Cooling device for power conversion apparatus

Abstract

To provide a cooling device for a power conversion apparatus that can exhibit the performance even when a plurality of semiconductor elements and a heat pipe are erected in a vertical orientation and used.SOLUTION: A cooling device for a power conversion apparatus comprises: a plurality of semiconductor elements; a heat sink having a base plate on which the plurality of semiconductor elements are mounted in a vertically aligned arrangement and which receives heat generated by the semiconductor elements, a heat pipe which is provided on the base plate such that its longitudinal direction becomes the vertical direction and stores a heat transfer medium inside, and fins which are provided so as to project from the base plate in a direction orthogonal to the base plate for radiating heat from the base plate; and a fan which is provided above the heat sink to blow air downward toward the fins of the heat sink.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] An embodiment of the present invention relates to a cooling device for a power conversion device. [Background technology]

[0002] Power conversion equipment consists of semiconductor elements, coolers that cool the semiconductor elements, and other electrical equipment. Coolers can be broadly classified into forced circulation liquid cooling methods using pumps, forced air cooling methods using fans and blowers, and natural air cooling methods that use only heat sinks. When selecting a cooling method, various considerations are taken into account, including cooling performance, low cost, low noise, energy saving, and maintenance-free operation. However, when the load on the semiconductor elements becomes large enough, natural air cooling methods are no longer sufficient, so forced air cooling methods are often chosen.

[0003] In a forced-air cooling cooler, especially in a power conversion device that uses multiple semiconductor elements, the semiconductor elements are arranged side by side, and their heat is transferred to a heat sink, which is then dissipated by a fan. In addition, when there are many semiconductor elements and the installation area is large, a heat pipe to dissipate the heat may be embedded in the base plate of the heat sink.

[0004] In a power conversion device that uses multiple semiconductor elements, if the semiconductor elements are arranged side by side on a horizontally installed heat sink, a large installation area is required. To reduce the installation area, it is possible to arrange the semiconductor elements on a vertically installed heat sink, but when the semiconductor elements are arranged vertically, the upper semiconductor elements are affected by the heat of the lower semiconductor elements. Therefore, if the load on the semiconductor elements is the same, the temperature rise of the semiconductor elements increases as they go higher, resulting in a temperature difference between the upper and lower semiconductor elements.

[0005] Furthermore, when attempting to equalize the temperature by installing a heat sink with an embedded heat pipe vertically, the heat pipe will be in a top-heat state, and will not be able to perform at its full potential if used vertically. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-233562 Summary of the Invention [Problem to be solved by the invention]

[0007] The problem to be solved by the present invention is to provide a cooling device for a power conversion device that can exhibit performance even when a heat sink to which a plurality of semiconductor elements are attached is installed vertically. [Means for solving the problem]

[0008] The cooling device of the power conversion device of this embodiment includes a heat sink composed of a plurality of semiconductor elements, a base plate on which the plurality of semiconductor elements are mounted in a vertical arrangement and which receives heat generated by the semiconductor elements, a heat pipe mounted on the base plate with its longitudinal direction in the vertical direction and containing a heat conduction medium therein, and fins protruding perpendicularly from the base plate and which dissipate heat from the base plate, and a fan mounted on top of the heat sink to blow air downward toward the fins of the heat sink. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing a cooling device for a power converter including a comb-shaped heat sink in which thin fin plates are arranged according to a first embodiment. [Figure 2] FIG. 2 is a perspective view showing a cooling device of a power converter including a heat sink on which pin-type fins are arranged according to a modification of the first embodiment. [Figure 3] FIG. 3 is a perspective view showing a cooling device for a power converter according to a second embodiment, in which a duct and an air leakage prevention plate are provided in addition to the configuration of the first embodiment. [Figure 4] FIG. 4 is a side view of a cooling device for a power conversion device according to a second embodiment, in which a duct and an air leakage prevention plate are provided in addition to the configuration of the first embodiment. [Figure 5] FIG. 5 is a plan view of a cooling device for a power conversion device according to a second embodiment, in which a duct and an air leakage prevention plate are provided in addition to the configuration of the first embodiment, as viewed from the bottom. [Figure 6] FIG. 6 is a cross-sectional view of a cooling device for a power conversion device according to a modified example of the second embodiment, in which a duct and an air leakage prevention plate are provided to surround the fins in addition to the configuration of the modified example of the first embodiment, as viewed from the side. [Figure 7] FIG. 7 is a plan view of a cooling device for a power conversion device according to a modified example of the second embodiment, in which a duct and an air leakage prevention plate are provided to surround the fins in addition to the configuration of the modified example of the first embodiment, as viewed from the bottom. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments for carrying out the invention will be described.

[0011] (First embodiment) A cooling device 1 for a power converter according to a first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a perspective view showing the cooling device 1 for a power converter according to the first embodiment, which includes a comb-shaped heat sink 12 on which thin fin plates 18 are arranged. Fig. 2 is a perspective view showing the cooling device 1 for a power converter according to a modified example of the first embodiment, which includes a heat sink 12 on which pin-shaped fins 19 are arranged.

[0012] The power conversion device is an inverter that converts DC power into AC power.

[0013] 1, a cooling device 1 for a power conversion device includes a plurality of semiconductor elements 10, a heat sink 12 having a plurality of fin plates 18 for cooling the plurality of semiconductor elements 10, and a fan 22 provided on the upper part of the heat sink 12 for blowing air downward toward the plurality of fin plates 18. The heat sink 12 includes a base plate 14 having one surface on which the plurality of semiconductor elements 10 are attached and for receiving heat generated by the plurality of semiconductor elements 10, a heat pipe 16 provided on the base plate 14 and containing a heat conductive medium therein, and a plurality of fin plates 18 provided on the other surface of the base plate 14 opposite the surface on which the plurality of semiconductor elements 10 are attached and for radiating heat from the base plate 14.

[0014] 1, the base plate 14 is installed so that its surface is in the vertical direction. That is, the semiconductor elements 10 are arranged side by side in the vertical direction. In this embodiment, the vertical direction refers to the vertical direction when the power conversion device is installed on flat ground.

[0015] 1, the semiconductor elements 10 are arranged in 6 columns and 3 rows. In FIG. 1, the semiconductor elements 10 are provided over the entire area of ​​the heat sink 12, but they do not necessarily have to be provided all the way to the top.

[0016] The fan 22 is provided above the heat sink 12 and blows air downward.

[0017] The heat sink 12 comprises a base plate 14 that receives heat generated by the plurality of semiconductor elements 10, a heat pipe 16 that is integral with the base plate 14 and contains a heat conducting medium therein, and a plurality of fin plates 18 that dissipate the received heat.

[0018] The base plate 14 is arranged so that its longitudinal direction is the vertical direction, and receives the heat generated by the plurality of semiconductor elements 10 .

[0019] The heat pipes 16 are mounted on the base plate 14 so that their longitudinal direction is vertical. The heat pipes 16 can be mounted in holes drilled in the base plate 14 and embedded therein, or in grooves dug and the heat pipes 16 mounted therein.

[0020] The heat pipe 16 is, for example, a sealed container with a capillary structure inside, and a heat conduction medium is sealed in the internal space. When one end of the heat pipe 16 is heated, the heat conduction medium evaporates. The evaporated heat conduction medium moves to the low-temperature section at the other end, where it condenses as it cools. The condensed heat conduction medium then circulates back to the one end via the capillary structure. In other words, the heat conduction medium undergoes a phase change inside the heat pipe 16.

[0021] The multiple fin plates 18 are thin fins arranged in a row with a predetermined gap between them in the vertical direction, and are provided so as to protrude from the surface of the base plate 14 opposite to the surface on which the semiconductor element is attached, and so as to protrude in a direction perpendicular to the surface of the base plate 14.

[0022] In a structure in which multiple semiconductor elements 10 are arranged vertically, when air heated by the heat generated by the lower semiconductor elements 10 flows upward, the upper semiconductor elements 10 are affected by the heat from the lower semiconductor elements 10, and for the same load, the temperature rise of the semiconductor elements 10 increases the further upwards. This results in a temperature difference between the upper and lower semiconductor elements 10.

[0023] To prevent these problems, a fan 22 is placed above the heat sink 12 so that the air flows from top to bottom. This causes the cooling air to flow between the multiple fin plates 18 protruding from the base plate 14, with the coolest air flowing upward, keeping the temperature of the upper semiconductor elements 10 lower than that of the lower semiconductor elements 10. This allows the heat pipes 16, which are installed vertically integrally with the base plate 14, to operate normally without experiencing a top-heat state, reducing the temperature difference between the upper and lower semiconductor elements 10.

[0024] 1, the multiple fins are thin plate-like fins arranged in a row with a predetermined gap maintained in the vertical direction, and are configured as multiple fin plates 18 that protrude from the surface of base plate 14 opposite the surface on which the semiconductor elements are attached, and that protrude in a direction perpendicular to the surface of base plate 14. However, as shown in Fig. 2, the fins 19 may be cylindrical pin-shaped. The pin-type fins 19 may be arranged in a row in the longitudinal direction of base plate 14, or in a lattice pattern.

[0025] As described above, the cooling device 1 of the power conversion device of the first embodiment prevents the heat pipes 16 from entering a top-heat state, thereby enabling uniform heating of the base plate 14 and reducing the temperature difference between the vertical semiconductor elements 10. In this way, by solving the problem of temperature differences occurring between the vertical semiconductor elements 10 when multiple semiconductor elements 10 are installed vertically and the problem of the heat pipes 16 entering a top-heat state, it is possible to obtain the same heat dissipation effect as when multiple semiconductor elements 10 are installed horizontally.

[0026] As a result, the installation area of ​​the cooling device can be reduced and the cooling performance per installation area can be improved.

[0027] (Second embodiment) Next, a cooling device 1 for a power converter provided with a duct 24 and an air leakage prevention plate 26 according to a second embodiment will be described with reference to FIG.

[0028] FIG. 3 is a perspective view showing a cooling device 1 for a power conversion device according to a second embodiment, which is provided with a duct 24 and an air leakage prevention plate 26 in addition to the configuration of the first embodiment.

[0029] The duct 24 is provided between the fan 22 and the heat sink 12, and guides the air blown from the fan 22 to the plurality of fin plates 18. The provision of the duct 24 prevents the air blown from the fan 22 from leaking to the outside when it flows into the plurality of fin plates 18.

[0030] FIG. 4 is a side view of the cooling device 1 for a power conversion device according to the second embodiment, in which a duct 24 and an air leakage prevention plate 26 are provided in addition to the configuration of the first embodiment.

[0031] 4, the air leakage prevention plate 26 is provided from the end of the duct 24 over the entire area of ​​the plurality of fin plates 18. This air leakage prevention plate 26 is provided so as to contact the tips of the plurality of fin plates 18, so that all air sent from the fan 22 flows through the gaps between the plurality of fin plates 18 and removes heat from the plurality of fin plates 18.

[0032] FIG. 5 is a plan view of the cooling device 1 for a power conversion device according to the second embodiment, in which a duct 24 and an air leakage prevention plate 26 are provided in addition to the configuration of the first embodiment, as viewed from the bottom.

[0033] As shown in Figure 5, in the case of a plurality of thin fin plates 18, where the left and right sides of the plurality of thin fin plates 18 are blocked by the plurality of thin fin plates 18 and air does not leak from the sides, the air leakage prevention plate 26 can be arranged so as to be in contact with the tip of the thin fin plates 18.

[0034] By providing the air leakage prevention plate 26, the air sent from the fan 22 and passing through the duct 24 flows downward along the multiple fin plates 18. The air leakage prevention plate 26 functions to form an air flow path.

[0035] By providing the duct 24 and the air leakage prevention plate 26, the air sent from the fan 22 is prevented from leaking on the way, and the air can be passed through the plurality of fin plates 18 more efficiently.

[0036] Next, the configuration of the air leakage prevention plate 26 when equipped with pin-type fins 19 will be described with reference to FIG.

[0037] FIG. 6 is a cross-sectional view of the cooling device 1 for a power conversion device according to a modified example of the second embodiment, in which a duct 24 and an air leakage prevention plate 26 are provided to surround the fins 19 in addition to the configuration of the modified example of the first embodiment, as viewed from the side.

[0038] Similar to the plurality of thin fin plates 18, an air leakage prevention plate 26 is arranged so as to contact the tips of the pin-type fins 19.

[0039] FIG. 7 is a plan view of the cooling device 1 for a power conversion device according to a modified example of the second embodiment, in which a duct 24 and an air leakage prevention plate 26 are provided to surround the fins 19 in addition to the configuration of the modified example of the first embodiment, as viewed from below.

[0040] The pin-type fins 19 have gaps between the fins that extend in the longitudinal direction. This causes air sent from the fan to leak laterally. In this case, the air leakage prevention plate 26 is provided so that it not only contacts the tips of the pin-type fins 19 but also surrounds the pin-type fins 19. In other words, the air leakage prevention plate 26 is provided so that it surrounds the entire area of ​​the pin-type fins 19 from the end of the duct 24.

[0041] This prevents the air sent from the fan 22 from leaking, and allows the air to pass through the pin-type fins 19 more efficiently.

[0042] Furthermore, even in the case of thin fin plates 18, air leakage prevention plates may be provided at one end and the other end of the thin fin plates 18 in the short side direction of the heat sink 12.

[0043] The cooling device 1 of the power conversion device of this embodiment has a heat sink 12 in which multiple semiconductor elements 10 are arranged vertically, a base plate 14 equipped with thin fin plates 18 and pin-type fins 19, heat pipes 16 are installed vertically, and air is blown from above downward by a fan 22. In such a structure, the cooling performance per installation area is preferably such that the total load of the semiconductor elements 10 is 100,000 watts / m2 or more.

[0044] As described above, by providing the duct 24 and the air leakage prevention plate 26, it is possible to solve the problem of temperature differences occurring between the upper and lower semiconductor elements when multiple semiconductor elements 10 are installed in a vertical arrangement, and the problem of the heat pipe 16 entering a top-heat state.

[0045] Furthermore, the same heat dissipation effect as when a plurality of semiconductor elements 10 are arranged horizontally can be obtained, resulting in a reduction in the installation area of ​​the cooling device and an improvement in cooling performance per installation area.

[0046] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0047] 1. Cooling device for power conversion equipment 10 Multiple semiconductor elements 12 Heat sink 14 Base plate 16 heat pipes 18 Thin fin plate 19 Pin-type fin 22 Fans 24 Duct 26 Air leak prevention board

Claims

1. A plurality of semiconductor elements; a heat sink having a base plate on which the plurality of semiconductor elements are mounted in a vertical arrangement and which receives heat generated by the semiconductor elements; a heat pipe disposed on the base plate with its longitudinal direction aligned vertically and containing a heat conductive medium therein; and fins disposed so as to protrude from the base plate in a direction perpendicular to the longitudinal direction and which dissipate heat from the base plate; a fan provided on an upper portion of the heat sink and configured to blow air downward toward the fins of the heat sink; A cooling device for a power conversion device having the above structure.

2. The fins are thin plate-shaped and are arranged side by side with a predetermined gap maintained in the vertical direction.

2. A cooling device for a power conversion device according to claim 1.

3. The fin is formed in a cylindrical shape.

2. A cooling device for a power conversion device according to claim 1.

4. a duct that guides the air blown by the fan to the fins; an air leakage prevention plate arranged to contact the tip of the fin; The cooling device for a power conversion device according to any one of claims 1 to 3, comprising:

5. The air leakage prevention plate is provided so as to surround the entire area of ​​the fin from the end of the duct. The cooling device for a power converter according to claim 4.

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