Processing device and support pillar

Abstract

To provide a processing device which inhibits increase in size of the device and reduces work time for adjusting a distance between two components.SOLUTION: A grinding device (1) includes: a holding unit (40) for holding a wafer (W); and a grinding unit (30) which is attached with grinding stones (39) configured to grind the held wafer and rotates the grind stones. The holding unit includes: a chuck table (12) for holding the wafer; a table base (45) to which the chuck table is attached; a base (53) supporting the table base; adjustment pillars (60) which are erected on the base and disposed between the table base and the base; a bearing (312) disposed between the adjustment pillars and the base; and load sensors (67) each of which is disposed in a pillar form within the support pillar. The support pillar includes: a first male screw part (71) which threadedly engages with a female screw part (471) provided at the table base; and an attachment surface (73) which is supported through the bearing on the base and maintains an axial position of the adjustment pillar by an operation for rotating the first male screw part.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a processing device and a support column. [Background technology]

[0002] Patent Documents 1 and 2 disclose grinding devices that grind wafers held on a chuck table. These devices are equipped with an inclination adjustment mechanism that adjusts the inclination of the chuck table so that the holding surface of the chuck table and the grinding surface of the grinding wheel are parallel to each other and the surface of the wafer is finished with high precision.

[0003] In addition, in Patent Document 2, a load sensor detects the load that the chuck table receives when a grinding wheel is pressed against a wafer held by the chuck table. In Patent Document 2, the chuck table is supported by a base, and the load sensor is disposed between the base and the chuck table.

[0004] Here, in Patent Document 3, the tilt adjustment mechanism for a chuck table is configured with an adjustment screw that connects the chuck table and a base, and a load sensor is provided inside the adjustment screw. The adjustment screw has two male thread portions with different thread pitches, one of the two male thread portions threadably engages with a female thread provided on the chuck table, and the other of the two male thread portions threadably engages with a female thread provided on the base. Because the two male thread portions of the adjustment screw have different thread pitches, when the adjustment screw is rotated, the movement distance of the chuck table relative to the adjustment screw differs from the movement distance of the base. This difference makes it possible to adjust the tilt by lengthening or shortening the distance between the chuck table and the base. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-001653 [Patent Document 2] Japanese Patent Publication No. 2021-115669 [Patent Document 3] Japanese Patent Publication No. 2021-137879 Summary of the Invention [Problem to be solved by the invention]

[0006] In Patent Document 2, the load sensor is sandwiched between the chuck table and the base, which results in a problem that the tilt adjustment mechanism becomes large, and in turn the entire grinding apparatus also becomes large.

[0007] In addition, in Patent Document 3, the distance between the chuck table and the base can be adjusted by differentiating the thread pitches of the two male threads of the adjustment screw, which poses a problem that the amount of rotation of the adjustment screw is large relative to the amount of distance adjustment, and the adjustment takes a long time.

[0008] The present invention has been made in consideration of these points, and one of its objects is to provide a processing device and a support column that can prevent the device from becoming too large and shorten the work time required to adjust the distance between two parts. [Means for solving the problem]

[0009] A processing apparatus according to one embodiment of the present invention is a processing apparatus comprising a holding unit that holds a wafer, and a processing unit that mounts and rotates a processing tool for processing the wafer held by the holding unit, wherein the holding unit comprises a chuck table that holds the wafer, a table base on which the chuck table is mounted and rotated, a base that supports the table base, a support column that stands on the base and is positioned between the table base and the base, a rotation support portion that is positioned between the support column and the base, and a load sensor that is columnarly positioned within the support column, and the support column has a male threaded portion that screws into a female threaded portion provided on the table base, and a mounting surface that is supported by the base via the rotation support portion and maintains the axial position of the support column by rotating the male threaded portion.

[0010] Another aspect of the present invention is a processing apparatus comprising a holding unit that holds a wafer, and a processing unit that is fitted with and rotates a processing tool for processing the wafer held by the holding unit, wherein the processing unit comprises a spindle unit that has the processing tool attached to its tip, a base that supports the spindle unit, a support column that is erected on the base and positioned between the spindle unit and the base, a rotation support portion that is positioned between the support column and the base, and a load sensor that is columnarly positioned within the support column, and the support column has a male threaded portion that screws into a female threaded portion provided on the spindle unit, and a mounting surface that is supported by the base via the rotation support portion and maintains the axial position of the support column by rotating the male threaded portion.

[0011] A support pillar of one embodiment of the present invention comprises a male threaded portion that screws into a female threaded portion provided on a first part, a mounting surface that is supported on a second part via a rotation support portion provided on the second part and maintains its axial position by rotating the male threaded portion, and a cylindrical load sensor that is disposed internally between the male threaded portion and the mounting surface. [Effects of the Invention]

[0012] According to the present invention, the support column has a mounting surface, allowing it to be rotated while maintaining its axial position via the rotation support part. This reduces the amount of rotation of the support column relative to the amount of position adjustment of a part or structure that has an internal thread that screws into the external thread of the support column, thereby shortening the adjustment work time. Furthermore, because the load sensor is located inside the support column, there is no need to sandwich the load sensor between two parts or structures, which prevents the area around the support column and, ultimately, the entire device from becoming larger. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a schematic perspective view of a grinding device according to an embodiment; [Figure 2] 1 is a schematic diagram showing a partial vertical cross section of a grinding device according to an embodiment of the present invention; [Figure 3]3A is an enlarged view of an adjustment support pillar of the table tilt adjustment mechanism of FIG. 2 and its surroundings, and FIG. 3B is an exploded view of the adjustment support pillar of FIG. 3A. [Figure 4] 4A is an enlarged view of a fixed support pillar and its surroundings of the table tilt adjustment mechanism of FIG. 2, and FIG. 4B is an exploded view of the fixed support pillar of FIG. 4A. [Figure 5] 5A is an enlarged view of the adjustment support pillar and its periphery of the spindle inclination adjustment mechanism of FIG. 2, and FIG. 5B is an enlarged view of the fixed support pillar and its periphery. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, a case where a grinding device according to an embodiment is applied to a grinding device will be described with reference to the accompanying drawings. Fig. 1 is a schematic perspective view of a grinding device according to an embodiment.

[0015] The X-axis, Y-axis, and Z-axis directions of the grinding apparatus 1 are perpendicular to one another. The X-axis and Y-axis directions are approximately horizontal, and the Z-axis direction is an up-down direction (vertical direction). Of the two arrows indicating the X-axis direction, the +X side is the right side and the -X side is the left side. Of the two arrows indicating the Y-axis direction, the +Y side is the front side and the -Y side is the rear side. Of the two arrows indicating the Z-axis direction, the +Z side is the up side and the -Z side is the down side.

[0016] 1, a rectangular opening extending in the X-axis direction is formed on the upper surface of a base 10 of the grinding device 1. This opening is covered by a movable plate 13 that is movable in the X-axis direction together with a chuck table 12, and a bellows-shaped waterproof cover 14.

[0017] The chuck table 12 is provided with a circular porous plate 15. The porous plate 15 is made of a porous material such as ceramics, and has fine pores formed throughout. The upper surface of the porous plate 15 constitutes a holding surface 16. The holding surface 16 holds the wafer W by suction using a suction source (not shown).

[0018] In this embodiment, the wafer W is formed in a substantially circular disk shape. The wafer W may be any plate-shaped workpiece to be ground, and may be a semiconductor substrate such as silicon or gallium arsenide, an inorganic material substrate such as ceramic, glass, or sapphire, or a package substrate for a semiconductor product.

[0019] In the grinding process, the lower surface W2 of the wafer W serves as a held surface that is sucked and held by the holding surface 16 of the chuck table 12, and the upper surface W1 of the wafer W serves as a ground surface that is ground. A protective tape T is attached to the lower surface W2 of the wafer W.

[0020] The chuck table 12 is rotated about a central axis C1 (see FIG. 2) parallel to the Z-axis direction by a table rotation mechanism 41 (described later) provided below the moving plate 13. A thickness measuring device 17 for measuring the thickness of the wafer W held on the chuck table 12 is installed on the base 10 at a position through which the chuck table 12 passes.

[0021] The thickness measuring device 17 includes a first height gauge that measures the height position of the upper surface W1 of the wafer W held on the holding surface 16 of the chuck table 12, and a second height gauge that measures the height position of the upper surface of the chuck table 12. The thickness measuring device 17 measures the thickness of the wafer W based on the difference between the measurement value of the first height gauge and the measurement value of the second height gauge.

[0022] The grinding device 1 further includes a lifting unit 20 and a grinding unit (processing unit) 30. The lifting unit 20 is provided on a column 19 erected at the rear of the base 10, and moves the grinding unit 30 up and down in the Z-axis direction.

[0023] The lifting unit 20 comprises a pair of guide rails 21 arranged on the front side of the column 19 and extending in the Z-axis direction, a lifting table 22 installed so as to be movable in the Z-axis direction relative to the pair of guide rails 21, and a ball screw 23 extending in the Z-axis direction and screwed into a screw-threaded portion (not shown) of the lifting table 22.

[0024] A motor 24 is connected to one end of the ball screw 23. In the lifting unit 20, the ball screw 23 is rotated by the driving force of the motor 24, causing the lifting table 22 and the grinding unit 30 to move up and down in the Z-axis direction. The height position (position in the Z-axis direction) of the grinding unit 30 that moves up and down is measured by a linear scale 25.

[0025] The grinding unit 30 includes a holder (second component) 31 that is attached to the front of the lift table 22 and serves as a base, and a spindle unit (first component) 32 that is supported by the holder 31. The holder 31 is attached to the front of the lift table 22. The spindle unit 32 includes a spindle housing 34 that has a flange portion 33 supported by the holder 31 at its lower portion, and a spindle 35 that rotates about a central axis C2 in the Z-axis direction by the driving force of a spindle motor (not shown). The grinding unit 30 further includes a spindle tilt adjustment mechanism 36 that adjusts the tilt of the spindle 35; the configuration of the spindle tilt adjustment mechanism 36 will be described later.

[0026] A mount 37 is connected to the tip (lower end) of the spindle 35, and a grinding wheel 38 is attached to the mount 37. A plurality of grinding wheels 39, which serve as processing tools, are provided in an annular shape on the underside of the grinding wheel 38. Thus, the annular grinding wheel 39 is attached to the tip of the spindle 35. The grinding unit 30 rotates the attached annular grinding wheel 39 by the spindle 35, and grinds the upper surface W1 of the wafer W held by suction on the holding surface 16 of the chuck table 12.

[0027] Fig. 2 is a schematic diagram showing a partial vertical cross section of a grinding apparatus according to an embodiment. As shown in Fig. 2, the grinding apparatus 1 has a holding unit 40 that is mounted on a base 10 and holds a wafer W. The holding unit 40 includes the chuck table 12 described above, a table rotation mechanism 41 that rotates the chuck table 12 about the Z axis, and a table tilt adjustment mechanism 42 that adjusts the tilt of the chuck table 12 with respect to the Z axis direction. The holding unit 40 also includes a table movement mechanism 50 that moves the chuck table 12 in the Y axis direction. Each of the mechanisms 41, 42, and 50 is disposed below a waterproof cover 14 (see Fig. 1, not shown in Fig. 2).

[0028] The table rotation mechanism 41 transmits a rotational force to a chuck spindle 43 provided below the chuck table 12 by a motor and pulley structure (not shown). Thus, the table rotation mechanism 41 rotates the chuck table 12 around a central axis C1 parallel to the Z axis by the rotation of the chuck spindle 43.

[0029] The table tilt adjustment mechanism 42 includes a table base (first component) 45 on which the chuck table 12 is mounted and rotated. The chuck table 12 is fixed to the table base 45 with screws. The table tilt adjustment mechanism 42 also includes an adjustment support column (support column) 60 for position adjustment and a fixed support column 61, which are connected to the table base 45. The specific configurations of the adjustment support column 60 and the fixed support column 61 will be described later.

[0030] The table base 45 includes a cylindrical portion 46 into which the chuck spindle 43 is inserted, and a disk-shaped flange portion 47 formed by expanding the diameter of the lower portion of the cylindrical portion 46. A bearing disposed inside the cylindrical portion 46 contacts the outer peripheral surface of the chuck spindle 43, and the chuck spindle 43 is rotatably supported by the cylindrical portion 46 via the bearing. The table tilt adjustment mechanism 42 adjusts the tilt of the flange portion 47 by driving the adjustment support column 60, thereby fulfilling the function of adjusting the tilt of the chuck spindle 43 and the chuck table 12.

[0031] The table movement mechanism 50 includes a guide rail 51 extending in the X-axis direction and a ball screw 52, ​​and a base (second component) 53 is supported so as to be movable along the guide rail 51. The ball screw 52 is threadedly engaged with a threaded portion 54 of the base 53, and when the ball screw 52 is rotated by operation of a motor 55, the base 53 and the chuck table 12 move in the Y-axis direction. The base 53 supports the table tilt adjustment mechanism 42 including the table base 45 and the chuck table 12 from below.

[0032] The operation of each part of the grinding device 1 is controlled by a control unit 58 (see FIG. 1). The control unit 58 is configured to include a processor that executes various processes, as well as a memory that stores various parameters, programs, etc. The memory stores, as part of the control program, programs for controlling the operation of the lifting unit 20, the grinding unit 30, the holding unit 40, etc.

[0033] When grinding the wafer W held on the chuck table 12, the chuck table 12 and the wafer W are moved and positioned below the grinding unit 30 via the table movement mechanism 50. In this state, the spindle 35 in the grinding unit 30 is rotated while being lowered at a predetermined speed for processing, and the upper surface W1 of the wafer W is ground by the grinding wheel 39. During this grinding, the chuck table 12 is rotated, for example, in the same direction as the spindle 35, causing the wafer W to rotate on its own axis. The outer diameter of the outer periphery ground by the grinding wheel 39 is larger than the radius of the holding surface 16, and by passing through the center of the wafer W, the entire upper surface W1 of the wafer W is uniformly ground by the grinding wheel 39.

[0034] Next, the table tilt adjustment mechanism 42 including the adjustment support column 60 and the fixed support column 61 and the surrounding structure will be described.

[0035] The adjustment support columns 60 and the fixed support columns 61 are erected on the base 53 and disposed between the table base 45 and the base 53. As a result, the table base 45 and the base 53 are connected by the adjustment support columns 60 and the fixed support columns 61 with a gap between them. In this embodiment, two adjustment support columns 60 (one not shown) and one fixed support column 61 are provided at equal intervals of 120 degrees along the circumferential direction centered on the central axis C1 of the chuck table 12. The number of adjustment support columns 60 and fixed support columns 61 is not limited to the above-mentioned number, and may be increased or decreased as long as tilt adjustment can be performed.

[0036] Fig. 3A is an enlarged view of the adjustment support pillar and its surroundings of the table tilt adjustment mechanism of Fig. 2, and Fig. 3B is an exploded view of the adjustment support pillar of Fig. 3A. As shown in Fig. 3A and Fig. 3B, adjustment support pillar 60 includes a generally cylindrical main body 63 extending in the vertical direction, a nut member 64 attached to the top of main body 63, and a spring member 65 serving as an elastic member, and houses a load sensor 67 inside.

[0037] The main body 63 includes a first male threaded portion (male threaded portion) 71 formed on the outer periphery of an intermediate portion in the axial direction (vertical direction, Z-axis direction), a second male threaded portion 72 formed on the outer periphery on the upper end side, and a ring-shaped flange 75 below the second male threaded portion 72. The first male threaded portion 71 is capable of threadably engaging with a female threaded portion 471 provided on the flange portion 47 of the table base 45. The second male threaded portion 72 is capable of threadably engaging with the nut member 64, and is formed at a position spaced a predetermined distance above the first male threaded portion 71.

[0038] The main body 63 has a stepped surface on its outer periphery that is formed by reducing its diameter at a position spaced a predetermined distance below the first male threaded portion 71, and this stepped surface serves as the mounting surface 73. The main body 63 also has an operating portion 74 whose lower end is formed in the shape of a hexagonal pillar. The operating portion 74 is a part that is operated with a tool such as a wrench, and the first male threaded portion 71 can be rotated via the operating portion 74.

[0039] The main body 63 is inserted into a hole 531 provided in the base 53 below the mounting surface 73. A bearing 532 serving as a rotation support is provided around the opening at the top of the hole 531. In other words, the bearing 532 is disposed between the main body 63 (adjustment support column 60) and the base 53.

[0040] The bearing 532 is in contact with the outer peripheral surface of the main body 63 below the mounting surface 73, and the main body 63 including the mounting surface 73 is rotatably supported on the base 53 via the bearing 532. Furthermore, the upper surface of the bearing 532 is in contact with the mounting surface 73, thereby maintaining the axial (up-down) position of the main body 63 while allowing rotation of the main body 63 around its axis.

[0041] The base 53 is provided with an opening 533 for exposing the operating portion 74 of the adjustment support column 60. An operator can insert a tool into the opening 533 and operate the operating portion 74 to rotate the main body portion 63 including the first male thread portion 71. Alternatively, a motor may be disposed within the opening 533, the rotation shaft of the motor may be connected to the operation unit 74, and the adjustment support column 60 may be rotated by the motor.

[0042] The nut member 64 includes an upper wall 76 that extends horizontally and has a female threaded hole and a recess 78 that comes into contact with the flange 75, and a cylindrical peripheral wall 77 that extends downward from the outer periphery of the upper wall 76, and is provided so that the spring member 65 can be housed inside the peripheral wall 77. With the main body 63 attached to the table base 45, the recess 78 comes into contact with the flange 75 so that the lower end of the peripheral wall 77 is separated from the upper surface of the flange 47, and the nut member 64 is fixed and the vertical position is set.

[0043] The spring member 65 is formed of a compression coil spring, and the upper region of the main body portion 63 is inserted into it. The spring member 65 is compressed in the vertical direction by the upper surface of the flange portion 47 and the lower surface of the upper wall 76 of the nut member 64. As a result, an upward force is applied to the main body portion 63 via the nut member 64 due to the elastic force of the spring member 65. This force causes an upward force to act from the first male thread portion 71 on the female thread portion 471 provided on the flange portion 47, and a reaction to this force causes a downward force to act from the female thread portion 471 on the first male thread portion 71. Therefore, the spring member 65 applies forces in opposite directions in the axial direction (vertical direction) to the female thread portion 471 and the first male thread portion 71, thereby enabling rotation of the first male thread portion 71 while eliminating backlash in the female thread portion 471 and the first male thread portion 71.

[0044] The load sensor 67 is accommodated in a load sensor accommodating portion 80 of the main body 63, and is arranged in a columnar shape inside the main body 63 (adjustment support column 60). The load sensor accommodating portion 80 is a bottomed hole that opens at the upper end side of the main body 63 and is formed at the axial center of the main body 63, and has a female thread portion 81 formed on its inner circumferential surface. The female thread portion 81 is formed on the inside corresponding to the lower region of the first male thread portion 71, and the bottom surface (lower surface) of the load sensor accommodating portion 80 is formed slightly above the mounting surface 73.

[0045] The load sensor 67 has a male thread portion 671 that screws into the female thread portion 81, and the load sensor 67 is housed with a compressive load applied in the vertical direction by screwing in the male thread portion 671. This allows the load sensor 67 to measure the load applied to the adjustment support column 60 (main body portion 63) in the vertical direction, which is the axial direction of the main body portion 63, i.e., the load applied to the chuck table 12.

[0046] Fig. 4A is an enlarged view of the fixed support pillar and its surroundings of the table tilt adjustment mechanism of Fig. 2, and Fig. 4B is an exploded view of the fixed support pillar of Fig. 4A. As shown in Fig. 4A and Fig. 4B, a load sensor 67 having the same configuration as the load sensor 67 described above is also housed inside the fixed support pillar 61. The fixed support pillar 61 includes a generally cylindrical main body 83 that is provided on the upper surface of the base 53 and extends in the vertical direction, and a nut member 84 that is attached to the top of the main body 83.

[0047] In the fixed support column 61, the main body 83 is provided with a load sensor housing portion 86 that houses the load sensor 67. The load sensor housing portion 86 is a bottomed hole that is opened at the upper end side of the main body 83 and formed at the axial center of the main body 83, and has a female thread portion 87 on its inner circumferential surface. By screwing the male thread portion 671 of the load sensor 67 into the female thread portion 87, the load sensor 67 is housed with a compressive load applied in the vertical direction. Therefore, the load sensor 67 of the fixed support column 61 can also measure the load acting on the chuck table 12, just like the load sensor 67 of the adjustment support column 60.

[0048] The main body 83 of the fixed support column 61 is equipped with a male thread portion 88 formed on the outer periphery of the upper end side and threadedly engaged with a nut member 84, a first support flange 91 formed on the outer periphery of an axially (vertically) intermediate portion, and a second support flange 92 formed on the lower end side. The portion of the main body 83 above the first support flange 91 can be inserted into a hole 472 formed in the flange portion 47 of the table base 45, and the table base 45 is placed on the first support flange 91. In this state, the nut member 84 is threadedly engaged with the male thread portion 88 and tightened, thereby fixing the fixed support column 61 to the table base 45.

[0049] The second support flange 92 of the main body 83 is fixed with screws to the upper surface of the base 53. As a result, the fixed support column 61 stands on the base 53 and supports the table base 45 from below.

[0050] Next, a method for adjusting the tilt of the chuck table 12 using the table tilt adjustment mechanism 42 will be described. To adjust the tilt of the chuck table 12, an operator rotates the main body 63 including the first male thread portion 71 of one or two adjustment support columns 60. When the main body 63 is rotated, the mounting surface 73 is supported by the bearing 532, thereby maintaining the vertical position of the main body 63 including the first male thread portion 71, and the table base 45 including the female thread portion 471 moves in the vertical direction. Therefore, the table base 45 and the chuck table 12 move relative to the adjustment support columns 60.

[0051] In this way, by rotating one or two adjustment support columns 60, the operator can change the distance between the base 53 where the adjustment support columns 60 are installed and the chuck table 12. This allows the operator to adjust the inclination of the chuck table 12 relative to the grinding unit 30, and adjust the parallelism between the holding surface 16 of the chuck table 12 and the underside of the grinding wheel 39 of the grinding unit 30.

[0052] Here, the spindle tilt adjustment mechanism 36 that adjusts the tilt of the spindle 35 of the grinding unit 30 also has an adjustment support pillar 60 and a fixed support pillar 61, similar to the table tilt adjustment mechanism 42. In this embodiment, two adjustment support pillars 60 (one not shown) and one fixed support pillar 61 are provided at equal intervals of 120 degrees along the circumferential direction centered on the central axis C2 of the spindle 35.

[0053] Fig. 5A is an enlarged view of the adjustment support pillar and its surroundings of the spindle inclination adjustment mechanism of Fig. 2, and Fig. 5B is an enlarged view of the fixed support pillar and its surroundings. In the spindle inclination adjustment mechanism 36, the adjustment support pillar 60 and the fixed support pillar 61 are erected on the holder 31 and disposed between the flange portion 33 of the spindle housing 34 and the holder 31.

[0054] As shown in FIG. 5A, in the spindle inclination adjustment mechanism , the first male thread portion 71 of the adjustment support column 60 can be threadably engaged with the female thread portion 331 provided on the flange portion 33 of the spindle housing .

[0055] In the spindle inclination adjustment mechanism 36, the main body 63 of the adjustment support column 60 is inserted into a hole 311 provided in the holder 31 serving as the base below the mounting surface 73. A bearing 312 serving as a rotation support is provided around the opening at the top of the hole 311. In other words, the bearing 312 is disposed between the main body 63 (adjustment support column 60) and the base 53.

[0056] The bearing 312 is in contact with the outer peripheral surface of the main body 63 below the mounting surface 73, and the main body 63 including the mounting surface 73 is rotatably supported by the holder 31 via the bearing 312. Furthermore, the upper surface of the bearing 312 is in contact with the mounting surface 73, thereby maintaining the axial (up-down) position of the main body 63 while allowing the main body 63 to rotate about its axis.

[0057] The spring member 65 is compressed in the vertical direction by the upper surface of the flange portion 33 and the lower surface of the upper wall 76 of the nut member 64. As a result, an upward force acts on the main body portion 63 via the nut member 64 due to the elastic force of the spring member 65. Due to this force, an upward force acts from the first male thread portion 71 on the female thread portion 331 provided on the flange portion 33, and as a reaction to this force, a downward force acts from the female thread portion 331 on the first male thread portion 71.

[0058] 5B , in the spindle inclination adjustment mechanism 36, the fixed support column 61 is provided on the upper surface of the holder 31, and the second support flange 92 is screwed and fixed to the holder 31. The portion of the main body 83 of the fixed support column 61 above the first support flange 91 can be inserted into a hole 332 provided in the flange portion 33 of the spindle housing 34, and the spindle housing 34 is placed on the first support flange 91. In this state, the fixed support column 61 is fixed to the spindle housing 34 by screwing and tightening a nut member 84 onto the male thread portion 88.

[0059] In the spindle inclination adjustment mechanism 36, the load sensor 67 can measure the load applied to each of the support columns 60, 61 in the axial direction (vertical direction), that is, the load applied to the spindle unit 32.

[0060] To adjust the tilt of the spindle unit 32 using the spindle tilt adjustment mechanism 36, similar to adjusting the tilt of the chuck table 12, an operator rotates the main body 63 including the first male thread portion 71 of one or two adjustment support columns 60. When the main body 63 is rotated, the mounting surface 73 is supported by the bearing 312, thereby maintaining the vertical position of the main body 63 including the first male thread portion 71, and the spindle housing 34 including the female thread portion 331 moves in the vertical direction. Therefore, the spindle unit 32 including the spindle housing 34 moves relative to the adjustment support columns 60.

[0061] In this way, by rotating one or two adjustment support columns 60, the operator can change the distance between the holder 31 where the adjustment support columns 60 are installed and the spindle unit 32. This allows the operator to change the inclination of the spindle unit 32 and adjust the inclination of the spindle unit 32 relative to the chuck table 12.

[0062] According to the above embodiment, the mounting surface 73 of the adjustment support column 60 is supported by the base 53 or the holder 31 via the bearings 532, 312, and it becomes possible to rotate the adjustment support column 60 while maintaining the axial position of the adjustment support column 60. As a result, compared to a conventional configuration in which the adjustment support column 60 is rotatably supported by the base 53 or the holder 31 using a screw structure, the amount of rotation of the adjustment support column 60 relative to the amount of tilt adjustment (amount of movement in the Z-axis direction) can be reduced, and the work time required for tilt adjustment can be shortened.

[0063] Moreover, since the load sensor 67 is disposed inside each of the support columns 60, 61, it is not necessary to sandwich the load sensor 67 between the base 53 and the table base 45 or between the holder 31 and the spindle housing 34. This makes it possible to prevent the peripheral structure of each of the support columns 60, 61, and in turn the entire grinding apparatus 1, from becoming larger.

[0064] The present invention is not limited to the above-described embodiments, and various modifications can be made. In the above-described embodiments, the size and shape shown in the accompanying drawings are not limited to these, and can be modified as appropriate within the scope of the effects of the present invention. In addition, the present invention can be modified as appropriate within the scope of the object of the present invention.

[0065] In the above embodiments, a grinding machine has been described as an example of the processing apparatus, but the present invention may also be applied to other processing apparatuses that lower wafers, such as a polishing machine or a cutting machine. When the processing apparatus is a polishing machine, the processing tool of the processing unit is a polishing pad, and when the processing apparatus is a cutting machine, the processing tool of the processing unit is a cutting tool or a cutting blade.

[0066] Furthermore, the adjustment support column 60 may be provided at a location that supports the space between two different components in various devices and structures other than processing devices. In devices, etc., that include the adjustment support column 60, a first component, which is one of the two different components, is provided with a female thread that screws into the first male thread 71, and a second component, which is the other of the two different components, is provided with a rotation support member such as a bearing that supports the mounting surface 73. Even in such a configuration, the load sensor 67 disposed on the adjustment support column 60 can measure the load applied between the two components, preventing the device having the two components from becoming larger, and shortening the time required to adjust the distance between the two components. [Industrial Applicability]

[0067] As described above, when applied to, for example, a processing device, the present invention has the effect of preventing the holding unit that holds the wafer and the processing unit from becoming larger, and shortening the work time required to adjust the distance between parts supported by the support pillars. [Explanation of symbols]

[0068] 1: Grinding equipment (processing equipment) 12: Chuck table 30: Grinding unit (processing unit) 31: Holder (base, second part) 32: Spindle unit (first part) 35: Spindle 39: Grinding wheel (processing tool) 40: Holding unit 45: Table base (first part) 53: Base (second part) 60: Adjustment support pillar (support pillar) 61: Fixed support column (support column) 65: Spring member (elastic member) 67: Load sensor 71: First male threaded part (male threaded part) 73: Mounting surface 312: Bearing (rotation support part) 331: Female thread 471: Female thread 532: Bearing (rotation support part) W: wafer

Claims

1. A processing apparatus including a holding unit that holds a wafer, and a processing unit that is mounted with and rotates a processing tool that processes the wafer held by the holding unit, the holding unit includes a chuck table for holding a wafer, a table base for mounting and rotating the chuck table, a base supporting the table base, a support column erected on the base and disposed between the table base and the base, a rotation support portion disposed between the support column and the base, and a load sensor disposed in the support column in the form of a column; The support column is provided with a male threaded portion that screws into a female threaded portion provided on the table base, and a mounting surface that is supported on the base via the rotation support portion and maintains the axial position of the support column by rotating the male threaded portion, in a processing device.

2. A processing apparatus including a holding unit that holds a wafer, and a processing unit that is mounted with and rotates a processing tool that processes the wafer held by the holding unit, The processing unit includes a spindle unit having the processing tool attached to a tip thereof, a base supporting the spindle unit, a support column erected on the base and disposed between the spindle unit and the base, a rotation support portion disposed between the support column and the base, and a load sensor disposed in a columnar shape within the support column; The support column is provided with a male threaded portion that screws into a female threaded portion provided on the spindle unit, and a mounting surface that is supported on the base via the rotation support portion and maintains the axial position of the support column by rotating the male threaded portion, in a processing device.

3. 3. The processing device according to claim 1, further comprising an elastic member for applying forces in opposite directions in the axial direction of the female thread portion and the male thread portion.

4. a male thread portion that screws into a female thread portion provided on the first component; a mounting surface that is supported by the second component via a rotation support portion provided on the second component and maintains the axial position by rotating the male thread portion; a cylindrical load sensor disposed inside the support column between the male threaded portion and the mounting surface;

Images