Wiring circuit board

Abstract

To provide a wiring circuit board capable of suppressing short circuits between a first terminal and a second terminal caused by solder.SOLUTION: A wiring circuit board 1 includes a first insulating layer 3, a circuit pattern 4, a second insulating layer 5, and a third insulating layer 6. The circuit pattern 4 has a first terminal 41A, first wiring 42A connected to the first terminal 41A, and a second terminal 41B spaced apart from the first terminal 41A. The first wiring 42A has a first main body portion 421A covered by the second insulating layer 5 and a first exposed portion 422A positioned between the first terminal 41A and the first main body portion 421A and exposed from the second insulating layer 5. The third insulating layer 6 is positioned between the first exposed portion 422A and the second terminal 41B, and is also positioned between the first terminal 41A and the second terminal 41B.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a printed circuit board. [Background technology]

[0002] Conventionally, a wired circuit board has been known that includes an insulating base layer, a conductor layer, and an insulating cover layer that covers the conductor layer. The conductor layer has a plurality of terminal portions and a plurality of wirings. The insulating cover layer covers the plurality of wirings (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-002248 Summary of the Invention [Problem to be solved by the invention]

[0004] In the wired circuit board described in Patent Document 1, if the pitch becomes even finer, when the molten solder on a terminal portion flows toward the adjacent terminal portion, there is a possibility that the adjacent terminals may be short-circuited via the solder.

[0005] The present invention provides a wired circuit board that can prevent a first terminal and a second terminal from being short-circuited by solder. [Means for solving the problem]

[0006] The present invention [1] includes a wired circuit board comprising: a first insulating layer; a circuit pattern disposed on the first insulating layer and having a first terminal, a first wiring connected to the first terminal, and a second terminal disposed at a distance from the first terminal; a second insulating layer disposed on the first insulating layer and covering the first wiring; and a third insulating layer disposed on the first insulating layer, wherein the first wiring has a first main body portion covered by the second insulating layer and a first exposed portion disposed between the first terminal and the first main body portion and exposed from the second insulating layer; and the third insulating layer is disposed between the first exposed portion and the second terminal, and between the first terminal and the second terminal.

[0007] According to this configuration, the third insulating layer is disposed between the first exposed portion and the second terminal, and also between the first terminal and the second terminal.

[0008] Therefore, even if the solder placed on the first terminal melts and the molten solder flows from the first terminal and the first exposed portion toward the second terminal, the third insulating layer can stop the molten solder.

[0009] As a result, it is possible to prevent the first terminal and the second terminal from being short-circuited by the solder.

[0010] The present invention [2] includes the wired circuit board of [1] above, wherein the circuit pattern further has a second wiring connected to the second terminal, the second wiring having a second main body portion covered by the second insulating layer and a second exposed portion disposed between the second terminal and the second main body portion and exposed from the second insulating layer, and the third insulating layer is disposed between the first exposed portion and the second exposed portion.

[0011] With this configuration, even if the solder that has flowed along the first exposed portion flows toward the second exposed portion, the third insulating layer can stop the molten solder.

[0012] As a result, it is possible to prevent the first exposed portion and the second exposed portion from being short-circuited by the solder.

[0013] The present invention [3] includes the wired circuit board of the above [1] or [2], in which the third insulating layer is continuous with the second insulating layer.

[0014] With this configuration, the solder flowing from the first exposed portion can be reliably stopped.

[0015] The present invention [4] includes the wired circuit board of any one of the above [1] to [3], wherein the first terminal has a first conductor layer disposed on the first insulating layer and a second conductor layer disposed on the first conductor layer.

[0016] The present invention [5] includes the wired circuit board of the above [4], wherein the second conductor layer protrudes beyond the second insulating layer in the thickness direction of the first insulating layer toward the opposite side of the first insulating layer relative to the first conductor layer.

[0017] The present invention [6] includes the wired circuit board of any one of the above [1] to [5], wherein the third insulating layer is disposed apart from the first terminal and the second terminal.

[0018] The present invention [7] includes the wired circuit board of any one of the above [1] to [6], wherein the first exposed portion extends in a direction perpendicular to the direction in which the first terminals and the second terminals are arranged.

[0019] According to this configuration, when the solder placed on the first terminal melts, the molten solder may flow along the first exposed portion.

[0020] In this regard, the first exposed portion extends in a direction perpendicular to the direction in which the first terminal and the second terminal are arranged side by side.

[0021] Therefore, the molten solder can be guided in a direction perpendicular to the direction in which the first terminals and the second terminals are arranged.

[0022] As a result, the molten solder can be prevented from flowing toward the second terminal.

[0023] The present invention [8] includes the wired circuit board of any one of the above [1] to [7], wherein the width of the first exposed portion is narrower than the width of the first terminal.

[0024] With this configuration, even if the molten solder flows along the first exposed portion, the flowed solder can be concentrated in an area narrower than the width of the first terminal.

[0025] As a result, the molten solder can be prevented from flowing toward the second terminal.

[0026] The present invention [9] includes a wired circuit board according to any one of the above [1] to [8], which has a flexible section in which at least a portion of the first wiring is arranged, and a support section that supports the flexible section, wherein the support section has a metal support layer, and the flexible section does not have the metal support layer. [Effects of the Invention]

[0027] According to the wired circuit board of the present invention, it is possible to prevent the first terminal and the second terminal from being short-circuited by solder. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 is a plan view of one embodiment of the wired circuit board of the present invention. [Figure 2] Fig. 2A is a cross-sectional view taken along line AA of the printed circuit board shown in Fig. 1. Fig. 2B is a cross-sectional view taken along line BB of the printed circuit board shown in Fig. 1. [Figure 3] FIG. 3 is a plan view of the printed circuit board of the modified example (1). [Figure 4] FIG. 4 is a plan view of the printed circuit board of the modified example (2). [Figure 5] FIG. 5 is a plan view of the printed circuit board of the modified example (3). [Figure 6] FIG. 6 is a plan view of a printed circuit board according to a fourth modification. [Figure 7]FIG. 7 is a plan view of a printed circuit board according to a modified example (5). [Figure 8] FIG. 8 is a plan view of a wired circuit board according to a sixth modification, showing a configuration in which the width of the first exposed portion of the wire is the same as the width of the terminal. [Figure 9] FIG. 9 is a plan view of a wired circuit board according to a sixth modification, showing a configuration in which the width of the first exposed portion of the wire is wider than the width of the terminal. [Figure 10] FIG. 10 is a plan view of a printed circuit board according to a seventh modification, showing an embodiment in which the third insulating layer has a tapered shape. [Figure 11] FIG. 11 is a plan view of a printed circuit board according to a modified example (7), showing a configuration in which the third insulating layer has a parabolic tapered shape. [Figure 12] FIG. 12 is a cross-sectional view of a wired circuit board according to a modified example (8), showing a configuration in which the third insulating layer covers the edges of the terminals. [Figure 13] FIG. 13 is a cross-sectional view of a printed circuit board according to a modified example (8), showing an embodiment in which the third insulating layer is made up of a plurality of insulating layers. [Figure 14] FIG. 14 shows a cross-sectional view of a printed circuit board according to a modified example (9). [Figure 15] FIG. 15 shows a cross-sectional view of a printed circuit board according to a modified example (11). [Figure 16] FIG. 16 shows a cross-sectional view of a printed circuit board according to a modified example (12). [Figure 17] Figures 17A to 17C are cross-sectional views of a wired circuit board according to Modification Example (13). Figure 17A shows a configuration in which the metal support layer is not included in the wired circuit board shown in Figure 2B. Figure 17B shows a configuration in which the metal support layer is not included in the wired circuit board shown in Figure 15. Figure 17C shows a configuration in which the metal support layer is not included in the wired circuit board shown in Figure 16. [Figure 18] Fig. 18A is a plan view of the wired circuit board of Modification Example (14), showing a configuration in which the second terminal and the third conductor layer are electrically connected via the second wiring, and Fig. 18B is a plan view of the wired circuit board of Modification Example (14), showing a configuration in which the second terminal and the third conductor layer are directly connected. [Figure 19]FIG. 19 is a plan view of a printed circuit board according to a modified example (15). [Figure 20] FIG. 20 is a plan view of a printed circuit board according to a modified example (16). [Figure 21] 21 is a cross-sectional view taken along CC of the printed circuit board shown in FIG. [Figure 22] FIG. 22 shows a cross-sectional view of a printed circuit board according to a modified example (17). DETAILED DESCRIPTION OF THE INVENTION

[0029] 1. Wiring circuit board As shown in FIG. 1, the wired circuit board 1 extends in a first direction and a second direction. The first direction is the direction in which a first terminal 41A and a second terminal 41B, which will be described later, are aligned. The second direction is perpendicular to the first direction. The shape of the wired circuit board 1 is not limited. The wired circuit board 1 may be a flexible wired circuit board or a circuit-equipped suspension board.

[0030] As shown in FIG. 2A, the wired circuit board 1 includes a metal support layer 2, a first insulating layer 3, a circuit pattern 4, a second insulating layer 5 (see FIG. 1), and a third insulating layer 6.

[0031] (1) Metal support layer The metal support layer 2 supports the first insulating layer 3, the circuit pattern 4, the second insulating layer 5, and the third insulating layer 6. Examples of materials for the metal support layer 2 include stainless steel and copper alloys.

[0032] (2) First insulating layer The first insulating layer 3 is disposed on one side of the metal support layer 2 in the thickness direction of the metal support layer 2. The thickness direction is perpendicular to the first and second directions. The first insulating layer 3 is disposed on one surface of the metal support layer 2 in the thickness direction. The first insulating layer 3 is disposed between the metal support layer 2 and the circuit pattern 4 in the thickness direction. The first insulating layer 3 insulates the metal support layer 2 from the circuit pattern 4. The first insulating layer 3 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. Preferably, the first insulating layer 3 is made of polyimide.

[0033] (3) Circuit pattern The circuit pattern 4 is disposed on one side of the first insulating layer 3 in the thickness direction. The circuit pattern 4 is disposed on one surface of the first insulating layer 3 in the thickness direction. The circuit pattern 4 is disposed on the opposite side of the metal support layer 2 with respect to the first insulating layer 3 in the thickness direction.

[0034] As shown in FIG. 1, the circuit pattern 4 has a first terminal 41A, a second terminal 41B, a first wiring 42A, and a second wiring 42B.

[0035] (3-1) 1st terminal The first terminal 41A is disposed at one end in the second direction of the wired circuit board 1. The first terminal 41A has a first conductor layer 411A and a second conductor layer 412A.

[0036] The first conductor layer 411A is disposed on one surface of the first insulating layer 3 in the thickness direction. The first conductor layer 411A extends in the first and second directions. The first conductor layer 411A has a substantially rectangular flat plate shape. In other words, the first conductor layer 411A has a square land shape. The first conductor layer 411A has a first edge E1 and a second edge E2 in the second direction. The first edge E1 is disposed away from the first exposed portion 422A of the first wiring 42A in the second direction. The first exposed portion 422A will be described later. The first edge E1 extends in the first direction. The second edge E2 is disposed between the first edge E1 and the first exposed portion 422A in the second direction. The second edge E2 extends in the first direction. The first conductor layer 411A is made of metal. Examples of metals include copper, silver, gold, iron, aluminum, and alloys thereof. The first conductor layer 411A is preferably made of copper.

[0037] As shown in FIG. 2B, the second conductor layer 412A is disposed on one side of the first conductor layer 411A in the thickness direction. The second conductor layer 412A is disposed on one surface of the first conductor layer 411A in the thickness direction. The second conductor layer 412A may be thicker than the first conductor layer 411A. The second conductor layer 412A protrudes beyond the second insulating layer 5 toward the opposite side of the first insulating layer 3 relative to the first conductor layer 411A in the thickness direction of the first insulating layer 3. The second conductor layer 412A may be made of the same metal as the material of the first conductor layer 411A. The second conductor layer 412A is preferably made of the same metal as the first conductor layer 411A.

[0038] (3-2) 2nd terminal 1, the second terminal 41B is disposed at one end of the wired circuit board 1 in the second direction. The second terminal 41B is disposed at a distance from the first terminal 41A in the first direction. The second terminal 41B has the same layer structure as the first terminal 41A. That is, like the first terminal 41A, the second terminal 41B has a first conductor layer 411B and a second conductor layer 412B.

[0039] The description of first conductor layer 411B is the same as the description of first conductor layer 411A, and the description of second conductor layer 412B is the same as the description of second conductor layer 412A, so the description of first conductor layer 411B and the description of second conductor layer 412B will be omitted.

[0040] (3-3) First wiring The first wiring 42A is connected to the first terminal 41A. More specifically, the first wiring 42A is connected to the first conductor layer 411A of the first terminal 41A. The first wiring 42A is made of the same metal as the first conductor layer 411A. The first wiring 42A has a first main body portion 421A and a first exposed portion 422A.

[0041] The first body portion 421A is a portion of the first wiring 42A that is covered by the second insulating layer 5. The first body portion 421A is disposed away from the first terminal 41A. The shape of the first body portion 421A is not limited. In this embodiment, the first body portion 421A extends in the second direction. The first body portion 421A may be bent in the first direction.

[0042] When the total length of the first wiring 42A is taken as 100%, the length of the first main body portion 421A is, for example, 50% to 99.99%. This proportion may be 99.0% or less, or may be 95.0% or less.

[0043] The first exposed portion 422A is a portion of the first wiring 42A that is exposed from the second insulating layer 5. The first exposed portion 422A is disposed between the first terminal 41A and the first main portion 421A. The first exposed portion 422A is disposed in the center of the first terminal 41A in the first direction. The first exposed portion 422A is continuous with the first main portion 421A and connected to the second edge E2 of the first terminal 41A. The first exposed portion 422A extends in the second direction. If the solder placed on the first terminal 41A melts, the molten solder may flow along the first exposed portion 422A. In this regard, since the first exposed portion 422A extends in the second direction, the molten solder can be guided in the second direction. As a result, the molten solder can be prevented from flowing in the first direction toward the second terminal 41B.

[0044] The width W2 (dimension in the first direction) of the first exposed portion 422A is narrower than the width W1 (dimension in the first direction) of the first terminal 41A. Therefore, even if the molten solder flows along the first exposed portion 422A, the flowed solder can be concentrated in an area in the first direction that is narrower than the width W1 of the first terminal 41A. As a result, the molten solder can be prevented from flowing in the first direction toward the second terminal 41B.

[0045] (3-4)Second wiring The second wiring 42B is connected to the second terminal 41B. More specifically, the second wiring 42B is connected to the first conductor layer 411B of the second terminal 41B. The second wiring 42B is made of the same metal as the first conductor layer 411B. The second wiring 42B is arranged apart from the first wiring 42A. The second wiring 42B has a second main body portion 421B and a second exposed portion 422B.

[0046] The second body portion 421B is a portion of the second wiring 42B that is covered by the second insulating layer 5. The second body portion 421B is disposed away from the second terminal 41B. The shape of the second body portion 421B is not limited. In this embodiment, the second body portion 421B extends in the second direction. The second body portion 421B may be bent in the first direction.

[0047] When the total length of the second wiring 42B is taken as 100%, the length of the second main body portion 421B is, for example, 50% to 99.99%. This proportion may be 99.0% or less, or may be 95.0% or less.

[0048] The second exposed portion 422B is a portion of the second wiring 42B that is exposed from the second insulating layer 5. The second exposed portion 422B is arranged between the second terminal 41B and the second main body portion 421B. The second exposed portion 422B is arranged in the center of the second terminal 41B in the first direction. The second exposed portion 422B is continuous with the second main body portion 421B and connected to the second terminal 41B. The second exposed portion 422B extends in the second direction. The width (dimension in the first direction) of the second exposed portion 422B is narrower than the width (dimension in the first direction) of the second terminal 41B.

[0049] (4) Second insulating layer The second insulating layer 5 is disposed on one surface of the first insulating layer 3 in the thickness direction. The second insulating layer 5 covers the first wiring 42A and the second wiring 42B. Specifically, the second insulating layer 5 covers the first body portion 421A of the first wiring 42A and the second body portion 421B of the second wiring 42B. The second insulating layer 5 does not cover the first terminal 41A, the second terminal 41B, the first exposed portion 422A of the first wiring 42A, or the second exposed portion 422B of the second wiring 42B. The second insulating layer 5 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0050] (5) Third insulating layer The third insulating layer 6 is disposed between the first exposed portion 422A and the second terminal 41B in the first direction, and is also disposed between the first terminal 41A and the second terminal 41B.

[0051] Therefore, even if the solder placed on first terminal 41A melts and flows from first terminal 41A and first exposed portion 422A toward second terminal 41B, the melted solder can be stopped by third insulating layer 6. As a result, it is possible to prevent first terminal 41A and second terminal 41B from being short-circuited by the solder.

[0052] Furthermore, third insulating layer 6 is disposed between first exposed portion 422A and second exposed portion 422B. Therefore, even if solder flows along first exposed portion 422A and flows toward second exposed portion 422B along the edge of second insulating layer 5, third insulating layer 6 can stop the molten solder. As a result, it is possible to prevent first exposed portion 422A and second exposed portion 422B from being short-circuited by solder.

[0053] The third insulating layer 6 extends in the second direction. The third insulating layer 6 has one end E11 and the other end E12 in the second direction. In the second direction, the distance D1 between the one end E11 and the second insulating layer 5 is longer than the distance D2 between the second edge E2 of the first terminal 41A and the second insulating layer 5. The other end E12 is disposed between the one end E11 and the second insulating layer 5 in the second direction. The other end E12 of the third insulating layer 6 is preferably continuous with the second insulating layer 5. By having the other end E12 of the third insulating layer 6 continuous with the second insulating layer 5, it is possible to reliably stop the solder from flowing from the first exposed portion 422A toward the second exposed portion 422B.

[0054] The third insulating layer 6 is disposed away from the first terminal 41A and the second terminal 41B in the first direction. Therefore, the solder flowing from the first terminal 41A or the first exposed portion 422A toward the second terminal 41B can be received between the third insulating layer 6 and the first terminal 41A. Furthermore, the solder flowing from the second terminal 41B or the second exposed portion 422B toward the first terminal 41A can be received between the third insulating layer 6 and the second terminal 41B.

[0055] 2A, the third insulating layer 6 is disposed on one side of the first insulating layer 3 in the thickness direction. The third insulating layer 6 is disposed on one surface of the first insulating layer 3 in the thickness direction.

[0056] The thickness T1 of the third insulating layer 6 may be thinner than the thickness T2 of the first terminal 41A. The thickness T1 of the third insulating layer 6 is preferably equal to or greater than the thickness T3 of the first conductor layer 411A. The thickness T1 of the third insulating layer 6 is preferably equal to or greater than the thickness T4 of the first exposed portion 422A (see FIG. 2B).

[0057] 2. Effects (1) According to the wired circuit board 1, as shown in FIG. 1, the third insulating layer 6 is arranged in the first direction between the first exposed portion 422A and the second terminal 41B, and also between the first terminal 41A and the second terminal 41B.

[0058] Therefore, even if the solder placed on the first terminal 41A melts and the molten solder flows from the first terminal 41A and the first exposed portion 422A toward the second terminal 41B, the third insulating layer 6 can stop the molten solder.

[0059] As a result, it is possible to prevent the first terminal 41A and the second terminal 41B from being short-circuited by the solder.

[0060] (2) According to the wired circuit board 1, as shown in FIG. 1, the third insulating layer 6 is disposed between the first exposed portion 422A and the second exposed portion 422B.

[0061] Therefore, even if the solder that has flowed along the first exposed portion 422A flows along the edge of the second insulating layer 5 toward the second exposed portion 422B, the third insulating layer 6 can stop the molten solder.

[0062] As a result, it is possible to prevent the first exposed portion 422A and the second exposed portion 422B from being short-circuited by the solder.

[0063] (3) According to the wired circuit board 1, the other end E12 of the third insulating layer 6 is continuous with the second insulating layer 5, as shown in FIG.

[0064] Therefore, the solder flowing from first exposed portion 422A toward second exposed portion 422B can be reliably stopped.

[0065] (4) According to the wired circuit board 1, as shown in FIG. 1, the first exposed portion 422A extends in the second direction.

[0066] Therefore, the molten solder can be guided in the second direction.

[0067] As a result, the molten solder can be prevented from flowing in the first direction toward the second terminal 41B.

[0068] (5) According to the wired circuit board 1, as shown in FIG. 1, the width W2 of the first exposed portion 422A is narrower than the width W1 of the first terminal 41A.

[0069] Therefore, even if the molten solder flows along the first exposed portion 422A, the flowed solder can be concentrated in an area in the first direction that is narrower than the width W1 of the first terminal 41A.

[0070] As a result, the molten solder can be prevented from flowing in the first direction toward the second terminal 41B.

[0071] 3. Variations In the modified example, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0072] (1) As shown in FIG. 3 , the third insulating layer 6 may be disposed between the entire first terminal 41A and the entire second terminal 41B in the first direction. The third insulating layer 6 may extend to the opposite side of the second insulating layer 5 from the first edge E1 of the first terminal 41A in the second direction. In other words, one end E11 of the third insulating layer 6 may be disposed on the opposite side of the second insulating layer 5 from the first edge E1 of the first terminal 41A in the second direction. Note that one end E11 of the third insulating layer 6 may be disposed at the same position as the first edge E1 of the first terminal 41A in the second direction.

[0073] (2) As shown in FIG. 4, a plurality of third insulating layers 6 may be disposed between the first terminal 41A and the second terminal 41B in the first direction.

[0074] (3) As shown in Fig. 5, the third insulating layer 6 may not be continuous with the second insulating layer 5. In this case, the third insulating layer 6 may be separated from the second insulating layer 5 in the second direction to an extent that does not allow the passage of solder. The third insulating layer 6 may be discontinuous with the second insulating layer 5 and may be in contact with the second insulating layer 5 in the second direction.

[0075] (4) As shown in Fig. 6, the first exposed portion 422A may be disposed closer to the second terminal 41B in the first direction than the center of the first terminal 41A. The second exposed portion 422B may be disposed closer to the first terminal 41A in the first direction than the center of the second terminal 41B.

[0076] (5) As shown in Fig. 7, the second terminal 100 may be a ground terminal. The second terminal 100 is electrically connected to the metal support layer 2 (see Fig. 2A) through a via 100A.

[0077] (6) As shown in Fig. 8, the width W2 of the first exposed portion 422A may be the same as the width W1 of the first terminal 41A. Alternatively, as shown in Fig. 9, the width W2 of the first exposed portion 422A may be wider than the width W1 of the first terminal 41A.

[0078] (7) The shape of the third insulating layer 6 is not limited. For example, as shown in Fig. 10, the third insulating layer 6 may have a tapered shape that becomes thinner as it moves away from the second insulating layer 5 in the second direction. The third insulating layer 6 may have a parabolic tapered shape as shown in Fig. 11. Alternatively, the third insulating layer 6 may have an exponential tapered shape.

[0079] (8) As shown in Fig. 12, the third insulating layer 6 may cover the edges of the first terminal 41A and the second terminal 41B. As shown in Fig. 13, the third insulating layer 6 may be a laminate of multiple insulating layers 61, 62.

[0080] In addition, the wired circuit board 1 may have a conductor layer arranged between the first exposed portion 422A and the second terminal 41B, and between the first terminal 41A and the second terminal 41B, and the third insulating layer 6 may cover the conductor layer.

[0081] (9) As shown in FIG. 14, the first terminal 41A and the second terminal 41B may be formed from a single conductor layer.

[0082] (10) The first terminal 41A and the second terminal 41B may be plated.

[0083] (11) As shown in FIG. 15, the wired circuit board 1 may further include a third conductor layer 51 and a third insulating layer 52.

[0084] The third conductor layer 51 is disposed on the other side of the first insulating layer 3 in the thickness direction. The third conductor layer 51 is disposed on the other surface of the first insulating layer 3 in the thickness direction. The third conductor layer 51 is disposed on the opposite side of the circuit pattern 4 with respect to the first insulating layer 3 in the thickness direction.

[0085] The third insulating layer 52 covers the third conductor layer 51. The third insulating layer 52 is disposed on the other side of the first insulating layer 3 in the thickness direction. The third insulating layer 52 is disposed on the other surface of the first insulating layer 3 in the thickness direction. The third insulating layer 52 may be bonded to the other surface of the first insulating layer 3 in the thickness direction and to the third conductor layer 51 with an adhesive 53. The third insulating layer 52 may be in direct contact with the other surface of the first insulating layer 3 in the thickness direction and to the third conductor layer 51. More specifically, when the third insulating layer 52 also functions as an adhesive, the third insulating layer 52 can be directly bonded to the other surface of the first insulating layer 3 and to the third conductor layer 51. For example, when the third insulating layer 52 is made of a thermoplastic resin, the third insulating layer 52 may also function as an adhesive.

[0086] The second insulating layer 5 may be bonded by an adhesive 53 to one surface of the first insulating layer 3 in the thickness direction and to each of the wirings (first wiring 42A and second wiring 42B).

[0087] Furthermore, the metal support layer 2 may be bonded to the other surface of the third insulating layer 52 in the thickness direction by the adhesive 53. Furthermore, if the third insulating layer 52 also functions as an adhesive, the metal support layer 2 may be bonded directly to the third insulating layer 52. In other words, the third insulating layer 52 may bond the other surface of the first insulating layer 3 to the metal support layer 2, and may also bond the third conductor layer 51 to the metal support layer 2.

[0088] (12) As shown in Fig. 16, the wired circuit board 1 may further include a fourth conductor layer 54 and a fourth insulating layer 55 in addition to the third conductor layer 51 and the third insulating layer 52. In this case, the wired circuit board 1 does not need to include the third conductor layer 51.

[0089] The fourth conductor layer 54 is disposed on the other side of the third insulating layer 52 in the thickness direction. The fourth conductor layer 54 is disposed on the other surface of the third insulating layer 52 in the thickness direction. The fourth conductor layer 54 is disposed on the opposite side of the third conductor layer 51 with respect to the third insulating layer 52 in the thickness direction.

[0090] The fourth insulating layer 55 covers the fourth conductor layer 54. The fourth insulating layer 55 is disposed on the other side of the third insulating layer 52 in the thickness direction. The fourth insulating layer 55 is disposed on the other surface of the third insulating layer 52 in the thickness direction. The fourth insulating layer 55 may be bonded to the other surface of the third insulating layer 52 in the thickness direction and to the fourth conductor layer 54 by an adhesive 53. The fourth insulating layer 55 may be in direct contact with the other surface of the third insulating layer 52 in the thickness direction and to the fourth conductor layer 54. More specifically, when the fourth insulating layer 55 also functions as an adhesive, the fourth insulating layer 55 can be directly bonded to the other surface of the third insulating layer 52 and to the fourth conductor layer 54. For example, when the fourth insulating layer 55 is made of a thermoplastic resin, the fourth insulating layer 55 can also function as an adhesive.

[0091] Furthermore, the metal support layer 2 may be bonded to the other surface of the fourth insulating layer 55 in the thickness direction by the adhesive 53. Furthermore, if the fourth insulating layer 55 also functions as an adhesive, the metal support layer 2 may be bonded directly to the fourth insulating layer 55. In other words, the fourth insulating layer 55 may bond the other surface of the third insulating layer 52 to the metal support layer 2, and may also bond the fourth conductor layer 54 to the metal support layer 2.

[0092] (13) As shown in FIGS. 17A to 17C, the wired circuit board 1 may not have the metal support layer 2. Specifically, as shown in FIG. 17A, the wired circuit board 1 shown in FIG. 2B may not have the metal support layer 2. As shown in FIG. 17B, the wired circuit board 1 shown in FIG. 15 may not have the metal support layer 2. As shown in FIG. 17C, the wired circuit board 1 shown in FIG. 16 may not have the metal support layer 2.

[0093] (14) As shown in FIGS. 18A and 18B, when the wired circuit board 1 includes a third conductor layer 51, the second terminal 41B may be electrically connected to the third conductor layer 51, for example.

[0094] 18A, the second wiring 42B may be connected to the third conductor layer 51 through a through hole 30 (via hole) in the first insulating layer 3. This allows the second terminal 41B to be electrically connected to the third conductor layer 51 via the second wiring 42B.

[0095] 18B, the second terminal 41B may be directly connected to the third conductor layer 51 through a through hole 30 (via hole) in the first insulating layer 3. In this case, the wired circuit board 1 does not include the second wiring 42B.

[0096] 19, the first exposed portion 422A of the first wiring 42A may be disposed in the first direction between the first terminal 41A and the third insulating layer 6. Furthermore, the second exposed portion 422B of the second wiring 42B may be disposed in the first direction between the second terminal 41B and the third insulating layer 6.

[0097] In this case, first exposed portion 422A and second exposed portion 422B may each extend in the first direction. First main body portion 421A may extend in the first direction continuously with first exposed portion 422A and curve in the second direction. Second main body portion 421B may extend in the first direction continuously with second exposed portion 422B and curve in the second direction. Third insulating layer 6 may cover at least a portion of curved portion 4211A of first main body portion 421A and at least a portion of curved portion 4211B of second main body portion 421B.

[0098] (16) As shown in FIG. 20, the wired circuit board 1 may have a supporting portion 1A and a flexible portion 1B.

[0099] Supporting portion 1A supports an end portion of flexible portion 1B. First terminal 41A and second terminal 41B may be disposed on supporting portion 1A. With an electronic component (not shown) mounted on wired circuit board 1, supporting portion 1A may be fixed to the electronic component.

[0100] The flexible portion 1B is flexible when electronic components are mounted on the wired circuit board 1. At least a portion of each of the first wiring 42A and the second wiring 42B is disposed on the flexible portion 1B. The shape of each of the flexible portions 1B is not limited. Each of the flexible portions 1B may be linear or curved. The wired circuit board 1 may have multiple flexible portions 1B.

[0101] 21, the metal support layer 2 may be disposed in the supporting part 1A, not in the flexible part 1B. In other words, the supporting part 1A may have the metal support layer 2, and the flexible part 1B may not have the metal support layer 2.

[0102] (17) As shown in FIG. 22, when the wired circuit board 1 has a supporting portion 1A and a flexible portion 1B, the wired circuit board 1 may include a third conductor layer 51 and a third insulating layer 52.

[0103] In this case, the metal support layer 2 may be bonded to the third insulating layer 52 by an adhesive 70. The adhesive 70 may be a conductive adhesive and may be in contact with the third conductor layer 51 through the through holes 52A of the third insulating layer 52. The third conductor layer 51 may be electrically connected to the metal support layer 2 via the adhesive 70 (conductive adhesive).

[0104] (18) The above-described modifications (1) to (17) can also provide the same effects as those of the above-described embodiment.

[0105] Furthermore, the above-described embodiment and modifications (1) to (17) can be combined. [Explanation of symbols]

[0106] 1 Wiring circuit board 3 First insulating layer 4 Circuit Pattern 41A 1st terminal 411A First conductor layer 412A Second conductor layer 41B 2nd terminal 42A 1st wiring 421A First main body part 422A 1st exposed part 42B Second wiring 421B 2nd main body 422B 2nd exposed part 5 Second insulating layer 6 Third insulating layer 100 2nd terminal

Claims

1. a first insulating layer; a circuit pattern disposed on the first insulating layer, the circuit pattern having a first terminal, a first wiring connected to the first terminal, and a second terminal disposed at an interval from the first terminal; a second insulating layer disposed on the first insulating layer and covering the first wiring; a third insulating layer disposed on the first insulating layer; Equipped with the first wiring has a first body portion covered by the second insulating layer, and a first exposed portion disposed between the first terminal and the first body portion and exposed from the second insulating layer, The third insulating layer is disposed between the first exposed portion and the second terminal, and between the first terminal and the second terminal.

2. the circuit pattern further includes a second wiring connected to the second terminal; the second wiring has a second body portion covered by the second insulating layer, and a second exposed portion disposed between the second terminal and the second body portion and exposed from the second insulating layer, The printed circuit board according to claim 1 , wherein the third insulating layer is disposed between the first exposed portion and the second exposed portion.

3. The printed circuit board according to claim 1 , wherein the third insulating layer is continuous with the second insulating layer.

4. The first terminal is a first conductor layer disposed on the first insulating layer; a second conductor layer disposed on the first conductor layer; The printed circuit board according to claim 1 , comprising:

5. The printed circuit board according to claim 4 , wherein the second conductor layer protrudes beyond the second insulating layer in a thickness direction of the first insulating layer toward an opposite side of the first conductor layer from the first insulating layer.

6. The printed circuit board according to claim 1 , wherein the third insulating layer is disposed apart from the first terminal and the second terminal.

7. The printed circuit board according to claim 1 , wherein the first exposed portion extends in a direction perpendicular to a direction in which the first terminals and the second terminals are arranged side by side.

8. The printed circuit board according to claim 1 , wherein a width of the first exposed portion is narrower than a width of the first terminal.

9. a flexible portion on which at least a portion of the first wiring is disposed, and a support portion that supports the flexible portion; the support portion has a metal support layer; The printed circuit board according to claim 1 , wherein the flexible portion does not have the metal support layer.

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