Polishing device and polishing method

Abstract

To provide a polishing device including a plurality of polishing heads and capable of reducing the number of additional mechanisms of a polishing head with respect to the number of polishing heads.SOLUTION: A polishing device includes: a base plate holding part 5 that holds and rotates a base plate W; a first polishing head 10A that presses a polishing tape 3 against a peripheral edge part of the base plate W; a second polishing head 10B that is arranged in a downstream side of the first polishing head 10A in a travel direction of the polishing tape 3 and presses the polishing tape 3 against the peripheral edge part of the base plate W; and a polishing tape supply mechanism 20 that feeds the polishing tape 3 in a longitudinal direction of the polishing tape 3 and supplies the polishing tape 3 to both the first polishing head 10A and the second polishing head 10B. The polishing tape supply mechanism 20 includes: a tape unwinding reel 21 arranged on an upstream side of the first polishing head 10A in the travel direction of the polishing tape 3; and a tape winding reel 22 arranged on a downstream side of the second polishing head 10B in the travel direction of the polishing tape 3.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a polishing apparatus and a polishing method for polishing the peripheral portion of a substrate such as a wafer. [Background technology]

[0002] In recent years, managing the surface condition of substrates has attracted attention from the perspective of improving yield in semiconductor device manufacturing. During the semiconductor device manufacturing process, various materials are deposited on silicon wafers. As a result, unwanted films and surface roughness form around the edges of the substrate. In recent years, a method of transporting a substrate by holding only the edges with an arm has become common. Under these circumstances, the unwanted films remaining on the edges peel off during various processes and adhere to devices formed on the substrate, reducing yield. Therefore, to remove the unwanted films from the edges of the substrate, the edges of the substrate are polished using a polishing device.

[0003] One known example of such a polishing apparatus is one that uses a polishing tape to polish the peripheral edge of a substrate. The polishing tape is fed in a predetermined direction while a polishing head presses the polishing tape against the peripheral edge of the rotating substrate, thereby polishing the peripheral edge of the substrate. Conventional polishing apparatuses include those equipped with a single polishing head and those equipped with multiple polishing heads to shorten the overall polishing process time, as shown in Patent Document 1. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5274993 Summary of the Invention [Problem to be solved by the invention]

[0005] In a polishing apparatus equipped with multiple polishing heads, a separate polishing head auxiliary mechanism is provided for each of the multiple polishing heads. Examples of the polishing head auxiliary mechanism include a tape supply and recovery mechanism that supplies and recovers polishing tape to and from the polishing head, and a tilt mechanism that tilts the polishing head. The same number of auxiliary mechanisms are provided for each polishing head. This requires space for installing these multiple auxiliary mechanisms, and maintenance must be performed for each of the multiple auxiliary mechanisms.

[0006] Therefore, the present invention provides a polishing apparatus and a polishing method that can reduce the number of accompanying mechanisms for polishing heads relative to the number of polishing heads in a polishing apparatus equipped with a plurality of polishing heads. [Means for solving the problem]

[0007] In one aspect, a polishing apparatus for polishing a peripheral portion of a substrate is provided, comprising: a substrate holding section for holding and rotating the substrate; a first polishing head for pressing a polishing tape against the peripheral portion of the substrate; a second polishing head arranged downstream of the first polishing head in the direction of travel of the polishing tape and for pressing the polishing tape against the peripheral portion of the substrate; and a polishing tape supply mechanism for feeding the polishing tape in its longitudinal direction and supplying the polishing tape to both the first polishing head and the second polishing head, wherein the polishing tape supply mechanism comprises a tape winding reel arranged upstream of the first polishing head in the direction of travel of the polishing tape, and a tape winding reel arranged downstream of the second polishing head in the direction of travel of the polishing tape. In one embodiment, the polishing apparatus further includes a tape cleaning nozzle positioned downstream of the first polishing head and upstream of the second polishing head in the direction of travel of the polishing tape, for cleaning the polishing tape with a fluid. In one embodiment, the polishing tape supply mechanism has a tape bending member arranged diagonally with respect to the longitudinal direction of the polishing tape, and the tape bending member is arranged between the first polishing head and the second polishing head in the direction of travel of the polishing tape.

[0008] In one embodiment, the polishing apparatus further includes an operation control unit that controls the operation of the first polishing head and the second polishing head, and the operation control unit is configured to cause the first polishing head and the second polishing head to press the polishing tape against the peripheral portion of the substrate while the polishing tape is fed a predetermined length, and then to stop the first polishing head and the second polishing head from pressing the polishing tape against the substrate until the used portion of the polishing tape is fed downstream of the second polishing head in the direction of travel of the polishing tape. In one embodiment, the predetermined length is equal to or less than the length of the polishing tape from the first polishing head to the second polishing head. In one embodiment, the first polishing head and the second polishing head are configured to press two different areas of the polishing tape in the width direction against the peripheral edge of the substrate, respectively. In one embodiment, the peripheral portion of the substrate includes a first region and a second region that are different in the thickness direction of the substrate, the pressing member of the first polishing head has a first shape corresponding to the target polishing shape of the first region, and the pressing member of the second polishing head has a second shape corresponding to the target polishing shape of the second region.

[0009] In one embodiment, the polishing apparatus further includes a third polishing head arranged downstream of the second polishing head in the direction of travel of the polishing tape and pressing the polishing tape against the peripheral portion of the substrate, the polishing tape supply mechanism being configured to supply the polishing tape to the first polishing head, the second polishing head, and the third polishing head, the take-up reel being arranged downstream of the third polishing head in the direction of travel of the polishing tape, the peripheral portion of the substrate further including a third region in the thickness direction of the substrate that is different from the first region and the second region, the pressing member of the third polishing head having a third shape corresponding to the polishing target shape of the third region, one of the first region, the second region, and the third region including a top edge portion of the substrate, the other of the first region, the second region, and the third region including a bevel portion of the substrate, and the remaining one of the first region, the second region, and the third region including a bottom edge portion of the substrate.

[0010] In one aspect, a polishing apparatus for polishing a peripheral portion of a substrate is provided, comprising: a substrate holding portion for holding and rotating the substrate; a first polishing head for pressing a first polishing tape against the peripheral portion of the substrate; and a second polishing head for pressing a second polishing tape against the peripheral portion of the substrate, wherein the peripheral portion of the substrate includes a first region and a second region that are different in the thickness direction of the substrate, and a pressing member of the first polishing head has a first shape corresponding to the target polishing shape of the first region, and a pressing member of the second polishing head has a second shape corresponding to the target polishing shape of the second region. In one embodiment, the polishing apparatus further includes a third polishing head that presses a third polishing tape against the peripheral portion of the substrate, the peripheral portion of the substrate further including a third region in the thickness direction of the substrate that is different from the first region and the second region, the pressing member of the third polishing head has a third shape corresponding to the target polishing shape of the third region, one of the first region, the second region, and the third region includes a top edge portion of the substrate, the other of the first region, the second region, and the third region includes a bevel portion of the substrate, and the remaining one of the first region, the second region, and the third region includes a bottom edge portion of the substrate.

[0011] In one aspect, a method for polishing a peripheral portion of a substrate is provided, which includes holding and rotating the substrate using a substrate holding unit, feeding a polishing tape in its longitudinal direction using a polishing tape supply mechanism, pressing the polishing tape against the peripheral portion of the substrate using a first polishing head, and pressing the polishing tape against the peripheral portion of the substrate using a second polishing head located downstream of the first polishing head in the direction of advancement of the polishing tape. In one embodiment, the polishing method further includes cleaning the polishing tape with a fluid using a tape cleaning nozzle located downstream of the first polishing head and upstream of the second polishing head in the direction of travel of the polishing tape. In one embodiment, the polishing tape is bent by a tape bending member disposed obliquely with respect to the longitudinal direction of the polishing tape while being fed from the first polishing head to the second polishing head.

[0012] In one embodiment, while the polishing tape is fed a predetermined length, the first polishing head and the second polishing head press the polishing tape against the peripheral portion of the substrate, and then the first polishing head and the second polishing head stop pressing the polishing tape against the substrate until the used portion of the polishing tape is fed downstream of the second polishing head in the direction of travel of the polishing tape. In one embodiment, the predetermined length is equal to or less than the length of the polishing tape from the first polishing head to the second polishing head. In one embodiment, the first polishing head and the second polishing head press two different areas of the polishing tape in the width direction against the peripheral edge of the substrate, respectively. In one embodiment, the peripheral portion of the substrate includes a first region and a second region that are different in the thickness direction of the substrate, the pressing member of the first polishing head has a first shape corresponding to the target polishing shape of the first region, and the pressing member of the second polishing head has a second shape corresponding to the target polishing shape of the second region.

[0013] In one embodiment, the polishing method further includes pressing the polishing tape against the peripheral portion of the substrate using a third polishing head arranged downstream of the second polishing head in the direction of travel of the polishing tape, wherein the peripheral portion of the substrate further includes a third region in the thickness direction of the substrate that is different from the first region and the second region, the pressing member of the third polishing head has a third shape corresponding to the target polishing shape of the third region, one of the first region, the second region, and the third region includes a top edge portion of the substrate, the other of the first region, the second region, and the third region includes a bevel portion of the substrate, and the remaining one of the first region, the second region, and the third region includes a bottom edge portion of the substrate.

[0014] In one aspect, a method for polishing a peripheral portion of a substrate is provided, comprising holding and rotating the substrate with a substrate holder, pressing a first polishing tape against the peripheral portion of the substrate with a first polishing head, and pressing a second polishing tape against the peripheral portion of the substrate with a second polishing head, wherein the peripheral portion of the substrate includes a first region and a second region that are different in the thickness direction of the substrate, a pressing member of the first polishing head has a first shape corresponding to the target polishing shape of the first region, and a pressing member of the second polishing head has a second shape corresponding to the target polishing shape of the second region. In one embodiment, the polishing method further includes pressing a third polishing tape against the peripheral portion of the substrate by a third polishing head, wherein the peripheral portion of the substrate further includes a third region in the thickness direction of the substrate that is different from the first region and the second region, the pressing member of the third polishing head has a third shape corresponding to the target polishing shape of the third region, one of the first region, the second region, and the third region includes a top edge portion of the substrate, the other of the first region, the second region, and the third region includes a bevel portion of the substrate, and the remaining one of the first region, the second region, and the third region includes a bottom edge portion of the substrate. [Effects of the Invention]

[0015] The polishing tape supply mechanism is configured to supply polishing tape to both the first polishing head and the second polishing head, and a single polishing tape supply mechanism is provided for both the first polishing head and the second polishing head. This allows the number of polishing tape supply mechanisms to be reduced relative to the number of polishing heads. As a result, the polishing apparatus can be made more compact and the maintenance costs of the polishing tape supply mechanisms can be reduced.

[0016] The pressing member of the first polishing head and the pressing member of the second polishing head have a first shape and a second shape, respectively, corresponding to the polishing target shapes of the first and second regions, which differ in the thickness direction of the peripheral edge of the substrate. Therefore, the peripheral edge of the substrate can be polished without tilting the first polishing head and the second polishing head, eliminating the need to provide a tilt mechanism for each of the first polishing head and the second polishing head. As a result, the polishing apparatus can be made more compact and the maintenance costs of the tilt mechanism can be reduced. [Brief explanation of the drawings]

[0017] [Figure 1] 1(a) and 1(b) are enlarged cross-sectional views showing the peripheral edge of the substrate. [Figure 2]FIG. 1 is a plan view showing an embodiment of a polishing apparatus. [Figure 3] 3 is a side view of the polishing apparatus as seen from the direction indicated by arrow A in FIG. 2. [Figure 4] 3 is a front view of the first polishing head, the tape unwinding reel, and the tape bending member as viewed from the direction indicated by the arrow B in FIG. 2. FIG. [Figure 5] 3 is a front view of the first polishing head and the tape bending member as viewed from the direction indicated by the arrow B in FIG. 2. FIG. [Figure 6] 3 is a front view of the second polishing head and the tape bending member as viewed from the direction indicated by the arrow C in FIG. 2. FIG. [Figure 7] 3 is a front view of the second polishing head and the tape bending member as viewed from the direction indicated by the arrow C in FIG. 2. FIG. [Figure 8] FIG. 10 is a view showing a state in which the first polishing head is polishing the peripheral edge of the substrate. [Figure 9] FIG. 10 is a flow chart showing one embodiment of a polishing tape feeding operation in a substrate polishing process. [Figure 10] FIG. 10(a) is a front view showing another embodiment of the first polishing head, and FIG. 10(b) is a front view showing another embodiment of the second polishing head. [Figure 11] 10(a) and 10(b) are diagrams showing used portions of polishing tape when the polishing tape is pressed against the peripheral edge of a substrate by the first polishing head shown in FIG. 10(a) and the second polishing head shown in FIG. 10(b). [Figure 12] FIG. 10 is a plan view showing another embodiment of the polishing apparatus. [Figure 13] 13 is a side view of the polishing apparatus as seen from the direction indicated by arrow D in FIG. 12. [Figure 14] FIG. 10 is a view showing a state in which the first polishing head presses the peripheral edge of the substrate. [Figure 15] FIG. 10 is a view showing a state in which the second polishing head presses the peripheral edge of the substrate. [Figure 16] FIG. 10 is a view showing a state in which the third polishing head presses the peripheral edge of the substrate. [Figure 17]Figure 17(a) is an enlarged cross-sectional view showing one embodiment of the pressing member of the first polishing head, Figure 17(b) is an enlarged cross-sectional view showing one embodiment of the pressing member of the second polishing head, and Figure 17(c) is an enlarged cross-sectional view showing one embodiment of the pressing member of the third polishing head. [Figure 18] FIG. 10 is a plan view showing still another embodiment of the polishing apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1(a) and 1(b) are enlarged cross-sectional views showing the peripheral portion of a substrate W. More specifically, FIG. 1(a) is a cross-sectional view of a so-called straight-type substrate, and FIG. 1(b) is a cross-sectional view of a so-called round-type substrate. The bevel portion B has a chamfered or rounded shape.

[0019] In the substrate W of FIG. 1(a), the bevel portion B is the outermost peripheral surface of the substrate W, which is composed of an upper inclined surface (upper bevel portion) B1, a lower inclined surface (lower bevel portion) B2, and a side portion (apex) B3. In the substrate W of FIG. 1(b), the bevel portion B is a portion having a curved cross section that constitutes the outermost peripheral surface of the substrate W. The top edge portion E1 is an annular flat portion located radially inward of the bevel portion B. The bottom edge portion E2 is an annular flat portion located opposite the top edge portion E1 and radially inward of the bevel portion B. The top edge portion E1 may include a region in which a device is formed. In this specification, the peripheral portion of the substrate W refers to a region that includes any of the top edge portion E1, the bevel portion B, and the bottom edge portion E2.

[0020] FIG. 2 is a plan view showing one embodiment of a polishing apparatus, and FIG. 3 is a side view of the polishing apparatus as viewed from the direction indicated by arrow A in FIG. 2. The polishing apparatus is an apparatus for polishing the peripheral portion of a substrate W such as a semiconductor wafer. The polishing apparatus includes a substrate holder 5 that holds and rotates the substrate W, a first polishing head 10A and a second polishing head 10B that press a polishing tape 3 against the peripheral portion of the substrate W, a polishing tape supply mechanism 20 that supplies the polishing tape 3 to both the first polishing head 10A and the second polishing head 10B, a lower supply nozzle 41 that supplies liquid to the lower surface of the substrate W, and an upper supply nozzle 42 that supplies liquid to the upper surface of the substrate W.

[0021] The substrate holder 5 includes a holding stage 7 that holds the substrate W by vacuum suction, a shaft 8 connected to the center of the holding stage 7, and a holding stage drive mechanism 9 that rotates and moves the holding stage 7 up and down. As shown in FIG. 3, the substrate W is placed on the substrate holding surface 7a of the holding stage 7. The holding stage drive mechanism 9 is configured to rotate the holding stage 7 about a predetermined rotation axis Cr and to move it up and down along the rotation axis Cr. The axis passing through the center O1 of the substrate W and the rotation axis Cr substantially coincide with each other.

[0022] The first polishing head 10A and the second polishing head 10B are configured to press the polishing tape 3 against the peripheral edge of the substrate W to polish the peripheral edge of the substrate W. The first polishing head 10A and the second polishing head 10B are arranged along the circumferential direction of the holding stage 7. The second polishing head 10B is disposed downstream of the first polishing head 10A in the traveling direction of the polishing tape 3.

[0023] As shown in FIG. 3, the first polishing head 10A includes a pressing member 12A that presses the polishing surface of the polishing tape 3 against the peripheral edge of the substrate W, and an air cylinder (actuator) 15 that moves the pressing member 12A toward the peripheral edge of the substrate W. The pressure of the polishing tape 3 against the substrate W is adjusted by controlling the air pressure supplied to the air cylinder 15. The pressing member 12A is disposed on the back side of the polishing tape 3 (the back side of the polishing surface having abrasive grains). When the pressing member 12A is moved toward the substrate W by the air cylinder 15, the pressing member 12A presses the back side of the polishing tape 3 against the peripheral edge of the substrate W. In this way, the first polishing head 10A polishes the peripheral edge of the substrate W.

[0024] The first polishing head 10A and the second polishing head 10B have basically the same configuration. The second polishing head 10B includes a pressing member 12B that presses the polishing surface of the polishing tape 3 against the peripheral edge of the substrate W, and an air cylinder (actuator) 15 that moves the pressing member 12B toward the peripheral edge of the substrate W.

[0025] The polishing tape supply mechanism 20 is configured to feed the polishing tape 3 in its longitudinal direction and supply the polishing tape 3 to both the first polishing head 10A and the second polishing head 10B. More specifically, the polishing tape supply mechanism 20 is configured to supply the polishing tape 3 to the first polishing head 10A and the second polishing head 10B in that order, and to collect the polishing tape 3 from the first polishing head 10A and the second polishing head 10B.

[0026] The polishing tape supply mechanism 20 includes a tape unwinding reel 21 that supplies the polishing tape 3 to the first polishing head 10A and the second polishing head 10B, a tape winding reel 22 that collects the polishing tape 3 used by the first polishing head 10A and the second polishing head 10B, tape bending members 25, 26, 27, and 28 arranged diagonally with respect to the longitudinal direction of the polishing tape 3, a tape folding roller 30 that folds the polishing tape 3, and multiple guide rollers 32 that guide the polishing tape 3 in the direction of travel.

[0027] The tape supply reel 21 is disposed upstream of the first polishing head 10A in the traveling direction of the polishing tape 3. The tape take-up reel 22 is disposed downstream of the second polishing head 10B in the traveling direction of the polishing tape 3. The tape supply reel 21 and the tape take-up reel 22 are connected to reel motors 23 and 24, respectively. The reel motors 23 and 24 are configured to apply a predetermined torque to the tape supply reel 21 and the tape take-up reel 22, respectively, to feed the polishing tape 3 in its longitudinal direction while applying tension to the polishing tape 3. The feed amount of the polishing tape 3 is calculated by the operation control unit 100, which will be described later, based on a signal from an angle detector (e.g., a rotary encoder, not shown) attached to the tape supply reel 21.

[0028] In this embodiment, the axis of the tape supply reel 21 and the tape take-up reel 22 extends vertically, and the tape supply reel 21 and the tape take-up reel 22 are arranged side by side in the horizontal direction, but in one embodiment, the axis of the tape supply reel 21 and the tape take-up reel 22 may extend horizontally, and the tape supply reel 21 and the tape take-up reel 22 may be arranged side by side in the vertical direction.

[0029] The tape bending members 25 to 28 are cylindrical or columnar structures fixed to a support member (not shown) without rotating. The tape bending member 25 is disposed between the tape supply reel 21 and the first polishing head 10A in the traveling direction of the polishing tape 3. The tape bending members 26 and 27 are disposed between the first polishing head 10A and the second polishing head 10B in the traveling direction of the polishing tape 3. More specifically, the tape bending member 26 is disposed upstream of the tape bending member 27 in the traveling direction of the polishing tape 3. A plurality of guide rollers 32 and a tape turning-back roller 30 are disposed between the tape bending member 26 and the tape bending member 27 in the traveling direction of the polishing tape 3. The tape bending member 28 is disposed between the second polishing head 10B and the tape take-up reel 22 in the traveling direction of the polishing tape 3. A plurality of guide rollers 32 are disposed between the tape bending member 28 and the tape take-up reel 22.

[0030] The tape bending member 25 and the tape bending member 26 are disposed outside the first polishing head 10A in the radial direction of the holding stage 7. More specifically, the tape bending member 26 is disposed outside the tape bending member 25 in the radial direction of the holding stage 7. As shown in FIG. 3 , in the traveling direction of the polishing tape 3, guide rollers 32 are disposed between the tape bending member 25 and the first polishing head 10A and between the first polishing head 10A and the tape bending member 26.

[0031] The tape bending member 27 and the tape bending member 28 are disposed outside the second polishing head 10B in the radial direction of the holding stage 7. More specifically, the tape bending member 28 is disposed outside the tape bending member 27 in the radial direction of the holding stage 7. In the traveling direction of the polishing tape 3, guide rollers 32 are disposed between the tape bending member 27 and the second polishing head 10B, and between the second polishing head 10B and the tape bending member 28. The arrangement and number of the tape turning rollers 30 are not limited to those of this embodiment, as long as they can turn the polishing tape 3 in the intended direction. The arrangement and number of the guide rollers 32 are not limited to those of this embodiment, as long as they can guide the polishing tape 3.

[0032] 4 is a front view of the first polishing head 10A, the tape supply reel 21, and the tape bending member 25, as seen from the direction indicated by arrow B in FIG. 2. As shown in FIG. 4, the polishing tape 3 supplied from the tape supply reel 21 is sent to the tape bending member 25. The tape bending member 25 has a tape support portion 25a that supports and bends the polishing tape 3. The tape support portion 25a is inclined obliquely with respect to the longitudinal direction of the polishing tape 3.

[0033] The tape bending member 25 changes the traveling direction of the polishing tape 3 by bending the polishing tape 3 obliquely along the tape support portion 25a. The polishing tape 3 is fed to the tape bending member 25 so that the surface of the polishing tape 3 opposite the polishing surface (i.e., the back surface of the polishing tape 3) contacts the tape support portion 25a. In the embodiment shown in FIG. 4, the tape bending member 25 is inclined at 45 degrees with respect to the longitudinal direction of the polishing tape 3, but the angle of the tape bending member 25 with respect to the longitudinal direction of the polishing tape 3 is not particularly limited as long as the traveling direction of the polishing tape 3 can be changed to the intended direction. In one embodiment, the polishing tape 3 may be fed to the tape bending member 25 so that the polishing surface of the polishing tape 3 contacts the tape support portion 25a.

[0034] In this embodiment, the tape bending member 25 changes the traveling direction of the polishing tape 3 from a direction D1 parallel to the substrate holding surface 7a of the holding stage 7 (i.e., horizontal direction) to a direction D2 perpendicular to the substrate holding surface 7a (i.e., vertical direction). The traveling direction D2 of the polishing tape 3 after being bent by the tape bending member 25 is the direction along the width direction of the polishing tape 3 before being bent. However, the directions D1 and D2 are not limited to this embodiment. The polishing tape 3 whose traveling direction has been changed by the tape bending member 25 is supplied to the first polishing head 10A via a guide roller 32 arranged between the tape bending member 25 and the first polishing head 10A, as shown in FIG. 3 . The polishing tape 3 is supplied to the first polishing head 10A so that the polishing surface of the polishing tape 3 faces the peripheral edge of the substrate W.

[0035] The polishing tape 3 used by the first polishing head 10A to polish the peripheral edge of the substrate W is fed to the tape bending member 26 via a guide roller 32 disposed between the first polishing head 10A and the tape bending member 26, as shown in FIG. 3. FIG. 5 is a front view of the first polishing head 10A and the tape bending member 26 as viewed from the direction indicated by arrow B in FIG. 2. As shown in FIG. 5, the tape bending member 26 has a tape support portion 26a that supports and bends the polishing tape 3. The tape support portion 26a is inclined obliquely with respect to the longitudinal direction of the polishing tape 3.

[0036] The tape bending member 26 changes the traveling direction of the polishing tape 3 by bending the polishing tape 3 obliquely along the tape support portion 26a. The polishing tape 3 is fed to the tape bending member 26 so that the surface of the polishing tape 3 opposite the polishing surface (i.e., the back surface of the polishing tape 3) contacts the tape support portion 26a. In the embodiment shown in FIG. 5, the tape bending member 26 is inclined at 45 degrees with respect to the longitudinal direction of the polishing tape 3, but the angle of the tape bending member 26 with respect to the longitudinal direction of the polishing tape 3 is not particularly limited as long as the traveling direction of the polishing tape 3 can be changed to the intended direction. In one embodiment, the polishing tape 3 may be fed to the tape bending member 26 so that the polishing surface of the polishing tape 3 contacts the tape support portion 26a.

[0037] In this embodiment, the tape bending member 26 changes the traveling direction of the polishing tape 3 from a direction D3 perpendicular to the substrate holding surface 7a of the holding stage 7 (i.e., a vertical direction) to a direction D4 parallel to the substrate holding surface 7a (i.e., a horizontal direction). The traveling direction D4 of the polishing tape 3 after being bent by the tape bending member 26 is a direction along the width direction of the polishing tape 3 before being bent. However, the directions D3 and D4 are not limited to this embodiment. The polishing tape 3 whose traveling direction has been changed by the tape bending member 26 is sent to the tape bending member 27 via a guide roller 32 and a tape turning roller 30 arranged between the tape bending member 26 and the tape bending member 27, as shown in FIG. 2.

[0038] FIG. 6 is a front view of the second polishing head 10B and the tape bending member 27 as viewed from the direction indicated by arrow C in FIG. 2. As shown in FIG. 6, the tape bending member 27 has a tape support portion 27a that supports and bends the polishing tape 3. The tape support portion 27a is inclined obliquely with respect to the longitudinal direction of the polishing tape 3. The tape bending member 27 changes the traveling direction of the polishing tape 3 by bending the polishing tape 3 obliquely along the tape support portion 27a. The polishing tape 3 is fed to the tape bending member 27 so that the surface of the polishing tape 3 opposite the polishing surface (i.e., the back surface of the polishing tape 3) contacts the tape support portion 27a. In the embodiment shown in FIG. 6, the tape bending member 27 is inclined at 45 degrees with respect to the longitudinal direction of the polishing tape 3. However, the angle of the tape bending member 27 with respect to the longitudinal direction of the polishing tape 3 is not particularly limited as long as the traveling direction of the polishing tape 3 can be changed to the intended direction. In one embodiment, the polishing tape 3 may be fed to the tape bending member 27 so that the polishing surface of the polishing tape 3 contacts the tape support portion 27a.

[0039] In this embodiment, the tape bending member 27 changes the traveling direction of the polishing tape 3 from a direction D5 parallel to the substrate holding surface 7a of the holding stage 7 (i.e., a horizontal direction) to a direction D6 perpendicular to the substrate holding surface 7a (i.e., a vertical direction). The traveling direction D6 of the polishing tape 3 after being bent by the tape bending member 27 is a direction along the width direction of the polishing tape 3 before being bent. However, the directions D5 and D6 are not limited to this embodiment. The polishing tape 3 whose traveling direction has been changed by the tape bending member 27 is supplied to the second polishing head 10B via a guide roller 32 arranged between the tape bending member 27 and the second polishing head 10B. The polishing tape 3 is turned over by the tape turning roller 30. The polishing tape 3 is supplied to the second polishing head 10B so that the polishing surface of the polishing tape 3 faces the peripheral edge of the substrate W.

[0040] In one embodiment, the tape folding roller 30 may be incorporated into the second polishing head 10B and configured to fold (reverse) the polishing tape 3 within the second polishing head 10B so that the polishing surface of the polishing tape 3 faces the peripheral edge of the substrate W.

[0041] The polishing tape 3 used by the second polishing head 10B to polish the peripheral edge of the substrate W is fed to the tape bending member 28 via a guide roller 32 disposed between the second polishing head 10B and the tape bending member 28. FIG. 7 is a front view of the second polishing head 10B and the tape bending member 28 as viewed from the direction indicated by arrow C in FIG. 2. As shown in FIG. 7, the tape bending member 28 has a tape support portion 28a that supports and bends the polishing tape 3. The tape support portion 28a is inclined obliquely with respect to the longitudinal direction of the polishing tape 3.

[0042] The tape bending member 28 changes the traveling direction of the polishing tape 3 by bending the polishing tape 3 obliquely along the tape support portion 28a. The polishing tape 3 is fed to the tape bending member 28 so that the surface of the polishing tape 3 opposite the polishing surface (i.e., the back surface of the polishing tape 3) contacts the tape support portion 28a. In the embodiment shown in FIG. 7, the tape bending member 28 is inclined at 45 degrees with respect to the longitudinal direction of the polishing tape 3, but the angle of the tape bending member 28 with respect to the longitudinal direction of the polishing tape 3 is not particularly limited as long as the traveling direction of the polishing tape 3 can be changed to the intended direction. In one embodiment, the polishing tape 3 may be fed to the tape bending member 28 so that the polishing surface of the polishing tape 3 contacts the tape support portion 28a.

[0043] In this embodiment, the tape bending member 28 changes the traveling direction of the polishing tape 3 from a direction D7 perpendicular to the substrate holding surface 7a of the holding stage 7 (i.e., a vertical direction) to a direction D8 parallel to the substrate holding surface 7a (i.e., a horizontal direction). The traveling direction D8 of the polishing tape 3 after being bent by the tape bending member 28 is a direction along the width direction of the polishing tape 3 before being bent. However, the directions D7 and D8 are not limited to this embodiment. The polishing tape 3 whose traveling direction has been changed by the tape bending member 28 is collected by the tape take-up reel 22 via a guide roller 32 arranged between the tape bending member 28 and the tape take-up reel 22, as shown in FIG. 2.

[0044] Although the tape bending members 25 to 28 in this embodiment are each a rod-shaped structure, the configuration of the tape bending members is not limited to this embodiment as long as the tape support parts can bend the polishing tape 3. For example, the tape bending members may be plate-shaped structures, or a single tape bending member may have multiple tape support parts and be configured to fold the polishing tape 3 multiple times by the single tape bending member.

[0045] In this embodiment, the tape bending members 25-28 are inclined at 45 degrees relative to the longitudinal direction of the polishing tape 3, but the angles of the tape bending members 25-28 relative to the longitudinal direction of the polishing tape 3 are not limited to this embodiment. The traveling direction of the polishing tape 3, which is changed by the tape bending members 25-28, can be adjusted by adjusting the angles of the tape bending members 25-28 relative to the longitudinal direction of the polishing tape 3.

[0046] 2, the polishing apparatus further includes a tape cleaning nozzle 34 that cleans the polishing tape 3 with a fluid. The tape cleaning nozzle 34 is disposed downstream of the first polishing head 10A and upstream of the second polishing head 10B in the traveling direction of the polishing tape 3. The tape cleaning nozzle 34 is configured to supply a fluid toward the polishing tape 3 to clean the polishing tape 3. Examples of the fluid supplied from the tape cleaning nozzle 34 include a liquid such as pure water and a gas such as dry air.

[0047] The polishing tape 3 fed from the first polishing head 10A may have particles, such as polishing debris, attached thereto, which are generated when the first polishing head 10A polishes the substrate W. The tape cleaning nozzle 34 removes the particles from the polishing tape 3 before the polishing tape 3 is supplied to the second polishing head 10B. Therefore, when the substrate W is polished by the second polishing head 10B, the particles attached to the polishing tape 3 can be prevented from adhering to the substrate W.

[0048] 3, the lower supply nozzle 41 is configured to supply liquid to the lower surface of the substrate W. The upper supply nozzle 42 is configured to supply liquid to the upper surface of the substrate W. An example of the liquid supplied to the substrate W is pure water. During polishing of the substrate W, the liquid is supplied from the lower supply nozzle 41 to the lower surface of the substrate W, and the liquid is supplied from the upper supply nozzle 42 to the upper surface of the substrate W.

[0049] As shown in FIG. 2, the polishing apparatus further includes a first tilt mechanism 50A that tilts the first polishing head 10A and a second tilt mechanism 50B that tilts the second polishing head 10B. The first tilt mechanism 50A is connected to the first polishing head 10A, and the second tilt mechanism 50B is connected to the second polishing head 10B. The first tilt mechanism 50A is configured to tilt the first polishing head 10A relative to the substrate holding surface 7a of the holding stage 7. The second tilt mechanism 50B is configured to tilt the second polishing head 10B relative to the substrate holding surface 7a of the holding stage 7. Since the first tilt mechanism 50A and the second tilt mechanism 50B have basically the same configuration, only the first tilt mechanism 50A will be described below.

[0050] The first tilt mechanism 50A includes a tilt arm 52 connected to the first polishing head 10A and an arm rotation device 53 that rotates the tilt arm 52. One end of the tilt arm 52 is located at the same height as the substrate holding surface 7a of the holding stage 7 and is connected to the arm rotation device 53. The other end of the tilt arm 52 is connected to the first polishing head 10A.

[0051] When the arm rotation device 53 rotates the tilt arm 52, the first tilt mechanism 50A can tilt the entire first polishing head 10A at a predetermined tilting speed relative to the substrate W on the substrate holding surface 7a of the holding stage 7. Furthermore, the first tilt mechanism 50A is configured to maintain the first polishing head 10A at a predetermined tilt angle. Note that the specific configuration of the first tilt mechanism 50A is not limited to that of this embodiment, as long as it can tilt the first polishing head 10A relative to the substrate holding surface 7a of the holding stage 7 and the substrate W.

[0052] 8 is a diagram showing the first polishing head 10A polishing the peripheral edge of the substrate W. The first tilt mechanism 50A can polish the peripheral edge of the substrate W by continuously or stepwise changing the tilt angle of the first polishing head 10A. In this way, the first polishing head 10A and the second polishing head 10B can polish the peripheral edges of the substrate W, namely, the top edge E1, the bottom edge E2, and the bevel B (see FIGS. 1(a) and 1(b)), by being tilted by the first tilt mechanism 50A and the second tilt mechanism 50B.

[0053] The polishing apparatus further includes an operation control unit 100 that controls the operation of each component of the polishing apparatus. The substrate holding unit 5, the first polishing head 10A, the second polishing head 10B, the polishing tape supply mechanism 20, the lower supply nozzle 41, the upper supply nozzle 42, the first tilt mechanism 50A, and the second tilt mechanism 50B are electrically connected to the operation control unit 100. The operation of the substrate holding unit 5, the first polishing head 10A, the second polishing head 10B, the polishing tape supply mechanism 20, the lower supply nozzle 41, the upper supply nozzle 42, the first tilt mechanism 50A, and the second tilt mechanism 50B is controlled by the operation control unit 100.

[0054] The operation control unit 100 includes at least one computer. The operation control unit 100 includes a storage device 100a that stores a program, and an arithmetic unit 100b that executes calculations in accordance with the program. The storage device 100a includes a main storage device (e.g., random access memory) accessible by the arithmetic unit 100b, and an auxiliary storage device (e.g., a hard disk drive or solid state drive) that stores the program. The arithmetic unit 100b includes a CPU (central processing unit) or a GPU (graphics processing module) that executes calculations in accordance with instructions included in the program stored in the storage device 100a. However, the specific configuration of the operation control unit 100 is not limited to these examples.

[0055] The polishing apparatus of this embodiment simultaneously drives the first polishing head 10A and the second polishing head 10B to polish the peripheral edge of the substrate W. Polishing of the peripheral edge of the substrate W is performed as follows: When the substrate W is transported to the polishing apparatus, the operation control unit 100 issues a command to the holding stage driving mechanism 9 of the substrate holder 5 to raise the holding stage 7. The substrate W is placed on the substrate holding surface 7a of the holding stage 7 and is held on the substrate holding surface 7a by vacuum suction. The operation control unit 100 issues a command to the holding stage driving mechanism 9 of the substrate holder 5 to lower the substrate W to the polishing position and rotate the holding stage 7 and the substrate W. Furthermore, the operation control unit 100 issues a command to the lower supply nozzle 41 and the upper supply nozzle 42 to supply liquid to the substrate W from the lower supply nozzle 41 and the upper supply nozzle 42.

[0056] Next, the operation control unit 100 issues a command to the polishing tape supply mechanism 20 to start supplying the polishing tape 3 to the first polishing head 10A and the second polishing head 10B. Thereafter, the operation control unit 100 issues a command to the air cylinder 15 of the first polishing head 10A to cause the pressing member 12A of the first polishing head 10A to press the polishing tape 3 against the peripheral edge of the substrate W, and issues a command to the air cylinder 15 of the second polishing head 10B to cause the pressing member 12B of the second polishing head 10B to press the polishing tape 3 against the peripheral edge of the substrate W. During or before polishing the substrate W, the operation control unit 100 issues a command to the first tilt mechanism 50A and the second tilt mechanism 50B to tilt the first polishing head 10A and the second polishing head 10B, respectively. As a result, the first polishing head 10A and the second polishing head 10B polish predetermined areas of the peripheral edge of the substrate W, respectively.

[0057] According to this embodiment, the polishing tape supply mechanism 20 is configured to supply the polishing tape 3 to both the first polishing head 10A and the second polishing head 10B, and a single polishing tape supply mechanism 20 is provided for both the first polishing head 10A and the second polishing head 10B. This allows for a reduction in the number of polishing tape supply mechanisms relative to the number of polishing heads. As a result, the polishing apparatus can be made more compact and the maintenance costs of the polishing tape supply mechanisms can be reduced.

[0058] FIG. 9 is a flow chart showing an embodiment of the operation of feeding the polishing tape 3 in the polishing process of the substrate W. In step 1-1, the operation control unit 100 causes the pressing member 12A of the first polishing head 10A and the pressing member 12B of the second polishing head 10B to press the polishing tape 3 against the peripheral edge of the substrate W while the polishing tape 3 is being fed by a predetermined length L. The used portion PA of the polishing tape 3, which is pressed by the pressing member 12A of the first polishing head 10A and has been used to polish the substrate W, and the used portion PB of the polishing tape 3, which is pressed by the pressing member 12B of the second polishing head 10B and has been used to polish the substrate W, are fed downstream in the traveling direction of the polishing tape 3.

[0059] In step 1-2, after the first polishing head 10A and the second polishing head 10B start pressing the polishing tape 3, when the polishing tape 3 has been fed a predetermined length L, the operation control unit 100 issues a command to the first polishing head 10A and the second polishing head 10B to stop pressing the polishing tape 3 against the substrate W. The polishing tape 3 moves away from the substrate W. The predetermined length L is equal to or less than the length of the polishing tape 3 from the first polishing head 10A to the second polishing head 10B. The operation control unit 100 can calculate the feed amount of the polishing tape 3 based on a signal from an angle detector (e.g., a rotary encoder, not shown) attached to the tape feed reel 21. In step 1-3, the operation control unit 100 continues to stop the first polishing head 10A and the second polishing head 10B from pressing the polishing tape 3 against the substrate W until the used portions PA and PB of the polishing tape 3 are sent downstream of the second polishing head 10B in the traveling direction of the polishing tape 3. The polishing tape 3 remains separated from the substrate W.

[0060] In step 1-4, while the polishing tape 3 is being fed by the predetermined length L, the operation control unit 100 controls the pressing member 12A of the first polishing head 10A and the pressing member 12B of the second polishing head 10B to press the polishing tape 3 against the peripheral edge of the substrate W again. The used portion PA of the polishing tape 3, which is pressed by the pressing member 12A of the first polishing head 10A and has been used to polish the substrate W, and the used portion PB of the polishing tape 3, which is pressed by the pressing member 12B of the second polishing head 10B and has been used to polish the substrate W, are fed downstream in the traveling direction of the polishing tape 3. Then, the operations of steps 1-2 to 1-4 are repeated.

[0061] Because abrasive grains have been detached from the used portions PA, PB of the polishing tape 3 due to polishing of the substrate W, if the used portions PA, PB of the polishing tape 3 are used again to polish the substrate W, the polishing ability will be reduced compared to an unused polishing tape 3. In the above-described feeding operation of the polishing tape 3, the second polishing head 10B, which is located downstream of the first polishing head 10A in the advancing direction of the polishing tape 3, can always press the unused portion of the polishing tape 3 against the substrate W without pressing the used portion PA of the polishing tape 3 against the substrate W.

[0062] 10(a) is a front view showing another embodiment of the first polishing head 10A, and FIG. 10(b) is a front view showing another embodiment of the second polishing head 10B. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the above-described embodiment, and therefore redundant description will be omitted. The first polishing head 10A and the second polishing head 10B of this embodiment are configured to press a first area X1 and a second area X2 of the polishing tape 3, which differ in the width direction of the polishing tape 3, against the peripheral edge of the substrate W, respectively.

[0063] 10(a), the pressing member 12A of the first polishing head 10A of this embodiment is disposed at a position corresponding to the first area X1 of the polishing tape 3. As shown in FIG. 10(b), the pressing member 12B of the second polishing head 10B of this embodiment is disposed at a position corresponding to the second area X2 of the polishing tape 3. The position of the pressing member 12A within the first polishing head 10A is different from the position of the pressing member 12B within the second polishing head 10B.

[0064] 11 shows used portions PA and PB of the polishing tape 3 when the polishing tape 3 is pressed against the peripheral edge of the substrate W by the first polishing head 10A shown in FIG. 10(a) and the second polishing head 10B shown in FIG. 10(b). As shown in FIG. 11, the used portion PA of the polishing tape 3 pressed by the pressing member 12A of the first polishing head 10A and used to polish the substrate W, and the used portion PB of the polishing tape 3 pressed by the pressing member 12B of the second polishing head 10B and used to polish the substrate W, are located in two different areas X1 and X2 in the width direction of the polishing tape 3. Therefore, even after the used portion PA of the polishing tape 3 reaches the second polishing head 10B, the second polishing head 10B can press the second area X2 of the polishing tape 3 against the peripheral edge of the substrate W without using the used portion PA.

[0065] Fig. 12 is a plan view showing another embodiment of the polishing apparatus, and Fig. 13 is a side view of the polishing apparatus as viewed from the direction indicated by arrow D in Fig. 12. The polishing apparatus of this embodiment includes a substrate holder 5 that holds and rotates a substrate W, a first polishing head 60A that presses a first polishing tape 3A against the peripheral edge of the substrate W, a second polishing head 60B that presses a second polishing tape 3B against the peripheral edge of the substrate W, a third polishing head 60C that presses a third polishing tape 3C against the peripheral edge of the substrate W, a first polishing tape supply mechanism 70A that supplies the first polishing tape 3A to the first polishing head 60A, a second polishing tape supply mechanism 70B that supplies the second polishing tape 3B to the second polishing head 60B, a third polishing tape supply mechanism 70C that supplies the third polishing tape 3C to the third polishing head 60C, a lower supply nozzle 41 that supplies liquid to the lower surface of the substrate W, and an upper supply nozzle 42 that supplies liquid to the upper surface of the substrate W.

[0066] 2 and 3, the substrate holding unit 5, the lower supply nozzle 41, and the upper supply nozzle 42 have the same configurations as the substrate holding unit 5, the lower supply nozzle 41, and the upper supply nozzle 42 described with reference to FIGS. 2 and 3, and therefore a redundant description thereof will be omitted. The first polishing head 60A, the second polishing head 60B, and the third polishing head 60C are arranged along the circumferential direction of the holding stage 7. In this embodiment, the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C are configured to press the first polishing tape 3A, the second polishing tape 3B, and the third polishing tape 3C against the peripheral edge of the substrate W, respectively.

[0067] As shown in FIG. 13, the first polishing head 60A includes a pressing member 62A that presses the polishing surface of the first polishing tape 3A against the peripheral edge of the substrate W, and an air cylinder (actuator) 65A that moves the pressing member 62A toward the peripheral edge of the substrate W. The pressing force of the first polishing tape 3A against the substrate W is adjusted by controlling the air pressure supplied to the air cylinder 65A. The pressing member 62A is disposed on the back side of the first polishing tape 3A (the back side of the polishing surface having abrasive grains). When the pressing member 62A is moved toward the substrate W by the air cylinder 65A, the pressing member 62A presses the back side of the first polishing tape 3A against the peripheral edge of the substrate W. In this way, the first polishing head 60A polishes the peripheral edge of the substrate W.

[0068] The first polishing head 60A, the second polishing head 60B, and the third polishing head 60C have basically the same configuration. The second polishing head 60B includes a pressing member 62B that presses the polishing surface of the second polishing tape 3B against the peripheral edge of the substrate W, and an air cylinder (actuator) 65B that moves the pressing member 62B toward the peripheral edge of the substrate W. The third polishing head 60C includes a pressing member 62C that presses the polishing surface of the third polishing tape 3C against the peripheral edge of the substrate W, and an air cylinder (actuator) 65C that moves the pressing member 62C toward the peripheral edge of the substrate W.

[0069] The first polishing tape supply mechanism 70A is configured to feed the first polishing tape 3A in its longitudinal direction and supply the first polishing tape 3A to the first polishing head 60A. More specifically, the first polishing tape supply mechanism 70A is configured to supply the first polishing tape 3A to the first polishing head 60A and collect the first polishing tape 3A from the first polishing head 60A. Similarly, the second polishing tape supply mechanism 70B is configured to feed the second polishing tape 3B in its longitudinal direction and supply the second polishing tape 3B to the second polishing head 60B. The third polishing tape supply mechanism 70C is configured to feed the third polishing tape 3C in its longitudinal direction and supply the third polishing tape 3C to the third polishing head 60C. Since the first polishing tape supply mechanism 70A, the second polishing tape supply mechanism 70B, and the third polishing tape supply mechanism 70C basically have the same configuration, only the first polishing tape supply mechanism 70A will be described below.

[0070] The first polishing tape supply mechanism 70A includes a tape supply reel 71, a tape take-up reel 72, and a plurality of guide rollers 76. The tape supply reel 71, the tape take-up reel 72, and the plurality of guide rollers 76 are fixed to a reel base 78. The first polishing tape 3A is supplied to the first polishing head 60A so that the polishing surface of the first polishing tape 3A faces the peripheral edge of the substrate W. The traveling direction of the first polishing tape 3A is guided by the guide rollers 76.

[0071] The tape supply reel 71 and the tape take-up reel 72 are respectively connected to reel motors 73 and 74. The tape supply reel 71 and the tape take-up reel 72 are fixed to a reel base 78 via the reel motors 73 and 74. The reel motors 73 and 74 are configured to apply a predetermined torque to the tape supply reel 71 and the tape take-up reel 72, respectively, and feed the first abrasive tape 3A in its longitudinal direction while applying tension to the first abrasive tape 3A.

[0072] In this embodiment, the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C have fixed inclination angles relative to the substrate holding surface 7a of the holding stage 7. Therefore, the polishing apparatus of this embodiment does not include a tilt mechanism for tilting the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C.

[0073] 14 is a diagram showing the first polishing head 60A pressing the peripheral edge of the substrate W, FIG. 15 is a diagram showing the second polishing head 60B pressing the peripheral edge of the substrate W, and FIG. 16 is a diagram showing the third polishing head 60C pressing the peripheral edge of the substrate W. In this embodiment, the first polishing head 60A is configured to polish an area including a top edge portion E1 of the peripheral edge of the substrate W, the second polishing head 60B is configured to polish an area including a bevel portion B of the peripheral edge of the substrate W, and the third polishing head 60C is configured to polish an area including a bottom edge portion E2 of the peripheral edge of the substrate W.

[0074] The first polishing head 60A is disposed so that its pressing member 62A faces the area including the top edge portion E1. The second polishing head 60B is disposed so that its pressing member 62B faces the area including the bevel portion B. The third polishing head 60C is disposed so that its pressing member 62C faces the area including the bottom edge portion E2.

[0075] FIG. 17(a) is an enlarged cross-sectional view showing an embodiment of a pressing member 62A of the first polishing head 60A, FIG. 17(b) is an enlarged cross-sectional view showing an embodiment of a pressing member 62B of the second polishing head 60B, and FIG. 17(c) is an enlarged cross-sectional view showing an embodiment of a pressing member 62C of the third polishing head 60C. The pressing member 62A of the first polishing head 60A has a first shape corresponding to the polishing target shape of the top edge portion E1 of the substrate W. The pressing member 62B of the second polishing head 60B has a second shape corresponding to the polishing target shape of the bevel portion B of the substrate W. The pressing member 62C of the third polishing head 60C has a third shape corresponding to the polishing target shape of the bottom edge portion E2 of the substrate W. The first shape of the pressing member 62A, the second shape of the pressing member 62B, and the third shape of the pressing member 62C are different from each other. The pressing members 62A to 62C are made of resin such as engineering plastic (for example, PEEK) or rubber material having excellent strength and durability such as ethylene propylene rubber (EPDM), polyurethane rubber, or silicone rubber.

[0076] The first polishing head 60A can polish the area including the top edge portion E1 of the substrate W to the target polishing shape by pressing the polishing tape 3A with a pressing member 62A having a first shape corresponding to the target polishing shape of the top edge portion E1 of the substrate W. The second polishing head 60B can polish the area including the bevel portion B of the substrate W to the target polishing shape by pressing the polishing tape 3B with a pressing member 62B having a second shape corresponding to the target polishing shape of the bevel portion B of the substrate W. The third polishing head 60C can polish the area including the bottom edge portion E2 of the substrate W to the target polishing shape by pressing the polishing tape 3C with a pressing member 62C having a third shape corresponding to the target polishing shape of the bottom edge portion E2 of the substrate W.

[0077] In this embodiment, the substrate holding unit 5, the first polishing head 60A, the second polishing head 60B, the third polishing head 60C, the first polishing tape supply mechanism 70A, the second polishing tape supply mechanism 70B, the third polishing tape supply mechanism 70C, the lower supply nozzle 41, and the upper supply nozzle 42 are electrically connected to the operation control unit 100. The operations of the substrate holding unit 5, the first polishing head 60A, the second polishing head 60B, the third polishing head 60C, the first polishing tape supply mechanism 70A, the second polishing tape supply mechanism 70B, the third polishing tape supply mechanism 70C, the lower supply nozzle 41, and the upper supply nozzle 42 are controlled by the operation control unit 100.

[0078] According to this embodiment, the pressing member 62A of the first polishing head 60A, the pressing member 62B of the second polishing head 60B, and the pressing member 62C of the third polishing head 60C have a first shape, a second shape, and a third shape corresponding to the polishing target shapes of the top edge portion E1, the bevel portion B, and the bottom edge portion E2, which differ in the thickness direction of the peripheral edge of the substrate W. Therefore, the peripheral edge of the substrate W can be polished without tilting the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C, and therefore there is no need to provide a tilt mechanism for each of the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C. As a result, the polishing apparatus can be made more compact and the maintenance costs of the tilt mechanisms can be reduced.

[0079] Figure 18 is a plan view showing yet another embodiment of a polishing apparatus. The polishing apparatus of this embodiment is a polishing apparatus equipped with the first polishing head 60A, second polishing head 60B, and third polishing head 60C described with reference to Figures 12 to 17, to which the polishing tape supply mechanism 20 described with reference to Figures 2 to 8 is applied. In this embodiment, the polishing tape supply mechanism is indicated by the reference numeral 80. The configuration and operation of this embodiment that are not particularly described are the same as those of the embodiment described with reference to Figures 12 to 17, so redundant description will be omitted.

[0080] The first polishing head 60A, the second polishing head 60B, and the third polishing head 60C of this embodiment are all configured to press the polishing tape 3 supplied from the polishing tape supply mechanism 80 against the peripheral edge of the substrate W.

[0081] The polishing tape supply mechanism 80 of this embodiment is configured to feed the polishing tape 3 in its longitudinal direction and supply the polishing tape 3 to all of the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C. More specifically, the polishing tape supply mechanism 80 is configured to supply the polishing tape 3 to the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C, and to collect the polishing tape 3 from the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C. The polishing tape 3 is supplied to the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C in this order.

[0082] The polishing tape supply mechanism 80 of this embodiment includes a tape winding reel 81 that supplies polishing tape 3 to the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C, a tape winding reel 82 that collects the polishing tape 3 used by the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C, tape bending members 85, 86, 87, 88, 89, and 90 arranged diagonally with respect to the longitudinal direction of the polishing tape 3, a tape folding roller 92 that folds the polishing tape 3, and a plurality of guide rollers 94 that guide the polishing tape 3 in the traveling direction.

[0083] The tape supply reel 81 is disposed upstream of the first polishing head 60A in the traveling direction of the polishing tape 3. The tape take-up reel 82 is disposed downstream of the third polishing head 60C in the traveling direction of the polishing tape 3. The tape supply reel 81 and the tape take-up reel 82 are connected to reel motors 83 and 84, respectively. The reel motors 83 and 84 are configured to apply a predetermined torque to the tape supply reel 81 and the tape take-up reel 82, respectively, and feed the polishing tape 3 in its longitudinal direction while applying tension to the polishing tape 3.

[0084] In this embodiment, the tape supply reel 81 and the tape take-up reel 82 have their respective axes extending vertically, and the tape supply reel 81 and the tape take-up reel 82 are arranged side by side horizontally, but in one embodiment, the tape supply reel 81 and the tape take-up reel 82 may have their respective axes extending horizontally, and the tape supply reel 81 and the tape take-up reel 82 may be arranged side by side vertically.

[0085] The tape bending members 85-90 are cylindrical or columnar structures that do not rotate and are fixed to a support member (not shown). The tape bending member 85 is disposed between the tape unwinding reel 81 and the first polishing head 60A in the traveling direction of the polishing tape 3. The tape bending members 86 and 87 are disposed between the first polishing head 60A and the second polishing head 60B in the traveling direction of the polishing tape 3. More specifically, the tape bending member 86 is disposed upstream of the tape bending member 87 in the traveling direction of the polishing tape 3. A guide roller 94 and a tape folding roller 92 are disposed between the tape bending member 86 and the tape bending member 87 in the traveling direction of the polishing tape 3.

[0086] The tape bending members 88, 89 are disposed between the second polishing head 60B and the third polishing head 60C in the traveling direction of the polishing tape 3. More specifically, the tape bending member 88 is disposed upstream of the tape bending member 89 in the traveling direction of the polishing tape 3. A guide roller 94 and a tape turning-back roller 92 are disposed between the tape bending member 88 and the tape bending member 89 in the traveling direction of the polishing tape 3. The tape bending member 90 is disposed between the third polishing head 60C and the tape take-up reel 82. A plurality of guide rollers 94 are disposed between the tape bending member 90 and the tape take-up reel 82.

[0087] The tape bending member 85 and the tape bending member 86 are disposed outside the first polishing head 60A in the radial direction of the holding stage 7. More specifically, the tape bending member 86 is disposed outside the tape bending member 85 in the radial direction of the holding stage 7. In the traveling direction of the polishing tape 3, guide rollers 94 are disposed between the tape bending member 85 and the first polishing head 60A, and between the first polishing head 60A and the tape bending member 86.

[0088] The tape bending member 87 and the tape bending member 88 are disposed outside the second polishing head 60B in the radial direction of the holding stage 7. More specifically, the tape bending member 88 is disposed outside the tape bending member 87 in the radial direction of the holding stage 7. In the traveling direction of the polishing tape 3, guide rollers 94 are disposed between the tape bending member 87 and the second polishing head 60B, and between the second polishing head 60B and the tape bending member 88.

[0089] The tape bending member 89 and the tape bending member 90 are disposed outside the third polishing head 60C in the radial direction of the holding stage 7. More specifically, the tape bending member 90 is disposed outside the tape bending member 89 in the radial direction of the holding stage 7. Guide rollers 94 are disposed between the tape bending member 89 and the third polishing head 60C, and between the third polishing head 60C and the tape bending member 90 in the traveling direction of the polishing tape 3. The arrangement and number of the tape turning rollers 92 are not limited to those of this embodiment, as long as they can turn the polishing tape 3 in the intended direction. The arrangement and number of the guide rollers 94 are not limited to those of this embodiment, as long as they can guide the polishing tape 3.

[0090] The polishing tape 3 supplied from the tape unwinding reel 81 is sent to the tape bending member 85. The configuration of the tape bending member 85 in this embodiment is the same as the configuration of the tape bending member 25 described with reference to FIG. 4, so a duplicated description will be omitted. The polishing tape 3, whose traveling direction has been changed by the tape bending member 85, is supplied to the first polishing head 60A via a guide roller 94 arranged between the tape bending member 85 and the first polishing head 60A. The polishing tape 3 is supplied to the first polishing head 60A so that the polishing surface of the polishing tape 3 faces the peripheral edge of the substrate W.

[0091] The polishing tape 3 used to polish the peripheral edge of the substrate W by the first polishing head 60A is fed to the tape bending member 86 via a guide roller 94 arranged between the first polishing head 60A and the tape bending member 86. The configuration of the tape bending member 86 in this embodiment is the same as the configuration of the tape bending member 26 described with reference to Figure 5, so a duplicated description will be omitted. The polishing tape 3 whose traveling direction has been changed by the tape bending member 86 is fed to the tape bending member 87 via a guide roller 94 and a tape turning roller 92 arranged between the tape bending member 86 and the tape bending member 87.

[0092] The configuration of the tape bending member 87 in this embodiment is the same as the configuration of the tape bending member 27 described with reference to Figure 6, so a duplicated description will be omitted. The polishing tape 3, whose traveling direction has been changed by the tape bending member 87, is supplied to the second polishing head 60B via a guide roller 94 arranged between the tape bending member 87 and the second polishing head 60B. The polishing tape 3 is turned back by the tape turning roller 92, thereby inverting the polishing tape 3. The polishing tape 3 is supplied to the second polishing head 60B so that the polishing surface of the polishing tape 3 faces the peripheral edge of the substrate W.

[0093] In one embodiment, the tape folding roller 92 may be incorporated into the second polishing head 60B and configured to fold (reverse) the polishing tape 3 within the second polishing head 60B so that the polishing surface of the polishing tape 3 faces the peripheral edge of the substrate W.

[0094] The polishing tape 3 used to polish the peripheral edge of the substrate W by the second polishing head 60B is fed to the tape bending member 88 via a guide roller 94 arranged between the second polishing head 60B and the tape bending member 88. The configuration of the tape bending member 88 in this embodiment is the same as the configuration of the tape bending member 26 described with reference to Figure 5, so a duplicated description will be omitted. The polishing tape 3 whose traveling direction has been changed by the tape bending member 88 is fed to the tape bending member 89 via a guide roller 94 arranged between the tape bending member 88 and the tape bending member 89.

[0095] The configuration of the tape bending member 89 in this embodiment is the same as the configuration of the tape bending member 27 described with reference to Figure 6, so a duplicated description will be omitted. The polishing tape 3, whose traveling direction has been changed by the tape bending member 89, is supplied to the third polishing head 60C via a guide roller 94 arranged between the tape bending member 89 and the third polishing head 60C. The polishing tape 3 is turned back by the tape turning roller 92, thereby inverting the polishing tape 3. The polishing tape 3 is supplied to the third polishing head 60C so that the polishing surface of the polishing tape 3 faces the peripheral edge of the substrate W.

[0096] In one embodiment, the tape folding roller 92 is incorporated into the third polishing head 60C and may be configured to fold (reverse) the polishing tape 3 within the third polishing head 60C so that the polishing surface of the polishing tape 3 faces the peripheral edge of the substrate W.

[0097] The polishing tape 3 used to polish the peripheral edge of the substrate W by the third polishing head 60C is fed to the tape bending member 90 via a guide roller 94 arranged between the third polishing head 60C and the tape bending member 90. The configuration of the tape bending member 90 in this embodiment is the same as the configuration of the tape bending member 28 described with reference to Figure 7, so a duplicated description will be omitted. The polishing tape 3 whose traveling direction has been changed by the tape bending member 90 is collected onto the tape take-up reel 82 via a guide roller 94 arranged between the tape bending member 90 and the tape take-up reel 82.

[0098] Although the tape bending members 85 to 90 in this embodiment are each a rod-shaped structure, the configuration of the tape bending members is not limited to this embodiment as long as the tape support parts can bend the polishing tape 3. For example, the tape bending members may be plate-shaped structures, or a single tape bending member may have multiple tape support parts and be configured to fold the polishing tape 3 multiple times by the single tape bending member.

[0099] In this embodiment, the tape bending members 85-90 are inclined at 45 degrees relative to the longitudinal direction of the polishing tape 3, but the angle of the tape bending members 85-90 relative to the longitudinal direction of the polishing tape 3 is not limited to this embodiment. The traveling direction of the polishing tape 3, which is changed by the tape bending members 85-90, can be adjusted by adjusting the angle of the tape bending members 85-90 relative to the longitudinal direction of the polishing tape 3.

[0100] 18, the polishing apparatus of this embodiment further includes tape cleaning nozzles 96, 97 that clean the polishing tape 3 with a fluid. The tape cleaning nozzle 96 is disposed downstream of the first polishing head 60A and upstream of the second polishing head 60B in the traveling direction of the polishing tape 3. The tape cleaning nozzle 97 is disposed downstream of the second polishing head 60B and upstream of the third polishing head 60C in the traveling direction of the polishing tape 3. The tape cleaning nozzles 96, 97 are configured to supply a fluid toward the polishing tape 3 to clean the polishing tape 3. Examples of the fluid supplied from the tape cleaning nozzles 96, 97 include a liquid such as pure water and a gas such as dry air.

[0101] The polishing tape 3 fed from the first polishing head 60A and the second polishing head 60B may have particles, such as polishing debris, attached thereto, generated when the substrate W is polished by the first polishing head 60A and the second polishing head 60B. The tape cleaning nozzle 96 removes particles from the polishing tape 3 before the polishing tape 3 is supplied to the second polishing head 60B. This prevents particles attached to the polishing tape 3 from adhering to the substrate W when the substrate W is polished by the second polishing head 60B. Similarly, the tape cleaning nozzle 97 removes particles from the polishing tape 3 before the polishing tape 3 is supplied to the third polishing head 60C. This prevents particles attached to the polishing tape 3 from adhering to the substrate W when the substrate W is polished by the third polishing head 60C.

[0102] In this embodiment, the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C have fixed inclination angles relative to the substrate holding surface 7a of the holding stage 7. Therefore, the polishing apparatus of this embodiment does not include a tilt mechanism for tilting the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C.

[0103] In this embodiment, the first polishing head 60A is configured to polish an area including a top edge portion E1 of the peripheral edge of the substrate W, the second polishing head 60B is configured to polish an area including a bevel portion B of the peripheral edge of the substrate W, and the third polishing head 60C is configured to polish an area including a bottom edge portion E2 of the peripheral edge of the substrate W. The pressing member of the first polishing head 60A has a first shape corresponding to the target polishing shape of the top edge portion E1 of the substrate W. The pressing member of the second polishing head 60B has a second shape corresponding to the target polishing shape of the bevel portion B of the substrate W. The pressing member of the third polishing head 60C has a third shape corresponding to the target polishing shape of the bottom edge portion E2 of the substrate W.

[0104] The first polishing head 60A can polish the area including the top edge portion E1 of the substrate W to the target polishing shape by pressing the polishing tape 3 with a pressing member having a first shape corresponding to the target polishing shape of the top edge portion E1 of the substrate W. The second polishing head 60B can polish the area including the bevel portion B of the substrate W to the target polishing shape by pressing the polishing tape 3 with a pressing member having a second shape corresponding to the target polishing shape of the bevel portion B of the substrate W. The third polishing head 60C can polish the area including the bottom edge portion E2 of the substrate W to the target polishing shape by pressing the polishing tape 3 with a pressing member having a third shape corresponding to the target polishing shape of the bottom edge portion E2 of the substrate W.

[0105] According to this embodiment, the polishing tape supply mechanism 80 is configured to supply the polishing tape 3 to all of the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C, and a single polishing tape supply mechanism 80 is provided for the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C. Therefore, the number of polishing tape supply mechanisms relative to the number of polishing heads can be reduced. As a result, space saving of the polishing apparatus can be achieved, and maintenance costs for the polishing tape supply mechanisms can be reduced.

[0106] Furthermore, according to this embodiment, the pressing members of the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C have first, second, and third shapes corresponding to the polishing target shapes of the top edge portion E1, the bevel portion B, and the bottom edge portion E2, which differ in the thickness direction of the peripheral edge of the substrate W. Therefore, the peripheral edge of the substrate W can be polished without tilting the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C, and therefore there is no need to provide a tilt mechanism for each of the first polishing head 60A, the second polishing head 60B, and the third polishing head 60C. As a result, the polishing apparatus can be made more compact and the maintenance costs of the tilt mechanisms can be reduced.

[0107] Furthermore, by not providing a tilt mechanism, it is possible to narrow the distance between the first polishing head 60A and the second polishing head 60B and the distance between the second polishing head 60B and the third polishing head 60C. As a result, the routing distance of the polishing tape 3 from the first polishing head 60A to the second polishing head 60B and from the second polishing head 60B to the third polishing head 60C is shortened, and the device configuration (such as the number of guide rollers 94 between the polishing heads) can be simplified.

[0108] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims. [Explanation of symbols]

[0109] 3 Polishing tape 3A No. 1 Polishing Tape 3B 2nd Polishing Tape 3C 3rd Polishing Tape 5 Board holding part 7 Holding Stage 7a Board holding surface 8 shafts 9. Holding stage drive mechanism 10A 1st Polishing Head 10B Second Polishing Head 12A, 12B Pressing member 15 Air cylinder (actuator) 20 Polishing tape supply mechanism 21 Tape unwinding reel 22 Tape take-up reel 23,24 Reel motor 25, 26, 27, 28 Tape bending member 30 Tape folding roller 32 Guide roller 34,35 Tape cleaning nozzle 41 Lower supply nozzle 42 Upper supply nozzle 50A 1st tilt mechanism 50B Second tilt mechanism 52 Tilt arm 53 Arm rotation device 60A No. 1 Polishing Head 60B Second Polishing Head 60C 3rd Polishing Head 62A, 62B, 62C pressing members 65 Air cylinder (actuator) 70A First Polishing Tape Supply Mechanism 70B Second polishing tape supply mechanism 70C 3rd polishing tape supply mechanism 71 Tape unwinding reel 72 Tape take-up reel 73,74 Reel motor 76 Guide roller 78 Reelbase 80 Polishing tape supply mechanism 81 Tape unwinding reel 82 Tape take-up reel 83,84 Reel motor 85, 86, 87, 88, 89, 90 Tape bending members 92 Tape folding roller 94 Guide Roller 96,97 Tape cleaning nozzle 100 Operation control section 100a Storage device 100b arithmetic unit

Claims

1. A polishing apparatus for polishing a peripheral portion of a substrate, comprising: a substrate holder that holds and rotates the substrate; a first polishing head that presses a polishing tape against the peripheral edge of the substrate; a second polishing head disposed downstream of the first polishing head in the advancing direction of the polishing tape and configured to press the polishing tape against the peripheral edge of the substrate; a polishing tape supply mechanism that feeds the polishing tape in its longitudinal direction and supplies the polishing tape to both the first polishing head and the second polishing head; The polishing tape supply mechanism includes: a tape unwinding reel disposed upstream of the first polishing head in the advancing direction of the polishing tape; a polishing apparatus comprising a tape take-up reel disposed downstream of the second polishing head in the advancing direction of the polishing tape;

2. 2. The polishing apparatus according to claim 1, further comprising a tape cleaning nozzle arranged downstream of the first polishing head and upstream of the second polishing head in the direction of travel of the polishing tape, for cleaning the polishing tape with a fluid.

3. the polishing tape supply mechanism has a tape bending member disposed obliquely with respect to the longitudinal direction of the polishing tape, 2. The polishing apparatus according to claim 1, wherein the tape bending member is disposed between the first polishing head and the second polishing head in the advancing direction of the polishing tape.

4. an operation control unit for controlling operations of the first polishing head and the second polishing head; 2. The polishing apparatus of claim 1, wherein the operation control unit is configured to cause the first polishing head and the second polishing head to press the polishing tape against the peripheral portion of the substrate while the polishing tape is fed a predetermined length, and then to stop the first polishing head and the second polishing head from pressing the polishing tape against the substrate until the used portion of the polishing tape is fed downstream of the second polishing head in the direction of travel of the polishing tape.

5. 5. The polishing apparatus according to claim 4, wherein the predetermined length is equal to or less than the length of the polishing tape from the first polishing head to the second polishing head.

6. 2. The polishing apparatus according to claim 1, wherein the first polishing head and the second polishing head are configured to press two different areas of the polishing tape in a width direction against the peripheral edge of the substrate, respectively.

7. the peripheral portion of the substrate includes a first region and a second region that are different in a thickness direction of the substrate; a pressing member of the first polishing head having a first shape corresponding to a polishing target shape of the first region; 2. The polishing apparatus according to claim 1, wherein the pressing member of said second polishing head has a second shape corresponding to a target shape of polishing of said second region.

8. a third polishing head disposed downstream of the second polishing head in the advancing direction of the polishing tape and pressing the polishing tape against the peripheral edge of the substrate; the polishing tape supply mechanism is configured to supply the polishing tape to the first polishing head, the second polishing head, and the third polishing head; the take-up reel is disposed downstream of the third polishing head in the advancing direction of the polishing tape, the peripheral portion of the substrate further includes a third region in a thickness direction of the substrate, the third region being different from the first region and the second region; the pressing member of the third polishing head has a third shape corresponding to the polishing target shape of the third area, one of the first region, the second region, and the third region includes a top edge portion of the substrate; the other of the first region, the second region, and the third region includes a bevel portion of the substrate; 8. The polishing apparatus according to claim 7, wherein the remaining one of the first region, the second region, and the third region includes a bottom edge portion of the substrate.

9. A polishing apparatus for polishing a peripheral portion of a substrate, comprising: a substrate holder that holds and rotates the substrate; a first polishing head that presses a first polishing tape against the peripheral edge of the substrate; a second polishing head that presses a second polishing tape against the peripheral edge of the substrate; the peripheral portion of the substrate includes a first region and a second region that are different in a thickness direction of the substrate; a pressing member of the first polishing head having a first shape corresponding to a polishing target shape of the first region; A polishing apparatus, wherein the pressing member of the second polishing head has a second shape corresponding to a polishing target shape of the second region.

10. a third polishing head that presses a third polishing tape against the peripheral edge of the substrate; the peripheral portion of the substrate further includes a third region in a thickness direction of the substrate, the third region being different from the first region and the second region; the pressing member of the third polishing head has a third shape corresponding to the polishing target shape of the third area, one of the first region, the second region, and the third region includes a top edge portion of the substrate; the other of the first region, the second region, and the third region includes a bevel portion of the substrate; 10. The polishing apparatus of claim 9, wherein the remaining one of the first region, the second region, and the third region includes a bottom edge portion of the substrate.

11. A method for polishing a peripheral portion of a substrate, comprising: The substrate is held and rotated by a substrate holder; A polishing method in which a polishing tape is fed in its longitudinal direction by a polishing tape supply mechanism, a first polishing head presses the polishing tape against the peripheral edge of the substrate, and a second polishing head arranged downstream of the first polishing head in the direction of advance of the polishing tape presses the polishing tape against the peripheral edge of the substrate.

12. 12. The polishing method according to claim 11, further comprising cleaning the polishing tape with a fluid using a tape cleaning nozzle located downstream of the first polishing head and upstream of the second polishing head in the direction of travel of the polishing tape.

13. 12. The polishing method according to claim 11, wherein the polishing tape is bent by a tape bending member disposed obliquely with respect to the longitudinal direction of the polishing tape while being fed from the first polishing head to the second polishing head.

14. 12. The polishing method of claim 11, wherein the first polishing head and the second polishing head press the polishing tape against the peripheral portion of the substrate while the polishing tape is fed a predetermined length, and then the first polishing head and the second polishing head stop pressing the polishing tape against the substrate until the used portion of the polishing tape is fed downstream of the second polishing head in the direction of travel of the polishing tape.

15. 15. The polishing method according to claim 14, wherein the predetermined length is equal to or less than the length of the polishing tape from the first polishing head to the second polishing head.

16. The polishing method according to claim 11 , wherein the first polishing head and the second polishing head press two different areas in the width direction of the polishing tape against the peripheral edge of the substrate, respectively.

17. the peripheral portion of the substrate includes a first region and a second region that are different in a thickness direction of the substrate; a pressing member of the first polishing head having a first shape corresponding to a polishing target shape of the first region; 12. The polishing method according to claim 11, wherein the pressing member of the second polishing head has a second shape corresponding to a target shape for polishing of the second region.

18. The method further includes pressing the polishing tape against the peripheral edge of the substrate by a third polishing head disposed downstream of the second polishing head in the advancing direction of the polishing tape, the peripheral portion of the substrate further includes a third region in a thickness direction of the substrate, the third region being different from the first region and the second region; the pressing member of the third polishing head has a third shape corresponding to the polishing target shape of the third area, one of the first region, the second region, and the third region includes a top edge portion of the substrate; the other of the first region, the second region, and the third region includes a bevel portion of the substrate; 20. The polishing method of claim 17, wherein the remaining one of the first region, the second region, and the third region comprises a bottom edge portion of the substrate.

19. A method for polishing a peripheral portion of a substrate, comprising: The substrate is held and rotated by a substrate holder; a first polishing head pressing a first polishing tape against the peripheral edge of the substrate; pressing a second polishing tape against the peripheral edge of the substrate by a second polishing head; the peripheral portion of the substrate includes a first region and a second region that are different in a thickness direction of the substrate; a pressing member of the first polishing head having a first shape corresponding to a polishing target shape of the first region; A polishing method, wherein the pressing member of the second polishing head has a second shape corresponding to a polishing target shape of the second region.

20. pressing a third polishing tape against the peripheral edge of the substrate with a third polishing head; the peripheral portion of the substrate further includes a third region in a thickness direction of the substrate, the third region being different from the first region and the second region; the pressing member of the third polishing head has a third shape corresponding to the polishing target shape of the third area, one of the first region, the second region, and the third region includes a top edge portion of the substrate; the other of the first region, the second region, and the third region includes a bevel portion of the substrate; 20. The polishing method of claim 19, wherein the remaining one of the first region, the second region, and the third region comprises a bottom edge portion of the substrate.

Images