection accuracy of the angular velocity around each axis. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-163955 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the configuration of the sensor device of Patent Document 1, the X-axis angular velocity sensor device is mounted on the side surface of a plate-shaped circuit board, making it difficult to arrange multiple X-axis angular velocity sensor devices side by side in a parallel orientation on the circuit board. [Means for solving the problem]

[0005] The sensor module of the present invention includes a first inertial sensor device group including a first inertial sensor device, a second inertial sensor device, and a third inertial sensor device, which have detection axes in the same direction; The base includes a first mounting surface on which the first inertial sensor device is disposed, a second mounting surface parallel to the first mounting surface on which the second inertial sensor device is disposed, and a third mounting surface parallel to the first mounting surface on which the third inertial sensor device is disposed. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a cross-sectional view showing a sensor module according to a first embodiment. [Figure 2] FIG. 2 is a top view showing the inside of the sensor module shown in FIG. [Figure 3] FIG. 2 is a development view of a sensor mounting board. [Figure 4] FIG. 10 is a cross-sectional view showing how the sensor-mounted board is accommodated in the base. [Figure 5] FIG. 10 is a cross-sectional view showing the orientation of the detection axes of the inertial sensor devices when they are housed in the base. [Figure 6] FIG. 2 is a diagram showing a modified example of the sensor module shown in FIG. [Figure 7] FIG. 2 is a diagram showing a modified example of the sensor module shown in FIG. [Figure 8] FIG. 2 is a diagram showing a modified example of the sensor module shown in FIG. [Figure 9] FIG. 2 is a diagram showing a modified example of the sensor module shown in FIG. [Figure 10] FIG. 2 is a diagram showing a modified example of the sensor module shown in FIG. [Figure 11] FIG. 10 is a cross-sectional view showing a sensor module according to a second embodiment. [Figure 12] FIG. 10 is a cross-sectional view showing a sensor module according to a third embodiment. [Figure 13] FIG. 4 is a front view of the first positioning part. [Figure 14] FIG. 10 is a top view showing a sensor module according to a fourth embodiment. [Figure 15] FIG. 15 is a cross-sectional view of the sensor module shown in FIG. [Figure 16]FIG. 15 is a cross-sectional view of the sensor module shown in FIG. [Figure 17] FIG. 2 is a development view of a sensor mounting board. [Figure 18] FIG. 10 is a top view showing a sensor module according to a fifth embodiment. [Figure 19] An exploded view of the sensor mounting board is shown. DETAILED DESCRIPTION OF THE INVENTION

[0007] The sensor module of the present invention will be described in detail below based on the embodiments shown in the accompanying drawings. For ease of explanation, each figure illustrates three mutually orthogonal axes as the X-axis, Y-axis, and Z-axis. For ease of explanation, the direction parallel to the X-axis will also be referred to as the "X-axis direction," the direction parallel to the Y-axis will also be referred to as the "Y-axis direction," and the direction parallel to the Z-axis will also be referred to as the "Z-axis direction." The arrow in the Z-axis direction will also be referred to as "up" and the opposite side as "down." In this specification, "parallel" refers not only to objects being parallel to each other, but also to objects that are deviated from parallelism within a range that can be considered equivalent to parallelism from the perspective of common technical knowledge, taking into account dimensional errors that may occur during manufacturing and tolerances recognized in the equipment. Similarly, "orthogonal" refers not only to objects being perpendicular to each other, but also to objects that are deviated from perpendicular to each other within a range that can be considered equivalent to orthogonal from the perspective of common technical knowledge, taking into account dimensional errors that may occur during manufacturing and tolerances recognized in the equipment.

[0008] First Embodiment FIG. 1 is a cross-sectional view showing a sensor module according to a first embodiment. FIG. 2 is a top view showing the inside of the sensor module shown in FIG. 1. FIG. 3 is a development view of a sensor mounting board. FIG. 4 is a cross-sectional view showing a state in which the sensor mounting board is housed in a base. FIG. 5 is a cross-sectional view showing the direction of the detection axis of each inertial sensor device housed in the base. FIGS. 6 to 10 are each views showing modified examples of the sensor module shown in FIG. 1.

[0009] The sensor module 1 shown in FIG. 1 includes a package 2 and a sensor-mounted substrate 5 housed in the package 2.

[0010] Package 2 1, the package 2 has a box-shaped base 3 with an opening on its top surface, and a plate-shaped lid 4 that is joined to the top surface of the base 3 and closes the opening of the base 3. The base 3 and the lid 4 can each be made of a metal material such as aluminum or stainless steel, or a ceramic material such as alumina. However, the materials that make up the base 3 and the lid 4 are not particularly limited.

[0011] 1 and 2, the base 3 has a rectangular plate-shaped bottom 31 and a rectangular frame-shaped outer wall 32 standing upward from the outer edge of the bottom 31. As shown in Fig. 2, the outer wall 32 has a first outer wall 321 located on the negative side in the X-axis direction and extending in the Y-axis direction, a second outer wall 322 located on the negative side in the Y-axis direction and extending in the X-axis direction, a third outer wall 323 located on the positive side in the X-axis direction and extending in the Y-axis direction, and a fourth outer wall 324 located on the positive side in the Y-axis direction and extending in the X-axis direction.

[0012] The first outer wall portion 321, which is the first wall portion, has a pair of wall surfaces 321a, 321b that face each other, with one wall surface 321a (the negative side in the X-axis direction) facing the outside of the base 3 and the other wall surface 321b (the positive side in the X-axis direction) facing the inside of the base 3. The second outer wall portion 322 has a pair of wall surfaces 322a, 322b that face each other, with one wall surface 322a (the negative side in the Y-axis direction) facing the outside of the base 3 and the other wall surface 322b (the positive side in the Y-axis direction) facing the inside of the base 3.

[0013] The third outer wall portion 323 has a pair of wall surfaces 323a, 323b that face each other on the front and back sides, with one wall surface 323a (on the positive side in the X-axis direction) facing the outside of the base 3 and the other wall surface 323b (on the negative side in the X-axis direction) facing the inside of the base 3. The fourth outer wall portion 324 has a pair of wall surfaces 324a, 324b that face each other on the front and back sides, with one wall surface 324a (on the positive side in the Y-axis direction) facing the outside of the base 3 and the other wall surface 324b (on the negative side in the Y-axis direction) facing the inside of the base 3.

[0014] As shown in FIG. 1, the base 3 has an inner wall portion 33 that extends upward from the bottom portion 31 and is located inside the outer wall portion 32. As shown in FIG. 2, the inner wall portion 33 extends in the Y-axis direction and includes a first inner wall portion 331, one end of which (the negative side in the Y-axis direction) is connected to the second outer wall portion 322 and the other end of which (the positive side in the Y-axis direction) is connected to the fourth outer wall portion 324. The first inner wall portion 331 is positioned offset toward the first outer wall portion 321 with respect to the center of the base 3, and divides the interior of the base 3 into a large region Q1 on the positive side in the X-axis direction and a small region Q2 on the negative side in the X-axis direction. The first inner wall portion 331, which is the second wall portion, has a pair of wall surfaces 331a and 331b that face the inside of the base 3. One wall surface 331a (on the negative side in the X-axis direction) faces the first outer wall portion 321, and the other wall surface 331b (on the positive side in the X-axis direction) faces the third outer wall portion 323.

[0015] Here, the three wall surfaces 321b, 331a, and 331b aligned along the X-axis direction are each configured in a YZ plane perpendicular to the X-axis. That is, the wall surfaces 321b, 331a, and 331b are parallel to one another. Inertial sensor devices 911, 912, and 913 are disposed on the wall surface 321b, which is the first mounting surface, the wall surface 331a, which is the second mounting surface, and the wall surface 331b, which is the third mounting surface, respectively. By forming the base 3 into a shape having the outer wall portion 32 and the inner wall portion 33, the wall surfaces 321b, 331a, and 331b can be formed with a simple configuration. In particular, because the wall surfaces 321b, 331a, and 331b are aligned along the X-axis direction, i.e., the normal direction of the wall surface 321b, the inertial sensor devices 911, 912, and 913 can be disposed adjacent to one another in a line. Therefore, the inertia detection accuracy of the sensor module 1 is improved, and the sensor module 1 can be made smaller.

[0016] 1, the lid 4 has a flat plate shape and is bonded to the upper surface of the base 3. The method for bonding the lid 4 to the base 3 is not particularly limited, and for example, screwing, adhesive bonding, etc. can be used. The lid 4 also has an opening 41 for exposing the connector 8 described below, and a frame-shaped wall portion 42 that protrudes downward from the periphery of the opening 41, i.e., into the base 3, and surrounds the connector 8.

[0017] The package 2 has been described above. However, the configuration of the package 2 is not particularly limited. For example, the shape of the base 3 in a plan view is not limited to a rectangle. Also, for example, at least one end of the first inner wall portion 331 does not have to be connected to the outer wall portion 32. Also, an opening for exposing the connector 8 may be formed in the bottom portion 31 or the outer wall portion 32 of the base 3, rather than in the lid 4.

[0018] <Sensor mounting board 5> 3 shows an exploded view of the sensor mounting board 5. As shown in the figure, the sensor mounting board 5 has a circuit element 7, a connector 8, a first inertial sensor device group 91, and a connection portion 6 that connects these together. The first inertial sensor device group 91 also has three inertial sensor devices: an inertial sensor device 911 that is a first inertial sensor device, an inertial sensor device 912 that is a second inertial sensor device, and an inertial sensor device 913 that is a third inertial sensor device.

[0019] The connection portion 6 is a flexible wiring board 61 having a strip shape extending in the X-axis direction and having flexibility. The circuit element 7, connector 8, and inertial sensor devices 911, 912, and 913 are mounted at predetermined positions on the flexible wiring board 61, and are electrically connected to each other via wiring (not shown) formed on the flexible wiring board 61. Specifically, the circuit element 7 and connector 8 are mounted on the front surface of the flexible wiring board 61, and the inertial sensor devices 911, 912, and 913 are mounted on the back surface. The inertial sensor devices 911, 912, and 913 are arranged side by side in the X-axis direction. The inertial sensor devices 911, 912, and 913 are electrically connected to the circuit element 7 via the wiring, and the circuit element 7 and connector 8 are electrically connected to each other via the wiring. In this way, by mounting the circuit element 7, connector 8 and inertial sensor devices 911, 912, 913 on the flexible wiring board 61, the components do not come apart, making it easier to attach these components to the base 3.

[0020] The inertial sensor devices 911, 912, and 913 have the same configuration. Each of the inertial sensor devices 911, 912, and 913 is a 6DoF (Six-degrees of freedom) sensor, and can independently detect angular velocity around three mutually orthogonal axes, that is, the J1-axis, the J2-axis, and the J3-axis directions, and acceleration in the J1-axis, the J2-axis, and the J3-axis directions.

[0021] Although not shown, the inertial sensor devices 911, 912, and 913 each have an angular velocity sensor element that detects angular velocity around the J1 axis, an angular velocity sensor element that detects angular velocity around the J2 axis, an angular velocity sensor element that detects angular velocity around the J3 axis, an acceleration sensor element that detects acceleration in the J1 axis direction, an acceleration sensor element that detects acceleration in the J2 axis direction, and an acceleration sensor element that detects acceleration in the J3 axis direction, a control circuit such as a microcontroller that controls the driving of each of these sensor elements, and a package that houses each of these parts.

[0022] Each angular velocity sensor element and each acceleration sensor element is, for example, a quartz crystal oscillator, a silicon MEMS (Micro Electric Mechanical Device), etc. The control circuit has, for example, a drive circuit that drives each sensor element, a temperature compensation circuit that temperature compensates the detection signal output from each sensor element, a detection circuit that detects the angular velocity around each axis and the acceleration in each axial direction based on the temperature-compensated detection signal, and an interface circuit that inputs and outputs various signals.

[0023] However, the configuration of the inertial sensor devices 911, 912, and 913 is not particularly limited as long as they are 6DoF sensors. For convenience of explanation, the surfaces of the inertial sensor devices 911, 912, and 913 mounted on the flexible wiring substrate 61 will be referred to as the "bottom surface," and the surfaces opposite the bottom surface will be referred to as the "top surface." In this embodiment, the bottom surface and the top surface are parallel to each other.

[0024] 4, the sensor mounting board 5 is housed in the base 3 with the back surface of the flexible wiring board 61 facing downward and the flexible wiring board 61 bent in the thickness direction (Z-axis direction) so as to extend over the first inner wall portion 331 and span the regions Q1 and Q2. By using the bendable flexible wiring board 61 as the joint 6 in this way, it becomes easy to attach the inertial sensor devices 911, 912, and 913 to the base 3.

[0025] 1, when the sensor mounting board 5 is housed in the base 3, the circuit element 7 and the connector 8 are each located within the region Q1 and are bonded to the inner bottom surface (the upper surface of the bottom portion 31) of the base 3 via the flexible wiring board 61. The inertial sensor device 913, together with the circuit element 7 and the connector 8, is located within the region Q1 and is bonded to the wall surface 331b of the first inner wall portion 331, which is the third mounting surface, with its top surface facing the wall surface 331b.

[0026] On the other hand, the inertial sensor device 911 is located within the region Q2, and is bonded to the wall surface 321b of the first outer wall portion 321, which is the first mounting surface, with its top surface facing the wall surface 321b. The inertial sensor device 912 is also located within the region Q2 together with the inertial sensor device 911, and is bonded to the wall surface 331a of the first inner wall portion 331, which is the second mounting surface, with its top surface facing the wall surface 331a. Note that the bonding method is not particularly limited, but in this embodiment, they are bonded using an adhesive.

[0027] According to this configuration, the base 3 has the wall surfaces 321b, 331a, and 331b that are parallel to one another, so that the inertial sensor devices 911, 912, and 913 can be easily arranged side by side in parallel postures.

[0028] 5, in a state where the sensor mounting board 5 is joined to the base 3, the inertial sensor devices 911, 912, and 913 are arranged side by side along the X-axis direction. By arranging the inertial sensor devices 911, 912, and 913 side by side along the X-axis direction in this way, the inertial sensor devices 911, 912, and 913 can be arranged closely in a line. This improves the inertial detection accuracy of the sensor module 1, and also enables the sensor module 1 to be made smaller.

[0029] The inertial sensor devices 911, 912, and 913 are disposed with their detection axes aligned. In the illustrated configuration, the inertial sensor devices 911, 912, and 913 are disposed with their J1 axis aligned along the Z axis, their J2 axis aligned along the Y axis, and their J3 axis aligned along the X axis. In particular, in this embodiment, the inertial sensor devices 911, 912, and 913 are disposed with their centers aligned on the same line along the X axis. Note that, in this embodiment, the inertial sensor devices 911 and 913 are oriented with their top surfaces facing the negative side of the X axis, whereas the inertial sensor device 912 is oriented with its top surface facing the positive side of the X axis. In other words, the inertial sensor device 912 is oriented 180° inverted about the Y axis relative to the inertial sensor devices 911 and 913, and as a result, the J1 axis and the J3 axis are oriented in opposite directions.

[0030] The circuit element 7 includes, for example, a drive control circuit that controls the driving of the inertial sensor devices 911, 912, and 913; a detection circuit that detects the angular velocity around each axis and the acceleration along each axis based on the detection signals output from each inertial sensor device 911, 912, and 913; and an interface circuit that inputs and outputs various signals. For example, the circuit element 7 calculates the angular velocity around the J2 axis and the acceleration along the J2 axis by averaging three detection signals received simultaneously from each of the inertial sensor devices 911, 912, and 913. The circuit element 7 calculates the angular velocity around the J1 axis, the acceleration along the J1 axis, the angular velocity around the J3 axis, and the acceleration along the J3 axis by averaging the three detection signals received simultaneously from each of the inertial sensor devices 911, 912, and 913 after aligning their positive and negative polarities. This configuration reduces noise and improves the accuracy of angular velocity and acceleration detection.

[0031] The above describes the sensor module 1. As described above, the sensor module 1 includes the first inertial sensor device group 91 including the inertial sensor device 911, the inertial sensor device 912, and the inertial sensor device 913, which have detection axes oriented in the same direction, and the base 3 including the wall surface 321b, which is a first mounting surface on which the inertial sensor device 911 is disposed, the wall surface 331a, which is a second mounting surface parallel to the wall surface 321b and on which the inertial sensor device 912 is disposed, and the wall surface 331b, which is a third mounting surface parallel to the wall surface 321b and on which the inertial sensor device 913 is disposed. With this configuration, the base 3 includes the wall surfaces 321b, 331a, and 331b, which are parallel to each other, making it easy to juxtapose the inertial sensor devices 911, 912, and 913 in parallel positions.

[0032] As described above, the wall surfaces 321b, 331a, and 331b are aligned along the normal direction of the wall surface 321b, i.e., along the X-axis direction. This allows the inertial sensor devices 911, 912, and 913 to be aligned in a line and placed close to each other. This improves the inertial detection accuracy of the sensor module 1 and also allows the sensor module 1 to be made smaller.

[0033] As described above, the inertial sensor devices 911, 912, and 913 are aligned along the normal direction of the wall surface 321b, i.e., along the X-axis direction. This allows the inertial sensor devices 911, 912, and 913 to be aligned in a line and placed close to each other. This improves the inertial detection accuracy of the sensor module 1 and also allows the sensor module 1 to be made smaller.

[0034] As described above, the base 3 is box-shaped and houses the first inertial sensor device group 91, and includes a first outer wall 321, which is a first wall having a pair of wall surfaces 321a, 321b on the front and back sides, one of which faces the outside of the base 3 and the other of which faces the inside of the base 3, and a first inner wall 331, which is a second wall arranged opposite the first outer wall 321 and has a pair of wall surfaces 331a, 331b on the front and back sides, both of which face the inside of the base 3. The wall surface 321b of the first outer wall 321 facing the inside of the base 3 is a first mounting surface, the wall surface 331a of the first inner wall 331 facing the first outer wall 321 is a second mounting surface, and the wall surface 331b of the first inner wall 331 located on the opposite side of the first outer wall 321 is a third mounting surface. According to this configuration, the first mounting surface, the second mounting surface, and the third mounting surface can be provided on the base 3 with a simple configuration.

[0035] As described above, the sensor module 1 has the connection parts 6 that connect the inertial sensor devices 911, 912, and 913. With this configuration, the inertial sensor devices 911, 912, and 913 do not come apart, making it easy to attach the inertial sensor devices 911, 912, and 913 to the base 3.

[0036] As described above, the connection portion 6 is the flexible wiring board 61. With this configuration, the positions and attitudes of the inertial sensor devices 911, 912, and 913 can be easily changed by bending the flexible wiring board 61. This makes it easy to attach the inertial sensor devices 911, 912, and 913 to the base 3.

[0037] Although the sensor module 1 has been described above, the configuration of the sensor module 1 is not particularly limited.

[0038] For example, the number of inertial sensor devices included in the first inertial sensor device group 91 is not limited to three and may be four or more. In the example shown in Fig. 6, the first inertial sensor device group 91 includes five inertial sensor devices 911, 912, 913, 914, and 915. In this case, a pair of first inner wall portions 331 may be formed side by side in the X-axis direction inside the base 3, and both wall surfaces of the first inner wall portion 331 located on the positive side in the X-axis direction may be used as mounting surfaces for the inertial sensor devices 914 and 915.

[0039] 7, all of the inertial sensor devices 911, 912, and 913 may face the same direction. In this case, the inertial sensor device 912 may be mounted on the flexible wiring board 61 in an orientation that is inverted relative to that of this embodiment.

[0040] In this way, the first inertial sensor devices 911, 912, and 913 have detection axes that face the same direction, but the detection axes may all face the same direction as in Fig. 7, or some of the detection axes may face the opposite direction to the other detection axes as in Fig. 5. In other words, when a certain direction is defined as the positive direction and the opposite direction as the negative direction, the detection axes that face the same direction may include detection axes that face only in the positive direction, detection axes that face only in the negative direction, or detection axes that face both the positive and negative directions.

[0041] Furthermore, for example, the inertial sensor devices 911, 912, and 913 do not have to be 6DoF sensors. In this case, for example, the inertial sensor devices 911, 912, and 913 may be single-axis angular velocity sensors that detect angular velocity around the J1 axis, and the J1 axis of each of the inertial sensor devices 911, 912, and 913 may be aligned along any one of the X-axis, Y-axis, and Z-axis. Furthermore, for example, the inertial sensor devices 911, 912, and 913 may be three-axis angular velocity sensors that detect angular velocity around the J1 axis, J2 axis, and J3 axis, and the J1 axis of each of the inertial sensor devices 911, 912, and 913 may be aligned along the Z-axis, the J2 axis, and the J3 axis, respectively.

[0042] Alternatively, for example, the inertial sensor devices 911, 912, and 913 may be uniaxial acceleration sensors that detect acceleration in the J1 axis direction, with the J1 axis of each of the inertial sensor devices 911, 912, and 913 aligned along any one of the X, Y, and Z axes. Alternatively, for example, the inertial sensor devices 911, 912, and 913 may be 3-axial acceleration sensors that detect acceleration in the J1, J2, and J3 axis directions, with the J1 axis of each of the inertial sensor devices 911, 912, and 913 aligned along the Z axis, the J2 axis along the Y axis, and the J3 axis along the Z axis.

[0043] The configuration of the connection portion 6 is not particularly limited. For example, as shown in FIG. 8 , the connection portion 6 may be a rigid-flexible wiring board 62 formed by connecting a plurality of rigid wiring boards 621 with a plurality of flexible wiring boards 622. In the illustrated example, the rigid-flexible wiring board 62 includes a rigid wiring board 621 on which an inertial sensor device 911 is mounted, a rigid wiring board 621 on which an inertial sensor device 912 is mounted, a rigid wiring board 621 on which an inertial sensor device 913 is mounted, and a rigid wiring board 621 on which a circuit element 7 and a connector 8 are mounted, all of which are connected via the flexible wiring board 622. In this configuration, the sensor mounting board 5 can be disposed within the base 3 by bending the flexible wiring board 622, as in the present embodiment.

[0044] 9, the connection unit 6 may be a connector wiring 63. The connector wiring 63 has connectors on both ends, and electrically connects two objects by connecting each connector to the object. In the illustrated example, the connection unit 6 has a connector wiring 63 that connects the inertial sensor devices 911 and 912, a connector wiring 63 that connects the inertial sensor devices 912 and 913, a connector wiring 63 that connects the inertial sensor device 913 and the circuit element 7, and a connector wiring 63 that connects the circuit element 7 and the connector 8.

[0045] Also, for example, as shown in FIG. 10, the connection portion 6 may be omitted.

[0046] Second Embodiment FIG. 11 is a cross-sectional view showing a sensor module according to the second embodiment.

[0047] This embodiment is similar to the first embodiment described above, except for the configuration of the sensor mounting substrate 5. In the following description, the differences between this embodiment and the first embodiment will be mainly described, and a description of similar points will be omitted. In addition, in the drawings of this embodiment, the same reference numerals are used to designate the same components as those in the previously described embodiment.

[0048] 11 , in the sensor mounting board 5 of this embodiment, the circuit element 7, the connector 8, and the inertial sensor devices 911, 912, and 913 are all mounted on the surface of the flexible wiring board 61. The sensor mounting board 5 is housed in the base 3 with the back surface facing downward and the flexible wiring board 61 folded in the thickness direction so as to extend beyond the first inner wall portion 331 and straddle the areas Q1 and Q2.

[0049] The circuit element 7 and the connector 8 are each located within the region Q1, and are bonded to the inner bottom surface of the base 3 via the flexible wiring board 61. The inertial sensor device 913, together with the circuit element 7 and the connector 8, is also located within the region Q1, and is bonded to the wall surface 331b via the flexible wiring board 61 with its bottom surface facing the wall surface 331b of the first inner wall portion 331.

[0050] On the other hand, the inertial sensor device 911 is located within the region Q2, and is joined to the wall surface 321b via the flexible wiring board 61 with its bottom surface facing the wall surface 321b of the first outer wall portion 321. The inertial sensor device 912 is also located within the region Q2 together with the inertial sensor device 911, and is joined to the wall surface 331a via the flexible wiring board 61 with its bottom surface facing the wall surface 331a of the first inner wall portion 331.

[0051] The second embodiment can also achieve the same effects as the first embodiment described above.

[0052] Third Embodiment Fig. 12 is a cross-sectional view showing a sensor module according to a third embodiment Fig. 13 is a front view of a first positioning part.

[0053] This embodiment is similar to the first embodiment described above, except for the configuration of the base 3. In the following description, differences between this embodiment and the first embodiment will be mainly described, and similar points will not be described again. In each drawing of this embodiment, the same reference numerals are used to designate the same components as those in the first embodiment.

[0054] 12, the base 3 of this embodiment has a first positioning part 391 that positions the inertial sensor device 911 relative to the wall surface 321b, a second positioning part 392 that positions the inertial sensor device 912 relative to the wall surface 331a, and a third positioning part 393 that positions the inertial sensor device 913 relative to the wall surface 331b. With this configuration, positional and orientational deviations of the inertial sensor devices 911, 912, and 913 can be effectively suppressed.

[0055] 13, the first positioning portion 391 protrudes from the wall surface 321b and has an abutment surface 391a that abuts against the side surface of the inertial sensor device 911 facing the negative side in the Z axis direction, and an abutment surface 391b that abuts against the side surface of the inertial sensor device 911 facing the positive side in the Y axis direction. With this simple configuration, it is possible to suppress positional and orientational deviations of the inertial sensor device 911. However, the configuration of the first positioning portion 391 is not particularly limited. Note that the second and third positioning portions 392 and 393 have the same configuration as the first positioning portion 391, and therefore a description thereof will be omitted.

[0056] The third embodiment can also achieve the same effects as the first embodiment described above.

[0057] <Fourth embodiment> Fig. 14 is a top view showing a sensor module according to a fourth embodiment. Figs. 15 and 16 are cross-sectional views of the sensor module shown in Fig. 14. Fig. 17 is a development view of a sensor mounting board.

[0058] This embodiment is similar to the first embodiment described above, except for the configurations of the base 3 and the sensor mounting board 5. In the following description, the differences between this embodiment and the first embodiment will be mainly described, and a description of the similarities will be omitted. In addition, in each drawing of this embodiment, the same components as those in the previously described embodiment are denoted by the same reference numerals.

[0059] 14 , in the base 3 of this embodiment, the inner wall portion 33 has a rectangular frame shape. The inner wall portion 33 has a first inner wall portion 331 located on the negative side of the X axis direction and extending in the Y axis direction, a second inner wall portion 332 located on the negative side of the Y axis direction and extending in the X axis direction, a third inner wall portion 333 located on the positive side of the X axis direction and extending in the Y axis direction, and a fourth inner wall portion 334 located on the positive side of the Y axis direction and extending in the X axis direction. Such inner wall portion 33 is formed concentrically with the outer wall portion 32.

[0060] 15 , the first inner wall portion 331 has a pair of wall surfaces 331a and 331b on opposite sides, both of which face the inside of the base 3. One wall surface 331a (on the negative side in the X-axis direction) faces the first outer wall portion 321, and the other wall surface 331b (on the positive side in the X-axis direction) faces the third inner wall portion 333. The third inner wall portion 333 has a pair of wall surfaces 333a and 333b on opposite sides, both of which face the inside of the base 3. One wall surface 333a (on the positive side in the X-axis direction) faces the third outer wall portion 323, and the other wall surface 333b (on the negative side in the X-axis direction) faces the first inner wall portion 331.

[0061] 16 , the second inner wall portion 332 has a pair of wall surfaces 332a, 332b on the front and back sides, both of which face the inside of the base 3. One wall surface 332a (on the negative Y-axis direction) faces the second outer wall portion 322, and the other wall surface 332b (on the positive Y-axis direction) faces the fourth inner wall portion 334. The fourth inner wall portion 334 has a pair of wall surfaces 334a, 334b ​​on the front and back sides, both of which face the inside of the base 3. One wall surface 334a (on the positive Y-axis direction) faces the fourth outer wall portion 324, and the other wall surface 334b ​​(on the negative Y-axis direction) faces the second inner wall portion 332.

[0062] 15, the six wall surfaces 321b, 331a, 331b, 333b, 333a, and 323b arranged along the X-axis direction are each configured on a YZ plane perpendicular to the X-axis. That is, the wall surfaces 321b, 331a, 331b, 333b, 333a, and 323b are parallel to one another. Similarly, as shown in FIG. 16, the six wall surfaces 322b, 332a, 332b, 334b, 334a, and 324b arranged along the Y-axis direction are each configured on an XZ plane perpendicular to the Y-axis. That is, the wall surfaces 322b, 332a, 332b, 334b, 334a, and 324b are parallel to one another.

[0063] As shown in FIG. 14, the sensor mounting board 5 has, in addition to the circuit element 7, the connector 8 and the first inertial sensor device group 91, a second inertial sensor device group 92, a third inertial sensor device group 93, a fourth inertial sensor device group 94, a fifth inertial sensor device group 95 and a sixth inertial sensor device group 96.

[0064] As in the above-described embodiment, the first inertial sensor device group 91 includes inertial sensor devices 911, 912, and 913. The second inertial sensor device group 92 includes an inertial sensor device 921 which is a fourth inertial sensor device, an inertial sensor device 922 which is a fifth inertial sensor device, and an inertial sensor device 923 which is a sixth inertial sensor device. The third inertial sensor device group 93 includes inertial sensor devices 931, 932, and 933.

[0065] These inertial sensor devices 911, 912, 913, 921, 922, 923, 931, 932, and 933 have the same configuration and are each a single-axis angular velocity sensor that detects angular velocity around the J1 axis. The inertial sensor devices 911, 912, and 913, the inertial sensor devices 921, 922, and 923, and the inertial sensor devices 931, 932, and 933 are housed in the base 3 in orientations perpendicular to one another. Specifically, the inertial sensor devices 911, 912, and 913 are housed in the base 3 in orientations in which the J1 axis coincides with the X axis. The inertial sensor devices 921, 922, and 923 are housed in the base 3 in orientations in which the J1 axis coincides with the Y axis. The inertial sensor devices 931, 932, and 933 are housed in the base 3 in orientations in which the J1 axis coincides with the Z axis.

[0066] The fourth inertial sensor device group 94 includes inertial sensor devices 941, 942, and 943. The fifth inertial sensor device group 95 includes inertial sensor devices 951, 952, and 953. The sixth inertial sensor device group 96 includes inertial sensor devices 961, 962, and 963.

[0067] These inertial sensor devices 941, 942, 943, 951, 952, 953, 961, 962, and 963 have the same configuration and are each a single-axis acceleration sensor that detects acceleration in the J1-axis direction. The inertial sensor devices 941, 942, and 943, the inertial sensor devices 951, 952, and 953, and the inertial sensor devices 961, 962, and 963 are housed in the base 3 in orientations perpendicular to one another. Specifically, the inertial sensor devices 941, 942, and 943 are housed in the base 3 in orientations in which the J1 axes coincide with the X-axis. The inertial sensor devices 951, 952, and 953 are housed in the base 3 in orientations in which the J1 axes coincide with the Y-axis. The inertial sensor devices 961, 962, and 963 are housed in the base 3 in orientations in which the J1 axes coincide with the Z-axis.

[0068] 17 shows a development view of flexible wiring board 61. As shown in the figure, flexible wiring board 61 is cross-shaped and has a central portion 610 located in the center, a first band portion 611 extending from central portion 610 to the negative side in the X-axis direction, a second band portion 612 extending from central portion 610 to the negative side in the Y-axis direction, a third band portion 613 extending from central portion 610 to the positive side in the X-axis direction, and a fourth band portion 614 extending from central portion 610 to the positive side in the Y-axis direction.

[0069] A circuit element 7 and a connector 8 are mounted on the front surface of the central portion 610, and inertial sensor devices 931, 932, 933, 961, 962, and 963 are mounted on the back surface of the central portion 610. The inertial sensor devices 931, 932, and 933 are arranged side by side in the X-axis direction. Similarly, the inertial sensor devices 961, 962, and 963 are arranged side by side in the X-axis direction.

[0070] Furthermore, inertial sensor devices 911, 912, and 913 are mounted side by side in the X-axis direction on the back surface of first band 611. Furthermore, inertial sensor devices 921, 922, and 923 are mounted side by side in the Y-axis direction on the back surface of second band 612. Furthermore, inertial sensor devices 941, 942, and 943 are mounted side by side in the X-axis direction on the back surface of third band 613. Furthermore, inertial sensor devices 951, 952, and 953 are mounted side by side in the Y-axis direction on the back surface of fourth band 614.

[0071] Such a sensor-mounted substrate 5 is housed in the base 3 with the back surface of the flexible wiring board 61 facing downwards, the central portion 610 positioned within the region Q1, and the first, second, third, and fourth band portions 611, 612, 613, and 614 folded in the thickness direction so that they extend beyond the inner wall portion 33 and straddle the regions Q1 and Q2.

[0072] 15 , the circuit element 7 and the connector 8 are each located within the region Q1 and are bonded to the inner bottom surface of the base 3 via a flexible wiring board 61. The inertial sensor devices 931, 932, 933, 961, 962, and 963 are each located within the region Q1 and are bonded to the inner bottom surface of the base 3 with their top surfaces facing the inner bottom surface of the base 3. In this embodiment, the portions where the circuit element 7 and the connector 8 are located are raised by approximately the thickness of the inertial sensor devices 931, 932, 933, 961, 962, and 963, thereby suppressing bending of the central portion 610.

[0073] 15, the inertial sensor device 911 is located in the region Q2 and is joined to the wall surface 321b of the first outer wall portion 321 with its top surface facing the wall surface 321b. The inertial sensor device 912 is located in the region Q2 and is joined to the wall surface 331a of the first inner wall portion 331 with its top surface facing the wall surface 331a. The inertial sensor device 913 is located in the region Q1 and is joined to the wall surface 331b of the first inner wall portion 331 with its top surface facing the wall surface 331b.

[0074] 16, the inertial sensor device 921 is located in the region Q2 and is joined to the wall surface 322b of the second outer wall portion 322, which is the fourth mounting surface, with its top surface facing the wall surface 322b. The inertial sensor device 922 is located in the region Q2 and is joined to the wall surface 332a of the second inner wall portion 332, which is the fifth mounting surface, with its top surface facing the wall surface 332a. The inertial sensor device 923 is located in the region Q1 and is joined to the wall surface 332b of the second inner wall portion 332, which is the sixth mounting surface, with its top surface facing the wall surface 332b.

[0075] 15, the inertial sensor device 941 is located in the region Q2 and is joined to the wall surface 323b of the third outer wall portion 323 with its top surface facing the wall surface 323b. The inertial sensor device 942 is located in the region Q2 and is joined to the wall surface 333a of the third inner wall portion 333 with its top surface facing the wall surface 333a. The inertial sensor device 943 is located in the region Q1 and is joined to the wall surface 333b of the third inner wall portion 333 with its top surface facing the wall surface 333b.

[0076] 16, the inertial sensor device 951 is located in the region Q2 and is joined to the wall surface 324b of the fourth outer wall portion 324 with its top surface facing the wall surface 324b. The inertial sensor device 952 is located in the region Q2 and is joined to the wall surface 334a of the fourth inner wall portion 334 with its top surface facing the wall surface 334a. The inertial sensor device 953 is located in the region Q1 and is joined to the wall surface 334b ​​of the fourth inner wall portion 334 with its top surface facing the wall surface 334b.

[0077] In addition, the inertial sensor devices 911, 912, 913, 921, 922, 923, 931, 932, 933, 941, 942, 943, 951, 952, 953, 961, 962, 963 may all be single-axis angular velocity sensors that detect angular velocity around the J1 axis, or single-axis acceleration sensors that detect acceleration in the J1 axis direction, or 6DoF sensors, or three-axis angular velocity sensors that detect angular velocity around each of the J1 axis, J2 axis, and J3 axis, or three-axis acceleration sensors that detect acceleration in each of the J1 axis, J2 axis, and J3 axis.

[0078] As described above, the sensor module 1 of this embodiment has a second inertial sensor device group 92 including the fourth inertial sensor device 921, the fifth inertial sensor device 922, and the sixth inertial sensor device 923, all of which have detection axes oriented in the same direction. The base 3 has a wall surface 322b serving as a fourth mounting surface on which the inertial sensor device 921 is disposed, a wall surface 332a serving as a fifth mounting surface parallel to the wall surface 322b on which the inertial sensor device 922 is disposed, and a sixth mounting surface wall surface 332b serving as a sixth mounting surface parallel to the wall surface 322b on which the inertial sensor device 923 is disposed. With this configuration, the base 3 has the parallel walls 322b, 332a, and 332b, which make it easy to juxtapose the inertial sensor devices 921, 922, and 923 in parallel positions.

[0079] The fourth embodiment can also achieve the same effects as the first embodiment described above.

[0080] Fifth Embodiment Fig. 18 is a top view showing a sensor module according to the fifth embodiment, and Fig. 19 is a development view of a sensor mounting board.

[0081] This embodiment is similar to the fourth embodiment described above, except for the configurations of the base 3 and the sensor mounting board 5. In the following description, differences between this embodiment and the first embodiment will be mainly described, and descriptions of similar points will be omitted. In addition, in each drawing of this embodiment, the same reference numerals are used to designate the same components as those in the above-described embodiments.

[0082] 18, in the base 3 of this embodiment, the inner wall portion 33 is L-shaped. The inner wall portion 33 has a first inner wall portion 331 located on the negative side in the X-axis direction and extending in the Y-axis direction, and a second inner wall portion 332 located on the negative side in the Y-axis direction and extending in the X-axis direction.

[0083] Furthermore, in addition to the circuit element 7, connector 8, and first inertial sensor device group 91, the sensor mounting board 5 also has a second inertial sensor device group 92, a third inertial sensor device group 93, and a fourth inertial sensor device group 94. Of these, the first inertial sensor device group 91, the second inertial sensor device group 92, and the third inertial sensor device group 93 have the same configuration as in the fourth embodiment, and therefore their description will be omitted. In contrast, the three inertial sensor devices 941, 942, and 943 included in the fourth inertial sensor device group 94 are triaxial acceleration sensors that detect acceleration in the directions of the J1 axis, J2 axis, and J3 axis, respectively.

[0084] 19 shows a development view of the sensor mounting board 5. As shown in the figure, the flexible wiring board 61 is L-shaped and has a central portion 610 located in the center, a first band portion 611 extending from the central portion 610 to the negative side in the X-axis direction, and a second band portion 612 extending from the central portion 610 to the negative side in the Y-axis direction.

[0085] A circuit element 7 and a connector 8 are mounted on the front surface of central portion 610, and inertial sensor devices 931, 932, 933, 941, 942, and 943 are mounted on the back surface of central portion 610. Inertial sensor devices 911, 912, and 913 are mounted on the back surface of first band portion 611, lined up in the X-axis direction. Inertial sensor devices 921, 922, and 923 are mounted on the back surface of second band portion 612, lined up in the Y-axis direction.

[0086] The sensor mounting board 5 is housed in the base 3 with the back surface of the flexible wiring board 61 facing downward, the central portion 610 located within the region Q1, and the first and second band portions 611 and 612 bent in the thickness direction so that they extend beyond the inner wall portion 33 and straddle the regions Q1 and Q2. When the sensor mounting board 5 is housed in the base 3, the J1 axes of the inertial sensor devices 941, 942, and 943 coincide with the X axis, the J2 axes coincide with the Y axis, and the J3 axes coincide with the Z axis.

[0087] The fifth embodiment can also achieve the same effects as the first embodiment described above.

[0088] Although the sensor module of the present invention has been described above based on the illustrated embodiment, the present invention is not limited to this, and the configuration of each part can be replaced with any configuration having a similar function. Furthermore, any other configuration may be added to the present invention. Furthermore, each embodiment may be combined as appropriate. [Explanation of symbols]

[0089] 1...sensor module, 2...package, 3...base, 31...bottom, 32...outer wall portion, 321...first outer wall portion, 321a...wall surface, 321b...wall surface, 322...second outer wall portion, 322a...wall surface, 322b...wall surface, 323...third outer wall portion, 323a...wall surface, 323b...wall surface, 324...fourth outer wall portion, 324a...wall surface, 324b...wall surface, 33...inner wall portion, 331...first inner wall portion, 331a...wall surface, 331b...wall surface, 332...second inner wall portion, 332a...wall surface, 332b...wall surface, 333...third inner wall portion, 333a...wall surface, 3 33b...wall surface, 334...fourth inner wall portion, 334a...wall surface, 334b...wall surface, 391...first positioning portion, 391a...contact surface, 391b...contact surface, 392...second positioning portion, 393...third positioning portion, 4...lid, 41...opening, 42...wall portion, 5...sensor mounting substrate, 6...connection portion, 61...flexible wiring board, 610...center portion, 611...first band portion, 612...second band portion, 613...third band portion, 614...fourth band portion, 62...rigid-flexible wiring board, 621...rigid wiring board, 622...flexible wiring Circuit board, 63...connector wiring, 7...circuit element, 8...connector, 91...first inertial sensor device group, 911...inertial sensor device, 912...inertial sensor device, 913...inertial sensor device, 914...inertial sensor device, 915...inertial sensor device, 92...second inertial sensor device group, 921...inertial sensor device, 922...inertial sensor device, 923...inertial sensor device, 93...third inertial sensor device group, 931...inertial sensor device, 932...inertial Sensor device, 933...inertial sensor device, 94...fourth inertial sensor device group, 941...inertial sensor device, 942...inertial sensor device, 943...inertial sensor device, 95...fifth inertial sensor device group, 951...inertial sensor device, 952...inertial sensor device, 953...inertial sensor device, 96...sixth inertial sensor device group, 961...inertial sensor device, 962...inertial sensor device, 963...inertial sensor device, Q1...area, Q2...area

Claims

1. a first inertial sensor device group including a first inertial sensor device, a second inertial sensor device, and a third inertial sensor device, each having a detection axis oriented in the same direction; a base including a first mounting surface on which the first inertial sensor device is arranged, a second mounting surface parallel to the first mounting surface on which the second inertial sensor device is arranged, and a third mounting surface parallel to the first mounting surface on which the third inertial sensor device is arranged.

2. The sensor module according to claim 1 , wherein the first mounting surface, the second mounting surface, and the third mounting surface are aligned along a normal direction of the first mounting surface.

3. The sensor module according to claim 2 , wherein the first inertial sensor device, the second inertial sensor device, and the third inertial sensor device are aligned along a normal direction of the first mounting surface.

4. the base is a box-like structure that houses the first inertial sensor device group; a first wall portion having a pair of wall surfaces facing the outside of the base and the other facing the inside of the base; and a second wall portion disposed opposite the first wall portion, and both of the pair of wall surfaces facing the inside of the base, a wall surface of the first wall portion facing the inside of the base is the first placement surface, a wall surface of the second wall portion facing the first wall portion is the second placement surface, The sensor module according to claim 3 , wherein a wall surface of the second wall portion located on the opposite side to the first wall portion is the third mounting surface.

5. The sensor module according to claim 1 , further comprising a connection portion connecting the first inertial sensor device, the second inertial sensor device, and the third inertial sensor device.

6. The sensor module according to claim 5 , wherein the connection portion is a flexible wiring board.

7. a second inertial sensor device group including a fourth inertial sensor device, a fifth inertial sensor device, and a sixth inertial sensor device, each having a detection axis oriented in the same direction; 2. The sensor module of claim 1, wherein the base comprises a fourth mounting surface on which the fourth inertial sensor device is arranged, a fifth mounting surface parallel to the fourth mounting surface on which the fifth inertial sensor device is arranged, and a sixth mounting surface parallel to the fourth mounting surface on which the sixth inertial sensor device is arranged.

Images