Solid electrolyte capacitor, and manufacturing method for solid electrolyte capacitor

Abstract

To provide a solid electrolyte capacitor capable of having higher reliability, and a manufacturing method for the same.SOLUTION: A solid electrolyte capacitor includes a lamination body including a plurality of solid electrolyte capacitor elements that is stacked. Each solid electrolyte capacitor element includes an anode electrode layer 8 electrically connected to a first side surface electrode E1, a dielectric layer 9 provided on the anode electrode layer 8, a cathode electrode layer 14 electrically connected to a second side surface electrode E2, a solid electrolyte layer 12 held between the dielectric layer 9 and the cathode electrode layer 14, an insulating region 10 provided on the anode electrode layer 8 and adjacent to a side surface of the solid electrolyte layer 12, an insulating part 162 held between a side surface of the insulating region 10 and the second side surface electrode E2 and including an insulating resin, and a first insulating layer 11 held between the insulating region 10 and the cathode electrode layer 14 and including the same resin as the resin included in the insulating region 10.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a solid electrolytic capacitor and a method for manufacturing a solid electrolytic capacitor. [Background technology]

[0002] Patent Documents 1 to 8 disclose solid electrolytic capacitors and methods for manufacturing the same. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6724881 [Patent Document 2] Patent No. 7020504 [Patent Document 3] Patent No. 6686975 [Patent Document 4] Patent No. 6776731 [Patent Document 5] Japanese Patent Publication No. 2022-68665 [Patent Document 6] Japanese Patent Publication No. 2020-194825 [Patent Document 7] Patent No. 7001891 [Patent Document 8] Japanese Patent Application Laid-Open No. 2012-193420 Summary of the Invention [Problem to be solved by the invention]

[0004] A solid electrolytic capacitor having a structure including a plurality of stacked solid electrolytic capacitor elements is known. A solid electrolytic capacitor and a manufacturing method thereof that can improve the reliability of such stacked solid electrolytic capacitors are desired. [Means for solving the problem]

[0005] A solid electrolytic capacitor according to one embodiment of the present disclosure includes a laminate including a plurality of stacked solid electrolytic capacitor elements, a first side electrode provided on a first side surface of the laminate, and a second side electrode provided on a second side surface of the laminate, and each solid electrolytic capacitor element includes an anode electrode layer electrically connected to the first side electrode, a dielectric layer provided on the anode electrode layer, a cathode electrode layer electrically connected to the second side electrode, a solid electrolyte layer interposed between the dielectric layer and the cathode electrode layer, an insulating region provided on the anode electrode layer and adjacent to a side surface of the solid electrolyte layer, an insulating portion interposed between the side surface of the insulating region and the second side electrode and containing an insulating resin, and a first insulating layer interposed between the insulating region and the cathode electrode layer and containing the same resin as the resin contained in the insulating region.

[0006] The solid electrolytic capacitor of the present disclosure may include a protective layer interposed between the insulating portion and the cathode electrode layer. This protective layer can function as a mask layer during manufacturing. The mask layer can also be removed by etching during manufacturing.

[0007] A method for manufacturing a solid electrolytic capacitor according to one aspect of the present disclosure includes the steps of: preparing a metal sheet including an anode electrode layer and a roughened layer including a dielectric layer provided on the anode electrode layer; forming a protective layer on the metal sheet; supplying a resin to the protective layer on the anode electrode layer or to a region adjacent to a region where the protective layer is to be formed after or before the protective layer is formed, causing the resin to be absorbed into the roughened layer to form an insulating region, and leaving the resin on the insulating region to form a first insulating layer; supplying a conductive polymer to the roughened layer to form a solid electrolyte layer; forming a cathode electrode layer on the solid electrolyte layer; and stacking the metal sheet and solid electrolytic capacitor sheets including the cathode electrode layer to form a laminate. forming a first groove in the laminate at a position passing through the protective layer to expose a side surface of the roughened layer located directly below the protective layer; etching the exposed side surface of the roughened layer; supplying an insulating resin into a space formed by the etching to form an insulating portion at a position adjacent to the insulating region; forming a second groove in the laminate so that a side surface of the anode electrode layer and a side surface of the cathode electrode layer are exposed; a first side surface of the laminate includes the exposed side surface of the anode electrode layer, and forming a first side electrode on the first side surface of the laminate; a second side surface of the laminate includes the exposed side surface of the cathode electrode layer, and forming a second side electrode on the second side surface of the laminate. [Effects of the Invention]

[0008] According to the solid electrolytic capacitor and the method for manufacturing the solid electrolytic capacitor of the present disclosure, reliability can be improved. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing the basic structure of a solid electrolytic capacitor. [Figure 2] FIG. 2 is a vertical cross-sectional view of a solid electrolytic capacitor. [Figure 3] FIG. 3 is a diagram showing an example of a structure in the vicinity of the solid electrolyte layer. [Figure 4] FIG. 4 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer. [Figure 5] FIG. 5 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer. [Figure 6] FIG. 6 is a diagram showing an example of the second region. [Figure 7] FIG. 7 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer. [Figure 8] FIG. 8 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer. [Figure 9] FIG. 9 is a diagram showing an example of a resin filling region and a first insulating portion. [Figure 10] FIG. 10 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer. [Figure 11] FIG. 11 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer. [Figure 12] 12A and 12B are diagrams for explaining a method for manufacturing a solid electrolytic capacitor (a longitudinal cross-sectional view (FIG. 12A) and a plan view (FIG. 12B)). [Figure 13] 13A and 13B are diagrams for explaining a method for manufacturing a solid electrolytic capacitor (a longitudinal cross-sectional view (FIG. 13A) and a plan view (FIG. 13B)). [Figure 14] 14A and 14B are diagrams (a longitudinal cross-sectional view (FIG. 14A) and a plan view (FIG. 14B)) for explaining a method for manufacturing a solid electrolytic capacitor. [Figure 15] 15A and 15B are diagrams for explaining a method for manufacturing a solid electrolytic capacitor (a longitudinal cross-sectional view (FIG. 15A) and a plan view (FIG. 15B)). [Figure 16] 16A and 16B are diagrams (a longitudinal cross-sectional view (FIG. 16A) and a plan view (FIG. 16B)) for explaining a method for manufacturing a solid electrolytic capacitor. [Figure 17] 17A and 17B are diagrams (a longitudinal cross-sectional view (FIG. 17A) and a plan view (FIG. 17B)) for explaining a method for manufacturing a solid electrolytic capacitor. [Figure 18]18A and 18B are diagrams (a longitudinal cross-sectional view (FIG. 18A) and a plan view (FIG. 18B)) for explaining a method for manufacturing a solid electrolytic capacitor. [Figure 19] FIG. 19 is a diagram for explaining a method for manufacturing a solid electrolytic capacitor. [Figure 20] FIG. 20 is a diagram for explaining a method for manufacturing a solid electrolytic capacitor. [Figure 21] FIG. 21 is an enlarged view of the periphery of the side tip of the anode electrode layer for illustrating a method for manufacturing a solid electrolytic capacitor. [Figure 22] FIG. 22 is a diagram illustrating a method for manufacturing a solid electrolytic capacitor. [Figure 23] FIG. 23 is an enlarged view of the periphery of the side tip of the anode electrode layer for illustrating a method for manufacturing a solid electrolytic capacitor. [Figure 24] FIG. 24 is a diagram for explaining a method for manufacturing a solid electrolytic capacitor. [Figure 25] FIG. 25 is an enlarged view of the periphery of the side tip of the anode electrode layer for illustrating a method for manufacturing a solid electrolytic capacitor. [Figure 26] FIG. 26 is a diagram for explaining a method for manufacturing a solid electrolytic capacitor. [Figure 27] FIG. 27 is an enlarged view of the periphery of the side tip of the anode electrode layer for illustrating a method for manufacturing a solid electrolytic capacitor. [Figure 28] FIG. 28 is a diagram for explaining a method for manufacturing a solid electrolytic capacitor. [Figure 29] FIG. 29 (FIG. 29(A) and FIG. 29(B)) is a vertical cross-sectional view of a solid electrolytic capacitor. [Figure 30] FIG. 30 is a perspective view of a solid electrolytic capacitor. [Figure 31] FIG. 31 is a diagram showing a solid electrolytic capacitor mounted on a substrate. [Figure 32] FIG. 32 is a diagram showing an example of a manufacturing apparatus for a solid electrolytic capacitor. [Figure 33] FIG. 33 is a vertical cross-sectional view of the vicinity of the region including the anode terminal and the cathode terminal. [Figure 34] FIG. 34 is a vertical cross-sectional view of the vicinity of the region including the anode terminal and the cathode terminal. [Figure 35] FIG. 35 is a diagram illustrating the manufacturing process of the structure shown in FIG. [Figure 36] FIG. 36 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer. [Figure 37] FIG. 37 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer. [Figure 38] FIG. 38 is a diagram showing an example of the peripheral structure of the side tip portion of the anode electrode layer. [Figure 39] 39 (FIG. 39(A), FIG. 39(B), FIG. 39(C), and FIG. 39(D)) are diagrams showing vertical cross-sectional structures in the vicinity of the mask layer. [Figure 40] FIG. 40 is a diagram showing an example of the peripheral structure of the side tip portion of the anode electrode layer. DETAILED DESCRIPTION OF THE INVENTION

[0010] Various exemplary embodiments will be described in detail below with reference to the drawings. Note that the same or equivalent parts in each drawing are designated by the same reference numerals, and redundant explanations will be omitted.

[0011] FIG. 1 is a diagram showing the basic structure of a solid electrolytic capacitor.

[0012] The solid electrolytic capacitor includes a support substrate 7, a laminate 100 provided on the support substrate 7, and a protective insulator 16 provided on the laminate 100. An anode terminal 1 and a cathode terminal 2 are provided on the lower surface of the support substrate 7. A first side surface S1 of the laminate 100 is provided with a first side surface electrode E1. A second side surface S2 of the laminate 100 is provided with a second side surface electrode E2.

[0013] The laminate 100 includes a plurality of stacked solid electrolytic capacitor elements. The number of solid electrolytic capacitor elements included in the laminate 100 may be two or more. For ease of explanation, the figure shows two solid electrolytic capacitor elements. That is, the laminate 100 includes a first solid electrolytic capacitor element CE1 and a second solid electrolytic capacitor element CE2.

[0014] A three-dimensional orthogonal coordinate system is set. The stacking direction of the solid electrolytic capacitor elements in the laminate 100 is defined as the Z-axis direction. The X-axis is perpendicular to the Z-axis. The Y-axis is perpendicular to the Z-axis and also perpendicular to the X-axis. The first side surface S1 is one YZ plane of the laminate 100, and the second side surface S2 is the other YZ plane of the laminate 100.

[0015] One solid electrolytic capacitor element includes a first capacitor C1 and a second capacitor C2 connected in parallel between an anode terminal 1 and a cathode terminal 2.

[0016] The first capacitor C1 includes an anode electrode layer 8 and a first cathode electrode layer 14 provided on the upper surface of the anode electrode layer 8. A first dielectric layer and a first solid electrolyte layer 12 are interposed between these electrode layers. This first dielectric layer is a dielectric layer 9 (see FIG. 3) formed from the periphery of an upper interface near-region 91 of the anode electrode layer 8 to the interior of the roughened layer, following the uneven shape. The second capacitor C2 includes an anode electrode layer 8 and a second cathode electrode layer 14B provided on the lower surface of the anode electrode layer 8. A second dielectric layer and a second solid electrolyte layer 12B are interposed between these electrode layers. This second dielectric layer is a dielectric layer formed from the periphery of a lower interface near-region 91B of the anode electrode layer 8 to the interior of the roughened layer, following the uneven shape. The second dielectric layer has a structure similar to the upper dielectric layer 9. The anode electrode layer 8 in the first capacitor C1 and the second capacitor C2 is a common electrode layer. One solid electrolytic capacitor element may include only the first capacitor C1, or one solid electrolytic capacitor element may include only the second capacitor C2.

[0017] The anode electrode layer 8 of each solid electrolytic capacitor element is electrically connected to a first side electrode E1. The first side electrode E1 is electrically connected to an anode terminal 1. The pair of first cathode electrode layer 14 and second cathode electrode layer 14B in each solid electrolytic capacitor element is electrically connected to a second side electrode E2. The second side electrode E2 is electrically connected to a cathode terminal 2. When a voltage is applied between the anode terminal 1 and the cathode terminal 2, a voltage is applied between the first side electrode E1 and the second side electrode E2. When a voltage is applied between the first side electrode E1 and the second side electrode E2, the first capacitor C1 and the second capacitor C2 of each solid electrolytic capacitor element are charged.

[0018] FIG. 2 is a vertical cross-sectional view of the solid electrolytic capacitor according to the embodiment.

[0019] The solid electrolytic capacitor includes a support substrate 7 on which an anode terminal 1 and a cathode terminal 2 are provided, a laminate 100 including a plurality of solid electrolytic capacitor elements stacked on the support substrate 7, and a protective insulator 16 provided on the laminate 100. The protective insulator 16 may be formed directly on the upper surface of the outermost solid electrolytic capacitor element constituting the laminate 100. In this example, the laminate 100 includes an uppermost insulating sheet IFT provided on the upper surface of the outermost solid electrolytic capacitor element, and a reinforcing sheet CF1 provided on the uppermost insulating sheet IFT. Therefore, the protective insulator 16 is provided so as to contact the upper surface of the reinforcing sheet CF1.

[0020] The reinforcing sheet CF1 is made of a prepreg containing glass fibers (glass cloth or glass nonwoven fabric). This prepreg can contain cured resin material and can be used as a core material such as a glass epoxy board. The use of the reinforcing sheet CF1 suppresses warping when stacking solid charge capacitor sheets and reduces damage to the elements when processing grooves (slits).

[0021] The solid electrolytic capacitor includes a laminate 100 provided on a support substrate 7, an anode terminal 1 provided on the underside of the support substrate 7 and electrically connected to a first side electrode E1, and a cathode terminal 2 provided on the underside of the support substrate 7 and electrically connected to a second side electrode E2. When the solid electrolytic capacitor is disposed on a wiring substrate having a first land electrode and a second land electrode, the anode terminal 1 and the cathode terminal 2 serve as connection terminals to these land electrodes. That is, the first land electrode is disposed directly below the anode terminal 1 provided on the underside of the support substrate 7, and the second land electrode is disposed directly below the cathode terminal 2. In this case, the first side electrode E1 and the second side electrode E2 can be electrically connected to the first land electrode and the second land electrode. Note that even if the anode terminal 1 and the cathode terminal 2 are omitted, the first and second side electrodes can be connected to the land electrodes on the wiring substrate.

[0022] The support substrate 7 is made of an insulating material. Known insulating materials include inorganic insulating materials and organic insulating materials. Inorganic insulating materials include silicon oxides (e.g., SiO2), silicon nitrides (e.g., SiN x Known insulating material substrates include glass substrates and LTCC (low-temperature co-fired ceramics) substrates containing alumina and glass materials. Known organic insulating materials include thermosetting resins such as polyimide and epoxy resin. Glass epoxy substrates, such as FR4 (Flame Retardant Type 4), can also be used, which are made by impregnating glass fiber (glass cloth or nonwoven glass) with epoxy resin and curing it. In this example, a glass epoxy substrate is used as a suitable insulating material for the support substrate 7. Anode terminal 1 and cathode terminal 2 are provided on the underside of the support substrate 7, but a dummy electrode layer may be provided on the upper surface of the support substrate 7. The dummy electrode layer reduces warping of the support substrate 7 and may be the same shape as the anode terminal 1 and cathode terminal 2, or may be provided over the entire upper surface of the support substrate 7.

[0023] The protective insulator 16 is made of an insulating material. Known insulating materials include inorganic insulating materials and organic insulating materials. While the above-mentioned materials are known as inorganic insulating materials, an organic insulating material is used in this example. Known organic insulating materials include thermosetting resins such as polyimide and epoxy resin. In this example, an epoxy resin containing a filler is used as an insulating material suitable for the protective insulator 16. The protective insulator 16 before thermal curing during production can be in the form of granules, liquid, granules, or film.

[0024] The laminate 100 is formed by stacking a plurality of solid electrolytic capacitor elements. Each solid electrolytic capacitor element (first solid electrolytic capacitor element CE1, second solid electrolytic capacitor element CE2) includes the first capacitor C1 and second capacitor C2 shown in FIG. 1. The structure of the first solid electrolytic capacitor element CE1 is the same as the structure of the second solid electrolytic capacitor element CE2. The structure of the first capacitor C1 is the same as the structure of the second capacitor C2, except that it is upside down.

[0025] The first capacitor C1 includes a roughened layer provided on the upper surface of an anode electrode layer 8. A first dielectric layer is provided on the upper surface of the roughened layer. A first solid electrolyte layer 12 is provided on the upper surface of the first dielectric layer. A first cathode electrode layer 14 is provided on the upper surface of the first solid electrolyte layer 12. The first dielectric layer and solid electrolyte layer 12 are sandwiched between the anode electrode layer 8 and the first cathode electrode layer 14. Specifically, the first capacitor C1 includes the anode electrode layer 8, a first dielectric layer provided on the surface of the anode electrode layer 8, the first solid electrolyte layer 12 covering the first dielectric layer, the first cathode electrode layer 14 sandwiching the first solid electrolyte layer 12 together with the first dielectric layer, and a first protective layer 15 covering the first cathode electrode layer 14. The first protective layer 15 can be omitted. The first solid electrolyte layer 12 is a roughened layer containing a conductive polymer. Furthermore, a conductive polymer layer 12r is formed on the roughened layer of first solid electrolyte layer 12. Conductive polymer layer 12r also functions as a solid electrolyte layer.

[0026] The roughened layer is made of roughened aluminum and has numerous pores. The roughening treatment can be performed by chemical conversion treatment and anodizing. The roughening treatment can also be performed by chemical conversion treatment alone. The roughening treatment can also be performed by anodizing alone. The chemical conversion treatment can be performed by immersing the aluminum foil in a chemical conversion solution (e.g., an aqueous solution of ammonium adipate). The anodizing treatment can be performed by applying a voltage to the aluminum foil immersed in an electrolyte. When anodizing is used, pores are formed on the surface side of the aluminum foil, and a dielectric layer made of aluminum oxide is formed. The roughening treatment can also be performed by etching. A first cathode electrode layer 14 is formed on the conductive polymer layer 12r via a first conductive layer 13. The first conductive layer 13 may be a single layer or two or more layers.

[0027] The anode electrode layer 8 is made of a valve metal, but the material is not particularly limited as long as it is one generally used in electrolytic capacitors. Known valve metals or valve-acting metals include aluminum (Al), tantalum (Ta), niobium (Nb), titanium (Ti), hafnium (Hf), zirconium (Zr), zinc (Zn), tungsten (W), bismuth (Bi), and antimony (Sb). Among these, aluminum or tantalum is relatively preferred. The anode electrode layer 8 may be an alloy containing at least one metal selected from this metal group. The metal constituting the anode electrode layer 8 preferably has a different solubility in acids or alkalis from the metal constituting the cathode electrode layer, and is preferably a metal that can be selectively etched with a specific solution. The anode electrode layer 8 in this example is made of aluminum. The thickness of the anode electrode layer 8 is, for example, 1 μm to 500 μm.

[0028] In this example, the first cathode electrode layer 14 is made of copper (Cu). In addition to copper (Cu), the first cathode electrode layer 14 may be made of other metals such as nickel (Ni), silver (Ag), and tin (Sn). From the viewpoints of conductivity and cost, a single copper layer and / or a composite layer containing copper and other metals (Ni, Cr, Ni-Cr, etc.) is desirable. The first cathode electrode layer 14 may also be an alloy containing at least one metal selected from this metal group. If the base layer of the first cathode electrode layer 14 contains Ni, Cr, etc., adhesion can be improved. Depending on the type of material of the first cathode electrode layer 14 (e.g., Ag), the base layer may not be necessary.

[0029] The conductive polymer (compound) contained in the first solid electrolyte layer 12 and the conductive polymer layer 12r preferably includes at least one selected from the group consisting of polypyrrole, polyaniline, polythiophene, polyfuran, and derivatives thereof. Poly(3,4-ethylenedioxythiophene) (PEDOT) and polypyrrole (PPY) are preferably used. These may be used alone or in combination of two or more. Adding an appropriate dopant to these materials can provide excellent conductivity.

[0030] The first conductive layer 13 is made of, for example, an adhesive conductive layer (e.g., carbon paste). The adhesive conductive layer includes a conductor and an adhesive. The conductor of the adhesive conductive layer is a carbon-containing material (e.g., graphite) or a metal. The adhesive of the adhesive conductive layer is a resin such as phenol resin, urea resin, epoxy resin, polyester resin, or polyimide resin, or a hydrocarbon compound such as paraffin oil. Carbon paste is a mixture of graphite powder and adhesive, and can be used for the first conductive layer 13. The first conductive layer 13 can also be formed by a printing method.

[0031] The metal conductive layer constituting the first cathode electrode layer 14 may be made of copper (Cu), nickel (Ni), silver (Ag), or tin (Sn), and these metal conductive layers may be formed as plated layers using a plating method. These metal conductive layers may also be formed by any method, such as sputtering. When a plated layer is formed by electroless plating, the underlying adhesive conductive layer may contain a catalytic metal. The catalytic metal is a noble metal that has catalytic activity for electroless plating, such as palladium (palladium-based material), gold, platinum, or rhodium, with palladium being particularly preferred. These may be used alone or in combination of two or more. An additional metal film (thicker film) may be formed by electrolytic plating on a metal film formed by electroless plating or sputtering.

[0032] Generally, copper plating can be performed using a copper sulfate bath, copper pyrophosphate bath, copper cyanide bath, copper fluoroborate bath, etc. Nickel plating can be performed using a Watts bath (nickel sulfate), sulfamic acid bath (nickel sulfamate), total chloride bath (nickel chloride), etc. Tin plating can be performed using a sulfuric acid bath, sulfonic acid bath, etc. Various plating methods are known and can be applied to the formation of each plating layer.

[0033] The first conductive layer 13 functions to electrically connect the solid electrolyte layer 12 directly below it to the first cathode electrode layer 14 above it. The first conductive layer 13 functions to protect the solid electrolyte layer 12 directly below it. From the viewpoint of its protective function, this conductive layer also serves as a protective layer. The first conductive layer 13 preferably includes a resin layer in which a conductor is blended with a resin that has high heat resistance, high moisture resistance (low water absorption and permeability), and high mechanical strength. The preferred thickness of the first conductive layer 13 is 1 μm to 50 μm, but it can also be 3 μm to 10 μm. Although the solid electrolyte layer 12 and the first cathode electrode layer 14 can be electrically connected even if the first conductive layer 13 is omitted, it is preferable to include the first conductive layer 13.

[0034] The first protective layer 15 is made of a resist material containing resin, and preferably a material containing resin and an inorganic material. A filler such as silica (silicon oxide) can be used as the inorganic material. A thermosetting resin such as polyimide or epoxy resin can be used as the resin material. In this example, the first protective layer 15 is made of epoxy resin with silica added. The resist material can be a liquid material dissolved in a suitable solvent during manufacturing. The first protective layer 15 can be omitted.

[0035] The second capacitor C2 includes a roughened layer provided on the lower surface of the anode electrode layer 8. A second dielectric layer is provided on the lower surface of the roughened layer. A second solid electrolyte layer 12B is provided on the lower surface of the second dielectric layer. A second cathode electrode layer 14B is provided on the lower surface of the second solid electrolyte layer 12B. The second dielectric layer and the second solid electrolyte layer 12B are sandwiched between the anode electrode layer 8 and the second cathode electrode layer 14B. Specifically, the second capacitor C2 includes the anode electrode layer 8, a second dielectric layer provided on the surface of the anode electrode layer 8, the second solid electrolyte layer 12B covering the second dielectric layer, the second cathode electrode layer 14B sandwiching the second solid electrolyte layer 12B together with the second dielectric layer, and a second protective layer 15B covering the second cathode electrode layer 14B. The second solid electrolyte layer 12B is a roughened layer containing a conductive polymer. In addition, a conductive polymer layer 12Br is formed below the roughened layer of second solid electrolyte layer 12B. A second cathode electrode layer 14B is formed below conductive polymer layer 12r with a second conductive layer 13B interposed therebetween.

[0036] The material of the second solid electrolyte layer 12B is the same as the material of the first solid electrolyte layer 12. The material of the conductive polymer layer 12Br is the same as the material of the conductive polymer layer 12r. The material of the second conductive layer 13B is the same as the material of the first conductive layer 13. The material of the second cathode electrode layer 14B is the same as the material of the first cathode electrode layer 14. The material of the second protective layer 15B is the same as the material of the first protective layer 15.

[0037] The anode electrode layer 8 is physically and electrically connected to a first side surface electrode E1 provided on a first side surface S1 of the laminate 100. The anode electrode layer 8 is electrically connected to an anode terminal 1 via the first side surface electrode E1. The first cathode electrode layer 14 and the second cathode electrode layer 14B are physically and electrically connected to a second side surface electrode E2 provided on a second side surface S2 of the laminate 100. The first cathode electrode layer 14 and the second cathode electrode layer 14B are electrically connected to a cathode terminal 2 via the second side surface electrode E2.

[0038] The first side electrode E1 and the second side electrode E2 have the same shape and are symmetrical with respect to the XZ plane that passes through the center position of the laminate 100 in the X-axis direction.

[0039] The portion of the first side electrode E1 facing the protective insulator 16 includes a first bent portion E1B bent outward from the first side surface S1, with the underside of the first bent portion E1B exposed. Because the first bent portion E1B is bent about the Y-axis, the amount of rotational deformation about the Z-axis is reduced. Furthermore, a fillet is more likely to form at the position where it contacts the underside of the first bent portion E1B. In this case, the dimension of the fillet in the X-axis direction at the position where it contacts the underside of the first bent portion E1B increases, resulting in an increase in volume. Therefore, the amount of deformation of the first bent portion E1B is reduced under environmental changes such as temperature, and the increased volume of the fillet itself increases its resistance to stress. Therefore, cracks are less likely to occur in the fillet, enabling the solid electrolytic capacitor to operate with high reliability. Furthermore, the complex connection interface between the fillet and the side electrode also serves to prevent the progression of any cracks that may occur.

[0040] The portion of the second side electrode E2 facing the protective insulator 16 includes a second bent portion E2B bent outward from the second side surface S2, with the underside of the second bent portion E2B exposed. Because the second bent portion E2B is bent about the Y-axis, the amount of rotational deformation about the Z-axis is reduced. Furthermore, a fillet is more likely to form at the position where it contacts the underside of the second bent portion E2B. In this case, the dimension of the fillet in the X-axis direction at the position where it contacts the underside of the second bent portion E2B increases, resulting in an increase in volume. Therefore, the amount of deformation of the second bent portion E2B is reduced under environmental changes such as temperature, and the increased volume of the fillet itself increases its resistance to stress. Therefore, cracks are less likely to occur in the fillet, enabling the solid electrolytic capacitor to operate with high reliability. Furthermore, the complex connection interface between the fillet and the side electrode also serves to prevent the progression of any cracks that may have occurred.

[0041] The dimension L1 of the first bent portion E1B in the direction perpendicular to the first side surface S1 is preferably 0.01 mm or more and 1 mm or less along the underside of the protective insulator 16. It is even more preferable that the dimension L1 be 0.03 mm or more and 0.3 mm or less. When the dimension L1 of the first bent portion E1B is equal to or greater than the above-mentioned lower limit, the fillet is more likely to contact the underside of the first bent portion E1B. This also helps to prevent microcracks from progressing in the Z direction and to prevent complete breakage of the component connection. Even if the dimension L1 of the first bent portion E1B exceeds the above-mentioned upper limit, the rate of increase in the effect of expanding the contact area of ​​the fillet with the underside of the first bent portion E1B is small. From the perspective of preventing an excessive increase in component size and reducing material costs, it is preferable that the dimension L1 be equal to or less than the upper limit.

[0042] Similarly, the dimension L2 of the second bent portion E2B in the direction perpendicular to the second side surface S2 is preferably 0.01 mm or more and 1 mm or less along the underside of the protective insulator 16. It is even more preferable that the dimension L2 be 0.03 mm or more and 0.3 mm or less. When the dimension L2 of the second bent portion E2B is equal to or greater than the above-mentioned lower limit, the fillet easily contacts the underside of the second bent portion E2B. This also suppresses the progression of microcracks in the Z direction and helps prevent complete rupture of the component connection. Even if the dimension L2 of the second bent portion E2B exceeds the above-mentioned upper limit, the rate of increase in the effect of expanding the contact area of ​​the fillet with the underside of the second bent portion E2B is small. Furthermore, from the perspective of suppressing excessive increases in component size and reducing material costs, it is preferable that the dimension L2 be equal to or less than the upper limit. A prototype was manufactured with dimension L1 = dimension L2. The dimensions of the prototypes were L1 = 0.1 mm, L1 = 0.25 mm, and L1 = 0.45 mm. In both cases, good contact with the fillet was observed. From this viewpoint, it is possible to set L1 = L2 = prototype dimension ±ΔL (ΔL = L1 × 50%), for example.

[0043] In the figure, the positive direction of the X-axis is the right side and the negative direction is the left side. A first insulating region 10 on the left side is interposed between the first side electrode E1 and the first solid electrolyte layer 12. A dielectric layer is formed around the periphery of the interface between the left first insulating region 10 and the anode electrode layer 8, and a region closer to the anode electrode layer 8 than the dielectric layer is a conductive region. A second insulating region 10B on the left side is interposed between the first side electrode E1 and the second solid electrolyte layer 12B. A dielectric layer is formed around the periphery of the interface between the left second insulating region 10B and the anode electrode layer 8, and a region closer to the anode electrode layer 8 than the dielectric layer is a conductive region. The first insulating region 10 is formed by filling an insulating resin into voids in a roughened layer above the anode electrode layer 8. Similarly, the second insulating region 10B is formed by filling an insulating resin into voids in a roughened layer below the anode electrode layer 8.

[0044] The right-side first insulating region 10 and insulating portion 162 are interposed between the second side electrode E2 and the first solid electrolyte layer 12. A dielectric layer is formed in the periphery near the interface between the right-side first insulating region 10 and the anode electrode layer 8, and a region closer to the anode electrode layer 8 than the dielectric layer is a conductive region. The right-side second insulating region 10B is interposed between the second side electrode E2 and the second solid electrolyte layer 12B. A dielectric layer is formed in the periphery near the interface between the right-side second insulating region 10B and the anode electrode layer 8, and a region closer to the anode electrode layer 8 than the dielectric layer is a conductive region.

[0045] The insulating portion 162 is interposed between the right-side first insulating region 10 and the second side electrode E2. The insulating portion 162 is interposed between the right-side second insulating region 10B and the second side electrode E2. The insulating portion 162 is interposed between the right end of the anode electrode layer 8 and the second side electrode E2. The material of the insulating portion 162 is different from the materials of the first insulating region 10 and the second insulating region 10B. The material of the first insulating region 10 and the second insulating region 10B is the same.

[0046] The material of the insulating portion 162 may include the same material as the material of the protective insulator 16. The insulating portion 162 may include a filler in a resin. Examples of the resin material include phenolic resin, methacrylic resin, epoxy resin, silicone resin, polycarbonate, polyethylene terephthalate, polyamide, polyimide, polybutadiene, polyethylene, and polystyrene. The resin may be a resist material. The resin material may be a thermosetting resin such as polyimide or epoxy resin, but a photocurable resin may also be used. Examples of inorganic materials constituting the filler include silica (SiO2), aluminum oxide (Al2O3), and aluminum nitride (AlN).

[0047] A first insulating layer 11 is interposed between the first insulating region 10 and the first cathode electrode layer 14. The first insulating layer 11 contains the same resin material as the first insulating region 10 and also contains a filler. Since the filler does not generally penetrate into the first insulating region 10, the filler content is small. A second insulating layer 11B is interposed between the second insulating region 10B and the second cathode electrode layer 14B. The second insulating layer 11B is made of the same material as the first insulating layer 11. The second insulating region 10B is made of the same material as the first insulating region 10.

[0048] The insulating portion 162 is provided between the first mask layer M1 (protective layer) and the second mask layer M1B (protective layer). The first mask layer M1 may contain a resin (e.g., epoxy resin) and a filler. During manufacturing, the first mask layer M1 has a high viscosity before hardening, so when applied to the roughened layer, the resin material before hardening does not penetrate into the interior. Therefore, during manufacturing, the roughened layer directly below the first mask layer M1 does not contain resin and can be easily etched. The insulating portion 162 is embedded in the region formed by etching the roughened layer. The first mask layer M1 is located between the insulating portion 162 and the first cathode electrode layer 14. The second mask layer M1B is located between the insulating portion 162 and the second cathode electrode layer 14B. The material and function of the second mask layer M1B are the same as those of the first mask layer M1. After etching, the area directly below the mask layer becomes a space free of resin residue from the roughened layer, making it easier to embed the insulating portion 162 and also making it possible to use a resin with low permeability as the material for the insulating portion 162.

[0049] A first insulating sheet IF1 is interposed between the support substrate 7 and the first solid electrolytic capacitor element CE1. A second insulating sheet IF2 is interposed between the first solid electrolytic capacitor element CE1 and the second solid electrolytic capacitor element CE2. The insulating sheet is made of a material containing resin, preferably a material containing resin and an inorganic material. The inorganic material can be a filler such as silica or glass fiber (glass cloth or glass nonwoven fabric). The resin material can be a thermosetting resin such as epoxy resin. In this example, a resin sheet made of epoxy resin with silica added is used, but a prepreg material made of glass fiber impregnated with epoxy resin can also be used.

[0050] FIG. 3 is a diagram showing the structure in the vicinity of the solid electrolyte layer.

[0051] A first dielectric layer 9 is formed on the surface of the anode electrode layer 8. The first dielectric layer 9 is typically an electrically insulating metal oxide film (aluminum oxide (Al2O3) when the anode electrode layer 8 is made of aluminum). The first dielectric layer 9 is formed by oxidizing the surface of the anode electrode layer 8 using a predetermined method. The thickness of the first dielectric layer 9 is, for example, 1 nm to 1 μm. The first solid electrolyte layer 12 is formed along the first dielectric layer 9 on the finely uneven surface of the anode electrode layer 8 formed by surface enlarging, so as to fill the recesses 8c. The thickness of the first solid electrolyte layer 12 is preferably such that it can cover the uneven surface. The thickness of the first solid electrolyte layer 12 is, for example, approximately 1 μm to 100 μm. Note that FIG. 1 shows an example in which a first conductive layer 13 is formed on the first solid electrolyte layer 12.

[0052] The thickness of the anode electrode layer 8, first solid electrolyte layer 12, and second solid electrolyte layer 12B (the thickness of the region (metal sheet) containing aluminum) can be preferably set to 50 μm to 300 μm. More preferably, this thickness can be set to 100 μm to 150 μm.

[0053] Next, the structure around the side end of the anode electrode layer 8 will be described.

[0054] FIG. 4 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer.

[0055] The solid electrolytic capacitor comprises a laminate 100 including a plurality of stacked solid electrolytic capacitor elements, a first side electrode E1 provided on a first side surface S1 of the laminate 100, and a second side electrode E2 provided on a second side surface S2 of the laminate 100.

[0056] Here, the solid electrolytic capacitor element includes a first dielectric layer, a first solid electrolyte layer 12, and a first cathode electrode layer 14 on the upper side of the anode electrode layer 8, and a first insulating region 10 and an insulating portion 162 on the side. The anode electrode layer 8 is electrically connected to a first side electrode E1. The first dielectric layer is provided on the anode electrode layer 8. The first cathode electrode layer 14 is electrically connected to a second side electrode E2. The first solid electrolyte layer 12 is interposed between the first dielectric layer and the first cathode electrode layer 14. The insulating portion 162 is interposed between the side surface of the anode electrode layer 8 and the second side electrode E2 and contains an insulating resin. The first insulating region 10 is interposed between the insulating portion 162 and the first solid electrolyte layer 12 and contains a material different from that of the insulating portion 162. A dielectric layer made of aluminum oxide or the like is interposed between the first insulating region 10 and the anode electrode layer 8, and this dielectric layer is formed around the interface vicinity region 91' thereof.

[0057] A second dielectric layer, a second solid electrolyte layer 12B, and a second cathode electrode layer 14B are provided below the anode electrode layer 8, and a second insulating region 10B and an insulating portion 162 are provided on the sides. A dielectric layer made of aluminum oxide or the like is interposed between the second insulating region 10B and the anode electrode layer 8, and this dielectric layer is formed around the interface vicinity region 91B'.

[0058] In this figure, an XYZ three-dimensional Cartesian coordinate system is also set, with multiple solid electrolytic capacitor elements stacked along the Z-axis direction, and the direction from the first side electrode E1 to the second side electrode E2 being the positive X-axis direction. The anode electrode layer 8 has a protrusion 8p that protrudes in the positive X-axis direction at its end position in the positive X-axis direction. The X-position of the tip of the protrusion 8p is designated as tip position xp. The first distance D1 is the distance between the anode electrode layer 8 and the second side electrode E2, specifically the distance between tip position xp of the protrusion 8p and the position of the second side S2 (second position x2). The X-position of the first insulating region 10 closest to the second side electrode E2 is designated as end position xs. The second distance D2 is the distance between the first insulating region 10 and the second side electrode E2, specifically the distance between end position xs on the second side electrode side of the first insulating region 10 and the position of the second side S2 (second position x2). Here, the first distance D1 is smaller than the second distance D2. The second distance D2 is also the distance between the second insulating region 10B and the second side electrode E2. In this way, the position of the side surface of the anode electrode layer 8 is closer to the second side electrode E2 than the insulating region 10B (D1 <D2)。

[0059] In the insulating portion 162, the filler content can be preferably 20% by mass or more and 90% by mass or less. The insulating portion 162 can contain multiple surrounding resins. These resins can be thermosetting resins such as epoxy resin or a mixed resin of acrylic and epoxy. Using a highly heat-resistant and highly elastic epoxy resin or a low-elastic epoxy resin as these resins is preferable in terms of reducing warpage and thermal stress. The basic function of the insulating portion 162 is to provide electrical insulation between the anode electrode layer 8 and the second side electrode E2.

[0060] The anode electrode layer 8 has a protrusion 8p on the second side electrode E2 side. Stress may be applied to the interface between the protrusion 8p and the insulating portion 162. Stress may be applied to the interface between the first insulating region 10 (or the second insulating region 10B) and the insulating portion 162. Meanwhile, the tip position xp of the protrusion 8p that determines the first distance D1 is different from the end position xs of the first insulating region 10 on the second side electrode side that determines the second distance D2. This makes it possible to suppress the transmission of stress to the interface with the insulating portion 162 more effectively than when these positions are aligned. In other words, it is possible to suppress the occurrence and progression of cracks within the element. When an interface of an appropriate material is located on the anode electrode layer 8, the tip position (X-direction position) of the protrusion 8p can be made different from this interface position (X-direction position). This makes it possible to suppress the transmission of stress to the interface more effectively than when these positions are aligned.

[0061] Furthermore, the protrusion 8p has a triangular shape in the XZ plane. The first angle θ, which defines the upper hypotenuse of the triangle, is the angle between the Z axis passing through the X-axis position (xs) that gives the second distance D2 of the first insulating region 10 and the contour line 8s of the protrusion 8p at the intersection of this Z axis and the protrusion 8p in the XZ plane. The first angle θ is greater than 90° (an obtuse angle: 90°<θ). With this obtuse angle, when a deformation stress is applied that bends the hypotenuse (contour line 8s) of the protrusion 8p about the Y axis, the force acting on the first insulating region 10 is smaller than when the first angle θ is 90°. In other words, the occurrence of cracks in the element is suppressed.

[0062] Similarly, the second angle θ' defining the lower hypotenuse of the triangle is the angle between the Z axis passing through the X-axis position (xs) that defines the second distance D2 of the second insulating region 10B and the contour line 8Bs of the protrusion 8p at the intersection of the Z axis and the protrusion 8p in the XZ plane. The second angle θ' is greater than 90° (an obtuse angle: 90°<θ'). With this obtuse angle, when a deformation stress is applied that bends the hypotenuse (contour line 8Bs) of the protrusion 8p about the Y axis, the force acting on the second insulating region 10B is smaller than when the second angle θ' is 90°. In other words, the occurrence of cracks within the element is suppressed.

[0063] The above-described structure not only prevents cracks from occurring but also prevents peeling between layers, thereby extending the life of the solid electrolytic capacitor.

[0064] The solid electrolytic capacitor according to this embodiment can reduce stress generated around the side surface of the anode electrode layer 8. In addition to the protrusion 8p described above, the device also includes a first mask layer M1 and a second mask layer M1B. As described above, the use of the mask layer allows for easy removal of the material (roughened layer) provided on the inner surface thereof, thereby easily improving the filling rate of the insulating portion provided in the space formed by the removal. The insulating portion 162 is adjacent to the anode electrode layer 8. Improving the filling rate of the insulating portion reduces the occurrence of stress due to internal voids, etc., and improves the reliability of the device. Furthermore, the increased flexibility in forming the insulating portion 162 allows for the structure of the insulating portion to be improved to reduce stress, thereby improving the reliability of the device.

[0065] The viscosity of the first mask layer M1 before solidification (curing) is higher than the viscosity of the first insulating layer 11 before solidification. In this example, the first mask layer M1 contains a resin and a filler. To increase the viscosity of the first mask layer M1, the filler content of the first mask layer M1 can be higher than the filler content of the first insulating layer 11. To increase the viscosity of the first mask layer M1 before solidification, the molecular weight of the resin of the first mask layer M1 before solidification can be higher than the molecular weight of the resin of the first insulating layer 11 before solidification. The viscosity of the first mask layer M1 before solidification also depends on the proportion of the solvent. The first mask layer M1 has a higher viscosity than the first insulating layer 11 before solidification, and is therefore less likely to be absorbed by the roughened layer located below the mask layer M1 during manufacturing. Therefore, the solid electrolytic capacitor has a structure that allows for easy removal of the roughened layer directly below the mask layer and a high filling rate of the insulating portion 162. Similarly, the viscosity of the second mask layer M1B before solidification is higher than the viscosity of the second insulating layer 11B before solidification. In this example, the second mask layer M1B contains a resin and a filler. To increase the viscosity of the second mask layer M1B, the filler content of the second mask layer M1B can be made higher than the filler content of the second insulating layer 11B. Furthermore, to increase the viscosity of the second mask layer M1B before solidification, the molecular weight of the resin of the second mask layer M1B before solidification can be made higher than the molecular weight of the resin of the second insulating layer 11B before solidification. Note that the viscosity of the second mask layer M1B before solidification also depends on the proportion of the solvent.

[0066] To further explain the materials, the first insulating region 10 contains the metal contained in the anode electrode layer 8 and the resin contained in the first insulating layer 11. The first insulating region 10 is formed by supplying resin to a roughened layer formed by roughening a metal sheet including the anode electrode layer 8, and the first insulating layer 11 is formed by the resin remaining thereon. Therefore, the first insulating region 10 contains the metal contained in the anode electrode layer 8 and the resin contained in the first insulating layer 11. An example of the metal is aluminum, and an example of the resin is epoxy resin. The material of the second insulating region 10B is the same as the material of the first insulating region 10.

[0067] The insulating portion 162 contains a resin and a filler, and the constituent material of the insulating portion 162 is different from that of the insulating region 10. The inclusion of a filler in the insulating portion 162 increases the hardness and mechanical strength of the insulating portion 162. In addition, the thermal expansion coefficient of the insulating portion 162 can be reduced.

[0068] FIG. 5 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer.

[0069] 4, this structure has a structure in which the region directly below the first mask layer M1 is further etched and then an insulating portion 162 is formed. That is, in this solid electrolytic capacitor element, the first insulating region 10 includes a first region 101 and a second region 102. The second region 102 is a region from which the internal metal elements have been removed during etching of the anode electrode layer, and the second region 102 is filled with resin in a subsequent process to form a resin-filled region 162 of the insulating portion 162. X The original second region 102 has a sponge-like softened structure due to the metal contained in the original insulating region 10 being extracted by etching. The insulating region 10 before etching contains resin and metal. The first region 101 contains the metal contained in the anode electrode layer 8 and the resin contained in the first insulating layer 11. A part of the insulating portion 162 is located around the protruding portion 8p of the anode electrode layer 8, and a relatively soft resin-filled region 162 is located around it. X The resin filling area 162 is located X has a structure that can reduce the stress applied to the protruding portion 8p. Only resin can be infiltrated into the second region 102 (roughened resin portion) during resin sealing. In this case, a resin-only layer can be formed at the interface with the anode electrode layer 8, where stress is greatest, and by combining this with a method for improving the filling rate of the insulating portion using a mask layer, the possibility of voids being formed in the roughened resin portion, which is difficult to fill, can be further reduced.

[0070] FIG. 6 is a diagram showing an example of the second region 102. As shown in FIG.

[0071] The second region 102 contains the resin RSN included in the first insulating layer 11. The second region 102 is a resin material from which a metal material such as aluminum has been removed. During the manufacturing process, immediately after the metal material is removed, the second region 102 contains a plurality of minute spaces MS dispersed in the resin RSN. Gas such as air may be contained in the minute spaces MS. Since the minute spaces MS are basically filled with resin, after the final manufacturing process, the second region 102 becomes a resin-filled region 162 consisting of a single layer of only the resin material. X It becomes.

[0072] FIG. 7 is a diagram showing an example of the peripheral structure of the side tip portion of the anode electrode layer.

[0073] This structure has a structure in which the region directly under the first mask layer M1 is further etched and then the insulating portion 162 is formed as compared with the structure shown in FIG. 5. That is, in this solid electrolytic capacitor element, the first insulating region 10 includes the first region 101 and the resin-filled region 162. X However, the tip position of the anode electrode layer 8 is located deeper than the position on the second side electrode E2 side of the resin-filled region 162. X In other words, the position of the side surface of the anode electrode layer 8 is farther from the second side electrode E2 than the resin-filled region 162 (D2 < D1 in the figure). The resin-filled region 162 has a structure in which, before resin filling, the metal originally contained inside the initial insulating region 10 escapes due to etching and softens into a sponge-like structure, and resin can be filled into the internal minute spaces as necessary. Around the protruding portion 8p of the anode electrode layer 8, there is a softened resin-filled region 162. X It has a structure that can reduce the stress applied from the resin-filled region 162 to the protruding portion 8p. X It has a structure that can reduce the stress applied from the resin-filled region 162 to the protruding portion 又は8p. X is located, and has a structure capable of reducing the stress applied from the resin-filled region 162 X to the protruding portion 8p.

[0074] FIG. It is a figure which shows an example of the peripheral structure of the side tip part of an anode electrode layer.

[0075] 7, this structure is different from the structure shown in FIG. 7 in that the region directly below the first mask layer M1 is further etched, and then two or more types of filling materials with different properties are filled into the space after etching. That is, the insulating portion 162 is a resin filling region 162 X and a second insulating portion 1622 interposed between the first insulating portion 1621 and the second side electrode E2. The resin contained in the first insulating portion 1621 is also contained in the minute space MS, and the second insulating portion 1622 has a higher filler content than the first insulating portion 1621.

[0076] Since second insulating portion 1622 is located farther from anode electrode layer 8 than first insulating portion 1621, the mechanical strength can be increased by increasing the filler content and increasing the hardness.

[0077] FIG. 9 is a diagram showing an example of a resin filling region and a first insulating portion.

[0078] The first insulating portion 1621 constituting a part of the insulating portion 162 has a relatively low filler content (including a case where no filler is contained). Therefore, when forming this, the resin that is the constituent material thereof is used to fill the resin-filled region 162 X This is also included in the minute space MS in the circuit board. If the minute space MS is filled with resin and the amount of air inside is reduced, it is possible to reduce stress changes that occur when the temperature changes. Filling the minute space MS with resin also makes it possible to prevent moisture from accumulating in the voids, which can deteriorate electrical reliability.

[0079] FIG. 10 is a diagram showing the peripheral structure of the side end portion of the anode electrode layer.

[0080] In this structure, the area of ​​the first insulating portion 1621 is enlarged compared to the structure shown in Fig. 8. This structure provides the same effects as the structure shown in Fig. 8.

[0081] FIG. 11 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer.

[0082] This structure is different from the structure shown in FIG. 10 in that the insulating portion 162 is a resin-filled region 162 X 16 shows an example in which only the first insulating portion 1621 adjacent to the resin filling region 162 is provided. The insulating portion 162 does not include the second insulating portion. Of course, the resin contained in the first insulating portion 1621 is X This structure has the same effect as the structure of Fig. 10, but has the advantage of reducing the number of manufacturing steps by one.

[0083] Next, a method for manufacturing the above solid electrolytic capacitor will be described.

[0084] FIG. 12 is a diagram (a vertical cross-sectional view (A) and a plan view (B)) for explaining a method for manufacturing a solid electrolytic capacitor.

[0085] The method for manufacturing a solid electrolytic capacitor includes (i) a process for manufacturing a solid electrolytic capacitor sheet (FIGS. 12 to 18), and (ii) a process for processing a plurality of solid electrolytic capacitor sheets (FIGS. 19 to 29).

[0086] (i) In the process for producing a solid electrolytic capacitor sheet, the following steps (a) to (g) are carried out in order.

[0087] (a) Formation of a mask layer on a metal sheet In the mask layer formation process shown in FIG. 12, first, a metal sheet 80 made of a valve metal is prepared. The metal sheet 80 includes an anode electrode layer 8 made of a valve metal (aluminum in this example), a first roughened layer 121, and a second roughened layer 121B. The first roughened layer 121 is formed on the upper surface of the anode electrode layer 8. The second roughened layer 121B is formed on the lower surface of the anode electrode layer 8. The roughened layers are formed by first roughening both surfaces of the metal sheet by etching or the like, and then forming oxide layers on these surfaces by chemical conversion treatment (oxide film formation treatment and / or anodization) on both surfaces of the metal sheet. A first dielectric layer (oxide layer: Al2O3 layer in this example) is formed on the upper surface of the anode electrode layer 8. The first dielectric layer is formed around the interface vicinity region 91 as shown in FIG. 3. A second dielectric layer (oxide layer: Al2O3 layer in this example) is formed on the lower surface of the anode electrode layer 8. The second dielectric layer is formed around the interface near region 91B as shown in FIG.

[0088] After preparing the metal sheet 80, a first mask layer M1 having a first pattern is formed on the first rough layer 121. The first pattern is a striped line pattern. Subsequently, a second mask layer M1B having a second pattern is formed on the upper surface (lower surface) of the second rough layer 121B. The second pattern is also a striped line pattern. Screen printing can be used to form the mask layer. The resin (e.g., thermosetting resin (epoxy resin)) contained in the printing paint used to form the mask layer and insulating layer is a prepolymer before curing and a polymer after curing. The first mask layer M1 and the second mask layer M1B may be formed simultaneously. The mask layer is a resin material containing a resin (e.g., epoxy resin) and a filler, and due to its high viscosity, it does not penetrate into the rough layer. When the first resist constituting this mask layer is a hardly soluble resist, and the resin constituting the first insulating layer 11 is a second resist, the following conditions are satisfied: the paint viscosity of the first resist ≥ the paint viscosity of the second resist and / or the printing thickness of the first resist ≤ the printing thickness of the second resist. In other words, the first resist has a higher or lower viscosity or printing thickness. Specifically, the printing paint for forming the mask layer is a liquid mixture containing a resin, a filler, and a solvent. The viscosity of this liquid mixture can generally be adjusted by adjusting the resin molecular weight, the amount of solvent, the amount of filler, or the filler shape (specific surface area). The viscosity and thixotropy can be increased when the resin molecular weight is higher, the amount of solvent is lower, the filler specific surface area is larger, or the filler amount is higher than those of the paint used to form the first insulating layer 11 and the second insulating layer 11B.

[0089] An example of the resin material constituting the mask layers (first mask layer M1 and second mask layer M1B) is a liquid mixture used as a solder resist. For example, a thermosetting solder resist is made by curing an epoxy resin with a curing agent such as imidazole. An alkali-developable solder resist is made by dissolving the resin with a weak alkali such as sodium carbonate before post-heating for curing.

[0090] Alternatively, a soluble resist material that is soluble in alkali or solvent may be used as the resist material for forming the mask layer, and the resist portion that has penetrated into the roughened interior may be dissolved and removed after the subsequent etching process of the anode electrode layer. When the first resist used for the mask layer is soluble, the viscosity and thickness may not be subject to the above-mentioned limitations. A positive resist can be used as a resist material that can be relatively easily removed with a stripper (solvent) after functioning as a mask layer. Many resist materials are known as positive resists, including those that use cresol novolac resin and a photosensitizer (naphthoquinone diazide compound).

[0091] (b) Insulating region formation process FIG. 13 is a diagram (longitudinal cross-sectional view (A) and plan view (B)) for explaining a method for manufacturing a solid electrolytic capacitor. In the step of forming an insulating region shown in FIG. 13, a resist is applied to the upper and lower surfaces of a metal sheet 80. There are various known methods for applying the resist, such as screen printing, gravure printing, and spray coating. In this example, the screen printing method is used.

[0092] In the upper surface resist printing process, a resist layer having a grid pattern (rectangular grid) is formed on the upper surface of the metal sheet 80. A mask (screen plate) with openings corresponding to the areas where the resist is to be applied is used to apply the resist within the openings, and a squeegee is used to apply pressure to the resist. This resist layer also includes linear first opening patterns OP1 extending along the Y-axis direction, and these opening patterns are located on the first mask layer M1. The width (dimension in the X-axis direction) of the first opening pattern OP1 is smaller than the width of the first mask layer M1.

[0093] In the lower surface resist printing process, a resist layer having a grid pattern (rectangular grid) is formed on the lower surface of the metal sheet 80. A mask (screen plate) with openings corresponding to the areas where the resist is to be applied is used to apply the resist within the openings, and a squeegee is used to apply pressure to the resist. This resist layer also includes linear second opening patterns OP2 extending along the Y-axis direction, and these opening patterns are located on the second mask layer M1B (on the lower surface). The width (dimension in the X-axis direction) of the second opening pattern OP2 is smaller than the width of the second mask layer M1B.

[0094] The upper surface resist printing process and the lower surface resist printing process can be performed simultaneously. Doing so can shorten the manufacturing time. The upper surface resist printing process and the lower surface resist printing process can also be performed at different times. The metal sheet 80 can also be turned upside down during processing. The resist material is a mixture of epoxy resin and silica filler, etc. Known fillers other than silica include alumina and aluminum hydroxide.

[0095] By applying the resist, the resist (insulating resin: epoxy resin, etc.) penetrates into the first roughened layer 121, forming a first insulating region 10 having a grid pattern (rectangular opening pattern) and a line-shaped opening pattern in plan view. Some of the resist remains on the first insulating region 10, forming a first insulating layer 11 having a grid pattern (rectangular opening pattern) and a line-shaped opening pattern in plan view. By applying the resist, the resist (insulating resin: epoxy resin, etc.) penetrates into the second roughened layer 121B, forming a second insulating region 10B having a grid pattern (rectangular opening pattern) and a line-shaped opening pattern in plan view. Some of the resist remains below the second insulating region 10B, forming a second insulating layer 11B having a grid pattern (rectangular opening pattern) and a line-shaped opening pattern in plan view.

[0096] The viscosity relationship between the resin materials used to form the first insulating layer 11 and the first mask layer M1 is as described above, and the viscosity of the first mask layer M1 can be set relatively high. However, if a soluble resin material is used, the viscosity relationship does not need to be limited to this. An example of a resin material constituting the insulating layers (first insulating layer 11 and second insulating layer 11B) is a liquid mixture used as a solder resist. A liquid mixture with a viscosity of 10,000 mPa·s at 25°C can be diluted with a solvent to reduce the viscosity and efficiently penetrate into the roughened layer. The viscosity of the resist material used to form the first insulating layer 11 can be, for example, 10 to 100 Pa·s (10,000 to 100,000 mPa·s, value at 1 rpm), and the viscosity of the resist material used to form the mask layer can be 100 to 500 Pa·s (1 rpm). Thus, the printing resist for forming the mask layer can have a viscosity higher than 10,000 mPs.

[0097] Note that the resist (resin) does not generally penetrate into the first rough layer 121 directly below the first mask layer M1, protecting the first rough layer 121. Similarly, the resist (resin) does not generally penetrate into the second rough layer 121B directly below the second mask layer M1B, protecting the second rough layer 121B. A rough layer that does not contain a resin material can be easily etched, so that in a later step, the region of the rough layer can be removed and the aforementioned insulating portion can be satisfactorily filled into the removed space.

[0098] The width (distance ΔX) in the X-axis direction of the rectangular opening pattern formed in the first insulating layer 11 (first insulating region 10) is given by distance ΔX = position xb - position xa. A conductive polymer is introduced into the openings in the first rough layer 121 and second rough layer 121B defined by distance ΔX. The dimensions of the second insulating layer 11B (second insulating region 10B) are the same as those of the first insulating layer 11 (first insulating region 10).

[0099] A first insulating layer 11 is formed on the surface of the metal sheet 80. The dimension of the metal sheet 80 in the X-axis direction is larger than the dimension in the Y-axis direction. The metal sheet 80 can be wound into a roll with the Y-axis as the axis of rotation; in this case, the figure shows a portion of the metal sheet extending from the roll.

[0100] The outer contour of the first insulating layer 11 is rectangular. The contour of the metal sheet 80 is also rectangular. These contours may be the same, or the first insulating layer 11 may be formed inside the metal sheet 80 in plan view. In this case, a margin area is set between the contour of the metal sheet 80 and the first insulating layer 11 formed inside it.

[0101] The order of the mask layer formation step and the insulating layer (11) formation step may be as described later in Figures 39(A) to 39(D). That is, the mask layer may be formed after the insulating layer (11) is formed.

[0102] (c) Solid electrolyte layer formation process FIG. 14 is a diagram (longitudinal cross-sectional view (A) and plan view (B)) for explaining a method for manufacturing a solid electrolytic capacitor. In the solid electrolyte layer formation step shown in FIG. 14, after the insulating regions are formed, a conductive polymer is introduced into the rectangular openings on the upper and lower surfaces of metal sheet 80 to form a solid electrolyte layer. There are various known methods for introducing the conductive polymer, such as a coating method, a chemical oxidation polymerization method, and an electrolytic polymerization method.

[0103] In the coating method, a solution containing a conductive polymer is supplied into the rectangular opening between the first insulating regions 10 on the upper surface (and the opening between the second insulating regions 10B on the lower surface). The solution containing a conductive polymer is a solution in which a soluble conductive polymer is dissolved in a solvent (water or other solvent), or a solution in which conductive polymer particles (with a particle diameter of several nm to 20 nm) are dispersed in a solvent such as water or an organic solvent. Methods for supplying the solution containing a conductive polymer into the opening include a method in which droplets are supplied from a dispenser and a method in which a physically continuous liquid is applied. Supply methods include inkjet printing, printing, and transfer printing. In this example, a method is used in which a solution containing a conductive polymer (e.g., an aqueous solution) is dropped into the opening from a dispenser and then dried (water removal). An example of a conductive polymer is doped poly(3,4-ethylenedioxythiophene) (PEDOT). Other conductive polymers mentioned above can also be used. In the electrolytic polymerization method, after forming a conductive resin seed layer as a base, the substrate is immersed in a monomer solution, and a conductive resin layer is grown on the seed layer by electrolytic polymerization.

[0104] The conductive polymer introduced to the upper surface penetrates into the first roughened layer 121 (see FIG. 13 ) in the openings between the first insulating regions 10, forming the first solid electrolyte layer 12. A portion of the conductive polymer remains on top of the first solid electrolyte layer 12, forming the first conductive polymer layer 12r. Alternatively, a portion of the conductive polymer may extend slightly beyond the opening, so that the first conductive polymer layer 12r is positioned so as to contact the main surface (XY plane) of the first insulating region 10. This reduces the risk of misalignment during manufacturing or the occurrence of uncoated or unfilled portions. Within the XY plane, each first solid electrolyte layer 12 has a rectangular shape, and these first solid electrolyte layers 12 are arranged two-dimensionally. The shape of each first solid electrolyte layer 12 is not limited to a rectangular shape and can be various shapes.

[0105] The conductive polymer introduced to the lower surface penetrates into the second roughened layer 121B (see FIG. 13) in the openings between the second insulating regions 10B, forming the second solid electrolyte layer 12B. A portion of the conductive polymer remains below the second solid electrolyte layer 12B (the lower portion in the drawing), forming the second conductive polymer layer 12Br. Alternatively, a portion of the conductive polymer may extend slightly beyond the opening, so that the second conductive polymer layer 12Br is positioned so as to contact the main surface (XY plane) of the second insulating region 10B. This reduces the risk of misalignment during manufacturing or the occurrence of uncoated or unfilled portions. Within the XY plane, each second solid electrolyte layer 12B has a rectangular shape, and these second solid electrolyte layers 12B are arranged two-dimensionally. The shape of each second solid electrolyte layer 12B is not limited to a rectangular shape and can be various shapes.

[0106] The process of introducing the conductive polymer on the upper surface and the process of introducing the conductive polymer on the lower surface can be performed simultaneously or at different times. Performing them simultaneously can shorten the manufacturing time. The sheet can also be turned over for further processing.

[0107] (d) Conductive layer formation process FIG. 15 is a diagram (longitudinal cross-sectional view (A) and plan view (B)) for explaining a method for manufacturing a solid electrolytic capacitor. In the conductive layer forming process shown in FIG. 15, after the conductive polymer introduction process, a first conductive layer 13 is formed on the surface of the first solid electrolyte layer 12, and a second conductive layer 13B is formed on the back surface of the second solid electrolyte layer 12B. Each conductive layer may be a single layer or may be two or more layers. Formation methods include applying a conductive layer material (e.g., carbon paste). Screen printing, gravure printing (transfer), and supplying methods using a dispenser are also available. Many supplying methods using a dispenser are known, including an air dispensing method in which compressed air is added to a liquid material and the material is forced out from a nozzle, a jet dispensing method in which a liquid material is sprayed from the tip of a nozzle, and an inkjet supplying method.

[0108] The process of forming the first conductive layer on the upper surface and the process of forming the second conductive layer on the lower surface can be performed simultaneously or at different times. Performing these processes simultaneously can shorten the manufacturing time. The sheet can also be turned over for further processing.

[0109] (e) Cathode electrode layer formation process FIG. 16 is a diagram (longitudinal cross-sectional view (A) and plan view (B)) for explaining a method for manufacturing a solid electrolytic capacitor. In the cathode electrode layer forming step shown in FIG. 16, after the conductive layer forming step, a first cathode electrode layer 14 is formed on the front surface including the front surface of the first conductive layer 13, and a second cathode electrode layer 14B is formed on the back surface including the front surface of the second conductive layer 13B. Although various formation methods are possible, a plating method is used in this example.

[0110] When forming the first cathode electrode layer 14 on the upper surface side, a base layer is formed on the surface including the surface of the first conductive layer 13. When forming the second cathode electrode layer 14B on the lower surface side, a base layer is formed on the surface including the surface of the second conductive layer 13B. These base layers are formed using, for example, a sputtering method. Copper (Cu) or a nickel-chromium alloy (NiCr) can be used as the material for the base layer. The material for the base layer may be any material that has high adhesion to the layer directly below it and on which a plating layer can be grown. A plating layer is formed on the base layer. In this example, the material for the plating layer is copper (Cu). A plating layer is formed by electrolytic plating on the entire surface on which the base layer is formed. Through these plating processes, the first cathode electrode layer 14 and the second cathode electrode layer 14B are formed. The cathode electrode layer is formed on the entire exposed surface of the substrate, and patterning can be performed in a later process.

[0111] (f) Protective layer (resist) formation process 17A and 17B are diagrams (longitudinal cross-sectional view (A) and plan view (B)) for explaining a method for manufacturing a solid electrolytic capacitor. In the protective layer forming step shown in FIG. 17, after the cathode electrode layer forming step, a first protective layer 15 is formed on the first cathode electrode layer 14, and a second protective layer 15B is formed on the second cathode electrode layer 14B. There are various methods for forming the first protective layer 15 and the second protective layer 15B. For example, screen printing and gravure printing (transfer) can be used. In this example, screen printing is used. The resist material for forming the first protective layer 15 and the second protective layer 15B is a material containing resin, as described above. The first protective layer forming step on the upper surface side and the second protective layer forming step on the lower surface side can be performed simultaneously or at different times. Performing them simultaneously can shorten the manufacturing time. The sheet may be turned over for processing.

[0112] The first protective layer 15 has a plurality of regions arranged two-dimensionally, each of which has a rectangular shape (shape in the XY plane), and the gaps between these regions form a lattice shape (rectangular lattice). The width of this gap in the X-axis direction is given as the width of the first opening H1. Note that the shape of each of the first protective layers 15 is not limited to a rectangle and can be various shapes.

[0113] The second protective layer 15B has a plurality of regions arranged two-dimensionally, each of which has a rectangular shape (shape in the XY plane), and the gaps between these regions form a lattice shape (rectangular lattice). The width of this gap in the X-axis direction is given as the width of the second opening H1B. The second protective layer 15B also has a frame-shaped region (not shown) similar to that of the first protective layer 15. The dimensions of each region of the second protective layer 15B are the same as those of the first protective layer 15. These protective layers can function as a mask when etching the cathode electrode layer. The shape of each second protective layer 15B is not limited to a rectangle and can be various shapes.

[0114] A first insulating region 10 is located directly below a first opening H1 located between adjacent rectangular regions included in the first protective layer 15, with a first cathode electrode layer 14 interposed therebetween. A second insulating region 10B is located directly below (on the anode electrode layer 8 side of) a second opening H1B located between adjacent rectangular regions included in the second protective layer 15B, with a second cathode electrode layer 14B interposed therebetween.

[0115] (g) Etching and dividing the cathode electrode layer FIG. 18 is a diagram (longitudinal cross-sectional view (A) and plan view (B)) for explaining a method for manufacturing a solid electrolytic capacitor. In the etching and dividing step of the cathode electrode layer shown in FIG. 18, after the step of forming the first and second protective layers, the first cathode electrode layer 14 and the second cathode electrode layer 14B are etched using these protective layers as a mask to divide them into a plurality of regions. As the etching solution, a ferric chloride aqueous solution, a copper chloride aqueous solution, a mixed solution of sulfuric acid and hydrogen peroxide, or the like can be used. Etching can be performed by spraying the etching solution onto the cathode electrode layer, or by immersing the cathode electrode layer in the etching solution. The cathode electrode layer formed by plating has a two-layer structure, so these layers are etched.

[0116] The etching solution removes the regions directly below the first openings in the first cathode electrode layer 14, dividing the first cathode electrode layer 14 into multiple rectangular regions. The width in the X-axis direction of the gaps between the rectangular regions made of the first cathode electrode layer 14 may be slightly wider than the width in the X-axis direction of the first openings H1 in the protective layer. The shape of these gaps in the XY plane is a lattice pattern (rectangular lattice).

[0117] The etching solution removes the regions of the second cathode electrode layer 14B directly below the first openings, dividing the second cathode electrode layer 14B into multiple rectangular regions. The width of the gaps between the rectangular regions of the second cathode electrode layer 14B in the X-axis direction may be slightly wider than the width of the second openings H1B in the protective layer in the X-axis direction. The shape of these gaps in the XY plane is a lattice (rectangular lattice).

[0118] As explained above, the method for manufacturing a solid electrolytic capacitor sheet includes (a) a step of forming a mask layer on a metal sheet, (b) a step of forming an insulating region, (c) a step of forming a solid electrolyte layer, (d) a step of forming a conductive layer, (e) a step of forming a cathode electrode layer, (f) a step of forming a protective layer, and (g) a step of etching and dividing the cathode electrode layer. Through these steps, a solid electrolytic capacitor sheet CES is manufactured.

[0119] (ii) A method for manufacturing individual solid electrolytic capacitors by processing a plurality of solid electrolytic capacitor sheets involves sequentially carrying out the following steps (A) to (G). (A) Laminated sheet forming process Fig. 19 is a diagram illustrating a method for manufacturing a solid electrolytic capacitor. In the laminate sheet forming step shown in Fig. 19, first, N solid electrolytic capacitor sheets shown in Fig. 18 are prepared (2≦N). In this example, N=4, and a first solid electrolytic capacitor sheet CES1, a second solid electrolytic capacitor sheet CES2, a third solid electrolytic capacitor sheet CES3, and a fourth solid electrolytic capacitor sheet CES4 are prepared.

[0120] Next, a first insulating sheet IF1, a first solid electrolytic capacitor sheet CES1, a second insulating sheet IF2, a second solid electrolytic capacitor sheet CES2, a third insulating sheet IF3, a third solid electrolytic capacitor sheet CES3, a fourth insulating sheet IF4, a fourth solid electrolytic capacitor sheet CES4, an uppermost insulating sheet IFT, and a reinforcing sheet CF1 are sequentially stacked on the support substrate 7. The stacked sheets are heated and pressure is applied in the Z-axis direction to form a laminated sheet 300. Note that a plurality of anode terminals 1 and cathode terminals 2 are patterned and formed on the underside of the support substrate 7 in advance, but in this example, intermediate terminals 210 are also formed, which will become the anode terminals and cathode terminals after separation in a later step.

[0121] In this example, the insulating sheets (first insulating sheet IF1, second insulating sheet IF2, third insulating sheet IF3, fourth insulating sheet IF4, and top insulating sheet IFT) are made of materials such as the thermosetting resin described above. By applying heat and pressure simultaneously, each insulating sheet bonds the upper and lower elements and hardens. The insulating sheets are preferably made of adhesive sheets containing a thermosetting resin and a filler. The insulating sheets can also be made of prepreg containing glass fiber (glass cloth or glass nonwoven fabric). This improves the strength of the element, making it less susceptible to deformation due to processing loads, and also improves reliability due to temperature changes. In other words, using a prepreg material containing glass cloth for the insulating sheets is advantageous for withstanding the processing loads during the subsequent groove formation process and the molding loads during the sealing process. Furthermore, forming a top insulating sheet on the outermost layer can further increase strength. A prepreg material containing glass fiber may be used in combination with an insulating sheet that does not contain glass fiber, and thickness and strength can be optimized by using a prepreg containing glass fiber only for the top insulating sheet of the outermost layer.

[0122] (B) Groove formation process FIG. 20 is a diagram illustrating a method for manufacturing a solid electrolytic capacitor. In the groove formation step shown in FIG. 20, first, the laminate sheet 300 formed in the step shown in FIG. 19 is prepared. Next, the support substrate 7 of the laminate sheet 300 is placed on the bottom side, and grooves are formed in a top-to-bottom direction (the -Z-axis direction in FIG. 20). The overall planar shape of the grooves in the XY plane is a lattice (rectangular lattice), and includes multiple groove groups extending in the X-axis direction and multiple groove groups extending in the Y-axis direction. Each groove is formed so as to cut the first roughened layer 121 (first mask layer M1) and the second roughened layer 121B (second mask layer M1B) of each electrolytic capacitor sheet in the thickness direction (Z-axis) and reach the inside of the support substrate 7. Each groove does not completely cut the support substrate 7. These grooves are formed by pressing a rotary blade against the laminate sheet 300. The number of rotary blades used to form the grooves may be multiple or single. The width of one groove (rotary blade) is 0.1 mm to 0.7 mm, and preferably 0.3 mm to 0.5 mm.

[0123] The two grooves adjacent to each other along the X-axis direction and extending along the Y-axis direction are referred to as the first groove GR1 and the second groove GR2. In a later step, the laminated sheet 300 is cut with a rotary blade having a width wider than the width of the first groove GR1 to form a third groove GR3 (see FIG. 26), and is cut with a rotary blade having a width wider than the width of the second groove GR2 to form a fourth groove GR4 (see FIG. 26).

[0124] In the figure, the positive direction of the X axis is the right side, and the negative direction is the left side.

[0125] In the area including the first groove GR1, the cutting positions are set as follows, starting from the left: the left cutting position x2" of the third groove GR3 (third rotary blade), the left cutting position xc0' of the first groove GR1 (first rotary blade), the right cutting position xe0' of the first groove GR1 (first rotary blade), the right cutting position (first position x1) of the third groove GR3 (third rotary blade), and the position xd0 of the left edge of the mask (protective layer 15) located to the right of the first groove GR1.

[0126] In the region including the second groove GR2, the cutting positions are set as follows, starting from the left: the left cutting position (second position x2) of the fourth groove GR4 (fourth rotary blade), the left cutting position xc' of the second groove GR2 (second rotary blade), the right cutting position xe of the second groove GR2 (second rotary blade), the right cutting position x1' of the fourth groove GR4 (fourth rotary blade), and the position xd of the left edge of the mask (protective layer 15) located to the right of the second groove GR2.

[0127] The XY planar shape of the groove groups formed before the etching process of the anode electrode layer 8 made of aluminum does not have to be a rectangular lattice as described above. For example, these groove groups may consist of only a plurality of grooves extending along the Y-axis direction. In this case, after the next etching process is completed, a plurality of groups extending along the X-axis direction are formed. In this case, the inner side surfaces (XZ planes) of the grooves along the X-axis direction are flat, making it easier to fill the groove groups with insulating resin. Using this process offers greater design freedom than when etching the inner side surfaces (XZ planes) of grooves extending along the X-axis direction.

[0128] 21 is an enlarged view of the periphery of the lateral tip of the anode electrode layer for explaining the manufacturing method of the solid electrolytic capacitor. The first groove GR1 is shown, but the peripheral structure of the second groove GR2 is also the same structure.

[0129] The first grooves GR1 extend through the first protective layer 15, the first cathode electrode layer 14, the first mask layer M1, the first rough layer 121, the anode electrode layer 8, the second rough layer 121B, the second mask layer M1B, the second cathode electrode layer 14B, and the second protective layer 15B in the thickness direction. By forming the first grooves GR1, the side surfaces of the first rough layer 121 and the second rough layer 121B are exposed. These exposed surfaces are then etched. (C) Etching process FIG. 22 is a diagram illustrating a method for manufacturing a solid electrolytic capacitor. In the etching step shown in FIG. 22, an etching solution is introduced into the multiple grooves shown in FIG. 20 to etch the first roughened layer 121, the second roughened layer 121B, and the side surfaces of the anode electrode layer 8 exposed in the grooves. The etching solution may be introduced by spray coating, or by immersing the exposed surfaces in the grooves in the etching solution. The type of etching solution for the material of the anode electrode layer 8 (aluminum (Al) in this example) is an etching solution that can selectively etch the material but not the material of the cathode electrode layer 14 (copper (Cu) in this example). Such an etching solution may be an alkaline solution such as an aqueous sodium hydroxide solution or an acidic solution such as sulfuric acid. The etching solution may contain an appropriate additive, if necessary.

[0130] The first roughened layer 121 made of aluminum, the second roughened layer 121B made of aluminum, and both exposed side surfaces of the anode electrode layer 8 made of aluminum are etched, and by the etching, new first spaces SPA and second spaces SPC continuous with each groove are formed, and protrusions are formed on both side surfaces of the anode electrode layer 8. Focusing on one solid electrolytic capacitor, the first space SPA continuous with the first groove GR1 is formed on the left side, and the second space SPC continuous with the second groove GR2 is formed on the right side.

[0131] The etching solution dissolves the first roughened layer 121, the second roughened layer 121B, and the anode electrode layer 8, but if the etching time is extended, it also dissolves the aluminum contained in the first insulating region 10 and the second insulating region 10B. The first insulating region 10 and the second insulating region 10B contain aluminum that constitutes the roughened layer and an insulating resin such as epoxy resin that has permeated the roughened layer. Because the etching solution dissolves the aluminum contained in the roughened layer, the groove-side regions of the first insulating region 10 and the second insulating region 10B are either removed by the etching solution or only the insulating resin remains.

[0132] Although protrusions are formed not only at both ends of the anode electrode layer 8 in the X-axis direction but also at both ends in the Y-axis direction, protrusions in the Y-axis direction do not necessarily have to be formed. For example, if the step of forming grooves extending in the X-axis direction is set after this etching step, protrusions will not be formed at both ends in the Y-axis direction. Such modifications to the manufacturing process are also possible.

[0133] 23 is an enlarged view of the periphery of the lateral tip of the anode electrode layer to explain the manufacturing method of the solid electrolytic capacitor. As shown in the figure, the areas where the first and second roughened layers were formed have been completely removed, and a first space SPA and a second space SPC continuous with the second groove GR2 (first groove GR1) have been formed. When the first mask layer M1 and the second mask layer M1B are made of a soluble resist, they can be removed. When a soluble mask layer is used and the mask layer is dissolved in the etching process, the mask layer disappears, resulting in a configuration in which the cathode electrode layer 14 and the insulating portion 162 (see FIG. 25) come into direct contact with each other.

[0134] (D) Filling process FIG. 24 is a diagram illustrating a method for manufacturing a solid electrolytic capacitor. In the filling step shown in FIG. 24, insulating resin (protective insulator 16, right-side insulating portion 162, left-side insulating portion 162A) is filled into the grooves and spaces connected to each groove formed in the laminate sheet 300. This insulating resin preferably contains a filler. In the filling step, insulating resin is supplied to the upper surface of the laminate sheet 300, and pressure is applied in the Z-axis direction to fill the insulating resin into the grooves and spaces. The supplied insulating resin may be in the form of a liquid or a solid sheet. Examples of filling methods that can be used include compression molding, transfer molding, and injection molding using a liquid insulating resin. Another filling method that can be used is to attach a sheet-shaped resin sealing material to the surface of the laminate sheet 300 and flatten and press the resin sealing material.

[0135] The insulating resin is a molding resin that covers most of the element after the solid electrolytic capacitor is completed. The insulating material that constitutes the insulating resin (protective insulator 16) is as described above, and a suitable example is an epoxy resin containing a filler. In the filling step, focusing on one solid electrolytic capacitor, the left insulating portion 162A is filled into the first space SPA formed in FIG. 22, and the right insulating portion 162 is filled into the second space SPC.

[0136] 25 is an enlarged view of the periphery of the lateral tip portion of the anode electrode layer for illustrating a method for manufacturing a solid electrolytic capacitor. As shown in the figure, resin is filled into the second groove GR2 (first groove GR1) and the first space SPA and second space SPC, forming the insulating portion 162 (insulating portion 162A). Note that, to reduce the possibility of voids occurring, a low-viscosity resin that does not contain filler may be injected into the groove before resin sealing to first fill the periphery of the resin roughened portion with resin (see FIGS. 5 to 11).

[0137] (E) Cutting process Fig. 26 is a diagram illustrating a method for manufacturing a solid electrolytic capacitor. In the cutting step shown in Fig. 26, a plurality of grooves whose depth direction is in the positive direction of the Z axis are formed in the laminated sheet 300. Note that the laminated sheet 300 can be turned over to easily form these grooves.

[0138] The overall shape of the grooves in the XY plane is stripe-shaped, with multiple groove groups extending in the Y-axis direction. Each groove is formed to cut the first insulating region 10 and the second insulating region 10B of each electrolytic capacitor sheet in the thickness direction (Z-axis) and reach the inside of the protective insulator 16, which functions as a lid. Each groove does not completely cut through the protective insulator 16. These grooves are formed by pressing a rotary blade against the laminated sheet 300. The number of rotary blades used to form the grooves may be multiple or single.

[0139] The two grooves adjacent to each other along the X-axis and extending along the Y-axis are designated as the third groove GR3 and the fourth groove GR4. The positional relationship between these grooves is as described above. By forming the third groove GR3, a portion of the left side of the anode terminal 1 is removed. By forming the fourth groove GR4, a portion of the right side of the cathode terminal 2 is removed.

[0140] Focusing on one solid electrolytic capacitor, a laminate functioning as an individual element is configured between a first position x1 on the right side of the third groove GR3 and a second position x2 on the left side of the fourth groove GR4. By forming the third groove GR3, the left side surface of the anode electrode layer 8 is exposed at the first position x1. By forming the fourth groove GR4, the right side surfaces of the first cathode electrode layer 14 and the second cathode electrode layer 14B are exposed at the second position x2. That is, in the cutting process, the laminate sheet 300 is cut at the first position x1 to expose the anode electrode layer 8, and at the second position x2 to expose the insulating portion 162 and the cathode electrode layers (the first cathode electrode layer 14 and the second cathode electrode layer 14B).

[0141] FIG. 27 is an enlarged view of the periphery of the lateral tip of the anode electrode layer to illustrate a manufacturing method of a solid electrolytic capacitor. As shown in the figure, the fourth groove GR4 extends through the first protective layer 15, the first cathode electrode layer 14, the first mask layer M1, the insulating portion 162, the first insulating region 10, the anode electrode layer 8, the second insulating region 10B, the second mask layer M1B, the second cathode electrode layer 14B, and the second protective layer 15B in the thickness direction. By forming the fourth groove GR4, the side surfaces of the first cathode electrode layer 14 and the second cathode electrode layer 14B are exposed on the left side surface of the groove in the figure. The side surface of the anode electrode layer 8 is exposed on the right side surface of the groove in the figure. Note that the structures shown in FIGS. 5 to 11 can also be manufactured by changing the amount of resin filled and the cutting positions of the third and fourth grooves. The cutting position at the right end of the third groove GR3 may be moved to the position of the gap in the first protective layer 15 (the first opening H1 in FIG. 17).

[0142] (F) Side electrode formation process FIG. 28 is a diagram illustrating a method for manufacturing a solid electrolytic capacitor. In the side electrode forming step shown in FIG. 28, a side electrode E is formed on the inner surface of the groove formed in the step of FIG. 26. In the subsequent dicing step, the right side portion of the side electrode E in one groove becomes a first side electrode E1, and the left side portion becomes a second side electrode E2. More specifically, in the side electrode forming step, the first side electrode E1 is formed on the first side surface S1 (see FIG. 2) exposed by cutting at the first position x1 (see FIG. 26), and the second side electrode E2 is formed on the second side surface S2 (see FIG. 2) exposed by cutting at the second position x2 (see FIG. 26). The side electrode E is formed by forming a plating layer on the base layer after forming an underlayer.

[0143] The underlayer is made of a metal material that has high adhesion to resins and metals. The underlayer (seed layer) can be made of metals such as Cu, Cr, Ni, Ti, or Zn, conductive materials containing C such as conductive carbon, or alloys containing at least one of these materials. The seed layer can be formed by common methods such as sputtering, electroless plating, or coating. The underlayer can be made of any material that has high adhesion to the layer directly below it and on which a plating layer can grow. A plating layer is formed on the underlayer. The plating layer may be a single layer or may be composed of multiple laminated metal layers. In this example, the plating layer is made of copper (Cu). The plating layer is formed by electrolytic plating on the entire surface on which the underlayer is formed. The plating layer can also be made of two or more layers. For example, the first plating layer can be a Cu layer and the second plating layer can be a Ni layer. For example, the first plating layer can be a Cu layer, the second plating layer can be a Ni layer, and the third plating layer can be a Sn layer. For example, the first plating layer may be a Cu layer and the second plating layer may be a Sn layer, or an Au layer may be used instead of the Sn layer.

[0144] (G) Dicing process (individualization process) In the dicing step shown in FIG. 28, the laminate sheet on which the side electrodes have been formed is diced. A rotary blade or the like can be used for dicing, and third openings H3 for element separation are formed. The dicing lines are set in a grid pattern (rectangular grid) and are composed of multiple groups of cutting lines extending in the X-axis direction and multiple groups of cutting lines extending in the Y-axis direction. The multiple groups of cutting lines extending in the X-axis direction pass directly above the insulating resin embedded in the grooves extending in the X-axis direction in the step of FIG. 24. The group of cutting lines extending in the Y-axis direction passes through the deepest part of the side electrodes E. As described above, this manufacturing method includes a singulation step in which the laminate sheet is divided by dicing or the like to form individual solid electrolytic capacitors.

[0145] 29 (FIGS. 29(A) and 29(B)) are longitudinal cross-sectional views of a solid electrolytic capacitor. FIG. 29(A) is a longitudinal cross-sectional view of a solid electrolytic capacitor manufactured by the above-described manufacturing method. The area surrounded by dotted line C in FIG. 28 constitutes one solid electrolytic capacitor. The first solid electrolytic capacitor sheet CES1, the second solid electrolytic capacitor sheet CES2, the third solid electrolytic capacitor sheet CES3, and the fourth solid electrolytic capacitor sheet CES4 shown in FIG. 28 constitute the first solid electrolytic capacitor element CE1, the second solid electrolytic capacitor element CE2, the third solid electrolytic capacitor element CE3, and the fourth solid electrolytic capacitor element CE4, respectively. This solid electrolytic capacitor is the same as the solid electrolytic capacitor shown in FIG. 2, except that the number of solid electrolytic capacitor elements is four.

[0146] Figure 29(B) is a longitudinal cross-sectional view of a solid electrolytic capacitor manufactured using a manufacturing method in which the width of the rotary dicing blade is widened. The area surrounded by dotted line J in Figure 28 is one solid electrolytic capacitor. This solid electrolytic capacitor does not have a bent portion on the side electrode. If a bent portion is provided, it has the effect of increasing the fillet strength as described above. If a bent portion is not provided, the element will be smaller.

[0147] As described above, the method for manufacturing a solid electrolytic capacitor includes (A) a laminated sheet forming process, (B) a groove forming process, (C) an etching process, (D) a filling process, (E) a cutting process, (F) a side electrode forming process, and (G) a dicing process. In the laminate sheet forming step (A), a plurality of solid electrolytic capacitor sheets CES each including an anode electrode layer 8 and a cathode electrode layer 14 were prepared, and a laminate sheet 300 was formed by laminating the plurality of solid electrolytic capacitor sheets. In the groove forming step (B), the first grooves GR1 and the second grooves GR2 were formed in the laminated sheet 300. In the etching step (C), the side surfaces of the first rough layer 121, the second rough layer 121B, and the anode electrode layer 8 exposed in the first grooves GR1 and the second grooves GR2 were etched. In the filling step (D), the insulating portion 162 was formed by filling the space formed by the etching in the step (C) with an insulating resin. (E) In the cutting process, the laminated sheet 300 was cut at a first position x1 to expose the anode electrode layer 8, and at a second position x2 to expose the insulating portion 162 and the cathode electrode layer (first cathode electrode layer 14, second cathode electrode layer 14B). (F) In the side electrode forming process, a first side electrode E1 was formed on the first side surface S1 exposed by cutting at the first position x1, and a second side electrode E2 was formed on the second side surface S2 exposed by cutting at the second position x2. In the (G) dicing step, the laminate sheet 300 was diced to separate it into a plurality of solid electrolytic capacitors. The dicing step is generally performed when using a laminate sheet having a plurality of solid electrolytic capacitors arranged two-dimensionally. Also, a group of a plurality of solid electrolytic capacitors has already been manufactured before the dicing step. If the dicing step at this stage is omitted, for example, in the above-mentioned (E) cutting step, the laminate sheet 300 may be adhered to another adhesive sheet and the laminate sheet itself may be completely cut in advance. In this case, the cutting step also serves as the dicing step.

[0148] The method for manufacturing the above-mentioned solid electrolytic capacitor includes a laminate sheet forming process in which a plurality of solid electrolytic capacitor sheets, each including an anode electrode layer and a cathode electrode layer, are prepared and the plurality of solid electrolytic capacitor sheets are stacked to form a laminate sheet, and a dicing process in which the laminate sheet is diced.

[0149] In this manufacturing method, a plurality of solid electrolytic capacitor sheets each including an anode electrode layer and a cathode electrode layer are prepared in advance, stacked, and then diced to produce individual solid electrolytic capacitors. This manufacturing method allows for cutting out a large number of solid electrolytic capacitors after stacking them all at once, thereby improving productivity.

[0150] The method for manufacturing the solid electrolytic capacitor described above includes a groove forming step of forming grooves in the laminate sheet 300, an anode side etching step of etching the side surfaces of the anode electrode layers 8 exposed in the grooves, and a filling step of filling the spaces formed by etching the anode electrode layers 8 with insulating resin to form insulating portions 162. The filled insulating resin insulates the side surfaces of the anode electrode layers. The method for manufacturing the solid electrolytic capacitor described above further includes a cutting step of cutting the laminate sheet at a first position x1 to expose the anode electrode layers 8 and at a second position x2 to expose the insulating portions and the cathode electrode layers 14, and a side electrode forming step of forming a first side electrode E1 on the first side surface exposed by cutting at the first position x1 and a second side electrode E2 on the second side surface exposed by cutting at the second position x2.

[0151] In this manufacturing method, the first side electrode E1 connected to the anode electrode layer 8 and the second side electrode E2 connected to the cathode electrode layer 14 can be easily formed, thereby improving productivity.

[0152] In the above-described method for manufacturing a solid electrolytic capacitor, the groove forming step forms first grooves GR1 and second grooves GR2 in the laminate sheet 300 as the grooves, and the anode side etching step etches the side surfaces of the anode electrode layer 8 exposed in the first grooves GR1 and second grooves GR2.

[0153] By forming the first groove GR1 and the second groove GR2, it is possible to form an independent solid electrolyte capacitor element between these grooves. Note that even when there is only one groove, it is possible to cut the laminated sheet at a position on the opposite side from the groove formation side in a separate process, but forming the first groove GR1 and the second groove GR2 allows for more efficient production.

[0154] In the above-described method for manufacturing a solid electrolytic capacitor, the method for manufacturing a solid electrolytic capacitor sheet used in the laminate sheet formation step includes the steps of forming insulating regions 10 having a grid pattern in a planar view on anode electrode layer 8, forming solid electrolyte layers 12 within openings of the grid pattern, and forming cathode electrode layers 14 electrically connected to solid electrolyte layer 12 and divided into multiple regions in a planar view. The divided cathode electrode layer formation step can include the steps of forming cathode electrode layers 14 electrically connected to solid electrolyte layer 12 and dividing cathode electrode layer 14 into multiple regions in a planar view. The divided cathode electrode layers can also be formed in advance by a printing method using a conductive resin or the like.

[0155] Dividing the cathode electrode layer 14 into multiple regions in advance facilitates electrical separation (insulation) of the anode and cathode after lamination, facilitating division of the laminated sheet. Dicing the laminated sheet 300 is also facilitated in the subsequent dicing process. Furthermore, when cutting the multiple regions of the cathode electrode layer 14 in the cutting process, the regions are spaced apart from the cut surface, making it easy to form a structure in which the first side electrode E1 is not connected to the cathode electrode layer 14. As described above, since the side electrode is formed along the Y-axis direction, multiple grooves (e.g., first groove GR1, second groove GR2) along the Y-axis direction in plan view are formed before the etching process. Meanwhile, multiple grooves (grooves for filling insulating resin) along the X-axis direction in plan view can also be formed after the etching process.

[0156] In the above-described method for manufacturing a solid electrolytic capacitor, the method for manufacturing a solid electrolytic capacitor sheet used in the laminated sheet formation process includes a step of preparing a metal sheet 80 having a roughened layer on an anode electrode layer 8, and the insulating region 10 is formed by supplying an insulating resin into the roughened layer.

[0157] By supplying the insulating resin to the roughened layer, an insulating region can be easily formed. Note that, since the metal components contained in the roughened layer can be dissolved out of a part of the insulating region by the etching process, the insulating resin can be filled in the filling process. The resin-filled insulating portion is completely separated from the anode portion, thereby improving the insulating performance.

[0158] In the above-described method for manufacturing a solid electrolytic capacitor, in the dicing step, the laminate sheet 300 is diced along the gaps between the multiple regions of the cathode electrode layer 14. By dicing, individual solid electrolytic capacitors can be easily produced.

[0159] FIG. 30 is a perspective view of a solid electrolytic capacitor.

[0160] The solid electrolytic capacitor includes a laminate 100 formed by stacking a plurality of solid electrolytic capacitor elements, a first side electrode E1 and a second side electrode E2 provided at both ends of the laminate 100 in the X-axis direction, and an anode terminal 1 and a cathode terminal 2 provided on the underside of a support substrate 7. A protective insulator 16 located at least above the solid electrolytic capacitor is a molded resin made of an insulating resin. This molded resin covers both ends of the laminate 100 in the Y-axis direction.

[0161] FIG. 31 is a diagram showing a solid electrolytic capacitor mounted on a substrate.

[0162] A first land electrode 103 and a second land electrode 104 are formed on a wiring substrate 105 made of an insulator. The first land electrode 103 is electrically connected to the anode terminal 1 and the first side electrode E1 via a first fillet 101 made of a solder material. The second land electrode 104 is electrically connected to the cathode terminal 2 and the second side electrode E2 via a second fillet 102 made of a solder material.

[0163] The anode terminal 1 and the cathode terminal 2 are made of copper (Cu), but may contain a material (Sn) contained in solder on their surfaces. The first side electrode E1 and the second side electrode E2 are made of copper (Cu), but may contain a material (Sn) contained in solder on their surfaces.

[0164] A first fillet 101 is in contact with the side surface (YZ plane) of the first side electrode E1 and the lower surface (XY plane) of the first bent portion E1B. A second fillet 102 is in contact with the side surface (YZ plane) of the second side electrode E2 and the lower surface (XY plane) of the second bent portion E2B. The presence of the first bent portion E1B and the second bent portion E2B increases the dimension of the fillet in the X-axis direction, thereby increasing its mechanical strength.

[0165] FIG. 32 is a diagram showing an example of a manufacturing apparatus for a solid electrolytic capacitor.

[0166] The steps (a) to (g) of manufacturing the above-described solid electrolytic capacitor sheet CES can utilize a roll 201 around which an initial metal sheet 80 is wound. The metal sheet 80 extending from the roll 201 is transported into the processing device 200 by a transport device 202. The processing device 200 continuously performs the above-described steps (a) to (g). After step (g) is completed, the metal sheet 80 is cut at regular intervals by a cutting device 203 to separate into individual solid electrolytic capacitor sheets CES. The solid electrolytic capacitor sheets CES are then sequentially stacked on the support substrate 7 as described in step (A), and subsequent processing is performed. In this manufacturing method, continuous processing using the roll 201 can increase production efficiency. Note that it is not necessary to perform all processing steps using the processing device 200. After some steps are performed using the processing device 200, the metal sheet can be wound onto another roll, and then another step can be performed using that roll. It is also possible to carry out the above-described manufacturing method using a sheet cut to a convenient size, rather than using a roll.

[0167] FIG. 33 is a vertical cross-sectional view of the vicinity of the region including the anode terminal and the cathode terminal.

[0168] The anode terminal 1 and the cathode terminal 2 can each have a structure in which multiple electrode layers are stacked. The first side electrode E1 is in contact with the side surface (YZ surface) of the anode terminal 1. The second side electrode E2 is in contact with the side surface (YZ surface) of the cathode terminal 2. There are various combinations of materials that can be used to configure these electrode stacked structures.

[0169] The anode terminal 1 includes a first anode electrode layer 1A, a second anode electrode layer 1B, and a third anode electrode layer 1C. The material of the seed layer constituting the anode terminal 1 may be the same as the material of the seed layer constituting the first side electrode E1. The material of the first anode electrode layer 1A constituting the anode terminal 1 may be the same as the material of the first electrode layer E11 constituting the first side electrode E1. The material of the second anode electrode layer 1B constituting the anode terminal 1 may be the same as the material of the second electrode layer E12 constituting the first side electrode E1. The material of the third anode electrode layer 1C constituting the anode terminal 1 may be the same as the material of the third electrode layer E13 constituting the first side electrode E1. These electrode materials may also be different.

[0170] The cathode terminal 2 includes a first cathode electrode layer 2A, a second cathode electrode layer 2B, and a third cathode electrode layer 3C. The material of the seed layer constituting the cathode terminal 2 may be the same as the material of the seed layer constituting the second side electrode E2. The material of the first cathode electrode layer 2A constituting the cathode terminal 2 may be the same as the material of the first electrode layer E21 constituting the second side electrode E2. The material of the second cathode electrode layer 2B constituting the cathode terminal 2 may be the same as the material of the second electrode layer E22 constituting the second side electrode E2. The material of the third cathode electrode layer 2C constituting the cathode terminal 2 may be the same as the material of the third electrode layer E23 constituting the second side electrode E2. These electrode materials may also be different.

[0171] In the above example, the anode terminal 1 and the cathode terminal 2 are manufactured in different periods from the first side electrode E1 and the second side electrode E2. When the first side electrode E1 and the second side electrode E2 are manufactured after the anode terminal 1 and the cathode terminal 2 are formed, the seed layer below the first electrode layer E11 in the first side electrode E1 contacts the side surface (YZ surface) of the anode terminal 1. Similarly, the seed layer of the first electrode layer E21 in the second side electrode E2 contacts the side surface (YZ surface) of the cathode terminal 2. These bottommost electrode layers are made of a material with high adhesiveness, so these terminals and electrode layers adhere well.

[0172] FIG. 34 is a vertical cross-sectional view of the vicinity of the region including the anode terminal and the cathode terminal.

[0173] This example discloses an electrode laminate structure manufactured by simultaneously forming an anode terminal 1 and a cathode terminal 2, along with a first side electrode E1 and a second side electrode E2. In this case, layers having the same material composition are continuous at both ends of the solid electrolytic capacitor in the X-axis direction.

[0174] That is, the first anode electrode layer 1A of the anode terminal 1 and the first electrode layer E11 of the first side electrode E1 are continuous. Similarly, the second anode electrode layer 1B and the second electrode layer E12 are continuous. The third anode electrode layer 1C and the third electrode layer E13 are continuous. The seed layer of the anode terminal 1 and the seed layer of the first side electrode E1 are also continuous.

[0175] Similarly, the first cathode electrode layer 2A of the cathode terminal 2 is continuous with the first electrode layer E21 of the second side electrode E2. The second cathode electrode layer 2B is continuous with the second electrode layer E22. The third cathode electrode layer 2C is continuous with the third electrode layer E23. The seed layer of the cathode terminal 2 is also continuous with the seed layer of the second side electrode E2.

[0176] The materials for these electrode layers are as described above.

[0177] Fig. 35 is a diagram for explaining the manufacturing process of the structure shown in Fig. 34. In this figure, a vertical cross-sectional view of the vicinity of the region including the anode terminal and the cathode terminal is shown.

[0178] In this manufacturing method, the anode terminal 1 and the cathode terminal 2 are not formed in any process steps prior to the groove formation process (FIG. 20). In the subsequent side electrode formation process (FIG. 28), a mask MK is formed before the side electrodes are formed. The mask MK is formed on the surface of the support substrate 7. The mask MK is made of an insulating material, such as a resist resin material or an inorganic insulating material. The mask MK is formed in the region between the regions where the anode terminal 1 and the cathode terminal 2 are to be formed. The planar pattern (pattern on the XY plane) of the mask MK may be a stripe shape along the Y axis. After the mask MK is formed, the first side electrode E1, the second side electrode E2, the anode terminal 1, and the cathode terminal 2 are simultaneously formed. That is, the respective electrode layers constituting these are stacked in order. After the electrode stack structure is formed, the mask MK can be removed, but it may also be left in place.

[0179] The first side electrode E1 and the second side electrode E2 may be formed by applying a conductive adhesive (e.g., silver paste) to the exposed side surfaces. The first side electrode E1 and the second side electrode E2 are electrically and physically connected to the anode terminal 1 and the cathode terminal 2, respectively. This manufacturing method allows the side electrodes to be formed in a simple manner. The cathode electrode layer 14 may be formed by a sputtering method, a plating method, or a screen printing method.

[0180] The following structure can also be adopted as the peripheral structure of the side end portion of the anode electrode layer described above.

[0181] FIG. 36 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer.

[0182] The peripheral structure of this example differs from the structure shown in Fig. 4 in that the insulating portion 162 and the cathode electrode layer 14 (second cathode electrode layer 14B) are in contact with each other, but is otherwise the same as the structure shown in Fig. 4. That is, in this example, the region of the first mask layer M1 (and the second mask layer M1B) close to the second side electrode E2 is completely removed by etching. The mask layer is made of an etchable material.

[0183] A portion of the first mask layer M1 (and second mask layer M1B) in a region far from the second side electrode E2 remains without being etched. That is, the first mask layer M1 (protective layer) is interposed between the first insulating region 10 and the first insulating layer 11. The second mask layer M1B (protective layer) is interposed between the second insulating region 10B and the second insulating layer 11B.

[0184] By also removing the first mask layer M1 during the etching step (FIG. 22), the space for resin filling in the subsequent step (FIG. 24) can be made larger, facilitating resin filling.

[0185] FIG. 37 is a diagram showing an example of the peripheral structure of the side end portion of the anode electrode layer.

[0186] The peripheral structure of this example differs from the structure shown in FIG. 10 in that the insulating portion 162 and the cathode electrode layer 14 (second cathode electrode layer 14B) are in contact with each other, but is otherwise identical to the structure shown in FIG. 10. In this example, the first mask layer M1 (and the second mask layer M1B) are completely removed by etching. The mask layers are made of an etchable material. Therefore, the insulating portion 162 extends to the region between the first insulating region 10 and the first insulating layer 11. The insulating portion 162 extends to the region between the second insulating region 10B and the second insulating layer 11B.

[0187] By completely removing the first mask layer M1 during the etching step (FIG. 22), the space for resin filling in the subsequent step (FIG. 24) can be made even larger, facilitating resin filling.

[0188] FIG. 38 is a diagram showing an example of the peripheral structure of the side tip portion of the anode electrode layer.

[0189] The peripheral structure of this example differs from the structure shown in FIG. 11 in that the insulating portion 162 and the cathode electrode layer 14 (second cathode electrode layer 14B) are in contact with each other, but is otherwise identical to the structure shown in FIG. 11. In this example, the first mask layer M1 (and second mask layer M1B) are completely removed by etching. The mask layers are made of an etchable material. Therefore, the insulating portion 162 extends to the region between the first insulating region 10 and the first insulating layer 11. The insulating portion 162 extends to the region between the second insulating region 10B and the second insulating layer 11B.

[0190] By completely removing the first mask layer M1 during the etching step (FIG. 22), the space for resin filling in the subsequent step (FIG. 24) can be made even larger, facilitating resin filling.

[0191] 39 (FIG. 39(A), FIG. 39(B), FIG. 39(C), and FIG. 39(D)) are diagrams showing vertical cross-sectional structures in the vicinity of the mask layer.

[0192] The raw material of the first insulating layer 11 and the raw material of the first mask layer M1 may be made of the same material. Figure 39(A) is a cross-sectional view of Figures 4, 5, 7, 8, 10, and 11 when the raw material of the first insulating layer 11 and the raw material of the first mask layer M1 are made of the same material. In this case, the first insulating layer 11 and the first mask layer M1 are integrated to the extent that they are indistinguishable visually. The raw material of the first insulating layer 11 and the first mask layer M1 may be made of similar materials to the extent that they are indistinguishable visually after manufacturing. Note that when the first mask layer M1 is present (Figures 4, 5, 7, 8, 10, and 11), the cathode electrode layer 14 and the insulating region 10 are not in contact with each other. Furthermore, when the raw material of the second insulating layer 11B and the raw material of the second mask layer M1B are made of the same material or similar materials, they are similarly integrated and become indistinguishable visually, as shown in the figure.

[0193] FIG. 39(B) shows an example in which the material for the first insulating layer 11 and the material for the first mask layer M1 are the same and have approximately the same thickness. Note that during manufacturing, the viscosity of the material for the first insulating layer 11 is lower than the viscosity of the material for the first mask layer M1. In this case, the first insulating layer 11 and the first mask layer M1 are integrated to the extent that they are indistinguishable visually. If the material for the second insulating layer 11B and the material for the second mask layer M1B are made of the same or similar materials, they will similarly be integrated and will be indistinguishable visually, as shown in the same figure.

[0194] 39(C) shows an example in which a first mask layer M1 is formed after the formation of the first insulating layer 11. In this case, a part of the first mask layer M1 is formed on the first insulating layer 11.

[0195] FIG. 39(D) shows an example in which a first mask layer M1 is formed after the formation of the first insulating layer 11, and then the first mask layer M1 is dissolved by the etching material. In this case, the insulating portion 162 also fills the area from which the first mask layer M1 has been removed. The boundary position α between the insulating region 10 and the insulating portion 162 moves in a direction away from the second electrode (toward the left in the drawing) as the etching time increases. The boundary position α can be moved to the position shown in FIGS. 5, 7, 8, 10, and 11.

[0196] FIG. 40 is a diagram showing an example of the peripheral structure of the side tip portion of the anode electrode layer.

[0197] This figure shows a longitudinal cross-sectional structure when the structure of FIG. 39(B) is adopted for the structure of FIG. 4. The first insulating layer 11 and the first mask layer M1 are integrated to the extent that they are indistinguishable from each other with the naked eye. The second insulating layer 11B and the second mask layer M1B are also integrated to the extent that they are indistinguishable from each other with the naked eye. The structure of FIG. 39(B) can also be applied to FIGS. 5, 7, 8, 10, and 11. The structure of FIG. 39(C) can also be applied to FIGS. 4, 5, 7, 8, 10, and 11. The structure of FIG. 39(D) can also be applied to FIGS. 36, 37, and 38. When the mask layer melts, the insulating portion 162 and the cathode electrode layer 14 come into contact with each other. The structures of the second insulating layer 11B and the second mask layer M1B are the same as those of the first insulating layer 11 and the first mask layer M1, and the modified structures in this case can be applied to the various structures described above.

[0198] As described above, various embodiments of the present disclosure have the following aspects.

[0199] The solid electrolytic capacitor of the first embodiment includes a laminate including a plurality of stacked solid electrolytic capacitor elements, a first side electrode E1 provided on a first side surface of the laminate, and a second side electrode E2 provided on a second side surface of the laminate, and each solid electrolytic capacitor element includes an anode electrode layer 8 electrically connected to the first side electrode E1, a dielectric layer 9 provided on the anode electrode layer 8, a cathode electrode layer 14 electrically connected to the second side electrode E2, a solid electrolyte layer 12 interposed between the dielectric layer 9 and the cathode electrode layer 14, an insulating region 10 provided on the anode electrode layer 8 and adjacent to a side surface of the solid electrolyte layer 12, an insulating portion 162 interposed between the side surface of the insulating region 10 and the second side electrode E2 and containing an insulating resin, and a first insulating layer 11 interposed between the insulating region 10 and the cathode electrode layer 14 and containing the same resin as the resin contained in the insulating region 10.

[0200] The solid electrolytic capacitor of the present disclosure may include a protective layer (mask layer M1) interposed between the insulating portion 162 and the cathode electrode layer 14. This protective layer can function as a mask layer during manufacturing. The mask layer M1 can also be etched during manufacturing.

[0201] This solid electrolytic capacitor reduces stress generated around the side surface of the anode electrode layer. Specifically, by using a mask layer, the material (roughened layer) on the inner surface can be easily removed. A roughened layer is easier to etch than a roughened layer containing a resin. A roughened layer is provided under the protective layer serving as the mask layer, and since this roughened layer is etched, insulating resin can be easily supplied into the space formed by etching to form an insulating portion. Specifically, the filling rate of the insulating portion provided in the space formed by removal can be easily improved. The insulating portion is adjacent to the anode electrode layer. Improving the filling rate of the insulating portion reduces the rate of stress generation due to internal voids, etc., and improves the reliability of the device. Furthermore, the increased flexibility in forming the insulating portion allows the structure of the insulating portion to be modified to reduce stress, thereby improving the reliability of the device.

[0202] The solid electrolytic capacitor of the second embodiment includes a protective layer (mask layer M1) interposed between the insulating portion 162 and the cathode electrode layer .

[0203] A third aspect of the solid electrolytic capacitor is the solid electrolytic capacitor of any one of the above aspects, wherein the protective layer (mask layer M1) contains a resin and a filler and has a higher filler content than the first insulating layer 11. Before solidification, the mask layer has a higher viscosity than the first insulating layer, and is less likely to be absorbed by the roughened layer located below the mask layer M1 during manufacturing. Therefore, the solid electrolytic capacitor has a structure that allows for easy removal of the roughened layer.

[0204] The solid electrolytic capacitor of a fourth aspect is the solid electrolytic capacitor of any one of the above aspects, in which the insulating region (10) contains the metal contained in the anode electrode layer 8 and the resin contained in the first insulating layer 11.

[0205] Insulating region 10 is formed by supplying resin to a roughened layer formed by roughening a metal sheet including anode electrode layer 8, and the resin remaining thereon forms first insulating layer 11. Therefore, insulating region 10 includes the metal contained in anode electrode layer 8 and the resin contained in first insulating layer 11. An example of the metal is aluminum, and the example of the resin is epoxy resin.

[0206] A solid electrolytic capacitor according to a fifth aspect is the solid electrolytic capacitor according to any one of the above aspects, wherein the insulating portion 162 contains a resin and a filler.

[0207] The constituent material of the insulating portion 162 is different as a whole from that of the insulating region 10. When the insulating portion 162 contains a filler, the hardness and mechanical strength thereof can be increased.

[0208] The solid electrolytic capacitor of the sixth aspect is the solid electrolytic capacitor of any one of the above aspects, in which the insulating portion 162 and the cathode electrode layer 14 are in contact with each other.

[0209] The solid electrolytic capacitor of a seventh aspect is the solid electrolytic capacitor of any one of the above aspects, in which a protective layer (mask layer M1) is interposed between the insulating region 10 and the first insulating layer 11.

[0210] The solid electrolytic capacitor of an eighth aspect is the solid electrolytic capacitor of any one of the above aspects, wherein the insulating region (10) includes a first region (101) containing the metal contained in the anode electrode layer (8) and the resin contained in the first insulating layer (11), and the insulating portion (162) is adjacent to the first region (101) and includes a resin-filled region (162) containing the resin contained in the first insulating layer (11). X , 102) and a resin-filled region 162 X and a first insulating portion 1621 adjacent to the first insulating portion 1621 and containing a resin and a filler.

[0211] The solid electrolytic capacitor of a ninth aspect is the solid electrolytic capacitor of any one of the above aspects, wherein the insulating region (10) includes a first region (101) containing the metal contained in the anode electrode layer (8) and the resin contained in the first insulating layer (11), and the insulating portion (162) is adjacent to the first region (101) and includes a resin-filled region (162) containing the resin contained in the first insulating layer (11). X , 102) and a resin-filled region 162 X a first insulating portion 1621 containing a resin and adjacent to the second side electrode E2; and a second insulating portion 1622 containing a filler and a resin and interposed between the first insulating portion 1621 and the second side electrode E2. The resin contained in the first insulating portion is a resin filled region 162. X The second insulating portion 1622 has a higher filler content than the first insulating portion 1621.

[0212] The solid electrolytic capacitor of a tenth aspect is the solid electrolytic capacitor of any one of the above aspects, wherein the resin filling region 162 X includes the resin contained in the first insulating layer 11 and the resin contained in the first insulating portion 1621.

[0213] As described above, the insulating portion (162) can also extend to the region between the insulating region (10) and the first insulating layer (11).

[0214] The solid electrolytic capacitor is a solid electrolytic capacitor according to any one of the above-described embodiments, wherein the insulating region (10) includes a first region (101) containing the metal contained in the anode electrode layer (8) and the resin (RSN) contained in the first insulating layer (11), and a resin filling region (162) containing the resin contained in the first insulating layer (11) and including minute spaces (MS) dispersed in the resin. X And, it is equipped with.

[0215] Resin filling area 162 X Since the resin-filled region 162 contains minute spaces MS, it is softer than the first region 101 containing metal. X When the anode electrode layer 8 is located in the vicinity of the electrode layer 8, the stress applied to the anode electrode layer 8 can be reduced.

[0216] The solid electrolytic capacitor is a solid electrolytic capacitor of any one of the above-described embodiments, wherein the insulating portion 162 comprises a first insulating portion 1621 adjacent to the resin filling region 102 and a second insulating portion 1622 interposed between the first insulating portion and the second side electrode, the resin RSN contained in the first insulating portion 1621 is also contained in the microspace, and the second insulating portion 1622 has a higher filler content than the first insulating portion 1621.

[0217] Since second insulating portion 1622 is located farther from anode electrode layer 8 than first insulating portion 1621, increasing the filler content and increasing hardness can increase mechanical strength. On the other hand, first insulating portion 1621 has a relatively low filler content (including cases where no filler is included), so when it is formed, the resin that is its constituent material is also contained within minute space MS. When resin is filled into minute space MS and the amount of air inside is reduced, it is also possible to reduce stress changes due to temperature changes.

[0218] The solid electrolytic capacitor is any one of the above-described solid electrolytic capacitors, wherein the insulating portion 162 is a resin filling region 162 X The resin contained in the first insulating portion 1621 is also contained in the minute space MS.

[0219] The solid electrolytic capacitor of an eleventh embodiment is the solid electrolytic capacitor of any one of the above-described embodiments, in which the position of the side surface of the anode electrode layer 8 (the tip of the protruding portion 8p) is closer to the second side surface electrode E2 than the insulating region 10 is.

[0220] A method for manufacturing the above-described solid electrolytic capacitor includes the steps of: preparing a metal sheet 80 having an anode electrode layer 8 and a roughened layer 121 provided on the anode electrode layer 8 and including a dielectric layer; forming a protective layer (mask layer M1) on the metal sheet 80; after forming the protective layer (mask layer M1) or before forming the protective layer (mask layer M1), supplying a resin to the protective layer (mask layer M1) on the anode electrode layer 8 or to an area adjacent to the area where the protective layer (mask layer M1) is to be formed, causing the resin to be absorbed into the roughened layer 121 to form insulating area 10 and allowing the resin to remain on the insulating area 10 to form first insulating layer 11; supplying a conductive polymer to the roughened layer 121 to form solid electrolyte layer 12; forming a cathode electrode layer 14 on the solid electrolyte layer 12; forming a first groove GR1 in the laminate at a position passing through the protective layer (mask layer M1) to expose a side surface of the roughened layer 121 located directly below the protective layer (mask layer M1); etching the exposed side surface of the roughened layer 121; supplying an insulating resin into a space formed by the etching to form an insulating portion 162 at a position adjacent to the insulating region 10; forming a second groove in the laminate so that a side surface of the anode electrode layer 8 and a side surface of the cathode electrode layer 14 are exposed;

[0221] When forming the first insulating layer 11 before forming the protective layer (mask layer M1), resin is first supplied to an area adjacent to the area where the protective layer (mask layer M1) is to be formed. The resin is absorbed into the roughened layer 121 to form the insulating area 10, and the resin is left on the insulating area 10 to form the first insulating layer 11. Next, the protective layer (mask layer M1) is formed on an area adjacent to the first insulating layer 11. As a result, as shown in Figures 39(B) and 39(D), the first mask layer M1 is located on a portion of the first insulating layer 11. The process for the back side including the second insulating layer is the same as the process for the front side including the first insulating layer 11. The subsequent process for forming the solid electrolyte layer 12 and subsequent processes are the same as the process for forming the first mask layer M1 before the first insulating layer 11. The area where the protective layer is to be formed is the area where the protective layer (mask layer) is to be formed, as shown in Figure 12.

[0222] The roughened layer 121 is easier to etch than a roughened layer containing a resin. The roughened layer 121 is provided under the protective layer (mask layer M1), and since this roughened layer 121 is etched, an insulating resin can be easily supplied into the space formed by etching to form the insulating portion 162. When the filling rate of the insulating portion 162 is improved, the rate of stress generation due to internal voids and the like is reduced, improving the reliability of the element. Furthermore, since there is more freedom in forming the insulating portion 162, it is also possible to improve the structure of the insulating portion 162 to reduce stress, as described above, thereby improving the reliability of the element.

[0223] In the above description, the first mask layer M1 and the first insulating layer 11 may be made of materials that have the same composition after curing. The second mask layer M1B and the second insulating layer 11B may be made of materials that have the same composition after curing. For example, in manufacturing these layers, the amount of solvent that evaporates during drying and / or the thickness of the printed film may be changed. This allows the amount of resin material that penetrates into the roughened aluminum portion to be adjusted. Therefore, by adjusting these factors, the mask layer and the insulating layer can be formed. When such materials are used, the first insulating layer 11 and the first mask layer M1 (the second insulating layer 11B and the second mask layer M1B), which are shown separately in the drawings, may be integrated.

[0224] In the structures shown in FIG. 8 and subsequent figures, the resin filling region 162 X The first insulating portion 1621 is shown as a separate member for the manufacturing process, but these may be made of substantially the same material. X Although the first insulating portion 1621 and the second insulating portion 1622 are shown as separate parts in the drawings, they may be integrated together.

[0225] Although various exemplary embodiments have been described above, various omissions, substitutions, and modifications may be made without being limited to the above-described exemplary embodiments. Furthermore, elements from different embodiments may be combined to form other embodiments. Furthermore, it will be understood from the above description that various embodiments of the present disclosure have been described herein for illustrative purposes, and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the following claims. [Explanation of symbols]

[0226] 1... anode terminal, 2... cathode terminal, 7... support substrate, 8... anode electrode layer, 8c... recess, 8p... protrusion, 9... first dielectric layer, 10... insulating region, 101... first region, resin-filled region 162 X, 11...first insulating layer, 11B...second insulating layer, 12...first solid electrolyte layer, 12B...second solid electrolyte layer, 12r...first conductive polymer layer, 12Br...second conductive polymer layer, 13...first conductive layer, 13B...second conductive layer, 14...first cathode electrode layer, 14B...second cathode electrode layer, 15...first protective layer, 15B...second protective layer, 16...protective insulator, 80...metal sheet, 91, 91', 91B, 91B'...near-interface region, 100...laminated body, 101...first fillet, 102...second Fillet, 103...first land electrode, 104...second land electrode, 121...first roughened layer, 121B...second roughened layer, 162...insulating portion, 162A...insulating portion, 1621...first insulating portion, 1622...second insulating portion, 200...processing device, 201...roll body, 202...conveyor device, 203...cutting device, 210...intermediate terminal, 300...laminated sheet, CES1...first solid electrolytic capacitor sheet, CES2...second solid electrolytic capacitor sheet, CES3...third solid electrolytic capacitor sheet, CES4...fourth solid electrolytic capacitor sheet, C1...first capacitor, C2...second capacitor, CE1...first solid electrolytic capacitor element, CE2...second solid electrolytic capacitor element, CE3...third solid electrolytic capacitor element, CE4...fourth solid electrolytic capacitor element, CF1...reinforcing sheet, D1...first distance, D2...second distance, E...side electrode, E1...first side electrode, E2...second side electrode, E1B...first bend, E2B...second bend, GR1...first groove, GR 2...second groove, GR3...third groove, GR4...fourth groove, H1...first opening, H1B...second opening, H3...third opening, IF1...first insulating sheet, IF2...second insulating sheet, IF3...third insulating sheet, IF4...fourth insulating sheet, IFT...top insulating sheet, M1...first mask layer, M1B...second mask layer, MK...mask, SPA...first space, SPC...second space, S1...first side, S2...second side, x1...first position, x2...second position, xp...tip position, xs...end position.

Claims

1. a laminate including a plurality of stacked solid electrolytic capacitor elements; a first side electrode provided on a first side surface of the laminate; a second side electrode provided on a second side surface of the laminate; Equipped with Each of the solid electrolytic capacitor elements is an anode electrode layer electrically connected to the first side electrode; a dielectric layer provided on the anode electrode layer; a cathode electrode layer electrically connected to the second side electrode; a solid electrolyte layer interposed between the dielectric layer and the cathode electrode layer; an insulating region provided on the anode electrode layer and adjacent to a side surface of the solid electrolyte layer; an insulating portion interposed between a side surface of the insulating region and the second side surface electrode and including an insulating resin; a first insulating layer interposed between the insulating region and the cathode electrode layer and containing the same resin as that contained in the insulating region; Equipped with Solid electrolytic capacitor.

2. a protective layer interposed between the insulating portion and the cathode electrode layer; The solid electrolytic capacitor according to claim 1 .

3. The protective layer is Contains a resin and a filler, having a higher filler content than the first insulating layer; The solid electrolytic capacitor according to claim 2 .

4. The insulating region is The anode electrode layer includes a metal, and the first insulating layer includes a resin. The solid electrolytic capacitor according to claim 1 .

5. The insulating portion includes a resin and a filler. The solid electrolytic capacitor according to claim 1 .

6. The insulating portion and the cathode electrode layer are in contact with each other. The solid electrolytic capacitor according to claim 1 .

7. a protective layer is interposed between the insulating region and the first insulating layer; The solid electrolytic capacitor according to claim 6.

8. the insulating region includes a first region including the metal contained in the anode electrode layer and the resin contained in the first insulating layer; The insulating portion is a resin-filled region adjacent to the first region and containing the resin contained in the first insulating layer; a first insulating portion adjacent to the resin filling region and including a resin and a filler; Equipped with The solid electrolytic capacitor according to claim 1 .

9. the insulating region includes a first region including the metal contained in the anode electrode layer and the resin contained in the first insulating layer; The insulating portion is a resin-filled region adjacent to the first region and containing the resin contained in the first insulating layer; a first insulating portion adjacent to the resin filling region and containing resin; a second insulating portion interposed between the first insulating portion and the second side electrode and including a filler and a resin; Equipped with the resin contained in the first insulating portion is also contained in the resin filling region; The second insulating portion has a higher filler content than the first insulating portion. The solid electrolytic capacitor according to claim 1 .

10. The resin filling region is a resin contained in the first insulating layer; a resin contained in the first insulating portion; Including, The solid electrolytic capacitor according to claim 8 or 9.

11. a side surface of the anode electrode layer is closer to the second side surface electrode than the insulating region; The solid electrolytic capacitor according to claim 1 .

12. providing a metal sheet including an anode electrode layer and a roughened layer including a dielectric layer disposed on the anode electrode layer; forming a protective layer on the metal sheet; after forming the protective layer or before forming the protective layer, supplying a resin to the protective layer on the anode electrode layer or to a region adjacent to a region where the protective layer is to be formed, causing the resin to be absorbed into the roughened layer to form an insulating region, and causing the resin to remain on the insulating region to form a first insulating layer; a step of supplying a conductive polymer to the roughened layer to form a solid electrolyte layer; forming a cathode electrode layer on the solid electrolyte layer; laminating the metal sheet and the solid electrolytic capacitor sheet including the cathode electrode layer to form a laminate; forming a first groove in the laminate at a position passing through the protective layer to expose a side surface of the roughened layer located directly below the protective layer; Etching the exposed side surfaces of the roughened layer; supplying an insulating resin into the space formed by the etching to form an insulating portion adjacent to the insulating region; forming a second groove in the laminate so that a side surface of the anode electrode layer is exposed and a side surface of the cathode electrode layer is exposed; a step of forming a first side electrode on the first side of the laminate, the first side including the side on which the anode electrode layer is exposed; a step of forming a second side electrode on the second side of the laminate, the second side including the exposed side of the cathode electrode layer; A method for manufacturing a solid electrolytic capacitor comprising:

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