Joining device, determination device, and article manufacturing method

Abstract

To provide a joining device that can determine whether to replace a collet while suppressing a decrease in productivity.SOLUTION: A joining device that bonds a die to an object to be bonded includes a first holding unit that holds the die, and a determination unit that determines whether to replace the first holding unit on the basis of history information regarding the bonding of the die to the object to be bonded using the first holding unit.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a joining device, a determination device, and a method for manufacturing an article. [Background technology]

[0002] As a semiconductor manufacturing equipment for manufacturing semiconductor devices, there is a bonding machine that bonds multiple dies to a workpiece (e.g., a substrate). The bonding machine performs a process of bonding the dies held by a head to the workpiece. A jig (collet) that comes into contact with the dies is located at the tip of the head.

[0003] Patent Document 1 discloses a method of replacing a collet based on the results of detecting the shape of the collet using a collet inspection unit equipped with a shape detection sensor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-75446 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the method of determining whether to replace the collet based on the result of detecting the shape of the collet, it takes time to detect the shape of the collet.

[0006] Therefore, an object of the present invention is to provide a joining device that can determine whether to replace a collet while suppressing a decrease in productivity. [Means for solving the problem]

[0007] In order to achieve the above object, one aspect of the present invention provides a bonding apparatus that bonds a die and an object to be bonded, characterized in that it has a first holding unit that holds the die, and a judgment unit that judges whether to replace the first holding unit based on history information regarding the bonding of the die and the object to be bonded using the first holding unit.

[0008] Further objects and other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a joining device that can determine whether to replace a collet while suppressing a decrease in productivity. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a diagram showing a configuration of a joining device in a first embodiment. FIG. [Figure 2] FIG. 2 is a schematic diagram of a head holding a die. [Figure 3] FIG. 2 is a view of the substrate stage as seen from the +Z-axis direction. [Figure 4] FIG. 2 is a flowchart showing a bonding method according to the present embodiment. [Figure 5] FIG. 10 is a schematic diagram showing an inspection device and a determination device according to a second embodiment. [Figure 6] FIG. 10 is a flowchart showing a process for determining whether to replace the collet in the second embodiment. [Figure 7] FIG. 10 is a flowchart showing a method for manufacturing an article according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and the embodiments may be combined in any manner. Furthermore, in the drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0012] In addition, in this specification and drawings, directions are basically shown using an XYZ coordinate system in which the vertical direction is the Z axis and the horizontal plane perpendicular to the vertical direction is the XY plane, with each axis being orthogonal to the other. However, if an XYZ coordinate system is shown in each drawing, that coordinate system takes precedence.

[0013] Specific configurations of each embodiment will be described below.

[0014] First Embodiment 1 is a diagram showing the configuration of a bonding apparatus 100 in this embodiment. The bonding apparatus 100 is an apparatus that bonds a die 51 to an object to be bonded 6. The die 51 can be a die that has been separated into individual dies through a dicing process (cutting process), a stack of several separated dies, a small piece of material, an optical element, a MEMS, or other structure.

[0015] The object to be bonded 6 may be a silicon wafer, a silicon wafer on which wiring is formed, a glass wafer, a glass panel on which wiring is formed, a printed wiring board (PWB) on which wiring is formed, a printed circuit board (PCB) on which electronic components are mounted, or a metal panel. Alternatively, the object to be bonded 6 may be a substrate on which a die on which a semiconductor device is formed is bonded to a wafer on which a semiconductor device is formed.

[0016] Furthermore, this embodiment does not limit the bonding method between the die 51 and the object 6 to a specific bonding method. For example, any bonding method may be employed, such as bonding with an adhesive, temporary bonding with a temporary adhesive, bonding by hybrid bonding, atomic diffusion bonding, vacuum bonding, bump bonding, etc., and various temporary and permanent bonding methods may be used.

[0017] The bonding device 100 may include a pickup unit 3 and a bonding unit 4 mounted on a base 1 that is vibration-damped by a mount 2. The bonding device 100 bonds dies 51, which are arranged on a dicing tape attached to a dicing frame 5, to any position on an object 6 to be bonded. In the example of FIG. 1, the pickup unit 3 and the bonding unit 4 are mounted on the same base, but the pickup unit 3 and the bonding unit 4 may also be mounted on separate bases.

[0018] The pickup unit 3 may include a pickup head 31 and a release head 32. The release head 32 peels the dicing tape from the die 51, and the pickup head 31 adsorbs the die 51 from which the dicing tape has been peeled off by the release head 32. The pickup head 31 rotates around the Y axis so that the adsorbed die 51 is positioned on the +Z direction side of the pickup head 31, and delivers the die 51 to the bonding head 423.

[0019] In this embodiment, an example has been shown in which the pickup head 31 rotates to transfer the die 51 to the bonding head 423, but the present invention is not limited to this example. For example, two or more die holders may be provided, and the die 51 may be transferred between the die holders to transfer the die 51 to the bonding head 423. Alternatively, the bonding head 423 may be configured to pick up the die 51 using a drive mechanism for the bonding head 423.

[0020] Furthermore, in order to improve productivity, a plurality of pickup units, a plurality of pickup heads, a plurality of release heads, and a plurality of bonding heads may be arranged.

[0021] FIG. 2 is a schematic diagram of a head that holds a die 51. This head is a pickup head 31 or a bonding head 423. The head that holds the die 51 includes a collet holder 312 that holds a collet 311 and a main body 313 that holds the collet holder 312. The collet holder 312 holds a collet (first holding part) 311, which is a jig that comes into contact with the die 51. FIG. 2(a) shows a state in which the collet 311, collet holder 312, and main body 313 are not integrated. FIG. 2(b) shows a state in which the collet 311, collet holder 312, and main body 313 are integrated. When performing a bonding process, the collet 311, collet holder 312, and main body 313 are integrated as shown in FIG. 2(b).

[0022] The collet holder 312 is held by the main body 313, and the collet 311 is held by the collet holder 312, for example, by suctioning gas in the space between the object to be held and the object being held, or by a mechanism such as a claw, or by magnetic force from a magnet.

[0023] Collet 311 holds die 51 on holding surface 311a. The collet is made of a material such as fluororubber, PEEK material, or SUS. Collet 311 holds die 51 by, for example, sucking gas from the space between holding surface 311a and die 51.

[0024] The collet holder 312 is always held by the main body 313. On the other hand, the collet 311 may be replaced depending on the type of die 51. Alternatively, the collet 311 may be replaced depending on damage (wear) or contamination that occurs when multiple dies 51 are joined together in sequence.

[0025] For example, when collet 311 is replaced due to damage or contamination, the used collet is discarded in collet disposal unit 451 shown in Fig. 1, and a new collet supplied from collet supply unit 452 is attached to collet holder 312. At this time, removal and attachment of collet 311 is performed, for example, by a collet replacement hand (not shown).

[0026] The bonding unit 4 includes a stage base 41 and an upper base 42, and a substrate stage 43 is mounted on the stage base 41. The substrate stage 43 can be driven in the X and Y directions and rotated around the Z axis by a drive unit such as a linear motor (not shown). Note that the rotational movement does not necessarily have to be performed by the substrate stage 43, and may be performed on the bonding head 423 side.

[0027] A first observation camera 431 is mounted on the substrate stage 43. The first observation camera 431 measures the positions of characteristic points of the die 51, the outer dimensions of the die 51, and the height direction distances of multiple points on the measurement surface. Therefore, the first observation camera 431 can be used to measure the position, outer dimensions, and flatness of the die 51 held by the bonding head 423.

[0028] A bar mirror 432 is arranged on the side of the substrate stage 43. The bar mirror 432 serves as a target for the interferometer 422. Furthermore, a substrate chuck (second holding unit) 433 that chucks (holds) the object to be bonded 6 is mounted on the substrate stage 43. The method of chucking the substrate by the substrate chuck 433 may be a vacuum suction method or an electrostatic adsorption method.

[0029] The upper base 42 supports a second observation camera 421, an interferometer 422 for measuring the position of the substrate stage 43, and a bonding head 423. The second observation camera 421 is a camera that measures the positions of feature points (such as element patterns or marks) on the object 6 and the distances in the Z direction between multiple points to measure flatness, and is, for example, a camera that uses infrared light as a measurement light source.

[0030] The substrate stage 43 includes a drive mechanism (not shown), which drives the substrate chuck 433 or the substrate stage 43 in the +Z direction to bring the die 51 and the object 6 closer to each other, bringing them into contact and bonding. After bonding the die 51 and the object 6, the substrate chuck 433 or the substrate stage 43 is driven in the -Z direction to return the substrate chuck 433 or the substrate stage 43 to its original position in the Z axis direction. The drive mechanism may be included in the bonding head 423, and the bonding operation between the die 51 and the object 6 may be performed by driving the bonding head 423 in the Z axis direction. Alternatively, the drive mechanism may be included in both the substrate stage 43 and the bonding head 423, and the bonding operation between the die 51 and the object 6 may be performed by driving the substrate chuck 433 or the substrate stage 43 and the bonding head 423 in the Z axis direction. That is, any relative drive mechanism may be used as long as it drives the bonding head 423 and the substrate chuck 433 relative to each other so that the distance between the die 51 and the object 6 to be bonded can be changed by a drive mechanism (not shown).

[0031] Furthermore, when joining the die 51 and the object 6 to be joined, the die 51 and the object 6 to be joined may be brought into contact with each other while deforming the die 51 by controlling the pressure in the internal space of the collet 311 that holds the die 51.

[0032] The control unit 441 comprehensively controls each unit of the bonding apparatus 100. The control unit 441 can also be a determination unit (determination device) that determines whether to replace the collet 311 using a method described below. The control unit 441 is configured, for example, by a computer (information processing device) having a processor such as a CPU and a storage unit such as a memory. The control unit 441 may be disposed inside the housing of the bonding apparatus or outside the housing. The control unit 441 disposed outside the housing of the bonding apparatus may be realized, for example, by a computer that functions as a control server connected to the bonding apparatus via a network. The storage unit 442 stores information including history information regarding the bonding of the die 51 and the workpiece 6 described below.

[0033] FIG. 3 is a view of the substrate stage 43 as viewed from the +Z-axis direction. The object 6 is held by a substrate chuck 433. The bar mirror 432 may include at least two bar mirrors so that the position of the object 6 can be measured in the X-axis direction, the Y-axis direction, and the rotation direction around the Z-axis. The bar mirror 432a serves as a target for an interferometer 422a that measures the position in the X-axis direction and an interferometer 422c that measures the rotation amount around the Z-axis based on the difference between the interferometer 422a and the bar mirror 432b that measures the position in the Y-axis direction. The interferometer 422 measures the position of the substrate stage 43 in the X-axis direction, the position in the Y-axis direction, and the rotation amount around the Z-axis in real time. The control unit 441 performs feedback control of the stage drive unit in real time based on the measurement results from the interferometer 422, thereby positioning the substrate stage 43 with high precision. As described above, positioning in this embodiment is performed by highly accurate position measurement by the interferometer and feedback control based on the results.

[0034] A reference plate 434 on which multiple marks (including marks 434a, 434b, and 434c) are drawn is disposed next to the substrate chuck 433. The reference plate 434 preferably has a low thermal expansion coefficient and the marks are drawn with high positional accuracy. In one example, the reference plate 434 may be a quartz substrate on which the marks are drawn using a drawing method used in semiconductor lithography. The reference plate 434 is preferably configured at the same height as the surface of the workpiece 6 and can be observed by the second observation camera 421, although this does not necessarily apply if a separate camera for observing the reference plate is configured. The substrate stage 43 may include a coarse-motion stage capable of moving over a large range and a fine-motion stage disposed on the coarse-motion stage and capable of moving over a small range with high precision. In this case, the first observation camera 431, the bar mirror 432, the substrate chuck 433, and the reference plate 434 are preferably fixed on the fine-motion stage for high-precision positioning.

[0035] The control unit 441 uses the results of observing the reference plate 434 with the second observation camera 421 to guarantee the origin position, magnification, X-axis and Y-axis directions (rotation), and orthogonality of the substrate stage 43. Mark 434a is observed with the second observation camera 421, and the measurement value of the interferometer when mark 434a is at the center of the image acquired by the camera is set as the origin of the substrate stage 43. Next, mark 434b is observed with the second observation camera 421, and the Y-axis direction and Y-magnification of the substrate stage 43 are determined from the measurement value of the interferometer when mark 434b is at the center of the image acquired by the camera. Next, mark 434c is observed with the second observation camera 421, and the X-axis direction and X-magnification of the substrate stage 43 are determined from the measurement value of the interferometer when mark 434c is at the center of the image acquired by the camera. Specifically, the direction from mark 434b toward mark 434a on the reference plate 434 is defined as the Y-axis direction, and the direction from mark 434c toward mark 434a is defined as the X-axis direction, and calibration of the axis direction and orthogonality is performed. Calibration is also performed using the distance between marks 434b and 434a as the Y-axis scale reference, and the distance between marks 434c and 434a as the X-axis scale reference. Because the measurement values ​​of an interferometer fluctuate due to changes in the refractive index of the interferometer optical path caused by changes in air pressure and temperature, it is desirable to perform calibration at any time to ensure the origin position, magnification, rotation, and orthogonality of the substrate stage 43. To reduce fluctuations in the measurement values ​​of the interferometer, it is desirable to have the temperature of the space in which the substrate stage 43 is placed controlled in a temperature-controlled chamber.

[0036] In the above example, the reference plate 434 on the substrate stage 43 is observed by the second observation camera 421. Instead of this configuration, the reference plate 434 may be attached to the upper base 42 and observed by the first observation camera 431. With this configuration, the origin position, magnification, rotation, and orthogonality of the substrate stage 43 can also be guaranteed.

[0037] In the above example, calibration is performed by observing the reference plate 434. Instead, calibration may be performed by, for example, abutting against a reference surface, or high-precision positioning may be performed using a position measurement unit that guarantees absolute values, such as a white light interferometer.

[0038] FIG. 4 is a flowchart of the bonding method according to this embodiment. First, the objects 6 are carried in by a transport device (not shown) (S1001). Since adhesion of foreign matter to the bonding surfaces of the die 51 or the objects 6 can cause bonding defects, the inside of the bonding apparatus 100 is a clean space of about Class 1. To maintain high cleanliness, the objects 6 are housed in a sealed container, such as a FOUP, and are carried into the bonding apparatus 100 from that container. To enhance cleanliness, the objects 6 may be cleaned in the bonding apparatus 100 after being carried in. Pretreatment for bonding is also performed. For example, when bonding is performed using an adhesive, the adhesive is applied to the objects 6. When bonding is performed by hybrid bonding, a treatment to activate the surfaces of the objects 6 is performed. In a pre-alignment unit (not shown), the rotation direction of the objects 6 is adjusted based on a notch or orientation flat formed in the objects 6, and the object 6 is roughly positioned based on the outer shape of the objects 6. Thereafter, the object 6 is held by a substrate chuck 433 on the substrate stage 43 .

[0039] Next, the control unit 441 controls the alignment of the object 6 to be bonded based on the result of measuring the position of the object 6 using the second observation camera 421 (S1002). The focus adjustment of the second observation camera 421 may be performed by a focus adjustment mechanism provided in the second observation camera 421, or may be performed by moving the object 6 to the Z-axis direction by a drive mechanism of the substrate stage 43. The alignment measurement can be performed by measuring an alignment mark formed in advance on the object 6 to be bonded. When no alignment mark is formed on the object 6 to be bonded, the alignment measurement is performed by measuring a feature point whose position can be specified. The control unit 441 measures the position of the feature point by measuring the image position of the projected feature point with respect to the center of the image acquired by imaging by the second observation camera 421. To perform high-precision measurement relative to the reference point of the bonding apparatus, the substrate stage 43 is driven in advance so that the mark formed on the reference plate 434 is within the field of view of the second observation camera 421, and the second observation camera 421 measures the position of the mark on the reference plate 434. The amount of offset relative to the measurement position measured by the second observation camera 421 is determined from the drive position of the substrate stage 43 at that time and the mark position measured by the second observation camera 421, thereby enabling high-precision measurement of the position relative to the reference point of the bonding apparatus 100. It is also desirable to measure the surface position of the bonding surface of the workpiece 6 using a height measurement unit (not shown) during step S1002. The thickness of the workpiece 6 varies from position to position, and the surface position of the workpiece 6 is important for accurately managing the gap between the die 51 and the workpiece 6 during the bonding operation. If the workpiece 6 is a substrate or panel on which no pattern is formed, the alignment in step S1002 does not need to be performed.

[0040] The above has described the processing related to the article 6. Next, a description will be given of the processing related to the die 51, which is performed in parallel with step S1001 and step S1002.

[0041] First, the dicing frame 5 is carried in by a transport device (not shown) (S2001). A dicing tape is attached to the dicing frame 5, and dies 51 are arranged on the dicing tape.

[0042] Next, the control unit (determination unit) 441 determines whether or not to replace the collet 311 based on the information stored in the storage unit 442 (S2002, determination step). The determination in step S2002 may be performed for the collet included in the pickup head 31, or may be performed for the collet included in the bonding head 423. Alternatively, it may be performed for both the collet included in the pickup head 31 and the collet included in the bonding head 423. The determination in step S2002 will be described in detail later.

[0043] If it is determined in step S2002 that the collet 311 is to be replaced, the collet 311 is replaced (S2003), and the process proceeds to step S2004. The collet 311 is replaced by a collet replacement hand (not shown), as described above. If it is determined in step S2002 that the collet 311 is not to be replaced, the process proceeds to step S2004 without performing step S2003.

[0044] Next, the die 51 is picked up by the pickup head 31 (S2004). In step S2004, first, the control unit 441 moves the pickup head 31 and the release head 32 to the position of the die 51 to be picked up. Then, while the pickup head 31 adsorbs the die 51, the release head 32 peels the die 51 and the dicing tape off, and the pickup head 31 holds the die 51.

[0045] Next, the control unit 441 controls the pickup head 31 to transfer the die 51 to the bonding head 423 (S2005). Pre-processing for bonding may be performed during step S2005. The pre-processing may be, for example, a cleaning process for the die 51, or, in the case of bonding using an adhesive, application of an adhesive to the die 51. In addition, in the case of bonding by hybrid bonding, the pre-processing may be a process for activating the surface of the die 51.

[0046] Next, the control unit 441 controls the alignment of the die 51 based on the results of measuring the position of the die 51 held by the bonding head 423 using the first observation camera 431 (S1003). In step S1003, the control unit 441 drives the substrate stage 43 so that a feature point of the die 51 is within the field of view of the first observation camera 431. The feature point may be an element pattern or an alignment mark within the die 51. Alternatively, all or part of the measured external dimensions and shape of the die 51 may be treated as the feature point. The focus adjustment may be performed, for example, by a focus adjustment mechanism of the first observation camera 431. Alternatively, the focus adjustment may be performed by driving the die 51 in the Z-axis direction using a drive mechanism of the bonding head 423. Alternatively, the focus adjustment may be performed by driving the first observation camera 431 in the Z-axis direction using a drive mechanism of the substrate stage 43 on which the first observation camera 431 is mounted.

[0047] Furthermore, it is desirable to measure the surface position of the die 51 using a height measurement unit (not shown) during step S1003. The thickness of each of the multiple dies 51 varies, and the position of the surface of the die 51 is important for managing the gap between the die 51 and the object 6 to be bonded with high precision during the bonding operation. Here, the height may be measured at multiple positions within the surface of the die 51, and the attitude of the die 51 or the object 6 to be bonded may be adjusted by a tilt mechanism (not shown) during bonding. The tilt mechanism may be provided on any of the substrate stage 43, the substrate chuck 433, and the bonding head 423.

[0048] Next, the control unit 441 drives the substrate stage 43 so that the die 51 is positioned above the bonding position on the object 6 (S1004). In other words, the die 51 is placed above the bonding position on the object 6. The control unit 441 measures the position of the substrate stage 43 with the interferometer 422 and performs feedback control of the substrate stage 43 in real time, thereby positioning the substrate stage 43 with high precision.

[0049] Next, the die 51 and the workpiece 6 are brought into contact with each other to perform the joining operation (S1005). Next, the storage unit 442 stores (updates) history information related to the joining of the die 51 and the workpiece 6 in association with information on the currently used collet 311 (S1006). The information on the collet 311 includes at least one of information on the type of collet 311, identification information of the collet 311 (for example, a control number, etc.), information on the material of the collet 311, and information on the size. Note that in this embodiment, the history information related to the joining of the die 51 and the workpiece 6 indicates history information on joining multiple dies to one or multiple workpieces.

[0050] In this embodiment, the storage (update) in step S1006 manages history information related to the bonding of the die 51 and the object 6 for each collet. The history information related to the bonding of the die 51 and the object 6 includes at least one of information on the number of times bonding has been performed, information on the number of times the die 51 has been picked up, information on the shape and size of the bonded die 51, and information acquired during bonding. The information acquired during bonding is information acquired by the control unit 441 when the die 51 and the object 6 are bonded. The information acquired during bonding includes at least one of the current applied to press the die 51 against the object 6, the pressure applied to the space inside the collet 311, and the time it takes for the collet 311 to hold the die 51.

[0051] The current applied to press the die 51 against the workpiece 6 is a current (pressing force) applied to press the die 51 when pressing the die 51 against the workpiece 6 to bond the die 51. The current applied to press the die 51 is, for example, a current applied to a head (mechanism) including the collet 311. When the history information regarding the bonding between the die 51 and the workpiece 6 is information about a current applied to press the die 51, information about a target value of the current used in controlling the application of the current to the head may be used. Alternatively, information about the current actually applied when applying the current to the head, or a measurement result of the current applied to the head may be used.

[0052] The pressure applied to the space within the collet 311 is the pressure applied to the space within the collet 311 in order to deform the die 51 when the die 51 and the workpiece 6 are bonded together. When the history information regarding the bonding of the die 51 and the workpiece 6 is information about the pressure applied to the space within the collet 311 in order to deform the die 51 when bonding, information about the target value of control may be used, as with the current described above. Alternatively, information about the actually applied pressure or the result of measuring the pressure may be used. Alternatively, the deformation of the collet 311 may be measured, the applied pressure may be calculated from the deformation of the collet 311, and the calculation result may be used.

[0053] The history information regarding the bonding of the die 51 and the workpiece 6 is information obtained by accumulating each piece of information (values) included in the history information based on the bonding history (performance), and the information in the storage unit 442 is updated each time a bonding process is performed. For example, in the case of information regarding the number of bonding operations, the cumulative number of bonding operations is associated with information about the collet 311 and stored in the storage unit 442. For example, in the case of information regarding pressure, the cumulative amount of applied pressure is associated with information about the collet 311 and stored in the storage unit 442. In other words, the history information regarding the bonding of the die 51 and the workpiece 6 is cumulative information (information about cumulative values ​​of usage performance) of the history (performance) of bonding the die 51 and the workpiece 6.

[0054] Next, the control unit 441 determines whether or not bonding of all the dies 51 to be bonded to the article 6 has been completed (S1007). If it is determined in step S1007 that bonding of all the dies 51 to be bonded to the article 6 has been completed, the article 6 to be bonded (first object) to which the plurality of dies 51 have been bonded is carried out by a conveying device (not shown) (S1008), and the process ends. If it is determined in step S1007 that bonding of all the dies 51 to be bonded to the article 6 has not been completed, the process returns to step S2002.

[0055] In this embodiment, the determination in step S1007 and steps S2002 to S2004 are performed after the bonding operation in step S1005. However, the determination in step S1007 and steps S2002 to S2004 may be performed in parallel with steps S1003 to S1005. Furthermore, when a die of a type different from the die 51 that has undergone (is undergoing) the bonding operation is to be bonded next, step S2001 is performed as necessary.

[0056] It should be noted that the number of dies 51 on the dicing frame 5 may differ from the number of dies 51 to be bonded to the object 6. Therefore, the loading of the object 6 and the loading of the dicing frame 5 are not synchronized. If there are not enough dies 51 on the dicing frame 5 during a series of bonding processes for one object 6, the next dicing frame is loaded. Furthermore, if there are dies 51 remaining on the dicing frame 5 after the series of bonding processes for one object 6 is completed, the remaining dies 51 are used to bond the next object 6.

[0057] The determination in step S2002 will be described in detail. The collet 311 included in the pickup head 31 or the bonding head 423 may become damaged or contaminated due to multiple attempts to hold the die 51. If the collet 311 is damaged or contaminated, the die 51 may fail to be picked up or may fall off due to insufficient holding force. Furthermore, insufficient holding force for holding the die 51 may adversely affect the bonding accuracy when bonding the die 51 to the workpiece 6. Therefore, if the collet 311 is damaged or contaminated, it must be replaced. Therefore, in this embodiment, in step S2002, the control unit (determination unit) 441 determines whether to replace the collet 311 based on history information related to bonding between the die 51 and the workpiece 6 stored in the memory unit 442. The deterioration in the holding performance of the collet 311 to hold the die 51 due to damage or contamination of the collet 311 varies depending on the material and size of the collet 311. Therefore, a replacement standard is determined in advance for each collet 311. The control unit 441 compares the replacement standard (reference value) of the target collet 311 (the collet 311 currently being used) with the history information regarding the bonding between the die 51 and the workpiece 6, and determines whether or not to replace the collet 311.

[0058] This determination is made based on the cumulative value of information included in the history information regarding the bonding of one or more dies 51 and the object 6 to be bonded. For example, it may be determined that the collet 311 needs to be replaced when the cumulative value of any of the information exceeds a reference value. Alternatively, it may be determined that the collet 311 needs to be replaced when the cumulative value of two or more (multiple types of) information exceeds a reference value. Alternatively, it may be determined that the collet 311 needs to be replaced when the cumulative value of a predetermined piece or pieces of information exceeds a reference value. For example, it may be determined that the collet 311 needs to be replaced when the number of bonding times exceeds a reference value and the cumulative value of the pressure values ​​exceeds a reference value.

[0059] The type of collet to be used varies depending on the type of die 51 to be joined. Therefore, the storage unit 442 manages history information relating to the joining of the die 51 and the workpiece 6 for each collet, and updates the history information (information on the cumulative value of usage results) relating to the joining of the die 51 and the workpiece 6 in association with the information on the collet used for joining.

[0060] Furthermore, in the present embodiment, an example has been shown in which it is determined whether or not to replace the collet 311 based on the cumulative value of the usage history of the collet 311, but the present invention is not limited to this example. For example, the control unit (determination unit) 441 may predict the time to replace the collet from information on the cumulative value of the usage history. Specifically, the number of bondings until the replacement criterion is reached may be predicted, and the collet may be replaced when the predicted number of bondings is reached. Note that the predicted information is not limited to the number of bondings, and may be other information included in the history information regarding the bonding of the die 51 and the workpiece 6. The predicted information, such as the number of bondings until replacement, the number of substrates processed until replacement, and the replacement date, may be displayed on the display unit (display) under the control of the display control unit. This display format may be a list format or a calendar format.

[0061] Furthermore, the replacement standard (standard value) of the history information regarding the bonding of the die 51 and the workpiece 6 may be updated (set) based on the actual results. For example, a pressure sensor may be provided inside the collet 311, and damage (wear) of the collet 311 may be predicted from the pressure value when the die 51 is held by suction, and the replacement standard may be updated based on the prediction result. Furthermore, this replacement standard may be updated based on data obtained from a plurality of bonding devices.

[0062] In the present embodiment, the control unit 441 in the bonding apparatus 100 determines whether or not to replace the collet 311, but the present invention is not limited to this example. For example, the determination may be made by an external information processing device. When the determination is made by an external information processing device, the information processing device has an acquisition unit that acquires information in which history information regarding the bonding of the die 51 and the workpiece 6 is associated with information about the collet 311.

[0063] According to this embodiment, it is possible to determine whether the collet 311 needs to be replaced without detecting the shape of the collet 311. In other words, it is possible to determine whether the collet 311 needs to be replaced without having to stop production in order to determine whether the collet 311 needs to be replaced. Therefore, it is possible to determine whether the collet 311 needs to be replaced while suppressing a decrease in productivity, and it is also possible to suppress the occurrence of errors due to insufficient holding force of the collet 311, which is advantageous from the viewpoint of productivity.

[0064] Second Embodiment This embodiment differs from the first embodiment in the information based on which a decision is made to replace the collet 311. In the first embodiment, a decision is made to replace the collet 311 based on history information related to the joining of the die 51 and the article 6. In this embodiment, a decision is made to replace the collet 311 based on information related to the inspection results of the first object obtained by joining the die 51 and the article 6.

[0065] 5 is a schematic diagram showing an inspection device 400 and a determination device 500 of this embodiment. The inspection device 400 inspects a first object obtained by bonding a die 51 and an object 6 to be bonded using the bonding device 100. The inspection device 400 inspects the bonding accuracy between the die 51 and the object 6 to inspect, for example, the positional deviation (overlay accuracy) of the bonding position of the die 51 relative to the desired bonding position of the object 6 to be bonded. Alternatively, the inspection device 400 inspects the electrical characteristics of the first object.

[0066] The inspection results of the first object are affected by various conditions of the joining process. Here, for example, if the collet 311 is damaged or contaminated, a specific trend will appear in the inspection results of the first object. Therefore, the determination device 500 of this embodiment determines whether to replace the collet 311 based on the inspection results of the first object. The determination device 500 may be disposed inside the joining device 100, inside the inspection device 400, or may be an information processing device external to the joining device 100 or the inspection device 400.

[0067] The determination device 500 includes an acquisition unit 501 that acquires information about the inspection results of the inspection device 400, and a determination unit 502 that determines whether or not to replace the collet 311 based on the information about the inspection results acquired by the acquisition unit 501.

[0068] 6 is a flowchart showing a process for determining whether to replace the collet 311 in this embodiment. First, the acquisition unit 501 acquires information about the inspection results of the first object inspected by the inspection device 400 (S3001, acquisition step).

[0069] Next, the determination unit 502 determines whether to replace the collet 311 based on the information about the inspection result acquired in step S3001 (S3002, determination step). The determination unit 502 compares the information about the inspection result with a replacement standard predetermined for each collet 311 to determine whether to replace the collet 311. This determination may be made, for example, by determining that the collet 311 should be replaced when the difference between the inspection result and an index value (e.g., a design value) exceeds a reference value (threshold value).

[0070] Next, the determination unit 502 transmits information about the determination result (whether or not to replace the collet 311) to the joining device 100 (S3003, transmission step). Note that if the determination device 500 is located inside the joining device 100, step S3003 does not need to be performed.

[0071] According to this embodiment, as with the first embodiment, it is possible to determine whether to replace the collet 311 while suppressing a decrease in productivity, and it is also possible to suppress the occurrence of errors due to insufficient holding force of the collet 311, which is advantageous from the standpoint of productivity.

[0072] <Third embodiment> 7 is a flowchart showing the method for manufacturing an article in this embodiment. First, a joining step (S4001) is performed in which the die 51 held by the collet 311 (first holding part) and the article 6 held by the substrate chuck 433 (second holding part) are joined together. Next, a determination step (S4002) is performed in which a determination is made as to whether or not to replace the collet 311 based on the history information or information on the inspection results relating to the joining of the die 51 and the article 6 described above. Next, a manufacturing step (S4003) is performed in which an article is manufactured from the first object in which the die 51 and the article 6 are joined together.

[0073] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, LEDs, sensors, optical devices, and the like.

[0074] The manufacturing process includes, for example, packaging. According to this manufacturing method, it is possible to manufacture an article while suppressing a decrease in productivity.

[0075] The disclosure of the present specification includes the following joining device, determination device, and method for manufacturing an article.

[0076] [Item 1] A joining device for joining a die and an object to be joined, a first holder for holding the die; a determination unit that determines whether to replace the first holding unit based on history information related to bonding of the die and the object using the first holding unit; A joining device comprising:

[0077] [Item 2] 2. The bonding device according to item 1, wherein the first holding part is a collet held by at least one of a pickup head and a bonding head.

[0078] [Item 3] 3. The bonding device according to item 1 or 2, wherein the history information is a cumulative value of usage results when a plurality of dies are bonded to one or a plurality of objects to be bonded.

[0079] [Item 4] 4. The joining device according to any one of items 1 to 3, wherein the history information is managed for each of the first holding parts.

[0080] [Item 5] 5. The bonding device according to any one of items 1 to 4, wherein the history information includes information on the number of bonding operations or information on the number of times the die has been picked up.

[0081] [Item 6] 6. The bonding device according to any one of items 1 to 5, wherein the history information includes at least one of a pressure applied to a space in the first holding part to deform the die during bonding, a current applied to a mechanism including the first holding part to press the die when pressing the die against the workpiece to bond it, and a time taken for the first holding part to hold the die.

[0082] [Item 7] 7. The joining device according to any one of items 1 to 6, wherein the determination unit makes a determination based on a plurality of types of information included in the history information.

[0083] [Item 8] The joining device according to any one of items 1 to 7, wherein the determination unit determines that the first holding unit should be replaced when a value included in the history information exceeds a reference value.

[0084] [Item 9] 9. The joining device according to any one of items 1 to 8, wherein the determining unit predicts when to replace the first holding unit.

[0085] [Item 10] 10. The joining device according to item 9, further comprising a display control unit that controls the display of information about the replacement time predicted by the determination unit on a display unit.

[0086] [Item 11] 11. The bonding device according to any one of items 1 to 10, wherein the reference value used for the judgment of the judgment unit is updated based on the performance when the first holding unit holds the die.

[0087] [Item 12] 12. The junction device according to item 11, wherein the update is based on information obtained from a plurality of junction devices.

[0088] [Item 13] an acquiring unit that acquires information in which information of the first holding unit is associated with history information regarding bonding of the die and the object to be bonded using the first holding unit; a determination unit that determines whether to replace the first holding unit based on the history information; A determination device comprising:

[0089] [Item 14] an acquisition unit that acquires information about an inspection result of a first object in which the die and the object to be bonded are bonded; a determination unit that determines whether to replace a first holder that holds the die based on information about the inspection results obtained by the acquisition unit.

[0090] [Item 15] Item 15. The determination device according to item 14, wherein the inspection result is an inspection result of the position of the die relative to the position of the workpiece, or an inspection result of the electrical characteristics of the first object.

[0091] [Item 16] a joining step of joining the die held by the first holding part and the object to be joined held by the second holding part; a determination step of determining whether to replace the first holding part based on history information or information regarding inspection results; a manufacturing process of manufacturing an article from a first object in which the die and the object to be bonded are bonded, the history information is information about a history of bonding between the die and the workpiece using the first holding unit, A method for manufacturing an article, characterized in that the information regarding the inspection results is information regarding the results of inspecting the first object.

[0092] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

Claims

1. A joining device for joining a die and an object to be joined, a first holder for holding the die; a determination unit that determines whether to replace the first holding unit based on history information related to bonding of the die and the workpiece using the first holding unit; A joining device comprising:

2. 2. The bonding apparatus according to claim 1, wherein the first holding portion is a collet held by at least one of a pickup head and a bonding head.

3. 2. The bonding apparatus according to claim 1, wherein the history information is an accumulated value of usage results when a plurality of dies are bonded to one or a plurality of workpieces.

4. The joining device according to claim 1 , wherein the history information is managed for each of the first holding units.

5. 2. The bonding apparatus according to claim 1, wherein the history information includes information on the number of bonding operations or information on the number of times the die has been picked up.

6. 2. The bonding apparatus according to claim 1, wherein the history information includes at least one of a pressure applied to a space within the first holding unit to deform the die during bonding, a current applied to a mechanism including the first holding unit to press the die when pressing the die against the workpiece to bond it, and a time taken for the first holding unit to hold the die.

7. The joining device according to claim 1 , wherein the determination unit makes a determination based on a plurality of types of information included in the history information.

8. The joining device according to claim 1 , wherein the determining unit determines that the first holding unit should be replaced when a value included in the history information exceeds a reference value.

9. The joining device according to claim 1 , wherein the determining unit predicts when to replace the first holding unit.

10. The joining device according to claim 9, further comprising a display control unit that controls displaying information about the replacement time predicted by the determination unit on a display unit.

11. 2. The bonding device according to claim 1, wherein the reference value used for the judgment by the judgment unit is updated based on the performance of the first holder when holding the die.

12. The bonding device of claim 11 , wherein the update is based on information obtained from multiple bonding devices.

13. an acquiring unit that acquires information in which information of the first holding unit is associated with history information regarding bonding of the die and the object to be bonded using the first holding unit; a determination unit that determines whether to replace the first holding unit based on the history information; A determination device comprising:

14. an acquisition unit that acquires information about an inspection result of a first object in which the die and the object to be bonded are bonded; a determination unit that determines whether to replace a first holder that holds the die based on information about the inspection results obtained by the acquisition unit.

15. 15. The determination device according to claim 14, wherein the inspection result is an inspection result of the position of the die relative to the position of the workpiece, or an inspection result of an electrical characteristic of the first object.

16. a joining step of joining the die held by the first holding part and the object to be joined held by the second holding part; a determination step of determining whether to replace the first holding unit based on history information or information regarding inspection results; a manufacturing process of manufacturing an article from a first object in which the die and the object to be bonded are bonded, the history information is information about a history of bonding between the die and the workpiece using the first holding unit, A method for manufacturing an article, wherein the information regarding the inspection result is information regarding the result of inspecting the first object.

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