Processing device and semiconductor device manufacturing method

Abstract

To improve processing efficiency when processing a workpiece.SOLUTION: A processing device includes a holding portion which holds a workpiece in a holding area, a rotating portion which has a motor which rotates the holding portion around a predetermined rotation axis, a processing unit which can be arranged facing the holding area and processes the workpiece, and a moving portion which moves the holding portion and the processing unit relatively along the rotation axis, and the holding portion has a side portion which is arranged around the rotation axis and away from the rotation axis, and the holding area is provided on the side portion.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus including a processing unit that processes a workpiece, and a method for manufacturing a semiconductor device that processes the workpiece and manufactures a semiconductor device from the workpiece. [Background technology]

[0002] Device chips are mounted on various electronic devices such as mobile phones and personal computers. Device chips are generally manufactured by processing semiconductor wafers. A plurality of planned dividing lines (i.e., streets) are set in a grid pattern on one side of the semiconductor wafer.

[0003] Devices such as ICs (Integrated Circuits) are formed in each rectangular area defined by a plurality of division lines, and the semiconductor wafer is divided into a plurality of device chips by cutting the semiconductor wafer along each of the division lines.

[0004] For example, a laser processing device is used to divide a semiconductor wafer (see, for example, Patent Document 1). The laser processing device includes a laser oscillator, a condenser lens, etc. By irradiating each planned division line with a laser beam having a wavelength that is absorbed by the semiconductor wafer, the semiconductor wafer is divided into multiple device chips by ablation processing.

[0005] A cutting device may also be used to divide a semiconductor wafer. The cutting device is equipped with a cutting unit including a spindle, and a cutting blade with an annular cutting edge is attached to the tip of the spindle. The cutting blade cuts the semiconductor wafer along each planned division line, thereby dividing the semiconductor wafer into multiple device chips.

[0006] The objects processed by processing devices such as laser processing devices and cutting devices are not limited to semiconductor wafers. Plate- or rod-shaped molded bodies in which multiple device chips are sealed with a sealant containing epoxy resin or the like may also be processed.

[0007] Such a molded body is formed by electrically connecting a plurality of device chips to a semiconductor package substrate, encapsulating the plurality of device chips with an encapsulant, and compression molding the molded body, which is then divided into device packages by cutting the molded body along predetermined division lines with a laser processing device or a cutting device.

[0008] Typically, when dividing a workpiece such as a semiconductor wafer or a molded body using a laser processing or cutting device, the workpiece is first sucked and held on a holding table using negative pressure.Then, the holding table, which holds the workpiece by suction, is moved within the XY plane relative to the focal point of the laser beam or the lower end of a cutting blade that rotates at high speed around a spindle.

[0009] Specifically, with the focal point or the lower end of the cutting blade positioned on an extension of the planned division line within the XY plane, the holding table is moved along the X-axis direction (that is, processing feed is performed).

[0010] This allows the workpiece to be machined along the planned dividing line that is arranged approximately parallel to the X-axis direction. Next, indexing is performed by moving the focal point or the lower end of the cutting blade relative to the holding table along the Y-axis direction.

[0011] By indexing, the focal point or the lower end of the cutting blade is positioned on an extension of another planned dividing line adjacent to the machined planned dividing line in the Y-axis direction, and the holding table is then moved again along the X-axis direction to machine the workpiece along the other planned dividing line.

[0012] In this way, when processing a workpiece by moving the focal point or cutting blade and the holding table relative to each other in the XY plane, it is necessary to accelerate the stationary holding table to a predetermined speed during the processing feed, and then decelerate the holding table, which is moving at the predetermined speed, to make it stationary.

[0013] In other words, even though the workpiece cannot be processed during the time of acceleration and deceleration when performing processing feed, the time of acceleration and deceleration when processing the workpiece inevitably occurs. For example, when the workpiece is accelerated from a stationary state (i.e., 0 mm / s) to a predetermined speed (e.g., 1000 mm / s) by 1 G (i.e., 9.8 m / s 2 ) takes about 0.1 seconds to accelerate.

[0014] Also, for example, when a predetermined speed (for example, 1000 mm / s) is changed to a stationary state (for example, 0 mm / s) by 1 G (for example, 9.8 m / s 2 ), it takes about 0.1 seconds to process one planned dividing line. In other words, it takes an extra time of about 0.2 seconds to process one planned dividing line.

[0015] Furthermore, if multiple processing feeds are performed on one planned dividing line, even more time is required. For example, if 20 processing feeds are performed on one planned dividing line (i.e., processing is performed in 20 passes), an extra time of approximately 4 seconds (= approximately 0.2 seconds × 20) is required.

[0016] In addition, since there are usually multiple dividing lines on one workpiece, it takes even more time. For example, if there are 48 dividing lines on one workpiece, it takes an extra time of about 192 seconds (= about 4 seconds x 48).

[0017] This extra time is unavoidable in conventional processing devices that accelerate and decelerate the holding table. Nevertheless, there is a demand for further improvements in processing efficiency in processing devices such as laser processing devices and cutting devices. [Prior art documents] [Patent documents]

[0018] [Patent Document 1] Japanese Patent Application Publication No. 2023-102993 Summary of the Invention [Problem to be solved by the invention]

[0019] The present invention has been made in view of the above problems, and has as its object to improve the processing efficiency when processing a workpiece. [Means for solving the problem]

[0020] According to one aspect of the present invention, there is provided a processing device comprising: a holding section that holds a workpiece in a holding area; a rotating section having a motor that rotates the holding section around a predetermined rotation axis; a processing unit that can be arranged facing the holding area and processes the workpiece; and a moving section that moves the holding section and the processing unit relatively along the rotation axis, wherein the holding section has a side section that is arranged around the rotation axis and away from the rotation axis, and the holding area is provided on the side section.

[0021] Preferably, the holding area of ​​the holding portion is provided on the outer or inner surface of a cylinder, on the outer surface of a pillar, a frustum or a cone, on the outer or inner surface of a frustum having a hollow portion, or on the outer or inner surface of a cone having a hollow portion.

[0022] Preferably, the processing unit is a laser beam irradiation unit having a laser oscillator and a condenser lens.

[0023] Preferably, the processing unit is a cutting unit having a spindle, and a cutting blade is attached to the tip of the spindle.

[0024] Preferably, the system further comprises a detection unit having a light source and a light receiving element for detecting the position of the workpiece held by the holding unit, and a controller having a memory and a processor for controlling the rotating unit, the processing unit, and the moving unit, and the controller uses the detection unit to control the position of the processing unit along the rotation axis.

[0025] Preferably, a negative pressure generated by a suction source is transmitted to the holding area of ​​the holding portion.

[0026] Preferably, the workpiece has a plurality of divisible elements, each having a plurality of electronic components linearly arranged thereon, and a connecting portion connecting the plurality of divisible elements in a direction intersecting the longitudinal direction of each divisible element, and when the workpiece is held by the holding portion, a plurality of planned dividing lines for dividing the plurality of electronic components are arranged discretely along the longitudinal direction of each divisible element and around the rotation axis.

[0027] Preferably, the holding area of ​​the holding portion has a plurality of openings to which the negative pressure generated by the suction source is transmitted, and the plurality of openings are provided at positions corresponding to the plurality of electronic components in each of the separated elements.

[0028] According to another aspect of the present invention, there is provided a method for manufacturing a semiconductor device, in which a workpiece is processed to manufacture a semiconductor device from the workpiece, the method comprising: a holding step of holding the workpiece on a side portion of a holding part having a side portion arranged around a rotation axis and spaced apart from the rotation axis; an alignment step of adjusting the processing position of the workpiece by the processing unit by moving the holding part and the processing unit relatively along the longitudinal direction of the rotation axis; and a processing step of processing the workpiece with the processing unit arranged facing the side portion while rotating the holding part holding the workpiece around the rotation axis. [Effects of the Invention]

[0029] In the processing device according to one aspect of the present invention, the workpiece can be processed by the processing unit while the holder holding the workpiece at its side is rotated around a predetermined rotation axis, thereby eliminating the extra time required for accelerating and decelerating the holding table and improving processing efficiency.

[0030] In a method for manufacturing a semiconductor device according to one aspect of the present invention, a holder holding a workpiece is rotated around a rotation axis while a processing unit disposed opposite a side surface of the holder processes the workpiece. This eliminates the extra time required for accelerating and decelerating the holding table, thereby improving processing efficiency. [Brief explanation of the drawings]

[0031] [Figure 1] FIG. 1(A) is a top view of the laser processing device, and FIG. 1(B) is a partial cross-sectional side view of the laser processing device. [Figure 2] FIG. 2(A) is a side view of the holding portion, and FIG. 2(B) is a cross-sectional view taken along line AA in FIG. 2(A). [Figure 3] FIG. 3(A) is a top view of the workpiece, and FIG. 3(B) is a side view of the workpiece. [Figure 4] 1 is a flow chart of a method for manufacturing a device package. [Figure 5] FIG. 5(A) is a top view showing the holding step, and FIG. 5(B) is a side view showing the holding step. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. 8(A) is a top view of the laser processing apparatus according to the second embodiment, and FIG. 8(B) is a partial cross-sectional side view of the laser processing apparatus according to the second embodiment. [Figure 9] FIG. 9(A) is a top view of a cutting device according to a third embodiment, and FIG. 9(B) is a partial cross-sectional side view of the cutting device according to the third embodiment. [Figure 10] FIG. 10 is a partial cross-sectional side view of a cutting device according to a fourth embodiment. [Figure 11]FIG. 11(A) is a side view of a holding portion according to the fifth embodiment, and FIG. 11(B) is a cross-sectional view taken along line CC of FIG. 11(A). [Figure 12] FIG. 12(A) is a top view of the workpiece in the modified example, and FIG. 12(B) is a side view of the workpiece in the modified example. [Figure 13] Figure 13(A) is a side view of the holding portion in the first modified example, Figure 13(B) is a top view of the holding portion in the first modified example, Figure 13(C) is a side view of the holding portion in the second modified example, and Figure 13(D) is a top view of the holding portion in the second modified example. [Figure 14] Figure 14(A) is a side view of the holding portion in the third modified example, Figure 14(B) is a top view of the holding portion in the third modified example, Figure 14(C) is a side view of the holding portion in the fourth modified example, and Figure 14(D) is a top view of the holding portion in the fourth modified example. [Figure 15] Figure 15(A) is a side view of the holding portion in the fifth modified example, Figure 15(B) is a top view of the holding portion in the fifth modified example, Figure 15(C) is a side view of the holding portion in the sixth modified example, and Figure 15(D) is a top view of the holding portion in the sixth modified example. [Figure 16] FIG. 16(A) is a side view of the holding portion in the seventh modified example, and FIG. 16(B) is a top view of the holding portion in the seventh modified example. [Figure 17] Figure 17(A) is a side view of the holding portion in the eighth modified example, Figure 17(B) is a top view of the holding portion in the eighth modified example, Figure 17(C) is a side view of the holding portion in the ninth modified example, and Figure 17(D) is a top view of the holding portion in the ninth modified example. [Figure 18] Figure 18(A) is a side view of the holding portion in the tenth modified example, Figure 18(B) is a top view of the holding portion in the tenth modified example, Figure 18(C) is a side view of the holding portion in the eleventh modified example, and Figure 18(D) is a top view of the holding portion in the eleventh modified example. DETAILED DESCRIPTION OF THE INVENTION

[0032] (First embodiment) An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1(A) is a top view of a laser processing device (i.e., processing device) 2, and Fig. 1(B) is a partially cross-sectional side view of the laser processing device 2. Fig. 1(B) shows some of the components of the laser processing device 2 in functional blocks.

[0033] 1A and 1B, the X-axis, Y-axis, and Z-axis are perpendicular to one another. For example, the XY plane defined by the X-axis and Y-axis is parallel to the horizontal plane, and the Z-axis is parallel to the vertical direction. The direction parallel to the Z-axis corresponds to the height direction or up-down direction.

[0034] The laser processing device 2 includes a holding unit 4 having a cylindrical shape with a bottom (i.e., a cylinder). The holding unit 4 is made of a metal such as stainless steel or an aluminum alloy. The holding unit 4 includes a cylindrical portion 4a1 and a disk-shaped bottom portion 4a2.

[0035] The bottom 4a2 of the holding unit 4 is connected to the rotating unit 8 via the rotary joint 6. The rotating unit 8 has a motor 8a, which includes a rotor 8a1 and a stator 8a2. The upper end of the rotor 8a1 is fixed to the bottom 4a2 of the holding unit 4.

[0036] By operating the motor 8a, the holder 4 rotates at high speed around a predetermined rotation axis 4d disposed substantially parallel to the Z-axis direction. The rotation axis 4d is disposed at the center of the holder 4 in the radial direction of the holder 4. In other words, the rotation axis 4d is disposed in a cylindrical hollow portion 4e.

[0037] As shown in Figures 1(A) and 1(B), the outer surface of the cylindrical portion 4a1 is positioned around the rotation axis 4d at a predetermined distance (more specifically, a length corresponding to the radius of the cylindrical portion 4a1) from the rotation axis 4d.

[0038] A rotary encoder (not shown) is provided on the rotating unit 8. A controller 50 (described later) can grasp the rotation angle of the holding unit 4 by detecting the rotation angle of the rotor 8a1 using the rotary encoder.

[0039] A flow path 8b is formed inside the rotor 8a1 along the Z-axis direction. Negative pressure generated by a vacuum device (i.e., suction source) 10 such as a vacuum pump or an ejector is transmitted to the flow path 8b via a rotary joint 6.

[0040] The flow paths 8b are connected to first flow paths provided in the bottom portion 4a2. The first flow paths are arranged radially in the XY plane. Fig. 1(B) shows the first flow paths arranged along the radial direction of the bottom portion 4a2.

[0041] The first flow path in the bottom portion 4a2 is connected to one or more second flow paths provided in the cylindrical portion 4a1. The second flow paths shown in FIG. 1(B) are arranged substantially parallel to the Z-axis direction. The second flow paths are connected to a plurality of openings 4b formed on the outer surface (i.e., the side surface) of the cylindrical portion 4a1.

[0042] The negative pressure generated by the vacuum device 10 is transmitted to each opening 4b located on the outer surface of the cylindrical portion 4a1 via the rotor 8a1, the bottom portion 4a2, etc. A solenoid valve 10a is provided between the vacuum device 10 and the rotary joint 6. The solenoid valve 10a includes, for example, a first valve for supplying negative pressure and a second valve for supplying positive pressure.

[0043] When the first valve is opened, negative pressure is transmitted from the vacuum device 10 to each opening 4b, and when the first valve is closed, each opening 4b is isolated from the vacuum device 10. When the second valve is opened, the first flow path, the second flow path, and each opening 4b are open to the atmosphere, and atmospheric pressure is supplied to each opening 4b.

[0044] Fig. 2(A) is a side view of the holding portion 4, and Fig. 2(B) is a cross-sectional view taken along line AA of Fig. 2(A). A plurality of openings 4b are arranged at approximately equal intervals along the Z-axis direction on the holding surface 4c, and the plurality of openings 4b are also arranged at approximately equal intervals along the circumferential direction of the holding portion 4.

[0045] In this way, the plurality of openings 4b are regularly arranged on the holding surface 4c. As will be described in detail later, the plurality of openings 4b are provided at positions that correspond one-to-one to the plurality of electronic components 17 formed by dividing the workpiece 11 along each of the planned division lines.

[0046] The holding surface 4c suction-holds the workpiece 11, which will be described later, with negative pressure. That is, in this embodiment, the outer surface of the cylindrical portion 4a1 functions as the holding surface (i.e., holding area) 4c that suction-holds the workpiece 11. The shape, size, arrangement, etc. of the multiple openings 4b are determined appropriately depending on the shape, size, arrangement, etc. of the workpiece 11.

[0047] Next, the workpiece 11 will be described with reference to Figures 3(A) and 3(B). Figure 3(A) is a top view of the workpiece 11, and Figure 3(B) is a side view of the workpiece 11 when viewed in the direction of arrow B. The workpiece 11 of this embodiment has a plurality of divided elements 13 that are each linear when viewed from above.

[0048] The dividable element 13 includes a lead frame, a semiconductor package substrate, etc. As shown in Figures 3(A) and 3(B), terminals 15 protrude from the side surfaces of the dividable element 13 in this embodiment. Note that the terminals 15 do not necessarily have to protrude from the side surfaces of the dividable element 13; the terminals 15 may simply be exposed on the side surfaces of the dividable element 13.

[0049] In each of the dividable elements 13, a plurality of electronic components 17 such as ICs are linearly arranged along the longitudinal direction 13a of the dividable element 13. Note that Fig. 3(A) representatively shows only two electronic components 17 located at different positions.

[0050] Each electronic component 17 is sealed with a molding resin such as epoxy resin and is not exposed in the divided element 13. Each electronic component 17 is electrically connected to a terminal 15 provided correspondingly.

[0051] A plurality of division lines 19 are set at approximately equal intervals in the longitudinal direction 13a on the upper surface of the dividable element 13. Two adjacent division lines 19 in the longitudinal direction 13a are positioned so as to sandwich one electronic component 17 therebetween in the longitudinal direction 13a.

[0052] The plurality of planned division lines 19 may or may not actually be drawn on the upper surface of the dividable element 13. In this embodiment, the plurality of planned division lines 19 are not drawn on the upper surface of the dividable element 13.

[0053] If multiple planned division lines 19 are not drawn on the upper surface of the dividable element 13, multiple planned division lines 19 are virtually set in the laser processing device 2 using alignment marks (not shown) or the like provided on the dividable element 13.

[0054] The multiple dividable elements 13 are arranged at approximately equal intervals in a short-side direction 13b of the dividable elements 13 that is perpendicular to (i.e., intersects with) the longitudinal direction 13a. The multiple dividable elements 13 arranged at approximately equal intervals along the short-side direction 13b are connected by ribbon-shaped connecting parts 21 made of resin. The connecting parts 21 are very thin and flexible, so they can be easily bent by hand.

[0055] In this embodiment, the two connecting portions 21 are arranged in parallel along the longitudinal direction 13a of the dividable elements 13, and the dividable elements 13 and the two connecting portions 21 are fixed to each other with mold resin when each electronic component 17 is resin-encapsulated. Note that the fixation of the dividable elements 13 and the connecting portions 21 is not limited to fixation with mold resin.

[0056] 3(A), each of the planned division lines 19 in one dividable element 13 and each of the planned division lines 19 in another dividable element 13 adjacent to the one dividable element 13 in the short-side direction 13b are located at approximately the same position in the long-side direction 13a. However, the arrangement of the dividable elements 13 is not limited to this example.

[0057] In another example, with respect to the left end of Figure 3(A), the multiple planned division lines 19 in odd-numbered dividable elements 13 are located at approximately the same position in the longitudinal direction 13a, and the multiple planned division lines 19 in even-numbered dividable elements 13 are also located at approximately the same position in the longitudinal direction 13a.

[0058] However, in this other example, the dividing lines 19 in the odd-numbered dividable elements 13 and the dividing lines 19 in the even-numbered dividable elements 13 are arranged in a zigzag pattern in the longitudinal direction 13a.

[0059] In any case, when the plurality of dividable elements 13 are divided along each of the planned dividing lines 19, a plurality of device packages (i.e., semiconductor devices) 23 are separated from each of the dividable elements 13. That is, each of the planned dividing lines 19 functions as a marking line for dividing the workpiece 11 into the plurality of device packages 23.

[0060] The device package 23 of this embodiment is, for example, an SOP (Small Outline Package), but the SOP is an example of a semiconductor device, and the device package 23 is not limited to only an SOP.

[0061] Each opening 4b of the holding surface 4c described with reference to Figure 2(A) is provided at a position corresponding to the device package 23 (i.e., electronic component 17), and each individual device package 23 is suction-held by the corresponding opening 4b.

[0062] Note that multiple (e.g., two) openings 4b may be provided per device package 23 (i.e., electronic component 17). When the singulated device package 23 is suction-held by one opening 4b, the device package 23 may rotate around the opening 4b due to, for example, its own weight, but providing multiple openings 4b can prevent this rotation.

[0063] Returning now to Figures 1(A) and (B), the rotating unit 8 is supported by an X-axis direction moving plate 12. The X-axis direction moving plate 12 is supported by a pair of guide rails 14 so as to be slidable along the X-axis direction. Note that Figure 1(B) shows one guide rail 14 located on the front side of the page.

[0064] A screw shaft 16a is provided along the X-axis direction between the pair of guide rails 14, and the screw shaft 16a is rotatably connected to a nut portion (not shown) provided on the bottom surface of the X-axis direction moving plate 12 via multiple balls (not shown).

[0065] One end of the screw shaft 16a is provided with a drive source 16b such as a servo motor, a stepping motor, etc. When the screw shaft 16a is rotated by the drive source 16b, the X-axis direction moving plate 12 moves along the X-axis direction.

[0066] The X-axis direction moving plate 12, the pair of guide rails 14, the nut portion, the screw shaft 16a, the drive source 16b, etc. constitute an X-axis direction moving unit 18 for moving the holding unit 4 along the X-axis direction. The X-axis direction moving unit 18 adjusts the position of the workpiece 11 in the X-axis direction relative to a focal point P of the laser beam L, which will be described later, for example.

[0067] A laser beam irradiation unit (i.e., processing unit) 20 is provided on the side of the holding unit 4. The laser beam irradiation unit 20 has a laser oscillator 22. The laser oscillator 22 has, for example, a crystal such as Nd:YAG as a laser medium.

[0068] By irradiating the crystal with excitation light from a light source such as a flash lamp or laser diode, a pulsed laser beam having a predetermined wavelength (for example, 1064 nm) is emitted from the laser oscillator 22 .

[0069] A pulsed laser beam emitted from the laser oscillator 22 passes through a condenser lens 24, is then reflected by a prism mirror 26, and is then irradiated onto the outer surface of the cylindrical portion 4a1 so as to be approximately perpendicular to the outer surface.

[0070] The laser oscillator 22, the condenser lens 24, the prism mirror 26, etc. are housed in a cylindrical housing 28. An opening 28a for irradiating the laser beam L is formed in a part of the side surface of the housing 28.

[0071] Opening 28a of housing 28 is disposed facing holding surface 4c. Laser beam L is emitted from opening 28a to perform laser processing on workpiece 11 held by suction on holding surface 4c.

[0072] A moving block 30 is fixed to the side of the housing 28. The moving block 30 is supported by a pair of guide rails 32 so as to be slidable along the Z-axis direction. Note that Fig. 1(B) shows one guide rail 32 located on the front side of the page.

[0073] A screw shaft 32a is provided between the pair of guide rails 32 along the Z-axis direction, and the screw shaft 32a is rotatably connected to a nut portion (not shown) provided on the side of the moving block 30 via multiple balls (not shown).

[0074] One end of the screw shaft 32a is provided with a drive source 34 such as a servo motor, a stepping motor, etc. When the screw shaft 32a is rotated by the drive source 34, the moving block 30 moves along the Z-axis direction.

[0075] The moving block 30, the pair of guide rails 32, the nut portion, the screw shaft 32a, the drive source 34, etc. constitute a first Z-axis moving portion (i.e., moving portion) 36 for moving the laser beam irradiation unit 20 along the Z-axis direction.

[0076] That is, the first Z-axis direction moving unit 36 ​​relatively moves the holding unit 4 and the laser beam irradiation unit 20 along the rotation axis 4d. The first Z-axis direction moving unit 36 ​​has a function of adjusting the focal point P of the laser beam L in the Z-axis direction.

[0077] It should be noted that an elevator device having a wedge mechanism may be used instead of the ball screw as the first Z-axis direction moving part 36. Furthermore, the spatial position of the laser beam irradiation unit 20 in the laser processing apparatus 2 may be fixed, and the holding part 4 may be moved along the X-axis direction and the Z-axis direction.

[0078] Incidentally, instead of or in addition to moving the holding unit 4 along the X-axis direction by the X-axis direction moving unit 18, the focal point P of the laser beam L may be moved along the X-axis direction. In order to move the focal point P along the X-axis direction, the laser beam irradiation unit 20 may be moved along the X-axis direction by a movement mechanism having a ball screw.

[0079] In addition, instead of physically moving the laser beam irradiation unit 20 along the X-axis direction, the focal point P may be moved along the X-axis direction by adjusting the phase of the laser beam L using an LCOS-SLM (Liquid Crystal on Silicon - Spatial Light Modulator) provided in the optical path, or the focal point P may be moved along the X-axis direction by physically adjusting the position of one or more lenses provided in the optical path.

[0080] A detector 40 for detecting the position of the workpiece 11 sucked and held by the holder 4 in the Z-axis direction is provided in a region different from the laser beam irradiation unit 20 in the circumferential direction of the cylindrical portion 4a1.

[0081] The detection unit 40 of this embodiment has a microscope camera (not shown) that has a light source such as an LED (Light Emitting Diode), an objective lens, and a solid-state imaging element (light receiving element) such as a CCD (Charge-Coupled Device).

[0082] A microscope camera is, for example, a two-dimensional camera (area camera) in which multiple light-receiving elements are arranged regularly in the vertical and horizontal directions, but it may also be a one-dimensional camera (i.e., a line camera) in which multiple light-receiving elements are arranged in a row in a predetermined direction.

[0083] In this embodiment, the controller 50 identifies the position in the Z-axis direction of the planned dividing line 19 that has already been set on the workpiece 11 or the planned dividing line 19 that will be set, based on an image obtained by the microscope camera. Note that a fiber sensor (not shown) can also be used as the detection unit 40 instead of the microscope camera.

[0084] The fiber sensor has a light source, a light receiving element, an optical fiber, etc. When the fiber sensor is used, the upper end position in the Z-axis direction of the separable element 13 is identified by irradiating light from the light source to the workpiece 11 via the fiber sensor and receiving the reflected light from the workpiece 11 with the light receiving element via the fiber sensor.

[0085] The housing of the detection unit 40 is supported by a pair of guide rails 42 so as to be slidable along the Z-axis direction. Note that Fig. 1(B) shows one guide rail 42 located on the front side of the page. A screw shaft 42a is provided between the pair of guide rails 42 along the Z-axis direction.

[0086] A screw shaft 42a is rotatably coupled via a plurality of balls (not shown) to a nut portion (not shown) provided on the side surface of the housing of the detection portion 40. A drive source 44 such as a servo motor or a stepping motor is provided on one end of the screw shaft 42a.

[0087] When the screw shaft 42a is rotated by the drive source 44, the housing of the detection unit 40 moves along the Z-axis direction. The pair of guide rails 42, the nut unit, the screw shaft 42a, the drive source 44, etc. constitute a second Z-axis movement unit 46 for moving the detection unit 40 along the Z-axis direction.

[0088] The operations of the rotating unit 8, solenoid valve 10a, X-axis moving unit 18, laser beam irradiation unit 20, first Z-axis moving unit 36, detection unit 40, second Z-axis moving unit 46, etc. are controlled by a controller 50.

[0089] The controller 50 is configured by a computer having a processor 50a, such as a CPU (Central Processing Unit), and a memory 50b. The memory 50b includes a main storage device such as a DRAM (Dynamic Random Access Memory) and an auxiliary storage device such as a flash memory.

[0090] The auxiliary storage device stores software. The functions of the controller 50 are realized by operating the processor 50a and the like in accordance with this software. The auxiliary storage device stores a first program for detecting the relative positions of the focal point P (see FIG. 6) of the laser beam L and the workpiece 11 in the Z-axis direction.

[0091] The first program is a program for performing image processing, and by executing the first program by the processor 50a, image processing is performed on the image obtained using the detection unit 40. The alignment mark is identified by the image processing.

[0092] For example, if the planned division line 19 is not drawn on the top surface of the dividable element 13, the detection unit 40 captures an image of the workpiece 11 in a stationary state to obtain images of the alignment marks (not shown) provided on the dividable element 13, the excess area of ​​the dividable element 13 (i.e., the end of the dividable element 13 where no electronic components 17 are provided), the connecting portions 21, etc., and then image processing is used to identify the positions of the alignment marks, etc. in the Z-axis direction.

[0093] The distance from the alignment mark to the nearest planned dividing line 19 is predetermined according to the divided element 13, and the distance between the planned dividing lines 19 in the longitudinal direction 13a is also predetermined. Therefore, if the position of the alignment mark in the Z-axis direction can be identified, the controller 50 can identify the position of each planned dividing line 19 in the Z-axis direction.

[0094] In addition, the controller 50 may determine the position of each alignment mark in the Z-axis direction for multiple adjacent divisible elements 13 in the short direction 13b, and then determine the position of the planned division line 19 in the Z-axis direction by averaging the multiple identified Z-axis positions.

[0095] Similarly, when using excess areas of the dividable elements 13, connecting portions 21, etc., the position of the planned division line 19 in the Z-axis direction may be identified for each dividable element 13, or the position of the planned division line 19 averaged in the Z-axis direction may be identified.

[0096] When a fiber sensor is used as the detection unit 40 instead of a microscope camera, the end of the fiber sensor that serves as the light entrance and exit is moved along the Z-axis direction, while light is irradiated from the fiber sensor onto the stationary workpiece 11 and the fiber sensor receives the reflected light from the workpiece 11.

[0097] The controller 50 identifies the Z-axis position of the upper ends of the dividable element 13, the connecting portion 21, etc. based on the change in the amount of reflected light obtained through the fiber sensor. In this case, the auxiliary storage device stores a second program for identifying the Z-axis position of the upper ends of the dividable element 13, the connecting portion 21, etc. based on the change in the amount of reflected light.

[0098] The reflectance of light in a specified wavelength band irradiated from a light source is known in advance depending on the material, so by irradiating light onto the workpiece 11 along the Z-axis direction, the positions of the upper end of the divided element 13, the upper end of the connecting portion 21, etc. can be identified based on changes in the amount of reflected light.

[0099] The distance from the upper end of the dividable element 13 to the nearest planned dividing line 19 is predetermined according to the dividable element 13, and the distance between the planned dividing lines 19 in the longitudinal direction 13a is also predetermined. Therefore, if the controller 50 can identify the position of the upper end of the dividable element 13, it can identify the position of each planned dividing line 19 in the Z-axis direction.

[0100] In this way, the controller 50 uses the detection unit 40 to identify the position of the planned division line 19 in the Z-axis direction, and controls the position of the laser beam irradiation unit 20 along the Z-axis direction (that is, the rotation axis 4d).

[0101] 4 to 7, a method for manufacturing the device package 23 will be described, in which the workpiece 11 is processed to manufacture a plurality of device packages 23 from the workpiece 11. FIG. 4 shows the flow of the method for manufacturing the device package 23.

[0102] As shown in Fig. 4, in this embodiment, the steps of holding step S10, alignment step S20, and processing step S30 are performed in this order. Fig. 5(A) is a top view showing holding step S10, and Fig. 5(B) is a side view showing holding step S10. Note that in Fig. 5(B) and subsequent figures, terminals 15 are not shown to make the drawings easier to read.

[0103] In the holding step S10, first, an operator wraps the workpiece 11 around the holding surface 4c located on the outer surface of the cylindrical portion 4a1 so that the device packages 23 correspond one-to-one to the openings 4b. At this time, the orientation, position, etc. of the workpiece 11 are appropriately adjusted so that each planned division line 19 is aligned along the circumferential direction of the holding surface 4c.

[0104] For example, the orientation, position, etc. of the workpiece 11 relative to the holding surface 4c are adjusted using marks, depressions, protrusions, etc. provided on the holding surface 4c. Next, the first valve for supplying negative pressure in the solenoid valve 10a is opened to apply negative pressure to the opening 4b, thereby suction-holding the workpiece 11 on the holding surface 4c.

[0105] When the workpiece 11 is suction-held by the holding surface 4c, the multiple planned division lines 19 in each dividable element 13 are arranged discretely along the longitudinal direction 13a of each dividable element 13. At the same time, each planned division line 19 is arranged around the rotation axis 4d so as to follow the circumferential direction of the holding surface 4c.

[0106] Whether the multiple planned division lines 19 are actually drawn or virtually arranged, the multiple planned division lines 19 are arranged discretely along the longitudinal direction 13a and around the rotation axis 4d.

[0107] After the holding step S10, the alignment step S20 is performed. Fig. 6 is a side view showing the alignment step S20. In the alignment step S20, first, an image of an alignment mark (not shown) provided on the workpiece 11 is captured by the detection unit 40.

[0108] Based on the obtained image, the controller 50 adjusts the position of the focal point P in the Z-axis direction by moving the holding part 4 and the laser beam irradiation unit 20 relatively along the Z-axis direction (i.e., the longitudinal direction of the rotation axis 4d).

[0109] In this embodiment, the position of the focal point P of the laser beam L corresponds to the processing position of the workpiece 11 by the laser beam irradiation unit 20, so in the alignment step S20, the position of the focal point P in the Z-axis direction at the start of laser processing is determined.

[0110] For example, the relative positions of the holding portion 4 and the laser beam irradiation unit 20 are adjusted so that the focal point P is located near the outermost part (i.e., the surface) of the divided element 13 in the radial direction (i.e., the X-axis direction) of the cylindrical portion 4a1, and on one of the multiple planned division lines 19 set on the divided element 13 that is located highest in the Z-axis direction.

[0111] The focal point P does not necessarily have to be set exactly on the surface of the outermost divided element 13. The focal point P may be positioned within a range of ±100 μm from the surface in the radial direction of the cylindrical portion 4a1. After the positioning step S20, the process proceeds to the processing step S30.

[0112] 7 is a side view showing the processing step S30. In the processing step S30, rotation of the holding part 4 is started and the rotation speed is set to a predetermined value (for example, 1000 rpm), and then irradiation of the laser beam L is started. An example of processing conditions is shown below. Note that a rotary encoder may be used to determine the processing start position around the rotation axis 4d.

[0113] Wavelength: 1064nm Average power: 200W Repetition frequency: 400kHz Rotation speed: 1000 rpm (surface of the divided element is 100 mm from the rotation axis)

[0114] In this manner, while the holder 4 holding the workpiece 11 is rotated around the rotation axis 4d, the workpiece 11 is subjected to ablation processing by the laser beam L irradiated from the laser beam irradiation unit 20.

[0115] The controller 50 monitors the rotation angle of the holding part 4 using a rotary encoder, and can therefore grasp how many times the condensing point P has rotated in the circumferential direction of the holding surface 4c. For example, by scanning each planned division line 19 with the condensing point P a predetermined number of times (i.e., a predetermined number of passes), the dividable element 13 is cut along the planned division lines 19.

[0116] Generally, to improve UPH (units per hour) by reducing the number of passes in laser processing, it is necessary to increase the average power of the laser beam L. However, increasing the average power increases the amount of heat applied per unit area.

[0117] Therefore, in order to maintain the processing quality without increasing the amount of heat applied per unit area of ​​the workpiece 11, it is necessary to increase the processing feed rate (which corresponds to the rotational speed in this embodiment) along with increasing the average output.

[0118] For example, when the average power is 50 W, a processing feed rate of 1000 mm / s can maintain processing quality, but when the average power is 200 W, the processing feed rate must be 4000 mm / s to maintain processing quality.

[0119] However, when moving the holding table within the XY plane as described above, if such an extremely high processing feed rate is applied, it takes approximately 0.4 seconds to reach 4000 mm / s when accelerating at 1 G from a stationary state, and it takes approximately 0.4 seconds to reach a stationary state when decelerating from 4000 mm / s at 1 G.

[0120] Therefore, an extra time of about 0.8 seconds is required to process one planned dividing line 19. Furthermore, if the number of passes is 20, an extra time of about 16 seconds (= about 0.8 seconds × 20) is required, and if one workpiece 11 has 48 planned dividing lines 19, an extra time of about 768 seconds (= about 16 seconds × 48) is required.

[0121] In contrast, in the processing step S30 of this embodiment, the holder 4 continues to rotate at a predetermined speed, so there is no need to repeatedly accelerate and decelerate the holder table along a predetermined direction as in the conventional method. This eliminates the need for additional time, thereby improving processing efficiency.

[0122] In this embodiment, the laser beam L is irradiated with the focal point P positioned at the height of the planned division line 19 located at the upper end in the Z-axis direction, and once the holding part 4 has rotated a predetermined number of times, the irradiation of the laser beam L is temporarily stopped. Then, the laser beam irradiation unit 20 is moved downward by a predetermined distance.

[0123] As a result, the focal point P is positioned near another adjacent planned division line 19 in the Z-axis direction. Then, irradiation of the laser beam L is resumed, and similarly, after the holding part 4 has rotated a predetermined number of times, irradiation of the laser beam L is stopped again, and the laser beam irradiation unit 20 is moved downward by a predetermined distance.

[0124] The holding unit 4 maintains the same rotation speed even while the laser beam irradiation unit 20 is moving. The dividable elements 13 are cut sequentially along each of the planned division lines 19, and after all of the dividable elements 13 have been divided into a plurality of device packages 23, the rotation of the holding unit 4 is stopped.

[0125] Next, a collection tray (not shown) is placed below the cylindrical portion 4a1. Then, the first valve for supplying negative pressure is closed and the second valve for supplying positive pressure is opened, thereby dropping each device package 23 from the holding surface 4c.

[0126] In this embodiment, the workpiece 11 can be processed by the laser beam irradiation unit 20 while the holder 4 holding the workpiece 11 on the holding surface 4c is rotated around the rotation axis 4d. Therefore, extra time associated with accelerating and decelerating the holding table can be eliminated, improving processing efficiency.

[0127] In the above description, the width of the division line 19 in the longitudinal direction 13a of the dividable element 13 is approximately the same as the width of the region to be irradiated with the laser beam L. However, the width of the division line 19 in the longitudinal direction 13a may be larger than the width of the region to be irradiated with the laser beam L.

[0128] In this case, in the processing step S30, the laser beam L is irradiated along the short direction 13b at both ends of one planned division line 19 in the longitudinal direction 13a, thereby forming two cutting grooves for one planned division line 19. The area between the two cutting grooves becomes waste material.

[0129] In order to properly dispose of the scraps, a through-hole (not shown) may be provided between two adjacent openings 4b in the Z-axis direction, penetrating from the holding surface 4c to the hollow portion 4e. The size of the through-hole in the holding surface 4c is larger than the size of the scraps.

[0130] When a through hole is provided, the second flow path for supplying negative pressure to the opening 4b is provided along the circumferential direction of the holding portion 4 so that the second flow path of the cylindrical portion 4a1 and the through hole do not overlap in the radial direction of the holding portion 4.

[0131] The scraps generated in the processing step S30 are discarded by being blown from the holding surface 4c into the hollow portion 4e by air jetted from an air nozzle (not shown) fixed to the laser beam irradiation unit 20. Instead of using an air nozzle, negative pressure may be supplied to the hollow portion 4e, and the scraps may be sucked into the hollow portion 4e as soon as they are generated, thereby discarding the scraps.

[0132] In addition, to confirm that the scrap has been discarded, the detection unit 40 (microscope camera) may take an image of the location where the scrap is generated, or the detection unit 40 (fiber sensor) may obtain a change in the amount of reflected light, thereby detecting that the scrap has been generated (i.e., that the divided element 13 has been cut).

[0133] Alternatively, a light source such as an LED (not shown) may be placed in the hollow portion 4e, and the light projected onto the detection unit 40 through a through hole corresponding to the position where the scrap is generated may be detected by the detection unit 40, thereby detecting the generation of scrap.

[0134] (Second embodiment) Next, a second embodiment will be described with reference to Fig. 8(A) and Fig. 8(B). Fig. 8(A) is a top view of a laser processing apparatus 2a according to the second embodiment, and Fig. 8(B) is a partial cross-sectional side view of the laser processing apparatus 2a according to the second embodiment.

[0135] In the second embodiment, a plurality of openings 4b are formed in the inner surface (i.e., the side surface) of the cylindrical holder 4, and thus a holding surface (holding area) 4c is provided on the inner surface. The inner surface is also arranged around the rotation axis 4d at a predetermined distance from the rotation axis 4d.

[0136] Since the holding surface 4c is provided on the inner surface of the holding part 4, the laser beam irradiation unit 20 and the detection part 40 are disposed in the hollow part 4e of the holding part 4. The opening 28a of the housing 28 of the laser beam irradiation unit 20 and the objective lens (not shown) of the detection part 40 each face the inner surface of the holding part 4.

[0137] Furthermore, the focal point P of the laser beam L and the detection unit 40 are each movable along the Z-axis direction within the hollow portion 4e. In the second embodiment as well, the workpiece 11 can be laser-processed by the laser beam irradiation unit 20 while the holding unit 4, which holds the workpiece 11 on the holding surface 4c, is rotated around the rotation axis 4d, thereby improving processing efficiency.

[0138] 8(A) and 8(B), the various modifications described in the first embodiment can also be applied to the laser processing apparatus 2a of the second embodiment. The same can be applied to the disposal and detection of scrap materials described in the first embodiment. However, in the second embodiment, the scrap materials are disposed of from the hollow portion 4e to the radially outer side of the holding portion 4.

[0139] (Third Embodiment) Next, a third embodiment will be described with reference to Figures 9(A) and 9(B). Figure 9(A) is a top view of a cutting device (i.e., processing device) 52 according to the third embodiment, and Figure 9(B) is a partially cross-sectional side view of the cutting device 52 according to the third embodiment. Figure 9(B) shows some of the components of the cutting device 52 in functional blocks.

[0140] The cutting device 52 of the third embodiment has a cutting unit (i.e., processing unit) 54 instead of the laser beam irradiation unit 20. The other components of the cutting device 52 are substantially the same as those of the laser processing device 2, and therefore description thereof will be omitted.

[0141] The cutting unit 54 has a spindle housing 56 whose longitudinal direction is arranged along the Z-axis direction. A cylindrical spindle 58 is partially rotatably housed within the spindle housing 56 by an air bearing (i.e., a hydrostatic air bearing). The longitudinal direction of the spindle 58 is also arranged along the Z-axis direction.

[0142] A motor (not shown) for rotating the spindle 58 is housed within the spindle housing 56. The tip (i.e., the lower end) of the spindle 58 protrudes from the spindle housing 56, and a disk-shaped receiving flange 60a is fixed to this tip.

[0143] The receiving flange 60a has a cylindrical boss (not shown) at the radial center. A male thread is formed on the outer peripheral side of the tip of the boss. A through hole (not shown) of a hub-shaped cutting blade 62 is inserted into the boss of the receiving flange 60a, and then an annular press nut 60b, which has a female thread formed on its inner peripheral surface, is tightened.

[0144] The cutting blade 62 has an annular base (i.e., hub) made of metal such as aluminum alloy, and an annular cutting blade provided on one side of the base. The cutting blade has abrasive grains made of diamond or the like, and a bond material made of resin, metal, vitrified or the like for fixing the abrasive grains.

[0145] When the cutting blade 62 is attached to the tip of the spindle 58 using the receiving flange 60a and the retaining nut 60b, the cutting edge is clamped between the receiving flange 60a and the base of the cutting blade 62. The cutting blade 62 is not limited to the hub type, and may be a hubless type (i.e., a cutting blade that does not have a base and has only the cutting edge).

[0146] In the third embodiment, the steps are also performed in the order of holding step S10, alignment step S20, and processing step S30. The holding step S10 and alignment step S20 are the same as those in the first embodiment. In the processing step S30, first, rotation of the holding unit 4 is started and set to a predetermined rotation speed (for example, 1000 rpm).

[0147] Thereafter, the holding part 4 is moved in the X-axis direction by the X-axis moving part 18 relative to the cutting blade 62 which is rotating at high speed (e.g., 30,000 rpm), so that the cutting edge of the cutting blade 62 cuts into the plurality of dividable elements 13 by a predetermined depth (e.g., 30 μm). An example of processing conditions is shown below.

[0148] Spindle rotation speed: 30,000 rpm Cutting depth: 30 μm (per rotation of the holding part) Rotation speed of the holding part: 1000 rpm (surface of the divided element is 100 mm from the rotation axis)

[0149] After the holding part 4 rotates once with the cutting blade cutting 30 μm into the plurality of dividable elements 13, in the second rotation the cutting blade is made to cut an additional 30 μm into the plurality of dividable elements 13 (i.e., to a depth of 60 μm from the surface of the dividable elements 13). The number of rotations of the holding part 4 can be monitored by the rotary encoder mentioned above.

[0150] During the third rotation, the cutting blade is caused to cut an additional 30 μm into the plurality of dividable elements 13. That is, during the third rotation, the cutting blade is caused to cut into the plurality of dividable elements 13 to a depth of 90 μm from the surface of the dividable elements 13. In this way, the cutting blade is caused to cut deeper into the plurality of dividable elements 13 in stages according to the rotation of the holding part 4.

[0151] If the thickness of each dividable element 13 is 1.5 mm, each dividable element 13 is cut along one planned dividing line 19 by rotating the holding part 4 50 times (50 rotations × 30 μm = 1500 μm). In the case of 1000 rpm (= 1000 rotations / 60 seconds), the time required for 50 rotations is 3 seconds, so multiple planned dividing lines 19 at the same height in the Z-axis direction are cut in 3 seconds.

[0152] Next, the holding portion 4 is moved away from the cutting unit 54 so as to move the cutting blade away from the divided element 13, and the cutting unit 54 is moved downward by a predetermined indexing feed amount (i.e., the distance between adjacent intended division lines 19 in the longitudinal direction 13a).

[0153] The rotation of the holding part 4 continues at a predetermined speed during the indexing feed. Then, in the same manner, for the next division line 19, each of the dividable elements 13 is cut stepwise, and multiple division lines 19 at the same height in the Z-axis direction are cut in 3 seconds.

[0154] In this way, the holding part 4 holding the workpiece 11 is rotated around the rotation axis 4d, while the cutting unit 54 cuts (machines) the workpiece 11. In the third embodiment, the extra time required for accelerating and decelerating the holding table as in the conventional case can also be eliminated, thereby improving the machining efficiency.

[0155] As in the first embodiment, instead of or together with moving the holding part 4 along the X-axis direction by the X-axis direction moving part 18, the cutting unit 54 may be moved along the X-axis direction.

[0156] In addition, the various modifications described in the first embodiment can also be applied to the cutting device 52 of the third embodiment. The disposal and detection of scrap materials described in the first embodiment can also be applied in the same way.

[0157] (Fourth embodiment) Next, a fourth embodiment will be described with reference to Fig. 10. Fig. 10 is a partially cross-sectional side view of a cutting device 52a according to the fourth embodiment. In the fourth embodiment, similar to the second embodiment, a plurality of openings 4b are formed on the inner surface (i.e., the side surface) of the holding part 4, and a holding surface (holding area) 4c is provided on the inner surface.

[0158] Since the holding surface 4c is provided on the inner surface of the holding part 4, the cutting unit 54 and the detection part 40 are disposed in the hollow part 4e of the holding part 4. In the fourth embodiment as well, the workpiece 11 can be cut by the cutting unit 54 while the holding part 4 holding the workpiece 11 on the holding surface 4c is rotated around the rotation axis 4d, thereby improving the processing efficiency.

[0159] The various modifications described in the first embodiment can also be applied to the cutting device 52a of the fourth embodiment. The same can be applied to the disposal and detection of scrap materials described in the first embodiment. However, in the fourth embodiment, the scrap materials are discarded from the hollow portion 4e to the radial outside of the holding portion 4.

[0160] (Fifth embodiment) Next, a fifth embodiment will be described with reference to Fig. 11(A) and Fig. 11(B). Fig. 11(A) is a side view of a holding portion 64 according to the fifth embodiment, and Fig. 11(B) is a cross-sectional view taken along CC in Fig. 11(A).

[0161] 11(A) and 11(B), in the fifth embodiment as well, the outer surface (i.e., the side surface) of the holding portion 64 functions as a holding surface (holding area) 4c that suction-holds the workpiece 11. However, in the fifth embodiment, porous ceramics 4f are exposed on the outer surface of the holding portion 64 instead of the regularly arranged multiple openings 4b (see FIG. 2(A)).

[0162] The porous ceramic 4f has a band shape in the side view shown in Fig. 11(A) and a ring shape in the cross section shown in Fig. 11(B). The porous ceramic 4f is fixed to the cylindrical portion 4a1, and the outer surface of the porous ceramic 4f and the outer surface of the cylindrical portion 4a1 are substantially flush with each other.

[0163] The porous ceramic 4f has pores interconnected in a three-dimensional network. The negative pressure generated by the vacuum device 10 passes through the first flow path in the bottom portion 4a2, the second flow path in the cylindrical portion 4a1, and so on, and is finally transmitted to the outer surface of the porous ceramic 4f.

[0164] In the fifth embodiment, the workpiece 11 can also be held by suction, but in order to further increase the suction force due to the negative pressure, it is preferable to completely cover the exposed outer surface of the porous ceramic 4f.

[0165] (Modification of workpiece 11) Fig. 12(A) is a top view of a modified workpiece 31, and Fig. 12(B) is a side view of the modified workpiece 31. In the modified workpiece 31, the multiple dividable elements 13 are fixed by a single rectangular resin sheet 25, rather than by ribbon-shaped connecting portions 21 (see Fig. 3(A)).

[0166] The resin sheet 25 is, for example, a laminate having a resin base layer and a resin adhesive layer provided on one surface of the base layer. The adhesive layer is, for example, an ultraviolet curable resin, and has adhesive strength when not irradiated with ultraviolet light, but its adhesiveness decreases when irradiated with ultraviolet light.

[0167] Each of the dividable elements 13 is fixed to the adhesive layer of the resin sheet 25, and the base material layer of the resin sheet 25 is sucked and held by the holding surface 4c. As a result, the workpiece 11 is sucked and held by the holding surface 4c via the resin sheet 25.

[0168] The length of the resin sheet 25 in the short-side direction 13b of the dividable element 13 is approximately equal to the circumferential length of the porous ceramic 4f on the holding surface 4c. Therefore, when the resin sheet 25 is wrapped around the holding surface 4c, the exposed outer surface of the porous ceramic 4f can be entirely covered with the resin sheet 25.

[0169] By completely covering the outer surface of the porous ceramic 4f with a resin sheet 25, the holding force at the holding surface 4c, including the outer surface of the porous ceramic 4f, can be made higher than when a workpiece 11 having a ribbon-shaped connecting portion 21 is held by suction.

[0170] In addition, when the porous ceramics 4f are exposed on the inner surface of the holding portion 4, as shown in Figures 8(A) and 8(B), rather than on the outer surface of the holding portion 4, the workpiece 31 is suction-held by the holding surface 4c located on the inner surface of the holding portion 4.

[0171] Incidentally, it is also possible to use both the connecting portion 21 (see FIG. 3(A)) and the resin sheet 25. In this case, for example, the resin sheet 25 is arranged so as to fill the gap between the two connecting portions 21 in the longitudinal direction 13a of the dividable element 13.

[0172] All of the dividable elements 13 are fixed to the connecting parts 21 and the resin sheet 25 in the longitudinal direction 13a and the lateral direction 13b. This allows the connecting parts 21 and the resin sheet 25 to entirely cover the exposed outer surface of the porous ceramic 4f.

[0173] (Modifications of the holding portion) Next, with reference to Fig. 13(A) to Fig. 18(D), various modifications of the shape of the holding portion 4 will be described. In the modifications shown in Fig. 13(A) to Fig. 18(D), a plurality of openings 4b may be regularly provided on the holding surface 4c, and the pores of the porous ceramic 4f may be exposed.

[0174] 13(A) is a side view of the holding portion 74 in the first modified example, and FIG. 13(B) is a top view of the holding portion 74 in the first modified example. The holding portion 74 in the first modified example has a polygonal prism shape (i.e., a columnar body). In the first modified example, the holding surface 4c is provided on the outer surface of the holding portion 74.

[0175] 13(C) is a side view of the holding portion 84 in the second modified example, and FIG. 13(D) is a top view of the holding portion 84 in the second modified example. The holding portion 84 in the second modified example has a cylindrical shape (i.e., a pillar body). In the second modified example, the holding surface 4c is provided on the outer surface of the holding portion 84.

[0176] 14(A) is a side view of the holding portion 94 in the third modified example, and FIG. 14(B) is a top view of the holding portion 94 in the third modified example. The holding portion 94 in the third modified example has a polygonal truncated pyramid shape (i.e., is a frustum). In the third modified example, the holding surface 4c is provided on the outer surface of the holding portion 94.

[0177] Fig. 14(C) is a side view of the holding portion 104 in the fourth modified example, and Fig. 14(D) is a top view of the holding portion 104 in the fourth modified example. The holding portion 104 in the fourth modified example has a truncated cone shape (i.e., a frustum). In the fourth modified example, the holding surface 4c is provided on the outer surface of the holding portion 104.

[0178] 15(A) is a side view of the holding portion 114 in the fifth modified example, and FIG. 15(B) is a top view of the holding portion 114 in the fifth modified example. The holding portion 114 in the fifth modified example has a polygonal pyramid shape (i.e., a cone). In the fifth modified example, the holding surface 4c is provided on the outer surface of the holding portion 114.

[0179] Fig. 15(C) is a side view of the holding portion 124 in the sixth modified example, and Fig. 15(D) is a top view of the holding portion 124 in the sixth modified example. The holding portion 124 in the sixth modified example has a conical shape (i.e., a pyramid). In the sixth modified example, the holding surface 4c is provided on the outer surface of the holding portion 124.

[0180] 16(A) is a side view of the holding portion 134 in the seventh modified example, and FIG. 16(B) is a top view of the holding portion 134 in the seventh modified example. The holding portion 134 in the seventh modified example has a polygonal cylindrical shape whose cross section in the Z-axis direction is polygonal (i.e., a cylindrical body). In the seventh modified example, the holding surface 4c may be provided on the outer surface of the holding portion 134 or on the inner surface of the holding portion 134.

[0181] 17(A) is a side view of the holding portion 144 in the eighth modified example, and FIG. 17(B) is a top view of the holding portion 144 in the eighth modified example. The holding portion 144 in the eighth modified example has a polygonal truncated pyramid shape with a polygonal truncated pyramid-shaped hollow portion 4e exposed upward (i.e., it is a truncated pyramid with a polygonal truncated pyramid-shaped hollow portion). In the eighth modified example, the holding surface 4c may be provided on the outer surface of the holding portion 144, or may be provided on the inner surface of the holding portion 144 facing the hollow portion 4e.

[0182] Fig. 17(C) is a side view of the holding portion 154 in the ninth modified example, and Fig. 17(D) is a top view of the holding portion 154 in the ninth modified example. The holding portion 154 in the ninth modified example has a truncated cone shape with a truncated cone-shaped cavity 4e exposed upward (i.e., it is a truncated cone with a truncated cone-shaped cavity). In the ninth modified example, the holding surface 4c may be provided on the outer surface of the holding portion 154, or may be provided on the inner surface of the holding portion 144 facing the cavity 4e.

[0183] Fig. 18(A) is a side view of a holding portion 164 in a tenth modified example, and Fig. 18(B) is a top view of the holding portion 164 in the tenth modified example. The holding portion 164 in the tenth modified example has a polygonal pyramid shape with a polygonal pyramid-shaped hollow portion 4e exposed upward (i.e., it is a cone with a polygonal pyramid-shaped hollow portion). In the tenth modified example, the holding surface 4c may be provided on the outer surface of the holding portion 164, or may be provided on the inner surface of the holding portion 164 facing the hollow portion 4e.

[0184] Fig. 18(C) is a side view of the holding portion 174 in the eleventh modified example, and Fig. 18(D) is a top view of the holding portion 174 in the eleventh modified example. The holding portion 174 in the eleventh modified example has a conical shape with a conical cavity 4e exposed upward (i.e., it is a pyramid with a conical cavity). In the eleventh modified example, the holding surface 4c may be provided on the outer surface of the holding portion 174, or may be provided on the inner surface of the holding portion 174 facing the cavity 4e.

[0185] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. The above-described X-axis moving unit 18, first Z-axis moving unit 36, second Z-axis moving unit 46, etc. have been described as having ball screws.

[0186] However, a similar linear guide mechanism can be realized by using a sliding screw instead of the ball screw. Also, instead of a servo motor, stepping motor, or the like, a pulley and a belt may be used as the drive source for the ball screw and sliding screw, and the rotational power of the pulley may be transmitted to each moving plate via a belt to move each moving plate linearly.

[0187] The second Z-axis direction moving unit 46 may be omitted, and the detection unit 40 may be fixed to the laser beam irradiation unit 20 or the cutting unit 54. This allows the number of linear guide mechanisms to be reduced, thereby simplifying the device configurations of the laser processing devices 2, 2a and the cutting devices 52, 52a.

[0188] In the above-described embodiment and modified examples, the case where negative pressure is transmitted from the opening 4b and the porous ceramic 4f has been described. However, the workpiece 11 may be suction-held by negative pressure transmitted from grooves linearly provided along each of the separable elements 13, or the workpiece 11 may be suction-held by a pin chuck having a plurality of regularly-arranged pin-shaped protrusions.

[0189] Furthermore, the workpieces 11 and 31 may be held by electrostatic force instead of by suction using negative pressure. When the workpieces 11 and 31 are held by electrostatic force, the holders 4, 64, 74, 84, 94, 104, 114, 124, 134, 144, 154, 164, and 174 are provided with electrostatic chucks.

[0190] When processing a workpiece 31 having a resin sheet 25 shown in Figures 12(A) and 12(B), instead of suction holding using negative pressure and electrostatic force, the workpiece 31 may be fixed to the holding part 4 etc. using physical fixing elements such as rubber bands, steel bands, belts, clips, clamps, etc.

[0191] Specifically, the excess area of ​​the resin sheet 25 located at both ends (i.e., the upper and lower ends) in the longitudinal direction 13a of the dividable element 13 is fixed to the outer surface of the holding part 4 or the like by a physical fixing element. Alternatively, the excess area of ​​the resin sheet 25 may be fixed to the inner surface of the holding part 4 or the like by a clamp or the like.

[0192] In the modified examples shown in Figures 14(A) to 15(D) and Figures 17(A) to 18(D), frustums and cones that taper downward are exemplified, but instead, frustums and cones that taper upward can also be used. [Explanation of symbols]

[0193] 2, 2a: Laser processing equipment (processing equipment) 4: holding portion, 4a1: cylindrical portion, 4a2: bottom portion, 4b: opening 4c: Holding surface (holding area), 4d: Rotation axis, 4e: Cavity, 4f: Porous ceramics 6: Rotary joint 8: Rotating part, 8a: Motor, 8a1: Rotor, 8a2: Stator, 8b: Flow path 10: Vacuum device (suction source), 10a: Solenoid valve 11,31: Workpiece, 13: Element to be divided, 13a: Longitudinal direction, 13b: Short direction 12: X-axis direction moving plate, 14: guide rail 16a: screw shaft, 16b: driving source, 18: X-axis direction moving part 15: Terminal, 17: Electronic component, 19: Dividing line, 21: Connecting part 20: Laser beam irradiation unit (processing unit) 22: laser oscillator, 24: condenser lens, 26: prism mirror 28: Housing, 28a: Opening 23: Device package (semiconductor device), 25: Resin sheet 30: moving block, 32: guide rail, 32a: screw shaft 34: driving source, 36: first Z-axis direction moving unit (moving unit) 40: detector, 42: guide rail, 42a: screw shaft 44: drive source, 46: second Z-axis direction moving unit 50: Controller, 50a: Processor, 50b: Memory 52,52a: Cutting equipment (processing equipment) 54: Cutting unit (processing unit), 56: Spindle housing, 58: Spindle 60a: Receiving flange, 60b: Presser nut, 62: Cutting blade 64,74,84,94,104,114: Holding part 124,134,144,154,164,174: Holding part B: Arrow L: laser beam, P: focal point S10: Holding process, S20: Alignment process, S30: Processing process

Claims

1. a holding section that holds the workpiece in a holding region; a rotating unit having a motor that rotates the holding unit around a predetermined rotation axis; a processing unit that can be arranged facing the holding area and processes the workpiece; a moving unit that moves the holding unit and the processing unit relatively along the rotation axis; Equipped with The holding portion has a side portion disposed around the rotation axis and spaced apart from the rotation axis, The processing device is characterized in that the holding area is provided on the side surface.

2. The holding area of ​​the holding portion is It is provided on the outer or inner surface of the cylinder. provided on the outer surface of a pillar, frustum or pyramid; On the outer or inner surface of a hollow frustum, or 2. The processing device according to claim 1, wherein the processing device is provided on an outer surface or an inner surface of a cone having a hollow portion.

3. 2. The processing device according to claim 1, wherein the processing unit is a laser beam irradiation unit having a laser oscillator and a condenser lens.

4. the processing unit is a cutting unit having a spindle, 2. The processing device according to claim 1, wherein a cutting blade is attached to the tip of the spindle.

5. a detection unit having a light source and a light receiving element for detecting the position of the workpiece held by the holding unit; a controller having a memory and a processor and controlling the rotating unit, the processing unit, and the moving unit; Further provided with 2. The processing device according to claim 1, wherein the controller controls the position of the processing unit along the rotation axis by utilizing the detection unit.

6. 2. The processing apparatus according to claim 1, wherein a negative pressure generated by a suction source is transmitted to the holding area of ​​the holding portion.

7. The workpiece is a plurality of divided elements, each of which has a plurality of electronic components linearly arranged thereon; a connecting portion that connects the plurality of dividable elements in a direction intersecting the longitudinal direction of each dividable element; and 7. The processing device according to claim 1, wherein when the workpiece is held by the holding portion, a plurality of planned division lines for dividing the plurality of electronic components are arranged discretely along the longitudinal direction of each divided element and around the rotation axis.

8. the holding area of ​​the holding part has a plurality of openings to which the negative pressure generated by the suction source is respectively transmitted; 8. The processing device according to claim 7, wherein the plurality of openings are provided at positions in each of the separated elements corresponding to the plurality of electronic components.

9. A method for manufacturing a semiconductor device by processing a workpiece to manufacture a semiconductor device from the workpiece, a holding step of holding the workpiece at a side surface of a holding part having a side surface disposed around a rotation axis and spaced apart from the rotation axis; an alignment step of adjusting a processing position of the workpiece by the processing unit by relatively moving the holding portion and the processing unit along the longitudinal direction of the rotation shaft; a processing step of processing the workpiece with the processing unit disposed opposite the side surface portion while rotating the holding portion holding the workpiece around the rotation axis; A method for manufacturing a semiconductor device comprising:

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