Inductor component

Abstract

To provide an inductor component with which it is possible to suppress the degradation of magnetic materials.SOLUTION: An inductor component comprises: first inductor wiring extending around a first swing shaft along a first direction, and an element body in which the first inductor wiring is located. The element body includes a magnetic material located more apart from the first swing shaft than the first inductor wiring in a second direction intersecting the first direction, and a first protective film located more apart from the first swing shaft than the magnetic material in the second direction and being in contact with the magnetic material in the second direction. The thickness of the first protective film, which is the dimension in the first direction, is larger than the thickness of the first inductor wiring.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to inductor components. [Background technology]

[0002] Patent Document 1 discloses a coil component having an element body containing a magnetic material and an insulating layer provided on the bottom surface of the element body. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-148899 Summary of the Invention [Problem to be solved by the invention]

[0004] The coil component of Patent Document 1 has room for improvement in terms of suppressing deterioration of the magnetic material due to environmental loads and the like.

[0005] An object of the present disclosure is to provide an inductor component that can suppress deterioration of magnetic materials. [Means for solving the problem]

[0006] An inductor component according to one aspect of the present disclosure includes: a first inductor wiring extending around a first pivot axis along a first direction; an element body in which the first inductor wiring is located; Equipped with The element body is a magnetic material positioned farther from the first pivot axis than the first inductor wiring in a second direction intersecting the first direction; a first protective film positioned farther from the first pivot axis than the magnetic material in the second direction and in contact with the magnetic material in the second direction; Including, The thickness of the first protective film, which is the dimension in the first direction, is greater than the thickness of the first inductor wiring. [Effects of the Invention]

[0007] According to the inductor component of the above aspect, deterioration of the magnetic material can be suppressed. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view illustrating an inductor component according to one embodiment of the present disclosure. [Figure 2] FIG. 2 is a plan view of the inductor component of FIG. 1. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. [Figure 4] 2 is a schematic plan view illustrating a layer of a first inductor wiring of the inductor component of FIG. 1; FIG. [Figure 5] 2 is a schematic plan view illustrating a layer of a second inductor wiring of the inductor component of FIG. 1; [Figure 6] FIG. 2 is a first diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 7] FIG. 2 is a second diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 8] FIG. 3 is a third diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 9] FIG. 4 is a fourth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 10] 1. FIG. 5 is a fifth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 11] FIG. 6 is a sixth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 12] 7 is a seventh diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 13] 8 is an eighth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 14] 9 is a ninth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 15] FIG. 19 is a tenth diagram illustrating an example of a method for manufacturing the inductor component of FIG. [Figure 16] FIG. 2 is a schematic plan view showing a first modified example of the inductor component of FIG. [Figure 17] FIG. 2 is a schematic plan view showing a second modified example of the inductor component of FIG. [Figure 18] FIG. 2 is a schematic plan view showing a third modified example of the inductor component of FIG. [Figure 19] FIG. 10 is a perspective view showing a fourth modified example of the inductor component of FIG. [Figure 20] FIG. 10 is an enlarged side view showing a fifth modified example of the inductor component of FIG. [Figure 21] FIG. 11 is a perspective view showing a sixth modified example of the inductor component of FIG. [Figure 22] FIG. 13 is a perspective view showing a seventh modified example of the inductor component of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Various aspects of the present disclosure will now be described.

[0010] The inductor component of the first aspect comprises: a first inductor wiring extending around a first pivot axis along a first direction; an element body in which the first inductor wiring is located; Equipped with The element body is a magnetic material positioned farther from the first pivot axis than the first inductor wiring in a second direction intersecting the first direction; a first protective film positioned farther from the first pivot axis than the magnetic material in the second direction and in contact with the magnetic material in the second direction; Including, The thickness of the first protective film, which is the dimension in the first direction, is greater than the thickness of the first inductor wiring.

[0011] The inductor component of the second aspect is the inductor component of the first aspect, a first conductor layer located on a first imaginary plane intersecting the first direction; the first inductor wiring is provided on the first conductor layer, The first conductor layer is a first main body portion positioned around the first pivot axis; a pull-out portion extending from the first main body portion in the second direction and in a direction away from the first pivot shaft, or in the second direction and in a direction approaching the first pivot shaft; Includes:

[0012] The inductor component of a third aspect is the inductor component of the second aspect, a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; a second inductor wiring provided on the second conductor layer, positioned on the opposite side of the second conductor layer from the first conductor layer in the first direction, and extending around a second pivot axis along the first direction; Equipped with.

[0013] An inductor component of a fourth aspect is the inductor component of the second or third aspect, wherein: The first protective film is configured to cover the first conductor layer.

[0014] An inductor component of a fifth aspect is the inductor component of any one of the first to fourth aspects, the first protective film includes a plurality of materials; The plurality of materials includes at least an inorganic filler.

[0015] An inductor component of a sixth aspect is the inductor component of any one of the first to fifth aspects, the first protective film includes a plurality of materials; The plurality of materials are all photosensitive materials.

[0016] An inductor component of a seventh aspect is the inductor component of the third aspect, a first insulating layer provided inside the element body and positioned between the first inductor wiring and the second conductor layer; The first protective film and the first insulating layer are integrally formed.

[0017] An inductor component of an eighth aspect is the inductor component of any one of the first to seventh aspects, The element body is configured so that the magnetic material is in contact with the end of the first protective film in the first direction.

[0018] An inductor component of a ninth aspect is the inductor component of any one of the first to eighth aspects, the magnetic material has a quadrangular shape including chamfered corners when viewed along the first direction, When viewed along the first direction, the dimension in the direction in which the distance from the outer surface of the first protective film to the magnetic material is shortest is defined as the width. The width of the first protective film is greatest at the chamfered corner portion.

[0019] An inductor component of a tenth aspect is the inductor component of the fourth aspect, The portion of the first conductor layer that is in contact with the first protective film is isolated from the first inductor wiring.

[0020] An inductor component of an eleventh aspect is the inductor component of the second or third aspect, wherein: a third conductor layer located on the first imaginary plane; a third inductor wiring provided in the third conductor layer and positioned around a third pivot axis extending along the first direction and spaced apart from the first pivot axis in the second direction; a second insulating layer located between the first inductor wiring and the third inductor wiring in the second direction; Equipped with The first protective film and the second insulating layer are integrally formed.

[0021] An inductor component of a twelfth aspect is the inductor component of the second or third aspect, wherein: the drawer portion extends from the first body portion in the second direction and away from the first pivot axis; Of both ends of the lead portion in the second direction, the tip end farther from the first main body portion is in contact with the first protective film.

[0022] An inductor component of a thirteenth aspect is the inductor component of the twelfth aspect, The first protective film covers the entire tip portion.

[0023] An inductor component of a fourteenth aspect is the inductor component of any one of the first to thirteenth aspects, wherein: The element body includes a second protective film in contact with one of both ends in the first direction.

[0024] An inductor component of a fifteenth aspect is the inductor component of any one of the first to fourteenth aspects, The first protective film includes a first film and a second film that is less exposed to the outside than the first film.

[0025] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The following description does not limit the present disclosure, but is merely exemplary in nature, and can be modified as appropriate without departing from the spirit of the present disclosure. The drawings are schematic, and the ratios of the dimensions do not necessarily correspond to the actual ones. In the following description, terms such as "about," "approximately," or "substantially" mean that the values, shapes, etc. following these terms include an acceptable range of error as determined by a person skilled in the art.

[0026] 1 to 3, an inductor component 1 according to the present disclosure includes a first inductor wiring 21 and an element body 2. The first inductor wiring 21 extends (is located) around a first pivot axis A1 along a first direction (e.g., the Z direction) inside the element body 2. The element body 2 includes a magnetic material (magnetic layer) 201 and an insulating layer 73 (an example of a first protective film).

[0027] In this embodiment, the inductor component 1 includes a first conductor layer 11, a second conductor layer 12, and a second inductor wiring 22 in addition to a first inductor wiring 21 and an element body 2. The first conductor layer 11, the second conductor layer 12, and the second inductor wiring 22 are located inside the element body 2. As shown in FIG. 3 , the first conductor layer 11 is located on a first imaginary plane S1. The first inductor wiring 21 is provided on the first conductor layer 11 and extends along the first imaginary plane S1. A direction intersecting (e.g., perpendicular to) the first imaginary plane S1 is defined as a first direction Z. As an example, the first imaginary plane S1 is located at the boundary between the insulating layer 71 and the first conductor layer 11.

[0028] As shown in FIG. 3 , the second conductor layer 12 is located on a second imaginary plane S2 that is adjacent and parallel to the first imaginary plane S1. Here, the term "the second imaginary plane S2 is adjacent and parallel to the first imaginary plane S1" refers to the fact that the first imaginary plane S1 and the second imaginary plane S2 are parallel to each other and that the second imaginary plane S2 is located at a distance in a direction perpendicular to the first imaginary plane S1. The first inductor wiring 21 is located between the first conductor layer 11 and the second conductor layer 12 in a first direction Z that intersects the first imaginary plane S1 and the second imaginary plane S2. The second inductor wiring 22 is provided on the second conductor layer 12 and extends along the second imaginary plane S2. The second inductor wiring 22 is located on the opposite side of the second conductor layer 12 from the first inductor wiring 21 in the first direction Z, and is located around a second pivot axis A2 that intersects (e.g., is perpendicular to) the second imaginary plane S2. As an example, the first pivot axis A1 and the second pivot axis A2 are positioned on the same straight line (see FIG. 3). The second imaginary plane S2 is positioned at the boundary between the insulating layer 72 and the second conductor layer 12.

[0029] The element body 2 has dimensions of, for example, 1.2 × 1.04 × 0.55 mm. As shown in FIGS. 2 and 3, the element body 2 has an outer surface (hereinafter referred to as the main surface 202) that intersects with the first direction Z. As shown in FIGS. 1 and 2, the main surface 202 is provided with a plurality of external terminals 101 to 103 and an insulating layer 76 (an example of a second protective film). The insulating layer 76 has a thickness of, for example, 10 μm and is configured to contact one of both ends of the element body 2 in the first direction Z. In this embodiment, the second inductor wiring 22 is located closest to the main surface 202 (i.e., the external terminal 101) in the first direction Z. The external terminals 101 to 103 are configured, for example, as a laminate of Cu / Ni / Au (=5 / 5 / 0.1 μm).

[0030] 4, the element body 2 has therein a first region B1 that is closer to the first pivot axis A1 than the first inductor wiring 21, and a second region B2 that is farther from the first pivot axis A1 than the first inductor wiring 21. A magnetic material 201 and a non-magnetic material 203 are located in the first region B1. The magnetic material 201 is located throughout the second region B2. The magnetic material 201 in the second region B2 is located farther from the first pivot axis A1 than the first inductor wiring 21 in a second direction that intersects the first direction Z.

[0031] As shown in FIG. 4, the insulating layer 73 is located farther from the first pivot axis A1 in the second direction than the magnetic material 201 in the second region B2 and is in contact with the magnetic material 201 in the second region B2 in the second direction. The thickness of the insulating layer 73, which is the dimension in the first direction Z, is greater than the thickness of the first inductor wiring 21. In this embodiment, as shown in FIG. 1, the insulating layer 73 has a generally strip-like shape extending around the first pivot axis A1 and is provided around the entire periphery of the element body 2. The insulating layer 73 is configured to cover the first conductor layer 11 (e.g., the lead portion 153) (see FIG. 20). In other words, the insulating layer 73 is configured so that the first inductor wiring 21 and the first conductor layer 11 are not exposed to the outside of the inductor component 1 in the second direction. As shown in FIG. 3, the insulating layer 73 is in contact with one of the ends in the first direction Z of the lead portions 153 and 154 of the first conductor layer 11, which will be described later, that is closer to the first inductor wiring 21. As an example, the insulating layer 73 extends in the first direction Z from the first imaginary plane S1 to the second imaginary plane S2.

[0032] The insulating layer 73 may contain multiple materials. That is, the insulating layer 73 may be formed of a single material or multiple materials. When the insulating layer 73 is formed of multiple materials, the multiple materials may contain at least an inorganic filler, or may all be photosensitive materials.

[0033] Contact with the magnetic material 201 refers to contact with a portion of the material constituting the magnetic material 201. When the magnetic material 201 is formed, for example, of a composite of resin and inorganic filler (e.g., a composite of epoxy and FeSiCr), the tip of the first main body portion 111 contacts at least one of the resin and inorganic filler of the magnetic material 201. The resin contained in the magnetic material 201 includes, for example, epoxy, acrylic, liquid crystal polymer, phenol, and combinations thereof, and is responsible for the strength and good insulating properties of the element body 2. The inorganic filler contained in the magnetic material 201 includes, for example, metal magnetic powder (e.g., Fe, FeSi-based, FeSiCr-based, FeNi-based, etc., containing Fe as the main component). In this case, the magnetic material 201 has high magnetic permeability and high magnetic saturation density. The inorganic filler does not need to be a single type of magnetic powder; it may be a combination of magnetic powders with different compositions and particle sizes, or it may contain an insulating filler such as silica to ensure a linear expansion coefficient and insulating properties.

[0034] The layer of the first inductor wiring 21 is located between the first imaginary plane S1 and the second imaginary plane S2, and the layer of the second inductor wiring 22 is located between the second imaginary plane S2 and the main surface 202 of the element body 2 described later.

[0035] 4, the first inductor wiring 21 has, for example, a spiral shape when viewed along the first direction Z. For example, the first pivot axis A1 is located at the center of the outer shape of the first inductor wiring 21. Vias 51 and 52 are connected to both ends of the first inductor wiring 21 in the direction in which the first inductor wiring 21 extends. The first inductor wiring 21 is formed of, for example, an L / S / t (=100 / 10 / 150 μm) laminate.

[0036] The first inductor wiring 21 has a first portion 211 to a seventh portion 217 .

[0037] The first portion 211 extends from an end portion located near the first pivot axis A1 to which the via 51 is connected in a direction away from the side surface 206 of the element body 2 along the short direction Y. As an example, the portion of the first portion 211 to which the via 51 is connected constitutes a first output section. The side surface 206 is one of a pair of side surfaces of the element body 2 extending along the longitudinal direction X.

[0038] The second portion 212 extends in the longitudinal direction X from one of the ends of the first portion 211 in the lateral direction Y that is farther from the side surface 206 of the element body 2.

[0039] The third portion 213 extends from one of the ends of the second portion 212 in the longitudinal direction X that is farther from the first portion 211 in the lateral direction Y in a direction approaching the side surface 206 of the element body 2.

[0040] The fourth portion 214 extends from one of the ends of the third portion 213 in the short-side direction Y that is farther from the second portion 212 in the longitudinal direction X toward the first portion 211.

[0041] The fifth portion 215 extends from one of the ends of the fourth portion 214 in the longitudinal direction X that is farther from the third portion 213 along the short direction Y in a direction away from the side surface 206 of the element body 2. The fifth portion 215 is located farther from the first pivot axis A1 in the longitudinal direction X than the first portion 211, and when viewed from the first pivot axis A1 along the longitudinal direction X, a part of the fifth portion 215 overlaps with the first portion 211. The fifth portion 215 and the first portion 211 are insulated from each other.

[0042] The sixth portion 216 extends from one of the ends of the fifth portion 215 in the short-side direction Y that is farther from the fourth portion 214 in the longitudinal direction X toward the third portion 213. The sixth portion 216 is located farther from the first pivot axis A1 in the short-side direction Y than the second portion 212, and when viewed from the first pivot axis A1 in the short-side direction Y, a part of the sixth portion 216 overlaps with the second portion 212. The sixth portion 216 and the second portion 212 are insulated from each other.

[0043] The seventh portion 217 extends from one of the ends of the sixth portion 216 in the longitudinal direction X that is farther from the fifth portion 215 along the short-side direction Y in a direction approaching the side surface 206 of the element body 2. The seventh portion 217 is located farther from the first pivot axis A1 in the longitudinal direction X than the third portion 213, and when viewed from the first pivot axis A1 along the longitudinal direction X, a portion of the seventh portion 217 overlaps with the third portion 213. The seventh portion 217 and the third portion 213 are insulated from each other. A via 52 is connected to one of the ends of the seventh portion 217 in the short-side direction Y that is closer to the side surface 206 of the element body 2. As an example, the portion of the seventh portion 217 to which the via 52 is connected configures the first input section.

[0044] 4, the first conductor layer 11 includes a first body portion 111 extending (positioned) around the first pivot axis A1, and lead portions 151, 153, and 154 extending from the first body portion 111 in a second direction intersecting the first direction and away from the first pivot axis A1, or in the second direction and toward the first pivot axis A1. In this embodiment, the first conductor layer 11 includes a protrusion 112 provided on the first body portion 111. When viewed along the first direction Z, the first body portion 111 has substantially the same shape as the first inductor wiring 21, and the entire first body portion 111 overlaps the first inductor wiring 21. The second direction may be any direction intersecting the first direction, such as the transverse direction X or the longitudinal direction Y, or a direction having components or vectors in both the transverse direction X and the longitudinal direction Y.

[0045] In this embodiment, the first conductor layer 11 has one lead portion 151, one lead portion 153, and four lead portions 154. By configuring the first conductor layer 11 to include the multiple lead portions 151, 153, and 154, it is possible to suppress changes in the DC resistance of the inductor component 1.

[0046] When viewed along the first direction Z, the lead-out portion 151 extends in the second direction (e.g., the transverse direction Y) from a portion of the first body portion 111 that overlaps with the fourth portion 214 of the first inductor wiring 21, toward the first pivot axis A1. The portion of the first body portion 111 where the lead-out portion 151 is provided is the portion of the first body portion 111 that faces the first pivot axis A1 in the second direction (e.g., the transverse direction Y) and is the farthest from the first pivot axis A1. This configuration can suppress dissolution of the first inductor wiring 21 due to etching when forming a magnetic path around the first pivot axis A1. As a result, an increase in the DC resistance of the inductor component 1 can be prevented.

[0047] Of both ends of the lead portion 151 in the short-side direction Y, the tip end farther from the first main body portion 111 is in contact with the magnetic material 201 located in the first region B1, which will be described later.

[0048] In this embodiment, the lead-out portion 151 has at least one opening 1511 (for example, four substantially circular openings 1511). The opening 1511 may or may not penetrate the lead-out portion 151 in the first direction Z. If the opening 1511 does not penetrate the lead-out portion 151, it has, for example, a concave shape that is recessed from one end of the lead-out portion 151 in the first direction Z toward the other end of the lead-out portion 151 in the first direction 151. In this case, if the first conductor layer 11 has multiple layers and the layer of the first conductor layer 11 farthest from the first inductor wiring 21 in the first direction Z is defined as the farthest layer, the farthest layer of the first conductor layer 11 is located between the bottom of the opening 1511 and the first imaginary plane S1.

[0049] By providing the lead-out portion 151 with at least one opening 1511, the path through which the etching solution can penetrate into the first inductor wiring 21 is narrowed, making it difficult for the etching solution to reach the first inductor wiring 21 when forming a magnetic path. This suppresses increases and variations in the DC resistance of the inductor component 1, and improves the efficiency with which the inductance of the inductor component 1 can be obtained.

[0050] When the opening 1511 has a concave shape recessed from one end of the lead portion 151 in the first direction Z toward the other end of the lead portion 151 in the first direction Z, the thickness of the portion of the first lead portion 151 where the opening 1511 is formed is thinner than the first main body portion 111. Therefore, for example, when etching the sacrificial copper, the portion of the lead portion 151 where the opening 1511 is formed opens before the first main body portion 111, thereby suppressing further erosion by the etching solution. As a result, it is possible to suppress an increase and variation in the DC resistance of the first inductor wiring 21. The concave opening 1511 can be formed, for example, by controlling the etching time.

[0051] When the opening 1511 penetrates the lead-out portion 151 in the first direction Z, a path for the etching solution to penetrate into the first inductor wiring 21 is blocked. This makes it possible to suppress an increase and variation in the DC resistance of the first inductor wiring 21 caused by corrosion of the first inductor wiring 21 by the etching solution. For example, when the opening 1511 penetrates the lead-out portion 151, the insulating layer 77 comes into contact with the base (e.g., the insulating layer 71) through the opening 1511, and the lead-out portion 151 is sandwiched between the two insulating layers 71, 77. This provides the first conductor layer 11 with sufficient adhesion to the insulating layers 71, 77.

[0052] The first conductor layer 11 includes multiple layers stacked along the first direction Z, and the farthest layer is located between the bottom of the opening 1511 and the first imaginary plane S1 in the first direction Z, allowing for the selection of an optimal metal material for the first conductor layer 11. For example, when the first conductor layer 11 is made of Ti / Cu, Ti improves adhesion to the base (e.g., the insulating layer 71), while Cu, which has high conductivity, improves shape controllability of the first inductor wiring 21. When the farthest layer is made of only Ti, the opening 1511 can be provided with high adhesion even if it is thin. When the farthest layer is made of multiple layers, selective etching is possible, thereby suppressing increases and variations in the DC resistance of the first inductor wiring 21.

[0053] The lead-out portion 151 has a plurality of openings 1511, which reduces the resistance of the first conductor layer 11. Furthermore, the path for supplying power to the first inductor wiring 21 is thick and difficult to cut, which allows stable plating growth of the first inductor wiring 21. As a result, variations in the first inductor wiring 21 can be suppressed.

[0054] In this embodiment, of both ends of the lead-out portion 151 in the first direction Z, the end closest to the first inductor wiring 21 is in contact with an insulating layer 77, which will be described later. As an example, the interior of an opening 1511 of the lead-out portion 151 is filled with the insulating layer 77. This connects the insulating layer 77 to the base (e.g., insulating layer 71) of the first conductor layer 11 through the opening 1511, thereby preventing the insulating layer 77 from collapsing or peeling off.

[0055] When viewed along the first direction Z, the drawn-out portion 153 extends from a portion of the first main body portion 111 that overlaps with the fifth portion 215 of the first inductor wiring 21 in the second direction (e.g., the longitudinal direction X) and in a direction away from the first pivot axis A1.

[0056] When viewed along the first direction Z, each lead portion 154 extends from a portion of the first main body portion 111 that overlaps with the seventh portion 217 of the first inductor wiring 21 in the second direction (e.g., the longitudinal direction X) away from the first pivot axis A1, in the opposite direction to the lead portion 153. The four lead portions 154 are positioned at intervals along the Y direction.

[0057] Of both ends of the lead portion 153 in the longitudinal direction X, the tip end farther from the first body portion 111 is exposed from the side surface 205 of the element body 2. Of both ends of each lead portion 154 in the longitudinal direction X, the tip end farther from the first body portion 111 is exposed from the side surface 204 of the element body 2. With this configuration, the parts of the lead portions 153, 154 that are exposed to the outside of the element body 2 can be covered with an insulating layer, thereby preventing metal corrosion of the lead portions 153, 154. For example, by configuring the inductor component 1 so that the tips of the lead portions 153, 154 are in contact with multiple insulating layers, the coverage of the tips of the lead portions 153, 154 can be increased. Each side surface 204, 205 extends along the short-side direction Y. The side surface 204 faces the seventh portion 217 of the first inductor wiring 21 in the longitudinal direction X, and the side surface 205 faces the fifth portion 215 of the first inductor wiring 21 in the longitudinal direction X.

[0058] For example, the "width of the drawn-out portion 151" and the "width of the first inductor wiring 21" are defined as follows. In this case, the width of the drawn-out portion 151 is greater than the width of the first inductor wiring 21. This reduces the resistance of the first conductor layer 11. Furthermore, since the path for supplying power to the first inductor wiring 21 becomes thicker and more difficult to cut, stable plating growth of the first inductor wiring 21 can be achieved. As a result, variations in the first inductor wiring 21 can be suppressed. When viewed along the first direction Z, the size of the lead-out portion 151 in a direction intersecting the direction in which the lead-out portion 151 extends (for example, the longitudinal direction X) is defined as the "width of the lead-out portion 151." The size of the first inductor wiring 21 in a direction intersecting the direction in which the first inductor wiring 21 extends is defined as the "width of the first inductor wiring 21."

[0059] The protrusion 112 is configured to extend from the first main body 111 toward the first pivot axis A1 not along the shortest route but along a deviated route (i.e., a roundabout route). When viewed along the first direction Z, the protrusion 112 does not extend the shortest distance D1 from the connection portion 1123 with the first main body 111 toward the end of the insulating layer 71. As an example, the end of the insulating layer 71 is located at the boundary between the insulating layer 71 and the insulating material 201 in the first region B1. The protrusion 112 is configured so that the dimension in the extension direction of the protrusion 112 is greater than the shortest distance D1. In this embodiment, the protrusion 112 is configured to extend from the first main body 111 in a direction intersecting a first imaginary straight line L1 passing through the connection portion 1123 with the first main body 111 and the first pivot axis A1, toward the first pivot axis A1. Because the protrusion 112 is directed toward the first pivot axis A1 via a roundabout route rather than the shortest route, it is possible to prevent the first inductor wiring 21 from being eroded by an etching solution, for example, when forming a magnetic path hole. As a result, it is possible to suppress variations and increases in the DC resistance of the inductor component 1. Furthermore, the provision of the protrusion 112 allows power to be supplied via an insulating layer, so the first inductor wiring 21 can be formed by plating growth. Plating growth (for example, electrolytic plating) can form a first conductor layer 11 with extremely high purity, and therefore it is possible to form a first inductor wiring 21 with high conductivity. As a result, it is possible to reduce the DC electrical resistance of the inductor component 1.

[0060] 4, in this embodiment, the protrusion 112 includes an extending portion 1121 and a curved portion 1122. When viewed along the first direction Z, the extending portion 1121 extends from a portion of the first main body 111 that overlaps with the first portion 211 of the first inductor wiring 21 toward the side surface 206 of the element body 2 in the short-side direction Y. The curved portion 1122 curves from one of both ends of the extending portion 1121 in the short-side direction Y that is closer to the side surface 206 of the element body 2 toward the first pivot axis A1. In other words, the first inductor wiring 21 and the protrusion 112 form an angle other than a right angle.

[0061] In this embodiment, of the two ends of the protruding portion 112 in the direction in which the protruding portion 112 extends, the end farther from the first main body portion 111 (i.e., of the two ends of the curved portion 1122 in the direction in which the curved portion 1122 extends, the end closer to the first pivot axis A1) is in contact with the magnetic material 201 of the element body 2 located in the first region B1. Of the two ends of the protruding portion 112 in the first direction Z, the end closer to the first inductor wiring 21 is in contact with the insulating layer 77. The insulating layer 77 is in contact with the first side surface 2101 of the first inductor wiring 21 that is located near the first pivot axis A1 in the second direction (e.g., the longitudinal direction X) among the side surfaces that intersect with the second direction (e.g., the longitudinal direction X). As a result, the protruding portion 112 is protected by the insulating layer 77 and the first inductor wiring 21 is not etched when the magnetic path is formed, thereby suppressing a decrease in the DC resistance of the inductor component 1 due to erosion. Filling the formed magnetic path with magnetic material 201 can improve the efficiency of obtaining inductance from inductor component 1. First body portion 111 and protruding portion 112 may be made of the same material or different materials.

[0062] In this embodiment, the first region B1 is surrounded by the first portion 211 to the fifth portion 215 of the first inductor wiring 21 when viewed in the first direction Z. The magnetic material 201 in the first region B1 has a substantially rectangular shape when viewed in the first direction Z, and is adjacent to the portions where the first inductor wirings 21 overlap (the first portion 211 to the third portion 213 in this embodiment) when viewed in the second direction from the first pivot axis A1. In other words, the magnetic material 201 is adjacent to the portion where the number of first inductor wirings 21 is the largest when viewed in the second direction from the first pivot axis A1. The non-magnetic material 203 in the first region B1 is provided between the magnetic material 201 in the first region B1 and the portions where the first inductor wirings 21 do not overlap (the fourth portion 214 and the fifth portion 215 in this embodiment) when viewed in the second direction from the first pivot axis A1. The non-magnetic material 203 includes an insulating layer 77 and extends along a third portion 213, a fourth portion 214, and a fifth portion 215 when viewed along the first direction Z.

[0063] As shown in FIG. 5, the second inductor wiring 22 extends (is located) around a second pivot axis A2 along the first direction Z. In this embodiment, the second inductor wiring 22 has a spiral shape that is spiral in the opposite direction to the first inductor wiring 21 when viewed along the first direction Z. The second pivot axis A2 is located at the center of the outer shape of the second inductor wiring 22, for example. The second inductor wiring 22 is configured, for example, with an L / S / t (=100 / 10 / 150 μm) laminate. Vias 53 and 54 extending in the first direction Z are connected to both ends of the second inductor wiring 22 in the direction in which the second inductor wiring 22 extends. As shown in FIG. 3, the via 53 connects the second inductor wiring 22 and the vertical wiring 61. The vertical wiring 61 connects the second inductor wiring 22 and the external terminal 101 via the via 53. An insulating layer 75 is located between the second inductor wiring 22 and the vertical wiring 61 in the first direction Z. The insulating layer 75 has a thickness of, for example, 15 μm.

[0064] The second inductor wiring 22 has a first portion 221 to a seventh portion 227.

[0065] The first portion 221 extends from an end portion located near the first pivot axis A1 to which the via 53 is connected in the short direction Y toward the side surface 206 of the element body 2. As an example, the portion of the first portion 221 to which the via 53 is connected constitutes the second output portion. When viewed along the first direction Z, the via 51 and the via 53 are adjacent to each other. The via 51 connects the portion of the first inductor wiring 21 to which the via 51 is connected and the portion of the second inductor wiring 22 to which the via 53 is connected. In other words, the first output portion and the second output portion are adjacent to each other. "The first output portion and the second output portion are adjacent to each other" refers to, for example, a state in which the via 51 and the via 53 are located in a very small area (for example, within 20 μm) when viewed along the first direction Z. In this embodiment, the via 51 and the via 53 are located at a distance of approximately 10 μm when viewed along the first direction Z.

[0066] The second portion 222 extends in the longitudinal direction X from one of both ends of the first portion 221 in the lateral direction Y that is closer to the side surface 206 of the element body 2.

[0067] The third portion 223 extends from one of the ends of the second portion 222 in the longitudinal direction X that is farther from the first portion 221 in the lateral direction Y in a direction away from the side surface 206 of the element body 2 .

[0068] The fourth portion 224 extends from one of both ends of the third portion 223 in the short-side direction Y that is farther from the second portion 222 along the longitudinal direction X in a direction approaching the first portion 221.

[0069] The fifth portion 225 extends from one of the ends of the fourth portion 224 in the longitudinal direction X that is farther from the third portion 223 along the short direction Y in a direction approaching the side surface 206 of the element body 2. The fifth portion 225 is located farther from the second pivot axis A2 in the longitudinal direction X than the first portion 221, and when viewed from the second pivot axis A2 along the longitudinal direction X, a part of the fifth portion 225 overlaps with the first portion 221. The fifth portion 225 and the first portion 221 are insulated from each other.

[0070] The sixth portion 226 extends from one of the ends of the fifth portion 225 in the short-side direction Y that is farther from the fourth portion 224 in the longitudinal direction X toward the third portion 223. The sixth portion 226 is located farther from the second pivot axis A2 in the short-side direction Y than the second portion 222, and when viewed from the second pivot axis A2 in the short-side direction Y, a part of the sixth portion 226 overlaps with the second portion 222. The sixth portion 226 and the second portion 222 are insulated from each other.

[0071] The seventh portion 227 extends from one of the ends of the sixth portion 226 in the longitudinal direction X that is farther from the fifth portion 225 along the short-side direction Y in a direction away from the side surface 206 of the element body 2. The seventh portion 227 is located farther from the second pivot axis A2 in the longitudinal direction X than the third portion 223. When viewed from the second pivot axis A2 along the longitudinal direction X, a portion of the seventh portion 227 overlaps with the third portion 223. The seventh portion 227 and the third portion 223 are insulated from each other. A via 54 is connected to one of the ends of the seventh portion 227 in the short-side direction Y that is farther from the side surface 206 of the element body 2. As an example, the portion of the seventh portion 227 to which the via 54 is connected constitutes a second input section. As shown in FIGS. 3 and 4 , when viewed along the first direction Z, the vias 52 and 54 are spaced apart in the short-side direction Y. That is, the first input section and the second input section are positioned apart in the second direction (for example, the short-side direction Y). When viewed along the first direction Z, the vias 52 and 54 are positioned 200 μm or more (for example, 500 μm) apart, thereby separating the first input section and the second input section. In this way, the first inductor wiring 21 and the second inductor wiring 22 have separate input sections and a common output section, and therefore can be used in a multi-phase DC-DC converter. Furthermore, because the output section is common, the first inductor wiring 21 and the second inductor wiring 22 have the same potential, which improves the resistance of the inductor component 1 to static electricity.

[0072] As shown in FIG. 5 , the second conductor layer 12 includes a second body portion 121 extending (positioned) around the second pivot axis A2 and a protrusion 122 provided on the second body portion 121. When viewed along the first direction Z, the second body portion 121 has a swirling portion 1211 having substantially the same shape as the second inductor wiring 22, and a non-swirling portion 1212 adjacent to the swirling portion 1211 and electrically independent of the swirling portion 1211. In this embodiment, when viewed along the first direction Z, the swirling portion 1211 entirely overlaps the second inductor wiring 22. When viewed along the first direction Z, the non-swirling portion 1212 has an oval shape extending along the short-side direction Y and is adjacent to a portion where the sixth portion 226 and the seventh portion 227 of the second inductor wiring 22 are connected. The swirling portion 1211 and the protrusion 122 of the second body portion 121 may be formed of the same material or different materials.

[0073] A lead-out portion 165 is provided at the center of the non-orbiting portion 1212 in the short-side direction Y. The lead-out portion 165 extends from the non-orbiting portion 1212 in the longitudinal direction X and in a direction away from the second pivot axis A2. Of both ends of the lead-out portion 165 in the longitudinal direction X, the tip end farther from the non-orbiting portion 1212 is in contact with the magnetic material 201 of the element body 2. The non-orbiting portion 1212 and the lead-out portion 165 of the second main body portion 121 may be made of the same material, or may be made of different materials.

[0074] The protrusion 122 is configured to extend from the second main body 121 toward the second pivot axis A2 not along the shortest route but along a deviated route (i.e., a roundabout route). When viewed along the first direction Z, the protrusion 122 does not extend the shortest distance D2 from the connection portion 1223 with the second main body 121 toward the end of the insulating layer 72. As an example, the end of the insulating layer 72 is located at the boundary between the insulating layer 72 and the insulating material 201 in the first region C1. The protrusion 122 is configured so that the dimension in the extension direction of the protrusion 122 is greater than the shortest distance D2. In this embodiment, the protrusion 122 is configured to extend from the second main body 121 in a direction intersecting a second imaginary straight line L2 passing through the connection portion 1223 with the second main body 121 and the second pivot axis A2, toward the second pivot axis A2. In this embodiment, the protrusion 122 includes an extending portion 1221 and a curved portion 1222. When viewed along the first direction Z, the extending portion 1221 extends from a portion of the second main body 121 that overlaps with the first portion 221 of the second inductor wiring 22 in the short-side direction Y in a direction away from the second center line CL2. The curved portion 1222 curves from one of both ends of the extending portion 1221 in the short-side direction Y that is farther from the second center line CL2 toward the second pivot axis A2. In other words, the second inductor wiring 22 and the protrusion 122 form an angle other than a right angle.

[0075] 5, in this embodiment, of the two ends of the protruding portion 122 in the direction in which the protruding portion 122 extends, the end farther from the second main body portion 121 (i.e., of the two ends of the curved portion 1222 in the direction in which the curved portion 1222 extends, the end closer to the second pivot axis A2) is in contact with the magnetic material 201 of the element body 2 located in the first region C1, which will be described later. Of the two ends of the protruding portion 122 in the first direction Z, the end closer to the second inductor wiring 22 is in contact with the insulating layer 78. The insulating layer 78 is in contact with a second side surface 2201 of the second inductor wiring 22 that is located near the second pivot axis A2 in the second direction (e.g., the longitudinal direction X), of the side surfaces that intersect with the second direction (e.g., the longitudinal direction X). The second main body portion 121 and the protruding portion 122 may be made of the same material or different materials.

[0076] As shown in FIG. 5, in this embodiment, the second conductor layer 12 includes five lead portions 161, 162, 163, 164, and 165.

[0077] When viewed along the first direction Z, the drawn-out portion 161 extends from a portion of the second main body portion 121 that overlaps with the second portion 222 of the second inductor wiring 22 in a second direction (e.g., the short-side direction Y) and in a direction approaching the second pivot axis A2.

[0078] When viewed along the first direction Z, the drawn-out portion 162 extends from a portion of the second main body portion 121 that overlaps with the third portion 223 of the second inductor wiring 22 in a second direction (e.g., the longitudinal direction X) and in a direction approaching the second pivot axis A2.

[0079] Of the ends of the lead-out portion 161 in the short-side direction Y, the tip end farther from the second main body portion 121 is in contact with the magnetic material 201 located in the first region C1 described below. Of the ends of the lead-out portion 162 in the long-side direction X, the tip end farther from the second main body portion 121 is in contact with the magnetic material 201 located in the first region C1.

[0080] When viewed along the first direction Z, the drawn-out portion 163 extends from a portion of the swirling portion 1211 that overlaps with the seventh portion 227 of the second inductor wiring 22 in the second direction (e.g., the longitudinal direction X) and in a direction away from the second swirling axis A2.

[0081] When viewed along the first direction Z, the drawn-out portion 164 extends from the portion of the swirling portion 1211 that overlaps with the fifth portion 225 of the second inductor wiring 22 in the second direction (e.g., the longitudinal direction X) and away from the second swirling axis A2, in the opposite direction to the drawn-out portion 163.

[0082] When viewed along the first direction Z, the lead-out portion 165 extends from the non-rotating portion 1212 in the second direction (e.g., the longitudinal direction X) away from the second rotation axis A2, in the same direction as the lead-out portion 163.

[0083] Of the ends of the lead portions 163 and 165 in the longitudinal direction X, the tip end farther from the turning portion 1211 is exposed from the side surface 204 of the element body 2. Of the ends of the lead portion 164 in the longitudinal direction X, the tip end farther from the turning portion 1211 is exposed from the side surface 205 of the element body 2.

[0084] 5, the element body 2 has therein a first region C1 that is closer to the second pivot axis A2 than the second inductor wiring 22, and a second region C2 that is farther from the second pivot axis A2 than the second inductor wiring 22. In this embodiment, the first region C1 is surrounded by the first portion 221 to the fifth portion 225 of the second inductor wiring 22 when viewed along the first direction Z. A magnetic material 201 and a non-magnetic material 203 are located in the first region C1. The magnetic material 201 in the first region C1 has a substantially rectangular shape when viewed along the first direction Z, and is adjacent to the first portion 211 to the fourth portion 224. In other words, when viewed along the second direction from the second pivot axis A2, the magnetic material 201 is adjacent to the portion with the largest number of second inductor wirings 22. The non-magnetic material 203 of the first region C1 includes an insulating layer 78, and is adjacent to the magnetic material 201, the first portion 221, the fourth portion 224, and the fifth portion 225 of the first region C1 when viewed along the first direction Z. The magnetic material 201 is located throughout the second region C2.

[0085] 5, the inductor component 1 includes a first pad portion 81 located on a second imaginary plane S2. When viewed along the first direction Z, the first pad portion 81 is located so as to overlap with the non-wound portion 1212 of the second conductor layer 12. Of both ends of the first pad portion 81 in the short-side direction Y, a via 55 is connected to the end closest to the second center line CL2.

[0086] 3, the inductor component 1 includes an insulating layer 71 and an insulating layer 72 (an example of a first insulating layer) located inside the element body 2. The insulating layer 71 is provided on the first conductor layer 11 and is located on the opposite side of the first inductor wiring 21 in the first direction Z. The insulating layer 72 is provided on the second conductor layer 12 and is located on the opposite side of the second inductor wiring 22 in the first direction Z. In other words, the insulating layer 72 is located between the first inductor wiring 21 and the second conductor layer 12. The insulating layer 72 may be formed integrally with the insulating layer 73.

[0087] As an example, the first conductor layer 11 has a thickness in the first direction Z of less than 1.0 μm. The thickness of the first conductor layer 11 is smaller than 1 / 100 of the thickness of the first inductor wiring 21. The second conductor layer 12 may also be configured similarly to the first conductor layer 11. That is, the second conductor layer 12 may be configured to have a thickness of less than 1.0 μm and smaller than 1 / 100 of the thickness of the second inductor wiring 22. This makes the first conductor layer 11 sufficiently thin relative to the first inductor wiring 21, so that the resistance of the first inductor wiring 21, rather than the first conductor layer 11, becomes dominant. As a result, the selectivity of the metal material constituting the first conductor layer 11 is improved. Furthermore, because the thickness of the first conductor layer 11 itself is sufficiently thin, interlayer short circuits via the first conductor layer 11 can be suppressed. For example, if the first conductor layer 11 is Ti / Cu deposited by sputtering, Ti is formed to a thickness of 30 nm and Cu is formed to a thickness of 800 nm. The first conductor layer 11 can be formed by sputtering, electroless plating, printing, etc. The first conductor layer 11 can be made of, for example, Au, Ag, or Al.

[0088] As an example, each of the first conductor layer 11 and the second conductor layer 12 includes a single layer (Cu or Ag) or multiple layers (e.g., Ti / Cu) stacked along the first direction Z. This configuration increases the degree of freedom in designing the inductor component 1, thereby reducing costs without compromising the quality of the inductor component 1. For example, the number of layers forming each conductor layer can be set arbitrarily depending on the layer. For example, by configuring the first conductor layer 11 to include two layers (Ti / Cu) and the second conductor layer 12 to include two layers (Cu), the adhesion of the first conductor layer 11 to the resin can be improved, while the adhesion of the second conductor layer 12 to copper (sacrificial copper) can be improved.

[0089] In this embodiment, as shown in FIG. 3, the inductor component 1 includes an insulating layer 74 located inside the element body 2. The insulating layer 74 is located farther from the second pivot axis A2 in the second direction than the magnetic material 201 in the second region C2 and is in contact with the magnetic material 201 in the second region C2 in the second direction. The insulating layer 74 has a thickness in the first direction Z that is equal to or greater than the dimension of the second inductor wiring 22. In this embodiment, as shown in FIG. 1, the insulating layer 74 has a substantially strip-like shape extending around the second pivot axis A2 and is provided around the entire periphery of the element body 2. The insulating layer 74 is configured to cover the second conductor layer 12 (e.g., the second main body portion 121). In other words, the insulating layer 74 is configured so that the second inductor wiring 22 and the second conductor layer 12 are not exposed to the outside of the inductor component 1 in the second direction. 3, the insulating layer 74 is in contact with one of the ends in the first direction Z of the lead portions 163, 164, and 165 of the second conductor layer 12, which will be described later, that is closer to the second inductor wiring 22. As an example, the insulating layer 74 extends from the second imaginary plane S2 toward the main surface 202 along the first direction Z.

[0090] As an example, as shown in FIGS. 4 and 5 , portions of the four lead portions 154 of the first conductor layer 11 and the lead portions 163 and 165 of the second conductor layer 12 overlap in the first direction Z, and the lead portion 153 of the first conductor layer 11 and the lead portion 164 of the second conductor layer 12 overlap in the first direction Z. When viewed along the first direction Z, the insulating layer 74 is the same size as or smaller than the insulating layer 73, and the insulating layer 73 overlaps the entire insulating layer 74. If the insulating layer 74 is larger than the insulating layer 73 when forming the magnetic material 201 in the second regions B2 and C2, a region (a void) where the magnetic material 201 cannot be formed may be generated. This may reduce the inductance acquisition efficiency of the inductor component 1 and the strength of the element body 2. In contrast, the inductor component 1 configured as described above can prevent a decrease in the inductance acquisition efficiency of the inductor component 1 and a decrease in the strength of the element body 2.

[0091] In this embodiment, as shown in FIG. 3 , the inductor component 1 includes an external terminal 101 provided on the main surface 202 and a vertical wiring 61 located inside the element body 2. The vertical wiring 61 extends in the first direction Z and connects the second inductor wiring 22 to the external terminal 101 while contacting the magnetic material 201 of the element body 2 in the second direction. In this embodiment, the vertical wiring 61 is located so as not to overlap the first regions B1 and C1 or the second regions B2 and C2 when viewed along the first direction Z. This prevents unnecessary force from being applied to the vertical wiring 61 when filling with the magnetic material 201, thereby preventing breakage of the vertical wiring 61. Furthermore, by configuring the vertical wiring 61 to contact the magnetic material 201 in the second direction, the volume of the magnetic material 201 can be increased, thereby improving the inductance acquisition efficiency of the inductor component 1. Because the vertical wiring 61 is a wiring for connection to the external terminal 101, insulation can be ensured even without an insulating layer. This eliminates the need for a step of forming an insulating layer on the vertical wiring 61, thereby reducing the manufacturing cost of the inductor component 1. The vertical wiring 61 is not limited to being connected to the second inductor wiring 22 via the via 53, and may be connected directly to the second inductor wiring 22. Furthermore, the vertical wiring 61 may be connected to the second inductor wiring 22 via a seed layer or a layer required for forming the vertical wiring 61, in addition to the via 53.

[0092] The insulating layers (e.g., insulating layers 71, 72, 75) in contact with both ends of the first inductor wiring 21 and the second inductor wiring 22 in the first direction Z and the insulating layers (e.g., insulating layers 73, 74, 77, 78) in contact with both ends of the first inductor wiring 21 and the second inductor wiring 22 in the second direction are formed of, for example, different materials. As an example, the insulating layers 71, 72, 75 are formed of an insulating material made of an epoxy system and an inorganic filler, and the insulating layers 73, 74, 77, 78 are formed of an acrylic system insulating material.

[0093] An example of a method for manufacturing the inductor component 1 will be described with reference to Figures 6 to 15. Figures 6 to 15 are drawings corresponding to a cross section taken along line III-III in Figure 2. In the manufacturing method shown in Figures 6 to 15, some or all of the steps are automatically performed using, for example, a manufacturing device for the inductor component 1.

[0094] As shown in FIGS. 6 and 7 , the manufacturing equipment forms an insulating layer 71 on a first laminate 1001, which is formed by laminating an adhesive layer 1100 and a seed layer (conductor) 1200 on a substrate 1000. Then, a pattern seed 1300 and a permanent resist 1400 are formed on the insulating layer 71 and the seed layer 1200 to form a second laminate 1002. The pattern seed 1300 constitutes the first conductor layer 11. The insulating layer 71 is formed, for example, by a process including laminating an insulating layer, photolithography (photolithography), and curing. The pattern seed 1300 is formed, for example, by a process including sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1400 is formed, for example, by a process including permanent resist lamination, photolithography, and curing. A portion of the permanent resist 1400 constitutes the nonmagnetic material 203 and the insulating layer 73.

[0095] 8, the manufacturing equipment simultaneously forms the first inductor wiring 21 and sacrificial copper 1500 on the second laminate 1002, and then forms an insulating layer 72 on the first inductor wiring 21. The first inductor wiring 21 and the sacrificial copper 1500 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The insulating layer 72 is formed, for example, by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1501 and the vias 51 and 52 are simultaneously formed during the photolithography process.

[0096] As shown in FIG. 9 , the manufacturing equipment forms a fourth laminate 1004 by forming a pattern seed 1600 located on the insulating layer 72 and a permanent resist 1700 on the third laminate 1003. The pattern seed 1600 constitutes the second conductor layer 12. The pattern seed 1600 is formed by a process including, for example, sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1700 is formed by a process including permanent resist lamination, photolithography, and hardening. A portion of the permanent resist 1700 constitutes the insulating layer 74.

[0097] The pattern seed 1600 may be formed of the same material as the pattern seed 1300 of the second laminate 1002, or may be formed of a material different from that of the pattern seed 1300. The pattern seeds 1300 and 1600 are formed by selecting an optimum material for each layer. For example, by forming the first-layer pattern seed 1300 from a conductive material containing Ti, it is possible to improve adhesion to the insulating layer 71 and the seed layer 1200. By forming the second-layer pattern seed 1600 from the same conductive material as the second inductor wiring 22 (for example, only Cu), it is possible to improve connectivity with the vias 53 and 54.

[0098] As shown in FIG. 10 , the manufacturing equipment forms the second inductor wiring 22 and the sacrificial copper 1800 on the fourth laminate 1004, then forms the insulating layer 75 on the second inductor wiring 22, and forms the vertical wiring 61 on the insulating layer 75 to form the fifth laminate 1005. The second inductor wiring 22 and the sacrificial copper 1800 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The insulating layer 75 is formed by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1801 and the vias 53 and 54 are simultaneously formed during the photolithography process. The vertical wiring 61 is formed, for example, by a process including sputtering (full-surface seed formation), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching.

[0099] As shown in FIG. 11 , the manufacturing equipment forms a protective layer 1900 on the vertical wiring 61 of the fifth laminate 1005, then removes the sacrificial copper 1500 and 1800 to form a magnetic path hole 2000, thereby forming a sixth laminate 1006. The protective layer 1900 is formed, for example, by a process including resist lamination and photolithography. The sacrificial copper 1500 and 1800 are removed, for example, by etching. If the first-layer pattern seed 1300 contains Ti, Ti etching is performed after Cu etching, leaving a portion of the seed layer 1200.

[0100] As shown in FIG. 12 , the manufacturing equipment removes the protective layer 1900 from the sixth laminate 1006, then forms a magnetic layer 2100, and forms a solder resist (insulating layer) 2200 on the magnetic layer 2100 to form the seventh laminate 1007. The protective layer 1900 is removed, for example, by a process including resist stripping. The magnetic layer 2100 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding exposes the vertical wiring 61 to the outside. The magnetic layer 2100 constitutes a part of the magnetic material 201. The solder resist 2200 is formed, for example, by a process including solder resist lamination, photolithography, and hardening. The solder resist 2200 has openings 2201 that expose the vertical wiring 61 to the outside. The solder resist 2200 constitutes the insulating layer 76.

[0101] As shown in FIG. 13 , the manufacturing equipment removes the substrate 1000, the adhesive layer 1100, and the seed layer 1200 from the seventh laminate 1007 to create an eighth laminate 1008. The substrate 1000 and the adhesive layer 1100 are removed, for example, by mechanically peeling off the adhesive layer 1100. The seed layer 1200 is removed, for example, by wet etching or polishing. When the seed layer 1200 is removed by wet etching, part of the metal magnetic powder in the magnetic layer 2100 is etched, roughening its surface, thereby improving adhesion with the magnetic layer 2300 formed in the next process.

[0102] As shown in FIG. 14 , the manufacturing equipment forms a magnetic layer 2300 on the eighth laminate 1008 to form a ninth laminate 1009. The magnetic layer 2300 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding is performed to adjust the thickness of the element body 2. The thickness of the element body 2 may be adjusted by adjusting the amount of pressing when forming the magnetic layer 2300, without performing grinding. The magnetic layer 2300 constitutes a part of the magnetic material 201.

[0103] 15, the manufacturing equipment forms external terminals 101 on the ninth laminate 1009, forms a tenth laminate 1010, and then singulates the tenth laminate 1010 to form the inductor component 1 shown in FIG. 3. The external terminals 101 are formed by a process including, for example, sputtering (Cu seed), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching. The singulation is performed, for example, along the dashed lines shown in FIG. 15.

[0104] Instead of forming the external terminals 101, the exposed vertical wiring 61 may serve as the external terminals. By adopting a configuration in which the external terminals 101 are formed in the openings 2201 of the solder resist 2200 and connected to the vertical wiring 61, as in this embodiment, the area of ​​the external terminals 101 can be increased, thereby improving the adhesive strength of the inductor component 1 to other devices, etc. Furthermore, the external terminals 101 can be formed in any shape, such as a convex shape, which increases the degree of freedom when mounting the inductor component 1.

[0105] The external terminals 101 may be formed without forming the solder resist 2200. The external terminals 101 may be formed by forming a seed layer on the entire surface and then performing electrolytic plating, as with the vertical wiring 61. In this case, the external terminals 101 have a structure similar to that of a Cu bump.

[0106] The inductor component 1 can provide the following effects.

[0107] The inductor component 1 includes a first inductor wiring 21 extending around a first pivot axis A1 along a first direction Z, and an element body 2 in which the first inductor wiring 21 is located. The element body 2 includes a magnetic material 201 located farther from the first pivot axis A1 in the second direction than the first inductor wiring 21, and an insulating layer 73 (an example of a first protective film) located farther from the first pivot axis A1 in the second direction than the magnetic material 201 and in contact with the magnetic material 201 in the second direction. The thickness of the insulating layer 73 is greater than the thickness of the first inductor wiring 21. This configuration can suppress a decrease in the efficiency of obtaining inductance. This configuration can suppress deterioration of the magnetic material 201.

[0108] For example, inductor components with electrodes formed on their bottom surfaces do not require solder fillets on their side surfaces, allowing for a narrower distance between adjacent inductor components when multiple inductor components are mounted. When a magnetic material containing magnetic metal powder is exposed on the side surfaces of the mounted inductor components, environmental stress (e.g., humidity, heat) can cause short circuits between adjacent inductor components through shed magnetic metal powder, or the magnetic metal powder can rust, reducing the efficiency of inductance acquisition by the inductor components. Inductor component 1 includes insulating layer 73, which can prevent a decrease in the efficiency of inductance acquisition.

[0109] The inductor component 1 includes a first conductor layer 11 located on a first imaginary plane S1 intersecting the first direction Z. A first inductor wiring 21 is provided on the first conductor layer 11. The first conductor layer 11 includes a first main body portion 111 located around the first pivot axis A1 and lead portions 151, 153, and 154 extending from the first main body portion 111 in the second direction away from the first pivot axis A1 or in the second direction toward the first pivot axis A1. With this configuration, for example, by forming the first inductor wiring 21 via the first conductor layer 11 by electrolytic plating, the distance between adjacent portions of the first inductor wiring 21 in the second direction can be narrowed. As a result, the density of the first inductor wiring 21 is increased, and the DC electrical resistance of the inductor component 1 can be reduced.

[0110] The inductor component 1 includes a second conductor layer 12 provided on a second imaginary plane S2 adjacent to and parallel to the first imaginary plane S1, and a second inductor wiring 22 provided on the second conductor layer 12. The second inductor wiring 22 is located on the opposite side of the second conductor layer 12 from the first conductor layer 11 in the first direction Z, and extends around a second pivot axis A2 along the first direction Z. This configuration increases the total number of turns of the inductor wiring of the inductor component 1, thereby improving the efficiency with which the inductance of the inductor component 1 is obtained. Because the first inductor wiring 21 and the second inductor wiring 22 are stacked in the same direction, it is easy to realize an inductor component 1 in which, for example, three or more inductor wirings including the first inductor wiring 21 and the second inductor wiring 22 are stacked.

[0111] The insulating layer 73 is configured to cover the first conductor layer 11. With this configuration, the first conductor layer 11 can be protected from environmental stress.

[0112] The insulating layer 73 includes multiple materials, and the multiple materials include at least an inorganic filler. Because the insulating layer 73 includes multiple materials, the design freedom of the inductor component 1 is improved. Because the multiple materials include an inorganic filler, the linear expansion coefficient of the insulating layer 73 can be easily reduced, thereby reducing residual stress. As a result, crack resistance to thermal stress and the like can be imparted to the insulating layer 73. Furthermore, the inorganic filler allows the insulating layer 73 to have good insulating properties.

[0113] The insulating layer 73 includes multiple materials, all of which are photosensitive materials. Because the insulating layer 73 includes multiple materials, the degree of freedom in designing the inductor component 1 is improved. Because the multiple materials are all photosensitive materials, the insulating layer 73 can be formed all at once when the first inductor wiring 21 and the vias 51 and 52 are formed. As a result, the manufacturing cost of the inductor component 1 can be reduced while reliably improving the protection performance of the insulating layer 73 for the element body 2.

[0114] The inductor component 1 includes an insulating layer 72 (an example of a first insulating layer) provided inside the element body 2 and located between the first inductor wiring 21 and the second conductor layer 12. The insulating layer 72 and the insulating layer 73 are integrally formed. This configuration reduces the manufacturing cost of the inductor component 1. Furthermore, since a protective film thicker than the first inductor wiring 21 can be easily formed, the protective performance against environmental stress can be easily improved.

[0115] The inductor component 1 includes an insulating layer 76 (an example of a second protective film) in contact with one end (e.g., the main surface 202) of the element body 2 in the first direction Z. The surface of the element body 2 is subjected to stress (alkali damage) when undergoing processes such as electroless plating during the formation of the external terminals 101, 102, and 103. Therefore, providing the insulating layer 76 reduces the stress that the element body 2 receives during the manufacturing process of the inductor component 1. Furthermore, forming the insulating layer 76 from a material suitable for the manufacturing process of the inductor component 1 can improve the reliability and yield of the inductor component 1. For example, when the insulating layer 73 is formed simultaneously with the formation of the first inductor wiring 21, a high-aspect and highly transparent pattern is required. For this reason, photosensitive polyimide-based materials are an option for the material forming the insulating layer 73. On the other hand, a relatively rough pattern of the external terminals 101, 102, and 103 is formed on the insulating layer 76. When the external terminals 101, 102, and 103 are formed by an electroless plating process, the material for forming the insulating layer 76 can be a print-type epoxy material containing pigments and inorganic fillers, taking into consideration the shielding properties of the element body 2. In this way, the material for the insulating layers 73 and 76 is selected depending on the design of the inductor component 1.

[0116] The inductor component 1 can be configured as follows.

[0117] The element body 2 is not limited to being configured such that the insulating layers 71 and 72 are in contact with the ends of the insulating layer 73 (an example of a first protective film) in the first direction Z. For example, the element body 2 may be configured such that the magnetic material 201 is in contact with the ends of the insulating layer 73 in the first direction Z. This configuration increases the volume of the magnetic material 201, thereby improving the efficiency with which the inductance of the inductor component 1 is obtained. Like the insulating layer 74, the insulating layer 73 may be configured such that only one end in the first direction Z is in contact with the magnetic material 201 (see FIG. 1 ), or such that both ends in the first direction Z are in contact with the magnetic material 201.

[0118] As shown in FIG. 16 , the element body 2 may be configured so that the width of the insulating layer 73 located at the corner 207 is the largest among the insulating layers 73. In the inductor component 1 shown in FIG. 16 , the element body 2 has a rectangular shape when viewed along the first direction Z. Each corner 207 of the magnetic material 201 is chamfered. When viewed along the first direction Z, the dimension in the direction in which the distance from the outer surface of the insulating layer 73 to the magnetic material 201 is shortest is defined as the "width of the insulating layer 73." Chipping is likely to occur at the corner 207 of the element body 2. Therefore, chipping can be suppressed by providing an insulating layer 73 that is softer than the magnetic material 201 at the corner 207 of the magnetic material 201. In the inductor component 1 shown in FIG. 16 , the insulating layer 73 is provided around the entire side surface of the element body 2, but this is not limited to this. For example, the insulating layer 73 may be provided only at the corner 207 of the element body 2.

[0119] 17 and 18 , the portion 156 of the first conductor layer 11 that is in contact with the insulating layer 73 may be isolated from the first inductor wiring 21. In other words, the portion 156 of the first conductor layer 11 that is in contact with the insulating layer 73 and the first inductor wiring 21 may not be in contact with each other and may be electrically insulated from each other. With this configuration, even if the first conductor layer 11 corrodes due to environmental stress, the first inductor wiring 21 can be protected, thereby suppressing an increase in the DC electrical resistance of the inductor component 1.

[0120] The inductor component 1 shown in FIGS. 17 and 18 includes a third conductor layer 13 located on a first imaginary plane S, a third inductor wiring 23, and an insulating layer 79 (an example of a second insulating layer). When viewed along the first direction Z, the third conductor layer 13 is located symmetrically with the first conductor layer 11 with respect to a first center line CL1 extending on the first imaginary plane S1 in the short-side direction of the inductor component 1 (e.g., the X direction), and has a shape symmetrical with the first conductor layer 11 with respect to the first center line CL1. The third inductor wiring 23 is located symmetrically with the first inductor wiring 21 with respect to the first center line CL1, and has a shape symmetrical with the first inductor wiring 21 with respect to the first center line CL1. The third inductor wiring 23 is located around a third pivot axis A3 that is located symmetrical with the first pivot axis A1 with respect to the first center line CL1. The insulating layer 79 is located between the first inductor wiring 21 and the third inductor wiring 23 in the second direction (e.g., the Y direction). As an example, the insulating layer 79 extends along the first center line CL1. The insulating layer 73 and the insulating layer 79 are integrally formed. By arranging multiple inductor wirings on the same imaginary plane in this manner, the mounting area density can be improved. Furthermore, since the insulating layer 79 insulates the first inductor wiring 21 from the third inductor wiring 23, a highly reliable inductor component 1 can be realized while increasing the mounting area density.

[0121] The positions of the lead portions 153 and 154 of the first conductor layer 11 and the positions of the lead portions 163, 164, and 165 of the second conductor layer 12 can be set arbitrarily. For example, in the inductor component 1 shown in FIG. 19 , the lead portion 164 of the second conductor layer 12 is exposed from a side surface 205 of the element body 2, and the protruding portion 153 of the first conductor layer 11 is exposed from a side surface that intersects with the side surfaces 204 and 205 of the element body 2. In the inductor component 1 shown in FIG. 21 , the protruding portion 153 of the first conductor layer 11 is exposed from a side surface 205 of the element body 2, and the lead portion 164 of the second conductor layer 12 is exposed from a side surface that intersects with the side surfaces 204 and 205 of the element body 2.

[0122] The inductor component 1 may be configured so that the tip portions of the lead portions 153, 154, 163, 164, and 165 exposed from the side surfaces 204 and 205 of the element body 2 are in contact with at least one insulating layer. This configuration can improve the corrosion resistance of the first conductor layer 11.

[0123] 20 shows an example of the tip of the lead portion 153. In FIG. 20, the tip of the lead portion 153 contacts the insulating layer 71 and the insulating layer 73. For example, by forming side surfaces 204 and 205 by down-cutting or up-cutting (moving the blade while rotating it along the first direction Z) during singulation (see FIG. 15), the insulating layers (e.g., insulating layers 71, 72, 73, and 74) located around the lead portions 153, 154, 163, 164, and 165 are stretched, and the tip portions of the lead portions 153, 154, 163, 164, and 165 are covered. This results in the lead portions 153, 154, 163, 164, and 165 having tip portions in contact with at least one insulating layer.

[0124] The inductor component 1 may be configured so that the insulating layer 73 covers the entire tip ends of the lead portions 153, 154. This configuration can further improve the corrosion resistance of the first conductor layer 11. By covering the tip ends of the lead portions 153, 154 with an insulating filler such as silica contained in the first insulating layer 71 or the third insulating layer 73, resistance to interlayer short circuits and the like is further improved.

[0125] The inductor component 1 may include a third protective film that has a lower exposure rate to the outside than the insulating layer 73 on the side surface of the element body 2 along the first direction Z. This configuration reduces the interface between the insulating layer 73 and the third protective film on the side surface of the element body 2 along the first direction Z, thereby further improving the protection performance for the magnetic material 201. Here, the exposure rate of the insulating layer 73 or the third protective film refers to the ratio of the area exposed to the outside to the entire surface area of ​​the insulating layer 73 or the third protective film.

[0126] The inductor component 1 shown in FIG. 21 includes insulating layers 71, 72, and 75 and insulating layers 171 and 172 as third protective films. As an example, the insulating layer 171 covers the entire side surface along the first direction Z of the magnetic material 201 that is located farther from the main surface 202 in the first direction Z than the insulating layer 71. The insulating layer 172 covers the entire side surface along the first direction Z of the magnetic material 201 and the insulating layer 76 that are located between the insulating layer 75 and the main surface 202 in the first direction Z. The inductor component 1 shown in FIG. 21 can be formed, for example, by the following method. After forming the vertical wiring 61 (see FIGS. 10 and 11), a permanent resist is formed on the region that will become the side surface of the element body 2 along the first direction Z. Furthermore, after removing the base substrate 1000, a permanent resist is formed on the surface opposite to the surface on which the inductor wiring is formed.

[0127] The inductor component 1 shown in FIG. 22 includes insulating layers 71, 72, and 75 and an insulating layer 171 as the third protective film. Only portions of the insulating layers 72 and 75 are exposed from the side surface of the element body 2 along the first direction Z. In the inductor component 1 shown in FIG. 22, the insulating layer 73 covers the side surface of the element body 2 along the first direction Z except for the portion where the third protective film is exposed. In the inductor component 1 shown in FIG. 22, the first conductor layer 11 includes three lead portions 154. The inductor component 1 shown in FIG. 22 can be formed, for example, by providing a via opening in the portion of the insulating layer 73 that corresponds to the third protective film, and providing insulating layers 72 and 75 inside the via opening.

[0128] The inductor component 1 may be configured to include conductor layers located on three or more parallel imaginary planes and inductor wiring provided on each of these conductor layers, i.e., the inductor component 1 may include three or more layers of inductor wiring.

[0129] The inductor component 1 may be configured so that only the first conductor layer 11 is located on the first imaginary plane S1, or so that two or more conductor layers including the first conductor layer 11 are located on the first imaginary plane S1. Similarly, the inductor component 1 may be configured so that only the second conductor layer 12 is located on the second imaginary plane S2, or so that two or more conductor layers including the second conductor layer 12 are located on the second imaginary plane S2. In other words, it is possible to realize an inductor component 1 in which multiple electrically independent inductor wirings are arranged on the same imaginary plane.

[0130] The conductor layers (e.g., first conductor layer 11 and second conductor layer 12), insulating layers (e.g., insulating layer 71, insulating layer 72, insulating layer 74 and insulating layer 76), vertical wiring 61, and vias 51, 52, 53, 54, 55 located inside the element body 2 may be omitted depending on the design of the inductor component 1, etc.

[0131] The shape and size of each part constituting the inductor component 1 are not limited to the above-described embodiments and can be set arbitrarily depending on the design of the inductor component 1. For example, the thickness of the first conductor layer 11 of the inductor component 1 is not limited to being less than 1.0 μm and less than 1 / 100 of the thickness of the first inductor wiring.

[0132] Each inductor wiring may have a spiral shape when viewed in the first direction Z. For example, each inductor wiring may be a curve with one or more windings (turns), or a curve with less than one winding. Each inductor wiring may have a linear shape in part.

[0133] The embodiments and modifications of the present disclosure can be combined with each other, or with modifications, or with each other. Features included in the embodiments and modifications of the present disclosure can also be combined with each other.

[0134] The disclosure of the present disclosure may vary in structural details, and changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the claimed disclosure. [Explanation of symbols]

[0135] 1. Inductor components 2 Base 201 Magnetic materials 202 Main surface 203 Non-magnetic materials 204, 205, 206 Side 207 Corner 11 First conductor layer 111 First main body part 112 Protrusion 12 Second conductor layer 121 Second main body part 122 Protrusion 21 First inductor wiring 22 Second inductor wiring 51, 52, 53, 54, 55 vias 61 Vertical wiring 71, 72, 73, 74, 75, 76, 77, 78, 79, 171, 172 Insulating layer 81 First pad section 101, 102, 103 External terminals 151, 153, 154, 155, 161, 162, 163, 164, 165 Drawer section

Claims

1. a first inductor wiring extending around a first pivot axis along a first direction; an element body in which the first inductor wiring is located; Equipped with The element body is a magnetic material positioned farther from the first pivot axis than the first inductor wiring in a second direction intersecting the first direction; a first protective film positioned farther from the first pivot axis than the magnetic material in the second direction and in contact with the magnetic material in the second direction; Including, The inductor component, wherein the thickness of the first protective film in the first direction is greater than the thickness of the first inductor wiring.

2. a first conductor layer located on a first imaginary plane intersecting the first direction; the first inductor wiring is provided on the first conductor layer, The first conductor layer is a first body portion positioned around the first pivot axis; a lead-out portion extending from the first main body portion in the second direction and in a direction away from the first pivot shaft, or in the second direction and in a direction approaching the first pivot shaft; The inductor component of claim 1 , comprising:

3. a second conductor layer provided on a second imaginary plane adjacent to and parallel to the first imaginary plane; a second inductor wiring provided on the second conductor layer, positioned on the opposite side of the second conductor layer from the first conductor layer in the first direction, and extending around a second pivot axis along the first direction; The inductor component of claim 2 , comprising:

4. The inductor component according to claim 2 , wherein the first protective film is configured to cover the first conductor layer.

5. the first protective film includes a plurality of materials; 4. The inductor component according to claim 1, wherein the plurality of materials include at least an inorganic filler.

6. the first protective film includes a plurality of materials; 4. The inductor component according to claim 1, wherein all of said plurality of materials are photosensitive materials.

7. a first insulating layer provided inside the element body and positioned between the first inductor wiring and the second conductor layer; The inductor component according to claim 3 , wherein the first protective film and the first insulating layer are integrally formed.

8. 4. The inductor component according to claim 1, wherein the element body is configured so that the magnetic material is in contact with an end of the first protective film in the first direction.

9. the magnetic material has a quadrangular shape including chamfered corners when viewed along the first direction, When viewed along the first direction, the dimension in the direction in which the distance from the outer surface of the first protective film to the magnetic material is shortest is defined as the width.

4. The inductor component according to claim 1, wherein the width of the first protective film is greatest at the chamfered corners.

10. The inductor component according to claim 4 , wherein a portion of the first conductor layer that is in contact with the first protective film is isolated from the first inductor wiring.

11. a third conductor layer located on the first imaginary plane; a third inductor wiring provided in the third conductor layer and positioned around a third pivot axis extending along the first direction and spaced apart from the first pivot axis in the second direction; a second insulating layer located between the first inductor wiring and the third inductor wiring in the second direction; Equipped with 4. The inductor component according to claim 2, wherein the first protective film and the second insulating layer are integrally formed.

12. the lead-out portion extends from the first body portion in the second direction and away from the first pivot axis; 4. The inductor component according to claim 2, wherein one of the ends of the lead portion in the second direction that is farther from the first body portion is in contact with the first protective film.

13. The inductor component according to claim 12 , wherein the first protective film covers the entire tip portion.

14. 4. The inductor component according to claim 1, further comprising a second protective film in contact with one of both ends of said element body in said first direction.

15. 4. The inductor component according to claim 1, further comprising a third protective film that is less exposed to the outside than said first protective film on a side surface of said element body along said first direction.

Images