Long member

Abstract

To provide a long member having superior mechanical strength, dimensional stability, and thin-wall flame retardancy.SOLUTION: A long member comprising a polyamide resin (A), glass fibers (B), and a halogen-free flame retardant (C), wherein a content of the polyamide resin (A) is 30-60 mass%, a content of the glass fibers (B) is 35-55 mass%, and a content of the halogen-free flame retardant (C) is 5-20 mass%.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a long part, and more particularly to a long part comprising a polyamide resin, a glass fiber, and a halogen-free flame retardant. [Background technology]

[0002] BACKGROUND ART Polyamide resins are excellent in mechanical properties, heat resistance, etc., and are therefore used in a variety of applications, such as electrical and electronic parts, automobile parts, and machine parts. In particular, for applications in electrical and electronic components, a high level of flame retardancy based on the UL-94 standard is required, and therefore compositions containing various flame retardants and polyamide resins have been proposed. For example, Patent Document 1 proposes a flame-retardant polyamide resin composition containing a polyamide resin, an adduct formed from melamine and phosphoric acid, an inorganic filler, and a specific metal salt of a higher fatty acid. Patent Document 1 describes that the flame-retardant polyamide resin composition has extremely high thin-wall flame retardancy, does not generate highly corrosive hydrogen halide gas during combustion, has excellent mechanical properties and moldability, and further has little bleeding. Patent Document 2 proposes a flame-retardant polyamide composition containing a polyamide resin, a flame retardant having no halogen groups in the molecule, a fatty acid metal salt, and a reinforcing agent. Patent Document 2 describes that the flame-retardant polyamide composition is halogen-free and has excellent mechanical properties such as toughness, heat resistance in a reflow soldering process, and particularly excellent flowability. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-275370 [Patent Document 2] International Publication No. 2008 / 126381 Summary of the Invention [Problem to be solved by the invention]

[0004] Resin compositions containing conventional polyamide resins, such as those described in Patent Documents 1 and 2, have excellent flame retardancy. However, when resin compositions containing conventional polyamide resins are used for long parts such as electrical and electronic components, the long parts have problems in that they do not have satisfactory mechanical strength and also undergo large dimensional changes after production.

[0005] In view of the above problems, an object of the present invention is to provide a long part that is excellent in mechanical strength, dimensional stability, and thin-walled flame retardancy. [Means for solving the problem]

[0006] As a result of intensive research to solve the above problems, the present inventors have conceived the following invention and found that the problems can be solved. That is, the present invention is as follows.

[0007] [1] A polyamide resin (A), a glass fiber (B), and a halogen-free flame retardant (C), The content of the polyamide resin (A) is 30 to 60 mass %, The content of the glass fiber (B) is 35 to 55 mass %, The content of the halogen-free flame retardant (C) in the long part is 5 to 20 mass %. [2] The long part according to [1] above, having a maximum outer dimension of 50 mm or more and 200 mm or less. [3] The long part according to [1] or [2], wherein the melting point of the polyamide resin (A) is 270°C or higher. [4] The polyamide resin (A) contains a dicarboxylic acid unit and a diamine unit, The long part according to any one of [1] to [3] above, wherein the diamine units contain 50 to 100 mol % of aliphatic diamine units having 7 to 18 carbon atoms relative to 100 mol % of all diamine units. [5] The long part according to any one of [1] to [4] above, which contains a metal soap (D). [6] The long part according to [5], wherein the metal soap (D) is calcium stearate. [7] The long part according to any one of the above [1] to [6], which contains a fatty acid amide (E). [8] The long part according to [7], wherein the fatty acid amide (E) is ethylene bisstearic acid amide. [9] The long component according to any one of [1] to [8] above, which is an electronic component for DDR. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a long part that is excellent in mechanical strength, dimensional stability, and thin-walled flame retardancy. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is an explanatory diagram illustrating a long part according to an embodiment of the present invention; [Figure 2] FIG. 2 is an explanatory diagram illustrating the measurement of mechanical strength of long parts produced in Examples and Comparative Examples. DETAILED DESCRIPTION OF THE INVENTION

[0010] The following describes an example of an embodiment of the present invention (hereinafter, sometimes referred to as "the present embodiment"). However, the embodiment described below is merely an example for embodying the technical idea of ​​the present invention, and the present invention is not limited to the following description. In addition, although preferred embodiments are shown in this specification, a combination of two or more of the individual preferred embodiments is also a preferred embodiment. When there are several numerical ranges for matters shown as numerical ranges, the lower limit and upper limit can be selectively combined to form a preferred embodiment. In this specification, when a numerical range is stated as "XX to YY", it means "XX or more and YY or less." Furthermore, in this specification, the term "unit" (where "" indicates a monomer) means "a structural unit derived from", for example, a "dicarboxylic acid unit" means "a structural unit derived from a dicarboxylic acid", and a "diamine unit" means "a structural unit derived from a diamine".

[0011] [Long parts] The long part according to this embodiment comprises a polyamide resin (A), a glass fiber (B), and a halogen-free flame retardant (C), and the content of the polyamide resin (A) is 30 to 60 mass %, the content of the glass fiber (B) is 35 to 55 mass %, and the content of the halogen-free flame retardant (C) is 5 to 20 mass %.

[0012] The long part according to the present embodiment has excellent mechanical strength, dimensional stability, and thin-wall flame retardancy despite its long length. Although the details of the reason for this are unknown, it is presumed to be due to the following reasons. Increasing the content of halogen-free flame retardant (C) to improve thin-wall flame retardancy reduces the mechanical strength of long parts. On the other hand, adding glass fiber (B) to long parts is expected to improve mechanical strength. By setting the content of polyamide resin (A), halogen-free flame retardant (C), and glass fiber (B) in long parts within specific ranges, it is believed that both excellent mechanical strength and excellent thin-wall flame retardancy can be achieved. Furthermore, long parts are prone to anisotropic shrinkage after manufacture, causing changes in the shape and dimensions of their long sides. However, when a specific amount of glass fiber (B) is contained in a long part, the glass fiber (B) is aligned along the long side direction, suppressing the anisotropic shrinkage that occurs after manufacture. As a result, it is believed that changes in the shape and dimensions of the long part are suppressed, resulting in good dimensional stability.

[0013] The elongated part according to this embodiment is preferably a part having a base and wall portions at both ends of the base. The base may also have pin holes for inserting pins. The elongated part according to this embodiment is preferably an electronic part for DDR (Double Data Rate) and / or PCIe (Peripheral Component Interconnect-express).

[0014] From the viewpoint of suitable use as an electronic component for DDR and / or an electronic component for PCIe, the longest outer dimension of the long component according to this embodiment is preferably 50 mm or more, more preferably 60 mm or more, even more preferably 70 mm or more, still more preferably 80 mm or more, and preferably 200 mm or less, more preferably 180 mm or less, even more preferably 170 mm or less, and still more preferably 150 mm or less. That is, the longest outer dimension of the long component is preferably 50 mm or more and 200 mm or less, more preferably 60 mm or more and 180 mm or less, even more preferably 70 mm or more and 170 mm or less, and still more preferably 80 mm or more and 150 mm or less.

[0015] In order to suitably use the long component according to this embodiment as an electronic component for DDR and / or an electronic component for PCIe, the ratio of the longest outer dimension to the shortest outer dimension (longest outer dimension:shortest outer dimension) is preferably 2:1 to 40:1, more preferably 3:1 to 35:1, even more preferably 5:1 to 35:1, still more preferably 10:1 to 30:1, and even more preferably 20:1 to 30:1.

[0016] Specifically, the long part according to this embodiment is preferably a long part having a shape as shown in Fig. 1. Fig. 1(a) is a front cross-sectional view of the long part, Fig. 1(b) is a side view, Fig. 1(c) is a bottom view, and Fig. 1(d) is an enlarged view of the circled portion in Fig. 1(c). As shown in Fig. 1(a), the long part according to this embodiment is preferably a part having a base and wall portions on both ends of the base. Furthermore, as shown in Figs. 1(c) and 1(d), the long part according to this embodiment is preferably provided with a pin hole in the base that penetrates the base.

[0017] In FIG. 1, X refers to the length of the base and is the longest outer dimension. It is preferable that X falls within the above-mentioned range of the longest outer dimension. In FIG. 1, Y refers to the height of the wall portion. Y is preferably 3 mm or more, more preferably 5 mm or more, even more preferably 10 mm or more, still more preferably 15 mm or more, and is preferably 200 mm or less, more preferably 150 mm or less, even more preferably 80 mm or less, and still more preferably 20 mm or less. In FIG. 1, Z refers to the thickness of the base and is the shortest outer dimension. Z is preferably 2 mm or more, more preferably 3 mm or more, even more preferably 4 mm or more, even more preferably 5 mm or more, and is preferably 200 mm or less, more preferably 150 mm or less, even more preferably 80 mm or less, and still more preferably 20 mm or less.

[0018] The long part as shown in FIG. 1 is preferably a socket used for high-speed communication parts, and is preferably a connector socket for DDR and / or a connector socket for PCIe, and is preferably a connector socket for DDR5.

[0019] <Polyamide resin (A)> The long part according to this embodiment contains a polyamide resin (A), and the content of the polyamide resin (A) in the long part is 30 to 60% by mass. The polyamide resin (A) preferably contains a dicarboxylic acid unit and a diamine unit, from the viewpoint of obtaining a thin, long part that is excellent in mechanical strength, dimensional stability, and flame retardancy.

[0020] (dicarboxylic acid unit) The polyamide resin (A) according to the present embodiment preferably contains a dicarboxylic acid unit. Examples of the dicarboxylic acid unit include aromatic dicarboxylic acid units such as a terephthalic acid unit, a naphthalenedicarboxylic acid unit, an isophthalic acid unit, a 1,4-phenylenedioxydiacetic acid unit, a 1,3-phenylenedioxydiacetic acid unit, a diphenic acid unit, a diphenylmethane-4,4'-dicarboxylic acid unit, a diphenylsulfone-4,4'-dicarboxylic acid unit, and a 4,4'-biphenyldicarboxylic acid unit. Examples of the naphthalenedicarboxylic acid unit include a 2,6-naphthalenedicarboxylic acid unit, a 2,7-naphthalenedicarboxylic acid unit, and a 1,4-naphthalenedicarboxylic acid unit.

[0021] Examples of the dicarboxylic acid unit include units derived from aliphatic dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedicarboxylic acid, dodecanedicarboxylic acid, dimethylmalonic acid, 2,2-diethylsuccinic acid, 2,2-dimethylglutaric acid, 2-methyladipic acid, trimethyladipic acid, and dimer acid; and units derived from alicyclic dicarboxylic acids such as 1,3-cyclopentanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, cycloheptanedicarboxylic acid, cyclooctanedicarboxylic acid, and cyclodecanedicarboxylic acid. The unit derived from these dicarboxylic acids may be of one type only, or may be of two or more types.

[0022] In one aspect of the present invention, from the viewpoint of heat resistance, the polyamide resin (A) contains dicarboxylic acid units, and the dicarboxylic acid units preferably contain 50 to 100 mol% aromatic dicarboxylic acid units relative to 100 mol% of all dicarboxylic acid units. When 50 to 100 mol% of the dicarboxylic acid units are aromatic dicarboxylic acid units, the polyamide resin has excellent heat resistance, and long parts with excellent heat resistance can be obtained. The content of aromatic dicarboxylic acid units relative to 100 mol% of all dicarboxylic acid units in the polyamide resin (A) is more preferably 75 to 100 mol% or more, even more preferably 90 to 100 mol%, and may even be 100 mol%. The aromatic dicarboxylic acid unit is preferably at least one selected from the group consisting of a terephthalic acid unit and a naphthalenedicarboxylic acid unit, and more preferably a terephthalic acid unit. That is, the dicarboxylic acid unit preferably contains 50 to 100 mol %, more preferably 75 to 100 mol %, even more preferably 90 to 100 mol %, or even 100 mol % of a structural unit derived from terephthalic acid.

[0023] (diamine units) The polyamide resin (A) according to the present embodiment preferably contains a diamine unit. The diamine unit may be a linear aliphatic diamine such as ethylenediamine, 1,2-propanediamine, 1,3-propanediamine, 1,4-butanediamine, 1,5-pentanediamine, 1,6-hexanediamine, 1,7-heptanediamine, 1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, or 1,13-tridecanediamine. Derived units: 1-butyl-1,2-ethanediamine, 1,1-dimethyl-1,4-butanediamine, 1-ethyl-1,4-butanediamine, 1,2-dimethyl-1,4-butanediamine, 1,3-dimethyl-1,4-butanediamine, 1,4-dimethyl-1,4-butanediamine, 2,3-dimethyl-1,4-butanediamine, 2-methyl-1,5-pentanediamine, 3-methyl-1,5-pentanediamine, 2,5-dimethyl units derived from branched-chain aliphatic diamines such as 2,4-dimethyl-1,6-hexanediamine, 3,3-dimethyl-1,6-hexanediamine, 2,2-dimethyl-1,6-hexanediamine, 2,2,4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,6-hexanediamine, 2-methyl-1,8-octanediamine, and 5-methyl-1,9-nonanediamine; units derived from alicyclic diamines such as cyclohexanediamine, methylcyclohexanediamine, isophoronediamine, norbornanedimethylamine, and tricyclodecanedimethylamine; and units derived from aromatic diamines such as p-phenylenediamine, m-phenylenediamine, xylylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, and 4,4'-diaminodiphenylether. Only one type of these diamine units may be contained, or two or more types may be contained.

[0024] The polyamide resin (A) according to the present embodiment contains diamine units, and the diamine units preferably contain 50 to 100 mol % aliphatic diamine units having 7 to 18 carbon atoms relative to 100 mol % of all diamine units. When 50 to 100 mol % of the diamine units are aliphatic diamine units having 7 to 18 carbon atoms, the resulting polyamide resin has excellent heat resistance and low water absorption, and long components having excellent heat resistance and low water absorption can be obtained. Furthermore, when the long components are used as electronic components, the occurrence of blisters can be suppressed during the reflow process performed to attach the long components to electronic substrates. The content of the aliphatic diamine units having 7 to 18 carbon atoms relative to 100 mol % of all diamine units in the polyamide resin (A) is more preferably 75 to 100 mol %, even more preferably 90 to 100 mol %, and may even be 100 mol %. Examples of the aliphatic diamine unit having 7 to 18 carbon atoms include the linear aliphatic diamine unit and branched aliphatic diamine unit described above.

[0025] The aliphatic diamine unit having 7 to 18 carbon atoms is preferably at least one selected from the group consisting of a 1,7-heptanediamine unit, a 1,8-octanediamine unit, a 1,9-nonanediamine unit, a 2-methyl-1,8-octanediamine unit, a 1,10-decanediamine unit, and a 1,12-dodecanediamine unit, and more preferably at least one selected from the group consisting of a 1,9-nonanediamine unit, a 2-methyl-1,8-octanediamine unit, and a 1,10-decanediamine unit. When the aliphatic diamine units contain both 1,9-nonanediamine units and 2-methyl-1,8-octanediamine units, the molar ratio of 1,9-nonanediamine units to 2-methyl-1,8-octanediamine units is preferably in the range of 1,9-nonanediamine units / 2-methyl-1,8-octanediamine units=95 / 5 to 5 / 95.

[0026] (aminocarboxylic acid unit and / or lactam unit) The polyamide resin (A) according to the present embodiment may contain an aminocarboxylic acid unit and / or a lactam unit. Examples of the aminocarboxylic acid unit include an 11-aminoundecanoic acid unit and a 12-aminododecanoic acid unit. Only one type of aminocarboxylic acid unit may be contained, or two or more types may be contained. The content of the aminocarboxylic acid unit in the polyamide resin (A) is preferably 50 mol% or less, more preferably 20 mol% or less, and even more preferably 10 mol% or less, relative to 100 mol% of all monomer units constituting the polyamide resin (A).

[0027] Examples of the lactam unit include an ε-caprolactam unit, an enantholactam unit, an undecane lactam unit, a lauryllactam unit, an α-pyrrolidone unit, and an α-piperidone unit. Only one type of lactam unit may be contained, or two or more types may be contained. The content of lactam units in the polyamide is preferably 50 mol% or less, more preferably 20 mol% or less, and even more preferably 10 mol% or less, relative to 100 mol% of all monomer units constituting the polyamide resin (A), and may even be 0 mol%.

[0028] (Type of polyamide resin (A)) In this embodiment, the polyamide resin (A) is preferably a semi-aromatic polyamide resin.

[0029] Representative semi-aromatic polyamides include polynonamethylene terephthalamide (polyamide 9T), poly(2-methyloctamethylene) terephthalamide (polyamide M8T), polynonamethylene terephthalamide / poly(2-methyloctamethylene) terephthalamide copolymer (polyamide 9T / M8T), polynonamethylene naphthalene dicarboxamide (polyamide 9N), polynonamethylene naphthalene dicarboxamide / poly(2-methyloctamethylene) naphthalene dicarboxamide copolymer (polyamide 9N / M8N), polydecamethylene terephthalamide (polyamide 10T), and copolymers of polyamide 10T and polyundecaneamide (polyamide 11) (polyamide 10T / 11), and polydodecamethylene terephthalamide (polyamide 12). Among these, polynonamethylene terephthalamide (polyamide 9T) and polydecamethylene terephthalamide (polyamide 10T) are preferred from the viewpoints of moldability and suppressing the occurrence of blisters in the reflow process.

[0030] (end-capping agent) The polyamide resin (A) according to the present embodiment may have its molecular chain terminals blocked with a terminal blocking agent. The terminal blocking rate of the molecular chain terminals of the polyamide resin (A) is preferably 10% or more, more preferably 30% or more, even more preferably 50% or more, and even more preferably 55% or more, from the viewpoint of obtaining a polyamide composition having excellent melt stability and heat distortion resistance. Furthermore, from the viewpoint of ensuring compatibility with various compounding ingredients such as the glass fiber (B), the terminal blocking rate is preferably 95% or less, more preferably 90% or less, even more preferably 85% or less, and even more preferably 80% or less. The terminal blocking rate can be calculated by measuring the number of carboxy groups, amino groups, and terminal blocking agent-derived structural units that constitute the structural units at the ends of the polyamide molecular chain, and then calculating the rate according to the following formula. 1 It can be determined based on the integral value of the characteristic signal corresponding to each structural unit calculated by H-NMR.

[0031] End sealing rate (%)=[(YZ) / Y]×100

[0032] In the formula, Y represents the total number of molecular chain ends of the polyamide resin (A), and Z represents the total number of carboxy groups and amino groups. The total number of molecular chain ends of the polyamide resin (A), Y, can be calculated, for example, by measuring the molecular weight of the polyamide resin (A) and multiplying the number of molecular chains derived therefrom. Alternatively, it can be calculated as the total number of structural units derived from carboxy groups, amino groups, and end-capping agents.

[0033] As the terminal blocking agent, a monofunctional compound having reactivity with a terminal amino group or a terminal carboxyl group can be used. Specific examples include monocarboxylic acids, acid anhydrides, monoisocyanates, monoacid halides, monoesters, monoalcohols, and monoamines. From the viewpoints of reactivity and the stability of the blocked terminals, monocarboxylic acids are preferred as terminal blocking agents for terminal amino groups, and monoamines are preferred as terminal blocking agents for terminal carboxyl groups. From the viewpoints of ease of handling, monocarboxylic acids are more preferred as terminal blocking agents.

[0034] The monocarboxylic acid used as the terminal blocking agent is not particularly limited as long as it is reactive with an amino group. Examples of the monocarboxylic acid include aliphatic monocarboxylic acids such as acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, and isobutyric acid; alicyclic monocarboxylic acids such as cyclopentanecarboxylic acid and cyclohexanecarboxylic acid; aromatic monocarboxylic acids such as benzoic acid, toluic acid, α-naphthalenecarboxylic acid, β-naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, and phenylacetic acid; and mixtures thereof. Among these, at least one selected from acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, and benzoic acid is preferred in terms of reactivity, stability of the blocked terminal, cost, and the like.

[0035] The monoamine used as the terminal blocking agent is not particularly limited as long as it is reactive with a carboxyl group. Examples of the monoamine include aliphatic monoamines such as methylamine, ethylamine, propylamine, butylamine, hexylamine, octylamine, decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine, and dibutylamine; alicyclic monoamines such as cyclohexylamine and dicyclohexylamine; aromatic monoamines such as aniline, toluidine, diphenylamine, and naphthylamine; and mixtures thereof. Among these, at least one selected from butylamine, hexylamine, octylamine, decylamine, stearylamine, cyclohexylamine, and aniline is preferred from the viewpoints of reactivity, high boiling point, stability of the blocked terminal, and cost.

[0036] In the polyamide resin (A) according to the present embodiment, the combined content of the dicarboxylic acid units, diamine units, and end-capping agent units relative to 100 mol% of all monomer units is preferably 80 to 100 mol%, more preferably 85 to 100 mol%, even more preferably 95 to 100 mol%, and still more preferably 98 to 100 mol%, from the viewpoint of heat resistance.

[0037] (Polyamide resin (A) content) The content of the polyamide resin (A) in the long part according to this embodiment is 30 to 60 mass %. When the content of polyamide resin (A) in the long part is 30 mass% or more, the resin composition (composition containing polyamide resin (A), glass fiber (B), and halogen-free flame retardant (C)) has good fluidity when producing the long part. When the resin composition has good fluidity, it is possible to suppress the occurrence of defective products caused by insufficient filling when producing a large number of long parts at once by injection molding or the like. Furthermore, by making the content of polyamide resin (A) in the long part 60% by mass or less, it is possible to obtain a long part having excellent mechanical strength, and also to suppress changes in shape and dimension of the long part after production, thereby obtaining a long part having excellent dimensional stability. The content of polyamide resin (A) in the long part is preferably 35% by mass or more, more preferably 38% by mass or more, and even more preferably 40% by mass or more from the viewpoint of fluidity of the resin composition, and is preferably 57% by mass or less, more preferably 55% by mass or less, and even more preferably 53% by mass or less from the viewpoint of suppressing shape and dimensional changes after production and obtaining a long part with excellent dimensional stability. That is, the content of polyamide resin (A) in the long part is preferably 35 to 57% by mass, more preferably 38 to 55% by mass, and even more preferably 40 to 53% by mass.

[0038] (Melting point of polyamide resin (A)) The melting point of the polyamide resin (A) according to the present embodiment is preferably 270°C or higher, more preferably 280°C or higher, even more preferably 290°C or higher, and even more preferably 300°C or higher, from the viewpoint of obtaining long parts with excellent heat resistance, and may be 350°C or lower or 330°C or lower from the viewpoint of moldability. When long components are used as electronic components, the higher the melting point of the polyamide resin (A), the less likely blisters will occur during the reflow process performed to attach the long components to an electronic substrate. The reflow process is usually performed at 260°C or higher, and the greater the difference between the temperature of the reflow process and the melting point of the polyamide resin (A), the more likely it is that thermal deformation of the long components will be suppressed, making blisters less likely to occur, which is preferable.

[0039] (Method for producing polyamide resin (A)) The polyamide resin (A) can be produced by any known method for producing polyamide resins, such as a solution polymerization method or an interfacial polymerization method using dicarboxylic acid and diamine in the form of acid chloride as raw materials, a melt polymerization method, a solid-state polymerization method, or a melt extrusion polymerization method using dicarboxylic acid and diamine as raw materials.

[0040] Catalysts that can be used in producing the polyamide resin (A) include, for example, phosphoric acid, phosphorous acid, hypophosphorous acid, and salts or esters thereof. Examples of the salts or esters include salts of phosphoric acid, phosphorous acid, or hypophosphorous acid with metals such as potassium, sodium, magnesium, vanadium, calcium, zinc, cobalt, manganese, tin, tungsten, germanium, titanium, and antimony; ammonium salts of phosphoric acid, phosphorous acid, or hypophosphorous acid; and ethyl esters, isopropyl esters, butyl esters, hexyl esters, isodecyl esters, octadecyl esters, decyl esters, stearyl esters, and phenyl esters of phosphoric acid, phosphorous acid, or hypophosphorous acid. Among these, sodium hypophosphite monohydrate and phosphorous acid are preferred.

[0041] <Glass fiber (B)> The long part according to this embodiment contains glass fibers (B), and the content of the glass fibers (B) in the long part is 35 to 55 mass %. The glass fiber (B) according to this embodiment is not particularly limited, and known glass fibers can be used as long as the effects of the present invention are not impaired. The glass fiber (B) may be used alone or in combination of two or more types.

[0042] The glass fiber (B) according to this embodiment may contain at least one surface treatment agent selected from the group consisting of coupling agents and sizing agents. Examples of the coupling agent include silane coupling agents and titanium coupling agents, such as γ-methacryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-aminopropyltriethoxysilane. Examples of sizing agents include urethane resin-based sizing agents, acrylic resin-based sizing agents, epoxy resin-based sizing agents, and acid anhydride group-containing resin-based sizing agents. However, when a urethane resin-based sizing agent, an acrylic resin-based sizing agent, or an epoxy resin-based sizing agent contains an acid anhydride group, it is considered to belong to the category of acid anhydride group-containing resin-based sizing agents. An acid anhydride group-containing resin-based sizing agent is composed of a resin containing at least an acid anhydride group, and is preferably composed of a copolymer containing an acid anhydride group.

[0043] The content of the glass fiber (B) in the long part according to this embodiment is 35 to 55 mass %. By making the content of glass fiber (B) in the long part 35% by mass or more, it is possible to obtain a long part having excellent mechanical strength, and also to suppress changes in shape and dimension of the long part after production, thereby obtaining a long part having excellent dimensional stability. Furthermore, by setting the content of glass fiber (B) in the long part to 55 mass% or less, the flowability of the resin composition (a composition containing polyamide resin (A), glass fiber (B), and halogen-free flame retardant (C)) during production is improved. When the resin composition has good flowability, it is possible to suppress the occurrence of defective products caused by insufficient filling when a large number of long parts are produced at once by injection molding or the like. The content of glass fiber (B) in the long part is preferably 36% by mass or more, more preferably 37% by mass or more, and even more preferably 38% by mass or more from the viewpoint of suppressing warpage and obtaining a long part with excellent dimensional stability, and is preferably 50% by mass or less, more preferably 47% by mass or less, and even more preferably 45% by mass or less from the viewpoint of the flowability of the resin composition. That is, the content of glass fiber (B) in the long part is preferably 36 to 50% by mass, more preferably 37 to 47% by mass, and even more preferably 38 to 45% by mass.

[0044] <Halogen-free flame retardant (C)> The long part according to this embodiment contains a halogen-free flame retardant (C), and the content of the halogen-free flame retardant (C) in the long part is 5 to 20 mass %. The halogen-free flame retardant (C) according to this embodiment is not particularly limited, and known compounds that do not contain halogen elements can be used as long as the effects of the present invention are not impaired. From the viewpoint of thin-wall flame retardancy, phosphorus-based flame retardants containing phosphorus are preferred as the halogen-free flame retardant (C). Examples of phosphorus-based flame retardants include red phosphorus-based flame retardants, phosphate ester-based flame retardants, phosphoric acid amide-based flame retardants, (poly)phosphate-based flame retardants, phosphazene-based flame retardants, and phosphine-based flame retardants. Among these, phosphine-based flame retardants are preferred.

[0045] Examples of phosphine-based flame retardants include monophosphinates and diphosphinates (hereinafter, both may be collectively referred to as "phosphinates"). These may be used alone or in combination of two or more.

[0046] The monophosphinate salt includes, for example, a compound represented by the following general formula (1). [ka]

[0047] An example of the diphosphinate salt is a compound represented by the following general formula (2). [ka]

[0048] In general formulas (1) and (2), R 1 , R 2 , R 3 and R 4 R each independently represents an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an arylalkyl group having 7 to 20 carbon atoms. 5represents an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 10 carbon atoms, an alkylarylene group having 7 to 20 carbon atoms, or an arylalkylene group having 7 to 20 carbon atoms. M represents calcium, magnesium, aluminum, or zinc. m is 2 or 3, n is 1 or 3, and x is 1 or 2. In general formula (2), the value of 2×n and the value of the product of m and x are usually equal to each other.

[0049] The alkyl group may be a linear or branched saturated aliphatic group, and the aryl group may be unsubstituted or substituted with various substituents, such as a phenyl group, a benzyl group, an o-toluyl group, or a 2,3-xylyl group.

[0050] The above-mentioned phosphinate salts can be produced in an aqueous solution using phosphinic acid and a metal component such as a metal carbonate, metal hydroxide, or metal oxide, as described in European Patent Application Publication No. 699708 and Japanese Patent Laid-Open No. 8-73720. These are usually monomeric compounds, but depending on the reaction conditions and environment, they may contain polymeric phosphinate salts with a condensation degree of 1 to 3.

[0051] Examples of monophosphinic acids and diphosphinic acids that constitute the phosphinic acid salt include dimethylphosphinic acid, ethylmethylphosphinic acid, diethylphosphinic acid, methyl-n-propylphosphinic acid, methanedi(methylphosphinic acid), benzene-1,4-di(methylphosphinic acid), methylphenylphosphinic acid, and diphenylphosphinic acid.

[0052] Examples of metal components constituting the phosphinate include calcium ions, magnesium ions, aluminum ions, and zinc ions.

[0053] Specific examples of phosphinates include calcium dimethylphosphinate, magnesium dimethylphosphinate, aluminum dimethylphosphinate, zinc dimethylphosphinate, calcium ethylmethylphosphinate, magnesium ethylmethylphosphinate, aluminum ethylmethylphosphinate, zinc ethylmethylphosphinate, calcium diethylphosphinate, magnesium diethylphosphinate, aluminum diethylphosphinate, zinc diethylphosphinate, calcium methyl-n-propylphosphinate, magnesium methyl-n-propylphosphinate, aluminum methyl-n-propylphosphinate, zinc methyl-n-propylphosphinate, calcium methylenebis(methylphosphinate), and Examples thereof include magnesium phenylene-1,4-bis(methylphosphinate), aluminum methylene-bis(methylphosphinate), zinc methylene-bis(methylphosphinate), calcium phenylene-1,4-bis(methylphosphinate), magnesium phenylene-1,4-bis(methylphosphinate), aluminum phenylene-1,4-bis(methylphosphinate), zinc phenylene-1,4-bis(methylphosphinate), calcium methylphenylphosphinate, magnesium methylphenylphosphinate, aluminum methylphenylphosphinate, zinc methylphenylphosphinate, calcium diphenylphosphinate, magnesium diphenylphosphinate, aluminum diphenylphosphinate, and zinc diphenylphosphinate.

[0054] Among these, calcium dimethylphosphinate, aluminum dimethylphosphinate, zinc dimethylphosphinate, calcium ethylmethylphosphinate, aluminum ethylmethylphosphinate, zinc ethylmethylphosphinate, calcium diethylphosphinate, aluminum diethylphosphinate, and zinc diethylphosphinate are preferred from the viewpoints of thin-wall flame retardancy and easy availability of the phosphinate. One of these phosphinates may be used alone, or two or more of them may be used in combination.

[0055] As the phosphinate, in terms of mechanical strength and the appearance of the long part, it is preferable to use a powder of the phosphinate that has been pulverized so that the average particle size of the phosphinate is 100 μm or less, and it is more preferable to use a powder that has been pulverized so that the average particle size is 50 μm or less.

[0056] The phosphinate does not necessarily have to be completely pure, and may contain unreacted substances or by-products to the extent that the effects of the present invention are not impaired.

[0057] The content of the halogen-free flame retardant (C) in the long part according to this embodiment is 5 to 20 mass %. When the content of the halogen-free flame retardant (C) in the long part is 5 mass % or more, the thin-wall flame retardancy is good. Furthermore, by keeping the content of the halogen-free flame retardant (C) in the long part at 20 mass% or less, the decomposition of the resin component promoted by the decomposed halogen-free flame retardant (C) can be suppressed, resulting in good production stability. The content of the halogen-free flame retardant (C) in the long part is preferably 6% by mass or more, more preferably 7% by mass or more, and even more preferably 8% by mass or more from the viewpoint of thin-wall flame retardancy, and is preferably 19% by mass or less, more preferably 18% by mass or less, and even more preferably 17% by mass or less from the viewpoint of production stability. That is, the content of the halogen-free flame retardant (C) in the long part is preferably 6 to 19% by mass, more preferably 7 to 18% by mass, and even more preferably 8 to 17% by mass.

[0058] <Metal soap (D)> The long part according to this embodiment may contain a metal soap (D). When the resin composition (composition containing polyamide resin (A), glass fiber (B), and halogen-free flame retardant (C)) constituting the long part contains metal soap (D), the metal soap (D) penetrates into the polyamide resin (A), thereby reducing adhesion of polyamide chains and improving slipperiness and fluidity between the resin composition and the molding machine. If the resin composition has good slipperiness and fluidity, it is possible to reduce the occurrence of defective products caused by insufficient filling when manufacturing a large number of long parts at once by injection molding or the like.

[0059] Examples of the metal soap (D) include metal salts of fatty acids having 10 to 28 carbon atoms. Examples include zinc stearate, zinc laurate, zinc octanoate, zinc behenate, zinc montanate, zinc melissate, calcium laurate, barium laurate, lithium laurate, cobalt stearate, potassium stearate, lithium stearate, barium stearate, calcium stearate, magnesium stearate, aluminum stearate, sodium stearate, nickel stearate, lead stearate, copper(II) stearate, calcium behenate, zinc behenate, magnesium behenate, lithium behenate, sodium behenate, silver behenate, calcium montanate, magnesium montanate, aluminum montanate, lithium montanate, and sodium montanate. Among these, calcium stearate, magnesium stearate, and zinc stearate are preferred, and calcium stearate is more preferred, from the viewpoint of the fluidity of the resin composition.

[0060] The content of the metal soap (D) in the long part is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and even more preferably 0.1% by mass or more, from the viewpoint of suppressing the occurrence of defective products due to insufficient filling, and is preferably 5% by mass or less, more preferably 2% by mass or less, and even more preferably 1% by mass or less, from the viewpoint of obtaining long parts excellent in mechanical strength and dimensional stability. That is, the content of the halogen-free flame retardant (C) in the long part is preferably 0.01 to 5% by mass, more preferably 0.05 to 2% by mass, and even more preferably 0.1 to 1% by mass.

[0061] <Fatty acid amide (E)> The elongated part according to this embodiment may contain a fatty acid amide (E). When the resin composition (composition containing polyamide resin (A), glass fiber (B), and halogen-free flame retardant (C)) constituting the long part contains fatty acid amide (E), the fatty acid amide (E) penetrates into the polyamide resin (A), thereby reducing adhesion of polyamide chains and improving slipperiness and fluidity between the resin composition and the molding machine. If the resin composition has good slipperiness and fluidity, it is possible to reduce the occurrence of defective products caused by insufficient filling when manufacturing a large number of long parts at once by injection molding or the like.

[0062] Examples of the fatty acid amide (E) include saturated fatty acid amides, unsaturated fatty acid amides, saturated fatty acid bisamides, and unsaturated fatty acid bisamides. Examples of saturated fatty acid amides include palmitic acid amide, stearic acid amide, and behenic acid amide. Examples of the unsaturated fatty acid amide include oleic acid amide and erucic acid amide. Examples of saturated fatty acid bisamides include ethylene bispalmitic acid amide, ethylene bisstearic acid amide, and hexamethylene bisstearic acid amide. Examples of unsaturated fatty acid bisamides include ethylene bisoleic acid amide, hexamethylene bisoleic acid amide, and N,N'-dioleylsebacic acid amide. Among these, saturated fatty acid bisamides are preferred, and ethylene bisstearic acid amide is more preferred, from the viewpoint of the fluidity of the resin composition.

[0063] The content of the fatty acid amide (E) in the long part is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and even more preferably 0.1% by mass or more, from the viewpoint of suppressing the occurrence of defective products due to insufficient filling, and is preferably 5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less, from the viewpoint of obtaining long parts excellent in mechanical strength and dimensional stability. That is, the content of the halogen-free flame retardant (C) in the long part is preferably 0.01 to 5% by mass, more preferably 0.05 to 4% by mass, and even more preferably 0.1 to 3% by mass.

[0064] The long part according to this embodiment may contain a metal soap (D) and / or a fatty acid amide (E). The long part according to this embodiment may contain a metal soap (D) and a fatty acid amide (E). In this case, the preferred contents of the metal soap (D) and the fatty acid amide (E) in the long part are the same as those described above.

[0065] <Other ingredients> The long part according to this embodiment may contain other components as needed in addition to the above-mentioned polyamide resin (A), glass fiber (B1), and halogen-free flame retardant (C), as well as the metal soap (D) and / or fatty acid amide (E) used as needed.

[0066] Examples of other components include stabilizers such as copper compounds; antioxidants such as hindered phenol antioxidants, hindered amine antioxidants, phosphorus-based antioxidants, and thio-based antioxidants; colorants; ultraviolet absorbers; light stabilizers; antistatic agents; heat stabilizers; crystal nucleating agents; plasticizers; lubricants; mold release agents; glidants; dispersants; oxygen absorbers; hydrogen sulfide adsorbents; crystallization retarders; impact modifiers such as α-olefin copolymers and rubber; anti-drip agents such as fluororesins, and flame retardant aids.

[0067] The content of the above other components is not particularly limited as long as it does not impair the effects of the present invention, but is preferably 0.001 to 10 mass %, more preferably 0.01 to 5 mass %, and even more preferably 0.1 to 1 mass % of the long part.

[0068] In the long part according to this embodiment, the total content of the polyamide resin (A), the glass fiber (B), and the halogen-free flame retardant (C) is preferably 60% by mass or more, more preferably 80% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more, and may be 100% by mass.

[0069] <Manufacturing method for long parts> There are no particular limitations on the manufacturing method of the long parts. Examples of methods for producing long parts include a method in which a polyamide resin (A), glass fiber (B), a halogen-free flame retardant (C), and optionally a metal soap (D), a fatty acid amide (E), and other components are uniformly mixed to produce a resin composition, and the resin composition is then molded. The preferred mixing method is melt-kneading using a single-screw extruder, twin-screw extruder, kneader, Banbury mixer, etc. The melt-kneading conditions are not particularly limited, but examples include melt-kneading for about 1 to 30 minutes at a temperature range about 10 to 50°C higher than the melting point of the polyamide resin (A). As the molding method, extrusion molding and injection molding are preferred, and injection molding is preferred from the viewpoint that molded articles of various shapes can be produced.

[0070] [Use of long parts] The long component according to this embodiment can be suitably used as a long electronic component. The long component according to this embodiment is preferably an electronic component for DDR and / or an electronic component for PCIe, and more preferably an electronic component for DDR5. Examples of the electronic components include connector sockets and floating connectors. The long part according to this embodiment is preferably a socket used in high-speed communication parts, and is preferably a connector socket for DDR and / or a connector for PCIe, and more preferably a connector socket for DDR5. [Example]

[0071] The present invention will be specifically explained below with reference to examples and comparative examples, but the present invention is not limited to these.

[0072] Measurements and evaluations in the Production Examples, Examples, and Comparative Examples were carried out according to the methods shown below.

[0073] Melting point The melting point of the polyamide resin (A) obtained in the production examples was measured in accordance with ISO 11357-3 (2011, 2nd edition) using a differential scanning calorimeter "DSC7020" manufactured by Hitachi High-Tech Science Corporation. Specifically, in a nitrogen atmosphere, a sample (polyamide resin (A)) was heated from 30°C to 300°C at a rate of 10°C / min, held at 300°C for 5 minutes to completely melt the sample, then cooled to 50°C at a rate of 10°C / min and held at 50°C for 5 minutes. The peak temperature of the melting peak that appeared when the sample was again heated to 300°C at a rate of 10°C / min was taken as the melting point (°C). If there were multiple melting peaks, the peak temperature of the highest melting peak was taken as the melting point (°C).

[0074] Mechanical strength A jig was hooked onto the end (latch portion) of the long part obtained in the examples and comparative examples (see Figure 2, one jig was hooked onto one location on the long part), and the jig was pulled upward at a speed of 25 mm / min (tensile test). Note that the jig was pulled in the direction of the arrow in Figure 2(a). At this time, the strength required for the long part to break (mechanical strength of the end of the long part) was measured, and this was taken as the mechanical strength of the long part.

[0075] Warpage (dimensional stability) The long parts obtained in the examples and comparative examples were left standing in a constant temperature and humidity chamber at 23°C and 50% RH for 24 hours, and then the amount of warping (dimensional change) of the long parts was measured. Specifically, the long part shown in Figure 1(a) was placed on the surface of a horizontal glass plate so that at least a portion of the bottom surface of the long part was in contact with the surface, and the distance from the surface of the glass plate to the bottom surface of the long part was measured with a dial gauge. The longest distance among the measured distances was taken as the amount of warping. It can be said that the smaller the amount of warpage, the better the dimensional stability of the long part.

[0076] Flame retardant (Preparation of test specimens for flame retardancy evaluation) Using an injection molding machine "UH-1000" (clamping force: 80 tons, screw diameter: φ26 mm) manufactured by Nissei Plastic Industrial Co., Ltd., the pellet-shaped resin compositions obtained in the Examples or Comparative Examples were injection molded using a T-runner mold under conditions of a cylinder temperature 20 to 30°C higher than the melting point of the polyamide resin (A) and a mold temperature of 140°C, to obtain molded articles having a thickness of 0.40 mm, a width of 13 mm, and a length of 125 mm. The obtained molded articles were polished on both sides to a thickness of 0.2 mm to prepare test specimens for evaluating flame retardancy.

[0077] (Flame retardancy test according to UL94 standard) The upper end of the test specimen was clamped to hold it vertically, and a specified flame (a blue flame 20±1 mm high) was applied to the lower end for 10 seconds, then released, and the burning time of the test specimen (first time) was measured. Immediately after the flame was extinguished, the specified flame was again applied to the lower end for 10 seconds, then released, and the burning time of the test specimen (second time) was measured. The same measurement was repeated for five specimens, obtaining a total of 10 data points: five for the first burning time and five for the second burning time. In addition, any molten material was visually confirmed during the flame exposure. From the obtained results, the flame retardancy was evaluated according to the following evaluation criteria: In the following evaluation criteria, T represents the total value of 10 data points, and M represents the maximum value of the 10 data points. V-0: T was less than 50 seconds and M was less than 10 seconds, the flame did not reach the clamp, and the flaming molten material did not fall and ignite the dry cotton placed 12 inches below. V-1: T was 250 seconds or less and M was 30 seconds or less, and all other conditions were the same as V-0. V-2: T was less than 250 seconds and M was less than 30 seconds, the flame did not rise to the clamp, and the flaming molten material fell and ignited dry cotton set 12 inches below. Out of Judgment: The result was inferior to the above evaluation standard "V-2".

[0078] Manufacturing stability (fluidity) In Examples 1 to 4 and Comparative Examples 1 and 2, long parts were manufactured under the same conditions as above except that a mold capable of manufacturing four long parts at a time was used as the injection molding machine mold and the maximum filling pressure of the injection molding machine was set to 200 MPa, and the manufacturing stability was evaluated according to the following criteria. G: No defective products were produced due to insufficient filling of the resin composition into the mold (all four long parts obtained had the specified shape and no chipping or other defects were observed). NG: Defective products were produced due to insufficient filling of the resin composition into the mold (at least one of the four long parts obtained did not have a specific shape and had chips or other defects).

[0079] <Production Example 1> (Preparation of Polyamide A-1) 7882.0 g of terephthalic acid, 7742.9 g of a diamine mixture of 1,9-nonanediamine and 2-methyl-1,8-octanediamine in an 85:15 molar ratio, 280.8 g of benzoic acid as an end-capping agent, 16.0 g of sodium hypophosphite monohydrate, and 4 L of distilled water were placed in a 40 L autoclave and purged with nitrogen. The internal temperature was raised to 200°C over 2 hours. The autoclave pressure was then increased to 2 MPa. The internal temperature was then maintained at 215°C, and the reaction was continued for 2 hours while gradually releasing water vapor to maintain the pressure at 2 MPa. The pressure was then reduced to 1.2 MPa over 30 minutes, yielding a prepolymer. This prepolymer was crushed to a size of 6 mm or less and dried at 120°C under reduced pressure for 12 hours. This was subjected to solid-state polymerization for 10 hours under conditions of a temperature of 230°C and a pressure of 13.3 Pa to obtain polyamide resin (A-1) (polyamide 9T). The melting point of the polyamide resin (A-1) was 306°C.

[0080] <Production Example 2> (Preparation of Polyamide A-2) 7558.1 g of terephthalic acid, 8082.2 g of 1,10-decanediamine, 343.7 g of benzoic acid as an end-capping agent, 16.0 g of sodium hypophosphite monohydrate, and 4 L of distilled water were placed in a 40 L autoclave and purged with nitrogen. The internal temperature was raised to 200°C over 2 hours. The autoclave pressure was then raised to 2 MPa. The internal temperature was then maintained at 215°C, and the reaction was continued for 2 hours while gradually releasing water vapor to maintain the pressure at 2 MPa. The pressure was then reduced to 1.2 MPa over 30 minutes to obtain a prepolymer. This prepolymer was crushed to a size of 6 mm or less and dried at 120°C under reduced pressure for 12 hours. This was then solid-state polymerized for 10 hours at 230°C and a pressure of 13.3 Pa to obtain polyamide resin (A-2) (Polyamide 10T). The melting point of the polyamide resin (A-2) was 317°C.

[0081] <Examples 1 to 4 and Comparative Examples 1 and 2> Polyamide resin (A), halogen-free flame retardant (C), metal soap (D), and fatty acid amide (E) were fed into the upstream hopper of a twin-screw extruder (twin-screw extruder "BTN-32" manufactured by Plastics Technology Research Institute Co., Ltd., screw diameter φ30 mm, L / D=32, rotation speed 150 rpm, output rate 10 kg / h) in the proportions shown in Table 1, and glass fiber (B) in the amount shown in Table 1 was fed into the downstream side feed port. The mixture was melt-kneaded and extruded at a cylinder temperature of 320°C, followed by cooling and cutting to obtain a pellet-shaped resin composition. Next, using an injection molding machine "SE-100EVA" (mold clamping force: 100 tons, screw diameter: φ32 mm) manufactured by Sumitomo Heavy Industries, Ltd., the obtained pelletized resin composition was molded into a long part having a shape as shown in Figure 1 under conditions of a cylinder temperature 20°C higher than the melting point of polyamide resin (A) and a mold temperature of 140°C. In Figure 1, the longest outer dimension X is 141 mm, Y is 16 mm, and the shortest outer dimension Z is 6 mm. The measurement and evaluation results for the resin composition and the long part are shown in Table 1.

[0082] The components shown in Table 1 are as follows: (Polyamide resin (A)) A-1: Polyamide resin (A-1) obtained in Production Example 1 A-2: Polyamide resin (A-2) obtained in Production Example 2

[0083] (Glass fiber (B)) Nitto Boseki Co., Ltd. "CS-3J256S", cross-sectional shape: circular, catalog values: average fiber length 3 mm, average fiber diameter 11 μm

[0084] (Halogen-free flame retardant (C)) Phosphinic acid metal salt flame retardant (aluminum diethylphosphinate), Clariant Chemicals' Exolit® OP1230

[0085] (Metal soap (D)) Calcium stearate, manufactured by NOF Corporation

[0086] (Fatty acid amide (E)) Ethylene bisstearic acid amide: NOF Corporation "Alflo H-50L"

[0087] [Table 1]

[0088] As is clear from Table 1, the long parts according to the examples are excellent in mechanical strength, thin-wall flame retardancy, and dimensional stability, while the long parts according to the comparative examples are inferior in at least one of mechanical strength and thin-wall flame retardancy.

Claims

1. A flame retardant according to claim 1, further comprising: a polyamide resin (A), a glass fiber (B), and a halogen-free flame retardant (C); The content of the polyamide resin (A) is 30 to 60% by mass, The content of the glass fiber (B) is 35 to 55 mass %, The content of the halogen-free flame retardant (C) is 5 to 20 mass %.

2. 2. The long part according to claim 1, wherein the longest outer dimension is 50 mm or more and 200 mm or less.

3. The long part according to claim 1, wherein the polyamide resin (A) has a melting point of 270°C or higher.

4. The polyamide resin (A) contains a dicarboxylic acid unit and a diamine unit, The long part according to claim 1, wherein the diamine units contain 50 to 100 mol % of aliphatic diamine units having 7 to 18 carbon atoms relative to 100 mol % of all diamine units.

5. The elongated part according to claim 1 , comprising a metal soap (D).

6. The elongated part according to claim 5, wherein the metal soap (D) is calcium stearate.

7. The elongated part according to claim 1 , comprising a fatty acid amide (E).

8. The long part according to claim 7, wherein the fatty acid amide (E) is ethylene bisstearic acid amide.

9. The long part according to any one of claims 1 to 8, which is an electronic part for DDR and / or an electronic part for PCIe.

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