Inductor component

Abstract

To provide an inductor component capable of suppressing a variation and an increase in direct current resistance.SOLUTION: An inductor component includes: a first conductor layer located on a first virtual plane; a first inductor wiring that is provided on the first conductor layer and that extends around a first turning axis along a first direction intersecting with the first virtual plane; and a first interlayer insulating layer that is in contact with the first conductor layer and that is located on a side opposite to the first inductor wiring with respect to the first conductor layer in the first direction. The first conductor layer includes a first body portion that extends around the first turning axis, and a first protruding portion that extends from the first body portion in a direction approaching the first turning axis, and the first protruding portion does not extend in the shortest distance from a connection portion with the body portion toward an end portion of the first interlayer insulating layer when viewed along the first direction.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to inductor components. [Background technology]

[0002] Patent Document 1 discloses a coil component including a substrate and a coil formed by plating on a main surface of the substrate. In the coil component of Patent Document 1, a seed pattern for plating the coil is formed on the substrate. The seed pattern includes a spiral pattern and a conductive pattern extending from the spiral pattern toward the outside of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-103591 Summary of the Invention [Problem to be solved by the invention]

[0004] In the coil component of Patent Document 1, the conductive pattern extends straight in a direction perpendicular to the side surface of the substrate, so the wiring may be corroded and dissolved by an etching solution during manufacturing. If the wiring dissolves during manufacturing, the DC resistance of the coil component may vary or increase.

[0005] An object of the present disclosure is to provide an inductor component that can suppress variations and increases in DC resistance. [Means for solving the problem]

[0006] An inductor component according to one aspect of the present disclosure includes: a first conductor layer located on a first imaginary plane; a first inductor wiring provided on the first conductor layer and extending around a first pivot axis along a first direction intersecting the first imaginary plane; a first interlayer insulating layer that is in contact with the first conductor layer and is located on the opposite side of the first conductor layer from the first inductor wiring in the first direction; Equipped with The first conductor layer is a first main body portion extending about the first pivot axis; a first protrusion extending from the first main body portion in a direction approaching the first pivot shaft; Including, When viewed along the first direction, the first protrusion does not extend the shortest distance from the connection portion with the main body toward the end of the first interlayer insulating layer. [Effects of the Invention]

[0007] According to the inductor component of the above aspect, variations and increases in DC resistance can be suppressed. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view illustrating an inductor component according to one embodiment of the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] 2 is a schematic plan view illustrating layers of a first inductor wiring and a third inductor wiring of the inductor component of FIG. 1. FIG. [Figure 4] 2 is a schematic plan view illustrating layers of a second inductor wiring and a fourth inductor wiring of the inductor component of FIG. 1; [Figure 5] FIG. 2 is a first diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 6] FIG. 2 is a second diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 7] FIG. 3 is a third diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 8] FIG. 4 is a fourth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 9] 1. FIG. 5 is a fifth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 10]FIG. 6 is a sixth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 11] 7 is a seventh diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 12] 8 is an eighth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 13] 9 is a ninth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 14] FIG. 19 is a tenth diagram illustrating an example of a method for manufacturing the inductor component of FIG. [Figure 15] FIG. 2 is a perspective view showing a first modified example of the inductor component of FIG. [Figure 16] FIG. 2 is an enlarged side view showing a second modified example of the inductor component of FIG. [Figure 17] FIG. 2 is a schematic plan view showing a third modified example of the inductor component of FIG. [Figure 18] FIG. 10 is a schematic plan view showing a fourth modified example of the inductor component of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Various aspects of the present disclosure will now be described.

[0010] The inductor component of the first aspect comprises: a first conductor layer located on a first imaginary plane; a first inductor wiring provided on the first conductor layer and extending around a first pivot axis along a first direction intersecting the first imaginary plane; a first interlayer insulating layer that is in contact with the first conductor layer and is located on the opposite side of the first conductor layer from the first inductor wiring in the first direction; Equipped with The first conductor layer is a first main body portion extending about the first pivot axis; a first protrusion extending from the first main body portion in a direction approaching the first pivot shaft; Including, When viewed along the first direction, the first protrusion does not extend the shortest distance from the connection portion with the main body toward the end of the first interlayer insulating layer.

[0011] The inductor component of the second aspect is the inductor component of the first aspect, an element body including a magnetic material, the first conductor layer and the first inductor wiring being located therein; the element body has therein a first region closer to the first pivot axis than the first inductor wiring and a second region farther from the first pivot axis than the first inductor wiring; The magnetic material is located in the first region and the second region.

[0012] The inductor component of a third aspect is the inductor component of the second aspect, a first insulating layer located inside the element body and in contact with a side surface of the first inductor wiring that intersects with a second direction that intersects with the first direction, an end of the first protrusion in the first direction that is closer to the first inductor wiring is in contact with the first insulating layer; Of both ends of the first protrusion in the extending direction of the first protrusion, the end farther from the first main body portion is in contact with the magnetic material.

[0013] An inductor component of a fourth aspect is the inductor component of any one of the first to third aspects, wherein: the first conductor layer has a thickness in the first direction that is less than 1.0 μm; The thickness of the first conductor layer is smaller than 1 / 100 of the thickness of the first inductor wiring.

[0014] An inductor component of a fifth aspect is the inductor component of any one of the first to fourth aspects, a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; a second inductor wiring provided on the second conductor layer, positioned between the first conductor layer and the second conductor layer, and extending around a second pivot axis along the first direction; a second interlayer insulating layer that is in contact with the second conductor layer and is located on the opposite side of the second conductor layer from the second inductor wiring in the first direction; Equipped with The second conductor layer is a second body portion extending about the second pivot axis; a second protrusion extending from the second main body portion in a direction approaching the second pivot shaft; Including, When viewed along the first direction, the second protruding portion does not extend the shortest distance from a connection portion with the main body portion toward an end of the second interlayer insulating layer, the first inductor wiring has a first input section connected to a first input element and a first output section connected to an output element; the second inductor wiring has a second input section connected to a second input element different from the first input element, and a second output section connected to the output element, When viewed along the first direction, the first input section and the second input section are spaced apart in a second direction that intersects the first direction, and the first output section and the second output section are adjacent to each other.

[0015] An inductor component of a sixth aspect is the inductor component of any one of the first to fourth aspects, The first conductor layer is a pull-out portion extending from the first main body portion in a second direction intersecting the first direction and away from the first pivot shaft, or in the second direction and toward the first pivot shaft, When viewed along the first direction, the size of the lead-out portion in a direction intersecting the direction in which the lead-out portion extends is defined as the width of the lead-out portion, and the size of the first inductor wiring in a direction intersecting the direction in which the first inductor wiring extends is defined as the width of the first inductor wiring, The width of the lead-out portion is greater than the width of the first inductor wiring.

[0016] An inductor component of a seventh aspect is the inductor component of the second aspect, an external terminal provided on an outer surface of the element body that intersects with the first direction; a vertical wiring located inside the element body; Equipped with The vertical wiring is When viewed along the first direction, the inductor wiring is positioned so as not to overlap with the first region and the second region, is in contact with the magnetic material of the base body in a second direction intersecting the first direction, and extends in the first direction to connect the first inductor wiring and the external terminal.

[0017] An inductor component of an eighth aspect is the inductor component of any one of the first to fourth aspects, wherein: The first conductor layer is a pull-out portion extending from the first main body portion in a second direction intersecting the first direction and in a direction approaching the first pivot shaft, The drawer portion is The contact hole is provided at a portion of the first body portion that faces the first pivot shaft in the second direction and is farthest from the first pivot shaft.

[0018] An inductor component of a ninth aspect is the inductor component of any one of the first to eighth aspects, a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; a second inductor wiring provided on the second conductor layer, positioned between the first conductor layer and the second conductor layer, and extending around a second pivot axis along the first direction; a second interlayer insulating layer that is in contact with the second conductor layer and is located on the opposite side of the second conductor layer from the second inductor wiring in the first direction; Equipped with The second conductor layer is a second main body portion positioned around the second pivot axis; a second protrusion extending from the second main body portion in a direction approaching the second pivot shaft; Including, When viewed along the first direction, the second protruding portion does not extend the shortest distance from a connection portion with the main body portion toward an end of the second interlayer insulating layer, The first conductor layer is a first drawer portion extending from the first main body portion in a direction away from the first pivot axis along a second direction intersecting the first direction, The second conductor layer is an inductor component including a second lead portion extending from the second body portion in a direction away from the second pivot axis along the second direction, a second insulating layer in contact with an end of the first lead portion in the first direction that is closer to the first inductor wiring; a third insulating layer in contact with an end of the second lead portion in the first direction that is closer to the second inductor wiring; Equipped with When viewed along the first direction, the first draw-out portion and the second draw-out portion are in an overlapping position, the third insulating layer is the same size as or smaller than the second insulating layer, and the second insulating layer overlaps the entire third insulating layer.

[0019] An inductor component of a tenth aspect is the inductor component of any one of the first to fourth aspects, an element body in which the first conductor layer and the first inductor wiring are located; the element body has a side surface that intersects with a second direction that intersects with the first direction, The first conductor layer is a drawer portion extending from the first body portion in the second direction and in a direction away from the first pivot axis, Of both ends of the lead portion in the second direction, the tip end farther from the first body portion is exposed from the side surface and is in contact with at least one insulating layer.

[0020] An inductor component of an eleventh aspect is the inductor component of any one of the first to fourth aspects, The first conductor layer is a pull-out portion extending from the first main body portion in a second direction intersecting the first direction and away from the first pivot shaft, or in the second direction and toward the first pivot shaft, The drawer has at least one opening.

[0021] An inductor component of a twelfth aspect is the inductor component of any one of the first to eleventh aspects, wherein: an element body in which the first conductor layer and the first inductor wiring are located; the element body has a side surface that intersects with a second direction that intersects with the first direction, the first conductor layer has a plurality of lead portions provided in a portion extending parallel to the side surface of the first body portion, Each of the plurality of drawer portions extends from the first body portion in the second direction away from the first pivot axis or in the second direction toward the first pivot axis.

[0022] An inductor component of a thirteenth aspect is the inductor component of any one of the first to twelfth aspects, wherein: When viewed along the first direction, the first imaginary line and a second imaginary line extending in the direction in which the first inductor wiring extends form an angle other than a right angle.

[0023] An inductor component of a fourteenth aspect is the inductor component of any one of the first to thirteenth aspects, wherein: a third conductor layer located on the first imaginary plane; a third inductor wiring provided in the third conductor layer and extending around a third pivot axis along the first direction; Equipped with The first conductor layer is a first drawer portion extending from the first main body portion in a direction away from the first pivot axis along a second direction intersecting the first direction, The third conductor layer is a third main body portion positioned around the third pivot axis; a second drawer portion extending from the third main body portion in a direction away from the third pivot shaft along the second direction; Including, the first conductor layer and the second conductor layer are spaced apart from each other in a second direction intersecting the first direction; the first lead portion is provided in a portion of the first body portion other than a portion facing the third conductor layer, The third lead portion is provided in a portion of the third main body other than the portion facing the first conductor layer.

[0024] The inductor component of a fifteenth aspect is a first conductor layer located on a first imaginary plane; a first inductor wiring provided on the first conductor layer and extending around a first pivot axis along a first direction intersecting the first imaginary plane; an element body including a magnetic material, the first conductor layer and the first inductor wiring being located therein; Equipped with the element body has a side surface that intersects with a second direction that intersects with the first direction, The first conductor layer is a first main body portion extending about the first pivot axis; a protrusion extending from the first main body portion in a direction forming an angle with respect to a third imaginary line perpendicular to the side surface and in a direction away from the first pivot axis; Includes.

[0025] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The following description does not limit the present disclosure, but is merely exemplary in nature, and can be modified as appropriate without departing from the spirit of the present disclosure. The drawings are schematic, and the ratios of the dimensions do not necessarily correspond to the actual ones. In the following description, terms such as "about," "approximately," or "substantially" mean that the values, shapes, etc. following these terms include an acceptable range of error as determined by a person skilled in the art.

[0026] As shown in FIGS. 1 and 2 , the inductor component 1 of the present disclosure includes a first conductor layer 11 and a first inductor wiring 21. The first conductor layer 11 extends (is located) on a first imaginary plane S1. The first inductor wiring 21 is provided on the first conductor layer 11 and extends along the first imaginary plane S1. The first inductor wiring 21 is located around a first pivot axis A1 that intersects (e.g., is perpendicular to) the first imaginary plane S1. As an example, the first imaginary plane S1 is located at the boundary between the first conductor layer 11 and the first inductor wiring 21.

[0027] In this embodiment, as shown in Figures 1 to 4, the inductor component 1 comprises an approximately rectangular parallelepiped body 2, a second conductor layer 12, a third conductor layer 13, a fourth conductor layer 14, a second inductor wiring 22, a third inductor wiring 23, and a fourth inductor wiring 24.

[0028] As shown in FIG. 2, the second conductor layer 12 extends (is located) on a second imaginary plane S2 adjacent to and parallel to the first imaginary plane S1. The first inductor wiring 21 is located between the first conductor layer 11 and the second conductor layer 12 in a first direction (e.g., the Z direction) intersecting the first imaginary plane S1 and the second imaginary plane S2. Here, the phrase "the second imaginary plane S2 is adjacent to and parallel to the first imaginary plane S1" means that the first imaginary plane S1 and the second imaginary plane S2 are parallel to each other and the second imaginary plane S2 is located at a distance in a direction perpendicular to the first imaginary plane S1. The second inductor wiring 22 is provided on the second conductor layer 12 and extends along the second imaginary plane S2. The second inductor wiring 22 is located around a second pivot axis A2 intersecting (e.g., perpendicular to) the second imaginary plane S2, with the second conductor layer 12 located between the first inductor wiring 21 and the second inductor wiring 22 in the first direction Z. As an example, the second imaginary plane S2 is located at the boundary between the second conductor layer 12 and the second inductor wiring 22.

[0029] The element body 2 has dimensions of, for example, 1.2 × 2.1 × 0.55 mm. The third conductor layer 13 is located on a first imaginary plane S1 and is electrically independent of the first conductor layer 11. The fourth conductor layer 14 is located on a second imaginary plane S2 and is electrically independent of the second conductor layer 12. The third inductor wiring 23 is provided on the third conductor layer 13. The fourth inductor wiring 24 is provided on the fourth conductor layer 14. The third inductor wiring 23 extends along the first imaginary plane S1. The fourth inductor wiring 24 extends along the second imaginary plane S2. The layers of the first inductor wiring 21 and the third inductor wiring 23 are located between the first imaginary plane S1 and the second imaginary plane S2, and the layers of the second inductor wiring 22 and the fourth inductor wiring 24 are located between the second imaginary plane S2 and a main surface 202 of the element body 2, which will be described later.

[0030] The element body 2 includes a magnetic material (magnetic layer) 201, and includes a first conductor layer 11, a second conductor layer 12, a third conductor layer 13, a fourth conductor layer 14, a first inductor wiring 21, a second inductor wiring 22, a third inductor wiring 23, and a fourth inductor wiring 24 located therein. As shown in FIG. 2, the element body 2 has an outer surface (hereinafter referred to as a main surface 202) that intersects with the first direction Z. As shown in FIG. 1, the main surface 202 is provided with a plurality of external terminals (six external terminals 101 to 106 in this embodiment) and an insulating layer 76. The insulating layer 76 has a thickness of, for example, 10 μm. In this embodiment, the second inductor wiring 22 is located closest to the main surface 202 (i.e., the external terminal 101) in the first direction Z. Each of the external terminals 101 to 106 is formed of, for example, a laminate of Cu / Ni / Au (=5 / 5 / 0.1 μm).

[0031] 3, when viewed along the first direction Z, the third conductor layer 13 is positioned symmetrically to the first conductor layer 11 with respect to a first center line CL1 that extends on the first imaginary plane S1 in the short-side direction of the inductor component 1 (for example, the X direction), and has a shape symmetrical to the first conductor layer 11 with respect to the first center line CL1. The third inductor wiring 23 is positioned symmetrical to the first inductor wiring 21 with respect to the first center line CL1, and has a shape symmetrical to the first inductor wiring 21 with respect to the first center line CL1. The third inductor wiring 23 extends around a third pivot axis A3 that is positioned symmetrical to the first pivot axis A1 with respect to the first center line CL1.

[0032] 4, when viewed along the first direction Z, the fourth conductor layer 14 is positioned symmetrically to the second conductor layer 12 with respect to a second center line CL2 that extends in the short direction X on the second imaginary plane S2, and has a shape symmetrical to the second conductor layer 12 with respect to the second center line CL2. The fourth inductor wiring 24 is positioned symmetrical to the second inductor wiring 22 with respect to the second center line CL2, and has a shape symmetrical to the second inductor wiring 22 with respect to the second center line CL2. The fourth inductor wiring 24 extends around a fourth pivot axis A4 that is positioned symmetrical to the second pivot axis A2 with respect to the second center line CL2.

[0033] For example, the first pivot axis A1 and the second pivot axis A2 are located on the same line (see FIG. 2), and the third pivot axis A3 and the fourth pivot axis A4 are located on the same line. The first center line CL1 and the second center line CL2 are located at approximately the center of the inductor component 1 in the longitudinal direction (e.g., the Y direction) when viewed along the first direction Z.

[0034] 3, the first inductor wiring 21 has a spiral shape when viewed in the first direction Z, for example. The first pivot axis A1 is located at the center of the outer shape of the first inductor wiring 21, for example. Vias 51 and 52 are connected to both ends of the first inductor wiring 21 in the direction in which the first inductor wiring 21 extends, respectively. The first inductor wiring 21 is formed of, for example, an L / S / t (=100 / 10 / 150 μm) laminate.

[0035] The first inductor wiring 21 has a first portion 211 to a seventh portion 217 .

[0036] The first portion 211 extends from an end portion located near the first pivot axis A1 to which the via 51 is connected in a direction away from the first center line CL1 along the longitudinal direction Y. As an example, the portion of the first portion 211 to which the via 51 is connected constitutes a first output portion.

[0037] The second portion 212 extends in the short direction X from one of both ends of the first portion 211 in the longitudinal direction Y that is farther from the first center line CL1.

[0038] The third portion 213 extends from one of both ends of the second portion 212 in the short-side direction X that is farther from the first portion 211 along the longitudinal direction Y in a direction approaching the first center line CL1.

[0039] The fourth portion 214 extends from one of the ends of the third portion 213 in the longitudinal direction Y that is farther from the second portion 212 in the short direction X toward the first portion 211.

[0040] The fifth portion 215 extends from one of both ends of the fourth portion 214 in the short-side direction X that is farther from the third portion 213 along the longitudinal direction Y in a direction away from the first center line CL1. The fifth portion 215 is located farther from the first pivot axis A1 in the short-side direction X than the first portion 211, and when viewed from the first pivot axis A1 in the short-side direction X, a part of the fifth portion 215 overlaps with the first portion 211. The fifth portion 215 and the first portion 211 are insulated from each other.

[0041] The sixth portion 216 extends from one of the ends of the fifth portion 215 in the longitudinal direction Y that is farther from the fourth portion 214 in the short direction X toward the third portion 213. The sixth portion 216 is located farther from the first pivot axis A1 in the longitudinal direction Y than the second portion 212, and when viewed from the first pivot axis A1 along the longitudinal direction Y, a part of the sixth portion 216 overlaps with the second portion 212. The sixth portion 216 and the second portion 212 are insulated from each other.

[0042] The seventh portion 217 extends from one of the ends of the sixth portion 216 in the short-side direction X that is farther from the fifth portion 215 along the longitudinal direction Y in a direction approaching the first center line CL1. The seventh portion 217 is located farther from the first pivot axis A1 in the short-side direction X than the third portion 213, and when viewed from the first pivot axis A1 along the short-side direction X, a portion of the seventh portion 217 overlaps with the third portion 213. The seventh portion 217 and the third portion 213 are insulated from each other. A via 52 is connected to one of the ends of the seventh portion 217 in the long-side direction Y that is closer to the first center line CL1. As an example, the portion of the seventh portion 217 to which the via 52 is connected configures a first input section.

[0043] The first conductor layer 11 includes a first main body portion 111 extending (positioned) around the first pivot axis A1, and a protrusion 112 (an example of a first protrusion) provided on the first main body portion 111. In this embodiment, the first main body portion 111 has substantially the same shape as the first inductor wiring 21 when viewed along the first direction Z, and the entire first main body portion 111 overlaps with the first inductor wiring 21.

[0044] As shown in FIG. 3 , the protrusion 112 is configured to extend from the first main body 111 toward the first pivot axis A1 not via the shortest route but via a deviated route (i.e., a roundabout route). When viewed along the first direction Z, the protrusion 112 does not extend the shortest distance D1 from the connection portion 1123 with the first main body 111 toward the end of the insulating layer 71. As an example, the end of the insulating layer 71 is located at the boundary between the insulating layer 71 and the insulating material 201 in the first region B1. The protrusion 112 is configured so that the dimension in the extension direction of the protrusion 112 is greater than the shortest distance D1. In this embodiment, the protrusion 112 is configured to extend from the first main body 111 in a direction intersecting a first imaginary straight line L1 passing through the connection portion 1123 with the first main body 111 and the first pivot axis A1, toward the first pivot axis A1. In this embodiment, the protruding portion 112 includes an extending portion 1121 and a curved portion 1122. When viewed in the first direction Z, the extending portion 1121 extends from a portion of the first main body portion 111 that overlaps with the first portion 211 of the first inductor wiring 21 in the longitudinal direction Y toward the first center line CL1. The curved portion 1122 curves from one of both ends of the extending portion 1121 in the longitudinal direction Y that is closer to the first center line CL1 toward the first pivot axis A1. In other words, the first inductor wiring 21 and the protruding portion 112 form an angle other than a right angle.

[0045] In this embodiment, of the two ends of the protruding portion 112 in the direction in which the protruding portion 112 extends, the end farther from the first main body portion 111 (i.e., of the two ends of the curved portion 1122 in the direction in which the curved portion 1122 extends, the end closer to the first pivot axis A1) is in contact with the magnetic material 201 of the element body 2 located in a first region B1, which will be described later. Of the two ends of the protruding portion 112 in the first direction Z, the end closer to the first inductor wiring 21 is in contact with an insulating layer 77 (an example of a first insulating layer). The insulating layer 77 is in contact with a first side surface 2101 of the first inductor wiring 21 that is located near the first pivot axis A1 in the second direction (e.g., the short-side direction X), among the side surfaces that intersect with the second direction (e.g., the short-side direction X). The first main body portion 111 and the protruding portion 112 may be made of the same material or different materials. The second direction may be any direction that intersects with the first direction, such as the short-side direction X or the long-side direction Y, or a direction having components or vectors in both the short-side direction X and the long-side direction Y.

[0046] Contact with the magnetic material 201 refers to contact with a portion of the material constituting the magnetic material 201. When the magnetic material 201 is formed, for example, of a composite of resin and inorganic filler (e.g., a composite of epoxy and FeSiCr), the tip of the first main body portion 111 contacts at least one of the resin and inorganic filler of the magnetic material 201. The resin contained in the magnetic material 201 includes, for example, epoxy, acrylic, liquid crystal polymer, phenol, and combinations thereof, and is responsible for the strength and good insulating properties of the element body 2. The inorganic filler contained in the magnetic material 201 includes, for example, metal magnetic powder (e.g., Fe, FeSi-based, FeSiCr-based, FeNi-based, etc., containing Fe as the main component). In this case, the magnetic material 201 has high magnetic permeability and high magnetic saturation density. The inorganic filler does not need to be a single type of magnetic powder; it may be a combination of magnetic powders with different compositions and particle sizes, or it may contain an insulating filler such as silica to ensure a linear expansion coefficient and insulating properties.

[0047] As shown in FIG. 3, in this embodiment, the first conductor layer 11 includes three lead portions 151, 152, and 153.

[0048] When viewed along the first direction Z, the lead-out portion 151 extends in the second direction (e.g., the longitudinal direction Y) and in a direction approaching the first pivot axis A1 from a portion of the first main body portion 111 that overlaps with the fourth portion 214 of the first inductor wiring 21. The portion of the first main body portion 111 where the lead-out portion 151 is provided is the portion of the first main body portion 111 that faces the first pivot axis A1 in the second direction (e.g., the longitudinal direction Y) and is farthest from the first pivot axis A1.

[0049] Of both ends of the lead portion 151 in the longitudinal direction Y, the tip end farther from the first main body portion 111 is in contact with the magnetic material 201 located in the first region B1, which will be described later.

[0050] When viewed along the first direction Z, the drawn-out portion 152 extends from a portion of the first main body portion 111 that overlaps with the seventh portion 217 of the first inductor wiring 21 in the second direction (e.g., the short-side direction X) and in a direction away from the first pivot axis A1.

[0051] When viewed along the first direction Z, the draw-out portion 153 extends from the portion of the first main body portion 111 that overlaps with the fifth portion 215 of the first inductor wiring 21 in the second direction (e.g., the short-side direction X) and away from the first pivot axis A1, in the direction opposite to the draw-out portion 152.

[0052] Of both ends of the lead portion 152 in the short-side direction X, the tip end farther from the first main body portion 111 is exposed from a side surface 204 of the element body 2. The side surface 204 faces the seventh portion 217 of the first inductor wiring 21 in the short-side direction X and extends along the longitudinal direction Y. Of both ends of the lead portion 153 in the short-side direction X, the tip end farther from the first main body portion 111 is exposed from a side surface 205 of the element body 2. The side surface 205 faces the fifth portion 215 of the first inductor wiring 21 in the short-side direction X and extends along the longitudinal direction Y.

[0053] For example, the "width of the lead-out portions 151 and 152" and the "width of the first inductor wiring 21" are defined as follows: In this case, the width of the lead-out portions 151 and 152 is larger than the width of the first inductor wiring 21. When viewed along the first direction Z, the size of the draw-out portions 151, 152 in a direction intersecting the direction in which the draw-out portions 151, 152 extend (for example, in the case of the draw-out portion 151, the short-side direction X, and in the case of the draw-out portion 152, the long-side direction Y) is defined as the "width of the draw-out portions 151, 152." The size of the first inductor wiring 21 in a direction intersecting the direction in which the first inductor wiring 21 extends is defined as the "width of the first inductor wiring 21."

[0054] As shown in FIG. 3 , the element body 2 has therein a first region B1 that is closer to the first pivot axis A1 than the first inductor wiring 21, and a second region B2 that is farther from the first pivot axis A1 than the first inductor wiring 21. In this embodiment, the first region B1 is surrounded by the first portion 211 to the fifth portion 215 of the first inductor wiring 21 when viewed along the first direction Z. A magnetic material 201 and a non-magnetic material 203 are located in the first region B1. The magnetic material 201 in the first region B1 has a substantially rectangular shape when viewed along the first direction Z, and is adjacent to the portions where the first inductor wiring 21 overlap (the first portion 211 to the third portion 213 in this embodiment) when viewed along the second direction from the first pivot axis A1. In other words, the magnetic material 201 is adjacent to the portion where the number of first inductor wirings 21 is greatest when viewed along the second direction from the first pivot axis A1. The non-magnetic material 203 in the first region B1 is provided between the magnetic material 201 in the first region B1 and the portions (in this embodiment, the fourth portion 214 and the fifth portion 215) where the first inductor wiring 21 does not overlap when viewed from the first pivot axis A1 along the second direction. The non-magnetic material 203 includes an insulating layer 77, and extends along the third portion 213, the fourth portion 214, and the fifth portion 215 when viewed along the first direction Z. The magnetic material 201 is located throughout the entire second region B2.

[0055] As shown in FIG. 4, the second inductor wiring 22 extends around a second pivot axis A2 along the first direction Z. In this embodiment, the second inductor wiring 22 has a spiral shape that is spiraled in the opposite direction to the first inductor wiring 21 when viewed along the first direction Z. The second pivot axis A2 is located at the center of the outer shape of the second inductor wiring 22, for example. The second inductor wiring 22 is configured, for example, of an L / S / t (=100 / 10 / 150 μm) laminate. Vias 53 and 54 extending in the first direction Z are connected to both ends of the second inductor wiring 22 in the direction in which the second inductor wiring 22 extends. As shown in FIG. 2, the via 53 connects the second inductor wiring 22 and the vertical wiring 61. The vertical wiring 61 connects the second inductor wiring 22 and the external terminal 101 via the via 53. An insulating layer 75 is located between the second inductor wiring 22 and the vertical wiring 61 in the first direction Z. The insulating layer 75 has a thickness of, for example, 15 μm.

[0056] The second inductor wiring 22 has a first portion 221 to a seventh portion 227.

[0057] The first portion 221 extends from an end portion located near the first pivot axis A1 to which the via 53 is connected in the longitudinal direction Y toward the second center line CL2. As an example, the portion of the first portion 221 to which the via 53 is connected constitutes the second output portion. When viewed along the first direction Z, the via 51 and the via 53 are adjacent to each other. The via 51 connects the portion of the first inductor wiring 21 to which the via 51 is connected and the portion of the second inductor wiring 22 to which the via 53 is connected. In other words, the first output portion and the second output portion are adjacent to each other. "The first output portion and the second output portion are adjacent to each other" refers to, for example, a state in which the via 51 and the via 53 are located in a very small area (e.g., within 20 μm) when viewed along the first direction Z. In this embodiment, the via 51 and the via 53 are located at a distance of approximately 10 μm when viewed along the first direction Z.

[0058] The second portion 222 extends in the short direction X from one of both ends of the first portion 221 in the longitudinal direction Y that is closer to the second center line CL2.

[0059] The third portion 223 extends from one of both ends of the second portion 222 in the short-side direction X that is farther from the first portion 221 along the longitudinal direction Y in a direction away from the second center line CL2.

[0060] The fourth portion 224 extends from one of the ends of the third portion 223 in the longitudinal direction Y that is farther from the second portion 222 in the short direction X toward the first portion 221.

[0061] The fifth portion 225 extends from one of both ends of the fourth portion 224 in the short-side direction X that is farther from the third portion 223 in the longitudinal direction Y toward the second center line CL2. The fifth portion 225 is located farther from the second pivot axis A2 in the short-side direction X than the first portion 221, and when viewed from the second pivot axis A2 in the short-side direction X, a part of the fifth portion 225 overlaps with the first portion 221. The fifth portion 225 and the first portion 221 are insulated from each other.

[0062] The sixth portion 226 extends from one of the ends of the fifth portion 225 in the longitudinal direction Y that is farther from the fourth portion 224 in the short direction X toward the third portion 223. The sixth portion 226 is located farther from the second pivot axis A2 in the longitudinal direction Y than the second portion 222, and when viewed from the second pivot axis A2 in the longitudinal direction Y, a part of the sixth portion 226 overlaps with the second portion 222. The sixth portion 226 and the second portion 222 are insulated from each other.

[0063] The seventh portion 227 extends from one of the ends of the sixth portion 226 in the short-side direction X that is farther from the fifth portion 225 along the longitudinal direction Y in a direction away from the second center line CL2. The seventh portion 227 is located farther from the second pivot axis A2 in the short-side direction X than the third portion 223. When viewed from the second pivot axis A2 along the short-side direction X, a portion of the seventh portion 227 overlaps with the third portion 223. The seventh portion 227 and the third portion 223 are insulated from each other. A via 54 is connected to one of the ends of the seventh portion 227 in the long-side direction Y that is farther from the second center line CL2. As an example, the portion of the seventh portion 227 to which the via 54 is connected constitutes a second input section. As shown in FIGS. 3 and 4 , when viewed along the first direction Z, the vias 52 and 54 are spaced apart in the longitudinal direction Y. That is, the first input portion and the second input portion are positioned apart in the second direction (for example, the longitudinal direction Y). When viewed along the first direction Z, the vias 52 and 54 are positioned apart by 200 μm or more (for example, 500 μm), thereby separating the first input portion and the second input portion.

[0064] 4, the second conductor layer 12 includes a second main body portion 121 extending (positioned) around the second pivot axis A2 and a protrusion 122 (an example of a second protrusion) provided on the second main body portion 121. When viewed along the first direction Z, the second main body portion 121 has a swirling portion 1211 having substantially the same shape as the second inductor wiring 22, and a non-swirling portion 1212 adjacent to the swirling portion 1211 and electrically independent of it. In this embodiment, when viewed along the first direction Z, the swirling portion 1211 entirely overlaps with the second inductor wiring 22. When viewed along the first direction Z, the non-swirling portion 1212 has an oval shape extending along the longitudinal direction Y, and is adjacent to a portion where the sixth portion 226 and the seventh portion 227 of the second inductor wiring 22 are connected. The swivel portion 1211 and the protrusion portion 122 of the second main body portion 121 may be made of the same material, or may be made of different materials.

[0065] A lead-out portion 165 is provided at the center of the non-orbiting portion 1212 in the longitudinal direction Y. The lead-out portion 165 extends from the non-orbiting portion 1212 in the short-side direction X and in a direction away from the second pivot axis A2. Of both ends of the lead-out portion 165 in the short-side direction X, the tip end farther from the non-orbiting portion 1212 is in contact with the magnetic material 201 of the element body 2. The non-orbiting portion 1212 and the lead-out portion 165 of the second main body portion 121 may be made of the same material, or may be made of different materials.

[0066] The protrusion 122 is configured to extend from the second main body 121 toward the second pivot axis A2 not along the shortest route but along a deviated route (i.e., a roundabout route). When viewed along the first direction Z, the protrusion 122 does not extend the shortest distance D2 from the connection portion 1223 with the second main body 121 toward the end of the insulating layer 72. As an example, the end of the insulating layer 72 is located at the boundary between the insulating layer 72 and the insulating material 201 in the first region C1. The protrusion 122 is configured so that the dimension in the extension direction of the protrusion 122 is greater than the shortest distance D2. In this embodiment, the protrusion 122 is configured to extend from the second main body 121 in a direction intersecting a second imaginary straight line L2 passing through the connection portion 1223 with the second main body 121 and the second pivot axis A2, toward the second pivot axis A2. In this embodiment, the protrusion 122 includes an extending portion 1221 and a curved portion 1222. When viewed in the first direction Z, the extending portion 1221 extends in the longitudinal direction Y from a portion of the second main body 121 that overlaps with the first portion 221 of the second inductor wiring 22 in a direction away from the second center line CL2. The curved portion 1222 curves from one of both ends of the extending portion 1221 in the longitudinal direction Y that is farther from the second center line CL2 toward the second pivot axis A2. In other words, the second inductor wiring 22 and the protrusion 122 form an angle other than a right angle.

[0067] 4, in this embodiment, of the two ends of the protruding portion 122 in the direction in which the protruding portion 122 extends, the end farther from the second main body portion 121 (i.e., of the two ends of the curved portion 1222 in the direction in which the curved portion 1222 extends, the end closer to the second pivot axis A2) is in contact with the magnetic material 201 of the element body 2 located in the first region C1, which will be described later. Of the two ends of the protruding portion 122 in the first direction Z, the end closer to the second inductor wiring 22 is in contact with the insulating layer 78. The insulating layer 78 is in contact with a second side surface 2201 of the second inductor wiring 22 that is located near the second pivot axis A2 in the second direction (e.g., the short-side direction X), of the side surfaces that intersect with the second direction (e.g., the short-side direction X). The second main body portion 121 and the protruding portion 122 may be made of the same material or different materials.

[0068] As shown in FIG. 4, in this embodiment, the second conductor layer 12 includes five lead portions 161, 162, 163, 164, and 165.

[0069] When viewed along the first direction Z, the drawn-out portion 161 extends from a portion of the second main body portion 121 that overlaps with the second portion 222 of the second inductor wiring 22 in a second direction (e.g., the longitudinal direction Y) and in a direction approaching the second pivot axis A2.

[0070] When viewed along the first direction Z, the drawn-out portion 162 extends from a portion of the second main body portion 121 that overlaps with the third portion 223 of the second inductor wiring 22 in the second direction (e.g., the short-side direction X) and in a direction approaching the second pivot axis A2.

[0071] Of the ends of the lead-out portion 161 in the longitudinal direction Y, the tip end farther from the second main body portion 121 is in contact with the magnetic material 201 located in the first region C1 described below. Of the ends of the lead-out portion 162 in the lateral direction X, the tip end farther from the second main body portion 121 is in contact with the magnetic material 201 located in the first region C1.

[0072] When viewed along the first direction Z, the lead-out portion 163 extends from the portion of the turning portion 1211 that overlaps with the seventh portion 227 of the second inductor wiring 22 in the second direction (e.g., the short-side direction X) and in a direction away from the second turning axis A2.

[0073] When viewed along the first direction Z, the drawn-out portion 164 extends from the portion of the swirling portion 1211 that overlaps with the fifth portion 225 of the second inductor wiring 22 in the second direction (e.g., the short-side direction X) and away from the second swirling axis A2, in the direction opposite to the drawn-out portion 163.

[0074] When viewed along the first direction Z, the lead-out portion 165 extends from the non-rotating portion 1212 in the second direction (e.g., the short-side direction X) away from the second rotation axis A2, in the same direction as the lead-out portion 163.

[0075] Of the ends of the lead portions 163 and 165 in the short-side direction X, the tip end farther from the turning portion 1211 is exposed from the side surface 204 of the element body 2. Of the ends of the lead portion 164 in the short-side direction X, the tip end farther from the turning portion 1211 is exposed from the side surface 205 of the element body 2.

[0076] As an example, the tip portions exposed from the side surfaces 204 and 205 of the lead portions 152, 153, 163, 164, and 165 are in contact with at least one insulating layer. For example, by forming the side surface 204 by down-cutting or up-cutting (moving the blade while rotating it along the first direction Z) during singulation (see FIG. 14), as shown in FIG. 16, the insulating layers (e.g., insulating layer 71 and insulating layer 73) located around the lead portion 152 are stretched to cover the tip portions of the lead portion 152. This results in the lead portion 152 having its tip portion in contact with at least one insulating layer. In FIG. 16, the stretched portion of the insulating layer 71 is indicated by 710, and the stretched portion of the insulating layer 73 is indicated by 730. In a similar manner, the lead portions 153, 163, 164, and 165 having their tip portions in contact with at least one insulating layer are obtained. The tip of the protrusion 112 is covered with an insulating filler such as silica contained in the first insulating layer 71 or the third insulating layer 73, thereby further improving resistance to interlayer short circuits and the like.

[0077] As shown in FIG. 4, the element body 2 has therein a first region C1 that is closer to the second pivot axis A2 than the second inductor wiring 22, and a second region C2 that is farther from the second pivot axis A2 than the second inductor wiring 22. In this embodiment, the first region C1 is surrounded by the first portion 221 to the fifth portion 225 of the second inductor wiring 22 when viewed along the first direction Z. A magnetic material 201 and a non-magnetic material 203 are located in the first region C1. The magnetic material 201 in the first region C1 has a substantially rectangular shape when viewed along the first direction Z, and is adjacent to the first portion 211 to the fourth portion 224. In other words, when viewed along the second direction from the second pivot axis A2, the magnetic material 201 is adjacent to the portion with the largest number of second inductor wirings 22. The non-magnetic material 203 of the first region C1 includes an insulating layer 78, and is adjacent to the magnetic material 201, the first portion 221, the fourth portion 224, and the fifth portion 225 of the first region C1 when viewed along the first direction Z. The magnetic material 201 is located throughout the second region C2.

[0078] 4, the inductor component 1 includes a first pad portion 81 and a second pad portion 82 located on a second imaginary plane S2. When viewed along the first direction Z, the first pad portion 81 is located so as to overlap with the non-wound portion 1212 of the second conductor layer 12. Of both ends of the first pad portion 81 in the longitudinal direction Y, a via 55 is connected to the end closest to the second center line CL2. The first pad portion 81 and the second pad portion 82 are located symmetrically with respect to the second center line CL2 and have shapes symmetrical with respect to the second center line CL2.

[0079] 2, the inductor component 1 includes an insulating layer 71 (an example of a first interlayer insulating layer) and an insulating layer 72 (an example of a second interlayer insulating layer) located inside the element body 2. The insulating layer 71 is in contact with the first conductor layer 11 and is located on the opposite side of the first inductor wiring 21 in the first direction Z. The insulating layer 72 is in contact with the second conductor layer 12 and is located on the opposite side of the second inductor wiring 22 in the first direction Z.

[0080] As an example, the first conductor layer 11 has a thickness in the first direction Z that is less than 1.0 μm. The thickness of the first conductor layer 11 is smaller than 1 / 100 of the thickness of the first inductor wiring 21. The second conductor layer 12 may also be configured in the same manner as the first conductor layer 11. In other words, the second conductor layer 12 may be configured to have a thickness that is less than 1.0 μm and smaller than 1 / 100 of the thickness of the second inductor wiring 22.

[0081] As an example, each of the first conductor layer 11 and the second conductor layer 12 includes a single layer (Cu or Ag) or multiple layers (e.g., Ti / Cu) stacked along the first direction Z. This configuration increases the degree of freedom in designing the inductor component 1, thereby reducing costs without compromising the quality of the inductor component 1. For example, the number of layers forming each conductor layer can be set arbitrarily depending on the layer. For example, by configuring the first conductor layer 11 to include two layers (Ti / Cu) and the second conductor layer 12 to include two layers (Cu), the adhesion of the first conductor layer 11 to the resin can be improved, while the adhesion of the second conductor layer 12 to copper (sacrificial copper) can be improved.

[0082] In this embodiment, as shown in FIG. 2 , the inductor component 1 includes an insulating layer 73 (an example of a second insulating layer) and an insulating layer 74 (an example of a third insulating layer) located inside the element body 2. The insulating layer 73 contacts one of both ends in the first direction Z of the lead portions 152, 153 (an example of a first lead portion) of the first conductor layer 11, the end closer to the first inductor wiring 21. As an example, the insulating layer 73 extends along the first direction Z from a first imaginary plane S1 to a second imaginary plane S2. The insulating layer 73 is formed so that its dimension in the first direction Z (i.e., thickness) is larger than that of the first inductor wiring 21. This ensures insulation between the first layer including the first conductor layer 11 and the first inductor wiring 21 and the second layer including the second conductor layer 12 and the second inductor wiring 22. The insulating layer 74 is in contact with one of both ends in the first direction Z of the lead portions 163, 164, 165 (an example of a second lead portion) of the second conductor layer 12, the end closer to the second inductor wiring 22. As an example, the insulating layer 74 extends from the second imaginary plane S2 along the first direction Z toward the main surface 202. The insulating layer 74 is formed to be thicker than the second inductor wiring 22.

[0083] 3 and 4, the lead-out portion 152 of the first conductor layer 11 and the lead-out portions 163 and 165 of the second conductor layer 12 are positioned to overlap in the first direction Z, and the lead-out portion 153 of the first conductor layer 11 and the lead-out portion 164 of the second conductor layer 12 are positioned to overlap in the first direction Z. When viewed along the first direction Z, the insulating layer 74 is the same size as or smaller than the insulating layer 73, and the insulating layer 73 overlaps the entire insulating layer 74.

[0084] 2, the inductor component 1 includes an external terminal 101 provided on the main surface 202 and a vertical wiring 61 located inside the element body 2. The vertical wiring 61 extends in the first direction Z and connects the second inductor wiring 22 to the external terminal 101 while being in contact with the magnetic material 201 of the element body 2 in the second direction. In this embodiment, the vertical wiring 61 is provided at a position that does not overlap with the first regions B1, C1 and the second regions B2, C2 when viewed along the first direction Z.

[0085] 3, the first conductor layer 11 and the third conductor layer 13 are positioned at an interval from each other in the second direction (for example, the longitudinal direction Y). The lead portions 152, 153 of the first conductor layer 11 are provided in a portion of the first body portion 111 other than the portion facing the third conductor layer 13 (i.e., the portion of the first body portion 111 facing the side surfaces 204, 205 of the element body 2). The lead portions 152, 153 (an example of a third lead portion) of the third conductor layer 13 are provided in a portion of the third body portion 131 other than the portion facing the first conductor layer 11 (i.e., the portion of the third body portion 131 facing the side surfaces 204, 205 of the element body 2).

[0086] The insulating layers (e.g., insulating layers 71, 72, 75) in contact with both ends of the first inductor wiring 21 and the second inductor wiring 22 in the first direction Z and the insulating layers (e.g., insulating layers 73, 74, 77, 78) in contact with both ends of the first inductor wiring 21 and the second inductor wiring 22 in the second direction are formed of, for example, different materials. As an example, the insulating layers 71, 72, 75 are formed of an insulating material made of an epoxy system and an inorganic filler, and the insulating layers 73, 74, 77, 78 are formed of an acrylic system insulating material.

[0087] An example of a method for manufacturing the inductor component 1 will be described with reference to Figures 5 to 14. In the following description, the third conductor layer 13, the fourth conductor layer 14, the third inductor wiring 23, and the fourth inductor wiring 24 will not be described. Figures 5 to 14 are drawings corresponding to a cross section taken along line II-II in Figure 1. In the manufacturing method shown in Figures 5 to 14, some or all of the steps are automatically performed using, for example, a manufacturing device for the inductor component 1.

[0088] As shown in FIGS. 5 and 6 , the manufacturing equipment forms an insulating layer 71 on a first laminate 1001, which is formed by laminating an adhesive layer 1100 and a seed layer (conductor) 1200 on a substrate 1000. Then, a pattern seed 1300 and a permanent resist 1400 are formed on the insulating layer 71 and the seed layer 1200 to form a second laminate 1002. The pattern seed 1300 constitutes the first conductor layer 11. The insulating layer 71 is formed, for example, by a process including laminating an insulating layer, photolithography (photolithography), and curing. The pattern seed 1300 is formed, for example, by a process including sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1400 is formed, for example, by a process including permanent resist lamination, photolithography, and curing. A portion of the permanent resist 1400 constitutes the nonmagnetic material 203 and the insulating layer 73.

[0089] 7, the manufacturing equipment simultaneously forms the first inductor wiring 21 and sacrificial copper 1500 on the second laminate 1002, and then forms an insulating layer 72 on the first inductor wiring 21. The first inductor wiring 21 and the sacrificial copper 1500 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The insulating layer 72 is formed, for example, by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1501 and the vias 51 and 52 are simultaneously formed during the photolithography process.

[0090] As shown in FIG. 8 , the manufacturing equipment forms a fourth laminate 1004 by forming a pattern seed 1600 located on the insulating layer 72 and a permanent resist 1700 on the third laminate 1003. The pattern seed 1600 constitutes the second conductor layer 12. The pattern seed 1600 is formed by a process including, for example, sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1700 is formed by a process including permanent resist lamination, photolithography, and hardening. A portion of the permanent resist 1700 constitutes the insulating layer 74.

[0091] The pattern seed 1600 may be formed of the same material as the pattern seed 1300 of the second laminate 1002, or may be formed of a material different from that of the pattern seed 1300. The pattern seeds 1300 and 1600 are formed by selecting an optimum material for each layer. For example, by forming the first-layer pattern seed 1300 from a conductive material containing Ti, it is possible to improve adhesion to the insulating layer 71 and the seed layer 1200. By forming the second-layer pattern seed 1600 from the same conductive material as the second inductor wiring 22 (for example, only Cu), it is possible to improve connectivity with the vias 53 and 54.

[0092] As shown in FIG. 9 , the manufacturing equipment forms the second inductor wiring 22 and the sacrificial copper 1800 on the fourth laminate 1004, then forms an insulating layer 75 on the second inductor wiring 22, and forms a vertical wiring 61 on the insulating layer 75 to form a fifth laminate 1005. The second inductor wiring 22 and the sacrificial copper 1800 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The insulating layer 75 is formed by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1801 and the vias 53 and 54 are simultaneously formed during the photolithography process. The vertical wiring 61 is formed, for example, by a process including sputtering (full-surface seed formation), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching.

[0093] As shown in FIG. 10 , the manufacturing equipment forms a protective layer 1900 on the vertical wiring 61 of the fifth laminate 1005, then removes the sacrificial copper 1500 and 1800 to form a magnetic path hole 2000, thereby forming a sixth laminate 1006. The protective layer 1900 is formed, for example, by a process including resist lamination and photolithography. The sacrificial copper 1500 and 1800 are removed, for example, by etching. If the first-layer pattern seed 1300 contains Ti, Ti etching is performed after Cu etching, leaving a portion of the seed layer 1200.

[0094] As shown in FIG. 11 , the manufacturing equipment removes the protective layer 1900 from the sixth laminate 1006, then forms a magnetic layer 2100, and forms a solder resist (insulating layer) 2200 on the magnetic layer 2100 to form the seventh laminate 1007. The protective layer 1900 is removed, for example, by a process including resist stripping. The magnetic layer 2100 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding exposes the vertical wiring 61 to the outside. The magnetic layer 2100 constitutes a part of the magnetic material 201. The solder resist 2200 is formed, for example, by a process including solder resist lamination, photolithography, and hardening. The solder resist 2200 has openings 2201 that expose the vertical wiring 61 to the outside. The solder resist 2200 constitutes the insulating layer 76.

[0095] As shown in FIG. 12 , the manufacturing equipment removes the substrate 1000, adhesive layer 1100, and seed layer 1200 from the seventh laminate 1007 to create an eighth laminate 1008. The substrate 1000 and adhesive layer 1100 are removed, for example, by mechanically peeling off the adhesive layer 1100. The seed layer 1200 is removed, for example, by wet etching or polishing. When the seed layer 1200 is removed by wet etching, part of the metal magnetic powder in the magnetic layer 2100 is etched, roughening its surface, thereby improving adhesion with the magnetic layer 2300 formed in the next process.

[0096] As shown in FIG. 13 , the manufacturing equipment forms a magnetic layer 2300 on the eighth laminate 1008 to form a ninth laminate 1009. The magnetic layer 2300 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding is performed to adjust the thickness of the element body 2. The thickness of the element body 2 may be adjusted by adjusting the amount of pressing when forming the magnetic layer 2300 without grinding. The magnetic layer 2300 constitutes a part of the magnetic material 201.

[0097] As shown in Fig. 14, the manufacturing equipment forms external terminals 101 on the ninth laminate 1009, forms a tenth laminate 1010, and then singulates the tenth laminate 1010 to form the inductor component 1 shown in Fig. 2. The external terminals 101 are formed by a process including, for example, sputtering (Cu seed), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching. The singulation is performed, for example, along the dashed lines shown in Fig. 14.

[0098] Instead of forming the external terminals 101, the exposed vertical wiring 61 may serve as the external terminals. By adopting a configuration in which the external terminals 101 are formed in the openings 2201 of the solder resist 2200 and connected to the vertical wiring 61, as in this embodiment, the area of ​​the external terminals 101 can be increased, thereby improving the adhesive strength of the inductor component 1 to other devices, etc. Furthermore, the external terminals 101 can be formed in any shape, such as a convex shape, which increases the degree of freedom when mounting the inductor component 1.

[0099] The external terminals 101 may be formed without forming the solder resist 2200. The external terminals 101 may be formed by forming a seed layer on the entire surface and then performing electrolytic plating, as with the vertical wiring 61. In this case, the external terminals 101 have a structure similar to that of a Cu bump.

[0100] The inductor component 1 can provide the following effects.

[0101] The inductor component 1 includes a first conductor layer 11, a first inductor wiring 21, and an insulating layer 71 (an example of a first interlayer insulating layer). The first conductor layer 11 is located on a first imaginary plane S1. The first inductor wiring 21 is provided on the first conductor layer 11 and extends around a first pivot axis A1. The insulating layer 71 is in contact with the first conductor layer 11 and is located on the opposite side of the first conductor layer 11 from the first inductor wiring 21 in the first direction Z. The first conductor layer 11 includes a first main body portion 111 extending around the first pivot axis A1 and a protrusion 112 (an example of a first protrusion) extending from the first main body portion 111 in a direction approaching the first pivot axis A1. When viewed along the first direction Z, the protrusion 112 does not extend the shortest distance from a connection portion 1123 with the first main body portion 111 toward the end of the insulating layer 71. That is, since the protrusion 112 is directed toward the first pivot axis A1 via a roundabout route rather than the shortest route, it is possible to prevent the first inductor wiring 21 from being eroded by an etching solution, for example, when forming the magnetic path hole. As a result, it is possible to suppress variations and increases in the DC resistance of the inductor component 1. Furthermore, since the provision of the protrusion 112 allows power to be supplied via an insulating layer, it is possible to form the first inductor wiring 21 by plating growth. Plating growth (for example, electrolytic plating) can form a first conductor layer 11 with extremely high purity, and therefore it is possible to form a first inductor wiring 21 with high conductivity. As a result, it is possible to reduce the DC electrical resistance of the inductor component 1.

[0102] The inductor component 1 includes an element body 2 containing a magnetic material 201 and having a first conductor layer 11 and a first inductor wiring 21 located therein. The element body 2 has therein a first region B1 that is closer to the first pivot axis A1 than the first inductor wiring 21, and a second region B2 that is farther from the first pivot axis A1 than the first inductor wiring 21. The magnetic material 201 is located in the first region B1 and the second region B2. This configuration can improve the efficiency with which the inductor component 1 obtains inductance.

[0103] The inductor component 1 includes an insulating layer 77 (an example of a first insulating layer). The insulating layer 77 is located inside the element body 2 and is in contact with a side surface of the first inductor wiring 21 that intersects with the second direction. Of both ends of the protrusion 112 in the first direction Z, the end closest to the first inductor wiring 21 is in contact with the insulating layer 77. Of both ends of the protrusion 112 in the extension direction of the protrusion 112, the end farther from the first body portion 111 is in contact with the magnetic material 201. With this configuration, the protrusion 112 is protected by the insulating layer 77 and the first inductor wiring 21 is not etched when the magnetic path is formed, thereby preventing a decrease in the DC resistance of the inductor component 1 due to erosion. By filling the formed magnetic path with the magnetic material 201, the efficiency with which the inductance of the inductor component 1 is obtained can be improved.

[0104] The first conductor layer 11 has a thickness of less than 1.0 μm. The thickness of the first conductor layer 11 is less than 1 / 100 of the thickness of the first inductor wiring 21. With this configuration, the first conductor layer 11 is sufficiently thin compared to the first inductor wiring 21, so that the resistance of the first inductor wiring 21, rather than the first conductor layer 11, becomes dominant. As a result, the selectivity of the metal material constituting the first conductor layer 11 is improved. Furthermore, because the thickness of the first conductor layer 11 itself is sufficiently thin, interlayer short circuits via the first conductor layer 11 can be suppressed. For example, if the first conductor layer 11 is Ti / Cu deposited by sputtering, Ti is formed to a thickness of 30 nm and Cu is formed to a thickness of 800 nm. The first conductor layer 11 can be formed by electroless plating or printing, in addition to sputtering. For example, Au, Ag, or Al can be used as the material for the first conductor layer 11.

[0105] The inductor component 1 includes a second conductor layer 12, a second inductor wiring 22, and an insulating layer 72 (an example of a second interlayer insulating layer). The second conductor layer 12 is provided on a second imaginary plane S2 that is adjacent to and parallel to a first imaginary plane S1. The second inductor wiring 22 is provided on the second conductor layer 12, is located between the first conductor layer 11 and the second conductor layer 12, and extends around a second pivot axis A2. The insulating layer 72 is in contact with the second conductor layer 12 and is located on the opposite side of the second conductor layer 12 from the second inductor wiring 22 in the first direction Z. The second conductor layer 12 includes a second main body portion 121 that extends around the second pivot axis A2, and a protrusion portion 122 (an example of a second protrusion portion) that extends from the second main body portion 121 in a direction approaching the second pivot axis A2. When viewed in the first direction Z, the protrusion 122 does not extend the shortest distance from the connection portion 1223 with the second body portion 121 toward the end of the insulating layer 71. The first inductor wiring 21 has a first input portion connected to a first input element and a first output portion connected to an output element. The second inductor wiring 22 has a second input portion connected to a second input element different from the first input element and a second output portion connected to the output element. When viewed in the first direction Z, the first input portion and the second input portion are spaced apart in the second direction, and the first output portion and the second output portion are adjacent to each other. Since the input portion is separate and the output portion is shared, the inductor component 1 can be used in a multi-phase DC-DC converter. The output portion can also be shared. In this case, the first inductor wiring 21 and the second inductor wiring 22 have the same potential, thereby improving the static electricity resistance of the inductor component 1.

[0106] The first conductor layer 11 includes lead portions 151 and 152. The lead portions 151 and 152 extend from the first main body portion 111 in the second direction away from the first pivot axis A1, or in the second direction toward the first pivot axis A1. When viewed along the first direction Z, the width of the lead portions 151 and 152 is greater than the width of the first inductor wiring 21. This configuration reduces the resistance of the first conductor layer 11. Furthermore, since the path for supplying power to the first inductor wiring 21 is thick and difficult to cut, stable plating growth of the first inductor wiring 21 can be achieved. As a result, variation in the first inductor wiring 21 can be suppressed.

[0107] The inductor component 1 includes an external terminal 101 provided on an outer surface of the element body 2 that intersects with the first direction Z, and a vertical wiring 61 located inside the element body 2. The vertical wiring 61 is provided at a position that does not overlap the first region B1 and the second region B2 when viewed along the first direction Z, and is in contact with the magnetic material 201 of the element body 2 in the second direction. The vertical wiring 61 extends in the first direction Z and connects the first inductor wiring 21 and the external terminal 101. Since unnecessary force is not applied to the vertical wiring 61 when the magnetic material 201 is filled, disconnection of the vertical wiring 61 can be suppressed. Furthermore, by configuring the vertical wiring 61 to be in contact with the magnetic material 201 in the second direction, the volume of the magnetic material 201 can be increased, thereby improving the inductance acquisition efficiency of the inductor component 1. Because the vertical wiring 61 is a wiring for connecting to the external terminal 101, insulation can be ensured even without an insulating layer. This eliminates the need for a process for forming an insulating layer on the vertical wiring 61, thereby reducing the manufacturing cost of the inductor component 1. The vertical wiring 61 is not limited to being connected to the second inductor wiring 22 via the via 53, and may be directly connected to the second inductor wiring 22. Furthermore, the vertical wiring 61 may be connected to the second inductor wiring 22 not only via the via 53 but also via a seed layer or a layer required for forming the vertical wiring 61.

[0108] The first conductor layer 11 includes a lead-out portion 151 extending from the first main body portion 111 in the second direction and in a direction approaching the first pivot axis A1. The lead-out portion 151 is provided in a portion of the first main body portion 111 that faces the first pivot axis A1 in the second direction and is farthest from the first pivot axis A1. With this configuration, dissolution of the first inductor wiring 21 due to etching can be suppressed when a magnetic path is formed around the first pivot axis A1. As a result, an increase in the DC resistance of the inductor component 1 can be prevented.

[0109] The inductor component 1 includes a second conductor layer 12, a second inductor wiring 22, and an insulating layer 72 (an example of a second interlayer insulating layer). The second conductor layer 12 is provided on a second imaginary plane S2 that is adjacent to and parallel to a first imaginary plane S1. The second inductor wiring 22 is provided on the second conductor layer 12, is located between the first conductor layer 11 and the second conductor layer 12, and extends around a second pivot axis A2. The insulating layer 72 is in contact with the second conductor layer 12 and is located on the opposite side of the second conductor layer 12 from the second inductor wiring 22 in the first direction Z. The second conductor layer 12 includes a second main body portion 121 that extends around the second pivot axis A2, and a protrusion portion 122 (an example of a second protrusion portion) that extends from the second main body portion 121 in a direction approaching the second pivot axis A2. When viewed along the first direction Z, the protrusion 122 does not extend the shortest distance from the connection portion 1223 with the second body portion 121 toward the end of the insulating layer 71. The first conductor layer 11 includes lead portions 152 and 153 (an example of a first lead portion) extending from the first body portion 111 in a direction away from the first pivot axis A1 along the second direction. The second conductor layer 12 includes lead portions 163, 164, and 165 (an example of a second lead portion) extending from the second body portion 121 in a direction away from the second pivot axis A2 along the second direction. The inductor component 1 includes an insulating layer 73 (an example of a second insulating layer) in contact with the end of the lead portions 152 and 153 closer to the first inductor wiring 21, of both ends in the first direction Z, and an insulating layer 74 (an example of a third insulating layer) in contact with the end of the lead portions 163, 164, and 165 closer to the second inductor wiring 22, of both ends in the first direction Z. When viewed along the first direction Z, the lead portions 152, 153 and the lead portions 163, 164, 165 are in overlapping positions, the insulating layer 74 is the same size as or smaller than the insulating layer 73, and the insulating layer 74 overlaps the entire insulating layer 74. If the insulating layer 74 is larger than the insulating layer 73 when forming the magnetic material 201 in the second regions B2, C2, a region (a gap) where the magnetic material 201 cannot be formed may be generated. In this case, the inductance acquisition efficiency of the inductor component 1 and the strength of the element body 2 may be reduced. With the above configuration, the inductor component 1 can prevent a reduction in the inductance acquisition efficiency of the inductor component 1 and a reduction in the strength of the element body 2.

[0110] Of both ends of the lead portions 152, 153 of the first conductor layer 11 in the second direction, the tip end farther from the first body portion 111 is exposed from the side surfaces 204, 205 of the element body 2 and is in contact with at least one insulating layer. With this configuration, the parts of the lead portions 152, 153 that are exposed to the outside of the element body 2 can be covered with an insulating layer, thereby preventing metal corrosion of the lead portions 152, 153. For example, by configuring the inductor component 1 so that the tip ends of the lead portions 152, 153 are in contact with multiple insulating layers, the coverage of the tip ends of the lead portions 152, 153 can be increased.

[0111] When viewed along the first direction Z, the first inductor wiring 21 and the protruding portion 112 form an angle other than a right angle. With this configuration, the protruding portion 112 can be reliably directed in a roundabout manner toward the first pivot axis A1, thereby more reliably suppressing variations and increases in the DC resistance of the inductor component 1.

[0112] The lead portions 152, 153 (an example of a first lead portion) of the first conductor layer 11 are provided in a portion of the first body portion 111 other than the portion facing the third conductor layer 13. The lead portions 152, 153 (an example of a third lead portion) of the third conductor layer are provided in a portion of the third body portion 131 other than the portion facing the first conductor layer 11. With this configuration, it is possible to ensure insulation between the first inductor wiring 21 and the third inductor wiring 23. It is also possible to reduce the mounting area when mounting multiple inductor wirings along the same plane.

[0113] The inductor component 1 can be configured as follows.

[0114] 15 , of all the inductor wirings including the first inductor wiring 21 and the second inductor wiring 22, the second inductor wiring 22 is located closest to the external terminal 107 in the first direction Z. If the leading ends of the lead portions 163, 164, and 165 of the second conductor layer 12 located closest to the external terminal 107 are exposed from the element body 2, they may cause a solder short. The risk of a solder short can be reduced by configuring the inductor component 1 so that the leading ends of the lead portions 163, 164, and 165 are exposed only from the side surface 204 extending in the longitudinal direction Y among the multiple side surfaces of the element body 2. By exposing the leading end of the protrusion 122 from the center of the side surface 204 in the longitudinal direction Y, the risk of a solder short can be more reliably reduced. 15, the tip of the lead-out portion 152 of the first inductor wiring 21 is also exposed from the side surface 204 of the element body 2. However, the inductor component 1 may be configured such that the tip of the lead-out portion 152 is exposed from a side surface 206 extending in the short-side direction X of the element body 2. FIG. 16 shows an example of the tip of the lead-out portion 152 exposed from the side surface 204. The tip of the lead-out portion 152 is in contact with multiple insulating layers 71, 73.

[0115] 17, the lead-out portion 151 may be configured to have at least one opening 1511. In the inductor component 1 shown in FIG. 17, the lead-out portion 151 has, as an example, four substantially circular openings 1511. When the lead-out portion 151 has the openings 1511, the path through which the etching solution can penetrate into the first inductor wiring 21 is narrowed, making it more difficult for the etching solution to reach the first inductor wiring 21 when forming a magnetic path. This suppresses increases and variations in the DC resistance of the first inductor wiring 21, and can improve the inductance acquisition efficiency of the inductor component 1.

[0116] The opening 1511 may or may not penetrate the lead-out portion 151 in the first direction Z. When the opening 1511 does not penetrate the lead-out portion 151 (for example, when the opening 1511 has a concave shape), the area where the first conductor layer 11 adheres to the base (insulating layer 71) increases, thereby ensuring the adhesion of the first conductor layer 11 to the base. Furthermore, a thin portion of the first conductor layer 11 (i.e., a portion of the lead-out portion 151 where the opening 1511 is provided) is immediately disconnected when corroded by the etching solution, thereby preventing the etching solution from penetrating the first inductor wiring 21. As a result, an increase and variation in the DC resistance of the first inductor wiring 21 can be prevented. When the opening 1511 penetrates the lead-out portion 151 (i.e., when the opening 1511 is a through-hole), the opening 1511 can completely block the etching solution from penetrating the first inductor wiring 21. As a result, the increase and variation in the DC resistance of the first inductor wiring 21 can be suppressed.

[0117] 17 and 18, the first conductor layer 11 may have multiple lead portions provided in portions extending parallel to the side surfaces 204, 206 of the element body 2. This configuration can suppress changes in the DC resistance of the inductor component 1. In the inductor component 1 shown in FIG. 17, the first conductor layer 11 has, when viewed along the first direction Z, four lead portions 154 that extend in the second direction (e.g., the X direction) and away from the first pivot axis A1 from a portion of the first main body portion 111 that overlaps with the seventh portion 217 of the first inductor wiring 21. The four lead portions 154 are positioned at intervals along the Y direction. Of both ends of each lead portion 154 in the X direction, the tip end farther from the first main body portion 111 is exposed from the side surface 204 of the element body 2. 18, the first conductor layer 11 has, when viewed along the first direction Z, three lead-out portions 155 that extend in the second direction (e.g., the Y direction) and in a direction approaching the first pivot axis A1 from a portion of the first main body portion 111 that overlaps with the fourth portion 214 of the first inductor wiring 21. Of both ends in the X direction of each lead-out portion 155, the tip end farther from the first main body portion 111 is in contact with the magnetic material 201 in the first region B1.

[0118] As shown in FIG. 18 , the first conductor layer 11 may include protrusions 113 and 114. The protrusions 113 and 114 extend from the first main body portion 111 in a direction angled with respect to third imaginary straight lines L31 and L32, which are perpendicular to the side surface 204 of the element body 2, and in a direction away from the first pivot axis A1. The protrusions 113 and 114 extend from the first pivot axis A1 to the side surface 204 via a roundabout route rather than the shortest route. This prevents the first inductor wiring 21 from being corroded by an etching solution when, for example, forming a magnetic path hole. As a result, variations and increases in the DC resistance of the inductor component 1 can be suppressed. Furthermore, providing the protrusions 113 and 114 allows power to be supplied via an insulating layer, allowing the first inductor wiring 21 to be formed by plating growth. Plating growth (e.g., electrolytic plating) can form a first conductor layer 11 with extremely high purity, thereby forming a first inductor wiring 21 with high conductivity. This reduces the DC electrical resistance of the inductor component 1. In the inductor component 1 shown in Fig. 18, the first conductor layer 11 includes protrusions 113 and 114 in addition to the protrusion 112. For example, the inductor component 1 may be configured such that the first conductor layer 11 includes only the protrusions 113 and 114.

[0119] The inductor component 1 may be configured to include conductor layers located on three or more parallel imaginary planes and inductor wiring provided on each of these conductor layers, i.e., the inductor component 1 may include three or more layers of inductor wiring.

[0120] The inductor component 1 may be configured so that only the first conductor layer 11 is located on the first imaginary plane S1, or so that three or more conductor layers including the first conductor layer 11 and the third conductor layer 13 are located on the first imaginary plane S1. Similarly, the inductor component 1 may be configured so that only the second conductor layer 12 is located on the second imaginary plane S2, or so that three or more conductor layers including the second conductor layer 12 and the fourth conductor layer 14 are located on the second imaginary plane S2. In other words, it is possible to realize an inductor component 1 in which multiple electrically independent inductor wirings are arranged on the same imaginary plane.

[0121] The insulating layers (e.g., first insulating layer 71, second insulating layer 72, third insulating layer 73 and fourth insulating layer 74) located inside the element body 2, the vertical wiring 61 and the vias 51, 52, 53, 54 and 55 may be omitted depending on the design of the inductor component 1, etc.

[0122] The shape and size of each part constituting the inductor component 1 are not limited to the above-described embodiments and can be set arbitrarily depending on the design of the inductor component 1. For example, the thickness of the first conductor layer 11 of the inductor component 1 is not limited to being less than 1.0 μm and less than 1 / 100 of the thickness of the first inductor wiring.

[0123] Each inductor wiring may have a spiral shape when viewed in the first direction Z. For example, each inductor wiring may be a curve with one or more windings (turns), or a curve with less than one winding. Each inductor wiring may have a linear shape in part.

[0124] The embodiments and modifications of the present disclosure can be combined with each other, or with modifications, or with each other. Features included in the embodiments and modifications of the present disclosure can also be combined with each other.

[0125] The disclosure of the present disclosure may vary in structural details, and changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the claimed disclosure. [Explanation of symbols]

[0126] 1. Inductor components 2 Base 201 Magnetic materials 202 Main surface 203 Non-magnetic materials 204, 205, 206 Side 11 First conductor layer 111 First main body part 112, 113, 114 protrusion 12 Second conductor layer 121 Second main body part 122 Protrusion 13 Third conductor layer 131 Third main body 14 Fourth conductor layer 21 First inductor wiring 22 Second inductor wiring 23 Third inductor wiring 24 Fourth inductor wiring 51, 52, 53, 54, 55 vias 61 Vertical wiring 71, 72, 73, 74, 75, 76, 77, 78 Insulating layer 81 First pad section 82 Second pad section 101, 102, 103, 104, 105, 106, 107 External terminals 151, 152, 153, 154, 155, 161, 162, 163, 164, 165 Drawer section

Claims

1. a first conductor layer located on a first imaginary plane; a first inductor wiring provided on the first conductor layer and extending around a first pivot axis along a first direction intersecting the first imaginary plane; a first interlayer insulating layer that is in contact with the first conductor layer and is located on the opposite side of the first conductor layer from the first inductor wiring in the first direction; Equipped with The first conductor layer is a first body portion extending about the first pivot axis; a first protrusion extending from the first main body portion in a direction approaching the first pivot shaft; Including, An inductor component in which, when viewed along the first direction, the first protrusion does not extend the shortest distance from the connection portion with the first body portion toward the end of the first interlayer insulating layer.

2. an element body including a magnetic material, the first conductor layer and the first inductor wiring being located therein; the element body has therein a first region closer to the first pivot axis than the first inductor wiring and a second region farther from the first pivot axis than the first inductor wiring; The inductor component according to claim 1 , wherein the magnetic material is located in the first region and the second region.

3. a first insulating layer located inside the element body and in contact with a side surface of the first inductor wiring that intersects with a second direction that intersects with the first direction, one end of the first protrusion in the first direction that is closer to the first inductor wiring is in contact with the first insulating layer; The inductor component according to claim 2 , wherein of both ends of the first protrusion in the extending direction of the first protrusion, the end farther from the first body portion is in contact with the magnetic material.

4. the first conductor layer has a thickness in the first direction that is less than 1.0 μm; 4. The inductor component according to claim 1, wherein the thickness of the first conductor layer is smaller than 1 / 100 of the thickness of the first inductor wiring.

5. a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; a second inductor wiring provided on the second conductor layer, positioned between the first conductor layer and the second conductor layer, and extending around a second pivot axis along the first direction; a second interlayer insulating layer that is in contact with the second conductor layer and is located on the opposite side of the second conductor layer from the second inductor wiring in the first direction; Equipped with The second conductor layer is a second body portion extending about the second pivot axis; a second protrusion extending from the second main body portion in a direction approaching the second pivot shaft; Including, When viewed along the first direction, the second protruding portion does not extend the shortest distance from a connection portion with the main body portion toward an end of the second interlayer insulating layer, the first inductor wiring has a first input section connected to a first input element and a first output section connected to an output element; the second inductor wiring has a second input section connected to a second input element different from the first input element, and a second output section connected to the output element, An inductor component according to any one of claims 1 to 3, wherein, when viewed along the first direction, the first input portion and the second input portion are spaced apart in a second direction intersecting the first direction, and the first output portion and the second output portion are adjacent to each other.

6. The first conductor layer is a lead-out portion extending from the first main body portion in a second direction intersecting the first direction and in a direction away from the first pivot shaft, or in the second direction and in a direction approaching the first pivot shaft, When viewed along the first direction, the size of the lead-out portion in a direction intersecting the direction in which the lead-out portion extends is defined as the width of the lead-out portion, and the size of the first inductor wiring in a direction intersecting the direction in which the first inductor wiring extends is defined as the width of the first inductor wiring, 4. The inductor component according to claim 1, wherein the width of the lead-out portion is greater than the width of the first inductor wiring.

7. an external terminal provided on an outer surface of the element body that intersects with the first direction; a vertical wiring located inside the element body; Equipped with The vertical wiring is 3. The inductor component of claim 2, wherein the inductor component is arranged in a position that does not overlap the first region and the second region when viewed along the first direction, is in contact with the magnetic material of the base body in a second direction that intersects the first direction, and extends in the first direction to connect the first inductor wiring and the external terminal.

8. The first conductor layer is a lead-out portion extending from the first main body portion in a second direction intersecting the first direction and in a direction approaching the first pivot shaft, The drawer portion is 4. The inductor component according to claim 1, wherein the first body portion is provided at a portion facing the first pivot axis in the second direction and farthest from the first pivot axis.

9. a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; a second inductor wiring provided on the second conductor layer, positioned between the first conductor layer and the second conductor layer, and extending around a second pivot axis along the first direction; a second interlayer insulating layer that is in contact with the second conductor layer and is located on the opposite side of the second conductor layer from the second inductor wiring in the first direction; Equipped with The second conductor layer is a second body portion positioned around the second pivot axis; a second protrusion extending from the second main body portion in a direction approaching the second pivot shaft; Including, When viewed along the first direction, the second protruding portion does not extend the shortest distance from a connection portion with the main body portion toward an end of the second interlayer insulating layer, The first conductor layer is a first lead-out portion extending from the first main body portion in a direction away from the first pivot axis along a second direction intersecting the first direction, The second conductor layer is an inductor component including a second lead portion extending from the second body portion in a direction away from the second pivot axis along the second direction, a second insulating layer in contact with an end of the first lead portion in the first direction that is closer to the first inductor wiring; a third insulating layer in contact with an end of the second lead portion that is closer to the second inductor wiring, among both ends of the second lead portion in the first direction; Equipped with An inductor component as described in any one of claims 1 to 3, wherein when viewed along the first direction, the first draw-out portion and the second draw-out portion are in an overlapping position, the third insulating layer is the same size as or smaller than the second insulating layer, and the second insulating layer overlaps the entire third insulating layer.

10. an element body in which the first conductor layer and the first inductor wiring are located; the element body has a side surface that intersects with a second direction that intersects with the first direction, The first conductor layer is a lead-out portion extending from the first body portion in the second direction and away from the first pivot axis; An inductor component as described in any one of claims 1 to 3, wherein the tip end of the extension portion farther from the first main body portion in the second direction is exposed from the side surface and is in contact with at least one insulating layer.

11. The first conductor layer is a lead-out portion extending from the first main body portion in a second direction intersecting the first direction and in a direction away from the first pivot shaft, or in the second direction and in a direction approaching the first pivot shaft, 4. The inductor component according to claim 1, wherein the lead-out portion has at least one opening.

12. an element body in which the first conductor layer and the first inductor wiring are located; the element body has a side surface that intersects with a second direction that intersects with the first direction, the first conductor layer has a plurality of lead portions provided in a portion extending parallel to the side surface of the first body portion, An inductor component as described in any one of claims 1 to 3, wherein each of the plurality of lead-out portions extends from the first main body portion in the second direction and away from the first pivot axis, or in the second direction and toward the first pivot axis.

13. 4. The inductor component according to claim 1, wherein the first inductor wiring and the first protrusion form an angle other than a right angle when viewed along the first direction.

14. a third conductor layer located on the first imaginary plane; a third inductor wiring provided in the third conductor layer and extending around a third pivot axis along the first direction; Equipped with The first conductor layer is a first lead-out portion extending from the first main body portion in a direction away from the first pivot axis along a second direction intersecting the first direction, The third conductor layer is a third main body portion positioned around the third pivot axis; a third drawer portion extending from the third main body portion in a direction away from the third pivot shaft along the second direction; Including, the first conductor layer and the third conductor layer are spaced apart from each other in a second direction intersecting the first direction; the first lead portion is provided in a portion of the first body portion other than a portion facing the third conductor layer, 4. The inductor component according to claim 1, wherein the third lead portion is provided in a portion of the third body portion other than a portion facing the first conductor layer.

15. a first conductor layer located on a first imaginary plane; a first inductor wiring provided on the first conductor layer and extending around a first pivot axis along a first direction intersecting the first imaginary plane; an element body including a magnetic material, the first conductor layer and the first inductor wiring being located therein; Equipped with the element body has a side surface that intersects with a second direction that intersects with the first direction, The first conductor layer is a first body portion extending about the first pivot axis; a protrusion extending from the first main body portion in a direction forming an angle with respect to a third imaginary line perpendicular to the side surface and in a direction away from the first pivot axis; , an inductor component.

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