Substrate processing device and method for detecting abnormality of seal member in substrate processing device

Abstract

To properly detect abnormality of a seal member.SOLUTION: A substrate processing device includes a processing container, a seal member, an illumination part, and an imaging part. The processing container includes a first member and a second member capable of being joined to each other and moves the second member to join it to the first member, to form a processing space for processing a substrate inside. The seal member is provided in one of the first member and the second member and comes into contact with the other of the first member and the second member when the first member and the second member are joined. The illumination part irradiates the seal member in one of the first member and the second member with light in such a state that the first member and the second member are separated. The imaging part images the seal member irradiated with the light from the illumination part.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus and a method for detecting an abnormality in a sealing member in the substrate processing apparatus. [Background technology]

[0002] BACKGROUND ART Conventionally, in substrate processing apparatuses that perform supercritical drying processing to dry substrates using a supercritical fluid, a seal member is used to ensure airtightness inside a processing vessel (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-131729 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can appropriately detect an abnormality in a sealing member. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a processing vessel, a seal member, an illumination unit, and an imaging unit. The processing vessel has a first member and a second member that can be coupled to each other, and a processing space for processing a substrate is formed therein by moving the second member and coupling it to the first member. The seal member is provided on one of the first member and the second member and contacts the other of the first member and the second member when the first member and the second member are coupled. The illumination unit irradiates light onto the seal member on one of the first member and the second member when the first member and the second member are separated. The imaging unit captures an image of the seal member irradiated with light from the illumination unit. [Effects of the Invention]

[0006] According to the present disclosure, an abnormality in a sealing member can be appropriately detected. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a diagram showing the configuration of a substrate processing system according to the first embodiment. [Figure 2] FIG. 2 is a diagram showing the configuration of the liquid processing unit according to the first embodiment. [Figure 3] FIG. 3 is an external perspective view showing the configuration of the dry processing unit according to the first embodiment. [Figure 4] FIG. 4 is a cross-sectional view showing the configuration of the dry processing unit according to the first embodiment. [Figure 5] FIG. 5 is a cross-sectional view showing the configuration of the dry processing unit according to the first embodiment. [Figure 6] FIG. 6 is a side view showing the configuration of the lid body in the dry processing unit. [Figure 7] FIG. 7 is a block diagram showing the configuration of the control device according to the first embodiment. [Figure 8] FIG. 8 is a diagram for explaining an example of the abnormality detection process according to the first embodiment. [Figure 9] FIG. 9 is a flowchart showing a procedure for substrate processing executed by the substrate processing system according to the first embodiment. [Figure 10] FIG. 10 is a flowchart showing an example of a specific procedure for the seal member abnormality detection process according to the first embodiment. [Figure 11] FIG. 11 is a cross-sectional view showing the configuration of the dry processing unit according to the second embodiment. [Figure 12] FIG. 12 is a block diagram showing the configuration of the control device according to the second embodiment. [Figure 13] FIG. 13 is a flowchart showing an example of a specific procedure for the seal member abnormality detection process according to the second embodiment. [Figure 14] FIG. 14 is a cross-sectional view showing the configuration of the dry processing unit according to the third embodiment. [Figure 15]FIG. 15 is a cross-sectional view showing an example of a state in which wafers are accommodated inside a processing container of a dry processing unit. [Figure 16] FIG. 16 is a schematic diagram showing a configuration example of an ozone water treatment unit according to the fourth embodiment. [Figure 17] FIG. 17 is a view showing a state in which the treatment container of the ozone water treatment unit according to the fourth embodiment is separated. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, a substrate processing apparatus and a method for detecting an abnormality in a sealing member in a substrate processing apparatus according to the present disclosure (hereinafter referred to as an "embodiment") will be described in detail with reference to the drawings. Note that the present disclosure is not limited to the embodiment. Furthermore, each embodiment can be appropriately combined within a range that does not cause contradiction in the processing content. Furthermore, the same parts in each of the following embodiments are given the same reference numerals, and duplicated explanations will be omitted.

[0009] In addition, for ease of understanding, the drawings referred to below may show an orthogonal coordinate system in which the X-axis, Y-axis, and Z-axis directions are defined as being orthogonal to each other, with the positive Z-axis direction being the vertically upward direction. Also, the direction of rotation around the vertical axis may be referred to as the θ direction.

[0010] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to manufacturing precision, installation precision, etc.

[0011] (First embodiment) <Configuration of substrate processing system> First, the configuration of a substrate processing system according to a first embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing the configuration of a substrate processing system according to a first embodiment.

[0012] 1, the substrate processing system 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are provided adjacent to each other.

[0013] The carry-in / out station 2 includes a carrier placement section 11 and a transport section 12. A plurality of carriers C are placed on the carrier placement section 11, each of which accommodates a plurality of semiconductor wafers (hereinafter referred to as "wafers W") in a horizontal position.

[0014] The transport section 12 is provided adjacent to the carrier placement section 11. Inside the transport section 12, a transport device 13 and a delivery section 14 are arranged.

[0015] The transfer device 13 includes a wafer holding mechanism that holds the wafer W. The transfer device 13 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the carrier C and the delivery section 14 using the wafer holding mechanism.

[0016] The processing station 3 is provided adjacent to the transport section 12. The processing station 3 includes a transport block 4 and a plurality of processing blocks 5 (two in this example).

[0017] The transfer block 4 includes a transfer area 15 and a transfer device 16. The transfer area 15 is, for example, a rectangular parallelepiped region extending along the arrangement direction (X-axis direction) of the loading / unloading station 2 and the processing station 3. The transfer area 15 has the transfer device 16 (an example of a substrate transfer device) disposed therein.

[0018] The transfer device 16 includes a wafer holding mechanism that holds the wafer W. The transfer device 16 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the delivery section 14 and the plurality of processing blocks 5 using the wafer holding mechanism.

[0019] The processing blocks 5 are arranged adjacent to the transfer area 15 on both sides of the transfer area 15. Specifically, the processing blocks 5 are arranged on one side (positive Y-axis direction side) and the other side (negative Y-axis direction side) of the transfer area 15 in a direction (Y-axis direction) perpendicular to the arrangement direction (X-axis direction) of the loading / unloading stations 2 and processing stations 3.

[0020] Each processing block 5 includes a liquid processing unit 17, a drying processing unit 18 (an example of a substrate processing apparatus), and a supply unit 19.

[0021] Liquid processing unit 17 performs a cleaning process to clean the upper surface, which is the pattern-formed surface, of wafer W. Liquid processing unit 17 also performs a liquid film forming process to form a liquid film on the surface (upper surface) of wafer W after the cleaning process. The configuration of liquid processing unit 17 will be described later.

[0022] The drying processing unit 18 performs a supercritical drying process on the wafer W after the liquid film formation process. Specifically, the drying processing unit 18 dries the wafer W by bringing the wafer W after the liquid film formation process into contact with a processing fluid in a supercritical state.

[0023] The dry processing unit 18 includes a processing area 181 where supercritical drying processing is performed, and a delivery area 182 where the wafer W is transferred between the transfer block 4 and the processing area 181. The processing area 181 and the delivery area 182 are arranged along the transfer area 15. The specific configuration of the dry processing unit 18 will be described later.

[0024] The supply unit 19 supplies a processing fluid to the drying processing unit 18. Specifically, the supply unit 19 includes a group of supply devices including a flow meter, a flow regulator, a back pressure valve, a heater, etc., and a housing that houses the group of supply devices. In the first embodiment, the supply unit 19 supplies CO2 as a processing fluid to the drying processing unit 18.

[0025] The substrate processing system 1 includes a control device 6. The control device 6 is, for example, a computer, and includes a control unit 61 and a storage unit 62.

[0026] Control unit 61 includes various circuits and a microcomputer having a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), input / output ports, etc. The CPU of the microcomputer reads and executes programs stored in the ROM to control the operations of transport device 16, liquid processing unit 17, drying processing unit 18, etc.

[0027] Such a program may be recorded on a computer-readable recording medium and installed from that recording medium into the storage unit 62 of the control device 6. Examples of computer-readable recording media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

[0028] The storage unit 62 is realized by, for example, a semiconductor memory element such as a RAM or a flash memory, or a storage device such as a hard disk or an optical disk.

[0029] <Configuration of liquid processing unit> Next, the configuration of liquid processing unit 17 will be described with reference to Fig. 2. Fig. 2 is a diagram showing the configuration of liquid processing unit 17 according to the first embodiment. Liquid processing unit 17 is configured as a single-wafer cleaning apparatus that cleans wafers W one by one by spin cleaning, for example.

[0030] 2, liquid processing unit 17 holds wafer W substantially horizontally using wafer holding mechanism 25 disposed in outer chamber 23 that forms a processing space, and rotates wafer W by rotating wafer holding mechanism 25 about a vertical axis. Liquid processing unit 17 then moves nozzle arm 26 above rotating wafer W, and supplies chemical liquid and rinse liquid from chemical liquid nozzle 26a provided at the tip of nozzle arm 26 in a predetermined order, thereby cleaning the surface of wafer W.

[0031] In liquid processing unit 17, a gas supply path 25a is formed inside wafer holding mechanism 25. Liquid processing unit 17 supplies a gas, for example, an inert gas such as nitrogen gas, supplied from gas supply path 25a to the center of the back surface of wafer W.

[0032] The cleaning process may involve first removing particles and organic contaminants using an alkaline chemical called SC1 liquid (a mixture of ammonia and hydrogen peroxide), followed by a rinse using deionized water (DIW), an acidic chemical called diluted hydrofluoric acid (DHF), which removes native oxide films, followed by a rinse using DIW.

[0033] The various chemical solutions described above are received in the outer chamber 23 or the inner cup 24 placed in the outer chamber 23, and are discharged from the drainage outlet 23a provided in the bottom of the outer chamber 23 or the drainage outlet 24a provided in the bottom of the inner cup 24. Furthermore, the atmosphere inside the outer chamber 23 is exhausted from the exhaust outlet 23b provided in the bottom of the outer chamber 23.

[0034] The liquid film forming process is performed after the rinsing process in the cleaning process. Specifically, the liquid processing unit 17 supplies IPA liquid to the front and back surfaces of the wafer W while rotating the wafer holding mechanism 25. As a result, the DIW remaining on both surfaces of the wafer W is replaced with IPA.

[0035] At this time, liquid processing unit 17 supplies gas from gas supply path 25a to the central portion of the back surface of wafer W. The gas supplied to the central portion of the back surface of wafer W flows along the back surface of wafer W toward the outer periphery of the back surface of wafer W. This prevents IPA supplied to the front surface of wafer W from flowing around to the back surface of wafer W during the liquid film formation process in liquid processing unit 17. Thereafter, liquid processing unit 17 gradually stops the rotation of wafer holding mechanism 25.

[0036] After the liquid film formation process, the wafer W, with the IPA liquid film formed on its surface, is transferred to the transfer device 16 by a transfer mechanism provided in the wafer holding mechanism 25 and carried out from the liquid processing unit 17. The liquid film formed on the wafer W prevents pattern collapse caused by evaporation (vaporization) of the liquid on the upper surface of the wafer W during the transfer of the wafer W from the liquid processing unit 17 to the drying processing unit 18 or during the operation of carrying the wafer W into the drying processing unit 18.

[0037] <Drying processing unit configuration> Next, the configuration of the drying processing unit 18 will be described with reference to Figs. 3 to 6. Fig. 3 is an external perspective view showing the configuration of the drying processing unit 18 according to the first embodiment. Figs. 4 and 5 are cross-sectional views showing the configuration of the drying processing unit 18 according to the first embodiment. Fig. 4 shows a state in which the lid body 33 of the drying processing unit 18 is placed in the delivery area 182, and Fig. 5 shows a state in which the lid body 33 is placed in the processing area 181.

[0038] 3 to 5, the dry processing unit 18 includes a processing container 30, a holding member 32, and a lifter 39. The processing container 30 has a container member 31 (an example of a first member) and a lid 33 (an example of a second member) that can be connected to and separated from each other, and is configured to be able to form a sealed processing space 31a therein.

[0039] The container member 31 is a housing-like container having a processing space 31a formed therein that can accommodate a wafer W having a diameter of, for example, 300 mm, and is a pressure vessel that can create a high-pressure environment of, for example, about 16 to 20 MPa. The container member 31 is disposed in the processing area 181 (see FIG. 1), and the supercritical drying process is performed in the processing space 31a inside the container member 31. A transfer port 31b (see FIGS. 4 and 5) for transferring the wafer W is formed adjacent to the processing space 31a in the processing space 31a. The container member 31 also has a holding member 32, a lid 33, and an opening 34 for loading and unloading the wafer W formed on its side. The opening 34 connects the processing space 31a to the delivery area 182.

[0040] The lid body 33 supports the holding member 32. The lid body 33 is connected to a moving mechanism 33a and is moved horizontally between the processing area 181 and the delivery area 182 by the moving mechanism 33a. This allows the lid body 33 to open and close the transfer opening 31b of the container member 31. When the lid body 33 moves to the processing area 181, the holding member 32 is disposed inside the container member 31, and the lid body 33 closes the transfer opening 31b. On the other hand, when the lid body 33 moves to the delivery area 182, the holding member 32 is disposed in the delivery area 182, and the lid body 33 opens the transfer opening 31b.

[0041] The holding member 32 horizontally holds the wafer W to be processed. The holding member 32 is, for example, a frame body having a rectangular shape in a plan view, and holds the wafer W by supporting the outer periphery of the wafer W from below. The holding member 32 is provided on a lid body 33.

[0042] Furthermore, supply ports 35A and 35B and a discharge port 36 are provided on the wall of the container member 31. The supply ports 35A and 35B and the discharge port 36 are connected to a supply flow path and a discharge flow path, respectively, which are provided on the upstream side and downstream side of the drying processing unit 18 and allow the supercritical fluid to circulate.

[0043] The supply port 35A is connected to the side surface of the housing-like container member 31 opposite to the opening 34. The supply port 35B and the discharge port 36 are connected to the bottom surface of the container member 31. Although two supply ports 35A, 35B and one discharge port 36 are illustrated in FIG. 3, the numbers of the supply ports 35A, 35B and the discharge port 36 are not particularly limited.

[0044] The processing space 31a is provided with fluid supply headers 37A and 37B and a fluid discharge header 38. Each of the fluid supply headers 37A and 37B and the fluid discharge header 38 has a plurality of openings formed therein.

[0045] The fluid supply header 37A is connected to the supply port 35A and is provided adjacent to the side of the processing space 31a opposite to the opening 34. A plurality of openings formed in the fluid supply header 37A face the opening 34 side.

[0046] The fluid supply header 37B is connected to the supply port 35B and is provided at the center of the bottom surface of the processing space 31a. A plurality of openings formed in the fluid supply header 37B face upward.

[0047] The fluid discharge header 38 is connected to the discharge port 36 and is provided on the transfer port 31b side of the bottom surface of the processing space 31a. A plurality of openings formed in the fluid discharge header 38 face upward.

[0048] The fluid supply headers 37A and 37B supply the processing fluid to the processing space 31a. The fluid discharge header 38 guides and discharges the processing fluid in the processing space 31a to the outside of the container member 31. The supercritical fluid discharged to the outside of the container member 31 via the fluid discharge header 38 includes IPA liquid dissolved in the supercritical fluid from the surface of the wafer W.

[0049] The dry processing unit 18 supplies heated processing fluid to the processing space 31a from the fluid supply headers 37A and 37B, while discharging the processing fluid from the processing space 31a via the fluid discharge header 38. A damper is provided in the processing fluid discharge path to adjust the amount of processing fluid discharged from the processing space 31a, and the damper adjusts the amount of processing fluid discharged so that the pressure in the processing space 31a is adjusted to a desired pressure. This maintains the processing fluid in a supercritical state within the processing space 31a. Hereinafter, the processing fluid in a supercritical state will be referred to as a "supercritical fluid."

[0050] In the processing space 31a, a laminar flow of the supercritical fluid is formed, flowing in a predetermined direction around the wafer W. The laminar flow of the supercritical fluid flows, for example, from the fluid supply header 37A above the wafer W, along the upper surface of the wafer W, toward the top of the transfer port 31b. Furthermore, the laminar flow of the supercritical fluid turns downward above the transfer port 31b, passes near the transfer port 31b, and flows toward the fluid discharge header 38.

[0051] In this example of laminar flow, a laminar flow of the supercritical fluid passes through an opening 32a formed between the wafer W and the lid 33 in the holding member 32 inside the processing space 31a.

[0052] The IPA liquid present on the pattern-forming surface (upper surface) of the wafer W comes into contact with the supercritical fluid under high pressure (for example, 16 MPa), and is gradually dissolved in the supercritical fluid, eventually being replaced by the supercritical fluid. As a result, the gaps between the patterns become filled with the supercritical fluid.

[0053] Thereafter, the drying processing unit 18 reduces the pressure in the processing space 31a from the high pressure state to atmospheric pressure, thereby changing the supercritical fluid that has filled the gaps between the patterns into a normal processing fluid, that is, a gaseous state.

[0054] In this way, the drying processing unit 18 replaces the IPA liquid present on the pattern-formed surface with a supercritical fluid, and then returns the supercritical fluid to a gaseous processing fluid, thereby removing the IPA liquid from the pattern-formed surface and drying the pattern-formed surface.

[0055] Supercritical fluids have lower viscosity than liquids (e.g., IPA liquid), have a high ability to dissolve liquids, and there is no interface between the supercritical fluid and liquids or gases in equilibrium with it. Therefore, by performing supercritical drying, the liquid can be dried without being affected by surface tension. In other words, it is possible to prevent the pattern from collapsing during the drying process.

[0056] In the embodiment, IPA liquid is used as the liquid for preventing drying, and CO2 is used as the processing fluid, but a liquid other than IPA may be used as the liquid for preventing drying, or a fluid other than CO2 may be used as the processing fluid.

[0057] The lifter 39 is disposed in the delivery area 182. The lifter 39 includes a plurality of lifter pins 39a and a support 39b connected to the lower ends of the plurality of lifter pins 39a to support the plurality of lifter pins 39a.

[0058] Lifter 39 is raised and lowered by an elevation mechanism (not shown). Specifically, lifter 39 is raised and lowered between a transfer position where the wafer W is transferred between lifter pins 39a and transfer device 16, and a standby position. The standby position is a position below lid body 33 and holding member 32 where the lifter does not interfere with lid body 33 and holding member 32.

[0059] Here, the sealing structure of the processing space 31a will be described with reference to Figures 4 and 5. As shown in Figures 4 and 5, the container member 31 has a through-hole 41 that passes through the opening 34 side from top to bottom.

[0060] The drying processing unit 18 includes a pressing member 42. As shown in Fig. 4, the pressing member 42 is inserted into a through-hole 41 formed in a portion below the opening 34. The pressing member 42 is connected to an elevating mechanism (not shown) that moves the pressing member 42 in the vertical direction.

[0061] The operation of the pressing member 42 will now be described. As shown in Fig. 5, the drying processing unit 18 first uses the moving mechanism 33a to move the holding member 32 and the lid 33, thereby sealing the processing space 31a with the lid 33. Thereafter, the drying processing unit 18 uses the lifting mechanism (not shown) to raise the pressing member 42, and inserts the pressing member 42 into the through-hole 41 formed in the portion above the opening 34.

[0062] The pressing member 42 presses the lid 33 toward the processing space 31a against the internal pressure caused by the supercritical fluid supplied to the processing space 31a, thereby keeping the processing space 31a sealed by the lid 33.

[0063] The container member 31 has a processing space 31a for processing the wafer W and a transfer opening 31b for transferring the wafer W to the processing space 31a. The container member 31 also has a surface 31c that surrounds the transfer opening 31b and faces the lid 33.

[0064] The lid 33 is inserted into the container member 31 through the opening 34 and is coupled to the container member 31 by abutting against the surface 31c of the container member 31 via the seal member 51. The seal member 51 is made of, for example, resin, has an O-shape in cross section, and is also called an "O-ring." Note that the seal member 51 is not limited to an O-ring, and may be, for example, a member that has a U-shape in cross section, also called a "U-seal."

[0065] The sealing member 51 is provided on a surface 33b of the lid body 33 that faces the surface 31c of the container member 31. Fig. 6 is a side view showing the configuration of the lid body 33 in the drying processing unit 18. Note that Fig. 6 is a side view of the surface 33b as seen from the front, and for ease of understanding, the position corresponding to the transfer opening 31b of the container member 31 is indicated by a dashed line.

[0066] As shown in FIG. 6, the seal member 51 is disposed so as to surround the transfer opening 31b and the holding member 32 in a side view.

[0067] 4 and 5, the description of the sealing member 51 will be continued. The sealing member 51 is disposed so that the inner surface thereof facing the transfer port 31b communicates with the processing space 31a. Therefore, the sealing member 51 deteriorates over time due to the internal pressure caused by the supercritical fluid supplied to the processing space 31a. For example, the deterioration state of the sealing member 51 may be such that a protruding portion is formed on part of the periphery of the sealing member 51 on the inner surface thereof facing the transfer port 31b. The protruding portion protruding from the periphery of the sealing member 51 is also referred to as "fuzz," for example.

[0068] Here, the drying processing unit 18 further includes an illumination section 55 and an imaging section 56.

[0069] The lighting unit 55 is provided in the delivery area 182, and irradiates light onto the sealing member 51 on the lid body 33 when the container member 31 and the lid body 33 are separated. For example, the lighting unit 55 irradiates light onto a predetermined area on the surface 33b of the lid body 33, the area including the sealing member 51.

[0070] The imaging unit 56 is provided adjacent to the illumination unit 55 in the delivery area 182, and captures an image of the sealing member 51 irradiated with light from the illumination unit 55. For example, the imaging unit 56 captures an image of a predetermined area on the surface 33b of the lid body 33, including the sealing member 51 irradiated with light from the illumination unit 55.

[0071] In this manner, in the drying processing unit 18, the illumination unit 55 is used to illuminate the seal member 51, and the imaging unit 56 is used to capture an image of the seal member 51, thereby detecting any abnormality in the seal member 51.

[0072] If imaging is performed by imaging unit 56 without using illumination unit 55, the interface between sealing member 51 on surface 33b of lid body 33 and the area around sealing member 51 on surface 33b cannot be clearly identified. This may make it difficult to identify protruding portions (i.e., fluff) that occur on the periphery of sealing member 51.

[0073] In contrast, in the drying processing unit 18 according to this embodiment, the illumination unit 55 is used to illuminate the sealing member 51, which is the image capture target of the imaging unit 56. This makes it possible to clearly identify the interface between the sealing member 51 and the area around the sealing member 51 on the surface 33b of the lid body 33 by utilizing the contrast difference between the sealing member 51 and the area around the sealing member 51. As a result, it becomes easier to identify protruding portions (i.e., fluff) protruding from the periphery of the sealing member 51, and therefore it is possible to appropriately detect abnormalities in the sealing member 51.

[0074] In the embodiment, from the viewpoint of making the contrast difference between the seal member 51 and the area around the seal member 51 more clear on the surface 33b of the lid body 33, the seal member 51 may have a color whose contrast ratio with respect to the surface 33b of the lid body 33 is equal to or greater than a predetermined value. For example, the color of the seal member 51 may be white.

[0075] <Detection process details> Next, details of the detection process for detecting an abnormality in the sealing member 51 will be described with reference to Figs. 7 and 8. Fig. 7 is a block diagram showing the configuration of the control device 6 according to the first embodiment. As shown in Fig. 7, the control device 6 includes a control unit 61 and a storage unit 62.

[0076] The control device 6 is also connected to the above-mentioned illumination unit 55 and imaging unit 56. Note that the control device 6 may also have various functional units that known computers have, such as various input devices and audio output devices, in addition to the functional units shown in Fig. 7 .

[0077] The storage unit 62 is realized by, for example, a semiconductor memory element such as a RAM or a flash memory, or a storage device such as a hard disk or an optical disk. The storage unit 62 stores information used in various processes in the control unit 61.

[0078] The control unit 61 is realized by, for example, a CPU, a micro processing unit (MPU), a graphics processing unit (GPU), or the like executing a program stored in the storage unit 62 using the RAM as a working area.

[0079] Furthermore, the control unit 61 may be realized by an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array).

[0080] The control unit 61 includes an illumination control unit 61a, an imaging control unit 61b, and an abnormality detection unit 61c.

[0081] The illumination control unit 61a controls the illumination unit 55 to irradiate the light from the illumination unit 55 onto the sealing member 51. The imaging control unit 61b controls the imaging unit 56 to capture an image of the sealing member 51 irradiated with light from the illumination unit 55, thereby obtaining a captured image.

[0082] The abnormality detection unit 61c receives the captured image acquired by the imaging control unit 61b, and based on the captured image, detects an abnormality in the seal member 51. Details of the abnormality detection process by the abnormality detection unit 61c will be described with reference to FIG.

[0083] FIG. 8 is a diagram illustrating an example of the abnormality detection process according to the first embodiment. The abnormality detection unit 61c first receives the captured image of the seal member 51 acquired by the imaging control unit 61b and performs image processing on the received captured image using a predetermined method. For example, the abnormality detection unit 61c acquires the contrast difference, which is the differential value of brightness between adjacent pixel data in the captured image, for each pixel, and detects pixels where the contrast difference is greater than or equal to a predetermined value as edges in the image. FIG. 8 shows the image-processed seal member 51 and the area around the seal member 51 on the surface 33b of the lid 33 as the detection range.

[0084] 8, an edge 510 is detected on the surface 33b of the lid 33 by searching the detection range in the vertical direction so as to follow the inner surface of the seal member 51 that is located on the transfer opening 31b side. The edge 510 indicates the periphery (hereinafter referred to as the "inner periphery") that is located on the transfer opening 31b side of the seal member 51. That is, the captured image of the seal member 51 according to this embodiment includes the seal member 51 as pixels with a relatively high brightness value and includes the area around the seal member 51 as pixels with a relatively low brightness value, and therefore the edge 510 coincides with the inner periphery of the seal member 51.

[0085] 8, on the surface 33b of the lid body 33, a base end 51b of a protruding portion (i.e., fluff) protruding from the inner peripheral edge of the sealing member 51 is detected by searching laterally with respect to the edge 510. On the surface 33b of the lid body 33, a terminal end 51c of the base end 51b of the protruding portion (i.e., fluff) protruding from the inner peripheral edge of the sealing member 51 is detected by searching below the base end 51b. This allows the protruding portion (i.e., fluff) protruding from the inner peripheral edge of the sealing member 51 to be identified.

[0086] Next, the abnormality detection unit 61c determines whether the length L of the identified protruding portion is equal to or greater than a threshold value, and if the length L is equal to or greater than the threshold value, detects that an abnormality has occurred in the seal member 51.

[0087] The abnormality detection unit 61c outputs an alert when it detects that an abnormality has occurred in the sealing member 51. For example, the abnormality detection unit 61c outputs an alert sound or a message to an output device (not shown) to indicate that an abnormality has occurred in the sealing member 51.

[0088] As described above, in this embodiment, an abnormality in the sealing member 51 is detected based on an image acquired by imaging the sealing member 51 using the imaging unit 56 while illuminating the sealing member 51 using the illumination unit 55. This makes it possible to accurately identify protruding portions (i.e., fluff) protruding from the periphery of the sealing member 51 by utilizing the contrast difference between the sealing member 51 and the area around the sealing member 51. Therefore, according to this embodiment, it is possible to improve the accuracy of detecting an abnormality in the sealing member 51.

[0089] Furthermore, in this embodiment, a protruding portion protruding from the inner peripheral edge of the sealing member 51 is identified based on the brightness in the captured image, and if the length L of the identified protruding portion is equal to or greater than a threshold, it is detected that an abnormality has occurred in the sealing member 51. This makes it possible to properly detect the state in which fluff has formed on the inner peripheral edge of the sealing member 51, thereby making it possible to prevent problems caused by fluff on the sealing member 51.

[0090] In this embodiment, an alert is output when it is detected that an abnormality has occurred in the seal member 51. This makes it possible to notify that an abnormality has occurred in the seal member 51.

[0091] <Substrate processing details> Next, details of the substrate processing according to the first embodiment will be described with reference to Fig. 9. Fig. 9 is a flowchart showing a processing procedure for substrate processing executed by the substrate processing system 1 according to the first embodiment. Fig. 10 shows an example of the processing procedure from when the wafer W is carried into the liquid processing unit 17 until when it is carried out from the drying processing unit 18. Each processing procedure shown in Fig. 9 is executed under the control of the control unit 61.

[0092] In the substrate processing system 1, first, the transfer device 13 takes out the wafer W accommodated in the carrier C and places it on the delivery section 14. Next, the transfer device 16 takes out the wafer W from the delivery section 14, and then, as shown in FIG. 9, loads the taken-out wafer W into the liquid processing unit 17 (step S101).

[0093] Next, in the substrate processing system 1, the liquid processing unit 17 performs liquid processing on the wafer W (step S102). Specifically, the liquid processing unit 17 performs a cleaning process on the surface of the wafer W using a chemical liquid or a rinse liquid, and then performs a liquid film forming process in which an IPA liquid is supplied to the surface of the wafer W to form a liquid film.

[0094] Next, in the substrate processing system 1, the wafer W after the liquid processing, ie, the wafer W on which the liquid film is formed, is transferred from the liquid processing unit 17 to the transfer device 16 (step S103).

[0095] Next, in the substrate processing system 1, the drying processing unit 18 uses the moving mechanism 33a (see Figure 4) to horizontally move the lid body 33, thereby placing the holding member 32 that is not yet holding a wafer W in the transfer area 182 (step S104).

[0096] Next, a sealing member abnormality detection process is performed (step S105) in the substrate processing system 1. The sealing member abnormality detection process will be described in detail later.

[0097] Subsequently, in the substrate processing system 1, the wafer W is carried into the drying processing unit 18 (step S106).

[0098] Specifically, the transfer device 16 places the wafer W held by the wafer holding mechanism of the transfer device 16 above the holding member 32 arranged in the delivery area 182 of the dry processing unit 18.

[0099] Next, in the substrate processing system 1, the wafer W is transferred from the transfer device 16 to the drying processing unit 18 (step S107).

[0100] Specifically, the drying processing unit 18 raises the lifter 39 from the standby position to the delivery position, thereby raising the wafer W held by the wafer holding mechanism of the transfer device 16 and causing the plurality of lifter pins 39a to support the wafer W. The transfer device 16 then retracts the wafer holding mechanism. The drying processing unit 18 then lowers the plurality of lifter pins 39a, thereby causing the holding member 32 to hold the wafer W.

[0101] Next, the drying processing unit 18 horizontally moves the holding member 32 using the moving mechanism 33a (see FIG. 4) to load the wafer W into the container member 31 (step S108).

[0102] Next, a supercritical drying process is performed (step S109) in the substrate processing system 1. Specifically, the drying process unit 18 dries the wafer W after the liquid film formation process by bringing the wafer W into contact with a processing fluid in a supercritical state.

[0103] Next, in the substrate processing system 1, the transfer device 16 removes the wafer W from the drying processing unit 18 (step S110). Specifically, the transfer device 16 holds the wafer W after the supercritical drying processing using the wafer holding mechanism, and removes the held wafer W from the transfer device 16. Thereafter, the transfer device 16 places the wafer W on the delivery section 14, and the transfer device 13 removes the wafer W from the delivery section 14 and returns it to the carrier C. This completes the series of substrate processing steps for one wafer W.

[0104] Next, an example of a specific procedure for the sealing member abnormality detection process in step S105 will be described with reference to Fig. 10. Fig. 10 is a flowchart showing an example of a specific procedure for the sealing member abnormality detection process according to the first embodiment. Before the sealing member abnormality detection process starts, in step S104 of Fig. 9, the lid body 33 is separated from the container member 31 and placed in the delivery area 182 together with the holding member 32.

[0105] In a state where the container member 31 and the lid body 33 are separated, the illumination control unit 61a causes the illumination unit 55 to irradiate light onto the sealing member 51 of the lid body 33 (step S201).

[0106] Next, the imaging control unit 61b uses the imaging unit 56 to capture an image of the sealing member 51 that has been irradiated with light (step S202), and obtains the captured image.

[0107] That is, in a state where holding member 32 not holding wafer W is arranged in delivery area 182 together with lid body 33, imaging unit 56 images sealing member 51 irradiated with light from illumination unit 55 before lifter 39 rises from the standby position to the delivery position. This makes it possible to suppress a decrease in imaging accuracy due to interference with lifter pins 39a of lifter 39.

[0108] Next, the abnormality detection unit 61c detects an abnormality in the seal member 51 based on the acquired captured image (step S203).

[0109] If it is detected that an abnormality has occurred in the sealing member 51 (Yes at step S204), the abnormality detection unit 61c outputs an alert (step S205) and ends the process.

[0110] On the other hand, if it is detected that no abnormality has occurred in the sealing member 51 (step S204, No), the abnormality detection unit 61c ends the process without outputting an alert.

[0111] Note that abnormality detection unit 61c may stop the execution of the supercritical drying process and output an alert when detecting that an abnormality has occurred in sealing member 51. For example, abnormality detection unit 61c may stop the processes from step S106 onwards in FIG. 9 and output an alert.

[0112] In the first embodiment described above, an example in which the sealing member 51 is provided on the lid 33 has been shown, but the sealing member 51 may also be provided on the surface 31c of the container member 31.

[0113] Furthermore, in the first embodiment, an example has been shown in which an abnormality in the sealing member 51 is detected based on the brightness of the captured image obtained by capturing an image of the sealing member 51 using the imaging unit 56, but the method of detecting an abnormality in the sealing member 51 is not limited to this. For example, an abnormality in the sealing member 51 may be detected based on a difference image between the captured image and a predetermined reference image stored in the storage unit 62. Note that the predetermined reference image is, for example, image data of the sealing member 51 and the area around the sealing member 51 captured in advance when the sealing member 51 is normal.

[0114] (Second embodiment) <Drying processing unit configuration> Next, the configuration of the drying processing unit 18 according to the second embodiment will be described with reference to Fig. 11. Fig. 11 is a cross-sectional view showing the configuration of the drying processing unit 18 according to the second embodiment. Fig. 11 shows a state in which the lid body 33 of the drying processing unit 18 is placed in the delivery area 182.

[0115] As shown in FIG. 11, the drying processing unit 18 further includes an illumination section 57 (an example of another illumination section) and an imaging section 58 (an example of another imaging section).

[0116] The lighting unit 57 is provided in the delivery area 182 and irradiates light onto a target contact area of ​​the container member 31 that will come into contact with the sealing member 51 when the container member 31 and the lid 33 are separated from each other. For example, the lighting unit 57 irradiates light onto a target contact area on the surface 31c of the container member 31.

[0117] The imaging unit 58 is provided adjacent to the illumination unit 57 in the delivery area 182, and captures an image of the contact target area irradiated with light from the illumination unit 57. For example, the imaging unit 58 captures an image of the contact target area irradiated with light from the illumination unit 55 on the surface 31c of the container member 31.

[0118] In this way, the drying processing unit 18 detects abnormalities in the sealing member 51 by illuminating the area to be contacted with the sealing member 51 using the lighting unit 57 and capturing an image of the area to be contacted with the sealing member 51 using the imaging unit 58.

[0119] There is a possibility that fluff detached from the sealing member 51 may adhere as an attachment to the region of the container member 31 that is to come into contact with the sealing member 51. If an image is captured by the imaging unit 58 without using the illumination unit 57, the interface between the attachment on the surface 31c of the container member 31 and the region around the attachment on the surface 31c cannot be clearly identified. For this reason, it may be difficult to identify the attachment (i.e., fluff) that has adhered to the region that is to come into contact with the sealing member 51.

[0120] In contrast to this, in the drying processing unit 18 according to this embodiment, the illumination unit 57 is used to illuminate the area to be contacted with the sealing member 51, which is the image capture target of the imaging unit 58. This makes it possible to clearly identify the interface between the attachment and the area around the attachment on the surface 31c of the container member 31 by utilizing the contrast difference between the attachment and the area around the attachment. As a result, it becomes easier to identify the attachment (i.e., fluff) that has adhered to the area to be contacted with the sealing member 51, and therefore it is possible to appropriately detect abnormalities in the sealing member 51.

[0121] <Control device configuration> Next, the configuration of the control device 6 according to the second embodiment will be described with reference to Fig. 12. Fig. 12 is a block diagram showing the configuration of the control device 6 according to the second embodiment. As shown in Fig. 12, an illumination unit 57 and an imaging unit 58 are connected to the control device 6.

[0122] The illumination control unit 61a controls the illumination unit 57 to irradiate the light from the illumination unit 57 onto the target contact area of ​​the container member 31 with the sealing member 51. The imaging control unit 61b controls the imaging unit 58 to capture an image of the target contact area with the sealing member 51 irradiated with the light from the illumination unit 57, thereby obtaining another captured image.

[0123] The abnormality detection unit 61c receives the captured image acquired by the imaging control unit 61b, and detects an abnormality in the seal member 51 based on the captured image.

[0124] Furthermore, the abnormality detection unit 61c receives another captured image acquired by the imaging control unit 61b, and detects an abnormality in the seal member 51 based on the other captured image.

[0125] Specifically, the abnormality detection unit 61c first receives another captured image of the target area for contact with the sealing member 51 acquired by the imaging control unit 61b, and performs image processing on the received another captured image using a predetermined method. For example, as in the case of the captured image, the abnormality detection unit 61c acquires, for each pixel, the contrast difference, which is the differential value of brightness between adjacent pixel data of the another captured image, and detects pixels where the contrast difference is higher than a predetermined value as an edge on the image.

[0126] The abnormality detection unit 61c determines whether an edge is detected, thereby detecting an abnormality in the sealing member 51. When it is determined that there is an attachment in the contact target area, the abnormality detection unit 61c detects that an abnormality has occurred in the sealing member 51.

[0127] Next, an example of a specific procedure for the sealing member abnormality detection process according to the second embodiment will be described with reference to Fig. 13. Fig. 13 is a flowchart showing an example of a specific procedure for the sealing member abnormality detection process according to the second embodiment. Before the sealing member abnormality detection process starts, in step S104 of Fig. 9, the lid body 33 is separated from the container member 31 and placed in the delivery area 182 together with the holding member 32.

[0128] The abnormality detection unit 61c detects an abnormality in the sealing member 51 based on the acquired captured image (step S203), and if it detects that no abnormality has occurred in the sealing member 51 (step S204, No), it proceeds to step S301.

[0129] In a state where the container member 31 and the lid body 33 are separated, the illumination control unit 61a uses the illumination unit 57 to irradiate light onto the area of ​​the container member 31 that is to be brought into contact with the seal member 51 (step S301).

[0130] Next, the imaging control unit 61b uses the imaging unit 58 to capture an image of the area to be contacted with the sealing member 51 that has been irradiated with light (step S302), and obtains another captured image.

[0131] That is, in a state where holding member 32 not holding wafer W is arranged in delivery area 182 together with lid body 33, imaging unit 56 images the area to be contacted with sealing member 51 irradiated with light from illumination unit 57 before lifter 39 rises from the standby position to the delivery position. This makes it possible to suppress a decrease in imaging accuracy due to interference with lifter pins 39a of lifter 39.

[0132] Next, the abnormality detection unit 61c detects an abnormality in the seal member 51 based on another captured image that has been acquired (step S303).

[0133] If it is detected that an abnormality has occurred in the sealing member 51 (Yes at step S304), the abnormality detection unit 61c outputs an alert (step S205) and ends the process.

[0134] On the other hand, if it is detected that no abnormality has occurred in the sealing member 51 (No at step S304), the abnormality detection unit 61c ends the process without outputting an alert.

[0135] Note that abnormality detection unit 61c may stop the execution of the supercritical drying process and output an alert when detecting that an abnormality has occurred in sealing member 51. For example, abnormality detection unit 61c may stop the processes from step S106 onwards in FIG. 9 and output an alert.

[0136] 13, the order of steps S201 to S203 and steps S301 to S303 may be reversed. That is, the abnormality detection unit 61c may perform abnormality detection for the sealing member 51 based on another captured image of the contact target area, and if it detects that no abnormality has occurred, may perform abnormality detection for the sealing member 51 based on the captured image of the sealing member 51.

[0137] In the second embodiment described above, an example has been shown in which an abnormality in the sealing member 51 is detected based on the brightness of another captured image acquired by capturing an image of the region to be contacted with the sealing member 51 by the imaging unit 58, but the method of detecting an abnormality in the sealing member 51 is not limited to this. For example, an abnormality in the sealing member 51 may be detected based on a difference image between the another captured image and a predetermined reference image stored in the storage unit 62. Note that the predetermined reference image is, for example, image data of the region to be contacted with the sealing member 51 that has been captured in advance and is normal.

[0138] (Third embodiment) Next, the configuration of the drying processing unit 18 according to the third embodiment will be described with reference to Fig. 14 and Fig. 15. Fig. 14 is a cross-sectional view showing the configuration of the drying processing unit 18 according to the third embodiment. Fig. 15 is a cross-sectional view showing an example of a state in which a wafer W is accommodated inside a processing container 70 of the drying processing unit 18.

[0139] 14 and 15, the drying processing unit 18 includes a processing container 70 and a support part 73. The processing container 70 has a container member 71 (an example of a first member) and a lid 72 (an example of a second member) that can be connected to and separated from each other, and is configured to be able to form a sealed processing space 711 therein.

[0140] The container member 71 is a housing-like container having a processing space 711 formed therein that can accommodate a wafer W having a diameter of, for example, 300 mm, and is a pressure vessel that can create a high-pressure environment of, for example, about 16 to 20 MPa. The container member 71 is disposed on both sides of the transfer area 15 (see FIG. 1) in the Y-axis direction, and the supercritical drying process is performed in the processing space 711 inside the container member 71. The container member 71 has a rectangular shape in a plan view, and has an opening 71a (an example of a transfer port) used for loading and unloading the wafer W on one of its multiple (here, four) side surfaces that faces the transfer area 15.

[0141] The lid body 72 is connected to a moving and rotating mechanism 72a and can be moved and rotated between a closed position and a standby position by the moving and rotating mechanism 72a. The closed position is a position where the lid body 72 closes the opening 71a. The standby position is a position where the lid body 72 opens the opening 71a and does not interfere with the path for carrying the wafer W into and out of the opening 71a.

[0142] The support parts 73 are provided inside the container member 71 and horizontally support the wafer W from below. The support parts 73 are support pins that support the wafer W from below, and are provided on the bottom surface inside the container member 71.

[0143] The container member 71 is provided with a supply part 75 and a discharge part 76. The supply part 75 is connected to a group of supply devices of the supply unit 19 (see FIG. 1), and supplies the processing fluid supplied from the supply unit 19 to the processing space 711. The discharge part 76 discharges the processing fluid from the processing space 711.

[0144] The supply unit 75 is provided on the side surface of the container member 71 opposite to the side where the opening 71a of the processing space 711 is formed. The supply unit 75 supplies the processing fluid horizontally to the processing space 711 from a supply port that opens laterally.

[0145] The discharge part 76 is provided on the bottom surface of the processing space 711 in the container member 71. The discharge part 76 discharges the processing fluid from a discharge port that opens upward.

[0146] The drying processing unit 18 supplies a processing fluid to the processing space 711 from a supply part 75, while discharging the processing fluid from the processing space 711 via a discharge part 76. A damper for adjusting the amount of processing fluid discharged from the processing space 711 is provided in the processing fluid discharge path, and the amount of processing fluid discharged is adjusted by the damper so that the pressure in the processing space 711 is adjusted to a desired pressure. This maintains the processing fluid in a supercritical state in the processing space 711. Hereinafter, the processing fluid in a supercritical state may be referred to as a "supercritical fluid."

[0147] The container member 71 has a first protrusion 313 and a second protrusion 314 that protrude further in the opening opening 71a in the lid opening direction of the opening 71a. The first protrusion 313 protrudes in the Y-axis direction from the bottom of the opening 71a, and the second protrusion 314 protrudes in the Y-axis direction from the top of the opening 71a.

[0148] The first protruding portion 313 is formed with a first insertion hole 315 that communicates between the upper surface and the lower surface of the first protruding portion 313. The second protruding portion 314 is formed with a second insertion hole 316 that communicates between the upper surface and the lower surface of the second protruding portion 314, at a position that faces the first insertion hole 315 in the vertical direction (i.e., above the first insertion hole 315).

[0149] The drying processing unit 18 also includes a locking member 77. The locking member 77 is inserted into a first insertion hole 315 formed in the first protrusion 313. The locking member 77 is connected to an elevating mechanism (not shown) that moves the locking member 77 in the vertical direction.

[0150] In the drying processing unit 18, first, a loading process of the wafer W is performed. In the loading process, the transfer device 16 transfers the wafer W held by the wafer holding mechanism to the support part 73. Then, the drying processing unit 18 moves and rotates the lid body 72, which is disposed in the standby position, to the open / close position. As a result, the wafer W supported by the support part 73 is accommodated in the processing space 711 of the container member 71, and the processing space 711 is sealed by the lid body 72.

[0151] Furthermore, the drying processing unit 18 causes the locking member 77 to be inserted into the second insertion hole 316 formed in the second protruding portion 314 by raising the locking member 77 using an elevating mechanism (not shown).

[0152] The locking member 77 presses the lid 72 against the internal pressure caused by the processing fluid supplied to the processing space 711. This allows the processing space 711 to be kept sealed by the lid 72.

[0153] Next, a pressure increase process is performed in the drying processing unit 18. In the pressure increase process, the drying processing unit 18 increases the pressure in the processing space 711 by supplying a processing fluid from the supply unit 75 to the processing space 711 of the container member 71. As a result, the pressure in the processing space 711 increases from atmospheric pressure to the processing pressure. The processing pressure exceeds the critical pressure (approximately 7.2 MPa) at which CO2, the processing fluid, becomes supercritical, and is, for example, approximately 16 MPa. This pressure increase process causes the processing fluid in the processing space 711 to change phase to a supercritical state, and the IPA liquid puddled on the surface of the wafer W begins to dissolve in the processing fluid in the supercritical state. Note that the processing fluid supplied from the supply unit 19 may be in a supercritical state or a liquid state.

[0154] Next, a circulation process is performed in the drying process unit 18. In the circulation process, the drying process unit 18 supplies a processing fluid from the supply part 75 to the processing space 711 while maintaining the pressure in the processing space 711 at the processing pressure, and discharges the processing fluid supplied to the processing space 711 from the discharge part 76 to the outside of the processing space 711. As a result, a laminar flow of the processing fluid flowing in a predetermined direction around the wafer W is formed in the processing space 711.

[0155] The IPA liquid present on the pattern-forming surface (upper surface) of the wafer W comes into contact with the supercritical fluid under high pressure (for example, 16 MPa), and is gradually dissolved in the supercritical fluid, eventually being replaced by the supercritical fluid. As a result, the gaps between the patterns become filled with the supercritical fluid.

[0156] Next, a decompression process is performed in the drying process unit 18. In the decompression process, the drying process unit 18 reduces the pressure in the process space 711 from a high pressure state to atmospheric pressure. As a result, the supercritical fluid that filled the gaps between the patterns changes into a normal, i.e., gaseous, process fluid. In this way, the IPA liquid between the patterns is removed, and the drying process of the wafer W is completed.

[0157] Here, IPA liquid is used as the liquid for preventing drying, and CO2 is used as the processing fluid, but a liquid other than IPA may be used as the liquid for preventing drying, and a fluid other than CO2 may be used as the processing fluid.

[0158] The container member 71 is formed with a processing space 711 for processing the wafer W and an opening 71a for transferring the wafer W into the processing space 711.

[0159] The lid 72 is coupled to the container member 71 by abutting against the surface around the opening 71a of the container member 71 via a sealing member 721. The sealing member 721 is made of, for example, resin, has an O-shape in cross section, and is also called an "O-ring." Note that the sealing member 721 is not limited to an O-ring, and may be, for example, a member that has a U-shape in cross section, also called a "U-seal."

[0160] The sealing member 721 is provided on a surface of the lid 72 that can face the surface surrounding the opening 71a of the container member 71. The sealing member 721 is disposed so as to surround the opening 71a in a side view. The sealing member 721 is disposed so that the inner surface facing the opening 71a communicates with the processing space 711. Therefore, the sealing member 721 deteriorates over time due to the internal pressure caused by the supercritical fluid supplied to the processing space 711. An example of a deteriorated state of the sealing member 721 is a state in which a protruding portion (i.e., fluff) is formed on part of the periphery of the sealing member 721 on the inner surface facing the opening 71a.

[0161] Here, the drying processing unit 18 further includes an illumination section 78 and an imaging section 79.

[0162] The lighting unit 78 irradiates light onto the sealing member 721 of the lid body 72 when the container member 71 and the lid body 72 are separated from each other.

[0163] The imaging unit 79 is provided adjacent to the illumination unit 78 and captures an image of the sealing member 721 irradiated with light from the illumination unit 78 .

[0164] In this way, in the drying processing unit 18, the illumination unit 78 is used to illuminate the sealing member 721, and the imaging unit 79 is used to capture an image of the sealing member 721, thereby detecting any abnormality in the sealing member 721. This makes it possible to appropriately detect any abnormality in the sealing member 721.

[0165] Furthermore, in this embodiment, the imaging unit 79 images the seal member 721 irradiated with light from the illumination unit 78 in a state where the container member 71 and the lid body 72 are separated and before the wafer W is transferred to the support unit 73 through the opening 51 a. This makes it possible to suppress a decrease in imaging accuracy associated with the wafer W loading process.

[0166] (Fourth embodiment) In the above-described first and second embodiments, a drying processing unit has been described as an example of a substrate processing apparatus, but the substrate processing apparatus is not limited to a drying processing unit. For example, the substrate processing apparatus may be an ozone water processing unit that processes wafers W with ozone water. In the third embodiment, a case will be described in which the substrate processing apparatus is an ozone water processing unit that processes wafers W with ozone water.

[0167] The configuration of the ozone water treatment unit 20 according to the fourth embodiment will be described with reference to Fig. 16 and Fig. 17. Fig. 16 is a schematic diagram showing an example of the configuration of the ozone water treatment unit 20 according to the fourth embodiment. Fig. 17 is a diagram showing the ozone water treatment unit 20 according to the fourth embodiment with the treatment vessel 80 separated.

[0168] 16 and 17, ozone water processing unit 20 (an example of a substrate processing apparatus) includes a processing container 80, a liquid supply unit 90, a liquid discharge unit 100, and a collection cup 110. The liquid supply unit 90 is an example of an ozone water supply unit. The liquid discharge unit 100 is an example of an ozone water discharge unit.

[0169] The processing vessel 80 has a first vessel member 80a (an example of a first member) and a second vessel member 80b (an example of a second member) that can be connected and separated from each other, and is configured to be able to form a sealed processing space S therein.

[0170] The first container member 80a includes a mounting portion 81, a support portion 82, a lifting mechanism 83, a heater 84, lift pins 85, and a sealing member 86.

[0171] The mounting portion 81 has a substantially circular plate shape and horizontally mounts the wafer W. A bank portion 81a is provided in the region of the mounting portion 81 where the wafer W is mounted. The bank portion 81a is arranged to rise from the periphery of the region of the mounting portion 81 where the wafer W is mounted, and contacts the edge of the wafer W to fix the position of the wafer W.

[0172] The support column 82 is a member extending in the vertical direction, and its base end is supported by the lifting mechanism 83 so as to be vertically movable, and its tip end horizontally supports the placement section 81. The lifting mechanism 83 moves the support column 82 in the vertical direction.

[0173] In the first container member 80a, the support column 82 is moved in the vertical direction using the lifting mechanism 83, thereby moving the placement section 81 supported by the support column 82 in the vertical direction.

[0174] The heater 84 is a planar heater provided inside the mounting portion 81, and heats the wafer W accommodated in the processing space S of the second container member 80b to a given temperature.

[0175] The lift pins 85 are arranged to penetrate the mounting portion 81 and are configured to be movable up and down by a lifting mechanism (not shown).

[0176] The lift pins 85 support the wafer W when the wafer W is placed on the placement portion 81 (see FIG. 17). For example, three lift pins 85 are provided on the placement portion 81, and are arranged at intervals of 120 degrees in the circumferential direction.

[0177] The seal member 86 is arranged to extend along the entire periphery of the mounting portion 81. When the first container member 80a and the second container member 80b are joined, the seal member 86 comes into contact with the second container member 80b to seal the processing space S of the second container member 80b. The seal member 86 may be, for example, an O-ring or a metal gasket.

[0178] The second container member 80b has a ceiling portion 87 facing the mounting portion 81 and a sidewall portion 88 extending downward from the ceiling portion 87. The second container member 80b has a substantially cylindrical portion in which an opening is formed at the bottom by the ceiling portion 87 and the sidewall portion 88 and a processing space S is formed inside.

[0179] The second container member 80b is connected to an elevation mechanism 89. The elevation mechanism 89 moves the second container member 80b in the vertical direction.

[0180] In the processing vessel 80 described so far, when loading and unloading a wafer W, the loading portion 81 and the second vessel member 80b can be moved by the lifting mechanisms 83, 89 to separate the loading portion 81 and the second vessel member 80b from each other, as shown in Fig. 17. When the loading portion 81 and the second vessel member 80b are separated from each other, the opening of the second vessel member 80b is opened, and the wafer W is transferred between the lift pins 85 and a substrate transfer device (not shown) through the gap between the loading portion 81 and the second vessel member 80b.

[0181] On the other hand, when processing a wafer W, the processing vessel 80 moves the mounting part 81 and the second container member 80b by the lifting mechanisms 83, 89, and brings the second container member 80b into contact with the mounting part 81, as shown in Fig. 16, thereby closing the opening of the second container member 80b. This joins the first container member 80a and the second container member 80b, and forms a sealed processing space S inside the processing vessel 80.

[0182] The liquid supply unit 90 is disposed on the ceiling portion 87 of the second container member 80b, and supplies ozone water to the processing space S. The liquid supply unit 90 includes a cover member 91 that covers the wafer W placed on the placement portion 81, and a supply pipe 92 provided in the cover member 91.

[0183] The supply pipe 92 is connected to an ozone water supply passage 93. The ozone water supply passage 93 supplies ozone water to the supply pipe 92. The ozone water supply passage 93 has, in order from the upstream side, an ozone water generator 94, a valve 95, and a pump 96 (an example of a pressurizing section).

[0184] The ozone water generating unit 94 generates ozone water having a given ozone concentration. The "given ozone concentration" is, for example, an ozone concentration that can remove (peel off) a resist film formed on the wafer W, and is, for example, in the range of 0 mg / L to 1500 mg / L.

[0185] The valve 95 is a valve that opens and closes the ozone water supply passage 93 .

[0186] The pump 96 pressurizes the ozonated water flowing through the ozonated water supply passage 93 to a pressure higher than atmospheric pressure, thereby enabling efficient production of ozonated water having a given ozone concentration.

[0187] The supply pipe 92 also has a supply port 92a provided in the cover member 91 at a position corresponding to the center of the wafer W. The supply pipe 92 supplies ozone water from the supply port 92a toward the center of the wafer W. As a result, a flow of ozone water is formed in the gap between the cover member 91 and the wafer W, along the bottom surface of the cover member 91, from the center of the wafer W toward the outer periphery of the wafer W.

[0188] The liquid discharge unit 100 is disposed on the ceiling portion 87 of the second container member 80b. The liquid discharge unit 100 discharges the ozone water that is supplied from the liquid supply unit 90 to the processing space S and that has passed through the processing space S to the outside of the processing container 80.

[0189] The collection cup 110 is disposed so as to surround the mounting portion 81, and collects the treatment liquid that flows down from the gap between the mounting portion 81 and the second container member 80b due to the separation between the mounting portion 81 and the second container member 80b. A drain port (not shown) is formed at the bottom of the collection cup 110, and the treatment liquid collected by the collection cup 110 is discharged from the drain port to the outside of the ozone water treatment unit 20.

[0190] When processing a wafer W in the ozone water processing unit 20 described above, first, the wafer W is placed on the mounting portion 81 of the first container member 80a. Next, the lifting mechanisms 83 and 89 move the mounting portion 81 and the second container member 80b so as to close the opening of the second container member 80b. This seals the processing space S of the second container member 80b.

[0191] Next, the liquid supply unit 90 supplies ozone water to the sealed processing space S, filling the processing space S with ozone water.

[0192] In this embodiment, with the processing space S filled with ozone water, the ozone water is pressurized by the pump 96 upstream of the liquid supply unit 90 to increase the supply pressure of the ozone water to the processing space S. This allows the ozone water inside the processing space S to be pressurized to a pressure higher than atmospheric pressure, for example, and therefore prevents the ozone concentration of the ozone water around the wafer W from decreasing due to a drop in the pressure of the ozone water inside the processing space S.

[0193] That is, in this embodiment, the concentration of the ozone water around the wafer W can be maintained by pressurizing the ozone water inside the processing space S.

[0194] Therefore, according to this embodiment, the wafer W can be efficiently treated with ozone water.

[0195] In this embodiment, the wafer W is covered with a cover member 91 of the liquid supply unit 90, and ozone water is supplied toward the wafer W from a supply pipe 92 provided in the cover member 91. This allows the gap between the wafer W and the cover member 91 to be filled with fresh, undeactivated ozone water, thereby enabling the wafer W to be processed more efficiently with ozone water.

[0196] In this embodiment, the supply pipe 92 supplies ozone water toward the center of the wafer W from a supply port 92a provided in the cover member 91 at a position corresponding to the center of the wafer W. As a result, a flow of ozone water is formed in the gap between the cover member 91 and the wafer W, flowing along the bottom surface of the cover member 91 from the center of the wafer W toward the outer periphery of the wafer W, and this flow of ozone water removes air bubbles from the gap between the cover member 91 and the wafer W.

[0197] Therefore, according to this embodiment, it is possible to suppress a decrease in the processing performance of the wafer W caused by bubbles in the ozone water.

[0198] In the ozone water treatment unit 20, the seal member 86 deteriorates over time due to the internal pressure caused by the ozone water supplied to the treatment space S. An example of a deteriorated state of the seal member 86 is a state in which a protruding portion (i.e., fluff) is formed on part of the periphery of the seal member 86 on the inner surface of the seal member 86.

[0199] Therefore, the ozone water treatment unit 20 further includes an illumination unit 121 and an imaging unit 122.

[0200] The lighting unit 121 irradiates light onto the sealing member 86 of the first container member 80a when the first container member 80a and the second container member 80b are separated from each other.

[0201] The imaging section 122 is provided adjacent to the illumination section 121 and captures an image of the seal member 86 irradiated with light from the illumination section 121 .

[0202] In this way, in the ozone water treatment unit 20, the lighting unit 121 is used to illuminate the sealing member 86, and the imaging unit 122 is used to capture an image of the sealing member 86, thereby detecting any abnormality in the sealing member 86. This allows the abnormality in the sealing member 86 to be detected appropriately.

[0203] (others) In the above embodiment, the number of illumination units (e.g., illumination units 55, 57, 78, 121) and imaging units (e.g., imaging units 56, 58, 79, 122) is not particularly limited. For example, one or more illumination units may be provided. Also, for example, one or more imaging units may be provided.

[0204] In addition, the lighting units (e.g., lighting units 55, 57, 78, 121) and imaging units (e.g., imaging units 56, 58, 79, 122) may each be connected to a moving mechanism (not shown) and configured to be movable between an imaging position where imaging is performed and a standby position by this moving mechanism.

[0205] As described above, the substrate processing apparatus according to the embodiment (e.g., the drying processing unit 18 and the ozone water processing unit 20) includes a processing container (e.g., the processing container 30, 70, 80), a sealing member (e.g., the sealing member 51, 86, 721), an illumination unit (e.g., the illumination unit 55, 78, 121), and an imaging unit (e.g., the imaging unit 56, 79, 122). The processing container has a first member (e.g., the container member 31, 71, the first container member 80a) and a second member (e.g., the lid 33, 72) that can be coupled to each other. By moving the second member and coupling it to the first member, a processing space (e.g., the processing space 31a, 711, S) is formed therein for processing a substrate (e.g., a wafer W). The sealing member is provided on one of the first member and the second member and contacts the other of the first member and the second member when the first member and the second member are coupled. The illumination unit irradiates light onto the sealing member on one of the first and second members when the first and second members are separated. The imaging unit captures an image of the sealing member irradiated with light from the illumination unit. This allows for appropriate detection of abnormalities in the sealing member.

[0206] The disclosed embodiments should be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0207] 1. Substrate Processing System 6. Control device 18 Drying Processing Unit 20 Ozone Water Treatment Unit 30, 70, 80 treatment container 31,71 Container member 31a,711,S Processing Space 31b Transport entrance 32 Retaining member 33,72 Lid 33a Moving mechanism 39 Lifter 39a Lifter pin 42 Pressing member 51,86,721 Sealing material 55, 57, 78, 121 Lighting Department 56, 58, 79, 122 Imaging unit 61 Control Unit 61a Lighting control unit 61b Imaging control unit 61c Abnormality detection unit 62 Memory section 73 Support part 80a first container member 80b second container member 90 Liquid supply section 96 Pump 100 Liquid drain 182 Delivery Area W wafer

Claims

1. a processing vessel having a first member and a second member that can be coupled to each other, the second member being moved and coupled to the first member to form a processing space therein for processing a substrate; a seal member provided on one of the first member and the second member and contacting the other of the first member and the second member when the first member and the second member are joined; an illumination unit that irradiates light onto the sealing member on one of the first member and the second member in a state in which the first member and the second member are separated; an imaging unit that images the sealing member irradiated with light from the illumination unit; A substrate processing apparatus comprising:

2. an abnormality detection unit that detects an abnormality in the seal member based on an image acquired by imaging the seal member using the imaging unit; Further equipped The substrate processing apparatus according to claim 1 .

3. The abnormality detection unit A protruding portion protruding from the periphery of the seal member is identified based on the brightness in the captured image, and if the length of the identified protruding portion is equal to or greater than a threshold value, it is detected that an abnormality has occurred in the seal member. The substrate processing apparatus according to claim 2 .

4. another lighting unit that irradiates light onto a contact target area of ​​the other of the first member and the second member that comes into contact with the sealing member when the first member and the second member are separated from each other; another imaging unit that images the contact target area irradiated with light from the another illumination unit; Equipped with The abnormality detection unit An abnormality in the sealing member is detected based on another captured image obtained by capturing an image of the contact target area by the other imaging unit. The substrate processing apparatus according to claim 2 .

5. The abnormality detection unit The presence or absence of an attachment in the contact target area is determined based on the brightness in the other captured image, and when it is determined that the attachment is present in the contact target area, it is detected that an abnormality has occurred in the sealing member. The substrate processing apparatus according to claim 4 .

6. The abnormality detection unit When an abnormality is detected in the sealing member, an alert is output. The substrate processing apparatus according to claim 2 .

7. The first member is a container member having a processing space for processing the substrate with a processing fluid and a transfer port to the processing space, The second member is a lid that can open and close the transfer port, The sealing member is a ring-shaped groove provided on one of the container member and the lid body, surrounding the transfer port; The processing vessel comprises: The substrate, on whose surface a liquid film is formed, is brought into contact with the processing fluid in a supercritical state, and a drying process is performed to dry the substrate. The substrate processing apparatus according to claim 1 .

8. a pressing member that presses the lid toward the processing space against an internal pressure generated by the processing fluid in a supercritical state supplied to the processing space within the container member; Further equipped The substrate processing apparatus according to claim 7 .

9. a holding member provided on the lid and holding the substrate; a moving mechanism that moves the holding member between a delivery area adjacent to the container member and the inside of the container member; Furthermore, The illumination unit and the imaging unit are Placed in the delivery area The substrate processing apparatus according to claim 7 .

10. a lifter disposed in the delivery area and having substrate support pins; a lifting mechanism that raises and lowers the lifter between a transfer position where the substrate is transferred between the substrate support pins and a substrate transport device, and a standby position where the substrate support pins are positioned below the holding members; Furthermore, The imaging unit In a state where the holding member not holding the substrate is arranged in the delivery area together with the lid body, an image of the sealing member irradiated with light from the lighting unit is taken before the lifter rises from the standby position to the delivery position. The substrate processing apparatus according to claim 9 .

11. a support portion provided in the container member and supporting the substrate from below; Furthermore, The imaging unit With the container member and the lid body separated, an image of the sealing member irradiated with light from the illumination unit is captured before the substrate is transported to the support unit through the transport port. The substrate processing apparatus according to claim 7 .

12. an ozone water supply unit that supplies ozone water to the treatment space; an ozone water discharge unit that discharges the ozone water from the treatment space; a pressurizing unit that pressurizes the ozone water upstream of the ozone water supply unit; Further equipped The substrate processing apparatus according to claim 1 .

13. a processing vessel having a first member and a second member that are connectable to each other, the processing vessel forming a processing space therein for processing a substrate by moving the second member to connect to the first member; a sealing member provided on one of the first member and the second member and contacting the other of the first member and the second member when the first member and the second member are connected; an illumination unit that irradiates light onto the sealing member on one of the first member and the second member when the first member and the second member are separated; and an imaging unit that images the sealing member irradiated with light from the illumination unit, in a substrate processing apparatus comprising: a step of irradiating light onto the sealing member on one of the first member and the second member using the illumination unit when the first member and the second member are separated; taking an image of the sealing member irradiated with the light using the imaging unit; detecting an abnormality in the sealing member based on an image captured by the imaging unit; A method for detecting an abnormality in a seal member in a substrate processing apparatus, comprising:

Images